MMB Networks EFR32 Zigbee / Thread Module BSB03PA10 / PA11 / PA12 Document Rev 0.7 The MMB Networks BSB03PA1x family is the latest generation Zigbee and Thread capable module. Based on the EFR32 multi-
protocol IC from Silicon Labs, the BSB03PA1x are drop-in Zigbee 3.0 solutions. Preloaded with MMB Networks RapidSE Zigbee Smart Energy application or RapidHA Home Automation application, it offers hardware vendors an easy way to integrate a fully-
implemented, automated Zigbee Smart Energy or Zigbee Home Automation platform into their existing devices. MMB Networks offers a variety of hardware and software development tools to facilitate integration. For more information, please visit http://www.mmbnetworks.com Features Benefits Pre-loaded with RapidConnect firmware Ensures compatibility with latest Zigbee and Thread specifications Built on Silicon Labs EFR32 Wireless Gecko Family Industry leading 802.15.4 MCU ensures best-in-class performance Certified application layer, onboard stack, antenna and regulatory approvals Provides rapid time-to-market and short implementation time Up to 118 dB link budget Delivers unmatched range for difficult installations SMD Chip Antenna or U.FL RF connector options Allows for external antennas where required 15.88mm x 12.6mm x 2.0mm module size Tiny module size will fit in the most miniature applications
+19.5, +16.5, and +8 dBm transmit power options Power and price optimized to meet end product transmit power requirements 15 GPIO (General Purpose Input/Output) connections Flexibility to drive simple to complex devices Page 1 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information Contents 1 | General Information ...................................................................................................................................3 2 | Memory ........................................................................................................................................................3 3 | Module Pinout .............................................................................................................................................3 3.1 | Debug and Programming Interface ..........................................................................................................................................4 4 | Electrical Specifications .............................................................................................................................4 4.1 | Absolute Maximum Ratings ...........................................................................................................................................................4 4.2 | Recommended Operating Conditions ....................................................................................................................................4 4.3 | DC Electrical Characteristics ...........................................................................................................................................................5 5 | RF Specifications .........................................................................................................................................5 5.1 | Receive Specifications ........................................................................................................................................................................5 5.2 | Transmit Specifications ......................................................................................................................................................................5 5.2.1 | Typical Transmit Performance Curves (Tx Current vs. Tx Power) ..........................................................................6 5.2.2 | Typical Transmit Performance Curves (Output Power vs. Tx Power) ..................................................................7 6 | Functional Specifications ..........................................................................................................................7 6.1 | Serial Ports .................................................................................................................................................................................................7 7 | Mechanical Specifications .........................................................................................................................8 7.1 | Physical Dimensions ............................................................................................................................................................................8 7.2 | Recommended Land Pattern (Surface Mount) ..................................................................................................................9 7.3 | RF Connector Dimensions ............................................................................................................................................................10 7.4 | Label Drawings ....................................................................................................................................................................................10 8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder)............................... 11 9 | Regulatory Approvals ............................................................................................................................. 11 9.1 | Federal Communications Commission (FCC - US) .........................................................................................11 9.2 | Industry Canada (IC) ........................................................................................................................................................................12 9.3 | EU .................................................................................................................................................................................................................13 9.4 | RoHS Compliance ..............................................................................................................................................................13 10 | Revision History ..................................................................................................................................... 13 11 | Ordering Information ........................................................................................................................... 14 Page 2 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 1 | General Information Note that some of the specifications refer to either the EFR32 chip or the Module. Specifications cited as EFR32 are taken from the EFR32 datasheet (this should also be noted where referred to). Module means measurements taken with our production module. 2 | Memory RAM (kB) 32 On-Chip Flash (kB) 256 3 | Module Pinout Module Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Function 2.4GHz antenna line out Module Ground EFR32 GPIO, Port D #13 EFR32 GPIO, Port D #14 EFR32 GPIO, Port D #15 EFR32 GPIO, Port A #1 EFR32 GPIO, Port A #0 Digital I/O Power Supply EFR32 GPIO, Port B #11 EFR32 GPIO, Port B #12 Module Ground Module Ground Module Ground EFR32 GPIO, Port B #13 EFR32 GPIO, Port B #14 EFR32 GPIO, Port B #15 Module Ground Module Main Power Module Ground EFR32 GPIO, Port C #10 EFR32 GPIO, Port C #11 Module Ground Reset input, active low EFR32 GPIO, Port F #0 EFR32 GPIO, Port F #1 EFR32 GPIO, Port F #2 Module Ground EFR32 Pin Name (number) 2G4RF_IOP (12) ADC Capable Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes PD13 (14) PD14 (15) PD15 (16) PA1 (18) PA0 (17) IOVDD (30) PB11 (19) PB12 (20) PB13 (21) PB14 (23) PB15 (24) PC10 (31) PC11 (32) RESETn (8) PF0 (1) PF1 (2) PF2 (3) Page 3 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 3.1 | Debug and Programming Interface In order to access the EFR32 for programming and debug purposes, it is recommended that the designer incorporate Silcon Labs 10-pin Mini Simplicity connector. The following table shows a pin mapping between Silicon Labs 10-pin Mini Simplicity connector and the module, and the graphic to the right displays the layout of the Mini Simplicity connector. Silicon Labs Simplicity Studio Port Pin Module Pad 1 2 3 4 5 6 7 8 9 10 18 (Module Main Power) 17 (Module Ground) 23 (Reset input, active low) 6 (EFR32 GPIO, Port A #1) 7 (EFR32 GPIO, Port A #0) 26 (EFR32 GPIO, Port F #2) 25 (EFR32 GPIO, Port F #1) 24 (EFR32 GPIO, Port F #0) 14 (EFR32 GPIO, Port B #13) 10 (EFR32 GPIO, Port B #12) VAEM RST VCOM_TX SWDIO PTI_FRAME 1 3 5 7 9 2 4 6 8 10 GND VCOM_RX SWO SWCLK PTI_DATA 4 | Electrical Specifications 4.1 | Absolute Maximum Ratings Parameter Supply Voltage (VCC) Voltage on any GPIO Voltage on any GPIO pin when used as an input to the general purpose ADC with the low voltage range selected Ambient Operating Temperature (standard version) Storage Temperature 4.2 | Recommended Operating Conditions Minimum Maximum Units 0
-0.3 3.6 VCC + 0.3 V V
-0.3
-40
-50 2 85 150 V C C Parameter Supply Voltage (VCC) Temperature Range Minimum Typical Maximum Units 2.0
-40 3.6 85 V C 3.3 Page 4 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 4.3 | DC Electrical Characteristics Parameter Operating Current RX Current Deep Sleep Current Test Condition At 25 C, VCC = 3.3v, normal mode, 19.5 dBm At 25 C, VCC = 3.3v, normal mode, 16.5 dBm At 25 C, VCC = 3.3v, normal mode, 8 dBm At 25 C, VCC = 3.3v, normal mode, 2.4 GHz At 25 C, VCC = 3.3v, shutdown mode. Full RAM retention and RTCC running from LFXO Minimum Typical Maximum Units 140 95 30 8.7 2 mA mA mA mA A 5 | RF Specifications 5.1 | Receive Specifications Note: The Typical number indicates one standard deviation above the mean, measured at room temperature (25C). The Min and Max numbers were measured over process corners at room temperature. Frequency range Sensitivity 1% PER, 20 byte packet defined by IEEE 802.15.4-2003
-98 dBm 2400 2483.5 MHz 5.2 | Transmit Specifications Output Power at highest power setting BSB03PA10 module BSB03PA11 module BSB03PA12 module 19.5 16.5 8.5 dBm dBm dBm Page 5 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 5.2.1 | Typical Transmit Performance Curves (Tx Current vs. Tx Power) Note: The graph above is for the PA10 variant. For PA11 and PA12 modules, the maximum output power is limited by the chosen SKU (16.5dBm or 8dBm respectively) Page 6 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 5.2.2 | Typical Transmit Performance Curves (Output Power vs. Tx Power) Note: The graph above is for the PA10 variant. For PA11 and PA12 modules, the maximum output power is limited by the chosen SKU (16.5dBm or 8dBm respectively) 6 | Functional Specifications 6.1 | Serial Ports Refer to the EFR32 data sheet for functionality and associated GPIO pinouts. Note: The module pinout table in section 3 of this document provides a cross reference between the MMB module pins and the EFR32 GPIO. Note 2: The RapidConnect firmware supports UART communication with a baud rate of 115.2kbps. However, MMB can modify this configuration as necessary through a Non-Recurring Engineering engagement. Page 7 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 7 | Mechanical Specifications 7.1 | Physical Dimensions D C B A Antenna W L Symbol L W H A B C D Description Length of the module Width of the module Height of the module Length of keep-out zone Width of keep-out zone Keep-out zone from corner of PCB Keep-out zone from corner of PCB Distance 15.88 mm 12.60 mm 2.88 mm 5.50 mm 8.50 mm 5.0 mm 5.0 mm Note: The above table and recommendation apply to BSB03PA1x-CHP products only. The BSB03PA1x family of devices use a System on Module (SOM) package process technology. Page 8 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 7.2 | Recommended Land Pattern (Surface Mount) The diagram below shows the recommended dimensions and arrangement of the pads for the module. The daughtercard upon which the module will be mounted should not include any traces or vias directly under the module, because they may come in contact with the modules traces and cause unexpected behavior. If it is absolutely necessary to include traces and/or vias under the module due to space constraints, then a customer can elect to do so at their own risk. MMB can provide a Hardware Designer Package to show the modules footprint and drill locations, which must not line up with the daughtercards drill locations. F7 22 27 F1 F5 F2 F3 1 2 4 1 13 F4 F6 1 0.64 mm F5 1.14 mm 1.14 mm Top and Bottom Pad Dimensions 0.64 mm Right Side Pad Dimensions Symbol F1 F2 F3 F4 F5 F6 F7 Description Distance pad centre to pad centre Distance pad centre to pad centre Distance pad centre to pad centre Distance pad centre to pad centre Pitch Module silkscreen outline Module silkscreen outline Distance 2.68 mm 1.40 mm 3.52 mm 1.48 mm 1.02 mm 12.60 mm 15.88 mm Page 9 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 7.3 | RF Connector Dimensions The diagram below shows the dimensions for the RF connector. This connector appears on the -RFC variants only. 7.4 | Label Drawings Page 10 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder) Temp
[ C ]
230C - 240C max 220C 30 +20/-10s 150C - 190C 90 30s Time [ s ]
Maximum reflow cycles: 2 Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside of your PCB and re-flow. 9 | Regulatory Approvals 9.1 | Federal Communications Commission (FCC - US) Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only. 9.1.1 | Approved Antennae For the BSB03PA1x-CHP modules using the onboard chip antenna, the approved power level settings are -2 dBm for channels 11-25 and -20 dBm for channel 26. The onboard chip antenna is Inpaq ACA-2012-A1-CC-S. For the BSB03PA1x-RFC modules using the approved external antenna, the approved power level settings are -11 dBm for channels 11-25 and -26 dBm for channel 26. The BSB03PA1x-RFC devices have been approved with the following external FCC approved antennas: Mag Layers EDA-1713-2G4C1-A2, and Bondale G-RA0K13200284-SZ478. 9.1.2 | FCC Notice The BSB03PA1x-CHP and BSB03PA1x-RFC devices comply with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or configured to operate with a separation distance of 20cm or more from all persons. Usage of Channel 26 at full power will result in non-compliance to FCC standards. MMB recommends avoiding use of channel 26 and if necessary only use with a reduced power setting. For further details please contact MMB. Page 11 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 9.1.3 | Modular Approval The BSB03PA1x-CHP and BSB03PA1x-RFC devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407. It should be noted that:
While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to the appropriate equipment authorization).
-- FCC Public Notice DA 00-1407 Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. NOTE:
This module is intended for an OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary when multiple modules are used. A 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for a population/uncontrolled environment can be satisfied. Further RF exposure shall be re-evaluated to the scenario of portable, and collocated use. USER MANUAL OF THE END PRODUCT:
In the user manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the users authority to operate this equipment. Page 12 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 9.1.4 | Labeling Requirements The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior enclosure of an incorporating device must list the MMB Research Inc. FCC ID XFF-BSB03PA1X and the FCC Notice above
(section 9.1.1). The exterior label should use the wording Contains or Contains Transmitter Module. For example:
Contains FCC ID: XFF-BSB03PA1X or Contains Transmitter Module FCC ID: XFF-BSB03PA1X Any similar wording that expresses the same meaning may be used. If the labelling area is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following Contains TX FCC ID: XFF-BSB03PA1X. If the labelling area is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. 9.2 | Industry Canada (IC) Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only. 9.2.1 | Approved Antennae For the BSB03PA1x-CHP modules using the onboard chip antenna, the approved power level settings are -2 dBm for channels 11-25 and -20 dBm for channel 26. For the BSB03PA1x-RFC modules using the approved external antenna, the approved power level settings are -11 dBm for channels 11-25 and -26 dBm for channel 26. 9.2.2 | IC Notice This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
(1) lappareil ne doit pas produire de brouillage, et
(2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Page 13 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 9.2.3 | Labeling Requirements The host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 8365A-BSB03PA1X Contient le metteur radio IC: 8365A-BSB03PA1X 9.3 | EU Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only. BSB03PA1x-CHP and BSB03PA1x-RFC devices are compliant with the following EU standards: ETSI EN 300 328 (v1.9.1), ETSI EN 301 489 1 (v1.9.2) and ETSI EN 301 489 17 (v2.2.1), provided that the transmit power level is set to -2 dBm (if on-board antenna is used) or -11 dBm (if whip antenna is used). These devices are also compliant with 2014/53/EU. 9.4 | RoHS Compliance The BSB03PA1X devices do not contain any substances in excess of the maximum concentration allowed by Directive 2002/95/EC. The module is RoHS compliant. 10 | Revision History Revision Date 0.7 0.6 0.5 0.4 0.3 0.2 0.1 2018/02/13 2017/11/21 2017/10/04 2017/09/15 2017/08/24 2017/07/10 2017/05/29 Comments Added Debug and Programming Section, Updated FCC/IC section Updated dimensions, package type, and ordering information Regulatory Information added New SKU names, minor updates Added PA11 and PA12 variants Minor updates Initial draft Page 14 Rev 0.7 MMB Networks 2018BSB03PA1x Module Data SheetPreliminary Information 11 | Ordering Information HW SKU BSB03PA10-CHP BSB03PA10-RFC BSB03PA10-PIN BSB03PA11-CHP BSB03PA11-RFC BSB03PA11-PIN BSB03PA12-CHP BSB03PA12-RFC BSB03PA12-PIN Max Output Power (dBm) 19.5 19.5 19.5 16.5 16.5 16.5 8 8 8 RF Output Option Chip Antenna RF Connector Module Pad 1 Chip Antenna RF Connector Module Pad 1 Chip Antenna RF Connector Module Pad 1 Status Engineering Samples Engineering Samples Engineering Samples Engineering Samples Engineering Samples Engineering Samples Engineering Samples Engineering Samples Engineering Samples Note: The above table provides the HW SKU which forms the first part of the complete part number. The complete part number takes the format: BSB03PA1x-yyy-r-zzz. Where r is the regulatory region (E=Europe, N=North America), and zzz represents a three digit programming code. Contact your local MMB sales representative to determine the correct programming code for your application. Page 15 Rev 0.7 MMB Networks 2018BSB03PA10x Module Data SheetCopyright 2018 MMB Research Inc. All rights reserved.The information in this document is subject to change without notice. This document is believed to be accurate and reliable, but the statements contained herein are presented without expressed or implied warranty.MMB Networks is a division of MMB Research Inc RapidSE, RapidHA, and RapidConnect are trademarks of MMB Research Inc. All other trademarks are the property of their respective holders.February 2018500 -243 College StreetToronto, Ontario, CanadaM5T 1R5416.636.3145info@mmbnetworks.comwww.mmbnetworks.comPreliminary Information