MMB Networks EFR32 Zigbee/Thread/BLE Module CSB04PA10 / PA11 Document Rev 0.3 The MMB Networks CSB04PA1x family is the latest generation Zigbee, Thread, and BLE capable module. Based on the EFR32 multi-protocol IC from Silicon Labs, the CSB04PA1x are drop-in Zigbee 3.0, Thread and BLE 5.0 solutions. Preloaded with MMB Networks RapidConnect Home Automation application, it offers hardware vendors an easy way to integrate a fully-implemented, automated Zigbee, Thread or BLE Home Automation platform into their existing devices. MMB Networks offers a variety of hardware and software development tools to facilitate integration. For more information, please visit http://www.mmbnetworks.com Features Benefits Pre-loaded with RapidConnect firmware Ensures compatibility with latest Zigbee, Thread and BLE specifications Built on Silicon Labs EFR32 Wireless Gecko Family Industry leading 802.15.4 MCU ensures best-in-class performance Certified application layer, onboard stack, antenna and regulatory approvals Provides rapid time-to-market and short implementation time Up to 121 dB link budget Delivers unmatched range for difficult installations SMD Chip Antenna or U.FL RF connector options Allows for external antennas where required 15.88mm x 12.6mm x 2.4mm module size Tiny module size will fit in the most miniature applications
+19, and +10dBm transmit power options Power and price optimized to meet end product transmit power requirements 15 GPIO (General Purpose Input/Output) connections Flexibility to drive simple to complex devices Page 1 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information Contents 1 | General Information ......................................................................................................................................................3 2 | Memory ..............................................................................................................................................................................3 3 | Module Pinout .................................................................................................................................................................3 3.1 | Debug and Programming Interface ................................................................................................................4 4 | Electrical Specifications ................................................................................................................................................4 4.1 | Absolute Maximum Ratings ...............................................................................................................................4 4.2 | Recommended Operating Conditions ...........................................................................................................4 4.3 | DC Electrical Characteristics ...............................................................................................................................5 4.3.1 | Typical Transmit Performance Curves (Supply Current vs. Tx Power Setting) ...............................5 5 | RF Specifications .............................................................................................................................................................6 5.1 | Receive Specifications ..........................................................................................................................................6 5.2 | Transmit Specifications ........................................................................................................................................6 5.2.1 | Typical Transmit Performance Curves (Output Power vs. Tx Power Setting) .................................7 6 | Functional Specifications .............................................................................................................................................7 6.1 | Serial Ports ................................................................................................................................................................7 7 | Mechanical Specifications ...........................................................................................................................................8 7.1 | Module Physical Dimensions and Host PCB Antenna Keep-out ...........................................................8 7.2 | Recommended Land Pattern (Surface Mount) ...........................................................................................9 7.3 | RF Connector Dimensions ............................................................................................................................... 10 7.4 | Label Drawings .................................................................................................................................................... 10 8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder) ......................................... 11 9 | Regulatory Approvals................................................................................................................................................. 11 9.1 | Federal Communications Commission (FCC - US) ...................................................................... 11 9.2 | Industry Canada (IC) .......................................................................................................................................... 13 9.3 | RoHS Compliance .................................................................................................................................. 14 9.4 | FCC & IC Compliance ............................................................................................................................ 14 10 | Revision History ......................................................................................................................................................... 14 11 | Ordering Information .............................................................................................................................................. 15 Page 2 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 1 | General Information Note that some of the specifications refer to either the EFR32MG13 chip or the Module. Specifications cited as EFR32 are taken from the EFR32MG13 datasheet (this should also be noted where referred to). Module means measurements taken with our production module. 2 | Memory RAM (kB) 64 On-Chip Flash (kB) 512 3 | Module Pinout Module Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 Function 2.4GHz antenna line out Module Ground EFR32 GPIO, Port D #13 EFR32 GPIO, Port D #14 EFR32 GPIO, Port D #15 EFR32 GPIO, Port A #1 EFR32 GPIO, Port A #0 Digital I/O Power Supply EFR32 GPIO, Port B #11 EFR32 GPIO, Port B #12 Module Ground Module Ground Module Ground EFR32 GPIO, Port B #13 EFR32 GPIO, Port B #14 EFR32 GPIO, Port B #15 Module Ground Module Main Power Module Ground EFR32 GPIO, Port C #10 EFR32 GPIO, Port C #11 Module Ground Reset input, active low EFR32 GPIO, Port F #0 EFR32 GPIO, Port F #1 EFR32 GPIO, Port F #2 Module Ground RFGND1 RFGND2 EFR32 Pin Name
(number) 2G4RF_IOP (12) Mini Simplicity Debug Interface ADC Capable Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes UART1_RX UART1_TX PTI_DATA PTI_FRAME GND VAEM RESET_N SW_CLK SW_DIO SW_O PD13 (14) PD14 (15) PD15 (16) PA1 (18) PA0 (17) IOVDD (30) PB11 (19) PB12 (20) PB13 (21) PB14 (23) PB15 (24) PC10 (31) PC11 (32) RESETn (8) PF0 (1) PF1 (2) PF2 (3) Page 3 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 3.1 | Debug and Programming Interface In order to access the EFR32 for programming and debug purposes, it is recommended that the designer incorporate Silcon Labs 10-pin Mini Simplicity connector. The following table shows a pin mapping between Silicon Labs 10-pin Mini Simplicity connector and the module, and the graphic to the right displays the layout of the Mini Simplicity connector. Silicon Labs Simplicity Studio Port Pin 1 2 3 4 5 6 7 8 9 10 Module Pad 8 (Digital I/O Power Supply) 17 (Module Ground) 23 (Reset input, active low) 6 (EFR32 GPIO, Port A #1) 7 (EFR32 GPIO, Port A #0) 26 (EFR32 GPIO, Port F #2) 25 (EFR32 GPIO, Port F #1) 24 (EFR32 GPIO, Port F #0) 14 (EFR32 GPIO, Port B #13) 10 (EFR32 GPIO, Port B #12) 4 | Electrical Specifications 4.1 | Absolute Maximum Ratings Parameter Supply Voltage (VCC) Voltage on any GPIO Ambient Operating Temperature (standard version) Storage Temperature 4.2 | Recommended Operating Conditions VAEM RST VCOM_TX SWDIO PTI_FRAME 1 3 5 7 9 2 4 6 8 10 GND VCOM_RX SWO SWCLK PTI_DATA Minimum Maximum Units 0
-0.3
-40
-50 3.6 VCC + 0.3 85 150 V V C C Parameter Supply Voltage (VCC) Temperature Range Minimum Typical Maximum Units 2.0
-40 3.6 85 V C 3.3 Page 4 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 4.3 | DC Electrical Characteristics Parameter TX Current RX Current Deep Sleep Current Test Condition At 25 C, VCC = 3.3v, normal mode, 19 dBm At 25 C, VCC = 3.3v, normal mode, 10 dBm At 25 C, VCC = 3.3v, normal mode, 2.4 GHz, CPU asleep At 25 C, VCC = 3.3v, normal mode, 2.4 GHz, CPU running At 25 C, VCC = 3.3v, shutdown mode. Full RAM retention and RTCC running from LFXO (EM2 mode) Minimum Typical Maximum Units 138 49 6 14 2.3 mA mA mA mA A 4.3.1 | Typical Transmit Performance Curve (Supply Current vs. Tx Power) Supply Current (mA) vs. TX Power Setting
) A m
(
c c I 140 120 100 80 60 40 20 0 0 1 2 3 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 9 8 Power Setting Note: The graph above is for the PA10 variant. For the PA11 module, the maximum output power is limited to 10.5dBm Page 5 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 5 | RF Specifications 5.1 | Receive Specifications Note: The Typical number indicates one standard deviation above the mean, measured at room temperature (25C). The Min and Max numbers were measured over process corners at room temperature. Parameter Frequency range Test Condition Min 2400 Typical Max 2483.5 Units MHz Sensitivity - Zigbee and Thread Sensitivity - Bluetooth Low Energy 1% PER, 20 byte packet defined by IEEE 802.15.4-2003 0.1% BER. Signal is reference signal1, bit rate=125kbps 0.1% BER. Signal is reference signal1, bit rate=500kbps 0.1% BER. Signal is reference signal1, bit rate=1Mbps 0.1% BER. Signal is reference signal1, bit rate=2Mbps
-102
-103
-99
-95
-91 dBm dBm dBm dBm dBm Notes:
1. Reference signal is defined 2GFSK at -67dBm, Modulation index=0.5, BT=0.5, desired data=PRBS9, interferer data=PRBS15, frequency accuracy better than 1 ppm 5.2 | Transmit Specifications Parameter 802.15.4 output power at highest power setting, general limit1 802.15.4 Channel 26 output power BLE output power at highest power setting, general limit1 BLE Channel 26 output power Test Condition CSB04PA102 CSB04PA112 CSB04PA10-CHP CSB04PA11-CHP CSB04PA1X-RFC3 CSB04PA102 CSB04PA112 CSB04PA10-CHP CSB04PA10-RFC CSB04PA112 Min Typical Max 19.2 10.5 15 10.5 8 19.2 10.5 19.2 15 10.5
``
Units dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm Notes:
1. RF channel 26 operates at special reduced power levels. 2. If antenna configuration (CHP- chip antenna or RFC - RF connector) is not specified then value applies to both configurations. 3. 1X includes CSB04PA10, and PA11 variants Page 6 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 5.2.1 | Typical Transmit Performance Curves (Output Power vs. Tx Power Setting) Output Power (dBm) vs. TX Power Setting
) m B d
(
r e w o P t u p t u O 20 18 16 14 12 10 8 6 4 2 0 0 2 4 6 10 8 12 Power Setting 14 16 18 20 Note: The graph above is for the PA10 variant. For the PA11 module, the maximum output power is limited to 10.5 dBm. 6 | Functional Specifications 6.1 | Serial Ports Refer to the EFR32MG13 data sheet for functionality and associated GPIO pinouts. Note: The module pinout table in section 3 of this document provides a cross reference between the MMB module pins and the EFR32 GPIO. Note 2: The RapidConnect firmware supports UART communication with a baud rate of 115.2kbps. However, MMB can modify this configuration as necessary through a Non-Recurring Engineering engagement. Page 7 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 7 | Mechanical Specifications 7.1 | Module Physical Dimensions and Host PCB Antenna Keep-out Symbol L W H L1 L2 L3 W1 W2 W3 W4 Description Length of the module Width of the module Height of the module Second keep-out length First keep-out length Length from module centre to edge of first keep-out Second keep-out width Distance from edge of first keep-out to edge of second keep-out First keep-out width Width from module centre to edge of first keep-out Distance 15.88 mm 12.60 mm 2.88 mm 2.27 mm 6.43mm 2.65 mm 17.41mm 4.41mm 7.62mm 5.4 mm Note: The above table and recommendation apply to CSB04PA1x-CHP products only. Copper keep-out regions apply to all PCB layers. CSB04PA1x-RFC have identical dimensions but do not require an antenna keep-out. The CSB04PA1x family of devices use a System on Module (SOM) package process technology. Page 8 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 7.2 | Recommended Land Pattern (Surface Mount) The diagram below shows the recommended dimensions and arrangement of the pads for the module. The PCB upon which the module will be mounted should not include any non-ground traces or vias on the top layer directly under the module. All copper features other than the module mounting pads, including ground vias, should be tented or covered with soldermask to avoid coming in contact with the modules traces and producing unexpected behavior. If it is absolutely necessary to include traces and/or vias under the module due to space constraints, then a customer can elect to do so at their own risk. MMB can provide a Hardware Designer Package to show the modules footprint and drill locations, which must not line up with the daughtercards drill locations. Note: Green box is the size of the top metal layer. Orange is the opening in the soldermask layer. Symbol F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 F15 Description Distance pad centre to pad centre (vertical: pad 21 to 22) Distance pad centre to pad centre (vertical: pad 13 to 14) Distance pad centre to pad centre (horizontal: pad 21 to 22) Distance pad centre to pad centre (horizontal: pad 13 to 14) Distance pad centre to RFGND centre (vertical: pad 27 to 28) Distance pad centre to RFGND centre (horizontal: pad 27 to 28) Pitch (pad to pad) Pitch (RFGND pad to RFGND pad) RFGND pad metal and soldermask width RFGND pad metal and soldermask length Module width Module length Width between silkscreen corners Length between silkscreen corners Size of silkscreen corner line Page 9 Distance 2.93 mm 1.67 mm 3.77 mm 1.69 mm 0.26 mm 2.90mm 1.02 mm 3.52mm 1.47mm 2.78mm 12.60 mm 15.88 mm 12.90 mm 16.18 mm 1 mm Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 7.3 | RF Connector Dimensions The diagram below shows the dimensions for the RF connector. This connector appears on the -RFC variants only. 7.4 | Label Drawings Note: Label Drawing will be added upon completion of certification Page 10 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder) Maximum reflow cycles: 2 Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside of your PCB and re-flow. 9 | Regulatory Approvals 9.1 | Federal Communications Commission (FCC - US) Note: this section applies to CSB04PA10-CHP and CSB04PA10-RFC devices only. 9.1.1 | Approved Antennae For the CSB04PA10-CHP modules using the onboard chip antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 15 dBm for channel 26. The approved BLE power level settings are 19.2dBm for both connected and advertising modes. The onboard chip antenna is Inpaq ACA-2012-A1-CC-S with a gain of 1.72dBi and 50 impedance. For the CSB04PA10-RFC modules using the approved external antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 8 dBm for channel 26. The approved BLE power level settings are 19.2dBm for connected mode and 15dBm for advertising modes. The CSB04PA1x-RFC devices have been approved with the following external FCC approved antennas: Mag Layers EDA-1713-2G4C1-A2, and Bondale G-RA0K13200284-SZ478 with a gain of 5dBi and nominal impedance of 50. 9.1.2 | FCC Notice The CSB04PA1x-CHP and CSB04PA1x-RFC devices comply with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or configured to operate with a separation distance of 20cm or more from all persons. Usage of Channel 26 at full power will result in non-compliance to FCC standards. MMB recommends avoiding use of channel 26 and if necessary only use with a reduced power setting. For further details please contact MMB. Page 11 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. 9.1.3 | Modular Approval The CSB04PA1x-CHP and CSB04PA1x-RFC devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407. It should be noted that:
While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to the appropriate equipment authorization).
-- FCC Public Notice DA 00-1407 Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. NOTE:
This module is intended for an OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary when multiple modules are used. A 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for a population/
uncontrolled environment can be satisfied. Further RF exposure shall be re-evaluated to the scenario of portable, and collocated use. USER MANUAL OF THE END PRODUCT:
In the user manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the users authority to operate this equipment. Page 12 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 9.1.4 | Labeling Requirements The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior enclosure of an incorporating device must list the MMB Research Inc. FCC ID XFF-CSB04PA1X and the FCC Notice above
(section 9.1.1). The exterior label should use the wording Contains or Contains Transmitter Module. For example:
Contains FCC ID: XFF-CSB04PA1X or Contains Transmitter Module FCC ID: XFF-CSB04PA1X Any similar wording that expresses the same meaning may be used. If the labelling area is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following Contains TX FCC ID: XFF-CSB04PA1X. If the labelling area is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. 9.2 | Industry Canada (IC) Note: this section applies to CSB04PA10-CHP and CSB04PA10-RFC devices only. 9.2.1 | Approved Antennae This radio transmitter IC: 8365A-CSB04PA1X has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Antenna Type Integral Chip Antenna Dipole Antenna Dipole Antenna Manufacturer Model Maximum Gain
(dBi) Nominal Impedance () Inpaq ACA-2012-A1-CC-S 1.72 Mag-Layers Scientific-Technics Co. Ltd. Bondale EDA-1713-2G4C1-A2 G-RA0K13200284-SZ478 5 5 50 50 50 For the CSB04PA10-CHP modules using the onboard chip antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 15 dBm for channel 26. The approved BLE power level settings are 19.2dBm for both connected and advertising modes. For the CSB04PA10-RFC modules using the approved external antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 8 dBm for channel 26. The approved BLE power level settings are 19.2dBm for connected mode and 15dBm for advertising modes. Page 13 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 9.2.2 | IC Notice This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
(1) lappareil ne doit pas produire de brouillage, et
(2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. 9.2.3 | Labeling Requirements The host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 8365A-CSB04PA1X Contient le metteur radio IC: 8365A-CSB04PA1X 9.2.4 | Additional Notice This module is intended for an OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary when multiple modules are used. A 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for a population/
uncontrolled environment can be satisfied. Further RF exposure shall be re-evaluated to the scenario of portable, and collocated use. 9.3 | RoHS Compliance The CSB04PA1X devices do not contain any substances in excess of the maximum concentration allowed by Directive 2002/95/EC. The module is RoHS compliant. 9.4 | FCC & IC Compliance In the event that conditions as described in the manual cannot be met, then the FCC and ISED authorizations are no longer considered valid and the FCC ID and IC certification number cannot be used on the final product. In these circumstances, the integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and ISED authorization. 10 | Revision History Revision Date 0.3 0.2 0.1 2018/07/30 2018/05/xx 2018/05/07 Comments Added section 9 forregulatory statements for FCC&IC, Updated 5.2 to include BLE transmit specifications. Added BLE5.0 support, other minor typos. Initial draft Page 14 Rev 0.3 MMB Networks 2018CSB04PA1x Module Data SheetPreliminary Information 11 | Ordering Information Hardware SKU CSB04PA10-CHP-N CSB04PA10-PIN-X CSB04PA10-RFC-N CSB04PA11-CHP-D CSB04PA11-PIN-X CSB04PA11-RFC-D Regulatory Approvals FCC/IC N/A1 FCC/IC FCC/IC, TBD N/A1 FCC/IC, TBD RF Output Option Chip Antenna Module Pad 1 RF Connector Chip Antenna Module Pad 1 RF Connector Status Engineering Samples Engineering Samples Engineering Samples Engineering Samples Engineering Samples Engineering Samples Notes:
1. The PIN variant of the module has no regulatory approvals. Host manufacturers who decide to use this variant are responsible for full certification of the product. The above table provides the HW SKU which forms the first part of the complete part number. The complete part number takes the format: CSB04PA1x-yyy-r-zzz. Where r is the regulatory region (E=Europe, N=North America, D=Dual), and zzz represents a three digit programming code. Contact your local MMB sales representative to determine the correct programming code for your application. Page 15 Rev 0.2 MMB Networks 2018CSB04PA1x Module Data SheetCopyright 2018 MMB Research Inc. All rights reserved.The information in this document is subject to change without notice. This document is believed to be accurate and reliable, but the statements contained herein are presented without expressed or implied warranty.MMB Networks is a division of MMB Research Inc RapidSE, RapidHA, and RapidConnect are trademarks of MMB Research Inc. All other trademarks are the property of their respective holders.May 2018500 -243 College StreetToronto, Ontario, CanadaM5T 1R5416.636.3145info@mmbnetworks.comwww.mmbnetworks.comPreliminary Information