MMB Networks EM357 ZigBee Module Z357PA20-SMT, Z357PA21-SMT The MMB Networks EM357 ZigBee Module is a drop-in ZigBee Smart Energy solution. Preloaded with MMB Researchs RapidSE ZigBee Smart Energy application or RapidHA Home Automation application, it offers hardware vendors an easy way to integrate a fully-implemented, automated ZigBee Smart Energy or ZigBee Home Automation platform into their existing devices. MMB Networks offers a variety of hardware and software development tools to facilitate integration. For more information, please visit http://www.mmbnetworks.com Contents Document Rev 1.1 1 | General Information ......................................................................................................................2 2 | Memory ...........................................................................................................................................2 3 | Module Pinout ................................................................................................................................2 3.1 | Debug and Programming Interface .........................................................................................................................3 4 | Electrical Specifications ................................................................................................................3 4.1 | Absolute Maximum Ratings ..........................................................................................................................................3 4.2 | Recommended Operating Conditions ...................................................................................................................3 4.3 | DC Electrical Characteristics ...........................................................................................................................................4 5 | RF Specifications ............................................................................................................................4 5.1 | Receive Specifications .......................................................................................................................................................4 5.2 | Transmit Specifications .....................................................................................................................................................5 6 | Functional Specifications .............................................................................................................5 6.1 | Serial Ports .................................................................................................................................................................................5 6.2 | GPIO ..............................................................................................................................................................................................6 6.3 | Analog to Digital Converter (ADC) ............................................................................................................................7 7 | Mechanical Specifications ............................................................................................................8 7.1 | Physical Dimensions ...........................................................................................................................................................8 7.4 | Labelling .....................................................................................................................................................................................9 8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder).....................9 9 | Regulatory Approvals .................................................................................................................10 9.1 | FCC ..............................................................................................................................................................................................10 9.2 | Industry Canada (IC) .......................................................................................................................................................10 10 | Ordering Information ...............................................................................................................11 Page 1 Rev 1.1 MMB Networks 2013MMB Module Data Sheet 1 | General Information Note that some of the specifications refer to either EM357 or Module. Please note specifications cited as EM357 are taken from the EM357 datasheet (this should also be noted where referred to). Module means measurements taken with our production module. 2 | Memory SKU Z357A.1.0 3 | Module Pinout Module Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 RAM (kB) 12 On-Chip Flash (kB) 192 Serial Flash (kB) 512 Function VCC (3.3 VDC) nCTS/SPI Slave nRTS/SPI Select nReset, active low PTI_EN PTI_DATA JTDO JTCK JTDI JTMS JRST RXD, SPI Slave In Module Controlled Handshake Line TXD, SPI Slave Out GND EM357 GPIO (EM357 Pin Number) CLK PB3 (19) PB4 (20)
(12) PA4 (26) PA5 (27) PC2 (33)
(32) PC3 (34) PC4 (35) PCO (40) PB2 (31) PA6 (29) PB1 (30) Page 2 Rev 1.1 MMB Networks 2013MMB Module Data Sheet 3.1 | Debug and Programming Interface In order to access the EM357 for programming and debug purposes, it is recommended that the designer incorporate Embers 10-pin InSight Port connector. This will allow Embers InSight Adapter (ISA3) to be used. Contact Ember for details regarding the InSight Port connector and ISA3. The following table shows a pin mapping between Embers 10-pin InSight Port connector and the module, and the graphic to the right displays the layout of the InSight Port connector. VBRD PC0 (nJRST) GND PC4 (JTMS/SWDIO) PA4 (PTI_EN) 1 3 5 7 9 2 4 6 8 10 PC2 (JTDO/SWO) PC3 (JTDI) JCLK/SWCLK nRESET PA5 (PTI_DATA) Ember InSight Port Pin 1 2 3 4 5 6 7 8 9 10 Module Pin 10, 18 (VCC) 25 (PC2 / JTDO / SWO) 28 (PC0 / JRST) 26 (PC3 / JTDI) 1, 11, 19, 22, 32 (GND) 24 (JTCK) 27 (PC4 / JTMS / SWDIO) 17, 23 (nReset) 7 (PA4/PTI_EN) 6 (PA5/PTI_DATA) 4 | Electrical Specifications 4.1 | Absolute Maximum Ratings Parameter Supply Voltage (VCC) Voltage on any GPIO ([PA[0:7], PB[0:7], PC[0:7]), JTCK, nReset Voltage on any GPIO pin (PA4, PA5, PB5, PB6, PB7, PC1) when used as an input to the general purpose ADC with the low voltage range selected Ambient Operating Temperature 4.2 | Recommended Operating Conditions Minimum Maximum Units 0
-0.3 3.6 VCC + 0.3 V V
-0.3
-40 2 85 V C Parameter Supply Voltage (VCC) Temperature Range Minimum Typical Maximum Units 2.7
-40 3.6 85 V C 3.3 Page 3 Rev 1.1 MMB Networks 2013MMB Module Data Sheet 4.3 | DC Electrical Characteristics Test Condition At 25 C, VCC = 3.3v, shutdown mode At 25 C, VCC = 3.3v, sleep mode At 25 C, VCC = 3.3v At 25 C, VCC = 3.3v, normal mode, 20 dBm Schmitt input threshold going from high to low Schmitt input threshold going from low to high Parameter Deep sleep current Idle current RX current TX current Low Schmitt switching threshold High Schmitt switching threshold Input current for logic 0 Input current for logic 1 Input pull-up resistor value Input pull-down resistor value Output voltage for logic 0 Output voltage for logic 1 Output source current (standard current pad) Output sink current (standard current pad) Output source current, high current pad: PA6, PA7, PB6, PB7, PC0 Output sink current, high current pad: PA6, PA7, PB6, PB7, PC0 Total output current (for I/O Pads) 5 | RF Specifications 5.1 | Receive Specifications Module Receive Characteristics Minimum Typical Maximum Units 0.65 TBD 13 32 175 235 A mA mA mA 0.5 x VCC V 0.42 x VCC 0.62 x VCC 29 29 24 24 0 0.82 x VCC 0.8 x VCC
-0.5 0.5 34 34 0.18 x VCC VCC 4 4 8 8 40 V A A k k V V mA mA mA mA mA Parameter Receive sensitivity Test Condition 1% PER as per IEEE 802.15.4 Min
-107 Typical
-106 Max
-100 Units dBm Page 4 Rev 1.1 MMB Networks 2013MMB Module Data Sheet EM357 Receive Characteristics This table lists the key parameters of the integrated IEEE 802.15.4-2003 receiver on the EM357. This information is taken from the Ember EM357 Datasheet. This document is available at:
http://www.silabs.com/Support%20Documents/TechnicalDocs/EM35x.pdf Note: Receive measurements were collected with Embers EM35x Ceramic Balun Reference Design (Version A0) at 2440MHz. The Typical number indicates one standard deviation above the mean, measured at room temperature (25C). The Min and Max numbers were measured over process corners at room temperature. Parameter Frequency range Relative frequency error (2x40 ppm required by IEEE 802.15.4-
2003) Relative timing error (2x40 ppm required by IEEE 802.15.4-2003) Linear RSSI range RSSI Range 5.2 | Transmit Specifications Parameter Output Power at highest power setting Error vector magnitude as per IEEE 802.15.4 Carrier frequency error PSD Mask relative PSD Mask absolute Test Condition As defined by IEEE 802.15.4-2003 Min 2400
-120
-120 40
-90 Typical Max 2500 Units MHz 120 120
-40 ppm ppm dB dB Test Condition Min Typical Max Units 21 5 20
-40
-20
-30 21.5 dBm 15 40
ppm dB dBm 3.5 MHz distance from carrier 3.5 MHz distance from carrier 6 | Functional Specifications 6.1 | Serial Ports Refer to the EM357 data sheet for functionality and associated GPIO pin outs. Note: The module pin out table in section 2 of this document provides a cross reference between the MMB PA module pins and the EM357 GPIO. 6.1.1 | SC1 Serial Controller (UART, SPI, TWI) The SC1 module provides UART, SPI (master or slave), or TWI (master) serial communications. Serial Controller Features The SPI master controller has the following features: (*Note: the SPI master controller data is provided to show the hardware capability. RapidSE is configured as a SPI Slave, not Master) Full duplex operation Programmable clock frequency (12 MHz max.) Programmable clock polarity and clock phase Page 5 Rev 1.1 MMB Networks 2013MMB Module Data Sheet Selectable data shift direction (either LSB or MSB first) Receive and transmit FIFOs Receive and transmit DMA channels The following signals can be made available on the GPIO pins:
MOSI (serial data out) MISO (serial data in) MCLK (serial clock out) Full duplex operation The SPI slave controller has the following features:
Up to 4 Mbps data transfer rate Programmable clock polarity and clock phase Selectable data shift direction (either LSB or MSB first) Slave select input The following signals can be made available on the GPIO pins:
MOSI (serial data in) MISO (serial data out) SCLK (serial clock in) nSSEL (slave select) The TWI master controller has the following features:
Uses only two bidirectional GPIO pins Programmable clock frequency (up to 400 kHz) Supports 7-bit and 10-bit addressing Compatible with Philips I2C-bus slave devices The following signals can be made available on the GPIO pins:
SDA (bidirectional serial data) SCL (bidirectional serial clock) The SC1 UART supports the following features:
Baud rate (300 bps up to 921.6 kbps) (*Note: these values are provided to show the hardware capability. RapidSE does not provide the ability to modify the baud rate from the default value of 115.2 kbps. However, MMB can adjust it as necessary through a Non-Recurring Engineering engagement) Parity bits (none, odd, or even) Stop bits (1 or 2) False start bit and noise filtering Receive and transmit FIFOs Data bits (7 or 8) Optional CTS/RTS flow control GPIO signals:
Receiver and transmit DMA channels TXD (serial data out) RXD (serial data in) nRTS (optional) nCTS (optional) 6.2 | GPIO The EM357 has multi-purpose GPIO pins that may be individually configured as:
General purpose output General purpose open-drain output Alternate output controlled by a peripheral device Alternate open-drain output controlled by a peripheral device Analog Page 6 Rev 1.1 MMB Networks 2013MMB Module Data Sheet General purpose input General purpose input with pull-up or pull-down resistor 6.3 | Analog to Digital Converter (ADC) Resolution of up to 14 bits Sample times as fast as 5.33 s (188 kHz) The ADC is a first-order sigma-delta converter with the following features:
Differential and single-ended conversions from six external and four internal sources One voltage range (differential): -VREF to +VREF Digital offset and gain correction Dedicated DMA channel with one-shot and continuous operating modes Choice of internal or external VREF internal VREF may be output to PB0 or external VREF may be derived from PB0 Parameter Conversion time VREF VREF output current VREF load capacitance External VREF voltage range External VREF input impedance Minimum input voltage (input buffer disabled) Minimum input voltage (input buffer enabled) Maximum input voltage (input buffer disabled) Maximum input voltage (input buffer enabled) Single-ended signal range (input buffer disabled) Single-ended signal range (input buffer enabled) Differential signal range (input buffer disabled) Differential signal range (input buffer enabled) Common mode range (input buffer disabled) Common mode range (input buffer enabled) Input referred ADC offset Input impedance (1 MHz sample clock) Input impedance (6 MHz sample clock) Input impedance (Not Sampling) Typical 1.2 1.2 Max 4096 1.23 1 10 1.3 Min 32 1.17 1.1 1 0 0.1 VREF VCC 0.1 VREF VCC 0.1
=+VREF
+VCC 0.1 VREF 10 0 0.1
=-VREF
=- VCC + 0.1 0
-10 1 0.5 10 VCC/2 Units s V mA nF V M Ohm V V V V V V V V V V mV M Ohm M Ohm M Ohm Page 7 Rev 1.1 MMB Networks 2013MMB Module Data Sheet 7 | Mechanical Specifications 7.1 | Physical Dimensions Symbol L W H A1 A2 A3 A B C D Description Length of the module Width of the module Height of the module Pitch Distance centre of pad to PCB edge Distance center of pad to PCB edge Length of keep-out zone Width of keep-out zone Keep-out zone from corner of PCB Keep-out zone from corner of PCB Distance 34.2 mm 15 mm 2.88 mm 1.27 mm 6 mm 3.7 mm 7.55 mm 6.2 mm 5 mm (minimum) 5 mm (minimum) Page 8 Rev 1.1 MMB Networks 2013MMB Module Data Sheet 7.4 | Labelling m m 1 1 11mm 8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder) Temp
[ C ]
230C - 240C max 220C 30 +20/-10s 150C - 190C 90 30s Time [ s ]
Maximum reflow cycles: 2 Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside of your PCB and re-flow. Page 9 Rev 1.1 MMB Networks 2013MMB Module Data Sheet 9 | Regulatory Approvals 9.1 | FCC 9.1.1 | FCC Notice This device (Z357PA20-SMT, Z357PA21-SMT) complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or configured to operate with a separation distance of 20cm or more from all persons. Usage of Channel 26 at full power will result in non-compliance to FCC standards. Manufacturer recommends avoiding use of channel 26 and if necessary only use with a reduced power setting. For further details please contact Manufacturer. 9.1.2 | Modular Approval This device (Z357PA20-SMT, Z357PA21-SMT) meets the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407. It should be noted that:
While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to the appropriate equipment authorization).
-- FCC Public Notice DA 00-1407 Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. 9.1.3 | Labeling Requirements The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior enclosure of an incorporating device must list the MMB Research Inc. FCC ID XFFZ357PA20 and the FCC Notice above
(section 9.1.1). The exterior label should use the wording Contains or Contains Transmitter Module. For example:
Contains FCC ID: XFFZ357PA20 or Contains Transmitter Module FCC ID: XFFZ357PA20 Any similar wording that expresses the same meaning may be used. 9.2 | Industry Canada (IC) 9.2.1 | IC Notice This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
(1) lappareil ne doit pas produire de brouillage, et
(2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Page 10 Rev 1.1 MMB Networks 2013MMB Module Data Sheet 9.2.2 | Labeling Requirements The host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 8365A-Z357PA20 10 | Ordering Information Interface Option SKU Z357PA21-SMT-P-TC Surface Mount Z357PA21-SMT-P-PC Surface Mount Surface Mount Z357PA21-SMT-N Software Option Pre-Programmed Pre-Programmed No Software Security Certificate Test Certificate Production Certificate N/A 25 Prince Arthur Ave. 25 Prince Arthur Ave. 416.636.3145 416.636.3145 Toronto, Ontario, Canada Toronto, Ontario, Canada info@mmbresearch.com info@mmbresearch.com M5R1B2 M5R1B2 www.mmbresearch.com www.mmbresearch.com Copyright 2013 MMB Research Inc. All rights reserved. Copyright 2013 MMB Research Inc. All rights reserved. The information in this document is subject to change without notice. This document The information in this document is subject to change without notice. This document is believed to be accurate and reliable, but the statements contained herein are is believed to be accurate and reliable, but the statements contained herein are presented without expressed or implied warranty. presented without expressed or implied warranty. MMB Networks is a division of MMB Research Inc. MMB Networks is a division of MMB Research Inc. RapidSE is a trademark of MMB Research Inc. RapidSE is a trademark of MMB Research Inc. All other trademarks are the property of their respective holders. All other trademarks are the property of their respective holders. July 2013 July 2013 Rev 1.1 MMB Networks 2013 Rev 1.1 MMB Networks 2013 Page 11 Page 11 MMB Module Data Sheet MMB Module Data Sheet