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| 1 2 3 4 5 6 | MANUAL | Users Manual | 3.69 MiB | April 17 2023 / May 23 2023 |
MultiConnect xDotTM MTXDOT Developer Guide MULTICONNECT XDOT DEVELOPER GUIDE MultiConnect xDot Developer Guide Models: MTXDOT-NA1-xxx, MTXDOT-EU1-xxx Part Number: S000645, Version 1.0 Copyright This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright 2016 by Multi-Tech Systems, Inc. Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and non-
infringement. Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes. Trademarks and Registered Trademarks MultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and xDot and Conduit are trademarks of Multi-Tech Systems, Inc. All other products and technologies are the trademarks or registered trademarks of their respective holders. Legal Notices The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications (Restricted Applications). Use of the products in such Restricted Applications is at the users sole risk and liability. MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS. The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever. Contacting MultiTech Knowledge Base The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go. Support Portal To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com. Support Business Hours: M-F, 8am to 5pm CT Country Europe, Middle East, Africa:
U.S., Canada, all others:
Warranty By Email support@multitech.co.uk support@multitech.com By Phone
+(44) 118 959 7774
(800) 972-2439 or (763) 717-5863 To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go. World Headquarters Multi-Tech Systems, Inc. 2205 Woodale Drive, Mounds View, MN 55112 Phone: (800) 328-9717 or (763) 785-3500 Fax (763) 785-9874 2 MultiConnect xDotTM MTXDOT Developer Guide CONTENTS Contents Chapter 1 Product Overview .................................................................................................................................... 6 Overview ....................................................................................................................................................................... 6 Documentation Overview ............................................................................................................................................. 6 Related Documentation .............................................................................................................................................. 6 mbed Documentation ................................................................................................................................................... 6 Programming the xDot Microcontroller ..................................................................................................................... 7 General mBed Links .................................................................................................................................................... 7 xDot Platform ............................................................................................................................................................. 7 EUI and Networking ...................................................................................................................................................... 7 Product Build Options ................................................................................................................................................... 8 Chapter 2 Getting Started ........................................................................................................................................ 9 Getting Started with the xDot Developer Kit................................................................................................................ 9 COM Port Enumeration by Operating System .............................................................................................................. 9 Linux ............................................................................................................................................................................ 9 Windows ..................................................................................................................................................................... 9 Mac ........................................................................................................................................................................... 10 Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11 xDot ............................................................................................................................................................................. 11 Chapter 4 Specifications and Pin Information ........................................................................................................ 12 MTXDOT Specifications ............................................................................................................................................... 12 Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14 Power Draw................................................................................................................................................................. 15 Measuring the Power Draw ...................................................................................................................................... 15 Electrical Characteristics ............................................................................................................................................. 16 xDot and Processor Pin Information .......................................................................................................................... 16 Pin Information ......................................................................................................................................................... 16 Pull-Up/Down............................................................................................................................................................ 19 xDot Pinout Design Notes ........................................................................................................................................... 20 Serial Pinout Notes.................................................................................................................................................... 20 Serial Settings.............................................................................................................................................................. 20 LoRa ............................................................................................................................................................................ 20 Throughput Rates...................................................................................................................................................... 20 Range ........................................................................................................................................................................ 20 Chapter 5 Antennas ............................................................................................................................................... 22 Antenna System ......................................................................................................................................................... 22 U.FL and Trace Antenna Options ............................................................................................................................... 22 Pulse Electronics Antenna........................................................................................................................................... 23 MultiConnect xDotTM MTXDOT Developer Guide 3 CONTENTS Antenna Specifications ............................................................................................................................................. 23 RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 24 Coaxial Cable Specifications ..................................................................................................................................... 24 Ethertronics Chip Antenna.......................................................................................................................................... 25 Antenna Specifications ............................................................................................................................................. 25 Stackup Information.................................................................................................................................................... 25 Developer Board Layer Stackup................................................................................................................................ 25 Stackup Table ............................................................................................................................................................ 26 Impedance ................................................................................................................................................................ 26 Chip Antenna Design Guidelines................................................................................................................................. 28 Antenna Pad Layout.................................................................................................................................................. 29 PCB Layout ................................................................................................................................................................ 29 OEM Integration ......................................................................................................................................................... 30 FCC & IC Information to Consumers ......................................................................................................................... 30 FCC Grant Notes........................................................................................................................................................ 30 Host Labeling............................................................................................................................................................... 30 Chapter 6 Safety Information................................................................................................................................. 31 Handling Precautions .................................................................................................................................................. 31 Radio Frequency (RF) Safety ....................................................................................................................................... 31 Scurit relative aux appareils radiofrquence (RF).............................................................................................. 31 Interference with Pacemakers and Other Medical Devices ...................................................................................... 32 Potential interference ............................................................................................................................................... 32 Precautions for pacemaker wearers ........................................................................................................................ 32 Device Maintenance ................................................................................................................................................... 32 User Responsibility...................................................................................................................................................... 32 Chapter 7 Regulatory Information ......................................................................................................................... 33 EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 33 47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 33 FCC Interference Notice ............................................................................................................................................. 33 FCC Notice ................................................................................................................................................................... 33 Industry Canada Class B Notice................................................................................................................................... 34 Chapter 8 Environmental Notices........................................................................................................................... 35 Waste Electrical and Electronic Equipment Statement .............................................................................................. 35 WEEE Directive.......................................................................................................................................................... 35 Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 35 REACH Statement ....................................................................................................................................................... 36 Registration of Substances........................................................................................................................................ 36 Substances of Very High Concern (SVHC) ................................................................................................................ 36 Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 37 Information on HS/TS Substances According to Chinese Standards ......................................................................... 38 Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 39 4 MultiConnect xDotTM MTXDOT Developer Guide CONTENTS Chapter 9 Labels .................................................................................................................................................... 40 Label Examples............................................................................................................................................................ 40 Chapter 10 Developer Kit Overview ....................................................................................................................... 41 xDot Developer Kit ..................................................................................................................................................... 41 Developer Kit Package Contents............................................................................................................................... 41 Firmware Updates..................................................................................................................................................... 41 Programming Devices in Production ........................................................................................................................ 41 xDot Developer Kit Mechanical Drawings................................................................................................................... 42 Micro Developer Board LEDs ...................................................................................................................................... 43 Chapter 11 Developer Board Schematics................................................................................................................ 44 Assembly Diagrams and Schematics ........................................................................................................................... 44 Assembly Diagrams ................................................................................................................................................... 44 Schematics ................................................................................................................................................................ 46 Chapter 12 Design Considerations.......................................................................................................................... 50 Noise Suppression Design ........................................................................................................................................... 50 PC Board Layout Guideline ......................................................................................................................................... 50 Electromagnetic Interference .................................................................................................................................... 50 Electrostatic Discharge Control................................................................................................................................... 51 Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 52 Mounting the Device on Your Board .......................................................................................................................... 52 Solder Profile............................................................................................................................................................... 52 Setpoints (Celsius)..................................................................................................................................................... 53 xDot Packing ............................................................................................................................................................... 53 Programming External Targets ................................................................................................................................... 53 JTAG/SWD Connector .............................................................................................................................................. 54 Index...................................................................................................................................................................... 55 MultiConnect xDotTM MTXDOT Developer Guide 5 CHAPTER 1 PRODUCT OVERVIEW Chapter 1 Product Overview Overview The MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments* using the unlicensed ISM bands in North America, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor and enhanced security. The xDot features an integrated ARM Cortex-M3 processor and mbedTM compatible software library for developers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications.
*Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In dense urban environments, a typical range is 1-2 miles. Documentation Overview This manual is one part of xDot documentation. Refer to the Related Documentation and mbed sections for additional information needed to program your xDot and integrate your application with the MultiConnect Conduit gateway. This document includes:
xDot device information: including mechanical drawings, specifications, safety and regulatory information, and other device specific content. Developer Kit information: including design considerations, schematics, and installation and operation information. This current version of this manual is available at www.multitech.com/support. Related Documentation DOT Series AT Command Reference: Includes details on the AT commands available for xDots. MultiTech Developer Site: Application notes, LoRa information, and documentation for related products such as the MultiConnect Conduit (MTCDT) gateway and the LoRa accessory card (MTAC-LORA) are available on the MultiTech developer site. This site includes information on using the Conduit with xDots. Go to:
www.multitech.net Processor Datasheet: ST ARM Cortex-M3 processor (STM32L151CCU6) datasheet is available on the ST website: http://www.st.com/resource/en/datasheet/stm32l151cc.pdf mbed Documentation ARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-M microcontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapid prototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, and supported development boards, an online compiler and online developer collaboration tools. Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit
(MTCDT) with an MTAC-LORA accessory card installed. 6 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 1 PRODUCT OVERVIEW Programming the xDot Microcontroller Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on a developer board. Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting binary file to the mbed USB drive, and reset the xDot. On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries. MultiTech offers both development and stable release versions of the library. Development version: libmxDot-dev-mbed5 Stable release version: libmxDot-mbed5 You can use either the mbed online compiler or offline tools. Online: Use the mbed-os library in your mbed application Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application. General mBed Links Explore mbed: http://developer.mbed.org/explore Getting Started with mbed: http://developer.mbed.org/getting-started mbed Handbook: http://developer.mbed.org/handbook/Homepage mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md mbed workspace tools documentation: https://github.com/ARMmbed/mbed-
os/blob/master/docs/BUILDING.md#workspace-tools xDot Platform The xDot mbed page includes the xDot library, firmware, and test cases https://developer.mbed.org/platforms/MTS-xDot-L151CC/
EUI and Networking xDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI:
AT+DI=<8-BYTE-HEX-MSB>
AT+DI=001122AABBCCDDEE For information on setting up xDots as part of a LoRa network, go to www.multitech.net. MultiConnect xDotTM MTXDOT Developer Guide 7 CHAPTER 1 PRODUCT OVERVIEW Product Build Options Product North America MTXDOT-NA1-A00 MTXDOT-NA1-A01 EMEA MTXDOT-EU1-A00 MTXDOT-EU1-A01 Developer Kits Description Package Quantity 915 MHz LoRa Module UFL/TRC (NAM) 915 MHz LoRa Module TRC (NAM) 868 MHz LoRa Module UFL/TRC (EU) 868 MHz LoRa Module TRC (EU) 1 or 100 100 1 or 100 100 MTMDK-XDOT-NA1-A00 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot MTMDK-XDOT-EU1-A00 MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDot Note:
The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revision and x is the revision number. 8 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 2 GETTING STARTED Chapter 2 Getting Started Getting Started with the xDot Developer Kit Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide. Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and the other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on which pins are available out of the box. Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/
To send commands to the xDot:
Plug the developer board into a USB port. 1. 2. Open communications software, such as TeraTerm, Putty, or Minicom. 3. Set the following:
Baud rate = 115,200 Data bits = 8 Parity = N Stop bits = 1 Flow control = Off To develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation for details and links. For help setting up a MultiConnect Conduit to send data to and from an xDot, refer to Related Documentation . COM Port Enumeration by Operating System xDots create an AT Commands port and a debug port. Linux The following COM ports are created on Linux systems:
/dev/ttyACMx
/dev/ttyACMy Where x and y may be 0 and 1, 3 and 4, etc. The COM port with lower number is the AT command port and COM port with the higher number is the debug port. Windows On Windows systems, COM ports appear in the Device Manager:
Debug Port: mbed Serial Port MultiConnect xDotTM MTXDOT Developer Guide 9 CHAPTER 2 GETTING STARTED AT Command Port: XR21V1410 USB UART You may need to install a driver for the debug port to function properly. Go to:
https://developer.mbed.org/handbook/Windows-serial-configuration Mac On Mac systems, COM ports appear in the Device Manager as:
/dev/cu.usbmodemx Where x is a string of numbers and possibly letters, ending in a number. The COM port with lower number is the AT command port and COM port with the higher number is the debug port. 10 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS Chapter 3 Mechanical Drawings with Pinouts xDot MultiConnect xDotTM MTXDOT Developer Guide 11 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Chapter 4 Specifications and Pin Information MTXDOT Specifications Category General Description Compatibility LoRaWAN 1.0 specifications Interfaces Note that pin functions are multiplexed. Up to 19 digital I/O Up to 10 analog inputs 2 DAC outputs I2C SPI Wake pin Reset pin Full UART mbed/simple UART (RX & TX only) mbed programming interface CPU Performance CPU Max Clock 32 MHz 32 MHz Flash Memory 256 KB, with xDot library 136 KB available; with AT firmware, 56 KB available EEPROM SRAM 8 KB, available 6 KB 32 KB Backup Register 128 byte, available 88 Radio Frequency ISM Bands 863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHz Physical Description Weight Dimensions RF Connectors
-UFL Models 0.0001 oz. (0.003g) Refer to Mechanical Drawings for Dimensions. U.FL
-Trace Models Trace Connection 12 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Environment Operating Temperature Storage Temperature
-40 C to +85 C
-40 C to +85 C Humidity 20%-90% RH, non-condensing Power Requirements Operating Voltage 2.4 to 3.57 V Certifications and Compliance EMC and Radio Compliance EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012 EN 301 489-03 V1.6.1:2013 FCC 15.247:2015 FCC 15.109:2015 FCC 15.107:2015 RSS 247:2015 ICES-003:2012 CISPR 22:2008 AS/NZS CISPR 22 AS/NZS 4268:2012 + a1:2013 Standard 2014 MPE Safety Compliance UL 60950-1 2nd ED cUL 60950-1 2nd ED IEC 60950-1 2nd ED AM1 + AM2 AS/NZS 60950.1:2015 Category Transmission Description North America Max Transmitter Power Output (TPO) 19 dBm Maximum Receive Sensitivity
-137 dBm EMEA 14 dBm
-137 dBm Link Budget1 147 dB Point-to-Point 147 dB Point-to-Point Max Effective Isotropic Radiated Power (EiRP) 22 dBm 10 dBm MultiConnect xDotTM MTXDOT Developer Guide 13 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Receive Sensitivity Spreading Factor North America Typical Sensitivity2 EMEA Typical Sensitivity3 6 7 8 9 10 11 12
-111 dBm
-116 dBm
-119 dBm
-122 dBm
-125 dBm
-127 dBm
-129 dBm
-121 dBm
-124 dBm
-127 dBm
-130 dBm
-133 dBm
-135 dBm
-137 dBm 1Greater link budget is possible with higher gain antenna. 2RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path. 3RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx path. Mapping Data Rate to Spreading Factor/Bandwidth US/AU EU Uplink DR0: SF10BW125 DR1: SF9BW125 DR2: SF8BW125 DR3: SF7BW125 DR4: SF8BW500 DR5-DR7: RFU Downlink DR8: SF12BW500 DR9: SF11BW500
... DR13: SF7BW500 DR0: SF12BW125
... DR5: SF7BW15 DR6: SF7BW250 DR7: FSK 14 MultiConnect xDotTM MTXDOT Developer Guide LDO = 3.3 LDO = 3.3 Voltage USB =
5v CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Power Draw Note:
Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source when determining product load. Transmit power measured with MTXDOT-NA1-xxx transmitting to a MultiConnect Conduit with an MTAC-LORA-915 accessory card installed. Power measurements are similar for MTXDOT-EU1-xxx models. Some 868 MHz sub-band frequencies do not support maximum TXP power of 20. Idle current measured with the xDot joined with Conduit, but idle without data transferring. Transmit power measured while transferring data packets using spread factor 9. Packet size limited to 53 bytes. The Conduit was set to receive packets from and send back to the xDot. A script was run to send the packet 100 times with either 10 or 53 bytes of data, with an average measurement taken during that time. For Inrush charge, recorded the highest observed value from five separate measurements. Voltage USB = 5v Standby Mode Current, (Sleep = 0 Deep Sleep) Stop Mode Current,
(Sleep = 1) Idle current Average Spreading Factor Setting Packet Size (#
1.9uA 1.9uA 2.2uA 2.2uA 11.1mA 11.1mA DR1 - SF9BW125 DR1 - SF9BW125 Bytes) 10 53 Average Current
(Amps) at Low Transmit Power Setting (TXP 2) Average Current
(Amps) at Default Transmit Power Setting (TXP 11) Average Current
(Amps) at Maximum Transmit Power Setting (TXP 20) Total Inrush Charge measured in MilliCoulombs Total Inrush Charge DURATION during Powerup (INRUSH Duration) LDO = 3.3 LDO = 3.3 0.013 0.017 0.017 0.024 0.018 0.025 0.132mC 0.132mC 153uS 147uS Measuring the Power Draw To measure the power draw on an xDot developer board:
1. Flash the latest AT command firmware on the xDot. 2. Unplug the xDot from the computer and then reconnect it. Connect current meter across JP30 on the developer board. 3. Set wake pin to wake, AT+WP=6. 4. Set wake mode to interrupt, AT+WM=1. 5. Put the xDot to sleep, AT+SLEEP=0|1. 6. Put jumper across JP5. 7. Note: After this step, AT command and debug ports no longer work. 8. Measure current draw. 9. Press the S2 button on the developer board to wake the xDot MultiConnect xDotTM MTXDOT Developer Guide 15 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Electrical Characteristics Signal Vin Low Vin High Vout Low Vout High VCC ICC Description Input low level Input high level Output low level Output high level Min
0.45 * VDD +0.6
0.4 Standard operating voltage 2.4 Operating current (mA)
@5V Operating current (mA)
@3.3V
Max 0.3 * VDD
.4
3.6 135 200 xDot and Processor Pin Information Pin Information Note:
Using the mbed platform expands your pin functionality options. Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left) The xDot is 0.045 x 0.045, board is 0.93 x 0.93 16 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 25 9 PB12 SPI2_NSS GPIO / SPI 26 10 PB13 SPI2_SCK GPIO / SPI 28 11 PB15 SPI2_MOSI GPIO / SPI 27 12 PB14 SPI2_MISO GPIO / SPI 30 31 12 13 20 18 13 14 15 16 23 24 PA9 UART1_TX GPIO / UART PA10 UART1_RX GPIO / UART PA2 PA3 PB2 PB0 UART2_TX UART2_RX GPIO3 GPIO2 Debug UART Debug UART GPIO GPIO TIM10_CH1/
I2C2_SMBA/
SPI2_NSS/
I2S2_WS/
USART3_CK/
LCD_SEG12 TIM9_CH1/
SPI2_SCK/
I2S2_CK/
USART3_CTS/
LCD_SEG13 TIM11_CH1/
SPI2_MOSI/
I2S2_SD/
LCD_SEG15 TIM9_CH2/
SPI2_MISO/
USART3_RTS/
LCD_SEG14 USART1_TX/
LCD_COM1 USART1_RX/
LCD_COM2 BOOT1 TIM3_CH3/
LCD_SEG5 ADC_IN18/
COMP1_INP/
VLCDRAIL2 ADC_IN19/
COMP1_INP ADC_IN21/
COMP1_INP/
RTC_REFIN ADC_IN20/
COMP1_INP
VLCDRAIL1/ ADCIN0b ADC_IN8/
COMP1_INP/
OPAMP2_VOUT/
VLCDRAIL3/
VREF_OUT 15 25 PA5 GPIO1 GPIO 14 26 PA4 GPIO0 GPIO 45 27 PB8 I2C1_SCL GPIO / I2C ADC_IN5/
DAC_OUT2/
COMP1_INP ADC_IN4/
DAC_OUT1/
COMP1_INP
TIM2_CH1_ETR/
SPI1_SCK SPI1_NSS/
SPI3_NSS/
I2S3_WS/
USART2_CK TIM4_CH3/
TIM10_CH1/
I2C1_SCL/
LCD_SEG16 MultiConnect xDotTM MTXDOT Developer Guide 17 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description 46 28 PB9 I2C1_SDA GPIO / I2C Processor Pin Alt1 TIM4_CH4/
TIM11_CH1/
I2C1_SDA/
LCD_COM3 Processor Pin Alt2
29 30 31 32 33 34 37 47 1, 5, 17, 20,35, 36, 38, 39, 40, 41, 42, 43, 44, 45, 46, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58 2, 6, 7, 8, 18, 19, 21, 22 37 34 33 32 7 10 8,23,35
,47,49 16 17 29 42 43 40 41 PA14 PA13 PA12 PA11 NRST MBED SWCLK JTCK-SWCLK MBED SWDIO JTMS-SWDIO UART1_RTS GPIO / UART UART1_CTS GPIO / UART USART1_RTS/
SPI1_MOSI USART1_CTS/
SPI1_MISO USB_DP USB_DM NRESET
PA0-WKUP1 WAKE GPIO / WAKE TIM2_CH1_ETR/
TIM5_CH1/
USART2_CTS WKUP1/
RTC_TAMP2/
ADC_IN0/
COMP1_INP ANT1 RFU (ANT2) GND Reserved LORA_DIO0 LORA Radio LORA_DIO1 LORA Radio LORA_DIO2 LORA Radio LORA_DIO3 LORA Radio LORA_DIO4 LORA Radio LORA_MISO LORA Radio LORA_MOSI LORA Radio VSS PA6 PA7 PA8 PB6 PB7 PB4 PB5 18 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 38 11 39 22 19 21 2 44 3 4 5 6 PA15 PA1 PB3 PB11 PB1 PB10 LORA_NSS LORA Radio LORA_RESET LORA Radio LORA_SCK LORA Radio SE_CLK SE_CTRL SE_IO Secure Element Secure Element Secure Element PC13-WKUP2 SE_RESET Secure Element BOOT0 PC14-
OSC32_IN(4) PC15-
OSC32_OUT PH0-
OSC_IN(5) PH1-
OSC_OUT(5) Boot0 RTC_CLK RTC_CLK Main 24M Main 24M
OSC32_IN OSC32_OUT OSC_IN OSC_OUT Pull-Up/Down 48QFN xDot Pin Pin Name SW Name 33 7 38 19 44 NRST PA15 PB1 BOOT0 LORA_NSS SE_CTRL PU/PD 10k PU 100k PU 10k PU 10k PD MultiConnect xDotTM MTXDOT Developer Guide 19 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION xDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. All pins that go to connectors are directly connected to the processor. Refer to Pin Information table for pull up and pull down information. xDots allow you to program pins depending on your application:
Serial: Available out of the box. See Serial Pinout Notes for details. mbed: Designed with the STM32L151CCU6 48-pin processor, this option provides the most flexibility. For more information about processor capabilities, see the processor datasheet. Serial Pinout Notes Out of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model for pin locations. 18 PTA1 UART1_CTS 19 PTA2 UART1_RTS 36 PTC3 UART1_RX 37 PTC4 UART1_TX Serial Settings When creating a serial connection with the device on the developer board, open communications software (such as TeraTerm, Putty, or Minicom ), and use the following settings:
Baud rate = 115,200 Data bits = 8 Parity = N Stop bits = 1 Flow control = Off LoRa Throughput Rates Theoretical maximum speeds for LoRa mode with ACKs off are:
Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps). Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps). Note: Data rates in the LoRaWAN specification vary by geographic region. Range Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Use the following formula to calculate the maximum range:
20 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION The following table provides example settings and the theoretical maximum range based on these settings. Example Frequency TX Power TX Antenna Gain RX Sensitivity1 RX Antenna Gain Fade Margin2 Distance Distance 18dB Transmit Power for 915 MHz Models 915 19 3
-120 3 30 8.14 13.08 Units MHz dBm dB dBm dB dB Miles Km Example 14dB Transmit Power for 868MHz Models 868 14 3
-120 3 30 5.41 8.70 1RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm. 2Fade Margin is set at the worst case of 30dB. Fade margin is an allowance a system designer includes to account for unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade margin set to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. The amount of fade margin to include in a calculation depends on the environment in which you will deploy the system. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm. MultiConnect xDotTM MTXDOT Developer Guide 21 CHAPTER 5 ANTENNAS Chapter 5 Antennas Antenna System The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. If changes are made to the device's certified antenna system, then recertification will be required. This radio transmitter has been tested with both the Pulse and Ethertronics antennas listed below. If you follow our design guidelines, you do not need to re-certify your design. The antenna you use must maintain the same specifications. It must be of the same type, with similar in-band and out-of-band radiation patterns. Antennas having a greater gain than the maximum gain indicated for the listed type, are strictly prohibited for use with this device. U.FL and Trace Antenna Options If using U.FL or trace antennas, note the following:
For a simple trace to RF antennas: Routing must follow standard RF design rules and practices for stripline/miscrostrip for a 50 ohm impedance line. Use the developer board schematics for a reference circuit for the a trace antenna. For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance of the SMA antenna as listed in the next topic. The xDot Developer Board includes an Ethertronics M620710-1K chip antenna, which by default connects the xDot to the chip antenna. Only one antenna, either U.FL or chip, may be used at a time. To use the xDots U.FL connector, remove resistor C23 and L1, marked on the following image, to disconnect the chip antenna. 22 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Pulse Electronics Antenna Manufacturer:
Description:
Model Number:
MultiTech Part Number:
MultiTech ordering information:
Pulse Electronics 868-915 MHz RP-SMA Antenna, 8"
W1063 45009830L Ordering Part Number Quantity AN868-915A-1HRA AN868-915A-10HRA AN868-915A-50HRA 1 10 50 Antenna Specifications Category Frequency Range Impedance VSWR Gain Radiation Description 868-928 MHz 50 Ohms
< 2.0 3.0 dBi Omni MultiConnect xDotTM MTXDOT Developer Guide 23 CHAPTER 5 ANTENNAS Category Polarization Description Vertical RSMA-to-U.FL Coaxial Cables Coaxial Cable Specifications Optional antenna cables can be ordered from MultiTech Cable Type Attenuation Connector Impedance Coaxial Cable
<1.0db 50 ohm Maximum Cable Length 16" (40 cm) Ordering Information Part Number CARSMA-UFL-1 CARSMA-UFL-10 CARSMA-UFL-100 Description RSMA-to-UFL Coax Cable (Single Pack) RSMA-to-UFL Coax Cable (Ten Pack) RSMA-to-UFL Coax Cable (One Hundred Pack) 24 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Ethertronics Chip Antenna This is the developer board's default antenna. Manufacturer:
Description:
Ethertronics 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount Model Number:
M620710-1K Datasheet:
http://www.ethertronics.com/files/2914/0652/9246/2-
Savvi_M620710_ISM__6x2.pdf Antenna Specifications Category Description Electrical Specifications Frequency Range 902928 MHz Peak Gain VSWR Impedance Average Efficiency Power Handling Polarization Mechanical Specifications Mounting Size 2.56 dBi 2:6:1 max 50 ohms unbalanced 58%
0.5 Watt cw Linear Surface Mount 6.00 x 2.00 x 1.1mm Stackup Information Developer Board Layer Stackup MultiConnect xDotTM MTXDOT Developer Guide 25 CHAPTER 5 ANTENNAS Stackup Table Impedance Polar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space. 26 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space. MultiConnect xDotTM MTXDOT Developer Guide 27 CHAPTER 5 ANTENNAS Chip Antenna Design Guidelines When designing antenna placement for the chip antenna, note the following:
The antenna's long side must be along the edge of the ground plane. Remove the ground plane from all layers below the antenna. The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm. The distance from the antenna to relatively large perturbations, such as a shield or large components, depends on the height of surrounding components. It should not be less than 1.5mm. We recommend a distance equal to or greater than 10mm from the end of the antenna to either end of the PCB distance. Performance is better from larger distances. Use the recommended land pattern shown in the figures below. Land patterns are composed of a 50 ohm line connected to each antenna feed point. Ground clearance around and under the antenna as shown in the PCB layout is recommended to maximize antenna performance. 28 MultiConnect xDotTM MTXDOT Developer Guide Antenna Pad Layout CHAPTER 5 ANTENNAS PCB Layout MultiConnect xDotTM MTXDOT Developer Guide 29 CHAPTER 5 ANTENNAS OEM Integration FCC & IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations:
47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4. FCC Grant Notes The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may be necessary. FCC Definitions Portable: (2.1093) A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile: (2.1091) A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitters radiating structure(s) and the body of the user or nearby persons. Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specific information required to satisfy RF exposure compliance for installations and final host devices. (See note under Grant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee. Note: Host design configurations constituting a device for portable use (<20 cm from human body) require separate FCC/IC approval. Host Labeling The following statements are required to be on the host label:
This device contains FCC ID: AU792U13A16858 This device contains equipment certified under IC: 125A-0055 For labeling examples, see Cellular Approvals and Labeling Requirements. 30 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 6 SAFETY INFORMATION Chapter 6 Safety Information Handling Precautions To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellular device. Although input protection circuitry has been incorporated into the devices to minimize the effect of static build-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting the device. Radio Frequency (RF) Safety Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment. Follow the safety advice given below. Operating your device close to other electronic equipment may cause interference if the equipment is inadequately protected. Observe any warning signs and manufacturers recommendations. Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use of radio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow restrictions for any environment where you operate the device. Do not place the antenna outdoors. Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction may lead to suspension or denial of cellular services to the offender, legal action, or both. Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle with fuel. Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use. Scurit relative aux appareils radiofrquence (RF) cause du risque d'interfrences de radiofrquence (RF), il est important de respecter toutes les rglementations spciales relatives aux quipements radio. Suivez les conseils de scurit ci-dessous. Utiliser l'appareil proximit d'autres quipements lectroniques peut causer des interfrences si les quipements ne sont pas bien protgs. Respectez tous les panneaux d'avertissement et les recommandations du fabricant. Certains secteurs industriels et certaines entreprises limitent l'utilisation des appareils cellulaires. Respectez ces restrictions relatives aux quipements radio dans les dpts de carburant, dans les usines de produits chimiques, ou dans les zones o des dynamitages sont en cours. Suivez les restrictions relatives chaque type d'environnement o vous utiliserez l'appareil. Ne placez pas l'antenne en extrieur. teignez votre appareil sans fil dans les avions. L'utilisation d'appareils lectroniques portables en avion est illgale: elle peut fortement perturber le fonctionnement de l'appareil et dsactiver le rseau cellulaire. S'il ne respecte pas cette consigne, le responsable peut voir son accs aux services cellulaires suspendu ou interdit, peut tre poursuivi en justice, ou les deux. teignez votre appareil sans fil proximit des pompes essence ou de diesel avant de remplir le rservoir de votre vhicule de carburant. MultiConnect xDotTM MTXDOT Developer Guide 31 CHAPTER 6 SAFETY INFORMATION teignez votre appareil sans fil dans les hpitaux ou dans toutes les zones o des appareils mdicaux sont susceptibles d'tre utiliss. Interference with Pacemakers and Other Medical Devices Potential interference Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted cardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for the Advancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure that cardiac pacemakers and defibrillators are safe from cellular device EMI. The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interference occurs, the FDA will assess the interference and work to resolve the problem. Precautions for pacemaker wearers If EMI occurs, it could affect a pacemaker in one of three ways:
Stop the pacemaker from delivering the stimulating pulses that regulate the heart's rhythm. Cause the pacemaker to deliver the pulses irregularly. Cause the pacemaker to ignore the heart's own rhythm and deliver pulses at a fixed rate. Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers. However, people with pacemakers may want to take simple precautions to be sure that their device doesn't cause a problem. Keep the device on the opposite side of the body from the pacemaker to add extra distance between the pacemaker and the device. Avoid placing a turned-on device next to the pacemaker (for example, dont carry the device in a shirt or jacket pocket directly over the pacemaker). Device Maintenance When maintaining your device:
Do not attempt to disassemble the device. There are no user serviceable parts inside. Do not expose your device to any extreme environment where the temperature or humidity is high. Do not expose the device to water, rain, or spilled beverages. It is not waterproof. Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The information contained on discs or cards may be affected by the device. Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with MultiTech's accessory specifications may invalidate the warranty. If the device is not working properly, contact MultiTech Technical Support. User Responsibility Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft. 32 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 7 REGULATORY INFORMATION Chapter 7 Regulatory Information EMC, Safety, and R&TTE Directive Compliance The CE mark is affixed to this product to confirm compliance with the following European Community Directives:
Council Directive 2014/30/EU on the approximation of the laws of Member States relating to electromagnetic compatibility;
and Council Directive 2014/35/EU on the harmonization of the laws of Member States relating to electrical equipment designed for use within certain voltage limits;
and Council Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment;
and Council Directive 1999/5/EC on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity. 47 CFR Part 15 Regulation Class B Devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. FCC Interference Notice Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Notice xDot products are open development based products that contain a sub ghz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 & IC RSS 247:2015) MultiConnect xDotTM MTXDOT Developer Guide 33 CHAPTER 7 REGULATORY INFORMATION MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. Users are prohibited from making any changes that affect the operation of the radio performance. Accessing or controlling the radio through any means other than the provided binary software will require the user to obtain their own intentional radiator license from the certification body governing their locality, as all pre-certification provided with xDot will have been made invalid. Industry Canada Class B Notice This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numrique de la classe B respecte toutes les exigences du Reglement Canadien sur le matriel brouilleur. This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for the following two conditions:
1. 2. the device may not cause harmful interference, and the user of the device must accept any interference suffered, even if the interference is likely to jeopardize the operation. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
1. 2. l'appareil ne doit pas produire de brouillage, et l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. 34 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 8 ENVIRONMENTAL NOTICES Chapter 8 Environmental Notices Waste Electrical and Electronic Equipment Statement Note: This statement may be used in documentation for your final product applications. WEEE Directive The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to take-
back electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements. Instructions for Disposal of WEEE by Users in the European Union The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or where you purchased the product. July, 2005 MultiConnect xDotTM MTXDOT Developer Guide 35 CHAPTER 8 ENVIRONMENTAL NOTICES REACH Statement Registration of Substances After careful review of the legislation and specifically the definition of an article as defined in EC Regulation 1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would be considered as articles. In light of the definition in 7.1(b) which requires registration of an article only if it contains a regulated substance that is intended to be released under normal or reasonably foreseeable conditions of use, Our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intended and anticipated use. Substances of Very High Concern (SVHC) Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewed these substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU REACH requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the European Chemicals Agency, and relevant substances have been confirmed, that exceeds greater than 0.1% (w/w), Multi-
Tech Systems, Inc. will provide updated compliance status. Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliant through a formalized process which includes collection and validation of materials declarations and selective materials analysis where appropriate. This data is controlled as part of a formal quality system and will be made available upon request. 36 MultiConnect xDotTM MTXDOT Developer Guide Restriction of the Use of Hazardous Substances (RoHS) CHAPTER 8 ENVIRONMENTAL NOTICES Multi-Tech Systems, Inc. Certificate of Compliance 2011/65/EU Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS). These MultiTech products do not contain the following banned chemicals1:
Lead, [Pb] < 1000 PPM Mercury, [Hg] < 1000 PPM Hexavalent Chromium, [Cr+6] < 1000 PPM Cadmium, [Cd] < 100 PPM Polybrominated Biphenyl, [PBB] < 1000 PPM Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM Environmental considerations:
Moisture Sensitivity Level (MSL) =1 Maximum Soldering temperature = 260C (in SMT reflow oven) 1Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration would be found in some modules (>1000 PPM);
- Resistors containing lead in a glass or ceramic matrix compound. MultiConnect xDotTM MTXDOT Developer Guide 37 CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII). Hazardous/Toxic Substance/Elements Name of the Component Lead
(PB) Mercury
(Hg) Cadmium
(CD) Hexavalent Chromium
(CR6+) Polybromi nated Biphenyl
(PBB) Polybrominat ed Diphenyl Ether (PBDE) Printed Circuit Boards Resistors Capacitors Ferrite Beads Relays/Opticals ICs Diodes/ Transistors Oscillators and Crystals Regulator Voltage Sensor Transformer Speaker Connectors LEDs Screws, Nuts, and other Hardware AC-DC Power Supplies Software /Documentation CDs Booklets and Paperwork Chassis O X X O O O O X O O O O O O X O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneous material of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits. O Represents that no such substances are used or that the concentration is within the aforementioned limits. 38 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese)
(MII) (EIP) 39 RoHS, Multi-Tech Systems, Inc.
(TS) (HS)
ICs
LEDs
/ CD
(PB) (Hg) (CD) (CR6+)
(PBB)
(PBDE) O X X O O O O X O O O O O O X O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O X / SJ/Txxx-2006 O MultiConnect xDotTM MTXDOT Developer Guide 39 CHAPTER 9 LABELS Chapter 9 Labels Label Examples Note: Actual labels vary depending on the regulatory approval markings and content. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is not the actual size. 1 - MultiTech Model Identification. 2 - MultiTech Ordering Part Number. 3 - Device Node Number. Example xDot Device Label Example Developer Board Device Label 40 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 10 DEVELOPER KIT OVERVIEW Chapter 10 Developer Kit Overview xDot Developer Kit The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application. Developer Kit Package Contents Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following:
Developer Board Customer Notices Firmware Updates 1 - xDot Developer Board with xDot Quick Start Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/
Programming Devices in Production Consult developer kit schematics for programming options. MultiConnect xDotTM MTXDOT Developer Guide 41 CHAPTER 10 DEVELOPER KIT OVERVIEW xDot Developer Kit Mechanical Drawings Note: The Reset and Wake buttons reset and wake the xDot processor. 42 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 10 DEVELOPER KIT OVERVIEW Micro Developer Board LEDs LED LED1 LED3/SDA LED2/PWR LED4/PROXY Description User-definable LED. Programming Status. Power, blue light when the board has power. LED for the proximity sensor, which is next to it (labeled U14 on the top assembly diagram). MultiConnect xDotTM MTXDOT Developer Guide 43 CHAPTER 11 DEVELOPER BOARD SCHEMATICS Chapter 11 Developer Board Schematics Assembly Diagrams and Schematics Assembly Diagrams Top 44 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS Bottom MultiConnect xDotTM MTXDOT Developer Guide 45 CHAPTER 11 DEVELOPER BOARD SCHEMATICS Schematics 46 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect xDotTM MTXDOT Developer Guide 47 CHAPTER 11 DEVELOPER BOARD SCHEMATICS 48 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect xDotTM MTXDOT Developer Guide 49 CHAPTER 12 DESIGN CONSIDERATIONS Chapter 12 Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels and quality. Noise in frequency ranges that affect modem performance is of particular concern. On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments. Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification. Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes. PC Board Layout Guideline In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide. The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the device vertically in place during the wave solder process. Electromagnetic Interference The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels. Keep traces carrying high frequency signals as short as possible. Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for ground and power distribution. Decouple power from ground with decoupling capacitors as close to the device's power pins as possible. Eliminate ground loops, which are unexpected current return paths to the power source and ground. Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines; however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design aid is to place footprints for these components and populate as necessary during performance/EMI testing and certification. Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple power lines are similar to decoupling telephone lines. 50 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 12 DESIGN CONSIDERATIONS Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. Locate cables and connectors to avoid coupling from high frequency circuits. Lay out the highest frequency signal traces next to the ground grid. If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground plane covers all traces. Minimize the number of through-hole connections on traces carrying high frequency signals. Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns are better. On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces. Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point. Electrostatic Discharge Control Handle all electronic devices with precautions to avoid damage due to the static charge accumulation. See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) a document for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment. This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing. MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling. MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers. MultiConnect xDotTM MTXDOT Developer Guide 51 CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Chapter 13 Mounting xDots and Programming Exter-
nal Targets Mounting the Device on Your Board A footprint diagram is included on the xDot Mechanical Diagram. Solder Profile Solder Paste: SAC NC 254 Note: Calculate slope over 120 seconds Name Low Limit High Limit Units Max Rising Slope (Target=1.0) Max Falling Slope Soak Time 150-170C Peak Temperature Total Time Above 218C 0
-2 15 235 30 2
-0.1 45 250 90 Degrees/Second Degrees/Second Seconds Degrees Celsius Seconds 52 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Setpoints (Celsius) Zone Top Bottom 1 130 130 2 160 160 3 170 170 4 190 190 5 230 230 6 245 245 7 255 255 Conveyer Speed 32.0 inch/minute Max Rising Slope Max Falling Slope Soak Time 150-
Peak Temp Total Time /218C TC Position Slope 1 2 3 Delta
<TC2>
<TC3>
<TC4>
1.38 1.38 1.38 0.00 PWI 38%
38%
38%
PWI 45%
32%
36%
Slope
-0.63
-0.75
-0.70 0.12 170C Time 28.82 26.75 29.47 2.72 PWI
-8%
Temp PWI 240.22
-30%
-22%
241.21
-17%
-4%
239.56
-39%
1.65 Time 43.61 43.66 43.29 0.37 PWI
-55%
-54%
-56%
xDot Packing xDots ship on 20 piece trays, which you can use for pick and place handling. Warning: Maximum temperature for these trays is 65 C. Programming External Targets You can use the xDot developer board to program external targets. To do this:
1. 2. Connect header JP1 to your target board with a 9-position ribbon cable.1 Apply power to your target board. MultiConnect xDotTM MTXDOT Developer Guide 53 CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS 3. When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbed programming interface to the external target. You can use the mbed programming environment as normal to program and debug the external target. 1MultiTech recommends the Samtec FFSD-05-D-06.00-01-N ribbon cable. JTAG/SWD Connector The developer board uses an unshrouded 10-pin header. Suitable connector headers include:
Harwin: M50-3500542 Mouser: 855-M50-3500542 Samtec shrouded header: FTSH-105-01-F-D-K The Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm). Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's red stripe. 54 MultiConnect xDotTM MTXDOT Developer Guide Index schematics Developer Board ...................................................44 A antenna ....................................................................22 23 developer board ......................................................25 antenna design guidelines ............................................28 assembly diagrams Developer Board ......................................................44 AT command port ............................................................................9 B baud rate.......................................................................20 board components Micro Developer Board............................................43 build options ...................................................................8 C cable coaxial ......................................................................24 certifications .................................................................12 Chinese hazardous substances Chinese version........................................................39 English version .........................................................38 Class B ..........................................................................33 Industry Canada .......................................................34 COM ports .......................................................................9 Conduit............................................................................6 D data bits ........................................................................20 debug port ......................................................................9 design guidelines antenna....................................................................28 device maintenance ............................................................32 dimensions ....................................................................11 documentation................................................................6 INDEX E electrical characteristics................................................16 electromagnetic interference .......................................50 electrostatic discharge ..................................................51 EMI ................................................................................50 ESD ................................................................................51 EUI ...................................................................................7 external targets.............................................................53 F FCC grant notes...............................................................30 FCC Notice Class B .....................................................................33 flow control...................................................................20 G ground plane.................................................................50 H handling precautions due to ESD..................................51 hazardous substances ...................................................37 host labeling..................................................................30 I Industry Canada Class B .....................................................................34 interfrence des radiofrquences.................................31 J JTAG connector .............................................................54 K KDB 447498 Section 8 ..................................................30 L labeling host ..........................................................................30 MultiConnect xDotTM MTXDOT Developer Guide 55 INDEX labels .............................................................................40 Linux ................................................................................9 LoRa range ........................................................................20 related products..............................................................6 ribbon cable ..................................................................53 RoHS..............................................................................37 RSMA-to-UFL cable .......................................................24 M Mac .................................................................................9 maintenance .................................................................32 mbed ..............................................................................6 mechanical drawings.....................................................11 Micro Developer Board............................................42 MTAC-LORA.....................................................................6 MTCDT.............................................................................6 MultiConnect ..................................................................6 N S safety RF interference ........................................................31 safety standards............................................................50 serial settings ................................................................20 solder profile.................................................................52 specifications.................................................................12 static..............................................................................31 stop bits.........................................................................20 scurit interfrences RF.......................................................31 network, connecting .......................................................7 noise suppression..........................................................50 T P packing list ....................................................................41 parity .............................................................................20 PC board layout.............................................................50 pin information .............................................................16 pinout notes..................................................................20 ports ................................................................................9 power draw...................................................................15 measuring ................................................................15 processor.........................................................................6 programming external targets ......................................53 trace antenna................................................................22 transmission ..................................................................12 U U.FL antenna .................................................................22 user responsibility.........................................................32 W Windows .........................................................................9 X R xDot packing..................................................................53 radio frequency interference........................................31 range .............................................................................20 receive sensitivity..........................................................12 56 MultiConnect xDotTM MTXDOT Developer Guide
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MultiConnect xDotTM MTXDOT Developer Guide MULTICONNECT XDOT DEVELOPER GUIDE MultiConnect xDot Developer Guide Models: MTXDOT-NA1-xxx, MTXDOT-EU1-xxx Part Number: S000645, Version 1.0 Copyright This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright 2016 by Multi-Tech Systems, Inc. Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and non-
infringement. Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes. Trademarks and Registered Trademarks MultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and xDot and Conduit are trademarks of Multi-Tech Systems, Inc. All other products and technologies are the trademarks or registered trademarks of their respective holders. Legal Notices The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications (Restricted Applications). Use of the products in such Restricted Applications is at the users sole risk and liability. MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS. The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever. Contacting MultiTech Knowledge Base The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go. Support Portal To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com. Support Business Hours: M-F, 8am to 5pm CT Country Europe, Middle East, Africa:
U.S., Canada, all others:
By Email support@multitech.co.uk support@multitech.com By Phone
+(44) 118 959 7774
(800) 972-2439 or (763) 717-5863 Warranty To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go. World Headquarters Multi-Tech Systems, Inc. 2205 Woodale Drive, Mounds View, MN 55112 Phone: (800) 328-9717 or (763) 785-3500 Fax (763) 785-9874 2 MultiConnect xDotTM MTXDOT Developer Guide CONTENTS Contents Chapter 1 Product Overview.................................................................................................................................... 6 Overview ....................................................................................................................................................................... 6 Documentation Overview ............................................................................................................................................. 6 Related Documentation.............................................................................................................................................. 6 mbed Documentation ................................................................................................................................................... 6 Programming the xDot Microcontroller ..................................................................................................................... 7 General mBed Links .................................................................................................................................................... 7 xDot Platform ............................................................................................................................................................. 7 EUI and Networking ...................................................................................................................................................... 7 Product Build Options ................................................................................................................................................... 8 Chapter 2 Getting Started ........................................................................................................................................ 9 Getting Started with the xDot Developer Kit................................................................................................................ 9 COM Port Enumeration by Operating System .............................................................................................................. 9 Linux............................................................................................................................................................................ 9 Windows ..................................................................................................................................................................... 9 Mac ........................................................................................................................................................................... 10 Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11 xDot............................................................................................................................................................................. 11 Chapter 4 Specifications and Pin Information ........................................................................................................ 12 MTXDOT Specifications............................................................................................................................................... 12 Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14 Power Draw................................................................................................................................................................. 15 Measuring the Power Draw ...................................................................................................................................... 15 Electrical Characteristics ............................................................................................................................................. 16 xDot and Processor Pin Information .......................................................................................................................... 16 Pin Information ......................................................................................................................................................... 16 Pull-Up/Down............................................................................................................................................................ 19 xDot Pinout Design Notes ........................................................................................................................................... 20 Serial Pinout Notes.................................................................................................................................................... 20 Serial Settings.............................................................................................................................................................. 20 LoRa ............................................................................................................................................................................ 20 Throughput Rates...................................................................................................................................................... 20 Range ........................................................................................................................................................................ 20 Chapter 5 Antennas ............................................................................................................................................... 22 Antenna System ......................................................................................................................................................... 22 U.FL and Trace Antenna Options ............................................................................................................................... 22 Pulse Electronics Antenna........................................................................................................................................... 23 MultiConnect xDotTM MTXDOT Developer Guide 3 CONTENTS Antenna Specifications ............................................................................................................................................. 23 RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 24 Coaxial Cable Specifications ..................................................................................................................................... 24 Ethertronics Chip Antenna.......................................................................................................................................... 25 Antenna Specifications ............................................................................................................................................. 25 Stackup Information.................................................................................................................................................... 25 Developer Board Layer Stackup................................................................................................................................ 25 Stackup Table............................................................................................................................................................ 26 Impedance ................................................................................................................................................................ 26 Chip Antenna Design Guidelines................................................................................................................................. 28 Antenna Pad Layout.................................................................................................................................................. 29 PCB Layout ................................................................................................................................................................ 29 OEM Integration ......................................................................................................................................................... 30 FCC & IC Information to Consumers ......................................................................................................................... 30 FCC Grant Notes........................................................................................................................................................ 30 Host Labeling............................................................................................................................................................... 30 Chapter 6 Safety Information................................................................................................................................. 31 Handling Precautions .................................................................................................................................................. 31 Radio Frequency (RF) Safety ....................................................................................................................................... 31 Scurit relative aux appareils radiofrquence (RF).............................................................................................. 31 Interference with Pacemakers and Other Medical Devices ...................................................................................... 32 Potential interference............................................................................................................................................... 32 Precautions for pacemaker wearers ........................................................................................................................ 32 Device Maintenance ................................................................................................................................................... 32 User Responsibility...................................................................................................................................................... 32 Chapter 7 Regulatory Information ......................................................................................................................... 33 EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 33 47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 33 FCC Interference Notice ............................................................................................................................................. 33 FCC Notice................................................................................................................................................................... 33 Industry Canada Class B Notice................................................................................................................................... 34 Chapter 8 Environmental Notices........................................................................................................................... 35 Waste Electrical and Electronic Equipment Statement .............................................................................................. 35 WEEE Directive.......................................................................................................................................................... 35 Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 35 REACH Statement ....................................................................................................................................................... 36 Registration of Substances........................................................................................................................................ 36 Substances of Very High Concern (SVHC) ................................................................................................................ 36 Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 37 Information on HS/TS Substances According to Chinese Standards ......................................................................... 38 Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 39 4 MultiConnect xDotTM MTXDOT Developer Guide CONTENTS Chapter 9 Labels .................................................................................................................................................... 40 Label Examples............................................................................................................................................................ 40 Chapter 10 Developer Kit Overview ....................................................................................................................... 41 xDot Developer Kit ..................................................................................................................................................... 41 Developer Kit Package Contents............................................................................................................................... 41 Firmware Updates..................................................................................................................................................... 41 Programming Devices in Production ........................................................................................................................ 41 xDot Developer Kit Mechanical Drawings................................................................................................................... 42 Micro Developer Board LEDs ...................................................................................................................................... 43 Chapter 11 Developer Board Schematics................................................................................................................ 44 Assembly Diagrams and Schematics........................................................................................................................... 44 Assembly Diagrams................................................................................................................................................... 44 Schematics ................................................................................................................................................................ 46 Chapter 12 Design Considerations.......................................................................................................................... 50 Noise Suppression Design........................................................................................................................................... 50 PC Board Layout Guideline ......................................................................................................................................... 50 Electromagnetic Interference .................................................................................................................................... 50 Electrostatic Discharge Control................................................................................................................................... 51 Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 52 Mounting the Device on Your Board .......................................................................................................................... 52 Solder Profile............................................................................................................................................................... 52 Setpoints (Celsius)..................................................................................................................................................... 53 xDot Packing ............................................................................................................................................................... 53 Programming External Targets ................................................................................................................................... 53 JTAG/SWD Connector .............................................................................................................................................. 54 Index...................................................................................................................................................................... 55 MultiConnect xDotTM MTXDOT Developer Guide 5 CHAPTER 1 PRODUCT OVERVIEW Chapter 1 Product Overview Overview The MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments* using the unlicensed ISM bands in North America, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor and enhanced security. The xDot features an integrated ARM Cortex-M3 processor and mbedTM compatible software library for developers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications.
*Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In dense urban environments, a typical range is 1-2 miles. Documentation Overview This manual is one part of xDot documentation. Refer to the Related Documentation and mbed sections for additional information needed to program your xDot and integrate your application with the MultiConnect Conduit gateway. This document includes:
xDot device information: including mechanical drawings, specifications, safety and regulatory information, Developer Kit information: including design considerations, schematics, and installation and operation and other device specific content. information. This current version of this manual is available at www.multitech.com/support. Related Documentation DOT Series AT Command Reference: Includes details on the AT commands available for xDots. MultiTech Developer Site: Application notes, LoRa information, and documentation for related products such as the MultiConnect Conduit (MTCDT) gateway and the LoRa accessory card (MTAC-LORA) are available on the MultiTech developer site. This site includes information on using the Conduit with xDots. Go to:
www.multitech.net Processor Datasheet: ST ARM Cortex-M3 processor (STM32L151CCU6) datasheet is available on the ST website: http://www.st.com/resource/en/datasheet/stm32l151cc.pdf mbed Documentation ARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-M microcontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapid prototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, and supported development boards, an online compiler and online developer collaboration tools. Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit
(MTCDT) with an MTAC-LORA accessory card installed. 6 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 1 PRODUCT OVERVIEW Programming the xDot Microcontroller Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on a developer board. Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting binary file to the mbed USB drive, and reset the xDot. On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries. MultiTech offers both development and stable release versions of the library. Development version: libmxDot-dev-mbed5 Stable release version: libmxDot-mbed5 You can use either the mbed online compiler or offline tools. Online: Use the mbed-os library in your mbed application Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application. General mBed Links Explore mbed: http://developer.mbed.org/explore Getting Started with mbed: http://developer.mbed.org/getting-started mbed Handbook: http://developer.mbed.org/handbook/Homepage mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md mbed workspace tools documentation: https://github.com/ARMmbed/mbed-
os/blob/master/docs/BUILDING.md#workspace-tools xDot Platform The xDot mbed page includes the xDot library, firmware, and test cases https://developer.mbed.org/platforms/MTS-xDot-L151CC/
EUI and Networking xDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI:
AT+DI=<8-BYTE-HEX-MSB>
AT+DI=001122AABBCCDDEE For information on setting up xDots as part of a LoRa network, go to www.multitech.net. MultiConnect xDotTM MTXDOT Developer Guide 7 CHAPTER 1 PRODUCT OVERVIEW Product Build Options Product North America MTXDOT-NA1-A00 MTXDOT-NA1-A01 EMEA MTXDOT-EU1-A00 MTXDOT-EU1-A01 Developer Kits MTMDK-XDOT-NA1-A00 MTMDK-XDOT-EU1-A00 Description 915 MHz LoRa Module UFL/TRC (NAM) 915 MHz LoRa Module TRC (NAM) 868 MHz LoRa Module UFL/TRC (EU) 868 MHz LoRa Module TRC (EU) Package Quantity 1 or 100 100 1 or 100 100 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDot Note:
The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revision and x is the revision number. 8 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 2 GETTING STARTED Chapter 2 Getting Started Getting Started with the xDot Developer Kit Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide. Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and the other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on which pins are available out of the box. Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/
To send commands to the xDot:
Plug the developer board into a USB port. 1. 2. Open communications software, such as TeraTerm, Putty, or Minicom. 3. Set the following:
Baud rate = 115,200 Data bits = 8 Parity = N Stop bits = 1 Flow control = Off To develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation for details and links. For help setting up a MultiConnect Conduit to send data to and from an xDot, refer to Related Documentation . COM Port Enumeration by Operating System xDots create an AT Commands port and a debug port. Linux The following COM ports are created on Linux systems:
/dev/ttyACMx
/dev/ttyACMy Where x and y may be 0 and 1, 3 and 4, etc. The COM port with lower number is the AT command port and COM port with the higher number is the debug port. Windows On Windows systems, COM ports appear in the Device Manager:
Debug Port: mbed Serial Port MultiConnect xDotTM MTXDOT Developer Guide 9 CHAPTER 2 GETTING STARTED AT Command Port: XR21V1410 USB UART You may need to install a driver for the debug port to function properly. Go to:
https://developer.mbed.org/handbook/Windows-serial-configuration Mac On Mac systems, COM ports appear in the Device Manager as:
/dev/cu.usbmodemx Where x is a string of numbers and possibly letters, ending in a number. The COM port with lower number is the AT command port and COM port with the higher number is the debug port. 10 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS Chapter 3 Mechanical Drawings with Pinouts xDot MultiConnect xDotTM MTXDOT Developer Guide 11 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Chapter 4 Specifications and Pin Information MTXDOT Specifications Category Description General Compatibility Interfaces LoRaWAN 1.0 specifications Note that pin functions are multiplexed. Up to 19 digital I/O Up to 10 analog inputs 2 DAC outputs I2C SPI Wake pin Reset pin Full UART mbed/simple UART (RX & TX only) mbed programming interface CPU Performance CPU Max Clock Flash Memory EEPROM SRAM Backup Register Radio Frequency ISM Bands Physical Description Weight Dimensions RF Connectors
-UFL Models
-Trace Models 32 MHz 32 MHz 256 KB, with xDot library 136 KB available; with AT firmware, 56 KB available 8 KB, available 6 KB 32 KB 128 byte, available 88 863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHz 0.0001 oz. (0.003g) Refer to Mechanical Drawings for Dimensions. U.FL Trace Connection 12 MultiConnect xDotTM MTXDOT Developer Guide
-40 C to +85 C
-40 C to +85 C Description Category Environment Operating Temperature Storage Temperature Humidity Power Requirements Operating Voltage Certifications and Compliance EMC and Radio Compliance 2.4 to 3.57 V 20%-90% RH, non-condensing EN 300 220-2 V2.4.1:2012 EN 301 489-03 V1.6.1:2013 FCC 15.247:2015 FCC 15.109:2015 FCC 15.107:2015 RSS 247:2015 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION EN 300 220-2 V2.4.1:2012 ICES-003:2012 CISPR 22:2008 AS/NZS CISPR 22 AS/NZS 4268:2012 + a1:2013 Standard 2014 MPE Safety Compliance UL 60950-1 2nd ED cUL 60950-1 2nd ED IEC 60950-1 2nd ED AM1 + AM2 AS/NZS 60950.1:2015 Category Transmission Max Transmitter Power Output (TPO) Maximum Receive Sensitivity Link Budget1 Max Effective Isotropic Radiated Power (EiRP) Description North America 19 dBm
-137 dBm EMEA 14 dBm
-137 dBm 147 dB Point-to-Point 22 dBm 147 dB Point-to-Point 10 dBm MultiConnect xDotTM MTXDOT Developer Guide 13 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Receive Sensitivity Spreading Factor 6 7 8 9 10 11 12 Description North America Typical Sensitivity2
-111 dBm
-116 dBm
-119 dBm
-122 dBm
-125 dBm
-127 dBm
-129 dBm EMEA Typical Sensitivity3
-121 dBm
-124 dBm
-127 dBm
-130 dBm
-133 dBm
-135 dBm
-137 dBm 1Greater link budget is possible with higher gain antenna. 2RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path. 3RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx path. Mapping Data Rate to Spreading Factor/Bandwidth US/AU EU Uplink DR0: SF10BW125 DR1: SF9BW125 DR2: SF8BW125 DR3: SF7BW125 DR4: SF8BW500 DR5-DR7: RFU Downlink DR8: SF12BW500 DR9: SF11BW500
... DR13: SF7BW500 DR0: SF12BW125
... DR5: SF7BW15 DR6: SF7BW250 DR7: FSK 14 MultiConnect xDotTM MTXDOT Developer Guide Power Draw CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Note:
Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source when determining product load. Transmit power measured with MTXDOT-NA1-xxx transmitting to a MultiConnect Conduit with an Power measurements are similar for MTXDOT-EU1-xxx models. Some 868 MHz sub-band frequencies MTAC-LORA-915 accessory card installed. do not support maximum TXP power of 20. Idle current measured with the xDot joined with Conduit, but idle without data transferring. Transmit power measured while transferring data packets using spread factor 9. Packet size limited to 53 bytes. The Conduit was set to receive packets from and send back to the xDot. A script was run to send the packet 100 times with either 10 or 53 bytes of data, with an average measurement taken during that time. For Inrush charge, recorded the highest observed value from five separate measurements. Voltage USB = 5v LDO = 3.3 LDO = 3.3 Voltage USB =
5v Standby Mode Current, (Sleep = 0 Deep Sleep) 1.9uA 1.9uA Stop Mode Current,
(Sleep = 1) 2.2uA 2.2uA Average Current
(Amps) at Low Transmit Power Setting (TXP 2) Average Current
(Amps) at Default Transmit Power Setting (TXP 11) LDO = 3.3 LDO = 3.3 0.013 0.017 0.017 0.024 Measuring the Power Draw To measure the power draw on an xDot developer board:
Idle current Average Spreading Factor Setting Packet Size (#
Bytes) 11.1mA 11.1mA DR1 - SF9BW125 DR1 - SF9BW125 10 53 Average Current
(Amps) at Maximum Transmit Power Setting (TXP 20) 0.018 0.025 Total Inrush Charge measured in MilliCoulombs Total Inrush Charge DURATION during Powerup (INRUSH Duration) 0.132mC 0.132mC 153uS 147uS Flash the latest AT command firmware on the xDot. 1. 2. Unplug the xDot from the computer and then reconnect it. 3. Connect current meter across JP30 on the developer board. Set wake pin to wake, AT+WP=6. 4. Set wake mode to interrupt, AT+WM=1. 5. 6. Put the xDot to sleep, AT+SLEEP=0|1. 7. Put jumper across JP5. Note: After this step, AT command and debug ports no longer work. 8. Measure current draw. 9. Press the S2 button on the developer board to wake the xDot MultiConnect xDotTM MTXDOT Developer Guide 15 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Electrical Characteristics Description Signal Vin Low Input low level Input high level Vin High Output low level Vout Low Vout High Output high level Min
--
0.45 * VDD +0.6
--
0.4 VCC ICC Standard operating voltage 2.4 Operating current (mA)
@5V Operating current (mA)
@3.3V
--
--
Max 0.3 * VDD
--
.4
--
3.6 135 200 xDot and Processor Pin Information Pin Information Note:
Using the mbed platform expands your pin functionality options. Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left) The xDot is 0.045 x 0.045, board is 0.93 x 0.93 16 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name 25 9 PB12 SPI2_NSS Function Description GPIO / SPI 26 10 PB13 SPI2_SCK GPIO / SPI 28 11 PB15 SPI2_MOSI GPIO / SPI 27 12 PB14 SPI2_MISO GPIO / SPI 30 31 12 13 20 18 15 14 13 14 15 16 23 24 25 26 PA9 PA10 PA2 PA3 PB2 PB0 PA5 PA4 UART1_TX GPIO / UART UART1_RX GPIO / UART UART2_TX UART2_RX GPIO3 GPIO2 Debug UART Debug UART GPIO GPIO GPIO1 GPIO0 GPIO GPIO 45 27 PB8 I2C1_SCL GPIO / I2C Processor Pin Alt2 ADC_IN18/
COMP1_INP/
VLCDRAIL2 ADC_IN19/
COMP1_INP ADC_IN21/
COMP1_INP/
RTC_REFIN ADC_IN20/
COMP1_INP
-
-
VLCDRAIL1/ ADCIN0b ADC_IN8/
COMP1_INP/
OPAMP2_VOUT/
VLCDRAIL3/
VREF_OUT ADC_IN5/
DAC_OUT2/
COMP1_INP ADC_IN4/
DAC_OUT1/
COMP1_INP
-
Processor Pin Alt1 TIM10_CH1/
I2C2_SMBA/
SPI2_NSS/
I2S2_WS/
USART3_CK/
LCD_SEG12 TIM9_CH1/
SPI2_SCK/
I2S2_CK/
USART3_CTS/
LCD_SEG13 TIM11_CH1/
SPI2_MOSI/
I2S2_SD/
LCD_SEG15 TIM9_CH2/
SPI2_MISO/
USART3_RTS/
LCD_SEG14 USART1_TX/
LCD_COM1 USART1_RX/
LCD_COM2 BOOT1 TIM3_CH3/
LCD_SEG5 TIM2_CH1_ETR/
SPI1_SCK SPI1_NSS/
SPI3_NSS/
I2S3_WS/
USART2_CK TIM4_CH3/
TIM10_CH1/
I2C1_SCL/
LCD_SEG16 MultiConnect xDotTM MTXDOT Developer Guide 17 Processor Pin Alt1 TIM4_CH4/
TIM11_CH1/
I2C1_SDA/
LCD_COM3 JTCK-SWCLK JTMS-SWDIO USART1_RTS/
SPI1_MOSI USART1_CTS/
SPI1_MISO
-
TIM2_CH1_ETR/
TIM5_CH1/
USART2_CTS Processor Pin Alt2
-
-
-
USB_DP USB_DM
-
WKUP1/
RTC_TAMP2/
ADC_IN0/
COMP1_INP CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name 46 28 PB9 I2C1_SDA Function Description GPIO / I2C MBED SWCLK MBED SWDIO GPIO / UART PA14 PA13 PA12 PA11 UART1_RTS UART1_CTS GPIO / UART NRST PA0-WKUP1 WAKE NRESET GPIO / WAKE ANT1 RFU (ANT2) GND Reserved LORA Radio LORA Radio LORA Radio LORA Radio LORA Radio LORA Radio LORA Radio LORA_DIO0 LORA_DIO1 LORA_DIO2 LORA_DIO3 LORA_DIO4 LORA_MISO LORA_MOSI VSS PA6 PA7 PA8 PB6 PB7 PB4 PB5 37 34 33 32 7 10 29 30 31 32 33 34 8,23,35
,47,49 37 47 1, 5, 17, 20,35, 36, 38, 39, 40, 41, 42, 43, 44, 45, 46, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58 2, 6, 7, 8, 18, 19, 21, 22 16 17 29 42 43 40 41 18 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name 38 11 39 22 19 21 2 44 3 4 5 6 LORA_NSS LORA_RESET LORA_SCK SE_CLK SE_CTRL SE_IO PA15 PA1 PB3 PB11 PB1 PB10 PC13-WKUP2 SE_RESET BOOT0 PC14-
OSC32_IN(4) PC15-
OSC32_OUT PH0-
OSC_IN(5) PH1-
OSC_OUT(5) xDot Pin 33 Pull-Up/Down 48QFN 7 38 19 44 Pin Name NRST PA15 PB1 BOOT0 Function Description LORA Radio LORA Radio LORA Radio Secure Element Secure Element Secure Element Secure Element Boot0 RTC_CLK RTC_CLK Main 24M Main 24M SW Name LORA_NSS SE_CTRL Processor Pin Alt1 Processor Pin Alt2
-
-
-
-
-
-
OSC32_IN OSC32_OUT OSC_IN OSC_OUT PU/PD 10k PU 100k PU 10k PU 10k PD MultiConnect xDotTM MTXDOT Developer Guide 19 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION xDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. All pins that go to connectors are directly connected to the processor. Refer to Pin Information table for pull up and pull down information. xDots allow you to program pins depending on your application:
Serial: Available out of the box. See Serial Pinout Notes for details. mbed: Designed with the STM32L151CCU6 48-pin processor, this option provides the most flexibility. For more information about processor capabilities, see the processor datasheet. Serial Pinout Notes Out of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model for pin locations. 18 PTA1 UART1_CTS 19 PTA2 UART1_RTS 36 PTC3 UART1_RX 37 PTC4 UART1_TX Serial Settings When creating a serial connection with the device on the developer board, open communications software (such as TeraTerm, Putty, or Minicom ), and use the following settings:
Baud rate = 115,200 Data bits = 8 Parity = N Stop bits = 1 Flow control = Off LoRa Throughput Rates Theoretical maximum speeds for LoRa mode with ACKs off are:
Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps). Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps). Note: Data rates in the LoRaWAN specification vary by geographic region. Range Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Use the following formula to calculate the maximum range:
20 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION The following table provides example settings and the theoretical maximum range based on these settings. Example Frequency TX Power TX Antenna Gain RX Sensitivity1 RX Antenna Gain Fade Margin2 Distance Distance 18dB Transmit Power for 915 MHz Models 915 19 3
-120 3 30 8.14 13.08 Units MHz dBm dB dBm dB dB Miles Km Example 14dB Transmit Power for 868MHz Models 868 14 3
-120 3 30 5.41 8.70 1RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm. 2Fade Margin is set at the worst case of 30dB. Fade margin is an allowance a system designer includes to account for unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade margin set to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. The amount of fade margin to include in a calculation depends on the environment in which you will deploy the system. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm. MultiConnect xDotTM MTXDOT Developer Guide 21 CHAPTER 5 ANTENNAS Chapter 5 Antennas Antenna System The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. If changes are made to the device's certified antenna system, then recertification will be required. This radio transmitter has been tested with both the Pulse and Ethertronics antennas listed below. If you follow our design guidelines, you do not need to re-certify your design. The antenna you use must maintain the same specifications. It must be of the same type, with similar in-band and out-of-band radiation patterns. Antennas having a greater gain than the maximum gain indicated for the listed type, are strictly prohibited for use with this device. U.FL and Trace Antenna Options If using U.FL or trace antennas, note the following:
For a simple trace to RF antennas: Routing must follow standard RF design rules and practices for stripline/miscrostrip for a 50 ohm impedance line. Use the developer board schematics for a reference circuit for the a trace antenna. For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance of the SMA antenna as listed in the next topic. The xDot Developer Board includes an Ethertronics M620710-1K chip antenna, which by default connects the xDot to the chip antenna. Only one antenna, either U.FL or chip, may be used at a time. To use the xDots U.FL connector, remove resistor C23 and L1, marked on the following image, to disconnect the chip antenna. 22 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Pulse Electronics Antenna Manufacturer:
Description:
Model Number:
MultiTech Part Number:
Pulse Electronics 868-915 MHz RP-SMA Antenna, 8"
W1063 45009830L MultiTech ordering information:
Ordering Part Number AN868-915A-1HRA AN868-915A-10HRA AN868-915A-50HRA Antenna Specifications Category Frequency Range Impedance VSWR Gain Radiation Quantity 1 10 50 Description 868-928 MHz 50 Ohms
< 2.0 3.0 dBi Omni MultiConnect xDotTM MTXDOT Developer Guide 23 CHAPTER 5 ANTENNAS Category Polarization Description Vertical RSMA-to-U.FL Coaxial Cables Coaxial Cable Specifications Optional antenna cables can be ordered from MultiTech Coaxial Cable
<1.0db 50 ohm 16" (40 cm) Cable Type Attenuation Connector Impedance Maximum Cable Length Ordering Information Part Number CARSMA-UFL-1 CARSMA-UFL-10 CARSMA-UFL-100 Description RSMA-to-UFL Coax Cable (Single Pack) RSMA-to-UFL Coax Cable (Ten Pack) RSMA-to-UFL Coax Cable (One Hundred Pack) 24 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Ethertronics Chip Antenna This is the developer board's default antenna. Manufacturer:
Description:
Model Number:
Datasheet:
Ethertronics 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount M620710-1K http://www.ethertronics.com/files/2914/0652/9246/2-
Savvi_M620710_ISM__6x2.pdf Antenna Specifications Category Electrical Specifications Frequency Range Peak Gain VSWR Impedance Average Efficiency Power Handling Polarization Mechanical Specifications Mounting Size Description 902928 MHz 2.56 dBi 2:6:1 max 50 ohms unbalanced 58%
0.5 Watt cw Linear Surface Mount 6.00 x 2.00 x 1.1mm Stackup Information Developer Board Layer Stackup MultiConnect xDotTM MTXDOT Developer Guide 25 CHAPTER 5 ANTENNAS Stackup Table Impedance Polar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space. 26 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space. MultiConnect xDotTM MTXDOT Developer Guide 27 CHAPTER 5 ANTENNAS Chip Antenna Design Guidelines When designing antenna placement for the chip antenna, note the following:
The antenna's long side must be along the edge of the ground plane. Remove the ground plane from all layers below the antenna. The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm. The distance from the antenna to relatively large perturbations, such as a shield or large components, depends on the height of surrounding components. It should not be less than 1.5mm. We recommend a distance equal to or greater than 10mm from the end of the antenna to either end of the PCB distance. Performance is better from larger distances. Use the recommended land pattern shown in the figures below. Land patterns are composed of a 50 ohm line connected to each antenna feed point. Ground clearance around and under the antenna as shown in the PCB layout is recommended to maximize antenna performance. 28 MultiConnect xDotTM MTXDOT Developer Guide Antenna Pad Layout CHAPTER 5 ANTENNAS PCB Layout MultiConnect xDotTM MTXDOT Developer Guide 29 CHAPTER 5 ANTENNAS OEM Integration FCC & IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations:
47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4. FCC Grant Notes The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may be necessary. FCC Definitions Portable: (2.1093) A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile: (2.1091) A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitters radiating structure(s) and the body of the user or nearby persons. Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specific information required to satisfy RF exposure compliance for installations and final host devices. (See note under Grant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee. Note: Host design configurations constituting a device for portable use (<20 cm from human body) require separate FCC/IC approval. Host Labeling The following statements are required to be on the host label:
This device contains FCC ID: AU792U13A16858 This device contains equipment certified under IC: 125A-0055 For labeling examples, see Cellular Approvals and Labeling Requirements. 30 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 6 SAFETY INFORMATION Chapter 6 Safety Information Handling Precautions To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellular device. Although input protection circuitry has been incorporated into the devices to minimize the effect of static build-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting the device. Radio Frequency (RF) Safety Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment. Follow the safety advice given below. Operating your device close to other electronic equipment may cause interference if the equipment is inadequately protected. Observe any warning signs and manufacturers recommendations. Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use of radio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow restrictions for any environment where you operate the device. Do not place the antenna outdoors. Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction may lead to suspension or denial of cellular services to the offender, legal action, or both. Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle with fuel. Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use. Scurit relative aux appareils radiofrquence (RF) cause du risque d'interfrences de radiofrquence (RF), il est important de respecter toutes les rglementations spciales relatives aux quipements radio. Suivez les conseils de scurit ci-dessous. Utiliser l'appareil proximit d'autres quipements lectroniques peut causer des interfrences si les quipements ne sont pas bien protgs. Respectez tous les panneaux d'avertissement et les recommandations du fabricant. Certains secteurs industriels et certaines entreprises limitent l'utilisation des appareils cellulaires. Respectez ces restrictions relatives aux quipements radio dans les dpts de carburant, dans les usines de produits chimiques, ou dans les zones o des dynamitages sont en cours. Suivez les restrictions relatives chaque type d'environnement o vous utiliserez l'appareil. Ne placez pas l'antenne en extrieur. teignez votre appareil sans fil dans les avions. L'utilisation d'appareils lectroniques portables en avion est illgale: elle peut fortement perturber le fonctionnement de l'appareil et dsactiver le rseau cellulaire. S'il ne respecte pas cette consigne, le responsable peut voir son accs aux services cellulaires suspendu ou interdit, peut tre poursuivi en justice, ou les deux. teignez votre appareil sans fil proximit des pompes essence ou de diesel avant de remplir le rservoir de votre vhicule de carburant. MultiConnect xDotTM MTXDOT Developer Guide 31 CHAPTER 6 SAFETY INFORMATION teignez votre appareil sans fil dans les hpitaux ou dans toutes les zones o des appareils mdicaux sont susceptibles d'tre utiliss. Interference with Pacemakers and Other Medical Devices Potential interference Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted cardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for the Advancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure that cardiac pacemakers and defibrillators are safe from cellular device EMI. The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interference occurs, the FDA will assess the interference and work to resolve the problem. Precautions for pacemaker wearers If EMI occurs, it could affect a pacemaker in one of three ways:
Stop the pacemaker from delivering the stimulating pulses that regulate the heart's rhythm. Cause the pacemaker to deliver the pulses irregularly. Cause the pacemaker to ignore the heart's own rhythm and deliver pulses at a fixed rate. Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers. However, people with pacemakers may want to take simple precautions to be sure that their device doesn't cause a problem. Keep the device on the opposite side of the body from the pacemaker to add extra distance between the pacemaker and the device. Avoid placing a turned-on device next to the pacemaker (for example, dont carry the device in a shirt or jacket pocket directly over the pacemaker). Device Maintenance When maintaining your device:
Do not attempt to disassemble the device. There are no user serviceable parts inside. Do not expose your device to any extreme environment where the temperature or humidity is high. Do not expose the device to water, rain, or spilled beverages. It is not waterproof. Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The information contained on discs or cards may be affected by the device. Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with MultiTech's accessory specifications may invalidate the warranty. If the device is not working properly, contact MultiTech Technical Support. User Responsibility Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft. 32 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 7 REGULATORY INFORMATION Chapter 7 Regulatory Information EMC, Safety, and R&TTE Directive Compliance The CE mark is affixed to this product to confirm compliance with the following European Community Directives:
Council Directive 2014/30/EU on the approximation of the laws of Member States relating to electromagnetic compatibility;
and Council Directive 2014/35/EU on the harmonization of the laws of Member States relating to electrical equipment designed for use within certain voltage limits;
and Council Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment;
and Council Directive 1999/5/EC on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity. 47 CFR Part 15 Regulation Class B Devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. FCC Interference Notice Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Notice xDot products are open development based products that contain a sub ghz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 & IC RSS 247:2015) MultiConnect xDotTM MTXDOT Developer Guide 33 CHAPTER 7 REGULATORY INFORMATION MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. Users are prohibited from making any changes that affect the operation of the radio performance. Accessing or controlling the radio through any means other than the provided binary software will require the user to obtain their own intentional radiator license from the certification body governing their locality, as all pre-certification provided with xDot will have been made invalid. Industry Canada Class B Notice This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numrique de la classe B respecte toutes les exigences du Reglement Canadien sur le matriel brouilleur. This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for the following two conditions:
1. 2. the device may not cause harmful interference, and the user of the device must accept any interference suffered, even if the interference is likely to jeopardize the operation. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
1. 2. l'appareil ne doit pas produire de brouillage, et l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. 34 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 8 ENVIRONMENTAL NOTICES Chapter 8 Environmental Notices Waste Electrical and Electronic Equipment Statement Note: This statement may be used in documentation for your final product applications. WEEE Directive The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to take-
back electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements. Instructions for Disposal of WEEE by Users in the European Union The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or where you purchased the product. July, 2005 MultiConnect xDotTM MTXDOT Developer Guide 35 CHAPTER 8 ENVIRONMENTAL NOTICES REACH Statement Registration of Substances After careful review of the legislation and specifically the definition of an article as defined in EC Regulation 1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would be considered as articles. In light of the definition in 7.1(b) which requires registration of an article only if it contains a regulated substance that is intended to be released under normal or reasonably foreseeable conditions of use, Our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intended and anticipated use. Substances of Very High Concern (SVHC) Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewed these substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU REACH requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the European Chemicals Agency, and relevant substances have been confirmed, that exceeds greater than 0.1% (w/w), Multi-
Tech Systems, Inc. will provide updated compliance status. Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliant through a formalized process which includes collection and validation of materials declarations and selective materials analysis where appropriate. This data is controlled as part of a formal quality system and will be made available upon request. 36 MultiConnect xDotTM MTXDOT Developer Guide Restriction of the Use of Hazardous Substances (RoHS) CHAPTER 8 ENVIRONMENTAL NOTICES Multi-Tech Systems, Inc. Certificate of Compliance 2011/65/EU Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS). These MultiTech products do not contain the following banned chemicals1:
Lead, [Pb] < 1000 PPM Mercury, [Hg] < 1000 PPM Hexavalent Chromium, [Cr+6] < 1000 PPM Cadmium, [Cd] < 100 PPM Polybrominated Biphenyl, [PBB] < 1000 PPM Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM Environmental considerations:
Moisture Sensitivity Level (MSL) =1 Maximum Soldering temperature = 260C (in SMT reflow oven) 1Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration would be found in some modules (>1000 PPM);
- Resistors containing lead in a glass or ceramic matrix compound. MultiConnect xDotTM MTXDOT Developer Guide 37 CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII). Hazardous/Toxic Substance/Elements Name of the Component Lead
(PB) Mercury
(Hg) Cadmium
(CD) Hexavalent Chromium
(CR6+) Printed Circuit Boards Resistors Capacitors Ferrite Beads Relays/Opticals ICs Diodes/ Transistors Oscillators and Crystals Regulator Voltage Sensor Transformer Speaker Connectors LEDs Screws, Nuts, and other Hardware AC-DC Power Supplies Software /Documentation CDs Booklets and Paperwork Chassis O X X O O O O X O O O O O O X O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O Polybromi nated Biphenyl
(PBB) O O O O O O O O O O O O O O O O O O O Polybrominat ed Diphenyl Ether (PBDE) O O O O O O O O O O O O O O O O O O O X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneous material of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits. O Represents that no such substances are used or that the concentration is within the aforementioned limits. 38 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese)
(MII) (EIP) 39 RoHS, Multi-Tech Systems, Inc.
(TS) (HS)
(PB) (Hg) (CD) (CR6+)
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LEDs
-
/ CD O X X O O O O X O O O O O O X O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O
(PBB) O O O O O O O O O O O O O O O O O O O
(PBDE) O O O O O O O O O O O O O O O O O O O X / SJ/Txxx-2006 O MultiConnect xDotTM MTXDOT Developer Guide 39 CHAPTER 9 LABELS Chapter 9 Labels Label Examples Note: Actual labels vary depending on the regulatory approval markings and content. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is not the actual size. 1 - MultiTech Model Identification. 2 - MultiTech Ordering Part Number. 3 - Device Node Number. Example xDot Device Label Example Developer Board Device Label 40 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 10 DEVELOPER KIT OVERVIEW Chapter 10 Developer Kit Overview xDot Developer Kit The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application. Developer Kit Package Contents Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following:
Developer Board Customer Notices 1 - xDot Developer Board with xDot Quick Start Firmware Updates Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/
Programming Devices in Production Consult developer kit schematics for programming options. MultiConnect xDotTM MTXDOT Developer Guide 41 CHAPTER 10 DEVELOPER KIT OVERVIEW xDot Developer Kit Mechanical Drawings Note: The Reset and Wake buttons reset and wake the xDot processor. 42 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 10 DEVELOPER KIT OVERVIEW Micro Developer Board LEDs LED LED1 LED3/SDA LED2/PWR LED4/PROXY Description User-definable LED. Programming Status. Power, blue light when the board has power. LED for the proximity sensor, which is next to it (labeled U14 on the top assembly diagram). MultiConnect xDotTM MTXDOT Developer Guide 43 CHAPTER 11 DEVELOPER BOARD SCHEMATICS Chapter 11 Developer Board Schematics Assembly Diagrams and Schematics Assembly Diagrams Top 44 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS Bottom MultiConnect xDotTM MTXDOT Developer Guide 45 CHAPTER 11 DEVELOPER BOARD SCHEMATICS Schematics 46 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect xDotTM MTXDOT Developer Guide 47 CHAPTER 11 DEVELOPER BOARD SCHEMATICS 48 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect xDotTM MTXDOT Developer Guide 49 CHAPTER 12 DESIGN CONSIDERATIONS Chapter 12 Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels and quality. Noise in frequency ranges that affect modem performance is of particular concern. On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments. Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification. Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes. PC Board Layout Guideline In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide. The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the device vertically in place during the wave solder process. Electromagnetic Interference The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels. Keep traces carrying high frequency signals as short as possible. Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for ground and power distribution. Decouple power from ground with decoupling capacitors as close to the device's power pins as possible. Eliminate ground loops, which are unexpected current return paths to the power source and ground. Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines; however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design aid is to place footprints for these components and populate as necessary during performance/EMI testing and certification. Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple power lines are similar to decoupling telephone lines. 50 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 12 DESIGN CONSIDERATIONS Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. Locate cables and connectors to avoid coupling from high frequency circuits. Lay out the highest frequency signal traces next to the ground grid. If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground plane covers all traces. Minimize the number of through-hole connections on traces carrying high frequency signals. Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces. Distribute high frequency signals continuously on a single trace rather than several traces radiating from are better. one point. Electrostatic Discharge Control Handle all electronic devices with precautions to avoid damage due to the static charge accumulation. See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) a document for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment. This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing. MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling. MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers. MultiConnect xDotTM MTXDOT Developer Guide 51 CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Chapter 13 Mounting xDots and Programming Exter-
nal Targets Mounting the Device on Your Board A footprint diagram is included on the xDot Mechanical Diagram. Solder Profile Solder Paste: SAC NC 254 Note: Calculate slope over 120 seconds Name Max Rising Slope (Target=1.0) Max Falling Slope Soak Time 150-170C Peak Temperature Total Time Above 218C Low Limit 0
-2 15 235 30 High Limit 2
-0.1 45 250 90 Units Degrees/Second Degrees/Second Seconds Degrees Celsius Seconds 52 MultiConnect xDotTM MTXDOT Developer Guide CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Setpoints (Celsius) Zone Top Bottom Conveyer Speed 1 130 130 3 2 170 160 160 170 32.0 inch/minute 4 190 190 5 230 230 6 245 245 7 255 255 Max Rising Slope Max Falling Slope Soak Time 150-
Peak Temp Total Time /218C TC 1 2 3 Delta Position Slope 1.38
<TC2>
1.38
<TC3>
<TC4>
1.38 0.00 PWI 38%
38%
38%
PWI 45%
32%
36%
Slope
-0.63
-0.75
-0.70 0.12 170C Time 28.82 26.75 29.47 2.72 PWI
-8%
-22%
-4%
PWI
-30%
-17%
-39%
Temp 240.22 241.21 239.56 1.65 Time 43.61 43.66 43.29 0.37 PWI
-55%
-54%
-56%
xDot Packing xDots ship on 20 piece trays, which you can use for pick and place handling. Warning: Maximum temperature for these trays is 65 C. Programming External Targets You can use the xDot developer board to program external targets. To do this:
1. 2. Connect header JP1 to your target board with a 9-position ribbon cable.1 Apply power to your target board. MultiConnect xDotTM MTXDOT Developer Guide 53 CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS 3. When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbed programming interface to the external target. You can use the mbed programming environment as normal to program and debug the external target. 1MultiTech recommends the Samtec FFSD-05-D-06.00-01-N ribbon cable. JTAG/SWD Connector The developer board uses an unshrouded 10-pin header. Suitable connector headers include:
Harwin: M50-3500542 Mouser: 855-M50-3500542 Samtec shrouded header: FTSH-105-01-F-D-K The Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm). Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's red stripe. 54 MultiConnect xDotTM MTXDOT Developer Guide Index schematics Developer Board ...................................................44 A antenna ....................................................................22 23 developer board ......................................................25 antenna design guidelines ............................................28 assembly diagrams Developer Board ......................................................44 AT command port ............................................................................9 B baud rate.......................................................................20 board components Micro Developer Board............................................43 build options ...................................................................8 C cable coaxial ......................................................................24 certifications .................................................................12 Chinese hazardous substances Chinese version........................................................39 English version .........................................................38 Class B ..........................................................................33 Industry Canada.......................................................34 COM ports.......................................................................9 Conduit............................................................................6 D data bits ........................................................................20 debug port ......................................................................9 design guidelines antenna....................................................................28 device maintenance ............................................................32 dimensions ....................................................................11 documentation................................................................6 INDEX E electrical characteristics................................................16 electromagnetic interference .......................................50 electrostatic discharge..................................................51 EMI ................................................................................50 ESD ................................................................................51 EUI...................................................................................7 external targets.............................................................53 F FCC FCC Notice grant notes...............................................................30 Class B .....................................................................33 flow control...................................................................20 G ground plane.................................................................50 H handling precautions due to ESD..................................51 hazardous substances ...................................................37 host labeling..................................................................30 I Industry Canada Class B .....................................................................34 interfrence des radiofrquences.................................31 J JTAG connector .............................................................54 K KDB 447498 Section 8 ..................................................30 L labeling host ..........................................................................30 MultiConnect xDotTM MTXDOT Developer Guide 55 INDEX labels .............................................................................40 Linux................................................................................9 LoRa range ........................................................................20 related products..............................................................6 ribbon cable ..................................................................53 RoHS..............................................................................37 RSMA-to-UFL cable .......................................................24 M Mac .................................................................................9 maintenance .................................................................32 mbed ..............................................................................6 mechanical drawings.....................................................11 Micro Developer Board............................................42 MTAC-LORA.....................................................................6 MTCDT.............................................................................6 MultiConnect ..................................................................6 N network, connecting .......................................................7 noise suppression..........................................................50 P packing list ....................................................................41 parity .............................................................................20 PC board layout.............................................................50 pin information .............................................................16 pinout notes..................................................................20 ports ................................................................................9 power draw...................................................................15 measuring ................................................................15 processor.........................................................................6 programming external targets......................................53 R radio frequency interference........................................31 range .............................................................................20 receive sensitivity..........................................................12 S safety RF interference ........................................................31 safety standards............................................................50 serial settings ................................................................20 solder profile.................................................................52 specifications.................................................................12 static..............................................................................31 stop bits.........................................................................20 scurit interfrences RF.......................................................31 T trace antenna................................................................22 transmission..................................................................12 U U.FL antenna .................................................................22 user responsibility.........................................................32 W Windows .........................................................................9 X xDot packing..................................................................53 56 MultiConnect xDotTM MTXDOT Developer Guide
| 1 2 3 4 5 6 | 1912RSU050-UE-Internal Photo | Internal Photos | 678.58 KiB | February 14 2020 / February 17 2020 |
| 1 2 3 4 5 6 | Host Label | ID Label/Location Info | 232.96 KiB | December 26 2019 |
FCC / ISED Label Product information label drawing
<__ 1.5 __ >
1 Node ID;
OR code This is the size on the current label 00 - 80 - 00 - 00 - 00 - 01 - 00- 12
| 1 2 3 4 5 6 | Label and Location | ID Label/Location Info | 198.62 KiB | December 26 2019 |
Model and regulatory label location:
Model ID Label Location FCC / ISED Label Location
| 1 2 3 4 5 6 | COVERED LIST ATTESTATION | Attestation Statements | 139.24 KiB | April 17 2023 / May 23 2023 |
Attention: Application Examiner Re: Covered List, located at https://www.fcc.gov/supplychain/coveredlist and 47 CFR parts 2.903 and 2.911(d)(5)(ii) of the FCC rules Applicant: Multi-Tech Systems, Inc. FCC ID: AU792U13A16858 To whom it may concern, Multi-Tech Systems, Inc. (Applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to 47 CFR part 2.903 of the FCC rules and does not originate directly or indirectly from any company named on the covered list located in the link above or any subsidiary or affiliate thereof. Applicant further certifies that, as of the date of the filing of the application, the Applicant is not identified on the Covered List as an entity producing covered equipment and is not a subsidiary or affiliate of any such entity pursuant to 47 CFR part 1.50002 and required by 47 CFR part 2.911(d)(5)(ii) of the FCC rules. I HEREBY CERTIFY THAT I am authorized to make the representations above on behalf of the Applicant and agree to immediately notify Intertek if there is any change in the status identified above. Tim Gunn Director of Certifications Multi-Tech Systems, Inc 02-14-2023 Multi-Tech Systems, Inc. 2205 Woodale Drive Mounds View, Minnesota 55112 U.S.A.
(763) 785-3500 or (800) 328-9717 Fax (763) 785-9874 www.multitech.com
| 1 2 3 4 5 6 | GRANTEE SIGNATURE AUTHORIZATION | Cover Letter(s) | 141.78 KiB | April 17 2023 / May 23 2023 |
12/05/2022 To whom it may concern, We, the undersigned, hereby authorize Darin Hatcher of Connected Development to make a Class II Permissive change application to FCC ID: AU792U13A16858 and IC: 125A-0055 for the following reason:
Allow a new antenna type. This authorization gives authority to Darin Hatcher to act on our behalf, as our agent, in the following matters related to the FCC and/or Industry Canada approval of this product: report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain this Class II Permissive change certification. Any act carried out by Darin Hatcher within the scope of this authorization shall have the same effect as our own. This authorization shall expire 12 months from original date. Sincerely, Tim Gunn Director of Certifications and Product Support
| 1 2 3 4 5 6 | MODULE ATTESTATION | Attestation Statements | 110.25 KiB | April 17 2023 / May 23 2023 |
KDB 388624 - Limited Modular (MODLIM) rule part specific Pre-Approval Guide (PAG) document. This Limited Modular and new antenna type Class II Permissive Change request for this radio is based on the following information:
FCC ID: AU792U13A16858 Addition of a new antenna type. New antenna type limited to the host device application. Grant notes for C2PC Limited Module to contain wording limiting this to the Water Meter application host device as tested. The new antenna type is for an underlid mount application of an Omnidirectional folded dipole antenna for use with water meter valve host application. This antenna is designed and owned by the host device manufacturer. Reference KDB guidance: KDB 178919 D01 Section II, A, 3, (New antenna type) and FCC Part 15.203. Reference KDB guidance: KDB 178919 D01 section III paragraph B: Limited the installation to a specific host or hosts, and KDB 996369 III, B. Reference KDB guidance for testing: KDB 996369 D04 Module Integration Guide, and KDB 447498 RF exposure compliance. New antenna and module combination is tested in the host device/application and is limited to this host device. Test results for this application are based on the new antenna and module combination and tested in the host device. This limited module continues to comply with the antenna requirements of Section 15.203 and 15.204(c), as seen in the original single module approval. No changes are made to the antenna connector. No changes to the approved single module hardware or software have been made, and that single module approval remains valid. (FCC ID: AU792U13A16858) The original single module grant limitations remain. Reference:
Testing for this C2PC for new antenna type and limited to the host test device:
FCC Part 15B (15.109) and Part 15C (15.247) with host device and new antenna FCC Part 1.1310 Maximum Permissible Exposure
| 1 2 3 4 5 6 | US AGENT | Attestation Statements | 166.28 KiB | April 17 2023 / May 23 2023 |
Attention: Application Examiner Re: Certification designating a U.S. agent for service of process pursuant to 47 CFR part 2.911(d)(7) of the FCC rules To whom it may concern, This letter is to certify that Multi-Tech Systems, Inc. (Applicant) accepts responsibilities to act as its own agent pursuant to 47 CFR part 2.911(d)(7) of the FCC rules for service of process. I consent to the obligation to accept service of process on behalf of the Applicant for all certification applications to the FCC. I HEREBY CERTIFY THAT I am authorized to make the representations above on behalf of the Applicant. I further acknowledge the requirement to maintain an agent extends for no less than one year after the termination of all marketing and importation or the conclusion of and commission-related proceeding involving the equipment and agree to immediately notify the FCC if there is any change in the status identified above. Applicant Company Name Contact Name Address Telephone No Email Multi-Tech Systems,Inc. Tim Gunn 2205 Woodale Dr. Mounds View, MN 55112 763-717-5501 tgunn@multitech.com Signature:
Date:
02-14-2023 Multi-Tech Systems, Inc. 2205 Woodale Drive Mounds View, Minnesota 55112 U.S.A.
(763) 785-3500 or (800) 328-9717 Fax (763) 785-9874 www.multitech.com
| 1 2 3 4 5 6 | Auth letter | Cover Letter(s) | 169.58 KiB | March 31 2023 |
WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6451515.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case CREATE CONNECT COMMUNICATE Re: Authorization for GSI Group LLC, FCC ID: AU792U13A16858 Date: 8-8-2022 To Whom It May Concern:
This letter grants authorization for representatives of GSI Group LLC to apply to the FCC for a permissive change. This authorization applies to MultiTech xDot Long Range LoRa Module MTXDOT-NA1, FCC ID: AU792U13A16858. This Authorization shall expire 12 months from the original date. Sincerely, Tim Gunn Director of Certifications and Product Support MultiTech Systems Inc. tgunn@multitech.com 763-717-5501 Multi-Tech Systems, Inc. 2205 Woodale Drive Mounds View, Minnesota 55112 U.S.A.
(763) 785-3500 or (800) 328-9717 Fax (763) 785-9874 www.multitech.com
| 1 2 3 4 5 6 | FCC Agent for service Attestation | Attestation Statements | 764.77 KiB | March 31 2023 |
CFR 47 2.911 (d)(7) Agent Designation Attestation Date: 03-27-2023 FCC ID: AU792U13A16858 To: Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA GSI Group LLC (the applicant) as required by section 2.911(d)(7), will also serve as the agent for service of process for the above referenced FCC ID. The applicant acknowledges that they will maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment. The applicant further acknowledges their responsibility to inform the FCC whenever the agent information changes. Agent Name / Contact Person:
Clint Richter FRN:
Company Name:
0033470345 GSI Group LLC Company US Address:
1004 East Illinois Street, Assumption, IL 62510, USA Contact Person Email Address:
Clint.Richter@agcocorp.com Sincerely Yours, Clint Richter GSI Group LLC 1004 East Illinois Street, Assumption, IL 62510, USA Clint.Richter@agcocorp.com GSI Group LLC Assumption Operations 1004 E. Illinois St., Assumption, IL, 62510 USA Tel: 217.226.2467 | www.grainsystems.com
| 1 2 3 4 5 6 | FCC Attestation | Attestation Statements | 821.86 KiB | March 31 2023 |
CFR 47 2.911 (d)(5) Attestation Date: 02-20-2023 FCC ID: AU792U13A16858 To: Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA 1. GSI Group LLC (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. 2. GSI Group LLC (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment and is not an affiliate or subsidiary of an entity identified on the Covered List. Sincerely Yours, Clint Richter Chief Engineer, Product Certification GSI Group LLC GSI Group LLC Assumption Operations 1004 E. Illinois St., Assumption, IL, 62510 USA Tel: 217.226.2467 | www.grainsystems.com
| 1 2 3 4 5 6 | FCC II change letter | Cover Letter(s) | 739.14 KiB | March 31 2023 |
July 29, 2022 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Attn: OET Dept. Ref: FCC Class II Permissive change for FCC ID: AU792U13A16858
(Original Grant date: 11/10/2016) Applicant: Multi Tech Systems Inc. Dear Examiner, This is to request a Class II permissive change for FCC ID: AU792U13A16858, originally granted on 11/10/2016. The major change filed under this application is:
Change #1:
Change #2:
use of a helical monopole antenna (Taoglas HA.31.A) with existing MultiTech xDot Long Range LoRa Module MTXDOT-NA1. LoRa Module MTXDOT-NA1 is used with the helical monopole antenna (Taoglas HA.31.A) inside the host GrainVue Monitoring Hub (074-11954). If you have any questions regarding this application, please feel free to contact me. Sincerely Yours, Clint Richter Chief Engineer, Product Certification GSI Group LLC GSI Group LLC Assumption Operations 1004 E. Illinois St., Assumption, IL, 62510 USA Tel: 217.226.2467 | www.grainsystems.com
| 1 2 3 4 5 6 | FCC agent auth letter | Cover Letter(s) | 742.44 KiB | March 31 2023 |
July 29, 2022 Federal Communications Commission Equipment Authorization branch 7435 Oakland Mills Road Columbia, MD 21046 To whom it may concern:
I, the undersigned, hereby authorize UL Verification Services Inc. to act on our behalf in all manners relating to application for equipment authorization, including signing of all documents relating to these matters. Any and all acts carried out by UL Verification Services Inc. on our behalf shall have the same effect as acts of our own. I, the undersigned, hereby certify that we are not subject to a denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 853(a). In authorizing UL Verification Services Inc. as our representative, we still recognize that we are responsible to:
a) b) c) d) e) comply with the relevant provisions of the certification program;
make all necessary arrangements for the conduct of the evaluation, including provision for examining documentation and access to all areas, records (including internal audit reports) and personnel for the purposes of evaluation (e.g. testing, inspection, assessment, surveillance, reassessment) and resolution of complaints;
make claims regarding certification only in respect of the scope for which certification has been granted;
do not use our product certification in such a manner as to bring the Certification Division into disrepute and not make any statement regarding our product certification which the Certification Division may consider misleading or unauthorized;
upon suspension or cancellation of certification, discontinue use of all advertising matter that contains any reference thereto and return any certification documents as required by the Certification Division;
GSI Group LLC Assumption Operations 1004 E. Illinois St., Assumption, IL, 62510 USA Tel: 217.226.2467 | www.grainsystems.com f) g) h) i) j) use certification only to indicate the products are certified as being in conformity with specified standards;
endeavor to ensure that no certificate or report nor any part thereof is used in a misleading manner;
ensure that any reference to our product certification in communication media such as documents, brochures or advertising, complies with the requirements of the Certification Division;
keep a record of all complaints made known to us relating to the products compliance with requirements of the relevant standard and to make these records available when requested;
take appropriate action with respect to such complaints and any deficiencies found in products or services that affect compliance with the requirements for certification;
k) document the actions taken. This authorization is valid until further written notice from the applicant. Sincerely Yours, Clint Richter Chief Engineer, Product Certification GSI Group LLC GSI Group LLC Assumption Operations 1004 E. Illinois St., Assumption, IL, 62510 USA Tel: 217.226.2467 | www.grainsystems.com
| 1 2 3 4 5 6 | Request for confidentiality letter | Cover Letter(s) | 736.98 KiB | March 31 2023 |
Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject:
Request for Confidentiality FCC ID: AU792U13A16858 To Whom It May Concern:
Pursuant to the provisions of Sections 0.457 and 0.459 of the Commissions rules (47 CFR 0.457, 0.459), we are requesting the Commission to withhold the following attachments as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Theory of Operation Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, Clint Richter Chief Engineer, Product Certification GSI Group LLC March 30, 2023 GSI Group LLC Assumption Operations 1004 E. Illinois St., Assumption, IL, 62510 USA Tel: 217.226.2467 | www.grainsystems.com
| 1 2 3 4 5 6 | 1912RSU050-U1-RF Exposure Report | RF Exposure Info | 204.38 KiB | February 14 2020 / February 17 2020 |
| 1 2 3 4 5 6 | 1912RSU050-U2-FCC RF Test Report (Radiated Spurious Emission) | Test Report | 731.97 KiB | February 14 2020 / February 17 2020 |
| 1 2 3 4 5 6 | C2PC Cover Letter | Attestation Statements | 41.63 KiB | February 14 2020 / February 17 2020 |
FireHUD Inc. 1701 Oakbrook Dr. STE K Norcross, GA, 30093 Request for Class II Permissive Change FCC ID: AU792U13A16858 Data: February 12, 2020 TO: Federal Communication Commission Please be notified that we, the undersigned, FireHUD Inc. declare that the reasons for this Class II permissive change are as below:
Original Present Remark Product Type Single Module Portable device Portable device contains the single module Product Name Transmitter Module FireHUD Band N/A Model Number MTXDOT-NA1 1 N/A Data Rate 125kHz & 500kHz 125kHz Portable device only uses 125kHz Data Rate Antenna Type External Dipole Internal Ceramic N/A Antenna Antenna We attest that there is no any other hardware and software change to the module. Therefore, we only perform the RF Exposure evaluation with this portable device. Sincerely, Tyler Sisk FireHUD Inc.
| 1 2 3 4 5 6 | FCC Class II Permissive Change Authorization Letter FireHUD 10-3-19 | Cover Letter(s) | 114.65 KiB | February 14 2020 / February 17 2020 |
10/3/2019 To whom it may concern, We, the undersigned, hereby authorize Tyler Sisk of FireHUD Inc. to make a Class II Permissive change application to FCC ID: AU792U13A16858 and IC: 125A-0055 for the following reason: Portable operation testing. This authorization gives authority to Tyler Sisk to act on our behalf, as our agent, in the following matters related to the FCC and/or Industry Canada approval of this product:
report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain this Class II Permissive change certification. Any act carried out by to Tyler Sisk within the scope of this authorization shall have the same effect as our own. This authorization shall expire 12 months from original date. Sincerely, Tim Gunn Director of Product Support / Certifications MultiTech Systems
| 1 2 3 4 5 6 | FireHud Authorization | Cover Letter(s) | 65.34 KiB | February 14 2020 / February 17 2020 |
Date: January 17, 2020 le FireHUD Inc. 1701 Oakbrook Dr. STE K Norcross, GA, 30093 Declaration of Authorization We, FireHUD Inc.,1701 Oakbrook Dr. STE K Norcross, GA, 30093, declare that, MRT Technology
(Suzhou) Co., Ltd, D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone, Suzhou, China, is authorized to apply for Certification of the following product on our behalf:
Product description: FireHUD Band Model No.: 1 Trademark: FireHUD FCC ID: AU792U13A16858 Sincerely, Tyler Sisk FireHUD Inc.
| 1 2 3 4 5 6 | MultiTech ConfidentialityAgreement-signed | Cover Letter(s) | 111.29 KiB | February 14 2020 / February 17 2020 |
Multi Tech Systems Inc 2205 Woodale Drive Mounds View, MN 55112 Confidentiality Letter Date: January 13, 2020 Federal Communications Commission Authorization and Evaluation Division FCC ID: AU792U13A16858 Confidentiality Request Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:
Tune-up Procedure The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Rule 0.457, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, Tim Gunn Director of Product Support / Certifications MultiTech Systems
| 1 2 3 4 5 6 | Authorization for Connected Development | Cover Letter(s) | 145.20 KiB | December 26 2019 |
7/11/2019 To whom it may concern, We, the undersigned, hereby authorize Darin Hatcher of Connected Development to make a Class II Permissive change application to FCC ID: AU792U13A16858 and IC: 125A-0055 for the following reason:
Allow a new exposure condition. This authorization gives authority to Darin Hatcher to act on our behalf, as our agent, in the following matters related to the FCC and/or Industry Canada approval of this product: report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain this Class II Permissive change certification. Any act carried out by Darin Hatcher within the scope of this authorization shall have the same effect as our own. This authorization shall expire 12 months from original date. Sincerely, Tracey Dickinson Multi Tech Systems
| 1 2 3 4 5 6 | Letter of Agency | Cover Letter(s) | 507.70 KiB | December 26 2019 |
) CONNECTED DEVELOPMENT December 3, 2019 Federal Communications Commission 445 12" Street SW Washington, DC 20554 Subject: Limited Agency Agreement Multi Tech Systems FCC ID: AU792U13A16858 To Whom It May Concern:
We, Multi Tech Systems, hereby authorized Intertek Testing Services to act as our Agent for the purpose of preparing application for FCC ID number AU792U13A16858 under all applicable parts of the FCC rules and regulations. The effective date of this limited agency agreement is November 25, 2019. The Limited Agency Agreement expires on February 25, 2020, unless sooner terminated or extended by written notice to Intertek Testing Services and the Federal Communications Commission. This is to advise that we are in full compliance with the Anti-Drug Abuse Act. The applicant is not subject to a denial of federal benefits pursuant to Section 5301 of the Anti-Drug Act of 1988, 21 U.S.C. 862, and no party to the application is subject to a denial of federal benefits pursuant to that section. If you have any questions or comments, please do not hesitate to contact me. Sincerely, >
~ a en 2 i o Darin Hatcher of Connected Development on behalf of Multi Tech Systems Sr. Certification Engineer 1001 Winstead Drive, Suite 130 | Cary, NC 27513 | Tel: 919-234-6501 | Fax: 919-678-1488
| 1 2 3 4 5 6 | Permissive change letter | Cover Letter(s) | 143.82 KiB | December 26 2019 |
) CONNECTED DEVELOPMENT DATE: December 24, 2019 Ref: Class II permissive change request letter Multi-Tech Systems, Inc., 2205 Woodale Dr., Mounds View Minnesota 55112 United States, is submitting this request for a Class || Permissive Change application per FCC 15.247 to add a new antenna and permit the use of the new antenna type to the existing file for FCC ID: AU792U13A16858. The radio module will only function in FHSS mode under this Class Il Permissive Change, and DTS mode will be disable. The new antenna is a Connected Development PCB Trace Antenna. No changes or modifications have been made to the radio. Verification of changes were made to ensure continued compliance and to verify the new antenna, which are included in this Class II Permissive Change application, Sincerely, Darin Hatcher Sr. Certification Engineer Connected Development 1001 Winstead Drive, Suite 130 Cary, NC 27513 Phone: (919) 234-6524 1001 Winstead Drive, Suite 130 | Cary, NC 27513 | Tel: 919-234-6501 | Fax: 919-678-1488
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2023-05-23 | 902.3 ~ 914.9 | DTS - Digital Transmission System | Class II Permissive Change |
| 2 | 2023-03-31 | 902.3 ~ 914.9 | DTS - Digital Transmission System | Class II permissive change or modification of presently authorized equipment |
| 3 | 2020-02-17 | 902.3 ~ 914.9 | DTS - Digital Transmission System | Class II Permissive Change |
| 4 | 2019-12-26 | 902.3 ~ 914.9 | DTS - Digital Transmission System | |
| 5 | 2017-04-26 | 902.3 ~ 914.9 | DTS - Digital Transmission System | Class II permissive change or modification of presently authorized equipment |
| 6 | 2016-11-10 | 902.3 ~ 914.9 | DTS - Digital Transmission System | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 2 3 4 5 6 | Effective |
2023-05-23
|
||||
| 1 2 3 4 5 6 |
2023-03-31
|
|||||
| 1 2 3 4 5 6 |
2020-02-17
|
|||||
| 1 2 3 4 5 6 |
2019-12-26
|
|||||
| 1 2 3 4 5 6 |
2017-04-26
|
|||||
| 1 2 3 4 5 6 |
2016-11-10
|
|||||
| 1 2 3 4 5 6 | Applicant's complete, legal business name |
Multi Tech Systems Inc
|
||||
| 1 2 3 4 5 6 | FCC Registration Number (FRN) |
0009336579
|
||||
| 1 2 3 4 5 6 | Physical Address |
2205 Woodale Drive
|
||||
| 1 2 3 4 5 6 |
Mounds View, MN
|
|||||
| 1 2 3 4 5 6 |
Mounds View, Minnesota 55112
|
|||||
| 1 2 3 4 5 6 |
United States
|
|||||
| app s | TCB Information | |||||
| 1 2 3 4 5 6 | TCB Application Email Address |
t******@intertek.com
|
||||
| 1 2 3 4 5 6 |
L******@ul.com
|
|||||
| 1 2 3 4 5 6 |
h******@acbcert.com
|
|||||
| 1 2 3 4 5 6 |
g******@element.com
|
|||||
| 1 2 3 4 5 6 |
g******@nwemc.com
|
|||||
| 1 2 3 4 5 6 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
| app s | FCC ID | |||||
| 1 2 3 4 5 6 | Grantee Code |
AU7
|
||||
| 1 2 3 4 5 6 | Equipment Product Code |
92U13A16858
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 2 3 4 5 6 | Name |
T******** G********
|
||||
| 1 2 3 4 5 6 |
T******** D******
|
|||||
| 1 2 3 4 5 6 | Title |
Director of Certifications and Product Support
|
||||
| 1 2 3 4 5 6 | Telephone Number |
763-7********
|
||||
| 1 2 3 4 5 6 |
763-7********
|
|||||
| 1 2 3 4 5 6 | Fax Number |
763-7********
|
||||
| 1 2 3 4 5 6 |
t******@multitech.com
|
|||||
| 1 2 3 4 5 6 |
t******@multitech.com
|
|||||
| app s | Technical Contact | |||||
| 1 2 3 4 5 6 | Firm Name |
MRT Technology (Suzhou) Co., Ltd
|
||||
| 1 2 3 4 5 6 |
Connected Development
|
|||||
| 1 2 3 4 5 6 | Name |
R******** W********
|
||||
| 1 2 3 4 5 6 |
A****** H****
|
|||||
| 1 2 3 4 5 6 | Physical Address |
D8 Building, Youxin Industrial Park, No.2 Tian'eda
|
||||
| 1 2 3 4 5 6 |
1900 Alameda Suite 420
|
|||||
| 1 2 3 4 5 6 |
Suzhou, 215104
|
|||||
| 1 2 3 4 5 6 |
San Jose, 95126
|
|||||
| 1 2 3 4 5 6 |
China
|
|||||
| 1 2 3 4 5 6 |
United States
|
|||||
| 1 2 3 4 5 6 | Telephone Number |
86-51******** Extension:
|
||||
| 1 2 3 4 5 6 |
85547********
|
|||||
| 1 2 3 4 5 6 | Fax Number |
86-51********
|
||||
| 1 2 3 4 5 6 |
r******@mrt-cert.com
|
|||||
| 1 2 3 4 5 6 |
d******@connecteddev.com
|
|||||
| app s | Non Technical Contact | |||||
| 1 2 3 4 5 6 | Firm Name |
MRT Technology (Suzhou) Co., Ltd
|
||||
| 1 2 3 4 5 6 | Name |
R**** W******
|
||||
| 1 2 3 4 5 6 | Physical Address |
D8 Building, Youxin Industrial Park, No.2 Tian'eda
|
||||
| 1 2 3 4 5 6 |
Suzhou, 215104
|
|||||
| 1 2 3 4 5 6 |
China
|
|||||
| 1 2 3 4 5 6 | Telephone Number |
86-51******** Extension:
|
||||
| 1 2 3 4 5 6 | Fax Number |
86-51********
|
||||
| 1 2 3 4 5 6 |
r******@mrt-cert.com
|
|||||
| app s | Confidentiality (long or short term) | |||||
| 1 2 3 4 5 6 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| 1 2 3 4 5 6 | Yes | |||||
| 1 2 3 4 5 6 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 2 3 4 5 6 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 2 3 4 5 6 | Equipment Class | DTS - Digital Transmission System | ||||
| 1 2 3 4 5 6 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | MTXDOT-NA1 | ||||
| 1 2 3 4 5 6 | FireHUD Band | |||||
| 1 2 3 4 5 6 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | Yes | ||||
| 1 2 3 4 5 6 | No | |||||
| 1 2 3 4 5 6 | Modular Equipment Type | Limited Single Modular Approval | ||||
| 1 2 3 4 5 6 | Single Modular Approval | |||||
| 1 2 3 4 5 6 | Does not apply | |||||
| 1 2 3 4 5 6 | Purpose / Application is for | Class II Permissive Change | ||||
| 1 2 3 4 5 6 | Class II permissive change or modification of presently authorized equipment | |||||
| 1 2 3 4 5 6 | Original Equipment | |||||
| 1 2 3 4 5 6 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 2 3 4 5 6 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 2 3 4 5 6 | Grant Comments | CIIPC for the module to be installed in a specific host with a new antenna. Output power is conducted. | ||||
| 1 2 3 4 5 6 | Class II permissive change to allow use in the specific host GrainVue Monitoring Hub with helical monopole antenna that described in this filing. Output power is conducted. This transmitter is a hybrid per FCC 15.247(f) and FCC KDB 453039. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. | |||||
| 1 2 3 4 5 6 | Power Output listed is conducted. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This is a C2PC application. | |||||
| 1 2 3 4 5 6 | Output power is conducted. Class II permissive change for change of antenna. Limited Modular approval as device tested in enclosure. This grant is for specific host device as documented in this filing, all other configurations require approval under Class II permissive change or New FCC ID. This transmitter is a hybrid per FCC 15.247(f) and FCC KDB 453039. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. | |||||
| 1 2 3 4 5 6 | Output power is conducted. This transmitter is a hybrid per FCC 15.247(f) and FCC KDB 453039. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This C2PC is for the portable RF exposure condition that results when this transmitter is installed in the Rut-Fin LLC, Model Gill-O-Tine Remote. | |||||
| 1 2 3 4 5 6 | Output power is conducted. This transmitter is a hybrid per FCC 15.247(f) and FCC KDB 453039. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. | |||||
| 1 2 3 4 5 6 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 2 3 4 5 6 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 2 3 4 5 6 | Firm Name |
Intertek Testing Services NA
|
||||
| 1 2 3 4 5 6 |
UL Verification Services Inc.
|
|||||
| 1 2 3 4 5 6 |
MRT Technology (Suzhou) Co., Ltd.
|
|||||
| 1 2 3 4 5 6 |
IntertekTesting Services NA Inc.
|
|||||
| 1 2 3 4 5 6 |
Element Materials Technology Minneapolis
|
|||||
| 1 2 3 4 5 6 | Name |
J**** S****
|
||||
| 1 2 3 4 5 6 |
J**** K********
|
|||||
| 1 2 3 4 5 6 |
M****** C******
|
|||||
| 1 2 3 4 5 6 |
C**** P******
|
|||||
| 1 2 3 4 5 6 |
R**** W******
|
|||||
| 1 2 3 4 5 6 | Telephone Number |
859-2********
|
||||
| 1 2 3 4 5 6 |
510 3********
|
|||||
| 1 2 3 4 5 6 |
+86-5******** Extension:
|
|||||
| 1 2 3 4 5 6 |
650-4********
|
|||||
| 1 2 3 4 5 6 |
503-8********
|
|||||
| 1 2 3 4 5 6 | Fax Number |
859 2********
|
||||
| 1 2 3 4 5 6 |
650 4********
|
|||||
| 1 2 3 4 5 6 |
503-8********
|
|||||
| 1 2 3 4 5 6 |
j******@intertek.com
|
|||||
| 1 2 3 4 5 6 |
j******@ul.com
|
|||||
| 1 2 3 4 5 6 |
m******@mrt-cert.com
|
|||||
| 1 2 3 4 5 6 |
c******@intertek.com
|
|||||
| 1 2 3 4 5 6 |
r******@element.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 15C | 902.30000000 | 914.90000000 | 0.0871000 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 2 | 1 | 15C | 902.30000000 | 914.90000000 | 0.0871000 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 3 | 1 | 15C | 902.30000000 | 914.90000000 | 0.0631000 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 4 | 1 | 15C | 902.30000000 | 914.90000000 | 0.0871000 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 5 | 1 | 15C | 902.30000000 | 914.90000000 | 0.0871000 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 6 | 1 | 15C | 902.30000000 | 914.90000000 | 0.0871000 | ||||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC