MBN52832 Data Sheet BLE Module Revision History Revision Date Author Change Description 06/03/2016 06/16/2016 8/25/2016 8/27/2016 12/15/2016 02/01/2017 03/15/2017 05/26/2017 RF PD RF PD RF PD RF PD RF PD RF PD RF PD RF PD Preliminary version Modified the module block diagram. Update test data points Update module dimension and reference schematic Applied model/type name MBN52832 to the datasheet Update Table 2.1 and Figure 2.2 Add sleep current Table 2.2, change pin 36, 37 pin 36 description to NC. Add section 6.1 and 6.2, recommendation for host PCB landing and placement. Updated reference schematic. Add section 9 and section 10, assembly and packaging information. Add section 12 Notice. Add section 13 Preconditions to use the module. Add regulatory section Update layout guidance for antenna connection; updated regulatory information Update the max height to 0.9mm, remove the sample part number. Remove Section 17, support contact. Added FCC and IC certification update for portable application in section 11.6 07/27/2017 8/23/2017 10/06/2017 06/14/2018 10/10/2018 RF PD RF PD Murata Murata Murata 11/13/18 Murata Corrected typos in section 7. 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.92 1.0 1.1 1.2 1.3 Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 www.murata.com 4 5 6 7 8 9 Table of Contents REVISION HISTORY .............................................................................................................................................................. 1 TABLE OF CONTENTS ......................................................................................................................................................... 2 1 INTRODUCTION ............................................................................................................................................................ 5 1.1 Features ..................................................................................................................................................................... 5 1.2 Applications ................................................................................................................................................................ 5 1.3 Block Diagram ............................................................................................................................................................ 6 1.4 Acronyms ................................................................................................................................................................... 6 1.5 References ................................................................................................................................................................. 6 2 MECHANICAL SPECIFICATION .................................................................................................................................. 7 2.1 Module Dimensions .................................................................................................................................................... 7 2.2 Top and Side View ..................................................................................................................................................... 7 2.3 PCB Footprint Top View ............................................................................................................................................. 8 2.4 Pin Configuration ........................................................................................................................................................ 9 3 DC ELECTRICAL SPECIFICATION ............................................................................................................................ 12 3.1 Typical Power Consumption .................................................................................................................................... 12 RF SPECIFICATION .................................................................................................................................................... 12 ENVIRONMENTAL SPECIFICATION ......................................................................................................................... 13 5.1 Absolute Maximum Rating ....................................................................................................................................... 13 5.2 Recommended Operating Condition ........................................................................................................................ 13 POWER SEQUENCE ................................................................................................................................................... 13 APPLICATION INFORMATION ................................................................................................................................... 14 7.1 Recommended PCB Landing Pattern ...................................................................................................................... 14 7.2 Host PCB Layout Recommendations ...................................................................................................................... 15 7.3 Layout Guidance for Using Internal PCB Antenna .................................................................................................. 16 7.4 Layout Guidance for Microstrip Design And External Antenna ................................................................................ 17 APPLICATION REFERENCE ...................................................................................................................................... 20 ASSEMBLY INFORMATION ....................................................................................................................................... 21 10 PACKAGING AND MARKING INFORMATION .......................................................................................................... 22 10.1 Dimensions of Tape (Plastic tape) ........................................................................................................................... 22 10.2 Dimensions of Reel .................................................................................................................................................. 23 10.3 Taping Diagrams ...................................................................................................................................................... 24 10.4 Leader and Tail tape ................................................................................................................................................ 25 10.5 Peeling Force ........................................................................................................................................................... 26 10.6 PACKAGE (Humidity proof Packaging) ................................................................................................................... 26 10.7 Module Marking Information..................................................................................................................................... 27 10.8 Moisture Sensitivity Level ......................................................................................................................................... 27 11 REGULATORY INFORMATION .................................................................................................................................. 28 11.1 FCC Notice (USA) .................................................................................................................................................... 28 11.2 FCC Labeling Requirements .................................................................................................................................... 29 11.3 IC Notice (Canada) .................................................................................................................................................. 29 11.4 IC Labeling Requirements ........................................................................................................................................ 30 11.5 ESTI compliance (Europe) ....................................................................................................................................... 30 11.6 RF Exposure ............................................................................................................................................................ 30 Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 2 of 34 www.murata.com 11.6.1 11.6.2 Using on-board PCB antenna ..................................................................................................................... 30 Using external antenna ............................................................................................................................... 30 12 ROHS INFORMATION ................................................................................................................................................. 30 13 ORDERING INFORMATION ........................................................................................................................................ 31 14 NOTICE ........................................................................................................................................................................ 32 14.1 Storage Conditions ................................................................................................................................................... 32 14.2 Handling Conditions ................................................................................................................................................. 32 14.3 Standard PCB Design (Land Pattern and Dimensions) ........................................................................................... 32 14.4 Notice for Chip Placer .............................................................................................................................................. 32 14.5 Operational Environment Conditions ....................................................................................................................... 32 14.6 Input Power Capacity ............................................................................................................................................... 33 15 PRECONDITIONS TO USE MURATA PRODUCTS ................................................................................................... 34 Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 3 of 34 www.murata.com LIST OF FIGURES Figure 1.1 Block Diagram ........................................................................................................................................................ 6 Figure 2.1 Module Top and Side View (Unit: mm) .................................................................................................................. 7 Figure 2.2 Module Footprint Top View (Unit: mm) .................................................................................................................. 8 Figure 2.3 Pinout Diagram Top View ...................................................................................................................................... 9 Figure 8.1 Recommended PCB Landing Pattern .................................................................................................................. 14 Figure 8.2 Host PCB Layout Recommendation, top view ..................................................................................................... 15 Figure 8.3 Layout Guide for Antenna Performance (1) ......................................................................................................... 16 Figure 8.4 Layout Guide for Antenna Performance (2) ......................................................................................................... 17 Figure 8.5 Layout Guide for External Antenna (1) ................................................................................................................ 18 Figure 8.6 Layout Guide for External Antenna (2) ................................................................................................................ 18 Figure 9.1 Reference Design ................................................................................................................................................ 20 Figure 10.1 Reflow Profile ..................................................................................................................................................... 21 Figure 11.1 Tape Dimensions (Unit in mm) .......................................................................................................................... 22 Figure 11.2 Reel Dimensions (Unit: mm) .............................................................................................................................. 23 Figure 11.3 Tape Diagram .................................................................................................................................................... 24 Figure 11.4 Tape Leader and Tail ......................................................................................................................................... 25 Figure 11.5 Peeling Force Diagram ...................................................................................................................................... 26 Figure 11.6 Packaging Diagram ........................................................................................................................................... 26 Figure 11.7 Module Marking Diagram ................................................................................................................................... 27 LIST OF TABLES Table 2.1: Module Dimensions ................................................................................................................................................ 7 Table 2.2 Pinouts .................................................................................................................................................................. 10 Table 3.1 Typical Power Consumption ................................................................................................................................. 12 Table 4.1 RF Characteristics ................................................................................................................................................. 12 Table 5.1 Absolute Maximum Rating .................................................................................................................................... 13 Table 5.2 Recommended Operating Condition ..................................................................................................................... 13 Table 12.1 Regulatory Standards Conformance ................................................................................................................... 28 Table 12.2 External Antenna to comply with FCC and IC .................................................................................................... 28 Table 12.3 External Antenna to comply with IC .................................................................................................................... 29 Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 4 of 34 www.murata.com 1 Introduction MBN52832 is a Bluetooth Low Energy module. It enables ultra-low power connectivity for data communication. The product integrates Nordic Bluetooth Low Energy IC, RF front end, and crystal. This is an ideal solution for Internet of Things (IOT) application. 1.1 Features Bluetooth v5 o Higher throughput o o Increased broadcast capacity Improved channel co-existence algorithm (SCA) ANT, NFC Tag Nordic nRF52832 Bluetooth Smart Built-in ARM Cortex M4 core with 64KB RAM and 512KB flash Dimension 7.4 x 7.0 x 0.9 mm Packaging: LGA Bluetooth/ANT Antenna Configuration:
o On-board PCB antenna o Supports external antenna from pin pad Maximum transmit power: +4dBm @ antenna port (LDO Mode) Receive sensitivity: -93dBm @ 1Mbps (LDO Mode) Power consumption o TX 7mA @ 3.5dBm (DCDC Mode) o RX 6mA (DCDC Mode) Host interface: UART, SPI Operating temperature range: -40 C to 85 C RoHS compliant MSL Level 3 in accordance with JEDEC J-STD-020 Regulatory certificates: FCC, IC, ETSI (plan) 1.2 Applications Home Automation Proximity Services Building automation Medical/Healthcare Beacon Other interfaces: 20 GPIO, 5 ADC, UART, SPI (master and slave), I2C, PWM and Debug SWD Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 5 of 34 www.murata.com 1.3 Block Diagram BLE/ANT Antenna 32MHz Xtal NFC Antenna
(Optional) Matching circuit Nordic nRF52832 To external or on-board antenna VCC SPI UART SWD GPIO/AIO 32KHz Xtal
(for ANT only Inductor for DC/DC
(optional) Figure 1.1 Block Diagram 1.4 Acronyms Inter-Integrated Circuit Analog Input / Output General Purpose Input / Output
- AIO
- GPIO
- I2C
- LPCOMP Low Power Comparator
- SPI
- UART Serial Peripheral Interface Universal Asynchronous Receiver Transmitter 1.5 References
[1] Nordic Semiconductor, nRF52832 - Product Specification v1.3, 2017
[2] Nordic Semiconductor, nRF52832-CIAA Pin assignment and mechanical dimensions, 2016 Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 6 of 34 www.murata.com 2 Mechanical Specification 2.1 Module Dimensions Table 2.1: Module Dimensions Parameter Dimension (L x W x H) Typical Unit 7.4 0.2mm x 7.0 0.2mm x 0.9 (max) mm 2.2 Top and Side View Pin 1 7.4mm typ. 1.0mm max. 7.0mm typ. Figure 2.1 Module Top and Side View (Unit: mm) Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 7 of 34 www.murata.com 2.3 PCB Footprint Top View Figure 2.2 Module Footprint Top View (Unit: mm) Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 8 of 34 www.murata.com 2.4 Pin Configuration Figure 2.3 Pinout Diagram Top View Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 9 of 34 www.murata.com Table 2.2 Pinouts Pin # Pin Name Nordic IC Pin P0_09/NFC ANT P0.09/NFC P0_06 P0_00/XL1 P0.06 P0.00/XL1 P0_01/XL2 P0.01/XL2 Description GPIO; NFC antenna connection. GPIO Connection for 32.768kHz crystal (LFXO);
GPIO Connection for 32.768kHz crystal (LFXO);
GPIO GND Module power supply DC/DC converter output pin. *Refer to reference schematic. 1V3 regulator supply decoupling. Input from DC/DC converter. Output from 1.3V LDO.
*Refer to reference schematic. GPIO; SAADC/COMP/LPCOMP input GPIO; SAADC/COMP/LPCOMP input GPIO; SAADC/COMP/LPCOMP input GPIO; SAADC/COMP/LPCOMP input GPIO; SAADC/COMP/LPCOMP input GPIO GPIO Serial Wire Debug I/O for debug and programming. GPIO; Configurable as system RESET pin Serial Wire Debug clock input for debug and programming. GND
*Refer to reference schematic. RF signal output. Connect to ANTIN for on-
board antenna or to external antenna.
*Refer to reference schematic. GPIO; Trace port output;
GND VCC DCC DEC P0_02/AIN0 P0_05/AIN3 P0_03/AIN1 P0_04/AIN2 P0_29/AIN5 P0_07 P0_08 SWDIO VDD DCC DEC4 P0.02/AIN0 P0.05/AIN3 P0.03/AIN1 P0.04/AIN2 P0.29/AIN5 P0.07 P0.08 SWDIO P0_21/RESET SWDCLK P0.21/RESET SWDCLK 19 GND 20 ANTIN ANTOUT GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 21 22 23 24 25 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O P0_18/TRACE0 P0.18/TRACE I/O P0_16/TRACE1 P0.16/TRACE I/O GPIO; Trace port output. P0_15/TRACE2 P0.15/TRACE I/O GPIO; Trace port output. P0_14/TRACE3 P0.14/TRACE I/O GPIO; Trace port output. P0_10/NFC ANT P0.10/NFC P0_20 P0_17 P0_13 26 27 28 29 30 GND 31 GND 32 GND 33 GND GPIO; NFC antenna connection. GPIO GPIO GPIO Ground. Ground. Ground. Ground. DATA[0]
DATA[1]
DATA[2]
DATA[3]
P0.20 P0.17 P0.13 Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 10 of 34 www.murata.com Pin # Pin Name 34 GND 35 GND 36 NC 37 NC Nordic IC Pin I/O Description Ground. Ground. NC NC Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 11 of 34 www.murata.com 3 DC Electrical Specification 3.1 Typical Power Consumption TX Active @3.5dBm RX Active Sleep Mode Table 3.1 Typical Power Consumption Current LDO mode DCDC mode LDO mode DCDC mode System Off System On with internal RC System On with external 32kHz crystal 16 7 14 6 0.36 2.13 1.79 Unit mA mA mA mA uA uA uA 4 RF Specification Conditions: 25C, VCC=3.3V, Parameters measured at RF connector. Specification Min. 2402 Unit Max. 2480 MHz MHz Table 4.1 RF Characteristics RF Characteristics Center frequency Channel Spacing Number of RF Channels Max output power LDO mode DCDC mode Modulation Characteristics f1avg f2max (at 99.9%) f2avg / f1avg Carrier frequency offset and drift 1) Frequency offset: | fn fTX |
2) Frequency drift: | f0 fn |
3) Drift rate #0: | f1 f0 |
4) Drift rate #n: | fn fn-5 |
Receiver sensitivity (PER
< 30.8%) Maximum input signal level (PER < 30.8%) LDO mode DCDC mode Typ.
2 40 4.0 3.5
-93
-90
225 185 0.8
-10
275 150 50 20 20
-70
-70
dBm dBm kHz kHz
kHz kHz kHz kHz dBm dBm dBm Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 12 of 34 www.murata.com 5 Environmental Specification 5.1 Absolute Maximum Rating Table 5.1 Absolute Maximum Rating Description Storage temperature Operating temperature VCC VIO, VDD 3.6 V VIO, VDD > 3.6 V NFC antenna pin current RF input level Parameter Operating Temperature Range VCC Supply rise time (0V to 1.7V) Min
-40
-40
-0.3
-0.3
-0.3 Min
-40 1.7 Max
+125 85
+3.9 3.9 80 10 VCC+0.3 Max 85 3.6 60 Unit C C V V V mA dBm Unit C V ms 5.2 Recommended Operating Condition Table 5.2 Recommended Operating Condition 6 Power Sequence For device start up sequence, please refer to Nordic Semiconductor, nRF52832 - Product Specification [1]. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 13 of 34 www.murata.com 7 Application Information 7.1 Recommended PCB Landing Pattern Figure 8.1 Recommended PCB Landing Pattern Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 14 of 34 www.murata.com 7.2 Host PCB Layout Recommendations Figure 8.2 Host PCB Layout Recommendation, top view Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 15 of 34 www.murata.com 7.3 Layout Guidance for Using Internal PCB Antenna The MBN52832 module is certified with an internal PCB antenna physically located on the module. For optimum EIRP
(Effectively Isotropically Radiated Power) when use the on-board antenna, please follow the following recommendations in the customer host circuit board design. A. The module is recommended is be placed on top left corner of the host circuit board. B. Around the antenna area, all layers of the customer circuit board should be free of any metal objects. Specifically, there should be no ground plane, traces or metal shield case C. Host circuit PCB length is longer than 40mm to get optimal performance by using ground plane. D. Right side of antenna area also should be free of grounds. E. Metal and plastic materials should be away from the module. (more than 3mm) Figure 8.3 Layout Guide for Antenna Performance (1) F. To use this internal antenna, the integrator must provide a simple two-component matching circuit between pins 20 and 21 of the module. This circuit will connect the RF I/O of the module directly to the PCB antenna. The picture below shows the location of pins 20 and 21. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 16 of 34 www.murata.com Figure 7.4 Layout Guide for Antenna Performance (2) The Integrator must place the matching circuit shown below between Pins 20 and 21 of the Module to duplicate the structure used during FCC/IC testing of the MBN52832. Use the exact PNs provided for L1 and C2 to meet regulatory requirements. On the integrators support board, place L1 between Pin 20 and Pin 21 of the Module. Place C2 adjacent to Pin 21. The other side of C2 should be attached to RF Ground. Any technical implementation questions regarding the layout or design of this circuit should be directed to Murata module technical support. 7.4 Layout Guidance for Microstrip Design And External Antenna The MBN52832 module is certified with an internal PCB antenna and two external antennas; a 7 dBi omni antenna and a 6 dBi patch antenna. Either patch or omni antenna should be connected to the MBN module using 50 ohm microstrip and a U.FL RF connector as shown below. This microstrip and U.FL connector are placed on the customers PCB and are external to the MBN module. The patch or omni antenna is then connected to this UFL Connector via a 50 ohm RF adapter cable. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 17 of 34 www.murata.com Figure 8.5 Layout Guide for External Antenna (1) The design of the 50 ohm microstrip on the customers PCB is crucially important. Compliant operation of the MBN is dependent on proper construction of this 50 ohm line and the following guidelines must be followed to ensure legal operation of the product. The diagram below shows the required microstrip structure to be routed between module pin TP21 and the UFL connector. The top PCB trace carries the RF energy from module to UFL connector. The Layer2 ground plane provides a return path for the circuit. The Dielectric material (along with the dimensions of the microstrip structures) determines the characteristic impedance of the microstrip transmission line. Figure 8.6 Layout Guide for External Antenna (2) Note the representative dimensions shown in the drawing above. It is imperative that the module customer (the integrator) use the exact dimensions we recommend to ensure a 50-ohm impedance for this transmission line. The following dimensions and/or ratios should be used to set the microstrip impedance to 50 ohms. Dielectric (PCB) Material We recommend standard FR-4 PCB material. Other dielectrics will work but will require recalculation of microstrip dimensions. The following guidance is predicated on the use of FR-4 Dielectric. If FR-4 is not used for PCB material, please contact Murata Electronics at (678) 684-2009 to determine new dimensions for microstrip structure. H (Dielectric Height) this is the thickness of dielectric between the trace layer (layer 1) and the ground plane on layer 2. Note that layer 2 must be electrical ground. We recommend a dielectric thickness of 8-15 mils. This range provides the customer with some flexibility in board construction. t (trace thickness) Microstrip impedance is not severely affected by the thickness dimension. Standard 1oz or 2oz copper deposition is recommended. Equivalent thickness is 1-2 mils. W (trace width) this is the crucial dimension. This width must be set correctly to obtain the desired 50 ohms impedance. When using FR-4 dielectric, the width (W) of the microstrip trace should be set to:
Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 18 of 34 www.murata.com Where W is microstrip trace width and H is Dielectric height. Note that both values must be measured in identical units (mils or mm) W = H * 1.8 Example:
H = 12 mils, W = 12 * 1.8 = 21.6 mils H = 0.4 mm W = 0.4 * 1.8 = 0.72 mm l (trace length) the impedance of the microstrip line is not dependent on its length. However, regulatory and performance limitations practically determine the actual length to be used by the customer (integrator). The length of this microstrip line must be longer than 7 mm to mimic the length used during FCC/IC certification of the MBN52832 module. Lengths longer than 7 mm are acceptable although additional signal loss will occur as a result. Given these restrictions, Murata recommends microstrip trace lengths between 7 mm and 25 mm. In any event, the microstrip line must operate over the same Dielectric-Ground Plane configuration shown above to act as a 50 ohm transmission line. Do not run the microstrip trace through sections of PCB that do not have the Dielectric-Ground plane configuration shown above. A reliable 50 ohm transmission line will be produced if the above guidance is closely followed. Any deviations from the guidance above may cause the module to operate in noncompliant manner. Any implementation questions or concerns should be directed to Murata module technical support. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 19 of 34 www.murata.com 8 Application Reference Notes:
Option #1: DC/DC converter: as it is Option #2: LDO: remove L1 and L2 Figure 9.1 Reference Design Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 20 of 34 www.murata.com 9 Assembly Information The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions Figure 10.1 Reflow Profile Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. Since this Product is Moisture Sensitive, any cleaning is NOT permitted. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 21 of 34 www.murata.com 10 Packaging and Marking Information 10.1 Dimensions of Tape (Plastic tape) Figure 11.1 Tape Dimensions (Unit in mm) Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 22 of 34 www.murata.com 10.2 Dimensions of Reel Figure 11.2 Reel Dimensions (Unit: mm) Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 23 of 34 www.murata.com 10.3 Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62 um in thickness
[4] Base tape : As specified in (1) Feeding Hole Feeding Direction Chip Figure 11.3 Tape Diagram Pin 1 Marking Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 24 of 34 www.murata.com 10.4 Leader and Tail tape Feeding Tail tape
(No components) 40 to 200mm Components No components 150mm min. Leader tape
(Cover tape alone) 250mm min. Figure 11.4 Tape Leader and Tail The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. The cover tape and base tape are not adhered at none components area for 250 mm min. Tear off strength against pulling of cover tape: 5 N min. Packaging unit: 1000 pcs./ reel Material:
- Base tape : Plastic
- Reel : Plastic
- Cover tape, cavity tape and reel are made the anti-static processing. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 25 of 34 www.murata.com 10.5 Peeling Force 165 to 180 1.3 N max. in the direction of peeling as shown below. 1.3 N max. Cover tape 10.6 PACKAGE (Humidity proof Packaging) Label Figure 11.5 Peeling Force Diagram Base tape Desiccant Humidity Indicator Anti-humidity Plastic Bag Figure 11.6 Packaging Diagram Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Label Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 26 of 34 www.murata.com 10.7 Module Marking Information Figure 11.7 shows the module marking. Dimensions are nominal, not absolute. Figure 11.7 Module Marking Diagram 10.8 Moisture Sensitivity Level The MBN52832 is planned to be qualified to moisture sensitivity level 3 in accordance with JEDEC J-STD-020. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 27 of 34 www.murata.com 11 Regulatory Information The table below shows the regulatory compliance status of the MBN52832 module. Table 12.1 Regulatory Standards Conformance Standard Certificate ID Regulatory Body FCC IC ETSI TELEC BT SIG Part 15 RSS-210 EN300 328, Ver. 2.1.1 ETSI EN301.489 - 17 Article 38-24 Paragraph 1 of the Radio Law BT 5.0 HSW2832 4492A-2832 Compliant 001-P1041 Declaration ID: D036210 QDID: 97989 MBN52832 also has been certified with a particular external antenna (see table below ). Table 12.2 External Antenna to comply with FCC and IC Part Number Vendor Gain (dBi) Connector Remarks S2406PL Cushcraft HG2407RD-RSP L-Comm 6.0 7.0 Type Patch Dipole U.FL U.FL Necessary for FCC/IC compliance only. Necessary for FCC/IC compliance only. To be compliant with RED Directive while using MBN52832 module with external antenna, the total EIRP including the antenna gain should be less than or equal to 10dBm. 11.1 FCC Notice (USA) Warning: Changes or modifications to this device not expressly approved by Murata could void the users authority to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The FCC requires the OEM to be notified that any changes or modifications not expressly approved by Murata may void the users authority to operate the equipment. While an application of the MBN52832 module in a product is not required to obtain a new FCC authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for that end product. This device using the integrated antenna has been tested to comply with FCC CFR Part 15. The device meets the requirements for modular transmitter approval as detailed in the FCC 47 CFR 15.212. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver. Increase the separation between the equipment and receiver. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 28 of 34 www.murata.com Is connected. Consult the dealer or an experienced radio/TV technician for help. 11.2 FCC Labeling Requirements When integrating the MBN52832 into a product the FCC labeling requirements must be met. This includes a clearly visible label on the outside of the finished product specifying the MBN52832 FCC identifier (FCC ID: HSW2832) as well as the notice above. The exterior label can use wording such as Contains Transmitter Module FCC ID: HSW2832 or Contains FCC ID: HSW2832 although any similar wording that expresses the same meaning may be used. 11.3 IC Notice (Canada) The term IC before the certification/registration number only signifies that the Industry Canada technical specifications were met. Le terme IC devant le numro de certification /denregistrement signifie seulement que les spcifications techniques Industrie Canada ont t respectes. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to The following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son utilisation est soumise Les deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interfrences et (2) cet appareil doit accepter Toute interfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement du dispositif. This device complies with Health Canadas Safety Code 6 / IC RSS-210. The installer of this device should ensure that RF radiation is not emitted in excess of the Health Canadas requirement. Information can be obtained at: http://www.hc-
sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php Cet appareil est conforme avec Sant Canada Code de scurit 6 / IC RSS-210. Le programme d'installation de cet appareil doit s'assurer que les rayonnements RF n'est pas mis au-del de l'exigence de Sant Canada. Les informations peuvent tre obtenues: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php This radio transmitter MBN52832 has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio (identifier le dispositif par son numro de certification ou son numro de modle s'il fait partie du matriel de catgorie I) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-
dessous et ayant un gain admissible maximal et l'impdance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. Part Number Vendor Gain (dBi) Connector Remarks Table 12.3 External Antenna to comply with IC S2406PL Cushcraft HG2407RD-RSP L-Comm 6.0 7.0 Type Patch Dipole U.FL U.FL Necessary for FCC/IC compliance only. Necessary for FCC/IC compliance only. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 29 of 34 www.murata.com 11.4 IC Labeling Requirements The host device should be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 4492A-2832, where 4492A-2832 is the modules certification number. 11.5 ESTI compliance (Europe) This device has been tested for use in the European Union. Both MBN52832 comply with the following regulation test. ETSI EN300 328, Ver. 2.1.1 ETSI EN301.489 - 17 If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in Annex II of the Radio and Telecommunications Terminal Equipment Directive. 11.6 RF Exposure 11.6.1 Using on-board PCB antenna This equipment complies with radiation exposure limits set forth for an uncontrolled environment. This equipment is in direct contact with the body of the user under normal operating conditions. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Cet quipement est conforme aux limites d'exposition aux radiations dans un environnement non contrl. Cet quipement est en contact direct avec le corps de l'utilisateur dans des conditions de fonctionnement normales. Cet metteur ne doit pas tre co-localises ou oprant en conjonction avec tout autre antenne ou transmetteur. 11.6.2 Using external antenna This equipment complies with radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This transmitter must not be co-
located or operating in conjunction with any other antenna or transmitter. Cet quipement est conforme aux limites d'exposition aux radiations dans un environnement non contrl. Cet quipement doit tre install et utilis distance minimum de 20 cm entre le radiateur et votre corps. Cet metteur ne doit pas tre co-
localises ou oprant en conjonction avec tout autre antenne ou transmetteur. If the module will be used for portable applications, the device must undergo SAR testing. The following statement must be included as a CAUTION statement in manuals for the products to alert users on FCC RF exposure compliance:
WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operations at closer distances than this are not recommended. 12 RoHS Information The MBN52832 module is conformed to RoHS requirement. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 30 of 34 www.murata.com 13 Ordering Information Product Model Name Murata Ordering Part Number Standard Order BLE Module MBN52832 WSM-BL241-ADA-008 Development Kit MBN52832DK WSM-BL241-ADA-008DK Increment 1000 pc 1 pcs Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 31 of 34 www.murata.com 14 Notice 14.1 Storage Conditions Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.
- The product shall be stored in non-corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 14.2 Handling Conditions Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 14.3 Standard PCB Design (Land Pattern and Dimensions) All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. If use non-standard lands, contact Murata beforehand. 14.4 Notice for Chip Placer When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. 14.5 Operational Environment Conditions Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 32 of 34 www.murata.com Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-
mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 14.6 Input Power Capacity Products shall be used in the input power capacity as specified in this specification. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 33 of 34 www.murata.com 15 PRECONDITIONS TO USE MURATA PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment. - Aerospace equipment - Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment. - Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you cant agree the above contents, you should inquire our sales. Copyright Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.3, 11/13/2018 Page 34 of 34 www.murata.com