FCC ID: HSW2EG Type 2EG BLE Module

Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This module has been tested and found to comply with the following requirements for Modular Approval. Part 15.247 - Operation within the bands 902-928 MHz, 2400-2483.5 MHz, and 5725-5850 MHz. Test Modes This device uses various test mode programs for test set up which operate separate from production firmware. Host integrators should contact the grantee for assistance with test modes needed for module/host compliance test requirements. Antennas This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio a t approuv par la FCC et ISED pour fonctionner avec les types d'antennes rpertoris ci-dessous avec le gain maximal autoris indiqu. Les types d'antennes non inclus dans cette liste, ayant un gain suprieur au gain maximum indiqu pour ce type, sont strictement interdits pour une utilisation avec cet appareil. Radio Antenna Type Freq. (MHz) Max. Peak Antenna Gain (dBi) BLE Monopole Antenna PCB Antenna 2400-2500 2400-2484 1.8

-3.0 The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in User manual. In the end product, the transmitter must be installed to provide a separation distance of at least 20cm with the Monopole Antenna and at 5mm with the PCB Antenna from all persons and must not be co-located or operation in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. User and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying the RF exposure compliance. 1

Datasheet Bluetooth 5.2 Wireless Module Data Sheet onsemi RSL15 Bluetooth 5.2 Soc Design Name: Type 2EG P/N: LBCA1HN2EG-917 Bluetooth 5.2 Wireless Module Data Sheet Table of Contents About This Guide ........................................................................................................................ 4 Audience & Purpose ............................................................................................................. 4 Document Conventions ......................................................................................................... 4 1 Product Information/General Information ................................................................................. 5 1.1 Scope .............................................................................................................................. 5 1.2 Key features .................................................................................................................... 5 1.3 Ordering Information ....................................................................................................... 5 1.4 Block Diagram ................................................................................................................. 7 1.5 Reference ....................................................................................................................... 7 2 Certification Information ........................................................................................................... 8 2.1 Radio Certification ........................................................................................................... 8 2.2 FCC Notice (USA) ........................................................................................................... 8 2.3 FCC Labeling Requirements ........................................................................................... 9 2.4 ISED Notice (Canada) ................................................................................................... 10 2.5 IC Labeling Requirements ............................................................................................. 11 2.6 ESTI compliance (Europe) ............................................................................................ 11 2.7 Bluetooth Qualification .................................................................................................. 12 3 Dimensions, Marking and Terminal Configurations ................................................................ 13 3.1 Structure ....................................................................................................................... 14 4 Module Pin Descriptions ........................................................................................................ 15 4.1 Pin Assignments ........................................................................................................... 15 4.2 Pin Descriptions ............................................................................................................ 16 5 Absolute Maximum Ratings ................................................................................................... 17 6 Operating Conditions ............................................................................................................. 17 6.1 General Operating Conditions ....................................................................................... 17 6.2 Digital I/O Requirements ............................................................................................... 18 7 DC/RF Characteristics ........................................................................................................... 19 7.1 Typical Power Consumption .......................................................................................... 19 7.2 RF Characteristics ......................................................................................................... 20 8 Power Sequence ................................................................................................................... 21 9 Application Information .......................................................................................................... 21 9.1 Recommended PCB Landing Pattern ............................................................................ 21 9.2 Host PCB Layout Recommendations ............................................................................ 22 9.3 Layout Guidance for Using Internal PCB Antenna ......................................................... 22 9.4 Layout Guidance for Microstrip Design and External Antenna ....................................... 24 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 1 Bluetooth 5.2 Wireless Module Data Sheet 9.5 Reference Circuit .......................................................................................................... 26 10 Tape and Reel Packing ........................................................................................................ 27 10.1 Dimensions of Tape (Plastic tape) ............................................................................... 27 10.2 Dimensions of Reel ..................................................................................................... 27 10.3 Taping Diagrams ......................................................................................................... 28 10.4 Leader and Tail Tape .................................................................................................. 29 10.5 Packaging (Humidity Proof Packing) ........................................................................... 30 11 Notice .................................................................................................................................. 31 11.1 Storage Conditions ...................................................................................................... 31 11.2 Handling Conditions .................................................................................................... 31 11.3 Standard PCB Design (Land Pattern and Dimensions) ............................................... 31 11.4 Notice for Chip Placer ................................................................................................. 32 11.5 Soldering Conditions ................................................................................................... 32 11.6 Cleaning ...................................................................................................................... 32 11.7 Operational Environment Conditions ........................................................................... 33 12 Preconditions to Use Our Products ...................................................................................... 34 Appendix................................................................................................................................... 36 Revision History ........................................................................................................................ 37 Figures Figure 1: Type 2EG Block Diagram............................................................................................. 7 Figure 2: Type 2EG Dimensions, Marking and Terminal Configurations ................................... 13 Figure 3: Type 2EG Structure ................................................................................................... 14 Figure 4: Top View .................................................................................................................... 15 Figure 5: Type 2EG Land Patterns............................................................................................ 21 Figure 6: Host PCB Layout Recommendation, top view ............................................................ 22 Figure 7: Layout Guide for Antenna Performance (1) ................................................................ 23 Figure 8: Layout Guide for Antenna Performance (2) ................................................................ 23 Figure 9: Layout Guide for External Antenna (1) ....................................................................... 24 Figure 10: Layout Guide for External Antenna (2) ..................................................................... 25 Figure 11: Dimensions of Tape (Plastic Tape) .......................................................................... 27 Figure 12: Dimension of Reel.................................................................................................... 27 Figure 13: Taping Diagrams...................................................................................................... 28 Figure 15: Taping Specifications ............................................................................................... 28 Figure 15: Taping Diagrams (Close Up) .................................................................................... 28 Figure 16: Leader and Tail Tape ............................................................................................... 29 Figure 17: Peeling Off Force ..................................................................................................... 29 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 2 Bluetooth 5.2 Wireless Module Data Sheet Figure 18: Packaging ................................................................................................................ 30 Figure 19: Reflow soldering standard conditions (Example) ...................................................... 32 Tables Table 1: Document Conventions ................................................................................................. 4 Table 2: Ordering Information ..................................................................................................... 5 Table 3: Radio Certification ......................................................................................................... 8 Table 4: External Antenna to comply with FCC and ISED ........................................................... 8 Table 5: External Antenna to comply with ISED ........................................................................ 10 Table 6: External Antenna to comply with ETSI ........................................................................ 11 Table 7: Type 2EG Markings .................................................................................................... 13 Table 8: Type 2EG Dimensions ................................................................................................ 13 Table 9: Type 2EG Pin Names ................................................................................................. 15 Table 10: Type 2EG Pin Descriptions ....................................................................................... 16 Table 11: Type 2EG Absolute Maximum Ratings ...................................................................... 17 Table 12: Type 2EG Operating Conditions ................................................................................ 17 Table 13: Type 2EG Digital I/O Requirements .......................................................................... 18 Table 14: RF Current Consumption .......................................................................................... 19 Table 15: Sleep Mode Current Consumption ............................................................................ 19 Table 16: Type 2EG RF Characteristics .................................................................................... 20 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 3 Bluetooth 5.2 Wireless Module Data Sheet About This Guide This data sheet summarizes the performance and other characteristics of Muratas Type 2EG. This specification is applied to the Type 2EG Bluetooth 5.2 module. Audience & Purpose The audience of this guide is the developer who wants to integrate the Type 2EG module in their systems. Document Conventions Table 1 describes the document conventions. Table 1: Document Conventions Conventions Description Attention/Warning Note Indicates very important note. Users are strongly recommended to review. Informational Note Intended for informational purposes. Users should review. Menu item Indicates menu navigation instructions. Example: InsertTablesQuick TablesSave Selection to Gallery Console input/output or code snippet This text style denotes a console input/output or code snippet.

# Console I/O comment This text style denotes a console input/output comment. This is for informational purposes only and does not denote actual console input/output.

// Code snippet comment This text style denotes a code snippet comment. This comment may exist in the original code. External Hyperlink This symbol indicates a hyperlink to an external document or website. Example: Embedded Artists AB Click on the text to open the external link. Internal Hyperlink This symbol indicates a hyperlink within the document. Example: Introduction Click on the text to jump to the hyperlinked page and/or section. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 4 Bluetooth 5.2 Wireless Module Data Sheet 1 Product Information/General Information 1.1 Scope This specification is applied to the Type 2EG Bluetooth 5.2 wireless module. 1.2 Key features Bluetooth v5.2 Higher throughput Increased broadcast capacity Improved channel co-existence algorithm (SCA) Long range Proximity onsemi RSL15 SoC Built-in ARM Cortex M33 core with 80kB RAM (including 64kB user RAM) and 512kB Flash Dimension 7.4 mm x 7.0 mm x 1.0 (max.) mm Packaging: LGA Antenna Configuration:

Built-in PCB antenna Optional external antenna from pin pad Max. transmit power: 6 dBm Receive sensitivity: -96 dBm @ 1Mbps Ultra-low power TX 4.3 mA @ 0dBm RX 2.7 mA @ 1Mbps Sleep mode 36nA @3V VBAT Host interface: UART, SPI Peripheral interfaces: 15 GPIO, ADC, DAC, PWM, I2C, UART, SPI (QSPI), PCM and Debug SWD Operating temperature range: -40 C to 85 C RoHS compliant MSL Level 3 in accordance with JEDEC J-STD-020 Regulatory certificates (plan): FCC, ISED, ETSI 1.3 Ordering Information Table 2: Ordering Information 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 5 Bluetooth 5.2 Wireless Module Data Sheet Ordering Part Number Description LBCA1HN2EG-917 LBCA1HN2EG-SMP LBCA1HN2EG-EVK Module Sample Evaluation kit Type 2EG is design name of this module. Design name may be used in certification test report. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 6 Bluetooth 5.2 Wireless Module Data Sheet 1.4 Block Diagram Figure 1: Type 2EG Block Diagram Antenna 48MHz Xtal To external or on-board antenna onsemi Matching NCH-RSL15-512-

101WC40-ABG 32KHz Xtal VBAT VDDO VDDA Reset SWD UART/SPI/GPIO Inductor for DCDC 1.5 Reference

[1] onsemi Bluetooth 5.2 Wireless MCU RSL15 Data Sheet, RSL15/D, Rev.1 May 2022

[2] Murata Type 2EG EVK Schematic 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 7 Bluetooth 5.2 Wireless Module Data Sheet 2 Certification Information 2.1 Radio Certification (To be confirmed) Table 3: Radio Certification Country Standard USA (FCC) FCC Part 15 C Canada (ISED) ISED RSS-247 Europe EN300 328, Ver. 2.2.2 Japan MIC Radio equipment for Article 2-1-19 of Certification Ordinance Certification ID H HSW2EG SW2EG 4492A-2EG This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types are included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. In the end product, the transmitter must be installed to provide a separation distance of at least 20cm with the Monopole Antenna and at 5mm with the PCB Antenna from all persons and must not be co-located or operation in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. User and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying the RF exposure compliance. Table 4: Antenna to comply with FCC and ISED Part Number Vendor Gain (dBi) Type Connector Remarks GW26.0152 Taoglas 1.8 Monopole SMA

-3.0 PCB Necessary for FCC/ISED compliance only. Necessary for FCC/ISED compliance only. To be compliant with RED Directive while using TYPE 2EG module with external antenna, the total EIRP including the antenna gain should be less than or equal to 10dBm. 2.2 FCC Notice (USA) Warning: Changes or modifications to this device not expressly approved by Murata could void the users authority to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device complies with below part 15 of the FCC Rules. Part 15 Subpart C. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 8 Bluetooth 5.2 Wireless Module Data Sheet The FCC requires the OEM to be notified that any changes or modifications not expressly approved by Murata may void the users authority to operate the equipment. While an application of the TYPE 2EG module in a product is not required to obtain a new FCC authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for that end product. Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This module has been tested and found to comply with the following requirements for Modular Approval. Part 15.247 - Operation within the bands 902-928 MHz, 2400-2483.5 MHz, and 5725-5850 MHz. Test Modes This device uses various test mode programs for test set up which operate separate from production firmware. Host integrators should contact the grantee for assistance with test modes needed for module/host compliance test requirements. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in User manual. 2.3 FCC Labeling Requirements When integrating the TYPE 2EG into a product the FCC labeling requirements must be met. This includes a clearly visible label on the outside of the finished product specifying the TYPE 2EG FCC identifier (FCC ID:

HSW2EG) as well as the notice above. The exterior label can use wording such as Contains Transmitter Module FCC ID: HSW2EG or Contains FCC ID: HSW2EG although any similar wording that expresses the same meaning may be used. The following information must be indicated on the host device of this module. FCC Compliance Information This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

*If it is difficult to describe this statement on the host device due to the size, please describe in the user's manual and also either describe on the device packaging or on a removable label attached to the device. The following statements must be described on the user manual of the host device of this module. FCC CAUTION Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 9 Bluetooth 5.2 Wireless Module Data Sheet This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines as this equipment has very low levels of RF energy. [*]

[*]But it is desirable that it should be installed and operated keeping the radiator at least 20cm or more away from person's body. 2.4 ISED Notice (Canada) This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio a t approuv par la FCC et ISED pour fonctionner avec les types d'antennes rpertoris ci-dessous avec le gain maximal autoris indiqu. Les types d'antennes non inclus dans cette liste, ayant un gain suprieur au gain maximum indiqu pour ce type, sont strictement interdits pour une utilisation avec cet appareil. This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes: (1) Lappareil ne doit pas produire de brouillage; (2) Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. This radio transmitter (4492A-2EG) has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le prsent metteur radio (4492A-2EG) a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'metteur. Table 5: Antenna to comply with ISED Part Number Vendor Gain (dBi) Type Connector Remarks GW26.0152 Taoglas 1.8 Monopole SMA

-3.0 PCB Necessary for FCC/ISED compliance only. Necessary for FCC/ISED 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 10 Bluetooth 5.2 Wireless Module Data Sheet compliance only. 2.5 IC Labeling Requirements The host device should be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:

Contains transmitter module IC: 4492A-2EG, where 4492A-2EG is the modules certification number. The following statements must be described on the user manual of the host device of this module. This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment and meets RSS-102 of the ISED radio frequency (RF) Exposure rules as this equipment has very low levels of RF energy. (*1) Cet quipement est conforme aux limites dexposition aux rayonnements nonces pour un environnement non contrl et respecte les rgles dexposition aux frquences radiolectriques (RF) CNR-102 de lISDE puisque cet appareil a une niveau tres bas d'energie RF. (*2)

* In case of the Mobile equipment : Please add the following text.

(*1) But it is desirable that it should be installed and operated keeping the radiator at least 20cm or more away from person's body.

(*2) Cependant, il est souhaitable qu'il devrait tre install et utilis en gardant une distance de 20 cm ou plus entre le radiateur et le corps humain. 2.6 ESTI compliance (Europe) This device has been tested for use in the European Union. Both TYPE 2EG comply with the following regulation test. ETSI EN300 328, Ver. 2.2.2 Table 6: External Antenna to comply with ETSI Part Number Vendor Gain (dBi) S181XX-2450S Nearson 2.1 Type Dipole Connector Remarks SMA Necessary for FCC/ISED compliance only. If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in Annex II of the Radio and Telecommunications Terminal Equipment Directive. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 11 Bluetooth 5.2 Wireless Module Data Sheet 2.7 Bluetooth Qualification QDID: TBD 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 12 Bluetooth 5.2 Wireless Module Data Sheet 3 Dimensions, Marking and Terminal Configurations Figure 2: Type 2EG Dimensions, Marking and Terminal Configurations A B C D E Type2EG SS1234567 2D code M Table 7: Type 2EG Markings Marking Meaning A B C D E Module Type Inspection Number 2D code Murata Logo Pin 1 Marking Table 8: Type 2EG Dimensions Mark Dimensions (mm) Mark Dimensions (mm) Mark Dimensions (mm) L a1 b2 b5 b8 e1 7.0 +/- 0.20 0.30 +/- 0.10 1.25 +/- 0.20 3.30 +/- 0.20 0.60 +/- 0.10 0.40 +/- 0.10 W a2 b3 b6 c1 e2 7.4 +/- 0.20 0.60 +/- 0.10 2.20 +/- 0.20 4.725 +/- 0.20 0.60 +/- 0.10 0.35 +/- 0.10 T b1 b4 b7 c2 e3 1.0 max. 0.30 +/- 0.20 0.425 +/- 0.20 0.30 +/- 0.20 0.30 +/- 0.10 0.40 +/- 0.10 T dimension does not include height of solder bumps if there is any. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 13 Bluetooth 5.2 Wireless Module Data Sheet 3.1 Structure Figure 3: Type 2EG Structure Other SMD Inductor Crystal Crystal RSL15 Resin Mold Shield PWB Substrate 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 14 Bluetooth 5.2 Wireless Module Data Sheet 4 Module Pin Descriptions 4.1 Pin Assignments Figure 4: Top View Table 9: Type 2EG Pin Names No Pin name No Pin name No Pin name No Pin name 1 2 3 4 5 6 7 GPIO13 GPIO12 GPIO7 JTMS JTCK VDDO GPIO14 10 GPIO11 11 GPIO4 12 GPIO2 13 NRST 14 GPIO10 15 GPIO1 16 GPIO0 19 GND ANT 20 RF 21 22 GND VBAT 23 24 GND VDDA 25 28 GND 29 GND 30 GND 31 GND 32 GND 33 NC 34 NC 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 15 Bluetooth 5.2 Wireless Module Data Sheet No Pin name No Pin name No Pin name No Pin name 8 9 GPIO8 GPIO6 17 GPIO3 18 GPIO9 26 GPIO5 27 GND 4.2 Pin Descriptions Table 10: Type 2EG Pin Descriptions No. Pin name Type Connection to RSL15 pin name Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 GPIO13 GPIO12 GPIO7 SWDIO SWCLK VDDO GPIO14 GPIO8 GPIO6 GPIO11 GPIO4 GPIO2 NRST GPIO10 GPIO1 GPIO0 GPIO3 GPIO9 GND ANT RF GND VBAT GND VDDA GPIO5 GND GND GND I/O I/O I/O I/O I/O

"C4"

"B4"

"B5"

"B6"

"B7"

General purpose I/O General purpose I/O General purpose I/O Serial Wire Debug I/O Serial Wire Debug clock PWR

"A7"

Module I/O voltage supply

"A6"

"A5"

"A4"

"A3"

"B3"

"A2"

"D1"

"A1"

"B1"

"C1"

"B2"

"C2"

I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND RF RF GND General purpose I/O General purpose I/O General purpose I/O General purpose I/O General purpose I/O General purpose I/O Reset General purpose I/O General purpose I/O General purpose I/O General purpose I/O General purpose I/O Connection to integrated antenna RF signal from/to IC PWR

"G2"

Module core & RF voltage supply GND PWR

"G3"

I/O

"C3"

GND GND GND Charge pump output for analog and flash supplies General purpose I/O 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 16 Bluetooth 5.2 Wireless Module Data Sheet No. Pin name Type Connection to RSL15 pin name Description 30 31 32 33 34 GND GND GND NC NC GND GND GND NC NC NC NC 5 Absolute Maximum Ratings Table 11: Type 2EG Absolute Maximum Ratings Parameter Minimum Maximum Storage Temperature Operating Temperature VBAT VDDO Vin RF input level

-40

-40 0

+85

+85 3.63 3.63 VDDO+0.3 18 Unit Degree C Degree C V V V dBm Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. 6 Operating Conditions 6.1 General Operating Conditions Table 12: Type 2EG Operating Conditions Parameter Symbol Note Operating Temperature VBAT supply rise time Maximum rate of voltage rise DC-DC Convert Input Voltage VBAT Buck Mode LDO Mode Digital I/O Supply Input VDDO Min

-40 1.4 1.2 1.2 Typ. Max Unit 25

+85 Degree C 0.1 3.6 3.6 3.6 V/us V V V 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 17 Bluetooth 5.2 Wireless Module Data Sheet Operation beyond the recommended operating conditions is neither recommended nor guaranteed. 6.2 Digital I/O Requirements Table 13: Type 2EG Digital I/O Requirements Symbol Parameter Condition VIH VIL VOH VOL

Input high voltage Input low voltage Output high voltage Output low voltage Weak Pullup Resistor Strong Pullup Resistor Pulldown Resistor 1. For VDDO < 1.8 V, VIL Max is 0.23 * VDDO Min 0.75 *

VDDO

-0.3 VDDO -

0.4

Typ. Max Unit

250 10 250 VDDO +

0.3 0.25 *

VDDO1 0.35 *

VDDO 0.4 V V V V k k k 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 18 Bluetooth 5.2 Wireless Module Data Sheet 7 DC/RF Characteristics 7.1 Typical Power Consumption Conditions: 25deg.C, VBAT=VDDO=3.0V Table 14: RF Current Consumption Operating Condition VBAT DC Conversion Min Typ. Max Unit Radio Receive Mode Rx @ 1 Mbps, 2.4 GHz 8 MHz system clock CortexM33 running BLE baseband only All Peripherals Disabled 64 kB RAM enabled Radio Transmit Mode Tx @ 1 Mbps, 2.4 GHz, 0 dBm 8 MHz system clock CortexM33 running BLE baseband only All Peripherals Disabled 64 kB RAM enabled Radio Transmit Mode Tx @ 1 Mbps, 2.4 GHz, 6 dBm 8 MHz system clock CortexM33 running BLE baseband only All Peripherals Disabled 64 kB RAM enabled 3.0 Buck Mode 1.25 LDO Mode 3.0 Buck Mode 1.25 LDO Mode 3.0 Buck Mode 1.25 LDO Mode Table 15: Sleep Mode Current Consumption 2.7 5.8 4.3 9.1 11.4 24.1 mA mA mA Operating Condition Clocks stopped All peripherals disabled No RAM retained 32 kHz RC32 inactive 32 kHz XTAL32K inactive Wakeup Source VBAT DC Conversion Min Typ. Max Unit GPIO 3.0 Buck Mode 36 nA 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 19 Bluetooth 5.2 Wireless Module Data Sheet 7.2 RF Characteristics Conditions: 25deg.C, VBAT=VDDO=3.0V Table 16: Type 2EG RF Characteristics DCDC mode LDO mode RF Characteristics Center frequency Channel Spacing Number of RF Channels Max output power *

Modulation Characteristics f1avg f2max (at 99.9%) f2avg / f1avg Carrier frequency offset and drift 1) Frequency offset: | fn fTX |

2) Frequency drift: | f0 fn |

3) Drift rate #0: | f1 f0 |

4) Drift rate #n: | fn fn-5 |

Receiver sensitivity (PER < 30.8%) DCDC mode LDO mode Maximum input signal level (PER < 30.8%)

-10 Min Typ. Max Unit 2402

225 185 0.8

2 40 6 6

-96

-96

2480 MHz

275

150 50 20 20

-70

-70

MHz

dBm dBm kHz kHz

kHz kHz kHz kHz dBm dBm dBm 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 20 Bluetooth 5.2 Wireless Module Data Sheet 8 Power Sequence For device start up sequence, please refer to onsemi RSL15 datasheet [1]. 9 Application Information 9.1 Recommended PCB Landing Pattern We recommend the host PCB land pattern be the same as the module pin pad pattern. Figure 5: Type 2EG Land Patterns 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 21 Bluetooth 5.2 Wireless Module Data Sheet 9.2 Host PCB Layout Recommendations Figure 6: Host PCB Layout Recommendation, top view 9.3 Layout Guidance for Using Internal PCB Antenna The TYPE 2EG module is certified with an internal PCB antenna physically located on the module. For optimum EIRP (Effectively Isotropically Radiated Power) when use the on-board antenna, please follow the following recommendations in the customer host circuit board design. A. The module is recommended is be placed on top left corner of the host circuit board. B. Around the antenna area, all layers of the customer circuit board should be free of any metal objects. Specifically, there should be no ground plane, traces, or metal shield case C. Host circuit PCB length is longer than 40mm to get optimal performance by using ground plane. D. Right side of antenna area also should be free of grounds. E. Metal and plastic materials should be away from the module. (More than 3mm) 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 22 Bluetooth 5.2 Wireless Module Data Sheet F. To use this internal antenna, the integrator must provide a simple two-component matching circuit between pins 20 and 21 of the module. This circuit will connect the RF I/O of the module directly to the PCB antenna. The picture below shows the location of pins 20 and 21. Figure 7: Layout Guide for Antenna Performance (1) Figure 8: Layout Guide for Antenna Performance (2) 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 23 Bluetooth 5.2 Wireless Module Data Sheet The Integrator must place the matching circuit shown below between Pins 20 and 21 of the Module to duplicate the structure used during FCC/ISED testing of the Type2EG module. Use the exact PNs provided for L1 and C15 and C16 to meet regulatory requirements. On the integrators support board, place L1 (1.6pF) between Pin 20 and Pin 21 of the Module. Place C16 adjacent to Pin 21. The other side of C16 should be attached to RF Ground. 9.4 Layout Guidance for Microstrip Design and External Antenna The TYPE 2EG module is certified with an internal PCB antenna and two external antennae, a 2.1 dBi omni antenna. The omni antenna should be connected to the Type2EG module using 50ohm microstrip RF trace and a U.FL RF connector as shown below. The microstrip RF trace and U.FL connector are placed on the customers PCB and are external to the Type2EG module. The omni antenna is then connected to this UFL Connector via a 50ohm RF adapter cable. Figure 9: Layout Guide for External Antenna (1) The design of the 50ohm microstrip RF trace on the customers PCB is crucially important. Compliant operation of the Type2EG module is dependent on proper construction of this 50ohm line and the following guidelines must be followed to ensure legal operation of the product. The diagram below shows the required microstrip structure to be routed between module pin 21 and the UFL connector. The top PCB trace carries the RF energy from module to UFL connector. The Layer2 ground plane provides a return path for the circuit. The Dielectric material (along with the dimensions of the microstrip structures) determines the characteristic impedance of the microstrip transmission line. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 24 Bluetooth 5.2 Wireless Module Data Sheet Figure 10: Layout Guide for External Antenna (2) Note the representative dimensions shown in the drawing above. It is imperative that the module customer (the integrator) use the exact dimensions we recommend to ensure a 50-ohm impedance for this transmission line. The following dimensions and/or ratios should be used to set the microstrip impedance to 50 ohms. Dielectric (PCB) Material We recommend standard FR-4 PCB material. Other dielectrics will work but will require recalculation of microstrip dimensions. The following guidance is predicated on the use of FR-4 Dielectric. If FR-4 is not used for PCB material, please contact Murata Electronics at (678) 684-2009 to determine new dimensions for microstrip structure. H (Dielectric Height) this is the thickness of dielectric between the trace layer (layer 1) and the ground plane on layer 2. Note that layer 2 must be electrical ground. We recommend a dielectric thickness of 8-15 mils. This range provides the customer with some flexibility in board construction. t (trace thickness) Microstrip impedance is not severely affected by the thickness dimension. Standard 1oz or 2oz copper deposition is recommended. Equivalent thickness is 1-2 mils. W (trace width) this is the crucial dimension. This width must be set correctly to obtain the desired 50 ohms impedance. When using FR-4 dielectric, the width (W) of the microstrip trace should be set to:

W = H * 1.8 Where W is microstrip trace width and H is Dielectric height. Note that both values must be measured in identical units (mils or mm) Example:

H = 12 mils, W = 12 * 1.8 = 21.6 mils H = 0.4 mm W = 0.4 * 1.8 = 0.72 mm l (trace length) the impedance of the microstrip line is not dependent on its length. However, regulatory and performance limitations practically determine the actual length to be used by the customer (integrator). The length of this microstrip line must be longer than 7 mm to mimic the length used during FCC/ISED certification of the TYPE 2EG module. Lengths longer than 7 mm are acceptable although additional signal loss will occur as a result. Given these restrictions, Murata recommends microstrip trace lengths between 7 mm and 25 mm. In any event, the microstrip line must operate over the same Dielectric-Ground Plane configuration shown above to act as a 50-ohm transmission line. Do not run the microstrip trace through sections of PCB that do not have the Dielectric-Ground plane configuration shown above. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 25 Bluetooth 5.2 Wireless Module Data Sheet A reliable 50-ohm transmission line will be produced if the above guidance is closely followed. Any deviations from the guidance above may cause the module to operate in noncompliant manner. Any implementation questions or concerns should be directed to Murata module technical support. 9.5 Reference Circuit Please refer to Type 2EG EVK schematics [2]. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 26 Bluetooth 5.2 Wireless Module Data Sheet 10 Tape and Reel Packing 10.1 Dimensions of Tape (Plastic tape) Figure 11: Dimensions of Tape (Plastic Tape) Cumulative tolerance of max. 40.0 0.15 every 10 pitches 10.2 Dimensions of Reel Figure 12: Dimension of Reel 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 27 Bluetooth 5.2 Wireless Module Data Sheet 10.3 Taping Diagrams Figure 13: Taping Diagrams

[3]

[1]

[2]

[3]

[4]

Figure 14: Taping Specifications Mark Description 1 2 3 4 Feeding hole. As specified in Dimensions of Tape (Plastic tape) Hole for Chip. As specified in Dimensions of Tape (Plastic tape)

. Cover tape. 62 M in thickness. Base tape. As specified in Dimensions of Tape (Plastic tape)

. Figure 15: Taping Diagrams (Close Up) Feeding Hole Feeding Direction Pin 1 Marking Chip 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 28 Bluetooth 5.2 Wireless Module Data Sheet 10.4 Leader and Tail Tape Figure 16: Leader and Tail Tape Feeding direction Tail tape Components No components Leader tape

(No components)

(Cover tape alone) The tape for chips is wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. The cover tape and base tape are not adhered at no components area for 250mm min. Tear off strength against pulling of cover tape: 5N min. Packaging unit: 1000pcs. / reel Material Base tape: Plastic Real: Plastic Cover tape, cavity tape and reel are made the anti-static processing. Peeling of force: 1.3N max. in the direction of peeling as shown below. Figure 17: Peeling Off Force 1.3 N max. 165 to 180 Cover tape Base tape 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 29 Bluetooth 5.2 Wireless Module Data Sheet 10.5 Packaging (Humidity Proof Packing) Figure 18: Packaging Label Desiccant Humidity Indicator Label Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 30 Bluetooth 5.2 Wireless Module Data Sheet 11 Notice 11.1 Storage Conditions Please use this product within 6month after receipt. The product shall be stored without opening the packing under the ambient temperature from 5 to 35 C and humidity from 20 ~ 70 %RH.

(Packing materials, in particular, may be deformed at the temperature over 40 C) The product left more than 6months after reception, it needs to be confirmed the solderability before used. The product shall be stored in noncorrosive gas (Cl2, NH3, SO2, NOx, etc.). Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object, and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) After the packing opened, the product shall be stored at <30 C / <60 %RH and the product shall be used within 168 hours. When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125 +5/-0 C, 24 hours, 1 time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) is not heat-resistant. 11.2 Handling Conditions Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bare hands that may result in poor solder ability and destroy by static electrical charge. 11.3 Standard PCB Design (Land Pattern and Dimensions) All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 31 Bluetooth 5.2 Wireless Module Data Sheet 11.4 Notice for Chip Placer When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. 11.5 Soldering Conditions The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the above-mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Figure 19: Reflow soldering standard conditions (Example) Pre-heating 250 deg.C 220 deg.C 180 deg.C 150 deg.C Within 10s Tpeak-5deg.C Cooling down Slowly Within 120s Within 60s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt. % or less. 11.6 Cleaning Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is done the customer is responsible for any issues or failures caused by the cleaning process. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 32 Bluetooth 5.2 Wireless Module Data Sheet 11.7 Operational Environment Conditions Products are designed to work for electronic products under normal environmental conditions

(ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. In an atmosphere containing corrosive gas (Cl2, NH3, SOx, NOx, etc.). In an atmosphere containing combustible and volatile gases. Dusty place. Direct sunlight place. Water splashing place. Humid place where water condenses. Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 33 Bluetooth 5.2 Wireless Module Data Sheet 12 Preconditions to Use Our Products PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You agree that you will use any and all software or program code (including but not limited to hcd, firmware, NVRAM, and blob) we may provide or to be embedded into our product (Software) provided that you use the Software bundled with our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU AS- IS BASIS, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE WITHOUT INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM ANY AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE NOR THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You shall indemnify and hold harmless us, our affiliates and our licensor from and against any and all claims, costs, expenses and liabilities (including attorneys fees), which arise in connection with the using the Software. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS AND THE SOFTWARE IN SUCH APPLICATIONS. Aircraft equipment. Power plant control equipment Burning / explosion control equipment Aerospace equipment Undersea equipment. Medical equipment. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 34 Bluetooth 5.2 Wireless Module Data Sheet Traffic signal equipment. Disaster prevention / crime prevention equipment. Transportation equipment (vehicles, trains, ships, elevator, etc.). Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, deviation or lapse in function of engineering sample, improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you cant agree the above contents, you should inquire our sales. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 35 Bluetooth 5.2 Wireless Module Data Sheet Appendix 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 36 Bluetooth 5.2 Wireless Module Data Sheet Revision History Revision Date Description

0.1 0.4 Aug 10, 2022

Aug 18, 2022 11/22/2022 Updated the FCC and ISED notice wording Comments First issue.

- Added DC and RF Spec 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 37 Bluetooth 5.2 Wireless Module Data Sheet Copyright Murata Manufacturing Co., Ltd. All rights reserved. The information and content in this document are provided as-is with no warranties of any kind and are for informational purpose only. Data and information have been carefully checked and are believed to be accurate; however, no liability or responsibility for any errors, omissions, or inaccuracies is assumed. Wi-Fi is a registered trademark of Wi-Fi Alliance. The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Other brand and product names are trademarks or registered trademarks of their respective owners. Specifications are subject to change without notice. 2019 by Murata Manufacturing Co., Ltd. Apr 05, 2022 SP-QD1ZM-L Rev. L4 www.murata.com 38

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6272904.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Label & Location Model Name: Type2EG Type2EG

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Federal Communication Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MID 21046 Regarding FCC ID: HSW2EG To whom it may concern:

Date: November 30, 2022 We, the undersigned, hereby authorize SGS Taiwan Ltd. to act on our behalf in all manners relating to application for equipment authorization with respect to the FCC ID above, including signing of all documents relating to these matters. Any and all acts carried out by the agent on our behalf shall have the same effect as acts of our own. We, the undersigned, hereby certify that we are not subject to a denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. We also declare that the information provided to the FCC is true and correct to the best of our knowledge

(47 CFR 2.911(d)) and we have been informed of the grantee responsibilities (47 CFR 2.909) with regard to certified equipment. This authorization is valid until further written notice from the applicant. Sincerely, Signature: ____ ________________ Printed Name /Title: Mark Tucker / Manager, Hardware Engineering Group Company Name: Murata Electronics North America

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6272911.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Date: November 30, 2022 Federal Communication Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MID 21046 REQUEST FOR CONFIDENTIALITY - FCC FCC ID: HSW2EG Pursuant to Sections 0.457(d) and 0.459 of the Commissions Rules and FCC Guidance document 726920, we hereby request permanent confidential treatment of exhibits identified as such in the table below and request they are permanently withheld from public review based on the documents containing trade secrets and proprietary information not customarily released to the public. The public disclosure of this information might be harmful to the applicant and provide unjustified benefits to its competitors. We also request short-term confidentiality on certain exhibits until the intended date of marketing as outlined below. We request the exhibits be withheld from public view for a period of (180) days. We attest marketing of the product will only commence after the period of short-term confidentiality expires, or if marketing is to commence before the requested number of days listed above, the grantee will inform Nemko to release the Short-Term Confidentiality information withheld on the FCC equipment authorization website. Exhibit Block Diagrams Operation Description Parts List & Placement/BOM Tune-Up Procedure Schematic Diagrams External Photos Internal Photos Test Setup Photos Users Manual Type of Confidentiality Requested Permanent Permanent Permanent Permanent Permanent

Permanent*

Permanent*

Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term The asterisked items (*) require further information to be provided in this justification letter before permanent confidentiality will be extended to these exhibits. Please refer to FCC KDB 726920 D01 found at:

https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=41731 and review section II, 3) regarding specific information that must accompany these requests. Note: any documents held under the Short-Term confidentiality will automatically become public after the requested time if an appropriate extension request has not been received. Any exhibits (i.e., schematic diagrams) that may have already been requested to have Permanent confidentiality as shown above need not be repeated under Short-Term confidentiality request. Sincerely, Signed:

Printed name: Mark Tucker Title: Manager, Hardware Engineering Group Company Name: Murata Electronics North America

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6272912.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Declaration Date: November 30, 2022 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Dear Examiner:

We declare that this equipment (Product Name: Type 2EG BLE Module, FCC ID: HSW2EG) complies with e-CFR Title 47 Part 2.925 (f), as it is too small to be labeled with FCC ID (smaller than 4-6 points). Hence the FCC ID is placed in user manual and packaging instead of being affixed on the equipment. Sincerely, Signature:

Printed Name /Title: Mark Tucker / Manager, Hardware Engineering Group Company Name: Murata Electronics North America

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