FCC ID: 2AF9F-1337R CHIP Pro

Revision History Revision Author Date Description v0.1 v1.0 V1.01 V1.02 V1.03 JAT JAT JAT GRH GRH Oct. 09, 2016 Initial Internal Release Oct. 11, 2016 Initial Public Release Dec. 20, 2016 Updated PCB Footprint and Pinout Map Mar. 06, 2017 Apr. 17, 2017 Updated Pinout Map, Mech. Drawing, Photos, Removed erroneous application diagram Add FCC/CE Compliance information and list of certified antennas, Add packaging information C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 2 Declaration This page left intentionally blank. \()/

C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 3 Table of Contents 1. OVERVIEW ........................................................................................................................................................ 6 1.1. APPLICATIONS .................................................................................................................................................... 6 2. FEATURES.......................................................................................................................................................... 7 2.1. CPU................................................................................................................................................................ 7 2.2. GPU ............................................................................................................................................................... 7 2.3. MEMORY ......................................................................................................................................................... 7 2.4. SYSTEM PERIPHERALS .......................................................................................................................................... 7 2.5. VIDEO ENGINE ................................................................................................................................................... 9 2.6. DISPLAY SUBSYSTEM ............................................................................................................................................ 9 2.7. CAMERA INPUT .................................................................................................................................................. 9 2.8. AUDIO SUBSYSTEM ............................................................................................................................................. 9 2.9. EXTERNAL PERIPHERALS ..................................................................................................................................... 10 2.10. POWER SYSTEM ............................................................................................................................................. 11 2.11. WIFI & BLUETOOTH ........................................................................................................................................ 11 3. ELECTRICAL CHARACTERISTICS ......................................................................................................................... 12 3.1. ABSOLUTE MAXIMUM RATINGS ........................................................................................................................... 12 3.2. RECOMMENDED OPERATING CONDITIONS .............................................................................................................. 12 3.3. DC ELECTRICAL CHARACTERISTICS ......................................................................................................................... 13 3.4. POWER CONSUMPTION ...................................................................................................................................... 13 3.5. OSCILLATOR ELECTRICAL CHARACTERISTICS ............................................................................................................. 14 3.6. POWER UP/DOWN AND RESET SPECIFICATIONS ....................................................................................................... 14 4. BLOCK DIAGRAM ............................................................................................................................................. 15 5. PIN DEFINITIONS ............................................................................................................................................. 16 5.1. PIN CHARACTERISTICS ........................................................................................................................................ 16 5.2. PIN MULTIPLEXING FUNCTIONS ............................................................................................................................ 19 5.3. DETAILED PIN/SIGNAL DESCRIPTION ..................................................................................................................... 20 5.4. PINOUT DIAGRAM ............................................................................................................................................ 16 6. MECHANICAL AND PACKAGING INFORMATION ................................................................................................ 22 6.1. MECHANICAL DRAWING ..................................................................................................................................... 22 6.2. RECOMMENDED PCB FOOTPRINT ......................................................................................................................... 23 6.3. SMT REFLOW PROFILE ...................................................................................................................................... 24 6.4. PACKAGING DIMENSIONS AND INFORMATION .......................................................................................................... 25 7. SCHEMATIC ..................................................................................................................................................... 26 C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 4 About This Documen tation From the desk of Gustavo Huber When Dave, Thomas, and I started Next Thing Co. in 2013, it was with a simple goal: we wanted to create things that would inspire creativity, and help people chase their own ideas of what needed to exist. We considered this goal both in terms of how economically accessible we could make our products (they had to be $99 or less), as well as how much pain we could remove from the design process for others (they had to be open source and well-

documented). Our first attempt was a software-defined camera named OTTO, built around an off-the-shelf embedded module. But early in development, we knew that our end-goals were at risk. The $39 module made it impossible to ship product priced under $99. It lacked Mainline Linux support, a reliable tool-chain, documentation and functional drivers making software development a cat-and-mouse game of bug tracking. But thanks to lots of long days, and some good friends both in Shenzhen and back home in Oakland, we built and shipped out 500 OTTOs -- a serious feat. Almost exactly a year later, we shipped out the first of what is now over 100,000 C.H.I.P.s delivered worldwide. At $9, C.H.I.P. was the fruition of our vision from a year prior: accessible, powerful technology, available to everyone for hobby, education, or products. In so many words, we were building the tools that we wished wed had before. The reaction was (and continues to be) astounding! Tweets and emails come from far and wide to tell us about impossible projects banged together in an afternoon, classrooms full of proud 10-year-old game developers who had never before written a line of code, and seasoned engineers brought back to memories of discovering their passion on a Commodore 64, 40 years prior. Yet, just as building OTTO showed us the tools we were missing, building C.H.I.P has taught us what it takes to scale production to keep up with [even unprecedented] demand. So it is with great pleasure that I invite you to explore, without non-disclosure agreements or any other obstructive formalities, this datasheet for C.H.I.P. Pro: the newest addition to the Next Thing Co. family. Thanks to the experience and support from our friends at Allwinner and Nanya, C.H.I.P. Pro is built from the ground up for clean and reliable design. From in-package DDR3 DRAM in the GR8 SiP (which allows us to buy known-good-die DRAM rather than market components), to keeping the onboard NAND, Bluetooth, WiFi, and power management that made C.H.I.P. so useful, C.H.I.P. Pro takes care of all the nuts and bolts, letting you get to the fun parts faster. With Next Thing Co. and the thriving Chipster community from bbs.nextthing.co at your side, we cant wait to see what youll do with C.H.I.P. Pro!

/Gustavo Co-founder, Hardware Guy C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 5 1. Overview At Next Thing Co., we work to make it easy to integrate computer hardware in products. C.H.I.P. Pro is powered by GR8, a system-in-package (SiP) that was designed by Next Thing Co. GR8 features a 1GHz Allwinner R8 ARM Cortex-A8 processor, Mali400 GPU, and 256MB of Nanya DDR3 DRAM in a 256-ball 14mm x 14mm FBGA package. C.H.I.P. Pro is a system-on-module (SoM) that has 512MB of high-speed NAND storage flashed with our GadgetOS. It can be simultaneously and seamlessly powered by any combination of USB, DC Input, or Li-ion battery, all intelligently managed by the AXP209 PMU. The module offers all the popular interfaces youd expect. With two High-Speed UARTs, a Two-Wire Serial Interface, a parallel camera sensor interface, SPI, two PWM channels, and a USB 2.0 port, C.H.I.P. Pro is packed full of I/O expandability. Comprehensive audio handling includes a built-in 24-bit ADC/DAC for analog audio, S/PDIF and AES3-

compatible One-Wire Digital Audio, as well as I2S digital audio for interfacing with professional audio codecs. C.H.I.P. Pro is CE, IC, and FCC 47 CFR 15.212 certified as a modular transmitter, making integration into end products easy. The on-board Realtek 8723DS 2.4GHz combination module provides compliant Wi-Fi B/G/N and Bluetooth 4.2 Low-Energy connectivity. A software controlled antenna path selects between the on-board chip antenna or a U.FL /

IPEX antenna connector where several pre-certified antennas can be added to optimize wireless range. The module is rated to operate from 2.9V-6V input in environments ranging between 0 and 70 degrees Celsius, and measures 45 mm x 30 mm. C.H.I.P. Pro is $16 in any quantity and includes custom factory flashing via Next Thing Co.s Gadget software tools for orders of 1000 or more. Because we want everyone to have access to building great things at awesome prices, the minimum order quantity for C.H.I.P. Pro is one. We cant wait to see how youll integrate C.H.I.P Pro in to your next product, project, or prototype. 1.1. Applications Physical Computing Voice Recognition Smart Clapper Animated GIF Camera Smart Consumer Devices Portable Audio Devices Cyber Dog Robot Toys C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 6 2. Features ARM CortexTM-A8 ARMv7 Instruction set plus Thumb-2 Instruction Set 32KB Instruction Cache and 32KB Data Cache 256KB L2 Cache Supports Open GL ES 1.1/ 2.0 and Open VG 1.1 2.1. CPU NEONTM SIMD Extensions Jazelle RCT Acceleration 2.2. GPU Mali400 2.3. Memory Boot ROM On-chip Boot ROM Supports NAND Flash, SPI NOR Flash, SD Card and USB OTG NANYA DDR3 SDRAM In-package 256MB 16-bit DDR3 memory NAND Flash 512MB SLC NAND Compatible with eMMC v4.4, SD Physical Layer Specification v2.0, SDIO Card Specification v2.0 1-/4-/8-bit bus width Supports block size of 1 to 65535 bytes Dedicated DMA for fast and uninterrupted data transfer SD/MMC One SD/MMC Host Controllers (SMHC) 2.4. System Peripherals CCM Clock Control Module C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 7 Seven PLLs driven by a main external Oscillator and an on-chip RC Oscillator Supports clock configuration and clock generated for corresponding modules Supports software-controlled clock gating and software-controlled reset for corresponding modules DMA Direct Memory Access Eight channels Normal DMA (NDMA) and eight channels Dedicated DMA (DDMA) Supports memory-to-memory, memory-to-peripheral, peripheral-to-memory data transfer types Transfer data width of 8/16/32-bits Programmable DMA burst size Features PWM Pulse Width Modulation Two output channels Supports continuous and pulse waveforms 0% to 100% adjustable duty cycle Up to 24 MHz output frequency Six Asynchronous Timers with interrupt-based operation A watchdog timer to generate reset signal or interrupt Two 33-bit Audio/Video Sync (AVS) counter to synchronize video and audio Asynchronous Timer One 64-bit counter Synchronous Timer Two Synchronous Timers with interrupt-based operation Interrupt Controller Normal interrupt requests (nIRQ) and fast interrupt requests (FIQ) Supports 96 interrupt sources Four level priority controller External interrupt can be triggered according to edge or level-sensitivity LRADC Low Resolution Analog-to-Digital Converter Analog-to-Digital Converter with 6-bit resolution suitable for multi-button input Supports multiple button press detection Supports single, normal and continuous work mode Sampling frequency up to 250 Hz Crypto Engine Supports AES, DES, 3DES, SHA-1, MD5 Supports ECB, CBC modes for AES/DES/3DES 128-bit, 192-bit and 256-bit key size for AES 160-bit hardware Pseudo Random Number Generator (PRNG) with a 175-bit seed C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 8 Features Supports multi-format video decoding of VP6/8, AVS, H.264, H.263, and MPEG-1/2/4 Supports encoding in H.264 MP format Four moveable and size-adjustable layers Image enhancement processor Alpha blending /anti-flicker Hardware cursor 2.5. Video Engine Video Decoding Up to 1080p@30fps resolution Video Encoding Up to 720p@30fps resolution 2.6. Display Subsystem Display Processing Multi-format image input Output color correction (luminance/hue/saturation) 2.7. Camera Input Maximum still capture resolution on parallel interface up to 5M Maximum video capture resolution on parallel interface up to 1080p@30fps 2.8. Audio Subsystem Audio Codec Audio Compression / Decompression Module On-chip 24-bit DAC for playback and ADC for recording Supports analog/digital volume control Supports 44.1 kHz, 48 kHz, 96 kHz, and 192 kHz sample rates Stereo microphone input Stereo headphone amplifier Supports 8-bit CMOS sensor parallel interface Supports BT656 interface Pixel clock up to 150MHz Selectable I2S or PCM on shared pins Full-duplex synchronous serial interface Configurable as a master or a slave Audio data resolutions of 16, 20, 24 I2S Audio data sample rate from 8 kHz to 192 kHz Left Justified or Right Justified I2S PCM supports 8-bit or 16-bit linear, 8-bit u-law, or 8-bit A-law companding sample format I2S/PCM Inter-IC Sound / Pulse Code Modulation One 128x24-bits FIFO for data transmit and one 64x24-bits FIFO for data receive Programmable FIFO thresholds C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 9 Features IEC-60958 (AES3 & S/PDIF-compatible) transmitter functionality Channel status insertion Hardware parity generation OWA - One Wire Audio One 3224bits FIFO (TX) for audio data transfer Programmable FIFO thresholds 2.9. External Peripherals TWI - Two Wire Interface (I2C-Compatible) One TWI (Two-Wire Interface) controller Supports Standard mode (up to 100 kbit/s) and Fast mode (up to 400 kbit/s) Configurable as a master or a slave Capable of 10-bit addressing UART - Universal Asynchronous Receiver/Transmitter Two UART controllers

- UART0 with 2 wires

- UART1 with 4 wires Compatible with industry-standard 16550 UARTs Support for word length from 5 to 8 bits, an optional parity bit, and 1, 1.5 or 2 stop bits Programmable parity (even, odd and no parity) All ports compatible with IrDA SPI Serial Peripheral Interface One SPI controller with one Chip Select signal Full-duplex synchronous serial interface Configurable as a master or a slave Configurable Polarity, phase and clock frequency C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 10 Features Intelligent Power Select (IPS) allows for three separate inputs: Vbus-USB (VBUS), Charge-In (CHG-IN), and Battery (BAT) Li-Po Battery Charging up to 1.8A with configurable current limiting, and Fuel Gauge Functionality Integrated ON/OFF button configurable logic, interrupt and startup/shutdown sequencing Integrated battery temperature sensor circuit, alternately usable as 12-bit ADC 2.10. Power System AXP209 Power Management Unit 2x LY8088 Switching Regulators 2.11. WiFi & Bluetooth Realtek 8723DS Integrated WiFi + Bluetooth Module Operates at ISM frequency bands (2.4GHz) 1.3A 2.3V-6V Input, 1.5MHz Synchronous Step-Down Converter SDIO 2.0 for WiFi and H5 Specification-compliant HS-UART for Bluetooth data paths Enterprise-level security supports WPA/WPA2 for WiFi. Hardware supports:

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IEEE 802.11b/g/n

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IEEE 802.11e QoS Enhancement (WMM)

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IEEE 802.11h Transmit Power Control and Dynamic Frequency Selection (TPC, DFS)

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IEEE 802.11i Open, shared key, and pair-wise key authentication services (WPA, WPA2)

- WiFi 1x1 TX/RX PHY data rates up to 150 Mbps downstream and 150 Mbps upstream

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- AFH to dynamically detect channel quality

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-

Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbps modulation mode Fully Qualified for Bluetooth 3.0/4.0/4.2 Dual mode including simultaneous Low Energy and BR/EDR Fullspeed Bluetooth operation with Piconet and Scatternet support Power Control/Enhanced Power Control Frame Aggregation for increased MAC efficiency (A-MSDU, A-MPDU) Low latency High-Throughput Block Acknowledgement (HT-BA) Transmit Opportunity and Short Inter-Frame Space bursting for higher multimedia bandwidth (TXOP, SIFS) Enhanced BT/WiFi Coexistence Control to improve transmission quality in different profiles Fast Automatic Gain Control (AGC) to improve receiving dynamic range Modularly pre-certified for use with several external antennas in addition to the included on-board SMT ceramic antenna Table 2.11.1: FCC Part 15 Pre-Certified Antennas Antenna Model Manufacturer AA107 HCX-P321 FXP73.07.0100A AA055 Unictron Wacosun Taoglas Unictron Gain 3.3dBi 2dBi 2.5dBi 2.5dBi Antenna Type PCB PCB PCB Ceramic Connection Type Frequency Range

(GHz to GHz) Cable Length

(mm) IPEX IPEX IPEX SMT 2.4-2.5 2.4-2.5 2.4-2.483 2.4-2.5 n/a 100 150 100 Note:This radio transmitter (20863-1337R) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio (20863-1337R)A t approuv par Industrie Canada pour fonctionner avec les types d'antenne Ci-dessous avec le gain maximal admissible indiqu. Antenne Types non inclus dans cette liste, ayant un gain suprieur au gain maximal Indiqu pour ce type, sont strictement interdits pour tre utiliss avec cet appareil. C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 11 3. Electrical Characteristics 3.1. Absolute Maximum Ratings The absolute maximum ratings are those values beyond which damage to the device may occur. The table below specifies the absolute maximum ratings over the operating junction temperature range of commercial temperature devices. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this standard may cause damage to the device. Table 3.1.1: Absolute Maximum Ratings Symbol II/O CHG-IN BAT VBus TSTG TA PD VESD ILatch-up Parameter In/Out Current for Input and Output Input Voltage for Charge-In Input Voltage for Battery-in Input Voltage for USB-VBus Storage Temperature Ambient Operating Temperature (1) PMU Internal Power Dissipation Electrostatic Discharge Human Body Model(HBM) (2) Charged Device Model(CDM) (3) Latch-up I-test performance current-pulse injection on each IO pin (4) Latch-up over-voltage performance voltage injection on each IO pin (5) Min

-40

-0.3

-0.3

-0.3

-30 0

-

-4000

-500 Unit mA V V V C C mW V V Max 40 11 4.2 11 125 70 2100 4000 500 Pass Pass

(1) Limited by operating temperature minimum of WiFi+BT Module, other components tested to -20C.

(2) Test method: JEDEC JS-001-2014(Class-3A). JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(3) Test method: JEDEC JS-002-2014(Class-C2A). JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

(4) Current test performance: Pins stressed per JEDEC JESD78D(Class I, Level A) and passed with I/O pin injection current as defined in JEDEC.

(5) Over voltage performance: Supplies stressed per JEDEC JESD78D(Class I, Level A) and passed voltage injection as defined in JEDEC. 3.2. Recommended Operating Conditions All C.H.I.P Pro modules are intended for use under the operating conditions contained in the table below. Table 3.2.1: Recommended Operating Conditions Symbol CHG-IN BAT VBus IOUT

(1) Programmable limit set in AXP209 PMU allows for safe attachment to USB 2.0, USB 3.0, or high-current CHG-IN sources. Parameter Input Voltage for Charge-In Input Voltage for Battery-In Input Voltage for VBus PMU VOUT Current available before loading BAT (1) Max 6.3 4.20.5%

6.3 2500 Typ 5~5.5 3.8 5~5.5 900 Unit V V V mA Min 3.8 3.0 3.8 500 C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 12 3.3. DC Electrical Characteristics Electrical Characteristics Table 3.3.1: DC Electrical Characteristics Symbol VIH VIL RPU RPD IIH IIL VOH VOL IOZ CIN COUT Parameter High-Level Input Voltage Low-Level Input Voltage Input Pull-up Resistance Input Pull-down Resistance High-Level Input Current Low-Level Input Current High-Level Output Voltage Low-Level Output Voltage Tri-State Output Leakage Current Input Capacitance Output Capacitance Min 0.7 * VCC-IO

-0.3 50 50

-

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VCC-IO -0.2 0

-10

-

-

Typ

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100 100

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-

-

-

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Max VCC-IO + 0.3 0.3 * VCC-IO 150 150 10 10 VCC-IO 0.2 10 5 5 Unit V V K K uA uA V V uA pF pF 3.4. Power Consumption C.H.I.P. Pro is designed for both battery and wall-powered embedded applications. The following measurements are offered as a rough starting point with which to begin to understand the range of power budgets relevant to a C.H.I.P. Pro-based device operated from a battery. Exact system power consumption is significantly influenced by factors such as software power optimizations (or lack thereof), power source quality, external peripheral circuitry, and ambient operating temperature. Table 3.4.1: Sample Power Consumption Measurements from Gadget Buildroot System State Measurement Value Idle @ Linux Shell Playing Local Audio WiFi Pinging Standby Shutdown Supply (BAT) Current Power Supply (BAT) Current Power Supply (BAT) Current Power Supply (BAT) Current Power Supply (BAT) Current Power 4.17 V 125.90 mA 525.00 mW 4.17 V 209.50 mA 873.62 mW 4.17 V 184.70 mA 770.20 mW 4.17 V 5.30 mA 22.10 mW 4.17 V 1.60 mA 6.67 mW C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 13 Electrical Characteristics 3.5. Oscillator Electrical Characteristics C.H.I.P. Pro contains a single 24.000MHz oscillator. The 24.000MHz frequency is used to generate the main source clock for PLL and the main digital blocks, the clock is provided through X24MIN. The table below lists the 24.000MHz crystal specifications. Table 3.5.1: 24MHz Crystal Characteristics Parameter Crystal Oscillator Frequency Range Startup Time Frequency Tolerance at 25 C Oscillation Mode Maximum Change Over Temperature Range Drive Level Equivalent Load Capacitance Series Resistance(ESR) Duty Cycle Motional Capacitance Shunt Capacitance Internal Bias Resistor Min

-

-

-50 Fundamental

-50

-

12

-

30

-

5 0.4 Typ 24.000

-

-

-

-

18 25 50

-

6.5 0.5 Max

-

-

+50

+50 300 22

-

70

-

7.5 0.6 Unit MHz ms ppm ppm uW pF

%

pF pF M Symbol 1/(tCPMAIN) tST PON CL RS CM CSHUT RBIAS 3.6. Power Up/Down and Reset Specifications C.H.I.P. Pro only requires that you apply voltage within the acceptable range to any or all of the AXP209s Intelligent Power Select inputs. Power up and power down sequence requirements for the GR8 SiP are handled by the on-board Power System provided by the AXP209 PMU and companion switching regulators. NOTE: Designs which omit a battery source often require additional bulk capacitance on their DC Input to best handle high current transients during boot or initial peripheral operation, such as WLAN pairing. While similar budgets to those shown in the Power Consumption section are applicable to DC Source (wall-powered) designs, they can achieve greater PMIC efficiencies by using a higher input voltages when compared to battery-only designs. For more details in specific system submodule power up/down timing, requirements, and design considerations please review the GR8 SiP documentation and AXP209 datasheet available at:

https://github.com/NextThingCo/CHIP_Pro-Hardware C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 14 4. Block Diagram Figure 3.6-1: C.H.I.P. Pro System Block Diagram C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 15 5. Pin Definitions 5.1. Pinout Diagram The following pin map demonstrates some of the common alternate pin mux configurations, overlaid on C.H.I.P. Pro. Figure 5.1-1: C.H.I.P. Pro Pinout C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 16 5.2. Pin Characteristics The following table lists the characteristics of C.H.I.P Pro pins from the following aspects:

Pin Definitions 1) Pin Number: Through-holes + Castellated Edges, numbered in CCW order starting from clipped corner, with GR8 face up 2) Pin Name: Names of signals multiplexed on each pin No. 3) Type: Signal direction I : Input O: Output I/O: Input / Output A: Analog A I/O: Analog Input / Output OD: Open Drain P: Power G: Ground Z: High-impedance 4) Pin Reset State: The state of the terminal at reset (power up) 5) Pull Up/Down: Denotes the presence of an internal pull up or pull down resister Pull up and pull down resistor can be enabled or disabled via software. 6) Buffer Strength: Drive strength of the associated output buffer. Table 5.2.1. Pin Characteristics Pin Name Default Function Type Reset State Default Pull Up/Down Buffer Strength

(mA) PB2 PB5 PB6 PB7 PB8 PB9 PB15 PB16 PD2 PD3 PD4 PD5 PE0 PE1 PE2 PE3 PWM GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 Pin #

PORT B 9 21 22 23 24 25 12 11 PORT D 13 14 15 16 PORT E 41 40 39 38 C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 17 Pin #

Pin Name Default Function Type Reset State Default Pull Up/Down Pin Definitions Buffer Strength

(mA) 37 36 35 34 33 32 31 30 PORT G 44 43 10 USB 52 51 48 47 50 Audio Codec 26 19 18 20 27 28 29 LRADC 42 Power 2 4 8 GND 1, 6, 17, 45, 46, 49, 53 PE4 PE5 PE6 PE7 PE8 PE9 PE10 PE11 PG3 PG4 PG13 USB0-DM USB0-DP USB1-DM USB1-DP VCC-USB AGND HPCOM HPL HPR MICIN1 MICIN2 VMIC LRADC0 VDD-3V3 CHG-IN BAT GND GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO PWM

-

-

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I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O A I/O A I/O A I/O A I/O P G AO AO AO AI AI AO AI P P P G Z Z Z Z Z Z Z Z Z Z Z

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL NO PULL

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

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-

20 20 20 20 20 20 20 20 20 20 20

-

-

-

-

-

-

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-

-

-

-

-

-

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-

C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 18 5.3. Pin Multiplexing Functions The following table provides a description of the multiplexing functions available on each pin, organized by GR8 pin name. Pin Definitions Table 5.3.1: Multiplexing Functions Multi2 Multi0 Multi1 Input Input Input Input Output Output Output Output LCD-D2 LCD-D3 LCD-D4 LCD-D5 Input Input Input Input Input Input Input Input Output Output Output Output Output Output Output Output PWM0 I2S-MCLK I2S-BCLK I2S-LRCK I2S-DO I2S-DI TWI1-SCK TWI1-SDA Port Port B PB2 PB5 PB6 PB7 PB8 PB9 PB15 PB16 Port D PD2 PD3 PD4 PD5 Port E PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PE8 PE9 PE10 PE11 Port G PG3 PG4 PG13 Note: PE0/PE1/PE2 are for input only in GPIO configuration. Output Output Output Output Output Output Output Output Output Input Input Input Input Input Input Input Input Input Input Input Input SDC1-CMD SDC1-CLK Output Output Output Input Input Input Multi3 Multi4 Multi5 Multi6 SPDIF-DO SPDIF-DI UART2-TX UART2-RX UART2-CTS UART2-RTS CSI-PCLK CSI-MCLK CSI-HSYNC CSI-VSYNC CSI-D0 CSI-D1 CSI-D2 CSI-D3 CSI-D4 CSI-D5 CSI-D6 CSI-D7 SPI2-CS0 SPI2-CLK SPI2-MOSI SPI2-MISO SDC2-D0 SDC2-D1 SDC2-D2 SDC2-D3 SDC2-CMD SDC2-CLK UART1-TX UART1-RX PWM1 UART1-TX UART1-RX EINT16 EINT19 EINT20 EINT21 EINT22 EINT23 EINT14 EINT15 EINT3 EINT4 EINT13 C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 19 5.4. Detailed Pin/Signal Description The following table lists the detailed function of every C.H.I.P. Pro pin/signal based on interface, including their pin type:

Pin Definitions Type: Signal direction I : Input O: Output I/O: Input / Output A: Analog A I/O: Analog Input / Output OD: Open Drain P: Power G: Ground Table 5.4.1: Signal Descriptions Pulse Width Module Channel0 Output Pulse Width Module Channel1 Output I2S Master Clock I2S Bit Clock I2S Left/Right Channel Select Clock I2S Data Output I2S Data Input Description TWI1 Clock TWI1 Data/Address Pin/Signal Name TWI Two Wire Interface (I2C Compatible) TWI1-SCK TWI1-SDA PWM Pulse Width Modulation PWM0 PWM1 I2S Inter-IC Sound I2S-MCLK I2S-BCLK I2S-LRCK I2S-DO I2S-DI OWA One Wire Audio (S/PDIF / AES3 Compatible) SPDIF-DO SPDIF-DI SPI Serial Peripheral Interface SPI2-CS0 SPI2-CLK SPI2-MISO SPI2-MOSI UART Universal Asynchronous Receiver/Transmitter UART1-TX UART1-RX UART2-TX UART2-RX UART2-CTS UART2-RTS UART0 Data Transmit UART0 Data Receive UART1 Data Transmit UART1 Data Receive UART1 Data Clear to Send UART1 Data Request to Send OWA Data Output OWA Data Input SPI0 Chip Select Signal (active low) SPI0 Clock Signal SPI0 Master Data In, Slave Data Out SPI0 Master Data Out, Slave Data In Type I/O I/O O O O I/O I/O O I O I I/O I/O I/O I/O O I O I I O C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 20 Description External Interrupt Input SDC2 Data Bit [3:0]

SDC2 Clock SDC2 Command Signal CSI Pixel Clock CSI Master Clock CSI Horizontal Sync CSI Vertical Sync CSI Data Bit [7:0]

Pin/Signal Name CSI Camera Sensor Interface CSI-PCLK CSI-MCLK CSI-HSYNC CSI-VSYNC CSI-Data[7:0]

SD/MMC SDC2-D[3:0]

SDC2-CLK SDC2-CMD External Interrupt EINT[3,4,13,19,24]

USB USB0-DM USB0-DP USB1-DM USB1-DP VCC-USB Audio Codec AGND HPCOM HPL HPR MICIN1 MICIN2 VMIC LRADC Low Resolution Analog-to-Digital Converter LRADC0 USB0 D- Signal USB0 D+ Signal USB1 D- Signal USB1 D+ Signal USB Power Supply Audio Codec Analog Ground Headphone Common Reference Output Headphone Left Channel Output Headphone Right Channel Output Microphone Input Microphone Input Bias Voltage Output for Main Microphone Pin Definitions Type I O I I I I/O O I/O I A I/O A I/O A I/O A I/O P G AO AO AO AI AI AO AI ADC Input for Channel 0 for Multi-Button Input C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 21 6. Mechanical and Packaging Information 6.1. Mechanical Drawing D E R E G G A T S 1

. 0 P Y T

, T E S F F O I S E D S H T O B D R A O B F O P Y T

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. 1 0.8 C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 22 Mechanical and Packaging Information 6.2. Recommended PCB Footprint Figure 6.2-1: C.H.I.P. Pro Module Footprint NOTE:

Part footprints for common EDA Software Packages are made available at:

https://github.com/NextThingCo/CHIP_Pro-Hardware C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 23 Mechanical and Packaging Information 6.3. SMT Reflow Profile NOTE:

C.H.I.P. Pro device designers should consult their manufacturer for an equipment-tailored reflow oven profile. The unique profile for each product is determined by the solder paste manufacturers recommendations as well as the maximum thermal load of the parts to be soldered on the printed circuit board. Next Thing Co. recommends using ROHS and REACH compliant SAC305 solder paste, such as Alpha OM350 or Senju M705. Machine Type: ERSA Conveyor Speed: 85cm/min Solder Paste Type: Alpha OM350 Figure 6.3-1: Example Reflow Profile C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 24 Mechanical and Packaging Information 6.4. Packaging Dimensions and Information C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 25 Figure 6.4-1: C.H.I.P. Pro Packaging Types & Dimensions 7. Schematic NOTE:

The most-current version of C.H.I.P. Pro Schematics and other technical documents are made available at:

https://github.com/NextThingCo/CHIP_Pro-Hardware C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 26 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 27 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 28 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 29 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 30 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 31 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 32 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 33 Schematic C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 34 Copyright Next Thing Co. All Rights Reserved. Join the discussion @ http://bbs.nextthing.co/c/CHIP-Pro Contact Us Sales:

Sales@NextThing.co Technical Questions:

Hardware@NextThing.co www.getchip.com C.H.I.P Pro Datasheet (Version 1.03) Copyright Next Thing Co. All Rights Reserved. Page 35 FCC/IC Statements

(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (15.107 and if applicable 15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in 15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module isintegrated" hasto be labelled with an auxilliary lable stating the FCC IDofthe RF Module,such as

"Contains FCC ID: 2AF9F-1337R

"This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

(1)this devicemay not cause harmful interference, and

(2)this devicemust accept any interference received, including interference thatmay cause undesired operation."

"

"Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment."

the Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device. The final host device, into which this RF Module isintegrated" hasto be labelled with an auxilliary lable stating the IC ofthe RF Module,such as

"Contains transmitter module IC 20863-1337R This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes :

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Host 15B and 15C compliance statement A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements, and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product;

to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification or Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions). The OEM integrator or the host manufacturer is responsible for the overall compliance of the host products FCC statement This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements. 9) in addition to permanent attached antenna, the product could be connected with some detachable antennas. Note:U.FL / IPEX antenna connector is not considered as a type of unique antenna coupling. However, as the installation of this module would be done by OEM integrator, it could be c onsidered as a professional installation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help FCC Radio Frequency Exposure Statement The device has been evaluated to meet general RF exposure requirements. The min separation distance is 20cm between the transmitter/antenna and nearby person. This transmitter/module must not be collocated or operating in conjunction with any other antenna or transmitter.