FCC ID: 2AXSOXJ-B1A Bluetooth module

| www.xiaojiang.cc XJ-B1A Module Series B1A BLEmesh Standard Module (PCB Antenna) XJ-B1A series of low-power Bluetooth module is a high-performance Bluetooth module which is developed based on the Telink low-power Bluetooth SOC TLSR8250 chip. The module adopts the stamp-type and side plug-in interfaces, is exquisite and compact, is fully lead out via ports and convenient to use, and helps the users omit the complicated RF hardware design, development and production links. Therefore, the users can easily realize the development of Bluetooth application programs on that basis, shorten the R&D cycle, and seize the market opportunities. This model is a pure hardware module that excludes any software. If you need the edition with software, please notify in

- Working frequency band: 2402-2480MHz multiplexing Communication Interface

2 PWM / 4 GPIO / 1 UART Pin advance. Product Characteristics Working Frequency Band Ultra-low Power Consumption

Support 2.7V-3.6V power supply

- Emission current: 20mA (10dBm power configuration)

- Receiving current: 7.5mA (overall current) Sleep current: 400nA (SRAM not saving) High-link Budget Sensitivity-96dBm1dBm (1Mbps, PER<30.8%)

- Emission power: Max.1.391dBm Memory Resources

Internal 512kB Flash (the capacity that the client can actually use is less than 512kB)

48kB on-chip SRAM, wherein 32kB can sleep and save Compatibility Mesh Functions Support BLE

- Designed interface mode with side plug-in and stamp holes compatible Support the Bluetooth SIG Mesh Support the exclusive Mesh of Telink

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| www.xiaojiang.cc Thanks for choosing XiaoJiang products. Please read through this Manual before using the products. By using the products, you have understood and accept the terms and instructions in this Manual. Ningbo Xiaojiang IoT Technology Co.Ltd reserves all legal rights to revise and explain the terms and information provided, without prior notices. Ningbo Xiaojiang IoT Technology Co.Ltd provides this document to support the product design of users. Users should design their products according to the specifications and parameters provided in the document.XiaoJiang shall not bear any liability for personal injury or property loss caused by improper operation of users. XiaoJiang has the right to update the document without notice. The copyright of this document belongs to XiaoJiang . Any person who reproduces and copy this document without permission of our company will bear legal responsibility. Copyright Ningbo Xiaojiang IoT Technology Co.Ltd reserves all rights. 2 / 16

| www.xiaojiang.cc ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. The OEM must comply with the FCC labeling requirements. If the modules label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: Contains transmitter module FCC ID: ZAXSOXJ-B1A . Additionally, the following statement should be included on the label and in the final products user manual: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and(2)this device must accept any interference received, including interference that may cause undesired operation. The module is limited to installation in mobile or fixed applications. Separate approval is required for all other operating configurations, including portable configuration with respect to Part 2.1093 and different antenna configurations. A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended enduse operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC application filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together. This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.

(OEM) Integrator has to assure compliance of the entire end product incluld the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. 3 / 16

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(OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user of the final host device. 4 / 16

| www.xiaojiang.cc CONTENTS 1 Specifications & Parameters..................................................................................................................6 2 Dimensional Drawing and Pin Definitions........................................................................................... 6 2.1 Dimensional Drawing................................................................................................................. 7 2.2 Pin Definitions............................................................................................................................ 8 3 Basic Operations.................................................................................................................................... 9 3.1 Pins..............................................................................................................................................9 3.2 Notices to Hardware Layout....................................................................................................... 9 3.3 Antenna Clearance...................................................................................................................... 9 4 Common Problems.............................................................................................................................. 11 4.1 Communication Failure of Module in Near Distance.............................................................. 11 4.2 Abnormal Power Consumption of Module.............................................................................. 11 4.3 Insufficient Communication Distance of Module.................................................................... 11 4.4 Module Authentication............................................................................................................. 11 5 Production Guide.................................................................................................................................13 5.1 Production Guide...................................................................................................................... 13 5.2 Requirements on Module Position on Bottom Plate................................................................ 13 5.3 Opening Design of Steel Mesh................................................................................................. 13 5.4 Standard Operation Procedure (SOP) of Reflow Soldering.....................................................14 6 Packaging............................................................................................................................................ 15 6.1 Packaging material....................................................................................................................15 6.2 Package size.............................................................................................................................. 15 6.3 Packaging direction...................................................................................................................16 5 / 16

| www.xiaojiang.cc 1 Specifications & Parameters Parameters Supply voltage V Max voltage of input pins Storage temperature Parameters Supply voltageV Work temperature Initial frequency tolerance

(KHz) Power consumption Receive

(mA) Transmit

(mA) Sleep

(uA) Transmit power (dBm) RSSI (dBm) Min 2.7

-40

-30 17 5.5 5.5

-25

-95 Table 1-1 Limit Parameters of Module Performance Min

-0.3

-0.3

-65 Max

+3.6 VDD+0.3 150 Table 1-2 Working Parameters1 of Module Performance Remarks All AVDD and DVDD with same voltages Remarks Below 25 TYP 3.3

18 6.8 6.5 1.391

-96 Max 3.6 85

+30 20 8 7.5 1

0.15 Deep sleep, not save SRAM Output power 10dBmsystem timer 16MHz Output power 0dBmsystem timer 16MHz Overall current Transmit power can be configured through software 1MbpsPER<30.8%

Work frequency (GHZ) 2.402 2.480 Support customized frequency setting Communication protocol BLE5/4.2/Mesh Interface type stamp /side inserted Dimensional accuracy GB/T1804-C level Meet the dimensional tolerance class C 2 Dimensional Drawing and Pin Definitions The physical diagram of XJ-B1A Module Series is as shown in Fig. 2-1. There will be a label on the shield cover, and it shall be subject to the physical product. 1 The test is conducted at 25 in a shielded room environment. 6 / 16

| www.xiaojiang.cc P26 P26 P1 P1 P10 P11 P16 P17 P10 P16 Fig. P11 2-1 Physical Diagram of XJ-B1A Module Series

* When this product is being designed, the resistance capacitor and PCB have optional material models, so their colors of appearance may be different on the premise that the performance requirements are met, and shall be subject to the physical products; please refer to Table 1-3 for the key materials BOM. Table 1-3 Key Materials of BOM Designator Priority Quantity Manufacturer Description U1 X1 X1 1 1 2 1 1 1 Telink Semiconductor TLSR8250F512ES16 TXC TST 8pF/24MHz/10PPM 8pF/24MHz/10PPM Package TSSOP16 3225 3225 2.1 Dimensional Drawing Fig. 2-2 Dimensional Drawing of XJ-B1A Module Series Chassis Soldering 7 / 16

| www.xiaojiang.cc 2.2 Pin Definitions Table 2-1 Pin Definitions2 Pin Name P5-P13 PIN P1 P2 P3 P4 P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 P24 P25 P26 Description Ground RF signal/ANT Ground Power on reset ,active low GND ANT GND RST NC GND VCC VCC GND PC<5>

PB<1>

PB<0>

GND The same as P21 The same as P21 The same as P23 SWS/UART_RTS/PA<7>

Single wire slave / UART_RTS / GPIO PA[7]

3.3V power supply for module internal circuit 3.3V power supply for module internal circuit Ground Ground SWS/UART_RTS/PA<7>

Single wire slave / UART_RTS / GPIO PA[7]

PWM3_N/UART_RX/sar_aio<9>/

PWM3 inverting output / UART_RX / SAR ADC PWM43/UART_TX/sar_aio<1>/

PWM4 output / UART_TX / SAR ADC input /

PWM34/UART_RX/sar_aio<0>/

PWM3 output / UART_RX / SAR ADC input /

input / GPIO PC[5]

GPIO PB[1]

The same as P21 GPIO PB[0]

Ground The same as P21 The same as P23 Note: This module is pin-multiplexed.that is, P21, P22, and P25 are the same output port,P23 and P26 are the same output port. This module can output 2 PWM. 2 For the specific functions of the multiplex pin, please refer to the Datasheet for TLSR8250F512 3 pin-multiplexed, P21, P22, and P25 are the same output port,PWM4 output 4 pin-multiplexed, P23, and P26 are the same output port,PWM3 output 8 / 16

| www.xiaojiang.cc 3 Basic Operations 3.1 Pins burning. When using the module, please choose the IO pin and carry out single-wire burning to the module according to the actual application. It is suggested leaving VCC, GND and SWS on the bottom plate for 3.2 Notices to Hardware Layout Fig. 3-1 Typical Application Circuits 1 Try to shorten the wire from the RF outlet to the antenna pad, lay the 50 impedance wire, surround the wire with copper foil which is grounded, and form as many as possible through holes around the wire. 2 If permitted, add the circuit from the RF outlet to the antenna pad. 3 Make sure the surrounding environment of the antenna is clear, and at least leave a 5mm clearance area. 3.3 Antenna Clearance 4 Pay attention to the grounding quality, and large-area pavement is recommended. 5 Keep off the high-voltage circuits, high-frequency switches and other circuits. When using the PCB antenna of our companys module, the following three schemes for the layout of the RF clearance area are recommended. Usually, the RF performance of the module under Scheme 1 (The PCB antenna is outside the board frame) is better than that of the module under Scheme 2 (The PCB antenna is placed along the board side and its lower part is hollowed), and the RF performance of the module under Scheme 2 is better than that under Scheme 3 (The PCB antenna is placed along the board side and is not clad with copper), i.e. Scheme 1 Scheme 2 Scheme 3. 9 / 16

| www.xiaojiang.cc Scheme 1: The PCB antenna is outside the board frame Fig. 3-2 The PCB antenna is outside the board frame Scheme 2: The PCB antenna is placed along the board side and its lower part is hollowed Fig. 3-3 The PCB antenna is placed along the board side and its lower part is hollowed Scheme 3: The PCB antenna is placed along the board side and is not clad with copper Fig. 3-4 The PCB antenna is placed along the board side and is not clad with copper 10 / 16

| www.xiaojiang.cc 4 Common Problems 4.1 Communication Failure of Module in Near Distance Make sure the sending and receiving configuration is consistent, because inconsistent configuration will disenable normal communication. Abnormal voltage: Too low voltage will lead to abnormal sending. Low battery: when in low battery, the voltage will be reduced at the time of sending which will cause abnormal in sending. Abnormal antenna soldering, RF signal failed to reach the antenna or wrong soldering of circuit. consumption. 4.2 Abnormal Power Consumption of Module The module is damaged due to such reasons as static electricity, resulting in abnormal power When in receiving at low power, the power consumption of the module does not achieve the expected effect due to the inaccuracy of timing configuration, etc. The power consumption of the module fluctuates when the working environment is adverse and in such extreme environments as high temperature and humidity, as well as low temperature. 4.3 Insufficient Communication Distance of Module The antenna impedance is not well matched, so the emission power is very low. Serious signal attenuation due to metal and other things around the antenna or because the Near communication distance of the module due to other interference signals in the testing module is in the metal. environment. Abnormal emission power due to not enough power supply. The testing environment is adverse, especially the humidity greatly attenuates the 2.4G signals. The module goes through the wall and other environments and then communicates with the other end, the wall greatly attenuates the signals; most signals go around the wall, so the signals are The module is too close to the ground, absorbed and reflected, and thus the communication greatly attenuated. effect is worse. 4.4 Module Authentication This module has been certified by SRRC (China) and FCC (United States). CMIIT ID number is 2019DP1351, and FCC ID number is ZAXSOXJ-B1A. Three display modes of CMIIT ID and FCC ID are provided. The first shield laser scheme is defaulted. 1.Shield shield laser: display module product serial number, CMIIT ID, FCC ID, RoHS logo, lierda registered trademark, CE certification logo, etc., with shield as the specific criterion;

2.Back label: display module product serial number, CMIIT ID, FCC ID, module P/N, lierda registered trademark, etc, specific to the manufactured product;

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| www.xiaojiang.cc FCC Statement This device complies with part 15 of the FCC rules Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the users authority to operate the equipment. NOTE: Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular

- Reorient or relocate the receiving antenna. installation. If this equipment does cause harmful interference to radio or television reception, which can

- Increase the separation between the equipment and receiver. be determined by turning the equipment off and on, the user is encouraged to try to correct the interference

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. by one or more of the following measures:

-Consult the dealer or an experienced radio/TV technician for help

- This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. and your body. RF Exposure Information and Statement :

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator 12 / 16

| www.xiaojiang.cc 5 Production Guide 5.1 Production Guide It is suggested processing SMT machine patch on the stamp tear sealing module, and finishing it within 24 hours after unpacking. Otherwise, please vacuumize and package again, so as to prevent the problem that the patch processing effect is poor due to damp. If there is a humidity indicator card in the package, it is suggested judging if the module needs to be baked according to the indication of the humidity card. The baking conditions are as follows:

Baking temperature: 1255;

Alarm temperature: 130;

SMT patch processing can be carried out after the product is cooled to < 36 under natural conditions. If the unpacking time exceeds 3 months, whether the product got damp shall be paid special attention to, because the gold immersion process of PCB may lead to the oxidation of the bonding pad when in excess of 3 months, and such problems as pseudo soldering and solder skips. In order to ensure the pass rate of reflow soldering, sampling 10% of products to carry out visual inspection and take the AOI test in the first time of patch processing is suggested, so as to ensure the reasonableness of furnace temperature control, device absorption mode, and placement method. During the whole production process, the operators at all stations must wear antistatic gloves. 5.2 Requirements on Module Position on Bottom Plate It is suggested that the thickness of liquid photosensitive solder resist at the module position on the bottom plate be less than 0.02mm, to avoid excessive thickness causing the module unable to be effectively contacted with the solder paste after being blocked up, thus affecting soldering quality. In addition, please make sure not to put other devices within 2mm around the module position on the interface board, so as to guarantee the maintenance of module. 5.3 Opening Design of Steel Mesh If the thickness of steel mesh on the bottom plate is selected by comprehensively considering the sealing type of the devices in the board in principle, pay close attention to the following requirements:

The bonding pad of module can be locally thickened to 0.15~0.20mm, to avoid missing solder. 13 / 16

File Name Block Diagram.pdf, Schematics.pdf, Operation Description.pdf

(Ningbo XiaojiangIoT Technology Co Ltd) Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: 2AXSOXJ-B1A Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Exhibit Type Block Diagram, Schematics, Operational Description The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Pursuant to DA04-1705 June 15, 2004 of the Commissions public notice, we also request temporary confidential treatment of information accompanying this application as outlined below:

Short-term confidentiality requested: 180 days Exhibit Type Internal Photos, Test Setup Photos Sincerely, File Name Internal Photos.pdf, Test Setup Photos.pdf Jizongchen/Manager Ningbo XiaojiangIoT Technology Co Ltd Rev 11/20/07

MODULAR APPROVAL LETTER FCC ID: 2AXSOXJ-B1A Modular Approval Requirement

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter musthave buffered modulation/data inputs(if such inputs are provided) to ensurethat the module will comply with part 15 requirements under conditions of excessivedata rates or over-modulation.

(iii) The modular transmitter musthave its own power supply regulation.

(iv) The modular transmitter mustcomply with the antenna and transmissionsystem requirements of 15.203, 15.204(b) and 15.204(c). The antennamust either be permanently attachedor employ a unique antennacoupler (at all connections between themodule and the antenna, including thecable). The professional installationprovision of 15.203 is not applicable tomodules but can apply to limited modular approvals under paragraph (b) ofthis section.

(v) The modular transmitter must be tested in a stand-alone configuration

(vi) The modular transmitter must beequipped with either a permanently affixedlabel or must be capable of electronicallydisplaying its FCC identification number.

(vii) The modular transmitter mustcomply with any specific rules or operatingrequirements that ordinarilyapply to a complete transmitter andthe manufacturer must provide adequateinstructions along with the moduleto explain any such requirements.A copy of these instructions must beincluded in the application for equipmentauthorization.

(viii) The modular transmitter mustcomply with any No Yes YES The modular transmitter have its own RF shielding YES The modular accord with Part 15 requirements YES The modularIt has its own power supply regulation YES The modular accord with the antenna requirements of Section 15.203 and 15.204(b)(c) YES YES The modular have one permanently affixed label YES The modular transmitter accord with any specific rule or operating requirements YES Z:\2020\Xiaojiang()\EN201210009W(ES201210076W)(XJB1A)\2.Technical Document\Timco\ModularApprovalLetter.docx applicable RF exposurerequirements in its final configuration. The modular transmitter accord RF exposure requirements The letter must be on the applicants letterhead and signed by the grantee code contact. Signature:

Jizongchen/Manager NingboXiaojiangIoTTechnologyCoLtd Data:January11,2021 Z:\2020\Xiaojiang()\EN201210009W(ES201210076W)(XJB1A)\2.Technical Document\Timco\ModularApprovalLetter.docx

(Ningbo XiaojiangIoT Technology Co Ltd) Federal Communications Commission Authorization and Evaluation Division 1435 Oakland Mills Road Columbia, MD 21046 Date: January 07, 2021 SUBJECT: FCC Application for FCC ID: 2AXSOXJ-B1A To Whom It May Concern:

We, the undersigned, hereby authorize Tony Wei at EMTEK(NINGBO) CO., LTD. on our behalf, to apply to the Federal Communications Commission on our equipment. Any and all acts carried out by EMTEK(NINGBO) CO., LTD. on our behalf shall have the same effect as acts of our own. This is to advise that we are in full compliance with the Anti- Drug Abuse Act. We, the applicant, are not subject to a denial of federal benefits pursuant to Section 5301 of the Anti-Drug Act of 1988, 21 USC853a, and no party to the application is subject to a denial of federal benefits pursuant to that section. Regards, Jizongchen/Manager Ningbo XiaojiangIoT Technology Co Ltd