FCC ID: T7V1740A Bluetooth LE Module

PAN1740A Bluetooth Low Energy Module Module Integration Guide Rev. 1.1 Wireless Connectivity Overview Features PAN1740A Bluetooth Module The PAN1740A is an optimized version of the PAN1740, offering a reduced boot time and supporting up to eight connections. It has a fully integrated radio transceiver and baseband processor for Bluetooth 5 Low Energy (LE). It can be used as a stand-alone application processor or as a data pump in hosted systems. The device is optimized for remote control units (RCU) requiring support for voice commands and motion/gesture recognition. Its integrated Audio Unit (AU) offers easy interface for MEMS microphones over PDM, external codecs over PCM/I2S, and a Sample Rate Converter unit. The Bluetooth LE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 5 standard. The PAN1740A has dedicated hardware for the Link Layer implementation of Bluetooth LE and interface controllers for enhanced connectivity capabilities. Block Diagram 1 About This Document Pre-programmed Bluetooth/MAC address Includes 16MHz and 32 768kHz crystal calibrated up to 1 ppm Single mode Bluetooth 5 System-on-Chip Programmable ARM Cortex-M0 CPU Autonomous Bluetooth LE stand-alone operation Bluetooth 5 (LE) embedded GATT profile (LE single mode) Dimensions: 9mm x 9.5mm x 1.8mm (SMD package with antenna) Less than a few A in low power modes Integrated shielding to resist EMI No external components needed Characteristics Peak power consumption: 4.9mA (Rx and Tx) Link budget: 93 dB (Rx sensitivity: -93dBm, Tx sensitivity 0dBm) Operating temperature range -40C to 85C Module Integration Guide Rev. 1.1 Page 2 of 44 PAN1740A Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time without notification. Please consult the most recently issued Module Integration Guide before initiating or completing a design. 1 About This Document Panasonic Industrial Devices Europe GmbH 2020. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Module Integration Guide does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status Engineering Samples. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Module Integration Guide and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:

The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by Panasonic for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. Description of hardware, software, and other information in this document is only intended to illustrate the functionality of the referred Panasonic product. It should not be construed as guaranteeing specific functionality of the product as described or suitable for a particular application. Any provided (source) code shall not be used or incorporated into any products or systems whose manufacture, use or sale is prohibited under any applicable laws or regulations. Any outlined or referenced (source) code within this document is provided on an as is basis without any right to technical support or updates and without warranty of any kind on a free of charge basis according to 516 German Civil Law (BGB) including without limitation, any warranties or conditions of title, non infringement, merchantability, or fitness for a particular purpose. Customer acknowledges that (source) code may bear defects and errors. Module Integration Guide Rev. 1.1 Page 3 of 44 PAN1740A Bluetooth Module The third-party tools mentioned in this document are offered by independent third-party providers who are solely responsible for these products. Panasonic has no responsibility whatsoever for the performance, product descriptions, specifications, referenced content, or any and all claims or representations of these third-party providers. Panasonic makes no warranty whatsoever, neither express nor implied, with respect to the goods, the referenced contents, or any and all claims or representations of the third-party providers. 1 About This Document To the maximum extent allowable by Law Panasonic assumes no liability whatsoever including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation loss of profits, loss of opportunities, business interruption, and loss of data. Module Integration Guide Rev. 1.1 Page 4 of 44 PAN1740A Bluetooth Module Table of Contents 1 About This Document 1 3 4 6 7 8 9 About This Document .................................................................................................................. 6 Purpose and Audience ......................................................................................................... 6 1.1 1.2 Revision History .................................................................................................................. 6 Use of Symbols ................................................................................................................... 6 1.3 1.4 Related Documents ............................................................................................................. 7 2 Overview ....................................................................................................................................... 8 PAN1740A Module ........................................................................................................................ 9 Block Diagram ..................................................................................................................... 9 3.1 Footprint ............................................................................................................................ 10 3.2 3.3 Placement ......................................................................................................................... 11 Reference Design ....................................................................................................................... 13 4.1 USB-Dongle ...................................................................................................................... 13 4.2 Mother Board .................................................................................................................... 14 Adapter Board ................................................................................................................... 15 4.3 5 Getting Started ........................................................................................................................... 16 Device Drivers ................................................................................................................... 16 Software Examples ............................................................................................................ 16 5.1 5.2 Run the Keil Project (Example) .................................................................................................. 17 Proximity Profile with two PAN1740A USB-Dongles (Example) ................................................ 20 Smart Snippets ........................................................................................................................... 23 Program Structure ............................................................................................................. 23 8.1 8.2 Application Demo: Proximity Profile .................................................................................... 27 Dialog Serial Port Service (DSPS) .............................................................................................. 29 Pro Kit with PAN1740A Adapter Board (iPod) ..................................................................... 29 9.1 9.2 Two Pro Kits with PAN1740A Adapter Board ...................................................................... 32 Two PAN1740A USB Sticks ............................................................................................... 32 9.3 10 Production Tools ........................................................................................................................ 34 11 Regulatory and Certification Information .................................................................................. 35 11.1 General Certification Information ........................................................................................ 35 11.2 Federal Communications Commission (FCC) for US ........................................................... 35 11.3 Innovation, Science, and Economic Development (ISED) for Canada .................................. 37 11.4 European Conformity According to RED (2014/53/EU) ........................................................ 41 11.5 Bluetooth ........................................................................................................................... 42 12 Restricted Use ............................................................................................................................ 43 12.1 Life Support Policy ............................................................................................................. 43 12.2 Restricted End Use ............................................................................................................ 43 13 Contact Details ........................................................................................................................... 44 13.1 Contact Us ........................................................................................................................ 44 13.2 Product Information ........................................................................................................... 44 Module Integration Guide Rev. 1.1 Page 5 of 44 PAN1740A Bluetooth Module 1 About This Document 1.1 Purpose and Audience 1 About This Document This Module Integration Guide is intended to support the easy integration of the PAN1740A into a product and to ensure the compliance with regulatory requirements. This guide gives an overview about the hardware design requirements by providing a reference design, which is the evaluation board of the PAN1740A. It describes how to use the PAN1740A on the evaluation board with the software packages and tools provided by Dialog Semiconductors. In addition, it explains how to start up the evaluation board, get all the needed software sources, execute example code and build own implementations. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as the PAN1740A or the module within this document. 1.2 Revision History Revision Date Modifications/Remarks 2019-11-07 First version 1.0 1.1 2020-05-14 New design. Renamed Design Guide into Module Integration Guide and updated structure. Renamed PAN1740/1740A into PAN1740A. Updated chapter Bluetooth: added end product ID. Updated chapter Regulatory and Certification Information. Updated picture Antenna Placement Recommendation. 1.3 Use of Symbols Symbol Description Indicates important information for the proper use of the product. Non-observance can lead to errors. Indicates important notes that, if not observed, can put the products functionality at risk. Indicates useful information designed to facilitate working with the module and software. Note Attention Tip Example:

[chapter number]

Cross reference

[chapter title]

Indicates cross references within the document. Description of the symbols used in this document 1.3 Use of Symbols. Module Integration Guide Rev. 1.1 Page 6 of 44 PAN1740A Bluetooth Module Symbol Description Requirement 1 About This Document Indicates a requirement that must be met before the corresponding tasks can be completed. Result This font GUI text Indicates the result of a task or the result of a series of tasks. Indicates fixed terms and text of the graphical user interface. Example:

Click Save. Example:

Menu > Menu item Path Indicates a path, e.g. to access a dialog. In the menu, select File > Setup page. This font File names, messages, user input Indicates file names or messages and information displayed on the screen or to be selected or entered by the user. Examples:

pan1760.c contains the actual module initialization. The message Failed to save your data is displayed. Enter the value Product 123. Key Key Indicates a key on the keyboard, e.g. F10 . 1.4 Related Documents For related documents please refer to the Panasonic website 13.2 Product Information. Module Integration Guide Rev. 1.1 Page 7 of 44 PAN1740A Bluetooth Module 2 Overview 2 Overview The PAN1740A is an optimized version of the PAN1740, offering a reduced boot time and supporting up to eight connections. It has a fully integrated radio transceiver and baseband processor for Bluetooth 5 LE. It can be used as a stand-alone application processor or as a data pump in hosted systems. The device is optimized for remote control units (RCU) requiring support for voice commands and motion/gesture recognition. Its integrated Audio Unit (AU) offers easy interface for MEMS microphones over PDM, external codecs over PCM/I2S, and a Sample Rate Converter unit. The Bluetooth LE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 5 standard. The PAN1740A has dedicated hardware for the Link Layer implementation of Bluetooth LE and interface controllers for enhanced connectivity capabilities. For related documents please refer to 13.2 Product Information. Module Integration Guide Rev. 1.1 Page 8 of 44 PAN1740A Bluetooth Module 3 PAN1740A Module 3.1 Block Diagram 3 PAN1740A Module Total capacity shall not exceed 2.5F. The total inductance shall not exceed 2.5H. There is no resistor value in this design. Module Integration Guide Rev. 1.1 Page 9 of 44 PAN1740A Bluetooth Module 3.2 Footprint 3 PAN1740A Module The dimensions are in millimeters. The outer dimensions have a tolerance of 0.2mm. The inner pins (2, 4, 6, 9, 11, 14, 16, 18, 21, 23) are shifted to the center by 1mm. Top View Module Integration Guide Rev. 1.1 Page 10 of 44 3.95 2.95 2.70 1.80 0.90 0.60 0 8 1

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. 0 9.00 PAN1740A Bluetooth Module 3.3 Placement 3 PAN1740A Module Antenna Keep out Area Do not place any ground plane under the marked restricted antenna area in any layer! This would be affecting the performance of the chip antenna in a critical manner. Impact of Placement on the Antenna Radiation Pattern The placement of the module, surrounding material, and customer components has an impact on the radiation pattern of the antenna. The recommendation for the ground plane is based on a FR4 4-Layer PCB. The following requirements must be met:

Keep this product away from heat. Heat is the major cause of decreasing the life of these products. Keep this product away from other high frequency circuits. The antenna requires a cutout area of 5mm x 3mm under the PAN1740A module. This Keep out Area shall be located in every layer under the module antenna. Note for example the Keep out Area in all four layers of the PAN1740A evaluation board. It is recommended to verify the perfect position of the module in the target application before fixing the design. Module Integration Guide Rev. 1.1 Page 11 of 44 PAN1740A Bluetooth Module 3 PAN1740A Module All dimensions are in millimeters. Use a ground plane in the area surrounding the module wherever possible. It is recommended to place the module:

In the center (horizontal) of mother PCB. At the edge (horizontal) of mother PCB. Antenna Placement Recommendation Module Integration Guide Rev. 1.1 Page 12 of 44 Min. 15.00 Min. 15.00 9.00 5.00 0 0

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. i n M PAN1740A Bluetooth Module 4 Reference Design 4.1 USB-Dongle 4.1.1 Functionality 4 Reference Design Atmel C includes Segger USB-to-UART programmer (serial number on the backside) OTP cannot be damaged (fail-safe development) Runs with Dialogs Keil Compiler projects Runs with Connection Manager Can be used for software development "on the fly"

4.1.2 Schematic Module Integration Guide Rev. 1.1 Page 13 of 44 J-Link OB www.segger.com C1 10 C2 C3 C4 C5 100nF 100nF 100nF 100nF 3 V 3

C6 10 C7 C8 C9 C10 100nF 100nF 100nF 100nF 8 A 9 A 3 B 3 F 5 F 6 E 3 D 4 D 7 E 1 B 9 F 5 G 1 H 3 J 4 K 2 K I N D D V T U O D D V I M T U D D V I 1 _ O D D V I 2 _ O D D V I 3 _ O D D V L L P D D V 1 _ E R O C D D V 2 _ E R O C D D V 3 _ E R O C D D V 4 _ E R O C D D V 5 _ E R O C D D V 6 _ E R O C D D V F E R V D A A N A D D V F E R V B 2 1 D A 0 1 C U B D D V I O D W S T S R N K L C W S S U B V D N G 3 V 3

O D T O W S V 5

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C11 10nF R7 0 ERASE NRST NRSTB FWUP ERASE For programming SAM3U2C TDI V 5

C15 100nF C16 47 X1 12MHz C13 18pF C14 18pF A10 B10 XIN32 XOUT32 1 N S 1 2 1 B B 5 1 M L B 2 L 7 1 C F n 0 1 IC1 ATSAM3U2CA-CU JTAGSEL TMS/SWDIO TCK/SWCLK TDI TST TDO/TRACESWO B7 C8 D8 D6 C9 C7 A7 B9 B8 D7 A2 A3 D2 D1 C2 C1 A1 XIN XOUT DHSDM DFSDM DHSDP DFSDP VBG R23 39 1%

R24 39 1%

5 2 R 8 k 6 C18 10pF I M T U D N G A N A D N G 1 _ D N G 2 _ D N G 3 _ D N G U B D N G L L P D N G 2 B 3 K 6 F 2 E 6 G 5 E 3 C USB_A X2 USB_VCC 1 DP 3 DN 2 USB_GND 4 3

D N G 1

D N G 4

D N G 2

D N G PA0/PGMNCMD J10 PA1/PGMRDY H9 PA2/PGMNOE H10 PA3/PGMNVALID G8 PA4/PGMM0 G10 PA5/PGMM1 G9 PA6/PGMM2 F8 PA7/PGMM3 F10 PA8/PGMD0 E10 PA9/PGMD1 E9 PA10/PGMD2 E8 PA11/PGMD3 D9 PA12/PGMD4 D10 PA13/PGMD5 H5 PA14/PGMD6 K6 PA15/PGMD7 H6 PA16/PGMD8 J6 PA17/PGMD9 K7 PA18/PGMD10 H7 PA19/PGMD11 J7 PA20/PGMD12 K8 PA21/PGMD13 J8 PA22/PGMD14 H4 PA23/PGMD15 K9 PA24 H8 PA25 K10 PA26 J9 PA27 H3 PA28 E3 PA29 E1 PA30 J4 PA31 F4 PB0 G3 PB1 F1 PB2 G2 PB3 J5 PB4 K5 PB5 H2 PB6 J1 PB7 K1 PB8 J2 PB9 E4 PB10 B4 PB11 G1 PB12 F2 PB13 G4 PB14 C4 PB15 G7 PB16 F7 PB17 A4 PB18 B5 PB19 C5 PB20 D5 PB21 A5 PB22 C6 PB23 A6 PB24 B6 R1 150 RESET CTS RTS RX TX R12 150 R13 100 R14 150 R15 100 SW_CLK SWDIO RX TX CTS RTS 3 V 3

R19 270 R20 270 LED1 Green LED2 Red TPS76933 IN1 3 EN IC3 GND OUT 5 NC 4 L3 C19 47 BLM15BB121SN1 3 V 3

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/HOLD 7 CLK 6 DI 5 W25X10CLUX R2 R8 R9 R10 R11 R16 R17 R18 nc nc nc nc 1k 1k nc nc P1.0 P1.1 P1.2 P1.3 M_RESET GND_TP P P V MOD1 PAN1740 12 11 10 9 6 5 4 3 24 23 22 21 2 13 P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 RST N.C. VPP 14 SW_CLK 16 SW_DIO 18 VCC 8 GND 1 GND 7 GND 15 GND 17 GND 19 GND 20 GND A GND B GND C GND D 3 V 3

8 2 R 0 SW_CLK SWDIO L1 C12 100nF BLM15BB121SN1 3 V 3

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4 2 2 R 7 k 4 IC2 1 2 RESET M_RESET S1 B3U-1000P 74LVC1G38DBV A B Y L H L L H H H L H H H L PAN1740ETU Reference Design DS-DG-1740ETU-

V1.1 4.2.2 Placement 4 Reference Design PAN1740A Bluetooth Module 4.2 Mother Board 4.2.1 Functionality Can be used with PAN1740A Adapter Board OTP can be programmed Runs with Dialogs Keil Compiler projects Runs with Connection Manager Can be used for software development "on the fly"

Runs with Smart Snippets including Power Profiler Module Integration Guide Rev. 1.1 Page 14 of 44 PAN1740A Bluetooth Module 4.3 Adapter Board 4 Reference Design Schematic Module Integration Guide Rev. 1.1 Page 15 of 44 J1_A J1_B MOD1 PAN1740 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 P0.2 P0.5 P0.6 P0.7 C C V P1.1 SWCLK P1.3 VPP P0.0 P0.1 P0.3 P0.4 C C V RST P1.0 SWDIO P1.2 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 B32 PCI-E-64 PCI-E-64 P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 RST 0

. c

. n 1 R 12 11 10 9 6 5 4 3 24 23 22 21 2 13 P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 RST N.C. VPP 14 SW_CLK 16 SW_DIO 18 VCC 8 VPP SWCLK SWDIO C C V C1 0.1 GND 1 GND 7 GND 15 GND 17 GND 19 GND 20 GND A GND B GND C GND D Reset PIN resistor is not mounted if the module is empty C C V JP1 1 JP2 1 5 Getting Started PAN1740A Bluetooth Module 5 Getting Started 5.1 Device Drivers 5.1.1 FTDI USB UART Depending on the operating system that is used, drivers for the FTDI USB UART might not be installed automatically. If in doubt, please check the FTDI website and install the drivers manually. For further information please visit https://www.ftdichip.com/Drivers/VCP.htm. 5.1.2 Segger J-Link SWD Debugger Depending on the operating system that is used, drivers for Segger J-Link SWD debugger might not be installed automatically. If in doubt, please check the Segger website and install the drivers manually. For further information please visit https://www.segger.com/downloads/jlink/. 5.2 Software Examples The PAN1740A USB evaluation board is delivered without any preinstalled software examples, but the following chapters describe how to use the recommended development environment and the Dialog Semiconductors Software Development Kit (SDK) to run different kinds of software examples. Module Integration Guide Rev. 1.1 Page 16 of 44 PAN1740A Bluetooth Module 6 Run the Keil Project (Example) The following requirements must be met:

SDK is installed. USB-Dongle is installed. 6 Run the Keil Project (Example) Use always the latest release from Dialogs website https://www.dialogs.com/. 1. Open the Dialog SDK. 2. Open the proximity project example. The project is located in the following SDK folder. 3. Open Keil Compiler. Module Integration Guide Rev. 1.1 Page 17 of 44 PAN1740A Bluetooth Module 4. Configure the Flash Target: Flash > Configure Flash Tools. Choose Settings. 6 Run the Keil Project (Example) 5. Click on the tab Debug (1). 6. Setup the Port to SW (2). 7. Click OK (3). Module Integration Guide Rev. 1.1 Page 18 of 44 PAN1740A Bluetooth Module 6 Run the Keil Project (Example) 8. Click on the icon Build to build the target files. 9. Click on the icon Debug to run the debug session. The proximity project has now been compiled and downloaded into the RAM of the PAN1740A ETU. For more detailed information on project examples, please refer to Dialogs download website https://www.dialogs.com/. Recommended is the proximity example as this is the most common profile. Module Integration Guide Rev. 1.1 Page 19 of 44 PAN1740A Bluetooth Module 7 Proximity Profile with two PAN1740A USB-Dongles 7 Proximity Profile with two PAN1740A USB-Dongles (Example)

(Example) This example uses Dialogs SDK version 3.0.2.1. The following requirement must be met:

Microsoft Visual C++ 2010 Express Freeware Compiler is installed. Use always the latest release from Dialogs website https://www.dialogs.com/. Receiver Configuration 1. Navigate to DA14580_SDK_3.0.2.1\dk_apps\keil_projects\proximity\

monitor_fe_usb. 2. Download the image proximity/monitor_fe_usb into the USB-Dongle. For details please refer to 6 Run the Keil Project (Example). 3. Open Keil Compiler and compile this project. Download the .hex-file:

4. Start and stop the debug mode or load the .hex-file with the Connection Manager. For debug mode using the Keil Compiler, be sure to check the Configure Flash Tool setting described in 6 Run the Keil Project (Example). Module Integration Guide Rev. 1.1 Page 20 of 44 PAN1740A Bluetooth Module The Debug session must be stopped. 7 Proximity Profile with two PAN1740A USB-Dongles (Example) 1. Open the folder Monitor Host Application in the SDK. 2. Open the project file host_proxm.sln with the Microsoft C++ Compiler. 3. Compile and run the software. 4. Determine the correct COM port using Windows Device Manager and enter this port number in the Proximity Host application (DOS window). Transmitter Configuration 1. Download the image proximity/reporter_fe_usb into the USB-Dongle. 2. Open Keil Compiler and compile this project. 3. Start and stop the debug mode or load the .hex-file with the Connection Manager to download the .hex-file. 4. Open the reporter host application. 6. Compile and run the software. 5. Open the project file host_proxr.sln with the Microsoft C++ Compiler. Module Integration Guide Rev. 1.1 Page 21 of 44 PAN1740A Bluetooth Module 7 Proximity Profile with two PAN1740A USB-Dongles (Example) 7. Determine the correct COM port using Windows Device Manager and enter this port number in the proximity host application (DOS window). The receiver side will show the connection status. The USB-Dongles are connected with the proximity profile. For more detailed information on Proximity Profile, please refer to Dialogs download website https://www.dialogs.com/. Module Integration Guide Rev. 1.1 Page 22 of 44 8 Smart Snippets The following description describes the structure and the usage of Smart Snippets in a nutshell. For more information as well as related documents, please refer to the Panasonic website PAN1740A Bluetooth Module 8 Smart Snippets 13.2 Product Information. 8.1 Program Structure For details, please refer to the Smart Snippets help (Help/User Guide/Sleep Mode Advisor). 8.1.1 Project and Port Selection 1. Open Smart Snippets. 2. Select a project, the virtual COM port, and the chip version to be able to control the development kit. When the application launches the first time, there will be no projects to select. Click New to create a new project. The name should not contain any spaces or special characters. 3. Select the chip version DA14580 and a virtual COM port which is assigned to the connected dialog development kit. 4. Click Open to establish a connection to the development kit. The software will show its default layout with a toolbar (Board Setup, UART Booter, Power Profiler, Sleep Mode Advisor, OTP Programmer, SPI Flash Programmer, EEPROM Programmer, and SPotA) and a few of these tools in the center of the dis-

play. Module Integration Guide Rev. 1.1 Page 23 of 44 PAN1740A Bluetooth Module 8.1.2 Board Setup 8 Smart Snippets The tab Board Setup in the toolbox has to be used before any other tool as it establishes a communication with the development kit during the boot sequence and comes along with two lists. The upper list contains UART ports with its baud rate, which connect the FTDI chip version DA14580. The other list selects the GPIO pin which enables 6.8V for OTP programming. 8.1.3 UART Booter The UART Booter enables to download application code directly into the RAM of the DA14580 to test its behavior in terms of power consumption for instance. 1. Click Browse (1) to select the desired code (.bin, hex., .ihex). 2. Click Download (2) and observe the Log (3) to handle the requested hardware reset. 3. Optional: Click Start Terminal (4) to receive debugging information via UART. Note that an activated UART connection disables the OTP connection with the result that the UART connection has to be closed to enable the OTP connection and vice versa. Module Integration Guide Rev. 1.1 Page 24 of 44 PAN1740A Bluetooth Module 8.1.4 Power Profiler 8 Smart Snippets The tool Power Profiler enables the user to measure the power consumption of the desired application with all its functionality. Start the measurement 1. Click Initialize. 2. Click Start. The program will be initialized and the COM port connection will be opened. Measurement example of the Bluetooth scanning process On the right side, the tool provides the measurement information about Peak Current (mA), Average Current (mA), Charge (C) and the Sleep Mode of the current measurement. In addition, the tool provides the following control functionalities:

Auto Trigger Mode Auto Stop Mode In Auto Trigger Mode the measurement process starts as soon as the current (mA) exceeds a user-definable threshold. In Auto Stop Mode the measurement process stops automatically when the user-definable time (ms) is elapsed. Module Integration Guide Rev. 1.1 Page 25 of 44 PAN1740A Bluetooth Module Toolbar 8 Smart Snippets The toolbar can be found in the top of Smart Snippets and enables the user to add:

Measurements and markers Export/import data to/from CSV-files Clear secondary current data Take snapshots of the Power Profiler chart (.png), which can be found in the path Dialog/Smart Snippets/Projects/UserProject. 8.1.5 Sleep Mode Advisor The tool Sleep Mode Advisor uses the gathered consumption data from the Power Profiler and depicts the power consumption in the sleep modes: Deep Sleep and Extended Sleep in a circle diagram. The parameters such as battery size, to obtain reliable calculation results have to be configured. The following figure from the Smart Snippets help shows an example that prefers the Extended Sleep Mode as the battery lasts 171 days compared to 170 days in deep sleep. Module Integration Guide Rev. 1.1 Page 26 of 44 PAN1740A Bluetooth Module 8 Smart Snippets 8.1.6 OTP Programmer, SPI Flash Programmer, and EEPROM Programmer To burn the OTP memory and the OTP header on the DA14580 with a user-definable .hex-,

.ihex-, or .bin-file, the tool OTP Programmer is used. The tab OTP Image serves the purpose to read and burn the OTP memory while the tab OTP header is used to validate and burn the OTP header. The tab OTP NVDS is used to burn the OTP NVDS memory block. The SPI Flash Programmer enables the user to download an image file to the SPI flash memory of the DA14580. The functionality is similar to the OTP Programmer functionality, but the used firmware is different. The EEPROM Programmer is used for downloading an image file to the DA14580 EEPROM Memory similar to the OTP Programmer and SPI Flash Programmer functionality. 8.1.7 SPotA (Software Patch over the Air) The tab SPotA can be used to execute software patches from changing a single variable in the code which resides in the SRAM to changing an instruction or data value read from the ROM used for protocol realization. Note that a SPotA is only possible with a SPotA capable counterpart. 8.2 Application Demo: Proximity Profile This application example demonstrates the usage of Smart Snippets based on the previously used proximity profile demo. Two evaluation boards DA14580 with PAN1740A adapter boards are used which are connected to Smart Snippets. One kit is loaded with the application code for the monitor monitor_fe_usb_full_emb_sys-

ram.hex by the UART Booter. The other kit is loaded with the application code for the reporter reporter_fe_usb_full_emb_sysram.hex. After that, the applications host_proxm_sdk and host_proxr_sdk will be launched and the respective COM ports will be entered and opened. Module Integration Guide Rev. 1.1 Page 27 of 44 PAN1740A Bluetooth Module Once the devices are connected, Smart Snippets enables live evaluation of the application code for instance by measuring the power consumption as depicted below. 8 Smart Snippets Module Integration Guide Rev. 1.1 Page 28 of 44 PAN1740A Bluetooth Module 9 Dialog Serial Port Service (DSPS) 9 Dialog Serial Port Service (DSPS) Dialog provides with DSPS its own Bluetooth LE communication profile. Software has been developed for the Development kit and tablets/phones allowing a serial port to be emulated between development kits, handheld devices, and PAN1740A USB sticks. This software can be downloaded from dialogs support website. In the following are a few different examples. 9.1 Pro Kit with PAN1740A Adapter Board (iPod) The following example shows an easy application of the SPS with Dialogs Pro Kit with a PAN1740A Adapter Board as device and an iPod running the DSPS application as host to exchange data. 9.1.1 Set up the Pro Kit The Pro Kit needs to be set up as device using Dialogs SPS application example sps_device. The Connection Manager or Smart Snippets can be used. The default pin assignment for the DSPS application software with hardware flow control on the Pro Kit:

Module Integration Guide Rev. 1.1 Page 29 of 44 PAN1740A Bluetooth Module This pin assignment can be changed to any desired pin assignment in the application source code file periph_setup.h. To simplify the connection by using jumpers, the following pin assignment is suitable. 9 Dialog Serial Port Service (DSPS) This assignment does only require a simple amendment in the code. 9.1.2 Start Dialog Serial Port Service (DSPS) The following requirement must be met:

The Pro Kit is set up. DSPS starts scanning automatically for discoverable devices supporting the Serial 1. Open the iOS application DSPS. Port Service. 2. Select the desired device to connect it. Module Integration Guide Rev. 1.1 Page 30 of 44 PAN1740A Bluetooth Module The following window appears. 9 Dialog Serial Port Service (DSPS) Tab Description The tab Console enables to send data (ASCII or HEX) immediately after typing the data into the field Send Console Mode Data and receives data from the device, e.g. Smart Snippet UART Terminal, as shown below. Module Integration Guide Rev. 1.1 Page 31 of 44 PAN1740A Bluetooth Module The tab RX/TX allows similar functionality as the tab Console, but enables to send data character by character manually or based on a cyclic sending interval which can be determined by the user. 9 Dialog Serial Port Service (DSPS) The tab File enables to send data files instead of character strings. After the definition of a connection interval, the file directory of the device can be browsed to select the desired file. 9.2 Two Pro Kits with PAN1740A Adapter Board Similar to the previous example it is possible to use two of Dialogs Pro Kits with PAN1740A Adapter Boards to emulate a serial port. Note the hardware flow control changes (jumper or source code) required as explained in 9.1 Pro Kit with PAN1740A Adapter Board (iPod). Set up one Pro Kit with the application software sps_device and the other Pro Kit with the application software sps_host by downloading the .hex-files onto the Pro Kits. The host will be discovered and connected to the device. A Terminal can be launched (for instance the Smart Snippet Terminal) and ex-

change data. 9.3 Two PAN1740A USB Sticks Establish a serial port connection with two PAN1740A USB sticks The da14580_config.h of the host and the device source code has to be amended. 1. Change the flow control mode from the default hardware flow control to software flow control. Module Integration Guide Rev. 1.1 Page 32 of 44 PAN1740A Bluetooth Module 2. Disable the sleep mode, as this is not fully supported for software flow control. 9 Dialog Serial Port Service (DSPS) 3. Compile the amended source codes. 4. Download the output .hex-files onto the sticks by using Dialogs Connection Manager or Note that it is not possible to run the sticks with Dialogs Smart Snippets. 5. Launch two terminals (e.g. Tera Term) with the corresponding COM port and the Keil Vision. following settings:

Baud Rate: 115 200bps Data Bits: 8 Stop Bits: 1 Parity: None Flow Control: Xon/Xoff 6. Start data exchange. The data transmission happens immediately. One terminal window will stay empty for unidirectional data transfer as depicted below. Module Integration Guide Rev. 1.1 Page 33 of 44 PAN1740A Bluetooth Module 10 Production Tools 10 Production Tools To program the PAN1740A in production a J-Link programmer and the 6.8V programming voltage on the input pin VPP is required. Example schematic for a programming jig:

For more details on programming the OTP, please refer to the Smart Snippets website and Dialogs website. The crystal frequency register and flag as well as the Bluetooth MAC address are already burned. Example of the programming into OTP:

Module Integration Guide Rev. 1.1 Page 34 of 44 L2 VCC 2 1 1 P J 9 1 8 1 C C V D N G IC2G$2 C1

C20 100n R3 330 R4 330 SV3 8 6 4 2 7 5 3 1 X1-7 X1-3 X1-8 X1-2 X1-1 X1-4 X1-6 X1-9 X1-5 20 11 9 16 8 17 7 3 R1 330 R2 330 C4 1 C5 1

/FOFF INVALID FORCEON READY R2IN R1IN R2OUT R1OUT T2OUT T1OUT T2IN T1IN C2-

C2+

C1-

C1+

V-

V+

IC2 MAX3225E 14 1 10 15 12 13 6 5 4 2 C2 1 C3 220n R5 330 R6 330 SV4 8 6 4 2 7 5 3 1 V 5

C9 100n C8 47 C7 10n 1 L V+

D+

D-

V-

1 3 2 4 C6 100n 2 P J 1 2 C C V 27 28 C10 100n 20 4 19 17 15 16 25 IC3 VCC VCCIO RESET#

OSCI OSCO 3V3OUT USBDP USBDM GND FT232RL TXD 1 RXD 5 RTS# 3 CTS# 11 DTR# 2 DSR# 9 DCD# 10 RI# 6 CBUS0 23 CBUS1 22 CBUS2 13 CBUS3 14 CBUS4 12 TEST 26 GND 7 GND 18 GND 21

. V 5 2 0 V 8 6

y p p u S _ 2 X

P P V l

i g n m m a r g o r p P T O f I TP12 VCC C21 100n L4 F3 F250 X3 X2 3 P J 1 2

+5V D1 1N4007 5 P J 1 2 VPP 0 5 2 F 2 F 2 D 7 0 0 4 N 1 X4

C13 IN OUT GND IC4 BA03 C12 1 2 1 JP4 L3 C22 100n X5 X6 TP14 270 R14 3 D

C14 C15 1 C16 100n 3 D E L MOD1 PAN1740 VPP 14 SW_CLK 16 SW_DIO 18 VCC 8 3V 12 11 10 9 6 5 4 3 24 23 22 21 2 13 P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 RST N.C. GND 1 GND 7 GND 15 GND 17 GND 19 GND 20 GND A GND B GND C GND D SC14580 JTAG SEGGER JLinkARM VCC C11 100n 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 SV7 VPP SV6 6 4 2 5 3 1 SV2 SV5 10 8 6 4 2 14 12 10 8 6 4 2 9 7 5 3 1 13 11 9 7 5 3 1 1 2 1 2 HOT RTN 1 P HOT RTN 2 P SV1 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 C C V 0 3 3 7 R 1 D E L 0 3 3 8 R 2 D E L Q1 BC847SMD Q2 BC847SMD k 0 1 9 R k 0 1 0 1 R TP9 TP10 C C V k 0 1 1 1 R TP3 PAN1740A Bluetooth Module 11 Regulatory and Certification Information 11 Regulatory and Certification Information 11.1 General Certification Information Regulatory certifications are valid for the following radio relevant software:

Dialog Semiconductor ROM of chip DA14585 Bluetooth Specification 5 For further certification requests for other radio software please contact Panasonic 13 Contact Details. 11.2 Federal Communications Commission (FCC) for US 11.2.1 FCC Statement The following FCC statement has to be printed in the OEM end product user information:

The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. 11.2.2 Caution The following FCC caution has to be printed in the OEM end product user information:

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Module Integration Guide Rev. 1.1 Page 35 of 44 PAN1740A Bluetooth Module However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception (which can be determined by turning the equipment off and on) the user is encouraged to try to correct the interference by one or more of the following measures:

11 Regulatory and Certification Information Reorient or relocate the receiving antenna, Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver, connected, Consult the dealer or an experienced radio/TV technician for help. 11.2.3 Label Requirements The following labelling requirements have to be implemented on the OEM end product:

The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC notice above. The FCC identifier is FCC ID: T7V1740A. This FCC identifier is valid for the PAN1740A. The end product must in any case be labelled on the exterior with:

"Contains FCC ID: T7V1740A "

Due to the PAN1740A model size, the FCC identifier is displayed in the installation instruction only and it cannot be displayed readable on the modules label due to the limited size. 11.2.4 Antenna Warning The following Antenna has to be followed by the OEM:

This antenna warning refers to the device with the model number PAN1740A. The device is tested with a integrated antenna listed below. When integrated into the OEMs product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. 11.2.5 Approved Antenna List Item Part Number Manufacturer Frequency Band Type Max. Gain (dBi) 1 ANT016008LCS2442MA1 TDK 2.4GHz Chip antenna

-1.7 Module Integration Guide Rev. 1.1 Page 36 of 44 PAN1740A Bluetooth Module 11.2.6 RF Exposure 11 Regulatory and Certification Information To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed 11.2.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN1740A with a mounted ceramic antenna

(FCC ID: T7V1740A) is below the FCC radio frequency exposure limits. Nevertheless, the PAN1740A shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. 11.3 Innovation, Science, and Economic Development (ISED) for Canada The following IC rules have to be followed by end product OEMs:

The PAN1740A is licensed to meet the regulatory requirements of ISED. English License ID:

IC: 216Q-1740A HVIN:

ENW89852A1KF Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in Approved Antenna List, having a maximum gain of -1.7dBi. Antennas not included in this list or having a gain greater than -1.7dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter without the need of re-assessment of conformity by ISED. Module Integration Guide Rev. 1.1 Page 37 of 44 PAN1740A Bluetooth Module Due to the model size, the IC identifier is displayed in the installation instruction and on the package label only. It cannot be displayed readable on the modules label due to the limited size. 11 Regulatory and Certification Information The end customer has to assure that the device has a distance of more than 5mm from the human body under all circumstances. If the end customer application intends to use the PAN1740A in a distance smaller 5mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to ISED. PAN1740A est garanti conforme aux dispositions rglementaires dIndustry Canada (ISED). French License:

HVIN:

IC: 216Q-1740A ENW89852A1KF Il est recommand aux fabricants dappareils fixes, mobiles ou portables de consulter la rglementation en vigueur et de vrifier la conformit de leurs produits relativement aux limites dexposition aux rayonnements radiofrquence ainsi quau dbit dabsorption spcifique maximum autoris. Des informations pour les utilisateurs sur la rglementation Canadienne concernant lexposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a t dvelopp pour fonctionner spcifiquement avec les antennes listes dans le tableau Approved Antenna List, prsentant un gain maximum de -1.7dBi. Des antennes autres que celles listes ici, ou prsentant un gain suprieur -1.7dBi ne doivent en aucune circonstance tre utilises en combinaison avec ce produit. Limpdance des antennes compatibles est 50 Ohm. Lantenne utilise avec ce produit ne doit ni tre situe proximit dune autre antenne ou dun autre metteur, ni tre utilise conjointement avec une autre antenne ou un autre metteur. En raison de la taille du produit, lidentifiant IC est fourni dans le manuel dinstallation. Le client final doit s'assurer que l'appareil se trouve en toutes circonstances une distance de plus de 5 mm du corps humain. Si le client final envisage une application ncessitant d'utiliser le PAN1740A une distance infrieure 5 mm du corps humain, alors le FEO doit rpter l'valuation DAS. L'quipement du client final doit rpondre aux exigences actuelles de scurit et de sant selon lISED. Module Integration Guide Rev. 1.1 Page 38 of 44 PAN1740A Bluetooth Module IC Notice 11.3.1 11 Regulatory and Certification Information The following IC notice has to be printed in English and French in the OEM end product user information:

The device PAN1740A, including the integrated antenna mentioned in 11.2.5 Approved Antenna List, complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil PAN1740A, les antennes y compris 11.2.5 Approved Antenna List est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

1. L'appareil ne doit pas produire de brouillage, et 2. L'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. English French Module Integration Guide Rev. 1.1 Page 39 of 44 PAN1740A Bluetooth Module 11.3.2 Labeling Requirements English 11 Regulatory and Certification Information The following IC labelling requirements have to be followed by end product OEMs:

Labeling Requirements The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is: IC: 216Q-1740A This IC identifier is valid for the PAN1740A module. In any case, the end product must be labelled on the exterior with:

French

"Contains IC: 216Q-1740A Obligations dtiquetage Les fabricants dquipements dorigine (FEO) en anglais Original Equipment Manufacturer (OEM) doivent sassurer que les obligations dtiquetage IC du produit final sont remplies. Ces obligations incluent une tiquette clairement visible lextrieur de lemballage externe, comportant lidentifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L identifiant IC est: IC: 216Q-1740A Cet identifiant est valide pour module PAN1740A. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante:

"Contient IC: 216Q-1740A Module Integration Guide Rev. 1.1 Page 40 of 44 PAN1740A Bluetooth Module 11 Regulatory and Certification Information 11.4 European Conformity According to RED (2014/53/EU) All modules described in this Module Integration Guide comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with RED (2014/53/EU) articles. Standards Due to the model size, the CE marking is displayed in the installation instruction and on the package label only. It cannot be displayed according to regulation (EU) No. 765/2008 in 5mm height on the modules label due to the limited space. The end product OEM has to re-assess the conformity of the end product to EU regulations, but can use the PAN1740A RED pre-assessment to shorten this procedure. The RED EU Type Examination Certificate No. T818698M issued by the Notified Body 0682 can be used for the OEM end product conformance assessment. If a Notified Body has been contracted for the end product conformity assessment, it should be noted that this EU Type Examination Certificate should be used for conformance assessment. As a result of the OEM end product conformity assessment procedure described in 2014/53/EU Directive and other applicable EU directives, the end customer equipment should be labelled as follows:

The requirements for CE marking are described in regulation (EU) No. 765/2008 Annex II. The end customer has to assure that the device has a distance of more than 5mm from the human body under all circumstances. If the end customer application intends to use the PAN1740A in a distance smaller 5mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to RED. PAN1740A and its model versions in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey. Module Integration Guide Rev. 1.1 Page 41 of 44 PAN1740A Bluetooth Module 11.5 Bluetooth 11 Regulatory and Certification Information For Bluetooth end products which integrate the PAN1740A the OEM needs to apply for an own end product listing (EPL) at the Bluetooth SIG. If the PAN1740A is used on more than one OEM product, costs can be saved by applying for a family EPL. For the end product EPL the following IDs can be used in order to avoid re-testing:

Bluetooth 5 End product Declaration ID D050149 QDID 148713 Bluetooth Marks According to the Bluetooth SIG, the PAN1740A fulfills the criteria to label your product as a Bluetooth device:

For further information please refer to the Bluetooth website www.bluetooth.com Module Integration Guide Rev. 1.1 Page 42 of 44 PAN1740A Bluetooth Module 12 Restricted Use 12.1 Life Support Policy 12 Restricted Use This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. 12.2 Restricted End Use This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end-user or any end-use prohibited by the European Union, United States or any other applicable law is strictly prohibited. Module Integration Guide Rev. 1.1 Page 43 of 44 PAN1740A Bluetooth Module 13 Contact Details 13.1 Contact Us 13 Contact Details Please contact your local Panasonic Sales office for details on additional product options and services:

For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic website Sales & Support to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 13.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents:

For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Module Integration Guide Rev. 1.1 Page 44 of 44

PAN1740A Bluetooth Module 3.4 Case Marking Example:

3 Detailed Description 1 Model name 2 Hardware/software version 3 Order number 4 IC ID 5 Lot code 7 FCC ID 8 Marking for Pin 1 9 2D barcode, for internal usage only 6 Engineering sample marking, if applicable Dimensions: 9mm x 9.5mm x 1.8mm (SMD package with antenna) Product Specification Rev. 1.0 Page 23 of 41

CONFIDENTIALITY REQUEST for Certification Service in USA Title/Model PAN1740A Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 2020-05-06 TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, we requests confidentiality for the following products:

FCC ID Number Product T7V1740A For the product stated above, we request permanent confidentiality for exhibits which contain Operational Description, Block Diagram, Schematics, Parts Lists or Tune Up Information. The above exhibits contain our trade secrets and proprietary information that could be of benefit to our competitors. If you have any questions, please feel free to contact me at the address shown below. Sincerely,

(signed) Name: Olaf Knoth Company: Panasonic Industrial Devices Europe GmbH Address: Zeppelinstrae 19, 21337 Lneburg Phone: +49 4131 899 257 Email: Olaf.knoth@eu.panasonic.com

Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Certification and Engineering Bureau Industry Canada Spectrum Engineering Branch 3701 Carling Avenue, Building 94 Ottawa, Ontario K2H 8S2 Subject: FCC / ISED Modular Approval Statement FCC ID:

Only applicable for ISED certification:

IC Company Number:

UPN:

HVIN:

(Hardware Version Identification Number) HMN:

(Host Marketing Name) TO WHOM IT MAY CONCERN PMN:

(Product Marketing Name) FVIN:

(Firmware Version Identification Number) No *

Yes Pursuant to Paragraphs RSP-100 Issue 10 November 2014 Item 7.3 and CFR 15.212, we herewith declare for our module. Modular approval requirement

(a) The radio elements must have the radio frequency circuitry be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly.

*Please provide a detailed explanation if the answer is No.:

(b) The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable RSS standard under conditions of excessive data rates or over-modulation.

*Please provide a detailed explanation if the answer is No.:

(c) The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module.

*Please provide a detailed explanation if the answer is No.:

(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module.

*Please provide a detailed explanation if the answer is No.:

Yes No *

(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration, i.e. the module must not be inside another device during testing.

*Please provide a detailed explanation if the answer is No.:

(f) The module shall comply with the Category I equipment labeling requirements and CFR 15.212(a)(1)(vi).

*Please provide a detailed explanation if the answer is No.:

(g) The module shall comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement which are based on the intended use/configurations.

*Please provide a detailed explanation if the answer is No.:

Only applicable for ISED certification:

(h) Is the modular device for an Industry Canada licensed exempt service?

(i) The modular transmitter complies with all applicable FCC rules. Instructions for maintaining compliance are given in the user instructions. If you have any questions, please feel free to contact us at the address shown below Best Regards, Company Name:

Company Address:

Contact Name:

Signature:

Phone:

Fax:

Email:

Signature Date:

INFO for applicant: LMA may be granted when one or more of the requirements in the table above cannot be demonstrated. LMA will also be issued in those instances where applicants can demonstrate that they will retain control over the final installation of the device, such that compliance of the end product is assured. In such cases, an operating condition on the LMA for the module must state that the module is only approved for use when installed in devices produced by a specific manufacturer. When LMA is sought, the application for equipment certification must specifically state how control of the end product, into which the module will be installed, will be maintained, such that full compliance of the end product is always ensured. 2019-03-25