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PAN1762 Bluetooth Low Energy Module Product Specification Rev. 1.1 Wireless Modules PAN1762 Bluetooth Module Bluetooth 2Mbps high-speed PHY, LE long range coded PHY LE advertising extensions (advertising on 40 channels) Channel selection algorithm #2 LE secure connections Advertising function without CPU Wake-Up and interaction Bluetooth SIG certified Mesh stack (soon) Characteristics Typical sensitivity -95dBm @ 1Mb/s and
-105dBm @ 125kb/s Output power max. 8dBm Typical current consumption of 11mA in TX (@
8dBm) and 5.1mA in RX mode Voltage range: 1.9V to 3.6V Temperature range: -40C to 85C Overview The PAN1762 is a Panasonic Bluetooth 5.0 Low Energy (LE) module based on the Toshiba TC35680 single-chip controller. Features Small SMD module: 15.6mm x 8.7mm x 1.9mm Same form factor and pinout as PAN1026A and PAN1760A Bluetooth LE 5.0 compliant Bluetooth stack in ROM 128kB flash memory available for application Max. 51kB RAM for application code and ROM patches Host mode and stand-alone mode operation, AT command mode (soon) Standard SIG Bluetooth LE profiles as well as SPP over Bluetooth LE profile 18 General Purpose I/Os, which are shared by 2SPI, 2IC, 2UART, 4PWM, 5ADC, and Wake-Up inputs Toshiba TC35680 featuring ARM Cortex-M0 with SWD interface Block Diagram Product Specification Rev. 1.1 Page 2 ChipAntennaToshibaTC35680SPIReset PAN1762Bluetooth Low Energy 5.0 ModuleCrystal32 MHzCrystal32.768 kHzFlash128 kBUARTICADCSWD1.9 V to 3.6 VDC-DCConversionGPIOs PAN1762 Bluetooth Module By purchase of any of the products described in this document the customer accepts the documents validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2019. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status Engineering Samples. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 1.1 Page 3 PAN1762 Bluetooth Module Table of Contents 1 About This Document ......................................................................................................................... 5 Purpose and Audience .............................................................................................................. 5 1.1 Revision History ......................................................................................................................... 5 1.2 1.3 Use of Symbols ......................................................................................................................... 5 Related Documents ................................................................................................................... 5 1.4 2 Overview .............................................................................................................................................. 6 Block Diagram ........................................................................................................................... 7 Pin Configuration ....................................................................................................................... 8 UART Interface ........................................................................................................................ 10 Bluetooth Features .................................................................................................................. 11 2.1 2.2 2.3 2.4 3 4 5 6 7 Detailed Description ......................................................................................................................... 12 Dimensions .............................................................................................................................. 12 3.1 Footprint .................................................................................................................................. 13 3.2 3.3 Packaging ................................................................................................................................ 14 Case Marking .......................................................................................................................... 17 3.4 Specification ..................................................................................................................................... 18 4.1 Default Test Conditions ........................................................................................................... 18 Absolute Maximum Ratings ..................................................................................................... 18 4.2 Recommended Operating Conditions ...................................................................................... 19 4.3 Current Consumption............................................................................................................... 19 4.4 4.5 Bluetooth ................................................................................................................................. 20 Reliability Tests ....................................................................................................................... 20 4.6 4.7 Recommended Soldering Profile ............................................................................................. 21 Cautions ............................................................................................................................................ 22 Design Notes ........................................................................................................................... 22 5.1 Installation Notes ..................................................................................................................... 22 5.2 5.3 Usage Condition Notes ............................................................................................................ 23 Storage Notes .......................................................................................................................... 23 5.4 5.5 Safety Cautions ....................................................................................................................... 23 5.6 Other Cautions ........................................................................................................................ 24 5.7 Restricted Use ......................................................................................................................... 25 Regulatory and Certification Information ....................................................................................... 26 Federal Communications Commission (FCC) for US .............................................................. 26 6.1 6.2 Innovation, Science, and Economic Development (ISED) for Canada .................................... 28 Japanese Radio Law Compliance ........................................................................................... 30 6.3 European Conformity According to RED (2014/53/EU) ........................................................... 31 6.4 6.5 Bluetooth ................................................................................................................................. 31 RoHS and REACH Declaration ............................................................................................... 32 6.6 Appendix ........................................................................................................................................... 33 7.1 Ordering Information ................................................................................................................ 33 Contact Details ........................................................................................................................ 34 7.2 Product Specification Rev. 1.1 Page 4 PAN1762 Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic module PAN1762. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as the PAN1762 or the module within this document. 1.2 Revision History Revision Date Modifications/Remarks 1.0 1.1 2018-11-20 Initial release 2019-05-28 Added certification and qualification information. 1.3 Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the products functionality at risk.
[chapter number]
[chapter title]
Cross reference Indicates cross references within the document. Example:
Description of the symbols used in this document 1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents 7.2.2 Product Information. Product Specification Rev. 1.1 Page 5 PAN1762 Bluetooth Module 2 Overview 2 Overview The PAN1762 is a Panasonic Bluetooth 5.0 Low Energy module based on the Toshiba TC35680 single-chip controller. The new Bluetooth 5.0 features enable a higher symbol rate of 2Mbps using the high-speed 2M PHY or a significantly longer range using the Low Energy coded PHY at 500kb/s or 125kb/s. The new channel selection algorithm improves the performance in environments which are busy at 2.4GHz. Furthermore, the new LE advertising extensions allow for much larger amounts of data to be broadcast in connectionless scenarios and are therefore favorable for beacon and mesh applications. A high output power of up to 8dBm and the industry leading sensitivity of the TC35680 in combination with the Low Energy coded PHY make the module very attractive in applications where a long range is required. The ultra-low current consumption of the PAN1762 makes the module an ideal choice for battery powered devices. Various sleep modes can be used to minimize power consumption and prolong battery life time. To provide maximum flexibility, the module can be operated in hosted as well as standalone mode. In standalone mode no external processor is necessary, which saves complexity, space, and cost. The built-in 128kB flash memory is completely free for application use. PAN1762 shares the same small form factor and footprint as PAN1026A and PAN1760A. When migrating from PAN1760A or PAN1760 only minor code changes are required. Previously developed software, such as Bluetooth Low Energy profiles and applications, can be easily migrated with a minimal effort. FCC, IC, MIC, and CE approval are available. Please refer to the Panasonic website for related documents 7.2.2 Product Information. Further information on the variants and versions 7.1 Ordering Information. Product Specification Rev. 1.1 Page 6 2.1 Block Diagram PAN1762 Bluetooth Module 2 Overview Product Specification Rev. 1.1 Page 7 ChipAntennaToshibaTC35680SPIReset PAN1762Bluetooth Low Energy 5.0 ModuleCrystal32 MHzCrystal32.768 kHzFlash128 kBUARTICADCSWD1.9 V to 3.6 VDC-DCConversionGPIOs PAN1762 Bluetooth Module 2 Overview 2.2 Pin Configuration Pin Assignment All dimensions are in millimeters. Top View Pin Functions No Pin Name Pin Type Description A1 GND Ground Pin Connect to ground A2 GPIO3 Digital I/O A3 RESET Digital Input Reset, active low A4 NC A5 VCC A6 VCC NC Not connected Power Analog/digital power supply connection Power Analog/digital power supply connection A7 GND Ground Pin Connect to ground A8 GPIO16 Digital I/O A9 GND Ground Pin Connect to ground A11 GND Ground Pin Connect to ground Product Specification Rev. 1.1 Page 8 A1A2A3A4A5A6A7A8A9A11A12B1B2B3B4B5B6B7B8B9C1C2C3C4C5C6C7C8C9D1D2D3D4D5D6D7D8D9E1E2E3E4E5E6E7E8E9F1F2F3F4F5F6F7F8F9F11F1215.65.0Groundplane keep-out area1.21.20.60.60.61.01.358.75.03.02.61.851.85 PAN1762 Bluetooth Module 2 Overview No Pin Name Pin Type Description A12 GND Ground Pin Connect to ground B1 GPIO9 B2 GPIO4 B3 NC B4 NC Digital I/O Digital I/O NC NC Not connected, leave open Not connected, leave open B5 GPIO7/UART RTS Digital I/O UART RTS B6 GPIO8/UART CTS Digital I/O UART CTS B7 GPIO17 Digital I/O B8 NC NC Not connected, leave open B9 GND Ground Pin Connect to ground C1 NC C2 NC NC NC Not connected, leave open Not connected, leave open C3 GPIO10 Digital I/O C4 SWDIO C5 SWDCLK SWD SWD C6 GPIO1 Digital I/O C7 NC NC Not connected, leave open C8 GND Ground Pin Connect to ground C9 GND Ground Pin Connect to ground D1 NC D2 NC D3 NC NC NC NC Not connected, leave open Not connected, leave open Not connected, leave open D4 GPIO0/WakeUp0 Digital I/O D5 NC NC Not connected, leave open D6 GPIO15/WakeUp1 Digital I/O D7 GND Ground Pin Connect to ground D8 GND Ground Pin Connect to ground D9 ANT RF-Signal Antenna pin (not connected for standard module version) E1 GPIO12/SDA Digital I/O I2C interface E2 GPIO11/SCL Digital I/O I2C interface E3 NC NC Not connected, leave open Product Specification Rev. 1.1 Page 9 PAN1762 Bluetooth Module 2 Overview No Pin Name Pin Type Description E4 NC E5 NC NC Not connected, leave open SLPXOIN Not connected for standard version (32kHz clock input) E6 GPIO6/UARTRX Digital Input UART RX E7 NC NC Not connected, leave open E8 GND Ground Pin Connect to ground E9 GND Ground Pin Connect to ground F1 GND Ground Pin Connect to ground F2 NC F3 NC F4 NC NC NC NC Not connected, leave open Not connected, leave open Not connected, leave open F5 GPIO14 Digital Input F6 GPIO2 Digital I/O F7 GPIO5/UARTTX Digital Output UART TX F8 GPIO13 Digital Output F9 GND Ground Pin Connect to ground F11 GND Ground Pin Connect to ground F12 GND Ground Pin Connect to ground Minimal configuration:
VCC GND UART Rx, Tx, no flow control 2.3 UART Interface Default baud rate: 115 200 Data format: 8, Stop: 1, Parity: none, LSB first Rx, Tx, no flow control Product Specification Rev. 1.1 Page 10 PAN1762 Bluetooth Module 2 Overview 2.4 Bluetooth Features 2Mbps high-speed PHY, Low Energy long range coded PHY Low Energy advertising extensions (advertising on 40 channels total) Channel selection algorithm #2 Low Energy secure connections Advertising function without CPU Wake-Up and interaction Bluetooth SIG certified Mesh stack (soon) Product Specification Rev. 1.1 Page 11 PAN1762 Bluetooth Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. No. Item Dimension Tolerance Remark 1 Width 2 Length 3 Height 8.70 15.60 1.80 0.35 0.35 0.35 With case Product Specification Rev. 1.1 Page 12 PAN1762 Bluetooth Module 3 Detailed Description 3.2 Footprint The outer dimensions have a tolerance of 0.35 mm. All dimensions are in millimeters. Top View Product Specification Rev. 1.1 Page 13 A1A2A3A4A5A6A7A8A9A11A12B1B2B3B4B5B6B7B8B9C1C2C3C4C5C6C7C8C9D1D2D3D4D5D6D7D8D9E1E2E3E4E5E6E7E8E9F1F2F3F4F5F6F7F8F9F11F1215.65.0Groundplane keep-out area1.21.20.60.60.61.01.358.75.03.02.61.851.85 PAN1762 Bluetooth Module 3 Detailed Description 3.3 Packaging The product is an ES status product and will be delivered in the package described below. 3.3.1 Tape Dimensions 3.3.2 Packing in Tape Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.1 Page 14 100730-PAN1720.vsdtrailer (empty)1 x circumference /hub(min 160mm)component packed areastandard 1500pcsleader (empty)minimum 10 pitchTop cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules.Direction of unreeling (for customer) PAN1762 Bluetooth Module 3 Detailed Description 3.3.3 Component Direction 3.3.4 Reel Dimension Product Specification Rev. 1.1 Page 15 PAN1762 Bluetooth Module 3 Detailed Description 3.3.5 Package Label Example
(1T)
(1J)
(1P)
(2P)
(9D)
(Q)
(HW/SW) Lot code MIC ID Customer order number, if applicable Order number Date code Quantity Hardware/software version 3.3.6 Total Package Product Specification Rev. 1.1 Page 16 PAN1762 Bluetooth Module 3 Detailed Description 3.4 Case Marking Example 1 2 3 4 5 6 7 8 9 10 11 MIC ID Brand name Hardware/software version Order number IC ID Lot code Engineering Sample marking, if applicable Marking for Pin 1 2D barcode, for internal usage only Bluetooth logo FCC ID Product Specification Rev. 1.1 Page 17 PAN1762 Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature:
Humidity:
Supply Voltage:
25C 10C 40% to 85% RH 3.3V 4.2 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Units TSTOR VDD VESD PRF VDIG IIN Storage temperature Power supply ESD robustness
(Target value) All pads, according to human body model (HBM), JEDEC STD 22, method A114 According to charged device model (CDM), JEDEC STD 22, method C101 RF input level Voltage on any digital pins Input current for any digital pin
-40 85 C
-0.3 3.9 mA 1 000 V 500 V 10 dBm
-0.3 VDD 0.3 V
-10 10 mA Product Specification Rev. 1.1 Page 18 PAN1762 Bluetooth Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Units TA VDD Ambient operating temperature range 3V3 Supply voltage
-40 85 C 1.8 3.3 3.6 V 4.4 Current Consumption The current consumption depends on the user scenario, on the setup, and timing in the power modes. Assume VDD = 3.0V, Tamb = 25C, if nothing else stated. Parameter Condition Min. Typ. Max. Units Current Consumption Of The Digital Circuits At Operation Data Transmission Current Consumption Bluetooth wireless: not used Built-in flash memory: not used Target value,1Mbps, 0dBm Target value,2Mbps, 0dBm Target value,1Mbps, 8dBm Target value,2Mbps, 8dBm Data Reception Current Consumption Target value, 1Mbps Target value, 2Mbps Current Consumption In Low Power Mode
(Sleep Mode) Power supply of CPU: on The oscillation of the sleep clock is operated. Whole of the data is retained. Current Consumption In Low Power Mode
(Backup Mode) Deep Sleep Mode Power supply of CPU: off The oscillation of the sleep clock is operated. Whole of the data is retained. Power supply of CPU: off The oscillation of the sleep clock is stopped. No data is retained. 1.2 mA 5.2 5.4 11.3 11.5 5.1 5.6 2.5 2.5 mA mA mA mA mA mA A A 50 nA Product Specification Rev. 1.1 Page 19 PAN1762 Bluetooth Module 4 Specification 4.5 Bluetooth Parameter Condition Min. Typ. Max. Units 2 402 2 480 MHz Operation Frequency Range Channel Spacing Bluetooth LE Output Power Maximum setting, measured at module bottom pad Sensitivity 1Mbps, PER = 30.8% at 1 500 packets with dirty Tx, 37 octets 2Mbps, PER = 30.8% at 1 500 packets with dirty Tx, 37 octets 500kbps (S = 2), PER = 30.8% at 1 500 packets with dirty Tx, 37 octets 125kbps (S = 8), PER = 30.8% at 1 500 packets with dirty Tx, 37 octets Symbol Parameter Condition Min. 1 Spurious emissions Conducted measurement at module RF bottom pad 4.6 Reliability Tests 2 8
-95
-93
-101
-105 MHz dBm dBm dBm dBm dBm Typ. Max. Units
<-30 dBm The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item Limit Condition 1 Variable Vibration Test Electrical parameters should be Freq.: 20~2 000Hz, Acc.: 17-50G, 2 Shock Drop Test 3 Heat-Shock/
Temperature Cycling Test within specification Electrical parameters should be within specification Electrical parameters should be within specification Sweep: 8min, 2 hours, For: XYZ axis Drop parts on concrete from a height of 1m for 3 times At -40C and 85C for 1 h/cycle Total = 300 cycles 4 Temperature Humidity Bias Test Electrical parameters should be within specification At 60C, 85% r.H., 300h 5 Low Temperature Storage Life Test Electrical parameters should be within specification At -40C, 300h 6 High Temperature Storage Life Test Electrical parameters should be within specification At 85C, 300h Product Specification Rev. 1.1 Page 20 PAN1762 Bluetooth Module 4 Specification 4.7 Recommended Soldering Profile Reflow permissible cycles: 2 Due to module weight, opposite side reflow is prohibited. More than 75 percent of the soldering area shall be coated by solder. The soldering profiles should be adhered to in order to prevent electrical or mechanical damage. Soldering profile assumes lead-free soldering. Product Specification Rev. 1.1 Page 21 PAN1762 Bluetooth Module 5 Cautions 5 Cautions Failure to follow the guidelines set forth in this document may result in degrading of the module functions and damage to the module. 5.1 Design Notes 1. Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage should abide by the maximum ratings ( 4.2 Absolute Maximum Ratings). 3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47F directly at the module). 4. This module should not be mechanically stressed when installed. 5. Keep this module away from heat. Heat is the major cause of decreasing the life time of these modules. 6. Avoid assembly and use of the target equipment in conditions where the module temperature may exceed the maximum tolerance. 7. Keep this module away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board. 5.2 Installation Notes 1. Reflow soldering is possible twice based on the conditions set forth in 4.7 Recommended Soldering Profile. Set up the temperature at the soldering portion of this module according to this reflow profile. 2. Carefully position the module so that the heat will not burn into printed circuit boards or affect other components that are susceptible to heat. 3. Carefully locate the module, to avoid an increased temperature caused by heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover and these modules to occur. 5. This module should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the module. Product Specification Rev. 1.1 Page 22 PAN1762 Bluetooth Module 5 Cautions 5.3 Usage Condition Notes 1. Take measures to protect the module against static electricity. If pulses or transient loads (a large load, which is suddenly applied) are applied to the modules, check and evaluate their operation before assembly of the final products. 2. Do not use dropped modules. 3. Do not touch, damage, or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this module. 5. Electrode peeling strength: Do not apply a force of more than 4.9N in any direction on the soldered module. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These modules are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 5.4 Storage Notes 1. The module should not be stressed mechanically during storage. 2. Do not store these modules in the following conditions or the performance characteristics of the module, such as RF performance will be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, Storage in direct sunlight, Storage in an environment where the temperature may be outside the range of 5C to 35C, or where the humidity may be outside the 45% to 85% range, Storage of the modules for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 3. Keep this module away from water, poisonous gas, and corrosive gas. 4. This module should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10). 5.5 Safety Cautions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum:
Product Specification Rev. 1.1 Page 23 PAN1762 Bluetooth Module 5 Cautions 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 5.6 Other Cautions 1. Do not use the module for other purposes than those listed in section 5.3 Usage Condition Notes. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the module. 3. This module has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These modules are not intended for use under the special conditions shown below. Before using these modules under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner:
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, In direct sunlight, outdoors, or in a dusty environment, In an environment where condensation occurs, In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these modules with new modules, because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. Please refer to the Panasonic website for for further information 7.2.2 Product Information. 5. Product Specification Rev. 1.1 Page 24 PAN1762 Bluetooth Module 5 Cautions 5.7 Restricted Use 5.7.1 Life Support Policy This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. 5.7.2 Restricted End Use This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end user or any end use prohibited by the European Union, United States or any other applicable law is strictly prohibited. Product Specification Rev. 1.1 Page 25 PAN1762 Bluetooth Module 6 Regulatory and Certification Information 6 Regulatory and Certification Information 6.1 Federal Communications Commission (FCC) for US 6.1.1 FCC Notice The PAN1762 including the antennas, which are listed in 6.1.5 Approved Antenna List, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. 6.1.2 Caution The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna, Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver, connected, Consult the dealer or an experienced radio/TV technician for help. Product Specification Rev. 1.1 Page 26 PAN1762 Bluetooth Module 6 Regulatory and Certification Information 6.1.3 Label Requirements The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V1762. This FCC identifier is valid for the PAN1762. The end product must in any case be labelled on the exterior with:
"Contains FCC ID: T7V1762"
6.1.4 Antenna Warning This antenna warning refers to the test device with the model number PAN1762 7.1 Ordering Information The device is tested with a standard SMA connector and with the antenna listed below. When integrated into the OEMs product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in 6.1.5 Approved Antenna List is the same (FCC ID: T7V1762). 6.1.5 Approved Antenna List Item Part Number Manufacturer Frequency Band Type Max. Gain
(dBi) 1 ANT016008LCS2442MA1 TDK 2.4GHz Chip antenna 1.6 Product Specification Rev. 1.1 Page 27 PAN1762 Bluetooth Module 6 Regulatory and Certification Information 6.1.6 RF Exposure To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed 6.1.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN1762 with a mounted ceramic antenna
(FCC ID: T7V1762) is below the FCC radio frequency exposure limits. Nevertheless, the PAN1762 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. 6.2 Innovation, Science, and Economic Development (ISED) for Canada English The PAN1762 is licensed to meet the regulatory requirements of ISED. License ID:
IC: 216Q-1762 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in 6.1.5 Approved Antenna List, having a maximum gain of +1.6 dBi. Antennas not included in this list or having a gain greater than +1.6 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to the model size, the IC identifier is displayed in the installation instruction only and it cannot be displayed on the modules label due to the limited size. French PAN1762 est garanti conforme aux dispositions rglementaires dIndustry Canada (ISED). License:
IC: 216Q-1762 Il est recommand aux fabricants dappareils fixes, mobiles ou portables de consulter la rglementation en vigueur et de vrifier la conformit de leurs produits relativement aux limites dexposition aux rayonnements radiofrquence ainsi quau dbit dabsorption spcifique maximum autoris. Product Specification Rev. 1.1 Page 28 PAN1762 Bluetooth Module 6 Regulatory and Certification Information Des informations pour les utilisateurs sur la rglementation Canadienne concernant lexposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a t dvelopp pour fonctionner spcifiquement avec les antennes listes dans le tableau 6.1.5 Approved Antenna List, prsentant un gain maximum de 1.6dBi. Des antennes autres que celles listes ici, ou prsentant un gain suprieur 1.6dBi ne doivent en aucune circonstance tre utilises en combinaison avec ce produit. Limpdance des antennes compatibles est 50 Ohm. Lantenne utilise avec ce produit ne doit ni tre situe proximit dune autre antenne ou dun autre metteur, ni tre utilise conjointement avec une autre antenne ou un autre metteur. En raison de la taille du produit, lidentifiant IC est fourni dans le manuel dinstallation. 6.2.1 IC Notice English The device PAN1762 ( 7.1 Ordering Information), including the antennas
( 6.1.5 Approved Antenna List), complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. French Le prsent appareil PAN1762 ( 7.1 Ordering Information), les antennes y compris ( 6.1.5 Approved Antenna List), est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
1. L'appareil ne doit pas produire de brouillage, et 2. L'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Product Specification Rev. 1.1 Page 29 PAN1762 Bluetooth Module 6 Regulatory and Certification Information 6.2.2 Labeling Requirements English Labeling Requirements French The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is:
IC: 216Q-1762 This IC identifier is valid for all PAN1762 modules 7.1 Ordering Information. In any case, the end product must be labelled on the exterior with:
"Contains IC: 216Q-1762 Obligations dtiquetage Les fabricants dquipements dorigine (FEO) en anglais Original Equipment Manufacturer (OEM) doivent sassurer que les obligations dtiquetage IC du produit final sont remplies. Ces obligations incluent une tiquette clairement visible lextrieur de lemballage externe, comportant lidentifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L identifiant IC est:
IC: 216Q-1762 Cet identifiant est valide pour tous les modules PAN1762 7.1 Ordering Information. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante:
"Contient IC: 216Q-1762 6.3 Japanese Radio Law Compliance This device is granted pursuant to the Japanese Radio Law (). This device should not be modified (otherwise the granted designation number will become invalid). The MIC ID is: [R]202-SMH031 Product Specification Rev. 1.1 Page 30 PAN1762 Bluetooth Module 6 Regulatory and Certification Information 6.4 European Conformity According to RED (2014/53/EU) All modules described in this Product Specification comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with RED (2014/53/EU) articles:
3.1a Safety/Health:
EN 62368-1:2014 EN 62311:2008 3.1b EMC:
3.2 Radio:
EN 301 489-1 V2.1.1:2017-02 EN 301 489-17 V3.1.1:2017-02 EN 300 328 V2.1.1:2016-11 As a result of the conformity assessment procedure described in 2014/53/EU Directive, the end customer equipment should be labelled as follows:
The end customer has to assure that the device has a distance of more than 20cm from the human body under all circumstances. The end customer equipment must meet the actual Safety/Health requirements according to RED. PAN1762 and its model versions in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey. 6.5 Bluetooth Bluetooth end products which integrate the PAN1762 need to receive the following IDs at creation:
Bluetooth 5.0 Declaration ID Component (Tested) Component (Tested) End Product D041739 D039178 D044293 QDID 118932 119076 121739 Product Specification Rev. 1.1 Page 31 PAN1762 Bluetooth Module 6 Regulatory and Certification Information Bluetooth Marks According to the Bluetooth SIG, the PAN1762 fulfills the criteria to label your product as a Bluetooth device:
For further information please refer to the Bluetooth website www.bluetooth.com. 6.6 RoHS and REACH Declaration The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the section Downloads of the respective product 7.2.2 Product Information. Product Specification Rev. 1.1 Page 32 PAN1762 Bluetooth Module 7 Appendix 7 Appendix 7.1 Ordering Information Variants and Versions Order Number Brand Name Description ENW89853A1KF2 PAN1762 Bluetooth Low Energy Module MOQ1 1 500 1 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. 2 Samples are available on customer demand. Product Specification Rev. 1.1 Page 33 PAN1762 Bluetooth Module 7 Appendix 7.2 Contact Details 7.2.1 Contact Us Please contact your local Panasonic Sales office for details on additional product options and services:
For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support website to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 7.2.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents:
For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Product Specification Rev. 1.1 Page 34
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-05-13 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2019-05-13
|
||||
1 | Applicant's complete, legal business name |
Panasonic Industrial Devices Europe GmbH
|
||||
1 | FCC Registration Number (FRN) |
0014980072
|
||||
1 | Physical Address |
Zeppelinstrasse 19
|
||||
1 |
Lueneburg, N/A 21337
|
|||||
1 |
Germany
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
J******@eurofins.de
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
T7V
|
||||
1 | Equipment Product Code |
1762
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
O****** K********
|
||||
1 | Title |
Product Safety
|
||||
1 | Telephone Number |
+49-4******** Extension:
|
||||
1 | Fax Number |
+49-4********
|
||||
1 |
o******@eu.panasonic.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Bluetooth Low Energy Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Single Modular Approval. Output power listed is peak conducted. This device is to be used for portable and mobile applications. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. OEM integrators and end-users must be provided with specific information required to satisfy RF exposure compliance, antenna installation and labeling requirements for the final host device. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
Eurofins Product Service GmbH
|
||||
1 | Name |
J****** K********
|
||||
1 | Telephone Number |
49-33********
|
||||
1 | Fax Number |
49-33********
|
||||
1 |
j******@eurofins.de
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0061000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC