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Module integration guide | Users Manual | 4.87 MiB | April 23 2020 / April 24 2020 | |||
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User manual | Users Manual | 1.14 MiB | February 04 2022 | |||
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Internal photos | Internal Photos | 151.18 KiB | February 04 2022 | |||
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External photos | External Photos | 210.65 KiB | February 04 2022 | |||
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Label information | ID Label/Location Info | 543.21 KiB | April 23 2020 | |||
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C2PC letter | Cover Letter(s) | 40.06 KiB | February 04 2022 | |||
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Declaration of electrically identical products | Cover Letter(s) | 47.07 KiB | February 04 2022 | |||
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FCC modular approval letter | Cover Letter(s) | 1008.23 KiB | February 04 2022 | |||
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LTC | Cover Letter(s) | 1003.95 KiB | February 04 2022 | |||
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Manufacturer Declaration on PAN1770 antenna gain | Cover Letter(s) | 96.17 KiB | February 04 2022 | |||
| 1 2 3 4 5 | Operational description | Operational Description | February 04 2022 | confidential | ||||
| 1 2 3 4 5 | Operational description - antenna | Operational Description | February 04 2022 | confidential | ||||
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RF Exposure info | RF Exposure Info | 293.64 KiB | February 04 2022 | |||
| 1 2 3 4 5 | Schematics | Schematics | February 04 2022 | confidential | ||||
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Test report DTS Part 1 | Test Report | 3.23 MiB | February 04 2022 | |||
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Test report DTS Part 2 | Test Report | 3.16 MiB | February 04 2022 | |||
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Test setup photos | Test Setup Photos | 922.34 KiB | February 04 2022 | |||
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FCC Modulat approval letter | Cover Letter(s) | 1008.19 KiB | February 04 2022 | |||
| 1 2 3 4 5 | Block diagram | Block Diagram | April 23 2020 | confidential | ||||
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Modular Request Letter | Cover Letter(s) | 905.77 KiB | April 23 2020 | |||
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STC | Cover Letter(s) | 98.61 KiB | April 23 2020 | |||
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Test report Part 1 | Test Report | 2.44 MiB | April 23 2020 | |||
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Test report Part 2 | Test Report | 5.90 MiB | April 23 2020 | |||
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Test report Part 3 | Test Report | 2.32 MiB | April 23 2020 |
| 1 2 3 4 5 | Module integration guide | Users Manual | 4.87 MiB | April 23 2020 / April 24 2020 |
PAN1780 Bluetooth Low Energy Module Module Integration Guide Rev. 1.1 Wireless Connectivity PAN1780 Bluetooth Module Bluetooth Overview The PAN1780 is a Bluetooth 5 Low Energy (LE) module based on the Nordic nRF52840 single chip controller. Features Surface mount type dimensions:
15.6mm x 8.7mm x 2 mm Same form factor as PAN1026A and PAN1762 but smaller pitch and more pins Nordic nRF52840 featuring ARM Cortex-M4F Bluetooth 5 LE including LE 2M and LE Coded with 64MHz PHY Embedded 1MB flash memory and 256kB internal RAM Includes ARM TrustZone CryptoCell 310 and supports secure boot including Root of Trust (RoT) Up to 48 general purpose I/Os (GPIO), which are shared by up to 4SPI, 2IC, 2UART, 4PWM, 8ADC, 1 NFC-A, 32kHz IN/OUT, nRESET USB 2.0 full-speed device interface Built in temperature sensor LE 2Mbps high speed PHY, LE long range coded PHY LE advertising extensions (advertising on 40 channels total) Channel selection algorithm #2 LE secure connections Over-the-air update of application software Qualified Bluetooth mesh profile stack Characteristics Typical sensitivity: -95dBm at 1Mb/s and -103dBm at 125kb/s Typical max. output power: 8dBm, configurable from -20dBm in 4dB steps and -40dBm in whisper mode Typical current consumption: 4.8mA in Tx
(at 0dBm) and 4.8mA in Rx mode Typical current consumption: 0.4A in System OFF mode, 1.5A with RTC wake up On-module DC/DC and LDO regulators with automated low current modes Voltage range: 1.7V to 5.5V Temperature range: -40C to 85C Block Diagram Module Integration Guide Rev. 1.1 Page 2 of 48 PAN1780 Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time without notification. Please consult the most recently issued Module Integration Guide before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2020. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Module Integration Guide does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status Engineering Samples. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Module Integration Guide and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by Panasonic for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. Description of hardware, software, and other information in this document is only intended to illustrate the functionality of the referred Panasonic product. It should not be construed as guaranteeing specific functionality of the product as described or suitable for a particular application. Any provided (source) code shall not be used or incorporated into any products or systems whose manufacture, use or sale is prohibited under any applicable laws or regulations. Any outlined or referenced (source) code within this document is provided on an as is basis without any right to technical support or updates and without warranty of any kind on a free of charge basis according to 516 German Civil Law (BGB) including without limitation, any warranties or conditions of title, non infringement, merchantability, or fitness for a particular purpose. Customer acknowledges that (source) code may bear defects and errors. Module Integration Guide Rev. 1.1 Page 3 of 48 PAN1780 Bluetooth Module The third-party tools mentioned in this document are offered by independent third-party providers who are solely responsible for these products. Panasonic has no responsibility whatsoever for the performance, product descriptions, specifications, referenced content, or any and all claims or representations of these third-party providers. Panasonic makes no warranty whatsoever, neither express nor implied, with respect to the goods, the referenced contents, or any and all claims or representations of the third-party providers. To the maximum extent allowable by Law Panasonic assumes no liability whatsoever including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation loss of profits, loss of opportunities, business interruption, and loss of data. Module Integration Guide Rev. 1.1 Page 4 of 48 PAN1780 Bluetooth Module Table of Contents About This Document ......................................................................................................................... 6 Purpose and Audience .............................................................................................................. 6 1.1 1.2 Revision History ......................................................................................................................... 6 Use of Symbols ......................................................................................................................... 7 1.3 1.4 Related Documents ................................................................................................................... 8 2 Overview .............................................................................................................................................. 9 PAN1780 Module ............................................................................................................................... 10 Block Diagram ......................................................................................................................... 10 3.1 Footprint .................................................................................................................................. 11 3.2 3.3 Placement ................................................................................................................................ 12 Reference Design.............................................................................................................................. 14 Block Diagram ......................................................................................................................... 14 4.1 4.2 Schematic ................................................................................................................................ 15 Building Blocks ........................................................................................................................ 16 4.3 Breakout Pins .......................................................................................................................... 16 4.4 4.5 Configuration Settings ............................................................................................................. 17 NFC Antenna Placement ......................................................................................................... 19 4.6 4.7 PCB Layout ............................................................................................................................. 19 5 Getting Started .................................................................................................................................. 22 Default Jumper Configuration .................................................................................................. 22 5.1 Device Drivers ......................................................................................................................... 22 5.2 5.3 Software Examples .................................................................................................................. 23 5.4 Getting Toolchain .................................................................................................................... 23 5.5 Getting Started ........................................................................................................................ 30 Regulatory and Certification Information ....................................................................................... 36 6.1 General Certification Information ............................................................................................. 36 Federal Communications Commission (FCC) for US .............................................................. 36 6.2 Innovation, Science, and Economic Development (ISED) for Canada .................................... 40 6.3 European Conformity According to RED (2014/53/EU) ........................................................... 44 6.4 6.5 Bluetooth ................................................................................................................................. 45 Restricted Use ................................................................................................................................... 46 Life Support Policy ................................................................................................................... 46 7.1 7.2 Restricted End Use .................................................................................................................. 46 Contact Details .................................................................................................................................. 47 Contact Us ............................................................................................................................... 47 8.1 8.2 Product Information ................................................................................................................. 47 1 3 4 6 7 8 Module Integration Guide Rev. 1.1 Page 5 of 48 PAN1780 Bluetooth Module 1 About This Document 1.1 Purpose and Audience 1 About This Document This Module Integration Guide is intended to support the easy integration of the PAN1780 into a product and to ensure the compliance with regulatory requirements. This guide gives an overview about the hardware design requirements by providing a reference design, which is the evaluation board of the PAN1780. It describes how to use the PAN1780 on the evaluation board with the software packages and tools provided by Nordic Semiconductors. In addition, it explains how to start up the evaluation board, get all the needed software sources, execute example code and build own implementations. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. Please read this guide carefully to assure the compliance of your product to regulatory. The product is referred to as the PAN1780 or the module within this document. 1.2 Revision History Revision Date Modifications/Remarks 2019-11-21 First version 0.1 0.2 0.3 1.0 1.1 2019-12-18 Formatting and editing chapter Getting Started 2020-01-08 New layout 2020-03-12 Added chapter Regulatory and Certification Information 2020-03-26 Chapter 6.1 Added Softdevice S113 Chapter 6.3 Added ISED SAR Warning: min. distance 15mm Chapter 6.3 Added ISED HVIN Module Integration Guide Rev. 1.1 Page 6 of 48 PAN1780 Bluetooth Module 1.3 Use of Symbols Symbol Description 1 About This Document Note Attention Tip Indicates important information for the proper use of the product. Non-observance can lead to errors. Indicates important notes that, if not observed, can put the products functionality at risk. Indicates useful information designed to facilitate working with the module and software.
[chapter number]
Cross reference
[chapter title]
Indicates cross references within the document. Example:
Description of the symbols used in this document 1.3 Use of Symbols. Requirement Indicates a requirement that must be met before the corresponding tasks can be completed. Result This font GUI text Indicates the result of a task or the result of a series of tasks. Indicates fixed terms and text of the graphical user interface. Menu > Menu item Path Example:
Click Save. Example:
Indicates a path, e.g. to access a dialog. In the menu, select File > Setup page. Module Integration Guide Rev. 1.1 Page 7 of 48 PAN1780 Bluetooth Module Symbol Description This font File names, messages, user input 1 About This Document Indicates file names or messages and information displayed on the screen or to be selected or entered by the user. Examples:
pan1760.c contains the actual module initialization. The message Failed to save your data is displayed. Enter the value Product 123. Key Key Indicates a key on the keyboard, e.g. F10 . 1.4 Related Documents For related documents please refer to the Panasonic website 8.2 Product Information. Module Integration Guide Rev. 1.1 Page 8 of 48 PAN1780 Bluetooth Module 2 Overview 2 Overview The PAN1780 is a Bluetooth 5 Low Energy (LE) module based on the Nordic nRF52840 single-chip controller. The Bluetooth 5 features additionally a higher symbol rate of 2Mbps using the high-speed LE 2M PHY or a significantly longer range using the LE coded PHY at 500kb/s or 125kb/s. The new channel selection algorithm (CSA#2) improves the performance in high interference environments. Furthermore, the new LE advertising extensions allow for much larger amounts of data to be broadcasted in connectionless scenarios. An output power of up to 8dBm and the high sensitivity of the nRF52840 in combination with the LE coded PHY makes the module very attractive in applications, where a long range is required. In addition the ultra-low current consumption of the PAN1780 makes the module an ideal choice for battery powered devices. With the Cortex M4F processor, 256 kB RAM and the build-in 1MB flash memory the PAN1780 can easily be used in standalone mode, thereby eliminating the need for an external processor, saving complexity, space, and cost. The rich set of security features from the ARM TrustZone CryptoCell 310 security subsystem provide the necessary means for secure device operation in the IoT space. The PAN1780 also supports Type 2 Near Field Communication (NFC-A) for use in simplified pairing and payment solutions (external antenna required). For related documents please refer to 8.2 Product Information. Module Integration Guide Rev. 1.1 Page 9 of 48 PAN1780 Bluetooth Module 3 PAN1780 Module 3.1 Block Diagram 3 PAN1780 Module Module Integration Guide Rev. 1.1 Page 10 of 48 PAN1780 Bluetooth Module 3.2 Footprint 3 PAN1780 Module The dimensions are in millimeters. The outer dimensions have a tolerance of 0.3 mm. Top View Module Integration Guide Rev. 1.1 Page 11 of 48 5 0 1
. 0 1 1
. 5 0 1
. G1 G2 G3 G4 G5 G6 G7 G8 G9 G10 G12 G13 F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 0 7 8
. D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A12 A13 1.00 1.10 2.20 1.40 0.60 15.60 PAN1780 Bluetooth Module 3.3 Placement 3 PAN1780 Module Antenna Keep out Area Do not place any ground plane under the marked restricted antenna area in any layer! This would be affecting the performance of the chip antenna in a critical manner. Impact of Placement on the Antenna Radiation Pattern The placement of the module, surrounding material, and customer components has an impact on the radiation pattern of the antenna. The recommendation for the ground plane is based on a FR4 4-Layer PCB. The following requirements must be met:
Keep this product away from heat. Heat is the major cause of decreasing the life of these products. Keep this product away from other high frequency circuits. The antenna requires a cutout area of 5mm x 3mm under the PAN1780 module. This Keep out Area shall be located in every layer under the module antenna. Note for example the Keep out Area in all four layers of the PAN1780 evaluation board. It is recommended to verify the perfect position of the module in the target application before fixing the design. Module Integration Guide Rev. 1.1 Page 12 of 48 PAN1780 Bluetooth Module 3 PAN1780 Module All dimensions are in millimeters. Use a ground plane in the area surrounding the module wherever possible. It is recommended to place the module:
In the center (horizontal) of mother PCB. At the edge (horizontal) of mother PCB. Antenna Placement Recommendation Module Integration Guide Rev. 1.1 Page 13 of 48 Min. 15.00 Min. 15.00 8.70 5.00 0 0
. 3 Keep out Area Top View
. 0 6 5 1 0 0
. 0 4
. i n M PAN1780 Bluetooth Module 4 Reference Design 4 Reference Design The reference design, shown in the block diagram below, gives an example of how to use the PAN1780, to get a J-Link SWD and an FTDI UART connection on just one USB Port (X2). The reference design of the evaluation board, including the provided peripherals is inspired by the design of the nRF52840 Development Kit from Nordic Semiconductors. 4.1 Block Diagram The second available USB port (X5) on the evaluation board is directly connected to the D+ and the D- pins of the PAN1780. Please see schematics in 4.2 Schematic. Module Integration Guide Rev. 1.1 Page 14 of 48 PAN1780 USB Development Board USB ( X2) USB- Hub Breakout PI N header PAN1780 J- Link SWD FTDI UART USB ( X5) PAN1780 Bluetooth Module 4.2 Schematic 4 Reference Design Module Integration Guide Rev. 1.1 Page 15 of 48 PAN1780 Bluetooth Module 4.3 Building Blocks 4 Reference Design 4.4 Breakout Pins Module Integration Guide Rev. 1.1 Page 16 of 48 USB HUB FTDI USB to UART conversion Reset Button User Buttons:
SW1 SW4 JTAG SWD:
Programming and debugging User LEDs:
LED1 LED4 Breakout pins:
IOs can be connected externally to sensor boards or for debugging reasons 2 0 0 P
. 3 0 0 P
. 6 2 0 P
. 7 2 0 P
. V 3 3
. V 8 1
. 7 1 0 P
. 9 1 0 P
. 0 2 0 P
. 1 2 0 P
. 2 2 0 P
. 5 0 0 P
. 7 0 0 P
. 8 0 0 P
. 6 0 0 P D N G V 5 8 2 0 P
. 9 2 0 P
. 0 3 0 P
. 1 3 0 P
. 2 1 1 P
. 5 1 1 P
. 4 1 1 P
. 3 1 1 P
. 2 0 1 P
. 1 0 1 P
. D N G PAN1780 Bluetooth Module 4.5 Configuration Settings 4 Reference Design Jumper JP11 Do not place JP11, if an external 3.3 V source is present. After each different configuration the reset button needs to be pressed. Jumper Layout Description JP1 5 V from USB connected 5 V power option, to power the board from USB or the 5 V pin. The 5 V from USB can also be used to power the sensor board. 5 V from or to breakout pin connected Module Integration Guide Rev. 1.1 Page 17 of 48 PAN1780 Bluetooth Module JP3 Jumper Layout Description 4 Reference Design JP4 SWD connected Access to module and programmer SWD. JP8 Module UART connected Access to module UART Rx and Tx. Module reset connected Module reset disconnected SWD disconnected Module UART disconnected JP9 Module VCC connected JP7, JP10 FTDI connected to module UART Module VCC connection and GND pin. The module VCC jumper can be removed for current measurements. Option for module UART to breakout pin or FTDI. Place jumpers either just on JP7 or JP7 and JP10. Breakout pins of JP2 connected to module UART 3.3 V are supplied to the breakout pin Option to power an external sensor board with 3.3 V. 3.3 V are not supplied to the breakout pin Module VCC connected Module VCC not connected 1, 3: GND 2, 4: NFC Antenna Option to break 3.3 V supply via JP9 and connect 5 V supply to pin 1 of JP12 to power the module. Option to connect NFC antenna to PAN1780 module. JP11 JP12 JP13 Module Integration Guide Rev. 1.1 Page 18 of 48 PAN1780 Bluetooth Module 4.6 NFC Antenna Placement 4 Reference Design For applications that need an external NFC antenna connection an antenna is provided inside the Evaluation Tool Kit. Please connect the antenna to JP13 as shown. 4.7 PCB Layout 4.7.1 Top Layer Module Integration Guide Rev. 1.1 Page 19 of 48 PAN1780 Bluetooth Module 4.7.2 Second Layer 4 Reference Design 4.7.3 Third Layer Module Integration Guide Rev. 1.1 Page 20 of 48 PAN1780 Bluetooth Module 4.7.4 Bottom Layer 4 Reference Design Module Integration Guide Rev. 1.1 Page 21 of 48 PAN1780 Bluetooth Module 5 Getting Started 5 Getting Started 5.1 Default Jumper Configuration 1. Place all highlighted jumpers on PAN1780 ETU Evaluation Board. 2. Connect the device via USB (Socket X2) to power it. 5.2 Device Drivers 5.2.1 General It might be necessary to install drivers for some components. Please note that the FTDI USB UART and the Segger J-Link SWD debugger provide COM ports to the system. Module Integration Guide Rev. 1.1 Page 22 of 48 NFC Antenna Switch Module UART:
Breakout pins FTDI 3.3V to pin Do not place with external 3.3V supply 5V from USB 5V from pin Module VCC Module VCC5V Breakout Module Reset SWD UART PAN1780 Bluetooth Module 5 Getting Started If the jumper configuration in 5.1 Default Jumper Configuration was considered, both COM ports can be used to open a UART connection to the PAN1780. Another jumper configuration for JP4, JP7, and JP10 breaks the connection to the PAN1780, although they are available in the device manager view. 5.2.2 FTDI USB UART Depending on the operating system that is used, drivers for the FTDI USB UART might not be installed automatically. If in doubt, please check the FTDI website and install the drivers manually. For further information please visit https://www.ftdichip.com/Drivers/VCP.htm. 5.2.3 Segger J-Link SWD Debugger Depending on the operating system that is used, drivers for Segger J-Link SWD debugger might not be installed automatically. If in doubt, please check the Segger website and install the drivers manually. For further information please visit https://www.segger.com/downloads/jlink/. 5.3 Software Examples The PAN1780 USB evaluation board is delivered without any preinstalled software examples, but the following chapters describe how to use the recommended development environment and the Nordic Semiconductors Software Development Kit (SDK) to run different kinds of software examples. 5.4 Getting Toolchain 5.4.1 Segger Embedded Studio The Segger Embedded Studio is an integrated development environment (IDE) for developers, which is free to use for Nordic Semiconductor devices. Segger Embedded Studio comes with project management tools and supports ARM Cortex devices. 1. Visit the website https://www.segger.com/. 2. Click Downloads (1) and select Embedded Studio (2). Module Integration Guide Rev. 1.1 Page 23 of 48 PAN1780 Bluetooth Module 3. Select a preferred version and operating system and download it. 5 Getting Started 4. Install Segger Embedded Studio IDE from the downloaded file. After opening Segger Embedded Studio for the first time, it will show a manage li-
5. Click Activate Your Free License, because Segger Embedded Studio will be used with cense window. a Nordic Semiconductor device. Segger Embedded Studio will lead to the Embedded Studio License Activation. 6. Fill in the form and request the license. Module Integration Guide Rev. 1.1 Page 24 of 48 PAN1780 Bluetooth Module 7. The license key will be send to the mail address that has been given. Copy the License Activation Key from that mail. 5 Getting Started 8. Open Segger Embedded Studio. 9. Click on the tab Tools (1) and select Licence Manager (2). 10. Click Activate Embedded Studio. Module Integration Guide Rev. 1.1 Page 25 of 48 PAN1780 Bluetooth Module 11. Enter the License Activation Key. 5 Getting Started Now the Segger Embedded Studio receives this non-commercial license to be used solely with Nordic Semiconductors devices. A detailed guide, how to use Segger Embedded Studio, is available on YouTube. Search for SEGGER Embedded Studio Getting started. Other IDEs and tools that can be used with Nordics nRF5 SDK are Keil, IAR, and GCC. For detailed information please refer to Nordic Semiconductors infocenter infocenter.nordicsemi.com. Module Integration Guide Rev. 1.1 Page 26 of 48 PAN1780 Bluetooth Module 5.4.2 Nordic nRF Connect 5 Getting Started 1. Visit the website https://www.nordicsemi.com/. 2. Search for nRF Connect for Desktop: Software and tools (1) > Development tools (2) > nRF Connect for Desktop (3). The download page will be shown. 3. Click on the tab Downloads (1) and click Download file (2). 4. Install nRF Connect for Desktop. Module Integration Guide Rev. 1.1 Page 27 of 48 PAN1780 Bluetooth Module 5.4.3 Nordic SDK 5 Getting Started 1. Visit the website https://www.nordicsemi.com/. 2. Search for nRF5 SDK: Software and tools (1) > Bluetooth software (2) > nRF5 SDK (3). The download page will be shown. 3. Click on the area Download latest version, nRF5 SDK. 4. Extract the zipped SDK to a working directory. Module Integration Guide Rev. 1.1 Page 28 of 48 PAN1780 Bluetooth Module The extracted folder gives an overview about the nRF5 SDK. 5 Getting Started For detailed information about hardware drivers, libraries, software examples, user guides, and data structures:
1. Open the folder documentation. 2. Open the file index.html. The Nordic Semiconductor infocenter will give detailed information about the SDK. 5.4.3.1 Other Nordic SDKs Other SDKs available for the PAN1780 are: nRF SDK for Mesh and nRF SDK for Thread and Zigbee. Downloads of this Nordic SDKs are available on Nordic Semiconductors website https://www.nordicsemi.com. For detailed information about the SDK please visit Nordic Semiconductors infocenter https://infocenter.nordicsemi.com. 5.4.4 Mobile Apps Nordic Semiconductors provides different mobile apps for Android devices in Google Play Store and iOS devices in Apple App Store. The following overview shows briefly the purpose of these apps, recommended for using with PAN1780 ETU. App Description nRF Connect App that allows, to scan for Bluetooth devices and communicate with them. nRF Toolbox Container app for the most popular Bluetooth accessories, also including over-the-air Device Firmware Update. nRF Blinky Simple app to give a good starting point for app development nRF UART Bluetooth app for UART service Module Integration Guide Rev. 1.1 Page 29 of 48 PAN1780 Bluetooth Module For an exemplary use of the nRF Blinky mobile app with PAN1780 see 5.5.3 nRF Blinky Mobile App or visit Nordic Semiconductors website https://www.nordicsemi.com/. 5 Getting Started 5.5 Getting Started This chapter gives an overview about the basic usage of the previously downloaded and installed tools, needed for using examples from SDK in first step and development of own software in next step. 5.5.1 nRF Connect for Desktop The following description shows how to flash a precompiled example *.hex-file from Nordics nRF5 SDK with nRF Connect for Desktop. The following requirements must be met:
nRF Connect for Desktop is installed on PC. The PAN1780 evaluation board is connected via USB cable on USB port X2 to the PC. Module Integration Guide Rev. 1.1 Page 30 of 48 PAN1780 Bluetooth Module 1. Open nRF Connect for Desktop. 2. Click Open to use the programmer module. 5 Getting Started 3. Select the preferred device in the drop down menu (1). Please see Segger ID on bottom of the PAN1780 ETU. 4. Click Add HEX file (2). 5. Add the example .hex-file from Nordic SDK folder nRF5_SDK_16.0.0_98a08e2 >
examples > peripheral > blinky > hex (2) with the designation blinky_pca10056.hex. 6. After the .hex-file was loaded successfully in nRF Connect, click Erase & write (3). Now the blinky application will be flashed on the PAN1780 ETU. The LEDs LED1, LED2, LED3, and LED4 will start to blink. Module Integration Guide Rev. 1.1 Page 31 of 48 PAN1780 Bluetooth Module 5.5.2 Segger Embedded Studio 5 Getting Started The following description shows how to start developing with PAN1780 and Segger Embedded Studio. 1. Open Segger Embedded Studio IDE. 2. Click File and select Open Solution. 3. Open the solution blinky_pca10056.emProject in the Nordic SDK folder nRF5_SDK_16.0.0_98a08e2 > examples > peripheral > blinky > pca10056 > blank >
ses. 4. Open the file main.c (1). 5. Change the code in line 70 nrf_delay_ms(500) to nrf_delay_ms(100) (2) and press F5 . Module Integration Guide Rev. 1.1 Page 32 of 48 PAN1780 Bluetooth Module 6. After flashing the software example press the button start in IDE. 5 Getting Started The blinky application will start. The LEDs LED1, LED2, LED3, and LED4 will start to blink much faster than in previous example from .hex-file ( 5.5.1 nRF Connect for Desktop). 5.5.3 nRF Blinky Mobile App The following requirements must be met:
PAN1780 ETU is powered via USB connector X2. stalled. Nordic Semiconductors app nRF Blinky from Apple App Store or Google Play Store is in-
The application ble_app_blinky_pca10056_s140.hex from SDK folder nRF5_SDK_16.0.0_98a08e2 > examples > ble_peripheral > ble_app_blinky > hex is flashed to PAN1780 device 5.4.2 Nordic nRF Connect. If the app nRF blinky is running on PAN1780, LED1 is solid ON. Module Integration Guide Rev. 1.1 Page 33 of 48 PAN1780 Bluetooth Module 1. Open the mobile app nRF Blinky. 2. Connect to the device Nordic_Blinky. 5 Getting Started LED1 will switch OFF and LED2 will be solid ON now. Now the mobile app nRF Blinky can be used for demonstrating communication. 1. Click on the slider (1) to toggle the LED3 on PAN1780 ETU. 2. The button SW1 on PAN1780 can be pressed, to send status of the button to the mobile app (2). Module Integration Guide Rev. 1.1 Page 34 of 48 PAN1780 Bluetooth Module In parallel a terminal can be used, to get information about the current status from module via UART:
5 Getting Started 1. Connect the PAN1780 on USB port X2 to the PC. 2. Open the COM port of PAN1780 with the following configuration:
Baud 115200 Data 8 Parity N Stop 1 Module Integration Guide Rev. 1.1 Page 35 of 48 PAN1780 Bluetooth Module 6 Regulatory and Certification Information 6 Regulatory and Certification Information 6.1 General Certification Information Regulatory certifications are valid for the following radio relevant software:
Nordic Soft Device S140 or S113 Bluetooth Specification 5 For further certification requests for other radio software please contact Panasonic 8 Contact Details. 6.2 Federal Communications Commission (FCC) for US 6.2.1 FCC Statement The following FCC statement has to be printed in the OEM end product user information:
The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Module Integration Guide Rev. 1.1 Page 36 of 48 PAN1780 Bluetooth Module 6.2.2 Caution 6 Regulatory and Certification Information The following FCC caution has to be printed in the OEM end product user information:
The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception (which can be determined by turning the equipment off and on) the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna, Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver, connected, Consult the dealer or an experienced radio/TV technician for help. Module Integration Guide Rev. 1.1 Page 37 of 48 PAN1780 Bluetooth Module 6.2.3 Label Requirements 6 Regulatory and Certification Information The following labelling requirements have to be implemented on the OEM end product:
The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC notice above. The FCC identifier is FCC ID: T7V1780. This FCC identifier is valid for the PAN1780. The end product must in any case be labelled on the exterior with:
"Contains FCC ID: T7V1780"
Due to the PAN1780 model size, the FCC identifier is displayed in the installation instruction only and it cannot be displayed readable on the modules label due to the limited size. 6.2.4 Antenna Warning The following Antenna has to be followed by the OEM:
This antenna warning refers to the device with the model number PAN1780. The device is tested with a integrated antenna listed below. When integrated into the OEMs product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. 6.2.5 Approved Antenna List Item Part Number Manufacturer Frequency Band Type Max. Gain (dBi) 1 ANT016008LCS2442MA1 TDK 2.4GHz Chip antenna
-1.0 Module Integration Guide Rev. 1.1 Page 38 of 48 PAN1780 Bluetooth Module 6.2.6 RF Exposure 6 Regulatory and Certification Information To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed 6.2.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN1780 with a mounted ceramic antenna
(FCC ID: T7V1780) is below the FCC radio frequency exposure limits. Nevertheless, the PAN1780 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. Module Integration Guide Rev. 1.1 Page 39 of 48 6.3 PAN1780 Bluetooth Module Innovation, Science, and Economic Development (ISED) for Canada 6 Regulatory and Certification Information The following IC rules have to be followed by end product OEMs:
The PAN1780 is licensed to meet the regulatory requirements of ISED. English License ID:
IC: 216Q-1780 HVIN:
ENW89854A1KF Due to the model size, the IC identifier is displayed in the installation instruction and on the package label only. It cannot be displayed readable on the modules label due to the limited size. Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in Approved Antenna List, having a maximum gain of -1.0dBi. Antennas not included in this list or having a gain greater than -1.0 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter without the need of re-assessment of conformity by ISED. The end customer has to assure that the device has a distance of more than 15mm from the human body under all circumstances. If the end customer application intends to use the PAN1780 in a distance smaller 15mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to ISED. Module Integration Guide Rev. 1.1 Page 40 of 48 PAN1780 Bluetooth Module 6 Regulatory and Certification Information PAN1780 est garanti conforme aux dispositions rglementaires dIndustry Canada (ISED). French License:
HVIN:
IC: 216Q-1780 ENW89854A1KF Il est recommand aux fabricants dappareils fixes, mobiles ou portables de consulter la rglementation en vigueur et de vrifier la conformit de leurs produits relativement aux limites dexposition aux rayonnements radiofrquence ainsi quau dbit dabsorption spcifique maximum autoris. Des informations pour les utilisateurs sur la rglementation Canadienne concernant lexposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a t dvelopp pour fonctionner spcifiquement avec les antennes listes dans le tableau Approved Antenna List, prsentant un gain maximum de -1.0dBi. Des antennes autres que celles listes ici, ou prsentant un gain suprieur -1.0dBi ne doivent en aucune circonstance tre utilises en combinaison avec ce produit. Limpdance des antennes compatibles est 50 Ohm. Lantenne utilise avec ce produit ne doit ni tre situe proximit dune autre antenne ou dun autre metteur, ni tre utilise conjointement avec une autre antenne ou un autre metteur. En raison de la taille du produit, lidentifiant IC est fourni dans le manuel dinstallation. Le client final doit s'assurer que l'appareil se trouve en toutes circonstances une distance de plus de 15 mm du corps humain. Si le client final envisage une application ncessitant d'utiliser le PAN1780 une distance infrieure 15 mm du corps humain, alors le FEO doit rpter l'valuation DAS. L'quipement du client final doit rpondre aux exigences actuelles de scurit et de sant selon lISED. Module Integration Guide Rev. 1.1 Page 41 of 48 PAN1780 Bluetooth Module IC Notice 6.3.1 6 Regulatory and Certification Information The following IC notice has to be printed in English and French in the OEM end product user information:
The device PAN1780, including the integrated antenna mentioned in 6.2.5 Approved Antenna List, complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil PAN1780, les antennes y compris 6.2.5 Approved Antenna List est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
1. L'appareil ne doit pas produire de brouillage, et 2. L'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. English French Module Integration Guide Rev. 1.1 Page 42 of 48 PAN1780 Bluetooth Module 6.3.2 Labeling Requirements 6 Regulatory and Certification Information The following IC labelling requirements have to be followed by end product OEMs:
English Labeling Requirements The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is: IC: 216Q-1780 This IC identifier is valid for the PAN1780 module. In any case, the end product must be labelled on the exterior with:
French
"Contains IC: 216Q-1780 Obligations dtiquetage Les fabricants dquipements dorigine (FEO) en anglais Original Equipment Manufacturer (OEM) doivent sassurer que les obligations dtiquetage IC du produit final sont remplies. Ces obligations incluent une tiquette clairement visible lextrieur de lemballage externe, comportant lidentifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L identifiant IC est: IC: 216Q-1780 Cet identifiant est valide pour module PAN1780. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante:
"Contient IC: 216Q-1780 Module Integration Guide Rev. 1.1 Page 43 of 48 PAN1780 Bluetooth Module 6 Regulatory and Certification Information 6.4 European Conformity According to RED (2014/53/EU) All modules described in this Module Integration Guide comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with RED (2014/53/EU) articles. Standards Due to the model size, the CE marking is displayed in the installation instruction and on the package label only. It cannot be displayed according to regulation (EU) No. 765/2008 in 5mm height on the modules label due to the limited space. The end product OEM has to re-assess the conformity of the end product to EU regulations, but can use the PAN1780 RED pre-assessment to shorten this procedure. The RED EU Type Examination Certificate No. T818666M-01 issued by the Notified Body 0682 can be used for the OEM end product conformance assessment. If a Notified Body has been contracted for the end product conformity assessment, it should be noted that this EU Type Examination Certificate should be used for conformance assessment. As a result of the OEM end product conformity assessment procedure described in 2014/53/EU Directive and other applicable EU directives, the end customer equipment should be labelled as follows:
The requirements for CE marking are described in regulation (EU) No. 765/2008 Annex II. The end customer has to assure that the device has a distance of more than 5mm from the human body under all circumstances. If the end customer application intends to use the PAN1780 in a distance smaller 5mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to RED. PAN1780 and its model versions in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey. Module Integration Guide Rev. 1.1 Page 44 of 48 PAN1780 Bluetooth Module 6.5 Bluetooth 6 Regulatory and Certification Information For Bluetooth end products which integrate the PAN1780 the OEM needs to apply for an own end product listing (EPL) at the Bluetooth SIG. If the PAN1780 is used on more than one OEM product, costs can be saved by applying for a family EPL. For the end product EPL the following IDs can be used in order to avoid re-testing:
Bluetooth 5 Declaration ID Component (Tested) Component (Tested) End Product TBD TBD TBD Bluetooth Marks According to the Bluetooth SIG, the PAN1780 fulfills the criteria to label your product as a Bluetooth device:
QDID TBD TBD TBD For further information please refer to the Bluetooth website www.bluetooth.com Module Integration Guide Rev. 1.1 Page 45 of 48 PAN1780 Bluetooth Module 7 Restricted Use 7.1 Life Support Policy 7 Restricted Use This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. 7.2 Restricted End Use This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end-user or any end-use prohibited by the European Union, United States or any other applicable law is strictly prohibited. Module Integration Guide Rev. 1.1 Page 46 of 48 PAN1780 Bluetooth Module 8 Contact Details 8.1 Contact Us 8 Contact Details Please contact your local Panasonic Sales office for details on additional product options and services:
For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic website Sales & Support to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 8.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents:
For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Module Integration Guide Rev. 1.1 Page 47 of 48 PAN1780 Bluetooth Module 8 Contact Details Module Integration Guide Rev. 1.1 Page 48 of 48
| 1 2 3 4 5 | User manual | Users Manual | 1.14 MiB | February 04 2022 |
PAN1770 Bluetooth Low Energy Module Product Specification Rev. 1.0 Wireless Connectivity PAN1770 Bluetooth Module Overview Bluetooth The PAN1770 is a Bluetooth 5.1 Low Energy (LE) module based on the Nordic nRF52840 single chip controller. Features Surface mount type dimensions:
15.6mm 8.7mm 2.05 mm Same form factor as PAN1026A and PAN1762 but smaller pitch and more pins Nordic nRF52840 featuring ARM Cortex-M4F Bluetooth 5.1 LE including LE 2M and LE Coded with 64MHz PHY Embedded 1MB flash memory and 256kB internal RAM Includes ARM TrustZone CryptoCell 310 and supports secure boot including Root of Trust (RoT) Up to 48 General Purpose I/Os (GPIO), which are shared by up to 4SPI, 2IC, 2UART, 4PWM, 8ADC, 1 NFC-A, 32kHz IN/OUT, nRESET USB 2.0 full-speed device interface Built in temperature sensor LE 2Mbps high speed PHY, LE long range coded PHY LE advertising extensions (advertising on 40 channels total) Channel selection algorithm #2 LE secure connections Over-the-air update of application software Qualified Bluetooth mesh profile stack Characteristics Typical sensitivity: -95dBm at 1Mb/s and -103dBm at 125kb/s Typical max. output power: 8dBm, configurable from -20dBm in 4dB steps and -40dBm in whisper mode Typical current consumption: 4.8mA in Tx
(at 0dBm) and 4.8mA in Rx mode Typical current consumption: 0.4A in System OFF mode, 1.5A with RTC wake up On-module DC-DC and LDO regulators with automated low current modes Voltage range: 1.7V to 5.5V Temperature range: -40C to 85C Block Diagram Product Specification Rev. 1.0 Page 2 of 41 PAN1770 Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2022. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Document Acceptance By signing the Product Specification, you acknowledge that you are a legal representative for your company and that you understand and accept the validity of the contents herein. If the signed version of the Product Specification has not been returned to Panasonic within 30 days after receipt of the product, the specification or approval sheet shall be deemed to be accepted by you. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status Engineering Samples. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 1.0 Page 3 of 41 PAN1770 Bluetooth Module Product Change Notifications (PCNs) and Information Notes (INs) Please consider the following PCNs/INs and take suitable countermeasures where necessary and appropriate; for further details please contact your local Panasonic Sales office ( 7.2.1 Contact Us):
Panasonic IN-034C - APPROTECT vulnerability Nordic IN141 V1.1 solution of the vulnerability problem by new HW/SW Information on Software The PAN1770 module does not contain any software ex works, i.e. software is provided by 3rd party suppliers only. The essential software resources can be found on the partner website of Nordic Semiconductor https://www.nordicsemi.com/. PIDEU provides a factory software programming service for your customized firmware; for further information please reach out to your local sales contact this regarding 7.2.1 Contact Us. Product Specification Rev. 1.0 Page 4 of 41 PAN1770 Bluetooth Module Table of Contents About This Document ......................................................................................................................... 6 Purpose and Audience .............................................................................................................. 6 1.1 Revision History ......................................................................................................................... 6 1.2 Use of Symbols ......................................................................................................................... 6 1.3 Related Documents ................................................................................................................... 6 1.4 2 Overview .............................................................................................................................................. 7 Block Diagram ........................................................................................................................... 8 Pin Configuration ....................................................................................................................... 9 Peripherals .............................................................................................................................. 12 Bluetooth Features .................................................................................................................. 12 2.1 2.2 2.3 2.4 Detailed Description ......................................................................................................................... 13 Dimensions .............................................................................................................................. 13 3.1 Footprint .................................................................................................................................. 14 3.2 Packaging ................................................................................................................................ 15 3.3 Case Marking .......................................................................................................................... 18 3.4 Specification ..................................................................................................................................... 19 Default Test Conditions ........................................................................................................... 19 4.1 Absolute Maximum Ratings ..................................................................................................... 19 4.2 Recommended Operating Conditions ...................................................................................... 20 4.3 Current Consumption............................................................................................................... 20 4.4 Bluetooth ................................................................................................................................. 21 4.5 Access Port Protection APPROTECT...................................................................................... 22 4.6 Antenna Placement Recommendation .................................................................................... 23 4.7 Reliability Tests ....................................................................................................................... 24 4.8 Recommended Soldering Profile ............................................................................................. 25 4.9 Cautions ............................................................................................................................................ 26 Design Notes ........................................................................................................................... 26 5.1 Installation Notes ..................................................................................................................... 26 5.2 Usage Condition Notes ............................................................................................................ 27 5.3 Storage Notes .......................................................................................................................... 27 5.4 5.5 Safety Cautions ....................................................................................................................... 27 5.6 Other Cautions ........................................................................................................................ 28 Restricted Use ......................................................................................................................... 29 5.7 Regulatory and Certification Information ....................................................................................... 30 Regulatory and Certification Information BLE .......................................................................... 30 6.1 RoHS and REACH Declaration ............................................................................................... 39 6.2 Appendix ........................................................................................................................................... 40 7.1 Ordering Information ................................................................................................................ 40 Contact Details ........................................................................................................................ 41 7.2 Product Specification Rev. 1.0 Page 5 of 41 1 3 4 5 6 7 PAN1770 Bluetooth Module 1 About This Document 1.1 Purpose and Audience 1 About This Document This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1770 module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as the PAN1770 or the module within this document. 1.2 Revision History Revision Date Modifications/Remarks 1.0 2022-01-14 First preliminary version 1.3 Use of Symbols Symbol Description Note Attention Example:
Indicates important information for the proper use of the product. Non-observance can lead to errors. Indicates important notes that, if not observed, can put the products functionality at risk.
[chapter number]
[chapter title]
Cross reference Indicates cross references within the document. Description of the symbols used in this document 1.3 Use of Symbols. 1.4 Related Documents For related documents please refer to the Panasonic website 7.2.2 Product Information. Product Specification Rev. 1.0 Page 6 of 41 PAN1770 Bluetooth Module 2 Overview 2 Overview The PAN1770 is a Bluetooth 5.1 Low Energy (LE) module based on the Nordic nRF52840 single-chip controller. The Bluetooth 5.1 features additionally a higher symbol rate of 2Mbps using the high-speed LE 2M PHY or a significantly longer range using the LE coded PHY at 500kb/s or 125kb/s. The new channel selection algorithm (CSA#2) improves the performance in high interference environments. Furthermore, the new LE advertising extensions allow for much larger amounts of data to be broadcasted in connectionless scenarios. An output power of up to 8dBm and the high sensitivity of the nRF52840 in combination with the LE coded PHY make the module very attractive in applications, where a long range is required. In addition, the ultra-low current consumption of the PAN1770 make the module an ideal choice for battery powered devices. With the Cortex M4F processor, 256 kB RAM and the build-in 1MB flash memory the PAN1770 can easily be used in standalone mode, thereby eliminating the need for an external processor, saving complexity, space, and cost. The rich set of security features from the ARM TrustZone CryptoCell 310 security subsystem provide the necessary means for secure device operation in the IoT space. The PAN1770 also supports Type 2 Near Field Communication (NFC-A) for use in simplified pairing and payment solutions (external antenna required). For related documents please refer to 7.2.2 Product Information. For further information on the variants and versions please refer to 7.1 Ordering Information. Product Specification Rev. 1.0 Page 7 of 41 PAN1770 Bluetooth Module 2.1 Block Diagram 2 Overview Product Specification Rev. 1.0 Page 8 of 41 PAN1770 Bluetooth Module 2.2 Pin Configuration Pin Assignment Top View 2 Overview Pin Functions No. Pin Name Pin Type Description A1 P0.27 A2 P0.26 Digital BI Digital BI GPIO GPIO A3 P0.04/AIN2 Digital BI/Analog Input GPIO/Sensor to ADC A4 P0.05/AIN3 Digital BI/Analog Input GPIO/Sensor to ADC A5 P0.03/AIN1 Digital BI/Analog Input GPIO/Sensor to ADC A6 P0.02/AIN0 Digital BI/Analog Input GPIO/Sensor to ADC A7 P0.29/AIN5 Digital BI/Analog Input GPIO/Sensor to ADC A8 NFC2 A9 NFC1 A10 GND A12 GND A13 GND B1 P0.06 B2 X32k_OUT RF NFC BI RF NFC BI Ground Ground Ground Digital BI 32kHz Connect to NFC Antenna Connect to NFC Antenna Connect to ground Connect to ground Connect to ground GPIO Leave open B3 P0.30/AIN6 Digital BI/Analog Input GPIO/Sensor to ADC Product Specification Rev. 1.0 Page 9 of 41 G1G2G3G4G5G6G7G8G9G10F1F2F3F4F5F6F7F8F9F10E1E2E3E4E5E6E7E8E9E10D1D2D3D4D5D6D7D8D9D10C1C2C3C4C5C6C7C8C9C10B1B2B3B4B5B6B7B8B9B10A2A3A4A5A6A7A8A9A10A12A13G12G13A1 PAN1770 Bluetooth Module 2 Overview No. Pin Name Pin Type Description B4 P0.31/AIN7 Digital BI/Analog Input GPIO/Sensor to ADC B5 P0.28/AIN4 Digital BI/Analog Input GPIO/Sensor to ADC C2 X32k_IN B6 P1.13 B7 P1.10 B8 P1.06 B9 P1.15 B10 GND C1 P0.08 C3 P1.03 C4 GND C5 GND C6 P1.14 C7 P1.11 C8 P1.12 C9 P1.05 C10 GND D1 GND D2 P1.08 D4 GND D5 GND D6 P0.24 D7 P1.02 D8 P1.07 D9 GND D10 GND E3 GND E4 P0.17 E5 P0.23 E6 P0.20 Digital BI Digital BI Digital BI Digital BI Ground Digital BI 32kHz Digital BI Ground Ground Digital BI Digital BI Digital BI Digital BI Ground Ground Digital BI Ground Ground Digital BI Digital BI Digital BI Ground Ground Ground Digital BI Digital BI Digital BI GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO Connect to ground GPIO Leave open GPIO Connect to ground Connect to ground Connect to ground Connect to ground Connect to ground Connect to ground Connect to ground Connect to ground Connect to ground E1 LV Mode Supply Voltage 1.7V to 3.6V E2 P1.09/TRCDAT3 Digital BI GPIO or Trace IF D3 D3 P0.07/TRCCLK Digital BI GPIO or Trace IF Clock Product Specification Rev. 1.0 Page 10 of 41 PAN1770 Bluetooth Module 2 Overview No. Pin Name Pin Type Description Serial Wire Debug IF Clock Leave unconnected F1 P0.12/TRCDAT1 Digital BI GPIO or Trace IF D1 F2 P0.11/TRCDAT2 Digital BI GPIO or Trace IF D2 Digital BI Digital BI Digital BI Digital BI Digital BI Digital BI Digital BI Digital BI Digital BI Digital BI Ground Digital BI USB D+
USB D-
Digital I Ground Ground Ground GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO Connect to ground Use for USB only Use for USB only Reset Signal Low Active Connect to ground Connect to ground Connect to ground G2 HV Mode Supply Voltage 2.5V to 5.5V (optional) G3 GND Ground Connect to ground G4 USB Mode Supply Voltage 4.35V to 5.5V G8 P1.00/TRCDAT0 Digital BI GPIO or Trace IF D0 G9 SWDIO Digital BI Serial Wire Debug IF Data E7 P0.21 E8 SWDCLK E9 P1.04 E10 NC F3 P0.13 F4 P0.14 F5 P0.15 F6 P0.19 F7 P1.01 F8 P0.25 F9 P0.22 F10 GND G1 P0.16 G5 DP G6 DM G7 nRESET G10 GND G12 GND G13 GND Product Specification Rev. 1.0 Page 11 of 41 2 Overview PAN1770 Bluetooth Module 2.3 Peripherals I2C, I2S, SPI (32MHz) Full-speed USB 2.0 device controller 2 UART (2 or 4 wire with CTS/RTS, 1 200 up to 1 M baud) QSPI (32MHz) PWM PDM AES and CRYPTOCELL 8 channel 12bit ADC Comparator Quadrature decoder Temperature sensor Real time counter Watchdog timer 48 PIOs Integrated 32kHz crystal 2.4 Bluetooth Features Bluetooth LE 5 Supports Bluetooth LE 5 high speed and long range modes Product Specification Rev. 1.0 Page 12 of 41 PAN1770 Bluetooth Module 3 Detailed Description 3.1 Dimensions 3 Detailed Description All dimensions are in millimeters. Top View No. Item Dimension Tolerance Remark 1 Width 2 Length 3 Height 8.70 15.60 2.05 0.30 0.30 0.30 With U.FL connector Product Specification Rev. 1.0 Page 13 of 41 3 Detailed Description PAN1770 Bluetooth Module 3.2 Footprint All dimensions are in millimeters. Top View Product Specification Rev. 1.0 Page 14 of 41 G1G2G3G4G5G6G7G8G9G10F1F2F3F4F5F6F7F8F9F10E1E2E3E4E5E6E7E8E9E101.10D1D2D3D4D5D6D7D8D9D10C1C2C3C4C5C6C7C8C9C10B1B2B3B4B5B6B7B8B9B101.001.10A2A3A4A5A6A7A8A92.20A10A121.40A13G12G130.6015.608.701.051.05A1 3 Detailed Description The module is a mass production status product and will be delivered in the package described below. PAN1770 Bluetooth Module 3.3 Packaging 3.3.1 Tape Dimensions 3.3.2 Packing in Tape Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.0 Page 15 of 41 trailer (empty)1 x circumference /hub(min 160mm)component packed areastandard 1500pcsleader (empty)minimum 10 pitchTop cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules.Direction of unreeling (for customer) PAN1770 Bluetooth Module 3.3.3 Component Direction 3 Detailed Description 3.3.4 Reel Dimension Product Specification Rev. 1.0 Page 16 of 41 Direction of unreeling(for customer)Pin 1 Marking(Top Side) PAN1770 Bluetooth Module 3.3.5 Package Label Example:
3 Detailed Description Customer order number, if applicable
(1T)
(1P)
(2P)
(9D)
(Q) Lot code Order number Date code Quantity
(HW/SW) Hardware/software version 3.3.6 Total Package Product Specification Rev. 1.0 Page 17 of 41 PAN1770 Bluetooth Module 3.4 Case Marking Example:
3 Detailed Description 1 Brand name 2 Hardware/software version 3 Order number 4 Lot code 5 Status: ES or empty for MP 6 2D barcode, for internal usage only 7 Marking for Pin 1 8 Bluetooth logo Product Specification Rev. 1.0 Page 18 of 41 PAN1770 Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature:
Humidity:
Supply Voltage:
25C 10C 40% to 85% RH 3.3V 4.2 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Unit I/O Pin Voltage on any Pin VDD 3.6 V VDD + 0.3 VDD VDDH VBUS Normal Supply Voltage High Supply Voltage USB Bus Voltage ESD ESD Robustness HBM 1C VDD > 3.6 V CDM MSL PRF Moisture Sensitivity Level RF Input Level TSTOR Storage Temperature
-0.3
-0.3
-0.3
-0.3
-0.3
-40 V
+3.9
+5.8
+5.8 3.9 1 000 500 1
+10 dBm
+125 C Product Specification Rev. 1.0 Page 19 of 41 PAN1770 Bluetooth Module 4.3 Recommended Operating Conditions 4 Specification The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Unit VDD (LV Mode) Supply Voltage tR_ VDD Supply Rise Time 0V to 1.7V VDD-POR Supply Voltage Power On Reset active VDDH (HV Mode) Supply Voltage VDDH - Optional tR_VDDH VBUS VI/O TA Supply Rise Time VBUS USB Supply Voltage Max I/O Pin Voltage 0V to 3.7V VBUS - Optional VDD 3.6V VDD 3.6V Operating Temperature 1.7 1.75 2.5 4.35
-0.3 VDD + 0.3 V VDD + 3.9
-40 25 85 C 3.6 V 60 ms 5.5 V 100 ms 5.5 V 4.4 Current Consumption The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD = 3.3V, Tamb = 25C, if nothing else stated, DC/DC enabled. Parameter Condition Min. Typ. Max. Unit Sleep Mode No RAM retention, Wake on Reset, SYS OFF Full RAM retention, Wake on Reset, SYS OFF No RAM retention, Wake on any event, SYS ON Full RAM retention, Wake on any event, SYS ON No RAM retention, Wake on RTC, SYS ON CPU executing CoreMark Running from RAM Running from Flash Rx Current 0.4 1.86 0.97 2.35 1.5 2.8 3.3 4.8 A A A A A mA mA mA Product Specification Rev. 1.0 Page 20 of 41 PAN1770 Bluetooth Module 4 Specification Parameter Condition Min. Typ. Max. Unit Tx Current 8dBm 4dBm 0dBm
-4dBm
-8dBm
-12dBm
-16dBm
-20dBm
-40dBm 14.8 9.6 4.8 3.1 3.3 3.0 3.8 2.7 2.3 mA mA mA mA mA mA mA mA mA 4.5 Bluetooth Parameter Frequency Data Rate Specification 2 402MHz to 2 480MHz 2Mbps, 1Mbps, 500kbps, 125kbps Number of Channels 40: 37 data/3 advertising (0, 12, 39) Receive Sensitivity
-103dBm (125kbps Bluetooth LE mode), -95dBm (1Mbps Bluetooth LE mode), -92 (2Mbps Bluetooth LE mode) Output Power
-40dBm to +8dBm Link Budget Up to 111dB Product Specification Rev. 1.0 Page 21 of 41 PAN1770 Bluetooth Module 4 Specification 4.6 Access Port Protection APPROTECT If using the APPROTECT version of the PAN1770 with order code ENW89854C2KF the following items according to Nordic IN141 V1.1 have to be considered. Access port protection:
In factory state, the PAN1770 with order code ENW89854C2KF implementing Nordic nRF52840 revision 3 silicon comes with the access port protection enabled. An ERASEALL command via the control access port (CTRL-AP) is required to enable access. In order to lock the device debug port, execute the following steps to enable the access port protection:
1. Start with a CTRL-AP ERASEALL operation. 2. Program code compiled with MDK 8.40.2 or later, with ENABLE_APPROTECT defined. 3. Write Enabled (0x00) to UICR.APPROTECT 4. Perform a hard reset to protect the device. The programmed code from step 2 will write APPROTECT.FORCEPROTECT to Force (0x00) To unlock device debug port (for debugging etc.), execute the following steps to disable the access port protection:
1. Start with a CTRL-AP ERASEALL operation. 2. Program code compiled with MDK 8.40.2 or later, without ENABLE_APPROTECT defined. 3. Write HwDisabled (0x5A) to UICR.APPROTECT 4. Perform any reset to run the code. The programmed code from step 2 will open access port by writing to APPROTECT.DISABLE during startup. APPROTECT.DISABLE during startup. If a PAN1770 with order code ENW89854C2KF implementing Nordic nRF52840 revision 3 silicon is programmed with software compiled with earlier versions of the MDK than 8.40.2 the debug port will be locked. However, the APPROTECT.FORCEPROTECT will not be written to Force (0x0), and the errata workarounds implemented in the MDK may not be applied to revision 3. Thus, it is required to upgrade to the latest MDK (MDK 8.40.2 or later) to ensure correct behavior. Product Specification Rev. 1.0 Page 22 of 41 PAN1770 Bluetooth Module 4.7 Antenna Placement Recommendation 4 Specification Impact of Placement on the Antenna Radiation Pattern The placement of the antenna, surrounding material, and customer components has an impact on his radiation pattern. It is recommended to use the antenna and U.FL to Reverse Polarity SMA adapter cable listed in 6.1.2.5 Approved Antenna List The following requirements must be met:
Keep this product away from heat. Heat is the major cause of decreasing the life of these products. Keep this product away from other high frequency circuits. Product Specification Rev. 1.0 Page 23 of 41 PAN1770 Bluetooth Module 4.8 Reliability Tests 4 Specification The measurement should be done after the test module has been exposed to room temperature and humidity for one hour. No. Item Limit Condition 1 Variable Vibration Test Electrical parameters should be Freq.: 20~2 000Hz, Acc.: 17-50G, within specification 2 Shock Drop Test 3 Heat-Shock/
Temperature Cycling Test 4 Temperature Humidity Bias Test 5 Low Temperature Storage Life Test 6 High Temperature Storage Life Test Sweep: 8min, 2 hours, For: XYZ axis Drop parts on concrete from a height of 1m for 3 times At -40C and 85C for 1 h/cycle Total = 300 cycles At 60C, 85% r.H., 300h At -40C, 300h At 85C, 300h Product Specification Rev. 1.0 Page 24 of 41 PAN1770 Bluetooth Module 4.9 Recommended Soldering Profile 4 Specification Reflow permissible cycles: 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead-free soldering Product Specification Rev. 1.0 Page 25 of 41 PAN1770 Bluetooth Module 5 Cautions 5 Cautions Failure to follow the guidelines set forth in this document may result in degrading of the module functions and damage to the module. 5.1 Design Notes module. Ratings). 1. Follow the conditions written in this specification, especially the control signals of this 2. The supply voltage should abide by the maximum ratings ( 4.2 Absolute Maximum 3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47F directly at the module). 4. This module should not be mechanically stressed when installed. 5. Keep this module away from heat. Heat is the major cause of decreasing the life time of these modules. 6. Avoid assembly and use of the target equipment in conditions where the module temperature may exceed the maximum tolerance. 7. Keep this module away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board. 5.2 Installation Notes 1. Reflow soldering is possible twice based on the conditions set forth in 4.9 Recommended Soldering Profile. Set up the temperature at the soldering portion of this module according to this reflow profile. 2. Carefully position the module so that the heat will not burn into printed circuit boards or affect other components that are susceptible to heat. 3. Carefully locate the module, to avoid an increased temperature caused by heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover and these modules to occur. 5. This module should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. to the module. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage Product Specification Rev. 1.0 Page 26 of 41 PAN1770 Bluetooth Module 5.3 Usage Condition Notes 5 Cautions 1. Take measures to protect the module against static electricity. If pulses or transient loads (a large load, which is suddenly applied) are applied to the modules, check and evaluate their operation before assembly of the final products. 2. Do not use dropped modules. 3. Do not touch, damage, or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this 5. Electrode peeling strength: Do not apply a force of more than 4.9N in any direction on 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause the soldered module. module. damage. 7. These modules are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 5.4 Storage Notes 1. The module should not be stressed mechanically during storage. 2. Do not store these modules in the following conditions or the performance characteristics of the module, such as RF performance will be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, Storage in direct sunlight, Storage in an environment where the temperature may be outside the range of 5C to 35C, or where the humidity may be outside the 45% to 85% range, Storage of the modules for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 3. Keep this module away from water, poisonous gas, and corrosive gas. 4. This module should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10). 5.5 Safety Cautions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum:
Product Specification Rev. 1.0 Page 27 of 41 PAN1770 Bluetooth Module 1. Ensure the safety of the whole system by installing a protection circuit and a protection 5 Cautions 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. device. Notes. 5.6 Other Cautions 1. Do not use the module for other purposes than those listed in 5.3 Usage Condition 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the module. 3. This module has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These modules are not intended for use under the special conditions shown below. Before using these modules under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner:
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, In direct sunlight, outdoors, or in a dusty environment, In an environment where condensation occurs, In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these modules with new modules, because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 5. For further information please refer to the Panasonic website 7.2.2 Product Information. Product Specification Rev. 1.0 Page 28 of 41 PAN1770 Bluetooth Module 5.7 Restricted Use 5.7.1 Life Support Policy 5 Cautions This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. 5.7.2 Restricted End Use This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end user or any end use prohibited by the European Union, United States or any other applicable law is strictly prohibited. Product Specification Rev. 1.0 Page 29 of 41 PAN1770 Bluetooth Module 6 Regulatory and Certification Information 6 Regulatory and Certification Information 6.1 Regulatory and Certification Information BLE 6.1.1 General Certification Information BLE Regulatory certifications are valid for the following radio relevant software:
Nordic SoftDevice S140, S113 and Wirepas V4.x or V5.x Bluetooth Specification 5 Regulatory certifications stay valid for APPROTECT versions provided that:
If the nRF52840 new silicon revision 3 with access port protection, which is implemented in the PAN1770 with Panasonic order code ENW89854C2KF is used:
Nordic IN141 V1.1 states The new revision has no impact on CE, FCC/ISED or Bluetooth certifications unless the new pulse shaping filter is enabled. FTPAN-254 describes how to enable the pulse shaping filter, but as stated before it needs to remain disabled. Hence the code described in FTPAN-254 shall not be implemented/executed; otherwise the PAN1770 pre-certification becomes invalid. The FTPAN-254 workaround is meant for designs using an PA/LNA RF front end, which is not feasible with the PAN1770. Therefore, it makes no sense to implement FTPAN-254. For further certification requests for other radio software please contact Panasonic 7.2 Contact Details. Product Specification Rev. 1.0 Page 30 of 41 PAN1770 Bluetooth Module 6 Regulatory and Certification Information 6.1.2 Federal Communications Commission (FCC) for US 6.1.2.1 FCC Notice The PAN1770 including the antennas, which are listed in 6.1.2.5 Approved Antenna List, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. 6.1.2.2 Caution The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. There is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna, Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver, connected, Consult the dealer or an experienced radio/TV technician for help. Product Specification Rev. 1.0 Page 31 of 41 PAN1770 Bluetooth Module 6.1.2.3 Label Requirements 6 Regulatory and Certification Information The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V1780. This FCC identifier is valid for the PAN1770. The end product must in any case be labelled on the exterior with:
"Contains FCC ID: T7V1780". Due to the PAN1770 model size, the FCC identifier is displayed in the installation instruction only and it cannot be displayed readable on the modules label due to the limited size. 6.1.2.4 Antenna Warning This antenna warning refers to the test device with the model number PAN1770 7.1 Ordering Information The device is tested with a U.FL to RSMA cable and with the antenna listed below. When integrated into the OEMs product, these antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in 6.1.2.5 Approved Antenna List is the same (FCC ID: T7V1780). 6.1.2.5 Approved Antenna List Item Part Number Manufacturer Frequency Band Type Max. Gain
(dBi) 1 W1030 Pulse 2.4GHz Dipole antenna
+1.4 2016693-x TE Connectivity assembly Product Specification Rev. 1.0 Page 32 of 41 PAN1770 Bluetooth Module 6.1.2.6 RF Exposure 6 Regulatory and Certification Information To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed 6.1.2.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN1770 with a mounted ceramic antenna
(FCC ID: T7V1780) is below the FCC radio frequency exposure limits. Nevertheless, the PAN1770 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. Product Specification Rev. 1.0 Page 33 of 41 PAN1770 Bluetooth Module Innovation, Science, and Economic Development (ISED) for Canada 6.1.3 6 Regulatory and Certification Information English The PAN1770 is licensed to meet the regulatory requirements of ISED. License ID:
IC: 216Q-1780 HVIN:
ENW89854C1KF, ENW89854C2KF Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in 6.1.2.5 Approved Antenna List, having a maximum gain of +1.4dBi. Antennas not included in this list or having a gain greater than +1.4dBi are strictly prohibited for use with this device. The required antenna impedance is 50 . The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to the model size, the IC identifier is displayed in the installation instruction only and it cannot be displayed on the modules label due to the limited size. The end customer has to assure that the device has a distance of more than 15mm from the human body under all circumstances. If the end customer application intends to use the PAN1770 in a distance smaller 15mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to ISED. PAN1770 est garanti conforme aux dispositions rglementaires dIndustry Canada (ISED). French License:
HVIN:
IC: 216Q-1780 ENW89854C1KF, ENW89854C2KF Il est recommand aux fabricants dappareils fixes, mobiles ou portables de consulter la rglementation en vigueur et de vrifier la conformit de leurs produits relativement aux limites dexposition aux rayonnements radiofrquence ainsi quau dbit dabsorption spcifique maximum autoris. Des informations pour les utilisateurs sur la rglementation Canadienne concernant lexposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Product Specification Rev. 1.0 Page 34 of 41 PAN1770 Bluetooth Module 6 Regulatory and Certification Information Ce produit a t dvelopp pour fonctionner spcifiquement avec les antennes listes dans le tableau 6.1.2.5 Approved Antenna List, prsentant un gain maximum de +1.4dBi. Des antennes autres que celles listes ici, ou prsentant un gain suprieur +1.4dBi ne doivent en aucune circonstance tre utilises en combinaison avec ce produit. Limpdance des antennes compatibles est 50 . Lantenne utilise avec ce produit ne doit ni tre situe proximit dune autre antenne ou dun autre metteur, ni tre utilise conjointement avec une autre antenne ou un autre metteur. En raison de la taille du produit, lidentifiant IC est fourni dans le manuel dinstallation. Le client final doit s'assurer que l'appareil se trouve en toutes circonstances une distance de plus de 15 mm du corps humain. Si le client final envisage une application ncessitant d'utiliser le PAN1770 une distance infrieure 15 mm du corps humain, alors le FEO doit rpter l'valuation DAS. L'quipement du client final doit rpondre aux exigences actuelles de scurit et de sant selon lISED. 6.1.3.1 IC Notice English The device PAN1770 ( 7.1 Ordering Information), including the antennas
( 6.1.2.5 Approved Antenna List), complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. French Le prsent appareil PAN1770 ( 7.1 Ordering Information), les antennes y compris ( 6.1.2.5 Approved Antenna List), est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
1. L'appareil ne doit pas produire de brouillage, et 2. L'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Product Specification Rev. 1.0 Page 35 of 41 PAN1770 Bluetooth Module 6.1.3.2 Labeling Requirements English 6 Regulatory and Certification Information Labeling Requirements The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is IC: 216Q-1780. This IC identifier is valid for all PAN1770 modules 7.1 Ordering Information. In any case, the end product must be labelled on the exterior with:
French
"Contains IC: 216Q-1780. Obligations dtiquetage Les fabricants dquipements dorigine (FEO) en anglais Original Equipment Manufacturer (OEM) doivent sassurer que les obligations dtiquetage IC du produit final sont remplies. Ces obligations incluent une tiquette clairement visible lextrieur de lemballage externe, comportant lidentifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L identifiant IC est IC: 216Q-1780. Cet identifiant est valide pour tous les modules PAN1770 7.1 Ordering Information. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante:
"Contient IC: 216Q-1780. Product Specification Rev. 1.0 Page 36 of 41 PAN1770 Bluetooth Module 6.1.4 European Conformity According to RED (2014/53/EU) All modules described in this Product Specification comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with RED (2014/53/EU) articles:
6 Regulatory and Certification Information 3.1a Safety/Health:
EN 62368-1: 2014/AC: 2015/A11: 2017 EN 62479: 2010 3.1b EMC:
EN 301 489-1 V2.2.3: (2019-11) EN 301 489-17 V3.2.2: (2019-02) 3.2 Radio:
EN 300 328 V2.2.2: (2019-07) Due to the model size, the CE marking is displayed in the installation instruction only and it cannot be displayed conform to regulation (EU) No. 765/2008 in 5mm height on the modules label due to the limited space. The RED EU Type Examination Certificate No. T818970P issued by the Notified Body 0682 can be used for the OEM end product conformity assessment. If a Notified Body has been contracted for the end product conformity assessment, it should be noted that this EU Type Examination Certificate should be used for conformance assessment. As a result of the conformity assessment procedure described in 2014/53/EU Directive, the end customer equipment should be labelled as follows:
The requirements for CE marking are described in regulation (EC) No. 765/2008 Annex II. The end customer has to assure that the device has a distance of more than 5mm from the human body under all circumstances. If the end customer application intends to use the PAN1770 in a distance smaller 5 mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to RED. PAN1770 and its model versions in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey. Product Specification Rev. 1.0 Page 37 of 41 PAN1770 Bluetooth Module 6.1.5 Bluetooth 6 Regulatory and Certification Information The final Bluetooth end product listing needs to be created by using the following IDs:
Bluetooth 5.1 End product Declaration ID D050150 QDID 148922 Bluetooth Marks According to the Bluetooth SIG, the PAN1770 fulfills the criteria to label your product as a Bluetooth device:
For further information please refer to the Bluetooth website www.bluetooth.com. Product Specification Rev. 1.0 Page 38 of 41 PAN1770 Bluetooth Module 6.2 RoHS and REACH Declaration 6 Regulatory and Certification Information The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the Downloads section of the respective product 7.2.2 Product Information. Product Specification Rev. 1.0 Page 39 of 41 PAN1770 Bluetooth Module 7 Appendix 7.1 Ordering Information Variants and Versions 7 Appendix Order Number Brand Name Description MOQ1 ENW89854C2KF 2 PAN1770 Bluetooth Low Energy Single Mode with U.FL connector 1 500 Access Port Protection APPROTECT HW Empty Flash 1 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. 2 Samples are available on customer demand. Product Specification Rev. 1.0 Page 40 of 41 PAN1770 Bluetooth Module 7.2 Contact Details 7.2.1 Contact Us 7 Appendix Please contact your local Panasonic Sales office for details on additional product options and services:
For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic website Sales & Support to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 7.2.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents:
For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Product Specification Rev. 1.0 Page 41 of 41
| 1 2 3 4 5 | Label information | ID Label/Location Info | 543.21 KiB | April 23 2020 |
REASONING PANASONIC BT MODUL PAN1780 WITHOUT IC ID ON PRODUCT CAUSED BY SIZE RESTRICTIONS In KDB784748D01V09r01 chapter 3 the FCC states the following:
(3) CERTIFICATION For certification, the product shall bear a nameplate or label with the FCC Identifier (FCC ID), as defined in Section 2.925.13 The FCC ID must always be accessible when using the product. The placement of the FCC ID must be a physical label on the product, unless an e-label is used. Physical FCC ID labels must be located on the surface of the product, or within a user-accessible non-detachable compartment (such as the battery compartment). The label shall be permanently affixed, permitting the device to be positively identified. The font needs to be readily legible, consistent with the dimensions of the equipment and its label area. When the device is so small, or for such use that it is impracticable to label with a font size that is four-points or larger (and the device does not utilize electronic labeling), then the FCC ID shall be placed in the user manual, and the FCC ID shall also be placed either on the device packaging or on a removable label attached to the device Definition of point (pt) A computer point (pt) is the smallest unit of measure in typography. It is a subdivision of the larger pica. The contemporary desktop publishing point (also called the PostScript point) was defined as 72 points to the inch (1 point = 172 inches = 25.472 mm = 0.3527 mm). Conversion 4pt to mm 4pt = 0.3527 x 4mm = 1,4108mm The below dimensioned and magnified graphic shows the product with the actual label and a visualized IC ID printed in 4pt font size. It demonstrates that the IC ID doesnt fit on the label if printed in 4pt. The brand name, product number, lot code and 2D data matrix code are laser printed in a font smaller than 2pt and are intended to be read by machines (scanner) or in a factory using a microscope. This product is intended to be sold to OEMs only. The OEM is obliged to print on the label of the end product containing this BT module the following This product contains transmitter IC: 216Q-1780 3 4 6 7 8 No. Item 1 Series (Brand) PAN1780 Module Laser Marking Description ENW89854A1KF 2 HW/SW Version HW Major Hardware Version: please refer to MS-CS-PAN1780 document SW Major Software Version: please refer to AI document ENW-No. /
Model Name ENW89854A1KF YY - Year WW - Calendar Week Lotcode
(YYWWDLL) D - Day of Week (e.g. Friday is 5) L - Line L - Lot 5 ES Marking Need to be mentioned during ES status (remove ES for MP) Necessity of ES marking will also be stated in the ECN Contains in total 30 characters, seperated by a semicolon. YYWWDLL;HHHHHHHH;89853A1;HW(Minor Version);SW YYWWDLL Production Date Code (see No. 6 above) HHHHHHHH Last eight digits from hexadecimal Panasonic Mac Address (example: 001343ABCDEF) 2D Data Matrix Code 89854A1 Part of the ENW-Number HW(Minor);SW(Minor) Minor Hardware and Minor Software Version, each 2 digits, please refer to MS-CS-PAN1780 and AI Document Pin 1 Mark on Top Side Fix, no change at all BT marking Bluetooth logo
| 1 2 3 4 5 | C2PC letter | Cover Letter(s) | 40.06 KiB | February 04 2022 |
Phone +49 (0) 4131 899-0 Fax +49 (0) 4131 899-120 E-Mail: pideu@eu.panasonic.com www.pideu.panasonic.de Panasonic Industrial Devices Europe GmbH Zeppelinstrae 19, 21337 Lneburg Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Certification and Engineering Bureau Innovation, Science and Economic Development Canada Spectrum Engineering Branch 3701 Carling Avenue, Building 94 Ottawa, Ontario K2H 8S2 Class 2 Permissive Change (C2PC) Request Letter FCC ID: T7V1780, granted on 04/22/20 IC: 216Q-1780, HVIN: ENW89854A1KF, granted on 04/23/20 TO WHOM IT MAY CONCERN Pursuant to CFR 2.1043 and RSP-100 (Issue 12), section 10.2 we, Panasonic Industrial Devices Europe GmbH hereby requests a Class 2 Permissive Change. Reason: New HVINs ENW89854C1KF, ENW89854C21KF with external antenna Modifications:
- New external antenna with +1.4 dBi antenna gain will be added The following new exhibits will be uploaded:
- Test Report and Test Setup Photos
- Schematics and PCB Layout
- User Manual If you have any questions, please feel free to contact us at the address shown below. Sincerely, January 25, 2022 Olaf Knoth Safety Manager Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lueneburg
| 1 2 3 4 5 | Declaration of electrically identical products | Cover Letter(s) | 47.07 KiB | February 04 2022 |
Phone +49 (0) 4131 899-0 Fax +49 (0) 4131 899-120 E-Mail: pideu@eu.panasonic.com www.pideu.panasonic.de Panasonic Industrial Devices Europe GmbH Zeppelinstrae 19, 21337 Lneburg Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Certification and Engineering Bureau Innovation, Science and Economic Development Canada Spectrum Engineering Branch 3701 Carling Avenue, Building 94 Ottawa, Ontario K2H 8S2 ATTESTATION STATEMENT Declaration on Identical Models TO WHOM IT MAY CONCERN We, Panasonic Industrial Devices Europe GmbH, declare on our sole responsibility that the model
<HVIN>: ENW89854A1KF with IC Certification Number: 216Q-1780; FCC ID: T7V-1780 is identical in hardware and software to the models
<HVIN>: ENW89854C1KF and ENW89854C2KF The only differences between the <HVIN> are:
These versions have an external antenna:
Antenna assembly: PULSE W1030 with U.FL to RSMA cable TE Connectivity 2016693-x Product label brand name is changed from PAN1780 to PAN1770 Product label HVIN is changed from ENW89854A1KF to ENW89854C1KF and ENW89854C2KF ENW89854C2KF further has the possibility to use APPROTECT We attest that above changing are not relevant for any RF behaviour subject to regulatory items. Therefore, CTC advanced GmbH Test Report 1-3308_21-01-06 can be used as evidence. If you have any questions, please feel free to contact us at the address shown below. January 25, 2022 Olaf Knoth Safety Manager Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lueneburg
| 1 2 3 4 5 | FCC modular approval letter | Cover Letter(s) | 1008.23 KiB | February 04 2022 |
RSP-100, Issue 12, August 2019 Modular Approval Attestation Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Certification and Engineering Bureau Innovation, Science and Economic Development Canada Spectrum Engineering Branch 3701 Carling Avenue, Building 94 Ottawa, Ontario K2H 8S2 Subject: FCC / ISED Modular Approval Statement Grantee Code Equipment Product Code Check your GC here. Click Grantee Search. Check your CN here. FCC ID:
CN:
(Company Number) HVIN:
(Hardware Version Id. Number) HMN:
(Host Marketing Name) UPN:
(Unique Product Number) PMN:
(Product Marketing Name) FVIN:
(Firmware Version Id. Number) TO WHOM IT MAY CONCERN Pursuant to Paragraphs RSP-100, Issue 12 and CFR 15.212, we herewith declare for our module. Modular approval requirement
(a) The radio elements shall have the radio frequency circuitry shielded. Physical/discrete and tuning capacitors may be located external to the shield, but shall be on the module assembly. Yes No *
*Please provide a detailed explanation if the answer is No.:
(b) If the module has modulation/data input(s), they shall be buffered in order to ensure that the module will comply with the requirements set out in the applicable Radio Standards Specification (RSS) and Part 15 under conditions of excessive data rates or over-modulation.
*Please provide a detailed explanation if the answer is No.:
(c) The module shall have its own power supply regulation on the module itself. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host product that houses the module.
*Please provide a detailed explanation if the answer is No.:
(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in the applicable RSS and rule part. The equipment certification application shall contain:
i. a detailed description of the configuration of highest antenna gain for each type of transmitting antenna for licence-exempt modules;
ii. the maximum transmitting antenna gain for licence modules; and iii. a detailed description of the configuration of lowest antenna gain for each type of receiving antenna for Dynamic Frequency Selection
(DFS) modules with removable antenna(s).
*Please provide a detailed explanation if the answer is No.:
Modular approval requirement
(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration
(i.e. the module shall not be inside another product during testing). Yes No *
*Please provide a detailed explanation if the answer is No.:
(f) The module complies or will comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement (1.1307(b), 1.1310, 2.1091, and 2.1093) in its intended configuration/integration in a host.
*Please provide a detailed explanation if the answer is No.:
(g) The module must be labeled with its permanently affixed label (indicating ISED certification number, HVIN and FCC identifier), or use an electronic display (see KDB Publication 784748 and RSP-100, section 5).
*Please provide a detailed explanation if the answer is No.:
(h) The module must comply with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee.
*Please provide a detailed explanation if the answer is No.:
(i) (Only applicable for FCC) The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b). For further information concerning antenna connectors see: DA-00-1087.
*Please provide a detailed explanation if the answer is No.:
If you have any questions, please feel free to contact us at the address shown below Best regards, Company Name:
Company Address:
Contact Name:
Signature:
Phone:
Fax:
E-mail:
Signature Date:
INFO for applicant: Limited Modolar Approval (LMA) may be granted when one or more of the requirements in the table above cannot be demonstrated. LMA will also be issued in those instances where applicants can demonstrate that they will retain control over the final installation of the device, such that compliance of the end product is assured. In such cases, an operating condition on the LMA for the module must state that the module is only approved for use when installed in devices produced by a specificmanufacturer. When LMA is sought, the application for equipment certification must specifically state how control of the end product, into which the module will be installed, will be maintained, such that full compliance of the end product is always ensured. Document Version 2.1 2020-10-30
| 1 2 3 4 5 | LTC | Cover Letter(s) | 1003.95 KiB | February 04 2022 |
LONG-TERM CONFIDENTIALITY REQUEST for Certification Service in the USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, we request Long-Term Confidentiality for the following product:
Grantee Code Equipment Product Code Check your GC here. Click Grantee Search. FCC ID:
For the product stated above, we request Long-Term Confidentiality for exhibits which contain Block Diagram, Operational Description, Parts List/Tune Up Info, Schematics, SDR Software/Security Info. The above exhibits contain our benefit to our competitors. This information will not be publicly available. trade secrets and proprietary information that could be of If you have any questions, please feel free to contact us at the address shown below. Sincerely, Company Name:
Company Address:
Contact Name:
Signature:
Phone:
Fax:
E-mail:
Signature Date:
Document Version 1.1 2020-10-30
| 1 2 3 4 5 | Manufacturer Declaration on PAN1770 antenna gain | Cover Letter(s) | 96.17 KiB | February 04 2022 |
Panasonic Industrial Devices Europe GmbH Zeppelinstrae 19, 21337 Lneburg Manufacturer Declaration on PAN1770 antenna gain PAN1770 is a variant of the base Model PAN1780 with external stub antenna instead of internal ceramic antenna. Base Model IDs are Phone +49 (0) 4131 899-0 Fax +49 (0) 4131 899-120 E-Mail: pideu@eu.panasonic.com www.pideu.panasonic.de RED TEC T818666-03-TEC FCC ID: T7V1780 IC ID: 216Q-1780 TO WHOM IT MAY CONCERN We, Panasonic Industrial Devices Europe GmbH, declare on our sole responsibility that the PAN1770 antenna gain of the assembly cable plus antenna is +1,4dBi. Evidence 1) Antenna data sheet by manufacturer Pulse P/N W1030 states 2.0 dBi gain 2) U.FL to RP-SMA cable data sheet by manufacturer TE Connectivity P/N 20166993-x states an attenuation of (2.6 * LENGTH + 0.4) dB = 0.66 dB at 100mm length, which can be rounded down to 0.6 dB attenuation for allowing margin. Calculation PAN1770 antenna gain = 2.0dBi 0.6 dB = +1.4 dBi If you have any questions, please feel free to contact us at the address shown below. Jan. 25, 2022 Olaf Knoth Safety Manager Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lueneburg Attachments 1) W1030 antenna data sheet 2) 20166993-x cable data sheet
| 1 2 3 4 5 | FCC Modulat approval letter | Cover Letter(s) | 1008.19 KiB | February 04 2022 |
RSP-100, Issue 12, August 2019 Modular Approval Attestation Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Certification and Engineering Bureau Innovation, Science and Economic Development Canada Spectrum Engineering Branch 3701 Carling Avenue, Building 94 Ottawa, Ontario K2H 8S2 Subject: FCC / ISED Modular Approval Statement Grantee Code Equipment Product Code Check your GC here. Click Grantee Search. Check your CN here. FCC ID:
CN:
(Company Number) HVIN:
(Hardware Version Id. Number) HMN:
(Host Marketing Name) UPN:
(Unique Product Number) PMN:
(Product Marketing Name) FVIN:
(Firmware Version Id. Number) TO WHOM IT MAY CONCERN Pursuant to Paragraphs RSP-100, Issue 12 and CFR 15.212, we herewith declare for our module. Modular approval requirement
(a) The radio elements shall have the radio frequency circuitry shielded. Physical/discrete and tuning capacitors may be located external to the shield, but shall be on the module assembly. Yes No *
*Please provide a detailed explanation if the answer is No.:
(b) If the module has modulation/data input(s), they shall be buffered in order to ensure that the module will comply with the requirements set out in the applicable Radio Standards Specification (RSS) and Part 15 under conditions of excessive data rates or over-modulation.
*Please provide a detailed explanation if the answer is No.:
(c) The module shall have its own power supply regulation on the module itself. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host product that houses the module.
*Please provide a detailed explanation if the answer is No.:
(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in the applicable RSS and rule part. The equipment certification application shall contain:
i. a detailed description of the configuration of highest antenna gain for each type of transmitting antenna for licence-exempt modules;
ii. the maximum transmitting antenna gain for licence modules; and iii. a detailed description of the configuration of lowest antenna gain for each type of receiving antenna for Dynamic Frequency Selection
(DFS) modules with removable antenna(s).
*Please provide a detailed explanation if the answer is No.:
Modular approval requirement
(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration
(i.e. the module shall not be inside another product during testing). Yes No *
*Please provide a detailed explanation if the answer is No.:
(f) The module complies or will comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement (1.1307(b), 1.1310, 2.1091, and 2.1093) in its intended configuration/integration in a host.
*Please provide a detailed explanation if the answer is No.:
(g) The module must be labeled with its permanently affixed label (indicating ISED certification number, HVIN and FCC identifier), or use an electronic display (see KDB Publication 784748 and RSP-100, section 5).
*Please provide a detailed explanation if the answer is No.:
(h) The module must comply with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee.
*Please provide a detailed explanation if the answer is No.:
(i) (Only applicable for FCC) The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b). For further information concerning antenna connectors see: DA-00-1087.
*Please provide a detailed explanation if the answer is No.:
If you have any questions, please feel free to contact us at the address shown below Best regards, Company Name:
Company Address:
Contact Name:
Signature:
Phone:
Fax:
E-mail:
Signature Date:
INFO for applicant: Limited Modolar Approval (LMA) may be granted when one or more of the requirements in the table above cannot be demonstrated. LMA will also be issued in those instances where applicants can demonstrate that they will retain control over the final installation of the device, such that compliance of the end product is assured. In such cases, an operating condition on the LMA for the module must state that the module is only approved for use when installed in devices produced by a specificmanufacturer. When LMA is sought, the application for equipment certification must specifically state how control of the end product, into which the module will be installed, will be maintained, such that full compliance of the end product is always ensured. Document Version 2.1 2020-10-30
| 1 2 3 4 5 | Modular Request Letter | Cover Letter(s) | 905.77 KiB | April 23 2020 |
Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Certification and Engineering Bureau Industry Canada Spectrum Engineering Branch 3701 Carling Avenue, Building 94 Ottawa, Ontario K2H 8S2 Subject: FCC / ISED Modular Approval Statement FCC ID:
Only applicable for ISED certification:
IC Company Number:
UPN:
HVIN:
(Hardware Version Identification Number) HMN:
(Host Marketing Name) TO WHOM IT MAY CONCERN PMN:
(Product Marketing Name) FVIN:
(Firmware Version Identification Number) No *
Yes Pursuant to Paragraphs RSP-100 Issue 10 November 2014 Item 7.3 and CFR 15.212, we herewith declare for our module. Modular approval requirement
(a) The radio elements must have the radio frequency circuitry be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly.
*Please provide a detailed explanation if the answer is No.:
(b) The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable RSS standard under conditions of excessive data rates or over-modulation.
*Please provide a detailed explanation if the answer is No.:
(c) The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module.
*Please provide a detailed explanation if the answer is No.:
(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module.
*Please provide a detailed explanation if the answer is No.:
Yes No *
(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration, i.e. the module must not be inside another device during testing.
*Please provide a detailed explanation if the answer is No.:
(f) The module shall comply with the Category I equipment labeling requirements and CFR 15.212(a)(1)(vi).
*Please provide a detailed explanation if the answer is No.:
(g) The module shall comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement which are based on the intended use/configurations.
*Please provide a detailed explanation if the answer is No.:
Only applicable for ISED certification:
(h) Is the modular device for an Industry Canada licensed exempt service?
(i) The modular transmitter complies with all applicable FCC rules. Instructions for maintaining compliance are given in the user instructions. If you have any questions, please feel free to contact us at the address shown below Best Regards, Company Name:
Company Address:
Contact Name:
Signature:
Phone:
Fax:
Email:
Signature Date:
INFO for applicant: LMA may be granted when one or more of the requirements in the table above cannot be demonstrated. LMA will also be issued in those instances where applicants can demonstrate that they will retain control over the final installation of the device, such that compliance of the end product is assured. In such cases, an operating condition on the LMA for the module must state that the module is only approved for use when installed in devices produced by a specific manufacturer. When LMA is sought, the application for equipment certification must specifically state how control of the end product, into which the module will be installed, will be maintained, such that full compliance of the end product is always ensured. 2019-03-25
| 1 2 3 4 5 | STC | Cover Letter(s) | 98.61 KiB | April 23 2020 |
SHORT-TERM CONFIDENTIALITY REQUEST Title/Model PAN1780 Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 2020-04-01 TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, we requests short term confidentiality for the following product:
FCC ID Number Product T7V1780 For the product stated above, we request that the following information be held confidential:
1. 2. 3. We request this confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned for 2020-09-30. If you have any questions, please feel free to contact me at the address shown below. Sincerely,
(signed) Name: Olaf Knoth Company: Panasonic Industrial Devices Europe GmbH Address: Zeppelinstrae 19, 21337 Lneburg Phone: +49 4131 899 257 Email: Olaf.knoth@eu.panasonic.com External and Internal Photographs Test Setup Photos User Manual
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2022-12-20 | 2405 ~ 2480 | DTS - Digital Transmission System | Class II Permissive Change |
| 2 | 2022-11-24 | 2402 ~ 2480 | DTS - Digital Transmission System | Class II permissive change or modification of presently authorized equipment |
| 3 | 2022-02-04 | 2402 ~ 2480 | DTS - Digital Transmission System | Class II Permissive Change |
| 4 | 2405 ~ 2480 | DTS - Digital Transmission System | ||
| 5 | 2020-04-23 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 2 3 4 5 | Effective |
2022-12-20
|
||||
| 1 2 3 4 5 |
2022-11-24
|
|||||
| 1 2 3 4 5 |
2022-02-04
|
|||||
| 1 2 3 4 5 |
2020-04-23
|
|||||
| 1 2 3 4 5 | Applicant's complete, legal business name |
Panasonic Industrial Devices Europe GmbH
|
||||
| 1 2 3 4 5 | FCC Registration Number (FRN) |
0014980072
|
||||
| 1 2 3 4 5 | Physical Address |
Zeppelinstrasse 19
|
||||
| 1 2 3 4 5 |
Lueneburg, N/A
|
|||||
| 1 2 3 4 5 |
Lueneburg, N/A 21337
|
|||||
| 1 2 3 4 5 |
Germany
|
|||||
| app s | TCB Information | |||||
| 1 2 3 4 5 | TCB Application Email Address |
t******@ctcadvanced.com
|
||||
| 1 2 3 4 5 |
h******@acbcert.com
|
|||||
| 1 2 3 4 5 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
| app s | FCC ID | |||||
| 1 2 3 4 5 | Grantee Code |
T7V
|
||||
| 1 2 3 4 5 | Equipment Product Code |
1780
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 2 3 4 5 | Name |
O****** K********
|
||||
| 1 2 3 4 5 | Title |
Product Safety
|
||||
| 1 2 3 4 5 | Telephone Number |
+49-4******** Extension:
|
||||
| 1 2 3 4 5 | Fax Number |
+49-4********
|
||||
| 1 2 3 4 5 |
o******@eu.panasonic.com
|
|||||
| app s | Technical Contact | |||||
| 1 2 3 4 5 | Firm Name |
DEKRA Testing and Certification (Suzhou) Co., Ltd.
|
||||
| 1 2 3 4 5 | Name |
H****** D****
|
||||
| 1 2 3 4 5 | Physical Address |
Guangzhou
|
||||
| 1 2 3 4 5 |
China
|
|||||
| 1 2 3 4 5 |
h******@dekra.com
|
|||||
| app s | Non Technical Contact | |||||
| n/a | ||||||
| app s | Confidentiality (long or short term) | |||||
| 1 2 3 4 5 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 2 3 4 5 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| 1 2 3 4 5 | Yes | |||||
| 1 2 3 4 5 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 09/30/2020 | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 2 3 4 5 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 2 3 4 5 | Equipment Class | DTS - Digital Transmission System | ||||
| 1 2 3 4 5 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Bluetooth LE LR Module | ||||
| 1 2 3 4 5 | Bluetooth module | |||||
| 1 2 3 4 5 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 2 3 4 5 | Modular Equipment Type | Single Modular Approval | ||||
| 1 2 3 4 5 | Purpose / Application is for | Class II Permissive Change | ||||
| 1 2 3 4 5 | Class II permissive change or modification of presently authorized equipment | |||||
| 1 2 3 4 5 | Original Equipment | |||||
| 1 2 3 4 5 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 2 3 4 5 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 2 3 4 5 | Grant Comments | Output power listed is peak conducted. Module integrators have to observe the grantee's Module integration guide. C2PC due to adding the additional antenna configuration external Antenna Assembly PULSE W1030 plus cable TE Connectivity 2016693-x for IEEE 802.15.4 connectivity. | ||||
| 1 2 3 4 5 | This is Class II Permissive change application. Output power listed is peak conducted. Module integrators have to observe the grantee's Module integration guide. | |||||
| 1 2 3 4 5 | Output power listed is peak conducted. Module integrators have to observe the grantee's Module integration guide. C2PC due to additional antenna assembly (PULSE W1030 with U.FL to RSMA cable TE Connectivity 2016693-x) with 1.4 dBi gain. | |||||
| 1 2 3 4 5 | Output power listed is peak conducted. Module integrators have to observe the grantee's Module integration guide. C2PC due to adding IEEE 802.15.4 functionality via software. | |||||
| 1 2 3 4 5 | Output power listed is peak conducted. Module integrators have to observe the grantee's Module integration guide. | |||||
| 1 2 3 4 5 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 2 3 4 5 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 2 3 4 5 | Firm Name |
CTC advanced GmbH
|
||||
| 1 2 3 4 5 |
DEKRA Testing and Certification (Shanghai) Ltd.
|
|||||
| 1 2 3 4 5 | Name |
G******** S******
|
||||
| 1 2 3 4 5 |
J**** L****
|
|||||
| 1 2 3 4 5 | Telephone Number |
49-68********
|
||||
| 1 2 3 4 5 |
+86 2********
|
|||||
| 1 2 3 4 5 | Fax Number |
49-68********
|
||||
| 1 2 3 4 5 |
m******@ctcadvanced.com
|
|||||
| 1 2 3 4 5 |
J******@dekra.com
|
|||||
| 1 2 3 4 5 |
t******@ctcadvanced.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 15C | 2402 | 2480 | 0.00708 | ||||||||||||||||||||||||||||||||||||
| 1 | 2 | 15C | 2405 | 2480 | 0.0049 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 2 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0030000 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 3 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0070800 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 4 | 1 | 15C | 2402 | 2480 | 0.00708 | ||||||||||||||||||||||||||||||||||||
| 4 | 2 | 15C | 2405 | 2480 | 0.0049 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 5 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0070800 | ||||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC