FCC ID: 2A2BS-PMF-001-7X7 PMF-001A

 

PMF-001A Microfence Beacon

Installation Manual

Microfence Installation Manual

1



Thank you for choosing the Paycom Microfence Model PMF-

001A. The Microfence uses Bluetooth beacon technology to

extend Geofencing Technology into places where GPS signals

cannot reach.

Table of Contents

What's in the box ...................................................................... 3

Components .............................................................................. 3

Choosing Installation Location .................................................. 4

Removing Wall Mount .............................................................. 4

Mounting the Wall Mount ........................................................ 5

Power ........................................................................................ 8

AAA Battery Insertion ............................................................... 9

Power Adapter Usage ............................................................... 9

LED operation............................................................................ 9

Configuring Beacon ................................................................... 9

Employee Phone Requirements ............................................. 13

Troubleshooting ...................................................................... 14

2

Microfence Installation Manual

What's in the box

In the box, you will find:

• a beacon assigned to your client code

• a 5VDC USB power adapter and cable

• Two AAA batteries

• Four drywall mounting screws

• Double-sided mounting tape

• An information placard for employees

• This installation manual

• A “Getting Started” manual.

Components

The principal components of the Microfence system are shown

in the following figures. The front view shows the LED indicator

at the top of the beacon and the power jack at the bottom.

Figure 1 – Front View

Microfence Installation Manual

3

LEDPower JackThe bottom view shows the wall mount, which is removeable

by pressing the release tabs.

Figure 2 - Bottom View

Choosing Installation Location

The Microfence beacon should be placed wherever you want

employees to clock in or out. When in operation the unit will

transmit a Bluetooth signal periodically that can be received by

the Paycom app on employees’ cellphones.

The beacon should be mounted on a wall or other surface.

Ideally, it should be mounted high on an inside wall in a large,

open area, such as a building lobby, breakroom, or similar

location where employees may congregate when clocking-in or

clocking-out.

Since the beacon uses RF technology its range will be improved

if the area has few obstructions to block the RF path.

Removing Wall Mount

The wall mount must be removed to insert batteries or to

attached it to a wall with screws. To release the wall mount

from the beacon:

1. Press the two release tabs on the bottom as shown in

Figure 3.

2. Pivot the wall mount upward as shown.

4

Microfence Installation Manual

Power JackRelease TabsWall MountBeaconFigure 3 - Wall Mount Removal

Mounting the Wall Mount

The figures below show mounting methods for the Paycom

beacon. The beacon should be mounted to a flat surface using

the supplied screws or double-sided tape.

Microfence Installation Manual

5

Figure 4 – Mounting the Wall Mount with Tape

When mounting with supplied double-sided mounting tape,

removed tape backing on one side and attach to the back face

of the unit wall mount. The remove the tape backing on the

other side. Carefully position the unit in desired location and

press firmly.

Note the double-sided mounting tape has an exceptionally

strong adhesive. Once positioned, repositioning is not advised.

Do not attempt to reposition the beacon when using

double-sided mounting tape!

6

Microfence Installation Manual

!Figure 5 - Mounting the Wall Mount with Screws

When mounting with screws pilot holes should be drilled prior

to inserting screws. The drilling templates in the following

figures show proper hole locations.

After mounting the wall plate to a wall, remove battery tab and

re-attached the beacon to the wall mount.

Microfence Installation Manual

7

Figure 6 - Drilling Template

Power

The beacon has 2 power options:

1. a 5V power adapter

2. AAA batteries

Either the power adapter or AAA batteries must be installed for

the unit to operate.

The beacon contains an internal coin cell battery to maintain

client-specific configuration information. This coin cell should

never be removed.

Never remove the coin cell!

NOTE: The unit has been pre-programmed to operate on your

client code. Removal of the coin cell will cause the unit to lose

this programming: If this occurs, please contact Paycom

Hardware Support and a Technician can ship you a replacement

unit.

8

Microfence Installation Manual

!85 mm(3.3 in)8 mm dia.(0.4 in)40 mm(1.6 in)4 mm dia.(0.2 in)AAA Battery Insertion

1. Separate the beacon from the wall mount as shown in

2. Insert fresh AAA batteries oriented as shown in the

prior section.

battery holder.

3. Snap the beacon back into the wall mount. The wall

mount has a retainer to hold the batteries in place.

Do not mix old and new batteries!

Power Adapter Usage

The power adapter is attached to the beacon with the provided

Micro USB-B cable.

1. Plug the Micro USB-B end of the cable into the beacon

USB port.

2. Plug the USB-A end of the cable into the power adapter.

3. Plug the power adapter into the wall.

LED operation

Upon power-up the beacon LED indicator will blink briefly.

Thereafter, the LED indicator will blink briefly every 5 minutes.

Configuring Beacon

This beacon has been assigned to your client code by Paycom.

Before employees can use the beacon, it must be assigned to a

web terminal.

Microfence Installation Manual

9

!Log in to Paycom and go to “Time Management → Time and

Attendance → Set up Terminal Restrictions”, as shown in Figure

7 below.

Figure 7 - Setup Terminal Restrictions

10

Microfence Installation Manual

Select the web time clock to be enabled for this beacon, as

shown in Figure 8 below.

Figure 8 - Web Time Clock Selection

Then select the “Microfencing” tab, as shown in Figure 9.

Figure 9 – Time Clock Microfencing Tab

Add a description for the Microfence beacon, and select the

beacon’s MAC Address from the drop-down list. The beacon’s

MAC address will be printed on an adhesive label on the beacon

Microfence Installation Manual

11

itself. Then select “Add” to add it to the Web Time Clock

terminal, as shown in Figure 10.

Figure 10 – Microfence Descripton and MAC Address Selection

After selecting “Add” the Microfence and its MAC address

should appear in the list of configured beacons, as shown in

Figure 11.

Employees should be able to clock-in and out using the

Microfence beacon and the Paycom app after the beacon is

added to the web terminal and the employee has this terminal

included in their Terminal Access Group.

If desired, this beacon may be assigned to additional Web Time

Clock terminals by means of the same process in the applicable

terminal.

12

Microfence Installation Manual

Figure 11 - SUCCESS! Microfence has been added!

Please contact your Paycom Specialist if you need any help in

setting up beacons.

Employee Phone Requirements

Employees will need to use the Paycom iOS or Android mobile

app. The mobile app must be updated to version 6.0 or later.

Employees must enable bluetooth, and grant the mobile app

access to bluetooth.

Microfence Installation Manual

13

Troubleshooting

If an employee cannot clock in, please check the following:

• Verify beacon is added to the terminal the employee is

• Verify the employee is on the latest version of the

• Verify the employee has Bluetooth enabled on their

using.

Paycom app.

smart phone.

• Verify the employee has allowed the Paycom app to

access Bluetooth on their smart phone.

• Verify beacon is powered on. The beacon LED light will

flash every 5 minutes when powered on by USB or

batteries. If no flashing, check USB power or replace

batteries.

• Have employee stand closer to the beacon. The beacon

uses wireless Bluetooth technology with limited range.

Walls and other electronics can interfere with reception

and reduce available range.

For

further assistance, please contact your Paycom

Representative or Paycom Hardware Support at 1-844-811-

5707

14

Microfence Installation Manual

To satisfy RF exposure requirements, this device and its antenna must operate

with a separation distance of at least 20 cm from all persons.

Changes or modifications not expressly approved by Paycom Software Inc.

could void the user's authority to operate the equipment.

to

the

Per RSS-Gen, Section 8.4 This device

complies with Industry Canada license-

exempt RSS standard(s). Operation is

subject

two

conditions: (1) this device may not

cause interference, and (2) this device

must accept any interference, including

interference that may cause undesired

operation of the device.

following

This device contains licence-exempt

transmitter(s)/receiver(s) that comply

with Innovation, Science and Economic

Development Canada’s licence-exempt

RSS(s). Operation is subject to the

following two conditions:

1. This device may not cause

interference.

2. This device must accept any

interference,

including

interference that may cause

undesired operation of the

device.

d'Industrie Canada.

Selon RSS-Gen, Section 8.4 Cet appareil

est conforme aux normes RSS sans

licence

Son

fonctionnement est soumis aux deux

conditions suivantes : (1) cet appareil

ne doit pas provoquer d'interférences,

et (2) cet appareil doit accepter toute

interférence,

les

interférences pouvant provoquer un

fonctionnement

de

l'appareil.

indésirable

compris

y

Cet

et

appareil

contient

des

émetteurs/récepteurs exempts de

licence qui sont conformes aux RSS

licence d'Innovation,

exemptés de

Sciences

Développement

économique Canada. L'exploitation est

soumise aux deux conditions suivantes

:

1. Cet appareil ne doit pas provoquer

d'interférences.

2. Cet appareil doit accepter toute

les

interférence,

interférences

de

provoquer

fonctionnement

indésirable de l'appareil.

compris

y

susceptibles

un

Microfence Installation Manual

15

Unit contains lithium-ion battery. Do not dispose of in household

waste.

This device complies with Part

15 of the FCC Rules. Operation is

subject to the following two

conditions: (1) this device may

not cause harmful Interference,

and (2) this device must accept

received,

any

including interference that may

cause undesired operation.

interference

Cet appareil est conforme à la

partie 15 des règles de la FCC.

Son fonctionnement est soumis

aux deux conditions suivantes :

(1) Cet appareil ne doit pas

provoquer

d'interférences

nuisibles, et (2) cet appareil doit

interférence

accepter

reçue,

les

interférences susceptibles de

provoquer un fonctionnement

indésirable.

toute

y

compris

FCC ID: 2A2BS-PMF-001-7X7

For technical support on this product, please call:

1-844-811-5707

or visit our support website at:

http://www.paycom.com

Printed in USA

1st Version

May, 2021



 

 

 

 

 

 

 

 

 

 

 

 

 

 

Application Report

SWRU120D – April 2007 – Revised January 2019

2.4-GHz Inverted F Antenna

This document describes a printed-circuit board (PCB) antenna design that can be used with all 2.4-GHz

transceivers and transmitters from Texas Instruments™. The maximum gain when used on the reference

board is measured to be +3.3 dBi, and the overall size requirements for this antenna are 25.7 × 7.5 mm

(not including ground plane).

ABSTRACT

Contents

1

2

3

4

Description of the antenna Design ........................................................................................ 2

Measurement Results ....................................................................................................... 3

Radiation Pattern ................................................................................................... 3

2.1

Reflection........................................................................................................... 10

2.2

Bandwidth .......................................................................................................... 11

2.3

Conclusion .................................................................................................................. 11

References .................................................................................................................. 11

Trademarks

Texas Instruments is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

SWRU120D – April 2007 – Revised January 2019

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Copyright © 2007–2019, Texas Instruments Incorporated

2.4-GHz Inverted F Antenna

1

Description of the antenna Design

1

Description of the antenna Design

www.ti.com

It is important to make an exact copy of the antenna dimensions to obtain optimum performance. The

easiest approach to implement the antenna in a PCB CAD tool is to import the antenna layout from a

gerber file or a DXF file. Such files are included in CC2430DB reference design [1]. The gerber file is

called Inverted_F_Antenna.spl and the DXF file is called Inverted_F_Antenna.dxf. If the antenna is

implemented on a PCB that is wider than the antenna, avoid placing components or having a ground

plane close to the end points of the antenna. If the CAD tool being used does not support importing gerber

or DXF files, see Figure 1 and Table 1.

The antenna impedance is tuned to 50 ohm on the reference board. The impedance will however be

affected by different size and shape of the ground plane, objects in the antenna nearfield such as

mechanical assemblies (housing, batteries, etc.), PCB thickness, PCB material and so on. It is therefore

recommended to add a pi-network close to the antenna feedpoint for impedance matching.

The results presented in this document are based on an antenna implemented on a PCB with a 1-mm

thickness using standard FR-4 material.

Figure 1. IFA Dimensions

Table 1. IFA Dimensions

H1

H2

H3

H4

H5

H6

H7

H8

H9

W1

5.70 mm

0.74 mm

1.29 mm

2.21 mm

0.66 mm

1.21 mm

0.80 mm

1.80 mm

0.61 mm

1.21 mm

W2

L1

L2

L3

L4

L5

L6

L7

L8

0.46 mm

25.58 mm

16.40 mm

2.18 mm

4.80 mm

1.00 mm

1.00 mm

3.20 mm

0.45 mm

2

2.4-GHz Inverted F Antenna

Copyright © 2007–2019, Texas Instruments Incorporated

SWRU120D – April 2007 – Revised January 2019

Submit Documentation Feedback

www.ti.com

2

Measurement Results

2.1 Radiation Pattern

All of the results presented in this section are based on measurements performed with the CC2430DB [1]

evaluation board.

Figure 2 shows how to relate all of the radiation patterns to the orientation of the antenna. The radiation

patterns were measured with the CC2430 device programmed to 0-dBm output power.

Measurement Results

Figure 2. Relating Antenna to Radiation Patterns

SWRU120D – April 2007 – Revised January 2019

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2.4-GHz Inverted F Antenna

3

Measurement Results

www.ti.com

Figure 3 shows the XY plane vertical polarization.

Figure 3. XY Plane–Vertical Polarization

4

2.4-GHz Inverted F Antenna

Copyright © 2007–2019, Texas Instruments Incorporated

SWRU120D – April 2007 – Revised January 2019

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www.ti.com

Measurement Results

Figure 4 shows the XY plane horizontal polarization.

Figure 4. XY Plane–Horizontal Polarization

SWRU120D – April 2007 – Revised January 2019

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2.4-GHz Inverted F Antenna

5

Measurement Results

www.ti.com

Figure 5 shows the XZ plane vertical polarization.

Figure 5. XZ Plane–Vertical Polarization

6

2.4-GHz Inverted F Antenna

Copyright © 2007–2019, Texas Instruments Incorporated

SWRU120D – April 2007 – Revised January 2019

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www.ti.com

Measurement Results

Figure 6 shows the XZ plane horizontal polarization.

Figure 6. XZ Plane–Horizontal Polarization

SWRU120D – April 2007 – Revised January 2019

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Copyright © 2007–2019, Texas Instruments Incorporated

2.4-GHz Inverted F Antenna

7

Measurement Results

www.ti.com

Figure 7 shows the YZ plane vertical polarization.

Figure 7. YZ Plane–Vertical Polarization

8

2.4-GHz Inverted F Antenna

Copyright © 2007–2019, Texas Instruments Incorporated

SWRU120D – April 2007 – Revised January 2019

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Measurement Results

Figure 8 shows the YZ plane horizontal polarization.

Figure 8. YZ Plane–Horizontal Polarization

SWRU120D – April 2007 – Revised January 2019

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Copyright © 2007–2019, Texas Instruments Incorporated

2.4-GHz Inverted F Antenna

9

Measurement Results

2.2 Reflection

www.ti.com

Figure 9 shows that the IFA ensures less than 10% reflection of the available power for a bandwidth of

more than 300 MHz. A large bandwidth makes the antenna less sensitive to detuning because of plastic

encapsulation or other objects in the vicinity of the antenna.

Figure 9. Measured Reflection at Feed Point of Antenna

10

2.4-GHz Inverted F Antenna

Copyright © 2007–2019, Texas Instruments Incorporated

SWRU120D – April 2007 – Revised January 2019

Submit Documentation Feedback

www.ti.com

2.3 Bandwidth

Measurement Results

Another way of measuring the bandwidth after the antenna is implemented on a PCB and connected to a

transmitter is to write test software that steps a carrier across the frequency band of interest. By using the

maximum hold function on a spectrum analyzer, the variation in output power across frequency can easily

be measured.

Figure 10 shows how the output power varies on the IFA when the PCB is horizontally oriented and the

receiving antenna has horizontal polarization. This measurement was not performed in an anechoic

chamber, thus the graph shows only the relative variation for the given frequency band.

Figure 10. Bandwidth of IFA

3

Conclusion

The PCB antenna presented in this document performs well for all frequencies in the 2.4-GHz ISM band.

Except for two narrow dips, the antenna has an omni directional radiation pattern in the plane of the PCB.

These properties will ensure stable performance regardless of operating frequency and positioning of the

antenna. Table 2 lists the most important properties for the IFA.

Table 2. Summary of IFA Properties

Gain in XY plane

Gain in XZ plane

Gain in YZ plane

Reflection

Antenna size

1.1 dBi

3.3 dBi

1.6 dBi

< –15 dB

25.7 × 7.5 mm

4

References

1. CC2430DB Reference Design

SWRU120D – April 2007 – Revised January 2019

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2.4-GHz Inverted F Antenna

11

Revision History

www.ti.com

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Revision History

Changes from C Revision (February 2017) to D Revision ............................................................................................. Page

• Update was made in the Abstract of this document. ................................................................................. 1

• Update was made to Section 1. ......................................................................................................... 2

12

Revision History

Copyright © 2007–2019, Texas Instruments Incorporated

SWRU120D – April 2007 – Revised January 2019

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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

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TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2019, Texas Instruments Incorporated



 

 

August 4, 2021 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Dear Sir/Madam:

Sincerely, Charles T. Ferguson Sr. Engineer Paycom Software, Inc. chuck.ferguson@paycomonline.com 254-644-6134 Enclosed please find an application for an original equipment certification of Model PMF-001A; FCC ID:

2A2BS-PMF-001-7X7 under Rule Part FCC 15.247. The device is a Bluetooth Low-Energy (BLE) beacon that is used for geolocation of employees when clocking-in/out of or time management system.

 

 

 

 

 

 

• Ultra-low power sensor controller

– Can run autonomous from the rest of the

• Low power

– Wide supply voltage range

CC2640R2F

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

CC2640R2F

SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

www.ti.com

1 Features

• Microcontroller

– Powerful Arm® Cortex®-M3

– EEMBC CoreMark® score: 142

– Up to 48-MHz clock speed

– 275KB of nonvolatile memory including 128KB

of in-system Programmable Flash

– Up to 28KB of system SRAM, of which 20KB is

ultra-low leakage SRAM

– 8KB of SRAM for cache or system RAM use

– 2-Pin cJTAG and JTAG debugging

– Supports over-the-air upgrade (OTA)

– 16-bit architecture

– 2KB of ultra-low leakage SRAM for code and

system

data

• Efficient code size architecture, placing drivers,

TI-RTOS, and Bluetooth® software in ROM to

make more Flash available for the application

• RoHS-compliant packages

– 2.7-mm × 2.7-mm YFV DSBGA34 (14 GPIOs)

– 4-mm × 4-mm RSM VQFN32 (10 GPIOs)

– 5-mm × 5-mm RHB VQFN32 (15 GPIOs)

– 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)

• Peripherals

– All digital peripheral pins can be routed to any

– Four general-purpose timer modules

(eight 16-bit or four 32-bit timers, PWM each)

– 12-bit ADC, 200-ksamples/s, 8-channel analog

GPIO

MUX

– Continuous time comparator

– Ultra-low power analog comparator

– Programmable current source

– UART, I2C, and I2S

– 2× SSI (SPI, MICROWIRE, TI)

– Real-Time Clock (RTC)

– AES-128 security module

– True Random Number Generator (TRNG)

– Support for eight capacitive-sensing buttons

– Integrated temperature sensor

• External system

– On-chip internal DC/DC converter

– Seamless integration with CC2590 and

CC2592 range extenders

– Very few external components

– Pin compatible with the SimpleLink™ CC2640

and CC2650 devices in all VQFN packages

– Pin compatible with the SimpleLink™ CC2642R

and CC2652R devices in 7-mm x 7-mm VQFN

packages

– Pin compatible with the SimpleLink™ CC1350

device in 4-mm × 4-mm and 5-mm × 5-mm

VQFN packages

• Normal operation: 1.8 to 3.8 V

• External regulator mode: 1.7 to 1.95 V

– Active-Mode RX: 5.9 mA

– Active-Mode TX at 0 dBm: 6.1 mA

– Active-Mode TX at +5 dBm: 9.1 mA

– Active-Mode MCU: 61 µA/MHz

– Active-Mode MCU: 48.5 CoreMark/mA

– Active-Mode sensor controller:

0.4mA + 8.2 µA/MHz

– Standby: 1.1 µA (RTC running and RAM/CPU

– Shutdown: 100 nA (wake up on external

retention)

events)

• RF section

– 2.4-GHz RF transceiver compatible with

Bluetooth® Low Energy 5.1 and earlier LE

specifications

– Excellent receiver sensitivity (–97 dBm for

BLE), selectivity, and blocking performance

– Link budget of 102 dB for BLE

– Programmable output power up to +5 dBm

– Single-ended or differential RF interface

– Suitable for systems targeting compliance with

worldwide radio frequency regulations

• ETSI EN 300 328 (Europe)

• EN 300 440 Class 2 (Europe)

• FCC CFR47 Part 15 (US)

• ARIB STD-T66 (Japan)

Copyright © 2020 Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

Submit Document Feedback

intellectual property matters and other important disclaimers. PRODUCTION DATA.

1

Product Folder Links: CC2640R2F

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

• Development Tools and Software

– Full-feature development kits

– Multiple reference designs

– SmartRF™ Studio

– Sensor Controller Studio

– IAR Embedded Workbench® for Arm®

– Code Composer Studio™ Integrated

Development Environment (IDE)

– Code Composer Studio™ Cloud IDE

2 Applications

• Home and Building Automation

– Connected appliances

– Lighting

– Smart locks

– Gateways

– Security Systems

Industrial

– Factory automation

– Asset tracking and management

•

www.ti.com

– HMI

– Access control

• Electronic Point Of Sale (EPOS)

– Electronic Shelf Label (ESL)

• Health and Medical

– Electronic thermometers

– SpO2

– Blood glucose monitors and blood pressure

monitors

– Weigh scales

– Hearing aids

• Sports and Fitness

– Wearable fitness and activity monitors

– Smart trackers

– Patient monitors

– Fitness machines

• HID

– Gaming

– Pointing devices (wireless keyboard and

mouse)

3 Description

The CC2640R2F device is a 2.4 GHz wireless microcontroller (MCU) supporting Bluetooth® 5.1 Low Energy and

Proprietary 2.4 GHz applications. The device is optimized for low-power wireless communication and advanced

sensing in building security systems, HVAC, asset tracking, and medical markets, and applications where

industrial performance is required. The highlighted features of this device include:

• Support for Bluetooth ® 5.1 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed),

Advertising Extensions, Multiple Advertisement Sets, as well as backwards compatibility and support for key

features from the Bluetooth ® 5.0 and earlier Low Energy specifications.

• Fully-qualified Bluetooth ® 5.1 software protocol stack included with the SimpleLink™ CC2640R2F Software

Development Kit (SDK) for developing applications on the powerful Arm® Cortex®-M3 processor.

• Longer battery life wireless applications with low standby current of 1.1 µA with full RAM retention.

• Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-

up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.

• Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver

capability to support multiple physical layers and RF standards, such as real-time localization (RTLS)

technologies.

• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy

(-103 dBm for 125-kbps LE Coded PHY).

The CC2640R2F device is part of the SimpleLink™ microcontroller (MCU) platform, which consists of

Wi-Fi®, Bluetooth ® Low Energy, Thread, ZigBee®, Sub-1 GHz MCUs, and host MCUs that all share a common,

easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A

one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices

into your design, allowing 100 percent code reuse when your design requirements change. For more

information, visit SimpleLink™ MCU platform.

PART NUMBER

CC2640R2FRGZ

CC2640R2FRHB

CC2640R2FRSM

Device Information (1)

PACKAGE

VQFN (48)

VQFN (32)

VQFN (32)

BODY SIZE (NOM)

7.00 mm × 7.00 mm

5.00 mm × 5.00 mm

4.00 mm × 4.00 mm

2

Submit Document Feedback

Copyright © 2020 Texas Instruments Incorporated

Product Folder Links: CC2640R2F

www.ti.com

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

PART NUMBER

CC2640R2FYFV

Device Information (1) (continued)

PACKAGE

DSBGA (34)

BODY SIZE (NOM)

2.70 mm × 2.70 mm

(1)

For more information, see Section 12.

Copyright © 2020 Texas Instruments Incorporated

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3

Product Folder Links: CC2640R2F

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

4 Functional Block Diagram

Figure 4-1 shows a block diagram for the CC2640R2F device.

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Figure 4-1. Block Diagram

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SimpleLink CC26xx Wireless MCUMain CPU:128-KBFlashSensor ControllercJTAG 20-KBSRAMROMARMCortex-M3DC-DC ConverterRF CoreARMCortex-M0DSP modem4-KB SRAMROMSensor Controller Engine2× Comparator12-bit ADC, 200 ks/sConstant Current SourceSPI-I2C Digital Sensor IF2-KB SRAMTime-to-digital ConverterGeneral Peripherals / Modules4× 32-bit Timers2× SSI (SPI, µW, TI)Watchdog TimerTemp. / Batt. MonitorRTCI2CUART I2S10 / 14 / 15 / 31 GPIOsAES32 ch. µDMAADCDigital PLLUp to 48 MHz61 µA/MHzTRNGADC8-KBcacheCopyright © 2016, Texas Instruments Incorporatedwww.ti.com

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 2

3 Description.......................................................................2

4 Functional Block Diagram.............................................. 4

5 Revision History.............................................................. 6

6 Device Comparison......................................................... 7

6.1 Related Products........................................................ 7

7 Terminal Configuration and Functions..........................8

7.1 Pin Diagram – RGZ Package......................................8

7.2 Signal Descriptions – RGZ Package...........................9

7.3 Pin Diagram – RHB Package....................................11

7.4 Signal Descriptions – RHB Package.........................12

7.5 Pin Diagram – YFV (Chip Scale, DSBGA)

Package...................................................................... 13

7.6 Signal Descriptions – YFV (Chip Scale, DSBGA)

Package...................................................................... 13

7.7 Pin Diagram – RSM Package................................... 15

7.8 Signal Descriptions – RSM Package........................ 16

8 Specifications................................................................ 17

8.1 Absolute Maximum Ratings...................................... 17

8.2 ESD Ratings............................................................. 17

8.3 Recommended Operating Conditions.......................18

8.4 Power Consumption Summary................................. 18

8.5 General Characteristics............................................ 19

8.6 125-kbps Coded (Bluetooth 5) – RX......................... 19

8.7 125-kbps Coded (Bluetooth 5) – TX......................... 20

8.8 500-kbps Coded (Bluetooth 5) – RX......................... 20

8.9 500-kbps Coded (Bluetooth 5) – TX......................... 21

8.10 1-Mbps GFSK (Bluetooth low energy) – RX........... 22

8.11 1-Mbps GFSK (Bluetooth low energy) – TX............23

8.12 2-Mbps GFSK (Bluetooth 5) – RX...........................23

8.13 2-Mbps GFSK (Bluetooth 5) – TX........................... 24

8.14 24-MHz Crystal Oscillator (XOSC_HF)...................24

8.15 32.768-kHz Crystal Oscillator (XOSC_LF)..............24

8.16 48-MHz RC Oscillator (RCOSC_HF)...................... 25

8.17 32-kHz RC Oscillator (RCOSC_LF)........................25

8.18 ADC Characteristics................................................25

8.19 Temperature Sensor............................................... 26

8.20 Battery Monitor........................................................26

8.21 Continuous Time Comparator................................. 27

8.22 Low-Power Clocked Comparator............................ 27

8.23 Programmable Current Source............................... 27

8.24 Synchronous Serial Interface (SSI).........................28

8.25 DC Characteristics.................................................. 29

8.26 Thermal Resistance Characteristics....................... 30

8.27 Timing Requirements.............................................. 30

8.28 Switching Characteristics........................................31

8.29 Typical Characteristics............................................ 32

9 Detailed Description......................................................36

9.1 Overview................................................................... 36

9.2 Functional Block Diagram......................................... 36

9.3 Main CPU..................................................................37

9.4 RF Core.................................................................... 37

9.5 Sensor Controller...................................................... 38

9.6 Memory..................................................................... 39

9.7 Debug....................................................................... 39

9.8 Power Management..................................................39

9.9 Clock Systems.......................................................... 40

9.10 General Peripherals and Modules.......................... 40

9.11 Voltage Supply Domains......................................... 42

9.12 System Architecture................................................42

10 Application, Implementation, and Layout................. 43

10.1 Application Information........................................... 43

10.2 5 × 5 External Differential (5XD) Application

Circuit.......................................................................... 45

10.3 4 × 4 External Single-ended (4XS) Application

Circuit.......................................................................... 47

11 Device and Documentation Support..........................49

11.1 Device Nomenclature..............................................49

11.2 Tools and Software..................................................50

11.3 Documentation Support.......................................... 51

11.4 Texas Instruments Low-Power RF Website............ 51

11.5 Low-Power RF eNewsletter.................................... 51

11.6 Support Resources................................................. 51

11.7 Trademarks............................................................. 51

11.8 Electrostatic Discharge Caution.............................. 51

11.9 Export Control Notice.............................................. 51

11.10 Glossary................................................................ 52

12 Mechanical, Packaging, and Orderable

Information.................................................................... 53

12.1 Packaging Information............................................ 53

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5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Page

Changes from Revision B (January 2018) to Revision C (September 2020)

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Changed intermodulation interferer frequencies in Section 8.12 .....................................................................23

• Changed Figure 8-20 in Section 8.29 .............................................................................................................. 32

• Changed IDLE value for Current in Section 9.8 ...............................................................................................39

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6 Device Comparison

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Table 6-1. Device Family Overview

Flash (KB) RAM (KB)

PHY Support

Device

CC2640R2Fxxx(2)

Bluetooth low energy

(Normal, High Speed, Long Range)

CC2640F128xxx

Bluetooth low energy (Normal)

CC2650F128xxx

Multi-Protocol(3)

CC2630F128xxx

IEEE 802.15.4 (/6LoWPAN)

CC2620F128xxx

IEEE 802.15.4 (RF4CE)

128

128

128

128

128

GPIO

Package(1)

31, 15, 14, 10

RGZ, RHB, YFV, RSM

31, 15, 10

31, 15, 10

31, 15, 10

31, 10

RGZ, RHB, RSM

RGZ, RHB, RSM

RGZ, RHB, RSM

RGZ, RSM

20

20

20

20

20

(1)

Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48,

RHB is 5-mm × 5-mm VQFN32, RSM is 4-mm × 4-mm VQFN32, and YFV is 2.7-mm × 2.7-mm DSBGA.

(2) CC2640R2Fxxx devices contain Bluetooth Low Energy Host & Controller libraries in ROM, leaving more of the 128KB Flash memory

available for the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and

Flash memory by the protocol stack may vary depending on device software configuration. See www.ti.com for more details.

The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.

(3)

6.1 Related Products

TI's Wireless

Connectivity

The wireless connectivity portfolio offers a wide selection of low-power RF solutions

suitable for a broad range of applications. The offerings range from fully customized

solutions to turn key offerings with pre-certified hardware and software (protocol).

TI's SimpleLink™ Sub-1

GHz Wireless MCUs

Long-range, low-power wireless connectivity solutions are offered in a wide range

of

Sub-1 GHz ISM bands.

Companion Products

Companion Products

SimpleLink™ CC2640R2

Wireless MCU

LaunchPad™

Development Kit

Review products that are frequently purchased or used in conjunction with this

product.

The CC2640R2 LaunchPad™ development kit brings easy Bluetooth® low energy

(BLE) connection to the LaunchPad ecosystem with the SimpleLink ultra-low power

CC26xx family of devices. Compared to the CC2650 LaunchPad, the CC2640R2

LaunchPad provides the following:

• More free flash memory for the user application in the CC2640R2 wireless MCU

• Out-of-the-box support for Bluetooth 4.2 specification

• 4× faster Over-the-Air download speed compared to Bluetooth 4.1

SimpleLink™ Bluetooth

low energy/Multi-

standard SensorTag

The new SensorTag IoT kit invites you to realize your cloud-connected product

idea. The new SensorTag now includes 10 low-power MEMS sensors in a tiny red

package. And it is expandable with DevPacks to make it easy to add your own

sensors or actuators.

Reference Designs for

CC2640

TI Designs Reference Design Library is a robust reference design library spanning

analog, embedded processor and connectivity. Created by TI experts to help you

jump-start your system design, all TI Designs include schematic or block diagrams,

BOMs, and design files to speed your time to market. Search and download

designs at ti.com/tidesigns.

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7 Terminal Configuration and Functions

7.1 Pin Diagram – RGZ Package

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Figure 7-1. RGZ Package 48-Pin VQFN (7-mm × 7-mm) Pinout, 0.5-mm Pitch

I/O pins marked in Figure 7-1 in bold have high-drive capabilities; they are the following:

• Pin 10, DIO_5

• Pin 11, DIO_6

• Pin 12, DIO_7

• Pin 24, JTAG_TMSC

• Pin 26, DIO_16

• Pin 27, DIO_17

I/O pins marked in Figure 7-1 in italics have analog capabilities; they are the following:

• Pin 36, DIO_23

• Pin 37, DIO_24

• Pin 38, DIO_25

• Pin 39, DIO_26

• Pin 40, DIO_27

• Pin 41, DIO_28

• Pin 42, DIO_29

• Pin 43, DIO_30

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4039DIO_2538DIO_243721222324DCDC_SW33DIO_1834RESET_N35DIO_2336X32K_Q24X32K_Q13RF_N2RF_P1DIO_2232DIO_2131DIO_2030DIO_1929DIO_05DIO_16DIO_278282726JTAG_TCKC2591011124142434420DIO_1519DIO_141817VDDR454647VDDR_RF4816151413DIO_17DIO_16VDDS_DCDCDIO_26DIO_12DIO_13VDDS2DIO_11DIO_10DIO_5DIO_6DIO_7DIO_3DIO_4X24M_PX24M_NDIO_8DIO_9DIO_28VDDS3DCOUPLJTAG_TMSCDIO_29DIO_30DIO_27VDDS7.2 Signal Descriptions – RGZ Package

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

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NAME

DCDC_SW

DCOUPL

DIO_0

DIO_1

DIO_2

DIO_3

DIO_4

DIO_5

DIO_6

DIO_7

DIO_8

DIO_9

DIO_10

DIO_11

DIO_12

DIO_13

DIO_14

DIO_15

DIO_16

DIO_17

DIO_18

DIO_19

DIO_20

DIO_21

DIO_22

DIO_23

DIO_24

DIO_25

DIO_26

DIO_27

DIO_28

DIO_29

DIO_30

JTAG_TMSC

JTAG_TCKC

RESET_N

RF_P

RF_N

VDDR

VDDR_RF

Table 7-1. Signal Descriptions – RGZ Package

NO.

33

23

TYPE

Power

Power

DESCRIPTION

Output from internal DC/DC(1)

1.27-V regulated digital-supply decoupling capacitor(2)

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

Digital I/O

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

Digital I/O

GPIO, JTAG_TDO, high-drive capability

Digital I/O

GPIO, JTAG_TDI, high-drive capability

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital I/O

JTAG TMSC, high-drive capability

Digital I/O

JTAG TCKC(3)

Digital input

Reset, active-low. No internal pullup.

5

6

7

8

9

10

11

12

14

15

16

17

18

19

20

21

26

27

28

29

30

31

32

36

37

38

39

40

41

42

43

24

25

35

1

2

45

48

RF I/O

RF I/O

Power

Power

Positive RF input signal to LNA during RX

Positive RF output signal to PA during TX

Negative RF input signal to LNA during RX

Negative RF output signal to PA during TX

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(2) (4)

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(2) (5)

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Table 7-1. Signal Descriptions – RGZ Package (continued)

VDDS_DCDC

NAME

VDDS

VDDS2

VDDS3

X32K_Q1

X32K_Q2

X24M_N

X24M_P

EGP

NO.

44

13

22

34

3

4

46

47

TYPE

Power

Power

Power

Power

DESCRIPTION

1.8-V to 3.8-V main chip supply(1)

1.8-V to 3.8-V DIO supply(1)

1.8-V to 3.8-V DIO supply(1)

1.8-V to 3.8-V DC/DC supply

Analog I/O

32-kHz crystal oscillator pin 1

Analog I/O

32-kHz crystal oscillator pin 2

Analog I/O

24-MHz crystal oscillator pin 1

Analog I/O

24-MHz crystal oscillator pin 2

Power

Ground – Exposed Ground Pad

For more details, see the technical reference manual (listed in Section 11.3).

(1)

(2) Do not supply external circuitry from this pin.

(3)

For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

If internal DC/DC is not used, this pin is supplied internally from the main LDO.

If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

(4)

(5)

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7.3 Pin Diagram – RHB Package

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Figure 7-2. RHB Package 32-Pin VQFN (5-mm × 5-mm) Pinout, 0.5-mm Pitch

I/O pins marked in Figure 7-2 in bold have high-drive capabilities; they are the following:

• Pin 8, DIO_2

• Pin 9, DIO_3

• Pin 10, DIO_4

• Pin 13, JTAG_TMSC

• Pin 15, DIO_5

• Pin 16, DIO_6

I/O pins marked in Figure 7-2 in italics have analog capabilities; they are the following:

• Pin 20, DIO_7

• Pin 21, DIO_8

• Pin 22, DIO_9

• Pin 23, DIO_10

• Pin 24, DIO_11

• Pin 25, DIO_12

• Pin 26, DIO_13

• Pin 27, DIO_14

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SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

7.4 Signal Descriptions – RHB Package

NAME

DCDC_SW

DCOUPL

Table 7-2. Signal Descriptions – RHB Package

DESCRIPTION

TYPE

Power

Power

Output from internal DC/DC(1)

1.27-V regulated digital-supply decoupling(2)

NO.

17

12

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DIO_0

DIO_1

DIO_2

DIO_3

DIO_4

DIO_5

DIO_6

DIO_7

DIO_8

DIO_9

DIO_10

DIO_11

DIO_12

DIO_13

DIO_14

RF_N

RF_P

RX_TX

VDDR

JTAG_TMSC

JTAG_TCKC

RESET_N

VDDR_RF

VDDS

VDDS2

VDDS_DCDC

X32K_Q1

X32K_Q2

X24M_N

X24M_P

EGP

6

7

8

9

10

15

16

20

21

22

23

24

25

26

27

13

14

19

2

1

3

29

32

28

11

18

4

5

30

31

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, High drive capability, JTAG_TDO

Digital I/O

GPIO, High drive capability, JTAG_TDI

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital I/O

JTAG TMSC, high-drive capability

Digital I/O

JTAG TCKC(3)

Digital input

Reset, active-low. No internal pullup.

Negative RF input signal to LNA during RX

Negative RF output signal to PA during TX

Positive RF input signal to LNA during RX

Positive RF output signal to PA during TX

Optional bias pin for the RF LNA

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(4) (2)

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(2) (5)

RF I/O

RF I/O

RF I/O

Power

Power

Power

Power

Power

1.8-V to 3.8-V main chip supply(1)

1.8-V to 3.8-V GPIO supply(1)

1.8-V to 3.8-V DC/DC supply

Analog I/O

32-kHz crystal oscillator pin 1

Analog I/O

32-kHz crystal oscillator pin 2

Analog I/O

24-MHz crystal oscillator pin 1

Analog I/O

24-MHz crystal oscillator pin 2

Power

Ground – Exposed Ground Pad

See technical reference manual (listed in Section 11.3) for more details.

(1)

(2) Do not supply external circuitry from this pin.

(3)

For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

If internal DC/DC is not used, this pin is supplied internally from the main LDO.

If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

(4)

(5)

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CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

7.5 Pin Diagram – YFV (Chip Scale, DSBGA) Package

Figure 7-3. YFV (2.7-mm × 2.7-mm) Pinout, Top View

7.6 Signal Descriptions – YFV (Chip Scale, DSBGA) Package

Table 7-3. Signal Descriptions – YFV Package

DESCRIPTION

TYPE

NO.

D1

F3

C5

F6

D5

E5

F5

E3

F1

D2

D3

A1

C2

B2

D4

B3

E4

F2

E2

Power

Power

Output from internal DC/DC(1)

1.27-V regulated digital-supply decoupling(2)

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, High-drive capability, JTAG_TDO

Digital I/O

GPIO, High-drive capability, JTAG_TDI

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital I/O

JTAG TMSC, high-drive capability

Digital I/O

JTAG TCKC(3)

Digital input

Reset, active-low. No internal pullup.

NAME

DCDC_SW

DCOUPL

DIO_0

DIO_1

DIO_2

DIO_3

DIO_4

DIO_5

DIO_6

DIO_7

DIO_8

DIO_9

DIO_10

DIO_11

DIO_12

DIO_13

JTAG_TMSC

JTAG_TCKC

RESET_N

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Table 7-3. Signal Descriptions – YFV Package (continued)

DESCRIPTION

NO.

TYPE

NAME

RF_N

RF_P

VDDR

VDDR_RF

VDDS

VDDS2

VDDS_DCDC

X32K_Q1

X32K_Q2

X24M_N

X24M_P

GND

Negative RF input signal to LNA during RX

Negative RF output signal to PA during TX

Positive RF input signal to LNA during RX

Positive RF output signal to PA during TX

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(4) (2)

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(5) (2)

RF I/O

RF I/O

Power

Power

Power

Power

Power

B6

B5

A3

B4

A2

F4

C1

D6

E6

C3

C4

1.8-V to 3.8-V main chip supply(1)

1.8-V to 3.8-V GPIO supply(1)

1.8-V to 3.8-V DC/DC supply

Analog I/O

32-kHz crystal oscillator pin 1

Analog I/O

32-kHz crystal oscillator pin 2

Analog I/O

24-MHz crystal oscillator pin 1

Analog I/O

24-MHz crystal oscillator pin 2

A4, B1, C6,

E1

Power

Ground

For more details, see the technical reference manual (listed in Section 11.3).

(1)

(2) Do not supply external circuitry from this pin.

(3)

For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

If internal DC/DC is not used, this pin is supplied internally from the main LDO.

If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

(4)

(5)

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7.7 Pin Diagram – RSM Package

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Figure 7-4. RSM Package 32-Pin VQFN (4-mm × 4-mm) Pinout, 0.4-mm Pitch

I/O pins marked in Figure 7-4 in bold have high-drive capabilities; they are as follows:

• Pin 8, DIO_0

• Pin 9, DIO_1

• Pin 10, DIO_2

• Pin 13, JTAG_TMSC

• Pin 15, DIO_3

• Pin 16, DIO_4

I/O pins marked in Figure 7-4 in italics have analog capabilities; they are as follows:

• Pin 22, DIO_5

• Pin 23, DIO_6

• Pin 24, DIO_7

• Pin 25, DIO_8

• Pin 26, DIO_9

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SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

7.8 Signal Descriptions – RSM Package

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Table 7-4. Signal Descriptions – RSM Package

DESCRIPTION

TYPE

NO.

Power

Power

Output from internal DC/DC.(1). Tie to ground for external regulator mode

(1.7-V to 1.95-V operation)

1.27-V regulated digital-supply decoupling capacitor(2)

NAME

DCDC_SW

DCOUPL

DIO_0

DIO_1

DIO_2

DIO_3

DIO_4

DIO_5

DIO_6

DIO_7

DIO_8

DIO_9

RF_N

RF_P

RX_TX

VDDR

JTAG_TMSC

JTAG_TCKC

RESET_N

VDDR_RF

VDDS

VDDS2

VDDS_DCDC

VSS

X32K_Q1

X32K_Q2

X24M_N

X24M_P

EGP

18

12

8

9

10

15

16

22

23

24

25

26

13

14

21

2

1

4

28

32

27

11

19

5

6

30

31

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, Sensor Controller, high-drive capability

Digital I/O

GPIO, High-drive capability, JTAG_TDO

Digital I/O

GPIO, High-drive capability, JTAG_TDI

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital/Analog I/O GPIO, Sensor Controller, Analog

Digital I/O

JTAG TMSC

Digital I/O

JTAG TCKC(3)

Digital Input

Reset, active-low. No internal pullup.

Negative RF input signal to LNA during RX

Negative RF output signal to PA during TX

Positive RF input signal to LNA during RX

Positive RF output signal to PA during TX

Optional bias pin for the RF LNA

RF I/O

RF I/O

RF I/O

Power

Power

Power

Power

Power

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC.(2) (4)

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(2) (5)

1.8-V to 3.8-V main chip supply(1)

1.8-V to 3.8-V GPIO supply(1)

1.8-V to 3.8-V DC/DC supply. Tie to ground for external regulator mode

(1.7-V to 1.95-V operation).

3, 7, 17, 20,

29

Power

Ground

Analog I/O

32-kHz crystal oscillator pin 1

Analog I/O

32-kHz crystal oscillator pin 2

Analog I/O

24-MHz crystal oscillator pin 1

Analog I/O

24-MHz crystal oscillator pin 2

Power

Ground – Exposed Ground Pad

See technical reference manual (listed in Section 11.3) for more details.

(1)

(2) Do not supply external circuitry from this pin.

(3)

For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

If internal DC/DC is not used, this pin is supplied internally from the main LDO.

If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

(4)

(5)

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8 Specifications

8.1 Absolute Maximum Ratings

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

over operating free-air temperature range (unless otherwise noted)(1) (2)

Supply voltage (VDDS, VDDS2,

and VDDS3)

Supply voltage (VDDS(3) and

VDDR)

Voltage on any digital pin(4) (5)

VDDR supplied by internal DC/DC regulator or

internal GLDO. VDDS_DCDC connected to VDDS

on PCB

External regulator mode (VDDS and VDDR pins

connected on PCB)

Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X24M_N and X24M_P

Voltage scaling enabled

Voltage on ADC input (Vin)

Voltage scaling disabled, internal reference

Voltage scaling disabled, VDDS as reference

Input RF level

Storage temperature

MIN

–0.3

–0.3

–0.3

–0.3

–0.3

–0.3

–0.3

–40

MAX UNIT

4.1

2.25

VDDSx + 0.3, max 4.1

VDDR + 0.3, max 2.25

VDDS

1.49

VDDS / 2.9

5 dBm

150

°C

All voltage values are with respect to ground, unless otherwise noted.

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

In external regulator mode, VDDS2 and VDDS3 must be at the same potential as VDDS.

Including analog-capable DIO.

Each pin is referenced to a specific VDDSx (VDDS, VDDS2 or VDDS3). For a pin-to-VDDS mapping table, see Table 9-3 .

8.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

...

RSM, RHB, and RGZ packages

Electrostatic discharge

...

YFV package

Human body model (HBM), per ANSI/ESDA/

JEDEC JS001(1)

Charged device model (CDM), per JESD22-

C101(2)

Human body model (HBM), per ANSI/ESDA/

JEDEC JS001(1)

Charged device model (CDM), per JESD22-

C101(2)

Non-RF pins

All pins

RF pins

All pins

RF pins

Non-RF pins

±2500

±500

±500

±1500

±500

±500

(1)

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Tstg

(1)

(2)

(3)

(4)

(5)

VESD

VESD

V

V

V

V

V

V

V

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SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

Ambient temperature

Operating supply

voltage (VDDS and

VDDR), external

regulator mode

Operating supply

voltage VDDS

Operating supply

voltages VDDS2 and

VDDS3

Operating supply

voltages VDDS2 and

VDDS3

For operation in 1.8-V systems

(VDDS and VDDR pins connected on PCB, internal DC/DC cannot be used)

1.7

1.95

V

For operation in battery-powered and 3.3-V systems

(internal DC/DC can be used to minimize power consumption)

VDDS < 2.7 V

VDDS ≥ 2.7 V

1.9

3.8

V

8.4 Power Consumption Summary

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V with internal DC/DC

converter, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

www.ti.com

MIN

–40

MAX UNIT

85

°C

1.8

1.8

3.8

3.8

V

V

Icore

Core current consumption

Reset. RESET_N pin asserted or VDDS below

Power-on-Reset threshold

Shutdown. No clocks running, no retention

Standby. With RTC, CPU, RAM and (partial)

register retention. RCOSC_LF

Standby. With RTC, CPU, RAM and (partial)

register retention. XOSC_LF

Standby. With Cache, RTC, CPU, RAM and

(partial) register retention. RCOSC_LF

Standby. With Cache, RTC, CPU, RAM and

(partial) register retention. XOSC_LF

Idle. Supply Systems and RAM powered.

Active. Core running CoreMark

Radio RX (1)

Radio RX(2)

Radio TX, 0-dBm output power(1)

Radio TX, 5-dBm output power(2)

Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) (3)

Peripheral power domain

Delta current with domain enabled

Serial power domain

Delta current with domain enabled

Iperi

RF Core

µDMA

Timers

I2C

I2S

SSI

UART

Delta current with power domain enabled, clock

enabled, RF core idle

Delta current with clock enabled, module idle

Delta current with clock enabled, module idle

Delta current with clock enabled, module idle

Delta current with clock enabled, module idle

Delta current with clock enabled, module idle

Delta current with clock enabled, module idle

Single-ended RF mode is optimized for size and power consumption. Measured on CC2650EM-4XS.

(1)

(2) Differential RF mode is optimized for RF performance. Measured on CC2650EM-5XD.

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1.45 mA +

31 µA/MHz

100

150

1.1

1.3

2.8

3.0

650

5.9

6.1

6.1

9.1

50

13

237

130

113

12

36

93

164

nA

µA

mA

µA

µA

µA

µA

µA

µA

µA

µA

µA

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

MAX UNIT

www.ti.com

(3)

Iperi is not supported in Standby or Shutdown.

8.5 General Characteristics

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

FLASH MEMORY

Supported flash erase cycles before

failure(1)

Maximum number of write operations

per row before erase(2)

Flash retention

105°C

Flash page/sector erase current

Average delta current

Flash page/sector size

Flash write current

Flash page/sector erase time(3)

Flash write time(3)

4 bytes at a time

Average delta current, 4 bytes at a time

(1)

(2)

(3)

Aborting flash during erase or program modes is not a safe operation.

Each row is 2048 bits (or 256 Bytes) wide.

This number is dependent on Flash aging and will increase over time and erase cycles.

8.6 125-kbps Coded (Bluetooth 5) – RX

Receiver sensitivity

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Data rate error tolerance

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Difference between the incoming carrier frequency

and the internally generated carrier frequency

Difference between incoming data rate and the

internally generated data rate (37-byte packets)

Difference between incoming data rate and the

internally generated data rate (255-byte packets)

Co-channel rejection (1)

Wanted signal at –79 dBm, modulated interferer in

channel, BER = 10–3

Selectivity, ±1 MHz (1)

Selectivity, ±2 MHz (1)

Selectivity, ±3 MHz (1)

Selectivity, ±4 MHz (1)

Selectivity, ±6 MHz (1)

Wanted signal at –79 dBm, modulated interferer at ±1

MHz, BER = 10–3

Wanted signal at –79 dBm, modulated interferer at ±2

MHz, Image frequency is at –2 MHz, BER = 10–3

Wanted signal at –79 dBm, modulated interferer at ±3

MHz, BER = 10–3

Wanted signal at –79 dBm, modulated interferer at ±4

MHz, BER = 10–3

Wanted signal at –79 dBm, modulated interferer at ±6

MHz, BER = 10–3

Alternate channel rejection, ±7

Wanted signal at –79 dBm, modulated interferer at ≥

MHz(1)

±7 MHz, BER = 10–3

Selectivity, image frequency(1) Wanted signal at –79 dBm, modulated interferer at

image frequency, BER = 10–3

100

11.4

–260

–260

–140

k Cycles

83

write

operations

Years at

105°C

mA

KB

mA

ms

µs

dBm

dBm

310

kHz

260

ppm

140

ppm

dB

dB

dB

dB

dB

dB

dB

dB

12.6

8.15

4

8

8

TYP

–103

>5

–3

9 / 5(2)

43 / 32(2)

47 / 42(2)

46 / 47(2)

49 / 46(2)

50 / 47(2)

32

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SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

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Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Selectivity, image frequency

±1 MHz(1)

Note that Image frequency + 1 MHz is the Co-channel

–1 MHz. Wanted signal at –79 dBm, modulated

interferer at ±1 MHz from image frequency, BER =

10–3

Blocker rejection, ±8 MHz and

above(1)

Wanted signal at –79 dBm, modulated interferer at ±8

MHz and above, BER = 10–3

Out-of-band blocking (3)

30 MHz to 2000 MHz

Out-of-band blocking

2003 MHz to 2399 MHz

Out-of-band blocking

2484 MHz to 2997 MHz

Intermodulation

Wanted signal at 2402 MHz, –76 dBm. Two

interferers at 2405 and 2408 MHz respectively, at the

given power level

(1) Numbers given as I/C dB.

(2)

(3)

X / Y, where X is +N MHz and Y is –N MHz.

Excluding one exception at Fwanted / 2, per Bluetooth Specification.

8.7 125-kbps Coded (Bluetooth 5) – TX

Output power, highest setting

Differential mode, delivered to a single-ended 50-Ω load

through a balun

Output power, highest setting

Measured on CC2650EM-4XS, delivered to a single-ended

50-Ω load

Output power, lowest setting

Delivered to a single-ended 50-Ω load through a balun

f < 1 GHz, outside restricted bands

Spurious emission conducted

measurement(1)

f < 1 GHz, restricted bands ETSI

f < 1 GHz, restricted bands FCC

f > 1 GHz, including harmonics

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

(1)

Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

8.8 500-kbps Coded (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

MAX UNIT

Receiver sensitivity

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Data rate error tolerance

Co-channel rejection (1)

Selectivity, ±1 MHz (1)

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Difference between the incoming carrier frequency

and the internally generated carrier frequency

Difference between incoming data rate and the

internally generated data rate (37-byte packets)

Difference between incoming data rate and the

internally generated data rate (255-byte packets)

Wanted signal at –72 dBm, modulated interferer in

channel, BER = 10–3

Wanted signal at –72 dBm, modulated interferer at ±1

MHz, BER = 10–3

–240

–500

–310

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5 / 32(2)

>46

–40

–19

–22

–42

5

2

–21

–43

–65

–71

–46

TYP

–101

>5

–5

9 / 5(2)

dB

dB

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

240

kHz

500

ppm

330

ppm

dB

dB

www.ti.com

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Selectivity, ±2 MHz (1)

Selectivity, ±3 MHz (1)

Selectivity, ±4 MHz (1)

Selectivity, ±6 MHz (1)

Wanted signal at –72 dBm, modulated interferer at ±2

MHz, Image frequency is at –2 MHz, BER = 10–3

Wanted signal at –72 dBm, modulated interferer at ±3

MHz, BER = 10–3

Wanted signal at –72 dBm, modulated interferer at ±4

MHz, BER = 10–3

Wanted signal at –72 dBm, modulated interferer at ±6

MHz, BER = 10–3

Alternate channel rejection,

±7 MHz(1)

Selectivity, image frequency(1) Wanted signal at –72 dBm, modulated interferer at

Wanted signal at –72 dBm, modulated interferer at

≥ ±7 MHz, BER = 10–3

image frequency, BER = 10–3

Selectivity, image frequency

±1 MHz(1)

Note that Image frequency + 1 MHz is the Co-channel

–1 MHz. Wanted signal at –72 dBm, modulated

interferer at ±1 MHz from image frequency, BER =

10–3

Blocker rejection, ±8 MHz and

above(1)

Wanted signal at –72 dBm, modulated interferer at ±8

MHz and above, BER = 10–3

Out-of-band blocking (3)

30 MHz to 2000 MHz

Out-of-band blocking

2003 MHz to 2399 MHz

Out-of-band blocking

2484 MHz to 2997 MHz

Intermodulation

Wanted signal at 2402 MHz, –69 dBm. Two

interferers at 2405 and 2408 MHz respectively, at the

given power level

(1) Numbers given as I/C dB.

(2)

(3)

X / Y, where X is +N MHz and Y is –N MHz.

Excluding one exception at Fwanted / 2, per Bluetooth Specification.

8.9 500-kbps Coded (Bluetooth 5) – TX

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Output power, highest setting

Differential mode, delivered to a single-ended 50-Ω load

through a balun

Output power, highest setting

Measured on CC2650EM-4XS, delivered to a single-ended

50-Ω load

Output power, lowest setting

Delivered to a single-ended 50-Ω load through a balun

f < 1 GHz, outside restricted bands

Spurious emission conducted

measurement(1)

f < 1 GHz, restricted bands ETSI

f < 1 GHz, restricted bands FCC

f > 1 GHz, including harmonics

(1)

Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

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41 / 31(2)

44 / 41(2)

44 / 44(2)

44 / 44(2)

44 / 44(2)

31

5 / 41(2)

44

–35

–19

–19

–37

5

2

–21

–43

–65

–71

–46

dB

dB

dB

dB

dB

dB

dB

dB

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

8.10 1-Mbps GFSK (Bluetooth low energy) – RX

www.ti.com

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

MAX UNIT

Receiver sensitivity

Receiver sensitivity

Receiver saturation

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Co-channel rejection(1)

Selectivity, ±1 MHz(1)

Selectivity, ±2 MHz(1)

Selectivity, ±3 MHz(1)

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Single-ended mode. Measured on CC2650EM-4XS,

at the SMA connector, BER = 10–3

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Single-ended mode. Measured on CC2650EM-4XS,

at the SMA connector, BER = 10–3

Difference between the incoming carrier frequency

and the internally generated carrier frequency

Difference between incoming data rate and the

internally generated data rate

Wanted signal at –67 dBm, modulated interferer in

channel, BER = 10–3

Wanted signal at –67 dBm, modulated interferer at ±1

MHz, BER = 10–3

Wanted signal at –67 dBm, modulated interferer at ±2

MHz, BER = 10–3

Wanted signal at –67 dBm, modulated interferer at ±3

MHz, BER = 10–3

Selectivity, ±4 MHz(1)

Wanted signal at –67 dBm, modulated interferer at ±4

MHz, BER = 10–3

Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at

≥ ±5 MHz, BER = 10–3

Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at

image frequency, BER = 10–3

Out-of-band blocking (3)

30 MHz to 2000 MHz

Out-of-band blocking

2003 MHz to 2399 MHz

Out-of-band blocking

2484 MHz to 2997 MHz

Out-of-band blocking

3000 MHz to 12.75 GHz

Intermodulation

Spurious emissions,

30 to 1000 MHz

Spurious emissions,

1 to 12.75 GHz

RSSI dynamic range

RSSI accuracy

Wanted signal at 2402 MHz, –64 dBm. Two

interferers at 2405 and 2408 MHz respectively, at the

given power level

Conducted measurement in a 50-Ω single-ended

load. Suitable for systems targeting compliance with

EN 300 328, EN 300 440 class 2, FCC CFR47, Part

15 and ARIB STD-T-66

Conducted measurement in a 50-Ω single-ended

load. Suitable for systems targeting compliance with

EN 300 328, EN 300 440 class 2, FCC CFR47, Part

15 and ARIB STD-T-66

(1) Numbers given as I/C dB.

(2)

(3)

X / Y, where X is +N MHz and Y is –N MHz.

Excluding one exception at Fwanted / 2, per Bluetooth Specification.

–350

–750

350

kHz

750

ppm

–6

7 / 3(2)

34 / 25(2)

38 / 26(2)

42 / 29(2)

TYP

–97

–96

4

0

32

25

–20

–5

–8

–10

–34

–71

–62

70

±4

dBm

dBm

dBm

dBm

dB

dB

dB

dB

dB

dB

dB

dB

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dB

dB

Selectivity, image frequency

±1 MHz(1)

Wanted signal at –67 dBm, modulated interferer at ±1

MHz from image frequency, BER = 10–3

3 / 26(2)

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8.11 1-Mbps GFSK (Bluetooth low energy) – TX

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Output power, highest setting

Differential mode, delivered to a single-ended 50-Ω load

through a balun

Output power, highest setting

Measured on CC2650EM-4XS, delivered to a single-ended

50-Ω load

Output power, lowest setting

Delivered to a single-ended 50-Ω load through a balun

f < 1 GHz, outside restricted bands

Spurious emission conducted

measurement(1)

f < 1 GHz, restricted bands ETSI

f < 1 GHz, restricted bands FCC

f > 1 GHz, including harmonics

(1)

Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

8.12 2-Mbps GFSK (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

MAX UNIT

Receiver sensitivity

Receiver saturation

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Differential mode. Measured at the CC2650EM-5XD

SMA connector, BER = 10–3

Frequency error tolerance

Difference between the incoming carrier frequency and

the internally generated carrier frequency

Data rate error tolerance

Co-channel rejection(1)

Selectivity, ±2 MHz(1)

Selectivity, ±4 MHz(1)

Selectivity, ±6 MHz(1)

Difference between incoming data rate and the

internally generated data rate

Wanted signal at –67 dBm, modulated interferer in

channel, BER = 10–3

Wanted signal at –67 dBm, modulated interferer at

±2 MHz, Image frequency is at –2 MHz BER = 10–3

Wanted signal at –67 dBm, modulated interferer at

±4 MHz, BER = 10–3

Wanted signal at –67 dBm, modulated interferer at

±6 MHz, BER = 10–3

Alternate channel rejection,

±7 MHz(1)

Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at

Wanted signal at –67 dBm, modulated interferer at

≥ ±7 MHz, BER = 10–3

image frequency, BER = 10–3

Selectivity, image frequency

±2 MHz(1)

Note that Image frequency + 2 MHz is the Co-channel.

Wanted signal at –67 dBm, modulated interferer at

±2 MHz from image frequency, BER = 10–3

Out-of-band blocking(3)

30 MHz to 2000 MHz

Out-of-band blocking

2003 MHz to 2399 MHz

Out-of-band blocking

2484 MHz to 2997 MHz

Out-of-band blocking

3000 MHz to 12.75 GHz

Intermodulation

Wanted signal at 2402 MHz, –64 dBm. Two interferers

at 2408 and 2414 MHz respectively, at the given power

level

(1) Numbers given as I/C dB.

(2)

X / Y, where X is +N MHz and Y is –N MHz.

–300

–1000

500

kHz

1000

ppm

5

2

–21

–43

–65

–71

–46

TYP

–91

3

–7

8 / 4(2)

31 / 26(2)

37 / 38(2)

37 / 36(2)

–7 / 26(2)

4

–33

–15

–12

–10

–45

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dB

dB

dB

dB

dB

dB

dB

dBm

dBm

dBm

dBm

dBm

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SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

(3)

Excluding one exception at Fwanted / 2, per Bluetooth Specification.

8.13 2-Mbps GFSK (Bluetooth 5) – TX

www.ti.com

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless

otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Output power, highest setting

Differential mode, delivered to a single-ended 50-Ω load

through a balun

Output power, highest setting

Measured on CC2650EM-4XS, delivered to a single-ended

50-Ω load

Output power, lowest setting

Delivered to a single-ended 50-Ω load through a balun

f < 1 GHz, outside restricted bands

Spurious emission conducted

measurement(1)

f < 1 GHz, restricted bands ETSI

f < 1 GHz, restricted bands FCC

f > 1 GHz, including harmonics

5

2

–21

–43

–65

–71

–46

dBm

dBm

dBm

dBm

dBm

dBm

dBm

(1)

Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

8.14 24-MHz Crystal Oscillator (XOSC_HF)

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.(1)

ESR Equivalent series resistance(2)

ESR Equivalent series resistance(2)

6 pF < CL ≤ 9 pF

5 pF < CL ≤ 6 pF

LM Motional inductance(2)

CL Crystal load capacitance(2) (3)

Crystal frequency(2) (4)

Crystal frequency tolerance(2) (5)

Start-up time(4) (6)

Relates to load capacitance

(CL in Farads)

< 1.6 × 10–24 / CL 2

TYP

20

24

150

60

80

9

40

Ω

Ω

H

pF

MHz

ppm

µs

5

–40

Probing or otherwise stopping the crystal while the DC/DC converter is enabled may cause permanent damage to the device.

The crystal manufacturer's specification must satisfy this requirement

Adjustable load capacitance is integrated into the device. External load capacitors are not required

(1)

(2)

(3)

(4) Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V

(5)

Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per

specification.

Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection.

(6)

8.15 32.768-kHz Crystal Oscillator (XOSC_LF)

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

Crystal frequency(1)

Crystal frequency tolerance, Bluetooth low-

energy applications(1) (2)

ESR Equivalent series resistance(1)

CL Crystal load capacitance(1)

MIN

–500

6

TYP

32.768

MAX

UNIT

kHz

30

500

ppm

100

12

kΩ

pF

(1)

(2)

The crystal manufacturer's specification must satisfy this requirement

Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per

Bluetooth specification.

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Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

UNIT

TEST CONDITIONS

PARAMETER

MAX

TYP

MIN

www.ti.com

8.16 48-MHz RC Oscillator (RCOSC_HF)

Frequency

Uncalibrated frequency accuracy

Calibrated frequency accuracy(1)

Start-up time

(1)

Accuracy relative to the calibration source (XOSC_HF).

8.17 32-kHz RC Oscillator (RCOSC_LF)

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

48

±1%

±0.25%

5

MHz

µs

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

UNIT

TEST CONDITIONS

PARAMETER

MAX

TYP

MIN

Calibrated frequency(1)

Temperature coefficient

32.8

80

kHz

ppm/°C

(1)

The frequency accuracy of the Real Time Clock (RTC) is not directly dependent on the frequency accuracy of the 32-kHz RC

Oscillator. The RTC can be calibrated to an accuracy within ±500 ppm of 32.768 kHz by measuring the frequency error of RCOSC_LF

relative to XOSC_HF and compensating the RTC tick speed. The procedure is explained in Running Bluetooth® Low Energy on

CC2640 Without 32 kHz Crystal.

Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1)

TEST CONDITIONS

MIN

0

TYP

MAX UNIT

VDDS

8.18 ADC Characteristics

PARAMETER

Input voltage range

Resolution

Sample rate

Offset

Gain error

DNL(3) Differential nonlinearity

INL(4)

Integral nonlinearity

ENOB Effective number of bits

VDDS as reference, 200 ksps, 9.6-kHz input tone

THD

Total harmonic distortion

VDDS as reference, 200 ksps, 9.6-kHz input tone

Internal 4.3-V equivalent reference(2)

Internal 4.3-V equivalent reference(2)

Internal 4.3-V equivalent reference(2), 200 ksps,

9.6-kHz input tone

Internal 1.44-V reference, voltage scaling disabled,

32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference(2), 200 ksps,

9.6-kHz input tone

Internal 1.44-V reference, voltage scaling disabled,

32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference(2), 200 ksps,

9.6-kHz input tone

VDDS as reference, 200 ksps, 9.6-kHz input tone

Internal 1.44-V reference, voltage scaling disabled,

32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference(2), 200 ksps,

9.6-kHz input tone

VDDS as reference, 200 ksps, 9.6-kHz input tone

Internal 1.44-V reference, voltage scaling disabled,

32 samples average, 200 ksps, 300-Hz input tone

SINAD,

SNDR

Signal-to-noise

and

Distortion ratio

SFDR

Spurious-free dynamic

range

200

ksps

V

Bits

LSB

LSB

LSB

LSB

Bits

dB

dB

dB

12

2

2.4

>–1

±3

9.8

10

11.1

–65

–69

–71

60

63

69

67

68

73

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Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Conversion time

Serial conversion, time-to-output, 24-MHz clock

Current consumption

Internal 4.3-V equivalent reference(2)

Current consumption

VDDS as reference

Reference voltage

Reference voltage

Reference voltage

Reference voltage

Input impedance

Equivalent fixed internal reference (input voltage scaling

enabled). For best accuracy, the ADC conversion should

be initiated through the TIRTOS API in order to include the

gain/offset compensation factors stored in FCFG1.

Fixed internal reference (input voltage scaling disabled).

For best accuracy, the ADC conversion should be initiated

through the TIRTOS API in order to include the gain/offset

compensation factors stored in FCFG1. This value is

derived from the scaled value (4.3 V) as follows:

Vref = 4.3 V × 1408 / 4095

VDDS as reference (Also known as RELATIVE) (input

voltage scaling enabled)

VDDS as reference (Also known as RELATIVE) (input

voltage scaling disabled)

200 ksps, voltage scaling enabled. Capacitive input, Input

impedance depends on sampling frequency and sampling

time

>1

MΩ

Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.

(1) Using IEEE Std 1241™-2010 for terminology and test methods.

(2)

(3) No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device (see Figure 8-21).

(4)

(5)

For a typical example, see Figure 8-22.

Applied voltage must be within absolute maximum ratings (Section 8.1) at all times.

8.19 Temperature Sensor

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

UNIT

TEST CONDITIONS

PARAMETER

MAX

TYP

MIN

Resolution

Range

Accuracy

Supply voltage coefficient(1)

8.20 Battery Monitor

Resolution

Range

Accuracy

(1)

Automatically compensated when using supplied driver libraries.

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

UNIT

TEST CONDITIONS

PARAMETER

MAX

TYP

MIN

50

0.66

0.75

4.3(2) (5)

1.48

VDDS

VDDS /

2.82(5)

4

±5

3.2

50

13

–40

85

1.8

3.8

clock-

cycles

mA

mA

V

V

V

V

°C

°C

°C

°C/V

mV

V

mV

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SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

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8.21 Continuous Time Comparator

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

Input voltage range

External reference voltage

Internal reference voltage

Offset

Hysteresis

Decision time

Current consumption when enabled(1)

DCOUPL as reference

Step from –10 mV to 10 mV

(1)

Additionally, the bias module must be enabled when running in standby mode.

8.22 Low-Power Clocked Comparator

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

TYP

MAX

UNIT

MIN

0

VDDS

0

0

VDDS

VDDS

1.27

3

<2

0.72

8.6

32

1.49–1.51

1.01–1.03

0.78–0.79

1.25–1.28

0.63–0.65

0.42–0.44

0.33–0.34

<5

<5

<1

362

V

V

V

mV

mV

µs

µA

kHz

V

V

V

V

V

V

V

V

mV

mV

nA

Input voltage range

Clock frequency

Internal reference voltage, VDDS / 2

Internal reference voltage, VDDS / 3

Internal reference voltage, VDDS / 4

Internal reference voltage, DCOUPL / 1

Internal reference voltage, DCOUPL / 2

Internal reference voltage, DCOUPL / 3

Internal reference voltage, DCOUPL / 4

Offset

Hysteresis

Decision time

Current consumption when enabled

Step from –50 mV to 50 mV

clock-cycle

8.23 Programmable Current Source

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Current source programmable output range

Resolution

Current consumption(1)

Including current source at maximum

programmable output

(1)

Additionally, the bias module must be enabled when running in standby mode.

0.25–20

0.25

23

µA

µA

µA

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PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Device operating as SLAVE

12

65024

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

8.24 Synchronous Serial Interface (SSI)

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

S1(1) tclk_per (SSIClk period)

S2(1) tclk_high (SSIClk high time)

S3(1) tclk_low (SSIClk low time)

S1 (TX only)(1) tclk_per (SSIClk period)

S1 (TX and RX)(1) tclk_per (SSIClk period)

S2(1) tclk_high (SSIClk high time)

S3(1) tclk_low (SSIClk low time)

Device operating as SLAVE

Device operating as SLAVE

One-way communication to SLAVE -

Device operating as MASTER

Normal duplex operation -

Device operating as MASTER

Device operating as MASTER

Device operating as MASTER

(1) Refer to SSI timing diagrams Figure 8-1, Figure 8-2, and Figure 8-3.

www.ti.com

4

8

65024

65024

0.5

0.5

0.5

0.5

system

clocks

tclk_per

tclk_per

system

clocks

system

clocks

tclk_per

tclk_per

Figure 8-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement

Figure 8-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer

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SSIClkSSIFssSSITxSSIRxMSBLSBS2S3S14to16bits0SSIClkSSIFssSSITxSSIRxMSBLSBMSBLSBS2S3S18-bitcontrol4to16bitsoutputdatawww.ti.com

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Figure 8-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1

PARAMETER

TEST CONDITIONS

MIN

TYP MAX

UNIT

8.25 DC Characteristics

GPIO VOH at 8-mA load

GPIO VOL at 8-mA load

GPIO VOH at 4-mA load

GPIO VOL at 4-mA load

GPIO pullup current

GPIO pulldown current

GPIO high/low input transition,

no hysteresis

GPIO low-to-high input transition,

with hysteresis

GPIO high-to-low input transition,

with hysteresis

TA = 25°C, VDDS = 1.8 V

IOCURR = 2, high-drive GPIOs only

IOCURR = 2, high-drive GPIOs only

IOCURR = 1

IOCURR = 1

Input mode, pullup enabled, Vpad = 0 V

Input mode, pulldown enabled, Vpad = VDDS

IH = 0, transition between reading 0 and reading 1

IH = 1, transition voltage for input read as 0 → 1

IH = 1, transition voltage for input read as 1 → 0

GPIO input hysteresis

IH = 1, difference between 0 → 1 and 1 → 0 points

GPIO VOH at 8-mA load

GPIO VOL at 8-mA load

GPIO VOH at 4-mA load

GPIO VOL at 4-mA load

TA = 25°C, VDDS = 3.0 V

IOCURR = 2, high-drive GPIOs only

IOCURR = 2, high-drive GPIOs only

IOCURR = 1

IOCURR = 1

1.32

1.32

0.32

0.32

1.54

0.26

1.58

0.21

71.7

21.1

0.88

1.07

0.74

0.33

2.68

0.33

2.72

0.28

µA

µA

V

V

V

V

V

V

V

V

V

V

V

V

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SSIClk(SPO = 1)SSITx(Master)SSIRx(Slave)LSBSSIClk(SPO = 0)S2S1SSIFssLSBS3MSBMSBVIH

VIL

NAME

RθJA

RθJB

PsiJT

PsiJB

(1)

(2)

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

www.ti.com

PARAMETER

TEST CONDITIONS

MIN

TYP MAX

UNIT

GPIO pullup current

GPIO pulldown current

GPIO high/low input transition,

no hysteresis

GPIO low-to-high input transition,

with hysteresis

GPIO high-to-low input transition,

with hysteresis

TA = 25°C, VDDS = 3.8 V

Input mode, pullup enabled, Vpad = 0 V

Input mode, pulldown enabled, Vpad = VDDS

IH = 0, transition between reading 0 and reading 1

IH = 1, transition voltage for input read as 0 → 1

IH = 1, transition voltage for input read as 1 → 0

GPIO input hysteresis

IH = 1, difference between 0 → 1 and 1 → 0 points

277

113

1.67

1.94

1.54

0.4

µA

µA

V

V

V

V

TA = 25°C

Lowest GPIO input voltage reliably interpreted as a

«High»

Highest GPIO input voltage reliably interpreted as a

«Low»

0.8 VDDS(1)

0.2

VDDS(1)

(1)

Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 11.3 for more details.

8.26 Thermal Resistance Characteristics

DESCRIPTION

RSM (°C/W)(1) (2) RHB (°C/W)(1) (2) RGZ (°C/W)(1) (2) YFV (°C/W)(1) (2)

Junction-to-ambient thermal resistance

RθJC(top)

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

Junction-to-top characterization parameter

Junction-to-board characterization parameter

RθJC(bot)

Junction-to-case (bottom) thermal resistance

36.9

30.3

7.6

0.4

7.4

2.1

32.8

24.0

6.8

0.3

6.8

1.9

29.6

15.7

6.2

0.3

6.2

1.9

76.2

0.3

16.3

1.8

16.3

N/A

°C/W = degrees Celsius per watt.

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/

JEDEC standards:

•

•

•

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air).

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements.

For RSM, RHB, and RGZ, power dissipation of 2 W and an ambient temperature of 70°C is assumed. For YFV, power dissipation of

1.3 W and ambient temperature of 25°C is assumed.

8.27 Timing Requirements

Rising supply-voltage slew rate

Falling supply-voltage slew rate

Falling supply-voltage slew rate, with low-power flash settings(1)

Positive temperature gradient in standby(2)

CONTROL INPUT AC CHARACTERISTICS(3)

RESET_N low duration

No limitation for negative

temperature gradient, or

outside standby mode

MIN

NOM

MAX

UNIT

0

0

1

100 mV/µs

20 mV/µs

3 mV/µs

5

°C/s

µs

(1)

(2)

(3)

For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor (see Figure

10-1) must be used to ensure compliance with this slew rate.

Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see

Section 8.17).

TA = –40°C to +85°C, VDDS = 1.7 V to 3.8 V, unless otherwise noted.

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Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.

UNIT

TEST CONDITIONS

PARAMETER

MAX

TYP

MIN

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8.28 Switching Characteristics

WAKEUP AND TIMING

Idle → Active

Standby → Active

Shutdown → Active

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

14

151

1015

µs

µs

µs

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8.29 Typical Characteristics

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Figure 8-4. BLE Sensitivity vs Temperature

Figure 8-5. BLE Sensitivity vs Supply Voltage

(VDDS)

Figure 8-6. BLE Sensitivity vs Channel Frequency

Figure 8-7. TX Output Power vs Temperature

Figure 8-8. TX Output Power vs Supply Voltage

(VDDS)

Figure 8-9. TX Output Power vs Channel

Frequency

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Temperature (qC)Sensitivity (dBm)-40-30-20-1001020304050607080-99-98-97-96-95-94Sensitivity 4XSSensitivity 5XDVDDS (V)Sensitivity (dBm)1.82.32.83.33.8-101-100-99-98-97-96-95D004BLE 5XD SensitivityBLE 4XS SensitivityFrequency (MHz)Sensitivity Level (dBm)240024102420243024402450246024702480-99-98.5-98-97.5-97-96.5-96-95.5-95D020Sensitivity 5XDSensitivity 4XSTemperature (qC)Output Power (dBm)-40-30-20-100102030405060708001234564XS 2-dBm Setting5XD 5-dBm SettingVDDS (V)Output power (dBm)1.82.32.83.33.80123456D0035XD 5(cid:16)dBm Setting4XS 2(cid:16)dBm SettingFrequency (MHz)Output Power (dBm)240024102420243024402450246024702480-1012345678D0215-dBm setting (5XD)0-dBm setting (4XS)www.ti.com

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

Figure 8-10. TX Current Consumption vs Supply

Voltage (VDDS)

Figure 8-11. RX Mode Current vs Supply Voltage

(VDDS)

Figure 8-12. RX Mode Current Consumption vs

Temperature

Figure 8-13. TX Mode Current Consumption vs

Temperature

Figure 8-14. Active Mode (MCU Running, No

Peripherals) Current Consumption vs Temperature

Figure 8-15. Active Mode (MCU Running, No

Peripherals) Current Consumption vs Supply

Voltage (VDDS)

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VDDS (V)TX Current (mA)1.822.22.42.62.833.23.43.63.845678910111213141516D0154XS 0-dBm Setting4XS 2-dBm Setting5XD 5-dBm SettingVoltage (V)Current Consumption (mA)1.82.052.32.552.83.053.33.553.844.555.566.577.588.599.51010.5D0164XS5XDTemperature (qC)RX Current (mA)-40-30-20-10010203040506070805.65.866.26.46.66.87D0015XD RX Current4XS RX CurrentTemperature (qC)TX Current (mA)-40-30-20-1001020304050607080024681012D0025XD 5(cid:16)dBm Setting4XS 2(cid:16)dBm SettingTemperature (qC)Active Mode Current Consumpstion (mA)-40-30-20-10010203040506070802.852.92.9533.053.1D006Active Mode CurrentVDDS (V)Current Consumption (mA)1.82.32.83.33.822.533.544.55D007Active Mode CurrentCC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

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Figure 8-16. SoC ADC Effective Number of Bits vs

Input Frequency (Internal Reference, Scaling

enabled)

Figure 8-17. SoC ADC Output vs Supply Voltage

(Fixed Input, Internal Reference)

Figure 8-18. SoC ADC Output vs Temperature

(Fixed Input, Internal Reference)

Figure 8-19. SoC ADC ENOB vs Sampling

Frequency (Scaling enabled, input frequency =

FS / 10)

Figure 8-20. Standby Mode Supply Current vs Temperature

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Input Frequency (Hz)Effective Number of Bits20030050010002000500010000200001000009.49.69.81010.210.410.610.81111.211.4D009Fs= 200 kHz, No AveragingFs= 200 kHz, 32 samples averagingVDDS (V)ADC Code1.82.32.83.33.81004.810051005.21005.41005.61005.810061006.21006.4D012Temperature (qC)ADC Code-40-30-20-10010203040506070801004.510051005.510061006.510071007.5D013Sampling Frequency (Hz)ENOB9.69.79.89.91010.110.210.310.410.51k10k100k200kD009AENOB Internal Reference (No Averaging)ENOB Internal Reference (32 Samples Averaging)www.ti.com

CC2640R2F

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Figure 8-21. SoC ADC DNL vs ADC Code (Internal Reference)

Figure 8-22. SoC ADC INL vs ADC Code (Internal Reference)

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ADC CodeDNL020040060080010001200140016001800200022002400260028003000320034003600380040004200-1.5-1-0.500.511.522.533.5D010ADC CodeINL020040060080010001200140016001800200022002400260028003000320034003600380040004200-4-3-2-10123D011CC2640R2F

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9 Detailed Description

9.1 Overview

The core modules of the CC26xx product family are shown in Section 9.2.

9.2 Functional Block Diagram

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SimpleLink CC26xx Wireless MCUMain CPU:128-KBFlashSensor ControllercJTAG 20-KBSRAMROMARMCortex-M3DC-DC ConverterRF CoreARMCortex-M0DSP modem4-KB SRAMROMSensor Controller Engine2× Comparator12-bit ADC, 200 ks/sConstant Current SourceSPI-I2C Digital Sensor IF2-KB SRAMTime-to-digital ConverterGeneral Peripherals / Modules4× 32-bit Timers2× SSI (SPI, µW, TI)Watchdog TimerTemp. / Batt. MonitorRTCI2CUART I2S10 / 14 / 15 / 31 GPIOsAES32 ch. µDMAADCDigital PLLUp to 48 MHz61 µA/MHzTRNGADC8-KBcacheCopyright © 2016, Texas Instruments Incorporatedwww.ti.com

9.3 Main CPU

CC2640R2F

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The SimpleLink™ CC2640R2F Wireless MCU contains an Arm® Cortex®-M3 (CM3) 32-bit CPU, which runs the

application and the higher layers of the protocol stack.

The CM3 processor provides a high-performance, low-cost platform that meets the system requirements of

minimal memory implementation, and low-power consumption, while delivering outstanding computational

performance and exceptional system response to interrupts.

Arm® Cortex®-M3 features include:

• 32-bit Arm® Cortex®-M3 architecture optimized for small-footprint embedded applications

• Outstanding processing performance combined with fast interrupt handling

• Arm® Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit Arm®

core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few

kilobytes of memory for microcontroller-class applications:

– Single-cycle multiply instruction and hardware divide

– Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral control

– Unaligned data access, enabling data to be efficiently packed into memory

• Fast code execution permits slower processor clock or increases sleep mode time

• Harvard architecture characterized by separate buses for instruction and data

• Efficient processor core, system, and memories

• Hardware division and fast digital-signal-processing oriented multiply accumulate

• Saturating arithmetic for signal processing

• Deterministic, high-performance interrupt handling for time-critical applications

• Enhanced system debug with extensive breakpoint and trace capabilities

• Serial wire trace reduces the number of pins required for debugging and tracing

• Migration from the ARM7™ processor family for better performance and power efficiency

• Optimized for single-cycle flash memory use

• Ultra-low-power consumption with integrated sleep modes

• 1.25 DMIPS per MHz

9.4 RF Core

The RF Core contains an Arm® Cortex®-M0 processor that interfaces the analog RF and base-band circuits,

handles data to and from the system side, and assembles the information bits in a given packet structure. The

RF core offers a high level, command-based API to the main CPU.

The RF core is capable of autonomously handling the time-critical aspects of the radio protocols (Bluetooth® low

energy) thus offloading the main CPU and leaving more resources for the user application.

The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The Arm®

Cortex®-M0 processor is not programmable by customers.

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9.5 Sensor Controller

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The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this

domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This

CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power

consumption and offloading the main CM3 CPU. The GPIOs that can be connected to the Sensor Controller are

listed in Table 9-1.

The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and

potential use cases may be (but are not limited to):

• Analog sensors using integrated ADC

• Digital sensors using GPIOs, bit-banged I2C, and SPI

• UART communication for sensor reading or debugging

• Capacitive sensing

• Waveform generation

• Pulse counting

• Keyboard scan

• Quadrature decoder for polling rotation sensors

• Oscillator calibration

Texas Instruments provides application examples for some of these use cases, but not for all of them.

The peripherals in the Sensor Controller include the following:

• The low-power clocked comparator can be used to wake the device from any state in which the comparator is

active. A configurable internal reference can be used in conjunction with the comparator. The output of the

comparator can also be used to trigger an interrupt or the ADC.

• Capacitive sensing functionality is implemented through the use of a constant current source, a time-to-digital

converter, and a comparator. The continuous time comparator in this block can also be used as a higher-

accuracy alternative to the low-power clocked comparator. The Sensor Controller will take care of baseline

tracking, hysteresis, filtering and other related functions.

• The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be

triggered by many different sources, including timers, I/O pins, software, the analog comparator, and the

RTC.

• The Sensor Controller also includes a SPI–I2C digital interface.

• The analog modules can be connected to up to eight different GPIOs.

The peripherals in the Sensor Controller can also be controlled from the main application processor.

Table 9-1. GPIOs Connected to the Sensor Controller (1)

5 × 5 RHB

DIO NUMBER

2.7 × 2.7 YFV

DIO NUMBER

7 × 7 RGZ

DIO NUMBER

4 × 4 RSM

DIO NUMBER

ANALOG

CAPABLE

Y

Y

Y

Y

Y

Y

Y

Y

N

N

N

30

29

28

27

26

25

24

23

7

6

5

13

12

11

9

10

8

7

4

3

2

9

8

7

6

5

2

1

0

Note

14

13

12

11

9

10

8

7

4

3

2

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Table 9-1. GPIOs Connected to the Sensor Controller (1) (continued)

5 × 5 RHB

DIO NUMBER

2.7 × 2.7 YFV

DIO NUMBER

7 × 7 RGZ

DIO NUMBER

4 × 4 RSM

DIO NUMBER

ANALOG

CAPABLE

N

N

N

N

N

4

3

2

1

0

1

0

1

0

(1) Depending on the package size, up to 16 pins can be connected to the Sensor Controller. Up to 8

of these pins can be connected to analog modules.

9.6 Memory

The Flash memory provides nonvolatile storage for code and data. The Flash memory is in-system

programmable.

The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two 4-KB

blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or disabled

individually for each block to minimize power consumption. In addition, if flash cache is disabled, the 8-KB cache

can be used as a general-purpose RAM.

The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib, and lower layer protocol stack

software ( Bluetooth low energy Controller). It also contains a bootloader that can be used to reprogram the

device using SPI or UART. For CC2640R2Fxxx devices, the ROM contains Bluetooth 4.2 low energy host- and

controller software libraries, leaving more of the flash memory available for the customer application.

9.7 Debug

9.8 Power Management

The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface.

To minimize power consumption, the CC2640R2F device supports a number of power modes and power

management features (see Table 9-2).

Wake-up Time to CPU Active(1)

1.45 mA + 31 µA/MHz

0.15 µA

1015 µs

0.1 µA

1015 µs

MODE

CPU

Flash

SRAM

Radio

Supply System

Current

Register Retention

SRAM Retention

High-Speed Clock

Low-Speed Clock

Peripherals

Sensor Controller

Wake up on RTC

Wake up on Pin Edge

Table 9-2. Power Modes

SOFTWARE CONFIGURABLE POWER MODES

STANDBY

SHUTDOWN

RESET PIN

HELD

Available

Available

ACTIVE

Active

On

On

On

–

Full

Full

XOSC_HF or

RCOSC_HF

XOSC_LF or

RCOSC_LF

Available

Available

Available

Available

IDLE

Off

Available

On

On

650 µA

14 µs

Full

Full

XOSC_HF or

RCOSC_HF

XOSC_LF or

RCOSC_LF

Available

Available

Available

Available

Duty Cycled

Off

Off

On

Off

1 µA

151 µs

Partial

Full

Off

XOSC_LF or

RCOSC_LF

Off

Available

Available

Available

Off

Off

Off

Off

Off

No

No

Off

Off

Off

Off

Off

Available

Off

Off

Off

Off

Off

No

No

Off

Off

Off

Off

Off

Off

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MODE

Wake up on Reset Pin

Brown Out Detector (BOD)

Power On Reset (POR)

(1) Not including RTOS overhead

ACTIVE

Available

Active

Active

Table 9-2. Power Modes (continued)

SOFTWARE CONFIGURABLE POWER MODES

IDLE

Available

Active

Active

RESET PIN

HELD

STANDBY

SHUTDOWN

Available

Available

Available

Duty Cycled

Active

Off

Active

N/A

N/A

In active mode, the application CM3 CPU is actively executing code. Active mode provides normal operation of

the processor and all of the peripherals that are currently enabled. The system clock can be any available clock

source (see Table 9-2).

In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked

and no code is executed. Any interrupt event will bring the processor back into active mode.

In standby mode, only the always-on domain (AON) is active. An external wake-up event, RTC event, or sensor-

controller event is required to bring the device back to active mode. MCU peripherals with retention do not need

to be reconfigured when waking up again, and the CPU continues execution from where it went into standby

mode. All GPIOs are latched in standby mode.

In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller. The

I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin

defined as a wake-up from Shutdown pin wakes up the device and functions as a reset trigger. The CPU can

differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status

register. The only state retained in this mode is the latched I/O state and the Flash memory contents.

The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller

independently of the main CPU, which means that the main CPU does not have to wake up, for example, to

execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current and wake-up time

that would otherwise be wasted. The Sensor Controller Studio enables the user to configure the sensor

controller and choose which peripherals are controlled and which conditions wake up the main CPU.

9.9 Clock Systems

The CC2640R2F supports two external and two internal clock sources.

A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to create a

48-MHz clock.

The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than

±500 ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal

32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed crystal

oscillator is designed for use with a 32-kHz watch-type crystal.

The internal high-speed oscillator (48-MHz) can be used as a clock source for the CPU subsystem.

The internal low-speed oscillator (32.768-kHz) can be used as a reference if the low-power crystal oscillator is

not used.

The 32-kHz clock source can be used as external clocking reference through GPIO.

9.10 General Peripherals and Modules

The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be

assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a

programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge

(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs

have high drive capabilities (marked in bold in Section 7).

The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and Texas Instruments

synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.

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The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baud-rate

generation up to a maximum of 3 Mbps .

Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be

configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.

Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.

In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF timer can

be synchronized to the RTC.

The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface is

capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.

The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,

initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that

create unpredictable output to feed a complex nonlinear combinatorial circuit.

The watchdog timer is used to regain control if the system fails due to a software error after an external device

fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-

out value is reached.

The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload

data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the available bus

bandwidth. The µDMA controller can perform transfer between memory and peripherals. The µDMA controller

has dedicated channels for each supported on-chip module and can be programmed to automatically perform

transfers between peripherals and memory as the peripheral is ready to transfer more data. Some features of

the µDMA controller include the following (this is not an exhaustive list):

• Highly flexible and configurable channel operation of up to 32 channels

• Transfer modes:

– Memory-to-memory

– Memory-to-peripheral

– Peripheral-to-memory

– Peripheral-to-peripheral

• Data sizes of 8, 16, and 32 bits

The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital supply is

off). This circuitry includes the following:

• The RTC can be used to wake the device from any state where it is active. The RTC contains three compare

and one capture registers. With software support, the RTC can be used for clock and calendar operation. The

RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be compensated to tick at the

correct frequency even when the internal 32-kHz RC oscillator is used instead of a crystal.

• The battery monitor and temperature sensor are accessible by software and give a battery status indication

as well as a coarse temperature measure.

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9.11 Voltage Supply Domains

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The CC2640R2F device can interface to two or three different voltage domains depending on the package type.

On-chip level converters ensure correct operation as long as the signal voltage on each input/output pin is set

with respect to the corresponding supply pin (VDDS, VDDS2 or VDDS3). Table 9-3 lists the pin-to-VDDS

mapping.

Table 9-3. Pin Function to VDDS Mapping Table

Package

VQFN 7 × 7 (RGZ)

VQFN 5 × 5 (RHB)

DSBGA (YFV)

DIO 23–30

Reset_N

DIO 0–11

DIO 12–22

JTAG

DIO 7–14

Reset_N

DIO 0–6

JTAG

N/A

VQFN 4 × 4

(RSM)

DIO 5–9

Reset_N

DIO 0–4

JTAG

DIO 7–13

Reset_N

DIO 0–6

JTAG

N/A

N/A

VDDS(1)

VDDS2

VDDS3

(1)

VDDS_DCDC must be connected to VDDS on the PCB.

9.12 System Architecture

Depending on the product configuration, CC26xx can function either as a Wireless Network Processor (WNP—

an IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-

Chip (SoC), with the application and protocol stack running on the Arm® Cortex®-M3 core inside the device.

In the first case, the external host MCU communicates with the device using SPI or UART. In the second case,

the application must be written according to the application framework supplied with the wireless protocol stack.

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10 Application, Implementation, and Layout

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI's customers are responsible for determining

suitability of components for their purposes. Customers should validate and test their design

implementation to confirm system functionality.

10.1 Application Information

Very few external components are required for the operation of the CC2640R2F device. This section provides

some general information about the various configuration options when using the CC2640R2F in an application,

and then shows two examples of application circuits with schematics and layout. This is only a small selection of

the many application circuit examples available as complete reference designs from the product folder on

www.ti.com.

Figure 10-1 shows the various RF front-end configuration options. The RF front end can be used in differential-

or single-ended configurations with the options of having internal or external biasing. These options allow for

various trade-offs between cost, board space, and RF performance. Differential operation with external bias

gives the best performance while single-ended operation with internal bias gives the least amount of external

components and the lowest power consumption. Reference designs exist for each of these options.

Figure 10-1. CC2640R2F Application Circuit

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Antenna(50 Ohm)1 pF1 pF2.4 nH2.4–2.7 nH6.8 pF6.2–6.8 nHAntenna(50 Ohm)1.2 pF15 nH2 nH1.2 pFAntenna(50 Ohm)1.2 pF2 nH1.2 pFAntenna(50 Ohm)1.2 pF2 nH1.2 pFPin 1 (RF P)Pin 2 (RF N)Pin 3 (RXTX)Pin 1 (RF P)Pin 2 (RF N)Pin 1 (RF P)Pin 2 (RF N)Red = Not necessary if internal bias is usedRed = Not necessary if internal bias is usedDifferential operationSingle ended operationSingle ended operation with 2 antennasPin 3 (RXTX)15 nH15 nH CC26xx (GND exposed die attached pad ) Pin 3/4 (RXTX)Pin 1 (RF P)Pin 2 (RF N)24MHz XTAL(Load caps on chip)10µF10µHOptional inductor. Only needed for DCDC operation12 pF12 pF12 pF12 pF2 nH2 nH1 pFinput decoupling10µF–22µFTo VDDR pinsVDDS_DCDC DCDC_SWRed = Not necessary if internal bias is usedCopyright © 2016, Texas Instruments IncorporatedCC2640R2F

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Figure 10-2 shows the various supply voltage configuration options. Not all power supply decoupling capacitors

or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed

overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical

reference manual (Section 11.3).

Figure 10-2. Supply Voltage Configurations

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Internal DC-DC RegulatorExternal RegulatorInternal LDO Regulator(GND Exposed DieAttached Pad)Pin 3/4 (RXTX)Pin 1 (RF P)Pin 2 (RF N)24-MHz XTAL(Load Caps on Chip)10 (cid:29)F10 (cid:29)HVDDS_DCDC Input Decoupling10 (cid:29)F–22 (cid:29)FTo All VDDR PinsVDDS_DCDC PinDCDC_SW Pin1.8 V–3.8 V to All VDDS Pins VDDRVDDRVDDSVDDSCC26xx (GND Exposed DieAttached Pad)Pin 3/4 (RXTX)Pin 1 (RF P)Pin 2 (RF N)24-MHz XTAL(Load Caps on Chip)VDDS_DCDC Input Decoupling10 (cid:29)F–22 (cid:29)FTo All VDDR PinsVDDS_DCDC PinNC1.8 V–3.8 V Supply VoltageVDDRVDDRVDDSVDDSCC26xx 10 (cid:29)FTo All VDDS Pins (GND Exposed DieAttached Pad)Pin 3/4 (RXTX)Pin 1 (RF P)Pin 2 (RF N)24-MHz XTAL(Load Capson Chip)VDDS_DCDC PinCC26xx 2.2 (cid:29)FDCDC_SW Pin1.7 V–1.95 V to All VDDR- and VDDS Pins Except VDDS_DCDCExt.RegulatorCopyright © 2016, Texas Instruments Incorporatedwww.ti.com

10.2 5 × 5 External Differential (5XD) Application Circuit

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Figure 10-3. 5 × 5 External Differential (5XD) Application Circuit

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C12DNMC131 pFL122 nH12L132 nH12VDDR Decoupling CapacitorsPin 32Pin 2950-ΩAntennaVDDSL110 uH12Y132.768 kHzC1812 pFC1712 pFPlace L1 andC8 close to pin 17C23DNMC22DNMC810 µFC10DNMC16100 nFC610 µFCC2650F128RHBU1VSS33DIO_06DIO_17DIO_28DIO_39DIO_410DIO_515DIO_616DIO_720DIO_821DIO_922DIO_1023DIO_1124DIO_1225DIO_1326DIO_1427VDDR29VDDR32VDDS28VDDS211VDDS_DCDC18DCOUPL12RESET_N19JTAG_TMSC13JTAG_TCKC14X32K_Q14X32K_Q25X24M_N30X24M_P31RF_P1RF_N2RX_TX3DCDC_SW17Y224 MHz1243C2DNMC111 pFC211 pFC20100 nFX24M_NX24M_PVDDSVDDRDCDC_SWDCDC_SWC316.8 pFVDDSnRESETC191 µFJTAG_TCKJTAG_TMSDIO_1DIO_0DIO_3DIO_2DIO_5/JTAG_TDODIO_4DIO_7DIO_6/JTAG_TDIDIO_10DIO_9DIO_8DIO_12DIO_11DIO_14DIO_13RX_TXRFPRFNL112.7 nH12L212.4 nH12VDD_EBFL1BLM18HE152SN112C9100 nFC3100 nFC4100 nFVDDS Decoupling CapacitorsPin 18Pin 28Pin 11C7100 nFL106.2 nH12R1100 kVDDRCopyright©2016,TexasInstrumentsIncorporatedCC2640R2F

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10.2.1 Layout

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Figure 10-4. 5 × 5 External Differential (5XD) Layout

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10.3 4 × 4 External Single-ended (4XS) Application Circuit

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Figure 10-5. 4 × 4 External Single-ended (4XS) Application Circuit

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RF_PC1412 pFC810FµC10DNMC16100 nFC510FµVDDS Decoupling CapacitorsVDDSPin 11Pin 27Pin 19Y132.768 kHzC1812 pFC1712 pFC3100 nFC4100 nFC6100 nFC121.2 pFVDDSR1100 kVDDRPlace L1 andC8 close to pin 18C20100 nFnRESETDIO_8DIO_0DIO_7DIO_9Pin28Pin32C9100 nFVDDR Decoupling CapacitorsVDDRY224 MHz1243C2DNMVDDSL2115 nH12L110Hµ12DCDC_SWC191 µF50-ΩAntennaFL1BLM18HE152SN112RF_N used for RX biasing.L21 may be removed at thecost of 1 dB degradedsensitivityVDD_EBC131.2 pFL122 nH12CC26XX_4X4U1DIO_08DIO_19DIO_210DIO_315DIO_416DIO_522DIO_623DIO_724DIO_825DIO_926RESET_N21JTAG_TCKC14JTAG_TMSC13X24M_P31X24M_N30DCOUPL12VSS29VSS3EGP33VDDS27VDDS211VDDS_DCDC19VDDR28VDDR32DCDC_SW18RX/TX4RF_NRF_P1X32K_Q26X32K_Q15VSS7VSS17VSS20DIO_1DIO_3/JTAG_TDODIO_2DIO_6DIO_5DIO_4/JTAG_TDIDCDC_SWJTAG_TCKnRESETJTAG_TMSC23DNMC22DNMX24M_NX24M_P2Copyright©2016,TexasInstrumentsIncorporatedCC2640R2F

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10.3.1 Layout

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Figure 10-6. 4 × 4 External Single-ended (4XS) Layout

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11 Device and Documentation Support

11.1 Device Nomenclature

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To designate the stages in the product development cycle, TI assigns prefixes to all pre-production part numbers

or date-code markings. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for

example, CC2640R2F is in production; therefore, no prefix/identification is assigned).

Device development evolutionary flow:

X

P

Experimental device that is not necessarily representative of the final device's electrical specifications and

may not use production assembly flow.

Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical

specifications.

null Production version of the silicon die that is fully qualified.

Production devices have been characterized fully, and the quality and reliability of the device have been

demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production

devices. Texas Instruments recommends that these devices not be used in any production system because their

expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type

(for example, ).

For orderable part numbers of the CC2640R2F device RSM, RHB, RGZ, or YFV package types, see the

Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales

representative.

Figure 11-1. Device Nomenclature

Copyright © 2020 Texas Instruments Incorporated

Submit Document Feedback

49

Product Folder Links: CC2640R2F

SimpleLink™MultistandardWireless MCUDEVICE FAMILYPREFIXX = Experimental deviceBlank = Qualified devicePACKAGE DESIGNATORRGZ = 48-pin VQFN (VeryThin Quad Flatpack No-Lead)RHB = 32-pin VQFN (VeryThin Quad Flatpack No-Lead)RSM = 32-pin VQFN (VeryThin Quad Flatpack No-Lead)YFV = 34-pin DSBGA(Die-Size Ball GridArray)R = Large ReelT = Small ReelCC26 xxzzz(R/T)yyyROM versionF128 = ROM version 1R2F = ROM version 2DEVICE40 = BluetoothCC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

11.2 Tools and Software

www.ti.com

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors,

generate code, develop algorithm implementations, and fully integrate and debug software and hardware

modules.

The following products support development of the CC2640R2F device applications:

Software Tools:

SmartRF Studio 7 is a PC application that helps designers of radio systems to easily evaluate the RF-IC at an

early stage in the design process.

• Test functions for sending and receiving radio packets, continuous wave transmit and receive

• Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger

• Can also be used without any hardware, but then only to generate, edit and export radio configuration

settings

• Can be used in combination with several development kits for Texas Instruments’ CCxxxx RF-ICs

Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The Sensor

Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple background tasks

autonomously and independent of the System CPU state.

• Allows for Sensor Controller task algorithms to be implemented using a C-like programming language

• Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller machine

code and associated definitions

• Allows for rapid development by using the integrated Sensor Controller task testing and debugging

functionality. This allows for live visualization of sensor data and algorithm verification.

IDEs and Compilers:

Integrated development environment with project management tools and editor

Code Composer Studio™ Integrated Development Environment (IDE):

•

• Code Composer Studio (CCS) 7.0 and later has built-in support for the CC26xx device family

• Best support for XDS debuggers; XDS100v3, XDS110 and XDS200

• High integration with TI-RTOS with support for TI-RTOS Object View

Integrated development environment with project management tools and editor

IAR EWARM 7.80.1 and later has built-in support for the CC26xx device family

IAR Embedded Workbench® for Arm®:

•

•

• Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link

•

• RTOS plugin available for TI-RTOS

Integrated development environment with project management tools and editor

For a complete listing of development-support tools for the CC2640R2F platform, visit the Texas Instruments

website at www.ti.com . For information on pricing and availability, contact the nearest TI field sales office or

authorized distributor.

50

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Copyright © 2020 Texas Instruments Incorporated

Product Folder Links: CC2640R2F

www.ti.com

11.3 Documentation Support

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

To receive notification of documentation updates, navigate to the device product folder on ti.com ( CC2640R2F ).

In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that

has changed. For change details, review the revision history included in any revised document.

The current documentation that describes the CC2640R2F devices, related peripherals, and other technical

collateral is listed in the following.

Technical Reference Manual

CC13xx, CC26xx SimpleLink™ Wireless MCU Technical Reference Manual

SPACER

11.4 Texas Instruments Low-Power RF Website

Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ

section, news and events updates. Go to www.ti.com/lprf.

11.5 Low-Power RF eNewsletter

The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other

news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles

include links to get more online information.

Sign up at: www.ti.com/lprfnewsletter

11.6 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.7 Trademarks

SmartRF™, Code Composer Studio™, LaunchPad™, TI E2E™ are trademarks of Texas Instruments.

IEEE Std 1241™ is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.

ARM7™ is a trademark of Arm Limited (or its subsidiaries).

Arm®, Cortex®, and Thumb® are registered trademarks of Arm Limited (or its subsidiaries).

CoreMark® is a registered trademark of Embedded Microprocessor Benchmark Consortium.

Bluetooth® is a registered trademark of Bluetooth SIG Inc.

IAR Embedded Workbench® are registered trademarks of IAR Systems AB.

Wi-Fi® is a registered trademark of Wi-Fi Alliance.

ZigBee® is a registered trademark of ZigBee Alliance.

All other trademarks are the property of their respective owners.

11.8 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.9 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as

defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled

product restricted by other applicable national regulations, received from disclosing party under nondisclosure

obligations (if any), or any direct product of such technology, to any destination to which such export or re-export

Copyright © 2020 Texas Instruments Incorporated

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Product Folder Links: CC2640R2F

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

www.ti.com

is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.

Department of Commerce and other competent Government authorities to the extent required by those laws.

11.10 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

52

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Copyright © 2020 Texas Instruments Incorporated

Product Folder Links: CC2640R2F

www.ti.com

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

12 Mechanical, Packaging, and Orderable Information

12.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2020 Texas Instruments Incorporated

Submit Document Feedback

53

Product Folder Links: CC2640R2F

PACKAGE OPTION ADDENDUM

21-Sep-2020

www.ti.com

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Eco Plan

Qty

(2)

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

(3)

(4/5)

Lead finish/

Ball material

(6)

CC2640R2FRGZR

ACTIVE

VQFN

RGZ

48

2500

NIPDAU | NIPDAUAG Level-3-260C-168 HR

-40 to 85

CC2640R2FRGZT

ACTIVE

VQFN

RGZ

48

250

NIPDAU | NIPDAUAG Level-3-260C-168 HR

-40 to 85

CC2640R2FRHBR

ACTIVE

VQFN

RHB

32

2500

NIPDAU | NIPDAUAG Level-3-260C-168 HR

-40 to 85

CC2640R2FRHBT

ACTIVE

VQFN

RHB

32

250

NIPDAU | NIPDAUAG Level-3-260C-168 HR

-40 to 85

CC2640R2FRSMR

ACTIVE

VQFN

RSM

32

3000

NIPDAU | NIPDAUAG Level-3-260C-168 HR

-40 to 85

CC2640R2FRSMT

ACTIVE

VQFN

RSM

32

250

NIPDAU | NIPDAUAG Level-3-260C-168 HR

-40 to 85

CC2640R2FYFVR

ACTIVE

DSBGA

YFV

34

2500

SNAGCU

Level-1-260C-UNLIM

-40 to 85

CC2640

R2F

CC2640

R2F

CC2640

R2F

CC2640

R2F

CC2640

R2F

CC2640

R2F

CC2640

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

CC2640R2FYFVT

ACTIVE

DSBGA

YFV

34

250

SNAGCU

Level-1-260C-UNLIM

-40 to 85

CC2640

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

21-Sep-2020

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CC2640R2F :

• Automotive: CC2640R2F-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2

www.ti.com

21-Sep-2020

PACKAGE MATERIALS INFORMATION

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package

Type

Package

Drawing

Pins

SPQ

A0

(mm)

B0

(mm)

K0

(mm)

P1

(mm)

W

(mm)

Pin1

Quadrant

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

CC2640R2FRGZR

CC2640R2FRGZR

CC2640R2FRGZT

CC2640R2FRGZT

CC2640R2FRHBR

CC2640R2FRSMR

CC2640R2FRSMT

CC2640R2FYFVR

CC2640R2FYFVT

VQFN

VQFN

VQFN

VQFN

VQFN

VQFN

VQFN

DSBGA

DSBGA

RGZ

RGZ

RGZ

RGZ

RHB

RSM

RSM

YFV

YFV

48

48

48

48

32

32

32

34

34

2500

2500

250

250

2500

3000

250

2500

250

330.0

330.0

180.0

180.0

330.0

330.0

180.0

180.0

180.0

16.4

16.4

16.4

16.4

12.4

12.4

12.4

8.4

8.4

7.3

7.3

7.3

7.3

5.3

4.25

4.25

2.75

2.75

7.3

7.3

7.3

7.3

5.3

4.25

4.25

2.75

2.75

1.1

1.1

1.1

1.1

1.1

1.15

1.15

0.81

0.81

12.0

12.0

12.0

12.0

8.0

8.0

8.0

4.0

4.0

16.0

16.0

16.0

16.0

12.0

12.0

12.0

8.0

8.0

Q2

Q2

Q2

Q2

Q2

Q2

Q2

Q1

Q1

Pack Materials-Page 1

www.ti.com

21-Sep-2020

PACKAGE MATERIALS INFORMATION

Device

Package Type

Package Drawing Pins

Length (mm) Width (mm) Height (mm)

*All dimensions are nominal

CC2640R2FRGZR

CC2640R2FRGZR

CC2640R2FRGZT

CC2640R2FRGZT

CC2640R2FRHBR

CC2640R2FRSMR

CC2640R2FRSMT

CC2640R2FYFVR

CC2640R2FYFVT

VQFN

VQFN

VQFN

VQFN

VQFN

VQFN

VQFN

DSBGA

DSBGA

RGZ

RGZ

RGZ

RGZ

RHB

RSM

RSM

YFV

YFV

SPQ

2500

2500

250

250

2500

3000

250

2500

250

48

48

48

48

32

32

32

34

34

336.6

367.0

210.0

210.0

336.6

336.6

210.0

182.0

182.0

336.6

367.0

185.0

185.0

336.6

336.6

185.0

182.0

182.0

31.8

35.0

35.0

35.0

31.8

31.8

35.0

20.0

20.0

Pack Materials-Page 2

RHB 32

5 x 5, 0.5 mm pitch

GENERIC PACKAGE VIEW

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224745/A

www.ti.com

RHB0032E

SCALE 3.000

A

5.1

4.9

PACKAGE OUTLINE

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

PIN 1 INDEX AREA

(0.1)

B

5.1

4.9

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS

20.000

C

SEATING PLANE

0.08 C

2X 3.5

3.45 0.1

9

(0.2) TYP

16

EXPOSED

THERMAL PAD

17

SEE SIDE WALL

DETAIL

33

SYMM

24

32X

0.3

0.2

0.1

0.05

C A B

C

1 MAX

0.05

0.00

28X 0.5

2X

3.5

8

1

PIN 1 ID

(OPTIONAL)

32

SYMM

25

32X

0.5

0.3

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4223442/B 08/2019

www.ti.com

RHB0032E

EXAMPLE BOARD LAYOUT

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

32

25

( 3.45)

SYMM

33

(1.475)

SYMM

(4.8)

24

17

32X (0.6)

32X (0.25)

28X (0.5)

( 0.2) TYP

VIA

(R0.05)

TYP

1

8

9

(1.475)

16

(4.8)

LAND PATTERN EXAMPLE

SCALE:18X

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

METAL

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

4223442/B 08/2019

www.ti.com

RHB0032E

EXAMPLE STENCIL DESIGN

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(R0.05) TYP

32

32X (0.6)

4X ( 1.49)

(0.845)

25

32X (0.25)

28X (0.5)

1

8

METAL

TYP

33

(0.845)

SYMM

(4.8)

24

17

9

16

SYMM

(4.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 33:

75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

4223442/B 08/2019

www.ti.com

RGZ 48

7 x 7, 0.5 mm pitch

GENERIC PACKAGE VIEW

VQFN - 1 mm max height

PLASTIC QUADFLAT PACK- NO LEAD

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224671/A

www.ti.com

RGZ0048A

PACKAGE OUTLINE

VQFN - 1 mm max height

PLASTIC QUADFLAT PACK- NO LEAD

B

7.1

6.9

A

PIN 1 INDEX AREA

(0.1) TYP

7.1

6.9

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS

(0.45) TYP

CHAMFERED LEAD

CORNER LEAD OPTION

1 MAX

0.05

0.00

2X

5.5

44X 0.5

13

12

2X 5.5

5.15±0.1

(0.2) TYP

C

SEATING PLANE

0.08 C

24

25

SEE SIDE WALL

DETAIL

SYMM

PIN1 ID

(OPTIONAL)

1

48

SEE LEAD OPTION

SYMM

48X 0.5

0.3

36

37

48X 0.30

0.18

0.1

0.05

C A B

C

NOTES:

1.

2.

3.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

This drawing is subject to change without notice.

The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

4219044/C 09/2020

www.ti.com

EXAMPLE BOARD LAYOUT

VQFN - 1 mm max height

PLASTIC QUADFLAT PACK- NO LEAD

48X (0.6)

48

35

2X (6.8)

( 5.15)

SYMM

RGZ0048A

48X (0.24)

44X (0.5)

1

SYMM

2X

(5.5)

34

2X

(6.8)

2X

(1.26)

2X

(1.065)

23

(R0.05)

TYP

12

21X (Ø0.2) VIA

TYP

13

2X (1.26)

2X (5.5)

LAND PATTERN EXAMPLE

SCALE: 15X

0.07 MIN

ALL AROUND

METAL

22

2X (1.065)

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

0.07 MAX

ALL AROUND

EXPOSED METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4219044/C 09/2020

NOTES: (continued)

4.

5.

This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271) .

Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

RGZ0048A

48X (0.6)

48X (0.24)

44X (0.5)

SYMM

2X

(5.5)

(R0.05)

TYP

EXAMPLE STENCIL DESIGN

VQFN - 1 mm max height

PLASTIC QUADFLAT PACK- NO LEAD

2X (6.8)

SYMM

( 1.06)

2X

(6.8)

2X

(0.63)

2X

(1.26)

NOTES: (continued)

design recommendations.

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

4219044/C 09/2020

2X (0.63)

2X (5.5)

2X

(1.26)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

67% PRINTED COVERAGE BY AREA

SCALE: 15X

www.ti.com

D: Max =

2.714 mm, Min =

2.654 mm

E: Max =

2.714 mm, Min =

2.654 mm

RSM 32

4 x 4, 0.4 mm pitch

GENERIC PACKAGE VIEW

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224982/A

www.ti.com

RSM0032B

SCALE 3.000

A

4.1

3.9

PACKAGE OUTLINE

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

B

4.1

3.9

0.45

0.25

(0.1)

0.25

0.15

DETAIL

OPTIONAL TERMINAL

TYPICAL

PIN 1 INDEX AREA

1 MAX

0.05

0.00

4X (0.45)

28X 0.4

8

1

2.8 0.05

2X 2.8

9

16

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS

C

SEATING PLANE

0.08 C

(0.2) TYP

17

SEE SIDE WALL

DETAIL

EXPOSED

THERMAL PAD

2X

2.8

33

SYMM

SEE TERMINAL

DETAIL

PIN 1 ID

(OPTIONAL)

32

SYMM

25

32X

0.45

0.25

24

32X

0.25

0.15

0.1

0.05

C A B

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4219108/B 08/2019

www.ti.com

RSM0032B

EXAMPLE BOARD LAYOUT

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

32X (0.55)

1

32X (0.2)

( 0.2) TYP

VIA

SYMM

28X (0.4)

8

(R0.05)

TYP

( 2.8)

SYMM

32

25

33

(3.85)

24

(1.15)

17

9

(1.15)

16

(3.85)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:20X

0.05 MAX

ALL AROUND

EXPOSED METAL

0.05 MIN

ALL AROUND

EXPOSED METAL

METAL

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

4219108/B 08/2019

www.ti.com

RSM0032B

EXAMPLE STENCIL DESIGN

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

4X ( 1.23)

32

(0.715)

25

(R0.05) TYP

32X (0.55)

1

32X (0.2)

28X (0.4)

8

SYMM

33

(0.715)

(3.85)

24

17

METAL

TYP

9

16

SYMM

(3.85)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

EXPOSED PAD 33:

77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

4219108/B 08/2019

www.ti.com

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