Guangzhou Shikun Electronic Technology Company Limited SPECIFICATION SKI.WB800D.3 B21495 IEEE 802.11a/b/g/n/ac/ax 1T1R Wi-Fi Module Integrated BT 5.2 Approved by Shikun Checked by Rechecked by Approved by Hao Xu Guitian Lv Aaron Wu Please send the original back to us after you have approved and signed. Approved by customer Comments Approved by Companys seal Customers Name:
REVISION HISTORY. VERSION DATE BOARD ID PAGE DESCRIPTION AUTHOR V0.0 2021.6.16 SKI.WB800D.3A21175 All First Issued V1.0 2021.9.7 SKI.WB800D.3B(21272) All V1.1 2021.11.24 SKI.WB800D.3B(21272) All V1.2 2022.08.23 SKI.WB800D.3B(21495) All Modify module block diagram, Bluetooth power, physical diagram Add reference schematics, furnace temperature marks, reliability standards Added the description of power configuration Fan Fan Fan Fan SKI.WB800D.3 Content 1. Introduction ...................................................................................... 1 2. Features ........................................................................................... 1 3. Block Diagram ...................................................................................2 4. Package Outline and Mounting .............................................................2 5. Pin Definition .................................................................................... 3 6. Product Pictures ................................................................................ 4 7. Key Materials .................................................................................... 4 8. General Requirements .......................................................................................................... 4 9. Electrical Characteristics ......................................................................................................6 9.1 IEEE 802.11b Section(2.4GHz) .............................................................................. 6 9.2 IEEE 802.11g Section(2.4GHz) ...................................................................................... 6 9.3 IEEE 802.11n HT20/40 Section(2.4GHz) ................................................................... 7 9.4 IEEE 802.11ax HE20/40 Section(2.4GHz) .................................................................8 9.5 IEEE 802.11a Section(5GHz) .................................................................................. 9 9.6 IEEE 802.11n HT20/40 Section(5GHz) ............................................................. 10 9.7 IEEE 802.11ac VHT20/40 Section(5GHz) ........................................................ 11 9.8 IEEE 802.11ax HE20/40 Section(5GHz) ...........................................................12 9.9 Bluetooth Section .......................................................................................................13 10. Reference Design ............................................................................................................... 14 10.1 Timing specification ................................................................................................14 10.2 DC Electrical Characteistics .................................................................................14 10.3 Reference schematic .............................................................................................. 15 11. Mechanical,Environmental and Reliability Tests ....................................................15 12. Package .................................................................................................................................. 17 13. Storage and Production ................................................................................................... 18 13.1 Storage requirements .............................................................................................. 18 13.2 Production parameters ..........................................................................................18 1 SKI.WB800D.3 1. Introduction SKI.WB800D.3 module is based on AICSEMI AIC8800D solution.SKI.WB800D.3 is a Wi-Fi 6 /
BT 5.2 combo low-power, high-performance and high-integrated wireless communication module which is designed for meeting the customers needs of small size and low cost. This module supports both WLAN and BT functions. Its WLAN/BT function supports the USB 2.0 interface, and the module meets the requirements of standard protocol IEEE 802.11 b/g/n/ax. Such units as power management, power amplifier and low-noise amplifier are integrated in the main chip of the module.This documentation describes the engineering requirements specification. 2. Features Protocol IEEE Std. 802.11b/g/a/n/ac/ax Chip Solution Band Bandwidth Dimensions Remark BT 5.2 AIC8800D 2.4GHz2400~2483.5MHz 5GHz: B1:5150~5250MHz B2:5250~5350MHz B3:5350~5470MHz B4:5745~5825MHz 20MHz/40MHz 19mm17mm3.2mm model Install way Supported Standards Data rate frequency band antenna rema interface rk SKI.WB800D.3 SMD IEEE 802.11a/b/g/n/ac/ax 229Mbps 2.4GHz/5GHz Stamp hole *2 1 3. Block Diagram SKI.WB800D.3 Figure 1 SKI.WB800D.3 Block Diagram 4. Package Outline and Mounting 2 5. Pin Definition SKI.WB800D.3 PIN SYMBOL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 LED AGND MAIN AGND AUX AGND BT_DIS WL_DIS VDD33 AGND WL_USB_DM WL_USB_DP AGND PDN D_WAKE_H H_WAKE_D 0_TX 0_RX 1_TX 1_RX 20 19 18 17 DESCRIPTION LED0 Ground Wi-Fi RF port0(2.4G+5G)connect to external antenna Ground Wi-Fi RF port1(BT)connect to external antenna Ground BT DisableL Active WIFI DisableL Active 3.3V input Ground WLAN USB2.0 DM Signal WLAN USB2.0 DP Signal Ground Power DownL Active WIFI Device Wake Host L Active Host Wake WIFI DeviceL Active WIFI&BT Uart0_TX WIFI&BT Uart0_RX BT Uart1_TX BT Uart1_TX 3 6. Product Pictures SKI.WB800D.3 top view Screen printing description:
bottom view
(1) The character in the red box is the PCB model of the product;
(2) The characters in the yellow box are the product cycle number;
(3) Other characters are non-key characters and do not need to be controlled 7. Key Materials serial number 1 2 3 4 5 Key name integrated circuit PCB model Specifications/
Materials remark AIC8800D 48-QFN SKI.WB800D.3 FR-4,4LAY crystal oscillator SMD3225 26MHz Duplexer SLFD18-5R950G-07T FEM CB5717
8. General Requirements 4 No. 8-1 8-2 8-3 8-4 8-5 8-6 8-7 Feature Operation Voltage Current Consumption Ripple Operation Temperature Antenna Type USB SKI.WB800D.3 Description 3.3V+/-0.3 600mA 120mV 0C to +40C External antenna High Speed USB 2.0 Interface Storage Temperature
-40C to +85C
* Ripple: The definition is the ripple requirement at motherboard supplies power to the module the point where the
*RF Power Configuration Requirements txpwr_index_2.4g:
[0]=8(ofdmlowrate)
[1]=8(ofdm64qam)
[2]=8(ofdm256qam)
[3]=8(ofdm1024qam)
[4]=8(dsss) txpwr_index_5g:
[0]=9(ofdmlowrate)
[1]=9(ofdm64qam)
[2]=9(ofdm256qam)
[3]=8(ofdm1024qam) The upper board needs to configure the userconfig value table according to the above requirements, so that the actual power value of the module is changed, if the above value is changed, a value is relatively increased or decreased by 2dBm, the adjustable range is (1~11), control requirements: according to the test performance requirements of the upper board, it can be relatively regulated. 5 SKI.WB800D.3 9. Electrical Characteristics The Test for electrical specification was performed under the following condition unless otherwise specified Ambient condition Temperature :25 5;
Power supply voltages3.3V+/-0.3 input power at the Module;
9.1 IEEE 802.11b Section(2.4GHz) Items Specification Mode Channel Data rate Contents IEEE802.11b CCK CH1 to CH13 1, 2, 5.5, 11Mbps TX Characteristics Min. Typ. Max. Unit Remark 1. Power Levels(Calibrated) 1) For antenna portCCK 11M 14.0 16.0 18.0 dBm 2. Spectrum Mask @ target power 1) fc +/-11MHz to +/-22MHz 2) fc > +/-22MHz 3 Constellation Error(EVM)@ target power 1) 1Mbps 2) 2Mbps 3) 5.5Mbps 4) 11Mbps 4. Frequency Error RX Characteristics 5 Minimum Input Level Sensitivity
(each chain) 1) 1Mbps (FER 8%) 2) 2Mbps (FER 8%) 3) 5.5Mbps (FER 8%) 4) 11Mbps (FER 8%)
-20 Min.
6 Maximum Input Level (FER 8%)
-10 9.2 IEEE 802.11g Section(2.4GHz)
-30
-50
-10
-10
-10
-10 20 Typ. Max.
-83
-80
-79
-76
dBr dBr dB dB dB dB ppm Unit dBm dBm dBm dBm dBm Items Specification Mode Channel Contents IEEE802.11g OFDM CH1 to CH13 6 Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps TX Characteristics Min. Typ. Max. Unit Remark 1. Power Levels 1) For antenna port54M 11.0 13.0 15.0 dBm SKI.WB800D.3 2. Spectrum Mask @ target power 1) at fc +/-11MHz 2) at fc +/-20MHz 3) at fc > +/-30MHz 3 Constellation Error(EVM)@ target power 1) 6Mbps 2) 9Mbps 3) 12Mbps 4) 18Mbps 5) 24Mbps 6) 36Mbps 7) 48Mbps 8) 54Mbps 4 Frequency Error RX Characteristics 5 Minimum Input Level Sensitivity
(each chain) 1) 6Mbps (PER 10%) 2) 9Mbps (PER 10%) 3) 12Mbps (PER 10%) 4) 18Mbps (PER 10%) 5) 24Mbps (PER 10%) 6) 36Mbps (PER 10%) 7) 48Mbps (PER 10%) 8) 54Mbps (PER 10%)
-20 Min.
6 Maximum Input Level (PER 10%)
-20
-20
-28
-40
-5
-8
-10
-13
-16
-19
-22
-25 20 Typ. Max.
-85
-84
-82
-80
-77
-73
-69
-65
dBr dBr dBr dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm 9.3 IEEE 802.11n HT20/40 Section(2.4GHz) Items Contents Specification Mode Channel Data rate (MCS index) IEEE802.11n HT20/40@2.4GHz OFDM HT20:CH1 to CH13 HT40:CH3 to CH11 MCS0/1/2/3/4/5/6/7 TX Characteristics Min. Typ. Max. Unit 1. Power Levels 7 1) For antenna portMCS7 11.0 13.0 15.0 dBm SKI.WB800D.3 2. Spectrum Mask @ target power 1) at fc +/-11MHz 2) at fc +/-20MHz 3) at fc > +/-30MHz 3. Constellation Error(EVM)@ target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 4. Frequency Error RX Characteristics 5.Minimum Input Level Sensitivity
(each chain) 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%) 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%)
-20 Min.
7. Maximum Input Level (PER 10%)
-20
-20
-28
-45
-5
-10
-13
-16
-19
-22
-25
-28 20 Typ. Max. HT20 HT40
-79
-76
-74
-71
-67
-63
-62
-61
-82
-79
-77
-74
-70
-66
-65
-64
dBr dBr dBr dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm 9.4 IEEE 802.11ax HE20/40 Section(2.4GHz) Items Contents Specification Mode Channel IEEE802.11ax HE20/40@2.4GHz OFDMA HE20:CH1 to CH13 HE40:CH3 to CH11 Data rate (MCS index) MCS0/1/2/3/4/5/6/7/8/9 TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) For antenna portMCS9 11.0 13.0 15.0 dBm 2. Spectrum Mask @VHT20/VHT40 target power 1) at fc +/-11MHz/21MHz/41MHz 2) at fc +/-20MHz/40MHz/80MHz 3) at fc +/-30MHz/60MHz/120MHz
8
-20
-28
-40 dBr dBr dBr 3. Constellation Error(EVM)@ target power SKI.WB800D.3 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 9) MCS8 10) MCS9
4. Frequency Error
-20
-5
-10
-13
-16
-19
-22
-25
-27
-30
-32 20 RX Characteristics Min. Typ. Max. 5.Minimum Input Level Sensitivity
(each chain) 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%) 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%) 9) MCS8(PER 10%) 10) MCS9(PER 10%)
6. Maximum Input Level (PER 10%)
-30 9.5 IEEE 802.11a Section(5GHz) Items Specification Mode Channel
HE20 HE40
-82
-79
-77
-74
-70
-66
-65
-64
-59
-79
-76
-74
-71
-67
-63
-62
-61
-56
-57
-54
Contents IEEE802.11a OFDM CH36 to CH165 dB dB dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm Data rate (MCS index) 6, 9, 12, 18, 24, 36, 48, 54Mbps TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) For antenna port54M 9.0 11.0 13.0 dBm 2. Spectrum Mask @target power 1) at fc +/-11MHz 2) at fc +/-20MHz 3) at fc > +/-30MHz 3. Constellation Error(EVM)@ target power 1) 6Mbps 2) 9Mbps
-20
-28
-40
-5
-8 dBr dBr dBr dB dB
9 SKI.WB800D.3 3) 12Mbps 4) 18Mbps 5) 24Mbps 6) 36Mbps 7) 48Mbps 8) 54Mbps 4 Frequency Error RX Characteristics 5 Minimum Input Level Sensitivity
(each chain) 1) 6Mbps (PER 10%) 2) 9Mbps (PER 10%) 3) 12Mbps (PER 10%) 4) 18Mbps (PER 10%) 5) 24Mbps (PER 10%) 6) 36Mbps (PER 10%) 7) 48Mbps (PER 10%) 8) 54Mbps (PER 10%)
-20 Min.
6. Maximum Input Level (PER 10%)
-30
-10
-13
-16
-19
-22
-25 20 Typ. Max.
-82
-81
-79
-77
-74
-70
-66
-65
dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm 9.6 IEEE 802.11n HT20/40 Section(5GHz) Items Contents Specification Mode Channel Data rate (MCS index) IEEE802.11n HT20/40@5GHz OFDM HT20:CH36 to CH165 HT40:CH38 to CH163 MCS0/1/2/3/4/5/6/7 TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) For antenna portMCS7 9.0 11.0 13.0 dBm 2. Spectrum Mask @target power 1) at fc +/-11MHz 2) at fc +/-20MHz 3) at fc > +/-30MHz 3. Constellation Error(EVM)@ target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6
10
-20
-28
-45
-5
-10
-13
-16
-19
-22
-25 dBr dBr dBr dB dB dB dB dB dB dB 8) MCS7 4. Frequency Error RX Characteristics 5. Minimum Input Level Sensitivity
(each chain) 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%) 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%)
-20 Min.
Typ.
-28 20 Max.
HT20 HT40
-82
-79
-77
-74
-70
-66
-65
-64
-79
-77
-74
-70
-66
-65
-64
-61
SKI.WB800D.3 dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm 6. Maximum Input Level (PER 10%)
-30 9.7 IEEE 802.11ac VHT20/40 Section(5GHz) Items Contents Specification Mode Channel Data rate (MCS index) IEEE802.11ac VHT20/40@5GHz OFDM VHT20:CH36 to CH165 VHT40:CH38 to CH163 MCS0/1/2/3/4/5/6/7/8/9 TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) For antenna portMCS9 9.0 11.0 13.0 dBm 2. Spectrum Mask @VHT20/VHT40 target power 1) at fc +/-11MHz/21MHz/41MHz 2) at fc +/-20MHz/40MHz/80MHz 3) at fc +/-30MHz/60MHz/120MHz 3. Constellation Error(EVM)@ target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 9) MCS8 10) MCS9
4. Frequency Error
-20
-20
-28
-40
-5
-10
-13
-16
-19
-22
-25
-27
-30
-32 20 RX Characteristics Min. Typ. Max. 11 dBr dBr dBr dB dB dB dB dB dB dB dB dB dB ppm Unit 5.Minimum Input Level Sensitivity VHT20 VHT40 SKI.WB800D.3 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%) 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%) 9) MCS8(PER 10%) 10) MCS9(PER 10%)
6. Maximum Input Level (PER 10%)
-30
-82
-79
-77
-74
-70
-66
-65
-64
-59
-57
9.8 IEEE 802.11ax HE20/40 Section(5GHz) dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
-79
-76
-74
-71
-67
-63
-62
-61
-56
-54
Contents Items Specification Mode Channel Data rate (MCS index) IEEE802.11ax HE20/40@5GHz OFDMA HE20:CH36 to CH165 HE40:CH38 to CH163 MCS0/1/2/3/4/5/6/7/8/9 TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) For antenna portMCS9 9.0 11.0 13.0 dBm 2. Spectrum Mask @VHT20/VHT40 target power 1) at fc +/-11MHz/21MHz/41MHz 2) at fc +/-20MHz/40MHz/80MHz 3) at fc +/-30MHz/60MHz/120MHz 3. Constellation Error(EVM)@ target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 9) MCS8 10) MCS9
4. Frequency Error
-20
-20
-28
-40
-5
-10
-13
-16
-19
-22
-25
-27
-30
-32 20 RX Characteristics Min. Typ. Max. dBr dBr dBr dB dB dB dB dB dB dB dB dB dB ppm Unit 5.Minimum Input Level Sensitivity HE20 HE40 1) MCS0 (PER 10%)
-82
-79 dBm 12 SKI.WB800D.3 Remark 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%) 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%) 9) MCS8(PER 10%) 10) MCS9(PER 10%)
6. Maximum Input Level (PER 10%)
-30 9.9 Bluetooth Section Items Specification Mode Number of Channel Frequency Band 1. Output Power 2. Gain step 3. Receiver sensitivity (BER 0.1%) 4. Maximum usable signal (BER 0.1%) 5. C/I co-channel (BER<0.1%) 6. C/I 1MHz (BER<0.1%) 7. C/I 2MHz (BER<0.1%) 8. C/I3MHz (BER<0.1%) 9. C/I Image channel (BER<0.1%) 10. C/I Image 1MHz (BER<0.1%) 11. Inter-modulation 12. Out-of-band blocking 1). 30MHz to 2000MHz 2). 2000MHz to 2399MHz 3). 2498MHz to 3000MHz 4). 3000MHz to 12.75GHz 13. Modulation characteristics 1). f1avg 2). f2max (For at least 99.9% of all f2max) 3). f1avg /f2avg 14. ICFT 15. Carrier frequency drift 1). One slot packet (DH1) 2). Two slot packet (DH3) 3). Five slot packet (DH5)
dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
-79
-77
-74
-70
-66
-65
-64
-59
-57
-76
-74
-71
-67
-63
-62
-61
-56
-54
Contents BT2.1+EDR/4.2/5.2 with BLE FHSS,GFSK,DPSK,DQPSK 79 Channels 2.402 GHz ~2.480GHz Min. Typ. Max. 3.0 1
-93.5
-80
-5 4
-14
-42
-49
-25
-50
-13
157 140 0.98 20 15 15 15
11 0
-30
-40
-9
-20
175
+75
+25
+40
+40
-10
-27
-27
-10 140 115 0.8
-75
-25
-40
-40 13 Unit dBm dB dBm dB dB dB dB dB dB dB dBm dBm dBm dBm KHz KHz KHz KHz KHz KHz KHz SKI.WB800D.3 4). Max drift rate 16. TX output spectrum(20dB bandwidth) 17. In-Band spurious emission 1). 2MHz offset 2). 3MHz offset 3). >3MHz offset
6 20 KHz/50us 922 1000 KHz
-45
-48
-48
-20
-40
-40 dBm dBm dBm 10. Reference Design 10.1 Timing specification 10.2 DC Electrical Characteistics Symbol Description conditions Min. Typ. Max. Unit VDD33 Power supplies VDDIO I/O input power supplies IVDD33 IVDDIO Power supply current I/O supply current VIH High-level input voltage VIL Low-level input voltage
3.0 3.0 1.7
VDDIO=3.3V VDDIO*0.625 VDDIO=1.8V VDDIO*0.65 VDDIO=3.3V VDDIO=1.8V
-0.3 High-level output VDDIO=3.3V VDDIO-0.4 voltage VDDIO=1.8V VDDIO-0.2 VOH VOL Low-level output VDDIO=3.3V voltage VDDIO=1.8V RPU Internal pull-up resistor VDDIO=3.3V VDDIO=1.8V RPD Internal pull-down VDDIO=3.3V resistor VDDIO=1.8V
-0.3 40 10 40 10 14 3.3 3.3 1.8
75 50 75 50 3.6 3.6 1.9 800 50 VDDIO+0.3 VDDIO*0.25 VDDIO*0.35 VDDIO+0.3 0.4 0.2 190 100 190 100 V V mA mA V V V V k k 10.3 Reference schematic SKI.WB800D.3 Note:
Reference schematic diagram 1. The MAIN is the WIFI-2.4G&5G antenna interface, and the AUX is the BT antenna interface, which needs to be controlled according to 50 impedance. 2. Ensure that the GND PIN near the antenna port is properly grounded (direct copper laying is recommended). 3. In order to facilitate the adjustment of RF performance, a -type matching circuit should be reserved between RF_ANT and the antenna. The circuit should be placed close to the antenna and the specifications should be selected according to the actual situation. When both the antenna and RF wiring have good performance, attach 0 through, and the NC of the devices on both sides is not attached. When the impedance of the antenna is mismatched, it can be matched and debuggable through this circuit. 4.RF wiring should be as short as possible, and avoid right and acute Angle wiring. 5. Try to reserve the UART0&UART1 cable design on the motherboard to facilitate RF performance testing and debugging. 11. Mechanical,Environmental and Reliability Tests Test Items Test Conditions Qty Criteria Condition The packed samples was tested at below condition:
After test, the outer box and inner box 11-1 Drop test Drop height:
760mm(0.5~9.5kg 610mm(9.5~18.5kg) Drop time: 1x corner, 3x 15 1xBox will not been broken by appearance visual inspection, and the products should be ok. edge and 6x face. X-Y-Z direction, first SKI.WB800D.3 Frequency changing from After test, the outer box and inner box 11-2 Vibration test 10Hz to 30Hz to 10Hz,amplitude 2.0mm, 1xBox will not been broken by appearance visual inspection and the products should 5 times vibrations, 5x times be ok. vibration. 11-3 Soldering ability test
(Only for SKI module) Soldering temperature:
2455 Soldering duration:
30.5S High 11-4 Temperature and Humidity Leave samples in 60, 90%
RH @ 24 hours Operation Test Low 11-5 Temperature Operation Test Leave samples in -15
@24 hours 1.After soldering, the soldered area must be covered by a smooth bright solder layer, some deficiencies such as a small amount of the pinhole, not wetting are allowed, but the deficiencies can not be in the same place 2. At least 90% of soldered area shall be covered continuously by the soldering material. After test, the products appearance, power, EVM and frequency error functional parameter shall be satisfied with the test specification. After test, the products appearance, power, EVM and frequency error functional parameter shall be satisfied with the test specification. 3 4 4 High 11-6 Temperature and Humidity Leave samples in 60, 90% RH for 4x hours Start Test Low 11-7 temperature start test High Leave samples in -15 for 4x hours 11-8 Temperature and Humidity Leave samples in 85, 95%
RH @ 48 hours Storage Test Low Temperature 11-9 Leave samples in -40,
@48 hours After test, power on and off the samples 4 for 3x tiems, the samples should be able to start normally After test, power on and off the samples 4 for 3x tiems, the samples should be able to start normally After test, the products appearance, power, EVM and frequency error functional parameter shall be satisfied with the test specification. After test, the products appearance, power, EVM and frequency error 4 4 16 Storage Test functional parameter shall be satisfied SKI.WB800D.3 11-10 Thermal Shock Test
-40~85dwell time 30min50cycles 11-11 Aging Test 60120Hrs with the test specification. After test, the products appearance, power, EVM and frequency error functional parameter shall be satisfied with the test specification. The products at high temperature for a long time can continuous work normally The Sample shall has no minor or major 4 10 11-12 Salt spray test NSS,35,PH:6.5~7.2, 24H 2 defects, such as physical damage, crack, corrosion, deformation etc;
Discharge voltage:
1kV C: 150pF 11-13 ESD Discharge resistance330 3 The products can recoverable smoothly after ESD test. Positive10 times 1 time for each second 12. Package 1braid packaging 2Braid direction 3Carton size 17 SKI.WB800D.3 4Packing Quantity Each plate is packed with 700 PCS, each box is packed with 7 PCS, the quantity of each box
=700*7=4900pcs 13. Storage and Production 13.1 Storage requirements This product has a humidity sensitivity of Class 4 (MSL4) and is shipped in vacuum sealed bags. Product handling, storage, and processing must follow IPC/JEDEC J-STD-033. When the ambient temperature is below 40 degrees Celsius and the air humidity is less than 90%, the product can be stored for 12 months under vacuum packaging. During the product storage period, if it is found that the vacuum packaging has air leakage, the humidity sensitive card discoloration reaches the baking standard, and the opening exposure time exceeds 72H, it needs to be used after baking. 13.2 Production parameters The maximum furnace temperature shall not exceed 250, and 240 is recommended. The recommended temperature curve of SMT welding furnace is shown in the figure below 18 SKI.WB800D.3 Figure 13-1 Recommended furnace temperature curve Table 13-2 Parameters of the furnace temperature curve Reflow Process Minimum temperature in preheating zone Maximum temperature of preheating zone Preheating rise time Reflow zone heating rate (TL to Tp) Low temperature in reflow zone Peak temperature in reflow zone Reflow peak temperature time tp (Tp fluctuation range 5 Reflow Zone cooling rate (Tp to TL) Reflux time MIX 150 60 235
-5 40 TYP MAX UNIT 200 120 3 250 30
-1 60 s
/s s
/s s 220 240
-3 19 SKI.WB800D.3 FCC Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used inaccordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the 20 equipment. SKI.WB800D.3 Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Contains FCC ID:2AL3T-WB800D any similar wording that expresses the same meaning may be used. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application. A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part 15B requirements. The module complies with FCC Part 15.247 / Part 15.407 and apply for Single module approval. 21 SKI.WB800D.3 Instructions for use SKI.WB800D.3 is a Wi-Fi module used in commercial display, and the first batch of home appliances are IFPD and TV . The module is implemented by AIC8800D Wi-Fi IC, which is provided to customers in the form of modules. The hardware and software architecture based on the module can realize the networking and connect to the Wi-Fi router or Bluetooth equipment. The module meets the requirements of standard protocol IEEE 802.11 b/g/n/ax and Bluetooth 5.2 with BLE and it is connected to Main Soc by USB interface. The power management, power amplifier and low-noise amplifier are integrated in the AIC8800D chip of the module which provide a low power consumption for users. 22