FCC ID: E675JS0052 G3L-900-60-005

PRELIMINARY 935-940 MHz System Integration Manual 044-05075 Rev. B January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Par. No. Table Of Contents Section 1 General Description Page No. Introduction....................................................................................................................................1-1 1-1 General Description ......................................................................................................................1-1 1-2 1-3 Functional And Physical Specifications.........................................................................................1-2 1-3.1 MCR20930-1-2 Subrack Specifications.........................................................................................1-3 GL3-900 Series Amplifier Specifications ......................................................................................1-5 1-3.2 Booster Amplifier Subrack Major Components.............................................................................1-8 1-4 1-5 Equipment Changes........................................................................................................................1-8 Section 2 Installation 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 Introduction....................................................................................................................................2-1 Site Survey .....................................................................................................................................2-1 Electrical Service Recommendations.............................................................................................2-1 Air Conditioning ............................................................................................................................2-1 Unpacking and Inspection..............................................................................................................2-2 Installation Instructions..................................................................................................................2-3 Amplifier Module Power, Alarm, Control, and RF Connector ......................................................2-4 Remote Control and Status.............................................................................................................2-5 Section 3 Operating Instructions 3-1 3-2 Introduction....................................................................................................................................3-1 Initial Start-Up and Operating Procedures .....................................................................................3-1 Section 4 Principles of Operation Introduction....................................................................................................................................4-1 4-1 RF Input Signal ..............................................................................................................................4-1 4-2 RF Output Load .............................................................................................................................4-1 4-3 System Functional Description.......................................................................................................4-1 4-4 Multi-Carrier Power Amplfier Functional Description ..................................................................4-2 4-5 Predriver Amplifier ........................................................................................................................4-3 4-5.1 4-5.2 Three Stage Driver Amplifier.........................................................................................................4-3 4-5.3 Main Amplifier...............................................................................................................................4-3 4-5.4 Alarm Monitoring and Control.......................................................................................................4-3 Loop Control Circuit......................................................................................................................4-3 4-5.5 Amplifier Module Cooling.............................................................................................................4-4 4-6 4-7 Power Distribution .........................................................................................................................4-4 044-05075 Rev. B iii January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Table Of Contents (Continued) Par. No. Section 5 Maintenance Page No. Introduction....................................................................................................................................5-1 5-1 Periodic Maintenance.....................................................................................................................5-1 5-2 Test Equipment Required For Test ................................................................................................5-1 5-3 Performance Test ...........................................................................................................................5-2 5-4 5-4.1 Amplifier Performance Test...........................................................................................................5-2 5-4.1.1 Amplifier Spurious Emissions Test................................................................................................5-2 5-4.1.2 Gain Test........................................................................................................................................5-2 5-4.1.3 Input Return Loss...........................................................................................................................5-2 5-5 Field Replacement of the Module ..................................................................................................5-5 Section 6 Troubleshooting 6-1 6-2 6-3 6-3.1 6-3.2 Introduction....................................................................................................................................6-1 Troubleshooting .............................................................................................................................6-1 Return for Service Procedures........................................................................................................6-1 Obtaining an RMA.........................................................................................................................6-1 Repackaging for Shipment .............................................................................................................6-1 List Of Appendices Appendix Page No. A B C Booster Amplifier Subrack Backplane Wiring Diagram...............................................................A-1 Disrtibution Printed Circuit Board Pinout Location......................................................................B-1 Power Setting Procedure...............................................................................................................C-1 List Of Illustrations Page No. VVA, Voltage Regulator and Dip Switch Pin Configuration.........................................................1-2 Booster Amplifier Subrack System-Top View...............................................................................1-9 Booster Amplifier Subrack Sysytem-Front View.........................................................................1-10 Booster Amplifier Subrack System-Side View (Front Door Open) .............................................1-11 Booster Amplifier Subrack System-Side View with Fans Removed............................................1-11 Booster Amplifier Subrack-Backplane.........................................................................................1-12 GL3-900 Series Amplifier............................................................................................................1-13 GL3-900 Series Amplifier Rear, Top, Front Views ..................................................................1-14 Table Of Contents (Continued) Figure No. 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 044-05075 Rev. B iv January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual List Of Illustrations (Continued) 2-1 2-7 4-1 4-2 5-1 J5 Alarm Connector .......................................................................................................................2-4 Front Panel POWER IN Connector ...............................................................................................2-5 System Block Diagram...................................................................................................................4-1 G3L-900-50/60-005 Multi-Carrier Power Amplifier Functional Block Diagram ..........................4-2 G3L-900-50/60-005 Amplifier Test Setup Diagram......................................................................5-3 List Of Tables Page No. Truth Table (Variable Attenuator) .................................................................................................1-2 Booster Amplifier Subrack System Specifications.........................................................................1-3 2-Way Splitter Electrical Specifications ........................................................................................1-4 2-Way Combiner Specifications.....................................................................................................1-4 G3L-900-Series Ampifier Electrical Specifications.......................................................................1-5 G3L-900-Series Amplifier Mechnaical Specifications...................................................................1-6 GL3-900 Series Amplifier Environmental Specifications..............................................................1-7 Major BAR System Components ...................................................................................................1-8 Remote Control and Status Specifications .....................................................................................2-5 J5 Alarm Connector Pin Designation.............................................................................................2-4 Front Panel POWER IN Connector Pin Designations....................................................................2-5 Periodic Maintenance.....................................................................................................................5-1 Test Equipment Required...............................................................................................................5-1 Multichannel Power Amplifier Test Data Sheet.............................................................................5-4 Troubleshooting .............................................................................................................................6-1 Table No. 1-1 1-2 1-3 1-4 1-5 1-4 1-7 1-8 2-1 2-2 2-3 5-1 5-2 5-3 6-1 044-05075 Rev. B v January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Section 1. General Description 1-1 Introduction This manual contains information and procedures for the installation, operation, and maintenance of Powerwave Technologies, Inc.s (Powerwaves) Booster Amplifier Subrack (BAS) system. This manual is organized into the following sections:

Appendix A: Backplane Wiring Diagram Appendix B: Distribution PCB Pinout Location Appendix C: Power Setting Procedure Section 1. General Description Section 2. Installation Section 3. Operating Instructions Section 4. Principles of Operation Section 5. Maintenance Section 6: Troubleshooting 1-2 General Description Engineered to operate in a 2-way transceiver paging base station, the BAS system is a linear, Multi-Carrier Power Amplifier (MCPA) system that operates in the 5 MHz frequency band from 935 MHz to 940 MHz. The system integrates the model MCR20930-1-2 Booster Amplifier Subrack (BAS) with two model G3L-900-50-005 MCPAs to deliver a composite RF output of 75.8 Watts (nominal), after combined losses. The system can also integrate two model G3L-900-

60-005 MCPAs to deliver a composite RF output of 91 Watts (nominal), after combined losses. Designed to function as a subrack (see Figures 1-2 thru 1-6) in the host base station, the enclo-

sure has a one inch (right and left side) flanged front panel and eight mounting holes (four on each side) to secure the Subrack into place (refer to Figure 1-3 for mounting hole locations). To aid in maintaining the systems operating temperature, the BAS is equipped with two cooling fans mounted on the front access door (see Figures 1-3 and 1-4). The G3L-900-50-005 amplifier dis-

places 1,672 BTUs of heat at full power. The G3L-900-60-005 amplifier displaces approximately 1,900 BTUs of heat at full power. The composite input signal is applied to a 30dB 10W input attenuator, followed by a voltage vari-

able attenuator that is controlled via dip switches on the front panel (refer to table 1-1 and figure 4-1). The maximum composite input signal may not exceed +31dBm. The composite signal is then fed to a two-way power splitter. The signals are applied to the amplifiers, and the amplifier outputs are combined again (refer to Tables 1-2 through 1-7 for specifications). With both ampli-

fiers installed, the system provides 20dB of gain. The BAS also houses a distribution printed circuit board (PCB) for internal power and alarm distri-

bution (refer to Appendix B). Accessible from the front panel is the DB9 external ALARM con-

nector, the RF IN and RF OUT type N connectors. Additionally, the front panel provides access to the +27 Vdc POWER IN connector, visibility of the two MCPAs fault alarm LED indicators and the GAIN CTRL dip switch. Refer to table 1-1 for the dip switch truth table and fiqure 1-1 for pin designations. With the access door open, the two amplifier modules are visible. All solid-state, the MCPAs are designed for parallel operation for high peak power output. Their modular construction and unique and highly effective LED-based operational status and fault indicators help minimize downtime. The turn-on and turn-off sequence of voltages are fully automatic, as is overload pro-

tection and recycling. Inadvertent operator damage from front panel manipulation is virtually im-

possible. Refer to Figures 1-7 and 1-8 for drawing views of the amplifier module. 044-05075 Rev. B 1-1 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Table 1-1 Truth Table Input Variable Attenuator Pin 1

+5Vdc

+5Vdc

+5Vdc

+5Vdc

+5Vdc 0Vdc Pin 2

+5Vdc

+5Vdc

+5Vdc

+0Vdc

+5Vdc 0Vdc Pin 3

+5Vdc

+5Vdc 0Vdc

+5Vdc

+5Vdc 0Vdc Pin 4

+5Vdc 0Vdc

+5Vdc

+5Vdc 0Vdc 0Vdc Attenuation 0dB 1dB 2dB 4dB 8dB 15dB DIP SWITCH SOCKET VARIABLE ATTENUATOR 1 2 3 4 5

+5Vdc VOLTAGE REGULATOR Vout GND GND NC NC GND GND

+27Vdc (Vin) 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 OUTPUT GND GND GND GND INPUT Figure 1-1 Variable Attenuator, Voltage Regulator and Dip Switch Socket Pin Configuration 1-3 Functional and Physical Specifications The BAS systems functional and physical specifications are listed in table 1-2. A functional block diagram is provided in section 4 of this manual to illustrate the systems operational layout. 044-05075 Rev. B 1-2 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 1-3.1 MCR20930-1-2 Subrack Specifications Table 1-2 MCR20930-1-2 Booster Amplifier Subrack System Specifications 935-940 MHz

+20 dBm, 0.2 dBm

+31 dBm composite w/variable attenuator set to 0dB at-

tenuation.

+46 dBm composite w/variable attenuator set to 15 dB at-

tenuation. Frequency Gain RF Input Power RF Output Power:

G3L-900-50-005 G3L-900-60-005 43.5 Watts (+46.39 dBm) nominal, 1 module 75.8 Watts (+48.80 dBm) nominal, 100 W (max.), 2 modules 52.3 Watts (+47.18 dBm) nominal, 1 module 91.0 Watts (+49.59 dBm) nominal, 120 W (max.), 2 modules 5

+5 Vdc TTL

+ 27 Vdc, 55 Amps max

-19 dBm 12.5 KHz 0 to 65 degrees C 12.22(H)x*17(W)x24.5(D) inches Approximately 80 Pounds (36.28 kilograms) Phase Variation Alarms D.C. Power Total System Return Loss Channel Spacing Operating Temperature Subrack Dimensions Weight (Fully assembled)

*Note: Does not include 1-inch right and left side mounting flanges. 044-05075 Rev. B 1-3 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Table 1-3 Electrical Specifications for 2-Way Splitter Insertion Loss Amplitude Balance Insertion Loss Flatness Over Frequency Input/Output Return Loss Port to Port Phase Delta Port to Port Isolation IP3 (Input Power = 5dBm) Power Handling (Fixed Attenuator) Power Handling (Variable Attenuator)

-33dB Min. (TBD on actual part)

-48dB Max. 0.2dB Max. 0.3dB Max.

-20dB Min. 5 Degrees Max.

-20.0dB Min.

-90dBc Min. 20 Watts Max. 3.16 Milliwatts Max. Insertion Loss Amplitude Balance Insertion Loss Flatness Over Frequency Input/Output Coupled Port Return Loss Port to Port Phase Delta Port to Port Isolation Power Handling Sampling Coupler Sampling Coupler Directivity IP3 (Input Power = TBD) Table 1-4 Electrical Specifications for 2-Way Combiner

-0.6 dB (TBD on actual parts) 0.2dB Max. 0.3dB Max.

-18.0 dB Min. 5 Degrees Max.

-20.0dB Min.. 120 Watts

-25dB 1dB

-18.0 dB Min.

-100 dBc Min 044-05075 Rev. B 1-4 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 1-3.2 GL3-900 Series Amplifier Sprecifications Table 1-5 G3L-900 Series Amplifiers Electrical Specifications Frequency Range Channel Spacing Output Power:

GL3-900-50-005 GL3-900-60-005 Input Power RF Gain GL3-900-50-005 GL3-900-60-005 RF Gain Flatness over the operating frequency range Gain Flatness:

Normal Operating Voltage Current Consumption:

GL3-900-50-005 GL3-900-60-005 Abnormal Operating Voltage RF Gain variation by Temp &

Voltage Gain Variation Over Dynamic Range Intermodulation Distortion In-Band Spurious Input/Output VSWR. Load Stability Output Isolation 935-940 MHz 12.5 KHz

+47 dBm (50 Watts) nominal, 60 Watts (max.)

+47.8 dBm (60 Watts) nominal, 75 Watts (max.)

-10.0 dBm max.

+58.8 dB 1.0 dB @ +27Vdc, 25 C.

+58.8 dB 1.0 dB @ +27Vdc, 25 C 0.1 dB over any 1.25 MHz (over the frequency range). 0.5 dB (935 MHz 942 MHz)

+27 Vdc 1V Nominal (5%) 1Vpp ripple (100-120 Hz) max. 20 Amps @ 27 Vdc, 25 C, Prf = 50 Watts average 27 Amps @ 27 Vdc, 25 C, Prf = 50 Watts average

+21 Vdc to below +26 Vdc. Above +28 Vdc to +29 Vdc. TBD 0.1 dB max./20 dB for 0 to 20 dB rated power output

-65 dBc min. (Main signal power to Spurious @ (12.5 kHz)

-55 dBc min @ +23 to +24 Vdc 1.5: 1 max @ 65 C. Infinite VSWR. all phases 20 dB min. (shall incorporate an output isolator) 044-05075 Rev. B 1-5 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Table 1-6 G3L-900 Series Amplifiers Mechanical Specifications Items Physical Dimension of MCPA Weight Connector Type Specifications Front panel: 342.5mm(W) x 99mm(H) x 3mm(D) Body: 288.8mm(W) x 95.3mm(H) x 446mm(D) Approximately 28.6 pounds (13 killograms) D-sub, Hybrid, Plug-in Type RF connector: PKZ 26-0020 series straight plug type (Phoenix Co.) refers to attached drawing. MCPA Front Panel Switch CKT Breaker. +27 Vdc Power Indicator Connector Description

+27 V

(Coaxial Contact)

(Power Contact)

(Power Contact)

(Coaxial Contact) 10 11 COM SV AMP AO 12 AMP A1 13 14 AMP A2 15 AMP A3 16 NC 17 NC RF Input Ground

+27 Vdc RF Output TX H TX L GND RX H RX L GND HERE LPA FF LPA RESERVED Pin Outs A1 A2 A3 A4 1 2 3 4 5 6 7 8 9 TBD LED type: SMD GREEN (When MCPA is enabled) Red (When any alarm occurred, LED is on) Green (When DC Power is ON, LED is on) TBD TBD Markings Front Panel LED Display RUN ALM DC MCPA Captive fastener Front Panel color & silk 044-05075 Rev. B 1-6 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Table 1-7 Environmental Specifications for G3L-900 Series Amplifiers Items Operating Temperature Storage Temperature Relative Humidity Operating Air Pressure Shock Pressure Vibration Corrosion Resistance/ Salt Fog Altitude Specifications 0 to + 65 C

-40 to + 85 C 5 to 90% RH (non-condensing) 860 to 1060 mbar 40 m/s s* @ 22 ms half sinusoid shock Integral forced air cooling must operate correctly at up to 0.3 inches back. Bellcore TR-NWT-000063 (1 m/s*s0.1200Hz) The MCPAs shall comply with the requirements of Bellcore Technical Reference TA-NWT-000487, Is-

sue 2, Section 4.12 All specifications shall be met at an altitude up to 15,000 feet where the maximum external ambient temperature is decreased by 0.5 C/ 1000 feet above sea level. The MCPAs shall not sustain damage when being transported at altitude up to 40,000 feet or uniformly applied pressure to 30 PSIA. 044-05075 Rev. B 1-7 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 1-4 Booster Amplifier Subrack (BAS) System Major Components Table 1-8 lists the model numbers and descriptions of the major components that comprise the BAS system and the document number (if available) of the manual related to each component. Model/PN 800-01292-001 800-01294-001 700-00901-001 700-00902-001 700-00903-001 700-00904-001 700-00905-001 800-001296-001 800-01297-001 500-01425-001 MCR20930-1-2 GL3-900-50-005 or GL3-900-60-005 Table 1-8 Major BAS System Components Qty Per System Description Expandable To Top Assembly, BAS II w/o Combiner Backplane Front Panel Assy Cable Assy, Power In Cable Assy, Amp Power Cable Assy, Amp Power Cable Assy, Fan Cable Assy, Amplifier Fan Assy Tray Assy PCB Assy, Power Distribution Booster Amplifier Subrack 50-Watt Amplifier 60-Watt Amplifier 1 1 1 1 1 2 1 2 1 1 1 2 2 1 1 1 1 1 2 1 2 1 1 1 2 2 1-5 Equipment Changes Powerwave Technologies, Inc. reserves the right to make minor changes to the equipment, in-

cluding but not limited to component substitution and circuitry changes. Changes that impact this manual may be incorporated in a later revision of the manual. 044-05075 Rev. B 1-8 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Figure 1-2 Booster Amplifier Subrack System Top View 044-05075 Rev. B 1-9 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 044-05075 Rev. B 1-10 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Section 2. Installation 2-1 Introduction This section contains unpacking, inspection, installation instructions and recommendations for the Booster Amplifier Subrack (BAS) System. It is important that the licensee perform the following tasks correctly and in good faith:

1. Carefully read all material in this section prior to equipment unpacking or installation. 2. Also, read and review the operating procedures in section 3 prior to installing the equipment. 3. If applicable, carefully review the Federal Communications Commission (FCC) rules as they apply to your installation. DON'T TAKE CHANCES WITH YOUR LICENSE. 2-2 Site Survey Powerwave Technologies recommends that site surveys be performed by qualified individuals or firms prior to equipment ordering or installation. Performing a detailed site survey will reduce or eliminate installation and turn-up delays caused by oversights. Pay particular attention to power plant capacity, air conditioning needs, and RF/DC cabling/breaker requirements. 2-3 Electrical Service Recommendations Powerwave recommends that:

! Proper AC line conditioning and surge suppression be provided on the primary AC input to the

+27 Vdc power source.

! All electrical service should be installed in accordance with the National Electrical Code, any applicable state or local codes, and good engineering practice.

! Straight, short ground runs be used.

! The electrical service must be well grounded. Circuit breakers should be thermal type, capable of handling the anticipated inrush current, in a load center with a master switch. 2-4 Air Conditioning Each GL3-900-50-005 and GL3-900-60-005 amplifier generates 1672 BTUs and 1900 BTUs of heat respectively at full power. A fully populated MCR20930-1-2 Booster Amplifier Subrack sys-

tem operating at full power will generate 3344 BTU's of heat (using two GL3-900-50-005 amplifi-

ers) and 3800 BTUs (using two GL3-900-60-005) amplifiers. At least a 1/3-ton air conditioner is needed to cool this Powerwave equipment. 044-05075 Rev B 2-1 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Unpacking and Inspection This equipment (as applicable) has been operated, tested and calibrated at the factory. Carefully open and remove the MCPAs and model MCR20930-1-2 Booster Amplifier Subrack (BAS) from their respective containers. Retain all packing material that can be reassembled in the event that the unit must be returned to the factory. Please perform the following steps:

Exercise care in handling equipment during inspection to prevent damage caused by rough or careless handling. CAUTION 1. Visually inspect the MCPAs and the BAS for damage that may have occurred during ship-

ment. 2. Check for evidence of water damage, bent or warped chassis, loose screws or nuts, or extra-

neous packing material in the connector(s). CAUTION Before applying power, make sure that all connectors to the BAS components are secure. Make sure that the input and output of the BAS are properly terminated at 50 ohms. Do not operate the system without a load attached. Refer to section 1, table 1-

2 for input power requirements. Excessive input power may damage the equipment. If possible, inspect the equipment in the presence of the delivery person. If the equipment is damaged:

! The carrier is your first area of recourse.

! A claim should be filed with the carrier once the extent of any damage is assessed. We can-

not stress too strongly the importance of IMMEDIATE careful inspection of the equipment and the subsequent IMMEDIATE filing of the necessary claims against the carrier if necessary. If the equipment is damaged and must be returned to the factory:

! Please write or phone for return authorization. Refer to section 6-3.1 of this manual for in-

structions.

! Powerwave may not accept returns without a return authorization. Claims for loss or damage may not be withheld from any payment to Powerwave nor may any payment due be withheld pending the outcome thereof. WE CANNOT GUARANTEE THE FREIGHT CARRIER'S PERFORMANCE 044-05075 Rev B 2-2 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 2-5 Installation Instructions The model MCR20930-1-2 Booster Amplifier Subrack (BAS) is designed for use in a 2-way transceiver paging base station. The host enclosure must permit access to the subrack for;

DC power, RF and monitor cables. As well as, proper ventilation. The BAS system is designed for an enclosure with at least 36 inches of depth. Please proceed with installation as follows:

Verify that all circuit breaker switches on the subrack are in the OFF position. Turn off external primary DC power before connecting DC power cables. WARNING 1. Install the subrack into the host base station and secure it into place using #10 32x1/2 Phil-

lips screws and #10 flat washers. 2. Connect POWER IN (+27 Vdc) to the subrack. Refer to figure 2-1 for pin locations and Ta-

ble 2-2 for pin designations. 3. Connect RF IN cable to the subrack. 4. Connect RF OUT cable to the subrack. 5. Connect external ALARM interface to external summary board. Refer to figure 2-2 for pin locations and table 2-4 for pin designation. 6. Loosen thumbscrews to the front access door and open the door. 7. Before installing the MPCA into the subrack, inspect the 21-pin D-sub male combo connector on the rear of each amplifier. Verify that all pins are straight, no pins are recessed, and that the alignment shield is not bent. 8. Place power ON/OFF switch on the MCPAs front panel in the off (far-left) position. WARNING Do not slam amplifiers into the subrack. Forcing the amplifier into the surack at too fast a rate may cause the pins on the 21-D-sub conector of the amplifier to become recessed or broken. Insert a plug-in MCPA into the subrack. Tighten thumbscrews. 9. 10. Repeat steps 7, 8 and 9 for the second MCPA. Check your work before applying DC voltage to the system. Make certain all connections are tight and correct. WARNING 11. Measure primary DC input voltage. DC input voltage should be +27 Vdc 1.0 Vdc. If the DC input voltage is above or below the limits, call and consult Powerwave before you turn on your amplifier system. 12. Refer to section 3 for initial turn-on and checkout procedures. 044-05075 Rev B 2-3 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 2-6 Amplifier Module Power, Alarm, Control, and RF Connector The power, alarm, control, and RF connections on the amplifier are made through a 21WA4 male connector and are listed and described in table 2-1 below and in section 1, table 1-4. Items Alarms & Controls Deletion Alarm Function Fail Alarm VSWR Alarm High Temp. Alarm Over Power Output Alarm DC Fail Alarm Loop Fail Alarm EN/DISABLE Table 2-1 MCPA Alarms & Controls Specifications TTL Level; +5 Volts Buffer: 74ABT244 (5V) - recommended When unit does not exist (HEAR_PAU) Equipped: GND Deletion OPEN When unit does not exist (HEAR_PAU) Normal: High Abnormal GND 3:1 (6dB 1dB) @ 35dBm-48dBm Output Power. PAU remains normal operation when this alarm condition disappears (NOT shutdown) This alarm only at +75C. +5 C//-0 C

@output power is greater than +48.5 dBm 0.5dB. MCPA will recover when the alarm condition disap-

pears. (NOT shutdown).

@ +20.5 Vdc 0.5V or +29 Vdc 0.5V. When this alarm occurs the MCPA shall shut-down When an alarm occurs on the feed forward path. Reserved Remarks D-Line D-Line RS-485 RS-485 RS-485 RS-485 RS-485 RS-485 The Alarm Interface connector on the front panel of the MCR20930-1-2 Booster Amplifier Subrack is a 9-pin female D-sub connector that permits serial interface with the external alarm monitor. Refer to figure 2-1 and table 2-3 for connector definition. Figure 2-1 J5 Alarm Connector Table 2-2 J5 Alarm Connector Pin Designation Pin 1 2 3 4 5 6 7 8 9 Description HERE_PAU-1 FF_PAU-1 DC_ON/OFF_1 PAU_RST_1 HERE_PAU_2 FF_PAU_2 DC_ON/OFF_2 PAU_RST_2 No Connection (NC) 044-05075 Rev B 2-4 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 2-7 Remote Control and Status Refer to table 2-3 for a description and list of remote control and status specifications for the MCPA. 1 2 3 6 5 7 Figure 2-2 Front Panel POWER IN Connector Table 2-3 Front Panel POWER IN Connector Pin Designations Pin 1 2 3 4 5 6 7 Description

+27Vdc Ground

+27Vdc NC

+27Vdc Ground Ground 044-05075 Rev B 2-5 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Table 2-4 Remote Control and Status Items RS-485 Physical Layer Asyn-

chronous Packet Protocol Address Response from PAU Specifcations Each MCPA shall support an RS-485 multi-drop differential serial asynchro-

nous communications link operation at 9600 baud, 1 bit start, 8 bit data, 1 bit parity, 1 bit stop bit. The host shall terminate the RS-485 differential re-

ceive and transmit lines with 120 ohms. Because this communications bus is also shared with other system resources. The MCPA is required to sup-

port the following asynchronous packet format communications protocol. Packet format used for both commands and responses. Byte 0 1 2 Field Source ID Destination ID Address of Destination CMND/ ECHO Command/ Echo field Address of Source Description Each MCPA shall receive but IGNORE any data packet NOT ADDRESSED to itself. The receiver must reset its state machines and ready itself to Receive the start of the next packet if it observes no activity on its RS-485 receive lines in 50 ms. The CMND/ ECHO byte is used to send commands from host to MCPA as follows:

Byte 0 1 Field Source ID Destination ID Address of Destination Address of Source Description

-b(7): 0

-b(4:6): PAS ID

-b(0:3): PAU slot ID 2 CMND Command Field CMND/ ECHO=

00H 01H-ffH MCPA responses always echo the received CMND bytes as an ECHO byte of the response packet. Report status Reserved Byte 0 Field Source ID Description 1 2 Destination ID Report Data

-b(7): 0

-b(4:6): PAS ID

-b(0:3): PAU slot ID Address of Source

-b0: 1= High VSWR condition/ 0=normal

-b1: 1=High Temperature condition/ 0=normal

-b2: 1=Over Power condition/ 0=normal

-b3: 1=DC fail condition/ 0=normal

-b4: 1=Loop alarm condition/ 0=normal

-b5: 1=PAUenable Condition/ 0=normal

-b6: reserved (0)

-b7: reserved (0) 044-05075 Rev B 2-6 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Section 3. Operating Instructions 3-1 Introduction This section contains operating instructions for Powerwaves Booster Amplifier Subrack (BAS) system. 3-2 Initial Start-Up and Operating Procedures To perform the initial start-up, proceed as follows:

1. Double check to ensure that all input and output cables are properly connected. CAUTION Before applying power, make sure that the input and output of the amplifier are properly terminated at 50 ohms. Do not operate the amplifier without a load attached. Refer to table 1-1 for input power requirements. Excessive input power may damage the MCPA NOTE The output coaxial cable between the amplifier and the antenna must be 50 ohm coaxial cable. Use of any other cable will distort the output. 2. Turn on the supply that provides +27 Vdc to the amplifier system. 3. Place the power ON/OFF switch on the amplifier front panel in the ON (middle) position. 4. Close the front access door. Tighten the thumbscrews. 5. Ensure that the GAIN CTRL dip switch is set at minimum gain (maximum attenua-

tion). Refer to section 1, table 1-1 for the dip switchs truth table. 6. Allow the amplifiers to warm up for at least 5 minutes before taking power readings. 7. Refer to appendix C for the power setting procedure. 044-05075 Rev. B 3-1 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Section 4. Principles of Operation 4-1 Introduction This section contains a functional description of Powerwave Technologies Inc.s, Booster Ampli-

fier Subrack (BAS) system. Refer to figure 4-1 for the systems functional block diagram. 4-2 RF Input Signal The maximum input power for all carrier frequencies to the system should not exceed the limits specified in section 1, table 1-2. 4-3 RF Output Load The load impedance should be as good as possible (VSWR of 1.5:1 or better) in the working band for good power transfer to the load. If the amplifier is operated into a filter, it will maintain its dis-

tortion characteristics outside the signal band even if the VSWR is infinite, provided the reflected power does not exceed one Watt. A parasitic signal of less than one-Watt incident on the output will not cause distortion at a higher level than the normal forward distortion (i.e. 65 dBc). MCR 20930-1-2 GAIN CTRL RF Input RS-485 Alarm Interface 30 dB VVA DB9 Ctrl 2x +27VDC 2x Ground Distribution Circuit Board

(DC,Fans, Alarms) Splitter ISO ISO GL3-900-50-005 GL3-900-60-005 MCR 20930-1-2

-25dB Sample MCPA MCPA Alarm Alarm C o m b i n e r RF Output Figure 4-1 System Block Diagram 4-4 System Functional Discription Designed as a subrack for installation in a 2-way transceiver paging base station, the BAS system is comprised of a MCR20930-1-2 Booster Amplifier Subrack (BAS) and two G3L-900-50-005 or G3L-900-60-005 plug-in multi-carrier power amplifiers (MPCAs). Additionally, the BAS houses a two-way power splitter/combiner and a distribution printed circuit board (PCB). Refer to Appendix A for pinout locations. The RF IN, RF OUT, +27 Vdc and the ALARM summary connector, interface with the host system via front panel cabling. The RF input signal is split equally and applied to the plug-in amplifiers. The output from each amplifier is an amplified composite signal (refer to table 1-5 for amplifier output specifications). All phase and gain corrections are performed on the signal(s) in the individual amplifier. The ampli-

fier outputs are fed to a power combiner and combined to form a composite RF output (refer to table 1-5). Refer to figure 4-1 for the System Functional Block Diagram. 044-05075 Rev. B 4-1 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual The distribution printed circuit board (PCB) assembly is used to distribute power to the BAS sys-

tems internal components. The PCB circuit is a DC/DC converter designed to convert the +27 Vdc input to +12 Vdc and +15 Vdc. Refer to Appendix B for pinout location. 4-5 Multi-Carrier Power Amplifier (MCPA) Functional Description The MCPA is a linear, feed-forward multi-carrier power amplifier that operates in the 5 MHz fre-

quency band from 935 MHz to 940 MHz (refer to table 1-5 for amplifier specifications). Each am-

plifier is a self-contained module and is functionally independent of the other MCPA in the system. The amplifiers are designed for parallel operation to achieve high peak power output (refer to Ta-

ble 1-2 for MPCA power specifications). Each MCPA has an alarm board that monitors the ampli-

fier performance. If a failure or fault occurs in an MCPA, it is transmitted to the host system via the D-subminiature 21WA4 connector at the rear of the module. A warning light (LED), which is routed from the amplifier via the J7 connector on the PCB to the front panel of the BAS, will illumi-

nate. The indicator LEDs are identified as Alarm 1 and Alarm 2 which corresponds to their re-

spective amplifier.. The amplifier is compliant to the requirements of FCC Part 90 with respect to spurious emissions. Constant gain is maintained by continuously comparing active paths with passive references, and correcting for small variations through the RF feedback controls. All gain variations, for example those due to temperature, are reduced to the passive reference variations. The amplifier is com-

prised of:

A preamp A driver amplifier A main amplifier An error and pre-error amplifier Alarm monitoring and control 1st Loop Phase & Gain Pre Main

-40dB

-30dB Delay

-10dB Main Amp FWD PWR RF Out RFL PWR Pre Amp Delay 2nd Loop Phase & Gain Error Amp Feed Forward Loop control

+15 +5 -5 Power Supply

+27VDC Alarms & Display Smart Rack Front Panel Figure 4-2 Multi-Carrier Power Amplifier Functional Block Diagram 044-05075 Rev. B 4-2 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 4-5.1 Predriver Amplifier The input of the amplifier uses two stages of class AB amplification which provide approximately 13.5 dB of gain in the 5 MHz frequency band from 935 MHz to 940 MHz. The amplifier operates on +27 Vdc. 4-5.2 Three-Stage Driver Amplifier The input of the amplifier uses three stages of class AB amplification which provide approximately 32 dB of gain in the 5 MHz frequency band from 935 MHz to 940 MHz. The amplifier operates on

+27 Vdc, and a bias voltage of +5 Vdc. The logic controls the +5 Vdc bias voltage that shuts down the amplifier. 4-5.3 Main Amplifier The signal provides approximately 11 dB of gain in the 935 to 940 MHz frequency band (refer to table 1-5 for amplifier specifications). The main amplifier operates on +27 Vdc, and a bias voltage of +5 Vdc. The alarm logic controls the +5 Vdc bias voltage that shuts down the amplifier. The main amplifier employs class AB amplification for maximum efficiency. The error amplifier and feed forward loops are used to correct signal non linearities introduced by the class AB main amplifier. The error amplifier operates in class A mode. The RF input signals are amplified by a preamp and coupled to an attenuator and phase shifter in the first feed-forward loop. The main signal is phase shifted by 180 degrees and amplified in the premain amplifier. The output from the premain amplifier is fed to the class AB main amplifier. The signal output from the main amplifier is sampled using a coupler, and the sample signal is combined with the main input signal and input to the second feed-forward loop. The error signal is attenuated, phase shifted 180 degrees, then fed to the error amplifier where it is amplified to a level identical to the sample output from the main amplifier. The output from the error amplifier is then coupled back and added to the output from the main amplifier. The control loops continu-

ously make adjustments to cancel out any distortion in the final output signals. 4-5.4 Alarm Monitoring and Control During routine operation, all normal variations are automatically compensated for by the feed-

forward loop control. However, when large variations occur beyond the adjustment range of the loop control, a loop fault will occur. When this happens, the ALARM LED is illuminated on the front panel of the subrack. The fault is transmitted back to an external summary module via the external ALARM interface connection on the front panel of the subrack. 4-5.5 Loop Control Circuit The primary function of the first loop is to provide an error signal for the second loop. The primary function of the second loop is to amplify the error signal to cancel out spurious products devel-

oped in the main amplifier. The input signal is amplified by a preamplifier and fed to a coupler and delay line. The signal from the coupler is fed to the attenuator and phase shifter in the first loop. The first loop control section phase shifts the main input signals by 180 degrees and constantly monitors the output for correct phase and gain. The second loop control section obtains a sample of the distortion added to the output signals by the main amplifiers. The signal is phase shifted 180 degrees, then fed to the error amplifier where it is amplified to the same power level as the input sample. The signal is then coupled to the error signal on to the main output signal. The final output is monitored by the second loop and adjusted to ensure that the signal distortion and intermodulation distortion (IMD) on the final output is can-

celled out. 044-05075 Rev. B 4-3 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 4-6 Amplifier Module Cooling Although each amplifier contains it own heat sink, it is cooled by forced air. Two fans mounted on the front of the subrack are used for forced air cooling and redundancy. The fans draw air through the front of the system and exhaust hot air out the back. The fans are field replaceable. Each amplifier, when properly cooled, will provide sufficient cooling to maintain the amplifier within the specified operating temperature range. Six inches of free space are required at both the front and rear panels of the subrack to allow adequate air volume to circulate over the heat sinks. 4-7 Power Distribution Primary DC power for the amplifier is provided by the host system. The amplifier module has a DC/DC converter and voltage regulator that converts the +27 Vdc to +15 Vdc, +5 Vdc, and +8 Vdc for internal use. 044-05075 Rev. B 4-4 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Section 5. Maintenance 5-1 Introduction This section contains periodic maintenance and performance test procedures for Powerwaves Booster Amplifier Subrack (BAS) system. NOTE Check your sales order and equipment warranty before attempting to service or repair the unit. Do not break the seals on equipment under warranty or the warranty will be null and void. Do not return equipment for warranty or repair service until proper shipping instructions are received from the factory. 5-2 Periodic Maintenance Periodic maintenance requirements are listed in Table 5-1. Table 5-1 also lists the intervals at which the tasks should be performed. Task Inspection Cables and Connectors Performance Tests Clean Fans/Heat Sinks Table 5-1. Periodic Maintenance Interval Action 12 Months 12 Months 3 Months Inspect signal and power cables for frayed insulation. Check RF connectors to be sure that they are tight. Perform annual test per paragraph 5-5. Inspect for debri. Remove dust with a soft cloth/brush or vacuum cleaner. 5-3 Test Equipment Required For Test Test equipment required to test the amplifier is listed in table 5-2. Equivalent test equipment may be substituted for any item, keeping in mind that a thermistor type power meter is required. NOTE All RF test equipment required must be calibrated to 0.05 dB resolution. Any deviation from the nominal attenuation must be accounted for and factored into all output readings. Table 5-2. Test Equipment Required Nomenclature Signal Generator 20 dB Attenuator, 250 Watt 20 dB Attenuator, 20 Watt (2 each) Spectrum Analyzer Coax Directional Coupler Power Meter / Sensor Arbitrary Waveform Generator Network Analyzer Source Diskette Manufacturer H.P. Bird Bird H.P. H.P. H.P. Sony H.P. Powerwave Model 8656B Tenuline Tenuline 8560E 778D 437B / 8481A AWG2021 8753C 044-05075 Rev. B 5-1 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 5-4 Performance Test Performance testing should be conducted every 12 months to ensure that the amplifier system meets the operational specifications listed in Table 5-3. Also verify system performance after any amplifier module is replaced in the field. The test equipment required to perform the testing is listed in table 5-2, and the test setup is shown in figure 5-1. NOTE The frequencies used in this test are typical for an amplifier with a 5 MHz band from 935 MHz to 940 MHz. Select evenly spaced F1, F2, F3, and F4 frequencies that cover the instantaneous bandwidth of your system. 5-4.1 Amplifier Performance Test To perform this test, proceed as follows:

Connect test equipment as shown in figure 5-1. WARNING Do not apply any RF signals at this time. 5-4.1.1 Amplifier Spurious Emissions Test:

With the RF input signal to the amplifier set to be as shown in Figure 5-1, use the spectrum ana-

lyzer to measure the spurious emissions performance. Record test data in Table 5-3. Verify that it is within the specifications shown in table 1-2. Switch tested amplifier to OFF. 5-4.1.2 Gain Test:

1. Disconnect spectrum analyzer from test setup, and connect the network analyzer. 2. Set network analyzer as follows:

A. Power output to -13 dBm. B. Frequency start to 935 MHz. C. Frequency stop to 940 MHz. D. Normalize the network analyzer for gain and return loss. 3. Check the amplifier gain across the band from 935 MHz to 940 MHz. Gain should be as specified in table 1-2. Record test data in table 5-3. 5-4.1.3 Input Return Loss:

Read and record the S11 return loss measurement on network analyzer. Record test data in table 5-3. 044-05075 Rev. B 5-2 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Figure 5-1 Amplifier Test Setup Diagram 044-05075 Rev. B 5-3 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Table 5-3. Multi-Carrier Power Amplifier Test Data Sheet DATE _________________________________ MODULE S/N___________________________ TEST CONDITIONS:

Load and Source Impedance: 50 Ohms VSWR: < 1.2:1 Supply Voltage: +27 Vdc 0.1 Vdc TEST RF Gain Spurious Emissions Gain Flatness Input Return Loss SPECIFICATION Vcc = 27 Vdc PO = See table 1-5 Freq. = 935 - 940 MHz Vcc = 27 Vdc PO = See table 1-5 935 - 940 MHz Band Vcc = 27 Vdc PO = See table 1-5 935 - 940 MHz Band Vcc = 27 Vdc PO = See table 1-5 935 - 940 MHz Band MIN Table 1-2

-0.5 dB MAX Table 1-2

+0.5 dB DATA

-65 dBc 0.5 dB

-12 dB PASS FAIL Tested by 044-05075 Rev. B 5-4 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual 5-5 Field Replacement of the Module The G3L-900-50-005 and GL3-900-60-005 multi-carrier power amplifier module can be replaced in the field on site by a qualified technician with experience maintaining RF power amplifiers and similar equipment:

To replace a power amplifier module, proceed as follows:

1. Set on/off switch on the front panel of the amplifier module to OFF (down). 2. Loosen the two thumbscrews that secure amplifier module to the subrack. CAUTION When removing the amplifier from the subrack, it is very important to support the amplifier such that the rear of the module does not suddenly drop when the guide rail disengages from the track. A drop such as this could damage the rear 21WA4 multipin connector. 3. With steady even pressure, use handle on front of amplifier to pull module out of subrack. 4. Install replacement in reverse order of steps 1 through 3 above. 044-05075 Rev. B 5-5 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Section 6. Troubleshooting 6-1 Introduction This section contains a list of problems which users have encountered and a few suggested ac-

tions that may correct the problem. If the suggested corrective action does not eliminate the problem, please contact your Powerwave field representative or the factory for further instructions. NOTE Check your sales order and equipment warranty before attempting to service or repair the unit. Do not break the seals on equipment under warranty or the warranty will be null and void. Do not return equipment for warranty or repair service until proper shipping instructions are received from the factory. 6-2 Troubleshooting Refer to table 6-1 for troubleshooting suggestions. Table 6-1. Troubleshooting. Symptom Suggested Action Inoperative MCR20930-1-2 Fan Noise G3L-900-50-005 or GL3-900-60-005 Inoperative 1. Check for proper power supply voltages. 2. Verify all RF connections. 3. Contact your field representative. 1. Locate noisy fan. 2. Check for damage 3. Replace noisy or damaged fan 1. Check for proper power supply voltage. 2. Verify all RF connections. 3. Verify that unit does not have a major fault (red LED on front panel). Recycle power. 6-3 Return For Service Procedures When returning products to Powerwave, the following procedures will ensure optimum response. 6-3.1 Obtaining An RMA A Return Material Authorization (RMA) number must be obtained prior to returning equipment to the factory for service. Please contact our Repair Department at (714) 466-1000 to obtain this number, or FAX your request to (714) 466-5800. Failure to obtain this RMA number may result in delays in receiving repair service. 6-3.2 Repackaging For Shipment To ensure safe shipment of the amplifier, it is recommended that the package designed for the amplifier be used. The original packaging material is reusable. If it is not available, contact Pow-

erwaves Customer Service Department for packing materials and information. 044-05075 Rev. B 6-1 January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Appendix A. Booster Amplifier Subrack Backplane Wiring Diagram RF IN A1 A2 1 2 3 4 5 6 7 8 9 1-

11 12 13 14 15 16 17 A3 A4 AMP_1 A1 A2 RF INPUT

+27Vdc 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 A3 A4 GND RF OUTPUT AMP_2 A1 A2 RF INPUT

+27Vdc P2 1 20 2 21 3 22 4 23 5 24 6 25 7 26 8 27 9 28 10 29 11 30 12 31 13 32 14 33 15 34 16 35 17 36 18 37

(TX_H)

(TX_L) GND

(RX_H)

(RX_L) GND

(HERE_PAU)

(FF_PAU)

(DC_ONNOFF)

(PAU_RST)

(DIV_SW)

(COM_SW)

(AMP_A0)

(AMP_A1)

(AMP_A2) LED_GRN ANODE LED_RED ANODE NC

(TX_H)_2

(TX_L)_2 GND_2

(RX_H)_2

(RX_L)_2 GND_2

(HERE_PAU)_2

(FF_PAU)_2

(DC_ONNOFF)_2

(PAU_RST)_2

(DIV_SW)_2

(COM_SW)_2

(AMP_A0)_2

(AMP_A1)_2

(AMP_A2)_2 LED_GRN ANODE_2 LED_RED ANODE_2 NC 044-05075 Rev. B A-1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 A3 A4 GND RF OUTPUT RF OUT January 2001 PRELIMINARY Booster Amplifier Subrack System Integration Manual Appendix B. Distribution Printed Circuit Board Pinout Location DB37 PINOUT 1 20 2 21 3 22 4 23 5 24 6 25 7 26 8 27 9 28 10 29 11 30 12 31 13 32 14 33 15 34 16 35 17 36 18 37 19 P4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 TX_H TX_L RX_H RX_L HERE_PAU_1 FF_PAU_1 DC_ON/OFF_1 PAU_RST_1 DIV_SW_1 COM_SW_1 O TP1

(AMP_A0_1) AMP_A1_1 AMP_A2_1 LED_GRN_1 LED_ RED_1 N/C TX_H TX_L RX_H RX_L HERE_PAU_2 FF_PAU_2 DC_ON/OFF_2 PAU_RST_2 DIV_SW_2 COM_SW_2 AMP_A0_2 O TP2 LED_GRN_2 LED_RED_2 N/C N/C N/C N/C N/C J4 1 2 3 4 RS485 J5 1 2 3 4 5 6 7 8 9 ALARM J6 1 2 3 4 NC SPLITTER/COMBINER J7 1 2 3 4 5 6 LED 044-05075 Rev. B B-1 January 2001 PRELIMINARY Booster Amplifier Subrack System Integra-

tion Appendix C Power Setting Procedure C-1 Power Setting Calculations:

1. Ensure the composite input power to the Powerwave MCR20930-1-2 is < 0 dBm. 2. Determine the required output level at the hatch plate per carrier (Analog, Digital, CDPD, and Setup Channels). Follow the example after step 5 below. 3. Determine the amount of loss between the subrack output and the hatch plate. A. Either the calculated value (Lucent uses 1.7dB for the Series II), or B. Measure the loss 1. Key one radio and make a measurement in dBm at the front of the subrack with an HP EPM-441A or equivalent power meter. Write the value down: _____ dBm. 2. Disconnect the radio and move the power meter to the hatch plate. 3. Key the same radio and make a measurement in dBm, and write it down: _____ dBm. The difference between the two measurements is the loss. 4. Determine the amount of power output at the rear of the subrack per carrier. 5. Multiply the number of carriers times the output power level per carrier at the front of the subrack. Three blank tables are provided on page 3 of this appendix for you to record your desired power levels. A Hatch Power

(w) B Convert Hatch Power to dBm a b=10*LOG(a / 0.001) 6.3 10*Log(6.3/0.001)=37.9934 Formula Example Analog CDMA*

21*

10*Log(21/0.001)=43.2222 CDPD 6.3 10*Log(6.3/0.001)=37.9934 Setup 6.3 10*Log(6.3/0.001)=37.9934 Inner Tier 2.5 10*Log(2.5/0.001)=33.9794 C Loss from Hatch to Powerwave Subrack (dB) D E F G Power @ Powerwave Subrack (dBm) Convert Powerwave Subrack Power to watts No. of Carriers Total Power per Signal c 1.7 1.7 1.7 1.7 1.7 d=b+c e=x10(d/10)*0.001 37.9934 + 1.7 = 39.6934 x10(39.9934/10)*0.001=9.318 4 43.2222 + 1.7 = 44.9222 x10(44.9222/10)*0.001=31.06 13 37.9934 + 1.7 = 39.6934 x10(39.9934/10)*0.001=9.318 4 37.9934 + 1.7 = 39.6934 x10(39.9934/10)*0.001=9.318 4 33.9794 + 1.7 = 35.6794 x10(35.6794/10)*0.001=3.697 8 f 10 2 1 1 4

(watts) g=ef 93.1838 62.1226 9.3184 9.3184 14.7911 188.7342 Total Power

*Some RF Engineers will give the power for Pilot Page and Sync (on the order of 2 to 5W). Powerwave normally multiplies this value by 7 for the purpose of roughly calculating the CDMA channel with full traffic load. If the total output power level at the front of the Powerwave subrack exceeds the subracks specified capability with the number of populated amplifiers: Reduce the number of input radios until the subrack power rating is met. 044-05075 Rev. B C-11 January 2001 PRELIMINARY Booster Amplifier Subrack System Integra-

tion C-2 Power Setting Procedure:

Gain Avail. 5 to 20dB

~-1.7dB C o m b

-30dB Splitter MCPA 58.8dBg Comb. DC Example:

Single Analog Ch Composite 111mW 20.45dBm 29.59dBm 910mW Maximum composite input level if gain is set to maximum (0 attenuation) 7.5W 11.09W 40.45dBm 49.59dBm 91W 38.75dBm 47.89dBm 61.52W Values in Boxes are given or known. The remaining values are calculated based on the given values. Figure C-1 Gain Block Example 1. Set all transceiver levels to midrange output levels if this is a new base station installation. For existing base stations, the levels may be left as they currently are set. The composite input level should not exceed -20dBm most applicatons. Higher input levels may result in over-driving the MCR20930-1-2 amplifier subrack. Refer to section 1 for individual model power specifications. NOTE 2. Ensure all radios are not transmitting, including CDPD. 3. Connect the power meter, with appropriate attenuators as necessary, to the transmit filter output feed at the hatch plate. 4. Set the GAIN CTRL to minimum gain (maximum attenuation). Refer to section 1, table 1-1 for the dip switch truth table. 5. Key one radio (usually this is the primary setup channel). 6. Set the output level using the GAIN CTRL on the Powerwave subrack and transmitter gain ad-

justment for this single channel. Normally, the CDMA channel has the most limiting range, so this is the best channel to start with, although most technicians normally start with the setup channel. Try to keep the adjustments in the middle of the available range adjustments. 7. Verify the power level is still correct. 8. Unkey the radio. 9. Key one radio at a time and set the power level of each individual radio at the hatch plate accord-

ing to the calculations made in the first section above. Do not readjust the GAIN CTRL level. 10. Unkey all radios. C-2.1 Overpower Verification 11. Connect the power meter, with appropriate attenuators as necessary, to the RF output of the Powerwave subrack. 12. Reconnect the transmit filter output cable to the antenna. 044-05075 Rev. B C-22 January 2001 PRELIMINARY Booster Amplifier Subrack System Integra-

tion 13. Key all the radios and measure the total maximum power. This power level should not exceed the rating for the MCR20930-1-2. If the power rating for the MCR20930-1-2 is exceeded, the in-

termodulation distortion performance of the amplifiers will suffer and the software-

overpower protection feature of the MCR20930-1 will activate. NOTE:

Each amplifier will go into overdrive alarm when they are being driven 3 dB over the rated power for that amplifier. Each amplifier will shut down at 3 dB over the rated power, and possibly cause the entire sector to be disabled. Table C-1 Amplifier and Amplifier Subrack ratings Amplifier 1 Module GL3-900-50-005 43.5 W (46.39 dBm) nominal GL3-900-60-005 52.3 W (47.18 dBm) nominal 2 Modules 75.8 W (48.80 dBm) nominal, 100 W (max) 91 W (49.59 dBm) nominal, 120 W (max) All measurements should be made with a calibrated power meter accurate within +2% (HP EPM-441A or equivalent) 14. Disconnect all the radios. 15. Reconnect the RF output coax cable to the Powerwave subrack. 044-05075 Rev. B C-33 January 2001 PRELIMINARY Booster Amplifier Subrack System Integra-

tion Hatch Power

(w) Convert Hatch Power to dBm Loss from Hatch to Powerwave Subrack (dB) Power @ Powerwave Subrack (dBm) Convert Powerwave Subrack Power to watts No. of Carriers a b=10*LOG(a / 0.001) c d=b+c e=x10(d/10)*0.001 f Total Power per Signal

(watts) g=ef Hatch Power

(w) Convert Hatch Power to dBm Loss from Hatch to Powerwave Subrack (dB) Power @ Powerwave Subrack (dBm) Convert Powerwave Subrack Power to watts No. of Carriers a b=10*LOG(a / 0.001) c d=b+c e=x10(d/10)*0.001 f Total Power per Signal

(watts) g=ef Total Power Hatch Power

(w) Convert Hatch Power to dBm Loss from Hatch to Powerwave Subrack (dB) Power @ Powerwave Subrack (dBm) Convert Powerwave Subrack Power to watts No. of Carriers a b=10*LOG(a / 0.001) c d=b+c e=x10(d/10)*0.001 f Total Power per Signal

(watts)l g=ef Total Power Formula Sector:

Formula Sector:

Formula Sector:

Total Power 044-05075 Rev. B C-44 January 2001