Datasheet Version 1.0 1.0 Overview 2.0 Features 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4.0 Specifications CPU Memory WiFi Bluetooth LTE CATM1 RTC Security Hash / encryption Block Diagram 5.0 Pinout 6.0 6.1 7.0 7.1 8.0 8.1 8.2 8.2.1 8.2.2 9.0 Pin Details Remapping Pins ESP32 Peripherals RTC Programming the device UART WiFi Telnet FTP Boot modes 9.1 Bootloader mode 9.2 Safe boot 10.0 Power 10.1 Current consumption by power modes/features running at 3.7V 11.0 Memory Map Flash RAM ROM and eFuses 11.1 11.2 11.3 12.0 WiFi 12.1 12.2 Supported features Specifications 03 03 04 04 04 04 04 04 04 04 04 04 05 06 08 09 09 10 10 10 10 10 10 10 10 11 11 12 12 12 12 13 13 13 13.0 Bluetooth Supported features Specification 13.1 13.2 13.2.1 Receiver Basic Data Rate 13.2.2 Receiver Enhanced Data Rate 13.2.3 Receiver Bluetooth LE 13.2.4 Transmitter Basic Data Rate 13.2.5 Transmitter Enhanced Data Rate 13.2.6 Transmitter Bluetooth LE 14.0 LTE CATM1 Supported features Specifications 14.1 14.2 14.2.1 Supported LTE bands 14.3 14.4 15.0 Electrical Characteristics SIM Card requirements Certified carriers 14 14 14 14 15 16 17 18 19 20 20 20 20 20 20 21 Absolute maximum ratings Input/Output characteristics 15.1 21 15.2 21 16.0 Minimum Recommended Circuit 22 17.0 Mechanical Specifications 18.0 Recommended Land Patterns 19.0 Design Considerations Antenna Impedance Deep sleep power Reference layout 19.1 19.2 19.3 20.0 Soldering Profile 21.0 Ordering Information 22.0 Packaging Reel Tape Box 22.1 22.2 22.3 23.0 Certification 23 23 24 24 24 25 26 27 27 27 27 27 28 Version 1.0 02 1.0 Overview 2.0 Features With WiFi, BLE and cellular LTECAT M1, the G01 OEM Module is the latest Pycom triplebearer MicroPython enabled micro controller on the market today the perfect enterprise grade platform for your connected things. Create and connect your things everywhere, fast. Powerful CPU, BLE and state of the art WiFi radio. 1KM Wifi Range MicroPython enabled Can be directly surface mount inside your product like a regular component Ultralow power usage: a fraction compared to other connected micro controllers Version 1.0 03 3.0 3.1 Specifications CPU Xtensa dualcore 32bit LX6 microprocessor(s), up 3.5 to 600 DMIPS Hardware floating point acceleration Python multithreading An extra ULPcoprocessor that can monitor GPIOs, the ADC channels and control most of the internal peripherals during deepsleep mode while only consuming 25uA. One single chip for CAT M1 LTE CATM1 3GPP release 13 LTE Advanced Pro Integrated baseband, RF, RAM memory and power Supports narrowband LTE UE categories M1 management Reduced TX power class option Peak power estimations:
TX current = 420mA peak @1.5Watt RX current = 330mA peak @1.2Watt Extended DRX (eDRX) and PSM features for long 3.6 3.7 3.8 sleep duration use cases RTC Running at 150kHz Security SSL/TLS support WPA Enterprise security Hash / encryption SHA MD5 DES AES 3.2 3.3 3.4 Memory RAM: 520KB + 4MB External flash: 8MB WiFi 802.11b/g/n 16mbps Bluetooth Low energy and classic 4.0 Block Diagram Figure 1 System block diagram Version 1.0 04 5.0 Pinout 8 1
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e c o d e r e t s i g e R Figure 2 Module pinout diagram Note: The ESP32 supports remapping its peripherals to alternative pins. See below for a detailed list. Version 1.0 05 6.0 Pin Details Table 1 Module pinout Module Pin ESP32 GPIO Pin Name Default Function ADC PWM RTC Notes 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 3 1 0 4 15 5 27 19 2 12 P0 P1 P2 P3 P4 P8 P9 Ground Ground Ground USIM Clock USIM I/O Ground Ground Ground Reset RX0
(Programming) TX0
(Programming) TX1 RX1 Sequans modem RX Sequans modem Interrupt Sequans modem CTS SDA 2*
2*
2*
2*
2*
2*
Active Low Used by the bootloader and to program the module Used by the bootloader and to program the module If tied to GND during boot the device will enter bootloader mode JTAG TDO, SD card CMD Not recommended for external use Not recommended for external use Not recommended for external use SD card DAT0 JTAG TDI Version 1.0 06 6.0 Pin Details Table 1 Module pinout Module Pin ESP32 GPIO Pin Name Default Function ADC PWM RTC Notes 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 13 22 21 36 37 38 39 35 34 32 33 26 25 14 P10 SCL (I2C) / CLK
(SPI) 2*
JTAG TCK P11 MOSI P12 P13 P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 If tied to 3.3V during boot the device enters safe boot mode, JTAG MISO Ground Ground WiFi/BT antenna 50 Ohm impedance required Ground Ground Ground 1 1 1 1 1 1 1 1 2*
2*
2*
Input only Input only Input only Input only Input only Input only Connected to the onboard RGB LED DAC DAC JTAG TMS, SD card SCLK Version 1.0 07 6.0 Pin Details Table 1 Module pinout Module Pin ESP32 GPIO Pin Name Default Function ADC PWM RTC Notes This supply should be able to source 650mA Only when the device is active, during deep sleep this drops to 0V Powers the Sequans cellular modem 50 Ohm impedance required 40 41 42 43 44 49 50 51 52 23 18 3.3V input Ground 1.8V Output Ground Ground 3.25.5V input Ground LTE CATM1 antenna Ground Sequans modem TX Sequans modem RTS The pins on the RTC power domain can be used during deep sleep, specifically GPIO pins will maintain their state while in deep sleep.
* ADC2 is currently not supported in the micropython firmware 6.1 Remapping Pins The ESP32 features comprehensive pin remapping functionality. This allows peripherals to be mapped onto almost any available GPIO pins. The above table merely shows the default assignments. For example, the default mapping has the SPI and I2C clocks overlapping, meaning both cannot be used simultaneously without remapping one to a different pin. For a detailed guide of what peripheral can be assigned to what pins please read Appendix A ESP32 Pin Lists of the ESP32 datasheet. Version 1.0 08 7.0 ESP32 Peripherals Table 2 Peripherals Peripheral Count Pins UART I2C SPI CAN*
JTAG PWM ADC DAC SD 3 2 3 1 1 1 Remappable to any GPIO. Note: P1318 can only be mapped to RX or CTS since they are input only. Remappable to any GPIO except P1318 since they are input only and I2C is bidirectional. Remappable to any GPIO. Note: P1318 can only be mapped to MISO since they are input only. Remappable to any GPIO. Note: P1318 can only be mapped to RX since they are input only. TDO = P4, TDI = P9, TCK = P10, TMS = P24 All GPIO except P1318 which are input only 18 Fixed mapping, see Table 1, Only ADC 1 is supported in our micropython firmware. 2 1 Only available on P21 and P22 DAT0 = P8, SCLK = P23, CMD = P4
* Requires an external CAN bus transceiver, we recommend the SN65HVD230 from Texas Instruments. 7.1 For a more detailed description of the ESP32 peripherals along with peripherals not currently supported by our firmware, please check the ESP32 datasheet. RTC Our modules by default all use the internal RC oscillator at 150kHz for the RTC. If you require better accuracy/
stability you can connect a 32.768 kHz crystal (or TCXO) externally on pins P19 and P20 (or P19 for a TXCO) Figure 3 External RTC crystal circuits Version 1.0 09 8.0 Programming the device 8.1 8.2 UART By default, the modules run an interactive python REPL on UART0 which is connected to P0 (RX) and P1
(TX) running at 115200 baud. Code can be run via this interactive REPL or you can use our PyMakr plugin for Atom or Visual Studio Code to upload code to the board. WiFi By default, the G01 also acts as a WiFi access point SSID: gpywlanXXXX Password: www.pycom.io Once connected to the G01s WiFi network you can access it in two ways. 9.0 Boot modes 9.1 Bootloader mode In order to update the firmware of the G01 device, it needs to be placed into bootloader mode. In order to do this, P2 needs to be connected to ground when the device reboots. Once in bootloader mode you can use the Pycom firmware update tool to update to the latest official firmware. If you are developing your own firmware based on our opensource firmware, a flashing script is provided with the source code. 8.2.1 8.2.2 9.2 Telnet Running on port 23 is a telnet server. This acts in a very similar way to the UART. It presents you with an interactive REPL and can also be used to upload code via PyMakr. FTP The G01 also runs a FTP server that allows you to copy files to and from the device, include an SD card if one is connected. To connect to this FTP server, you need to use plain FTP (unencrypted) with the following credentials:
User: micro Password: python Safe boot The micropython firmware features a safe boot feature that skips the boot.py and main.py scripts and goes straight to the REPL. This is useful if the device is programmed with code that causes the device to crash or become inaccessible. To access this mode, you need to connect P12 to 3.3V and reset the device. Upon entering safe boot mode, the onboard LED will begin to blink orange. Depending on the duration the pin is held at 3.3V, a different firmware will be run. Table 3 Boot modes 03 Seconds 36 Seconds Current firmware without running boot.py or main.py Previous firmware if the firmware was uploaded via OTA
(without running boot.py and main.py) Version 1.0 10 10.0 Power The G01 features an onboard voltage regulator that takes 3.5V 5.5V from the VIN pin and regulates it to 3.3V. It is important to only use the 3.3V as an output and not try to feed 3.3V into this pin as this could damage the regulator. 10.1 Current consumption by power modes/features running at 3.3V Table 4 Power consumption by feature Mode Idle (no radios) LTE Transmit LTE Attached WiFi AP WiFi client Bluetooth Deep sleep Min Avg. 37 173 75 117 130 113 13.5 Max 285 Units mA mA mA mA mA mA mA Version 1.0 11 11.0 Memory Map 11.1 Flash Table 5 Flash memory map Name NVS Description Start address Size Nonvolatile RAM area. Used by the NVS API 0x9000 0x7000 Firmware Slot 0 First firmware slot. Factory firmware is flashed here 0x10000 0x180000 OTA info Information about the current active firmware 0x190000 0x1000 Firmware Slot 1 Second firmware slot 0x1A0000 0x180000 File system Config File system (2) 11.2 RAM 504KB file system on devices with 4MB flash 0x380000 0x7F000 Config area for LoRa, Sigfox and LTE 0x3FF000 0x1000 4MB file system on devices with 8MB flash 0x400000 0x400000 Table 6 RAM memory map Name Description Onchip SRAM Internal RAM memory used by the 2 xtensa CPUs Fast RTC RAM Slow RTC RAM Fast RAM area accessible by the xtensa cores during boot and sleep modes Slow RAM area accessible by the UltraLow Power Coprocessor during deep sleep External pSRAM External QSPI RAM memory clocked @ 40MHz 11.3 ROM and eFuses Table 7 Miscellaneous memory Name Description Onchip ROM Contains core functions and boot code. 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including Flash Encryption and ChipID eFuse Version 1.0 Size 520KB 8KB 8KB 4MB Size 448KB 1kbit 12 12.0 WiFi 12.1 Supported features 802.11 b/g/n 802.11 n (2.4 GHz), up to 150 Mbps 802.11 e: QoS for wireless multimedia technology WMMPS, UAPSD AMPDU and AMSDU aggregation Block ACK Fragmentation and defragmentation Automatic Beacon monitoring/scanning 802.11 i security features: preauthentication and TSN WiFi Protected Access (WPA/WPA2/WPA2 Enterprise/WiFi Protected Setup (WPS) Infrastructure BSS Station mode/SoftAP mode WiFi Direct (P2P), P2P Discovery, P2P Group Owner mode and P2P Power Management 12.2 Specifications Table 8 WiFi specifications Description Input Frequency Min 2412 Typ. Max 2462 Unit MHz Output power of PA for 11b mode 20.48 21.31 22.13 dBm Sensitivity DSSS, 1Mbps CCK, 11 Mbps OFDM, 6 Mbps OFDM, 54 Mbps HT20, MCS0 HT20, MCS7 HT40, MCS0 HT40, MCS7 MCS32 OFDM, 6 Mbps OFDM, 54 Mbps HT20, MCS0 HT20, MCS7 Version 1.0 Adjacent channel rejection 37 21 37 20 98 91 93 75 93 73 90 70 89 dBm dBm dBm dBm dBm dBm dBm dBm dBm dB dB dB dB 13 13.0 Bluetooth 13.1 Supported features Compliant with Bluetooth v4.2 BR/EDR and BLE specification class2 transmitter without external power amplifier Enhanced power control NZIF receiver with 97 dBm sensitivity Adaptive Frequency Hopping (AFH) Standard HCI based on SDIO/SPI/UART Highspeed UART HCI, up to 4 Mbps BT 4.2 controller and host stack 13.2 Specification 13.2.1 Receiver Basic Data Rate Table 9 Receiver (basic data rate) specifications Parameter Sensitivity @0.1% BER Maximum received signal @0.1% BER Cochannel C/I F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz 30Mhz ~ 2000MHz 2000MHz ~
2400MHz 2500MHz ~
3000MHz 3000MHz ~
12.5GHz Adjacent channel selectivity C/I Outofband blocking performance Intermodulation Version 1.0 Service Discover Protocol (SDP) General Access Profile (GAP) Security Manage Protocol (SMP) ATT/GATT HID All GATTbased profile supported SPPlike GATTbased profile BLE Beacon A2DP/AVRCP/SPP, HSP/HFP, RFCOMM CVSD and SBC for audio codec Bluetooth Piconet and Scatternet Min 0 10 27 27 10 36 Typ. 94
+7 Max 6 6 25 33 25 45 Unit dBm dBm dB dB dB dB dB dB dB dBm dBm dBm dBm dBm 14 13.2.2 Receiver Enhanced Data Rate Table 10 Receiver (basic data rate) specifications Parameter Min Typ. Max Unit Sensitivity @0.1% BER Maximum received signal @0.1% BER Cochannel C/I Adjacent channel selectivity C/I Sensitivity @0.1% BER Maximum received signal @0.1% BER C/I cchannel Adjacent channel selectivity C/I
/4 DQPSK F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz 8DPSK F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz 90 0 11 7 7 25 35 25 45 84 5 18 2 2 25 25 25 38 dBm dBm dB dB dB dB dB dB dB dBm dBm dB dB dB dB dB dB dB Version 1.0 15 13.2.3 Receiver Bluetooth LE Table 11 Receiver (BLE) specifications Parameter Sensitivity @30.8% PER Maximum received signal @30.8% PER Cochannel C/I Adjacent channel selectivity C/I Outofband blocking performance Intermodulation F = F0 + 1MHz F = F0 1MHz F = F0 + 2MHz F = F0 2MHz F = F0 + 3MHz F = F0 3MHz 30MHz ~
2000MHz 2000MHz ~
2400MHz 2500MHz ~
3000MHz 3000MHz ~
12.5GHZ Min 0 10 27 27 10 36 Typ. 97
+10 5 5 25 35 35 45 Max Unit dBm dBm dB dB dB dB dB dB dB dB dBm dBm dBm dBm Version 1.0 16 13.2.4 Transmitter Basic Data Rate Table 12 Transmitter (basic data rate) specifications Parameter RF transmit power RF power control range
+20 dB bandwidth F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz F = F0 + >3 MHz F = F0 >3 MHz Adjacent channel transmit power f1avg f2max f2avg/f1avg ICFT Drift rate Drift (1 slot packet) Drift (5 slot packet) Min
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3 133.7 Typ. 4 0.9 24 16.1 40.8 35.6 45.7 40.2 45.6 44.6 0.92 7 0.7 6 6 Max
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5 155 Unit dBm dBm MHz dBm dBm dBm dBm dBm dBm dBm dBm KHz KHz KHz KHz/50s KHz KHz Version 1.0 17
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13.2.5 Transmitter Enhanced Data Rate Table 13 Transmitter (enhanced data rate) specifications Parameter RF transmit power Gain control step RF power control range
/4 DQPSK max w0
/4 DQPSK max wi
/4 DQPSK max |wi + w0|
8DPSK max w0 8DPSK max wi 8DPSK max |wi + w0|
/4 DQPSK modulation accuracy 99% DEVM RMS DEVM Peak DEVM RMS DEVM 8 DPSK modulation accuracy 99% DEVM Peak DEVM F = F0 + 1MHz F = F0 1MHz F = F0 + 2MHz Inband spurious emissions F = F0 2MHz F = F0 + 3MHz F = F0 3MHz F = F0 >3MHz EDR differential phase coding Version 1.0 Min 5 Typ. 6.5
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0.72 6 7.42 0.7 9.6 10 4.28 13.3 5.8 14 34 40.2 34 36 38 40.3 100 Max 8 30 20 41.5 Unit dBm dBm dBm KHz KHz KHz KHz KHz KHz
%
%
%
%
%
%
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%
18
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13.2.6 Transmitter Bluetooth LE Table 14 Transmitter (BLE) specifications Parameter RF transmit power Gain control step RF power control range Adjacent channel transmit power F = F0 + 1MHz F = F0 1MHz F = F0 + 2MHz F = F0 2MHz F = F0 + 3MHz F = F0 3MHz F = F0 + >3MHz F = F0 >3MHz f1avg f2max f2avg/f1avg ICFT Drift rate Drift Min 2 247 Typ. 3.5
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14.6 12.7 44.3 38.7 49.2 44.7 50 50 0.92 10 0.7 2 Max 5 265 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm KHz KHz KHz KHz/50s KHz Version 1.0 19
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14.0 LTE CATM1 14.1 Supported features 3GPP release 13 LTE Advanced Pro Supports narrowband LTE UE categories M1 Integrated baseband, RF, RAM memory and power management Reduced TX power class option Extended DRX (eDRX) and PSM features for long sleep duration use cases Table 15 LTE modem performance Parameter Min Typ. Max Unit Data rate LTE Cat M1 in 1.4 Mhz, HDFDD DL LTE Cat M1 in 1.4 Mhz, HDFDD UP 300 375 kbps kbps 14.2.1 Supported LTE bands Table 16 Supported LTE bands Bands Low Bands 4, 12, 13 14.3 SIM Card requirements Table 17 SIM card specificiations Parameter Form factor Variant Supply Voltage 14.4 Certified carriers Table 18 Certified carriers Carrier Verizon US TX/RX Frequencies LTE BAND 4:1710-1755MHz(TX);2110-2155(RX) LTE BAND 12:699-716MHz(TX);729-746(RX) LTE BAND 13:777-787MHz(TX);746-756(RX) Min Typ. Max Unit NanoSIM USIM 1.8 v Country United States Network LTE CATM1 Version 1.0 20 15.0 Electrical Characteristics 15.1 Absolute maximum ratings Table 19 Absolute maximum ratings Parameter Symbol Supply Input Voltage Supply Output Current Supply Output Voltage Storage Temperature Operating Temperature Moisture Sensitivity Level 15.2 Input/Output characteristics Table 20 Input/Output characteristics Parameter Input low voltage Input high voltage Max Input sink current Input leakage current Input pin capacitance Output low voltage Output high voltage VIN IOUT V3V3 TSTR TOPR MSL Symbol VIL VIH ISINK IIL Cpin VOL VOH Min 3.5 40 Min 0.3 0.75V3V3 0.1V3V3 0.8V3V3 Max Output source current ISOURCE Typ. Max Unit 3.3 1 5.5 1.2 85 V A V C C Typ. Max Unit 6 6 0.25V3V3 V3V3+0.3 12 50 2 12 V V mA nA pF V V mA Version 1.0 21 16.0 Minimum Recommended Circuit Figure 4 Minimum required circuit Version 1.0 22 17.0 Mechanical Specifications Figure 5 Mechanical drawing (top down view) 18.0 Recommended Land Patterns Figure 6 Recommended land pattern Version 1.0 23 19.0 Design Considerations 19.1 Antenna Impedance Our OEM modules are intended to be used with a 50ohm antenna. They are also required to be connected to the antenna by a 50ohm grounded coplanar waveguide (as shown in the reference design below with the yellow lines) or a microstrip. Figure 7 50ohm impedance antenna connections 19.2 Deep sleep power When selecting a voltage regulator for your application ensure that it has a low power mode, and that this is enabled when the device enters deep sleep. We also recommend cutting off power to all nonessential components such as LEDs, logic gates, sensors etc. when the device is in deep sleep. This can be done using the circuit shown right:
This circuit uses the 1.8V output of the module to cut off supply to nonessential circuitry. The 1.8V output is only active when the module is running, when it goes to deep sleep it drops to 0V. The nonessential circuitry is then powered from the ACTIVE_POWER bus Figure 8 Power switch for deep sleep mode Version 1.0 24 19.3 Reference layout Below you will find the designs for our universal reference board that fits all of our OEM modules. The design files can be downloaded from our website. Figure 9 PCB layers for reference design Units: mm Version 1.0 25 20.0 Soldering Profile Figure 10 Reflow soldering temperature profile Table 21 Soldering profile temperatures Stage Ramp to soak Soak Ramp to peak Reflow Cool down Duration/Rate 2C/s 60s 1C/s 45s 2C/s Temperature Ambient 185C 185C 240C
>225C The above profile is based on Alpha CVP390 solder paste, which has been successfully tested with our devices. Version 1.0 26 21.0 Ordering Information Table 22 Ordering information Product EAN Description 0700461341598 G01 OEM version of GPy 1.0 0700461908845 Reel of 250 G01 OEM modules 0700461908968 Reel of 500 G01 OEM modules 22.0 Packaging 22.1 Reel 22.3 Box Figure 11 Mechanical drawing of reel Units: mm Figure 13 Mechanical drawing of reel box Units: mm 22.2 Tape Figure 12 Mechanical drawing of reel tape Units: mm Version 1.0 27 23.0 Certification FCC 2AJMTG01R IC 22263G01R Copies of the certificates can be found on our website. Version 1.0 28
Statement
(2) This device must accept any interference received, including
party responsible for compliance could void the user's authority to
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of
This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with
encouraged to try to correct the interference by one or more of the following measur
RF Warning Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment . This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. This device is intended only for OEM integrators
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
manufacturer is responsible for ensuring compliance with the
es:
module and a module is added, the host manufacturer is responsible
We hereby acknowledge our responsibility to provide guidance to the host manufacturer in the event that they require assistance for
longer considered valid and the FCC ID cannot be used on the
End Product Labeling The outside of final products that contains this module device must display a label referring to theenclosed module. This exterior label can use wording such as: "Contains Transmitter Module FCC ID:2AJMTG01R or Contains FCC ID:2AJMTG01R , Any similar wording that expresses the same meaning may be used.
In the user manual of the end product, the end user has to be informed that the equipment complies with FCC radio-frequency
The end user has to also be informed that any changes or
The end user manual shall include all required regulatory
ISED RSS Warning/ISED RF Exposure Statement
7
@ FDD (Band 4),
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10.51 @ FDD (Band 12) and 10.94 @ FDD (Band 13)
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For IC , to meet RF exposure & ERP/ERIP, the maximum net gain of antennas allowed are 5.96 dBi @ FDD (Band 4), 7.14 @ FDD (Band 12) and 7.46 @ FDD (Band 13). The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.