IEEE 80 02.15.4 RF M Module Spec cification She eet 10527A003 2011-05-27 File No.: 11 Date : 2 Manua al RP-M10 00A AT-M10 00A IEE EE802.15.4 R RF Module MAY 27. 2011 Mode el Number Part Number Spec cification. Date Rema arks VERSION 2 2.0 Page 1 IEEE 802.15.4 RF Module Specification Sheet REVISION HISTORY NO REASON DESCRIPTION OF CHANGES REMARKS DATE 1 2 New Rev 1 RP-M100A Manual For Approval first releases Update of Specification For Approval Ver.1.1 Ver. 2.0 2010.02.22 2011.05.27 VERSION 2.0 Page 2 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION 1.1 Scope This specification is applied to IEEE802.15.4 ZigBee Transceiver Module This module has Chip Antenna and embeds 16MHz X-TAL and Single chip SOC. Item Application Frequency Range Technical Standard Type Size 1.2 Description 1.3 Appearance 1) Out line Description Transceiver Module 2.4 ~ 2.4835 GHz IEEE802.15.4 SMD Type 17.9 x 14.9 x 2.6 mm Unit :mm VERSION 2.0 Page 3 IEEE 80 02.15.4 RF M Module Spec cification She eet 1. SP PECIFICAT TION 2) Pcb draw wing (top vie ew). Pads of f pin 1~41
; (W*L: 0.7*
1.6mm) Pads of f pin 42,45
; (R=0.75, C Circle) Pads of f pin 43,44
; (R=0.625, C Circle) Solde shoul agains ermask ope d be enou st these pad ening of 42~
ugh about ds size.
~45 pins 25~50%
NOT TE) Silk pa aste inserting for Short pro otection, when n soldering Silk(w=0.15m mm 0.8mm 1mm VERSION 2 2.0 Page 4 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION 1.4 Absolute maximum ratings Symbol Parameter VDD VDDIO RFIN TSTG ESD Chip core supply voltage I/O supply voltage(3V_IN) Input RF level Storage Temperature HBM(JESD22-A114-F) MM(JESD22-A115-A) CDM(JESD22-C101-E) 1.5 DC Characteristics Symbol Parameter VDD VDDIO VIH VIL VOH VOL TA Chip core supply voltage
(AVDD_1.5V,DVDD_1.5V) I/O supply voltage(3V_IN) High level input voltage Low level input voltage High level output voltage Low level output voltage Air temperature Rating
-0.3 to 1.65
-0.3 to 3.3 10
-40 to 85 2000 150 500 Unit V V dBm V V V Min 1.35 1.35(*) 0.7X VDDIO 0 VDDIO -0.5 0
-40 Typ. 1.5 3.0 Max 1.65 3.3 VDDIO 0.3X VDDIO VDDIO 0.4 85 Unit V V V V V V
(*) : MSV=L, min 1.9V(regulator drop voltage), 3VIN=2.7~3.3V is Recommended. VERSION 2.0 Page 5 IEEE 802.15.4 RF Module Specification Sheet 1.6 Electrical specifications 1.SPECIFICATION
(Condition: EVM Board RF Conduction, at 25, 3V_IN=3.0V, VDD(AVDD,DVDD=1.5V,X-tal 16MHz) 1.6.1 Current Consumption and timing characteristics Parameter Min Typ. Max Unit Current Consumption Active MCU without RX/TX operation
(AES, Peripheral, SADC Disabled) Active MCU with TX Mode
(AES, Peripheral, SADC Disabled)
@ +8dBm output power
@+0dBm output power Active MCU with RX Mode
(AES, Peripheral, SADC Disabled) PM1(BOD Off) PM2 PM3 AES Peripheral Sensor ADC 4.6 45.0 32.5 35 25 1.7 0.3 3.1 2.6 1 90 mA mA mA uA uA uA mA mA mA VERSION 2.0 Page 6 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION 1.6.2 RF Characteristics (Fc=2450MHz) Parameter RF Frequency Range Spurious radiation
@30MHz ~ 1000MHz
@1GHz ~ 12.75GHz Received RF Bandwidth Channel Bandwidth Receiver Sensitivity
(PER1%,Packet length of 22-byte) Normal mode (250 kbps) Turbo mode (500 kbps) Premium mode (1000 kbps) Adjacent Channel Rejection
+5MHz
-5MHz Alternate Channel Rejection
+10MHz
-10MHz Co-Channel Rejection Blocking / Desensitization
+5MHz / -5MHz
+10MHz / -10MHz
+20MHz / -20MHz
+30MHz / -30MHz
+50MHz / -50MHz Max 2483.5 Min 2400 Typ
-65
-70 2 5
-98
-95
-91 50 49 55 54
-8
-53 / -52
-48 / -46
-44 / -40
-43 / -38
-41 / -37 Unit MHz dBm MHz MHz dBm dB dB dB dBm VERSION 2.0 Page 7 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION Parameter Min TX output power Transmit chip rate Spurious Emission(30Hz~1GHz) Spurious Emission(1GHz~2.5GHz) Spurious Emission(2.5GHz~12.7GHz) 2nd Harmonics 3nd Harmonics Frequency Error Tolerance Error Vector Magnitude(EVM) Saturation(Maximum Input Level) RSSI Dynamic Range RSSI Accuracy RSSI Linearity RSSI Average Time Frequency Synthesizer Phase Noise
(Unmodulated carrier)
@100KHz offset
@1MHz offset
@2MHz offset
@3MHz offset
@5MHz offset PLL Lock Time PLL Jitter
-100 Typ 5.5 2000
-50
-40
-50
-50
-65 10 5 90 1.2 0.2 128
-75
-106
-112
-119
-129 110 16 Max 8 Unit dBm
+100 35
+6/-3 6 kChips/s dBm dBm dBm dBm dBm KHz
dBm dB dB dB usec dBc/Hz us Psec VERSION 2.0 Page 8 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION 1.6.2.1 Antenna Description Parameter Chip Antenna ( used in RP-M100A) Model Name Frequency Bandwidth Gain(max) Connector Dipole Antenna ( used in RP-M110A) Model Name Frequency Bandwidth Gain(max) Connector Description ISM-SWC-01 2400 ~ 2500 (MHz) 100 (MHz)
-0.97dBi Chip WE-2400TO 2400~24835 (MHz) 83.5 (MHz) 1.98 dBi Reverrse SMA male VERSION 2.0 Page 9 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION 1.6.3 16MHz Crystal Oscillator & On-chip RC Regulator & ADC & On-chip Voltage Regulator Max Parameter Typ Min 16MHz Crystal Oscillator Crystal Frequency Crystal Frequency Accuracy Requirement ESR C0 CL On-chip RC Regulator Frequency Sensor ADC Number of Bits Conversion Time Differential Nonlinearity(DNL) Integral Nonlinearity(INL) SINAD(Sine Input) On-chip Voltage Regulator Supply range for Regulator Regulated Output Maximum Current No Load Current Start-up Time
-20 1.9 16 9 32.78 12 256 16 16 51.0 3.0 1.5 15 260
+20 80 3 3.6 140 Unit MHz ppm KHz bits usec LSB LSB dB V V mA uA usec VERSION 2.0 Page 10 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION 1.7 Electrical Interface Terminal 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 NAME ACH0 ACH1 ACH2 ACH3 AVDD_1.5V AGND MS0 MS1 MS2 MSV RESETB 3V_IN DGND P1[7]
P1[6]
P1[5]
P1[4]
P1[3]
P1[2]
P1[1]
P1[0]
P3[7]
P3[6]
Interface Analog Analog Analog Analog Power Ground Digital Digital Digital Digital Digital Power Ground Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital I/O I/O I/O I/O I/O I/O
I I I I I I
O B B B B B B B B B Description Sensor ADC input Sensor ADC input Sensor ADC input Sensor ADC input 1.5V Power Supply input/output RF Ground Mode select Mode select Mode select Mode select of voltage(0=1.5V) Reset (Active Low) 3V Power supply Ground for digital core and I/O Port P1.7GPO/P0AND/TRSW Port P1.6/TRSWB Port P1.5 Port P1.4 /QUADZB/Sleep Timer OSC Buffer Input. Port P1.3/QUADZA/Sleep Timer OSC Buffer Output/RTCLKOUT Port P1.2 Port P1.1/TXD1 Port P1.0/RXD1 Port P3.7/12mA Drive capability /PWM3/CTS1/SPICSN(slave only) Port P3.6/12 mA Drive capability /PWM2/RTS1/SPICLK VERSION 2.0 Page 11 IEEE 802.15.4 RF Module Specification Sheet 1. SPECIFICATION Terminal NAME Interface I/O Description 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 P3[5]
P3[4]
P3[3]
P3[2]
P3[1]
P3[0]
DGND DVDD_1.5V P0[7]
P0[6]
P0[5]
P0[4]
P0[3]
P0[2]
P0[1]
P0[0]
NC NC AGND DGND DGND AGND Digital Digital Digital Digital Digital Digital Ground Power Digital Digital Digital Digital Digital Digital Digital Digital NC NC Ground Ground Ground Ground B B B B B B
I/O B B B B B B B B
Port P3.5/T1/CTS0/QUADYB/SPIDO Port P3.4/T0/RTS0/QUADYA/SPIDI Port P3.3/INT1(active low) Port P3.2/INT0(active low) Port P3.1/TXD0/QUADXB Port P3.0/RXD0/QUADXA Ground for digital core and I/O 1.5V Power Supply input/output Port P0.7/I2STX_MCLK Port P0.6/I2STX_BCLK Port P0.5/I2STX_LRCK Port P0.4/I2STX_DO Port P0.3/I2SRX_MCLK Port P0.2/I2SRX_BCLK Port P0.1/I2SRX_LRCK Port P0.0/I2SRX_DI No Connection No Connection RF Ground Ground for digital core and I/O Ground for digital core and I/O RF Ground VERSION 2.0 Page 12 IEEE 802.15.4 RF Module Specification Sheet 1) After you stick RP-M100A in ADPTER -PCIB , connect ADPTER -PCIB to your PC using the USB 2. Operation cable as shown below figure. EVB Board 2) Move 2. Power switch(Figure1) in USB position to power up. 3) Check if 3. USB Power LED(Figure1) stays on.
( => To initialize LM2400-R, press the 4. Reset switch(Figure1). ) 4) After the CatTerm 2.0 (Serial Terminal Program) is installed, run this program. And then press the Connect button to configure the serial port as shown below figure.
( In setting the COM port, after you install the driver of the CP2102(USB chip), select the COM port which is setted automatically. VERSION 2.0 Page 13 IEEE 802.15.4 RF Module Specification Sheet 5) If you press the Connect button, stay in the connection status. In the <RX>,<TX> window, select the ASCII and the Immediately option. 6) If you press the 4. Reset switch(Figure 1), the selection menu appears in the window. VERSION 2.0 Page 14 IEEE 802.15.4 RF Module Specification Sheet 7) The description of menu is as shown below the table. If you want to select one, put the number in command line of TX window. Channel
2)26,2480MHz [0-2]:
0)11,2405MHz 1)19,2445MHz setting 0) channel 11 (2405MHz) 1) channel 19 (2445MHz) 2) channel 26 (2480MHz) or channel 25(2475MHz)
>>> Modulation setting 0)No Modulation 1)Modulation
[0-1]:
Caution) In LM2400-PR module, when you switch between Unmodulation and Modulation, you should select Normal before Unmodulation or Modulation. Ex) Unmodulation -> Normal ->Modulation
>>> TxPower setting (refer the tx power table [0x77-0x]:
=> Refer to below Transmit Power by PowerLevel table Caution) In the <TX> window, select the HEX option.
>>> Rx Mode setting 0)Rx Mode OFF 1) Rx Mode ON [0-1]:
0) When the Rx Mode is OFF, stays in TX status. 1) When the Rx Mode is ON, stays in RX status. 0 Channel setting 1 Modulation setting 2 TxPower setting 3 Rx setting VERSION 2.0 Page 15 IEEE 802.15.4 RF Module Specification Sheet ex) In 5.0dBm, the hex value of TX power is 0x77. In -38.4dBm, 0x70.
[ TX power table ]
VERSION 2.0 Page 16 IEEE 802.15.4 RF Module Specification Sheet 3. Reliability 3.1 Reliability
. No. 1 2 3 4 5 6 7 8 9 10 Test item Reflow Thermal Cycle Thermal Shock Cycle Vibration Test High Temperature Storage Test Low Temperature Storage Test High Temperature & Humidity Storage Test Operating Temperature TEST High Temperature & Humidity Operating Test Drop Test ESD Test condition Normal Pbfree reflow Condition.2 times 30min. at -40, 30min. at 85 , 100Cycles Recovery Time 2hours 50Hz -> 500Hz -> 50Hz , 15min/Cycle X,Y,Z : Each 12 times [Total : 9hours]
96 hours at 852, Recovery Time 2hours 96 hours at -402, Recovery Time 2hours 96 hours at 602 & 95%RH2%RH. Recovery Time 2hours 96hours at -40,85 24hours at 60 & 85%2%RH. Height min 76 , All sides onto Iron plate(T=min2mm). HBM : 2000V MM : 150V CDM : 500V 3.2 Antenna 1) Specification of Antenna
(Condition: Application Board_40.0 x 40.0 x1.2t mm ) ITEM Frequency V.S.W.R Gain(AVG) Maximum input power Characteristics TYPE Polarization Radiated Pattern Impendence SIZE UNIT MHz dBi W Meander IFA Vertical Omni-directional 50 10.5X3.5X1.7tmm MIN 2400
-2 TYP MAX 2500 2.0 1 2) Antenna matching for Application Board
; Board design for the optimization of the antenna is necessary confirm of AAC VERSION 2.0 Page 17 IEEE 802.15.4 RF Module Specification Sheet FCC Information to User This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is con-nected. Consult the dealer or an experienced radio/TV technician for help. Caution Modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. FCC Compliance Information : This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation RF exposure compliance:
The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. VERSION 2.0 Page 18 IEEE 802.15.4 RF Module Specification Sheet To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operate in conjunction with any other antenna or transmitter. As such, the radio component of this device is intended only for OEM integrators under the following two conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (e.g., digital device emissions, PC peripheral requirements). In the event that these conditions cannot be met (for example, co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following :
Contains Transmitter Module FCC ID: UNTRP-M100A. The radio component is an integral part of the RP-M100A and cannot be removed. VERSION 2.0 Page 19