FCC ID: A3LSIP005AFS30 ARTIK-0530

ARTIK 530(s) User Manual and HOST INSTALLATION MANUAL Reference Samsung Module Model: SIP005AFS30 FCC ID: A3L-SIP005AFS30 IC ID: 649E-SIP005AFS30 The Samsung ARTIK 530(s) is a certified transmitter module approved under FCC ID: A3L-SIP005AFS30 and ISED Canada certification number 649E-SIP005AFS30. Instructions for installation of this module when using the onboard uFL connectors can be found in this document and provided that those instructions are followed the certification of the module can be leveraged for the combination of host and system. If using an on-board trace to connect to an antenna, either directly or via an on-board rf connector, please refer to the limited modular approval installation guide. The Full Modular Approval (FMA) covers the module installed such that the U.FL connectors for the ZigBee and Wi-Fi/Bluetooth antennas on the module connect directly to the antennas via an u.FL-to-RP-

SMA connector. The FMA covers the antenna configuration listed below:

Option 1: Patch Antenna direct connected to SoM (see the Molex 146153-0050 peak gain in the section below) Option 2: Use SMA Mounted Antenna direct connected to SoM (see the Taoglas GW.71.5153 peak gain in the section below). The connector should be reverse gender or thread. The u.FL-to-RP-SMA connector specification and its loss are listed below:

Vendor: Data Alliance, LLC. (https://www.data-alliance.net) Antenna Cable: SKU: RSf30mmUFL, u.FL to RP-SMA Female: 1 inch cable One end has a U.FL connector and the other end has a RP-SMA female connector. Cable Thickness: 1.13mm: Thin, flexible Page 1 of 5 Attenuation Per Foot:

o at 900 MHz: 0.23 db/ft o at 2.4 GHz: 0.39 db/ft o at 3.4GHz: 0.47 db/ft o at 5.1-5.8GHz: 0.643 db/ft The actual measurement of the cable loss:

Frequency Cable loss 2400MHz 5180MHz WiFi 5320MHz 5600MHz 5800MHz Zigbee 2400MHz 0.37 0.57 1.6 0.87 1.0 0.37 The Full Modular Approval covers these 2 antenna:

1. Molex 146153-0050 Antenna type 2.4/5GHz Balanced Flex Antenna Antenna peak gain

+2.56 dBi(2484 MHz)

(WiFi and Zigbee)

+3.04 dBi (5180 MHz)

+3.49 dBi (5320 MHz)

+4.59 dBi (5600 MHz)

-4.87 dBi (5800 MHz) 2. Taoglas GW.71.5153 Antenna type Diploe 2.4GHz/5.8GHz RP-SMA Antenna Antenna peak gain

+3.2 dBi(2484 MHz)

(WiFi and Zigbee)

+4.8 dBi (5180 MHz)

+4.7 dBi (5320 MHz)

+4.3 dBi (5600 MHz)

+4.0 dBi (5800 MHz) Connection of an antenna directly to the U.FL connectors on the module, is covered by the certification provided that the following requirements are met:

1. The antenna type must be a dipole or patch antenna;

Page 2 of 5 2. The gain of the antenna, which includes any cable loss between the uFL connector on the module and the antenna, must not exceed1 the following:

Frequency

(antenna peak gain - cable loss)

(antenna peak gain - cable loss) Maximum patch antenna gain Maximum dipole antenna gain

(Molex 146153-0050)

(Taoglas GW.71.5153) 2400MHz 5180MHz 2.56-0.37=2.19 3.04-0.57=2.47 WiFi 5320MHz 3.49-1.6=1.89 5600MHz 5800MHz 4.59-0.87=3.72 4.87-1.0=3.87 Zigbee 2400MHz 2.56-0.37=2.19 3.2-0.37=2.83 4.8-0.57=4.23 4.7-1.6=3.1 4.3-0.87=3.43 4.0-1.0=3.0 3.2-0.37=2.83 All other requirements in the installation instructions must be followed. These include:

Labeling the host device with Contains FCC ID: A3L-SIP005AFS30 and Contains IC ID: 649E-

SIP005AFS30;

Ensuring that the end user does not have the ability to remove the antennas, or if they do using a unique antenna connector to ensure only an equivalent antenna can be used;

Host devices must be considered as mobile equipment for RF exposure classification. This means that the host device should not be operating within 20cm of people and would typically be a desktop, wall mounted or similar device. If the installation conditions cannot be met then additional certification requirements apply. Please contact Samsung at support@samsung.com to determine if your installation conditions can be covered through a Class 2 Permissive Change to the modular approval or need to be addressed as a system level

(host + module) approval. Instruction to integrator for the dipole antenna For the dipole the user/integration manual, according to RSS-GEN, must give direction to the integrator that the end product manual needs to follow the following:

For license-exempt equipment with detachable antennas, the user manual shall also contain the following notice in a conspicuous location:

This radio transmitter [649E-SIP005AFS30] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. 1. Molex 146153-0050 Antenna type 2.4/5GHz Balanced Flex Antenna 1 These values are lower than those detailed for connection to the PCB trace as they account for the cable loss between module and PCB trace and the loss of the PCB trace Page 3 of 5 Antenna peak gain

+2.56 dBi(2484 MHz)

(WiFi and Zigbee)

+3.04 dBi (5180 MHz)

+3.49 dBi (5320 MHz)

+4.59 dBi (5600 MHz)

-4.87 dBi (5800 MHz) 2. Taoglas GW.71.5153 Antenna type Diploe 2.4GHz/5.8GHz RP-SMA Antenna Antenna peak gain

+3.2 dBi(2484 MHz)

(WiFi and Zigbee)

+4.8 dBi (5180 MHz)

+4.7 dBi (5320 MHz)

+4.3 dBi (5600 MHz)

+4.0 dBi (5800 MHz) FCC REGULATORY DISCLOSURES This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two Conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesirable operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/ TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the transmitters radiating structure(s) and the body of the user or nearby persons. This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance with all applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The Page 4 of 5 OEM product must comply with all applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely responsible for certification and testing and labeling of its own products. In addition to any independently required labels, the OEM shall also affix to the outside of a device into which the module is installed a label referring to the enclosed module. This exterior label should be prepared in a legible font and permanently affixed and using the wording Contains Transmitter Module FCCID: A3LSIP005AFS30 The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of 20 cm between the equipments radiating structure(s) and the body of the user or nearby persons. The OEM shall also advise its end user of this requirement as required by applicable rules. The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines for an uncontrolled environment can be satisfied. The OEM shall further inform its end user that any change or modifications to this module not expressly approved by the manufacturer will void the warranty and the users authority to operate the equipment. INDUSTRY CANADA REGULATORY DISCLOSURES INDUSTRY CANADA STATEMENT This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'opration est soumise aux deux conditions suivantes:(1) cet appareil ne peut causer d'interfrences, et

(2) cet appareil doit accepter toute interfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement de l'appareil. INDUSTRY CANADA RADIATION EXPOSURE STATEMENT AND LIMITATIONS ON USE This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This equipment should be installed and must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment is restricted to indoor use in the 5.15-5.25 GHz range. This equipment is not able to be operated at 5600-5650. In the United States and Canada, only Channel 1~11 can be operated and these channel assignments deal only with the 2.4 GHz range. The end product must be labeled to display the Industry Canada certification number of the module. Contains transmitter module IC: 649E-SIP005AFS30 Le dispositif d'accueil doivent tre tiquets pour afficher le numro de certification d'Industrie Canada du module. Contient module metteur IC : 649E-SIP005AFS30. Page 5 of 5

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" b asis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide TABLE OF CONTENTS Table of Contents ................................................................................................................................................................... 2 List of Figures .......................................................................................................................................................................... 3 List of Tables ........................................................................................................................................................................... 3 Version History ...................................................................................................................................................................................... 4 Handling Guide ....................................................................................................................................................................... 5 ARTIK 530 Development Board Overview ........................................................................................................................... 6 features .................................................................................................................................................................................................. 6 Block diagram ....................................................................................................................................................................................... 7 Mechanical Drawings ........................................................................................................................................................................... 7 ARTIK 530 Module ................................................................................................................................................................ 10 ARTIK 530 Module Specification ........................................................................................................................................................ 10 ARTIK 530 Development Board Interposer Board ........................................................................................................... 11 Interposer Board Boot mode Configuration .................................................................................................................................... 12 USB OTG ............................................................................................................................................................................................... 13 HDMI 1.4a ............................................................................................................................................................................................ 13 LVDS ..................................................................................................................................................................................................... 14 Ethernet................................................................................................................................................................................................ 14 Antenna ................................................................................................................................................................................................ 15 ARTIK 530 Development Board Platform Board .............................................................................................................. 16 Configuration of External Power Source .......................................................................................................................................... 17 SD-Card Interface................................................................................................................................................................................ 17 EarJack Interface ................................................................................................................................................................................. 18 MIPI DSI/CSI Interface ......................................................................................................................................................................... 18 USB Host 2.0 Interface ....................................................................................................................................................................... 19 Connector to IF Board Interface ........................................................................................................................................................ 20 ARTIK 530 Development Board IF Board .......................................................................................................................... 21 Preview on the ARTIK IF board .......................................................................................................................................................... 21 Configuration of external Power Source .......................................................................................................................................... 22 ARTIK 530 Development Board Booting ........................................................................................................................... 23 Serial Port Connection ....................................................................................................................................................................... 23 Terminal Emulator Installation ......................................................................................................................................................... 24 Power on the ARTIK 530 Development Board.................................................................................................................................. 25 Network Settings ................................................................................................................ ! . How to use sftp .................................................................................................................. ! . How to use ssh ................................................................................................................... ! . Package installation .......................................................................................................... ! . Legal Information ................................................................................................................................................................. 27 Samsung Confidential Specifications in this document are tentative and subject to change. 2 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide LIST OF FIGURES Figure 1. Preview of the ARTIK 530 Board ............................................................................................................................ 6 Figure 2. ARTIK 530 Development Board .............................................................................................................................. 7 Figure 3. Mechanical Drawing ARTIK 530 Development Board Interposer Board all dimensions are in [mm] .......... 8 Figure 4. Mechanical Drawing ARTIK 530 Development Board Platform Board all dimensions are in [mm] ............. 9 Figure 5. ARTIK 530 Development Board Interposer Board Left Top Side, Right Bottom Side .................................. 11 Figure 6. ARTIK 530 Development Board Booting Switch Location ................................................................................ 12 Figure 7. USB OTG Interface location on the Interposer Board ...................................................................................... 13 Figure 8. HDMI 1.4a Interface location on the Interposer Board ................................................................................... 13 Figure 9. LVDS Interface location on the Interposer Board ............................................................................................. 14 Figure 10. Ethernet Interface location on the Interposer Board .................................................................................... 14 Figure 11. Antenna location on the Interposer Board ..................................................................................................... 15 Figure 12. ARTIK 530 Development Board Platform Board Left Bottom Side, Right Top Side ................................... 16 Figure 13. Jumper Interface locations JP1-JP4 on the Platform Board ........................................................................... 17 Figure 14. SD-Card Interface location on the Platform Board ........................................................................................ 17 Figure 15. Ear Jack Interface location on the Platform Board ......................................................................................... 18 Figure 16. MIPI DSI Interface location on the Platform Board ........................................................................................ 18 Figure 17. MIPI CSI Interface Location on the Platform Board ....................................................................................... 19 Figure 18 USB2.0 Interface location on the Platform Board ........................................................................................... 19 Figure 19. Expansion Connector Interface location on the Platform Board ................................................................. 20 Figure 20. ARTIK 530 Development Board IF Board ......................................................................................................... 21 Figure 21. Jumper Interface locations J20, J21 on the IF Board ....................................................................................... 22 Figure 22. Typical Linux Serial Console .............................................................................................................................. 23 Figure 23. USB Serial Cable hooked up to the Platform Board ....................................................................................... 24 Figure 24 Connection Power adaptor with development Board .................................................................................... 25 Figure 25. Power switch location on the development Board ........................................................................................ 25 Figure 26. Power button location on the development Board ....................................................................................... 26 LIST OF TABLES Table 1. Main Features of the ARTIK 530 Module ............................................................................................................. 10 Table 2. Boot option that can be set on the Interposer Board ....................................................................................... 12 Table 3 Antenna spec ........................................................................................................................................................... 15 Table 4. Connector J2 ............................................................................................................................................................ 21 Table 5. Connector J3 ............................................................................................................................................................ 22 Samsung Confidential Specifications in this document are tentative and subject to change. 3 Samsung Semiconductor, Inc. VERSION HISTORY Revision Date ARTIK 530 Development Board User Guide Description Maturity Samsung Confidential Specifications in this document are tentative and subject to change. 4 Samsung Semiconductor, Inc. HANDLING GUIDE Precaution against Electrostatic Discharge ARTIK 530 Development Board User Guide When using the ARTIK 530 Board, ensure that the environment is protected against static electricity:

Contamination Do not use the ARTIK 530 Board in an environment exposed to dust or dirt adhesion. Temperature/Humidity The ARTIK 530 Board is sensitive to:

1. Environment 2. Temperature 3. Humidity High temperature or humidity deteriorates the characteristics of ARTIK 530 Board, therefore, do not store or use the ARTIK 530 Board under such conditions. Mechanical Shock Do not to apply excessive mechanical shock or force on the ARTIK 530 Board. Chemical Do not expose the ARTIK 530 Board to chemicals. Exposure to chemicals leads to reactions that deteriorate the characteristics of the ARTIK 530 Board. EMS (Electro Magnetic Susceptibility) Strong electromagnetic waves or magnetic fields may affect the characteristics of the ARTIK 530 Board during the operation under insufficient PCB circuit design for Electro Magnetic Susceptibility (EMS). Samsung Confidential Specifications in this document are tentative and subject to change. 5 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide ARTIK 530 DEVELOPMENT BOARD OVERVIEW FEATURES The ARTIK 530 Development Board consists of 1x Interposer Board , 1x Platform Board, and 1x IF Board. The Interposer Board does include the ARTIK 530 Module. The ARTIK 530 Development Board is an affordable approach for developing an IoT solution. Figure 1 show the locations of the various boards that make up the ARTIK 530 Development Board. Figure 1. Preview of the ARTIK 530 Board Samsung Confidential Specifications in this document are tentative and subject to change. 6 Samsung Semiconductor, Inc. BLOCK DIAGRAM ARTIK 530 Development Board User Guide Figure 2 shows the block diagram of the ARTIK 530 Development Board, if you want more information on the ARTIK 530 Module please consult the ARTIK 530 Module Datasheet. Figure 2. ARTIK 530 Development Board MECHANICAL DRAWINGS Figure 3 and Figure 4 show the ARTIK 530 Development Board Interposer Board and the Platform Board respectively. Samsung Confidential Specifications in this document are tentative and subject to change. 7 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide Figure 3. Mechanical Drawing ARTIK 530 Development Board Interposer Board all dimensions are in [mm]

Samsung Confidential Specifications in this document are tentative and subject to change. 8 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide Figure 4. Mechanical Drawing ARTIK 530 Development Board Platform Board all dimensions are in [mm]

Samsung Confidential Specifications in this document are tentative and subject to change. 9 Samsung Semiconductor, Inc. ARTIK 530 MODULE ARTIK 530 Development Board User Guide The ARTIK 530 Development Board contains the ARTIK 530 Module. This section will describe some of the main features of this module. For more information on the ARTIK 530 Module please consult the ARTIK 530 Module datasheet. ARTIK 530 MODULE SPECIFICATION The ARTIK 530 Module is designed for IoT devices and it contains a lot of functions based on a Linux system. Not only multimedia functions but also network functions for example Wi-Fi or ZigBee. In addition the ARTIK 530 Module has mass storage functionality and its own security solution. Table 1 shows the main features of the ARTIK 530 Module that is part of the ARTIK 530 Development Board. Table 1. Main Features of the ARTIK 530 Module Processor Media Memory Security Radio CPU GPU 4x ARM Cortex-A9@1.2GHz 3D graphics accelerator Camera I/F Display Audio 4-Lane MIPI CSI 4-Lane MIPI DSI up to FHD@24bpp I2S audio interface DRAM FLASH 512MB DDR3 @ 800MHz 4GB eMMC Secure Element Trusted Execution Environment Secure point to point authentication and data transfer Trustware WLAN Bluetooth 802.15.4 IEEE 802.11a/b/g/n 4.2+LE ZigBee + Thread Power Management PMIC Provides all power of the ARTIK 530 Module using on board bucks and LDOs Interfaces Analog and Digital I/O GPIO, I2C, SPI, UART, SDIO, USB 2.0, JTAG, Analog Input Samsung Confidential Specifications in this document are tentative and subject to change. 10 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide ARTIK 530 DEVELOPMENT BOARD INTERPOSER BOARD The Interposer Board as depicted in Figure 5 highlights the most important components on the Interposer board. Figure 5. ARTIK 530 Development Board Interposer Board Left Top Side, Right Bottom Side Samsung Confidential Specifications in this document are tentative and subject to change. 11 Samsung Semiconductor, Inc. INTERPOSER BOARD BOOT MODE CONFIGURATION ARTIK 530 Development Board User Guide This section describes the various boot modes that are supported on the ARTIK 530 Development Board. Table 2 and Figure 6 show how to manipulate SW4 and where SW4 is located on the Interposer Board to set the various booting options that are available on the ARTIK 530 Development Board. Table 2. Boot option that can be set on the Interposer Board SW4 AP_GPB13_SD0_BOOT AP_GPB15_SD1_BOOT AP_GPB4_VID1_3_BOOT eMMc 1st Boot Off Off Off SD Card 1st Boot Off Off On USB 1st Boot On On X Figure 6. ARTIK 530 Development Board Booting Switch Location Samsung Confidential Specifications in this document are tentative and subject to change. 12 Samsung Semiconductor, Inc. USB OTG ARTIK 530 Development Board User Guide The Interposer board has 1x USB OTG connector located as can be seen in Figure 7. Figure 7. USB OTG Interface location on the Interposer Board HDMI 1.4A The Interposer board has 1x HDMI 1.4a connector (Micro D-Type) located as can be seen in Figure 8. The following video formats are supported:

1. 480p/480i @59.94Hz/60Hz, 576p/576i@50Hz 2. 720p/720i @50Hz/59.94Hz/60Hz 3. 1080p/1080i @50Hz/59.94Hz/60Hz Figure 8. HDMI 1.4a Interface location on the Interposer Board Samsung Confidential Specifications in this document are tentative and subject to change. 13 Samsung Semiconductor, Inc. LVDS ARTIK 530 Development Board User Guide The Interposer board has 1x LVDS Interface containing 5x data channels and 1x clock channel, its location can be seen in Figure 9. The available maximum resolution is 1920x1080@60fps. Figure 9. LVDS Interface location on the Interposer Board ETHERNET The Interposer board has 1x Ethernet Interface, its location can be seen in Figure 10. The Ethernet Interface is based on 802.3az-2010 complying to the Energy Efficient Ethernet (EEE) standard. The maximum theoretical speed of the interface is 1000Mbps. Figure 10. Ethernet Interface location on the Interposer Board Samsung Confidential Specifications in this document are tentative and subject to change. 14 Samsung Semiconductor, Inc. ANTENNA ARTIK 530 Development Board User Guide Antenna which is enclosed in KIT has to be assembled on Interposer board if use Wifi/BT and Zigbee. Antena spec can be seen in Table 3 Antenna type Antenna peak gain Frequency Connector type ANT.Size Table 3 Antenna spec Dipole Antenna

+1.43(2.4GHz)/ +0.91(5GHz) 2.4GHz, 5GHz (for Wi-Fi, BT, ZigBee) SMA-M 108.7mm Figure 11. Antenna location on the Interposer Board Samsung Confidential Specifications in this document are tentative and subject to change. 15 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide ARTIK 530 DEVELOPMENT BOARD PLATFORM BOARD The Platform Board as depicted in Figure 12 highlights the most important components on the Interposer board. Figure 12. ARTIK 530 Development Board Platform Board Left Bottom Side, Right Top Side Samsung Confidential Specifications in this document are tentative and subject to change. 16 Samsung Semiconductor, Inc. CONFIGURATION OF EXTERNAL POWER SOURCE ARTIK 530 Development Board User Guide Through selection of the Jumpers JP1-JP4 the IO power source can be selected to either DC-5V or to Charger Output. Figure 13 shows how to set the various jumpers to switch between power sources. Figure 13. Jumper Interface locations JP1-JP4 on the Platform Board SD-CARD INTERFACE The Platform board has 1x SD-CARD interface supporting SD3.0 located as can be seen in Figure 14. Figure 14. SD-Card Interface location on the Platform Board Samsung Confidential Specifications in this document are tentative and subject to change. 17 Samsung Semiconductor, Inc. EARJACK INTERFACE ARTIK 530 Development Board User Guide The Platform board has 1x 4 pin ear jack interface supporting stereo audio as can be seen in Figure 15. Figure 15. Ear Jack Interface location on the Platform Board MIPI DSI/CSI INTERFACE The Platform board has 1x MIPI DSI and 1x MIPI CSI interface. The location of the DSI Display interface can be seen in Figure 16. The location of the MIPI CSI interface can be seen in Figure 17.The MIPI DSI interface can operate at a maximum resolution of WUXGA (1920x1200), whereas the MIPI CSI interface can have a static resolution of 5M pixels or a dynamic resolution for video capturing of 1080P. Figure 16. MIPI DSI Interface location on the Platform Board Samsung Confidential Specifications in this document are tentative and subject to change. 18 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide Figure 17. MIPI CSI Interface Location on the Platform Board USB HOST 2.0 INTERFACE The Platform board has 1x USB 2.0 Interface. The location of the USB 2.0 interface can be seen in . Figure 18 USB2.0 Interface location on the Platform Board Samsung Confidential Specifications in this document are tentative and subject to change. 19 Samsung Semiconductor, Inc. CONNECTOR TO IF BOARD INTERFACE ARTIK 530 Development Board User Guide The Platform board has 1x expansion connector that can be seen in Figure 19. This connector enables expansion Figure 19. Expansion Connector Interface location on the Platform Board Samsung Confidential Specifications in this document are tentative and subject to change. 20 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide ARTIK 530 DEVELOPMENT BOARD IF BOARD PREVIEW ON THE ARTIK IF BOARD Figure 20 shows the highlights of the connector IF board. In addition Table 4 with J2 and Table 5 with J3 show the pinout of the connectors with its meaning. Figure 20. ARTIK 530 Development Board IF Board Table 4. Connector J2 Pin Name Pin Number Pin Number Pin Name XADC1 XADC2 XADC3 XADC4 XADC5 GND ADD_XI2C0_SCL ADD_XI2C0_SDA GND ADD_XSPI0_CS ADD_XSPI0_CLK ADD_XSPI0_MISO ADD_XSPI0_MOSI GND NC MICOM_GPIO1 GND NC NC GND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 GND ADD_XGPIO0 ADD_XGPIO1 ADD_XGPIO2 ADD_XGPIO3 ADD_XGPIO4 ADD_XGPIO5 ADD_XGPIO6 ADD_XGPIO7 ADD_XGPIO8 ADD_XGPIO9 GND ADD_XAGPIO0 GND ADD_XPWM0_OUT GND ADD_XUART0_RX ADD_XUART0_TX GND XADC0 Samsung Confidential Specifications in this document are tentative and subject to change. 21 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide Table 5. Connector J3 Pin Name Pin Number Pin Number Pin Name GND GND GND GND DC5V VBAT_MAIN AP_VDDIO VDD_EXT1P8_ALIVE VDD_EXT1P8 VDD_EXT3P3_ALIVE VDD_EXT3P3 VDD_EXT5P0_1 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 MICOM_GPIO1 MICOM_GPIO2 MICOM_GPIO3 MICOM_GPIO4 MICOM_GPIO5 MICOM_GPIO6 MICOM_GPIO7 MICOM_GPIO8 MICOM_GPIO9 MICOM_GPIO10 MICOM_GPIO11 MICOM_GPIO12 MICOM_GPIO13 MICOM_GPIO14 GND GND GND GND GND GND CONFIGURATION OF EXTERNAL POWER SOURCE Through selection of the Jumpers J20 and J21 you can choose the IO power source (I2C, UART GPIO) or the XGPIO power source of either, 1.8V, 3.3V or 5V. Figure 21 shows how to set the various jumpers to switch between power sources. Figure 21. Jumper Interface locations J20, J21 on the IF Board Samsung Confidential Specifications in this document are tentative and subject to change. 22 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide ARTIK 530 DEVELOPMENT BOARD BOOTING This section will describe how to setup a connection with the ARTIK 530 Module using the Serial Port Connection and a variety of tools. SERIAL PORT CONNECTION You can use a typical Linux serial console as depicted in Figure 22, using the serial connector. If your PC does not have a serial port use the USB serial cable instead. To use the serial USB cable you need to install the device driver that is associated with your particular USB serial cable. Figure 23 depicts the USB serial cable and where it is hooked up to the Platform Board. Figure 22. Typical Linux Serial Console Samsung Confidential Specifications in this document are tentative and subject to change. 23 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide Figure 23. USB Serial Cable hooked up to the Platform Board TERMINAL EMULATOR INSTALLATION Setting up a connection with the ARTIK 530 Module can be done in a variety of ways. Here we choose to install PuTTY a free serial console. The software can be downloaded from http://www.putty.org/. Once downloaded go through the following steps:

1. Open the device manager on the control panel. 2. Check the COM port number on your PC when you connect the USB serial cable. In our case the COM port allocated is COM13. 3. Set the PuTTY configuration as follows:

a. Set the Serial line as the COM port number found in step 2. b. Set the COM speed to "115200". c. Set the connection type to "Serial". d. Save the session under ARTIK-Pro. 4. Select your saved session and click the Open button. Samsung Confidential Specifications in this document are tentative and subject to change. 24 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide 5. Power on the ARTIK 530 Development Board and hold the power button for about 1 second. 6. You should see booting messages from the ARTIK 530 Module 7. Once booting is completed you can exercise the ARTIK 530 Module using Fedora Linux commands. POWER ON THE ARTIK 530 DEVELOPMENT BOARD go through the following steps:

1. Connect Power adapter and Platform board as depicted in Figure 24 Figure 24 Connection Power adaptor with development Board 2. Turn on Power switch . Figure 25. Power switch location on the development Board 3. Hold the power button for about 1 second. Samsung Confidential Specifications in this document are tentative and subject to change. 25 Samsung Semiconductor, Inc. ARTIK 530 Development Board User Guide Figure 26. Power button location on the development Board Samsung Confidential Specifications in this document are tentative and subject to change. 26 Samsung Semiconductor, Inc. LEGAL INFORMATION ARTIK 530 Development Board User Guide INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK DEVELOPMENT BOARD AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER SAMSUNG PRODUCTS). NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. THE LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK DEVELOPER LICENSE AGREEMENT THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT AS PROVIDED IN THE SAMSUNG ARTIK DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND ITS AFFILIATES (COLLECTIVELY, SAMSUNG) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR NOTICE. THIS DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION DISCUSSED HEREIN IS PROVIDED ON AN AS IS BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES NO RESPONSIBILITY FOR POSSIBLE ERRORS OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM THE USE OF THE DOCUMENTATION CONTAINED HEREIN. Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand names, trademarks and registered trademarks belong to their respective owners. For updates or additional information about Samsung ARTIK, contact the Samsung ARTIK team via the Samsung ARTIK website at www.artik.io. Copyright 2016 Samsung Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Samsung Electronics. Samsung Confidential Specifications in this document are tentative and subject to change. 27

MODULE DISCLOSURES QUICK START GUIDE FCC REGULATORY DISCLOSURES This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two Conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesirable operation This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/ TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the transmitters radiating structure(s) and the body of the user or nearby persons. This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance with all applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The OEM product must comply with all applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely responsible for certification and testing and labeling of its own products. In addition to any independently required labels, the OEM shall also affix to the outside of a device into which the module is installed a label referring to the enclosed module. This exterior label should be prepared in a legible font and permanently affixed and using the wording Contains Transmitter Module FCCID: A3LSIP005AFS30 The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of 20 cm between the equipments radiating structure(s) and the body of the user or nearby persons. The OEM shall also advise its end user of this requirement as required by applicable rules. The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines for an uncontrolled environment can be satisfied. The OEM shall further inform its DB2/ 30119155.1 DRAFT 04/12/16 5:16PM 4:05PM end user that any change or modifications to this module not expressly approved by the manufacturer will void the warranty and the users authority to operate the equipment. INDUSTRY CANADA REGULATORY DISCLOSURES INDUSTRY CANADA STATEMENT This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'opration est soumise aux deux conditions suivantes:(1) cet appareil ne peut causer d'interfrences, et

(2) cet appareil doit accepter toute interfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement de l'appareil. INDUSTRY CANADA RADIATION EXPOSURE STATEMENT AND LIMITATIONS ON USE This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This equipment should be installed and must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment is restricted to indoor use in the 5.15-5.25 GHz range. This equipment is not able to be operated at 5600-5650. In the United States and Canada, only Channel 1~11 can be operated and these channel assignments deal only with the 2.4 GHz range. The end product must be labeled to display the Industry Canada certification number of the module. Contains transmitter module IC: 649E-SIP005AFS30 Le dispositif d'accueil doivent tre tiquets pour afficher le numro de certification d'Industrie Canada du module. Contient module metteur IC : 649E-SIP005AFS30 DB2/ 30119155.1 DRAFT 04/12/16 5:16PM 4:05PM EU REGULATORY DISCLOSURES CE STATEMENT *

The following statement must be supplied with each product but can be printed in the user manual, the packaging, or provided as a separated leaflet. Hereby, Samsung declares that this IoT Module is in compliance with the essential requirements and other relevant provisions of Article 3 of the R&TTE Directive 1999/5/EC, 2004/108/EC and RoHS directive 2011/65/EU. The declaration of conformity may be consulted at [www.artik.io/]

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