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Samsung Semiconductor, Inc. Top View ARTIK 050 Module Block Diagram ARTIK 050 Module Data Sheet Samsungs ARTIK 050 Module is a highly-integrated module for secure Internet of Things (IoT) devices that require Wi-Fi. It is based on an ARM Cortex -R4 core with on-chip memories, a complete 2.4GHz Wi-Fi Phy, MAC layer processing, a large complement of standard digital buses, including audio (I2S), and power management. The module is packaged with additional external Flash memory, a hardware Secure Element and a single integrated 2.4GHz structural antenna. The application processor is fully available for applications, since the Wi-Fi stack through the MAC layer is handled by a co-processor. Aimed especially at power-sensitive devices needing Wi-Fi, the ARTIK 050 Module provides excellent performance in a portable environment, with a feature set tailored specifically for IoT end nodes. Processor Main CPU WLAN CPU ARM Cortex-R4, 32-bit address and data paths @ 320MHz, 32KB I$, 32KB D$
ARM Cortex-R4,32-bit address and data paths @ 160MHz Memory User Embedded RAM FLASH Security Secure Element Radio Wi-Fi Power Management Single Supply Interfaces 2MB 8MB SPI Flash on Module Hardware-protected key storage with secure point-to-point authentication and data transfer IEEE802.11 b/g/n 2.4GHz radio Provides all power on the ARTIK 050 Module using on board regulators Digital I/O USB2.0, 2x I2C, 1x I2S, 2x SPI, 2x 2-UART, 6x PWM, 11x GPIOs (Dedicated), 5x GPIOs (Multiplexed) SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. Samsung Confidential Specifications in this document are tentative and subject to change. 2 ARTIK 050 MODULERADIOSECURITYPROCESSORPOWER MGT.MEMORYINTERFACES Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet TABLE OF CONTENTS Table of Contents ................................................................................................................................................................... 3 List of Figures ........................................................................................................................................................................................ 4 List of Tables .......................................................................................................................................................................................... 4 Version History ...................................................................................................................................................................................... 5 ARTIK 050 Module Block Diagram ....................................................................................................................................... 6 ARTIK 050 Module PADS ....................................................................................................................................................................... 6 ARTIK 050 Module Wi-Fi ....................................................................................................................................................................... 6 ARTIK 050 Module Flash ....................................................................................................................................................................... 7 ARTIK 050 Module Secure Element ..................................................................................................................................................... 7 ARTIK 050 Module Power Management ............................................................................................................................................. 8 ARTIK 050 Module Media SoC.............................................................................................................................................................. 8 ARTIK 050 Module PADs ...................................................................................................................................................... 10 ARTIK 050 Module GPIO Alternate Functions ................................................................................................................... 14 ARTIK 050 Module Booting Process ................................................................................................................................... 17 ARTIK 050 Module Electrical Specifications ...................................................................................................................... 18 Absolute Maximum Ratings ............................................................................................................................................................... 18 Recommended Operating Conditions .............................................................................................................................................. 18 Power Supply Requirements .............................................................................................................................................................. 19 ESD Ratings .......................................................................................................................................................................................... 21 DC Electrical Characteristics .............................................................................................................................................................. 22 AC Electrical Characteristics .............................................................................................................................................................. 23 ARTIK 050 Module Mechanical Specifications .................................................................................................................. 29 Ordering Information .......................................................................................................................................................... 31 FCC Certification ................................................................................................................................................................... 32 Legal Information ................................................................................................................................................................. 33 Samsung Confidential Specifications in this document are tentative and subject to change. 3 Samsung Semiconductor, Inc. LIST OF FIGURES ARTIK 050 Module Data Sheet Figure 1. ARTIK 050 Module Functional Block Diagram ................................................................................................................ 6 Figure 2. ARTIK 050 Module Main SoC Block Diagram .................................................................................................................. 9 Figure 3. ARTIK 050 Module Top View........................................................................................................................................... 9 Figure 4. ARTIK 050 Module PADs Bottom View ........................................................................................................................... 10 Figure 5. ARTIK 050 Module Power Distribution .......................................................................................................................... 19 Figure 6. ARTIK 050 Module Power Sequence ............................................................................................................................... 20 Figure 7. I2S Tx Timing Diagram ..................................................................................................................................................... 23 Figure 8. I2S Rx Timing Diagram ..................................................................................................................................................... 23 Figure 9. I2S Frame Level Timing .................................................................................................................................................... 24 Figure 10. USB2.0 Bus Reset to High-Speed Mode Operation .................................................................................................... 25 Figure 11. USB2.0 High Speed Mode Transmit Timing ................................................................................................................ 25 Figure 12. USB2.0 High Speed Mode Receive Timing ................................................................................................................... 26 Figure 13. ARTIK 050 Module Mechanical Drawing Views .......................................................................................................... 29 Figure 14. ARTIK 050 Module Part Placement and Part Values.................................................................................................. 30 LIST OF TABLES Table 1. PAD Description ................................................................................................................................................................. 11 Table 2. GPIO Alternate Functions ................................................................................................................................................. 14 Table 3. GPIO Alternate Functions (continued) ............................................................................................................................ 16 Table 4. Absolute Maximum Ratings ............................................................................................................................................. 18 Table 5. Recommended Operating Conditions............................................................................................................................. 18 Table 6. ESD Ratings ........................................................................................................................................................................ 21 Table 7.I/O DC Characteristics ........................................................................................................................................................ 22 Table 8. I2S Tx/Rx Timing Parameters ............................................................................................................................................ 24 Table 9. I2S M_CLK Specification ..................................................................................................................................................... 24 Table 10. USB2.0 Timing Parameters ............................................................................................................................................ 27 Table 11. USB1.1 Timing Parameters ............................................................................................................................................ 27 Table 12.I/O AC Characteristics ...................................................................................................................................................... 28 Samsung Confidential Specifications in this document are tentative and subject to change. 4 Samsung Semiconductor, Inc. VERSION HISTORY Revision Date Description February 22, 2016 First version of datasheet ARTIK 050 Module Data Sheet Added Table 9, Table 10, Table 11 and Table 12. Added Top view of the ARTIK 050 Module, Updated Figure 4. Changed Figure 7, Figure 8, Figure 9, Figure 10, Figure 11, Figure 12. Changed Section Module Booting Process. Changed Figure 3, Figure 4, added Figure 13, added Figure 14. Updated Front Page. Changed Module Flash Section. Updated section ARTIK 050 Module Media SoC section. Updated Table 1-5, updated Table 7,8. Changed Table 13. Formatting, changed Top Logo, and first page. Version Numbering Changed, changed first page. Removed 802.11a functionality, Updated Page 1, Updated Figure 1, Updated Module Wi-Fi section, Updated Module Flash section, Updated Secure Element section, Updated Figure 2, Updated Figure 3, Updated Figure 4 Label, Updated ARTIK 050 Module Booting Process, Updated ARTIK 050 Module mechanical specifications and drawing section. Updated Figure 1, 3, 4, 5, 13. Changed section ARTIK 050 Module Media SoC. Changed first Page and picture on first page. Updated Table 1, 2, 3, 4, 8. Changed WiFi-> Wi-Fi. Changes are based on HW small HW update. Updated Figure 1. Updated Firgure 13. Updated Table 1. Updated Table 1. Updated Table 1, 7, 8. Added FCC certification section. ADDED figure 6, Power Up sequence. Updated to new template. Maturity Alpha Candidate Alpha Candidate Alpha Candidate Alpha Candidate Alpha Release Alpha Release Alpha Release Alpha Release Alpha Release Alpha Release Alpha Release 1.0 1.1 1.15 1.20 1.21 1.22 1.23 March 04, 2016 March 07, 2016 March 30, 2016 April 4, 2016 April 11, 2016 April 27, 2016 1.24 May 26, 2016 1.25 1.26 1.27 May 27, 2016 June 13, 2016 July 6, 2016 Samsung Confidential Specifications in this document are tentative and subject to change. 5 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE BLOCK DIAGRAM Figure 1. ARTIK 050 Module Functional Block Diagram ARTIK 050 MODULE PADS The ARTIK 050 Module utilizes 58 individual I/O PADS supporting Power, GND, RESET, GPIO, PWM, I2C, I2S, SPI, JTAG, UART and USB. The I/O PADS are directly available on the PCB to guarantee an absolute low cost solution. ARTIK 050 MODULE WI-FI The BCM43907 SoC, as part of the ARTIK 050 Module, provides IEEE 802.11 b/g/n functionality into a single SoC. There is one 2.4GHz band which provides operation for IEEE 802.11n and legacy IEEE802.11b/g. In addition to the radio technology that is integrated into the device, there is a 2.4GHz power amplifier (PA) with integrated transmit and receive baluns. This level of integration guarantees an overall system cost that is very attractive for the ARTIK 050 Module. For detailed information on the BCM43907, contact Broadcom Ltd. Samsung Confidential Specifications in this document are tentative and subject to change. 6 BCM43907MX25L6433F8MB FLASHS3FT9MFSE658 PADSSPIPWM6RESET1I2C (2x)4GPIO112USB9I2S (1+1)8SPI (2x)UART22N7002DWLEVELSHIFTER25JTAG2UART5GNDVDD_VBAT1IM8123SNDC-DCVINVDDIO1UARTUSB_VDD_3V31VDDIO_RMII1VDDIO_AUDIO1VDDIO_SD111GNDVDDIO3V3VDDIO1VDDIOMETAL STRUCTURAL ANTENNARF_ANT01PWR_RST Samsung Semiconductor, Inc. ARTIK 050 MODULE FLASH ARTIK 050 Module Data Sheet The ARTIK 050 Module carries a 64Mb (8MB) bits serial flash memory unit. The most important hardware features of the Serial Flash Memory are:
67108864x1 bit structure, 33554432x2 bit structure or 16777216x4 bit structure 2048 equal sectors of 4KB each, that can be erased individually 256 equal sectors of 32KB each, that can be erased individually 128 equal sectors of 64KB each, that can be erased individually The flash memory contains the OS and application code that is loaded during the boot sequence. For detailed information on the MX25L6433F, contact Macronix International Co., LTD. ARTIK 050 MODULE SECURE ELEMENT The S3FT9MF is a Secure Element from Samsung Electronics providing an ISO/IEC 7816 & 14443 compliant interface. The most important hardware features of the Secure Element are:
Dedicated 16-bit SecuCalm CPU core Crypto co-processor Modular Multiplication accelerator RSA 2080bits ECC 512 bits Data security Memory encryption for all memory 256B read only and 256B non erasable area Selective reset operation if abnormal voltages/frequencies are detected Embedded tamper-free memory 32KB ROM 264KB FLASH 8.5KB Static RAM including 2.5KB crypto memory Serial interfaces:
ISO 7816-3 compliant interface Asynchronous half-duplex character receive/transmit serial interface For more information on S3FT9MF contact Samsung Electronics Co., Ltd. Samsung Confidential Specifications in this document are tentative and subject to change. 7 Samsung Semiconductor, Inc. ARTIK 050 MODULE POWER MANAGEMENT ARTIK 050 Module Data Sheet The ARTIK 050 Module has dedicated power management, containing an IM8123SN high-efficiency step-down DC-DC convertor. The power management is set up such that it provides all power requirements for the module. The most important features of the power management on the ARTIK 050 Module are:
Wide input range 4.5V VIN 18V Low shut down current Ishutdown ~ 5 A Thermal shutdown protection High Switching Frequency 500 kHz For additional information on the IM8123SN, contact IMS Semiconductor Co., Ltd. ARTIK 050 MODULE MEDIA SOC The main SoC on the ARTIK 050 Module is based on the BCM43907 from Broadcom Ltd. Figure 2 shows the block schematic of the SoC. The system is architected with 2 dedicated Cortex-R4 cores. The first Cortex-R4 core, running at 160MHz, is solely responsible for WLAN activities. It contains 512KB of Tightly-Coupled (TC) RAM in addition to 320KB of TC ROM. The tight coupling assures that the WLAN functionality can operate fully autonomously. The second core, also a Cortex-R4, is specifically added for application processing. The core is supported by 2MB of SRAM for application code. The core can run in 2 speed modes. The 160MHz mode is available when conserving power is important, while the 320MHz mode can be used when more intensive processing is required. In addition to the dual core Cortex-R4, there is a wide array of interfaces available. The ARTIK 050 Module has 2x UART (2-pin), 2x I2C, 11x GPIO (dedicated) + 5x GPIO (shared between JTAG), 6x PWM, 1x 4-pin I2S (No Data In), 1x 5-pin I2S, 2x SPI, 2x I2C, 1x USB and 1x JTAG (that shared 5 GPIO pins) interface for debugging and bring-up activities. The great variety of interfaces makes the ARTIK 050 Module the right module for a wide variety of IoT markets. Samsung Confidential Specifications in this document are tentative and subject to change. 8 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Figure 2. ARTIK 050 Module Main SoC Block Diagram Figure 3 shows the top side of the ARTIK 050 Module that is populated with the ARM application processor, the flash memory, the Secure Element and the Level Shifter. Figure 3. ARTIK 050 Module Top View Samsung Confidential Specifications in this document are tentative and subject to change. 9 BCM43907CORTEX-R432KB I-CACHE32KB D-CACHEPeripheralsGPIOJTAGSPI|BSCHigh Speed I/FUSB 2.0BSCPWMUARTMulti MediaAUDIOI2S2MB RAM640KB ROMCRYPTOGRAPHYAPPS DOMAINALWAYS ON DOMAINWLAN DOMAINAXI BRIDGEAXI BRIDGEAXI BRIDGEPS RAMRTCPMU CONTROLLERPMUCORTEX-R4IEEE 802.11 MACIEEE 802.11n PHY2.4GHz RADIO512KB RAM320KB ROMAXI BRIDGEAXI BRIDGEPROCESSORBCM43907FLASHMX25L6433FSECURE ELEMENTS3FT9MFLEVEL SHIFTER2N7002DWSTRUCTURAL ANTENNAWSANT2G01 Samsung Semiconductor, Inc. ARTIK 050 MODULE PADS ARTIK 050 Module Data Sheet The ARTIK 050 Module utilizes 58 individual PADS straight on the PCB. The 58 individual PADS provide Power, GND, RESET, GPIO, PWM, I2C, I2S, SPI, JTAG, UART and USB functionality. In Figure 4, logical listing is provided of all power/signal names that are assigned to physical pins of the PADS. In addition, Table 1 provides an in depth description of the functionality of each signal available on the PADS. Figure 4. ARTIK 050 Module PADs Bottom View Samsung Confidential Specifications in this document are tentative and subject to change. 10 353433323130292827262524GPIO_15_HOST_VTRIMGPIO_16VINI2S0_MCKI2S_SCK_BCLKI2S_SD_OUTI2S0_WS_LRCLKPWR_RSTSPI_0_CLKSPI_0_MOSISPI_0_MISOGNDGPIO_13_SDIO_MODEI2C_0_SCLI2C_0_SDAGPIO_0PWM_5PWM_4PWM_3PWM_2PWM_0GNDGPIO_8_TAP_SELGPIO_9_USB_HSIC_SELGPIO_11_ACPU_BOOT_MODEGNDGPIO_12GPIO_14GPIO_7_WCPU_BOOT_MODEUSB2_DNUSB2_DPGNDUART_TXDUART_RXDPWM_11234567891011121314151617181920212223RESET_NGNDGPIO_6_JTAG_TRST_LGPIO_5_JTAG_TDOGPIO_4_JTAG_TDIGPIO_3_JTAG_TMSGPIO_2_JTAG_TCKSPI_1_CLKSPI_1_MISC3.3V_OUTSPI_1_MOSII2S1_MCKI2S1_SCK_BCLKI2S1_SD_INI2S1_SD_OUTI2S1_WS_LRCLKI2C_1_SDAI2C_1_SCLSPI_1_CSRF_SW_CTRL_6_UART1_RX_INRF_SW_CTRL_7_RSRC_INIT_MODE_ART1_TX_OUTSPI_0_CSGPIO_1_GSPI_MODE5857565554535251504948474645444342414039383736ARTIK 050 MODULEBOTTOM VIEW Samsung Semiconductor, Inc. Table 1. PAD Description PAD
#
Name Voltage
[V]
I/O Type 1 2 3 4 5 6 7 8 9 10 11 12 13 I2C_0_SCL 3V35 I2C_0_SDA 3V35 PWM_5 3V35 PWM_4 3V35 PWM_3 3V35 PWM_2 3V35 PWM_0 3V35 PWM_1 3V35 GPIO_0 3V35 GND 0V0 USB2_DN 3V35 USB2_DP 3V35 GND 0V0 BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O NA BCM USB BCM USB NA ARTIK 050 Module Data Sheet Active Mode Low Power Mode Power Down Mode DS
[mA]
Default Function Comments
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-
-
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-
-
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-
-
-
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-
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-
-
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-
I2C0 CLK I2C0 DATA PWM 5 PWM 4 PWM 3 PWM 2 PWM 0 PWM 1 DF PU PU
-
-
-
-
-
-
IN/PD IO/PU/P D/NP IO/PU/PD/N P High-Z/NP 8 USB20H_CTL GPIO 0 Comments for Design Internal 4.7K /
3.3V Pull-up Internal 4.7K /
3.3V Pull-up For USB mode, need to connect overcurrent flag pin with 4.7K Pull-up NA NA NA NA NA NA Ground
-
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-
-
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-
USB2_DN USB2_DP NA NA NA NA NA NA Ground 14 GPIO_7_WCPU_B OOT_MODE 3V35 BCM I/O IN/PU IO/PU/P D/NP IO/PU/PD/N P High-Z/NP 8
-
15 GPIO_8_TAP_SEL 3V35 BCM I/O IN/PU IO/PU/P D/NP IO/PU/PD/N P High-Z/NP 8 GPIO_8 Boot Wireless Internal 10K/3.3V Pull-up for boot CPU from mode : not Tightly Coupled recommended RAM Pull down resistor Internal 10K/3.3V Pull-up for boot mode : not GPIO 8, default recommended function TAP_SEL_P Pull-down resistor Only fo Input, Not support Output Internal 10K/3.3V Pull-up for boot 16 GPIO_9_USB_HSI C_SEL 3V35 BCM I IN/PU IO/PU/P D/NP IO/PU/PD/N P High-Z/NP 8 GPIO_9 USB 2.0 PHY is mode : not selected recommended 17 GPIO_11_ACPU_B OOT_MODE 3V35 BCM I/O IN/PD IO/PU/P D/NP 18 UART_TXD 3V35 BCM UART
(LS)
-
-
IO/PU/PD/N P
-
High-Z/NP 8
-
-
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-
Boot Main CPU from internal ROM Level Shifted UART_TXD Pull-down resistor For boot mode :
not recommended Pull-up resistor Level Shifted UART_TXD, need to Pull-up resistor for UART communication Samsung Confidential Specifications in this document are tentative and subject to change. 11 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet PAD
#
Name Voltage
[V]
I/O Type DF Active Mode Low Power Mode Power Down Mode DS
[mA]
Default Function Comments Comments for Design
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-
-
-
-
-
Level Shifted UART_RXD Level Shifted UART_RXD, need to Pull-up resistor for UART communication 1K serial resistor after Level-
shifter, not recommended serial resister over 1K NA NA NA NA NA NA Ground IN/NP IN/NP IO/PU/P D/NP IO/PU/P D/NP IO/PU/PD/N P IO/PU/PD/N P High-Z/NP High-Z/NP 8 8 GPIO_12 GPIO 12 GPIO_14 GPIO 14 19 UART_RXD 3V35 20 21 22 23 24 25 26 GND 0V0 GPIO_12 3V35 GPIO_14 3V35 GPIO_13_SDIO_M ODE 3V35 GPIO_15_HOST_V TRIM 3V35 GPIO_16 3V35 I2S0_MCK 3V35 27 I2S0_SCK_BLCK 3V35 28 I2S0_SD_OUT 3V35 29 I2S0_WS_LRCLK 3V35 30 31 32 33 PWR_RST NA GND VIN 0V0 4V5 SPI_0_CLK 3V35 34 SPI_0_MOSI 3V35 35 SPI_0_MISO 3V35 36 SPI_0_CS 3V35 BCM UART
(LS) NA BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O Power En Input NA Power Input BCM I/O BCM I/O BCM I/O BCM I/O IN/PU IO/PU/P D/NP IO/PU/PD/N P High-Z/NP 8 IN/PD IO/PU/P D/NP IO/PU/PD/N P High-Z/NP 8 IN/NP IO/PU/P D/NP
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-
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IO/PU/PD/N P
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High-Z/NP 8
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NA NA NA NA NA NA NA NA NA NA NA NA
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GPIO 13 boot Internal 10K/3.3V Pull-up for boot strap mode : not SDIO_MODE GPIO 15 boot strap VTRIM_EN GPIO 16 I2S 0 MCK I2S 0 SCK_BLCK I2S 0 SD_OUT I2S 0 WS_LRCLK recommended Pull up resistor for boot mode :
not recommanded Pull-up resistor if PWR_RST is 0 DCDC disabled 150Kohm PU, 75Kohm PD, VIH 1.45V, VIL 0.4V Ground Ground Power SPI 0 CLK SPI 0 MOSI SPI 0 MISO SPI 0 CS MIN 4.75 ~ MAX 18V Power pin for 050 IO port, Current limit 100mA @3.3V Reset pin, not recommended Pull-down resister Debug_JTAG Debug_JTAG 37 3.3V_OUT 3V35 NA NA NA NA NA NA NA Power 38 RESET_N 3V35 39 GPIO_3_JTAG_TM S 3V35 40 GPIO_4_JTAG_TDI 3V35 BCM RESET BCM I/O BCM I/O
-
-
-
-
IN/PD IN/NP IO/PU/P D/NP IO/PU/P D/NP IO/PU/PD/N P IO/PU/PD/N P High-Z/NP High-Z/NP
-
8 8
-
Reset ARTIK 050 Module GCI_GPIO(1) GCI_GPIO(2) Samsung Confidential Specifications in this document are tentative and subject to change. 12 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Name Voltage
[V]
I/O Type PAD
#
41 42 43 44 45 46 47 48 GPIO_2_JTAG_TC K GPIO_5_JTAG_TD O GPIO_6_JTAG_TRS T_L GND RF_SW_CTRL_6_U ART1_RX_IN RF_SW_CTRL_7_R SRC_INIT_MODE_ UART1_TX_OUT 3V35 3V35 3V35 0V0 3V35 3V35 I2C_1_SCL 3V35 I2C_1_SDA 3V35 49 I2S1_WS_LRCLK 3V35 50 I2S1_SD_OUT 3V35 51 I2S1_SD_IN 3V35 52 I2S1_SCK_BCLK 3V35 53 I2S1_MCK 3V35 54 SPI_1_MOSI 3V35 55 SPI_1_CS 3V35 56 SPI_1_MISO 3V35 57 SPI_1_CLK 3V35 58 GPIO_1_GSPI_MO DE 3V35 DF NP IN/PD IN/NP Active Mode IO/PU/P D/NP IO/PU/P D/NP IO/PU/P D/NP NA NA Low Power Mode IO/PU/PD/N P IO/PU/PD/N P IO/PU/PD/N P NA Power Down Mode High-Z/NP High-Z/NP High-Z/NP DS
[mA]
Default Function Comments Comments for Design 8 8 8 GCI_GPIO(0) GCI_GPIO(3) GCI_GPIO(4) Debug_JTAG Debug_JTAG Debug_JTAG NA NA NA Ground OUT/NP O/NP O/NP High-Z IN/PD O/NP O/NP High-Z PU PU
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NP IO/PU/P D/NP IO/PU/PD/N P High-Z/NP 8
-
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RF_SW+CTRL_6 Debug_UART_RX RF_SW+CTRL_7 PMU enable strap Debug_UART_TX I2C 1 SCL I2C 1 SDA Internal 4.7K/3.3V Pull-up Internal 4.7K/3.3V Pull-up I2S 1 WS_LRCLK I2S 1 SD_OUT I2S 1 SD_IN I2S 1 SCK_BCLK I2S 1 MCK SPI 1 MOSI SPI 1 CS SPI 1 MISO SPI 1 CLK GPIO 1 with GSPI_MODE strap For boot mode :
not recommended Pull-up resistor BCM I/O BCM I/O BCM I/O NA BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O BCM I/O
*PU = Pull Up, PD = Pull Down, NP = No Pull Samsung Confidential Specifications in this document are tentative and subject to change. 13 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE GPIO ALTERNATE FUNCTIONS All the GPIOs, as indicated in Table 1, have alternate functions that can be programmed using the GPIO API provided in the SW development environment. In Table 2 and Table 3, the alternate functions of all GPIOs connected only to the BCM43907 that are available on the PADS of the ARTIK 050 Module are described. Table 2. GPIO Alternate Functions DF F1 F2 F3 F4 F5
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-
-
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-
I2C0_CLK I2C0_SDATA GPIO_22 GPIO_21 PWM5 PWM4 PWM3 PWM2 PWM0 PWM1 GPIO_8 GPIO_6 GPIO_5 GPIO_4 GPIO_2 GPIO_3 GPIO_29 GPIO_28 GPIO_23 GPIO_22 GPIO_21 GPIO_20 GPIO_18 GPIO_19
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
USB20H_CT L
-
GPIO_0 UART0_RXD I2C1_SDATA PWM0 SPI1_MISO GPIO_7 GPIO_8 GPIO_9 UART0_RTS_OU T SPI1_MISO SPI1_CLK PWM1 PWM3 SPI1_CS PWM2 PWM3 PWM4 PWM5 UART0_RXD UART0_TXD GPIO_8_TAP_SEL GPIO_9_USB_HSIC_SEL GPIO_8 GPIO_9 GPIO_11_ACPU_BOOT_MODE
-
GPIO_11 SPI1_CS PWM5 I2C1_CLK UART0_RTS_OU T GPIO_12 GPIO_12 I2C1_SDATA UART0_RXD SPI1_MISO PWM2 GPIO_14 GPIO_14 PWM0 UART0_CTS_IN SPI1_MOSI I2C1_SDATA GPIO_13 I2C1_CLK UART0_TXD SPI1_CLK PWM3
-
-
-
-
-
-
-
-
-
-
-
GPIO_15 PWM1 GPIO_16 UART0_CTS_IN I2S_MCLK0 I2S_SCLK0 GPIO_23 GPIO_24 I2S_SDATAO0 GPIO_27 I2S_LRCLK0 SPI0_CLK SPI0_MOSI SPI0_MISO SPI0_CS GPIO_25 GPIO_18 GPIO_19 GPIO_17 GPIO_20 UART0_RTS_OU T PWM0 GPIO_0 GPIO_2 GPIO_5 GPIO_3 GPIO_25 GPIO_26 GPIO_24 GPIO_27 GPIO_3_JTAG_TMS GCI_GPIO(1) GPIO_3 GPIO_4_JTAG_TDI GCI_GPIO(2) GPIO_4 GPIO_2_JTAG_TCK GCI_GPIO(0) GPIO_2 GPIO_5_JTAG_TDO GCI_GPIO(3) GPIO_5 GPIO_6_JTAG_TRST_L GCI_GPIO(4) GPIO_6
-
-
-
-
-
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-
-
-
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RF_SW_CTRL_6_UART1_RX_IN
-
RF_SW+CTRL_ 6 UART_DBG_RX SECI_IN SPI1_CS I2C1_CLK PWM2 SPI1_MOSI
-
-
-
-
-
-
-
-
GCI_GPIO_ 1 GCI_GPIO_ 2 GCI_GPIO_ 0 GCI_GPIO_ 3 GCI_GPIO_ 4
-
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Name I2C_0_SCL I2C_0_SDA PWM_5 PWM_4 PWM_3 PWM_2 PWM_0 PWM_1 GPIO_0 GPIO_7_WCPU_BOOT_MODE GPIO_12 GPIO_14 GPIO_13_SDIO_MODE GPIO_15_HOST_VTRIM GPIO_16 I2S0_MCK I2S0_SCK_BLCK I2S0_SD_OUT I2S0_WS_LRCLK SPI_0_CLK SPI_0_MOSI SPI_0_MISO SPI_0_CS PAD
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1 2 3 4 5 6 7 8 9 14 15 16 17 21 22 23 24 25 26 27 28 29 33 34 35 36 39 40 41 42 43 45 Samsung Confidential Specifications in this document are tentative and subject to change. 14 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet PAD
#
46 49 50 51 52 53 58 Name DF F1 F2 F3 F4 F5 RF_SW_CTRL_7_RSRC_INIT_ MODE_UART1_TX_OUT I2S1_WS_LRCLK I2S1_SD_OUT I2S1_SD_IN I2S1_SCK_BCLK I2S1_MCK GPIO_1_GSPI_MODE
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RF_SW+CTRL_ 7 UART_DBG_TX SECI_OUT I2S_LRCLK1 GPIO_0 GPIO_31 I2S_SDATAO1 GPIO_28 I2S_SDATAI1 GPIO_29 I2S_SCLK1 I2S_MCLK1 GPIO_31 GPIO_30 GPIO_6 GPIO_8 GPIO_30 GPIO_17
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GPIO_1 UART0_TXD I2C1_CLK PWM1 SPI1_CLK Samsung Confidential Specifications in this document are tentative and subject to change. 15 Samsung Semiconductor, Inc. Table 3. GPIO Alternate Functions (continued) ARTIK 050 Module Data Sheet Name I2C_0_SCL I2C_0_SDA PWM_5 PWM_4 PWM_3 PWM_2 PWM_0 PWM_1 GPIO_0 F6 F7 F8 F9 F10 F11
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PWM2 GPIO_12 GPIO_8
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PWM4 USB20H_CTL GPIO_7_WCPU_BOOT_MODE I2C1_CLK GPIO_15 GPIO_11 PMU_TEST_O
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GPIO_8_TAP_SEL GPIO_9_USB_HSIC_SEL
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GPIO_11_ACPU_BOOT_MODE PWM1 GPIO_16 GPIO_12 TAP_SEL_P I2C1_SDAT A GPIO_0 GPIO_7 GPIO_13 GPIO_15
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I2C1_CLK PWM1 PWM5 PWM0 GPIO_12 GPIO_14 GPIO_13_SDIO_MODE GPIO_15_HOST_VTRIM PWM4 GPIO_8 GPIO_16
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PWM5
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GPIO_10 GPIO_9 GPIO_11
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GPIO_0 GPIO_7 I2C1_SDATA GPIO_14 GPIO_10 RF_DISABLE_L GPIO_16 I2S0_MCK I2S0_SCK_BLCK I2S0_SD_OUT I2S0_WS_LRCLK SPI_0_CLK SPI_0_MOSI SPI_0_MISO SPI_0_CS GPIO_3_JTAG_TMS GPIO_4_JTAG_TDI GPIO_2_JTAG_TCK GPIO_5_JTAG_TDO GPIO_6_JTAG_TRST_L RF_SW_CTRL_6_UART1_RX_IN RF_SW_CTRL_7_RSRC_INIT_ MODE_UART1_TX_OUT I2S1_WS_LRCLK I2S1_SD_OUT I2S1_SD_IN I2S1_SCK_BCLK I2S1_MCK
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GPIO_1_GSPI_MODE PWM3 GPIO_13 GPIO_9 PWM3 PWM0 PWM4 PWM1 PWM5
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TMS TDI TCK TDO TRST_L
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SDIO_SEP_ INT_0D SDIO_SEP_INT
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PWM5 PWM2
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PWM3 PWM4
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PAD
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1 2 3 4 5 6 7 8 9 14 15 16 17 21 22 23 24 25 26 27 28 29 33 34 35 36 39 40 41 42 43 45 46 49 50 51 52 53 58 Samsung Confidential Specifications in this document are tentative and subject to change. 16 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE BOOTING PROCESS When booting the ARTIK 050 Module, various strapping options are used to guarantee a certain booting behavior. In addition, some GPIOs are set to perform alternate functions instead of their default boot-up behavior. The following summary provides a list reflecting what strapping options were used and what states certain GPIOs will attain:
Boot Wireless CPU from tightly coupled RAM using GPIO_7_WCPU_BOOT_MODE as high during boot Boot main CPU from internal ROM using GPIO_11_ACPU_BOOT_MODE as low during boot Set GPIO_8_TAP_SEL in TAP_SEL_P default mode Enable USB 2.0 PHY using GPIO_9_USB_HSIC_SEL as high during boot Enable PMU resource initialization mode selection using RF_SW_CTRL_7_RSRC_INIT_MODE_UART1_TX_OUT as low during boot Set RF_SW_CTRL_6_UART1_RX_IN in UART_DBG_RX default mode Set GPIO_2_JTAG_TCK as JTAG_TCK default mode Set GPIO_3_JTAG_TMS as JTAG_TMS default mode Set GPIO_4_JTAG_TDI as JTAG_TDI default mode Set GPIO_5_JTAG_TDO as JTAG_TDO default mode Set GPIO_6_JTAG_TRST_L as JTAG_TRST_L default mode Once the boot is completed, most of the GPIO pins that are not set for alternate functions can be used as generic GPIOs. In addition, the GPIO pins can always be reprogrammed to functions that serve the products design needs. Samsung Confidential Specifications in this document are tentative and subject to change. 17 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings are those ratings where permanent damage to the ARTIK 050 Module can occur. Functional operation at absolute maximum ratings is not guaranteed and not recommended. Table 4. Absolute Maximum Ratings PAD:[Pin#]
PAD:[32]
Symbol VIN Condition Min Typ Max Units Input voltage VIN on the high efficiency step down converter (IM8123SM) 20 V PAD:[1,2,3,4,5,6,7,8,9,14,15, 16,17,21,22,23,24,25,26,27, 28,29,33,34,35,36,39,40, 41,42,43,45,46,47,48,49,50, 51,52,53,54,55,56,57,58]
Vundershoot Undershoot voltage for I/O
-0.50 PAD:[30]
PWR_RST PAD:[18,19]
VMAX IO is running at 3.3V level shifter is closed so 60+3.3 IMAX Continuous Continuous at 100C Pulsed
-0.30 20.3 63.3 115 73 800 RECOMMENDED OPERATING CONDITIONS The following table describes the operating conditions of the ARTIK 050 Module:
Table 5. Recommended Operating Conditions V V V mA mA mA PAD:[Pin#]
Symbol Condition Min Typ Max Units PAD:[32]
VIN TO TS Input voltage VIN on the high efficiency step down converter (IM8123SM) Maximum operating temperature Storage temperature 4.50
-25
-40 18.0 85 125 V C C Samsung Confidential Specifications in this document are tentative and subject to change. 18 Samsung Semiconductor, Inc. POWER SUPPLY REQUIREMENTS ARTIK 050 Module Data Sheet The power management of the ARTIK 050 Module, as depicted in Figure 5, contains the IM8123SN high-efficiency DC-DC convertor that will handle all power requirements for the ARTIK 050 Module. Figure 5. ARTIK 050 Module Power Distribution Samsung Confidential Specifications in this document are tentative and subject to change. 19 BCM43907MX25L6433F8MB FLASHS3FT9MFSE58 PADS2N7002DWLEVELSHIFTER5GNDVDD_VBAT1IM8123SNDC-DCVINVDDIOUSB_VDD_3V31VDDIO_RMII1VDDIO_AUDIO1VDDIO_SD111GNDVDDIO3V3VDDIO1VDDIO1PWR_RST Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Figure 6. ARTIK 050 Module Power Sequence Note : The BCM43907 has an internal power-on reset (POR) circuit. The device will be held in reset for a maximum of 110 ms after VDDC and VDDIO have both passed the POR threshold. Note : The 10%-90% VBAT rise time should not be faster than 40 s. VBAT should be up before or at the same time as VDDIO. VDDIO should not be present first or be held high before VBAT is high. Samsung Confidential Specifications in this document are tentative and subject to change. 20 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ESD RATINGS Table 6. ESD Ratings Parameter ESD stress voltage Human Body Model ESD stress voltage Charged Device Model Min
-1.0 Typ 250 Max Units 1.0 kV V Samsung Confidential Specifications in this document are tentative and subject to change. 21 Samsung Semiconductor, Inc. DC ELECTRICAL CHARACTERISTICS ARTIK 050 Module Data Sheet Table 7 below describes the DC characteristics for all GPIO pins that are available on the PAD. Table 7.I/O DC Characteristics PAD:[Pin#]
Symbo Condition Min Typ Max Unit PAD:[1,2,3,4,5,6,7,8,9,14, 15,16,17,21,22,23,24,25, 26,27,28,29,33,34,35, 36,39,40,41,42,43,45,46, 47,48,49,50,51,52,53,54, 55,56,57,58]
PAD:[19]
PAD:[45,46]*
l VIH VIL VOH VOL VIH VIL CIN Input high voltage Input low voltage Output high voltage @ 2mA Output low voltage @ 2mA Input high voltage Input low voltage Input capacitance 2.00 2.90 3.5 5 0.80 0.40 20 0.2 5 s V V V V V V pF
*Programmable 2mA to 16mA drive strength. The default is 10mA. Samsung Confidential Specifications in this document are tentative and subject to change. 22 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet AC ELECTRICAL CHARACTERISTICS This section describes the timing and its associated constraints on the various interfaces (I2C, I2S, etc.) that can be found on the PAD. I2S TX TIMING DIAGRAM I2S RX TIMING DIAGRAM Figure 7. I2S Tx Timing Diagram Figure 8. I2S Rx Timing Diagram Samsung Confidential Specifications in this document are tentative and subject to change. 23 I2S_SCLKI2S_SDATAO and I2S_LRCKtdtr = 0.8TTthtr = 0tRCtHC = 0.35TtLC = 0.35TVH = 2.0VVL = 0.8VT = Clock PeriodTtr = Minimum allowed Clock Period for transmitterT > TtrtRC is only relevant for transmitters in Slave modeI2S_SCLKI2S_SDATAI and I2S_LRCKtsr = 0.2TTtHC = 0.35TtLC = 0.35TVH = 2.0VVL = 0.8VT = Clock PeriodTr = Minimum allowed Clock Period for transmitterT > Trthr = 0 ARTIK 050 Module Data Sheet Samsung Semiconductor, Inc. I2S RECEIVER/TRANSMITTER TIMING PARAMETERS Table 8. I2S Tx/Rx Timing Parameters Parameter Transmitter Receiver Lower Limit Upper Limit Lower Limit Minimu m Maximu m Minimu m Maximu m Minimu m Maximu m Clock Period T Slave Mode:
Ttr Clock HIGH, tHC Clock LOW, tLC Clock rise time, tRC Transmitter Delay, tdtr Transmitter Hold Time, thtr Receiver Setup Time, tsr Receiver Hold Time, thr 0 0.35Tr 0.35Tr Table 9. I2S M_CLK Specification 0.15Tr 0.8T Ttr 0.35Tr 0.35Tr 0.2Tr 0 Parameter Minimu m Typica l Maximu m Unit Frequency Range Frequency Accuracy (with respect to the XTAL frequency) Tuning Resolution Tuning Range Tuning Step Size Tuning Rate Baseband Jitter (100Hz40kHz) Wideband Jitter (100Hz1MHz) I2S FRAME LEVEL TIMING 1 1 50 1000 1 40 10 100 200 MHz ppb ppb ppm ppm ppm/ms ps rms ps rms Figure 9. I2S Frame Level Timing Samsung Confidential Specifications in this document are tentative and subject to change. 24 I2S_SCLKI2S_LRCLK1 clockI/O Data123MSB1 clockn-2nn-1LSB123MSBn-2nn-1LSB1/fsLeft ChannelRight Channel Samsung Semiconductor, Inc. USB PHY TIMING DIAGRAMS ARTIK 050 Module Data Sheet Figure 10. USB2.0 Bus Reset to High-Speed Mode Operation Figure 11. USB2.0 High Speed Mode Transmit Timing Samsung Confidential Specifications in this document are tentative and subject to change. 25 DM IdleDP Idle< 100 s 40 to 60 s100 to 500 sHS DataHS Data> 1.0 ms3 to 3.125 msDeviceK-Chirp100 to875 s< 7 ms> 10 msStart of ResetDevice goes into Full-Speed ModeStart of Host (Hub) ChirpDevice Tests for Single-Ended Zero (SE0 State)End of Host (Hub) ChirpEnd of ResetHigh-Speed ChirpCLK60TXDATADP/DMTXVALIDTXREADYXVERSELOPMODETERMSEL00000B0B1PIDLatency = 42 bits96 bitsTx driver is enabled here Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Figure 12. USB2.0 High Speed Mode Receive Timing Samsung Confidential Specifications in this document are tentative and subject to change. 26 CLK60RXDATADP/DMRXACTIVERXVALIDXVERSELOPMODETERMSEL00000B1B2Latency = 72 bits64 bitsB0 Samsung Semiconductor, Inc. USB PHY TIMING PARAMETERS Table 10. USB2.0 Timing Parameters Parameter Symbol Conditions Baud Rate Unit Interval Differential Input Voltage Sensitivity Input Common Mode Voltage Range Receiver Jitter Tolerance Input Impedance Ouput High Voltage Output Low Voltage Ouput Rise Time Output Fall Time Transmitter Jitter Output Impedance BPS UI VHSDI VHSCM THSRX RIN VHSOH VHSOL THSR THSF HSTX RO Receiver in HS Mode Static Condition |VIDP-VIDN|
Single Ended Transmitter in HS Mode Static Condition Static Condition 10% 90%
90% 10%
Transmit Output Jitter Single Ended Chirp-J Output Voltage (Differential) VCHIRPJ Chirp-K Output Voltage (Differential) VCHIRPK HS Termination Disabled. 1.5k5% Pull-up Resistor Connected HS Termination Disabled. 1.5k5% Pull-up Resistor Connected Table 11. USB1.1 Timing Parameters Parameter Symbol Conditions Baud Rate FS Baud Rate LS Unit Interval FS Unit Interval LS Differential Input Voltage Sensitivity Input Common Mode Voltage Range Input Impedance Input High Voltage Input Low Voltage Ouput High Voltage Output Low Voltage BPS BPS UI UI VFSDI VFSCM ZIN VFSIH VFSIL VFSOH VFSOL Ouput Rise/Fall Time for Fast Speed TFSR , TFSF Ouput Rise/Fall Time for Low Speed TLSR , TLSF Fast Speed Jitter Low Speed Jitter Ouput Impedance FSTX LSTX RO Receiver Static Condition |VIDP-VIDN|
Static Condition Static Condition Transmitter Static Condition Static Condition 10% 90%
10% 90%
Single Ended ARTIK 050 Module Data Sheet Minimu Typica Maximu m 500 0.15 49.5 440 10 0.05 49.5 m 300
-50
-0.15 40.5 360
-10 500 500
-0.05 40.5 700
-900 l 480 2083 45 400 0 45 1100 mV
-500 mV Minimu Typica Maximu m 200 0.8 300 2.0 2.8 4 75
-2
-25 28 l 12 1.5 83.33 666.67 m 2.5 0.8 0.3 20 300 2 25 44 Units Mbps ps mV mV UI mV mV ps ps UI Units Mbps Mbps ns ns mV V k V V V V ns ns ns ns 27 Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. Table 12.I/O AC Characteristics ARTIK 050 Module Data Sheet PAD:[Pin#]
Symbol Condition Min Typ Max Units PAD:[18,19]
CISS COSS CRSS tD(ON) tD(OFF) Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-off Delay Time Dynamic Characteristics VPAD:[33,34,35,36]=28.3V, f=1.0MHz Switching Characteristics V*PAD-PAD =30V, IPAD-PAD=0.2A, VGEN=10V, RL=150, RGEN=25 37.8 12.4 6.5 5.85 12.5 50 25 7 20 20 pF pF pF ns ns
*PAD-PAD means from PAD:[18] to PAD:[18] or from PAD:[19] to PAD:[19], it is the voltage swing over time on PAD:[18] or PAD:[19]
Samsung Confidential Specifications in this document are tentative and subject to change. 28 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE MECHANICAL SPECIFICATIONS The ARTIK 050 Module supports 58x PADs. The mechanical dimensions of the top view and bottom view of the ARTIK 050 Module with its dimensions can be found in Figure 13. Figure 14 provides the part placement and part values of the most important components on the ARTIK 050 Module. Figure 13. ARTIK 050 Module Mechanical Drawing Views Samsung Confidential Specifications in this document are tentative and subject to change. 29 18mmNorthWestEastSouthTOP40mmWi-Fi antenna is placed at the north side.Do not place any component on bottomexcept defined solder plates.1.5mmNorthEastWestSouth5836123352423 solder plates27.0mm12 solder plates13.8mm23 solder plates27.0mmBOTTOM 2.1mm2.1mm1.5mm16mm40mm38mm1.2mm0.6mm0.6mm0.6mm1.3mm0.2mm Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Figure 14. ARTIK 050 Module Part Placement and Part Values Samsung Confidential Specifications in this document are tentative and subject to change. 30 Samsung Semiconductor, Inc. ORDERING INFORMATION Please contact via ARTIK official webpage http://www.artik.io ARTIK 050 Module Data Sheet Samsung Confidential Specifications in this document are tentative and subject to change. 31 Samsung Semiconductor, Inc. FCC CERTIFICATION ARTIK 050 Module Data Sheet This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Caution: Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void users authority to operate the equipment. This appliance and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. A minimum separation distance of 20cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements. Instruction to OEM This device complies with Industry Canadas license-exempt RSSs. Operation is subject to the following two conditions:
1. This device may not cause interference and 2. This device must accept any interference, including interference that may cause undesired operation of the device. This application and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. A minimum separation distance of 20cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements. Host labeling requirement: Contains transmitter module FCC ID: A3LATKM005000 IC ID: 649E-ATKM005000 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Samsung Confidential Specifications in this document are tentative and subject to change. 32 Samsung Semiconductor, Inc. LEGAL INFORMATION ARTIK 050 Module Data Sheet INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK DEVELOPMENT KIT AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER SAMSUNG PRODUCTS). NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. THE LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK DEVELOPER LICENSE AGREEMENT THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT AS PROVIDED IN THE SAMSUNG ARTIK DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND ITS AFFILIATES (COLLECTIVELY, SAMSUNG) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR NOTICE. THIS DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION DISCUSSED HEREIN IS PROVIDED ON AN AS IS BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES NO RESPONSIBILITY FOR POSSIBLE ERRORS OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM THE USE OF THE DOCUMENTATION CONTAINED HEREIN. Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand names, trademarks and registered trademarks belong to their respective owners. For updates or additional information about Samsung ARTIK, contact the Samsung ARTIK team via the Samsung ARTIK website at www.artik.io. Copyright 2016 Samsung Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Samsung Electronics. Samsung Confidential Specifications in this document are tentative and subject to change. 33
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2016-07-29 | 2412 ~ 2462 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2016-07-29
|
||||
1 | Applicant's complete, legal business name |
Samsung Electronics Co Ltd
|
||||
1 | FCC Registration Number (FRN) |
0027908797
|
||||
1 | Physical Address |
19 Chapin Rd., Building D
|
||||
1 |
Pine Brook, New Jersey 07058
|
|||||
1 |
United States
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
t******@siemic.com
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
A3L
|
||||
1 | Equipment Product Code |
ATKM005000
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
J**** C******
|
||||
1 | Title |
General Manager
|
||||
1 | Telephone Number |
973-8********
|
||||
1 | Fax Number |
973-8********
|
||||
1 |
j******@samsung.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | IOT Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Power listed is the maximum conducted output power. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi- transmitter product procedures. End-users and installers must be provided with transmitter operating conditions for satisfying RF exposure compliance. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
KCTL INC
|
||||
1 | Name |
J**** B********
|
||||
1 | Telephone Number |
82-70********
|
||||
1 | Fax Number |
82-50********
|
||||
1 |
j******@kctl.co.kr
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2412.00000000 | 2462.00000000 | 0.2620000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC