FCC ID: S5EBTV81018 Ankle worn electronic tracking device

 

MONITORING SOLUTIONS A Satellite Tracking of People LLC Company BLUtag V8 User Training SECURUS MONITORING SOLUTIONS |

A Satellite Tracking of People LLC Company D R A F T FCC Regulation FCC ID: S5EBTV81018 Blutag V8 complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: reorient or relocate the receiving antenna, increase the separation between the equipment and receiver, connect the equipment into an outlet on a circuit different from that to which the receiver is connected, consult the supplier of the device for help. RF Exposure (SAR) Statement for Blutag V8 FCC ID: S5EBTV81018 This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. It was tested as an ankle worn device in accordance with OET Bulletin 65 Supplement C. The maximum SAR value reported is 1.81 W/Kg. The cellular and other transmitters used in BLUtag V8 are not co-located. The ISM transmitter is operational only when it is required to communicate with the associated equipment. The BLUtag V8 is set up automatically to prevent simultaneous transmission between the GSM and other transmitters. WARNING Changes or modifications to these units not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. Canadian Compliance (Industry Canada) for Blutag V8 IC: 9086A-BTV81018, MODEL NUMBER: BLUTAG V8 This Class B digital apparatus complies with Canadian ICES-003 The Blutag Device has been designed to comply with applicable safety requirements for exposure to radio waves. The radio wave exposure guidelines employ a unit of measurement known as the Specific Absorption Rate, or SAR. Tests for SAR are conducted according to RSS-102 with the Blutag V8 device transmitting at its highest certified power level in all used frequency bands. The highest SAR value for the Blutag V8 when tested was 1.81 W/Kg. The Blutag V8 device is designed to be ankle worn. Please follow the instructions included in the user guide for installation around the ankle. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Conformit du Canada (Industrie Canada) pour Blutag V8 IC: 9086A-BTV81018, NUMRO DU MODLE: BLUTAG V8 Le prsent appareil numrique de Classe B est conforme la norme canadienne ICES-003. L'appareil BluTag V8 a t conu pour tre conforme aux normes de scurit applicables concernant l'exposition aux ondes radiolectriques. Les directives d'exposition aux ondes radiolectriques utilisent l'unit de mesure connue sous le nom de Taux d'absorption spcifique ou TAS. Des tests de TAS ont t excuts conformment la norme RSS-102 avec l'appareil BluTag V8 mettant son niveau de puissance certifi le plus lev dans toutes les bandes de frquences utilises. La valeur de TAS la plus leve pour BluTag V8 pendant le test tait de 1.81 W/kg. L'appareil Blutag V8 a t conu pour tre port la cheville. Veuillez respecter les instructions relatives l'installation de l'appareil la cheville stipules dans le guide de l'utilisateur. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. WARNING BATTERY SAFETY The Blutag V8 device contains a non-removable lithium-Ion battery. Do not attempt to remove the battery. Do not dispose of The Blutag V8 or the lithium-Ion battery in a fire. The lithium-Ion battery might present a fire or chemical burn hazard if mistreated. Do not disassemble, crush, or puncture the lithium-Ion battery or the Blutag V8 device. Do not heat the battery or Blutag V8 device above 140F (60C). Please return the Device to Satellite Tracking of People LLC, 5353 W Sam Houston Parkway N, Suite 190, Houston, TX 77041-5186 USA for disposal otherwise only dispose of the battery or Blutag device in accordance with the laws and regulations in your area governing disposal of this type of battery. SCURIT DES PILES Les appareils BluTag V8 contiennent une pile au lithium-ion non amovible. Ne pas tenter de retirer la pile. Ne pas jeter BluTag V8 ou la pile au lithium-ion dans un feu. La pile au lithium-ion prsente un risque d'incendie ou de brlure chimique en cas de mauvais traitement. Ne pas dsassembler, craser ni percer la pile au lithium-ion ou l'appareil BluTag V8. Ne pas chauffer la pile ou l'appareil BluTag V8 des tempratures suprieures 60 C (140 F). Veuillez renvoyer l'appareil Satellite Tracking of People LLC, 5353 W Sam Houston Parkway N, Suite 190, Houston, TX 77041-5186 USA. pour limination ou si vous voulez vous charger vous-mme de l'limination de la pile ou de l'appareil BluTag V8, veuillez vous conformer aux lois et la rglementation de votre rgion rgissant la mise au rebut de ce type de pile. SECURUS MONITORING SOLUTIONS |

A Satellite Tracking of People LLC Company D R A F T TOPICS 1 6 DEVICE REMOVAL OVERVIEW DASHBOARD ENROLLMENT INSTALLATION 2 3 4 5 ASSIGNING DEVICES SECURUS MONITORING SOLUTIONS |

3 A Satellite Tracking of People LLC Company D R A F T SECTION 1 OVERVIEW SECURUS MONITORING SOLUTIONS |

4 A Satellite Tracking of People LLC Company D R A F T BLUTAG OVERVIEW Features + Specifications Lightweight (6oz), one-piece device Attempts GPS once every minute Calls every 10 minutes Tamper-resistant, fiber optic strap Waterproof to 50 feet Memory capacity of 10+ days GPS interference detection Jamming Possible Shielding Possible SECURUS MONITORING SOLUTIONS |

5 A Satellite Tracking of People LLC Company D R A F T BLUTAG OVERVIEW Device Components LED CHARGING INDICATOR CAPACITIVE TOUCH/CALL BUTTON CHARGING CRADLE SECURUS MONITORING SOLUTIONS |

6 A Satellite Tracking of People LLC Company D R A F T BLUTAG OVERVIEW Battery Life 60 minute charge per day*

40-60 hour battery capacity Three battery notifications to enrollee and agent:

Low Battery Approximately 10 hours left Device vibrates twice every 10 minutes until charged or completely dead Low battery event seen online only Critical Battery Approximately 4 hours left Dead Battery Approximately 20-30 minutes left Agent is alerted Agent is alerted After dead battery, tracking is still possible for up to two hours

*If BLUtag reaches any of the three battery levels (low, critical, dead) charge for 2.5 continuous hours. SECURUS MONITORING SOLUTIONS |

7 A Satellite Tracking of People LLC Company D R A F T BLUTAG OVERVIEW How GPS Works BLUtag attempts to acquire GPS once every minute. Reception and accuracy are best when moving and there is an open unobstructed view of the sky. GPS tracking is possible when at least 3 satellites can be heard. SECURUS MONITORING SOLUTIONS |

8 A Satellite Tracking of People LLC Company D R A F T VERITRACKS Software Web-based application (nothing to install) Phone & Tablet-friendly Google maps Universal software for all hardware Mobile apps 9 SECURUS MONITORING SOLUTIONS |

9 A Satellite Tracking of People LLC Company D R A F T SECTION 2 DASHBOARD SECURUS MONITORING SOLUTIONS |

10 A Satellite Tracking of People LLC Company D R A F T DASHBOARD VIEWS There are four views. Each displays an enrollees name, Primary ID, and risk level. General:

Enrollees BLUtags serial number. GPS only:

Serial number, recent call and GPS dates/times, battery level, critical violation status Events Only:

Number of notes, critical violation status, zone violation status by category RF Only:

Assigned BLUhome and BLUband number, last BLUhome call, RF Status, and Other (RF) event status SECURUS MONITORING SOLUTIONS |

11 A Satellite Tracking of People LLC Company D R A F T GETTING TO KNOW THE DASHBOARD Click the Dashboard tab. The following options will be available:

Find Enrollees View Events New Note SECURUS MONITORING SOLUTIONS |

12 A Satellite Tracking of People LLC Company D R A F T FINDING ENROLLEES IN THE DASHBOARD 1. Search by Enrollee Name 2. Search by Primary ID 3. Search by Agent 4. Search by Organization (ORI) 5. Search by Assigned Status 6. Search by Caseload:

a. Both for all caseloads b. Yes for your own c. No for all but your own 1 2 3 5 4 6 SECURUS MONITORING SOLUTIONS |

13 A Satellite Tracking of People LLC Company D R A F T ADDING CASE NOTES VIA THE DASHBOARD Notes not related to an event can be added to the enrollees Profile as a Case Note. 1. Click the New Note button. 2. Add a Note. 3. Click Save. 1 2 3 SECURUS MONITORING SOLUTIONS |

14 A Satellite Tracking of People LLC Company D R A F T VIEWING THE ENROLLEES LAST TRACK VIA THE DASHBOARD By clicking the Last Track icon for the selected enrollee, you are presented with their status. SECURUS MONITORING SOLUTIONS |

15 A Satellite Tracking of People LLC Company D R A F T ACCESSING ENROLLEE PROFILES VIA THE DASHBOARD By clicking the Profile icon for the selected enrollee, you are taken to their Map of their most recent position in the Enrollees tile. SECURUS MONITORING SOLUTIONS |

16 A Satellite Tracking of People LLC Company D R A F T SECTION 3 ENROLLMENT SECURUS MONITORING SOLUTIONS |

17 A Satellite Tracking of People LLC Company D R A F T NAVIGATING VERITRACKS Tiles Menu Options Tile Tabs Varying choices within each tile 18 SECURUS MONITORING SOLUTIONS |

18 A Satellite Tracking of People LLC Company D R A F T TILE TOTALS Tile totals reflect the following:

Enrollee Number of assigned enrollees for the selected agency Events Number of open events Zones Number of existing zones (assigned & unassigned) Reports Number of processed reports 19 SECURUS MONITORING SOLUTIONS |

19 A Satellite Tracking of People LLC Company D R A F T USING THE FIND & SEARCH MENUS Each Tile has its own Find / Search menu. Each is designed to display results that are based on default search criteria or that chosen by the agent. 1 Find / Search menus remember their settings from session to session. Therefore, to return to the default criteria:

1. Click the Find or Search menu. 2. Click the Reset button to reset the criteria to its defaults. 3. Click Find. 2 3 20 SECURUS MONITORING SOLUTIONS |

20 A Satellite Tracking of People LLC Company D R A F T FINDING ENROLLEES FROM TILE 1. Search by Risk Level 2. Search by Organization (ORI) 3. Search by My Caseload 4. Search by Open Events Both for ALL events Yes for in progress events

(open) No for closed events 5. Search by Is Assigned 6. Search by Device Type 1 3 5 2 4 6 21 SECURUS MONITORING SOLUTIONS |

21 A Satellite Tracking of People LLC Company D R A F T FIND ANYTHING Use Find Anything to search by:

Enrollee Name (eg. Doe, John) Primary ID Agent Name Device Number Zone Name 22 SECURUS MONITORING SOLUTIONS |

22 A Satellite Tracking of People LLC Company D R A F T FIND ANYTHING LEGEND Enrollee in ORI (Last name, First name) Zone (PID Address Title Last name) Device (12-xxxxxx, 15-xxxxxx, etc.) Agent (Last name, First name) SECURUS MONITORING SOLUTIONS |

23 A Satellite Tracking of People LLC Company D R A F T CREATING AN ENROLLEE PROFILE 1. Click the Enrollees tile. 2. Click Add. 3. Fill in the required fields: Primary ID, First Name, and Last Name. 4. Confirm or change the Organization, Agent, and Risk Level. 5. Click Save. 1 5 2 3 4 SECURUS MONITORING SOLUTIONS |

24 A Satellite Tracking of People LLC Company D R A F T ADDING MULTIPLE ENROLLEE PHOTOS 1. In the enrollees Profile, click the Edit button. 2. Above the photo, click the

(+) Add Photo button. 3 3. Type a Description and choose a Photo Type. 4. Click Browse to search for your picture. 5. Once selected, click Update. 6. Use the Arrows to toggle through the pictures. 7. Click Save. 6 7 1 5 2 4 SECURUS MONITORING SOLUTIONS |

25 A Satellite Tracking of People LLC Company D R A F T ADDING ENROLLEE ADDRESSES 1. Under the profile, click Addresses. 2. Click Add. 3. In the Type list, choose Home, Work or Other. 4. Enter a Title for the address (e.g. Home, Work, etc.). 5. Fill in the Street 1 box. 6. Type the City, State, and Zip 7. Code. In Additional Information, add Phone 2 1 3 4 5 6 7 SECURUS MONITORING SOLUTIONS |

26 A Satellite Tracking of People LLC Company D R A F T ADDING ENROLLEE ADDRESSES Click the Geocode button to view the approximate address. To adjust the address placement, drag its icon. 8. 9. 10. Click Save. 8 9 10 SECURUS MONITORING SOLUTIONS |

27 A Satellite Tracking of People LLC Company D R A F T UPDATE AVAILABLE BAR The Update Available bar displays above enrollee cards when an update is available for an enrollee listed on the current page of cards. Clicking the bar is optional, as updated enrollee data will display upon navigating between tabs and tiles. Do not click the Update Available bar while viewing unsaved data. By doing so, unsaved data will be lost. 28 SECURUS MONITORING SOLUTIONS |

28 A Satellite Tracking of People LLC Company D R A F T SECTION 4 INSTALLATION SECURUS MONITORING SOLUTIONS |

29 A Satellite Tracking of People LLC Company D R A F T PREPARING BLUTAG FOR INSTALLATION Begin charging BLUtag at least 4 hours prior to the install. Charge BLUtag in an area where it can also acquire GPS. If GPS is not available, acquire GPS elsewhere for at least 45 minutes. Though GPS might be present within the first few minutes of exposure - for optimal performance, allow BLUtag time to update its almanac prior to use. Important:

Do not leave BLUtags charging for more than two weeks. Avoid charging in the heat of direct sunlight. SECURUS MONITORING SOLUTIONS |

30 A Satellite Tracking of People LLC Company D R A F T VERIFY BLUTAG READINESS FROM ENROLLEE PROFILE Prior to assignment (e.g. during charging), BLUtag will regularly call, acquire GPS, and note its battery level allowing you to verify its readiness. 1 2 4 1. Click the Enrollees tile. 2. Select the enrollees profile. 3. Click the Device Assignments tab. 4. Click Change Assignment. 5. Type or select the desired device. A green square indicates readiness. 6. If the status is not green, it has not met one of the following criteria:

a. Recent contact b. GPS of 60% or greater c. Most recent battery level of 4 volts or higher 7. If the above criteria has not been met, click Contact to research its status. 5 3 6 7 SECURUS MONITORING SOLUTIONS |

31 A Satellite Tracking of People LLC Company D R A F T VERIFY BLUTAG READINESS FROM INVENTORY TILE Prior to assignment (e.g. during charging), BLUtag will regularly call, acquire GPS, and note its battery level allowing you to verify its readiness. 1. 2. 3. 4. Enter Tag # in FIND ANYTHING or Click the Inventory tile. Select the Find Devices Search Option. Type or select the desired device. The green indicator indicates readiness. If the status is not green, it has not met one of the following criteria:

a. Recent contact b. GPS of 60% or greater c. Most recent battery level of 4 volts or higher 5. When selecting the device you can view its activity (last contact/track/battery level and including last GPS point (map)) If the above criteria has not been met, click Contact to research its status. 6. 2 3 4 6 1 5 SECURUS MONITORING SOLUTIONS |

32 A Satellite Tracking of People LLC Company D R A F T ATTACH BLUTAG TO ENROLLEE 1. Locate the strap, strap clips(x2), top cap(x2) and cutting tool. 1 2. Make note of BLUtags serial number. 3. Using the cutter, cut off one end of the strap. a) Make sure holes on the strap are secured on the posts on the template side of the cutting tool prior to cutting. b) Cut on a solid flat surface X 2 2 3 4. 5. 6. Lay clip 1 on the table (solid surface) and place strap in clip flush to border. 4 Insert top cap, ensure cylinder of top cap is seated securely into the recess on the strap clip. Place clip 2 on top of the strap and press together. Ensure clips are flush and no strap is protruding from ends of clips. 5 6 SECURUS MONITORING SOLUTIONS |

33 A Satellite Tracking of People LLC Company D R A F T ATTACH BLUTAG TO ENROLLEE 7. Slide clipped end of strap into wing 7a. For left leg insert clipped end into wing marked L 7b. For right leg install insert clipped end into wing marked R. 8. Place BLUtag on the outside of the ankle and wrap the strap around, tight to the skin. 9. Mark the strap that meets the edge of the wing with silver marker. 10. Slide the strap through cutter in the direction of the Insert arrow on the top of the cutter. Stop where the mark on the strap meets the edge of the cutting tool. Ensure holes on the strap are secured on the posts on the template side of the cutting tool. 7 8 9 10 SECURUS MONITORING SOLUTIONS |

34 A Satellite Tracking of People LLC Company D R A F T ATTACH BLUTAG TO ENROLLEE 12. Repeat steps 4-6 on newly cut side 13. Slide clipped end into open wing. 14. Ensure top caps are flush with wings on both sides. 12 13-14 SECURUS MONITORING SOLUTIONS |

35 A Satellite Tracking of People LLC Company D R A F T SECTION 5 ASSIGNING DEVICES SECURUS MONITORING SOLUTIONS |

36 A Satellite Tracking of People LLC Company D R A F T ASSIGNING A DEVICE To be completed after installation 1. In VeriTracks, click the Enrollees tile. 2. Select the enrollees profile. 3. Click the Device Assignments tab. 4. Click Change Assignment. 5. Type or select the desired device. 6. Click the Save button. 1 2 4 5 3 6 SECURUS MONITORING SOLUTIONS |

37 A Satellite Tracking of People LLC Company D R A F T VERIFYING A SUCCESSFUL DEVICE ASSIGNMENT 1. Within the Enrollees tile, select the enrollees profile. 2. Click their Contact tab to verify that a recent contact was made. 2 3. Click their Events tab to confirm that there is not a Master Tamper. 3 4 4. Click the Map tab to verify that current GPS has been acquired. SECURUS MONITORING SOLUTIONS |

38 A Satellite Tracking of People LLC Company D R A F T ENROLLEE INSTRUCTIONS FOR WEARING BLUTAG Discuss the following with the enrollee:

the tag. level. the tag. time. Attach the charging cup by clipping it to both sides of Do not force a boot over the tag. Light on front indicates charging, not the battery Remove the charger by gently detaching its clips from A sock can be worn over and/or under the device. BluTag is hypoallergenic and cannot overheat. Do not tamper with the device (no pulling, striking, attempt to open). or above 131 F). removal of the tag. Charge twice daily for 30 continuous minutes each Do not expose to extreme temperatures (below -4 F Notify the agency if a medical procedure requires If a 30-minute charge is skipped, charge for 60 continuous minutes. Do not press status call button unless instructed by If you feel a low battery vibration (twice every 10 minutes), charge for 2.5 continuous hours. the agency. Do not charge while sleeping or driving. Do not submerge BluTag in water (baths, pools, large contact the agency. bodies of water). If the tag vibrates or beeps, contact the agency. If the light shines or blinks when off the charger, SECURUS MONITORING SOLUTIONS |

39 A Satellite Tracking of People LLC Company D R A F T SECTION 6 DEVICE REMOVAL SECURUS MONITORING SOLUTIONS |

40 A Satellite Tracking of People LLC Company D R A F T UNASSIGNING BLUTAG Unassign BLUtag prior to cutting the strap to avoid causing a false tamper event. 1. Click the Enrollees tile. 2. Select the enrollees profile. 3. Click the Device Assignments tab. 4. Click Unassign Devices. 5. In the Type list, click the arrow to view and choose the appropriate reason for unassigning the device. 6. Check Track Charger Status 7. Click Save. BLUtag will now box. shut off. 1 2 5 6 4 3 7 SECURUS MONITORING SOLUTIONS |

41 A Satellite Tracking of People LLC Company D R A F T REMOVE BLUTAG FROM ENROLLEE Complete the following steps after unassigning the enrollee in VeriTracks. 1. Locate device removal tool, medical shears and gloves (optional) 2. Cut the strap in the middle, leaving an equal amount on both sides. 3. Pry the top cap off using the device removal tool 4. Insert prongs of the device removal tool into the slots in the strap clips 5. Pull up on the strap to remove from the wing. 2 3 6. Repeat on the other side 7. Inspect all parts for signs of tampering. 8. Clean the lens and surrounding area of any dirt build up. 1 4 SECURUS MONITORING SOLUTIONS |

42 A Satellite Tracking of People LLC Company D R A F T Removal Continued Notes:

If the enrollee has completed the program, no signs of tampering exist, and the unit is not needed for evidence, place the device back into inventory. If you had to unassign the enrollee and plan to reuse the bracelet, make sure to place BLUtag back on the charger to power it back on. If you sense a problem with the device, send it back to STOP. SECURUS MONITORING SOLUTIONS |

43 A Satellite Tracking of People LLC Company D R A F T SECURUS Technologies MONITORING SOLUTIONS A Satellite Tracking of People LLC Company SECURUS Technologies | 44 SECURUS MONITORING SOLUTIONS |

A Satellite Tracking of People LLC Company D R A F T

 

 

LE910Cx HW User Guide Doc#: 1VV0301298 Rev.5 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. COPYRIGHTS This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. COMPUTER SOFTWARE COPYRIGHTS The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product. Rev. 2.0 Page 2 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit III. High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High-Risk Activities. IV. Trademarks TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners. V. Third Party Rights The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third-Party Right software. TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY OTHER CODE), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE. NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Rev. 2.0 Page 3 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 APPLICABILITY TABLE This documentation applies to the following products:

Table 1: Applicability Table Module Name Description LE910C1-NA North America AT&T with global roaming LE910C1-NS North America - Sprint variant LE910C1-AP APAC variant LE910C4-EU Europe variant CAT4 variant LE910C1-EU Europe variant CAT1 variant LE910C4-NF North America CAT4 variant LE910C1-NF North America CAT1 variant Rev. 2.0 Page 4 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 CONTENTS 1. INTRODUCTION .............................................................................................9 2. 2.5.1. 2.5.2. 2.6.1. 2.6.2. 2.7.1. 2.7.2. 2.8.1. 2.8.2. Scope ............................................................................................................. 9 Audience......................................................................................................... 9 Contact Information, Support .......................................................................... 9 Text Conventions ...........................................................................................10 Related Documents .......................................................................................11 PRODUCT DESCRIPTION ............................................................................ 12 Overview........................................................................................................12 Applications ...................................................................................................13 General Functionality and Main Features.......................................................13 Block Diagram ...............................................................................................16 Environmental Requirements .........................................................................17 Temperature Range .......................................................................................17 RoHS Compliance .........................................................................................17 Operating Frequency Bands ..........................................................................18 RF Bands per Regional Variant .....................................................................18 Reference Table of RF Bands Characteristics ...............................................19 RF Parameters ..............................................................................................22 Sensitivity ......................................................................................................22 Output power .................................................................................................22 Mechanical Specifications ..............................................................................23 Dimensions ....................................................................................................23 Weight ...........................................................................................................23 3. MODULE CONNECTIONS ............................................................................ 24 4. 4.3.1. 4.3.2. 4.3.3. Pin-out ...........................................................................................................24 Signals That Must Be Connected ...................................................................33 LGA Pads Layout ...........................................................................................35 Backward Compatibility to xE910 Family .......................................................36 ELECTRICAL SPECIFICATIONS ................................................................. 37 Absolute Maximum Ratings Not Operational ...............................................37 Recommended Operating Conditions ............................................................37 Logic Level Specifications ..............................................................................38 1.8V Pads - Absolute Maximum Ratings ........................................................38 1.8V Standard GPIOs ....................................................................................38 1.8V SD Card Pads .......................................................................................39 Rev. 2.0 Page 5 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 4.3.4. 4.3.5. 4.3.6. 4.3.7. 1.8V SIM Card Pads ......................................................................................40 Dual Voltage Pads - Absolute Maximum Ratings ...........................................40 SD Card Pads @ 2.95V .................................................................................41 SIM Card Pads @2.95V.................................................................................41 5. HARDWARE COMMANDS ........................................................................... 42 5.3.1. 5.3.2. 5.3.3. 6. 6.3.1. 6.3.1.1. 6.3.1.2. 6.3.1.3. 6.3.2. 6.3.3. Turning on the LE910Cx Module ...................................................................42 Initialization and Activation State ...................................................................43 Turning off the LE910Cx Module ...................................................................45 Shutdown by Software Command ..................................................................46 Hardware Shutdown ......................................................................................47 Unconditional Hardware Shutdown ................................................................48 Powering OFF the Module .............................................................................49 POWER SUPPLY .......................................................................................... 50 Power Supply Requirements ..........................................................................50 Power Consumption ......................................................................................51 General Design Rules ....................................................................................53 Electrical Design Guidelines ..........................................................................53

+ 5V Input Source Power Supply Design Guidelines ...................................53

+ 12V Input Source Power Supply Design Guidelines .................................54 Battery Source Power Supply Design Guidelines ........................................55 Thermal Design Guidelines ............................................................................55 Power Supply PCB Layout Guidelines ...........................................................56 7. ANTENNA(S) ................................................................................................ 58 7.5.1. 7.5.2. 7.5.3. 7.5.4. 7.5.5. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ...............................58 GSM/WCDMA/TD-SCDMA/LTE Antenna PCB Line Guidelines ..................59 GSM/WCDMA/LTE Antenna Installation Guidelines....................................60 Antenna Diversity Requirements ....................................................................60 GNSS Antenna Requirements .......................................................................61 Combined GNSS Antenna .............................................................................61 Linear and Patch GNSS Antenna ..................................................................61 Front End Design Considerations ..................................................................62 GNSS Antenna PCB Line Guidelines ..........................................................62 GNSS Antenna Installation Guidelines ........................................................63 8. HARDWARE INTERFACES .......................................................................... 64 USB Port........................................................................................................65 HSIC Interface (Optional) ...............................................................................66 SGMII Interface..............................................................................................66 Rev. 2.0 Page 6 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 8.3.1. Ethernet Control interface ..............................................................................67 8.4.1. 8.4.2. 8.4.3. 8.5.1. 8.5.2. 8.5.3. 8.5.4. 8.6.1. 8.6.1.1. 8.6.1.2. 8.7.1. 8.7.2. 8.7.3. Serial Ports ....................................................................................................68 Modem Serial Port 1 Signals..........................................................................68 Modem Serial Port 2 ......................................................................................71 RS232 Level Translation ................................................................................71 Peripheral Ports .............................................................................................73 SPI Serial Peripheral Interface ....................................................................73 I2C - Inter-integrated Circuit ...........................................................................74 SD/MMC Card Interface .................................................................................75 WiFi SDIO Interface .......................................................................................77 Audio Interface ..............................................................................................78 Digital Audio ..................................................................................................78 Short Frame Timing Diagrams .......................................................................79 Long Frame Timing Diagrams ........................................................................80 General Purpose I/O ......................................................................................82 Using a GPIO Pad as Input ............................................................................84 Using a GPIO Pad as an interrupt / Wakeup source ......................................84 Using a GPIO Pad as Output .........................................................................85 9. MISCELLANEOUS FUNCTIONS .................................................................. 86 9.5.1. 9.5.2. Indication of Network Service Availability .......................................................86 Indication of Software Ready .........................................................................87 RTC Real Time Clock .................................................................................87 VAUX Power Output ......................................................................................87 ADC Converter ..............................................................................................88 Description .....................................................................................................88 Using the ADC Converter ..............................................................................88 Using the Temperature Monitor Function .......................................................88 GNSS Characteristics ....................................................................................89 10. MOUNTING THE MODULE ON YOUR BOARD ........................................... 90 10.7.1. 10.7.2. Rev. 2.0 General ..........................................................................................................90 Finishing & Dimensions .................................................................................90 Recommended Footprint for the Application ..................................................93 Stencil ............................................................................................................94 PCB Pad Design ............................................................................................94 Recommendations for PCB Pad Dimensions (mm) ........................................95 Solder Paste ..................................................................................................95 Solder Reflow ................................................................................................96 Cleaning ........................................................................................................98 Page 7 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 11. APPLICATION GUIDE .................................................................................. 99 11.3.1. 11.5.1. 11.5.2. Debug of the LE910Cx Module in Production ................................................99 Bypass Capacitor on Power Supplies .......................................................... 100 SIM Interface ............................................................................................... 101 SIM Schematic Example .............................................................................. 101 EMC Recommendations .............................................................................. 102 Download and Debug Port ........................................................................... 102 Fast Boot mode ........................................................................................... 103 Recovery Boot Mode ................................................................................... 103 12. PACKING SYSTEM .................................................................................... 104 13. 14. 15. 16. Packing System Tray ................................................................................ 104 Tape & Reel ................................................................................................. 106 Moisture Sensitivity ...................................................................................... 108 SAFETY RECOMMENDATIONS................................................................. 109 CONFORMITY ASSESSMENT ISSUES ..................................................... 110 FCC/ISED Regulatory Notices ..................................................................... 110 ACRONYMS ................................................................................................ 113 DOCUMENT HISTORY ............................................................................... 116 Rev. 2.0 Page 8 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 1. Introduction Scope Introduction Scope This document introduces the Telit LE910Cx module and presents possible and recommended hardware solutions for developing a product based on the LE910Cx module. All the features and solutions detailed in this document are applicable to all LE910Cx variants, where LE910Cx refers to the variants listed in the applicability table. If a specific feature is applicable to a specific product only, it will be clearly marked. NOTE:

LE910Cx refers to all modules listed in the Applicability Table. This document takes into account all the basic functions of a wireless module; suggests a valid hardware solution for each function and points out incorrect solutions and common errors to be avoided. Obviously, this document cannot embrace every hardware solution or every product that can be designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LE910Cx module. NOTE:

The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx cellular module within a user application must be done according to the design rules described in this manual. Audience This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LE910Cx module. Contact Information, Support For general contact, technical support services, technical questions and report documentation errors, contact Telit Technical Support at:

TS-EMEA@telit.com TS-AMERICAS@telit.com TS-APAC@telit.com Rev. 2.0 Page 9 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Alternatively, use:

http://www.telit.com/support Introduction Text Conventions For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com To register for product news and announcements or for product questions contact Telits Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information. Text Conventions The following conventions are used to emphasize specific types of information:

DANGER:

Danger This information MUST be followed, or catastrophic equipment failure or bodily injury may occur. WARNING:

Caution or Warning Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. NOTE:

Tip or Information Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. Rev. 2.0 Page 10 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Related Documents Table 2: Related Documents Introduction Related Documents Document Title Document Number Ref 1: LE920x4/LE910Cx AT Command User Guide 80490ST10778A Ref 2: Telit EVB HW User Guide 1VV0301249 Ref 3: LE910Cx Interface Board HW User Guide 1VV0301323 Ref 4: LE910/LE920 Digital Voice Interface Application Note 80000NT11246A Ref 5: Telit_LE920A4_LE910Cx_Wi-

Fi_Interface_Application_Note_r1 80490NT11511A Ref 6: Antenna Detection Application Note 80000NT10002A Ref 7: High-Speed Inter-Chip USB Electrical Specification, version 1.0

(a supplement to the USB 2.0 specification, Section 3.8.2) Ref 8: ETH_Expansion_board_Application Note 80490NT11622A Rev. 2.0 Page 11 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description Overview 2. Product Description Overview LE910Cx is Telits new LTE series for IoT applications. In its most basic use case, LE910Cx can be applied as a wireless communication front-

end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces. LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For differences in the designated RF band sets refer to Section 2.6.1, RF Bands per Regional Variant. NOTE:

(EN) The integration of the LE910Cx cellular module within user application shall be done according to the design rules described in this manual.

(IT) Lintegrazione del modulo cellulare LE910Cx allinterno dellapplicazione dellutente dovr rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die Integration des LE910Cx Mobilfunk-Moduls in ein Gert mu gem der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija LE910Cx modula v uporabniki aplikaciji bo morala upotevati projektna navodila, opisana v tem prironiku.

(SP) La utilizacin del modulo LE910Cx debe ser conforme a los usos para los cuales ha sido deseado descritos en este manual del usuario.

(FR) Lintgration du module cellulaire LE910Cx dans lapplication de lutilisateur sera faite selon les rgles de conception dcrites dans ce manuel.

(HE) The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice. Rev. 2.0 Page 12 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Applications Product Description Applications LE910Cx can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

Emergency call Telematics services Road pricing Pay-as-you-drive insurance Stolen vehicles tracking Internet connectivity General Functionality and Main Features The LE910Cx series of cellular modules features an LTE and multi-RAT modem together with a powerful on-chip application processor and a rich set of interfaces. The major functions and features are listed below:

Table 3: Features Table Function Features Modem Multi-RAT cellular modem for voice and data communication o LTE FDD Cat1 (Other variants) (10/5Mbps DL/UL). o Carrier aggregation is not supported o GSM/GPRS/EDGE o WCDMA up to DC HSPA+, Rel.9 Support for SIM profile switching Regional variants with optimal choice of RF bands for worldwide coverage of countries and MNOs State-of-the-art GNSS solution with GPS/GLONASS/BeiDou/Galileo/QZSS receiver Digital audio subsystem PCM/I2S digital audio interface Up to 48 kHz sample rate, 16-bit words Two USIM ports dual voltage Class B and Class C support Hot swap support Clock rates up to 5 MHz Application processor Application processor to run customer application code 32-bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating system Flash + DDR are large enough to allow for customers own software applications Rev. 2.0 Page 13 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description General Functionality and Main Features Function Features Interfaces Rich set of interfaces, including:

SD/MMC Card Interface supporting SD3.0 standard SDIO for external WiFi transceiver supporting SDIO3.0 standard SGMII for external Ethernet transceiver o Compliant with IEEE802.3 o Full duplex operation at 1 Gbps o Half/full duplex operation at 10/100 Mbps o Support for VLAN tagging o Support for IEEE1588, PTP (Precision Time Protocol) USB2.0 USB port is typically used for:

o Flashing of firmware and module configuration o Production testing o Accessing the Application Processors file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o NMEA data to an external host CPU HSIC (Optional) o High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver compatible with traditional USB cable connected topologies o Bidirectional data strobe signal (STROBE) o Bidirectional data signal (DATA) o No power consumption unless a transfer is in progress o Maximum trace length 10 cm o Signals driven at 1.2V standard LVCMOS levels Peripheral Ports SPI, I2C, UART GPIOs Antenna ports Form factor Form factor (28x28mm), accommodating the multiple RF bands in each region variant Environment and quality requirements Single supply module The entire module is designed and qualified by Telit for satisfying the environment and quality requirements. The module generates all its internal supply voltages. RTC No dedicated RTC supply, RTC is supplied by VBATT Rev. 2.0 Page 14 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description General Functionality and Main Features Function Features Operating temperature Range -40 C to +85 C (conditions as defined in Section 2.5.1, Temperature Range). NOTE:

The following interfaces are unique for the LE910Cx and may not be supported on other (former or future) xE910 family. Special care must be taken when designing the application board if future compatibility is required:

- SGMII for Ethernet connectivity

- SDIO for WIFI connectivity

- SD/MMC for SD Card connectivity Rev. 2.0 Page 15 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Block Diagram Product Description Block Diagram Figure 1 shows an overview of the internal architecture of the LE910Cx module. It includes the following sub-functions:

Application processor, Modem subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC. RF front end and antenna ports. Digital Audio interface for external codec. Rich IO interfaces. Depending on which LE910Cx software features are enabled, some of its interfaces that are exported due to multiplexing may be used internally and thus may not be usable by the application. PMIC with the RTC function inside Figure 1: LE910Cx Block Diagram GNSS_Sync GNSS Antennna LOCATION MEMORIES MODEM RF FRONTEND APPLICATION PROCESSOR PMIC RTC SIM PCM In/out VBATT_PA Cellular antenna 1 Cellular antenna 2 VBATT ADC JTAG I2C HSIC SPI SGMII USB2.0 UART GPIO 2xSDIO Rev. 2.0 Page 16 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description Environmental Requirements Environmental Requirements 2.5.1. Temperature Range Operating temperature range

-20 ~ +55C. This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range.

-40 ~ +85C. Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction. 40C ~ +95C Storage and non-

operating temperature range 2.5.2. RoHS Compliance As a part of the Telit corporate policy of environmental protection, the LE910Cx complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union

(EU directive 2011/65/EU). Rev. 2.0 Page 17 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description Operating Frequency Bands Operating Frequency Bands The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes conform to the 3GPP specifications. 2.6.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE910Cx family, showing the supported band sets in each variant and the supported band pairs for 2x carrier aggregation. Table 4: RF Bands per Regional Variant Region Variant 2G HSPA+

LTE FDD LTE TDD TD-SCDMA LE910C1-NA 2, 3, 5, 8 1, 2, 4, 5, 8 2, 4, 12 LE910C1-NS LE910C1-AP

-

-

LE910C4-EU 3, 8 LE910C1-EU 3, 8 LE910C4-NF

-

-

1, 5, 8 1, 3, 8 1, 3, 8 2, 4, 5 LE910C1-NF

-

2, 4, 5 2, 4, 5, 12, 25, 26 1, 3, 5, 8, 28 1, 3, 7, 8, 20, 28A 1, 3, 7, 8, 20, 28A 2, 4, 5, 12, 13, 14, 66, 71 2, 4, 5, 12, 13, 14, 66, 71

-

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-

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Rev. 2.0 Page 18 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description Operating Frequency Bands 2.6.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels PCS 1900 DCS 1800 GSM 850 EGSM 900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 1710 ~ 1785 1805 ~ 1880 512 ~ 885 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 890 ~ 915 935 ~ 960 0 ~ 124 Tx-Rx Offset 80 MHz 95 MHz 45 MHz 45 MHz 880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz WCDMA 2100 B1 1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888 Rx: 10562 ~ 10838 190 MHz WCDMA 1900 B2 1850 ~ 1910 1930 ~ 1990 WCDMA 1800 B3 1710 ~ 1785 1805 ~ 1880 WCDMA AWS B4 1710 ~ 1755 2110 ~ 2155 WCDMA 850 B5 824 ~ 849 869 ~ 894 WCDMA 900 B8 880 ~ 915 925 ~ 960 WCDMA 1800 B9 1750 ~ 1784.8 1845 ~ 1879.8 WCDMA 800 B19 830 ~ 845 875 ~ 890 TDS CDMA 2000 B34 2010 ~ 2025 2010 ~ 2025 TDS CDMA 1900 B39 1880 ~ 1920 1880 ~ 1920 LTE 2100 B1 1920 ~ 1980 2110 ~ 2170 Tx: 9262 ~ 9538 Rx: 9662 ~ 9938 Tx: 937 ~ 1288 Rx: 1162 ~ 1513 Tx: 1312 ~ 1513 Rx: 1537 ~ 1738 Tx: 4132 ~ 4233 Rx: 4357 ~ 4458 Tx: 2712 ~ 2863 Rx: 2937 ~ 3088 Tx: 8762 ~ 8912 Rx: 9237 ~ 9387 Tx: 312 ~ 363 Rx: 712 ~ 763 80 MHz 95 MHz 400 MHz 45 MHz 45 MHz 95 MHz 45 MHz Tx: 10054 ~ 10121 Rx: 10054 ~ 10121 0 MHz Tx: 9404 ~ 9596 Rx: 9404 ~ 9596 0 MHz Tx: 18000 ~ 18599 Rx: 0 ~ 599 190 MHz Rev. 2.0 Page 19 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description Operating Frequency Bands Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset LTE 1900 B2 1850 ~ 1910 1930 ~ 1990 LTE 1800 B3 1710 ~ 1785 1805 ~ 1880 LTE AWS B4 1710 ~ 1755 2110 ~ 2155 LTE 850 B5 824 ~ 849 869 ~ 894 LTE 2600 B7 2500 ~ 2570 2620 ~ 2690 LTE 900 B8 880 ~ 915 925 ~ 960 LTE 1800 B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 LTE AWS+ B10 1710 ~ 1770 2110 ~ 2170 LTE 700a B12 699 ~ 716 729 ~ 746 LTE 700c B13 777 ~ 787 746 ~ 756 LTE 700b B17 704 ~ 716 734 ~ 746 LTE 800 B19 830 ~ 845 875 ~ 890 LTE 800 B20 832 ~ 862 791 ~ 821 LTE 1500 B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 LTE 1900+ B25 1930 ~ 1995 1850 ~ 1915 Tx: 18600 ~ 19199 Rx: 600 ~ 1199 80 MHz Tx: 19200 ~ 19949 Rx: 1200 ~ 1949 95 MHz Tx: 19950 ~ 20399 Rx: 1950 ~ 2399 400 MHz Tx: 20400 ~ 20649 Rx: 2400 ~ 2649 45 MHz Tx: 20750 ~ 21449 Rx: 2750 ~ 3449 120 MHz Tx: 21450 ~ 21799 Rx: 3450 ~ 3799 45 MHz Tx: 21800 ~ 2149 Rx: 3800 ~ 4149 95 MHz Tx: 22150 ~ 22749 Rx: 4150 ~ 4749 400 MHz Tx: 23010 ~ 23179 Rx: 5010 ~ 5179 30 MHz Tx: 27210 ~ 27659 Rx: 9210 ~ 9659

-31 MHz Tx: 23730 ~ 23849 Rx: 5730 ~ 5849 30 MHz Tx: 24000 ~ 24149 Rx: 6000 ~ 6149 45 MHz Tx: 24150 ~ 24449 Rx: 6150 ~ 6449

-41 MHz Tx: 24450 ~ 24599 Rx: 6450 ~ 6599 48 MHz Tx: 26040 ~ 26689 Rx: 8040 ~ 8689 80 MHz Rev. 2.0 Page 20 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description Operating Frequency Bands Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset LTE 850+ B26 814 ~ 849 859 ~ 894 LTE 700 B28A 703 ~ 733 758 ~ 788 LTE 700 B28 703 ~ 748 758 ~ 803 LTE AWS-3 B66 1710 ~ 1780 2210 ~ 2200 LTE600 B71 663 ~ 698 617 ~ 652 LTE TDD 2600 B38 2570 ~ 2620 2570 ~ 2620 LTE TDD 1900 B39 1880 ~ 1920 1880 ~ 1920 LTE TDD 2300 B40 2300 ~ 2400 2300 ~ 2400 LTE TDD 2500 B41M 2555 ~ 2655 2555 ~ 2655 Tx: 26690 ~ 27039 Rx: 8690 ~ 9039 45 MHz Tx: 27210 ~ 27510 Rx: 9210 ~ 9510 55 MHz Tx: 27210 ~ 27659 Rx: 9210 ~ 9659 55 MHz Tx: 131972-132671 Rx: 66436-67335 400 MHz Tx: 133122-133471 Rx: 68568-68935 46 MHz Tx: 37750 ~ 38250 Rx: 37750 ~ 38250 0 MHz Tx: 38250 ~ 38650 Rx: 38250 ~ 38650 0 MHz Tx: 38650 ~ 39650 Rx: 38650 ~ 39650 0 MHz Tx: 40265 ~ 41215 Rx: 40265 ~ 41215 0 MHz Rev. 2.0 Page 21 of 119 2018-09-16 Product Description RF Parameters LE910Cx HW User Guide Doc#: 1VV0301298 RF Parameters 2.7.1. Sensitivity Typical sensitivity levels are as follows:

-108 dBm @ 2G

-113.5 dBm @ 3G

-103 dBm @ 4G FDD (BW=5 MHz) 2.7.2. Output power Typical values for Max output level are as follow:

2G:

- LB: 33dBm

- HB: 30dBm 3G/TD-SCDMA: 24dBm 4G (FDD & TDD): 23dBm @1RB. Rev. 2.0 Page 22 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Product Description Mechanical Specifications Mechanical Specifications 2.8.1. Dimensions The modules overall dimensions are:

Length:

28.2 mm, +/- 0.15 mm tolerance Width:

28.2 mm, +/- 0.15 mm tolerance Thickness: 2.2 mm, +/- 0.15 mm tolerance NOTE:

Consider a typical label thickness of 0.1 mm in addition to the module thickness. 2.8.2. Weight The nominal weight of the LE910Cx module is 9.0 gram. Rev. 2.0 Page 23 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out 3. Module Connections Pin-out Table 6: Pin-out PAD Signal I/O Function Type Comment USB HS 2.0 Communication Port B15 USB_D+

I/O USB differential Data (+) C15 USB_D-

I/O USB differential Data (-) A13 USB_VBUS AI Power sense for the internal USB transceiver Power A14 USB_ID AI USB ID Asynchronous UART N15 C103/TXD I Serial data input (TXD) from DTE 1.8V M15 C104/RXD O Serial data output to DTE 1.8V L14 C105/RTS P15 C106/CTS P14 C107/DSR M14 C108/DTR N14 C109/DCD R14 C125/RING I O O I O O Input for Request to send signal (RTS) from DTE 1.8V Output for Clear to send signal

(CTS) to DTE 1.8V Output for Data Set Ready

(DSR) to DTE 1.8V Input for Data Terminal Ready

(DTR) from DTE 1.8V Output for Data Carrier Detect

(DCD) to DTE 1.8V Output for Ring Indication (RI) to DTE 1.8V SPI Serial Peripheral Interface / AUX UART F15 SPI_CLK O SPI Clock output E15 SPI_MISO/ RX_AUX I D15 SPI_MOSI/TX_AUX O SPI data Master Input Slave output / RX_AUX SPI data Master Output Slave input/ TX_AUX H14 SPI_CS/GPIO11 O SPI Chip select output /

GPIO11 1.8V 1.8V 1.8V 1.8V See note below Alternate Fn GPIO_32 Alternate Fn GPIO_34 Alternate Fn GPIO_33 Alternate Fn GPIO_31 See note below Rev. 2.0 Page 24 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment SD/MMC Card Digital I/O J12 SD/MMC_CMD F12 SD/MMC_CLK O O SD Command SD Card Clock E12 SD/MMC_DATA0 I/O SD Serial Data 0 G12 SD/MMC_DATA1 I/O SD Serial Data 1 K12 SD/MMC_DATA2 I/O SD Serial Data 2 H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V 1.8/2.95V 1.8/2.95V 1.8/2.95V 1.8/2.95V 1.8/2.95V SD card detect input 1.8V Active Low Power supply for MMC card pull-up resistors 1.8/2.95V G13 SD/MMC_CD F13 VMMC WiFi (SDIO) Interface N13 WiFi_SD_CMD L13 WiFi_SD_CLK I

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O O Wi-Fi SD Command Wi-Fi SD Clock J13 WiFi_SD_DATA0 I/O Wi-Fi SD Serial Data 0 M13 WiFi_SD_DATA1 I/O Wi-Fi SD Serial Data 1 K13 WiFi_SD_DATA2 I/O Wi-Fi SD Serial Data 2 H13 WiFi_SD_DATA3 I/O Wi-Fi SD Serial Data 3 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V L12 WiFi_SDRST O Wi-Fi Reset / Power enable control 1.8V Active Low M11 WLAN_SLEEP_CLK O Wi-Fi Sleep clock output 1.8V M10 RFCLK2_QCA O Wi-Fi low noise RF clock output 1.8V LTE-WiFi Coexistence M8 WCI_TX M9 WCI_RX SIM Card Interface 1 A6 A7 SIMCLK1 SIMRST1 O I O O Wireless coexistence interface TXD 1.8V Wireless coexistence interface RXD 1.8V External SIM 1 signal Clock 1.8/2.85V External SIM 1 signal Reset 1.8/2.85V Rev. 2.0 Page 25 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment A5 SIMIO1 A4 SIMIN1 A3 SIMVCC1 SIM Card Interface 2 C1 D1 SIMCLK2 SIMRST2 I/O External SIM 1 signal - Data I/O 1.8/2.85V Internally PU 10 k to SIMVCC1 I

-

O O External SIM 1 signal -

Presence 1.8V Active low External SIM 1 signal Power supply for SIM 1 1.8/2.85V External SIM 2 signal Clock 1.8/2.85V External SIM 2 signal Reset 1.8/2.85V C2 SIMIO2 I/O External SIM 2 signal Data I/O 1.8/2.85V Internally PU 10k to SIMVCC2 External SIM 2 signal Presence 1.8V Active low G4 SIMIN2 D2 SIMVCC2 Digital Voice Interface (DVI) B9 DVI_WAO B6 B7 DVI_RX DVI_TX B8 DVI_CLK B12 REF_CLK General Purpose Digital I/O I

-

O I O O O External SIM 2 signal Power supply for SIM 2 1.8/2.85V Digital Voice interface (WAO master output) Digital Voice interface (Rx) Digital Voice interface (Tx) Digital Voice interface (CLK master output) Reference clock for external Codec 1.8V 1.8V 1.8V 1.8V 1.8V C8 GPIO_01 I/O GPIO_01 / STAT_LED 1.8V C9 GPIO_02 I/O GPIO_02 C10 GPIO_03 I/O GPIO_03 C11 GPIO_04 I/O GPIO_04 1.8V 1.8V 1.8V See Note below Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Rev. 2.0 Page 26 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V RF RF B14 GPIO_05 I/O GPIO_05 C12 GPIO_06 I/O GPIO_06 C13 GPIO_07 I/O GPIO_07 K15 GPIO_08 I/O GPIO_08 / SW_RDY L15 GPIO_09 I/O GPIO_09 G15 GPIO_10 I/O GPIO_10 RF Section K1 Antenna F1 ANT_DIV GPS Section R9 ANT_GPS R7 GPS_LNA_EN N9 GPS_SYNC Miscellaneous Functions R12 ON_OFF_N R13 HW_SHUTDOWN_N I I O O I I R11 VAUX/PWRMON O I/O GSM/EDGE/UMTS/LTE Main antenna (50 Ohm) UMTS/LTE antenna diversity input (50 Ohm) GPS antenna (50 Ohm) RF Enables the external regulator for GPS LNA 1.8V GPS sync signal for Dead Reckoning 1.8V Power ON / Power OFF input Unconditional Shutdown input Supply output for external accessories /

Power ON monitor 1.8V B1 ADC_IN1 H4 ADC_IN2 D7 ADC_IN3 AI AI AI Analog/Digital Converter Input 1 Analog Analog/Digital Converter Input 2 Analog Analog/Digital Converter Input 3 Analog Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Active low Active low Rev. 2.0 Page 27 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment SGMII Interface E4 F4 D5 D6 SGMII_RX_P SGMII_RX_M AI AI SGMII receive plus SGMII receive minus SGMII_TX_P AO SGMII transmit plus SGMII_TX_M AO SGMII transmit - minus PHY PHY PHY PHY HSIC Interface A12 HSIC_DATA A11 HSIC_STB I2C Interface I/O I/O High-speed inter-chip interface

- data 1.2V Optional High-speed inter-chip interface

- strobe 1.2V Optional B11 I2C_SCL I/O I2C clock B10 I2C_SDA I/O I2C Data Power Supply M1 VBATT M2 VBATT N1 VBATT_PA N2 VBATT_PA P1 VBATT_PA P2 VBATT_PA A2 GND B13 GND D4 GND E1 E2 GND GND

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Main Power Supply (Digital Section) Main Power Supply (Digital Section) Main Power Supply (RF Section) Main Power Supply (RF Section) Main Power Supply (RF Section) Main Power Supply (RF Section) Ground Ground Ground Ground Ground 1.8V 1.8V Power Power Power Power Power Power Internally PU 2.2k to 1.8V Internally PU 2.2k to 1.8V Rev. 2.0 Page 28 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment E14 GND F2 G1 G2 G7 G8 G9 H1 H2 H7 H8 H9 J1 J2 J7 J8 J9 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND K2 GND L1 L2 GND GND M3 GND M4 GND M12 GND N3 N4 N5 N6 P3 GND GND GND GND GND

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Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Rev. 2.0 Page 29 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment P4 P5 P6 P8 P9 GND GND GND GND GND P10 GND P13 GND R2 R3 R5 R6 R8 GND GND GND GND GND R10 GND Reserved A8 A9 Reserved Reserved A10 Reserved B2 B3 B4 B5 C3 C4 C5 C6 C7 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved C14 Reserved D3 Reserved

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Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Rev. 2.0 Page 30 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment D8 D9 Reserved Reserved D10 Reserved D11 Reserved D12 Reserved D13 Reserved D14 Reserved E3 Reserved E13 Reserved F3 Reserved F14 Reserved G3 Reserved G14 Reserved H3 Reserved H15 Reserved J3 J4 Reserved Reserved J14 Reserved J15 Reserved K3 K4 Reserved Reserved K14 Reserved L3 L4 Reserved Reserved M5 Reserved M6 Reserved M7 Reserved N7 Reserved

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Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Rev. 2.0 Page 31 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Pin-out PAD Signal I/O Function Type Comment N8 Reserved N10 Reserved N11 Reserved N12 Reserved P7 Reserved P11 Reserved P12 Reserved Reserved for future use R4 RFU

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Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved for future use. Not connected internally Can be tied to GND WARNING:

GPIO_09 and WCI_RX are used as special HW flags during boot. If they are used as GPIOs, they must be connected via a 3-state buffer to avoid any undesirable effect during the boot. NOTE:

When the UART signals are used as the communication port between the host and the modem, the RTS must be connected to GND (on the module side) if flow control is not used. If the UART port is not used, all UART signals can be left disconnected. NOTE:

Unless otherwise specified, RESERVED pins must be left unconnected

(floating). Rev. 2.0 Page 32 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Signals That Must Be Connected NOTE:

The following pins are unique for the LE910Cx and may not be supported on other (former or future) xE910 family modules. Special care must be taken when designing the application board if future compatibility is required. REF_CLK SPI_CS USB_ID I2C_SCL I2C_SDA ADC_IN2 ADC_IN3 Signals That Must Be Connected Table 7 lists the LE910Cx signals that must be connected even if not used by the end application:

Table 7: Mandatory Signals PAD Signal Notes VBATT &

VBATT_PA GND M1, M2, N1, N2, P1, P2 A2, B13, D4, E1, E2, E14, F2, G1, G2, G7, G8, G9, H1, H2, H7, H8, H9, J1, J2, J7, J8, J9, K2, L1, L2, M3, M4, M12, N3, N4, N5, N6, P3, P4, P5, P6, P8, P9, P10, P13, R2, R3, R5, R6, R8, R10 R12 R13 B15 C15 A13 ON/OFF Main power on off signal HW_SHUTDOWN_N Emergency power off USB_D+

USB_D-

USB_VBUS If not used, connect to a Test Point or an USB connector If not used, connect to a Test Point or an USB connector If not used, connect to a Test Point or an USB connector Rev. 2.0 Page 33 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Signals That Must Be Connected PAD Signal Notes N15 M15 L14 P15 D15 E15 K1 F1 R9 C103/TXD C104/RXD C105/RTS C106/CTS TX_AUX RX_AUX Antenna ANT_DIV If not used, connect to a Test Point If not used, connect to a Test Point If flow control is not used, connect to GND If not used, connect to a Test Point If not used, connect to a Test Point If not used, connect to a Test Point MAIN antenna DIV antenna ANT_GPS GPS antenna C4, C5, C6, C7, D3, E3, G3, K4, L4, P11 Reserved Connect to a Test Point for Telit internal use L15 M9 GPIO_09 WCI_RX If not used, connect to a Test Point If not used, connect to a Test Point Rev. 2.0 Page 34 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 LGA Pads Layout Figure 2: LGA Pads Layout Module Connections LGA Pads Layout 1 5 1 4 1 3 1 1 1 0 9 8 7 6 5 4 3 2 1 S I M R S T D V I _ T X S I M C L K D V I _ R X H S I C _ S T B I 2 C _ S C L I G P O _ 0 4 R E S R E S R E S I 2 C _ S D A I G P O _ 0 3 D V I _ W A 0 I G P O _ 0 2 D V I _ C L K I G P O _ 0 1 S I M O I S I M N I S I M V C C G N D A R E S R E S R E S R E S A D C _ I N 1 S I M C L K 2 S I M R S T 2 B C D S I M O 2 I S I M V C C 2 R E S R E S R E S R E S R E S R E S R E S R E S R E S R E S R E S R E S A D C _ I N 3 S G M I I _ T X _ M S G M I I _ T X _ P R E S G N D S G M I I _ R X _ P S G M I I _ R X _ M S I M N 2 I G N D G N D G N D R E S G N D G N D E R E S G N D A N T _ D V I F R E S G N D G N D G G N D G N D G N D A D C _ I N 2 R E S G N D G N D H G N D G N D G N D R E S R E S R E S R E S G N D G N D G N D A N T _ M A N I J K R E S R E S G N D G N D L W L A N _ S L E E P _ C L K R E S R F C L K 2 _ Q C A R E S W C I _ R X D _ T G P O 2 5 I G P S _ S Y N C W C I _ T X D _ T G P O 2 4 I R E S R E S R E S R E S G N D G N D R E S G N D G N D G N D G N D R E S R E S G N D G N D G N D R E S G N D G N D G N D G N D V B A T T V B A T T _ P A V B A T T _ P A V B A T T V B A T T _ P A V B A T T _ P A M N P 1 2 H S I C _ D A T A R E F _ C L K I G P O _ 0 6 M M C _ D A T 0 M M C _ C L K M M C _ D A T 1 M M C _ D A T 3 M M C _ C M D M M C _ D A T 2 W I F I _ S D R S T G N D R E S U S B _ D

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P W R M O N G N D A N T _ G P S G N D G P S _ L N A _ E N G N D G N D R F U G N D G N D R Rev. 2.0 Page 35 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Module Connections Backward Compatibility to xE910 Family Backward Compatibility to xE910 Family The LE910Cx is a new series in the xE910 form factor The LE910Cx is fully backward compatible to the previous xE910 in terms of:

Mechanical dimensions Package and pin-map To support the extra features and additional interfaces, the LE910Cx introduces more pins compared to the xE910. The extra pins of the LE910Cx can be considered as optional if not needed and can be left unconnected (floating) if not used. In this case, the new LE910Cx can be safely mounted on existing carrier boards designed for the previous xE910. The additional pins of the LE910Cx are shown in Figure 3 (marked as Green) Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view) Rev. 2.0 Page 36 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Electrical Specifications Absolute Maximum Ratings Not Operational 4. Electrical Specifications Absolute Maximum Ratings Not Operational WARNING:

A deviation from the value ranges listed below may harm the LE910Cx module. Table 8: Absolute Maximum Ratings Not Operational Symbol Parameter Min Max Unit VBATT Battery supply voltage on pin VBATT

-0.5

+6.0

[V]

VBATT TRANSIENT Transient voltage on pin VBATT (< 10 ms)

-0.5

+7.0

[V]

VBATT_PA Battery supply voltage on pin VBATT_PA

-0.3

+6.0

[V]

Recommended Operating Conditions Table 9: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit

-40 3.4

+25

+85 3.8 4.2

[C]

[V]

3.4 3.8 4.2

[V]

-

80 2000

[mA]

Tamb VBATT VBATT_PA IBATT_PA + IBATT Ambient temperature Battery supply voltage on pin VBATT Battery supply voltage on pin VBATT_PA Peak current to be used to dimension decoupling capacitors on pin VBATT_PA Rev. 2.0 Page 37 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Electrical Specifications Logic Level Specifications Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE910Cx are 1.8V CMOS logic. Only few specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE910Cx interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges. NOTE:

Do not connect LE910Cx digital logic signals directly to OEM digital logic signals with a level higher than 2.7V for 1.8V CMOS signals. 4.3.1. 1.8V Pads - Absolute Maximum Ratings Table 10: Absolute Maximum Ratings - Not Functional Parameter Min Max Input level on any digital pin when on

-0.3V

+2.16V Input voltage on analog pins when on

-0.3V

+2.16 V 4.3.2. 1.8V Standard GPIOs Table 11: Operating Range Interface Levels (1.8V CMOS) Pad Parameter Min Max Unit Comment VIH VIL Input high level 1.25V

--

Input low level

--

0.6V VOH Output high level 1.4V

--

VOL Output low level IIL IIH Low-level input leakage current High-level input leakage current

--

-1

--

0.45V

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+1

[V]

[V]

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[uA]

No pull-up

[uA]

No pull-down RPU Pull-up resistance 30 390

[k]

Rev. 2.0 Page 38 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Electrical Specifications Logic Level Specifications Pad Parameter Min Max Unit Comment RPD Pull-down resistance Ci Input capacitance 30

--

390 5

[k]

[pF]

NOTE:

Pull-Up and Pull-Down resistance of GPIO3, GPIO7 and GPIO8 is different than above mentioned GPIO3 pull resistance is specified as 10K to 50K 4.3.3. 1.8V SD Card Pads Table 12: Operating Range SD Card Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH VIL Input high level 1.27V 2V Input low level

-0.3V 0.58V VOH Output high level 1.4V

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VOL Output low level IIL IIH Low-level input leakage current High-level input leakage current RPU Pull-up resistance RPD Pull-down resistance Ci Input capacitance 0

-2

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Rev. 2.0 Page 39 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Electrical Specifications Logic Level Specifications 4.3.4. 1.8V SIM Card Pads Table 13: Operating Range SIM Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.35V 2V VIL Input low level

-0.3V 0.43V VOH Output high level 1.35V 1.875V VOL Output low level IIL IIH Low-level input leakage current High-level input leakage current RPU Pull-up resistance RPD Pull-down resistance Ci Input capacitance 0V

-2

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2 100 100 5

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4.3.5. Dual Voltage Pads - Absolute Maximum Ratings Table 14: Absolute Maximum Ratings - Not Functional Parameter Min Max Input level on any digital pin when on

-0.3V

+3.6V Input voltage on analog pins when on

-0.3V

+3.6 V Rev. 2.0 Page 40 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Electrical Specifications Logic Level Specifications 4.3.6. Table 15: Operating Range For SD Card Pads Operating at 2.95V SD Card Pads @ 2.95V Pad Parameter Min Max Unit Comments VIH VIL Input high level 1.9V 3.1V Input low level

-0.3V 0.7V VOH Output high level 2.1V 3.05V VOL Output low level IIL IIH Low-level input leakage current High-level input leakage current RPU Pull-up resistance RPD Pull-down resistance Ci Input capacitance 0V

-10 10 10

[V]

[V]

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-0.3V 0.55V VOH Output high level 2.25V 3.1V

[V]

[V]

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-10 10 10 Rev. 2.0 Page 41 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Turning on the LE910Cx Module 5. Hardware Commands Turning on the LE910Cx Module To turn on the LE910Cx module, the ON_OFF_N pad must be asserted low for at least 1 second and then released. The maximum current that can be drained from the ON/OFF # pad is 0.1 mA. This pin is internally pulled up; customers should expect to see ~ 800 mV on the output. Figure 4 illustrates a simple circuit to power on the module using an inverted buffer output. Figure 4: Power-on Circuit NOTE:

Recommended values R2 = 47 k, R1 = 10 k. Rev. 2.0 Page 42 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Initialization and Activation State Initialization and Activation State After turning on the LE910Cx module, a predefined internal boot sequence performs the HW and SW initialization of the module, which takes some time to complete fully. During this process, the LE910Cx is not accessible. As shown in Figure 5, the LE910Cx becomes operational at least 25 seconds after PWRMON goes HIGH. NOTE:

During the Initialization state, AT commands are not available. The DTE host must wait for the Activation state prior to communicating with the LE910Cx. Figure 5: LE910Cx Initialization and Activation VBATT ON_OFF SW_RDY V_AUX PWRMON 1 Sec < T_Hold < 2 Sec T_RDY < 20 Sec 18 Sec < T_PWRMON < 20 Sec OK to Send AT commands All interfaces and pins configured OFF State Initialization State Active State NOTE:

SW_RDY signal is available on GPIO_08 (by default GPIO_08 functions as SW_RDY) NOTE:

To check whether the LE910Cx has completely powered on, monitor the SW_RDY hardware line. When SW_RDY goes high, the module has completely powered on and is ready to accept AT commands. Rev. 2.0 Page 43 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Initialization and Activation State NOTE:

During SW initialization of the LE910Cx, the SW configures all pads and interfaces to their desired mode. When PWRMON goes high, this indicates that the initialization of all I/O pads is completed. NOTE:

Do not use any pull-up resistor on the ON_OFF_N line as it is internally pulled up. Using a pull-up resistor may cause latch-up problems on the LE910Cx power regulator and improper powering on/off of the module. The ON_OFF_N line must be connected only in an open-collector configuration. NOTE:

For systems not requiring controlled power ON/OFF, automatic power on can be supported by shorting the ON_OFF signal directly GND In this case, the module will start power on sequence immediately after VBATT supply is applied NOTE:

Active low signals are labeled with a name that ends with "#" or with _N NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. Rev. 2.0 Page 44 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Turning off the LE910Cx Module Turning off the LE910Cx Module Turning off the device can be done in the following different ways:

Shutdown by software using AT#SHDN software command Hardware shutdown using ON_OFF_N pad Hardware Unconditional Shutdown using the SHDN_N pad When the device is shut down by a software command or a hardware shutdown, it issues a detach request to the network, informing the network that the device will not be reachable any more. NOTE:

To check if the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, this indicates that the device has powered off. NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. Rev. 2.0 Page 45 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Turning off the LE910Cx Module 5.3.1. Shutdown by Software Command The LE910Cx module can be shut down by a software command. When a shutdown command is sent, LE910Cx goes into the Finalization state and at the end of the finalization process shuts down PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 10 seconds from sending a shutdown command until reaching a complete shutdown. The DTE host should monitor the status of PWRMON to observe the actual power-off. Figure 6: Shutdown by Software Command NOTE:

To check whether the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, the device has powered off. Rev. 2.0 Page 46 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Turning off the LE910Cx Module 5.3.2. Hardware Shutdown To turn off the LE910Cx module, the ON_OFF_N pad must be asserted low for at least 2.5 seconds and then released. Use the same circuitry and timing for power-on. When the hold time of ON/OFF# is above 2.5 seconds, LE910Cx goes into the Finalization state and eventually shuts down PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 15 seconds from sending a shutdown command until reaching a complete shutdown. The DTE host should monitor the status of PWRMON to observe the actual power-off. Figure 7: Hardware Shutdown NOTE:

To check whether the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, the device has powered off. Rev. 2.0 Page 47 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Turning off the LE910Cx Module 5.3.3. Unconditional Hardware Shutdown To unconditionally shut down the LE910Cx module, the HW_SHUTDOWN_N pad must be tied low for at least 200 milliseconds and then released. Figure 8 shows a simple circuit for applying an unconditional shutdown. Figure 8: Circuit for Unconditional Hardware Shutdown Figure 9 shows the system power-down timing when using HW_SHUTDOWN_N. Figure 9: Power down timing using HW_SHUTDOWN_N VBATT SHDN_N SW_RDY V_AUX PWRMON 200mS Sec < T_Hold T_RDY ~0 Sec T_PWRMON ~0 Sec Active State OFF State NOTE:

Recommended values are as follows: R2 = 47k, R1 = 10k. Rev. 2.0 Page 48 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Commands Powering OFF the Module NOTE:

Do not use any pull-up resistor on the HW_SHUTDOWN_N line or any totem pole digital output. Using a pull-up resistor may cause latch-up problems on the LE910Cx power regulator and improper functioning of the module. The HW_SHUTDOWN_N line must be connected only in an open-collector configuration. NOTE:

The Unconditional Hardware Shutdown must always be implemented on the boards, but the software must use it only as an emergency exit procedure, and not as a normal power-off operation. Powering OFF the Module Powering OFF the module should be done gracefully allowing the module to complete all ongoing and pending tasks while properly handling all memory buffers. In the case where a complete power supply shut down is needed, the following procedure should be followed:

1. Perform a HW shutdown as described in Section 5.3.1 2. Wait for the HW Shutdown procedure to complete (monitor the PWRMON pin). 3. Turn OFF power supply to the module WARNING:

Follow the recommended procedure for shut down and power off carefully. Not following the recommended shut-down and power off procedures might damage the device and consequently void the warranty. Rev. 2.0 Page 49 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply Power Supply Requirements 6. Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. Power Supply Requirements The LE910Cx power requirements are as follows:

Table 17: Power Supply Requirements Nominal supply voltage 3.8V Supply voltage range 3.4V 4.2V Max ripple on module input supply 30 mV NOTE:

For PTCRB approval on the final products, the power supply is required to be within the range of Normal Supply voltage ranger. Rev. 2.0 Page 50 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply Power Consumption Power Consumption Table 18 provides typical current consumption values of LE910Cx for the various available modes. Table 18: LE910Cx Current Consumption Mode Average

(Typ.) Mode Description Switched Off Switched off 25A Module supplied but switched Off (RTC On) Idle Mode (Standby Mode; No Call in Progress) AT+CFUN=4 1.0 mA Tx and Rx disabled; module is not registered on the network (Flight mode) GSM DRX AT+CFUN=5 WCDMA 2.0 mA DRx2 1.4 mA DRx5 1.4 mA DRx7 1.2 mA DRx8 LTE 1.8mA Paging cycle #128 frames (1.28 sec DRx cycle) 1.4mA Paging cycle #256 frames (2.56 sec DRx cycle) Operative Mode (LTE) LTE (0dBm) 180mA 190mA 210mA LTE CAT 1 channel BW 5 MHz, RB=1, Tx =

0 dBm

(Test case: BAND 1, Channel 300) LTE CAT 1 channel BW 10 MHz, RB=1, Tx =

0 dBm

(Test case: BAND 1, Channel 300) LTE CAT 1 channel BW 5 MHz, RB=1, Tx =

0 dBm With FTP TpT session LTE to USB 10Mbps DL/5Mbps UL

(Test case: BAND 1, Channel 300) Operative Mode (WCDMA) WCDMA Voice 200mA WCDMA voice call (Tx = 10 dBm) WCDMA HSDPA

(0 dBm) 150mA WCDMA data call (Cat 14, Tx = 0 dBm, Max throughput) Rev. 2.0 Page 51 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply Power Consumption Mode Average

(Typ.) Mode Description WCDMA HSDPA

(22 dBm) 310mA WCDMA data call (Cat 14, Tx = 22 dBm, Max throughput) Operative Mode (GSM) GSM Tx and Rx mode GSM900 PL5 DCS1800 PL0 GPRS 4 Tx + 1 Rx GSM 900 PL5 DCS 1800 PL0 250 mA 170mA 430mA 340mA Operative Mode (GPS) GSM voice call GPRS Sending Data mode (CS-4) GPS tracking 40mA LTE connection is idle

* Worst/best case current values depend on network configuration, not under module control. NOTE:

The electrical design for the power supply must ensure a peak current output of at least 2.0A. NOTE:

In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base frequency of about 216 Hz with relative current peaks as high as about 2.0A. Therefore, the power supply must be designed to withstand these current peaks without big voltage drops. This means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed, a strong noise floor is generated on the ground. This will reflect on all the audio paths producing an audible annoying noise at 216 Hz. If the voltage drops during the peaks, current absorption is too high. The device may even shut down as a consequence of the supply voltage drop. Rev. 2.0 Page 52 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply General Design Rules General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps:

Electrical design Thermal design PCB layout 6.3.1. Electrical Design Guidelines The electrical design of the power supply depends strongly on the power source where this power is drained. Power sources can be distinguished by three categories:

+5V input (typically PC internal regulator output)

+12V input (typically automotive) Battery 6.3.1.1.

+ 5V Input Source Power Supply Design Guidelines The desired output for the power supply is 3.8V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption. When using a linear regulator, a proper heat sink must be provided to dissipate the power generated. A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LE910Cx module. A 100 F tantalum capacitor is usually suitable on both VBATT and VBATT_PA power lines. Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. A protection diode must be inserted close to the power input to protect the LE910Cx module from power polarity inversion. Figure 10 shows an example of a linear regulator with 5V input. Figure 10: Example of Linear Regulator with 5V Input Rev. 2.0 Page 53 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply General Design Rules 6.3.1.2.

+ 12V Input Source Power Supply Design Guidelines The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used. A switching power supply is preferable because of its better efficiency, especially with the 2A peak current load expected during GSM Tx. When using a switching regulator, a 500-kHz or higher switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption. In any case, the selection of the frequency and switching design is related to the application to be developed due to the fact that the switching frequency can also generate EMC interference. For car batteries (lead-acid accumulators) the input voltage can rise up to 15.8V. This must be kept in mind when choosing components: all components in the power supply must withstand this voltage. A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks. A 100F tantalum capacitor is usually suitable on VBATT & VBATT_PA power lines. Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. For automotive applications, a spike protection diode must be inserted close to the power input to clean the supply of spikes. A protection diode must be inserted close to the power input to protect the LE910Cx module from power polarity inversion. This can be the same diode as for spike protection. Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 11: Example of Switching Regulator with 12V Input Part 1 Figure 12: Example of Switching Regulator with 12V Input Part 2 Rev. 2.0 Page 54 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply General Design Rules 6.3.1.3. Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the LE910Cx module. NOTE:

Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the LE910Cx module. Their use can lead to overvoltage on the LE910Cx and damage it. Use only Li-Ion battery types. A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks; a 100F tantalum capacitor is usually suitable. Make sure that the low ESR capacitor (usually a tantalum one) is rated at least 10V. A protection diode must be inserted close to the power input to protect the LE910Cx module from power polarity inversion. Otherwise, the battery connector must be done in a way to avoid polarity inversions when connecting the battery. The battery capacity must be at least 500 mAh to withstand the current peaks of 2A. 6.3.2. Thermal Design Guidelines The thermal design for the power supply heat sink must be done with the following specifications:

Average current consumption during RF transmission @PWR level max in LE910Cx as shown in Table 18: LE910Cx Current Consumption Average current consumption during Class10 GPRS transmission @PWR level max as shown in Table 18: LE910Cx Current Consumption Average GPS current consumption during GPS tracking (LTE @ idle): mA (40mA) NOTE:

The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly. Rev. 2.0 Page 55 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply General Design Rules NOTE:

The thermal design for the power supply must be made keeping an average consumption at the max transmitting level during calls of (LTE/HSPA)/GPRS plus average consumption in GPS Tracking mode. Considering the very low current during Idle, especially if the Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs significant current only during an Active Call or Data session. For the heat generated by the LE910Cx module, consider it to be 2W max during transmission at Class10 GPRS upload. In LTE/WCDMA/HSPA mode, the LE910Cx emits RF signals continuously during transmission. Therefore, you must pay special attention how to dissipate the heat generated. The LE910Cx is designed to conduct the heat flow from the module ICs towards the bottom of the PCB across GND metal layers The generated heat is mostly conducted to the ground plane under the LE910Cx module. The application board should be properly designed to dissipate this heat. Application board design needs to make sure the area under the LE910Cx module is as large as possible. Make sure that the LE910Cx is mounted on the large ground area of application board and provide many ground vias to dissipate the heat. Even though peak current consumption in GSM mode is higher than in LTE/WCDMA/HSPA, considerations for the heat sink are more important in the case of WCDMA due to the continuous transmission conditions. 6.3.3. Power Supply PCB Layout Guidelines As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances. The bypass low ESR capacitor must be placed close to the LE910Cx power input pads, or if the power supply is of a switching type, it can be placed close to the inductor to cut the ripple, as long as the PCB trace from the capacitor to LE910Cx is wide enough to ensure a drop-less connection even during the 2A current peaks. The protection diode must be placed close to the input connector where the power source is drained. The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks. Rev. 2.0 Page 56 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Power Supply General Design Rules Note that this is not done in order to avoid RF power loss but to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply (also introducing the noise floor at the burst base frequency) For this reason, while a voltage drop of 300-400 mV may be acceptable from the RF power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application does not have an audio interface but only uses the data feature of the LE910Cx, this noise is not so disturbing, and the power supply layout design can be more forgiving. The PCB traces to LE910Cx and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible. The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100-

500 kHz). Use a good common ground plane. Place the power supply on the board in a way to guarantee that the high current return paths in the ground plane do not overlap any noise sensitive circuitry, such as the microphone amplifier/buffer or earphone amplifier. The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables. Rev. 2.0 Page 57 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Antenna(s) GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements 7. Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the products overall performance. Read carefully and follow the requirements and guidelines for a good and proper design. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements The antenna for the LE910Cx device must meet the following requirements:

Table 19: Primary Antenna Requirements Frequency range The customer must use the most suitable antenna bandwidth for covering the frequency bands provided by the network operator and supported by the OEM while using the Telit module. The bands supported by each variant of the LE910Cx module family are provided in Section 2.6.1, RF Bands per Regional Variant. Gain Gain < 3 dBi Impedance 50 Ohm Input power

> 33 dBm(2 W) peak power in GSM

> 24 dBm average power in WCDMA & LTE VSWR absolute max <= 10:1 VSWR recommended

<= 2:1 Since there is no antenna connector on the LE910Cx module, the antenna must be connected to the LE910Cx antenna pad (AD1) by a transmission line implemented on the PCB. If the antenna is not directly connected to the antenna pad of the LE910Cx, a PCB line is required to connect to it or to its connector. This transmission line must meet the following requirements:

Table 20: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads. Rev. 2.0 Page 58 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Antenna(s) GSM/WCDMA/TD-SCDMA/LTE Antenna PCB Line Guidelines Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LE910Cx module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations. GSM/WCDMA/TD-SCDMA/LTE Antenna PCB Line Guidelines Make sure that the transmission lines characteristic impedance is 50 Ohm. Keep the line on the PCB as short as possible since the antenna line loss should be less than around 0.3 dB. Line geometry should have uniform characteristics, constant cross sections, and avoid meanders and abrupt curves. Any suitable geometry/structure can be used for implementing the printed transmission line affecting the antenna. If a ground plane is required in the line geometry, this plane must be continuous and sufficiently extended so the geometry can be as similar as possible to the related canonical model. Keep, if possible, at least one layer of the PCB used only for the ground plane. If possible, use this layer as reference ground plane for the transmission line. Surround the PCB transmission line with ground (on both sides). Avoid having other signal tracks facing the antenna line track directly. Avoid crossing any un-shielded transmission line footprint with other tracks on different layers. The ground surrounding the antenna line on the PCB must be strictly connected to the main Ground plane by means of via-holes (once per 2 mm at least) placed close to the ground edges facing the line track. Place EM-noisy devices as far as possible from LE910Cx antenna line. Keep the antenna line far away from the LE910Cx power supply lines. If EM-noisy devices are present on the PCB hosting the LE910Cx, such as fast switching ICs, take care to shield them with a metal frame cover. If EM-noisy devices are not present around the line, geometries like Micro strip or Grounded Coplanar Waveguide are preferred because they typically ensure less attenuation compared to a Strip line having the same length. Rev. 2.0 Page 59 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Antenna(s) GSM/WCDMA/LTE Antenna Installation Guidelines GSM/WCDMA/LTE Antenna Installation Guidelines Install the antenna in a location with access to the network radio signal. The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna must not be installed inside metal cases. The antenna must be installed according to the antenna manufacturers instructions. Antenna Diversity Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. Table 21: Antenna Diversity Requirements Frequency range The customer must use the most suitable antenna bandwidth for covering the frequency bands provided by the network operator and supported by the OEM while using the Telit module. The bands supported by each variant of the LE910Cx module family are provided in Section 2.6.1, RF Bands per Regional Variant Impedance 50 VSWR recommended 2:1 Since there is no antenna connector on the LE910Cx module, the antenna must be connected to the LE910Cx antenna pad by means of a transmission line implemented on the PCB. If the antenna is not directly connected at the antenna pad of the LE910Cx (AU9), a PCB line is required to connect to it or to its connector. The second Rx antenna must not be located in close vicinity of the main antenna. To improve diversity gain and isolation and to reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space within the application. NOTE:

If Rx Diversity is not used/connected, disable the Diversity functionality using the AT+XRXDIV command (refer to Ref 1: LE920x4/LE910Cx AT Command User Guide) and connect the Diversity pad AU9 to a 50 Ohm termination. Rev. 2.0 Page 60 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Antenna(s) GNSS Antenna Requirements GNSS Antenna Requirements LE910Cx supports an active antenna. It is recommended to use antennas as follow:

An external active antenna (17dB typ. Gain, GPS only) An external active antenna plus GNSS pre-filter (17dB typ. Gain) NOTE:

The external GNSS pre-filter is required for the GLONASS application. The GNSS pre-filter must meet the following requirements:

Source and load impedance = 50 Ohm Insertion loss (1575.421576.42 MHz) = 1.4 dB (Max) Insertion loss (1565.421585.42 MHz) = 2.0 dB (Max) Insertion loss (1597.55151605.886 MHz) = 2.0 dB (Max) NOTE:

It is recommended to add a DC block to the customers GPS application to prevent damage to the LE910Cx module due to unwanted DC voltage. NOTE:

It is recommended to add PI matching network near the GPS connector on the application board in case that RF matching is needed. 7.5.1. Combined GNSS Antenna The use of a combined RF/GNSS antenna is NOT recommended. This solution can generate an extremely poor GNSS reception. In addition, the combination of antennas requires an additional diplexer, which adds significant power loss in the RF path. 7.5.2. Linear and Patch GNSS Antenna Using this type of antenna introduces at least 3 dB of loss compared to a circularly polarized (CP) antenna. Having a spherical gain response instead of a hemispherical gain response can aggravate the multipath behaviour and create poor position accuracy. Rev. 2.0 Page 61 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Antenna(s) GNSS Antenna Requirements 7.5.3. Front End Design Considerations Since there is no antenna connector on the LE910Cx module, the antenna must be connected to the LE910Cx through the PCB to the antenna pad. If the antenna is not directly connected at the antenna pad of the LE910Cx, a PCB line is required. This line of transmission must meet the following requirements:

Table 22: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads. Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements. This device is to be used only for mobile and fixed application. 7.5.4. GNSS Antenna PCB Line Guidelines Ensure that the antenna line impedance is 50 Ohm. Keep the line on the PCB as short as possible to reduce the loss. The antenna line must have uniform characteristics, constant cross section, avoiding meanders and abrupt curves. Keep one layer of the PCB used only for the Ground plane; if possible. Surround (on the sides, over and under) the antenna line on the PCB with Ground. Avoid having other signal tracks directly facing the antenna line track. The Ground around the antenna line on the PCB must be strictly connected to the main Ground plane by placing vias at least once per 2mm. Place EM-noisy devices as far as possible from LE910Cx antenna line. Keep the antenna line far away from the LE910Cx power supply lines. If EM-noisy devices are around the PCB hosting the LE910Cx, such as fast switching ICs, ensure shielding the antenna line by burying it inside the layers of PCB and surrounding it with Ground planes; or shield it with a metal frame cover. If you do not have EM-noisy devices around the PCB of LE910Cx, use a Micro strip line on the surface copper layer for the antenna line. The line attenuation will be lower than a buried one. Rev. 2.0 Page 62 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Antenna(s) GNSS Antenna Requirements 7.5.5. GNSS Antenna Installation Guidelines The LE910Cx, due to its sensitivity characteristics, is capable of performing a fix inside buildings. (In any case, the sensitivity could be affected by the building characteristics i.e. shielding.) The antenna must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna must not be installed inside metal cases. The antenna must be installed according to the antenna manufacturers instructions. Rev. 2.0 Page 63 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces GNSS Antenna Requirements 8. Hardware Interfaces Table 23 summarizes all the hardware interfaces of the LE910Cx module. Table 23: LE910Cx Hardware Interfaces Interface LE910Cx SGMII HSIC For Ethernet support x1 (Optional) SD/MMC x1 dual voltage interface for supporting SD/MMC card SDIO USB SPI I2C For WIFI support (1.8V only) USB2.0, Optional OTG support Master only, up to 50 MHz For sensors, audio control UART 2 HS-UART (up to 4 Mbps) Audio I/F I2S/PCM, Analog I/O GPIO USIM ADC Antenna ports 10 ~ 27 (10 dedicated + 17 multiplexed with other signals) x2, dual voltage each (1.8V/2.85V) Up to x3 2 for Cellular, 1 for GNSS Rev. 2.0 Page 64 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 USB Port Hardware Interfaces USB Port The LE910Cx module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It can also operate with USB full-speed hosts

(12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the LE910Cx module and OEM hardware. NOTE:

The USB_D+ and USB_D- signals have a clock rate of 480 MHz. The signal traces must be routed carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value should be as close as possible to 90 Ohms differential. Table 24 lists the USB interface signals. Table 24: USB Interface Signals Signal Pad No. Usage USB_VBUS A13 Power and cable detection for the internal USB transceiver. Acceptable input voltage range 2.5V 5.5V @ max 5 mA consumption USB_D-

C15 Minus (-) line of the differential, bi-directional USB signal to/from the peripheral device USB_D+

B15 Plus (+) line of the differential, bi-directional USB signal to/from the peripheral device USB_ID A14 Used for USB OTG to determine host or client mode NOTE:

USB_VBUS input power is internally used to detect the USB port and start the enumeration process. It is a power supply pin with a maximum consumption of 5 mA. Do not use pull up or a voltage divider for sourcing this supply Rev. 2.0 Page 65 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces HSIC Interface (Optional) NOTE:

Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. NOTE:

USB OTG support is optional and is not supported by default. An external 5V power supply is required on the application board for supporting USB OTG HSIC Interface (Optional) The application processor exposes a High-Speed Inter-Chip (HSIC). HSIC eliminates the analog transceiver from a USB interface for lower voltage operation and reduced power dissipation. High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver compatible with traditional USB cable connected topologies Bidirectional data strobe signal (STROBE) Bidirectional data signal (DATA) No power consumption unless a transfer is in progress Further details will be provided in a future release of this document. SGMII Interface The SOC includes an integrated Ethernet MAC with an SGMII interface, having the following key features:

The SGMII interface can be used connect to an external Ethernet PHY, or an external switch. When enabled, an additional network interface will be available to the Linux kernels router. Further details can be found at Ref 8: ETH_Expansion_board_Application Note Rev. 2.0 Page 66 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces SGMII Interface 8.3.1. Ethernet Control interface When using an external PHY for Ethernet connectivity, the LE910Cx also includes the control interface for managing the external PHY Table 25 lists the signals for controlling the external PHY Table 25: Ethernet Control Interface Signals PAD Signal I/O Function Type Comment C2 MAC_MDC O MAC to PHY Clock 2.85V Logic Level C1 MAC_MDIO I/O MAC to PHY Data 2.85V D1 ETH_RST_N O Reset to Ethernet PHY 2.85V G4 ETH_INT_N I Interrupt from Ethernet PHY 1.8V Specifications are shown in Section 4.3.7, SIM Card Pads @2.95V, Table 16 Logic Level Specifications are shown in Table 11 NOTE:

The Ethernet control interface is shared with USIM2 port!

When Ethernet PHY is used, USIM2 port cannot be used (and vice versa). NOTE:

ETH_INT_N is a 1.8V input. It has an internal pull up to 1.8V inside the module thus it should be connected to an open drain interrupt pin of the Ethernet PHY. In case the PHY does not support 1.8V I/O, proper level shifter needs to be used. Rev. 2.0 Page 67 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Serial Ports Hardware Interfaces Serial Ports The serial port is typically a secondary interface between the LE910Cx module and OEM hardware. The following serial ports are available on the module:

Modem Serial Port 1 (Main) Modem Serial Port 2 (Auxiliary) Several serial port configurations can be designed for the OEM hardware. The most common are:

RS232 PC com port Microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) Microcontroller UART @ 3.3V/5V or other voltages different from 1.8V Depending on the type of serial port on OEM hardware, level translator circuits may be needed to make the system operate. The only configuration that does not need level translation is the 1.8V UART. The LE910Cx UART has CMOS levels as described in Section 4.3, Logic Level Specifications. 8.4.1. Modem Serial Port 1 Signals On the LE910Cx, Serial Port 1 is a +1.8V UART with 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Table 26 lists the signals of LE910Cx Serial Port 1. Table 26: Modem Serial Port 1 Signals RS232 Pin#

Signal Pad No. Name Usage 1 2 3 4 5 6 DCD -

DCD_UART RXD -

TX_UART TXD -

RX_UART N14 M15 N15 DTR -

DTR_UART M14 Data Carrier Detect Output from LE910Cx that indicates carrier presence Transmit line

*see Note Output transmit line of LE910Cx UART Receive line

*see Note Input receive line of LE910Cx UART Data Terminal Ready Input to LE910Cx that controls the DTE READY condition GND A2, B13, D4 Ground Ground DSR -

DSR_UART P14 Data Set Ready Output from LE910Cx that indicates that the module is ready Rev. 2.0 Page 68 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Serial Ports RS232 Pin#

7 8 9 Signal Pad No. Name Usage RTS -

RTS_UART L14 Request to Send Input to LE910Cx controlling the Hardware flow control CTS -

CTS_UART P15 Clear to Send Output from LE910Cx controlling the Hardware flow control RI -

RI_UART R14 Ring Indicator Output from LE910Cx indicating the Incoming call condition NOTE:

DCD, DTR, DSR, RI signals that are not used for UART functions can be configured as GPIO using AT commands. NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE:

For minimum implementations, only the TXD and RXD lines need be connected. The other lines can be left open provided a software flow control is implemented. NOTE:

According to V.24, Rx/Tx signal names refer to the application side;

therefore, on the LE910Cx side, these signal are in the opposite direction:

TXD on the application side will be connected to the receive line (here named TXD/ RX_UART) of the LE910Cx serial port and vice versa for Rx. NOTE:

The DTR pin is used to control the UART and system sleep Pulling the DTR pin low prevents the UART and the entire module from entering low power mode. DTR can be left floating if not used (DTR is internally pulled high). Rev. 2.0 Page 69 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Serial Ports Rev. 2.0 Page 70 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 8.4.2. Modem Serial Port 2 Hardware Interfaces Serial Ports On the LE910Cx, Serial Port 2 is a +1.8V UART with Rx and Tx signals only. The UART functionality is shared with SPI, thus simultaneous use of SPI and UART is not supported. Table 27 lists the signals of the LE910Cx Serial Port 2. Table 27: Modem Serial Port 2 Signals PAD Signal I/O Function Type Comment D15 TXD_AUX O Auxiliary UART (Tx Data to DTE) 1.8V E15 RXD_AUX I Auxiliary UART (Rx Data to DTE) 1.8V Shared with SPI_MOSI Shared with SPI_MISO NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE:

The Auxiliary UART is used as the SW main debug console. It is required to place test points on this interface even if not used. 8.4.3. RS232 Level Translation To interface the LE910Cx with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions:

Invert the electrical signal in both directions Change the level from 0/1.8V to +15/-15V The RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip-level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator, not a RS485 or other standards). Rev. 2.0 Page 71 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Serial Ports By convention, the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. To translate the whole set of control lines of the UART, the following is required:

2 drivers 2 receivers WARNING:

The digital input lines, operating at 1.8V CMOS levels, have absolute maximum input voltage of 2.0V. The level translator IC outputs on the module side (i.e. LE910Cx inputs) will cause damage to the module inputs if the level translator is powered with +3.8V power. So, the level translator IC must be powered from a dedicated +1.8V power supply. As an example, RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels

(example on 4 signals only). Figure 13: RS232 Level Adaption Circuitry Example NOTE:

In this case, the length of the lines on the application must be taken into account to avoid problems in the case of high-speed rates on RS232. The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure 14. Signal names and directions are named and defined from the DTE point of view. Figure 14: RS232 Serial Port Lines Connection Layout Rev. 2.0 Page 72 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Peripheral Ports Hardware Interfaces Peripheral Ports In addition to the LE910Cx serial ports, the LE910Cx supports the following peripheral ports:

I2C - Inter-integrated circuit SPI Serial Peripheral Interface SD/MMC Card Interface SDIO Interface 8.5.1. SPI Serial Peripheral Interface The LE910Cx SPI supports the following:

Master Mode only 1.8V CMOS level Up to 50 MHz clock rate NOTE:

SPI is supported only on the Linux side. The LE910Cx module supports Master mode only and cannot be configured as Slave mode. Table 28: SPI Signals PAD Signal I/O Function Type Comment F15 SPI_CLK O SPI clock output 1.8V E15 SPI_MISO I SPI data Master input Slave output D15 SPI_MOSI O SPI data Master output Slave input 1.8V 1.8V Shared with RX_AUX Shared with TX_AUX H14 SPI_CS O SPI chip-select output 1.8V Figure 15: SPI Signal Connectivity LE910Cx (Master) SPI_CS SPI_CLK SPI_MOSI SPI_MISO Host (Slave) SPI_CS SPI_CLK SPI_MOSI SPI_MISO Rev. 2.0 Page 73 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Peripheral Ports 8.5.2. I2C - Inter-integrated Circuit The LE910Cx supports an I2C interface on the following pins:

B11 - I2C_SCL B10 - I2C_SDA The I2C can also be used externally by the end customer application. In addition, SW emulated I2C functionality can be used on GPIO pins 1-10. Any GPIO

(among GPIO 1-10) can be configured as SCL or SDA. LE910Cx supports I2C Master Mode only. NOTE:

SW emulated I2C on GPIO lines is supported only from the modem side. For more information, refer to Ref 1: LE920x4/LE910Cx AT Command User Guide for command settings. NOTE:

To keep backward compatibility with previous LE910 products, it is recommended to keep using the SW emulated I2C available on GPIOs 1-10. Rev. 2.0 Page 74 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Peripheral Ports 8.5.3. SD/MMC Card Interface The LE910Cx provides an SD port supporting the SD3.0 specification, which can be used to support standard SD/MMC memory cards with the following features:

Interface with SD/MMC memory cards up to 2 TB Max clock @ 2.95V - 50 MHz SDR Max Data: 25 MB/s SD standard: HS-SDR25 at 2.95V Max clock @ 1.8V - 200 MHz SDR Max Data: 100 MB/s SD standard: UHS-SDR104 at 1.8 V Max clock @ 1.8V - 50 MHz DDR Max Data: 50 MB/s SD standard: UHS-DDR50 at 1.8 V Table 29 lists the LE910Cx SD card signals. Table 29: SD Card Signals PAD Signal I/O Function Type Comments J12 SD/MMC_CMD F12 SD/MMC_CLK O O SD command SD card clock 1.8/2.95V 1.8/2.95V E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V G13 SD/MMC_CD F13 VMMC I

-

SD card detect input 1.8V Active Low Power supply for MMC card pull-up resistors 1.8/2.95V Max Current is 50mA Rev. 2.0 Page 75 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Peripheral Ports Figure 16 shows the recommended connection diagram of the SD interface. Figure 16: SD/MMC Interface Connectivity External PS 3V VMMC 10 K 10 K 10 K 10 K 10 K GND C=100nF MicroSD DATA2 DATA3 CMD VDD VSS DATA0 DATA1 MMC_CD LE910Cx SD/MMC Interface SD/MMC_DATA2 SD/MMC_DATA3 SD/MMC_CMD SD/MMC_CLK SD/MMC_DATA0 SD/MMC_DATA1 SD/MMC_CD GND GND NOTE:

SD/MMC is supported only on the Linux side. The power supply to the SD/MMC card is to be provided by the Host application board. The LE910Cx does not provide a dedicated power supply for the SD/MMC card. VMMC Supply is limited to 50mA thus can only supply the MMC card external pull-up resistors. Pull-up resistors must be placed on the host application board. The card detection input has an internal pull-up resistor. VMMC can be used for enabling of the external power supply (LDO Enable signal) Rev. 2.0 Page 76 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 8.5.4. WiFi SDIO Interface Hardware Interfaces Peripheral Ports The LE910Cx provides an SDIO port supporting the SDIO3.0 specification, which can be used to interface with a WiFi chipset (Qualcomm QCA65x4 chipset or other WiFi solutions). The LE910Cx module includes an integrated SW driver to support the Qualcomm QCA6574 chipset. NOTE:

Qualcomm QCA9377 WiFi chipset may be supported on some of the LE910Cx variants. Please contact your Telit representative for more details. The LE910Cx SDIO port supports the SDIO 3.0 specification at 1.8V CMOS only, thus cannot be used as an external SD/MMC card connection. The LE910Cx module supports an LTE/WiFi coexistence mechanism via the WCI

(Wireless Coexistence Interface) port, which connects between the module and the external WiFi IC. For a detailed explanation, refer to Ref 5: Telit_LE920A4_LE910Cx_Wi-

Fi_Interface_Application_Note_r1. Table 30: WiFi SDIO Interface Signals PAD Signal I/O Function Type Comments N13 L13 WIFI_SD_CMD O WiFi SD Command 1.8V WIFI_SD_CLK O WiFi SD Clock 1.8V 200 MHz max. J13 WIFI_SD_DATA0 I/O WiFi SD Serial Data 0 M13 WIFI_SD_DATA1 I/O WiFi SD Serial Data 1 WIFI_SD_DATA2 I/O WiFi SD Serial Data 2 WIFI_SD_DATA3 I/O WiFi SD Serial Data 3 1.8V 1.8V 1.8V 1.8V K13 H13 L12 WIFI_SDRST O WiFi Reset / Power enable 1.8V Active Low control M8 WCI_TX O Wireless coexistence 1.8V interface TXD M9 WCI_RX I Wireless coexistence 1.8V interface RXD Rev. 2.0 Page 77 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Audio Interface The LE910Cx module supports a digital audio interface. 8.6.1. Digital Audio Hardware Interfaces Audio Interface The LE910Cx module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins:

Table 31: Digital Audio Interface (DVI) Signals PAD Signal I/O Function Type Comments B9 DVI_WA0 O Digital Audio Interface (WA0) B-PD 1.8V PCM_SYNC B6 DVI_RX I Digital Audio Interface (RX) B-PD 1.8V PCM_DIN B7 DVI_TX O Digital Audio Interface (TX) B-PD 1.8V PCM_DOUT B8 DVI_CLK O Digital Audio Interface (CLK) B-PD 1.8V PCM_CLK B12 REF_CLK O Audio Master Clock B-PD 1.8V I2S_MCLK LE910Cx DVI has the following characteristics:

PCM Master and slave modes using short or long frame sync modes 16-bit linear PCM format PCM clock rates of 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default) Frame size of 8, 16, 32, 64, 128 & 256 bits per frame Sample rates of 8 kHz and 16 kHz In addition to the DVI port, the LE910Cx module provides a master clock signal

(REF_CLK on Pin B12) which can either provide a reference clock to an external codec or form an I2S interface together with the DVI port where the REF_CLK acts as the I2S_MCLK. The REF_CLK default frequency is 12.288 MHz. When using the DVI with REF_CLK as an I2S interface, 12.288 MHz is 256 x fs (where fs

= 48 kHz) Rev. 2.0 Page 78 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Audio Interface 8.6.1.1. Short Frame Timing Diagrams Figure 17: Primary PCM Timing Table 32: PCM_CODEC Timing Parameters Rev. 2.0 Page 79 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Audio Interface 8.6.1.2. Long Frame Timing Diagrams Figure 18: Auxiliary PCM Timing Rev. 2.0 Page 80 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces Audio Interface Table 33: AUX_PCM_CODEC Timing Parameters Rev. 2.0 Page 81 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces General Purpose I/O General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways:

Input Output Alternative function (internally controlled) Input pads can only be read, reporting digital values (high / low) present on the pad at the reading time. Output pads can only be written or queried and set values on the pad output. Alternative function pads can be internally controlled by LE910Cx firmware and act according to the implementation. The following GPIOs are always available as a primary function on the LE910Cx. Table 34: Primary GPIOs PAD Signal I/O Function Type C8 GPIO_01 I/O Configurable GPIO C9 GPIO_02 I/O Configurable GPIO C10 GPIO_03 I/O Configurable GPIO C11 GPIO_04 I/O Configurable GPIO B14 GPIO_05 I/O Configurable GPIO C12 GPIO_06 I/O Configurable GPIO C13 GPIO_07 I/O Configurable GPIO K15 GPIO_08 I/O Configurable GPIO L15 GPIO_09 I/O Configurable GPIO G15 GPIO_10 I/O Configurable GPIO CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V Drive Strength Note 2-16 mA

*

2-16 mA 2-16 mA 2-16 mA 2-16 mA 2-16 mA 2-16 mA 2-16 mA 2-16 mA 2-16 mA

*

*

*

*

Rev. 2.0 Page 82 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces General Purpose I/O WARNING:

GPIOs marked with (*) should not be pulled high externally (by the carrier board) during module power on procedure. Pulling those pads high during module power up might lead to unwanted/non-operational boot mode. The additional GPIOs below can be used in case their initial functionality is not used:

Table 35: Additional GPIOs PAD Signal I/O Initial Function Alternate Function Type Drive Strength Note L12 GPIO_13 I/O WIFI_SDRST Configurable GPIO CMOS 1.8V 2-16 mA

*

N13 GPIO_14 I/O WIFI_SDIO_CMD Configurable GPIO CMOS 1.8V 2-16 mA J13 GPIO_15 I/O WIFI_SDIO_D0 M13 GPIO_16 I/O WIFI_SDIO_D1 K13 GPIO_17 I/O WIFI_SDIO_D2 H13 GPIO_18 I/O WIFI_SDIO_D3 Configurable GPIO CMOS 1.8V 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA L13 GPIO_19 I/O WIFI_SDIO_CLK Configurable GPIO CMOS 1.8V 2-16 mA M8 GPIO_24 I/O WCI_TXD M9 GPIO_25 I/O WCI_RXD R14 GPIO_31 I/O UART_RI P14 GPIO_32 I/O UART_DSR N14 GPIO_33 I/O UART_DCD M14 GPIO_34 I/O UART_DTR F15 GPIO_35 I/O SPI_CLK Configurable GPIO CMOS 1.8V 2-16 mA

*

Configurable GPIO CMOS 1.8V 2-16 mA

*

Configurable GPIO CMOS 1.8V 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA

*

Configurable GPIO CMOS 1.8V 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA Rev. 2.0 Page 83 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces General Purpose I/O PAD Signal I/O Initial Function E15 GPIO_36 I/O SPI_MISO D15 GPIO_37 I/O SPI_MOSI H14 GPIO_11 I/O SPI_CS Note Alternate Function Type Configurable GPIO CMOS 1.8V Drive Strength 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA Configurable GPIO CMOS 1.8V 2-16 mA WARNING:

GPIOs marked with (*) should not be pulled high externally (by the carrier board) during module power on procedure. Pulling those pads high during module power up might lead to unwanted/non-operational boot mode. NOTE:

LE910Cx GPIOs 1~10 can also be used as alternate I2C function. Refer to Section 8.5.2, I2C - Inter-integrated Circuit. 8.7.1. Using a GPIO Pad as Input GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device is connected with the GPIO input, the pad has interface levels different from the 1.8V CMOS. It can be buffered with an open collector transistor with a 10 k pull-up resistor to 1.8V. 8.7.2. Using a GPIO Pad as an interrupt / Wakeup source GPIO pads that are used as input can also be used as an interrupt source for the software. In general, all GPIO pads can be also used as interrupts. However, not all GPIOs can be used as a wakeup source of the module (wakeup from sleep). Only the following GPIOs can be used for waking up the system from sleep:

GPIO1 GPIO4 GPIO5 GPIO8 Rev. 2.0 Page 84 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Hardware Interfaces General Purpose I/O 8.7.3. Using a GPIO Pad as Output GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output, and therefore the pull-

up resistor can be omitted. Figure 19: GPIO Output Pad Equivalent Circuit Rev. 2.0 Page 85 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Miscellaneous Functions Indication of Network Service Availability 9. Miscellaneous Functions Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the LE910Cx module, the STAT_LED usually needs an external transistor to drive an external LED. The STAT_LED does not have a dedicated pin. The STAT_LED functionality is available on GPIO_01 pin (by default GPIO_01 functions as STAT_LED) Table 36: Network Service Availability Indication LED Status Device Status Permanently off Device off Fast blinking (Period 1s, Ton 0,5s) Net search / Not registered /

Turning off Slow blinking (Period 3s, Ton 0,3s) Registered with full service Permanently on A call is active Figure 20: Status LED Circuit Example Rev. 2.0 Page 86 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Miscellaneous Functions Indication of Software Ready Indication of Software Ready The SW_RDY signal provides indication about the ability of the module to receive commands. As long as the SW_RDY is asserted low, it indicates that the LE910Cx has not yet finished booting. Once the SW_RDY is asserted high, it indicates that the LE910Cx is ready to receive commands. The SW_RDY does not have a dedicated pin. The SW_RDY functionality is available on GPIO_08 pin (by default GPIO_08 functions as SW_RDY). RTC Real Time Clock The RTC within the LE910Cx module does not have a dedicated RTC supply pin. The RTC block is supplied by the VBATT supply. If the battery is removed, RTC is not maintained so if maintaining an internal RTC is needed, VBATT must be supplied continuously. In Power OFF mode, the average current consumption is ~25uA. VAUX Power Output A regulated power supply output is provided to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are as follows:

Table 37: Operating Range VAUX Power Supply Min Typical Max Output voltage Output current Output bypass capacitor (within the module) 1.75V 1.80V 1.85V 100 mA 1 F Rev. 2.0 Page 87 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 ADC Converter 9.5.1. Description Miscellaneous Functions ADC Converter The LE910Cx module provides three on-board 8-bit Analog to Digital converters. Each ADC reads the voltage level applied on the relevant pin, converts it and stores it into an 8-

bit word. Table 38: ADC Parameters Min Max Units Input voltage range 0.1 AD conversion Resolution

-

-

9.5.2. Using the ADC Converter 1.7 8

< 6.6 Volt bits mV An AT command is available to use the ADC function. The command is AT#ADC=1,2. The read value is expressed in mV. Refer to Ref 1: LE920x4/LE910Cx AT Command User Guide for the full description of this function. Using the Temperature Monitor Function The Temperature Monitor supports temperature monitoring by giving periodic temperature indications, to execute some function at extreme state. If properly set (see the

#TEMPMON command in Ref 1: LE920x4/LE910Cx AT Command User Guide), it raises a GPIO to High Logic level when the maximum temperature is reached. Rev. 2.0 Page 88 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Miscellaneous Functions GNSS Characteristics GNSS Characteristics Table 39 specifies the GNSS characteristics and expected performance. The values are related to typical environment and conditions. Table 39: GNSS Characteristics Parameters Typical Measurement Notes Standalone or MS Based Tracking Sensitivity Sensitivity Acquisition Cold Start Sensitivity Hot TTFF Warm Cold Accuracy Min Navigation update rate Dynamics Operation limits A-GPS

-162.3 dBm

-157.5 dBm

-157.5 dBm 1.1s 22.1s 29.94s 0.8 m 1Hz 2g 515 m/sec Supported GPS+GLONASS Simulator test GPS+GLONASS Simulator test GPS+GLONASS Simulator test GPS+GLONASS Simulator test Rev. 2.0 Page 89 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board General 10. Mounting the Module on your Board General The LE910Cx module is designed to be compliant with a standard lead-free soldering process. Finishing & Dimensions The below figure shows the mechanical dimensions of the LE910Cx module. Figure 21: LE910Cx Mechanical Dimensions (Bottom View) 4 x Route Inhibit Pin B1 Lead-free Alloy:

Surface finishing Ni/Au for all solder pads Rev. 2.0 Page 90 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Finishing & Dimensions Figure 22: LE910Cx Mechanical Dimensions (Top view) Rev. 2.0 Page 91 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Finishing & Dimensions Figure 23: LE910Cx Mechanical Dimensions (Side view) Rev. 2.0 Page 92 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Recommended Footprint for the Application Recommended Footprint for the Application Figure 24 shows the recommended footprint for the application board (dimensions are in mm). To facilitate replacing the LE910Cx module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application board in direct contact with the module. NOTE:

In the customer application, the region marked as INHIBIT WIRING in Figure 24 must be clear of signal wiring or ground polygons. Figure 24: Recommended Footprint - Top View, 181 pads 4 x Route Inhibit Rev. 2.0 Page 93 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Stencil Stencil Stencils apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 m. PCB Pad Design The solder pads on the PCB are recommended to be of the Non-Solder Mask Defined

(NSMD) type. Figure 25: PCB Pad Design Rev. 2.0 Page 94 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Recommendations for PCB Pad Dimensions (mm) Recommendations for PCB Pad Dimensions (mm) Figure 26: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro via inside the pads are allowed. Holes in pad are allowed only for blind holes and not for through holes. Table 40: Recommendations for PCB Pad Surfaces Finish Layer Thickness (um) Properties Electro-less Ni / Immersion Au 3-7 / 0.05-0.15 Good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. Solder Paste We recommend using only no clean solder paste to avoid the cleaning of the modules after assembly. Rev. 2.0 Page 95 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Solder Paste 10.7.1. Solder Reflow Figure 27 shows the recommended solder reflow profile. Figure 27: Solder Reflow Profile Rev. 2.0 Page 96 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Solder Paste Table 41: Solder Profile Characteristics Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3C/second max Preheat Temperature min (Tsmin) Temperature max (Tsmax) Time (min to max) (ts) Tsmax to TL Ramp-up rate Time maintained above:

Temperature (TL) Time (tL) Peak temperature (Tp) 150C 200C 60-180 seconds 3C/second max 217C 60-150 seconds 245 +0/-5C Time within 5C of actual peak 10-30 seconds Temperature (tp) Ramp-down rate 6C/second max Time 25C to peak temperature 8 minutes max NOTE:

All temperatures refer to the top side of the package, measured on the package body surface. WARNING:

The LE910Cx module withstands one reflow process only. Rev. 2.0 Page 97 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Mounting the Module on your Board Solder Paste 10.7.2. Cleaning In general, cleaning the module mounted on the carrier board is not recommended. Residues between module and host board cannot be easily removed with any cleaning method. Cleaning with water or any organic solvent can lead to capillary effects where the cleaning solvent is absorbed into the gap between the module and the host board or even leak inside the module (due to the gap between the module shield and PCB) . The combination of soldering flux residues and encapsulated solvent could lead to short circuits between conductive parts. The solvent could also damage the module label. Ultrasonic cleaning could damage the module permanently. Especially for crystal oscillators where the risk of damaging is very high. Rev. 2.0 Page 98 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Application Guide Debug of the LE910Cx Module in Production 11. Application Guide Debug of the LE910Cx Module in Production To test and debug the mounting of the LE910Cx module, we strongly recommend adding several test pads on the application board design for the following purposes:

Checking the connection between the LE910Cx itself and the application Testing the performance of the module by connecting it with an external computer Depending on the customer application, these test pads include, but are not limited to the following signals:

TXD RXD ON/OFF HW_SHUTDOWN_N GND VBATT TX_AUX RX_AUX USB_VBUS USB_D+

USB_D-

GPIO_09 WCI_RX In addition, the following signals are also recommended (but not mandatory):

PWRMON GPIO_01 (STAT_LED) GPIO_08 (SW_RDY) Rev. 2.0 Page 99 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Application Guide Bypass Capacitor on Power Supplies Bypass Capacitor on Power Supplies When a sudden voltage step to or a cut from the power supplies is asserted, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behaviour. The behaviour can appear differently depending on the various applications. Customers must pay special attention to this issue when they design their application board. The length and width of the power lines must be considered carefully, and the capacitance of the capacitors must be selected accordingly. The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems, such as GSM. Especially, a suitable bypass capacitor must be mounted on the following lines on the application board:

VBATT & VBATT_PA (M1, M2, N1, N2, P1, P2) USB_VBUS (Pad A13) Recommended values are:

100uF for both VBATT and VBATT_PA together 4.7uF for USB_VBUS (including the 1uF capacitor inside the module) Customers must still consider that the capacitance mainly depends on the conditions of their application board. Generally, more capacitance is required when the power line is longer. Rev. 2.0 Page 100 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 SIM Interface Application Guide SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE910Cx supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 28 illustrates in particular how to design the application side and what values to assign the components. Figure 28: SIM Schematics NOTE:

The resistor value on SIMIO pulled up to SIMVCC must be defined to be compliant with the 3GPP specification for USIM electrical testing. The LE910Cx module contains an internal pull-up resistor of 10K on SIMIO. However, the un-mounted R1 option in the application can be used to tune SIMIO timing if necessary. Table 42 lists the values of C1 to be adopted with the LE910Cx product:

Table 42: SIM Interface C1 Range Product P/N C1 Range (nF) LE910Cx 100 nF Rev. 2.0 Page 101 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Application Guide EMC Recommendations EMC Recommendations All LE910Cx signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 43 lists the characteristics. Table 43: EMC Recommendations Pad Signal I/O Function Contact Air All Pins All pins All functions 4kV 8kV Antenna F1, K1, R9 Antenna pads Analog I/O Antenna pad 4kV 4kV Appropriate series resistors must be considered to protect the input lines from overvoltage. Download and Debug Port Choose one of the following options in the design of host system to download or upgrade the Telit software and debug the LE910Cx module when it is already mounted on a host system. UART and USB interfaces Users who use both UART and USB interfaces to communicate with the LE910Cx module must implement a USB download method in the host system to upgrade the LE910Cx when it is mounted. USB interface only Users who use a USB interface only to communicate with the LE910Cx module must arrange for a USB port in the host system to debug or upgrade the LE910Cx when it is mounted. UART interface only Users who use a UART interface only to communicate with the LE910Cx module must arrange for a UART port in the host system to debug or upgrade the LE910Cx when it is mounted. Rev. 2.0 Page 102 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 11.5.1. Fast Boot mode Application Guide Download and Debug Port Fast boot mode is normally used by Telit SW to enter SW download mode Fastboot is triggered by GPIO_09 (PAD L15). Asserting this signal high (1.8V) during boot will force the system into Fastboot 11.5.2. Recovery Boot Mode Emergency boot download mode is used in case of corrupted boot image was flashed into the device or in case all other recovery modes failed to work Emergency download mode is triggered by WCI_RX signal (PAD M9). Asserting this signal high (1.8V) during boot will force the system into Emergency download. NOTE:

The application board must support accessible test pads on GPIO_09 and WCI_RX signal to enable the download recovery modes mentioned above. Rev. 2.0 Page 103 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Packing System Packing System Tray 12. Packing System Packing System Tray The LE910Cx modules are packaged on trays of 36 pieces each as shown in Figure 29. These trays can be used in SMT processes for pick & place handling. Figure 29: Packing Rev. 2.0 Page 104 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Figure 30: Tray Drawing Packing System Packing System Tray Rev. 2.0 Page 105 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Tape & Reel The LE910Cx can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. Figure 31: Module Positioning into the Carrier Packing System Tape & Reel Figure 32: Carrier Tape Detail Rev. 2.0 Page 106 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Figure 33: Reel Detail Packing System Tape & Reel Rev. 2.0 Page 107 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Figure 34: Reel Box Detail Packing System Moisture Sensitivity Moisture Sensitivity The LE910Cx module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all of the requirements for using this kind of components. Rev. 2.0 Page 108 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Safety Recommendations Moisture Sensitivity 13. Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas:

Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion, such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulations and the specific environment regulations. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product must be supplied with a stabilized voltage source and the wiring conform to the security and fire prevention regulations. The product must be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. The same caution must be taken for the SIM, checking carefully the instructions for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible for the functioning of the final product; therefore, care must be taken of the external components of the module, as well as of any project or installation issue, because of the risk of disturbing the cellular network or external devices or having any impact on safety. Should there be any doubt, refer to the technical documentation and the regulations in force. Every module must be equipped with a proper antenna with the specified characteristics. The antenna must be installed with care to avoid any interference with other electronic devices and must be installed with the guarantee of a minimum 20 cm distance from a human body. If this requirement cannot be satisfied, the system integrator must assess the final product against the SAR regulation. The European Community provides some Directives for electronic equipment introduced on the market. All the relevant information is available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm The text of the Directive 99/05 regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm Rev. 2.0 Page 109 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Conformity Assessment Issues FCC/ISED Regulatory Notices 14. Conformity Assessment Issues FCC/ISED Regulatory Notices Modification Statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the users authority to operate the equipment. Telit napprouve aucune modification apporte lappareil par lutilisateur, quelle quen soit la nature. Tout changement ou modification peuvent annuler le droit dutilisation de lappareil par lutilisateur. Interference Statement (if it is not placed in the device) This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Wireless Notice This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS102 of the ISED radio frequency (RF) Exposure rules. Antenna gain must be below:

Frequency Band Freq [MHz]

LE910C1 NA Gain [dBi]

LE910C1 NS Gain [dBi]

LE910C1/C4 NF Gain

[dBi]

850 MHz 1900 MHz 1700 MHz 900 MHz 700 MHz 600 MHz 850 1900 1700 900 700 600 3.64 2.51 5.00 5.00 5.63 N/A 6.08 8.01 5.00 N/A 5.63 N/A 6.12 8.01 5.00 N/A 5.94 5.63 This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Rev. 2.0 Page 110 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Conformity Assessment Issues FCC/ISED Regulatory Notices Le prsent appareil est conforme l'exposition aux radiations FCC / ISED dfinies pour un environnement non contrl et rpond aux directives d'exposition de la frquence de la FCC radiofrquence (RF) et RSS102 de la frquence radio (RF) ISED rgles d'exposition. Gain de l'antenne doit tre ci-dessous:

Frequency Band Freq [MHz]

LE910C1 NA Gain [dBi]

LE910C1 NS Gain [dBi]

LE910C1/C4 NF Gain

[dBi]

850 MHz 1900 MHz 1700 MHz 900 MHz 700 MHz 600 MHz 850 1900 1700 900 700 600 3.64 2.51 5.00 5.00 5.63 N/A 6.08 8.01 5.00 N/A 5.63 N/A 6.12 8.01 5.00 N/A 5.94 5.63 L'metteur ne doit pas tre colocalis ni fonctionner conjointement avec autre antenne ou autre metteur. FCC Class B Digital Device Notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the Increase the separation between the equipment and receiver. receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter module", or the word

"Contains", or similar wording expressing the same meaning, as follows:

Rev. 2.0 Page 111 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Conformity Assessment Issues FCC/ISED Regulatory Notices LE910C1 NA Contains FCC ID: RI7LE910C1NA Contains IC: 5131A-LE910C1NA LE910C1 NS Contains FCC ID: RI7LE910C1NS Contains IC: 5131A-LE910C1NS LE910C1/C4 NF Contains FCC ID: RI7LE910CXNF Contains IC: 5131A-LE910CXNF L'appareil hte doit tre tiquet comme il faut pour permettre l'identification des modules qui s'y trouvent. L'tiquette de certification du module donn doit tre pose sur l'appareil hte un endroit bien en vue en tout temps. En l'absence d'tiquette, l'appareil hte doit porter une tiquette donnant le FCC ID et le IC du module, prcd des mots Contient un module d'mission , du mot Contient ou d'une formulation similaire exprimant le mme sens, comme suit:

LE910C1 NA Contains FCC ID: RI7LE910C1NA Contains IC: 5131A-LE910C1NA LE910C1 NS Contains FCC ID: RI7LE910C1NS Contains IC: 5131A-LE910C1NS LE910C1/C4 NF Contains FCC ID: RI7LE910CXNF Contains IC: 5131A-LE910CXNF CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de classe B est conforme la norme canadienne ICES-003. Rev. 2.0 Page 112 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 15. Acronyms Acronyms FCC/ISED Regulatory Notices ADC AE Analog-to-digital converter Application-enabled CABC Content Adaptive Backlight Control DAC FDD Digital-to-analog converter Frequency division duplex GLONASS Global orbiting navigation satellite system GNSS GNSS GPIO GPRS GPS GSM I2C LTE Global navigation satellite system Global navigation satellite system General-purpose input/output General packet radio services Global positioning system Global system for mobile communications Inter-integrated circuit Long term evolution RGMII Reduced Gigabit media-independent interface SD SIM SMX Secure digital Subscriber identity module SmartMX Rev. 2.0 Page 113 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Acronyms FCC/ISED Regulatory Notices SOC SPI UART UMTS USB System-on-Chip Serial peripheral interface Universal asynchronous receiver transmitter Universal mobile telecommunications system Universal serial bus WCDMA Wideband code division multiple access WCI ADC AE DAC DTE FDD Wireless Coexistence Interface Analog-to-digital converter Application-enabled Digital-to-analog converter Data Terminal Equipment Frequency division duplex GLONASS Global orbiting navigation satellite system GNSS GPIO GPRS GPS GSM HSIC Global navigation satellite system General-purpose input/output General packet radio services Global positioning system Global system for mobile communications High-speed inter-chip Rev. 2.0 Page 114 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Acronyms FCC/ISED Regulatory Notices I2C LTE SD Inter-integrated circuit Long term evolution Secure digital SGMII Serial Gigabit media-independent interface SIM SOC SPI UART UMTS USB WCI Subscriber identity module System-on-Chip Serial peripheral interface Universal asynchronous receiver transmitter Universal mobile telecommunications system Universal serial bus Wireless Coexistence Interface WCDMA Wideband code division multiple access Rev. 2.0 Page 115 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Document History FCC/ISED Regulatory Notices 16. Document History Table 44: Document History Revision Date Changes 5 4 3 2 2018-09-16 Section 14 Adding Antenna gain and FCC ID & IC numbers for LE910C1/C4 NF. 2018-08-20 Table 1 & 4 - Added LE910C4-EU variant Section 2.3 Updated SIM interface max speed Declared HSIC interface as optional throughout the document Section 2.6.2 Updated RF frequency table Section 6.2 Added clarification related to DRX and CFUN=5 Section 8.1 - Corrected Typo related to USB_VBUS pad number Section 8.4.1- Clarified note about DTR pin 2018-07-18 Section 2.8.1 - Fixed typo related to module size General - Align cross reference links across the document 2018-06-14 Template update and pagination update Section 1.5 Updated AT Command UG reference Section 2.6.1 - Updated Band support table Section 6.3.2 - Updated Thermal design guidelines Section 8.3 - Removed optional term from Ethernet interface 1.13 2018-05-17 Added new variant LE910C1-NF Section 2.6.1 - Added band 66 support for LE910Cx-NF Section 2.6.2 - Added band 66 and band 71 to frequency table Section 3.1 - Updated value of SIM internal pullup Section 8.3 added clarification regarding Ethernet control interface logic levels Section 8.5.4 Removed note related to WIFI_SDRST Section 9.7 - Updated GNSS characteristics 1.12 2018-03-18 Replaced LE910C1 with LE910Cx throughout the document Section 2.6.1 and Table 1 - Added LE910C1-EU and LE910C4-NF variants Section 8.7 Added notes related to GPIO pullups Section 10.7.2 - Added clarification related to flux cleaning Rev. 2.0 Page 116 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Document History FCC/ISED Regulatory Notices Revision Date Changes 1.11 2018-02-22 Section 5.3.2 Updated section name Section 5.4 Added section for clarifying power down and power off procedures Section 8.6.1 Update for PCM slave mode 1.10 2017-12-27 General spelling and grammar edits throughout the document Section 2.3 Updated features list table. Section 2.4 - Fixed typo in section and inside block diagram. 1.09 2017-12-07 Section 14.1 Updated LE910C1 NA 850MHz Max antenna gain. Section 6.2.2 Corrected Class12 to Class10. 1.08 2017-11-14 Section 2.6.2 - Changed B41 to B41M Section 2.7 Renamed from Sensitivity to RF parameters and added TX output power section (2.7.2) Section 2.8 Added note regarding label thickness Section 3.1 - Removed duplication of description related to USB_VBUS. Section 5.2 Added clarification regarding ON_OFF. Section 7.5 Added note related to GPS port. Section 8.1 Added clarification regarding VBUS supply. Section 8.1.1 Added clarification regarding OTG. Section 8.3.1 Added clarification regarding ETH_INT_N pin. 1.07 1.06 1.05 1.04 2017-07-23 Adding a note for power supply section 2017-07-10 Renaming the product from LE910Cx to LE910C1 2017-06-18 Section 6.1 Updated power consumption tables 2017-05-25 Section 14.1 Added Labelling Requirements for the Host device 1.03 2017-04-23 Section 11.4:

Updated ESD values Updated Reference document table Section 8.3 - Updated Ethernet control interface information Section 8.5.2 Added note related to I2C Section 2.6.2 Updated table 4 with B25 information. Section 14.1:

Added LE910C1 NS Max antenna gain. Added LE910C1 NS FCC ID & IC number. Rev. 2.0 Page 117 of 119 2018-09-16 LE910Cx HW User Guide Doc#: 1VV0301298 Document History FCC/ISED Regulatory Notices Revision Date Changes 1.02 2017-04-03 Section 14.1 updated column Band to Frequency Band in Wireless notice table Section 8.4.1 - Added note regarding DTR 1.01 2017-02-16 Adding Section 14: FCC/ISED Regulatory notices Changing Document History section from 14 to 15 1.0 2016-12-22 Section 1.5 - Updated Related Documents table Section 5.3.4 Added Figure for SHDN_N power down timing Section 8.5.3 Added clarification about VMMC Section 9.7 - Added GNSS characteristics 0.6 0.5 2016-12-07 Remove all China variant related information 2016-12-02 Added section 9.2 to better describe SW_RDY signal Minor modifications per typos and improved description Renaming of SHDN_N pin 0.4 2016-11-30 Updated band support table Updated WIFI application note doc info Added note related to future compatibility related to few pins Updated section 3.2 - Signals That Must Be Connected Updated pinout and pin description Updated pinout layout (Figure 2) Remove HW RESET description section Updated serial port 2 section Updated SPI port section Updated 1.8V pads pull info Updated AUX UART section Updated GPIO section Updated mechanical drawing (Cosmetic) 0.3 2016-11-13 Added information for GPIO usage as Interrupt Added clarification for AUX_UART location and backward compatibility 2016-09-05 Minor edits 2016-08-30 First Draft 0.2 0.1 Rev. 2.0 Page 118 of 119 2018-09-16

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

FCCID:S5EBTV81018 ICID:9086ABTV81018 December 17th 2019 SerialLabelforBLUtagv8 LocationofBLUtagV8SerialLabel 5353 West Sam Houston Parkway North, Suite 190, Houston, TX 77041 www.stopllc.com P:832-553-9500 F: 832-553-9530 BLUtagV8SerialTagLabel StephenFreathy VPEngineering 5353 West Sam Houston Parkway North, Suite 190, Houston, TX 77041 www.stopllc.com P:832-553-9500 F: 832-553-9530

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

December 3rd 2019 Telecommunication Certification Body TUV Rheinland of North America 1279 Quarry Lane Pleasanton, CA 94566 Date: 3rd December 2019 Subject: Confidentiality Request for FCC ID: S5EBTV81018 and 9086A-BTV81018 Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC/IC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent Permanent Permanent Permanent Permanent Permanent Exhibit Block Diagrams Internal Photos Operation Description/Theory of Operation Tune-Up Procedure Schematics Users Manual BOM/Part list Satellite Tracking of People LLC has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of 90 days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TUV Rheinland in the event information regarding the product or the product is made available to the public. TUV Rheinland will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. Sincerely, Stephen Freathy VP Engineering 5353 West Sam Houston Parkway North, Suite 190, Houston, TX 77041 www.stopllc.com P:832-553-9500 F: 832-553-9530

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Dec23,2019 DearFCCExaminer, WeareapplyingforFCCcertificationofourAnkleWornElectronicTrackingDevicewith FCCID:S5EBTV81018;

TheDeviceisbasedonthefollowingprecertifiedradiomodules, MurataWiFi/BluetoothwithFCCIDVPYLB1LD,singlemodularapproval,grantissued05/26/2017, TelitWCDMAandLTEcellularwirelessmodulewithFCCIDRI7LE910CXNF,singlemodularapproval, grantissued10/18/2018 AndisinadditionequippedwithaLoRa915MHzradio. BasedonFCCKDB996369D02ModuleQ&A1andduetodocumentedequalityoftheWiFi/Bluetoothand thecellularradioportionsweclaimvalidityofalltestresultsfromthefollowingtestreportsasfiledforthe initialapproval FiledunderFCCID:VPYLB1LD:

#17040026JMA001,rev.5/2/2017,ofIntertekJapanK.K. FiledunderFCCID:RI7LE910CXNF:

#1870209RHPUSP17V00A,8/23/2018,ofDEKRATestingandCertificationCo.,Ltd... Weconfirmthattheabovelistedprecertifiedradiomodulesareintegratedstrictlyaccordingtothe respectiveintegrationmanualsandaccordinggrantconditions,andthus,thattheleveragedtestresults fromtheabovelistedreportsarerepresentativeforthesameradiosbeingpartofourendproduct. Radiatedspuriousemissionsandoutputpowertestinghasbeenappliedforverificationofcontinued compliance,asdocumentedintherelevantEMCandSARreportsfiledwiththisapplication. SinceourendproductwillbeusedinanklewornpositionSARtestinghasbeenappliedasdocumentedin theSARreportfiledwiththisapplication. StephenFreathy VPEngineering SatelliteTrackingofPeopleLLC 5353WSamHoustonParkwayN,Suite190Houston,Texas77041P|(832)5539500

 

 

December 3rd 2019 Telecommunication Certification Body TUV Rheinland of North America 1279 Quarry Lane Pleasanton, CA 94566 Date: 3rd December 2019 Authority to Act as Agent To Whom It May Concern:

I appoint William H. Graff Of TUV, to act as our agent in the preparation of this application for equipment certification. I certify that submitted documents properly describe the device or system for which equipment certification is sought. I also certify that each unit manufactured, imported or marketed, as defined in the FCC or Industry Canadas regulations will have affixed to it a label identical to that submitted for approval with this application. For instances where our authorized agent signs the application for certification on our behalf, I acknowledge that all responsibility for complying with the terms and conditions for Certification, as specified by TUV Rheinland Group, still resides with Satellite Tracking of People LLC, 5353 West Sam Houston Parkway North, Suite 190, Houston 77041 For TCB applications, We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002 (b), to the application is subject to denial of federal benefits, that includes FCC benefits. Thank you, Agency Agreement Expiration Date: December 3rd 2020 Sincerely, Stephen Freathy VP Engineering Satellite Tracking of People LLC 5353 West Sam Houston Parkway North, Suite 190, Houston, TX 77041 www.stopllc.com P:832-553-9500 F: 832-553-9530

 

 

 

 

 

 

Installation Manual Antenna Discription We got approval by the antenna in the pattern of the figure. When using our authorization ID, it is necessary to use an equivalent antenna pattern. Used for tuning antenna gain

* Antenna peak gain should be 0 dBi or less

 

 

User Manual Model Number : Type1LD FCC ID and IC Number for this product is as follows. FCC ID: VPYLB1LD IC : 772C-LB1LD For OEM integration only device cannot be sold to general public. Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in the Installation manual Notice. Please describe the following warning on the final product which contains this module. Contains Transmitter Module FCC ID:VPYLB1LD or Contains FCC ID: VPYLB1LD Contains IC: 772C-LB1LD This device complies with part 15 of FCC Rules and Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme la partie 15 des rgles de la FCC et aux normes des CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'appareil doit accepter tout brouillage subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. When the product is small, as for these words mentioned above, the posting to a manual is possible. Please describe the following warning to the manual. FCC CAUTION Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter. When installing it in a mobile equipment. Please describe the following warning to the manual. This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency

(RF) Exposure Guidelines and RSS-102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and operated keeping the radiator at least 20cm or more away from persons body. Cet quipement est conforme aux limites dexposition aux rayonnements nonces pour un environnement non contrl et respecte les rgles les radiolectriques (RF) de la FCC lignes directrices d'exposition et dexposition aux frquences radiolectriques (RF) CNR-102 de lIC. Cet quipement doit tre install et utilis en gardant une distance de 20 cm ou plus entre le radiateur et le corps humain. When installing it in a portable equipment. FCCClass II permissive change application and SAR test are necessary. IC Class II permissive change application and SAR test are necessary. Please contact Murata. Note) Portable equipment : Equipment for which the spaces between human body and antenna are used within 20cm. Mobile equipment : Equipment used at position in which the spaces between human body and antenna exceeded 20cm.