Bluetooth Class 1 OEM Module Parani-BCD110 Product Datasheet Version 1.0.0 February 9, 2012 Sena Technologies, Inc. PARANI-BCD110 Copyright Copyright 2012, Sena Technologies, Inc. All rights reserved. Sena Technologies reserves the right to make changes and improvements to its product without providing notice. Trademark Parani is a trademark of Sena Technologies, Inc. Windows is a registered trademark of Microsoft Corporation. Notice to Users When a system failure may cause serious consequences, protecting life and property against such consequences with a backup system or safety device is essential. The user agrees that protection against consequences resulting from system failure is the user's responsibility. This device is not approved for life-support or medical systems. Changes or modifications to this device not explicitly approved by Sena Technologies will void the user's authority to operate this device. Precautions and Safety Do not drop or subject the device to impact. Damage to your products may result from improper use. Keep away from harsh environments including humid, dusty, and smoky areas. Damage to your products may result from improper use. Do not use excessive force on the buttons or attempt to disassemble the device. Damage to your products may result from improper use. Do not place heavy objects on the product. Damage to your products may result from improper use. Contact Information Technical support email: support@sena.com Company website: http://www.sena.com Page 2 of 26 PARANI-BCD110 Contents 1. General .......................................................................................................................................................... 4 1.1 Features ............................................................................................................................................... 4 1.2 Applications .......................................................................................................................................... 4 1.3 Device Diagram .................................................................................................................................... 5 1.4 Pin Diagram .......................................................................................................................................... 5 1.5 Pin Descriptions.................................................................................................................................... 6 1.6 Dimensions and PCB land pattern ....................................................................................................... 8 2. Electrical characteristics ............................................................................................................................... 11 2.1 Absolute maximum ratings .................................................................................................................. 11 2.2 Recommended operating conditions ................................................................................................... 11 2.3 Power Consumptions .......................................................................................................................... 11 3. RF Characteristics ....................................................................................................................................... 12 3.1 Basic Data Rate .................................................................................................................................. 12 3.1.1 Transmitter Performance .......................................................................................................... 12 3.1.2 Transceiver ............................................................................................................................... 12 3.1.3 Receiver Performance ............................................................................................................. 12 3.2 Enhanced Data Rate .......................................................................................................................... 13 3.2.1 Transmitter performance .......................................................................................................... 13 3.2.2 Receiver performance .............................................................................................................. 14 4. Device Terminal Descriptions ...................................................................................................................... 15 4.1 UART Interface ................................................................................................................................... 15 4.2 USB Interface ..................................................................................................................................... 15 4.3 I2C Interface ....................................................................................................................................... 16 4.4 PCM CODEC Interface ...................................................................................................................... 16 4.5 I/O Parallel Ports ................................................................................................................................ 16 4.6 Reset Interface ................................................................................................................................... 17 5. Application Schematic.................................................................................................................................. 18 6. Software Stack ............................................................................................................................................. 21 7. Solder Profiles ............................................................................................................................................. 22 8. Packaging Information ................................................................................................................................. 23 9. Certificate Information ................................................................................................................................. 25 9.1 FCC .................................................................................................................................................... 25 9.1.1 FCC Compliance Statement ............................................................................................... 25 9.1.2 RF Exposure Statement ..................................................................................................... 25 9.1.3 Do not ................................................................................................................................. 25 9.2 CE .................................................................................................................................................. 26 9.3 IC ................................................................................................................................................... 26 9.4 KC .................................................................................................................................................. 26 9.5 TELEC ........................................................................................................................................... 26 9.6 SIG ................................................................................................................................................. 26 Page 3 of 26 PARANI-BCD110 1. General The Parani-BCD110 is a Bluetooth Class 1 OEM module for OEM manufacturers who want to implement Bluetooth Class 1 functionality with their products cost effectively and also in timely manner. Users can build their own antenna circuit around the BCD110 to lower the overall cost while benefit from the BCD110s field-
proven standard SPP (Serial Port Profile) firmware provided with no additional cost. The BCD110 supports Class 1 Bluetooth transmission level for longer communication distance typically ranges from 100 m up to 1 km. The BCD110 supports UART, USB, I2C, PCM, PIO interfaces for the communication with the OEM products. The BCD110 is provided with Bluetooth v2.0 compatible firmware runs internally for SPP (Serial Port Profile) applications by default. The SPP firmware supports up to 4 simultaneous multiple connections and is designed to work out-of-box for real world SPP applications such as POS (Point-of-sales), industrial automation, remote metering and other various applications. Optionally, the BCD110 can be supplied with only software stack up to HCI level so entire Bluetooth stack runs on the host side for the application such as USB dongles for computers, or OEM manufacturers can even develop and embed their own firmware into the BCD110. The BCD110 is fully qualified with Bluetooth v.2.0+EDR specification so OEM manufacturers can save cost and time for overall OEM product certifications, which makes the BCD110 ideal solution for larger volume and cost sensitive applications. 1.1 Features Bluetooth Class 1 Fully qualified with Bluetooth v2.0 + EDR specification Transmit Power: max. +20dBm Receive sensitivity: -90dBm (0.1% BER) Size: DIP type 16.8 x 34.6 x 7.5mm - with shield can SMD type 14.8 x 34.6 x 3.0mm - with shield can Integrated variable antennas Integrated 8Mbit Flash Memory Extended operating temperature range: -40C ~ +85C USB, Dual UART, I2C, PCM, PIO interfaces 802.11 co-existence Field-proven SPP (Serial Port Profile) firmware supporting up to 4 simultaneous multiple connections RoHS Compliant 1.2 Applications High-speed data transceiver systems for long distance communication PCs/Personal Digital Assistants (PDA) Bluetooth USB dongle Bluetooth serial dongle Bluetooth access points Remote metering devices POS (Point-of-sales) devices Industrial automation devices Page 4 of 26 1.3 Device Diagram PARANI-BCD110 2402 ~ 2480MHz Parani-BCD110 2.4GHz Antenna RF_IN/OUT RF Amplifier Circuit 5dBi dipole 3dBi dipole 1dBi stub 0dBi chip LNA PA RAM 2.4GHz Radio Baseband DSP IO Voltage Regulator 1.8V core MCU BlueCore4 External USB UART SPI PIO PCM Interface Pad or connector Crystal 26MHz Flash Memory 8Mb VCC 3.3V Figure 1-1 Device Diagram 1.4 Pin Diagram Figure 1-2 Pin diagram Page 5 of 26 1.5 Pin Descriptions Function USB Interface Pin Name USB_DP USB_DN SPI Interface PCM Interface PIO Interface UART Interface UART_TXD UART_RXD UART_RTS UART_CTS PCM_OUT PCM_IN PCM_SYNC PCM_CLK SPI_MISO SPI_MOSI SPI_CSB SPI_CLK PIO_2 PIO_3 PIO_4 PIO_5 PIO_6 PIO_7 PIO_8 PIO_9 PIO_10 PIO_11 AIO_0 AIO_1 PVCC
+3V3 GND AIO Power Others PARANI-BCD110 Pin Number Description 11 10 8 7 6 9 15 12 13 14 20 23 22 21 29 28 24 25 26 27 30 31 32 33 4 5 3 16 1, 2, 17, 19 34, 35, 36 USB data plus USB data minus UART data output UART data input UART request to send active low UART clear to send active low Synchronous data output Synchronous data input Synchronous data sync Synchronous data clock SPI data output SPI data input Chip select for SPI, active low SPI clock Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Analogue programmable input/output line Analogue programmable input/output line Power supply for power amplifier, 3.3V Power supply for system, 3.3V Ground RESETB 18 Reset, active low, > 5ms to cause a reset Table 1-1 Pin descriptions Page 6 of 26 Function Pin Name USB UART PCM SPI PIO AIO Others USB_DP USB_DN UART_TXD UART_RXD UART_RTS UART_CTS PCM_OUT PCM_IN PCM_SYNC PCM_CLK SPI_MISO SPI_MOSI SPI_CSB SPI_CLK PIO_2 PIO_3 PIO_4 PIO_5 PIO_6 PIO_7 PIO_8 PIO_9 PIO_10 PIO_11 AIO_0 AIO_1 RESETB PARANI-BCD110 STATE Define (SPP)
UART_TXD UART_RXD UART_RTS UART_CTS
UART_DCD UART_DTR UART_DSR FACTORY_RESET BT_MODE F/C_CTRL
STATUS_LED0 STATUS_LED1
RESETB Direction Input Input Output Input Output Input Output Input Input Input Output Input Input Input Output Output Input Input Input Output Input Input Output Output Output Output Input Pull-up/down Weak pull-up Weak pull-up Tri-stated with weak pull-up Weak pull-down Tri-stated with weak pull-up Weak pull-down Tri-stated with weak pull-down Weak pull-down Weak pull-down Weak pull-down Tri-stated with weak pull-down Weak pull-down Weak pull-up Weak pull-down Weak pull-down Weak pull-down Weak pull-up Weak pull-up Weak pull-up Weak pull-up Weak pull-down Weak pull-down Weak pull-down Weak pull-down Driving low Driving low Weak pull-up Table 1-2 Pin States on Reset (SPP) Page 7 of 26 1.6 Dimensions and PCB land pattern PARANI-BCD110 Figure 1-3 BCD110SU Dimensions Figure 1-4 BCD110DU Dimensions Figure 1-5 BCD110SC Dimensions Figure 1-6 BCD110DC Dimensions Page 8 of 26 PARANI-BCD110 Figure 1-7 BCD110DS Dimensions
[SMD Type] [DIP Type]
Figure 1-8 Recommended Land Pattern Page 9 of 26 PARANI-BCD110 Figure 1-4 Recommended Board Layout
*BCD110SU, DU, DS has no keep-out area. Model despription Model name Interface Connector Antenna Type1 Type2 Type3 Parani-BCD110DU DIP, pin U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110DS DIP, pin RPSMA 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110DC DIP, pin CHIP 0dBi Chip Parani-BCD110SU SMD, pad U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110SC SMD, pad CHIP 0dBi Chip Page 10 of 26 2. Electrical characteristics 2.1 Absolute maximum ratings Ratings Storage Temperature Operating Temperature Supply voltage PVCC
+3V3 Min
-40
-40
-0.4
-0.4 Max
+85
+85 3.6 3.6 Other terminal voltages GND 0.4
+3V3 +0.4 Table 2-1 Absolute maximum ratings 2.2 Recommended operating conditions Ratings Operating Temperature Supply voltage Supply current PVCC
+3V3 UART USB PVCC
+3V3 Min
-40 2.7 2.7 3.0 3.1 100 40 Typ 25 3.3 3.3 3.3 3.3 150 50 Max
+85 3.6 3.6 3.6 3.6 200 100 PARANI-BCD110 Unit C C V V V Unit C V V V V mA mA Table 2-2 Recommended operating conditions
* Total current consumption = operating mode: max 100mA, test mode: max. 200mA 2.3 Power Consumptions Role
Operation Mode Inquiry and page Scan Power on (Standby) Connectable Mode(Mode3) Connected (No data) Connected (file transfer) Connected (file transfer) UART Rate(kbps) 115.2 115.2 115.2 115.2-
115.2 9.6 Current 76 2 18 15 45 55 Unit mA mA mA mA mA mA Table 2-3 Power consumptions (SPP) Page 11 of 26 3. RF Characteristics 3.1 Basic Data Rate 3.1.1 Transmitter Performance RF Characteristics PVCC = 3.3V, 25C Output power Power Density Power Control TX Output Spectrum-Frequency range TX Output Spectrum-20dB Bandwidth Adjacent Channel Power F = F0 2MHz F = F0 3MHz F = F0 > 3MHz f1avg f2avg f2avg/f1avg Modulation Characteristics Initial Carrier Frequency Tolerance Carrier Frequency Drift Drift rate 1 slot Freq Drift 5 slot Freq Drift PARANI-BCD110 Min Typ Max 16 16 3 2402
145 115 0.8
-20
-20
-25
-40 18 18 4
900
165 155 0.95
19 19 6 2480
-20
-40
-40 175
20 20 25 40 Bluetooth Specification 20 20 2 step 8 2400 ~2483.5 1000
-20
-40
-40 140 f1avg 175 f2avg 115
(f1avg/f2avg) 0.8 75 20 25 40 Unit dBm dBm dB MHz kHz dBm dBm dBm kHz kHz
kHz kHz/50s kHz kHz Table 3-1 Transmitter performance at basic data rate 3.1.2 Transceiver RF Characteristics PVCC = 3.3V, 25C Out of band Spurious Emissions 0.030-1.000GHz 1.000-12.75GHz 1.800-5.100GHz 5.100-5.300GHz Min Typ Max
-36
-30
-47
-47
Bluetooth Specification
-36
-30
-47
-47 Table 3-2 Transceiver at basic data rate 3.1.3 Receiver Performance RF Characteristics Temperature 25C Sensitivity - Single slot packets (0.1%) Sensitivity - Multi slot packets (0.1%) C/I performance at 0.1% BER co-channel F = F0 + 1MHz F = F0 1MHz Min Typ Max
-90
-90
-70
-70
-11 0 0 Page 12 of 26 Bluetooth Specification
-70
-70
-11 0 0 Unit dBm dBm dBm dBm Unit dBm dBm dB kHz dB PARANI-BCD110 Blocking performance F = F0 + 2MHz F = F0 2MHz F = F0 3MHz F = F0 + 5MHz F = FImage 0.030-2.000GHz 2.000-2.400GHz 2.500-3.000GHz 3.000-12.75GHz Inter-modulation performance Maximum input level at 0.1% BER
-10
-27
-27
-10
-39
-20
0
-20
-30
-40
-40
-9
-20
-30
-40
-40
-9
-10
-27
-27
-10
-39
-20 Table 3-3 Receiver Performance at basic data rate 3.2 Enhanced Data Rate 3.2.1 Transmitter performance RF Characteristics PVCC = 3.3V, Temperature 25C Maximum RF Transmit Power Relative Transmit Power Carrier Frequency Stability
/4 DQPSK 8DPSK Modulation Accuracy
/4 DQPSK 8DPSK
| 0 |
| i |
| 0 + i |
| 0 |
| i |
| 0 + i |
RMS DEVM 99% DEVM Peak DEVM RMS DEVM 99% DEVM Peak DEVM EDR Differential Phase Encoding In-band Spurious Emissions
(8DPSK) F F0 + 3MHz F < F0 + 3MHz F = F0 3MHz F = F0 2MHz F = F0 1MHz F = F0 + 1MHz F = F0 + 2MHz F = F0 + 3MHz Min Typ Max
-2
-4
-10
-75
-75
-10
-75
-75
99
2
1 10 75 75 10 75 75 20 30 35 13 20 25
-40
-40
-40
-20
-26
-26
-20
-40 Bluetooth Specification
-6 to +4
-4 to +1 10 for all blocks 75 for all packets 75 for all blocks 10 for all blocks 75 for all packets 75 for all blocks 20 30 35 13 20 25 99
-40
-40
-40
-20
-26
-26
-20
-40 Table 3-4 Transmitter performance at enhanced data rate Page 13 of 26 dB dB dB dB dB dBm dBm dBm dBm dBm dBm Unit dB dB kHz kHz kHz kHz kHz kHz
dBm dBm dBm dBm dB dB dBm dBm 3.2.2 Receiver performance PARANI-BCD110
/4 DQPSK 8DPSK
/4 DQPSK 8DPSK RF Characteristics Temperature 25C Sensitivity at 0.01% BER BER floor performance C/I Performance
(co-channel at 0.1% BER) C/I Performance
(Adjacent Channel Selectivity) F = F0 + 1MHz /4 DQPSK F = F0 1MHz /4 DQPSK F = F0 + 2MHz /4 DQPSK 8DPSK 8DPSK 8DPSK F = F0 2MHz /4 DQPSK 8DPSK F F0 + 3MHz /4 DQPSK F F0 5MHz F = FImage Maximum input level at 0.1% BER 8DPSK
/4 DQPSK 8DPSK
/4 DQPSK 8DPSK
/4 DQPSK 8DPSK Min Typ Max Bluetooth Unit Specification
-20
-20
-88
-85
-70
-70
-60 13 21 0 5 0 5
-30
-25
-20
-13
-40
-33
-40
-33
-7 0
-70
-70
-60
+13
+21 0
+5 0
+5
-30
-25
-20
-13
-40
-33
-40
-33
-7 0
-20
-20 dBm dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm Table 3-5 Receiver performance at enhanced data rate Page 14 of 26 PARANI-BCD110 4. Device Terminal Descriptions 4.1 UART Interface UART (Universal Asynchronous Receiver and Transmitter) interface provides a simple mechanism for communicating with other serial device using the RS232 protocol. When BCD110 is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS, UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. All UART connections are implemented using CMOS technology and have signaling levels of 0V and 3.3V Minimum Maximum Parameter Baud Rate Flow Control Parity Number of Stop Bits Bits per Channel Possible Values 1200 baud (2%Error) 3M baud (1%Error) RTS/CTS or None None, Odd or Even 1 or 2 8 Table 4-1 Possible UART Settings 4.2 USB Interface BCD110 USB devices contain a full speed (12Mbits/s) USB interface that is capable of driving of a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented behave as specified in the USB section of the Bluetooth specification v2.0+EDR or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. As USB is a Master/Slave oriented system (in common with other USB peripherals), BCD110 only supports USB slave operation. The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to the internal USB I/O buffers of the BCD110, therefore, have low output impedance. To match the connection to the characteristic of the USB cable, resistors must be placed in series with USB_DP/USB_DN and the cable. BCD110 features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when BCD110 is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with section 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15K5%
pull-down resistor (in the hub/host) when VDD_PADS=3.1V. This presents a Thevenin resistance to the host of at least 900. Page 15 of 26 PARANI-BCD110 4.3 I2C Interface PIO[8:6] can be used to form a mater I2C interface. The interface is formed using software to drive these lines. Therefore, it is suited only to relatively slow functions such as driving a dot matrix LCD (Liquid Crystal Display), keyboard scanner or EEPROM. Notes:
PIO lines need to be pull-up through 2.2K resistors. PIO[7:6] dual functions, UART bypass and EEPROM support, therefore, devices using an EEPROM cannot support UART bypass mode. For connection to EEPROMs, refer to CSR documentation on I2C EEPROM for use with BlueCore. This provides information on the type of devices currently supported. 4.4 PCM CODEC Interface PCM (Pulse Code Modulation) is a standard method used to digitize audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, BCD110 has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. BCD110 offers a bi-directional digital audio interface that route directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on BCD110 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any on time. BCD110 can operate as PCM interface Master generating an output clock of 128, 256, or 512kHz. When configured as PCM interface slave, it can operate with an input clock up to 2048kHz. BCD110 is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. BCD110 interfaces directly to PCM audio devices including the following:
Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices OKI MSM7705 four channel A-raw and u-law CODEC Motorola MC145481 8-bit A-law and u-law CODEC Motorola MC145483 13-bit linear CODEC STW 5093 and 5094 14-bit linear CODECs BCD110 is also compatible with the Motorola SSITM interface 4.5 I/O Parallel Ports PIO lines can be configured through software to have either weak or strong pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. PIO_6 or PIO_2 can be configured as a request line for an external clock source. This is useful when the clock to BCD110 is provided from a system ASIC (Application Specific Integrated Circuit). Using PSKEY_CLOCK_REQUEST_ENABLE (0x246), this terminal can be configured to be low when BCD110 is in Deep Sleep and high when a clock is required. The clock must be supplied within 4ms of the rising edge of PIO_6 or PIO_2 to avoid losing timing accuracy in certain Bluetooth operating modes. Page 16 of 26 PARANI-BCD110 BCD110 has three general purpose analogue interface pins, AIO_0 and AIO_1. These are used to access internal circuitry and control signals. One pin is allocated to decoupling for the on-chip band gap reference voltage, the other two may be configured to provide additional functionality. 4.6 Reset Interface BCD110 may be reset from several sources: RESETB pin, power on reset, a UART break character or via a software configured watchdog timer. The RESETB pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. The power on reset occurs when the VDD_CORE supply falls below typically 1.5V and is released when VDD_CORE rises above typically 1.6V. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The PIOs have weak pull-downs. Page 17 of 26 5. Application Schematic PARANI-BCD110 Figure 5-1 BT Module Interface Figure 5-2 Power Supply and Reset Interface Page 18 of 26 PARANI-BCD110 Figure 5-3 RS232 Serial Interface Figure 5-4 MICOM UART Interface Page 19 of 26 PARANI-BCD110 Figure 5-5 USB Interface Figure 5-6 I2C Interface Figure 5-7 PCM Interface Page 20 of 26 PARANI-BCD110 6. Software Stack BCD110 is provided with Bluetooth v2.0 compatible firmware runs internally for SPP (Serial Port Profile) applications by default. The firmware is designed to work out-of-box for real world SPP applications such as POS (Point-of-sales), industrial automation, remote metering and other various applications. The SPP firmware can be configured and controlled by typical AT commands. Users can easily configure BCD110 by using a terminal program such as HyperTerminal and can use Bluetooth wireless communication without modifying users existing serial communication program. In addition to the basic AT commands, BCD110 provides some expanded AT commands for various functions. User friendly ParaniWizard and ParaniWIN are also provided for easy setup on Microsoft Windows. To run AT commands on the BCD110, the BCD110 should be connected to the serial port of the users own board or equivalent to carry the BCD110. The SPP firmware provided with the BCD110 is identical to the firmware of the Parani-ESD100V2 and Parani-ESD110V2. To shorten the overall development cycle or for quick verification during or before own development work, users might want to try ESD100V2/110V2 starter kits first for convenience. Also, please refer to the ESD100V2/110V2 users manual for overall concept, configuration and complete AT commands list of the SPP firmware. The ESD100V2/110V2 users manual can be downloaded from Sena support home page at http://www.sena.com/support/downloads/. Optionally, the BCD110 can be supplied with only software stack up to HCI level so users can develop and embed their own firmware version into the BCD110 or entire Bluetooth stack runs on the host side for the application such as USB dongle for computers. Regarding these custom firmware options, please contact a Sena representative for more detail. UART t s o H SPP Firmware RFCOMM L2CAP HCI Link Manager Baseband/Link Control Radio PCM I/O USB UART t s o H HCI Link Manager Baseband/Link Control Radio Figure 6-1 SPP Firmware Bluetooth software stack Figure 6-2 HCI firmware Bluetooth Software Stack Page 21 of 26 PARANI-BCD110 7. Solder Profiles The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder re-flow. There are four zones:
Preheat Zone This zone raises the temperature at a controlled rate, typically 1-2.5C /s Equilibrium Zone This zone brings the board to a uniform temperature and also activates the flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimize the out gassing of the flux. Reflow Zone The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. Cooling Zone The cooling rate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical rates will be 2-5C/s Figure 7-1 Typical Lead-Free Re-flow Solder Profile Key features of the profile:
Initial Ramp = 1-2.5C/sec to 175C25C equilibrium Equilibrium time = 60 to 180 seconds Ramp to Maximum temperature (245C) = 3C/sec max. Time above liquids temperature (217C): 45~90 seconds Device absolute maximum reflow temperature: 260C The BCD110 will withstand the specified profile up to two reflows to a maximum temperature of 260C Page 22 of 26 8. Packaging Information PARANI-BCD110 Figure 8-1 Tape Information Page 23 of 26 PARANI-BCD110 TBD Figure 8-2 Reel Information Page 24 of 26 PARANI-BCD110 9. Certificate Information 9.1 FCC FCC Rule: Part 15 Subpart C Section 15.247 FCCID: S7AIW02 9.1.1 FCC Compliance Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, Including interference that may cause undesired operation Information to User This equipment has been tested and found to comply with limits for a Class B digital device, Pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by on or more of the following measures:
- Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver-Connect the equipment into an outlet a circuit different form that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. 9.1.2 RF Exposure Statement The equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. 9.1.3 Do not Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void users authority to operate the equipment. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operate in conjunction with any other antenna or transmitter. As such, the radio component of this device is intended only for OEM integrators under the following two conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (e.g., digital device emissions, PC peripheral requirements). In the event that these conditions cannot be met (for example, co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following :
Contains Transmitter Module FCC ID: S7AIW02. The radio component is an integral part of the Parani-BCD110DU and cannot be removed. Page 25 of 26 PARANI-BCD110 9.2 CE 1177 9.3 IC Declare under our own responsibility that the product Bluetooth Module Brand name: SENA Model No.:
Parani-BCD110DU / Parani-BCD110DC / Parani-BCD110DS Parani-BCD110SU / Parani-BCD110SC To which this declaration refers conforms with the relevant standards or other standardizing documents EN 60950-1 ETSI EN 301 489-1 ETSI EN 301 489-17 ETSI EN 300 328 According to the regulations in Directive 1999/5/EC This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Radio Cert. No.: IC: 8154A-IW02 9.4 KC Type Registration Certification No: KCC-CRM-SNA-IW02 9.5 TELEC Technical Regulations for Specified Radio Equipment Article 2, Section 1 (19) Certification No:
9.6 SIG QDID: B016862 Model Name: Parani-BCD110 Core Version: 2.0+EDR Product Type: End Product Declared Specifications: Baseband Conformance, Radio, Service Discovery Protocol, Logical Link Control and Adaption Protocol, Generic Access Profile, Link Manager, RFCOMM, Serial Port Profile, Host Controller Interface, Summary ICS, Product Type Page 26 of 26