| all | frequencies |
|
|
|
|
|
exhibits | applications |
|---|---|---|---|---|---|---|---|---|
| manual | photos | label | ||||||
| app s | submitted / available | |||||||
|---|---|---|---|---|---|---|---|---|
| 1 2 3 |
|
User Manual | Users Manual | 1.35 MiB | January 18 2021 / July 17 2021 | delayed release | ||
| 1 2 3 |
|
Photographs - internal | Internal Photos | 383.69 KiB | January 18 2021 / July 17 2021 | delayed release | ||
| 1 2 3 |
|
FCC - Letter - Modular approval 2 | External Photos | 436.68 KiB | January 18 2021 | |||
| 1 2 3 |
|
Photographs - external | External Photos | 5.29 MiB | January 18 2021 / July 17 2021 | delayed release | ||
| 1 2 3 |
|
Product label design | ID Label/Location Info | 1.21 MiB | January 18 2021 | |||
| 1 2 3 |
|
66697REM.001 | Test Report | 1.33 MiB | January 18 2021 | |||
| 1 2 3 |
|
66697REM.001 Photographs | Test Setup Photos | 339.82 KiB | January 18 2021 / July 17 2021 | delayed release | ||
| 1 2 3 | Bill of Materials | Parts List/Tune Up Info | January 18 2021 | confidential | ||||
| 1 2 3 | Block diagram | Block Diagram | January 18 2021 | confidential | ||||
| 1 2 3 | Electrical Diagrams | Schematics | January 18 2021 | confidential | ||||
| 1 2 3 |
|
FCC - Agent letter | Cover Letter(s) | 108.60 KiB | January 18 2021 | |||
| 1 2 3 |
|
FCC - Letter - Confidentiality request | Cover Letter(s) | 508.34 KiB | January 18 2021 | |||
| 1 2 3 |
|
FCC - Letter - Modular approval 1 | Cover Letter(s) | 504.54 KiB | January 18 2021 | |||
| 1 2 3 |
|
Letter of declaration for Band 2 4and 12 only | Cover Letter(s) | 76.13 KiB | January 18 2021 | |||
| 1 2 3 | Operational description | Operational Description | January 18 2021 | confidential | ||||
| 1 2 3 |
|
RF Exposure | RF Exposure Info | 536.37 KiB | January 18 2021 | |||
| 1 2 3 | Tune up | Parts List/Tune Up Info | January 18 2021 | confidential | ||||
| 1 2 3 |
|
66697RRF.001 | Test Report | 2.82 MiB | January 18 2021 | |||
| 1 2 3 |
|
66697RRF.001 Photographs | Test Setup Photos | 1.38 MiB | January 18 2021 / July 17 2021 | delayed release | ||
| 1 2 3 |
|
66697RRF.002 | Test Report | 5.44 MiB | January 18 2021 | |||
| 1 2 3 |
|
66697RRF.002 Photographs | Test Setup Photos | 1.15 MiB | January 18 2021 / July 17 2021 | delayed release | ||
| 1 2 3 | Electrical dIagram | Schematics | January 18 2021 | confidential | ||||
| 1 2 3 | Block diagram - v2 | Block Diagram | January 18 2021 | confidential |
| 1 2 3 | User Manual | Users Manual | 1.35 MiB | January 18 2021 / July 17 2021 | delayed release |
Preliminary
Datasheet
SEQUANS Communications
15-55 Boulevard Charles de Gaulle
92700 Colombes, France
Phone. +33.1.70.72.16.00
Fax. +33.1.70.72.16.09
www.sequans.com
contact@sequans.com
1 Product Summary
1.1
General Description
The Monarch 2 GM02S is an LTE Cat M1/NB1/NB2 module based on Sequans'
second generation Monarch 2 chip platform. GM02S is a total module
solution, including a complete, Single-SKU™ RF front end for deployment in
any band worldwide, and an integrated EAL5+ Secure Element (SE) enabling
the integration of the SIM inside the module with zero compromise on
security while lowering cost and reducing complexity. The GM02S is part of
Sequans next generation "S" family of modules, featuring a very small yet
cost-effective form factor that requires no external components.
GM02S leverages Sequans' 15-plus years of experience in 4G and 5G
technologies and incorporates Sequans' carrier-proven LTE protocol stack and
a software suite that is one of the most mature in the industry. The GM02S is
part of Sequans next generation "S" family of modules, featuring a very small
yet cost-effective form factor that requires no external components. The
GM02S inherits Monarch's already certified LTE-M and NB-IoT stack and
delivers the significantly improved performance and lower power
consumption enabled by Sequans' second generation Monarch 2 chip and the
new module architecture.
Sequans technology, both hardware and software, is 100-percent owned by
Sequans, ensuring fast time to market and lowest total cost of ownership for
device makers.
1.2
Frequency Bands
The LTE frequency bands supported by GM02S are B1 (2100), B2 (1900 PCS),
B3 (1800+), B4 (AWS-1), B5 (850), B8 (900 GSM), B12 (700 a), B13 (700 c),
B14 (700 PS), B17 (700 b), B18 (800 Lower), B19 (800 Upper), B20 (800 DD),
B25 (1900+), B26 (850+), B28 (700 APT), B66 (AWS-3), B71 (600), B85 (700 a+).
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
1
PRODUCT SUMMARY
APPLICATIONS
1.3
Applications
GM02S is ideal for adding LTE-M and/or NB-IoT LTE connectivity to
narrowband, low data rate M2M and IoT devices, including utility meters,
industrial sensors, health and fitness bands, asset trackers, and numerous
additional devices for smart home, smart city, and wearable applications.
GM02S can be used by applications as slim modem controlled by an external
MCU via UART. Alternatively, applications may run on GM02S' integrated
MCU.
1.4
Block Diagram
(cid:25)!
"(cid:4)(cid:29)(cid:20)(cid:4)(cid:4)(cid:5)
(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)
(cid:23)(cid:17)(cid:9)
(cid:17)(cid:6)(cid:3)(cid:4)(cid:29)(cid:9)
!(cid:4))
(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:9)
(cid:11)(cid:12)(cid:13)(cid:14)(cid:15)(cid:14)(cid:16)
#"(cid:23)(cid:25)
$(cid:10)(cid:27)
%&$(cid:31)
(cid:11)&$
’(cid:25)"%
(cid:17)(cid:18)(cid:5)(cid:19)(cid:8)
(cid:2)(cid:20)(cid:21)(cid:3)(cid:6)(cid:22)
(cid:23)(cid:20)(cid:5)(cid:18)(cid:24)(cid:25)(cid:26)(cid:21)(cid:20)
(cid:27)(cid:18)(cid:3)(cid:7)(cid:28)
(cid:27)(cid:6)(cid:22)(cid:19)(cid:29)(cid:5)(cid:18)(cid:30)
(cid:31)(cid:19)(cid:7)(cid:26)(cid:18)(cid:18)(cid:5)(cid:29)(cid:3)(cid:6)
(cid:11)$(cid:2)(cid:16)(cid:30)(cid:11)$(cid:2)(
Figure 1-1: GM02S Block Diagram
2
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
PRODUCT SUMMARY
GENERAL FEATURES
1.5
General Features
Physical Characteristics
LGA module, 100 pads
Size: 16.3 mm x 17 mm x 1.85 mm
Temperature Range
Operation temperature range: -40°C to +85 °C
Storage: MSL3
Power Supply
Voltage range for RF compliancy: 2.5V to 5.5V
Functional voltage range: 2.2V to 5.5V
Tx Power
Interfaces
LTE Features
+23 dBm for each band
• Dual (U)SIM Card Interface: support for external, removable or fixed UICC.
Support for integrated UICC (iUICC) with dedicated p/n
• 4x High-Speed UART Interfaces with flow control, up to 921600 bauds
• GPIOs, I2C, SPI, PWM, Pulse Counter, I2S/PCM, ADC
3GPP LTE Release 13/14 Cat M1/NB1/NB2 compliant.
LTE Cat M1: 1.1 Mbps / 0.3 Mbps UL/DL throughput
LTE Cat NB2: 160 Kbps / 120.7 Kbps UL/DL throughput
Note: Cat NB1/NB2 will be supported in future module versions via software
upgrade.
SMS
Text and PDU modes
Firmware Upgrade
UART Interface, FOTA, Support of full and differential firmware upgrade
RoHS
All hardware components are fully compliant with EU RoHS directive,
halogen-free
Table 1-1: Orderable Part Numbers
Orderable
Part Number
Hardware Version
Software Build
(ATI1)
UE Version
(ATI1)
PTCRB
Model
Name/Model
Orderable
Status
SVN
GM02RB6QRZ
Engineering Sample.
HW Rev1
GM02RB6QRA Engineering Sample.
HW Rev2
Engineering software release.
Please consult your Sequans’
representative
Engineering software release.
Please consult your Sequans’
representative
N/A
N/A
0
0
Available
Not yet
orderable.
Note:
Please contact your Sequans’ technical representative to select the
applicable part number for your project.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
3
2 Interfaces
2.1
Pin Assignment
(cid:2)(cid:7)(cid:8)
(cid:9)(cid:10)(cid:11)(cid:2)
(cid:12)(cid:13)(cid:11)(cid:10)
(cid:14)(cid:11)(cid:15)(cid:16)
(cid:6)(cid:17)(cid:3)
(cid:20)(cid:11)(cid:21)(cid:10)
(cid:2)(cid:22)(cid:17)(cid:23)
(cid:6)(cid:22)(cid:17)
(cid:17)(cid:5)(cid:19)
(cid:6)(cid:17)(cid:3)(cid:18)(cid:12)(cid:19)(cid:19)
(cid:24)(cid:5)(cid:25)(cid:26)(cid:27)(cid:28)(cid:23)(cid:29)(cid:30)
(cid:21)(cid:16)(cid:6)(cid:16)(cid:10)(cid:7)
(cid:21)(cid:31) (cid:31)!"(cid:31)#
&(cid:10)(cid:16)(cid:18)(cid:11)(cid:7)(cid:10)
$(cid:12)%
(cid:11)(cid:8)(cid:19)
&(cid:16)(cid:8)
(cid:21)(cid:17)(cid:7)(cid:2)
(cid:8)(cid:7)(cid:19)
(cid:22)(cid:6)(cid:18)(cid:6)(cid:10)(cid:11)(cid:10)(cid:20)(cid:6)
(cid:2).. (cid:2)!/(cid:29)0#(cid:28)10#(cid:28)
(cid:10)2(cid:31)!314
(cid:3)(cid:23)(cid:8)(cid:20)&(cid:16)
(cid:10)(cid:23)(cid:22)(cid:28)(cid:12)(cid:17)(cid:16)(cid:14)
’(cid:22)(cid:19)(cid:13)(cid:28)(cid:12)(cid:17)(cid:16)(cid:14)(
$(cid:4)(cid:4)
,%
,*
,+
,(cid:5)
,(cid:4)
%%
%*
%+
%(cid:5)
%(cid:4)
-%
-*
-+
-(cid:5)
-$
,,
,-
,)
,(cid:24)
,$
%,
%-
%)
%(cid:24)
%$
-,
--
-)
-(cid:24)
$
(cid:5)
(cid:24)
$(cid:4)
$(cid:5)
$+
$*
$%
$,
(cid:5)(cid:4)
+
)
*
-
%
,
$$
$(cid:24)
$)
$-
(cid:2)$
(cid:2)(cid:5)
(cid:2)(cid:24)
(cid:2)+
(cid:2))
(cid:2)*
(cid:2)-
(cid:2)%
(cid:2),
(cid:2)$(cid:4)
(cid:2)$$
(cid:2)$(cid:5)
(cid:2)$(cid:24)
(cid:2)$+
(cid:2)$)
(cid:2)$*
(cid:2)$-
(cid:2)$%
(cid:2)$,
(cid:2)(cid:5)(cid:4)
(cid:5)(cid:24)
(cid:5))
(cid:5)-
(cid:5),
(cid:24)$
(cid:24)(cid:24)
(cid:24))
(cid:24)-
(cid:24),
+$
+(cid:24)
+)
+-
+,
(cid:5)$
(cid:5)(cid:5)
(cid:5)+
(cid:5)*
(cid:5)%
(cid:24)(cid:4)
(cid:24)(cid:5)
(cid:24)+
(cid:24)*
(cid:24)%
+(cid:4)
+(cid:5)
++
+*
+%
)(cid:4)
*-
*)
*(cid:24)
*$
),
)-
))
-(cid:4)
*,
*%
**
*+
*(cid:5)
*(cid:4)
)%
)*
)+
)(cid:24)
)(cid:5)
)$
Figure 2-1: Module Pads Assignments
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
4
INTERFACES
ANTENNA
2.2
Antenna
Table 2-1: Antenna Pad Details
Pad #
Pad Name Direction
Comments
90
LTE_ANT
In/Out
Main Antenna, for Rx and Tx
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
5
INTERFACES
POWER
2.3
Power
2.3.1
Power Details
Note:
Pad 1V8 is the reference voltage for IOs. It can be used to provide
power small devices (100 mA maximum usage). This voltage is
not available when the modem is in Deep Sleep. When the
modem is in standby the voltage drops to 1.62V as per Table 2-2.
Pad #
Pad Name
Direction
Power
Group
Min
Operational
Value
Typical
Operational
Value
Max
Operational
Value
PVDD_1V8 Out
1.62 V
1.8 V
1.98 V
Table 2-2: Power Pads
1V8
See note above
8
73
SIM_VCC1
PVDD_1V8 Out
1.62 V
1.8 V
1.98 V
60, 62, 63 VBAT
N/A
in
2.5 V
5.5 V
1. See also Section 2.5 USIM Interfaces on page 12.
Table 2-3: Electrical Maximum Rating for GM02S
Direction Minimum Typical Maximum
VBAT
In
2.2 V
5.5 V
Note:
Reference VBAT voltage range is 2.5 V to 5.5 V for operations and
2.2 V to 5.5 V for functional behavior with possible degradation of
RF performances.
Figure 2-2: Timing Diagram for Power-Up Sequence
6
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
INTERFACES
POWER
Figure 2-3: Timing Diagram for Reset Sequence
2.3.2
Power States
Figure 2-4 represents the electrical states of the module and their transitions.
&(cid:3)*(cid:20)(cid:6)(cid:9)(cid:31)++
45(cid:5)(cid:29)(cid:29)(cid:9)(cid:31)(cid:13)
&(cid:3)*(cid:20)(cid:6)(cid:9)(cid:31)(cid:4)
(cid:23)!(cid:11)!(cid:25)(cid:9)
(cid:23)(cid:20)(cid:18)(cid:20)(cid:5)(cid:19)(cid:20))
(cid:23)!(cid:11)!(cid:25)
"(cid:19)(cid:19)(cid:20)(cid:6)(cid:29)(cid:20))
"(cid:7)(cid:29)(cid:26),(cid:20)
-.(cid:9)(cid:23)/(cid:4)(cid:9)0(cid:9)(cid:2)(cid:3))(cid:20)(cid:19)1
(cid:11)(cid:18)(cid:20)(cid:20)3(cid:9)
(cid:27)(cid:3)(cid:21)(cid:21)(cid:5)(cid:4))
6"7!(cid:9)
(cid:11)(cid:3)/(cid:6)(cid:7)(cid:20)
2(cid:20)(cid:20)3(cid:9)(cid:11)(cid:18)(cid:20)(cid:20)3
Figure 2-4: Electrical States and Transitions
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
7
INTERFACES
POWER
The various power modes are described in Table 2-4 and illustrated on Figure
2-5.
Table 2-4: Power Modes Description
Power Mode
LTE Mode
Available Interfaces
Deep Sleep
Standby
Active
PSM, eDRX with long duration
WAKE pins (including RTS0/1)
eDRX short duration and IDLE
WAKE pins (including RTS0/1)
Connected
All interfaces
2(cid:20)(cid:20)3(cid:9)(cid:11)(cid:18)(cid:20)(cid:20)3
(cid:11)(cid:29)(cid:5)(cid:4))5(cid:22)
"(cid:7)(cid:29)(cid:26),(cid:20)
Figure 2-5: Power Modes
8
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
2.4
UART
INTERFACES
UART
GM02S, when used as a slim modem, has three UARTs available. While the
function of the UARTs can be configured, the default function for each UART
is as follows:
• UART0: data and control from external MCU via AT commands
• UART1: debug and upgrade
• UART2: modem console
In addition, a fourth UART (UART3) may be used when running applications
on GM02S.
Table 2-5: UART Signals
Pad #
Pad
Name
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
2
e
p
y
t
d
a
P
e
t
a
t
S
t
e
s
e
r
@
36
GPIO12/TXD0
TXD0
GPIO12
PVDD_1V8
In/Out
BIDIR HighZ,
34
GPIO13/RXD0 RXD0
GPIO13
PVDD_1V8
In/Out
BIDIR Out-1,
35
GPIO14/CTS0
CTS0
GPIO14
PVDD_1V8
In/Out
BIDIR Out-1,
33
RTS0
RTS0
N/A
PMU_5V
In
IN
HighZ
32
TXD1
TXD1
N/A
PVDD_1V8
In
BIDIR HighZ,
30
RXD1
RXD1
N/A
PVDD_1V8 Out
BIDIR Out-1,
In for primary function, UART0
Out for primary function, UART0
Out for primary function, UART0
Wake signal enabled by default.
UART1
UART1
2mA
2mA
2mA
2mA
2mA
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
9
INTERFACES
UART
Table 2-5: UART Signals (Continued)
Pad #
Pad
Name
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
2
e
p
y
t
d
a
P
e
t
a
t
S
t
e
s
e
r
@
31
CTS1
CTS1
N/A
PVDD_1V8 Out
BIDIR Out-1,
29
RTS1
RTS1
N/A
PMU_5V
In
IN
HighZ
28
GPIO15/TXD2
TXD2
GPIO15
PVDD_1V8
In/Out
BIDIR HighZ,
UART1
Wake signal enabled by default.
In for primary function, UART2
26
GPIO16/RXD2 RXD2
GPIO16
PVDD_1V8
In/Out
BIDIR Out-1,
Out for primary function, UART2
GPIO17 CTS2/DCD0
PVDD_1V8
In/Out
BIDIR Out-1,
27
25
GPIO17/
CTS2/DCD0
GPIO18/
RTS2/DSR0
GPIO18 RTS2/DSR0
PVDD_1V8
In/Out
BIDIR HighZ,
24
GPIO19/TXD3 GPIO19 TXD3
PVDD_1V8
In/Out
BIDIR HighZ,
22
GPIO20/RXD3 GPIO20 RXD3
PVDD_1V8
In/Out
BIDIR Out-1,
In for primary function, UART3
Out for primary function, UART3
21
GPIO21/CTS3
GPIO21 CTS3
PVDD_1V8
In/Out
BIDIR Out-1,
UART2
UART2
UART3
2mA
2mA
2mA
2mA
2mA
2mA
2mA
2mA
10
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
INTERFACES
UART
Table 2-5: UART Signals (Continued)
Pad #
Pad
Name
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
2
e
p
y
t
d
a
P
e
t
a
t
S
t
e
s
e
r
@
23
GPIO22/RTS3
GPIO22 RTS3
PVDD_1V8
In/Out
BIDIR Out-1,
2mA
UART3
1. Alternate functions will be available in future versions via SW upgrade.
2.UART pad types’s electrical characteristics are detailed in Table 2-15.
High-Speed UARTs Flow Control Signals
• CTS0, CTS1, CTS2, CTS3: resp. UART0, UART1, UART2, UART3 flow
control, Clear-To-Send, active low, of the GM02S. To be connected to the
CTS of the remote UART device. Provision a 1 kOhm pull-down on CTS
pin when flowcontrol is not used. If it is connected to an external compo-
nent (like a RS232 driver), the user should make sure that this component
will present a low level to the GM02S. See Figure 2-6.
• RTS0, RTS1, RTS2, RTS3: resp. UART0, UART1, UART2, UART3 flow
control, Ready-To-Send, active low, of the GM02S. To be connected to the
RTS of the remote UART device. See Figure 2-6.
Figure 2-6 represents the typical implementation for the hardware
flowcontrol.
%(cid:2)(cid:16)(cid:10)(cid:11)
"33(cid:18)(cid:26)(cid:7)(cid:5)(cid:29)(cid:26)(cid:3)(cid:4)
(cid:25)82(cid:16)(cid:30)(cid:25)82((cid:30)(cid:25)82(cid:10)(cid:30)(cid:25)82(cid:14)
(cid:23)82(cid:16)(cid:30)(cid:23)82((cid:30)(cid:23)82(cid:10)(cid:30)(cid:23)82(cid:14)
(cid:23)(cid:25)(cid:11)(cid:16)(cid:30)(cid:23)(cid:25)(cid:11)((cid:30)(cid:23)(cid:25)(cid:11)(cid:10)(cid:30)(cid:23)(cid:25)(cid:11)(cid:14)
(cid:27)(cid:25)(cid:11)(cid:16)(cid:30)(cid:27)(cid:25)(cid:11)((cid:30)(cid:27)(cid:25)(cid:11)(cid:10)(cid:30)(cid:27)(cid:25)(cid:11)(cid:14)
(cid:25)82
(cid:23)82
(cid:23)(cid:25)(cid:11)9(cid:13)
(cid:27)(cid:25)(cid:11)9(cid:13)
Figure 2-6: UART Convention and Flow Control
Note:
High-Speed UART can be used as low-speed UART, given a
specific software registers configuration and the setting of the
CTS signal to 0. Please contact Sequans customer support for
details.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
11
INTERFACES
USIM INTERFACES
2.5
USIM Interfaces
2.5.1
SIM0 Interface
This is the main external SIM interface. It can be used with removable or
non-removable SIM cards or with soldered SIM chips. The power supply of
the SIM is managed by the modem to ensure lowest power consumption of
the SIM.
Table 2-6: SIM0 Signals
Pad #
Pad
Name
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
1
e
p
y
t
d
a
P
e
t
a
t
S
t
e
s
e
r
@
Comment
42
45
44
43
73
SIM0_CLK
SIM0_CLK
PVDD_1V8 Out
BIDIR
Out-0, 2mA Main SIM
SIM0_DETECT2
SIM0_DETECT
PMU_5V
In
IN
HighZ
Main SIM
SIM0_IO
SIM0_IO
PVDD_1V8
In/Out
BIDIR
HighZ, 2mA Main SIM
SIM0_RSTN
SIM0_RSTN
PVDD_1V8 Out
BIDIR
Out-0, 2mA Main SIM
SIM0_VCC3
SIM0_VCC
PVDD_1V8 Out
Supply Out-0, 2mA Main SIM
1.USIM pad types’s electrical characteristics are detailed in Table 2-15.
2. SIM0_DETECT can be configured as a WAKE pin via software command.
3. See range of values in Table 2-2.
12
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
INTERFACES
I2C
2.5.2
SIM1 Interface
This interface can be used as a second SIM interface for GM02S, typically used
for soldered SIM chips (since it lacks SIM detect and SIM VCC). If design only
has one SIM, it is preferred then to use the main SIM interface (see Section
SIM0 Interface above).
Table 2-7: SIM1 Signals
Pad #
Pad
Name
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
2
e
p
y
T
d
a
P
e
t
a
t
S
t
e
s
e
r
@
GPIO26/SIM1_CLK
GPIO26
SIM1_CLK
PVDD_1V8 Out
BIDIR Out-0,
GPIO27/SIM1_RESETN GPIO27
SIM1_RESETN PVDD_1V8 Out
BIDIR Out-0,
GPIO25/SIM1_IO
GPIO25
SIM1_IO
PVDD_1V8
In/Out
BIDIR HighZ,
2mA
2mA
2mA
40
41
39
1. Alternate functions will be available in future versions via SW upgrade.
2.Pad types’s electrical characteristics are detailed in Table 2-15.
2.6
I2C
Table 2-8: I2C Pad Details
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
2
e
p
y
t
d
a
P
e
t
a
t
S
t
e
s
e
r
@
GPIO23
I2C_SDA
PVDD_1V8
In/Out
BIDIR
HiZ
GPIO24
I2C_SCL
PVDD_1V8
In/Out
BIDIR
HiZ
Pad #
95
97
Pad
Name
GPIO23/
I2C_SDA
GPIO24/
I2C_SCL
1. Alternate functions will be available in future versions via SW upgrade.
2.I2C pad types’s electrical characteristics are detailed in Table 2-15.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
13
INTERFACES
PCM
2.7
PCM
Table 2-9: PCM Pad Details
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
2
e
p
y
t
d
a
P
e
t
a
t
S
t
e
s
e
r
@
GPIO4
PCM_CLK
PVDD_1V8
In/Out
BIDIR
HighZ
GPIO3
PCM_RXD
PVDD_1V8
In/Out
BIDIR
HighZ
GPIO5
PCM_FS
PVDD_1V8
In/Out
BIDIR
HighZ
GPIO6
PCM_TXD
PVDD_1V8
In/Out
BIDIR
HighZ
Pad #
Pad
Name
96
98
99
100
GPIO4/
PCM_CLK
GPIO3/
PCM_RXD
GPIO5/
PCM_FS
GPIO6/
PCM_TXD
1. Alternate functions will be available in future versions via SW upgrade.
2.PCM pad types’s electrical characteristics are detailed in Table 2-15.
14
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
INTERFACES
SPI
2.8
SPI
Table 2-10: SPI Pad Details
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
2
e
p
y
t
d
a
P
e
t
a
t
S
t
e
s
e
r
@
GPIO7
SPI_SDI
PVDD_1V8
In/Out
BIDIR HighZ
GPIO8
SPI_SDO
PVDD_1V8
In/Out
BIDIR HighZ
GPIO9
SPI_CLK
PVDD_1V8
In/Out
BIDIR HighZ
GPIO10
SPI_CSN1
PVDD_1V8
In/Out
BIDIR HighZ
GPIO11
SPI_CSN2
PVDD_1V8
In/Out
BIDIR HighZ
Pad #
Pad
Name
3
4
2
5
7
GPIO7/
SPI_SDI
GPIO8/
SPI_SDO
GPIO9/
SPI_CLK
GPIO10/
SPI_CSN1
GPIO11/
SPI_CSN2
1. Alternate functions will be available in future versions via SW upgrade.
2.SPI pad types’s electrical characteristics are detailed in Table 2-15.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
15
INTERFACES
GPIO
2.9
GPIO
There is a total of 33 GPIOs available on GM02S: 28 named GPIO1 to GPIO28
and 5 named GPIO31 to GPIO35. The GPIOs listed in Table 2-11 are not
enabled by default. Changing their state can be done by software.
Table 2-11: GPIOs Disabled by Default
GPIO Range
Enable State by Default
GPIO3 to GPIO11
GPIO17 to GPIO28
GPIO31 to GPIO32
Disabled
Disabled
Disabled
The GPIOs are documented throughout this datasheet based on their shared
or assigned function. In addition to the GPIO there are 5 wake signals
available (documented in Section 2.10 Other Signals on page 17).
16
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
INTERFACES
OTHER SIGNALS
2.10 Other Signals
Table 2-12: GND and DNC Pads
Pads Type
Pads Number
GND
1, 6, 37, 38, 50, 51, 52, 54, 56, 58, 59, 61, 64, 65, 78, 79,
80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 91, 92, 93
DNC (Reserved)
15, 17, 53, 71, 74, 75, 76, 77, 94
Table 2-13: Other Signals (No Interface)
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
d
a
P
2
e
p
y
T
e
t
a
t
S
t
e
s
e
r
@
72
ADC1
N/A
PVDD_1V8
In
IN
N/A
ADC1
(See Note 1)
Pad #
Name
12
13
14
19
18
GPIO1/
STATUS_LED
GPIO2/
PS_STATUS
GPIO28/
DTR0
GPIO31/
PWM0/
PULSE0/
19M2_OUT
GPIO32/
PWM1/
PULSE1
Analog Digital Converter (ADC, IN)
STATUS_LED
GPIO1
PVDD_1V8
In/Out
BIDIR
Primary Function: Status LED (STATUS_LED, OUT)
PS_STATUS
GPIO2
PVDD_1V8
In/Out
BIDIR
HighZ,
2mA
HighZ,
2mA
Primary Function: Power Saving status (PS_STATUS, OUT) enabled by default.
Active high.
DTR0
PVDD_1V8
In/Out
BIDIR
HighZ
PVDD_1V8
In/Out
BIDIR
HighZ
GPIO28
(See Note 1)
GPIO31
(See Note 1)
PWM0/
PULSE0/
19M2_OUT
GPIO32
(See Note 1)
PWM1/
PULSE1
PVDD_1V8
In/Out
BIDIR
HighZ
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
17
INTERFACES
OTHER SIGNALS
Pad #
Name
GPIO33/
TX_IND
Table 2-13: Other Signals (No Interface) (Continued)
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
d
a
P
2
e
p
y
T
e
t
a
t
S
t
e
s
e
r
@
TX_IND
GPIO33
PVDD_1V8
In/Out
BIDIR
Primary Function: Transmission indicator (TX_IND, OUT). Active high.
ANT_TUNE0
GPIO34
PVDD_1V8
In/Out
BIDIR
Primary Function: Antenna tunning (ANT_TUNE0, OUT)
ANT_TUNE1
GPIO35
PVDD_1V8
In/Out
BIDIR
Primary Function: Antenna tunning (ANT_TUNE1, OUT)
RESERVED
N/A
PVDD_1V8
N/A
BIDIR
GPIO34/
ANT_TUNE0
GPIO35/
ANT_TUNE1
RESERVED/
FFF_FFH
HighZ,
2mA
HighZ,
2mA
HighZ,
2mA
HighZ,
2mA
Boot mode selection (FFF_FFH, IN). This pad needs a pull-down resistor by default.
RESERVED
RESERVED
N/A
PVDD_1V8
N/A
BIDIR
Do not connect
9
10
11
20
15,
17,
53,
71,
74,
75,
76,
77,
94
46
RESETN
EXT_RST_N
N/A
PMU_5V
In
IN
In, Pull-up
Module HW reset signal. Active low. The minimum duration of a pulse on
EXT_RST_N signal to be taken into account is 3.2 ms..This pin has an internal
pull-up.
16
RING0
RING0
N/A
PVDD_1V8
In/Out
BIDIR
HighZ,
2mA
UART0 ring line (RING0, OUT). Enabled by default with inversed polarity.
48
WAKE0
WAKE0
N/A
PMU_5V
In
IN
HighZ
Wake #0 input line (WAKE0, IN), diabled by default.
18
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
INTERFACES
OTHER SIGNALS
Table 2-13: Other Signals (No Interface) (Continued)
Pad #
Name
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
e
t
a
n
r
e
t
l
A
1
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
d
a
P
2
e
p
y
T
e
t
a
t
S
t
e
s
e
r
@
47
WAKE1
WAKE1
N/A
PMU_5V
In
IN
HighZ
Wake #1 input line (WAKE1, IN), diabled by default.
49
WAKE2
WAKE2
N/A
PMU_5V
In
IN
HighZ
Wake #2 input line (WAKE2, IN), diabled by default.
55
WAKE3
WAKE3
N/A
PMU_5V
In
IN
HighZ
Wake #3 input line (WAKE3, IN), diabled by default.
57
WAKE4
WAKE4
N/A
PMU_5V
In
IN
HighZ
Wake #4 input line (WAKE4, IN), diabled by default.
1. Functions will be available in future versions via SW upgrade.
2.Pad types’s electrical characteristics are detailed in Table 2-15.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
19
INTERFACES
JTAG
2.11 JTAG
Table 2-14: JTAG Pad Details
Pad #
Pad
Name
y
r
a
m
i
r
P
n
o
i
t
c
n
u
F
p
u
o
r
G
r
e
w
o
P
n
o
i
t
c
e
r
i
D
1
e
p
y
t
d
a
P
69
JTAG_TCK
JTAG_TCK
PVDD_1V8
In
IN
e
t
a
t
S
t
e
s
e
r
@
In
Pull-down
Schmitt-trigger
67
68
66
70
JTAG_TDI
JTAG_TDI
PVDD_1V8
In
IN
In, Pull-up
JTAG_TDO
JTAG_TDO
PVDD_1V8 Out
BIDIR Out, 0
JTAG_TMS
JTAG_TMS
PVDD_1V8
In
In, Pull-up
JTAG_TRSTN JTAG_TRSTN PVDD_1V8
In
In, Pull-down
IN
IN
1.JTAG pad types’s electrical characteristics are detailed in Table 2-15.
20
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
2.12 Digital IO Characteristics
INTERFACES
DIGITAL IO CHARACTERISTICS
The voltage and current characteristics of the various IO pads of the GM02S
versus IO bank supply voltage are illustrated in the tables below.
Caution:
The PCB designer must ensure that the voltage on these pads
never exceeds Vih of the power group to which they belong.
See Table 2-15 for digital IO characteristics of the different IO pads. Refer to
each interface of GM02S in chapter Interfaces to know the power group and
IO pad type for each pad. Note that IN pads are inputs only whereas BIDIR
can be both inputs and output.
Table 2-15: DC Characteristics for Digital IOs, Voltage 1.8 V
Symbol
Minimum
Maximum
Unit
VIH
Input HIGH level, PVDD_1V8 I/O pins
1.26
3.3
0.8
VBAT + 0.6 (max 5.5) V
0.54
0.2
1.8
0.36
VIH
Input HIGH level, PMU_5V I/O pins
VIL
Input LOW level, PVDD_1V8 I/O pins
VIL
Input LOW level, PMU_5V I/O pins
VOH
Output HIGH voltage
VOL
Output LOW voltage
IRPU
Input pull-up resistor current
RRPU
Input pull-up resistance
IRPD
Input pull-down resistor current
RRPD
Input pull-down resistance
VH
Input hysteresis
1.44
0
0
0
15
15
0.18
32.4
kOhm
32.4
kOhm
V
V
V
V
V
V
µA
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
21
INTERFACES
DIGITAL IO CHARACTERISTICS
Table 2-15: DC Characteristics for Digital IOs, Voltage 1.8 V (Continued)
Symbol
Minimum
Maximum
Unit
IPAD
Input leakage current, non-tolerant
-1
IOZ
Off-State leakage current
1
1
µA
µA
22
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
3 Mechanical
Characteristics
3.1
Package Description
The package size with tolerance is:
(16.3 ± 0.1) mm x (17.0 ± 0.1) mm x (1.85 max) mm
Figure 3-1: GM02S Top and Side Views
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
23
MECHANICAL CHARACTERISTICS
PACKAGE DESCRIPTION
Figure 3-2: GM02S PCB View
Note:
Gxx pads should be grounded to a large ground plane on
customer's PCB layer 1. It is also recommended to have the Gxx
pads area in the PCB through ground vias to improve thermal
dissipation efficiency.
Table 3-1: GM02S Dimensions (mm)
Dimension
Value (mm)
L
W
T
T0
L1
W1
L2
W2
a1
a2
16.3 ± 0.1
17.0 ± 0.1
1.85 max
0.5 max
0.5 ± 0.1
0.7 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
2.25 ± 0.1
3.05 ± 0.1
24
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
MECHANICAL CHARACTERISTICS
PACKAGE DESCRIPTION
Table 3-1: GM02S Dimensions (mm) (Continued)
Dimension
Value (mm)
a3
a4
a5
b1
b2
b3
b4
b5
P1
P2
P3
P4
1.45 ± 0.1
2.45 ± 0.1
6.5 ± 0.1
2.0 ± 0.1
3.0 ± 0.1
3.1 ± 0.1
5.5 ± 0.1
5.95 ± 0.1
0.3 ± 0.1
0.3 ± 0.1
0.4 ± 0.1
0.4 ± 0.1
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
25
MECHANICAL CHARACTERISTICS
PACKAGE DESCRIPTION
Figure 3-3: GM02S Laser Marking (Preliminary)
Notes on Figure 3-3:
1. FCC ID: 2AAGMGM02S
IC: 12732A-GM02S
IMEI:XXXXXXXXXXXXXXX
2.
3.
4.
ICCID:XXXXXXXXXXXXXXX (for future support)
5. S/N:G2HYYMMDDNNNNSSS (16 digits)
• G2H: reserved (3 digits)
• YYMMDD: Manufacturing Date (YY:Year;MM:Month,DD:Day)
• NNNN: Panel counter (from 0001~9999)
• SSS: Piece location on panel (from 001~036)
6. 2D marked "a" refer to IMEI Barcode
7. 2D marked "b" refer to ICCID Barcode (for future support)
8. 2D marked "c" refer to S/N Barcode
26
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
MECHANICAL CHARACTERISTICS
ENVIRONMENTAL CONDITIONS
3.2
Environmental Conditions
The environmental operating conditions are:
• Temperature:
– Operational and RF compliant: -40°C, +85°C
(PCB temperature as measured by on-board thermistor)
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
27
MECHANICAL CHARACTERISTICS
PACKING
3.3
Packing
The GM02S is delivered in Tape-and-Reel. Details are provided in the figures
below.
Figure 3-4: Packing Modules in Reels
Figure 3-5: Packing Reels in Boxes
28
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
3.4
Storage and Mounting
The GM02S module is Moisture Level 3 rated as per JEDEC industrial
standard: http://www.ipc.org/TOC/J-STD-033D-TOC.pdf
MECHANICAL CHARACTERISTICS
STORAGE AND MOUNTING
Table 3-2: Reflow Profile
Profile Feature
Soaking Time
Reflow Time
Peak Temperature
Pre-heat Rate
Ramp-down Rate
150°C~200°C90~120 seconds
> 217 °C
60~90 seconds
235°C ~245°C
25°C~150°C
3°C/second max
TP~TL
3°C/second max
Figure 3-6: Reflow Profile Parameters
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
29
4 Regulatory Approval
• RED regulatory approval details will be provided in a future revision of
• TELEC regulatory approval details will be provided in a future revision of
this document.
this document.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
30
4.1
FCC Regulatory Approval
REGULATORY APPROVAL
FCC REGULATORY APPROVAL
FCC-ID: 2AAGMGM02S (single modular approval)
This above identified LTE radio module is not intended to be provided to
end-users but is for installation by OEM integrators only.
Installation/Integration
OEM integrators must follow Sequans installation instructions to provide for
and benefit from FCC compliant module integrations and must abide
especially by the following:
The maximum antenna gain values (accounting for cable attenuation) to
comply with the FCC maximum ERP/EIRP limits and with RF Exposure rules:
• LTE band 2 (1800 MHz): 10 dBi
• LTE band 4 (1700 MHz): 7 dBi
• LTE band 12 (700 MHz): 7.6 dBi
The Sequans' module integration guidelines must be closely followed.
Compliance of host integrations of the module is limited to hosts adaptation
designs which are identical to Sequans' reference design.
Host integrations with adaption designs deviating from Sequans' reference
design require either class 2 permissive change to this modular approval or a
separate host approval with different FCC-ID;
Host integrations with co-located (simultaneously operating) radio
transmitters must be evaluated in accordance with FCC multi-transmitter
rules and may require either class 2 permissive change to this modular
approval or a separate host approval with different FCC-ID, dependent on the
result of the evaluation; Inquiry at FCC or a TCB is urgently recommended.
Integrations of the module into host products which are intended for portable
use, i.e. less than 20cm distance between its radiating structures (antenna) and
the body of nearby persons, or which otherwise put additional technical
requirements like Hearing Aid compatibility require either class 2 permissive
change to this modular approval or a separate host approval with different
FCC-ID;
Compliance with Unwanted Emission Limits for Digital Device
If the OEM host integration fully complies with the above described reference
design and can completely inherit and rest on compliance of the existing
modular approval the OEM remains still responsible to show compliance of
the overall end-product with the FCC limits for unwanted conducted and
radiated emissions from the digital device (unintentional radio) portion of
such end-product (commonly addressed as part 15B compliance or similar).
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
31
REGULATORY APPROVAL
FCC REGULATORY APPROVAL
End-product Labelling
• FCC-ID
The module's FCC-ID must either be visible from the exterior of the host
product (e.g. per window) or per electronic display, or shall be displayed
on an additional exterior label per the following or similar string:
contains FCC-ID: 2AAGMGM02S
• Digital Device - Unwanted Emissions Notice
If the end-product falls under part 15 of the FCC rules (it shall display the
following user notice on its exterior acc. to part 15.19 (the notice may be
printed in the manual in case the host is too small):
This device complies with Part 15 of the FCC Rules.Operation is
subject to the following two conditions:
(1) This device may not cause harmful interference,
and
(2) This device must accept any interference received, including
interference that may cause undesired operation.
• Further Labelling Requirements may apply dependent on the FCC rule
parts relevant to the host product.
• End-product User Instructions / Notices in the Manual
At a minimum, end-product users must be provided with the following
notices at a prominent location of the product literature furnished with the
product:
* Product Modifications
Modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this
equipment.
* RF Exposure Compliance
This equipment complies with FCC radio frequency radiation exposure
rules and limits set forth for an uncontrolled environment, when
installed and operated with minimum distance of 20cm between its
radiating structures (antenna) and the body of nearby persons and
when not operated simultaneously with other nearby
radio-transmitters.
• Maximum Antenna Gain
The user instructions of end-products equipped with standard external
antenna connectors for the modular radio transmitter providing the option
to connect other antennae than those which may or may not be bundled
with the end-product must list the maximum allowed antenna gain values
as derived from those given above, accounting for the cable attenuations of
the actual installation.
32
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
REGULATORY APPROVAL
FCC REGULATORY APPROVAL
• Digital Device - Unwanted Emissions Notice
If the end-product is or contains a digital device (unintentional radio
portions) and is not exempted by its use case (like vehicular use) the
following part 15.105 (b) user notice shall be provided at prominent loca-
tion of the product literature:
This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protection against
harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency
energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the
following measures:
o Reorient or relocate the receiving antenna.
o Increase the separation between the equipment and receiver.
o Connect the equipment into an outlet on a circuit different from
that to which the receiver is connected.
o Consult the dealer or an experienced radio/TV technician for help
• Further User Notices
May be required dependent on the FCC rule parts relevant to the host
product.
• Non-allowed User Instructions
The end-product user guidance may NOT include instructions about how
to install or de-install the module.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
33
REGULATORY APPROVAL
INDUSTRY CANADA STATEMENT
4.2
Industry Canada Statement
This device complies with ISED’s licence exempt RSSs. Operation is subject to
the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils
radio exempts de licence. L’exploitation est autorisée aux deux conditions
suivantes : (1) le dispositif ne doit pas produire de brouillage préjudiciable, et
(2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage
susceptible de provoquer un fonctionnement indésirable.
This device is intended only for OEM integrators under the following
conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the
antenna and users, and
2) The transmitter module may not be co located with an y other transmitter
or antenna
As long as 2 conditions above are met , further transmitter test will not be
required. However, the OEM integrator is still responsible for testing their end
product for any additional compliance requirements required with this
module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les
conditions suivantes: (Pour utilisation de dispositif module)
1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est
respectée entre l'antenne et les utilisateurs, et
2) Le module émetteur peut ne pas être coïmp lanté av ec un autre émetteur
ou antenne.
Tant que les 2 conditions ci dessus sont remplies, des essais supplémentaires
sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est
toujours responsable des essais sur son produit final pour toutes exigences de
conformité supplémentaires requis pour ce module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop
configurations or colocation with another transmitter), then the Canada
authorizatio n is no longer considered valid and the IC ID can not be used on
the final product. In these circumstances, the OEM integrator will be
responsible for re evaluating the end product (including the transmitter) and
obtaining a separate Canada authorization.
34
PROPRIETARY
SEQUANS Communications
GM02S DATASHEET (PRELIMINARY)
REGULATORY APPROVAL
INDUSTRY CANADA STATEMENT
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour
certaines configurations d'ordinateur portable ou de certaines co localisation
avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme
valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y
compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the
antenna may be installed such that 20 cm may be maintained between the
antenna and users. The final end product must be labeled in a visible area
with the following: "Contains IC:12732A-GM02S".
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un
dispositif où l'antenne peut être installée de telle sorte qu'une distance de
20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final
doit être étiqueté dans un endroit visible avec l'inscription suivante:
"Contient des IC: 12732A-GM02S".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end
user regarding how to install or remove this RF module in the user's manual
of the end product which integrates this module.
The end user manual shall include all required regulatory
information/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à
l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF
dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations
réglementaires requises et avertissements comme indiqué dans ce manuel.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
35
A Acronyms
DL
ESD
ETSI
I/O
I2C
Acronym
Definition
ADC
Analog to Digital Converter
CPU
Central Processing Unit
Downlink
Electro-static discharge
European Telecommunications Standard Institute
GND
Ground
GPIO
General Purpose Input Output
Input/Output
Inter-Integrated Circuit interface
IMEI
International Mobile Equipment Identity
IP
Internet Protocol
JTAG
Joint Test Action Group
LGA
Large Grid Array
LTE
Long Term Evolution, or 4G. Standard is developed by the 3GPP
www.3gpp.org.
MIMO
Multiple In Multiple Out
NAS
Network Access Server
OMADM Open Mobile Alliance Device Management
PCM
Pulse-Code Modulation
PHY
Physical Layer
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
36
Acronym
Definition
RED
European Radio Equipment Directive
RF
Radio Frequency
RoHS
Restriction of Hazardous Substances
Reception
or SN: Serial Number
Subscriber Identification Module
SMS
Short Message Service
Serial Peripheral Interface
Transmission
UART
Universal Asynchronous Receiver Transmitter
Rx
S/N
SIM
SPI
Tx
UE
UL
User Equipment
Uplink
USB
Universal Serial Bus
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
37
About this Datasheet
Purpose and Scope
The GM02S is a complete LTE Cat M1/NB1/NB2 module including base-band,
RF and memory, for the design of narrowband low data rate M2M and IoT
devices for wide deployment. This document provides technical information
about GM02S LGA module. GM02S is based on Sequans' Monarch 2 platform.
Who Should Read this Document
This document is intended for engineers who are developing User Equipment
(UE) for LTE systems.
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
38
Changes in this Document
The following changes were done since the previous edition of this document:
• Updated part numbers details in .Table 1-1 on page 3
• Added timing diagrams in Section 2.3 Power on page 6.
• Added Section 2.3.2 Power States on page 7.
• Added default Enable status for GPIOs in Section 2.9 GPIO on page 16
• Added RING0 polarity information in Table 2-13.
• Restrict usage for Pad #53 to Reserved in Table 2-13 and signals list.
• Updated wake signals default enable state in Table 2-5 and Table 2-13.
• Updated VBAT characteristics in Table 2-15 on page 21.
• Updated Section 3.3 Packing on page 28.
• Added Sections FCC Regulatory Approval and Industry Canada Statement
in Chapter Regulatory Approval on page 30.
• Changed assignment (from GND to DNC) for pads 71, 74, 75, 76, 77.
• Various edits
GM02S DATASHEET (PRELIMINARY)
PROPRIETARY
SEQUANS Communications
39
Table of Contents
1.1
1.2
1.3
1.4
1.5
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
3.1
3.2
3.3
3.4
Chapter 1
Product Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Frequency Bands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
General Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Chapter 2
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3.1
2.3.2
2.5.1
2.5.2
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Power Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Power States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
USIM Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SIM0 Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SIM1 Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
PCM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SPI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Other Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
JTAG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Digital IO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Chapter 3
Mechanical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Environmental Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Storage and Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Chapter 4
Regulatory Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.1
FCC Regulatory Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Proprietary
SEQUANS Communications
40
Table of Contents
4.2
Industry Canada Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Appendix A
Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
About this Datasheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Purpose and Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Who Should Read this Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Changes in this Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Proprietary
SEQUANS Communications
41
| 1 2 3 | Photographs - internal | Internal Photos | 383.69 KiB | January 18 2021 / July 17 2021 | delayed release |
| 1 2 3 | FCC - Letter - Modular approval 2 | External Photos | 436.68 KiB | January 18 2021 |
Date: January 1st 2021 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: FCC Modular approval letter for FCC ID: 2AAGMGM02S To whom it may concern:
The following attestation addresses the fourth requirements to support modular approval:
This device is designed for mobile or fixed operation; portable operation is subject to a Class 2 permissive change application or to a new and separate FCC ID. The maximum antenna gain is limited to the values calculated in the RF exposure exhibit for each mode/frequency band respectively. The product has a FCC ID label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module. The exterior ID:
2AAGMGM02S or Contains FCC ID: 2AAGMGM02S. label will read as follows: Contains Transmitter Module FCC We request to include in the grant the following words in the device description or grant notes: modular transmitter or transmitter module. If there are any additional questions or if further information is needed, please contact us. Sincerely, PA __________________________ By:
Title:
Company:
Telephone:
e-mail:
Sebastien Falgayrettes Director, Product and Program management Sequans Communications
+33627991534 sfalgayrettes@sequans.com FCB014_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless
| 1 2 3 | Photographs - external | External Photos | 5.29 MiB | January 18 2021 / July 17 2021 | delayed release |
| 1 2 3 | Product label design | ID Label/Location Info | 1.21 MiB | January 18 2021 |
Laser Marking & Packaging SPEC Project: GM02S SQN PN: GM02RB6QRZCZ0CZ0FF USI PN: 6756-001500-04 MD USI 2020.11 Laser marking USI. All rights reserved. Box label Box label USI. All rights reserved. Carton label Carton label USI. All rights reserved. Thank You www.usish.com Realizing IDEAS Together USI. All rights reserved.
| 1 2 3 | 66697REM.001 Photographs | Test Setup Photos | 339.82 KiB | January 18 2021 / July 17 2021 | delayed release |
| 1 2 3 | FCC - Agent letter | Cover Letter(s) | 108.60 KiB | January 18 2021 |
Date: Thursday, 3rd Dec,2020 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: Agent letter for FCC ID: 2AAGMGM02S We, hereby authorize Sequans Communications 55 Boulevard Charles de Gaulle, 92700 Colombes, FRANCE DEKRA Testing and Certification, S.A.U. C/Severo Ochoa 2, 29590 Campanillas Mr. lvaro Corrales Sedeo, e-mail: alvaro.corrales@dekra.com, Phone: +34 925 619 198 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We also hereby certify that neither we nor any party to this application are subject to a denial of U.S. Federal benefits, which include FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, U.S.C. 862 because of conviction for possession or distribution of controlled substance. For instances where our authorized agent signs the application for certification on our behalf, I acknowledge that all responsibility for complying with the terms and conditions for Certification, as specified by DEKRA Testing and Certification, S.A.U., still resides with us. This agreement expires one year from the current date. Sincerely, __________________________ By:
Title:
Company:
Telephone:
e-mail:
Sebastien Falgayrettes Director, Product and Program management Sequans Communications
+33 627 991 534 sfalgayrettes@sequans.com FCB011_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless
| 1 2 3 | FCC - Letter - Confidentiality request | Cover Letter(s) | 508.34 KiB | January 18 2021 |
Date: January 1st 2021 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: Confidentiality request for FCC ID: 2AAGMGM02S To whom it may concern:
Pursuant to 0.457(d)(1)(ii) and 0.459 of the Commissions Rules (47 C.F.R.) and 552 (b)(4) of the Freedom of Information Act, Sequans Communications hereby request requests that a part of the subject FCC application be held confidential to avoid release of sensitive information of the product to the public. For the product stated above, we request that the following information be withheld from public disclose:
Type of Confidentiality Requested Exhibit Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent Permanent Permanent Permanent Block Diagrams External Photos Internal Photos Operation Description Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual Permanent Confidentiality:
The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to us and provide unjustified benefits to our competitors. Short-Term Confidentiality:
We hereby request short-term confidentiality for the product stated above to avoid premature release of sensitive information prior to marketing or release of the product to the public. Release date of short term confidentiality is:
45 days from grant date marked 90 days from grant date marked 135 days from grant date marked 180 days from grant date marked Specific date:
We are also aware that we are responsible to notify DEKRA in the event information regarding the product or the product is made available to the public. DEKRA will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. Sincerely, PA __________________________ By:
Title:
Company:
Telephone:
e-mail:
Sebastien Falgayrettes Director, Product and Program management Sequans Communications
+33627991534 sfalgayrettes@sequans.com FCB012_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless
| 1 2 3 | FCC - Letter - Modular approval 1 | Cover Letter(s) | 504.54 KiB | January 18 2021 |
Date: January 1st 2021 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: FCC Modular approval letter for FCC ID: 2AAGMGM02S To whom it may concern:
The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:
Modular approval requirement Yes No*
(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.
(ii) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.
(iii) The modular transmitter must have its own power supply regulation.
(iv) The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.
(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see 15.31(i)). X
(vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.
(vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization.
(viii) The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. X X X X X X X
* Shall provide a detailed explanation if the answer is No. Sincerely, PA __________________________ By:
Title:
Company:
Telephone:
e-mail:
Sebastien Falgayrettes Director, Product and Program management Sequans Communications
+33627991534 sfalgayrettes@sequans.com FCB013_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless
| 1 2 3 | Letter of declaration for Band 2 4and 12 only | Cover Letter(s) | 76.13 KiB | January 18 2021 |
Date: 18/01/2021 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa We, Sequans Communications, 15-55 Boulevard Charles de Gaulle Colombers, France hereby declare that the product:
Type of equipment: LTE Cat-M Cellular communication module Brand name: Sequans Communications Model name: GM02S FCC ID: 2AAGMGM02S IC: 12732A-GM02S Operates only in the LTE Cat M1 bands 2, 4, 12 in USA and Canada, and the other supported bands are going to be disabled by SW in USA (FCC) and Canada (ISED). Sincerely, __________________________ By:
Title:
Company:
Telephone:
e-mail:
Sebastien Falgayrettes Director, Product and Program management Sequans Communications
+33 627 991 534 sfalgayrettes@sequans.com FCB015_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless
| 1 2 3 | 66697RRF.001 Photographs | Test Setup Photos | 1.38 MiB | January 18 2021 / July 17 2021 | delayed release |
| 1 2 3 | 66697RRF.002 Photographs | Test Setup Photos | 1.15 MiB | January 18 2021 / July 17 2021 | delayed release |
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2021-01-18 | JAB - Part 15 Class B Digital Device | Original Equipment | |
| 2 | 1850 ~ 1910 | PCB - PCS Licensed Transmitter | ||
| 3 | 729 ~ 746 | CXX - Communications Rcvr for use w/ licensed Tx and CBs |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 2 3 | Effective |
2021-01-18
|
||||
| 1 2 3 | Applicant's complete, legal business name |
Sequans Communications
|
||||
| 1 2 3 | FCC Registration Number (FRN) |
0022755912
|
||||
| 1 2 3 | Physical Address |
15-55 Boulevard Charles de Gaulle
|
||||
| 1 2 3 |
Colombes, N/A
|
|||||
| 1 2 3 |
France
|
|||||
| app s | TCB Information | |||||
| 1 2 3 | TCB Application Email Address |
a******@dekra.com
|
||||
| 1 2 3 | TCB Scope |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
||||
| 1 2 3 |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
|||||
| app s | FCC ID | |||||
| 1 2 3 | Grantee Code |
2AAGM
|
||||
| 1 2 3 | Equipment Product Code |
GM02S
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 2 3 | Name |
S**** F****
|
||||
| 1 2 3 | Title |
PLM senior director
|
||||
| 1 2 3 | Telephone Number |
00336********
|
||||
| 1 2 3 | Fax Number |
00331********
|
||||
| 1 2 3 |
s******@sequans.com
|
|||||
| app s | Technical Contact | |||||
| n/a | ||||||
| app s | Non Technical Contact | |||||
| n/a | ||||||
| app s | Confidentiality (long or short term) | |||||
| 1 2 3 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 2 3 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 2 3 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 07/17/2021 | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 2 3 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 2 3 | Equipment Class | JAB - Part 15 Class B Digital Device | ||||
| 1 2 3 | PCB - PCS Licensed Transmitter | |||||
| 1 2 3 | CXX - Communications Rcvr for use w/ licensed Tx and CBs | |||||
| 1 2 3 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | GM02S module | ||||
| 1 2 3 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 2 3 | Modular Equipment Type | Single Modular Approval | ||||
| 1 2 3 | Purpose / Application is for | Original Equipment | ||||
| 1 2 3 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
| 1 2 3 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 2 3 | Grant Comments | Power out is conducted at the antenna terminal. This device is to be used only for mobile and fixed application. The antenna of this transmitter must provide a separation distance of at least 20 cm from all persons. The maximum antenna gain for compliance with ERP/EIRP limits and RF exposure requirements is 10.0 dBi for band 2, 7.0 dBi for band 4, and 10.6 dBi for band 12. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. The module grantee is responsible for providing the documentation to the system integrator on restrictions of use, for continuing compliance of the module. The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369. | ||||
| 1 2 3 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 2 3 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 2 3 | Firm Name |
DEKRA Testing and Certification, S.A.U.
|
||||
| 1 2 3 | Name |
F**** C******
|
||||
| 1 2 3 | Telephone Number |
34-95********
|
||||
| 1 2 3 | Fax Number |
34-95********
|
||||
| 1 2 3 |
f******@dekra.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 15B | |||||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 2 | 1 | 27 | 1710 | 1755 | 0.167 | 0.02 ppm | 1M10G7D | ||||||||||||||||||||||||||||||||||
| 2 | 2 | 27 | 1710 | 1755 | 0.166 | 0.02 ppm | 959KD7W | ||||||||||||||||||||||||||||||||||
| 2 | 3 | 27 | 698 | 716 | 0.179 | 0.02 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
| 2 | 4 | 27 | 698 | 716 | 0.177 | 0.02 ppm | 969KD7W | ||||||||||||||||||||||||||||||||||
| 2 | 5 | 24E | 1850 | 1910 | 0.163 | 0.02 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
| 2 | 6 | 24E | 1850 | 1910 | 0.158 | 0.02 ppm | 969KD7W | ||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 3 | 1 | 15B | 729.00000000 | 746.00000000 | |||||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC