FCC ID: 2AAGMGM02SA GM02S module

Data Sheet SEQUANS Communications 15-55 Boulevard Charles de Gaulle 92700 Colombes, France Phone. +33.1.70.72.16.00 Fax. +33.1.70.72.16.09 www.sequans.com contact@sequans.com About this Data Sheet Purpose and Scope The GM02S is a complete LTE Cat M1/NB1/NB2 module with baseband, RF and memory, targeted at narrow band low data rate M2M and IoT devices for wide deployment. This document provides technical information about GM02S LGA module. GM02S is based on Sequans Monarch 2 platform. Who Should Read this Document This document is intended for engineers who develop User Equipment (UE) for LTE systems. Changes in this Document This is revision 12 of the GM02S Data Sheet. The signal list delivered as MS-Excel companion file to this data sheet is unchanged. The following changes were done since the previous version of this document:

Added information about LTE-M/NB-IoT dual mode operation. i SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Table of Contents Chapter 1: General Description...................................................................... 1 1.1 Frequency Bands........................................................................................................................ 1 1.2 Applications................................................................................................................................ 2 1.3 Block Diagram............................................................................................................................2 1.4 General Features......................................................................................................................... 2 1.5 Available Part Numbers..............................................................................................................3 Chapter 2: Interfaces...................................................................................... 5 2.1 Pin Assignment...........................................................................................................................5 2.2 UART.......................................................................................................................................... 6 2.3 USIM Interfaces......................................................................................................................... 8 2.4 IC............................................................................................................................................... 9 2.5 PCM............................................................................................................................................ 9 2.6 SPI...............................................................................................................................................9 2.7 GPIO......................................................................................................................................... 10 2.8 Other Signals............................................................................................................................ 10 2.9 JTAG......................................................................................................................................... 12 2.10 Antenna................................................................................................................................... 13 Chapter 3: Electrical, RF and Thermal Characteristics................................. 14 3.1 Power........................................................................................................................................ 14 3.2 Digital I/O Characteristics........................................................................................................16 3.3 RF Performance........................................................................................................................ 17 3.4 Power Supply Dimensioning....................................................................................................18 3.5 Maximum Electrical Ratings....................................................................................................19 3.6 Thermal Considerations............................................................................................................20 Chapter 4: Mechanical Characteristics..........................................................21 4.1 Package Description................................................................................................................. 21 4.2 Environmental Conditions........................................................................................................ 22 4.3 Packing......................................................................................................................................23 4.4 Storage and Mounting.............................................................................................................. 24 4.5 Reliability Specification........................................................................................................... 25 Chapter 5: Regulatory Approval................................................................... 27 5.1 Regulatory Approval, LTE-M Operation Only........................................................................ 27 5.1.1 FCC Regulatory Approval.........................................................................................27 5.1.2 ISED Regulatory Approval....................................................................................... 29 5.1.3 NCC Regulatory Approval........................................................................................ 30 5.1.4 ACMA Regulatory Marking......................................................................................30 5.1.5 JATE TELEC Regulatory Marking........................................................................... 31 5.1.6 RED Regulatory Safety Notice................................................................................. 31 5.1.7 UKCA Regulatory Marking...................................................................................... 31 5.2 Regulatory approval, NB-IoT Operation Only........................................................................ 31 Appendix A: Acronyms...................................................................................32 1 General Description The Monarch 2 GM02S an LTE Cat M1/NB1/NB2 module based on Sequans second generation Monarch 2 chip platform. The GM02S is a total module solution, including a complete, Single-SKU RF front end capable of operating on every GSM band worldwide, and an integrated EAL5+ Secure Element (SE) capable of hosting the SIM inside the module with zero compromise on security while lowering cost and reducing complexity. The GM02S is part of Sequans next generation S family of modules, featuring a very small and cost-effective form factor that requires no external components. The GM02S leverages Sequanss 15-plus years of experience in 4G+ technologies and incorporates Sequanss carrier-approved LTE protocol stack and a software suite amongst the most mature in the industry. The GM02S is part of Sequanss next generation "S"

family of modules, featuring a very small and cost-effective form factor which requires no external components. The GM02S inherits Monarchs already certified LTE-M and NB-IoT stack and delivers a significantly improved performance and lower power consumption thanks to Sequanss second generation Monarch 2 chip and the new module architecture. Sequanss technology, both hardware and software, is completely owned by Sequans, ensuring a fast time to market and the lowest total cost of ownership for device makers. 1.1 Frequency Bands GM02S supports the following bands:

B1(2100);

B2(1900PCS);

B3(1800+);

B4(AWS-1);

B5(850);

B8(900GSM);

B12(700a);

B13(700c);

B14(700PS);

B17(700b);

B18(800Lower);

B19(800Upper);

B20(800DD);

B25(1900+);

B26(850+);

B28(700APT);

B66(AWS-3);

B71(600);

B85(700a+). 1 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 General Description Applications 1.2 Applications GM02S is ideal for adding LTE-M and/or NB-IoT LTE connectivity to narrow band, low data rate M2M and IoT devices such as utility meters, industrial sensors, health and fitness appliances, asset trackers, and many additional devices in smart home, smart city, and wearable applications. GM02S can also be used as a slim modem controlled by an external MCU via its UART. Alternatively, the GM02S can execute applets on its embedded MCU. 1.3 Block Diagram LTE Antenna GM02S RF Front End Monarch 2 SQN3430 UART I2C GPIO SPI JTAG Flash Memory Real-Time Clock Crystal/

Oscillator SIM0/SIM1 Figure 1: GM02S Block Diagram 1.4 General Features Physical Characteristics Temperature Range Power Supply Tx Power Interfaces SMS Firmware Upgrade LGA module, 120 pads. Size: 16.3 17 1.85 mm Operation temperature range: -40 to +85 C Storage: MSL3 Voltage range for RF compliance: 2.5 to 5.5 V Functional voltage range: 2.2 to 5.5 V

+23 dBm in each band Dual (U)SIM Card Interface: support for external, removable or fixed UICC. Support for integrated UICC (iUICC) with a dedicated p/n;

4x High-Speed UART Interfaces with flow control, up to 921600 bauds;

GPIOs, I2C, SPI, PWM, Pulse Counter, I2S/PCM, ADC;

Text and PDU modes UART interface, FOTA, support of full and differential firmware upgrade 2 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 General Description Available Part Numbers RoHS LTE Features All hardware components are fully compliant with EU RoHS directive, bromine-free 3GPP LTE Release 13/14 Cat M1/NB1/NB2 compliant;

LTE Cat M1: 1.1 Mbps / 0.3 Mbps UL/DL throughput;

LTE Cat NB1: 62.5 kbps / 27.2 kbps UL/DL throughput;

LTE Cat NB2: 160 kbps / 120.7 kbps UL/DL throughput. 1.5 Available Part Numbers GM02Ss ECCN is 5A991. Table 1: Available Part Numbers Available PartNumber Hardware Version Software Build (ATI1) UE Version

(ATI1) PTCRB Model Name Model

GM02RB6QRC HW Rev.2 LR 8.0.1.2 UE 8.0.1.2 See note below FCC/IC/

RED/

UKCA/

ACMA/

JATE/

TELEC/

PTCRB/

GCF GM02RB6QRD HW Rev.2 LR 8.0.4.3 UE 8.0.4.3 See note below FCC/IC/

RED/

UKCA/

ACMA/

NCC/

JATE/

TELEC/

PTCRB/

GCF GM02RB6QRE HW Rev.2 LR 8.0.5.10 UE 8.0.5.10 See note below FCC/IC/

RED/

UKCA/

ACMA/

NCC/

JATE/

TELEC/

PTCRB/

GCF SVN Availability Status See note below Obsolete. Not recommended for new designs. See note below Available See note below See note below Note: Please contact your local technical representative to pick the appropriate part number for your project. 3 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 General Description Available Part Numbers Note: There is still no available part number corresponding to the dual-mode version of the GM02S. Dual-mode LTE-M/NB-IoT pre-commercial software release is however available and can be activated after a software upgrade from the LTE-M single-

mode module version. Please contact your local technical representative for detailed information 4 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 2 Interfaces The GM02S provides electric interfaces connecting it to the external parts, such as communication I/O ports, GPIO and antenna RF I/O. This chapter provides information about all these interfaces. Power supply pins and details thereof are detailed in section Electrical, RF and Thermal Characteristics. Important: Please refer to this data sheets companion MS-Excel file for details on each pins:

Default assigned function;

State during low power modes;

Configurability with AT commands;

Pull status and requirements. 2.1 Pin Assignment Figure 2: GM02S Module Pads Assignments 5 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces UART 2.2 UART When the GM02S is used as a slim modem, it has three UARTs available. The default function for each UART is as follows:

UART0: data and control from external MCU via AT commands UART1: debug and upgrade UART2: modem console This default configuration can be overridden. In addition, a fourth UART (UART3) is available for applications running on the GM02S . Note: See section Power for behaviour of I/Os in Deep Sleep mode. Table 2: UART Signals Pad #

36 34 35 33 32 30 31 29 28 26 Pad Name GPIO12/

TXD0 GPIO13/

RXD0 GPIO14/

CTS0 Primary Function Alternate Function 1 Power Group Direction Pad type Reset state 2 TXD0 GPIO12 PVDD_1V8 In/Out BIDIR High-Z, 2mA In for primary function, UART0 RXD0 GPIO13 PVDD_1V8 In/Out BIDIR Out-1, 2mA Out for primary function, UART0 CTS0 GPIO14 PVDD_1V8 In/Out BIDIR Out-1, 2mA Out for primary function, UART0 RTS0 RTS0 N/A PMU_5V In IN High-Z Wake signal enabled by default. TXD1 TXD1 N/A PVDD_1V8 In BIDIR High-Z, 2mA UART1 RXD1 RXD1 N/A PVDD_1V8 Out BIDIR Out-1, 2mA UART1 CTS1 CTS1 N/A PVDD_1V8 Out BIDIR Out-1, 2mA UART1 RTS1 RTS1 N/A PMU_5V In IN High-Z GPIO15/

TXD2 GPIO16/

RXD2 Wake signal enabled by default. TXD2 GPIO15 PVDD_1V8 In/Out BIDIR High-Z, 2mA In for primary function, UART2 RXD2 GPIO16 PVDD_1V8 In/Out BIDIR Out-1, 2mA Out for primary function, UART2 1 Alternate functions will be available in future versions via SW upgrade. 2 UART pad typess electrical characteristics are detailed in Table 19 and Table 20. 6 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces UART Pad #

27 25 24 22 21 23 Pad Name GPIO17/

CTS2/

DCD0 GPIO18/

RTS2/

DSR0 GPIO19/

TXD3 GPIO20/

RXD3 GPIO21/

CTS3 GPIO22/

RTS3 1 Alternate Function CTS2/

DCD0 RTS2/

DSR0 Primary Function GPIO17 UART2 GPIO18 UART2 Power Group Direction Pad type Reset state 2 PVDD_1V8 In/Out BIDIR Out-1, 2mA PVDD_1V8 In/Out BIDIR GPIO19 TXD3 PVDD_1V8 In/Out BIDIR In for primary function, UART3 GPIO20 RXD3 PVDD_1V8 In/Out BIDIR Out-1, 2mA Out for primary function, UART3 GPIO21 CTS3 PVDD_1V8 In/Out BIDIR Out-1, 2mA UART3 GPIO22 RTS3 PVDD_1V8 In/Out BIDIR Out-1, 2mA UART3 High-Z, 2mA HighZ, 2mA High-Speed UARTs Flow Control Signals CTS0, CTS1, CTS2, CTS3: Clear-To-Send signals of resp. UART0, UART1, UART2, UART3 (active low). To be connected to the CTS of the remote UART device. See Figure 3. Leave CTS unconnected if hardware flow control is not used. RTS0, RTS1, RTS2, RTS3: Ready-To-Send signals of resp. UART0, UART1, UART2, UART3 (active low). To be connected to the RTS of the remote UART device. Tie to a 1 k pull-down when flow control is not used. If connected to an external part (like a RS-232 driver), the user must insure that the part presents a low level to the GM02S See Figure 3. Figure 3 represents the typical implementation for hardware flow control. GM02S Applicaon TXD0/TXD1/TXD2/TXD3 RXD0/RXD1/RXD2/RXD3 RTS0/RTS1/RTS2/RTS3 CTS0/CTS1/CTS2/CTS3 TXD RXD RTS_N CTS_N Figure 3: UART Convention and Flow Control Note: Please refer to Module Integration Guide for details on UART connections. 1 Alternate functions will be available in future versions via SW upgrade. 2 UART pad typess electrical characteristics are detailed in Table 19 and Table 20. 7 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces USIM Interfaces 2.3 USIM Interfaces 2.3.1 SIM0 Interface This is the main external SIM interface. It can be used with removable or non-removable SIM cards or with soldered SIM chips. The modem manages the SIMs power supply to keep consumption as low as possible. Note: See Section Power for behaviour of I/Os in Deep Sleep mode. Table 3: SIM0 Signals Pad #

Pad Name Primary Function Power Group Direction Pad type SIM0_CLK SIM0_CLK PVDD_1V8 Out BIDIR 3 Reset State Out-0, 2mA Comment Main SIM SIM0_DETECT 4 SIM0_DETECT PMU_5V In IN High-Z Main SIM SIM0_IO SIM0_IO PVDD_1V8 In/Out BIDIR SIM0_RSTN SIM0_RSTN PVDD_1V8 Out BIDIR SIM0_VCC 5 SIM0_VCC PVDD_1V8 Out SUPPLY High-Z, 2mA Out-0, 2mA Out-0, 2mA Main SIM Main SIM Main SIM 42 45 44 43 73 2.3.2 SIM1 Interface This GM02S s interface to a second SIM is typically meant for soldered SIM chips (since it lacks SIM detect and SIM VCC). If the board makes use of a single SIM, it should be connected to the main SIM interface (see Section SIM0 Interface above). Note: See Section Power for behaviour of I/Os in Deep Sleep mode. Table 4: SIM1 Signals Pad #

Pad Name Primary Function Alternate Function 6 Power Group Direction Pad Type Reset state 7 40 41 39 GPIO26/

SIM1_CLK GPIO27/

SIM1_RESETN GPIO25/

SIM1_IO GPIO26 SIM1_CLK PVDD_1V8 Out BIDIR GPIO27 SIM1_RESETN PVDD_1V8 Out BIDIR GPIO25 SIM1_IO PVDD_1V8 In/Out BIDIR Out-0, 2mA Out-0, 2mA High-Z, 2mA 3 USIM pad types electrical characteristics are detailed in Table 19 and Table 20. 4 SIM0_DETECT is active high (high when a card is present, low when no card is present). It can be configured as a WAKE pin via software command. 5 See range of values in Table 13. 6 Alternate functions will be available in future versions via SW upgrade. 7 Pad types electrical characteristics are detailed in Table 19. 8 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces IC Important: Both SIM0 and SIM1 interfaces use 1.8V signalling. 2.4 IC Note: See Section Power for behaviour of I/Os in Deep Sleep mode. Table 5: IC Pad Details Pad #

Pad Name Primary Function Alternate Function 8 Power Group Direction Pad type Reset State 9 95 97 GPIO23/

I2C_SDA GPIO24/

I2C_SCL GPIO23 I2C_SDA PVDD_1V8 In/Out BIDIR High-Z GPIO24 I2C_SCL PVDD_1V8 In/Out BIDIR High-Z 2.5 PCM Note: See section Power for behaviour of I/Os in Deep Sleep mode. Table 6: PCM Pad Details Pad #

Pad Name Primary Function Alternate Function 10 Power Group Direction Pad type Reset State 11 96 98 99 100 GPIO4/

PCM_CLK GPIO3/

PCM_RXD GPIO5/

PCM_FS GPIO6/

PCM_TXD GPIO4 PCM_CLK PVDD_1V8 In/Out BIDIR High-Z GPIO3 PCM_RXD PVDD_1V8 In/Out BIDIR High-Z GPIO5 PCM_FS PVDD_1V8 In/Out BIDIR High-Z GPIO6 PCM_TXD PVDD_1V8 In/Out BIDIR High-Z 2.6 SPI Note: See section Power for behaviour of I/Os in Deep Sleep mode. 8 Alternate functions will be available in future versions via SW upgrade. 9 IC pad typess electrical characteristics are detailed in Table 19. 10 Alternate functions will be available in future versions via SW upgrade. 11 PCM pad typess electrical characteristics are detailed Table 19. 9 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces GPIO Table 7: SPI Pad Details Pad #

Pad Name Primary Function Alternate Function 12 Power Group Direction Pad type Reset state 13 3 4 2 5 7 GPIO7/

SPI_SDI GPIO8/

SPI_SDO GPIO9/

SPI_CLK GPIO10/

SPI_CSN1 GPIO11/

SPI_CSN2 GPIO7 SPI_SDI PVDD_1V8 In/Out BIDIR High-Z GPIO8 SPI_SDO PVDD_1V8 In/Out BIDIR High-Z GPIO9 SPI_CLK PVDD_1V8 In/Out BIDIR High-Z GPIO10 SPI_CSN1 PVDD_1V8 In/Out BIDIR High-Z GPIO11 SPI_CSN2 PVDD_1V8 In/Out BIDIR High-Z 2.7 GPIO 33 GPIOs are available on the GM02S the first 28 are named GPIO1 to GPIO28 and the last five GPIO31 to GPIO35. The GPIOs listed in Table 8 are not enabled by default. Their states are controlled by software. Table 8: GPIO pads detail GPIO Range GPIO3 to GPIO11 GPIO17 to GPIO28 GPIO31 to GPIO32 Default State Disabled Disabled Disabled The GPIOs are documented in this data sheet according to their shared or assigned function. In addition to the GPIO, five wake signals are also available (see section Other Signals). 2.8 Other Signals Table 9: GND and DNC pads Pads Type GND Pads Number 1, 6, 37, 38, 50, 51, 52, 54, 56, 58, 59, 61, 64, 65, 71,78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 91, 92, 93 DNC (Reserved) 15, 17, 53, 74, 75, 76, 77, 94 Note: See Section Power for behaviour of I/Os in Deep Sleep mode. 12 Alternate functions will be available in future versions via SW upgrade. 13 SPI pad types electrical characteristics are detailed in Table 19. 10 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces Other Signals Table 10: Other Signals (No Interface) Pad #

Name 72 ADC1 Primary Function ADC1 Note 14) 14 Alternate Function Power Group Direction Pad Type Reset State 15

(see N/A N/A In IN N/A 12 13 14 19 18 9 10 11 14 20 GPIO1/

STATUS_LED GPIO2/

PS_STATUS GPIO28/

DTR0 GPIO31/

PWM0/

PULSE0/

19M2_OUT GPIO32/

PWM1/

PULSE1 GPIO33/

TX_IND GPIO34/

ANT_TUNE0 GPIO35/

ANT_TUNE1 GPIO28/

LNA_ENABLE RESERVED/

FFF_FFH Analogue-Digital Converter (ADC, IN) STATUS_LED GPIO1 PVDD_1V8 In/Out BIDIR Primary Function: Status LED (STATUS_LED, OUT) PS_STATUS GPIO2 PVDD_1V8 In/Out BIDIR High-Z, 2mA High-Z, 2mA Primary Function: Power Saving status (PS_STATUS, OUT) enabled by default. Active high. GPIO28 Note 14) GPIO31 Note 14)

(see DTR0 PVDD_1V8 In/Out BIDIR High-Z

(see PWM0/

PULSE0/

19M2_OUT PVDD_1V8 In/Out BIDIR High-Z GPIO32 Note 14)

(see PWM1/

PULSE1 PVDD_1V8 In/Out BIDIR High-Z TX_IND GPIO33 PVDD_1V8 In/Out BIDIR High-Z, 2mA Primary Function: Transmission indicator (TX_IND, OUT). Active high. ANT_TUNE0 GPIO34 PVDD_1V8 In/Out BIDIR Primary Function: Antenna tuning (ANT_TUNE0, OUT) ANT_TUNE1 GPIO35 PVDD_1V8 In/Out BIDIR Primary Function: Antenna tuning (ANT_TUNE1, OUT) LNA_ENABLE GPIO28 PVDD_1V8 In/Out BIDIR Primary Function: External GNSS LNA enable signal RESERVED N/A PVDD_1V8 N/A BIDIR High-Z, 2mA High-Z, 2mA High-Z, 2mA High-Z, 2mA Boot mode selection (FFF_FFH, IN). This pad needs a pull-down resistor by default. RESERVED RESERVED N/A PVDD_1V8 N/A BIDIR N/A Do not connect 15, 17, 53, 74, 75, 76, 77, 94 46 RESETN RESETN N/A PMU_5V In IN In, Pull-up 14 Functions will be available in future versions via SW upgrade. 15 Pad typess electrical characteristics are detailed in Table 19 and Table 20. 11 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces JTAG Pad #

Name Primary Function 14 Alternate Function Power Group Direction Pad Type Reset State 15 Module HW reset signal. Active low. The minimum duration of a reset pulse on the RESETN signal is 100s. 16 RING0 RING0 N/A PVDD_1V8 In/Out BIDIR High-Z, 2mA UART0 ring line (RING0, OUT). Enabled by default with inverted polarity. 48 47 49 55 57 WAKE0 WAKE0 N/A PMU_5V In Wake #0 input line (WAKE0, IN), disabled by default. WAKE1 WAKE1 N/A PMU_5V In Wake #1 input line (WAKE1, IN), disabled by default. WAKE2 WAKE2 N/A PMU_5V In Wake #2 input line (WAKE2, IN), disabled by default. WAKE3 WAKE3 N/A PMU_5V In Wake #3 input line (WAKE3, IN), disabled by default. WAKE4 WAKE4 N/A PMU_5V In IN IN IN IN IN Wake #4 input line (WAKE4, IN), disabled by default. High-Z High-Z High-Z High-Z High-Z 2.9 JTAG Note: See Section Power for behaviour of I/Os in Deep Sleep mode. Table 11: JTAG pads Details Pad #

Pad Name Primary Function Power Group Direction Pad type Reset State 16 69 67 68 66 70 JTAG_TCK JTAG_TCK PVDD_1V8 JTAG_TDI JTAG_TDI PVDD_1V8 In In IN IN Pull-down, In, Schmitt-trigger In, Pull-up JTAG_TDO JTAG_TDO PVDD_1V8 Out BIDIR Out, 0 JTAG_TMS JTAG_TMS PVDD_1V8 JTAG_TRSTN JTAG_TRSTN PVDD_1V8 In In IN IN In, Pull-up In, Pull-down Note: The GM02S does not support boundary scan (IEEE 1149.1) for production testing. 14 Functions will be available in future versions via SW upgrade. 15 Pad typess electrical characteristics are detailed in Table 19 and Table 20. 16 JTAG pad typess electrical characteristics are detailed in Table 19. 12 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Interfaces Antenna 2.10 Antenna Table 12: Antenna pad Details Pad #

Pad Name 90 LTE_ANT Direction In/Out Comments Main Antenna, for Rx and Tx 13 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 3 Electrical, RF and Thermal Characteristics 3.1 Power 3.1.1 Power Pads Characteristics Note: Pad 1V8 is the reference voltage for I/Os. It can be used to provide power to small devices (100mA maximum usage). This voltage is not available when the modem is in Deep Sleep mode. When the modem is in standby the voltage drops to 1.62V as per Table 13. Table 13: Power Pads Pad #

Pad Name Power Group Direction Min Value Typical Value Max Value 8 73 1V8 (see Note above) PVDD_1V8 Out 1.62V 1.8V 1.98V SIM_VCC 17 PVDD_1V8 Out 60, 62, 63 VBAT N/A In 1.62V 2.2V 1.8V 1.98V 5.5V Note: Reference VBAT voltage range is 2.5V to 5.5V for RF-compliant operation and 2.2V to 5.5V for functional operation with possible degradation of RF performances. 3.1.2 Power-Up and Reset Sequences Important: The 1V8 power signal can remain low up to 370 s after the VBAT rising edge Figure 4: Typical Timing Diagram for Power-Up Sequence 17 See also Section USIM Interfaces. 14 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Electrical, RF and Thermal Characteristics Power Figure 5: Typical Timing Diagram for Reset Sequence Note: since RESETN is pulled-up internally, RESETN does not need to be held low after VBAT is established, as shown in Figure 5. There is no timing condition between RESETN and VBAT. Note: RESETN minimum duration for reliable detection is 100 s 3.1.3 Power States Figure 6 represents the electrical states of the module and their transitions. RESET Asserted Power O Vba ON Power On RESET Released Acve Standby Sleep Command WAKE Source Sleep Deep Sleep Figure 6: Electrical States and Transitions Power modes are described in Table 14 and illustrated in Figure 6. Table 14: Power Modes Description Power Mode LTE Mode Available Interfaces Active Standby Sleep Deep Sleep Connected (RF on) Connected (RF off) All interfaces All interfaces Short eDRX idle duration RRC Idle WAKE pins (including RTS0/1) PSM eDRX idle, Long duration, radio-off, airplane idle WAKE pins (including RTS0/1) 3.1.4 In Deep Sleep mode, the Digital PVDD_1V8 bi-directional I/Os are completely powered off and behave like 50M high-impedance pins. PVDD_1V8 BIDIR Pads State in Deep Sleep mode 15 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Electrical, RF and Thermal Characteristics Digital I/O Characteristics 3.1.5 PMU_5V IN Pads State in Deep Sleep mode In Deep Sleep mode the digital PMU_5V inputs are completely powered off and behave like 180M high-impedance pins. Table 15 gives the values of the measured leakage current (measurements taken on silicon) for the PMU wake inputs. Table 15: Measured Leakage Current for the PMU Wake Inputs Minimum 3 nA Typical 4 nA Maximum 12 nA Table 16 shows values of the external pull-up/pull-down resistor to be used at the PMU wake inputs pads. Table 16: External Pull-up/Pull-down Resistor at PMU Wake Input Pads Minimum 1 k Typical 10 k Maximum 100 k Table 17 details the PMU wake input pulses detection mechanism timings. Table 17: PMU Wake Input Pulses Detection Mechanism Timings Maximum pulse width guaranteed to be ignored Minimum pulse width guaranteed to be recognised 11.1 ns 100 s Table 18 provides the internal pull-up current range at RESETN. Table 18: Internal Pull-Up Current at RESETN Pad Minimum 73.5 nA 3.2 Typical 100 nA Maximum 160.5 nA Digital I/O Characteristics This section details the voltage and current characteristics of the various I/O pads of the GM02S . The I/Os belong either one of two power groups:

PVDD_1V8 PMU_5V The operational voltage range of both power groups is described in Table 19 and Table 20. CAUTION: Designers must ensure that the input voltage on any of the I/O pads never exceeds the VIH of the power group they belong to. See Table 19 for the digital I/O characteristics of the different I/O pads. Refer to each interface of the GM02S in chapter Interfaces for the power group and I/O pad type of each pad. Note that IN pads are inputs only whereas BIDIR can be both inputs and outputs. 16 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Electrical, RF and Thermal Characteristics RF Performance Table 19: DC Ratings for Digital I/Os, PVDD_1V8 Power Group Minimum Maximum Unit Symbol VIH Input HIGH level VIL Input LOW level VOH Output HIGH voltage VOL Output LOW voltage IRPU Input pull-up resistor current RRPU Input pull-up resistance IRPD Input pull-down resistor current RRPD Input pull-down resistance VH Input hysteresis 1.26 0 1.44 0 15 27 15 27 0.18 IPAD Input leakage current, non-tolerant

-1 IOZ Off-State leakage current 3.3 0.54 1.8 0.36 34 34 1 1 Table 20: DC Ratings for Digital I/Os, PMU_5V Power Group Symbol VIH Input HIGH level VIL Input LOW level Minimum Maximum 0.8 0 VBAT + 0.6 (max. 5.5) 0.2 V V V V A k A k V A A Unit V V 3.3 RF Performance Important: For proper operation, the VSWR at the antenna pad must be better than 2:1 in conducted mode and 3:1 in radiated mode. A higher value could result either in poor RF performance, reduced Tx power or increased sideband/harmonic emission levels. Very high VSWRs can permanently damage the power amplifier. It is recommended to add a DC blocking capacitor in series with the module RF input/

output pad (#90). 3.3.1 RF Sensitivity The GM02S exhibits the following typical RF sensitivity at 2.5V:

Table 21: RF Sensitivity Technology LTE-M NB-IoT Band Low Bands: B5, B8, B12, B13, B14, B17, B18, B19, B20, B26, B28, B71, B85 Typical Sensitivity

-105 dBm High bands: B1, B2, B3, B4, B25, B66 -106 dBm Low Bands: B5, B8, B12, B13, B17, B18, B19, B20, B26, B28, B71, B85

-108 dBm 17 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Electrical, RF and Thermal Characteristics Power Supply Dimensioning Technology Band Typical Sensitivity High bands: B1, B2, B3, B4, B25, B66 -108 dBm 3.3.2 RF Output Power The GM02S maximum output power within the recommended operating range (from 2.5 to 5.5V) is given in Table 22. Table 22: RF Max Output Power Bands All Bands Output Power 23 dBm 1 dB 3.3.3 RF performance at 2.2 V While it is not recommended to operate the GM02S in the range 2.2 to 2.5V, the RF section will continue to work normally, albeit with reduced TX output power as shown in Table 23 below. Table 23: RF Performance at 2.2 V compared to 2.5 V Temperature Sensitivity Loss Output Power Loss

-30 C 25 C 85 C 3.4 No loss No loss No loss 1.1 dB 1.1 dB 1.7 dB Power Supply Dimensioning This section provides guidance to designers working on the power supply or selecting a suitable battery to power the GM02S . 3.4.1 Overview The current consumption of the GM02S peaks before every TX sub-frame as shown in Figure 7. In this figure, the time division is 50s. Around 150s from the start, two current pulses peaking 34% higher than the average current consumption during the 23 dBm TX tone which follows can be observed. Figure 7: Current Consumption in TX Sub-Frame 3.4.2 Peak Current Measurement Method Sequans recommends to use the setup represented in Figure 8 for peak current measuring. This setup was used to record the measurements presented in Table 24. Note that:

18 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Electrical, RF and Thermal Characteristics Maximum Electrical Ratings 1. 2. 3. 4. Voltage probes are placed close to module VBAT input;

Voltage probes accuracy is calibrated using a current probe;

A large capacitance Cbatt is placed close to the VBAT pin to simulate a battery and screen the device from the parasitic inductances of the cables and tracks;

2 22F capacitors (Cext) are placed between the voltage probes and the module VBAT input to soften the current peaks. Figure 8: Setup for Current Peak Measurement 3.4.3 Peak Current Measurement Table 24 gives the peak current values measured on the setup shown on Figure 8 for different voltages and temperatures. Table 24: Peak Current Measurements Input Voltage T = -40C 5.5 V 3.8 V 2.5 V 2.2 V 328 mA 475 mA 705 mA 676 mA 3.4.4 Margin T = -30C 305 mA 438 mA 667 mA 640 mA T = +25C T = +85C 263 mA 444 mA 679 mA 652 mA 268 mA 479 mA 741 mA 717 mA Important: It is recommended that designs potentially sensitive to the current peaks described in this section use the recommended Cext 2 22F and dimension the power supply with an extra 20% margin w/r to the values provided in this section. 3.5 Maximum Electrical Ratings Table 25: Maximum Electrical Ratings Parameter Supply Voltage VBAT Minimum

-0.2 V I/Os in Power Group PVDD_1V8

-0.2 V Maximum 5.5 V 4.125 V 19 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Electrical, RF and Thermal Characteristics Thermal Considerations Parameter Minimum I/Os in Power Group PMU_5V

-0.2 V Maximum 6.0 V 3.6 Thermal Considerations Special attention needs to be given to thermal dissipation. The outer layers of the host board must be covered in as many wide copper areas as possible, and those must be stitched with evenly spaced ground vias. Care must be taken that no air gap exists along the thermal path from the GM02S to the dissipating copper area(s). Gaps can be filled with heat conducting materials such as GapPad. The Gxx pads should be tied to a large ground plane on the customer's PCB layer 1. It is also recommended to have the Gxx pads area on the PCB stitched with through ground vias to improve thermal dissipation. If the host board is piggybacked over a larger board, the aforementioned heat dissipation considerations should be applied to both the main and the daughter board. 20 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 4 Mechanical Characteristics 4.1 Package Description The package size with tolerance is (16.3 0.15)mm (17.0 0.15)mm (1.85 max)mm. Maximum warpage is 0.13 mm (as per JEITA ED7306). The GM02S weights 0.85g. Figure 9: Module Top and Side Views Table 26: Module Dimensions (mm) Figure 10: Module PCB View Dimension L W T T0 L1 W1 L2 Value (mm) 16.3 0.15 17.0 0.15 1.85 max 0.426 max 0.5 0.1 0.7 0.1 0.8 0.1 21 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Mechanical Characteristics Environmental Conditions Dimension W2 a1 a2 a3 a4 a5 b1 b2 b3 b4 b5 P1 P2 P3 P4 Value (mm) 0.8 0.1 2.25 0.1 3.05 0.1 1.45 0.1 2.45 0.1 6.5 0.1 2.0 0.1 3.0 0.1 3.1 0.1 5.5 0.1 5.95 0.1 0.3 0.1 0.3 0.1 0.4 0.1 0.4 0.1 Figure 11: GM02S Laser Marking Notes on Figure 11:

1. 2. 3. 4. 5. 6. 7. The triangle in the bottom-right corner provides pin #1 location. FCC ID: 2AAGMGM02SA IC: 12732A-GM02SA IMEI:XXXXXXXXXXXXXXX S/N:G2PYYMMDDNNNNSSS (16 digits) G2P: reserved, value subject to change at Sequans discretion (3 digits);

YYMMDD: Manufacturing Date (YY:Year;MM:Month,DD:Day);

NNNN: Panel counter (from 0001~9999);

SSS: Piece location on panel (from 001 to 065). 2D marked a refer to IMEI Barcode 2D marked b refer to S/N Barcode 4.2 Environmental Conditions GM02S operating conditions:

22 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Mechanical Characteristics Packing Temperature (PCB temperature as measured by on-board thermistor):

Operational: -40C to +85C;

RF compliant: -30C to +85C Humidity: 10% to 85% (non-condensing) 4.3 Packing The GM02S is delivered in Tape-and-Reel. Details are provided in the figures below. Figure 12: Packing Modules in Reels Figure 13: Packing Reels in Boxes The full box set weights about 5.95 kg. 23 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Mechanical Characteristics Storage and Mounting The label attached to reels, vacuum bags, and the PP boxes is shown in Figure 14. The label attached to the cardboard box (which contains 3 PP boxes) is shown in Figure 15. Figure 14: Reel, Vacuum Bag and PP Box Label Figure 15: Cardboard Box Label 4.4 Storage and Mounting The GM02S module is Moisture Level 3 rated as per JEDEC industrial standard. The GM02S is JEDEC J-STD-033D compliant and can be stored at T<40C and relative humidity<90%. The GM02S can withstand up to three reflows at a maximum of 250 C. Table 27: Reflow Profile Profile Feature Solder Paste Alloy Sn 96.5/Ag 3.0/Cu 0.5 (Lead Free solder paste) Peak Package Body Temperature 235 C to 245 C Fusion Time Pre-heat / Soak Ramp-up Rate Ramp-down Rate Temp: over 220C Duration: 60 ~ 90 s Temp: 150 ~ 200 C Time: 60 ~ 120 s

< 3 C/s

-3 to 0 C/s 24 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Mechanical Characteristics Reliability Specification Profile Feature Air composition N2, O2 contents less than 1,500 ppm Figure 16: Reflow Profile Parameters Recommended stencil thickness: 0.1 to 0.13 mm (prefer 0.1 mm). More detail on the PCB land pattern will be provided in a future edition of the document. 4.5 Reliability Specification GM02S has been tested against Sequans's industrial reliability specification as described in Table 28. Table 28: Reliability Test Plan Item Test conditions Standard

#Samples Result Preconditioning

(a) Bake: 125C / 24 hours JESD22-A113 175 PASS

(b) MSL3: 30C/60% RH, 192 hrs

(c) SAT (CSAM & TSCAN)

(d) X-ray

(e) Reflow 3 cycles at Tp:2502C

(f) SAT (CSAM & TSCAN) TC THB Temperature Shock Cycling (TC):

JESD22-A104 25 PASS

-40C to +85C air to air, 20 minutes, ramp rate 20C/minute, 1000 cycles Temperature Humidity Bias Test

+85C, 85 % RH, Vcc Max, Read Point at 168/500/1,000 hrs JESD22-A101 25 168 hrs: PASS 500/1,000 hrs: see note below Environmental Testing - A Cold Environmental Testing Test A Cold. -40C, 500 hrs Environmental Testing - B Dry Heat Environmental Testing Test B Dry Heat. +85C, 500 hrs IEC60068-2-1 JESD22-A119 IEC60068-2-2 JESD22-A103 HTOL High Temperature Operating Test N/A 25 25 50 PASS PASS PASS 75C, Vcc max, Tx: 50% / Rx: 50%. Read Point at 283/500/1,000 hours 25 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Mechanical Characteristics Reliability Specification Item Shock Test conditions Standard

#Samples Result Mechanical Shock (MS) DIN IEC 68-2-27 15 PASS

(Half Sine, 500G, 1.0 ms, 1 shock for each axis) Drop Drop Test Vibration 1. Height: 80cm;

2. Concrete or steel;

3. All surfaces and edges. Vibration Test (Vib) Sweep-Sine Vibration. Sinusoidal, 10 ~ 500 Hz, 1.0octave/

min, 10 sweep cycles for 2 hr for each axis. DIN IEC 68-2-31 ETS 300019-2-7 15 PASS DIN IEC 68-2-6 571 EIA/TIA 4.1.1.2 15 PASS ESD HBM Start: 1000V, Stop: 1500V JS-001JESD22-

A114 CDM Start: 250V, Stop: 500V JS-002STM5.3.1 TCT Temperature Change Test IEC60068-2-14 12 12 25 PASS PASS PASS 10 cycles; 1 cycle has the following steps (roughly 7+ hrs):

Ramp from ambient (23C) to

-40C at 3C/min. 3 hrs at - 40C Ramp to 85C at 3C/min 3 hrs at 85C Ramp from 85C to 23C at 3C/

min Note: THB test is ongoing. Results will be provided in a future edition of the document. 26 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 5 Regulatory Approval 5.1 Regulatory Approval, LTE-M Operation Only 5.1.1 FCC Regulatory Approval FCC-ID: 2AAGMGM02SA (single modular approval) This above identified LTE radio module is not intended to be provided to end-users but is for installation by OEM integrators only. Installation/Integration OEM integrators must follow Sequans installation instructions to provide for and benefit from FCC compliant module integrations and must abide especially by the following provisions:

The maximum antenna gain values (accounting for cable attenuation) to comply with the FCC maximum ERP/EIRP limits and with RF Exposure rules:

LTE band 2 (1900 PCS): 8.0 dBi LTE band 4 (AWS-1): 5.0 dBi LTE band 5 (850): 9.4 dBi LTE band 12 (700a): 8.6 dBi LTE band 13 (700c): 9.1 dBi LTE band 17 (700b): 8.7 dBi LTE band 25 (1900+): 8.0 dBi LTE band 66 (AWS-3): 5.0 dBi Sequans's module integration guidelines must be closely followed. Compliance of host integrations of the module is limited to hosts adaptation designs which are identical to Sequans' reference design. Host integrations with adaption designs deviating from Sequans' reference design require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID;

Host integrations with co-located (simultaneously operating) radio transmitters must be evaluated in accordance with FCC multi-transmitter rules and may require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID, dependent on the result of the evaluation; Inquiry at FCC or a TCB is urgently recommended. Integrations of the module into host products which are intended for portable use, i.e. less than 20cm distance between its radiating structures (antenna) and the body of nearby persons, or which otherwise put additional technical requirements like Hearing Aid compatibility require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID;

Compliance with Unwanted Emission Limits for Digital Device 27 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Regulatory Approval Regulatory Approval, LTE-M Operation Only If the OEM host integration fully complies with the above described reference design and can completely inherit and rest on compliance of the existing modular approval the OEM remains still responsible to show compliance of the overall end-product with the FCC limits for unwanted conducted and radiated emissions from the digital device

(unintentional radio) portion of such end-product (commonly addressed as part 15B compliance or similar). End-product Labelling The module's FCC-ID must either be visible from the exterior of the host product (e.g. per window) or per electronic display, or shall be displayed on an additional exterior label per the following or similar string: contains FCC-ID: 2AAGMGM02SA Digital Device - Unwanted Emissions Notice: If the end-product falls under part 15 of the FCC rules (it shall display the following user notice on its exterior acc. to part 15.19

(the notice may be printed in the manual in case the host is too small):

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Further Labelling Requirements may apply dependent on the FCC rule parts relevant to the host product. End-product User Instructions / Notices in the Manual: At a minimum, end-product users must be provided with the following notices at a prominent location of the product literature furnished with the product:

Product Modifications: Modifications not expressly approved by the party responsible for compliance could void the users authority to operate this equipment. RF Exposure Compliance: This equipment complies with FCC radio frequency radiation exposure rules and limits set forth for an uncontrolled environment, when installed and operated with minimum distance of 20 cm between its radiating structures

(antenna) and the body of nearby persons and when not operated simultaneously with other nearby radio-transmitters. Maximum Antenna Gain: The user instructions of end-products equipped with standard external antenna connectors for the modular radio transmitter providing the option to connect other antennae than those which may or may not be bundled with the end-product must list the maximum allowed antenna gain values as derived from those given above, accounting for the cable attenuations of the actual installation. Digital Device - Unwanted Emissions Notice: If the end-product is or contains a digital device (unintentional radio portions) and is not exempted by its use case

(like vehicular use) the following part 15.105 (b) user notice shall be provided at prominent location of the product literature:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is 28 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Regulatory Approval Regulatory Approval, LTE-M Operation Only encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna;

Increase the separation between the equipment and receiver;

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected;

Consult the dealer or an experienced radio/TV technician for help Further User Notices: May be required dependent on the FCC rule parts relevant to the host product. Non-allowed User Instructions: The end-product user guidance may NOT include instructions about how to install or de-install the module. 5.1.2 ISED Regulatory Approval This device complies with ISEDs licence exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR de lISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit supporter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. This device is intended only for OEM integrators under the following conditions: (For module device use) 1. 2. The antenna must be installed such that 20 cm is maintained between the antenna and users, and The transmitter module may not be co located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1. 2. L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et Le module metteur peut ne pas tre co implant avec un autre metteur ou antenne. Tant que les deux conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. LTE band 2 (1900 PCS): 8.0 dBi LTE band 4 (AWS-1): 5.0 dBi LTE band 5 (850): 6.1 dBi LTE band 12 (700a): 5.6 dBi LTE band 13 (700c): 5.9 dBi LTE band 17 (700b): 5.6 dBi 29 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Regulatory Approval Regulatory Approval, LTE-M Operation Only LTE band 25 (1900+): 8.0 dBi LTE band 66 (AWS-3): 5.0 dBi IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorisation is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate Canada authorisation. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labelling This transmitter module is authorised only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC:12732A-GM02SA. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20 cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: Contient des IC: 12732A-GM02SA. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. 5.1.3 NCC Regulatory Approval Installation/Integration MPE 0.90 mW/ cm 0.059 mW/cm20 5.1.4 ACMA Regulatory Marking 30 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Regulatory Approval Regulatory approval, NB-IoT Operation Only 5.1.5 JATE TELEC Regulatory Marking 5.1.6 RED Regulatory Safety Notice CAUTION: Equipment must be supplied by ES1, PS1 circuits according to the standard EN 62368-1. 5.1.7 UKCA Regulatory Marking 5.2 Regulatory approval, NB-IoT Operation Only Certification of NB-IoT pre-commercial software release is under way with FCC, ISED, ACMA, RED, UKCA. 31 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 A Acronyms Acronym Definition ADC CPU DL ESD ETSI GND GPIO I/O IC Analog to Digital Converter Central Processing Unit Downlink Electro-static discharge European Telecommunications Standard Institute Ground General Purpose Input Output Input/Output Inter-Integrated Circuit interface IMEI International Mobile Equipment Identity IP Internet Protocol JTAG Joint Test Action Group LGA LNA LTE Large Grid Array Low-Noise Amplifier Long Term Evolution, or 4G. Standard is developed by the 3GPP. MIMO Multiple In Multiple Out NAS Network Access Server OMADM Open Mobile Alliance Device Management PCM PHY RED SAW RF Pulse-Code Modulation Physical Layer European Radio Equipment Directive Surface Acoustic Wave (filter) Radio Frequency RoHS Restriction of Hazardous Substances Rx S/N SIM SMS SPI Tx Reception or SN: Serial Number Subscriber Identification Module Short Message Service Serial Peripheral Interface Transmission UART Universal Asynchronous Receiver Transmitter UE UL User Equipment Uplink 32 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12 Acronyms Acronym Definition USB Universal Serial Bus 33 SEQUANS Communications Proprietary GM02S Data Sheet Revision 12

Preliminary Datasheet SEQUANS Communications 15-55 Boulevard Charles de Gaulle 92700 Colombes, France Phone. +33.1.70.72.16.00 Fax. +33.1.70.72.16.09 www.sequans.com contact@sequans.com 1 Product Summary 1.1 General Description The Monarch 2 GM02S is an LTE Cat M1/NB1/NB2 module based on Sequans'

second generation Monarch 2 chip platform. GM02S is a total module solution, including a complete, Single-SKU RF front end for deployment in any band worldwide, and an integrated EAL5+ Secure Element (SE) enabling the integration of the SIM inside the module with zero compromise on security while lowering cost and reducing complexity. The GM02S is part of Sequans next generation "S" family of modules, featuring a very small yet cost-effective form factor that requires no external components. GM02S leverages Sequans' 15-plus years of experience in 4G and 5G technologies and incorporates Sequans' carrier-proven LTE protocol stack and a software suite that is one of the most mature in the industry. The GM02S is part of Sequans next generation "S" family of modules, featuring a very small yet cost-effective form factor that requires no external components. The GM02S inherits Monarch's already certified LTE-M and NB-IoT stack and delivers the significantly improved performance and lower power consumption enabled by Sequans' second generation Monarch 2 chip and the new module architecture. Sequans technology, both hardware and software, is 100-percent owned by Sequans, ensuring fast time to market and lowest total cost of ownership for device makers. 1.2 Frequency Bands The LTE frequency bands supported by GM02S are B1 (2100), B2 (1900 PCS), B3 (1800+), B4 (AWS-1), B5 (850), B8 (900 GSM), B12 (700 a), B13 (700 c), B14 (700 PS), B17 (700 b), B18 (800 Lower), B19 (800 Upper), B20 (800 DD), B25 (1900+), B26 (850+), B28 (700 APT), B66 (AWS-3), B71 (600), B85 (700 a+). GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 1 PRODUCT SUMMARY APPLICATIONS 1.3 Applications GM02S is ideal for adding LTE-M and/or NB-IoT LTE connectivity to narrowband, low data rate M2M and IoT devices, including utility meters, industrial sensors, health and fitness bands, asset trackers, and numerous additional devices for smart home, smart city, and wearable applications. GM02S can be used by applications as slim modem controlled by an external MCU via UART. Alternatively, applications may run on GM02S' integrated MCU. 1.4 Block Diagram

Figure 1-1: GM02S Block Diagram 1.5 General Features Physical Characteristics LGA module, 100 pads Size: 16.3 mm x 17 mm x 1.85 mm Temperature Range Operation temperature range: -40C to +85 C Storage: MSL3 Power Supply Voltage range for RF compliancy: 2.5V to 5.5V Functional voltage range: 2.2V to 5.5V Tx Power Interfaces

+23 dBm for each band Dual (U)SIM Card Interface: support for external, removable or fixed UICC. Support for integrated UICC (iUICC) with dedicated p/n 4x High-Speed UART Interfaces with flow control, up to 921600 bauds GPIOs, I2C, SPI, PWM, Pulse Counter, I2S/PCM, ADC 2 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) PRODUCT SUMMARY GENERAL FEATURES LTE Features 3GPP LTE Release 13/14 Cat M1/NB1/NB2 compliant. LTE Cat M1: 1.1 Mbps / 0.3 Mbps UL/DL throughput LTE Cat NB1: 62.5 kbps / 27.2 kbps UL/DL throughput LTE Cat NB2: 160 kbps / 120.7 kbps UL/DL throughput Note: Cat NB1/NB2 will be supported in future module versions via software upgrade. SMS Text and PDU modes Firmware Upgrade UART Interface, FOTA, Support of full and differential firmware upgrade RoHS All hardware components are fully compliant with EU RoHS directive, halogen-free GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 3 PRODUCT SUMMARY GENERAL FEATURES Table 1-1: Orderable Part Numbers Orderable Part Number Hardware Version Software Build

(ATI1) UE Version

(ATI1) PTCRB Model Name/Model Orderable Status SVN GM02RB6QRZ Engineering Sample. HW Rev1 GM02RB6QRA Engineering Sample. HW Rev2 GM02RB6QRB Engineering Sample. HW Rev2 Engineering software release. Please consult your Sequans representative Engineering software release. Please consult your Sequans representative Engineering software release. Please consult your Sequans representative UE8.0.0.0 N/A 0 End-of-Life UE8.0.0.0 N/A 0 Available UE8.0.0.0 N/A 0 Available Note:

Please contact your Sequans technical representative to select the applicable part number for your project. 4 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 2 Interfaces 2.1 Pin Assignment

.. !/0#10#

2!314

) Figure 2-1: Module Pads Assignments GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 5 INTERFACES ANTENNA 2.2 Antenna Table 2-1: Antenna Pad Details Pad #

Pad Name Direction Comments 90 LTE_ANT In/Out Main Antenna, for Rx and Tx 2.3 Power 2.3.1 Power Details Note:

Pad 1V8 is the reference voltage for IOs. It can be used to provide power small devices (100 mA maximum usage). This voltage is not available when the modem is in Deep Sleep. When the modem is in standby the voltage drops to 1.62V as per Table 2-2. Table 2-2: Power Pads Pad #

Pad Name Power Group Direction Min Operational Value Typical Operational Value Max Operational Value 8 73 1V8 See note above PVDD_1V8 Out 1.62 V 1.8 V 1.98 V SIM_VCC1 PVDD_1V8 Out 1.62 V 1.8 V 1.98 V 60, 62, 63 VBAT N/A in 2.5 V 5.5 V 1. See also Section 2.5 USIM Interfaces on page 16. Table 2-3: Electrical Maximum Rating for GM02S Direction Minimum Typical Maximum VBAT In 2.2 V 5.5 V Note:

Reference VBAT voltage range is 2.5 V to 5.5 V for operations and 2.2 V to 5.5 V for functional behavior with possible degradation of RF performances. 6 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) INTERFACES POWER Figure 2-2: Timing Diagram for Power-Up Sequence Figure 2-3: Timing Diagram for Reset Sequence Note on Figure 2-3:

Since EXT_RST_N is pulled-up internally, EXT_RST_N does not need to be maintained low after VBAT is established. This is shown by Figure 2-3. There is no timing condition between EXT_RST_N and VBAT. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 7 INTERFACES POWER 2.3.2 Power States Figure 2-4 represents the electrical states of the module and their transitions.

0-

) 1"2!

3

/.. Figure 2-4: Electrical States and Transitions The various power modes are described in Table 2-4 and illustrated on Figure 2-4. Table 2-4: Power Modes Description Power Mode LTE Mode Available Interfaces Active Connected (RF on) All interfaces Standby Connected (RF off) All interfaces Sleep Short eDRX idle duration RRC Idle WAKE pins (including RTS0/1) Deep Sleep PSM idle, Long eDRX idle duration, radio-off, airplane WAKE pins (including RTS0/1) 8 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 2.3.3 Detailed Behavior of IO Pads of BIDIR Type Behavior in Sleep, Standby or Active Modes Figure 2-5 shows a simplified diagram of the Digital bi-directional IOs in Sleep, Standby or Active modes. INTERFACES POWER Figure 2-5: Digital Bi-Directional IOs in Sleep, Standby or Active Modes Behavior in Deep Sleep Mode In Deep Sleep Mode the Digital bi-directional IOs are completly powered Off. In Deep Sleep Mode the Digital bi-directional IOs can be seen as high-impedance from the outside. Table 2-5 shows the Digital bi-directional IOs expected impedance value as seen from the ouside in Deep Sleep Mode. Table 2-5: Digital Bi-Directional IOs Expected Impedance Value

(Seen from the Outside) in Deep Sleep Mode 50 MOhm Typical GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 9 INTERFACES POWER 2.3.4 Detailed Behavior of IO Pads of BIDIR_WAKE Type Behavior in Sleep, Standby or Active Modes PMU bi-directional wake IOs are used as general purposed IO buffers in Sleep, Standby or Active modes. Figure 2-6 shows a simplified diagram of the PMU bi-directional wake IOs in those modes. Note:

The PMU bi-directional wake IOs output buffer requires the 3.0V power supply to be ON. Figure 2-6: PMU Wake IOs in Sleep, Standby or Active Modes 10 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) INTERFACES POWER Behavior in Deep Sleep Mode. Note:

The PMU bi-directional wake IOs output buffer is disabled in Deep Sleep Mode. Figure 2-7 shows a simplified diagram of the PMU bi-directional wake IOs in Deep Sleep Mode. Figure 2-7: PMU Wake IOs in Deep Sleep Mode Mode In Deep Sleep Mode, all PMU bi-directional wake IOs are high impedance with ultra low leakage current. This corresponds to a minimum impedance of 180 MOhm at the maximum input supply voltage of 3.6 V. If an event is presented on the wake IO pad and this wake IO has been configured to be sensitive on that event, this will take the system back to Active mode. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 11 INTERFACES POWER Table 2-6 shows the values of the measured leakage current (measurements taken on silicon) for the PMU wake IOs. Table 2-6: Measured Leakage Current for the PMU Wake IOs. Minimum Typical Maximum 3 nA 4 nA 12 nA Table 2-7 shows values of the external pull-up/pull-down resistor to be used on the PMU wake IOs pads. Table 2-7: External Pull-up/Pull-down Resistor to Be Used on the PMU Wake IOs Pads. Minimum Typical Maximum 1 kOhm 10 kOhm 100 kOhm Table 2-8 shows details about the PMU wake IOs pulses detection mecha-

nism timings. Table 2-8: Details about the PMU Wake IOs Pulses Detection Mechanism Timings Maximum Pulse Width that Is Guaranteed to Be Ignored Minimum Pulse Width that Is Guaranteed to Be Seen 11.1 ns 100 s 12 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 2.4 UART INTERFACES UART GM02S, when used as a slim modem, has three UARTs available. While the function of the UARTs can be configured, the default function for each UART is as follows:

UART0: data and control from external MCU via AT commands UART1: debug and upgrade UART2: modem console In addition, a fourth UART (UART3) may be used when running applications on GM02S. Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Table 2-9: UART Signals Pad #

Pad Name y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D 2 e p y t d a P e t a t S t e s e r

36 GPIO12/TXD0 TXD0 GPIO12 PVDD_1V8 In/Out BIDIR HighZ, 2mA In for primary function, UART0 34 GPIO13/RXD0 RXD0 GPIO13 PVDD_1V8 In/Out BIDIR Out-1, 2mA Out for primary function, UART0 35 GPIO14/CTS0 CTS0 GPIO14 PVDD_1V8 In/Out BIDIR Out-1, 2mA Out for primary function, UART0 33 RTS0 RTS0 N/A PMU_5V In IN HighZ Wake signal enabled by default. 32 TXD1 TXD1 N/A PVDD_1V8 In BIDIR HighZ, 2mA UART1 GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 13 INTERFACES UART Table 2-9: UART Signals (Continued) Pad #

Pad Name y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D 2 e p y t d a P e t a t S t e s e r

30 RXD1 RXD1 N/A PVDD_1V8 Out BIDIR Out-1, 2mA UART1 31 CTS1 CTS1 N/A PVDD_1V8 Out BIDIR Out-1, 2mA UART1 29 RTS1 RTS1 N/A PMU_5V In IN HighZ Wake signal enabled by default. 28 GPIO15/TXD2 TXD2 GPIO15 PVDD_1V8 In/Out BIDIR HighZ, 2mA In for primary function, UART2 26 GPIO16/RXD2 RXD2 GPIO16 PVDD_1V8 In/Out BIDIR Out-1, 2mA 27 25 GPIO17/

CTS2/DCD0 GPIO18/

RTS2/DSR0 Out for primary function, UART2 GPIO17 CTS2/DCD0 PVDD_1V8 In/Out BIDIR Out-1, 2mA UART2 GPIO18 RTS2/DSR0 PVDD_1V8 In/Out BIDIR HighZ, 2mA UART2 24 GPIO19/TXD3 GPIO19 TXD3 PVDD_1V8 In/Out BIDIR HighZ, 2mA In for primary function, UART3 22 GPIO20/RXD3 GPIO20 RXD3 PVDD_1V8 In/Out BIDIR Out-1, 2mA Out for primary function, UART3 14 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) INTERFACES UART Table 2-9: UART Signals (Continued) Pad #

Pad Name y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D 2 e p y t d a P e t a t S t e s e r

21 GPIO21/CTS3 GPIO21 CTS3 PVDD_1V8 In/Out BIDIR Out-1, 2mA UART3 23 GPIO22/RTS3 GPIO22 RTS3 PVDD_1V8 In/Out BIDIR Out-1, 2mA UART3 1. Alternate functions will be available in future versions via SW upgrade. 2.UART pad typess electrical characteristics are detailed in Table 2-19. High-Speed UARTs Flow Control Signals CTS0, CTS1, CTS2, CTS3: resp. UART0, UART1, UART2, UART3 flow control, Clear-To-Send, active low, of the GM02S. To be connected to the CTS of the remote UART device. See Figure 2-8. RTS0, RTS1, RTS2, RTS3: resp. UART0, UART1, UART2, UART3 flow control, Ready-To-Send, active low, of the GM02S. To be connected to the RTS of the remote UART device. Provision a 1 kOhm pull-down on RTS pin when flowcontrol is not used. If it is connected to an external component

(like a RS232 driver), the user should make sure that this component will present a low level to the GM02S. See Figure 2-8. Figure 2-8 represents the typical implementation for the hardware flowcontrol.

4/4/(4/4/

4/4/(4/4/

4/

4/

5

5 Figure 2-8: UART Convention and Flow Control Note:

Please refer to Module Integration Guide for details on UART connection. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 15 INTERFACES USIM INTERFACES 2.5 USIM Interfaces 2.5.1 SIM0 Interface This is the main external SIM interface. It can be used with removable or non-removable SIM cards or with soldered SIM chips. The power supply of the SIM is managed by the modem to ensure lowest power consumption of the SIM. Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Table 2-10: SIM0 Signals Pad #

Pad Name y r a m i r P n o i t c n u F p u o r G r e w o P n o i t c e r i D 1 e p y t d a P e t a t S t e s e r

Comment 42 45 44 43 73 SIM0_CLK SIM0_CLK PVDD_1V8 Out BIDIR Out-0, 2mA Main SIM SIM0_DETECT2 SIM0_DETECT PMU_5V In IN HighZ Main SIM SIM0_IO SIM0_IO PVDD_1V8 In/Out BIDIR HighZ, 2mA Main SIM SIM0_RSTN SIM0_RSTN PVDD_1V8 Out BIDIR Out-0, 2mA Main SIM SIM0_VCC3 SIM0_VCC PVDD_1V8 Out Supply Out-0, 2mA Main SIM 1.USIM pad typess electrical characteristics are detailed in Table 2-19. 2. SIM0_DETECT is active HIGH (HIGH when a card is present, LOW when no card is present). It can be configured as a WAKE pin via software command. 3. See range of values in Table 2-2. 16 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) INTERFACES USIM INTERFACES 2.5.2 SIM1 Interface This interface can be used as a second SIM interface for GM02S, typically used for soldered SIM chips (since it lacks SIM detect and SIM VCC). If design only has one SIM, it is preferred then to use the main SIM interface (see Section SIM0 Interface above). Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Table 2-11: SIM1 Signals Pad #

Pad Name y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D 2 e p y T d a P e t a t S t e s e r

40 41 39 GPIO26/SIM1_CLK GPIO26 SIM1_CLK PVDD_1V8 Out BIDIR Out-0, 2mA GPIO27/SIM1_RESETN GPIO27 SIM1_RESETN PVDD_1V8 Out BIDIR Out-0, 2mA GPIO25/SIM1_IO GPIO25 SIM1_IO PVDD_1V8 In/Out BIDIR HighZ, 2mA 1. Alternate functions will be available in future versions via SW upgrade. 2.Pad typess electrical characteristics are detailed in Table 2-19. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 17 INTERFACES I2C 2.6 I2C Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Table 2-12: I2C Pad Details y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D 2 e p y t d a P e t a t S t e s e r

GPIO23 I2C_SDA PVDD_1V8 In/Out BIDIR HiZ GPIO24 I2C_SCL PVDD_1V8 In/Out BIDIR HiZ Pad #

95 97 Pad Name GPIO23/

I2C_SDA GPIO24/

I2C_SCL 1. Alternate functions will be available in future versions via SW upgrade. 2.I2C pad typess electrical characteristics are detailed in Table 2-19. 18 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 2.7 PCM INTERFACES PCM Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Table 2-13: PCM Pad Details y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D 2 e p y t d a P e t a t S t e s e r

GPIO4 PCM_CLK PVDD_1V8 In/Out BIDIR HighZ GPIO3 PCM_RXD PVDD_1V8 In/Out BIDIR HighZ GPIO5 PCM_FS PVDD_1V8 In/Out BIDIR HighZ GPIO6 PCM_TXD PVDD_1V8 In/Out BIDIR HighZ Pad #

Pad Name 96 98 99 GPIO4/

PCM_CLK GPIO3/

PCM_RXD GPIO5/

PCM_FS 100 GPIO6/

PCM_TXD 1. Alternate functions will be available in future versions via SW upgrade. 2.PCM pad typess electrical characteristics are detailed in Table 2-19. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 19 INTERFACES SPI 2.8 SPI Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Table 2-14: SPI Pad Details y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D 2 e p y t d a P e t a t S t e s e r

GPIO7 SPI_SDI PVDD_1V8 In/Out BIDIR HighZ GPIO8 SPI_SDO PVDD_1V8 In/Out BIDIR HighZ GPIO9 SPI_CLK PVDD_1V8 In/Out BIDIR HighZ GPIO10 SPI_CSN1 PVDD_1V8 In/Out BIDIR HighZ GPIO11 SPI_CSN2 PVDD_1V8 In/Out BIDIR HighZ Pad #

3 4 2 5 7 Pad Name GPIO7/

SPI_SDI GPIO8/

SPI_SDO GPIO9/

SPI_CLK GPIO10/

SPI_CSN1 GPIO11/

SPI_CSN2 1. Alternate functions will be available in future versions via SW upgrade. 2.SPI pad typess electrical characteristics are detailed in Table 2-19. 20 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) INTERFACES GPIO 2.9 GPIO There is a total of 33 GPIOs available on GM02S: 28 named GPIO1 to GPIO28 and 5 named GPIO31 to GPIO35. The GPIOs listed in Table 2-15 are not enabled by default. Changing their state can be done by software. Table 2-15: GPIOs Disabled by Default GPIO Range Enable State by Default GPIO3 to GPIO11 GPIO17 to GPIO28 GPIO31 to GPIO32 Disabled Disabled Disabled The GPIOs are documented throughout this datasheet based on their shared or assigned function. In addition to the GPIO there are 5 wake signals available (documented in Section 2.10 Other Signals on page 22). GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 21 INTERFACES OTHER SIGNALS 2.10 Other Signals Table 2-16: GND and DNC Pads Pads Type Pads Number GND 1, 6, 37, 38, 50, 51, 52, 54, 56, 58, 59, 61, 64, 65, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 91, 92, 93 DNC (Reserved) 15, 17, 53, 71, 74, 75, 76, 77, 94 Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Table 2-17: Other Signals (No Interface) Pad #

Name 72 ADC1 ADC1

(See Note 1) y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D d a P 2 e p y T e t a t S t e s e r

N/A PVDD_1V8 In IN N/A 12 13 14 19 18 22 Analog Digital Converter (ADC, IN) STATUS_LED GPIO1 PVDD_1V8 In/Out BIDIR HighZ, 2mA Primary Function: Status LED (STATUS_LED, OUT) PS_STATUS GPIO2 PVDD_1V8 In/Out BIDIR HighZ, 2mA Primary Function: Power Saving status (PS_STATUS, OUT) enabled by default. Active high. GPIO28

(See Note 1) GPIO31

(See Note 1) DTR0 PVDD_1V8 In/Out BIDIR HighZ PVDD_1V8 In/Out BIDIR HighZ PWM0/

PULSE0/

19M2_OUT GPIO32

(See Note 1) PWM1/

PULSE1 PVDD_1V8 In/Out BIDIR HighZ GPIO1/

STATUS_LED GPIO2/

PS_STATUS GPIO28/

DTR0 GPIO31/

PWM0/

PULSE0/

19M2_OUT GPIO32/

PWM1/

PULSE1 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) Table 2-17: Other Signals (No Interface) (Continued) Pad #

Name y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D d a P 2 e p y T e t a t S t e s e r

INTERFACES OTHER SIGNALS 9 10 11 20 15, 17, 53, 71, 74, 75, 76, 77, 94 46 GPIO33/

TX_IND GPIO34/

ANT_TUNE0 GPIO35/

ANT_TUNE1 RESERVED/

FFF_FFH TX_IND GPIO33 PVDD_1V8 In/Out BIDIR HighZ, 2mA Primary Function: Transmission indicator (TX_IND, OUT). Active high. ANT_TUNE0 GPIO34 PVDD_1V8 In/Out BIDIR HighZ, 2mA Primary Function: Antenna tuning (ANT_TUNE0, OUT) ANT_TUNE1 GPIO35 PVDD_1V8 In/Out BIDIR HighZ, 2mA Primary Function: Antenna tuning (ANT_TUNE1, OUT) RESERVED N/A PVDD_1V8 N/A BIDIR HighZ, 2mA Boot mode selection (FFF_FFH, IN). This pad needs a pull-down resistor by default. RESERVED RESERVED N/A PVDD_1V8 N/A BIDIR Do not connect RESETN EXT_RST_N N/A PMU_5V In IN In, Pull-up Module HW reset signal. Active low. The minimum duration of a pulse on EXT_RST_N signal to be taken into account is 3.2 ms..This pin has an internal pull-up. 16 RING0 RING0 N/A PVDD_1V8 In/Out BIDIR HighZ, 2mA UART0 ring line (RING0, OUT). Enabled by default with inversed polarity. 48 WAKE0 WAKE0 N/A PMU_5V In IN HighZ Wake #0 input line (WAKE0, IN), disabled by default. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 23 INTERFACES OTHER SIGNALS Table 2-17: Other Signals (No Interface) (Continued) Pad #

Name y r a m i r P n o i t c n u F e t a n r e t l A 1 n o i t c n u F p u o r G r e w o P n o i t c e r i D d a P 2 e p y T e t a t S t e s e r

47 WAKE1 WAKE1 N/A PMU_5V In IN HighZ Wake #1 input line (WAKE1, IN), disabled by default. 49 WAKE2 WAKE2 N/A PMU_5V In IN HighZ Wake #2 input line (WAKE2, IN), disabled by default. 55 WAKE3 WAKE3 N/A PMU_5V In IN HighZ Wake #3 input line (WAKE3, IN), disabled by default. 57 WAKE4 WAKE4 N/A PMU_5V In IN HighZ Wake #4 input line (WAKE4, IN), disabled by default. 1. Functions will be available in future versions via SW upgrade. 2.Pad typess electrical characteristics are detailed in Table 2-19. 24 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 2.11 JTAG Note:

See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. INTERFACES JTAG Table 2-18: JTAG Pad Details Pad #

Pad Name y r a m i r P n o i t c n u F p u o r G r e w o P n o i t c e r i D 1 e p y t d a P 69 JTAG_TCK JTAG_TCK PVDD_1V8 In IN e t a t S t e s e r

In Pull-down Schmitt-trigger 67 68 66 70 JTAG_TDI JTAG_TDI PVDD_1V8 In IN In, Pull-up JTAG_TDO JTAG_TDO PVDD_1V8 Out BIDIR Out, 0 JTAG_TMS JTAG_TMS PVDD_1V8 In JTAG_TRSTN JTAG_TRSTN PVDD_1V8 In IN IN In, Pull-up In, Pull-down 1.JTAG pad typess electrical characteristics are detailed in Table 2-19. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 25 INTERFACES DIGITAL IO CHARACTERISTICS 2.12 Digital IO Characteristics The voltage and current characteristics of the various IO pads of the GM02S versus IO bank supply voltage are illustrated in the tables below. Caution:

The PCB designer must ensure that the voltage on these pads never exceeds Vih of the power group to which they belong. See Table 2-19 for digital IO characteristics of the different IO pads. Refer to each interface of GM02S in chapter Interfaces to know the power group and IO pad type for each pad. Note that IN pads are inputs only whereas BIDIR can be both inputs and output. Table 2-19: DC Characteristics for Digital IOs, Voltage 1.8 V Symbol Minimum Maximum Unit VIH Input HIGH level, PVDD_1V8 I/O pins 1.26 3.3 V VIH Input HIGH level, PMU_5V I/O pins VIL Input LOW level, PVDD_1V8 I/O pins VIL Input LOW level, PMU_5V I/O pins VOH Output HIGH voltage VOL Output LOW voltage IRPU Input pull-up resistor current RRPU Input pull-up resistance IRPD Input pull-down resistor current RRPD Input pull-down resistance VH Input hysteresis 26 0.8 VBAT + 0.6 (max 5.5) V 0 0 1.44 0 15 0.2 15 0.2 0.18 0.54 0.2 1.8 0.36 V V V V A 32.4 kOhm 32.4 kOhm V PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) INTERFACES DIGITAL IO CHARACTERISTICS Table 2-19: DC Characteristics for Digital IOs, Voltage 1.8 V (Continued) Symbol Minimum Maximum Unit IPAD Input leakage current, non-tolerant

-1 IOZ Off-State leakage current 1 1 A A GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 27 3 Mechanical Characteristics 3.1 Package Description The package size with tolerance is:

(16.3 0.15) mm x (17.0 0.15) mm x (1.85 max) mm The weight of the GM02S is 0.85 g. Figure 3-1: GM02S Top and Side Views GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 28 MECHANICAL CHARACTERISTICS PACKAGE DESCRIPTION Figure 3-2: GM02S PCB View Note:

Gxx pads should be grounded to a large ground plane on customer's PCB layer 1. It is also recommended to have the Gxx pads area in the PCB through ground vias to improve thermal dissipation efficiency. Table 3-1: GM02S Dimensions (mm) Dimension Value (mm) L W T T0 L1 W1 L2 W2 a1 a2 16.3 0.15 17.0 0.15 1.85 max 0.426 max 0.5 0.1 0.7 0.1 0.8 0.1 0.8 0.1 2.25 0.1 3.05 0.1 GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 29 MECHANICAL CHARACTERISTICS PACKAGE DESCRIPTION Table 3-1: GM02S Dimensions (mm) (Continued) Dimension Value (mm) a3 a4 a5 b1 b2 b3 b4 b5 P1 P2 P3 P4 1.45 0.1 2.45 0.1 6.5 0.1 2.0 0.1 3.0 0.1 3.1 0.1 5.5 0.1 5.95 0.1 0.3 0.1 0.3 0.1 0.4 0.1 0.4 0.1 30 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) MECHANICAL CHARACTERISTICS PACKAGE DESCRIPTION Figure 3-3: GM02S Laser Marking (Preliminary) Notes on Figure 3-3:

1. The triangle in the low-right corner provides pin#1 location. 2. FCC ID: 2AAGMGM02SA 3. 4. 5. IC: 12732A-GM02SA IMEI:XXXXXXXXXXXXXXX ICCID:XXXXXXXXXXXXXXX (for future support) 6. S/N:G2MYYMMDDNNNNSSS (16 digits) G2M: reserved, value subject to change at Sequans discretion (3 digits) YYMMDD: Manufacturing Date (YY:Year;MM:Month,DD:Day) NNNN: Panel counter (from 0001~9999) SSS: Piece location on panel (from 001~036) 7. 2D marked "a" refer to IMEI Barcode 8. 2D marked "b" refer to ICCID Barcode (for future support) 9. 2D marked "c" refer to S/N Barcode GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 31 MECHANICAL CHARACTERISTICS ENVIRONMENTAL CONDITIONS 3.2 Environmental Conditions The environmental operating conditions are:

Temperature (PCB temperature as measured by on-board thermistor):

Operational: -40C, +85C RF compliant: -30C, +85C 32 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 3.3 Packing The GM02S is delivered in Tape-and-Reel. Details are provided in the figures below. MECHANICAL CHARACTERISTICS PACKING Figure 3-4: Packing Modules in Reels Figure 3-5: Packing Reels in Boxes GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 33 MECHANICAL CHARACTERISTICS STORAGE AND MOUNTING 3.4 Storage and Mounting The GM02S module is Moisture Level 3 rated as per JEDEC industrial standard: http://www.ipc.org/TOC/J-STD-033D-TOC.pdf. The GM02S can support up to 3 reflows with 250C maximum. Table 3-2: Reflow Profile Profile Feature Solder Paste Alloy Sn96.5/Ag3.0/Cu0.5 (Lead Free solder paste) Peak Package Body Temperature 235C to 245C Liquidous Time Pre-heat / Soak Ramp-up Rate Ramp-down Rate Gas Apply Temp: over 220C Time: 60 seconds ~ 90 seconds Temp: 150~200C Time: 60 seconds ~ 120 seconds

< 3C/second

-3C~0C/second Nitrogen gas O2 ppm less than 1500 ppm Figure 3-6: Reflow Profile Parameters Recommended stencil thickness: 0.1mm~0.13mm (prefer 0.1mm). More detail on PCB land pattern will be proviedd in a future edition of the document. 34 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 4 Regulatory Approval RED regulatory approval details will be provided in a future revision of this document. TELEC regulatory approval details will be provided in a future revision of this document. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 35 REGULATORY APPROVAL FCC REGULATORY APPROVAL 4.1 FCC Regulatory Approval FCC-ID: 2AAGMGM02SA (single modular approval) This above identified LTE radio module is not intended to be provided to end-users but is for installation by OEM integrators only. Installation/Integration OEM integrators must follow Sequans installation instructions to provide for and benefit from FCC compliant module integrations and must abide especially by the following:

The maximum antenna gain values (accounting for cable attenuation) to comply with the FCC maximum ERP/EIRP limits and with RF Exposure rules:

LTE band 2 (1900 PCS): 8.0 dBi LTE band 4 (AWS-1): 5.0 dBi LTE band 5 (850): 9.4 dBi LTE band 12 (700a): 8.6 dBi LTE band 13 (700c): 9.1 dBi LTE band 17 (700b): 8.7 dBi LTE band 25 (1900+): 8.0 dBi LTE band 66 (AWS-3): 5.0 dBi The Sequans' module integration guidelines must be closely followed. Compliance of host integrations of the module is limited to hosts adaptation designs which are identical to Sequans' reference design. Host integrations with adaption designs deviating from Sequans' reference design require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID;

Host integrations with co-located (simultaneously operating) radio transmitters must be evaluated in accordance with FCC multi-transmitter rules and may require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID, dependent on the result of the evaluation; Inquiry at FCC or a TCB is urgently recommended. Integrations of the module into host products which are intended for portable use, i.e. less than 20cm distance between its radiating structures (antenna) and the body of nearby persons, or which otherwise put additional technical requirements like Hearing Aid compatibility require either class 2 permissive change to this modular approval or a separate host approval with different FCC-ID;

36 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) REGULATORY APPROVAL FCC REGULATORY APPROVAL Compliance with Unwanted Emission Limits for Digital Device If the OEM host integration fully complies with the above described reference design and can completely inherit and rest on compliance of the existing modular approval the OEM remains still responsible to show compliance of the overall end-product with the FCC limits for unwanted conducted and radiated emissions from the digital device (unintentional radio) portion of such end-product (commonly addressed as part 15B compliance or similar). End-product Labelling FCC-ID The module's FCC-ID must either be visible from the exterior of the host product (e.g. per window) or per electronic display, or shall be displayed on an additional exterior label per the following or similar string:

contains FCC-ID: 2AAGMGM02SA Digital Device - Unwanted Emissions Notice If the end-product falls under part 15 of the FCC rules (it shall display the following user notice on its exterior acc. to part 15.19 (the notice may be printed in the manual in case the host is too small):

This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that may cause undesired operation. Further Labelling Requirements may apply dependent on the FCC rule parts relevant to the host product. End-product User Instructions / Notices in the Manual At a minimum, end-product users must be provided with the following notices at a prominent location of the product literature furnished with the product:

* Product Modifications Modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

* RF Exposure Compliance This equipment complies with FCC radio frequency radiation exposure rules and limits set forth for an uncontrolled environment, when installed and operated with minimum distance of 20cm between its radiating structures (antenna) and the body of nearby persons and when not operated simultaneously with other nearby radio-transmitters. Maximum Antenna Gain The user instructions of end-products equipped with standard external antenna connectors for the modular radio transmitter providing the option to connect other antennae than those which may or may not be bundled with the end-product must list the maximum allowed antenna gain values as derived from those given above, accounting for the cable attenuations of the actual installation. GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 37 REGULATORY APPROVAL FCC REGULATORY APPROVAL Digital Device - Unwanted Emissions Notice If the end-product is or contains a digital device (unintentional radio portions) and is not exempted by its use case (like vehicular use) the following part 15.105 (b) user notice shall be provided at prominent loca-

tion of the product literature:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

o Reorient or relocate the receiving antenna. o Increase the separation between the equipment and receiver. o Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. o Consult the dealer or an experienced radio/TV technician for help Further User Notices May be required dependent on the FCC rule parts relevant to the host product. Non-allowed User Instructions The end-product user guidance may NOT include instructions about how to install or de-install the module. 38 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) 4.2 ISED Regulatory Approval REGULATORY APPROVAL ISED REGULATORY APPROVAL This device complies with ISEDs licence exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et

(2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co located with an y other transmitter or antenna As long as 2 conditions above are met , further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre comp lant av ec un autre metteur ou antenne. Tant que les 2 conditions ci dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. LTE band 2 (1900 PCS): 8.0 dBi LTE band 4 (AWS-1): 5.0 dBi LTE band 5 (850): 6.1 dBi LTE band 12 (700a): 5.6 dBi LTE band 13 (700c): 5.9 dBi LTE band 17 (700b): 5.6 dBi LTE band 25 (1900+): 8.0 dBi LTE band 66 (AWS-3): 5.0 dBi GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 39 REGULATORY APPROVAL ISED REGULATORY APPROVAL IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: "Contains IC:12732A-GM02SA". Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante:

"Contient des IC: 12732A-GM02SA". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. 40 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) A Acronyms Acronym Definition ADC Analog to Digital Converter CPU Central Processing Unit DL ESD ETSI Downlink Electro-static discharge European Telecommunications Standard Institute GND Ground GPIO General Purpose Input Output I/O I2C Input/Output Inter-Integrated Circuit interface IMEI International Mobile Equipment Identity IP Internet Protocol JTAG Joint Test Action Group LGA Large Grid Array LTE Long Term Evolution, or 4G. Standard is developed by the 3GPP www.3gpp.org. MIMO Multiple In Multiple Out NAS Network Access Server OMADM Open Mobile Alliance Device Management PCM Pulse-Code Modulation PHY Physical Layer GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 41 Acronym Definition RED European Radio Equipment Directive RF Radio Frequency RoHS Restriction of Hazardous Substances Rx S/N SIM Reception or SN: Serial Number Subscriber Identification Module SMS Short Message Service SPI Tx Serial Peripheral Interface Transmission UART Universal Asynchronous Receiver Transmitter UE UL User Equipment Uplink USB Universal Serial Bus 42 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY) About this Datasheet Purpose and Scope The GM02S is a complete LTE Cat M1/NB1/NB2 module including base-band, RF and memory, for the design of narrowband low data rate M2M and IoT devices for wide deployment. This document provides technical information about GM02S LGA module. GM02S is based on Sequans' Monarch 2 platform. Who Should Read this Document This document is intended for engineers who are developing User Equipment

(UE) for LTE systems. Changes in this Document The following changes were done since the previous edition of this document:

Updated orderable status of Part Numbers in Table 1-1 on page 4. Updated Section Power States, added Sections Detailed Behavior of IO Pads of BIDIR Type and Detailed Behavior of IO Pads of BIDIR_WAKE Type in Section 2.3 Power on page 6. Updated Section 2.4 UART on page 13. Updated Section 2.5.1 SIM0 Interface on page 16. Updated Section 2.12 Digital IO Characteristics on page 26. Updated Section 3.1 Package Description on page 28. Updated Section 3.2 Environmental Conditions on page 32. Updated Section 3.4 Storage and Mounting on page 34. Updated Section 4.1 FCC Regulatory Approval on page 36. Various edits GM02S DATASHEET (PRELIMINARY) PROPRIETARY SEQUANS Communications 43 Table of Contents Chapter 1 Product Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 1.2 1.3 1.4 1.5 General Description . 1 Frequency Bands. 1 Applications . 2 Block Diagram . 2 General Features . 2 Chapter 2 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3.1 2.3.2 2.3.3 2.3.4 2.5.1 2.5.2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 Pin Assignment . 5 Antenna . 6 Power . 6 Power Details . 6 Power States . 8 Detailed Behavior of IO Pads of BIDIR Type . 9 Detailed Behavior of IO Pads of BIDIR_WAKE Type . 10 UART . 13 USIM Interfaces . 16 SIM0 Interface . 16 SIM1 Interface . 17 I2C . 18 PCM . 19 SPI. 20 GPIO . 21 Other Signals. 22 JTAG. 25 Digital IO Characteristics . 26 Chapter 3 Mechanical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.1 3.2 3.3 3.4 Package Description . 28 Environmental Conditions . 32 Packing . 33 Storage and Mounting. 34 Chapter 4 Regulatory Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Proprietary SEQUANS Communications 44 Table of Contents 4.1 4.2 FCC Regulatory Approval . 36 ISED Regulatory Approval. 39 Appendix A Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 About this Datasheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Purpose and Scope . 43 Who Should Read this Document . 43 Changes in this Document . 43 Proprietary SEQUANS Communications 45

Laser Marking & Packaging SPEC Project: GM02S SQN PN: GM02RB6QRACZ0CZ0FF USI PN: 6756-001510-04 MD USI 2020.11 Laser marking USI. All rights reserved. Box label Box label USI. All rights reserved. Carton label Carton label USI. All rights reserved. Thank You www.usish.com Realizing IDEAS Together USI. All rights reserved.

Date: 09/08/2022 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Rd. Columbia MD 21046 FCC ID: 2AAGMGM02SA To whom it may concern:

We, Sequans Communications 55 Boulevard Charles de Gaulle, 92700 Colombes hereby declare that GM02S will not operate in NBIoT lowest and highest channels for the bands with band edge limitations, i.e. 699.1, 715.9, 777.1, 786.9, 814.1, 823.9, 824.1, 848.9, 1710.1, 1754.9, 1755.1, 1779.9, 1850.1, 1914.9 MHz. For each frequency band GM02Ss firmware locks the NB-IoT channel closest to the edge of the frequency band in order to meet the standard requirements of different countries and regions. The provided module will thus not support the NB-IoT channel closest to the edge of each band. The available frequency ranges have been tested and verified to meet the standard requirements of the corresponding countries and regions Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans.com

Class II Permissive Change for FCC Date: 10/08/2022 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Rd. Columbia MD 21046 FCC ID: 2AAGMGM02SA To whom it may concern:

We, Sequans Communications 55 Boulevard Charles de Gaulle, 92700 Colombes hereby request a Class II Permissive Change for the Product approved under the above-

mentioned FCC ID pursuant to Part 2.1043, of Title 47 of the Code of Federal Regulations. The Class II Permissive Change action must be applied to FCC ID: 2AAGMGM02SA dated January 18th 2021. The Product (GM02S) will now enable NB-IoT which was initially certified for Rel 14 Cat-M technology with LTE FDD bands 2, 4, 5, 12, 13, 17, 25, 66. This activation is done through SW. We have implemented support for NB-IoT technology for LTE FDD bands 2, 4, 5, 12, 13, 17, 25, 26, 66, as per 3GPP Rel14 NB1/NB2 CE level 0, 1, 2 CP only data B26 was not certified but already supported by HW in previous FCC submission. The Inband/Guardband/standalone mode of operation activation is done through SW, allowing scanning on the B26, whereas was not allowed in initial SW version. We confirm that this NB-IoT feature does not affect RF characteristics of the module. Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans.com

Date: 30th May,2022 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: Agent letter for FCC ID: 2AAGMGM02SA We, hereby authorize Sequans Communications 55 Boulevard Charles de Gaulle, 92700 Colombes DEKRA Testing and Certification, S.A.U. C/Severo Ochoa 2, 29590 Campanillas Mr. lvaro Corrales Sedeo, e-mail: alvaro.corrales@dekra.com, Phone: +34 925 619 198 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We also hereby certify that neither we nor any party to this application are subject to a denial of U.S. Federal benefits, which include FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, U.S.C. 862 because of conviction for possession or distribution of controlled substance. For instances where our authorized agent signs the application for certification on our behalf, I acknowledge that all responsibility for complying with the terms and conditions for Certification, as specified by DEKRA Testing and Certification, S.A.U., still resides with us. This agreement expires one year from the current date. Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans.com

Date: 30th May,2022 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: Confidentiality request for FCC ID: 2AAGMGM02SA To whom it may concern:

Pursuant to 0.457(d)(1)(ii) and 0.459 of the Commissions Rules (47 C.F.R.) and 552 (b)(4) of the Freedom of Information Act, Sequans Communications hereby request requests that a part of the subject FCC application be held confidential to avoid release of sensitive information of the product to the public. For the product stated above, we request that the following information be withheld from public disclose:

Type of Confidentiality Requested Exhibit Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent Permanent Permanent Permanent Block Diagrams External Photos Internal Photos Operation Description Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual Permanent Confidentiality:

The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to us and provide unjustified benefits to our competitors. Short-Term Confidentiality:

We hereby request short-term confidentiality for the product stated above to avoid premature release of sensitive information prior to marketing or release of the product to the public. Release date of short term confidentiality is:

45 days from grant date marked 90 days from grant date marked 135 days from grant date marked 180 days from grant date marked Specific date:

We are also aware that we are responsible to notify AT4 wireless in the event information regarding the product or the product is made available to the public. AT4 wireless will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-

1705. Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans

Date: 30th May,2022 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: FCC Modular approval letter for FCC ID: 2AAGMGM02SA To whom it may concern:

The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement Yes No*

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure requirements in its final configuration.

* Shall provide a detailed explanation if the answer is No. Yes Yes Yes Yes Yes Yes Yes Yes Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans.com

Date: Tuesday,23rd Feb 2021 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: Agent letter for FCC ID: 2AAGMGM02SA We, hereby authorize Sequans Communications 55 Boulevard Charles de Gaulle, 92700 Colombes DEKRA Testing and Certification, S.A.U. C/Severo Ochoa 2, 29590 Campanillas Mr. lvaro Corrales Sedeo, e-mail: alvaro.corrales@dekra.com, Phone: +34 925 619 198 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We also hereby certify that neither we nor any party to this application are subject to a denial of U.S. Federal benefits, which include FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, U.S.C. 862 because of conviction for possession or distribution of controlled substance. For instances where our authorized agent signs the application for certification on our behalf, I acknowledge that all responsibility for complying with the terms and conditions for Certification, as specified by DEKRA Testing and Certification, S.A.U., still resides with us. This agreement expires one year from the current date. Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans.com FCB011_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless

Date: 23rd Feb 2021 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: Confidentiality request for FCC ID: 2AAGMGM02SA To whom it may concern:

Pursuant to 0.457(d)(1)(ii) and 0.459 of the Commissions Rules (47 C.F.R.) and 552 (b)(4) of the Freedom of Information Act, Sequans Communications hereby request requests that a part of the subject FCC application be held confidential to avoid release of sensitive information of the product to the public. For the product stated above, we request that the following information be withheld from public disclose:

Type of Confidentiality Requested Exhibit Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent Permanent Permanent Permanent Block Diagrams External Photos Internal Photos Operation Description Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual Permanent Confidentiality:

The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to us and provide unjustified benefits to our competitors. Short-Term Confidentiality:

We hereby request short-term confidentiality for the product stated above to avoid premature release of sensitive information prior to marketing or release of the product to the public. Release date of short term confidentiality is:

45 days from grant date marked 90 days from grant date marked 135 days from grant date marked 180 days from grant date marked Specific date:

FCB015_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless We are also aware that we are responsible to notify AT4 wireless in the event information regarding the product or the product is made available to the public. AT4 wireless will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-

1705. Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans FCB015_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless

Date: Tuesday,24th Feb 2021 DEKRA Testing and Certification, S.A.U. Parque Tecnolgico de Andaluca C/ Severo Ochoa 2 & 6 29590 Campanillas Mlaga, Espaa Ref: FCC Modular approval letter for FCC ID: 2AAGMGM02SA To whom it may concern:

The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement Yes No*

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure requirements in its final configuration.

* Shall provide a detailed explanation if the answer is No. Yes Yes Yes Yes Yes Yes Yes Yes FCB015_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans.com FCB015_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless

Supported bands Date: 29/03/2021 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Rd. Columbia MD 21046 FCC ID: 2AAGMGM02SA To whom it may concern:

We, Sequans Communications, 15-55 Boulevard Charles de Gaulle Colombers, France hereby declare that Product object of this approval process operates only in the LTE Cat M1 bands 5, 12 (17), 13, 25 (2), 66 (4) in the US, and the other supported bands will be disabled by SW. Sincerely, __________________________ By:

Title:

Company:

Telephone:

e-mail:

Sebastien Falgayrettes Director, Product and Program management Sequans Communications

+33 627 991 534 sfalgayrettes@sequans.com FCB015_02 //DEKRA Testing and Certification, S.A.U. // www.dekra-product-safety.com/wireless