FCC ID: 2ACCRMW24 AIOT Module

EH-MW24 Datasheet V0.1 Copyright 2022 Ehong Information Technology Co. Ltd. All rights reserved. Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 2 (31) Table of Contents 1 Product Overview ....................................................................................................... 4 2 Hardware Specification ................................................................................................ 5 2.1 Block Diagram .................................................................................................................5 Internal PA Design Block Diagram ................................................................................................. 5 External PA Design Block Diagram ............................................................................................... 6 2.1.1 2.1.2 2.2 Pinout Description ..........................................................................................................6 Pin Map .............................................................................................................................................. 6 Pin Definition ..................................................................................................................................... 7 IO Pin Mux Table .............................................................................................................................. 9 2.2.1 2.2.2 2.2.3 2.3 Peripheral Interfaces ..................................................................................................... 10 2.4 Bootstrap Signals ......................................................................................................... 10 Bootstrap Mode ............................................................................................................................... 10 JTAG Mode ...................................................................................................................................... 10 XTAL Mode ...................................................................................................................................... 10 32.768KHz Sleep Clock Mode ...................................................................................................... 11 2.4.1 2.4.2 2.4.3 2.4.4 3 Electrical Characteristics ........................................................................................ 12 3.1 Absolute Maximum Ratings ......................................................................................... 12 3.2 Recommended Operating Conditions ........................................................................ 12 3.3 DC Electrical Characteristics ....................................................................................... 12 4 Radio Performance ................................................................................................... 13 4.1 BLE Radio Characteristics ........................................................................................... 13 4.2 802.15.4 Radio Characteristics .................................................................................... 13 5 Mechanical Specification ........................................................................................ 14 5.1 Dimensional View .......................................................................................................... 14 5.2 Pad Dimension .............................................................................................................. 14 6 Development Kit ....................................................................................................... 16 6.1 Overview......................................................................................................................... 16 Hostless Mode................................................................................................................................. 16 Hosted Mode ................................................................................................................................... 16 6.1.1 6.1.2 6.2 Hostless Development Kit ............................................................................................ 18 Hardware Configuration ................................................................................................................. 18 Block Diagram ................................................................................................................................. 20 Dimension ........................................................................................................................................ 21 6.2.1 6.2.2 6.2. 3 Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 3 (31) 6.3 Hosted Development Kit (Pmod Adapter) .................................................................. 22 Hardware Configuration ................................................................................................................. 22 Block Diagram ................................................................................................................................. 24 Dimension ........................................................................................................................................ 24 6.3.1 6.3.2 6.3.3 6.4 Hosted Development Kit (Android Shield) ................................................................. 24 7 Manufacturing Recommendation ........................................................................... 25 7.1 Power Layout Guideline ............................................................................................... 25 7.2 RF Layout Guideline ..................................................................................................... 25 7.3 Soldering Recommendations ...................................................................................... 25 8 Packaging .................................................................................................................. 27 9 Regulatory Compliance ........................................................................................... 28 10 Order Information .................................................................................................. 29 Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 4 (31) 1 Product Overview Powered by the widely-deployed Qualcomm BLE 5 and 802.15.4 combo QCA4024 wireless MCU, the Ehong EH-MW24 IoT connectivity stamp module is purpose-built for IoT applications that are running on top of ZigBee or Thread over 802.15.4. Additional BLE 5 support can be used for commissioning or any other applications utilizing BLE mesh connectivity. EH-MW24 has a dedicated Cortex-M0 microcontroller with 128KB SRAM and 384KB ROM to act as a communication processor (CP) to handle BLE and 802.15.4 at MAC/PHY layer as well as a dedicated Cortex-M4F microcontroller with 704KB SRAM (328KB for applications) and 512KB ROM to function as an application processor (AP) to run 802.15.4 upper layer protocol stacks like ZigBee and Thread, application layer protocols and IoT applications. Cortex-M0 with dedicated memory can also be used as a security processor (SP) to enable trusted execution environment (TEE) for enhanced security which is getting more and more critical to IoT applications. EH-NW24 supports both ZigBee 3.0 (ZigBee PRO 2017 R22) and OpenThread 1.1 upper layer protocol stacks built on top of 802.15.4. QCA4024 at the core of EH-MW24 is a Thread certified component. With the latest matter from CSA gaining market traction and industry adoption, matter over Thread is being also added into EH-MW24 to enable easier and quicker time-to-market to build matter certified devices. EH-MW24 is design-optimized to minimize module footprint in order to fit into space constraint applications. It also offers internal on-chip power amplifier and external power amplifier options as well as supports either U.FL or PCB antenna with the same pin compatible form factor. EN-MW24 has undergone vigorous regulatory compliance tests and design fine-tuning and passed all major international regulatory certifications such as FCC, IC, CE, UKCA, SRRC, MIC, KCC, etc. It also environmentally complies with RoHS and WEEE. EH-MW24 Powered by Qualcomm QCA4024

(BLE 5 + 802.15.4) FCC ID: 2ACCRMW24 IC ID:

20625-MW24 CMIIT ID: XXXXYZNNNN Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 5 (31) 2 Hardware Specification This section provides detailed hardware design and specification of EH-MW24 module. Overall hardware design was optimized for smaller footprint and maximized cost saving. 2.1 Block Diagram EH-MW24 is powered by Qualcomm QCA4024 with an integrated 4MB flash, an 40MHz XTAL as well as discrete RF components. The design has option to add an external power amplifier for BLE and 802.15.4 to achieve max Tx power +20 dBm. The block diagram is shown below. 2.1.1 Internal PA Design Block Diagram BT/15.4 ANT

(U.FL) BT/15.4 ANT

(PCB) 2.4G Band Pass Filter SP3T BT Tx Matching BT/15.4 Rx Matching 15.4 Tx Matching E B _ 0 L T N C _ E F E B _ 2 T U O X T E B _ N X R I E B _ 1 T U O X T E B _ 1 L T N C _ E F QCA4024 GPIO_24_BE GPIO_25_BE GPIO_26_BE GPIO_27_BE GPIO_59_BE GPIO_8_BE GPIO_9_BE GPIO_12_BE GPIO_18_BE GPIO_19_BE GPIO_20_BE GPIO_21_BE GPIO_22_BE GPIO_23_BE GPIO_60_BE CHIP_PWN_L_BE EXT_CLKOUT_BE I L A T X 40MHz O L A T X 4MB NOR Flash GPIO_42 BE-

GPIO_47 BE-

GPIO_43_BE GPIO_44_BE GPIO_45_BE GPIO_46_BE CLK CS#

DI/D0 DO/D1 WP#/D2 HOLD#/D3 GPIO_10_BE/I2CM0_SCL GPIO_11_BE/I2CM0_SDA GPIO_16_BE/I2CM1_SCL GPIO_17_BE/I2CM1_SDA GPIO_55_BE/ADC_3 GPIO_56_BE/ADC_4 GPIO_57_BE/ADC_5 GPIO_58_BE/ADC_6 32K_XTALI 32K_XTALO USB20_DP_BE USB20_DM_BE VDDIO (1.8V or 3.3V) VDD33 Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 6 (31) 2.1.2 External PA Design Block Diagram BT/15.4 ANT

(U.FL) BT/15.4 ANT

(PCB) 2.4G Band Pass Filter Power Amplifier SPDT SPDT BT/15.4 Rx Matching BT Tx Matching 15.4 Tx Matching E B _ N X R I E B _ 1 L T N C _ E F E B _ 2 T U O X T E B _ 0 L T N C _ E F E B _ 1 T U O X T E B _ 1 L T N C _ E F GPIO_24_BE GPIO_25_BE GPIO_26_BE GPIO_27_BE GPIO_59_BE GPIO_8_BE GPIO_9_BE GPIO_12_BE GPIO_18_BE GPIO_19_BE GPIO_20_BE GPIO_21_BE GPIO_22_BE GPIO_23_BE GPIO_60_BE QCA4024 CHIP_PWN_L_BE EXT_CLKOUT_BE I L A T X 40MHz O L A T X 2.2 Pinout Description 2.2.1 Pin Map 4MB NOR Flash GPIO_42-BE GPIO_47-BE GPIO_43_BE GPIO_44_BE GPIO_45_BE GPIO_46_BE CLK CS#

DI/D0 DO/D1 WP#/D2 HOLD#/D3 GPIO_10_BE/I2CM0_SCL GPIO_11_BE/I2CM0_SDA GPIO_16_BE/I2CM1_SCL GPIO_17_BE/I2CM1_SDA GPIO_55_BE/ADC_3 GPIO_56_BE/ADC_4 GPIO_57_BE/ADC_5 GPIO_58_BE/ADC_6 32K_XTALI 32K_XTALO USB20_DP_BE USB20_DM_BE VDDIO (1.8V or 3.3V) VDD33 Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 7 (31) 2.2.2 Pin Definition Pin 23 21 Pin Name Type Description VDD33 VDDIO PWR Power input (2.93 ~ 3.63V) connected to 3.3V10% as default PWR Host I/O voltage input (1.8V or 3.3V) 8,22,24 GND GND Ground 20 CHIP_PWD_L DI Reset 1 9 10 25 26 34 33 31 EXT_CLKOUT DO 40MHz system clock output USB_DP AI/AO USB differential data+

USB_DM AI/AO USB differential data-

RTC32K_XTALI AI Optional 32kHz crystal input. Can be N/C (or floating) RTC32K_XTALO AO Optional 32kHz crystal output. Can be N/C (or floating) GPIO_8 GPIO_9 GPIO_10 DI/DO Generic GPIO (multiplexed). See GPIO Pin Mux Table. DI/DO DI/DO Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 8 (31) 32 27 29 20 14 11 20 15 13 16 17 18 19 28 7 6 5 4 3 2 GPIO_11 GPIO_12 GPIO_16 GPIO_17 GPIO_18 GPIO_19 GPIO_20 GPIO_21 GPIO_22 GPIO_23 GPIO_24 GPIO_25 GPIO_26 GPIO_27 GPIO_55 GPIO_56 GPIO_57 GPIO_58 GPIO_59 GPIO_60 DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO 8 (33) 9 (31) 2.2.3 IO Pin Mux Table GPIO ADC PWM SDIO SPI UART I2C I2S KyPad1 KyPad2 JTAG PTA 8 9 10 11 12 16 17 18 19 20 21 22 23 24 25 26 27 55 ADC_3 56 ADC_4 57 ADC_5 58 ADC_6 59 ADC_7 60 UART_RXD UART_TXD I2CM0_SCL I2CM0_SDA COL_4 COL_3 JTAG1_TCK ROW_4 ROW_0 JTAG1_TDO COL_5 ROW_1 JTAG1_TMS ROW_5 ROW_2 JTAG1_TDI COL_6 ROW_3 JTAG1_TRST PWM_0 SDIO_CLK SDIO_CMD SPIM_CS2 HSUART_RTS I2CM1_SCL ROW_0 COL_7 BT_ACTIVE SDIO_D0 SPIM_CS1 HSUART_RXD I2CM1_SDA ROW_1 ROW_4 WLAN_ACTIVE PWM_6 SDIO_D1 SPI_CLK HSUART_CTS PWM_1 SDIO_D2 SPI_CS HSUART_TXD PWM_2 SDIO_D3 SPI_MISO HSUART_RXD PWM_4 PWM_3 PWM_5 SPI_MOSI HSUART_RTS SPIM_CS0 UART_RXD SPIM_CLK UART_TXD CPIM_MOSI SPIM_MISO COL_2 ROW_5 COL_3 ROW_6 ROW_2 ROW_7 ROW_3 COL_7 ROW_7 JTAG2_TCK JTAG2_TDO JTAG2_TMS JTAG2_TDI I2S_BCLK I2S_SDI I2S_SDO I2S_WS I2S_MCLK HSUART_CTS HSUART_TXD BT_PRIORITY 10 (31) 2.3 Peripheral Interfaces EH-MW24 supports the following peripheral interfaces through 24x multiplexed GPIO:

1x SDIO slave 1x SPI master or slave 1x High-Speed UART (3Mbps) 1x UART (115.2kbps) 2x I2C master 1x I2S master or slave 5x 12-bit ADC 7x PWM 1x JTAG 1x USB 2.0 (for manufacturing testing) 2.4 Bootstrap Signals 2.4.1 Bootstrap Mode GPIO_9 GPIO_22 Description 0 0 0 1 Force M4 to load image from flash memory (Default) Force M4 to boot in EDL (Emergency Download Mode) Allows user to burn image into flash memory 2.4.2 JTAG Mode GPIO_9 GPIO_18 GPIO_25 Description 0 0 0 0 1 0 1 0 1 X 0 0 1 1 X No JTAG enabled Not Allowed JTAG Pins on GPIO [11:8]

JTAG Pins on GPIO [27:24]

Not Allowed 2.4.3 XTAL Mode GPIO_23 Description 0 1 40MHz XTAL Not Allowed Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 11 (31) 2.4.4 32.768KHz Sleep Clock Mode GPIO_20 GPIO_21 Description 0 1 0 1 0 0 1 1 Chip Internal LPO External Crystal 32.768KHz External 32.768KHz TCXO Clock connected to GPIO_48 Not Allowed Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 12 (31) 3 Electrical Characteristics 3.1 Absolute Maximum Ratings The absolute maximum ratings provided in this section reflect the stress levels that, if exceeded, may cause permanent damage to the device. No functionality is guaranteed outside the operating specifications. Functionality and reliability are only guaranteed within the operating conditions described in Section 4.2. Symbol Parameter VDD33 Power input voltage VDDIO I/O input voltage Min

-0.3

-0.3 Max Unit 4.0 4.0 V V 3.2 Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power input voltage VDDIO I/O input voltage 2.97 2.97 3.3 3.3 3.63 3.63 V V 3.3 DC Electrical Characteristics These conditions apply to all DC characteristics unless otherwise specified: Tamb = 25 C, VDD33 = 3.3V. Symbol Parameter Conditions Min Typ Max Unit VIH VIL VOH VOL High Level Input Voltage Low Level Input Voltage High Level Output Voltage Low Level Output Voltage

2.97

-0.3 3.0

-0.3

3.63 0.3 3.3 0.4 V V V V Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 13 (31) 4 Radio Performance 4.1 BLE Radio Characteristics Parameter Tx Power Rx Sensitivity Description Typical Unit BLE Data Rate 1Mbps BLE Data Rate 2Mbps BLE Data Rate 1Mbps BLE Data Rate 2Mbps

+7

+7

-88

-88 dBm dBm dBm dBm 4.2 802.15.4 Radio Characteristics Parameter Description Tx Power 802.15.4 Data Rate 250kbps (O-QPSK DSSS) Rx Sensitivity 802.15.4 Data Rate 250kbps (O-QPSK DSSS) Typical Unit

+17

-98 dBm dBm Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 14 (31) 5 Mechanical Specification 5.1 Dimensional View 5.2 Pad Dimension Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 15 (31) Parameter Description Value A B C D E F Pin Exterior Pin Interior Diameter Pin Interior Offset Pin Spacing Pin Exterior Pin Comer Spacing Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 16 (31) 6 Development Kit 6.1 Overview Two kinds of development kits are created to allow EH-MW24 operate in either hostless mode or hosted modes. The hosted mode can further be broken down to either Network Co-Processor (NCP) mode or Radio Co-Processor (RCP) to allow flexibility to adapt to an external host. 6.1.1 Hostless Mode In hostless mode, EH-MW24 performs both applications and communications without an external host required to maximize cost saving and minimize size. The following diagram shows a typical deployment scenario and software architecture. d a e r h T All-in-One e e B g Z i EH-MW24 Powered by Qualcomm QCA4024

(BLE 5 + 802.15.4) Module Software FCC ID: 2ACCRMW24 IC ID:

20625-MW24 CMIIT ID: XXXXYZNNNN IoT Applications UDP TCP IPv6 ZigBee Device ZigBee PRO APS Layer ZigBee Base Device 6LowPAN ZigBee PRO Network Layer 802.15.4 MAC 802.15.4 PHY 6.1.2 Hosted Mode In hosted mode, an external host is required to carry out applications while EH-MW24 is functioning as either Network Communication Processor (NCP) or Radio Communication Processor (RCP). Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 17 (31) In Network Communication Processor (NCP) mode, all protocol stack will be offloading to EH-NW24 while an external host is focusing on IoT applications. This will take advantage of full computing resources on EH-MW24 to take care of all communication related tasks and minimize software changes required on an external host. The following diagram shows the NCP deployment scenario and software architecture. d a e r h T e e B g Z i Network Co-Processor Host Application Processor Up to 2x UART OR SPI SDIO EH-MW24 Powered by Qualcomm QCA4024

(BLE 5 + 802.15.4) Module Software FCC ID: 2ACCRMW24 IC ID:

20625-MW24 CMIIT ID: XXXXYZNNNN Host Application Processor QCA4024 Module IoT Applications Up to 2x UART ZigBee Device UDP TCP ZigBee Base Device IPv6 ZigBee PRO APS Layer 6LowPAN ZigBee PRO Network Layer 802.15.4 MAC 802.15.4 PHY In Radio Communication Processor (RCP) mode, EH-NW24 is simply performing 802.15.4 MAC functions while an external host will take care of all upper level protocol stacks as well as on IoT applications. This will take advantage of full computing resources on the host and simplifies software structure on EH-

MW24. The following diagram shows the RCP deployment scenario and software architecture. d a e r h T e e B g Z i Radio Co- Processor Host Application Processor IoT Applications SPI SDIO Host Application Processor EH-MW24 Powered by Qualcomm QCA4024

(BLE 5 + 802.15.4) FCC ID: 2ACCRMW24 IC ID:

20625-MW24 CMIIT ID: XXXXYZNNNN UDP TCP IPv6 ZigBee Device ZigBee PRO APS Layer ZigBee Base Device 6LowPAN ZigBee PRO Network Layer QCA4024 Module Module Software SPI SDIO 802.15.4 MAC 802.15.4 PHY Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 18 (31) 6.2 Hostless Development Kit 6.2.1 Hardware Configuration 15-pin 2.54 mm (0.1) Header Cortex Debug 10-pin connector 4-position DIP Switch Micro USB PWR-ON LED Reset Button It has the following headers, connectors, DIP switch and LED:

1. 2x 15-pin 2.54mm (0.1) header All GPIO and control pins are exposed to these two headers as shown below:

15-pin 2.54 mm (0.1) Header GPIO_8 30 GPIO_9 GPIO_11 GPIO_10 GPIO_17 GPIO_16 GPIO_27 GPIO_12 CHIP_PWR_L GPIO_26 GPIO_25 VDD_1V8 VDD_3V3 VDD_5V0 29 28 27 26 25 24 23 22 21 20 19 18 17 GND 16 1 2 3 4 5 6 7 8 9 EXT_CLKOUT GPIO_60 GPIO_59 GPIO_58 GPIO_57 GPIO_56 GPIO_55 GPIO_19 GPIO_20 10 GPIO_22 11 GPIO_18 12 GPIO_21 13 GPIO_23 14 GPIO_24 15 GND Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 19 (31) 2. Micro-USB connector This USB port is used to power the development kit as well as to provide UART interface to EH-MW24 via USB to UART bridge. It can be also used to re-flash image and perform manufacturing test. 3. Cortex Debug 10-pin connector This standard connector is used for JTAG function supported by QCA4024. It can be connected to an external debugger such as SEGGER j-Link to offer ITM and DWT trace information. 4. Reset Button This button can be used to reset EH-MW24. 5. PWR-ON LED It is used to indicate power on state when on. 6. 10-position DIP switch This is used to configure operation as defined below:

Switch Position Value SW1 SW2 SW3 SW4 ON USB for manufacturing test OFF USB for UART ON JTAG Enabled OFF JTAG Disabled ON I/O voltage 3.3V OFF I/O voltage 1.8V ON RTC 32kHz XTAL enabled OFF RTC 32kHz XTAL disabled Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 20 (31) 6.2.2 Block Diagram USB_5V 1.8V LDO 3.3V 5V VDD33 VDD_1V8 VDD_3V3 VDD_5V0 PWR LED Micro USB DP DM SPDT USB to UART Bridge JTAG_TCK JTAG_TDO JTAG_TMS JTAG_TDI JTAG_TRST JTAG Reset Button HSUART_RTS HSUART_RXD HSUART_CTS HSUART_TXD SPST USB_DP USB_DM GPIO_16 GPIO_17 GPIO_59 GPIO_60 GPIO_8 GPIO_9 GPIO_10 GPIO_11 GPIO_12 CHIP_PWD_L VDDIO VDD_3V3 VDD_1V8 SPDT T U O K L C _ T X E 1 0 6 _ O P G I 9 5 _ O P G I 8 5 _ O P G I 7 5 _ O P G I 6 5 _ O P G I 5 5 _ O P G I 9 1 _ O P G I 0 2 _ O P G I 2 2 _ O P G I 8 1 _ O P G I 1 2 _ O P G I 3 2 _ O P G I 4 2 _ O P G I D N G 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VDD3V3 32K_XTALI 32kHz 32K_XTALO

) m m 4

. 5 2

1

) m m 2 6

. 8 2

7 7 6 2

. 1 VDDIO 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 8 _ O P G I 9 _ O P G I 1 1 _ O P G I 0 1 _ O P G I 7 1 _ O P G I 6 1 _ O P G I 7 2 _ O P G I 2 1 _ O P G I L _ D W P _ P H C I 6 2 _ O P G I 5 2 _ O P G I 8 V 1 _ D D V 3 V 3 _ D D V 0 V 5 _ D D V D N G 6.2.3 Dimension 21 (31) 6.3 Hosted Development Kit (Pmod Adapter) Hosted development kit is created per various industry standards. One of those standards being used is Digilent PmodTM Interface Specification (https://digilent.com/reference/pmod/start). 6.3.1 Hardware Configuration Hosted development kit (Pmod Adapter) is shown below:

3-pin 2.54 mm (0.1) USB Header Pmod Type 2A(SPI)/3A(UART) PWR-ON LED 4-position DIP Switch Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 22 (31) It has the following headers, connectors, DIP switch and LED:

1. 2x6 2.54mm (0.1) Header Pmod Type 2A (SPI)/3A (UART) Interface type can be configured by DIP switch SW2. In case of UART, male and female can be configured DIP switch SW3. Pmod Type 2A BT_PRIORITY/INT GPIO_60 RESET CHIP_PWR_L BT_ACTIVE/SPI_CS2 GPIO_16 7 8 9 WLAN_ACTIVE/SPI_CS3 GPIO_17 10 GND 11 VDD33 12 1 2 3 3 5 6 GPIO_12 SPI_CS GPIO_23 SPI_MOSI GPIO_20 SPI_MISO GPIO_18 SPI_CLK GND VDD33 SPI Slave Pmod Type 3A BT_PRIORITY/INT GPIO_60 RESET CHIP_PWR_L BT_ACTIVE/NC GPIO_16 7 8 9 WLAN_ACTIVE/NC GPIO_17 10 GND 11 VDD33 12 1 2 3 3 5 6 GPIO_18 HSUART_CTS GPIO_19 HSUART_TXD GPIO_20 HSUART_RXD GPIO_23 HSUART_RTS GND VDD33 UART Male Pmod Type 3A BT_PRIORITY/INT GPIO_60 RESET CHIP_PWR_L BT_ACTIVE/NC GPIO_16 7 8 9 WLAN_ACTIVE/NC GPIO_17 10 GND 11 VDD33 12 1 2 3 3 5 6 GPIO_23 HSUART_RTS GPIO_20 HSUART_RXD GPIO_19 HSUART_TXD GPIO_18 HSUART_CTS GND VDD33 UART Female 2. 3-pin 2,54 mm (0.1) USB header It is offered as an option in case the user wants to re-flash image via USB interface. 3. PWR-ON LED It is used to indicate power on state when on 4. 4-position DIP Switch This is used to configure operation as defined below:

Switch Position Value SW1 ON Boot from USB OFF Boot from UART SW2 ON Pmod Type 2A (SPI) Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 23 (31) OFF Pmod Type 3A (UART) ON Pmod Type 3A (UART) Male OFF Pmod Type 3A (UART) Female ON RTC 32kHz XTAL enabled OFF RTC 32kHz XTAL disabled SW3 SW4 6.3.2 Block Diagram PIN_6/PIN_12 (VCC) PIN_5/PIN_11 (GND) PIN_1 (SS/CTS) PIN_2 (MOSI/TXD) PIN_3 (MISO/RXD) PIN_4 (SCK/RTS) PIN_8 (RESET) PIN_7 (INT) PIN_9 (N/S) PIN_10 (N/S) PWR LED VDDIO VDD33 GPIO_19/SPI_CS SW_1 (CTS) GPIO_23/SPI_MOSI SW_2 (TXD) GPIO_20/SPI_MISO SW_3 (RXD) GPIO_18/SPI_CLK SW_4 (RTS) CHIP_PWD_L GPIO_60/BT_PRIORITY GPIO_16/BT_ACTIVE GPIO_17/WLAN_ACTIVE USB_DP USB_DM GND SPDT UART Tx/Rx Selection 32K_XTALI 32kHz 32K_XTALO

) m m 2 3

. 0 2

8

, 0 SW_1 (CTS) SW_2 (TXD) SW_3 (RXD) SW_4 (RTS) GPIO_18/HSUART_CTS GPIO_23/HSUART_RTS GPIO_19/HSUART_TXD GPIO_20/HSUART_RXD GPIO_20/HSUART_RXD GPIO_19/HSUART_TXD GPIO_23/HSUART_RTS GPIO_18/HSUART_CTS SPDT 6.3.3 Dimension 24 (31) 6.4 Hosted Development Kit (Android Shield) Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 25 (31) 7 Manufacturing Recommendation 7.1 Power Layout Guideline The module is powered by either 3V battery or DC 3.3V. Power pin connection capacitor is as close as possible to chip and pin. Decoupling the power supply from the chip using a capacitor. Use capacitors to prevent noise from coupling back to the power plane. 7.2 RF Layout Guideline To optimize antenna performance, place the module in the corner of the PCB as shown below. Do not cover copper and trace the antenna clearance area. Keep the antenna area as far away as possible from the power supply and metal components. Connect all GND pins directly to a solid GND plane. Place GND vias as close as possible to the GND pin. Use a good layout method to avoid excessive noise coupling with signal lines or supply voltage lines. 7.3 Soldering Recommendations The EH-MW24 modules can be SMT on the board following the temperature curve graph:

Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 26 (31) Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 27 (31) 8 Packaging Modules are packaged on reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and a humidity card and placed in an 36x25x12cm box. Anti-static warnings and labels adhere to the outside of the bag. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity.12.2 Packing Label Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 28 (31) 9 Regulatory Compliance Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 29 (31) 10 Order Information Part Number Value EH-MW24 PCB only antenna EH-MW24W PCB or U.FL antenna EH-MW24E External PA PCB only antenna EH-MW24EW External PA PCB or U.FL antenna Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 30 (31) Revision History Revision Description Initial version 0.1 1.0 Date May 31, 2022 Documentation Title EH-MW24 Datasheet Documentation No Revision V0.1 Classification Status Date Public Preliminary Apr 15, 2022 is the FCC rules. Operation the following two cond subject and

(2) this device must accept any int cause undesired operation. to the party responsible for compliance could v operate the equipment. found been tested the FCC Rules. These limits are designed and to to a residential installation. This equipment generates uses and, to if radio communications. However, there not installed and used comply with the limits for a Class B digital de provide reasonable protec and accordance with the instructi th no this equipment does cause harmful int turning the equipment off the following or If determined by guarantee by one correct the interference more to of in is of by 15 to has of 15 modifications not expressly approved FCC Statement This device complies with part itions: (1) this device may not cause harmful interference, erference received, including interference that may or Changes oid the authority users NOTE: This equipment vice, pursuant part to tion against harmful interference in can radiate radio frequency energy ons, may cause harmful interference at erference and measures:

interference will not occur or radio to encouraged is on, the user television reception, which can try a particular installation. be antenna. and to in relocate the receiving separation between the Reorient or Increase the Connect the equipment into an outlet on a circuit different from that to which the receiver connected. equipment receiver. experienced radio/TV technician for help. is or an the dealer Note:

Consult Important Radiation Exposure Statement This environment. This or transmitter transmitter. equipment complies must not with FCC radiation exposure limits set forth for an uncontrolled be co-located or operating in conjunction with any other antenna End Product Labeling The final end product must be labeled in a visible area with the following" Contains FCC ID:

2ACCRMW24

". OEM integrator has to be not to provide information to the End User aware RF module in the users manual of to the the end product end user regarding how which integrates to this shall include all required regulatory information/warning as show in or remove this Manual Information The install module. end The this manual. user manual Antennas Antenna Specification are as follows:

Type: PCB Antenna Gain: 0.54dBi ISED Statement English: This device complies with Industry Canada licenseexempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, a nd (2) This device must accept any interference, including interference that may cause undesired operation of the device. The digital apparatus complies with Canadian CAN ICES3 (B)/NMB3(B). French: Le prsentappareilestconforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationestautorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareildoit accepter tout brouillageradi olectriquesubi, mmesi le brouillageest susceptible d'encompromettre le fonctionnement. This radio transmitter (ISED certification number: 20625-MW24) has been approved by Industry Canada to operate with the antenna types listed with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur.

(ISED certification number: 20625-MW24) a t approuv par Radiation Exposure Statement This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. Dclaration d'exposition aux radiations Cet quipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrl. This device is intended only for OEM integrators under the following condition:

The transmitter module may not be co-located with any other transmitter or antenna. As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes:

Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. Important Note:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. Note Importante:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l' IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final

(y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The final end product must be labeled in a visible area with the following: Contains IC: 20625-MW24 Plaque signaltique du produit final Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: Contient des IC: 20625-MW24 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. Please visit www.ehonglink.com/ for the latest information. THIS CODUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to the use of information in this document, is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners and are hereby acknowledged. Copyright2022 Ehong InformationTechnology Co. Ltd. All rights reserved.

Ehong EH-MW24 Powered by Qualcomm QCA4024

(BLE 5 + 802.15.4) FCC ID: 2ACCRMW24 d IC : 20625-MW24 CMIIT ID: XXXXYZNNNN

|220.)P6498

[G Rrennenanas a: @:

ShangHai Ehong Technology Co.,Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 Subject: Request for Confidentiality FCC ID: 2ACCRMW24 To Whom It May Concern, C5266091_X10_Ed.2 Date: 2022-08-30 Pursuant to the provisions of Sections 0.457 and 0.459 of Commission's rules

(47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure. Exhibits ID Label/Location Attestation Statement External Photos Block Diagram Schematics Test Report Test Setup Photos Users Manual Internal Photos Parts List / Tune Up RF Exposure Info Operational Description Cover Letter(s) SDR Software / Security Info Long-Term Confidentiality No No No No No NOTE 1 NOTE 1 No No Short-Term Confidentiality NOTE 2 No No No No No No NOTE 1: Long-Term Confidentiality may be permitted under special conditions (See II. LONG-TERM CONFIDENTIALITY, Section 3 of KDB 726920, use last in force) NOTE 2: Short-Term Confidentiality can be requested for a maximum of 180 days from the date of the grant. Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In case of short-term Confidentiality, the applicant requests the exhibits selected above are withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Sincerely, Rik Tang 1/1

C5266091_X8_Ed.1 ShangHai Ehong Technology Co.,Ltd. Letter of Authorization Company:

ShangHai Ehong Technology Co.,Ltd. Address:

district,Shanghai, China Room 501, No.485 Xingmei Road, Minhang Product Name:

AIOT Module Model Number: EH-MW24 FCC Identifier:

2ACCRMW24 We authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, to act on our behalf on all matters concerning the above named equipment. Any individual within LGAI Technological Center S.A. is authorized to act on our behalf and take action on the application. We declare that authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, is allowed to forward all information related to the approval project to the Federal Communication Commission and to discuss any issues concerning the approval application. Any and all acts carried out by LGAI Technological Center S.A. on our behalf shall have the same effect as acts of our own. Name:

Rik Tang Date: 2022-08-30 Title: CEO Signature of applicant:

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ShangHai Ehong Technology Co.,Ltd. Modular Transmitter Approval Request C5266091_X9_Ed.2 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Company name: ShangHai Ehong Technology Co.,Ltd. FCC ID: 2ACCRMW24 Gentlemen, In accordance with 47CFR 15.212 Modular Transmitters and been v02. Certification following requirements. 2ACCRMW24 Guide FCC has ID:

KDB 996369 D01 Module examined against the Items to be covered by Single modular transmitters. Requirement per 15.212 and KDB 996369 D01 Modular Certification Guide v02 1. The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly 2. The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal Explanation from Grantee

(do not write yes/no, but explain why product complies/how it is achieved) The module has its own RF shielding. The modular has buffered data inputs, it is integrated in chip 3. The module must contain power supply regulation on the module The modular has power supply regulation 4. The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b) 5. The module must demonstrate compliance in a stand-

alone configuration 6. The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements) Antenna is independent fixed All power lines derived from the host device are regulated before energizing other circuits internal The label is independent fixed 7. The module must comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee Compliant with all applicable FCC rules. Detail instructions are given in the Users Manual 8. The module must comply with RF exposure requirements Approved to comply with the applicable RF exposure requirement, please see the MPE evaluation Name:

Rik Tang Date: 2022-08-30 Title: CEO Signature of applicant:

1/1