FCC ID: 2ACCRES101 BLE Module

Ehong Technology Co.,Ltd EH-ES101 Low Energy SIP Module Data Sheet EH-2018090-DS Rev1.1 Bluetooth Radio

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Fully embedded Bluetooth V4.2 single mode ARM Cortex-M0 @ 32-bit Support Profiles

- BLE (Master and slave)

- The generic attribute profile (GATT) User Interface

- Send AT command over UART

- Firmware upgrade over the air (OTA)

- Transmit data: 1Mbps transmission speed

- I2C ,SPI interface ( Master )

- Watchdog and RTC

- 2 PWM modules General I/O

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14 general purpose I/Os 2 analog I/Os (10bit ADC) Power dissipation

- Standby power consumption of less than 1uA in hibernation mode (wakeable) FCC/RED/IC/RoHs and Bluetooth qualified Single voltage supply: 1.8-- 3.6V typical Small form factor: 7.0 x 7.0x 1.0mm Operating temperature range: -40 C to 105 C Sept 17, 2018 Ehong Professional Bluetooth Solutions Provider page 1 of 14 VERSION HISTORY EH-ES101 Version V1.1 Comment Change the Pin GPIO to DIO in the schematic diagram Confidential and Proprietary Ehong Technology Co.,Ltd NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: DCC@ehlink.com.cn Restricted Distribution: Not to be distributed to anyone who is not an employee of either Ehong Technology Co.,Ltd or its affiliated companies without the express approval of Ehong Configuration Management. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Ehong Technology Co.,Ltd. This Bluetooth trademark is owned by the Bluetooth SIG Inc., USA and is licensed to Ehong Technologies. All other trademarks listed herein are owned by their respective owners. 2016 Ehong Technology Co.,Ltd. All rights reserved. Ehong Professional Bluetooth Solutions Provider page 2 of 14 EH-ES101 1. Contents 1. Description ......................................................................................................................................................... 4 2. Applications ....................................................................................................................................................... 4 3. EH-ES101 Product numbering ...................................................................................................................... 4 4. Pinout and Terminal Description .................................................................................................................. 5 4.1. Pin Configuration ......................................................................................................................................... 5 5. Physical Interfaces ........................................................................................................................................... 7 5.1. GPIO .............................................................................................................................................................. 7 5.2. ADC ............................................................................................................................................................... 7 5.3. PWM .............................................................................................................................................................. 8 5.4. UART ............................................................................................................................................................. 8 5.5. I2C Master .................................................................................................................................................... 8 5.6. SPI Master .................................................................................................................................................... 8 6. Electrical Characteristics ............................................................................................................................... 8 6.1. Recommended Operation Conditions ...................................................................................................... 8 6.2. Absolute Maximum Rating ......................................................................................................................... 9 6.3. Input/Output Terminal Characteristics ...................................................................................................... 9 6.4. Power Consumption .................................................................................................................................... 9 7. Reference Design ........................................................................................................................................... 10 8. Layout and Soldering Considerations ...................................................................................................... 11 8.1. EH-ES101 external view ........................................................................................................................... 11 8.2. PCB package outline drawing .................................................................................................................. 11 9. Tape and reel information ............................................................................................................................ 12 9.1. Tapa orientation ......................................................................................................................................... 12 9.2. Tape dimensions ....................................................................................................................................... 12 9.3. Reel information ......................................................................................................................................... 13 10. The tray information ...................................................................................................................................... 13 11. Soldering Recommendations ...................................................................................................................... 14 12. Contact Information ....................................................................................................................................... 14 Ehong Professional Bluetooth Solutions Provider page 3 of 14 1. Description EH-ES101 EH-ES101 series is a powerful, highly flexible, ultra-low power Bluetooth smart SIP module base on BlueNRG-1 SoC from ST. Embedded 2.4GHz transceiver; the EH-ES101module provides a complete RF solution allowing faster time-to-market with reduced development costs. The module offers all Bluetooth low energy features: radio, stack, profiles and application space for customer application, so no external control processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module. The module is small in size and support the module of selecting the external antenna to facilitate the flexible development of the product.The module can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes only less 1uA and will wake up in few hundred microseconds. After buying Bluetooth module, we provide free technical support APP of iOS system or APP Android system. 2. Applications Sports and fitness Healthcare Home entertainment Office and mobile accessories Automotive Commercial Watches Human interface devices 3. EH-ES101 Product numbering EH-ES101 A. EH ------------- Company Name(Ehong) B. ES101 ------------ Module Name Ehong Professional Bluetooth Solutions Provider page 4 of 14 4. Pinout and Terminal Description 4.1. Pin Configuration EH-ES101 Symbol Pin PAD Type Figure 1 Pinout of EH-ES101 General purpose digit I/O Description See IO function map DIO0 DIO1 DIO2 DIO3 DIO5 DIO6 DIO9 DIO10 VDD1V2 DIO11 DIO12 SMPT2 SMPT1 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 General purpose digit I/O See IO function map General purpose digit I/O See IO function map General purpose digit I/O See IO function map General purpose digit I/O See IO function map General purpose digit I/O See IO function map General purpose digit I/O General purpose digit I/O 1.2V digit core output General purpose digit I/O General purpose digit I/O See IO function map, also work as SWDCLK See IO function map, also work as SWDIO Connect a capacitor See IO function map See IO function map SMPS output to external filter / VCC input Connect to VCC or an inductor SMPS output to external filter Powered ground Ehong Professional Bluetooth Solutions Provider page 5 of 14 RF GND GND ADC2 ANATEST1 DIO8 DIO14/TEST0 DIO7/BOOT ADC1 DIO4 RESET GND VBAT1 16 17 18 19 20 21 22 23 24 25 26 27 28 Use an internal antenna or connect to an external antenna. Powered ground Powered ground ADC input 2 Antenna test pin1 General purpose digit I/O General purpose digit I/O / Analog output General purpose digit BOOT pin EH-ES101 Used for indicate RFs TX/RX event, also can user for extern antenna switch See IO function map See IO function map See IO function map, used for BOOT pin(vcc) for jump to bootloader when power on ADC input 1 General purpose digit I/O See IO function map System reset pin Powered ground Powered VCC Active low level 1.8-3.6V Table 1PIN Terminal Description Pin namea GPIO mode000 Mode serial1001 Mode serial0100 Mode serial2101 Type Signal Type Signal Type Signal Type Signal IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 IO12 IO14 I/O I/O I/O I/O I/O I/O I/O GPIO 0 GPIO 1 GPIO 2 GPIO 3 GPIO 4 GPIO 5 GPIO 6

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I/O GPIO 8 I/O I/O GPIO 9 GPIO 10 I/O GPIO 11 OD GPIO 12b GPIO 14 I/O I O O O I O O I O I I I I UART_CTS UART_RTS PWM0 PWM1 UART_RXD UART_TXD UART_RTS UART_CTS UART_TXD SWCLK SWDIO UART_RXD

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I/O I2C1_CLK I/O I/O O I I/O I/O I/O I/O I/O I O I/O I/O I/O SPI_CLK SPI_CS1 SPI_OUT SPI_IN I2C2_CLK I2C2_DAT I2C2_CLK

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I O O O O I

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PDM_DAT A PDM_CLK

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PWM0 PWM1 PDM_DAT A I2C2_DAT O PDM_CLK SPI_CLK SPI_IN SPI_OUT SPI_CS1 I2C2_DAT I

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SPI_CLK O PDM_DAT A

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Table 2IO function MAP Ehong Professional Bluetooth Solutions Provider page 6 of 14 EH-ES101 5. Physical Interfaces 5.1. GPIO 14 IOs are provided. Every IO can program for other function. All theGP IOs are in high impedance under reset. All the IOs are in high impedance in low power modes (sleep and standby). If pre-programmed as wake up sources, pins IO9, IO10 and IO11 are in input pull up. All the GIOs can programed for an interrupt source. Edge detection or level detection, and falling/rising or both. GIO0~GIO8 and GIO14 can program input pull down. GIO9~GIO11 can program input pull up. GIO12 can only be General Purpose Input pins (not output). When power for 3.3V, internal Pull resister is:

Name RPD RPU Description Name Min Pull-down Value Pull-up Value 53 57 Type 84 81 Max 144 122 Unit K Table 3Internal Pull for 3.3V When power for 1.8V, internal Pull resister is:

Name Description Name Min Type Max Unit Digital input and output when 1.8V supply RPD RPU Pull-down Value Pull-up Value 117 135 202 211 363 334 K Table 4Internal Pull for 1.8V Note:

A. GIO7 can work as BOOT pin. when power on, if GIO7 is high level, CPU will jump to bootloader mode, and this time can update the firmware by UART. B. GIO9 and DIO10 can work as SWDCLK and SWDIO. If need debug or download also can use Jlink OB or ST-LINK. The IOs programmed to be wake up sources need an external drive according to the selected level sensitivity. If the wake up level is high level, a pull down drive should be used. If the wake up level is low level, a pull up drive should be used. If no external drive is applied, IO9, IO10 and IO11 are only sensitive to low level as they have an internal pull up (activated by default). IO12 do not have an internal pull and therefore require an external drive. 5.2. ADC 2 ADCs are provided. Main features are:

. Internal temperature and battery level conversion. e pins ADC1 and ADC2. Ehong Professional Bluetooth Solutions Provider page 7 of 14 EH-ES101 5.3. PWM 2 PWMs can be driven by internal PWM module. 5.4. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the TTL protocol. When using low-power mode, TXD needs to pull up resistance, and the reference value is 4.7k. Main features are:

Programmable baud rate can reach up to 921600bps. me of 5, 6, 7 or 8 bits of data.

-parity bit generation and detection. 5.5. I2C Master The module can act as an I2C master when configured by software. Main features are:

e and up to 100 Kb/s in standard mode. multi-master system with bus arbitration. 5.6. SPI Master The module can act as an SPI master (mode 0) when configured by software. Main features are:

6. Electrical Characteristics 6.1. Recommended Operation Conditions Operating Condition Operating Temperature Range Battery (VDD_BAT) operation Frequency Range ADC Input range Min

-30 1.8 2402 0 Typical

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3.3

-2

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Max

+80

+3.6 2480

+1.2 Unit C V MHz V Ehong Professional Bluetooth Solutions Provider page 8 of 14 Table 5: Recommended Operation Conditions EH-ES101 Rating Storage Temperature Battery (VBAT) operation*

I/O supply voltage Min

-40 1.8

-0.4 Max

+85 3.6

+3.6 Other Terminal Voltages except RF Vss-0.4 VBAT+0.4 Unit C V V V

*In the absence of damage, the maximum 10% of product life is allowed for short term operation, but the output regulation and other specifications will not be guaranteed in excess of 4.2V.*

Table 6: Absolute Maximum Rating 6.2. Absolute Maximum Rating

*Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 6.3. Input/Output Terminal Characteristics Input Voltage Levels VIL input logic level low VIH input logic level high Tr/Tf Output Voltage Levels VOL output logic level low, lOL = 4.0mA Min

-0.4 0.7 x VDD

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Min

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VOH output logic level high, lOH = -4.0mA 0.75 x VDD Tr/Tf

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Typical

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Typical

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Max 0.4 VDD + 0.4 25 Max 0.4

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5 Unit V V ns Unit V V ns Table 7: Digital I/O Characteristics Condition Human Body Model Contact Discharge per JEDEC EIA/JESD22-

A114 Machine Model Contact Discharge per JEDEC EIA/JESD22-A115 200V Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 III Class Max Rating 2 2000V (all pins) 200V (all pins) 500V (all pins) Table 8: ESD Protection 6.4. Power Consumption Current consumption is measured using a battery.

(1)When the DC-DC converter is activated, the power consumption is as follows:

Ehong Professional Bluetooth Solutions Provider page 9 of 14 Pattern Standby Sleep describe All functions are shut down. GPIO preprogramming is required to wake up. 32kHz on and 24KB RAM retain Model at full speed Open all functions RF TX active RF RX active VDD=3.3V VDD=3.3V EH-ES101 Total typical current at 3.3V (average)

<700nA

<2.1uA 2.5mA-3.6mA

~8.3mA peak

~7.7mA peak

(2)The power consumption is as follows when the DC-DC converter is not used:

Table 9: Current Consumption Discribe Total typical current at 3.3V (average) pattern Standby Sleep All functions are shut down. GPIO preprogramming is required to wake up. 32kHz on and 24KB RAM retain

<700nA

<2.1uA 2.5mA-3.6mA

~15.3mA peak

~14.5mA peak Model at full speed Open all functions RF TX active RF RX active VDD=3.3V VDD=3.3V 7. Reference Design Ehong Professional Bluetooth Solutions Provider page 10 of 14 Figure 2 Reference Design important EH-ES101 Note:

A. DC-DC transverter select;

(1) When the DC-DC converter is not used, a 0 - o resistor is welded to the welding plate 1-3, otherwise it cannot work;

(2) When the dc-dc converter is activated, a 10uH inductance is welded to the welding disc 1-2.This method can reduce peak power consumption, and the peak current can be reduced by about 45%. B. Pin23 BOOT pin cant connect to VCC, or else will always goto boot mode;

C. Pin9 VDD1V2 need connect a test pad. 8. Layout and Soldering Considerations 8.1. EH-ES101 external view Figure 3 EH-ES101 External view 8.2. PCB package outline drawing VIEW) E hong Professional Bluetooth Solutions Provider page 11 of 14 Figure 4:EH-ES101 package information (TOP 9. Tape and reel information EH-ES101 modules are supplied on the tape and reels. For tape and reel packing and labeling, see IC packing and labeling specification. EH-ES101 9.1. Tapa orientation Figure 5 shows the EH-ES101 module LGA packing tape orientation. User Direction of Feed Figure 5: EH-ES101 module tape orientation 9.2. Tape dimensions Figure 6 shows and Table10 lists the dimensions of the tape for the EH-ES101 module. Figure 6 EH-ES101 tape dimensions ITEM DIM(mm) 16.0 W A0 7.3 B0 7.3 K0 1.5 P 12 F 7.5 E 1.75 D0 P0 1.5 4 P2 2.0 T 0.3 Table 10: EH-ES101 module tape dimensions Ehong Professional Bluetooth Solutions Provider page 12 of 14 9.3. Reel information EH-ES101 Figure 7 EH-ES101 reel dimensions Item Unit:mm A 330 B 16.4 D 100 E 2.0 F 21.5 G 13.2 H 2.6 I 10.75 Table 11: EH-ES101 module reel dimensions 10. The tray information Figure 8 is the size of EH-ES101 pallet, and the number of chips in the tray is 26*10=260PCS. Ehong Professional Bluetooth Solutions Provider page 13 of 14 Figure 8: EH-ES101 pallet size. EH-ES101 11. Soldering Recommendations EH-ES101 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. SMT stencil making requirements If Bluetooth module PIN pitch 0.25mm and other component PIN pitch 0.25mm,so you choose SMT stencil thickness 0.15mm. If Bluetooth module PIN pitch 0.25mm and other component PIN pitch 0.25mm,so you choose SMT Ladder stencil Bluetooth module thickness 0.15mm other component thickness 0.13mm. Solder pad open via ratio Length 1:1.2, width 1:1. 12. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Website: http://www.ehonglink.com Tel: 021-61263536 Fax: 021-61263536 Address: Suite501,No.3 building,No.439 Jinglian road,Minhang district,Shanghai,China FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. FCC Label Instructions:

The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: Contains Transmitter Module FCC ID: 2ACCRES101,or Contains FCC ID: 2ACCRES101, Any similar wording that expresses the same meaning may be used Ehong Professional Bluetooth Solutions Provider page 14 of 14