FCC ID: 2ACCRMB18 Bluetooth Module

EH-MB18 Bluetooth Technology Audio Module Bluetooth radio

- Fully embedded Bluetooth v4.2(Smart ready)

- Bluetooth v3.0 specification compliant

- TX power +8dbm,-90dbm RX sensitivity

-

- Range up to 15m

-

- Multipoint capability(7 transmit data devices Internal chip antenna or U.fl port 128-bit encryption security connected at the same time) Support profiles

- SPP (Master and slave), iAP (ipod accessory protocol)

- BLE(GATT Profile)

- HFP ,A2DP,AVRCP,HID(Salve) User interface

- Send AT command over UART

- Firmware upgrade over USB

- With SPP service active: 560kbps transmission speed (UART)

- PCM interface (I2S,SPDIF)

- I2C interface(Master ),SPI Audio codec

-

optional support for 64Mb of external SPI flash 16Mb internal flash memory (64-bit wide, 45ns) 80MHz RISC MCU and 80MIPS Kalimba DSP

-

- Support for CSR's latest CVC technology for narrow-band and wideband voice connections including wind noise reduction

- Support Apt-X ,AAC, Apt-XLL,SBC codec General I/O 13 eneral purpose I/Os 2 analogue I/O

-

-

- Support for up to 3 capacitive touch sensor inputs

-

Three fully configurable LED drivers FCC and Bluetooth qualified Single voltage supply: 2.7-3.6V Small form factor: 30.4 x 15.26 x 2.4mm Operating temperature range: -40 C to 85 C Ehong Technology Co., Ltd Bluetooth Audio Module 1. Contents 1. Description ......................................................................................................................................................... 4 2. Application ......................................................................................................................................................... 4 3. EH-MB18 Product numbering ........................................................................................................................ 4 4. Electrical Characteristic .................................................................................................................................. 5 4.1. Recommend operation conditions ............................................................................................................ 5 4.2. Absolute Maximum Rating ......................................................................................................................... 5 4.3. Power consumptions .................................................................................................................................. 5 4.4. Input/output Terminal Characteristics ...................................................................................................... 7 4.4.1. Digital Terminals .................................................................................................................................. 7 4.4.2. USB ....................................................................................................................................................... 8 4.4.3. Internal CODEC Analogue to Digital Converter .............................................................................. 8 Internal CODEC Digital to Analogue Converter.............................................................................. 9 4.4.4. 5. Pinout and Terminal Description ................................................................................................................ 10 5.1. Pin assignment .......................................................................................................................................... 10 6. Physical Interfaces ......................................................................................................................................... 13 6.1. Power Supply ............................................................................................................................................. 13 6.2. Reset ........................................................................................................................................................... 13 6.3. PIO .............................................................................................................................................................. 14 6.4. AIO .............................................................................................................................................................. 14 6.5. RF interface ............................................................................................................................................... 14 6.6. UART .......................................................................................................................................................... 14 6.7. I2C Master .................................................................................................................................................. 15 6.8. Apple iOS CP reference design .............................................................................................................. 16 6.9. Digital Audio Interfaces ............................................................................................................................ 17 6.9.1. PCM .................................................................................................................................................... 18 6.9.2. Digital Audio Interface (I2S) ............................................................................................................. 19 6.9.3. IEC 60958 Interface (SPDIF) .......................................................................................................... 22 6.10. Microphone input ................................................................................................................................... 23 6.11. Analog Output stage ............................................................................................................................. 24 6.12. USB ......................................................................................................................................................... 24 7. EH-MB18 Reference Design ......................................................................................................................... 26 Ehong Technology Co., Ltd Bluetooth Audio Module 8. Mechanical and PCB Footprint Characteristics ...................................................................................... 27 9. RF Layout Guidelines .................................................................................................................................... 28 10. Reflow Profile ............................................................................................................................................... 29 11. Contact Information ................................................................................................................................... 30 2. Table of Tables TABLE 1: RECOMMENDED OPERATING CONDITIONS .................................................................................................... 5 TABLE 2: ABSOLUTE MAXIMUM RATING RECOMMENDED OPERATING CONDITIONS ................................................... 5 TABLE 3: POWER CONSUMPTIONS ................................................................................................................................ 7 TABLE 4: DIGITAL TERMINAL ......................................................................................................................................... 8 TABLE 5: USB TERMINAL .............................................................................................................................................. 8 TABLE 6: ANALOGUE TO DIGITAL CONVERTER ............................................................................................................. 9 TABLE 7: DIGITAL TO ANALOGUE CONVERTER ........................................................................................................... 10 TABLE 8PIN TERMINAL DESCRIPTION ..................................................................................................................... 13 TABLE 9: PIN STATUS ON RESET ................................................................................................................................ 14 TABLE 10: POSSIBLE UART SETTINGS ...................................................................................................................... 15 TABLE 11: ALTERNATIVE FUNCTIONS OF THE DIGITAL AUDIO BUS INTERFACE ON THE PCM INTERFACE ............... 18 TABLE 12 : DIGITAL AUDIO INTERFACE SLAVE TIMING ............................................................................................... 21 TABLE 13 : DIGITAL AUDIO INTERFACE MASTER TIMING............................................................................................ 21 TABLE 14: USB INTERFACE COMPONENT VALUES .................................................................................................... 25 3. Table of Figures FIGURE 1PINOUT OF EH-MB18.............................................................................................................................. 10 FIGURE 2POWER SUPPLY PCB DESIGN ................................................................................................................ 13 FIGURE 3CONNECTION TO HOST DEVICE ............................................................................................................... 15 FIGURE 4 : EXAMPLE EEPROM CONNECTION WITH I2C INTERFACE ........................................................................ 16 FIGURE 5 : APPLE CO-PROCESSOR 2.0C ................................................................................................................... 16 FIGURE 6 : APPLE CO-PROCESSOR 2.0B ................................................................................................................... 17 FIGURE 7 : AUDIO INTERFACE ..................................................................................................................................... 18 FIGURE 8 : DIGITAL AUDIO INTERFACE MODES .......................................................................................................... 20 FIGURE 9 : DIGITAL AUDIO INTERFACE SLAVE TIMING ............................................................................................... 21 FIGURE 10 : DIGITAL AUDIO INTERFACE MASTER TIMING .......................................................................................... 21 FIGURE 11: EXAMPLE CIRCUIT FOR SPDIF INTERFACE (CO-AXIAL) ........................................................................ 22 FIGURE 12: EXAMPLE CIRCUIT FOR SPDIF INTERFACE (OPTICAL) ........................................................................... 22 FIGURE 13: MICROPHONE BIASING (SINGLE CHANNEL SHOWN) ............................................................................... 23 FIGURE 14: SPEAKER OUTPUT .................................................................................................................................... 24 FIGURE 15: USB CONNECTIONS ................................................................................................................................ 25 FIGURE 16: REFERENCE DESIGN ............................................................................................................................... 26 FIGURE 17: RECOMMENDED PCB MOUNTING PATTERN (UNIT: MM, DEVIATION:0.02MM)TOP VIEW ..................... 27 FIGURE 18: CLEARANCE AREA OF ANTENNA ............................................................................................................. 28 FIGURE 19: RECOMMENDED REFLOW PROFILE ......................................................................................................... 29 Ehong Technology Co., Ltd Bluetooth Audio Module 1. Description The EH-MB18 is an easy to use Bluetooth module, compliant with Bluetooth v4.2. The module provides complete RF platform in a small form factor. The module enables electronic devices with wireless connectivity, not requiring any RF experience or expertise for integration into the final product. The module being a certified solution optimizes the time to market of the final application. The module built-in enhanced Kalimba DSP coprocessor with 80MIPS, supports enhanced audio and DSP Applications (t Apt-X, AAC, Apt-XLL, SBC codec).Support GATT,A2DP, AVRCP, HSP, HFP,SPP, iAP and PBAP Profiles communication with smart ready devices. The module BLE profile communication with smart phones (iOS and Android), must be install the APP. EHong iOS system APP download address: https://itunes.apple.com/cn/app/ehong-

link/id854886208?mt=8. The module has 14 x general purpose IOs, 2x Analogue inputs/outputs (temperature sensor, charger control, etc), 3xs capacitive touch sensors, three fully configurable LED drivers

(PWM).The module optional support for 64Mb of external SPI flash 16Mb internal flash memory

(64-bit wide, 45ns),support Li-Ion battery charger with Instant-ON. 2. Application Home entertainment eco-system TVs Smart remote controllers Wired or wireless sound bars Wired or wireless speakers and headphones Bluetooth low energy connectivity to external 3D glasses Tablets / PCs / Mobile Connectivity Wired or wireless headphones for music / gaming / multimedia content Wired or wireless speakers Wired or wireless speaker phones Mono Headsets for voice 3. EH-MB18 Product numbering EH-MB18(B) A. EH ------------- Company Name(Ehong) B. MB18 ------------ Module Name C. B ------------- U.FL Connector Ehong Technology Co., Ltd Bluetooth Audio Module 4. Electrical Characteristic 4.1. Recommend operation conditions Operating Condition Operating Temperature Range PIO Voltage AIO Voltage LED VDD Voltage VCHG(a) RF frequency Min

-40

+1.7

+1.7

+1.1

+2.7

+4.75 2400 Typical

--

+3.3

+1.8 3.7

+3.3

+5 Max

+85

+3.6

+1.95

+3.6

+3.6

+5.75 Unit C V V V V V 2441 24800 MHz Table 1: Recommended Operating Conditions Note:(a) Maximum charging current 200mA 4.2. Absolute Maximum Rating Rating Storage Temperature PIO Voltage AIO Voltage LED VDD Voltage VCHG USB_DP/USB_DN Voltage Other Terminal Voltages Min

-40

-0.4

-0.4

-0.4

-0.4

-0.4

-0.4 Max

+125

+3.6

+1.95

+3.6

+3.6

+5.75

+3.6 VSS-0.4 VDD+0. 4 Unit C V V V V V V V Table 2: Absolute Maximum Rating Recommended Operating Conditions 4.3. Power consumptions DUT Role Connection Packet Type N/A N/A Deep sleep Page scan With UART host connection Page = 1280ms interval Window = 11.25ms

-

-

Average Current Unit 55 uA 219 uA Ehong Technology Co., Ltd Bluetooth Audio Module

-

378 uA N/A Inquiry a n d p a g e s c a n Inquiry

=

1 2 8 0 m s interval Page =

1 2 8 0 m s interval W i n d o w =

11.25m s Master ACL Master ACL Master SCO Sniff = 500ms, 1 attempt, 0 timeout Sniff = 1280ms, 8 attempts, 1 timeout Sniff = 100ms, 1 attempt, PCM Master SCO Sniff = 100ms, 1 attempt, mono audio codec DH1 DH1 HV3 HV3 119 uA 109 uA 7.6 mA 9.8 mA Master eSCO Setting S3, sniff =

2EV3 5.8 mA 100ms, PCM Master eSCO Setting S3, sniff =

3EV3 5.4 mA Master eSCO Master eSCO Slave ACL Slave ACL Slave SCO 100ms, PCM Setting S3, sniff =

100ms, mono audio codec Setting S3, sniff =

100ms, mono audio codec Sniff = 500ms, 1 attempt, 0 timeout Sniff = 1280ms, 8 attempts, 1 timeout Sniff = 100ms, 1 attempt, PCM Slave SCO Sniff = 100ms, 1 attempt, mono audio codec 2EV3 7.9 mA 3EV3 7.5 mA DH1 DH1 HV3 HV3 127 uA 129 uA 7.8 mA 10 mA Slave eSCO Setting S3, sniff =

2EV3 6.2 mA 100ms, PCM Slave eSCO Setting S3, sniff =

3EV3 5.8 mA Ehong Technology Co., Ltd Bluetooth Audio Module Slave eSCO Slave eSCO 100ms, PCM Setting S3, sniff =

100ms, mono audio codec Setting S3, sniff =

100ms, mono audio codec 2EV3 8.2 mA 3EV3 7.9 mA Note : Current consumption values are taken with:

Table 3: Power consumptions Firmware ID = 7919 RF TX power set to 0dBm No RF retransmissions in case of eSCO Audio gateway transmits silence when SCO/eSCO channel is open LEDs disconnected AFH off 4.4. Input/output Terminal Characteristics VOL output logic level low, lOL = 4.0mA VOH output logic level high, lOH = -4.0mA 4.4.1. Digital Terminals Digital Terminals Input Voltage VIL input logic level low VIH input logic level high Tr/Tf Tr/Tf Strong pull-up Strong pull-down Weak pull-up Weak pull-down CI Input Capacitance Ehong Technology Co., Ltd Min Type Max Unit

-

0.4 0.7 x VDD

-

Output Voltage

-

0.75 X VDD

-

-

-

-

-

-

-

0.4 VDD + 0.4 25 0.4

-

5 Input and Tristate Currents

-150 10

-5

-40 40

-10 150

-1.0

-0.33 0.33 1.0 1.0

-

5.0 5.0 V V ns V V ns A A A A pF Bluetooth Audio Module Table 4: Digital Terminal 4.4.2. USB Min Type VDD_USB for correct USB operation 3.10 3.30 Input Threshold VIL input logic level low VIH input logic level high Input Leakage Current VSS_DIG < VIN < VDD_USB(a) CI input capacitance

-

0.70 x VDD_US B

-1 2.5 Output Voltage Levels to Correctly Terminated USB Cable VOL output logic level low VOH output logic level high 0 2.80

(a) Internal USB pull-up disable Table 5: USB Terminal 4.4.3. Internal CODEC Analogue to Digital Converter Analogue to Digital Converter

-

-

1

-

-

-

Max 3.60 0.30 x VDD_US B

-

5 10 0.2 VDD_USB Unit V V V A pF V V Parameter Conditions Min Type Max Unit Resolution Input Sample Rate, Fsample

-

-

fin = 1kHz B/W =

20HzFsample/

Fsample 8kHz 16kHz

-

8

-

-

-

-

93 92 16 48 Bits kHz

-

-

dB dB Ehong Technology Co., Ltd Bluetooth Audio Module SNR THD+N Digital gain Analogue gain 2 (20kHz max) A-Weighted THD+N < 0.1%

1.6Vpk-pk input 32kHz 44.1kHz 48kHz Fsample fin = 1kHz B/W =

20HzFsample/

2 (20kHz max) 1.6Vpk-pk input Digital gain resolution = 1/32 8kHz 48kHz Pre-amplifier setting = 0dB, 9dB, 21dB or 30dB Analogue setting = -3dB to 12dB in 3dB steps

-24 Stereo separation (crosstalk)

-

-

-

-

-

-

3

-

92 92 92 0.004 0.008

-

-

-

-

-

-

-

21.5 dB dB dB

%

%

dB 42 dB

-89

-

dB Table 6: Analogue to Digital Converter 4.4.4. Internal CODEC Digital to Analogue Converter Digital to Analogue Converter Parameter Conditions Min Type Max Unit Resolution Output Sample Rate, Fsample

-

-

SNR fin = 1kHz B/W =

20Hz20kHz A-Weighted THD+N < 0.01%

0dBFS input THD+N fin = 1kHz B/W =

20Hz20kHz 0dBFS input

-

8

-

-

16 96 Bit s kHz Load Fsample 48kHz 100k 48kHz 32 48kHz 16 Fsample Load 8kHz 100k 8kHz 32 8kHz 16 48kHz 100k 48kHz 32

-

-

-

-

-

-

-

-

96 96 96 0.002 0.002 0.003 0.003 0.003

-

-

-

-

-

-

-

-

dB dB dB

%

%

%

%

%

Ehong Technology Co., Ltd Bluetooth Audio Module Digital Gain Digital Gain Resolution = 1/32 48kHz 16

-

-24 Analogue Gain Analogue Gain Resolution = 3dB

-21 Stereo separation (crosstalk)

-

-88 Table 7: Digital to Analogue Converter 5. Pinout and Terminal Description 5.1. Pin assignment 0.004

-

-

-

21.5 0

-

%

dB dB dB Figure 1Pinout of EH-MB18 Pin Symbol I/O Type Description 1 2 3 GND AIO0 AIO1 Ground Ground Bi-directional Bi-directional Analogue programmable input/output line Analogue programmable input/output line 4 CAP_SENSE0 Analogue input Capacitive touch sensor input 5 CAP_SENSE1 Analogue input Capacitive touch sensor input 6 CAP_SENSE2 Analogue input Capacitive touch sensor input 7 8 9 GND Ground Ground PCM_IN CMOS Input, with weak internal pull-down Synchronous Data Input PCM_CLK Bi-directional with weak Synchronous Data Clock Ehong Technology Co., Ltd Bluetooth Audio Module 10 PCM_SYNC 11 PCM_OUT 12 RESETB 13 14 15 UART_CTS UART_RTS UART_RX 16 UART_TX internal pull-down Bi-directional with weak internal pull-down CMOS output, tri-state, with weak internal pull-

down CMOS input with weak internal pull-up Bi-directional with weak pull down Bi-directional with weak internal pull-up CMOS input with weak internal pull-down Bi-directional CMOS output, tri-state, with weak internal pull-up Synchronous Data Sync Synchronous Data Output Active LOW RESETB, input debounced so must be low for >5ms to cause a RESETB Uart clear to send ,active low uart request to send ,active low UART data input UART data output USB_D+

Bi-directional USB data plus with selectable internal 1.5K pull up resistor USB_D-

Bi-directional USB data minus 17 18 19 PIO0 20 SPI_CSB 21 SPI_MISO Bi-directional with programmable strength internal pull-up/down Input with weak internal pull-up CMOS output, tri-state, with weak internal pull-

down Programmable input/output line Chip select for Synchronous Serial Interface for programming only, active low Serial Peripheral Interface output for programming only 22 23 24 25 26 27 28 SPI_MOSI SPI_CLK CMOS input, with weak internal pull-down Serial Peripheral Interface input for programming only Input with weak internal pull-down Serial Peripheral interface clock for programming only LED2 LED1 LED0 PIO6 PIO7 Open drain output LED Driver Open drain output LED Driver Open drain output LED Driver Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength Programmable input/output line Programmable input/output line or I2C SDA Ehong Technology Co., Ltd Bluetooth Audio Module internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Programmable input/output line or I2C SCL Programmable input/output line Programmable input/output line 29 PIO5 30 PIO14 PIO4 31 32 33 34 VDD_3V3 Power Supply

+2.7V- +3.6V power input GND Ground Ground VDD_CHG Charger input

+4.7V--+5.7V charge input 35 QSPI_FALSH_IO3 36 QSPI_FLASH_CS 37 QSPI_FLASH_CLK 38 QSPI_FLASH_IO0 39 QSPI_FLASH_IO2 40 QSPI_FLASH_IO1 41 QSPI_SRAM_CLK 42 QSPI_SRAM_CS Bi-directional with strong internal pull-down Bi-directional with strong internal pull-up Bi-directional with strong internal pull-down Bi-directional with strong internal pull-down Bi-directional with strong internal pull-down Bi-directional with strong internal pull-down Bi-directional with strong internal pull-down Bi-directional with strong internal pull-up Serial quad I/O flash data bit 3 SPI flash chip select SPI flash clock Serial quad I/O flash data bit 0 Serial quad I/O flash data bit 2 Serial quad I/O flash data bit 1 SPI RAM clock SPI RAM chip select 43 44 45 46 47 48 49 50 51 MIC_RN Analogue Microphone input negative, right MIC_RP Analogue Microphone input positive, right MIC_BIAS_B Analogue out Microphone bias B MIC_LN Analogue Microphone input negative, right MIC_LP Analogue Microphone input positive, left MIC_BIAS_A Analogue out Microphone bias A SPK_RP Analogue Speaker output positive, right SPK_RN Analogue Speaker output negative, right SPK_LN Analogue Speaker output negative, left Ehong Technology Co., Ltd Bluetooth Audio Module SPK_LP Analogue Speaker output positive, left GND Ground Ground Table 8PIN Terminal Description 52 53 6. Physical Interfaces 6.1. Power Supply

- The module DC3.3V power input.

- Power supply pin connection capacitor to chip and pin as far as possible close

- Capacitor decouples power to the chip

- Capacitor prevents noise coupling back to power plane. Figure 2Power Supply PCB Design 6.2. Reset The module may be reset from several sources: RESETB pin, power-on reset, a UART break character or via software configured watchdog timer. The RESETB pin is an active low RESETB and is internally filtered using the internal low frequency clock oscillator. A RESETB will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. At RESETB the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The pull-down state is shown below. Pin Name / Group Pin Status on RESETB USB_DP USB_DN N/a N/a Ehong Technology Co., Ltd Bluetooth Audio Module UART_RX UART_TX UART_RTS UART_CTS SPI_MOSI SPI_CLK SPI_CSB SPI_MISO RESET PIOs PCM_IN PCM_CLK PCM_SYNC PCM_OUT QSPI_SRAM_CS QSPI_FLASH_CS QSPI_SRAM_CLK QSPI_FLASH_CLK Strong PU Weak PU Weak PU Weak PD Weak PD Weak PD Strong PU Weak PD Strong PU Weak PD Weak PD Weak PD Weak PD Weak PD Strong PU Strong PU Strong PD Strong PD Table 9: Pin Status on Reset 6.3. PIO EH-MB18 has a total of 13digital programmable I/O terminals. They are powered from VDD . Their functions depend on firmware running on the device. PIO lines can be configured through software to have either weak or strong pull-ups or pull-downs. Note:

All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. 6.4. AIO EH-MB18 has 2 analogue I/O terminals. Their functions depend on software. Typically ADC functions can be configured to battery voltage measurement. They can also be used as a digital PIO. 6.5. RF interface EH-MB18 internet chip antenna and U.fl port choose one of the ways. U.fl port external antenna, impedance is 50 ohm. 6.6. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. Ehong Technology Co., Ltd Bluetooth Audio Module The UART CTS and RTS signals can be used to implement RS232 hardware flow control where both are active low indicators. Parameter Baud Rate Minimum Maximum Flow Control Parity Number of Stop Bits Bits per Byte Possible Values 1200 baud (2%Error) 9600 baud (1%Error) 3M baud (1%Error) RTS/CTS or None None, Odd or Even 1 or 2 8 Table 10: Possible UART Settings Figure 3Connection To Host device 6.7. I2C Master PIO6, PIO7 and PIO8 can be used to form a master I2C interface. The interface is formed using software to drive these lines. It is suited only to relatively slow functions such as driving a LCD, keyboard scanner or EEPROM. In the case, PIO lines need to be pulled up through 2.2K resistors. Ehong Technology Co., Ltd Bluetooth Audio Module Figure 4 : Example EEPROM Connection with I2C Interface Apple iOS CP reference design 6.8. The figures below give an indicative overview of what the hardware concept looks like. A specific MFI co-processor layout is available for licensed MFI developers from the MFI program. Figure 5 : Apple Co-processor 2.0C Ehong Technology Co., Ltd Bluetooth Audio Module Figure 6 : Apple Co-processor 2.0B 6.9. Digital Audio Interfaces The audio interface circuit consists of:

Stereo/Dual-mono audio codec Dual audio inputs and outputs 6 digital MEMS microphone inputs A configurable PCM, IS or SPDIF interface Figure 2 outlines the functional blocks of the interface. The codec supports stereo playback and recording of audio signals at multiple sample rates with a resolution of 16-bit. The ADC and the DAC of the codec each contain 2 independent channels. Any ADC or DAC channel can be run at its own independent sample rate. Ehong Technology Co., Ltd Bluetooth Audio Module Figure 7 : Audio Interface The interface for the digital audio bus shares the same pins as the PCM codec interface described in Table 11, which means each of the audio buses are mutually exclusive in their usage. Table 11 lists these alternative functions. PCM Interface PCM_OUT PCM_IN PCM_SYNC PCM_CLK SPDIF Interface SPDIF_OUT SPDIF_IN

-

-

IS Interface SD_OUT SD_IN WS SCK Table 11: Alternative Functions of the Digital Audio Bus Interface on the PCM Interface The audio input circuitry consists of a dual audio input that can be configured to be either single-ended or fully differential and programmed for either microphone or line input. It has an analogue and digital programmable gain stage for optimization of different microphones. The audio output circuitry consists of a dual differential class A-B output stage. 6.9.1. PCM The audio pulse code modulation (PCM) interface supports continuous transmission and reception of PCM encoded audio data over Bluetooth. Hardware on EH-MB18 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any one time. EH-MB18 can operate as the PCM interface master generating PCM_SYNC and PCM_CLK or as a PCM interface slave accepting externally generated PCM_SYNC and PCM_CLK. EH-MB18 is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. Ehong Technology Co., Ltd Bluetooth Audio Module It supports 13-bit or 16-bit linear, 8-bit u-law or A-law companded sample formats and can receive and transmit on any selection of three of the first four slots following PCM_SYNC. EH-MB18 interfaces directly to PCM audio devices including the following:

Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices OKI MSM7705 four channel A-law and -law CODEC Motorola MC145481 8-bit A-law and -law CODEC Motorola MC145483 13-bit linear CODEC STW 5093 and 5094 14-bit linear CODECs(8) EH-MB18 is also compatible with the Motorola SSI interface 6.9.2. Digital Audio Interface (I2S) The digital audio interface supports the industry standard formats for I2S, left-justified or right-

justified. The interface shares the same pins of the PCM interface as Table 11. Special firmware is needed if I2S is used. Contact EHong for the special firmware when use I2S as the interface between the module and the host or the codec. The I2S support following formats, Ehong Technology Co., Ltd Bluetooth Audio Module Figure 8 : Digital Audio Interface Modes Symbol Parameter

-

-

tch tcl topd tssu tsh tisu tih SCK Frequency WS Frequency SCK high time SCK low time SCK to SD_OUT delay WS to SCK set up time WS to SCK hold time SD_IN to SCK set-up time SD_IN to SCK hold time Ehong Technology Co., Ltd Min

-

Typical Max

-

6.2

-

80 80

-

20 20 20 20

-

-

-

-

-

-

-

-

96

-

-

20

-

-

-

-

Unit MHz kHz ns ns ns ns ns ns ns Bluetooth Audio Module Table 12 : Digital Audio Interface Slave Timing Figure 9 : Digital Audio Interface Slave Timing Symbol

-

-

topd tspd tisu tih Parameter SCK Frequency WS Frequency SCK to SD_OUT delay SCK to WS delay SD_IN to SCK set-up time SD_IN to SCK hold time Min

-

Typical Max

-

6.2

-

-

-

20 10

-

-

-

-

-

96 20 20

-

-

Table 13 : Digital Audio Interface Master Timing Unit MHz kHz ns ns ns ns Figure 10 : Digital Audio Interface Master Timing Ehong Technology Co., Ltd Bluetooth Audio Module 6.9.3. IEC 60958 Interface (SPDIF) The IEC 60958 interface is a digital audio interface that uses bi-phase coding to minimise the DC content of the transmitted signal and allows the receiver to decode the clock information from the transmitted signal. The IEC 60958 specification is based on the 2 industry standards:

AES/EBU Sony and Philips interface specification SPDIF The interface is compatible with IEC 60958-1, IEC 60958-3 and IEC 60958-4. The SPDIF interface signals are SPDIF_IN and SPDIF_OUT and are shared on the PCM interface pins. The input and output stages of the SPDIF pins can interface to:

A 75 coaxial cable with an RCA connector, see Figure 11. An optical link that uses Toslink optical components, see Figure 12. Figure 11: Example Circuit for SPDIF Interface (Co-Axial) Figure 12: Example Circuit for SPDIF Interface (Optical) Ehong Technology Co., Ltd Bluetooth Audio Module 6.10. Microphone input The module contains 2 independent low-noise microphone bias generators. The microphone bias generators are recommended for biasing electret condensor microphones. Figure 9.6 shows a biasing circuit for microphones with a sensitivity between about 40 to 60dB (0dB = 1V/Pa):

Where:

The microphone bias generators derives their power from VBAT or VOUT_3V3 \

and requires no capacitor on its output. The microphone bias generators maintains regulation within the limits 70A to 2.8mA, supporting a 2mA source typically required by 2 electret condensor microphones. If the microphone sits below these limits, then the microphone output must be pre-loaded with a large value resistor to ground. Biasing resistors R1 and R2 equal 2.2k. The input impedance at MIC_LN, MIC_LP, MIC_RN and MIC_RP is typically 6k. C1, C2, C3 and C4 are 100/150nF if bass roll-off is required to limit wind noise on the microphone. R1 and R2 set the microphone load impedance and are normally around 2.2k. Figure 13: Microphone Biasing (Single Channel Shown) Ehong Technology Co., Ltd Bluetooth Audio Module The microphone bias characteristics include:

Power supply:

CSR8670 BGA microphone supply is VBAT (via SMP_VBAT) or VOUT_3V3 (via SMPS_3V3) Minimum input voltage = Output voltage + drop-out voltage Maximum input voltage is 4.25V Drop-out voltage:

300mV maximum Output voltage:

1.8V or 2.6V Tolerance 90% to 110%

Output current:

70A to 2.8mA No load capacitor required 6.11. Analog Output stage The output stage digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to a 2Mbits/s 5-bit multi-bit bit stream, which is fed into the analogue output circuitry. The output stage circuit is comprised a DAC with gain setting and class AB amplifier. The output is available as a differential signal between SPKR_A_N and SPKR_L_P for the right channel, as Figure 6 shows, and between SPKL_B_N and SPKL_B_P for the left channel. Figure 14: Speaker output 6.12. USB This is a full speed (12M bits/s) USB interface for communicating with other compatible digital devices. The module acts as a USB peripheral, responding to request from a master host controller, such as a PC. The USB interface is capable of driving a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented can behave as specified in the USB section of the Bluetooth specification v2.1+EDR or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. Ehong Technology Co., Ltd Bluetooth Audio Module The module has an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when module is ready to enumerate. It signals to the USB master that it is a full speed (12Mbit/s) USB device. Figure 15: USB Connections Identifier Rs Value 27 Nominal Function Impedance matching to USB cable Table 14: USB Interface Component Values Note:

USB_ON is only used when the firmware need an input to detect if USB is connected and the USB function shall be enabled. In such case it is shared with the module PIO terminals. If detection is not needed (firmware already runs with USB, such as USB DFU or USB CDC), USB_ON is not needed. Ehong Technology Co., Ltd Bluetooth Audio Module 7. EH-MB18 Reference Design Figure 16: Reference Design Ehong Technology Co., Ltd Bluetooth Audio Module 8. Mechanical and PCB Footprint Characteristics Figure 17: Recommended PCB Mounting Pattern (Unit: mm, Deviation:0.02mm)TOP View Ehong Technology Co., Ltd Bluetooth Audio Module 9. RF Layout Guidelines EH-MB18 RF design to ensure enough clearance area of antenna, area length is 1.6 times of antenna length, area width is 4 times of antenna width, the bigger the better if the space allows. Module antenna clearance area size, as follows. Figure 18: Clearance Area of Antenna Ehong Technology Co., Ltd Bluetooth Audio Module 10. Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. 250 217 210 25 0 A B C D 1 2 3 4 5 E 6 min Figure 19: Recommended Reflow Profile Pre-heat zone (A) This zone raises the temperature at a controlled rate, typically 0.5 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) In order to resolve the upright component issue, it is recommended to keep the temperature in 210 217 for about 20 to 30 second. Reflow Zone (D) The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C. Ehong Technology Co., Ltd Bluetooth Audio Module 11. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Phone: +86 21 64769993 Fax: +86 21 64765833 Street address: Rom1505, Blk 1st ,No.833 South Hong mei Rd ,Ming hang district shanghai Ehong Technology Co., Ltd NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

(1)thisdevicemaynotcauseharmfulinterference,and

(2) this device must accept any interference received, including interference that may cause undesiredoperation. Changes or modifications to this unit not expressly approved by the party responsible for compliancecouldvoidtheuser'sauthoritytooperatetheequipment. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. the Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into any (portable, mobile, fixed) host device. The final host device, into which this RF Module is integrated" has to be labelled with an auxilliary lable stating the FCC ID of the RF Module, such as

"Contains FCC ID: 2ACCRMB18".