FCC ID: 2ACCRMC10 Bluetooth Module

EH-MC10 Bluetooth technology low energy module 128-bit encryption security Bluetooth radio

- Fully embedded Bluetooth v4.0 single mode

- TX power +6 dbm,-92.5dbm RX sensitivity

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- Range up to 100m

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- Multipoint capability(2devices at master) Support profiles

- BLE (Master and slave)

- The generic attribute profile (GATT)

- Health care, Sports and fitness, Proximity Integrated chip antenna or U.FL port sensing profiles

- Alerts and timer profiles User interface

- Send AT command over UART

- Firmware upgrade over the air (OTA)

- Transmit data: 300kbps transmission speed

(UART) 10 general purpose I/Os 3 analogue I/O (10bit ADC)

- I2C interface(Master )

- SPI

- PWM(4 channel) General I/O

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FCC and Bluetooth qualified Single voltage supply: 3.3V typical Small form factor: 17.70 x 11.95x 2.2mm Operating temperature range: -30 C to 80 C Version 2.0 July 21 2014 Shanghai Ehong Technologies Inc Bluetooth Low Energy Module 1. Contents 1. Description .................................................................................................................................................. 3 2. Applications ................................................................................................................................................ 4 3. EH-MC10 Product numbering .................................................................................................................. 4 4. Electrical Characteristics ......................................................................................................................... 4 4.1. Recommended Operation Conditions ................................................................................................. 4 4.2. Absolute Maximum Rating ................................................................................................................... 5 Input/Output Terminal Characteristics ................................................................................................ 5 4.3. 4.4. Power Consumption ............................................................................................................................. 6 5. Pinout and Terminal Description ............................................................................................................. 7 5.1. Pin Configuration .................................................................................................................................. 7 6. Physical Interfaces .................................................................................................................................... 9 6.1. Power Supply ........................................................................................................................................ 9 6.2. PIO......................................................................................................................................................... 9 6.3. AIO......................................................................................................................................................... 9 6.4. PWM ...................................................................................................................................................... 9 6.5. UART ................................................................................................................................................... 10 I2C Master........................................................................................................................................... 10 6.6. 6.7. SPI Master .......................................................................................................................................... 10 6.8. SPI Debug ........................................................................................................................................... 11 7. Reference Design ..................................................................................................................................... 11 8. Layout and Soldering Considerations ................................................................................................. 11 8.1. Soldering Recommendations ............................................................................................................ 11 8.2. Layout Guidelines ............................................................................................................................... 12 9. Mechanical and PCB Footprint Characteristics ................................................................................. 13 10. Reflow Profile ........................................................................................................................................ 14 11. Contact Information ............................................................................................................................. 15 Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 2. Table of Tables TABLE 1: RECOMMENDED OPERATION CONDITIONS ............................................................................................... 4 TABLE 2ABSOLUTE MAXIMUM RATING ................................................................................................................ 5 TABLE 3: DIGITAL I/O CHARACTERISTICS ............................................................................................................... 5 TABLE 4: AIO CHARACTERISTICS ........................................................................................................................... 5 TABLE 5 ESD PROTECTION ................................................................................................................................... 6 TABLE 6: CURRENT CONSUMPTION ........................................................................................................................ 6 TABLE 7PIN TERMINAL DESCRIPTION ................................................................................................................. 8 TABLE 8: POSSIBLE UART SETTINGS .................................................................................................................. 10 3. Table of Figures FIGURE 1 PINOUT OF EH-MC10 ........................................................................................................................ 7

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FIGURE 2 POWER SUPPLY PCB DESIGN .................................................................................................... 9 FIGURE 3 CONNECTION TO HOST DEVICE ........................................................................................................ 10 FIGURE 4 REFERENCE DESIGN......................................................................................................................... 11 FIGURE 5: CLEARANCE AREA OF ANTENNA ........................................................................................................... 12 FIGURE 6 PHYSICAL DIMENSIONS AND RECOMMENDED FOOTPRINT (UNIT: MM, DEVIATION:0.02MM) ............... 13 FIGURE 7: RECOMMENDED REFLOW PROFILE ..................................................................................................... 14 1. Description EH-MC10 Bluetooth low energy single mode module is a single mode device targeted for low power sensors and accessories. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module The module offers all Bluetooth low energy features: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect sen so rs, simp le u se r in t e rf a ce s o r even displays directly to the module. The module can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes only 600nA and will wake up in few hundred microseconds. After buying Bluetooth module, we provide free technical support APP of iOS system or APP Android system. 2. Applications Sports and fitness Healthcare Home entertainment Office and mobile accessories Automotive Commercial Watches Human interface devices 3. EH-MC10 Product numbering EH-MC10X A. EH ------------- Company Name(EHong) B. MC10 ------------ Module Name C. X ------------ A = Antenna B =U.FL 4. Electrical Characteristics 4.1. Recommended Operation Conditions Table 1: Recommended Operation Conditions Operating Condition Operating Temperature Range Shanghai Ehong Technologies Co., Ltd Min

-30 Typical

--

Max

+80 Unit C Bluetooth Low Energy Module Battery (VDD_BAT) operation I/O Supply Voltage (VDD_PIO) AIO input Frequency range 1.8 1.2 0 2402

--

--

-

+3.6

+3.6

+1.3 2480 Table 2Absolute Maximum Rating V V V MHz 4.2. Absolute Maximum Rating Rating Storage Temperature Battery (VBAT) operation*

I/O supply voltage Other Terminal Voltages except RF Min

-40 1.8

-0.4 Vss-0.4 Max

+85 3.6

+3.6 VBAT+0

.4 Unit C V V V

* Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 4.3. Input/Output Terminal Characteristics Table 3: Digital I/O Characteristics Input Voltage Levels VIL input logic level low VIH input logic level high Tr/Tf Output Voltage Levels VOL output logic level low, lOL = 4.0mA VOH output logic level high, lOH = -4.0mA Tr/Tf Input and Tri-state Current With strong pull-up With strong pull-down With weak pull-up With weak pull-down CI Input Capacitance Min

-0.4 0.7 x VDD

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Min

-

0.75 x VDD

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Min

-150 10

-5.0 0.33 1.0 Typical

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-

-

Typical

-

-

-

Typical

-40 40

-1.0

+1.0

-

Max 0.4 VDD + 0.4 25 Max 0.4

--

5 Max

-10 150

-0.33 5.0 5.0 Unit V V ns Unit V V ns Unit A A A A pF Table 4: AIO Characteristics Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module Input Voltage Levels AIO Min 0 Typical

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Max 1.3 Unit V Table 5 ESD Protection Condition Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 Machine Model Contact Discharge per JEDEC EIA/JESD22-

A115 Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 4.4. Power Consumption The current consumption are measured at the VBAT Class 2 200V III Max Rating 2000V (all pins) 200V (all pins) 500V (all pins) Mode Dormant Hibernate Deep sleep Idea RF RX /TX active

(0dBm) Table 6: Current Consumption Description All functions are shutdown. To wake up toggle the WAKE pin All functions are shutdown except for the sleep clock. The module can wake up on a timer on the sleep clock. VDD=3.3V 1ms wake up time VDD=3.3V <1us wake up time Total typical current at 3.3V (average)

<600nA

<1.5uA

<5uA 1mA VDD=3.3V VDD_PIO=3.3V

~16mA @3V peak Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 5. Pinout and Terminal Description 5.1. Pin Configuration Symbol GND AIO2 AIO1 AIO0 UART_TX UART_RX PIO3 PIO4 PIO5/SPI_CLK Pin 1 2 3 4 5 6 7 8 9 Figure 1 Pinout of EH-MC10 PAD Type Ground Bidirectional analogue Bidirectional analogue Bidirectional analogue CMOS output, tristate, with weak internal pull-up CMOS input with weak internal pull-

down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down GND 10 Ground Shanghai Ehong Technologies Co., Ltd Description Ground 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line UART data output UART data input Programmable input/output line PWM or LED Controls Programmable input/output line PWM or LED Controls Programmable input/output line Or debug SPI_CLK select by SPI_PIO_SEL Ground Bluetooth Low Energy Module I2C_SDA 11 Bi-directional tristate with weak internal pull-up I2C_SCL 12 Input with weak internal pull-up I2C data input/output or SPI serial flash data output(SF_OUT) I2C clock or SPI serial flash clock output

(SF_CLK) Programmable input/output line Programmable input/output line Or debug chip select, selected by SPI_PIO_SEL Programmable input/output line Or debug SPI_MOSI, selected by SPI_PIO_SEL PIO power supply Programmable input/output line Or debug SPI_MISO, selected by SPI_PIO_SEL Programmable input/output line PWM or LED Controls Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Powered Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Ground Ground Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Programmable input/output line PWM or LED Controls Programmable input/output line Input with strong internal pull-down Selects SPI debug on (8:5) NP Power supply Ground NP Input has no internal pull-up or pull-

down use external pull-down Ground Table 7PIN Terminal Description NP Button cell battery or DC 1.8V to 3.6V Ground NP Set high to wake the module from hibernate. Use an external pull-down for this pin. Ground PIO2 PIO6/SPI_CSB PIO7/SPI_MOSI VCC_PIO PIO8/SPI_MISO PIO9 GND PIO10 PIO11 SPI_PIO_S NP VBAT GND NP WAKE_UP GND 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6. Physical Interfaces 6.1. Power Supply

- The module power supply 3v coin cell batteries or DC 3.3v

- Power supply pin connection capacitor to chip and pin as far as possible close

- Capacitor decouples power to the chip

- Capacitor prevents noise coupling back to power plane.

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Figure 2 Power Supply PCB Design 6.2. PIO 10 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered from VDD_PIO. PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down. Note:

At reset all PIO lines are inputs with weak pull-downs. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. 6.3. AIO 3 AIOs are provided. They can be connected to internal 10 bits ADC. Their functions depend on software. They can be used to read or output a voltage between 0V to 1.3V. Each of them can be used as a digital output with special firmware. 6.4. PWM 4 PIOs (PIO3, PIO4, PIO9, and PIO10) can be driven by internal PWM module. The PWM module also works while the module is sleep. So it can be used as a LED flasher. These functions are controlled by special firmware. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6.5. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. Table 8: Possible UART Settings Parameter Baud Rate Minimum Maximum Flow Control Parity Number of Stop Bits Bits per Byte Possible Values 1200 baud (2%Error) 9600 baud (1%Error) 2M baud (1%Error) RTS/CTS or None None, Odd or Even 1 or 2 8 Figure 3 Connection To Host device I2C Master 6.6. The module can act as an I2C master when configured by software. Any two PIOs can be configured as I2C_SCL and I2C_SDA. 6.7. SPI Master The module can act as an SPI master (mode 0) when configured by software. Any four PIOs can be configured as SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT. The clock rate of the software SPI is around 470kHz. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6.8. SPI Debug The SPI Debug interface is chosen when SPI_PIO_S is high. The interface is used to program and debug the module. So always place test points or header on PCB for this interface and SPI_PIO_SEL. 7. Reference Design Figure 4 Reference Design 8. Layout and Soldering Considerations 8.1. Soldering Recommendations EH-MC10 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Comply will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. Refer to technical documentations of particular solder paste for profile configurations Avoid using more than one flow. Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150um stencil thickness is recommended. Aperture size of the stencil should be 1:1 with the pad size. A low residue, no clean solder paste should be used due to low mounted height of the component. 8.2. Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 3. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 6 mm from the antenna. Any dielectric closer than 6 mm from the antenna will detune the antenna to lower frequencies. Figure 5: Clearance area of antenna Shanghai Ehong Technologies Co., Ltd 9. Mechanical and PCB Footprint Characteristics Bluetooth Low Energy Module Figure 6 Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm) Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 10. Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. 250 217 210 25 0 A 1 B 2 C D 3 4 5 E 6 min Figure 7: Recommended Reflow Profile Pre-heat zone (A) This zone raises the temperature at a controlled rate, typically 0.5 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) In order to resolve the upright component issue, it is recommended to keep the temperature in 210 217 for about 20 to 30 second. Reflow Zone (D) The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 11. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Phone: +86 21 61139798 Fax: +86 21 61263536 Street address: Rom501,No 3 building ,#439 jinglianRd ,Minghang district shanghai Shanghai Ehong Technologies Co., Ltd FCC Statement:

This equipment has been tested and found to comply with the limits for Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

television Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment to an outlet on a circuit different from that to which the connected. receiver is This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modifications to this product will void the users authority to operate this equipment. RF Radiation Exposure Statement:

1.This Transmitter must not be co located or operating in conjunction with any other antenna or transmitter. 2.This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. FCC Information to OEM integrator The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 1.To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi transmitter product procedures. 2. Only those antennas with same type and lesser gain filed under this FCC ID number can be used with this device. 3. The regulatory label on the final system must include the statement: Contains FCC ID: xxxx or using electronic labeling method as documented in KDB 784748. 4. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two ways authentication between module and the host system

FCC ID:2ACCRMC10 L A B E L P H O T O G R A P H S 25MM L a b e l L o c a t i o n 15MM Copyright of this report is owned by Centre of Testing Service and may not be reproduced other than in full except with the written approval of the issuing Company. CENTRE OF TESTING SERVICE CO., LTD. A101No.65Zhuji Highway,Tianhe DistrictGuangzhou, China Tel+86-20-85543113 (32 lines) Fax+86-20-38780406 Complaint line+86-20-85533471 E-mailcts@cts-lab.com.cn See Reverse For Terms And Conditions of Service Report No.: CGZ3150306-00214-EF Page 1 of 1

ShangHai Ehong Technology Co.,Ltd. Suite501, No.3 building, No.439 Jinglian road, Minhang district, Shanghai, China Letter of Authorization Bluetooth Module ShangHai Ehong Technology Co.,Ltd. Suite501, No.3 building, No.439 Jinglian road, Minhang Company:

Address:

district, Shanghai, China Product Name:

Model Number:

We authorize MiCOM Labs, 440 Boulder Court, Suite 200, Pleasanton, CA 94566, USA, to act on our behalf on all matters concerning the above named equipment. Any individual within MiCOM Labs is authorized to act on our behalf and take action on the application. This shall include the following:

EH-MC10 Testing Approval applications (includes complete product documentation package, including Confidential information) and procedures Payment of approval fees We declare that MiCOM Labs, 440 Boulder Court, Suite 200, Pleasanton, CA 94566, USA, is allowed to forward all information related to the approval project to the applied notified body and to the notification entities and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Name: Tony Tang Title: Manager Signature of applicant:

Date: Mar.03,2015

3/12/2015 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Request for Confidentiality Company name: < ShangHai Ehong Technology Co.,Ltd. >

FCC ID: 2ACCRMC10 FCC Part 15 Certification Gentlemen, Pursuant to 47 CFR 0.457(d)(1)(ii) and 0.459 < ShangHai Ehong Technology Co.,Ltd. > hereby requests permanent confidentiality of the following documents for the subject application:

Exhibit Type Block Diagram Operational Description Schematics Parts / BOM Description Block Diagram Operational Description Schematics Parts / BOM File Name Block Diagram Operational Description Schematics Parts / BOM Note: Any exhibit NOT granted Confidential status is viewable on the FCC website as soon as the Grant is issued. Reason why the material should be withheld from public inspection:

These documents contain detailed system, equipment description and related information about the product which < ShangHai Ehong Technology Co.,Ltd. > considers proprietary, confidential, and a custom design not otherwise available to the general public. State why the information is a trade secret;

Since the design is a basis from which future products will evolve, < ShangHai Ehong Technology Co.,Ltd. > considers that this information would be of significant benefit to its competitors and that disclosure would give competitors an unfair advantage in the marketplace. Trade secret information is information which is not generally known or reasonably ascertainable, by which a business can obtain an economic advantage over competitors. The information is not normally released to any party or person outside the company. Sincerely, Signature:

Company: ShangHai Ehong Technology Co.,Ltd. Name: Tony Tang Title: Manager Date: Mar.03,2015

Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Company name: ShangHai Ehong Technology Co.,Ltd. FCC ID: 2ACCRMC10 Gentlemen, In accordance with 47CFR 15.212 Modular Transmitters and KDB 996369 D01 Module Certification Guide v01r04 ShangHai Ehong Technology Co.,Ltd. has been examined against the following requirements. Essential Elements of 15.212(a)(1) 1, The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly 2, The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal Yes No Yes, It is fulfilled.The modular transmitter has own shielding. Shielding is show on external photos Yes, It is fulfilled.The module have buffered modulation/data inputs It is transmitting using GFSK modulation. Yes, It is fulfilled.The module transmitter have its own power supply regulation (DC 3.3V by itself) Yes, It is fulfilled. The modular comply with antenna requirements

.( Ceramic antenna) Yes, It is fulfilled.The modular was tested in a atand-alone configuration. Please see the setup photos and test jig photo. Yes, It is fulfilled. The label is shown on transmitter modular, Please see the label view. Yes, It is fulfilled.The operation description and user guides provide this detail. Yes, It is fulfilled.The modular is exempted due to its low field strength. 3, The module must contain power supply regulation on the module 4, The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b) 5, The module must demonstrate compliance in a stand-alone configuration 6, The module must be labelled with its permanently affixed FCC ID label, or use an electronic display

(See KDB Publication 784748 about labelling requirements) 7, The module must comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee 8, The module must comply with RF exposure requirements Sincerely, Name: Tony Tang Title: Manager