EH-MC16 Low Energy Module User manual 08 Sep 2018 Version1.1 Professional Bluetooth Solution Provider QUICK VIEW Bluetooth Radio
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Fully embedded Bluetooth v4.2 single mode ARM Cortex-M4, 160KB SRAM
+7.5dBm TX power
-97dbm RX sensitivity LE advertising Extensions AES128/192/256 encrypt/decrypt engine Supports OTA(Over the Air) Support Profiles
- BLE (Master and slave)
- SIGmesh
- The generic attribute profile (GATT)
- Health care, Sports and fitness, Proximity sensing profiles
- Alerts and timer profiles
- HID keyboards, remote User Interface
- UART*2
- SPI master interface
- RTC
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IC *2
- PWM *8
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I2S/PCM interface for external audio codec
- Supports I8080 interface for LCD
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4M internal SPI flash General I/O
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15 general purpose I/Os
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1 analogue I/O (10bit ADC) Voltage supply: 3.0V typical Certification: BQB, SRRC Operating temperature range: -30 C to 85 C Ehong Technology Co.,Ltd 2014-2019. Page 2 of 14 VERSION HISTORY Version V1.0 V1.1 Original publication of this document. Update contact list Comment Contact information Sales sales@ehlink.com.cn Technical support support@ehlink.com.cn Website Phone Fax Address http://www.ehonglink.com
+86 21 64769993
+86 21 64765833 Rm1505,1st,No.833 South Hongmei Rd, Shanghai, China Ehong Technology Co.,Ltd 2014-2019. Page 3 of 14 Contents Contact information ................................................................................................................................................. 3 1. Description ......................................................................................................................................................... 6 2. Applications ....................................................................................................................................................... 6 3. EH-MC16 Product numbering ........................................................................................................................ 6 4. Electrical Characteristics ................................................................................................................................ 6 4.1 Recommended Operation Conditions .................................................................................................................. 6 4.2 Absolute Maximum Rating .................................................................................................................................. 7 4.3 Input/Output Terminal Characteristics ................................................................................................................ 7 5. Pinout and Terminal Description .................................................................................................................. 8 5.1 Pin Configuration ................................................................................................................................................ 8 6. Physical Interfaces ........................................................................................................................................... 9 6.1Power Supply ..................................................................................................................................................... 9 6.2 PWMs ............................................................................................................................................................... 10 6.3 UART ................................................................................................................................................................ 10 6.4 I2C Master/ Slave ........................................................................................................................................... 10 6.5 SPI ............................................................................................................................................................... 10 6.6 Audio ........................................................................................................................................................... 11 8. Layout and Soldering Considerations ...................................................................................................... 12 8.1 Soldering Recommendations ............................................................................................................................. 12 8.2 Layout Guidelines .............................................................................................................................................. 12 9. Mechanical and PCB Footprint Characteristics ...................................................................................... 13 10. Packaging ......................................................................................................................................................... 13 11. Certification ...................................................................................................................................................... 14 11.1. 11.2. Bluetooth ................................................................................................................................................. 14 SRRC ....................................................................................................................................................... 14 Ehong Technology Co.,Ltd 2014-2019. Page 4 of 14 1. Tables TABLE 1: RECOMMENDED OPERATION CONDITIONS ................................................................................................... 6 TABLE 2: ABSOLUTE MAXIMUM RATING........................................................................................................................ 7 TABLE 3: DIGITAL I/O CHARACTERISTICS ..................................................................................................................... 7 TABLE 4: AIO CHARACTERISTICS ................................................................................................................................. 7 TABLE 5: ESD PROTECTION ......................................................................................................................................... 7 TABLE 6: PIN TERMINAL DESCRIPTION ........................................................................................................................ 9 2. Figures FIGURE 1: PINOUT OF EH-MC16 ................................................................................................................................. 8 FIGURE 2: POWER SUPPLY PCB DESIGN .................................................................................................................... 9 FIGURE 3: CONNECTION TO HOST DEVICE ................................................................................................................ 10 FIGURE 4: REFERENCE DESIGN .................................................................................................................................. 11 FIGURE 5: REFERENCE DESIGN IMPORTANT ................................................................................................................. 11 FIGURE 6:CLEARANCE AREA OF ANTENNA .................................................................................................................. 12 FIGURE 7: PHYSICAL DIMENSIONS AND RECOMMENDED FOOTPRINT (UNIT: MM, DEVIATION:0.02MM) ................... 13 FIGURE 8: EH-MC16 PACKAGING (PALLET ........................................................................................................... 13 Ehong Technology Co.,Ltd 2014-2019. Page 5 of 14 1. Description EH-MC16 Bluetooth low energy single mode module is a single mode device targeted for low power sensors and accessories. The module offers all Bluetooth low energy features v4.2: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module. The module can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes only 1.6uA(no RAM retention and external interrupts enabled) and will wake up in few hundred microseconds. After buying Bluetooth module, we provide free technical support APP of iOS system or APP Android system. 2. Applications HID: keyboards, mice, touchpads, advanced remote controls with voice activation Sports and fitness sensors: heart rate, runner/cycle speed and cadence Health sensors: blood pressure, thermometer and glucose meters Mobile accessories: watches, proximity tags, alert tags and camera controls Smart home: heating/lighting control 3. EH-MC16 Product numbering EH-MC16 A. EH
----------- Company Name(Ehong) B. MC16 ----------- Module Name 4. Electrical Characteristics 4.1 Recommended Operation Conditions Operating Condition Operating Temperature Range Battery (VDD_BAT) operation I/O Supply Voltage (VDD_PIO) AIO input Frequency range Min
-30 2.1 2.1 0 2402 Typical
+20
+3.0
+3.0
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Max
+85
+3.6
+3.6
+1.26 Unit C V V V 2480 MHz Table 1: Recommended Operation Conditions Ehong Technology Co.,Ltd 2014-2019. Page 6 of 14
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E H M C 1 6 D a t a S h e e t 4.2 Absolute Maximum Rating Rating Storage Temperature Battery (VBAT) operation*
I/O supply voltage Min
-40 0 0 Max
+85
+3.6
+3.6 Unit C V V Table 2Absolute Maximum Rating
* Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 4.3 Input/Output Terminal Characteristics Input Voltage Levels VIL input logic level low Min
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VIH input logic level high 70% x VDD Tr/Tf Output Voltage Levels VOL output logic level low, lOL = 8.0mA(Max Drive Strength)
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Min
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VOH output logic level high, IOL = - 8.0 mA 80% x VDD
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(Max Drive Strength) Tr/Tf (For 30pF load) Input and Tri-state Current With strong pull-up With strong pull-down With weak pull-up With weak pull-down CI Input Capacitance
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Min 3.5 3.5 8 10
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Typical Max Unit
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Typical
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Typical 4.7 4.7 40 40 5 25% xVDD
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25 Max 20%X VDD_PADS
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2 Max 6.0 6.0 50 50
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V V ns Unit V V ns Unit K K A A pF
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E H M C 1 6 D a t a S h e e t Table 3: Digital I/O Characteristics Input Voltage Levels AIO Min 0 Typical Max Unit
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VDD_AUX V Table 4: AIO Characteristics Condition Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 Class Max Rating 1C C1 2000V (all pins) 500V (all pins) Table 5: ESD Protection Ehong Technology Co.,Ltd 2014-2019. Page 7 of 14 5. Pinout and Terminal Description 5.1 Pin Configuration
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E H M C 1 6 D a t a S h e e t Figure 1 Pinout of EH-MC16 I/O Description Remark Pin GND UART_TX UART_RX UART TX UART RX SWDIO AIO/DIO Programmable IO SWDCLK AIO/DIO Programmable IO The test point for MP needs to be reserved Use of calibration The test point for MP needs to be reserved Use of calibration General purpose IO; 8mA driving capability.With wakeup function.With internal strong/weak pull-up and pull-down.SWDIO (default) General purpose IO; 8mA driving capability.With wakeup function.With internal strong/weak pull-up and pull-down.SWDIO (default) ADC2 AIO/DIO Programmable IO GPIO LOG UART RX Power on trap: Pull-up for normal operation Pull-
down to bypass executing program code in flash
(PAD internal pull-up by default). LED1 AIO/DIO Programmable IO GPIO SPI_CLK DIO Programmable IO GPIO SPI_MISO DIO Programmable IO GPIO SPI_MOSI DIO Programmable IO GPIO SPI_CSN DIO Programmable IO GPIO GND RESET Global reset, active low The test point for MP needs to be reserved Use of calibration Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Ehong Technology Co.,Ltd 2014-2019. Page 8 of 14 15 16 17 18 19 21 22 23 24 TESTPOI NT TESTPOI NT VCC GND for LDO and VCC Buck 1. Supply, 1.8 V ~ 3.6 V 2. A set of ADC can be used for battery voltage detection 3. Test point for MP calibration shall be reserved PWM1 AIO Programmable IO PWM2 AIO Programmable IO PWM3 OD_GPIO Programmable IO 20 PWM4 OD_GPIO Programmable IO PWM5 OD_GPIO Programmable IO Support PWM function LED
(fixed Timer) Connect cold light by default Support PWM function LED
(fixed Timer) Connect cold light by default 1. The I2C SDA 2. LED supported PWM such as breathing lamp
(adjustable Timer) 3. RED by default 1. The I2C SDA 2. LED supported PWM such as breathing lamp
(adjustable Timer) 3. GREEN by default 1.LED supported PWM such as breathing lamp
(adjustable Timer) 2. Default to receive BLUE ADC1 AIO/DIO Programmable IO GPIO GPIO1 GPIO2 GPIO3 GPIO2 DIO DIO TPx TPx Programmable IO GPIO Programmable IO GPIO Programmable IO BLE Test mode Programmable IO 1. The MPTOOL crystal trim 2. Test point for MP calibration shall be reserved Table 6PIN Terminal Description
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E H M C 1 6 D a t a S h e e t 6. Physical Interfaces 6.1Power Supply The module power supply 3v coin cell batteries or DC 3.3v Power supply pin connection capacitor to chip and pin as far as possible close Capacitor decouples power to the chip Capacitor prevents noise coupling back to power plane. Figure 2 Power Supply PCB Design Ehong Technology Co.,Ltd 2014-2019. Page 9 of 14 6.2 PWMs BT Module has 5 PWM. PWM1: Cold light LED;
PWM2: Warm light LED;
PWM3: RED LED;
PWM4: Green LED;
PWM5: Blue LED. The PWM1, PWM2 is default high level. Prevent the light from turning on after power on. Need MOS to logic transformation. 6.3 UART The MC16 embeds UART to implement full-duplex transmission and reception. Both TX and RX interface are 4-layer FIFO interface. Hardware flow control is also support via RTS and CTS.
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E H M C 1 6 D a t a S h e e t NoteThe maximum baud rate is 2400 baud during deep sleep. Figure 3 Connection To Host Device 6.4 I2C Master/ Slave The MC16 embeds I2C hardware module, which could act as Master mode or Slave mode. I2C is POPULAR inter-IC interface requiring only 2 bus lines, a serial data line (SDA) and a serial clonk (SCL). M030 I2C module supports standard mode (100kbps), Fast-mode
(400kbps), Fast-mode plus (1Mbps) and High-speed mode (3.4Mbps) with restriction that system clock must be by at least 10x of data rate. I2C module of the M030 acts as Slave mode by default. I2C slave mode supports two sub modes including DMA and Mapping mode. 6.5 SPI The MC16 embed SPI, which could act as Master mode or Slave mode. SPI is high-speed, full-
duplex and synchronous communication bus requiring 4bus lines including a chip select (CS) line, a data input (DI) line, a data output (DO)line and a clock (CK) line. SPI for the M030 acts as slave mode by default. SPI Slave mode support DMA. Ehong Technology Co.,Ltd 2014-2019. Page 10 of 14 6.6 Audio Figure 4 Reference Design Ehong Technology Co.,Ltd 2014-2019. Page 11 of 14
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E H M C 1 6 D a t a S h e e t PWM1PWM2330R330RBT MODULE3.3V3.3V1MR1MR100KR100KR 8. Layout and Soldering Considerations 8.1 Soldering Recommendations EH-MC16 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Comply will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. The following recommendation should be taken as a starting point guide. Refer to technical documentations of particular solder paste for profile configuration. Avoid using more than one flow. Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150um stencil thickness is recommended. Aperture size of the stencil should be 1:1 with the pad size. A low residue, no clean solder paste should be used due to low mounted height of the component. 8.2 Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 6. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 6 mm from the antenna. Any dielectric closer than 6 mm from the antenna will detune the antenna to lower frequencies. Figure 6 Clearance area of antenna Ehong Technology Co.,Ltd 2014-2019. Page 12 of 14
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E H M C 1 6 D a t a S h e e t 9. Mechanical and PCB Footprint Characteristics Figure 7Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm) 10. Packaging Remarkpackaging for the palletone packaging quantity is 100 PCS Figure 8 EH-MC16 Packaging (Pallet Ehong Technology Co.,Ltd 2014-2019. Page 13 of 14
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E H M C 1 6 D a t a S h e e t 11. Certification EH-MC16 is compliant to following specifications. 11.1. Bluetooth EH-MC16 Bluetooth audio module is Bluetooth qualified and listed as a controller subsystem and it is Bluetooth compliant to the following profiles of the core spec version V4.2. The QDID is D044285. 11.2. SRRC EH-MC16 has type certification in China with certification number CMIIT ID: 2019DP0081. FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference,and (2) this device must accept any interference received, including interference that may cause undesired operation. Ehong Technology Co.,Ltd 2014-2019. Page 14 of 14
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E H M C 1 6 D a t a S h e e t Regulatory Module Integration Instructions 2.2 List of applicable FCC rules This device complies with part 15.247 of the FCC Rules. 2.3 Summarize the specific operational use conditions This module can be applied in HID, sports and fitness sensors , health sensors, mobile accessories as well as smart home. The input voltage to the module should be nominally 1.8-3.6 V DC typical value 3V DC and the ambient temperature of the module should not exceed 85. This module using one kind of PCB antenna with maximum gain is 0 dBi , If the antenna needs to be changedthe certification should be re-applied. 2.4 Limited module procedures Not applicable 2.5 Trace antenna designs Not applicable 2.6 RF exposure considerations This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. If the device built into a host as a portable usage the additional RF exposure evaluation may be required as specified by 2.1093. 2.7 Antennas Module contains one PCB antenna. 2.8 Label and compliance information The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: "Contains Transmitter Module FCC ID: 2ACCRMC16
" or "Contains FCC ID: 2ACCRMC16 "Any similar wording that expresses the same meaning may be used. 2.9 Information on test modes and additional testing requirements a)The modular transmitter has been fully tested by the module grantee on the required number of channels modulation types and modes it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer installing the modular transmitter perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g.where a different antenna may be causing additional emissions). b)The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters digital circuitry or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance. C)If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5 15.15 and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference has been corrected The EH-MC16 module is based on RTL8752CKF chip .support standard Bluetooth HCI UART commands. For the testing module on your product, user can refer to specification of the Bluetooth system on how to configure and evaluate the module.This specification can also be found on the official Bluetooth website:
https://www.bluetooth.org/enus/specification/adoptedspecifications. 2.10 Additional testing Part 15 subpart B disclaimer The final host / module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device . The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules including the transmitter operation and should refer to guidance in KDB 996369. Frequency spectrum to be investigated For host products with certified modular transmitter the frequency range of investigation of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3) or the range applicable to the digital device as shown in Section 15.33(b)(1) whichever is the higher frequency range of investigation. Operating the host product When testing the host product all the transmitters must be operating.The transmitters can be enabled by using publicly-available drivers and turned on so the transmitters are active. In certain conditions it might be appropriate to use a technology-specific call box (test set) where accessory devices or drivers are not available. When testing for emissions from the unintentional radiator the transmitter shall be placed in the receive mode or idle mode if possible. If receive mode only is not possible then the radio shall be passive (preferred) and/or active scanning. In these cases this would need to enable activity on the communication BUS
(i.e. PCIe SDIO USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4 ANSI C63.10 and ANSI C63.26 for further general testing details. The product under test is placed into a normal paired' mode with another BLE device as per the normal intended use of the product (for example transferring data). ISED RSS Warning:
This device complies with Innovation, Science and Economic Development Canada licenceexempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'ISED applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. ISED RF exposure statement:
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.This transmitter must not be co-
located or operating in conjunction with any other antenna or transmitter. Le rayonnement de la classe b repecte ISED fixaient un environnement non contrls. Installation et mise en uvre de ce matriel devrait avec changeur distance minimale entre 20 cm tonon corps.Lanceurs ou ne peuvent pas coexister cette antenne ou capteurs avec dautres. IC Label Instructions:
The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as:
Contains Transmitter Module IC: 22745-MC16,or Contains IC: 22745-MC16, Any similar wording that expresses the same meaning may be used Instructions d'tiquetage IC: L'extrieur des produits finis contenant ce module doit afficher une tiquette faisant rfrence au module inclus. Cette tiquette extrieure peut utiliser des libells tels que: contient le module metteur IC: 22745-MC16 ou contient: IC: 22745-MC16 , tout libell similaire exprimant le mme sens peut tre utilis