EH-MC60
Professional Bluetooth Solution Provider
VERSION HISTORY
Version
Comment
Date
Author
V1.0
V1.1
V1.2
V1.3
V1.4
First edition
2021-4-12
Maggie.Z
Revise the antenna pattern, revise the known errors
2021-5-27
Maggie.Z
Revise known errors, add development board kits and
power consumption tests
Modify Pin definition
Increase the communication distance between the
mobile phone and the module
2021-6-30
Maggie.Z
2021-7-03
Maggie.Z
2021-7-16
Maggie.Z
Contact information
Sales
sales@ehonglink.com
Technical support
support@ehonglink.com
Website
http://www.ehonglink.com
Phone
+0086 21 64769993-203
Address
Room 501, No.485 Xingmei Road, Shanghai, China.
©Ehong Technology Co.,Ltd
Page 2 of 15
Contents
1.
Introduction ........................................................................................................................ 4
2. Quick Specifications ........................................................................................................... 4
3. Applications ........................................................................................................................ 5
4. Ordering Information .......................................................................................................... 5
5. Block Diagram .................................................................................................................... 5
6. Pin Descriptions ................................................................................................................. 6
Pin-out ............................................................................................................................ 6
6.1
Pin Descriptions .............................................................................................................. 6
6.2
7. Electrical Specifications ..................................................................................................... 8
7.1
Recommended Operation Conditions .............................................................................. 8
7.2 Module power consumption............................................................................................. 8
8. Software/ Firmware ............................................................................................................ 9
9. Mechanical Data ................................................................................................................ 9
Dimensions ..................................................................................................................... 9
9.1
Recommended PCB Land Pads .................................................................................... 10
9.2
10.
Physical Interfaces ....................................................................................................... 10
10.1 GPIO ............................................................................................................................. 10
10.2 UART ............................................................................................................................ 10
10.3
I2C Master/ Slave .......................................................................................................... 11
10.4 SPI ................................................................................................................................ 11
10.5 More interfaces ............................................................................................................. 11
11.
RF Design Notes .......................................................................................................... 11
11.1 Recommended RF Layout & Ground Plane................................................................... 11
11.2 Antenna Patterns .......................................................................................................... 12
90 degree direction ........................................................................................... 12
0 degree direction ............................................................................................. 12
11.2.1
11.2.2
12.
Layout and Soldering ................................................................................................. 13
12.1 Layout ........................................................................................................................... 13
12.2 Layout Guidelines ......................................................................................................... 13
13.
14.
15.
16.
Development Kit ........................................................................................................... 13
Module power consumption test .................................................................................. 14
Communication distance .............................................................................................. 14
Related Documents ...................................................................................................... 14
©Ehong Technology Co.,Ltd
Page 3 of 15
1. Introduction
EH-MC60 is a low-power, cost-effective Bluetooth SOC module that supports
Bluetooth 5 (5.2). 32-bit RISC-V microprocessor, 256KB RAM, support Bluetooth
long-distance, big data ,BLE Mesh.
The module supports a variety of working modes, including master-slave
integration, multi-master-slave (4 masters and 4 slaves), which can meet the needs
of a variety of application scenarios.
The module provides up to 1MB of ROM space, supports various hardware
interfaces, and can directly connect to external devices (such as sensors) without
an external processor to meet customer customization requirements.
EH-MC60 supports customers to build terminal equipment and enter the market
faster.
2. Quick Specifications
Bluetooth Version
BLE Version
Bluetooth 5.2 Low Energy
Radio
Frequency
Bluetooth/SIG Mesh
2402MHz-2480MHz
Transmit power
7.26dBm@BLE mode
Receiver sensitivity
-96dBm@BLE 1Mbps
Modulations
GFSK at 1 Mbps, 2 Mbps data rates
Antenna
BLE Long range
Supported
Supported
OTA
Electrical Specifications
Power supply
VBAT:1.8 VDC to 4.3 VDC, 3.3VDC typical
Current consumption
Active TX mode( TX power:0dBm):6.6mA
@3.3V DCDC
Active RX mode : 6.1mA
Deep sleep(without SRAM retention): 0.9μA
Deep sleep with 32K SRAM retention: 1.9μA
Hardware
Dimensions
Interfaces
Temperature Range
-40°C to +85°C
17.8x12.8x2.20mm
UART
SPI
I2C
PWM
GPIO*20
ADC
Swire
©Ehong Technology Co.,Ltd
Page 4 of 15
3. Applications
⚫ Apple Home Kit
⚫ Apple Find My Network
⚫ Low-Power Sensor Networks
⚫ Fitness / Sports / Health
⚫ Smart Home
⚫ Smart lighting systems
⚫ iBeacons™ / Proximity
⚫ BLE Mesh applications
⚫ Smart Toys / accessories
⚫ Internet of Things
⚫ Hotel Automation
⚫ Office Automation
4. Ordering Information
Part number
EH-MC60
description
Onboard antenna module
Support external antenna (externally led out by the pad hole)
©Ehong Technology Co.,Ltd
Page 5 of 15
6. Pin Descriptions
6.1 Pin-out
6.2 Pin Descriptions
No.
Pin
Default Function 1
Function 2
Function 3
Function 4
Simulation
function 5
1
2
3
4
5
6
7
8
9
PE0
PE1
PE3
PE4
PE5
PE6
PE7
GND
GND
-
-
-
-
GPIO
PWM3_O
FREQ_CHN_I
UART1_TX
I2C_SCK_IO
GPIO
PWM1_O ADC_Q_DAT3
UART1_CTS_I
I2C_SCK_IO
PE2
GPIO
PWM2_O ADC_Q_DAT4
I2C_SDA_IO
UART1_RTX_I
O
GPIO
PWM0_O ADC_Q_DAT5
UART1_RTS
I2C_SDA_IO
GPIO
PWM4_O ADC_Q_DAT6
RX_CYC2LNA
TDI_I
GPIO
PWM5_O ADC_Q_DAT7
TX_CYC2PA
TDO
TMS
TCK
-
-
ADC_Q_DAT8
PWM2_N
TMS_IO
ADC_Q_DAT9
PWM3_N
TCK_I
10
SWS
SWS
-
-
SWS_IO
Programmi
ng pin
-
-
-
-
-
-
-
-
-
-
©Ehong Technology Co.,Ltd
Page 6 of 14
11
PB0
GPIO
PWM5_O
TX_EN_I
TX_CYC2PA
12
PB1
GPIO
PWM3_O
TX_ON_I
RX_CYC2LNA
13
PB2
GPIO
DAC_I_DAT2_I
I2C_SCK_IO
14
PB3
GPIO
O/DAC_I_DAT3
I2C_SDA_IO
UART0_T
X_O
TX_DAT0_
UART0_RTX_I
_I
/
TX_DAT2_
UART0_RTS_O
DAC_I_DAT4_I
PWM0
CLK
HSPI_HOLD_N
lp_comp<0>/
_IO
sar_in<0>
CODEC_IRQ_O/
lp_comp<1>/
HSPI_WP_N_IO
sar_in<1>
DMIC_DAT_I/
lp_comp<2>/
HSPI_DI_IO
sar_in<2>
DMIC_CLK1_O/
p_comp<3>/
HSPI_DO_IO
sar_in<3>
DMIC_CLK2_O/
lp_comp<4>/
HSPI_CK_IO
sar_in<4>
16
PB5
GPIO
TX_DATA_
PWM1_O/
CODEC_MCLK_I/
lp_comp<5>/
VAL
DAC_I_DAT5_I
ATSEL[0]
sar_in<5>
17
PB6
GPIO
RATE0_I
MISO_IO1
UART0_CTS_I/
DAC_I_DAT6_I
TX_CYC2PA_O/
lp_comp<6>/
HSPI_CN_IO
sar_in<6>
DMIC_CLK1_O/
ADC_I_DA
T0
DMIC_DA
T_I-
I
21
PC2
GPIO
DAC_Q_DAT2_
ATSEL[1]
I2C_SDA_IO
22
PC1
GPIO
TX_CLK
ATSEL[0]
I2C_SCK_IO
PC0
GPIO
PWM0_O RX_EN_I
CSN
SWM_IO
PD2
GPIO
PWM2_N
ADC_I_DAT4
MISO_IO1
UART0_TX
25
PD3
GPIO
ADC_I_DAT5
MOSI_IO0
UART0_RTX_IO
PWM3_N_
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
I
I
-
-
-
O
-
-
-
15
PB4
GPIO
18
19
20
GND
GND
GND
GND
VBAT
3.3V
23
24
26
27
28
Notice:
circuits.
RES
ET
RESET
GND
GND
RF
-
1. General-purpose input/output; support wake-up function. All are internal pull-up and pull-down
2. The IO voltage range is 1.8V~3.6V, and the typical value is 3.3V.
3. For debugging, it is recommended to keep SWS test points.
4. If used with MCU chip, it is recommended to connect the reset pin.
©Ehong Technology Co.,Ltd
Page 7 of 14
7. Electrical Specifications
7.1 Recommended Operation Conditions
Operating Condition
Min
Typical
Max
Unit
Operating Temperature Range
Storage Temperature Range
Battery (VDD_BAT) operation
I/O Supply Voltage (VDD_PIO)
AIO input
-40
-40
1.8
1.8
0
+20
+20
+3.7
+3.3
-
+85
+85
+4.3
+3.6
+3.3
Frequency range
2402
2480
MHz
7.2 Module power consumption
⚫ Working current：Condition: VBAT=3V, VDDIO=3V, ambient temperature: 25℃
Power mode
Active RX mode, with DCDC
Active RX mode, with LDO
Active TX mode(@0dBm,with DCDC)
Active TX mode(@0dBm,with LDO)
Current
Consumption(Max)
6.1
11.5
6.6
12.5
Module average power consumption
°C
°C
V
V
V
Unit
mA
mA
mA
mA
⚫ Minimum power consumption：Condition: VBAT=3V，VDDIO=3V，ambient
temperature:25℃
Power
Mode
Always
32k
Retenti
CPU
Wakeup
Current
on
RCOSC/XTAL
on
Method
Consumpti
Registers
SRAM
on (typical)
suspend
ON
ON
Retention OFF
GPIO
32kHz Timer
40~50μA
Deep sleep
retention
with
ON
ON
Retention
32K
OFF
GPIO
32kHz Timer
2~3μA
Deep sleep
OFF
ON
OFF
OFF
GPIO
32kHz Timer
1~2μA
Module minimum power consumption
©Ehong Technology Co.,Ltd
Page 8 of 14
Condition
Level
Max Rating
Human body contact discharge rate JEDEC EIA/JESD22-
1C
2000V (all pins)
Charge device type according to contact discharge JEDEC
C1
500V (all pins)
A114
EIA/JESD22-C101
ESD Protection
8. Software/ Firmware
Software
Support
Software
encryption
Standard Software
Ehong provide module with standard software for customer to develop.
Support to make some modification and support customized MAC address
SDK development
Ehong provide SDK and description
Support software encryption for mass production
9. Mechanical Data
9.1 Dimensions
17.8*12.8*2.2mm
©Ehong Technology Co.,Ltd
Page 9 of 14
9.2 Recommended PCB Land Pads
10. Physical Interfaces
10.1
GPIO
10.2 UART
The General input/output can be set different function according the the pinmux
configuration in the code including PWM, UART, i2C etc.
EH-MC60 supports 2 UARTs, and the two interfaces support full-duplex transmission
and reception. Support hardware flow control through RTS and CTS.
Note：Baud rate supports from 1200 bps from 2Mbps
©Ehong Technology Co.,Ltd
Page 10 of 14
10.3
I2C Master/ Slave
There is an independent hardware I2C interface in EH-MC60, which is composed of
serial data line (SDA) and serial clock (SCL).
Support the configuration of master-slave mode.
Support 7/10 bit I2C address; configurable I2C address (slave mode); standard rate
(1-100kHz), fast rate (100kHz-400kHz).
10.4 SPI
EH-MC60 has an independent SPI interface. Support master-slave mode, support
two-wire and three-wire SPI interface, support DMA.
10.5 More interfaces
EH-MC60 has a single-bus SWS interface, supports single-wire communication, and
the maximum rate can reach 2Mbps.
11. RF Design Notes
11.1 Recommended RF Layout & Ground Plane
For EH-MC60, the integrated antenna needs a suitable reference ground plane to
improve radiation efficiency.
The area extending from under the antenna part of the module should be kept free of
copper and other metals. The module should be placed on the edge of the PCB with
the antenna edge facing outward.
©Ehong Technology Co.,Ltd
Page 11 of 14
11.2 Antenna Patterns
11.2.1 90 degree direction
11.2.2 0 degree direction
©Ehong Technology Co.,Ltd
Page 12 of 14
12.
Layout and Soldering
12.1
Layout
• Module power supply: 3v button battery or DC 3.3v
• Power pin connection capacitor is as close as possible to chip and pin
• Decoupling the power supply from the chip using a capacitor
• Use capacitors to prevent noise from coupling back to the power plane.
12.2 Layout Guidelines
To optimize antenna performance, place the module in the corner of the PCB as
shown in Figure 6. Do not cover copper and trace the antenna clearance area. Keep
the antenna area as far away as possible from the power supply and metal
components. Connect all GND pins directly to a solid GND plane. Place GND vias as
close as possible to the GND pin. Use a good layout method to avoid excessive
noise coupling with signal lines or supply voltage lines
13.
Development Kit
Note: For the use of development boards and kits, please refer to Ehong Development
Board datesheets.
©Ehong Technology Co.,Ltd
Page 13 of 14
14. Module power consumption test
Broadcast power consumption (transmit power: 2.8; broadcast interval: 30ms): about 708 uA;
Power consumption when connected to mobile phone: about 21uA;
Enter low power consumption mode: about 0.944uA;
15. Communication distance
Test method: connect the mobile phone to the module, connect to the communication
20 times, and send 20 bytes each time;
Communication distance: about 200 meters;
16. Related Documents
Ehong Documents:
Visit website and download: http://www.ehonglink.com
Supports：support@ehonglink.com
Sales：
sales@ehonglink.com
phone: +0086 21-64769993-203
©Ehong Technology Co.,Ltd
Page 14 of 14
FCC Statement
Any Changes or modifications not expressly approved by the party responsible for compliance could void
the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired
operation.
(cid:44)(cid:41)(cid:41)(cid:3)(cid:56)(cid:71)(cid:74)(cid:79)(cid:71)(cid:90)(cid:79)(cid:85)(cid:84)(cid:3)(cid:43)(cid:94)(cid:86)(cid:85)(cid:89)(cid:91)(cid:88)(cid:75)(cid:3)(cid:57)(cid:90)(cid:71)(cid:90)(cid:75)(cid:83)(cid:75)(cid:84)(cid:90)(cid:32)(cid:3)
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment .This equipment should be installed and operated with minimum distance 20cm between the
radiator& your body.
ISED RSS Warning/ISED RF Exposure Statement
ISED RSS Warning:
This device complies with Innovation, Science and Economic Development Canada licence-exempt
RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
Le présent appareil est conforme aux CNR d'ISED applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
ISED RF exposure statement:
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator& your
body.This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Le rayonnement de la classe b repecte ISED fixaient un environnement non contrôlés.Installation et mise en
œuvre de ce matériel devrait avec échangeur distance minimale entre 20 cm ton corps.Lanceurs ou ne peuvent
pas coexister cette antenne ou capteurs avec d’autres.
FCC/ISED Label Instructions:
If using a permanently affixed label, the modular transmitter must be labeled with its own FCC or ISED
identification number, and, if the FCC or IESD identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also
display a label referring to the enclosed module. This exterior label can use wording such as the
following:
“Contains FCC ID: 2ACCRMC60,IC:20625-MC60".
Any similar wording that expresses the same meaning may be used. The Grantee may either
provide such a label, an example of which must be included in the application for equipment
authorization, or, must provide adequate instructions along with the module which explain this requirement.
This radio transmitter has been approved by Innovation, Science and Economic Development Canada to
operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not
included in this list, having a gain greater than the maximum gain indicated for that type, are strictly
prohibited for use e with this device.
Revision History
OEM Guidance
1. Applicable FCC rules
This device complies with part 15.247 of the FCC Rules.
2. The specific operational use conditions
This module can be used in IoT devices. The input voltage to the module is
nominally 3.3 V DC. The operational ambient temperature of the module is
-40 °C ~ 85 °C. the embedded PCB antenna is allowed. Any other
external antenna is prohibited.
3. Limited module procedures
4. Trace antenna design
N/A
N/A
5. RF exposure considerations
The equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
minimum distance 20cm between the radiator and your body. If the equipment
built into a host as a portable usage, the additional RF exposure evaluation may
be required as specified by 2.1093.
Espressif Systems
6. Antenna
Antenna type: PCB antenna Peak gain : 1.55dBi
7.
Label and compliance information
An exterior label on OEM’s end product can use wording such as the
following: “Contains Transmitter Module FCC ID: 2ACCRMC60” or
“Contains FCC ID: 2ACCRMC60”
8.
Information on test modes and additional testing requirements
a)The modular transmitter has been fully tested by the module grantee on the required
number of channels,modulation types, and modes, it should not be necessary for the host
installer to re-test all the available transmitter modes or settings. It is recommended that the
host product manufacturer, installing the modular transmitter,perform some investigative
measurements to confirm that the resulting composite system does not exceed the spurious
emissions limits or band edge limits (e.g., where a different antenna may be causing
additional emissions).
b)The testing should check for emissions that may occur due to the intermixing of emissions
with the other transmitters, digital circuitry, or due to physical properties of the host product
(enclosure). This investigation is especially important when integrating multiple modular
transmitters where the certification is based on testing each of them in a stand-alone
configuration. It is important to note that host product manufacturers should not assume that
because the modular transmitter is certified that they do not have any responsibility for final
product compliance.
c)If the investigation indicates a compliance concern the host product manufacturer is
obligated to mitigate the issue. Host products using a modular transmitter are subject to all
the applicable individual technical rules as well as to the general conditions of operation in
Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product
will be obligated to stop operating the device until the interference have been corrected .
9. Additional testing, Part 15 Sub part B disclaimer The final host / module combination
need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order
to be properly authorized for operation as a Part 15 digital device.
The host integrator installing this module into their product must ensure that the final
composite product complies with the FCC requirements by a technical assessment or
evaluation to the FCC rules, including the transmitter operation and should refer to guidance
in KDB 996369. For host products with certified modular transmitter, the frequency range of
investigation of the composite system is specified by rule in Sections 15.33(a)(1) through
(a)(3), or the range applicable to the digital device, as shown in Section 15.33(b)(1),
whichever is the higher frequency range of investigation
When testing the host product, all the transmitters must be operating.The transmitters can
be enabled by using publicly-available drivers and turned on, so the transmitters are active.
In certain conditions it might be appropriate to use a technology-specific call box (test set)
where accessory 50 devices or drivers are not available. When testing for emissions from
the unintentional radiator, the transmitter shall be placed in the receive mode or idle mode, if
possible. If receive mode only is not possible then, the radio shall be passive (preferred)
and/or active scanning. In these cases, this would need to enable activity on the
communication BUS (i.e., PCIe, SDIO, USB) to ensure the unintentional radiator circuitry is
enabled. Testing laboratories may need to add attenuation or filters depending on the signal
strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4,
ANSI C63.10 and ANSI C63.26 for further general testing details.
The product under test is set into a link/association with a partnering device, as per the
normal intended use of the product. To ease testing, the product under test is set to transmit
at a high duty cycle, such as by sending a file or streaming some media content.