FCC ID: 2AK9DL620 NB-IoT Module

L620 Hardware Design L620 Hardware Design NB-IoT Module Series Version V1.1 Date 2018-06-05 Copyright Shanghai Mobiletek Communication Ltd 0 Shanghai Mobiletek Communication Ltd L620 Hardware Design Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and therefore may not be activated or may be limited by local network operators or network service providers. Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Shanghai Mobiletek Communication Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability. Copyright DISCLAIMER design. All specification supplied herein are subject to change without notice at any time. This document contains proprietary technical information which is the property of Shanghai Mobiletek Communication Ltd. copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of patent or the registration of a utility model or ALL CONTENTS OF THIS MANUAL ARE PROVIDED AS IS. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDINGBUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL.TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL SHANGHAI MOBILETEKCOMMUNICATION LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED CONFIDENTIAL LYNQ SAVINGS REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT. Copyright Shanghai Mobiletek Communication Ltd 1 L620 Hardware Design Version History Date Version Modify records 2018-04-14 V1.0 First Release 2018-06-05 V1.1 Change PIN name of PIN16; modify peak current at different supply voltages Author Rc.Dong Rc.Dong CONFIDENTIAL LYNQ Copyright Shanghai Mobiletek Communication Ltd 2 L620 Hardware Design CONTENT 1. Introduction .......................................................................................................................................................... 5 1.1 Hardware Diagram .............................................................................................................................................. 5 1.2 Main features ...................................................................................................................................................... 5 1.3 Specifications ...................................................................................................................................................... 6 1.4 Interfaces ............................................................................................................................................................ 7 2. Package Information ............................................................................................................................................. 8 3. 4. Interface Circuit Design ....................................................................................................................................... 14 LYNQ 2.1 Pin Configuration ................................................................................................................................................ 8 2.2 Pin definition ....................................................................................................................................................... 9 2.3 Package Information ......................................................................................................................................... 11 2.3.1 Dimensions ................................................................................................................................................ 11 2.3.2 Module size ................................................................................................................................................ 12 2.3.3 Recommend Pad ........................................................................................................................................ 13 3.1 Power Section ................................................................................................................................................... 14 3.1.1 Power Supply ............................................................................................................................................. 14 3.1.2 Hardware Power On/Off ............................................................................................................................ 15 3.1.3 Hardware reset .......................................................................................................................................... 15 3.1.4 RTC_EINT Key ............................................................................................................................................. 16 3.2 SIM Interface ..................................................................................................................................................... 16 3.2.1 Pin Description ........................................................................................................................................... 16 3.2.2 SIM application .......................................................................................................................................... 16 3.2.3 eSIM ........................................................................................................................................................... 17 3.3 IIC Interface ....................................................................................................................................................... 18 3.4 UART Interface .................................................................................................................................................. 18 3.4.1 Pin Description ........................................................................................................................................... 18 3.4.2 UART application........................................................................................................................................ 19 3.5 LED Interface ..................................................................................................................................................... 20 3.5.1 LED Control circuit ..................................................................................................................................... 20 3.5.2 LED Status description ............................................................................................................................... 20 3.6 ADC ................................................................................................................................................................... 21 CONFIDENTIAL 4.1 Electrical characteristic ..................................................................................................................................... 22 4.2 Temperature characteristic ............................................................................................................................... 22 4.3 Absolute Maximum Power ................................................................................................................................ 23 4.4 Recommended operating conditions ................................................................................................................ 23 4.5 Power consumption .......................................................................................................................................... 23 4.6 Power Sequence ............................................................................................................................................... 25 4.7 Digital Interface Characteristics ........................................................................................................................ 25 4.8 ESD .................................................................................................................................................................... 26 Electrical characteristics ..................................................................................................................................... 22 Copyright Shanghai Mobiletek Communication Ltd 3 L620 Hardware Design 5. RF Features ......................................................................................................................................................... 28 5.1 RF Main Features .............................................................................................................................................. 28 5.2 Data link ............................................................................................................................................................ 30 5.3 Antenna Circuit Design...................................................................................................................................... 31 5.4 Antenna Design ................................................................................................................................................. 32 6. Storage and Production ...................................................................................................................................... 34 6.1 Storage .............................................................................................................................................................. 34 6.2 Production ........................................................................................................................................................ 34 6.2.1 Module confirmation and moisture........................................................................................................... 35 6.2.2 SMT reflow attentions ............................................................................................................................... 36 6.2.3 SMT stencil design and the problem of less tin soldering ......................................................................... 37 6.2.4 SMT attentions........................................................................................................................................... 37 CONFIDENTIAL LYNQ Copyright Shanghai Mobiletek Communication Ltd 4 L620 Hardware Design 1. Introduction L620 is a small NB-IoT module for LCC package, with stable and reliable performance. It can be widely used for various products and equipment of IoT. 1.1 Main features CPU ARM Cortex-M4@78MHz C Copyright Shanghai Mobiletek Communication Ltd 5 L620 Hardware Design Flash SYSRAM: 32KB PSRAM: 32Mb Flash: 32Mb Frequency bands 3GPP R13/R14 Band 2/5/12 Output Power 22dBm2dB Sensitivity

-139dBm1dB Data transmission DL25.5kbps CONFIDENTIAL LYNQ UL35.35kbps(single-tone)/58.3kbps(multi-tone) Ultra-low power consumption PSM3.5uA @3.3V 1.2 Specifications Supply Voltage Range2.13.6Vtype3.3V Dimensions17.6mm * 15.8mm * 2.3mm Copyright Shanghai Mobiletek Communication Ltd 6 L620 Hardware Design Package45-pin LCC Operation Temperature Range-40+85 Storage Temperature Range-45+90 Support PSM and eDRX mode Weight Approx 1g 1.3 Interfaces IIC GPIO EINT ADC UART SPI IIS PWM SIM: Support 1.8V/3V or eSIM CONFIDENTIAL LYNQ Copyright Shanghai Mobiletek Communication Ltd 7 L620 Hardware Design 2. Package Information 2.1 Pin Configuration O S I M _ I P S I S O M _ I P S K C S _ I P S S C _ I P S T A B V T A B V 1 O I P G D N G D N G T N A UA RT 2_ T X D UA RT 2_ R X D RTC _E I N T A D C G ND N C S I M _ S I O S I M _ S C LK S IM _ S R S T 1 2 3 4 5 6 7 8 9 S I M _ D E T 10 V S I M 11 S YS R S T B 12 5 4 3 4 4 4 2 4 1 4 0 4 9 3 8 3 7 3 6 3 2 9 3 0 3 1 3 2 3 3 3 4 3 5 G ND I IS _ T X I IS _ R X I IS _ C K I IS _ W S P W R KE Y CONFIDENTIAL LYNQ D C D _ 1 T R A U D X R _ 1 T R A U D X T _ 1 T R A U R T D _ 1 T R A U S T C _ 1 T R A U S T R _ 1 T R A U R _ 1 T R A U V I O18 I L T E N M W P G ND D N G T H G S DA 9 2 O S CL G N P G 3 2 2 2 1 2 0 2 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 8 2 7 2 6 2 5 2 4 I I UA RT _De bu g_ R X D UA RT _De bu g_ T X D UART Key Other GND SIM IO Power IIS ANT SPI Figure 2-1 L620 Pin View Copyright Shanghai Mobiletek Communication Ltd 8 L620 Hardware Design 2.2 Pin definition Table 2-1 L620 Pin description Pin NO. Pin name Type Function Description Power domain State (1) 1. UART2_TXD O UART2 transmit data output VIO18 Open 2. UART2_RXD I UART2 receive data input VIO18 Open 3. RTC_EINT 4. ADC 5. GND 6. NC 7. SIM_SIO 8. SIM_SCLK 9. SIM_RST 10. SIM_DET 11. VSIM 12. 13. SYSRSTB NETLIGHT 14. PWM 15. GND 16. GPIO29 I I I O O G 03.6V I/O NC GND Open Open Open Open Ground 1.8/3.0V 1.8/3.0V 1.8/3.0V SIM data 01.4V SIM reset SIM clock SIM detect pin ADC external input channel Wake up module for exiting PSM CONFIDENTIAL LYNQ Output PIN as LED control for UART1 data carrier detect General input/output PIN UART1 ready to receive System reset signal SIM output voltage network status PWM output 2.13.6V 1.8/3.0V Ground VIO18 VIO18 VIO18 VIO18 VIO18 VIO18 Open Open Open Open Open Open Open Open Open GND DO I/O DI O O G P I 17. 18. UART1_DCD UART1_RTS 19. UART1_RING DO UART1 ring indicator VIO18 Open 20. UART1_DTR DI UART1 Data terminal ready VIO18 Open 21. UART1_CTS DO UART1 clear to send VIO18 Open Copyright Shanghai Mobiletek Communication Ltd 9 L620 Hardware Design 22. UART1_TXD O UART1 transmit data output VIO18 Open 23. UART1_RXD I UART1 receive data input VIO18 Open 24. 25. UART_Debug_ TXD UART_Debug_ RXD O UART_Debug transmit data output VIO18 Open I UART_Debug receive data input VIO18 Open 26. GND G Ground GND 27. SDA I/O IIC data VIO18 Open 28. SCL 29. VIO18 30. PWRKEY 31. IIS_RX 32. IIS_CK 33. IIS_WS 34. IIS_TX 35. GND 36. ANT 37. GND 38. GND 39. GPIO1 40. VBAT 41. VBAT 42. SPI_CS 43. SPI_MOSI I P G O O DI I/O DO 1.8V Open Open Open Open Open Open VIO18 VIO18 VIO18 VIO18 VIO18 Ground IIC clock 03.6V Powerkey Digital audio input Digital audio output 1.8V output voltage The left/right word select The bit clock of the interface CONFIDENTIAL LYNQ General input/output PIN SPI master out slave in ANT Antenna SPI chip-select Power supply 2.13.6V Ground Ground VIO18 VIO18 VIO18 VBAT VBAT Open Open Open Open Open GND GND GND I/O I/O G G O P 44. SPI_MISO I/O SPI master in slave out VIO18 Open 45. SPI_SCK O SPI clock VIO18 Open

(1) Suggested status when not in use. Copyright Shanghai Mobiletek Communication Ltd 10 L620 Hardware Design P:POWER I:INPUT O:OUTPUT Table 2-2 Pin type description G:GROUND DI:DIGITAL INPUT DO:DIGITAL OUTPUT ANT:ANTENNA NC:NOT CONNECT 2.3 Package Information 2.3.1 Dimensions The L620 mechanical dimensions are described as following figure (Top view, Back view, Side view). CONFIDENTIAL LYNQ Figure 2-2 Mechanical Dimensions Copyright Shanghai Mobiletek Communication Ltd 11 L620 Hardware Design 2.3.2 Module size Figure 2-3 Module Size (Unitmm) Copyright Shanghai Mobiletek Communication Ltd 12 LYNQ CONFIDENTIAL L620 Hardware Design 2.3.3 Recommend Pad Figure 2-4 Recommend pad(Top view, Unit mm) Copyright Shanghai Mobiletek Communication Ltd 13 LYNQ CONFIDENTIAL L620 Hardware Design 3. Interface Circuit Design 3.1 Power Section 3.1.1 Power Supply VBAT is the main power supply of the module, and the input voltage range is 2.1V to 3.6V. The recommended voltage is 3.3V. Because the module transmit burst may cause voltage drops, it is recommended that the total bypass cap used in the VBAT be greater than 330uF. At this time, the module's transient peak current will reach 600mA. If the total bypass cap on the VBAT is less than 330uF, the module's transient peak current will reach 1A when the module's supply voltage is between 2.1V and 3.0V and the module's transient peak current will reach 600mA when the module's supply voltage is between 3.0V and 3.6V. During layout, the capacitors are close to the VBAT pins and VBAT trace width is about 1mm. VBAT Power Module 330uF 22uF 4.7uF 100nF Figure 3-1 Power Supply circuit Notes: According to the environment, please select capacitor as large value as possible; and add 100pF, 33pF capacitors if requiring. Copyright Shanghai Mobiletek Communication Ltd 14 LYNQ CONFIDENTIAL L620 Hardware Design 3.1.2 Hardware Power On/Off Module 30-pin is the Power on/off key. Pulling down the PWRKEY at least 300ms1s and then releasing, the module will boot. There is internally pulled-up resistor. Module 30-pin can also be used for hardware shutdown. When this pin has been pulled down over 811 seconds, the module will shutdown. PWRKEY ESD Figure 3-2 Turn on circuit Note: In PSM mode, you can exit the PSM mode by pulling PWRKEY low. 3.1.3 Hardware reset Module 12-pin is the hardware reset input. The module will reset hardware when it receives a 48ms low level signal. It is internally pull-up to VBAT, and does not need to pull up externally. SYSRSTB ESD Figure 3-3 System Reset Copyright Shanghai Mobiletek Communication Ltd 15 LYNQ CONFIDENTIAL L620 Hardware Design 3.1.4 RTC_EINT Key Module 3-pin is the RTC_EINT input. The module will exit the PSM mode when it receives a 48ms low level signal. It is internally pull-up to VBAT, and do not need to pull up externally. RTC_EINT ESD Figure 3-4 RTC_EINT Key 3.2 SIM Interface 3.2.1 Pin Description L620 supports and is able to automatically detect 3.0V and 1.8V SIM card. SIM card interface signal as shown in table 3-1. Table 3-1 SIM Pin Description Pin NO. Pin Name Signal definition Function Description 7 8 9 10 11 SIM_SIO SIM card data pin SIM card DATA signal, I/O signal SIM_SCLK SIM card clock pin SIM_SRST SIM card reset pin SIM card clock signal, output by the module SIM card reset signal, output by the module SIM_DET SIM detect pin SIM detect pin, input signal VSIM VSIM output voltage VSIM card power supply, output by the module 3.2.2 SIM application Please note to increase the ESD components on SIM card signal group (PIN number: 7, 8, 9, 11), near the SIM card seat. Copyright Shanghai Mobiletek Communication Ltd 16 LYNQ CONFIDENTIAL L620 Hardware Design In order to meet the requirements of 3GPP TS 27.005 protocol and EMC certification, the proposed SIM card is arranged near the module SIM card interface, and avoid to layout too long resulting in serious waveform distortion, affecting the signal integrity. SIM_SCLK and SIM_SIO signals are recommended to be protected. Paralleling a 1uF capacitor between GND and VSIM, that can filter out the interference of radio frequency signals. SIM_SIO SIM_SCLK SIM_SRST VSIM I/O CLK VPP RST GND VCC NC ESD ESD ESD ESD 1uF Figure 3-5 SIM Circuit Note: The capacity value of ESD components should be under 22pF. 3.2.3 eSIM The eSIM card is reserved inside the module. The eSIM card and external SIM card can only be selected one by one. Copyright Shanghai Mobiletek Communication Ltd 17 LYNQ CONFIDENTIAL L620 Hardware Design Note: The module with the eSIM card is L620E; and the module with the external SIM card is L620. 3.3 IIC Interface L620 module can support a group of IIC interface. When you need to use the IIC interface to communicate, which need external pull-up 4.7K resistor by VIO18. 3.4 UART Interface 3.4.1 Pin Description The L620 provides three UART serial communication interfaces: the UART_Debug can be used as the debug port on the AP of the L620 and can also be used to download software. It is a 2-wire UART interface. UART1 can be used as complete non-synchronous communication interface, supporting standard modem handshake signal control and in compliance with the RS-232 interface protocol, also supporting 4-wire serial bus interface or 2-wire serial bus interface mode. UART2 is used as a debug port on the modem of the L620. The three groups of UART port support programmable data width, stop bits, and parity bits, with separate TX and RX FIFOs (512 bytes each). The max baud rate of normal application of UART

(non-Bluetooth) is 921600bps. UART1 supports adaptive baud rate. Table 3-2 UART Pin Description Pin NO. Pin Name I/O Function Description 1 2 UART2_TXD UART2_RXD O I UART2 transmit data output UART2 receive data input Copyright Shanghai Mobiletek Communication Ltd 18 LYNQ CONFIDENTIAL L620 Hardware Design 17 18 19 20 21 22 23 24 25 UART1_DCD UART1_RTS DO DI UART1 data carrier detect UART1 ready to receive UART1_RING DO UART1_DTR DI UART1 ring indicator. It can be used as wake out signal to host from module UART1 Data terminal ready(wake up module) UART1_CTS DO UART1 clear to send UART1_TXD UART1_RXD O I UART1 transmit data output UART1 receive data input UART_Debug_TXD O UART_Debug transmit data output UART_Debug_RXD I UART_Debug receive data input 3.4.2 UART application If used UART in communication between the module and application processor, and the level is 1.8V, the connection mode is shown in Figure 3-6 and figure 3-7. You can use the complete RS232 mode, 4 wires or 2 wires mode connection. Module interface level is 1.8V. If the AP interface level does not match, you must increase the level conversion circuit. TXD RXD L620 CTS RTS GND TXD RXD AP CTS RTS GND Figure 3-6 Connect to AP method(4lines) Copyright Shanghai Mobiletek Communication Ltd 19 LYNQ CONFIDENTIAL L620 Hardware Design L620 Serial Port AP Serial Port TXD RXD CTS RTS DTR DCD RING GND TXD RXD CTS RTS DTR DCD RING GND Figure 3-7 Connect to AP method 3.5 LED Interface 3.5.1 LED Control circuit NETLIGHT (PIN13) can be used to control the LED status of the network. Figure 3-8 LED Circuit 3.5.2 LED Status description NETLIGHT (PIN13) is used as the enable pin. Table 3-3 lists the LED status. Copyright Shanghai Mobiletek Communication Ltd 20 100KNETLIGHTPOWERLYNQ CONFIDENTIAL L620 Hardware Design LED Status OFF Table 3-3 LED Status Module Status Power off Cycle 1Hz, duty ratio 50%

Shut down network Cycle 0.3Hz, duty ratio 10%

Registered network Cycle 10Hz, duty ratio 50%

Data Transmit 3.6 ADC The module provides an ADC for detecting light-sensitive resistors or other devices that require ADC detection. The Max voltage of ADC is 1.4V with 10-bit accuracy. Table 3-4 ADC value Parameter Input range Min. 0.05 Typ. Max. 1.4 Unit V Copyright Shanghai Mobiletek Communication Ltd 21 LYNQ CONFIDENTIAL L620 Hardware Design 4. Electrical characteristics 4.1 Electrical characteristic Table 4-1 Electrical characteristic Power VBAT Peak current Min. Nom. Max Unit 2.1

-0.3 3.3

-

3.6 1.0 V A Notes: The over-low voltage cant power on the module; Over-high voltage may be danger to damage the module. 4.2 Temperature characteristic Table 4-2 Temperature characteristic State Working Storage Min. Nom. Max Unit

-40

-45 25 25 85 90 Copyright Shanghai Mobiletek Communication Ltd 22 LYNQ CONFIDENTIAL L620 Hardware Design Note: When the temperature is over the range, the RF performance may be dropped. It also may cause power down or restart problem. 4.3 Absolute Maximum Power Table 4-3 Absolute maximum power rating PIN Name Description Min. Typ. Max. Unit VIO18 Digital power for IO 1.62 1.8 1.98 V 4.4 Recommended operating conditions Table 4-4 Recommended operating range PIN Name Description Min. Typ. Max. Unit VIO18 Digital power for IO 1.62 1.8 1.98 V Note: All the GPIOs of module are 1.8V. 4.5 Power consumption Table 4-5 Power Consumption Parameter Conditions Min. Average Max. Unit Power off mode VBAT=3.3V

-

3.5 uA Copyright Shanghai Mobiletek Communication Ltd 23 LYNQ CONFIDENTIAL L620 Hardware Design PSM VBAT=3.3V

-

3.5 150 0.9 17 135.4 144.6 123.9 eDRX VBAT=3.3V, Value=81.92s, PTW=5.12s, Paging cycle: 1.28s DRX VBAT=3.3V, Paging cycle: 1.28s Wake mode VBAT=3.3V Band2 Band5 VBAT=3.3V@TX22.69dBm VBAT=3.3V@TX22.75dBm Band12 VBAT=3.3V@TX22.9dBm 2.1VVBAT3.0V VBAT(total bypass cap) 330uF Peak current 3.0VVBAT3.6V VBAT(total bypass cap) 330uF 2.1VVBAT3.6V VBAT(total bypass cap) 330uF uA uA mA mA mA mA mA 1 A 600 mA 600 mA NoteThe test value of power consumption is the value tested in laboratory condition. The power consumption of the L620 is explained as follows:

1Wake mode (Normal working mode): The module is in normal working mode and all functions are normal. Data can be sent and received. In this mode, the module can switch to DRX/eDRX mode or Copyright Shanghai Mobiletek Communication Ltd 24 LYNQ CONFIDENTIAL L620 Hardware Design PSM mode. 2DRX/eDRX mode: The module is in paging state. In this mode, the module can switch to normal working mode or PSM mode. 3PSM mode: Only RTC of the module is working. In this mode, the module is in a network disconnected state and doesnt receive any network paging. Only when the TAU periodic request timer (T3412) is timeout, or the UE has the MO service to be processed and actively exits, the UE will exit the PSM mode and enter the connected state to process the uplink and downlink services. 4.6 Power Sequence Figure 4-1 Power up time sequence diagram 4.7 Digital Interface Characteristics Table 4-6 Digital IO Voltage Parameter Description Min. Typical Max. Unit VIH VIL High level input voltage 1.62 1.8 1.98 Low level input voltage 0

-

0.7 V V Copyright Shanghai Mobiletek Communication Ltd 25 LYNQ CONFIDENTIAL L620 Hardware Design VOH High level output voltage 1.62 1.8 1.98 VOL Low level output voltage 0

-

0.3 V V Note: Suit to all GPIOs, IIC, UART interfaces. 4.8 ESD Because there is no special protection against electrostatic discharge in the module, it is necessary to pay attention to the protection of electrostatic protection in the production, assembly and operation module. The performance parameters of the module test are as follows. ESD parameterTem25humidity45%

Table 4-7 ESD Performance PIN Name Contact discharge Air discharge VBAT GND RF_ANT 4KV 4KV 4KV 8KV 8KV 8KV Enhanced ESD performance method:

1 If a converted board is added, it should have enough GND pins and be equally distributed. And the Layout of GND should be enough wide. 2 Key (Powerkey, RTC_EINT key and Reset key) need to add ESD device. Reset key line cant be Copyright Shanghai Mobiletek Communication Ltd 26 LYNQ CONFIDENTIAL L620 Hardware Design near the edge of the board. 3 UART and other plug connector need to add ESD devices, and the other control lines from the outside of the machine also need to add ESD devices. 4 SIM card should be added ESD protect. 5 External antenna, please add ESD device, ESD Cpf<0.5pF. Notes: For ESD protect, please add ESD methods according to upper ways. ESD components include varistors and TVS. For better performance, please use TVS. Copyright Shanghai Mobiletek Communication Ltd 27 LYNQ CONFIDENTIAL L620 Hardware Design 5. RF Features 5.1 RF Main Features a) Support 3GPP R13/R14 b) Support Single-tone and Multi-tone c) Support PSM and eDRX mode d) Support bands include EUTRA 2/5/12 The operating frequency range of the product is shown in table 5-1. 1850 MHz 1910 MHz 1930 MHz 1990MHz Band Uplink Band2 Band5 824 MHz 849 MHz Band12 699 MHz 716 MHz Note Downlink CTC/CMCC(optional) 869 MHz 894 MHz Table 5-1 Frequency Band CONFIDENTIAL LYNQ 729 MHz 746 MHz Copyright Shanghai Mobiletek Communication Ltd 28 L620 Hardware Design Table 5-2 Output power Band Max output power Min output power Band2 Band5 Band12 22dBm2dBm 22dBm2dBm 22dBm2dB

< -40dBm

< -40dBm

< -40dBm 200 KHz (CAT NB1) Band REF SENS

(Total)

-117

-115

-115 Band2 Band5 Band12 200 KHz(CAT NB1) REF SENS

(EPRE @15KHz) 200 KHz(CAT 200 KHz(CAT NB1) NB-PDSCH repetitions NB1) NB-PDSCH repetitions

(Total)

(EPRE @15KHz)

-126.4

-125.8

-126.1

-129.4

-128.2

-128.6

-139

-139

-139 Copyright Shanghai Mobiletek Communication Ltd 29 QN L620 Hardware Design 5.2 Data link Table 5-4 Data link Single Tone Multi Tone Band Downlink Uplink Downlink Uplink Band2 25.5kbps 35.35kbps 25.5kbps 58.3kbps Band5 25.5kbps 35.35kbps 25.5kbps 58.3kbps Band12 25.5kbps 35.35kbps 25.5kbps 58.3kbps Copyright Shanghai Mobiletek Communication Ltd 30 CONFID L620 Hardware Design 5.3 Antenna Circuit Design The connecting part of the RF antenna supports the PAD form. The connection between the module and the main board antenna interface is required to be welded and connected through a microstrip line or a strip line. The microstrip line or strip line is designed according to the characteristic impedance of 50 ohm, and the length of the wire is less than 10mm. Reserved matching network. Copyright Shanghai Mobiletek Communication Ltd 31 CONFINTIAL L620 Hardware Design Figure R1, C1, C2 and R2 composition of the antenna matching network for antenna debugging, the default R1, R2 paste 0 ohm resistor and C2, C1 empty paste. RF Connector in the figure is used for testing and conducting test (for example, CE, FCC, etc.), which need to be placed as close as possible by the module, the RF path from the module to the antenna feed point should be kept 50 ohm impedance control. This product antenna peripheral circuit design, the proposed RF circuit Layout program: RF line trances top layer, a reference to the second layer. Users need to pay attention to the design of the PCB line: to ensure the RF has full reference GND layer. Figure 5-2 RF Trace Design 5.4 Antenna Design PIFA or IFA antenna can be used for inner antenna; Whip antenna can be used for external antenna. The antenna gain must more than 3dBi. The recommend area of inner antenna: 100mm*10mm*6mm

(L*W*H), the main board length no less than 90mm. The antenna should be as far as possible from the chip and memory, power interface, data cable interface, camera FPC, screen FPC, connector FPC, and other possible EMI modules and devices. Copyright Shanghai Mobiletek Communication Ltd 32 LYNQ CONFIDENTIAL L620 Hardware Design Table 5-5 Antenna Specifications Parameter Specification Efficiency S11/VSWR

>40%

<-10dB Polarization linear polarization TRP TIS Low Band Middle Band Low Band

>18dBm Middle Band

>18dBm Low Band

<-107dBm (Total without repetitions) Middle Band

<-107dBm (Total without repetitions) Band 5/12 Band 2 Copyright Shanghai Mobiletek Communication Ltd 33 LYNQ L620 Hardware Design 6. Storage and Production 6.1 Storage The rank of moisture proof of the module is level 3. There is an obvious sign on the table of the internal and the external packaging. In the vacuum sealed bag, the module can be stored for 180 days when the temperature is below 40and the humidity is below 90% under good air circulation. Humidity level is descripted detail as follows:

Table 6-1 Humidity level Rank Factory Environment +30C /60%RH 1 2 2a 3 4 5 5a 6 No controll < 30C /85%RH One year 4 weeks 168 hours 72 hours 48 hours 24 hours Baking before using, SMT during the time table signs Notes: Moving, storage, production of module must meet the demand of IPC/JEDEC J-STD-033. 6.2 Production The module is a humidity sensitive device. If the device needs reflow soldering, disassembly and Copyright Shanghai Mobiletek Communication Ltd 34 LYNQ CONFIDENTIAL L620 Hardware Design maintenance, we must strictly comply with the requirements of humidity sensitive device. If module is damp, a reflow soldering or using a hot-air gun maintenance will lead to internal damage, because the water vapor has the rapid expansion of the burst, causing physical injury to the device, like PCB foaming and BGA component fail. So customers should refer to the following recommendations. 6.2.1 Module confirmation and moisture The module in the production and packaging process should be strictly accordance with the humidity sensitive device operation. The factory packaging is vacuum bag, desiccant, and humidity indicator card. Please pay attention to the moisture control before SMT and the confirmation of the following aspects. Demand of Baking confirmation Smart module uses vacuum sealed bag, which can make it stored for 6 months under the condition of temp 30C and humidity < 60%. The module should be baked before reflowing soldering if any of the conditions below happen. 1. Storage exceeds the time limit. 2. Package damages and vacuum bags have air leakage. 3. Humidity indicating card change the color at 10%. 4. Module is placed naked in the air over 168 hours. 5. Module is placed naked in the air under 168 hours but not temp 30C and humidity < 60%. Baking condition confirmation The moisture proof level of the smart module is level 3. And the baking conditions are as follows. Table 6-2 Baking conditions Copyright Shanghai Mobiletek Communication Ltd 35 LYNQ CONFIDENTIAL L620 Hardware Design Baking conditions 120C / 5%RH 40C / 5%RH Baking time 4 hours 30 days Description not use the original tray Can use the original tray Notes: The original anti-ESD tray temperature does not exceed 50C. Otherwise the tray will be deformed. The anti-ESD tray of the original packaging is only used for packaging, and cant be used as a SMT tray. During taking and placing, please take notes of ESD and cannot be placed as overlay. Customer product maintenance If maintenance module after SMT, it is easy for damp module to damage when removing, so the module disassembly and other related maintenance operations should complete within 48 hours after SMT, or need to bake and then maintenance the module. Because the module return from the field work cant ensure the dry state, it must be baked in accordance with the conditions of baking, then for disassembly and maintenance. If it has been exposed to the humid environment for a long time, please properly extend the baking time, such as 125C /36 hours. 6.2.2 SMT reflow attentions The module has the BGA chips, chip resistances and capacitances internally, which will melt at high temperature. If module melt completely encountered a large shock, such as excessive vibration of reflux conveyor belt or hit the board, internal components will easily shift or be false welding. So, using intelligent modules over the furnace need to pay attention to:

Modules cant be vibrate larger, namely customer requirements as far as possible in orbit (chain) Copyright Shanghai Mobiletek Communication Ltd 36 LYNQ CONFIDENTIAL 6.2.3 SMT stencil design and the problem of less tin soldering L620 Hardware Design furnace, furnace, avoid on the barbed wire furnace, in order to ensure smooth furnace. The highest temperature cant too high. In the condition that meet the welding quality of customer motherboard and module, the lower furnace temperature and the shorter maximum temperature time, the better. Some customers temperature curve in the line is not suitable, high temperature is too high, and customer motherboard melt good, but non-performing rate is on the high side. Through the analysis of the causes, it found that melt again of BGA components lead device offset and short circuit. After adjusting the temperature curve, it can ensure that the customers motherboard the welding quality, and also improve the pass through rate. Non-performing rate is controlled below the 2/10000. CONFIDENTIAL LYNQ Suggest use ladder stencil, which means the depth of the region of module is thicker than other areas. Please adjust validation according to the measured thickness of solder paste, the actual company conditions and experience value. The products need to strictly test. Stencil: Reference module package, and the user can adjust according to their company experience; Outside of the module, the stencil extends outside. The GND pads use the net Part of customers found false welding or circuit short when reflowing. The main reason is module tin less, PCB distortion or tins too large. Suggestions are as follows:

If customer motherboard is thin and slender with a furnace deformation, warping risks, you will be suggested to create "a furnace vehicle" to ensure the welding quality. Other production proposals are as follows:

The solder pastes use brands like Alfa. Copyright Shanghai Mobiletek Communication Ltd 37 stencil. 6.2.4 SMT attentions L620 Hardware Design The module must use the SMT machine mount (important), and do not recommend manually placed or manual welding. For SMT quality, Please ensure the necessary condition according to actual condition of factory before SMT, like SMT pressure, speed (very important), stencil ways. We must use the reflow oven more than 8 temperature zones, and strictly control the furnace temperature curve. Recommended temperature:

B. constant temperature zone: temperature 140-190C, time: 60s-120s. E. recirculation zone: PEAK temperature 235-250C, time over 220C: 45s-75s. Notes: customers board deformation must be controlled well. By reducing the number of imposition or increasing patch clamp to reduce the deformation. Module thickness of the stencil is recommended to be thickened, and the rest position can be maintained by 0.1mm. LYNQ CONFIDENTIAL Copyright Shanghai Mobiletek Communication Ltd 38 LYNQ FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. ISED RF exposure statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator&

your body.This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Le rayonnement de la classe b repecte ISED fixaient un environnement non contrls.Installation et mise en uvre de ce matriel devrait avec changeur distance minimale entre 20 cm ton corps.Lanceurs ou ne peuvent pas coexister cette antenne ou capteurs avec dautres. End Product Labeling:

The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: "Contains Transmitter Module FCC ID:2AK9DL620/24342-L620 or Contains FCC ID:2AK9DLL620/24342-L620 , Any similar wording that expresses the same meaning may be used. tiquetage du produit final L'extrieur des produits finaux qui contient cette.Le module doit afficher une tiquette faisant rfrence au module ci-joint. Cette tiquette extrieure peut utiliser un libell tel que: "Contient le module metteur FCC ID:2AK9DL620/IC:24342-L620 ,Contient FCC ID:2AK9DL620/IC:24342-L620 RTout libell similaire qui exprime la mme signification peut tre utilis . 6LQJOH0RGXODU$SSURYDO2XWSXWSRZHULVFRQGXFWHG7KLVGHYLFHLVWREHXVHGLQPRELOHRUIL[HG

DSSOLFDWLRQVRQO\$QWHQQDJDLQLQFOXGLQJFDEOHORVVPXVWQRWH[FHHG7 G%L @ FDD (Band 4), 0.5dBi@NB-IoT(Band2) 9.5dBi 9.81 @ FDD (Band 12) and 10.57 @ FDD (Band 13) IRUWKHSXUSRVHRIVDWLVI\LQJWKHUHTXLUHPHQWVRI&)5

16.45dBi@NB-IoT(Band5),11.27dBi@NB-IoT(Band12), 0dBi@NB-IoT(Band5), 0dBi@NB-IoT(Band12),

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For IC , to meet RF exposure & ERP/ERIP, the maximum net gain of antennas allowed are 9.5 dBi

@ NB-IoT(Band 2), 9.08 dBi @ NB-IoT (Band 5) and 7.21 dBi @ NB-IoT (Band 12). The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

EXHIBIT B - EUT INTERNAL PHOTOGRAPHS EUT Shielding off View EUT Bottom View

EXHIBIT B - EUT INTERNAL PHOTOGRAPHS EUT Shielding off View EUT Bottom View

EXHIBIT A - EUT EXTERNAL PHOTOGRAPHS EUT Top View EUT Bottom View

EXHIBIT A - EUT EXTERNAL PHOTOGRAPHS EUT Top View EUT Bottom View EUT with Debug Board View Antenna Port EUT

LYNG 1620 PID:000-00-00000 mie IMEI:869858030000658 SN:P4H90102000001 FCC ID: 2AK9DL620 IC: 24342-1620

Company: Shanghai MobileTek Communication Ltd. Add: Free Trade Zone No. 33, No. 17 building 6H Xiya Road, Shanghai, 200131 China Tel: +86-18616835910 Fax: +86-21-54451877 E-mail: b.yang@mobiletek.cn FCC Authorization Date: 2019-10-16 FEDERAL COMMUNICATIONS COMMISSION Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Subject: Agent Authorization To whom it may concern:

We, Shanghai MobileTek Communication Ltd., the undersigned, Hereby authorizes Bay Area Compliance Laboratories Corporation to act on its behalf in all matters relating to application for Equipment authorization, including the signing of all documents relating to these matters. All acts carried out by Bay Area Compliance Laboratories Corp. on our behalf shall have the same effect as our own action. We, the undersigned, hereby certify that we are not subject to a denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. This authorization is valid until further written notice from the applicant. Sincerely Yours, Typed or Printed Name: bin yang Signature:

Title: manager QA-FR-170-B

Company: Shanghai MobileTek Communication Ltd. Add: Free Trade Zone No. 33, No. 17 building 6H Xiya Road, Shanghai, 200131 China Tel: +86-18616835910 Fax: +86-21-54451877 E-mail: b.yang@mobiletek.cn DECLARATION FEDERAL COMMUNICATIONS COMMISSIONS Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Dear Sir or Madam:

We, Shanghai MobileTek Communication Ltd. hereby declare that product name : NB-IoT Module (model name: L620, L620DPG. FCC ID: 2AK9DL620). L620 and L620DPG are electrically identical with the same electromagnetic emissions and electromagnetic compatibility characteristics. L620 have been tested by BACL. The differences of them are as follows:

model name. Please contact me if there is need for any additional clarification or information. Best Regards, Signature:

Print Name: bin yang Title: manager

Company: Shanghai MobileTek Communication Ltd. Add: Free Trade Zone No. 33, No. 17 building 6H Xiya Road, Shanghai, 200131 China Tel: +86-18616835910 Fax: +86-21-54451877 E-mail: b.yang@mobiletek.cn Date: 2019-10-16 FEDERAL COMMUNICATIONS COMMISSIONS Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Subject: Description of Permissive Change Dear Sir/Madam, We, Shanghai MobileTek Communication Ltd. hereby authorize Bay Area Compliance laboratory Corp to act as a laboratory for testing and test report generation for the following project(s):

FCC ID: 2AK9DL620 Model Name: L620 Original Grant Date: 11/22/2018 1. Add the series model: L620DPG. 2. Add the NB-IoT Band 4 by upgrading firmware. We affirm that between BACL and Shanghai MobileTek Communication Ltd., any difference in understanding, including test plan, measurement methods, applicable standards and relevant procedures and processes have been resolved prior to commencement of testing activities. This authorization is valid until further written notice from the applicant. Sincerely, Signature:

Typed or Printed Name: bin yang Title: manager

Company: Shanghai MobileTek Communication Ltd. Add: Free Trade Zone No. 33, No. 17 building 6H Xiya Road, Shanghai, China 200131 Tel: +86-18616835910 Fax: +86-21-54451877 FCC Confidential Authorization 2018-06-11 FEDERAL COMMUNICATIONS COMMISSIONS Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Subject: Confidentiality Request regarding application for certification of FCC ID: 2AK9DL620 In accordance with Sections 0.457 and 0.459 of the Commissions Rules, Shanghai MobileTek Communication Ltd. hereby requests long-term confidential treatment of information accompanying this application as outlined below:

Block Diagram Schematics Operation Description Bom Tune up procedure As well as short-term (180 days )confidential treatment of information accompanying this application as outlined below:

Internal Photos Users Manual External Photos Test Set-up Photos The above materials contain proprietary and confidential information not customarily released to the public. The public disclosure of these materials provides unjustified benefits to its competitors in the market. Sincerely Yours, Signature:

Typed or Printed Name: bin yang Title: manager QA-FR-172-A

Company: Shanghai MobileTek Communication Ltd. Add: Free Trade Zone No. 33, No. 17 building 6H Xiya Road, Shanghai, China 200131 Tel: +86-18616835910 Fax: +86-21-54451877 Applicant FCCID:

Request Approval Shanghai MobileTek Communication Ltd. 2AK9DL620 Section15.212ModularTransmitters for Modular RequestforLimitedModularApproval Requirements EUTConditions Comply(Y/N) SingleModularApprovalRequirements Y Y Y Y The shielding of the radio portion can be demonstrated in EXHIBIT B External Photo. The modular transmitter have buffered modulation/data inputs, Buffered data inputs stage has been integrated in chip(MT2625), RefertoSchematics. The modular rated power is 3.3V.RefertoUser manual. The modular transmitter doesn't have antenna connector which is accessible by user. please refer to :External photograph" exhibit. The maximum antenna gain for LTE:9.0 dBi @ FDD (Band 2), 10.41 dBi @ FDD (Band 5) and 9.69dBi @ FDD (Band 12). 1 2 3 4 to the requirements The radio elements of the modular transmitter must have their own shielding. The physical crystal and located tuning capacitors may be external shielded radio elements. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure thatthemodulewillcomplywithpart 15.247 under conditions of excessive data rates or overmodulation. The modular transmitter must have its own power supply regulation. transmitter must The modular comply with the antenna and transmission system requirements of 15.203, 15.204(b) and 15.204(c). The either be permanently attached or employ a unique antenna coupler (at all connections between the module and the cable).Theprofessionalinstallation provisionof15.203isnotapplicable to modules but can apply to limited modular approvals under paragraph

(b)ofthissection. antenna must the antenna, including Themodulartransmitteris connectedtothecontrolled boardwhentesting. Pleaserefertosetupphoto. Y FCC ID is shown on the label and permanently affixed to this modular transmitter,please Refertothelabeldrawing. Y 5 6 tested Unless testing The modular transmitter must be in a standalone configuration, i.e., the module must not be inside another device for during compliance with part 15.247 requirements. the transmitter module will be batterypowered,itmustcomply with the AC line conducted requirements found in 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical ofactualuseor,ifthatlengthis unknown, 10 centimeters to insure that there isnocouplingbetweenthecase of the module and supporting equipment. Any accessories, peripherals, support equipment connected to the module during testing shall be unmodified and commercially available(see15.31(i)). least or at If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number isnotvisiblewhenthemoduleis installed inside another device, then the outside of the device into which is installed must also display a label referring to the enclosed module. This exterior label can use wording the following: Contains Transmitter the module such as ModuleFCCID:2AK9DL620", Any similar wording that expresses thesamemeaningmaybeused. The Grantee may either provide such a label, an example of which must be included in the application authorization, or, must provide adequateinstructionsalongwith the module which explain this requirement.Inthelattercase,a copy of these instructions must beincludedintheapplicationfor equipmentauthorization. for equipment 7 8 requirements The modular transmitter must complywithanyspecificrulesor operating that ordinarily apply to a complete the transmitter and manufacturer must provide adequateinstructionsalongwith the module to explain any such requirements. A copy of these instructionsmustbeincludedin the application for equipment authorization. The modular transmitter must comply with any applicable RF exposure requirements its finalconfiguration. in Y The necessary explanation to be complied with this requirement is contained in the user manual, please referstothe User manual. The modular comply with any applicable RF exposure requirements in its final configuration. Y Sincerely Yours, Signature:

Typed or Printed Name: bin yang Title: manager

Company: Shanghai MobileTek Communication Ltd. Add: Free Trade Zone No. 33, No. 17 building 6H Xiya Road, Shanghai, China 200131 Tel: +86-18616835910 Fax: +86-21-54451877 FCC Authorization Date: 2018-06-11 FEDERAL COMMUNICATIONS COMMISSION Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Subject: Agent Authorization To whom it may concern:

We, Shanghai MobileTek Communication Ltd, the undersigned, Hereby authorizes Bay Area Compliance Laboratories Corporation to act on its behalf in all matters relating to application for Equipment authorization, including the signing of all documents relating to these matters. All acts carried out by Bay Area Compliance Laboratories Corp. on our behalf shall have the same effect as our own action. We, the undersigned, hereby certify that we are not subject to a denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. This authorization is valid until further written notice from the applicant. Sincerely Yours, Signature:

Typed or Printed Name: bin yang Title: manager QA-FR-170-B