6189N
Module manual 6189N Customer Approval :
Company Title Signature Date Fn-Link Revision History Version Date Revision Content Approved 1.0 1.1 1.2 1.3 2019/01/10 New version 2019/04/10 Update thickness dimension 2019/08/06 Update packing information 2019/11/12 Update module photo 6189N-SFC Draft Lzm Lxy Lxy Lxy Lxy Szs Szs Szs F 6189N-SFC CONTENTS 1 Overview....................................................................................................................................1 1.1 Introduction......................................................................................................................... 1 1.2 Features.............................................................................................................................. 1 1.3 General Specification........................................................................................................ 2 1.4 Recommended Operating Rating....................................................................................2 1.5 EEPROM Information....................................................................................................2 2 General Specification.............................................................................................................2 2.1 Wi-Fi RF Specifications.....................................................................................................2 3 Pin Assignments..................................................................................................................... 3 3.1 Pin Outline...........................................................................................................................3 3.2 Pin Definition.......................................................................................................................4 4 Dimensions...............................................................................................................................5 4.1 Module Picture................................................................................................................... 5 4.2 Marking Description...........................................................................................................5 4.3 Module Physical Dimensions........................................................................................... 6 4.4 Layout Reference...............................................................................................................7 6 Host Interface Timing Diagram............................................................................................8 6.1 SDIO Pin Description........................................................................................................ 8 6.2 SDIO Default Mode Timing Diagram.............................................................................. 9 6.3 SDIO Power-on sequence................................................................................................9 7 Reference Design................................................................................................................. 10 8 Ordering Information........................................................................................................... 11 9 The Key Material List........................................................................................................... 11 10 Environmental Requirements..........................................................................................11 10.1 Recommended Reflow Profile..................................................................................... 11 10.2 Patch Wi-Fi modules installed before the notice...................................................... 12 11 Package................................................................................................................................. 13 11.1 Reel..................................................................................................................................13 11.2 Packaging Detail............................................................................................................ 13 F 6189N 1 Overview 1.1 Introduction 6189N-SFC is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO network interface device. High-speed wireless connection up to 150 Mbps. It can be easily manufactured on SMT process. This WLAN Module design is based on Realtek RTL8189FTV-VC-CG. It is a highly integrated single-chip Wireless LAN (WLAN) SDIO network interface controller complying with the 802.11n specification. It combines a MAC, a 1T1R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective. This compact module is a total solution for Wi-Fi technology. The module is specifically developed for Smart phones and Portable devices. 1.2 Features WLAN Operate at ISM frequency bands (2.4GHz) CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatible Wi-Fi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates 1 6189N 1.3 General Specification Model Name 6189N Product Description S Dimension Wi-Fi Interface L x W x T: 23 x 21 x 4.8 (typical) mm Support SDIO Operating temperature 0C to 70C Storage temperature
-55C to +125C 1.4 Recommended Operating Rating Operating Temperature VBAT VDDIO Min. Typ. Max. Unit 0 3.0 1.7 25 3.3 1.8 or 3.3 70 3.6 3.6 deg.C V V 1.5 EEPROM Information WI-FI Vendor ID Product ID 024C F179 2 General Specification 2.1 Wi-Fi RF Specifications Features Main Chipset Operating Frequency Operating Voltage Host Interface WIFI Standard Descriptions Realtek RTL8189FTV-VC-CG 2.4002.4835GHz 3.3Vdc 10% I/O supply voltage SDIO/GSPI Wi-Fi:
IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, Modulation Wi-Fi:
802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps), 802.11 g/n: OFDM FN-LINK TECHNOLOGY LIMITED 2 Proprietary & Confidential Information PHY Data rates Wi-Fi:
6189N-SFC 802.11b: 11, 5.5, 2, 1 Mbps 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps 802.11n: up to 150Mbps 802.11b@11Mbps 152dBm 802.11g@54Mbps 142dBm 802.11n@65Mbps 142dBm Other rate power control by power by rate. Transmit Output Wi-Fi:
Power EVM 802.11b /11Mbps: EVM-9dB 802.11g /54Mbps: EVM-25dB 802.11n /65Mbps: EVM-28dB 802.11b@8% PER Receiver Sensitivity
(HT20) 11Mbps< -82dBm 802.11g@10% PER 54Mbps< -71dBm 802.11n@10% PER MCS 7 <-67dBm Operating Channel Wi-Fi 2.4GHz:
11: (Ch. 1-11) United States(North America) 13: (Ch. 1-13) Europe 14: (Ch. 1-14) Japan Media Access Control Wi-Fi: CSMA/CA with ACK Network Architecture Wi-Fi: Ad-hoc mode (Peer-to-Peer ) Infrastructure mode Software AP Wi-Fi Direct Security Antenna On Board antenna Wi-Fi: WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, OS Supported Android /Linux/ Win CE /iOS /XP/WIN7 Dimension Typical L x W x H 23x21x4.8mm 3 Pin Assignments 3.1 Pin Outline
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F 6189N GND 1 GND GND 2 3 19 GND 18 GND 17 GND 5 N C 4 V B A T 7 G N D 6 V D D O I 8 I C H P _ E N 9 10 12 13 14 15 11 S D _ D 3 S D _ D 2 S D _ C M D S D _ C L K S D _ D 0 S D _ D 1 16 G N D W L _ W A K E _ H O S T 3.2 Pin Definition NO. Type Description Voltage Name GND GND GND VBAT NC VDDIO GND CHIP_EN SD_D2 SD_D3 SD_CMD SD_CLK Ground connections Ground connections Ground connections P P I I/O I/O I/O I/O I Supply 3.3V 3.3V Floating (Dont connected to ground) 3.3V I/O Voltage supply input 1.8V to 1.8V ~ 3.3V Ground connections Wi-Fi enable pin, default pull high 3.3V SDIO Data line 2 SDIO Data line 3 SDIO Command Input SDIO Clock Input 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 9 WL_WAKE_HOST WLAN to wake-up HOST 1 2 3 4 5 6 7 8 10 11 12 13 F I/O I/O 14 15 16 17 18 19 SD_D0 SD_D1 GND GND GND GND SDIO Data line 0 SDIO Data line 1 Ground connections Ground connections Ground connections Ground connections 6189N-SFC 1.8V ~ 3.3V 1.8V ~ 3.3V 4.2 Marking Description F 4.3 Module Physical Dimensions 6189N-SFC 23 2.65 1 4.15 5.65 11.5 0.7 0.35 1.15 2.65 4.15 5.65 7.15 8.65 10.5 21 6 4.4 Layout Reference
(unit: mm ) 6189N-SFC 23 2.65 1 4.15 5.65 11.75 0.7 0.35 1.15 2.65 4.15 5.65 7.15 8.65 10.75 21 F 6189N-SFC 6 Host Interface Timing Diagram 6.1 SDIO Pin Description The module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps), and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This out-of-band interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK CMD Clock Command Line F 6.2 SDIO Default Mode Timing Diagram 6189N-SFC 6.3 SDIO Power-on sequence Symbol T33ramp Toff T33ramp T12ramp TPOR Tnon_rdy Min 0.2 250 0.2 0.1 2 1 Max No Limit 1000 2.5 1.5 8 10 Unit ms ms ms ms ms ms Typical
500 0.5 0.5 2 2 9 FN-LINK TECHNOLOGY LIMITED Proprietary & Confidential Information 7 Reference Design 6189N-SFC 1. chip_EN could not use for module power off, please switch the 3.3V power for module on/off. 2.please keep the antenna on no metal area. Note:
F 8 Ordering Information Part No. FG6189NSFC-00 Description RTL8189FTV-VC-CG b/g/n, Wi-Fi, 1T1R, 23X21mm, SDIO, PCB V1.0 with antenna 6189N-SFC 9 The Key Material List Shielding 6189N-SFC V1.0 Shielding cover no insulation layer cover 14.79x10.72-full height of 1.4 copper, no positioning pin Main Crystal 26mhz 3225 10ppm, 10.5pF, E3SB26E00002SE10C0BB
(HOSONIC) ESD 0402 5.5V 0.1pF GESD1005H5R5CR10GPT(Sunlord) Main Main Main Chipset RTL8189FTV-VC-CG 10 Environmental Requirements 10.1 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250C Number of Times : 2 times F 10.2 Patch Wi-Fi modules installed before the notice 6189N-SFC Wi-Fi module installed note:
When open a stencil. 1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 , relative humidity: < 90% r.h. 2. The module vacuum packing once opened, time limit of the assembly:
Card:1) check the humidity display value should be less than 30% (in blue), such as:
30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption. 2.) factory environmental temperature humidity control: -30 , 60% r.h.. 3). Once opened, the workshop the preservation of life for 168 hours. 3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 , 8 hours. 3). After baking, put the right amount of desiccant to seal packages. F 11 Package 11.1 Reel A roll of 350pcs 6189N-SFC 11.2 Packaging Detail the take-up package Size of black tape:44mm*12.48m the cover tape :37.5mm*12.48m Using self-adhesive tape Color of plastic disc:blue A roll of 350pcs F 6189N-SFC NY bag size:420mm*450mm size 335*335*55mm The packing case size:335*255*360mm F RF Exposure Information and Statement This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 5 FCC and IC Statement This device complies with part 15 of the FCC rules and RSS-247 of Industry Canada. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de la classe B est conforme la norme NMB-003 du Canada. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital These limits are designed to provide reasonable device, pursuant to part 15 of the FCC Rules. protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help
- This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. Instructions to the OEM/Integrator:
This module has been granted modular approval for mobile applications. OEM integrators for host products may use the module in their final products without additional FCC/ISED (Innovation, Science and Economic Development Canada) certification if they meet the following conditions. Otherwise, Additional FCC/IC approvals must be obtained. The OEM must comply with the FCC labeling requirements. If the modules label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: Contains transmitter module FCC ID: 2ASV9-6189N. Additionally, the following statement should be included on the products user manual:
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation. label and in the final The users manual for the host product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC / IC RF exposure guidelines. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. This Module is full modular approval, it is limited to OEM installation ONLY. The module is limited to installation in mobile application. A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. The OEM integrator is responsible for ensuring that the end-user has no manual instruction The Grantee will provide guidance to the Host Manufacturer for compliance with the Part to remove or install module. 15B requirements if requested. Any modifications made to the module will void the Grant of certification ,including radiated antenna replacement ,the OEM integrator will be responsible for re-evaluating emission of part 15C,and obtain a separate FCC authorization. IC labeling requirement for the final end product:
The final end product must be labeled in a visible area with the following Contains IC:
24909-8188U1PS The Host Marketing Name (HMN) must be indicated at any location on the exterior of the host product or product packaging or product literature, which shall be available with the host product or online. Le produit final doit tre not dans une zone visible Contains IC: 24909-6189N Le nom du prsentateur (HMN) doit tre indiqu dans toute location sur le nom du produit hte ou du label ou de la littrature du produit, Qui doit tre disponible avec le produit hte ou en ligne.