SPECIFICATION 20800D8-04V1.0&1ANT IEEE 802. 11 Wi-Fi Integrated Approved by Company Checked by Rechecked by Approved by Please send the original back to us after you have approved and signed. Approved by customer Comments Approved b y l Companys sea Customers Name:
REVISION HISTORY VERSION DATE BOARD ID PAGE DESCRIPTI ON AUTHOR V1.0 2023.05.27 AIC8800D40 1. Introduction 20800D8-04 module is based on AIC8800D40 solution. 20800D8-04 is a combo low-power, and high-integrated wireless communication module which is designed for meeting the customers needs of high-performance band dual small size and low cost. This module supports both WLAN and functions. Its WLAN/function supports the USB2.0/SDIO3.0 interface, and its BT function supports the UART interface, and the module meets the requirements of standard protocol IEEE 802.11 . Such units as power management, power amplifier and low- noise amplifier are integrated in the main chip of the module. Its WLAN PHY rate is up to 2 8 6 . 8 Mbps@TX. The module can be applied in smart sound boxes, set-
top boxes,game machines, printers, IP cameras, tachographs, and other smart equipment. This documentation describes the engineering requirements specification. 20800D8-04 AIC8800D40 20800D8-04 WLAN WLAN/BT USB2.0 / SDIO3.0 UART IEEE 802.11 2. Features Reserving System Chip Solution Band Dimensions IEEE Std. 802.11b IEEE Std. 802.11g IEEE Std. 802.11n IEEE Std. 802.11ax AIC8800D40 2.4GHz 12mm12mm1.85mm Antenna Stamp Hole Installation Mode SMD Remark 2 4. Package Outline and Mountin g 3 5. Pin Definition PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 SYMBOL GND WL_ANT GND NC NC GPIOB5/HOST_WAKE GPIOB3/WAKE_HOST NC VBAT NC NC PWR_WF WL_WAKE_HOST SDIO_D2 SDIO_D3 SDIO_CMD SDIO_CLK SDIO_D0 SDIO_D1 GND NC VIO NC NC PCM_OUT PCM_CLK PCM_IN DESCRIPTION Connected to Ground 2.4&
Connected to Ground
GPIO/
GPIO/
3.3V
PWR_KEY WIFI I/O I/O I/O I/O I/O I/O Connected to Ground
3.3V/1.8V
I/O I/O I/O 4 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 PCM_SYNC UART0_TX UART0_RX GND NC GND PWR_ NC GND NC NC NC NC UART1_RTS UART1_TX UART1_RX UART1_CTS 6. Product Pictures I/O I/O I/O Connected to Ground
Connected to Ground GPIO/_DIS GPIO Connected to Ground
I/O I/O I/O I/O
(Top view
(Bottom view 5 7. Key Materials
1 2 3 4 AIC8800D40 QFN48 AIC PCB 8. General Requirements No. 8-1 8-2 8-3 8-4 8-5 8-6 8-7 Feature Operation Voltage Current Consumption Ripple Operation Temperature Antenna Type Interface Description 3.3V0.3 580mA 120mV
-20C to +40C External antenna SDIO3.0/USB2.0/PCM/UART Storage Temperature
-40C to +85C 9. Electrical Characteristics
255 ;
3.3V(10%
The Test for electrical specification was performed under the following condition unless otherwise specified. Ambient condition Temperature :25 5;
Power supply voltages3.3V (10%) input power at the Module;
9.1 IEEE 802.11b Section (2.4GHz) Items Specification Mode Channel Data rate Contents IEEE802.11b CCK CH1 to CH13 1, 2, 5.5, 11Mbps TX Characteristics Min. Typ. Max. Unit Remark 1. Power Levels at each rate 6
(1Mbps~11Mbps) 2. Spectrum Mask @ target power 1) fc 11MHz to 22MHz 2) fc > 22MHz 3. Constellation Error(EVM)@ target power 1) 1Mbps 2) 2Mbps 3) 5.5Mbps 4) 11Mbps 4. Frequency Error RX Characteristics 5. Minimum Input Level Sensitivity 1) 1Mbps (FER 8%) 2) 2Mbps (FER 8%) 3) 5.5Mbps (FER 8%) 4) 11Mbps (FER 8%) 6. Maximum Input Level (FER 8%)
-20 Min.
-10
Typ.
-30
-50
-9.11
-9.11
-9.11
-9.11 20 Max.
-83
-80
-79
-76
dBr dBr dB dB dB dB ppm Unit dBm dBm dBm dBm dBm 9.2 IEEE 802.11g Section (2.4GHz) Items Specification Mode Channel Data rate Contents IEEE802.11g OFDM CH1 to CH13 6, 9, 12, 18, 24, 36, 48, 54Mbps TX Characteristics Min. Typ. Max. Unit Remark 1. Power Levels 1) For antenna port54M 2. Spectrum Mask @ target power 1) at fc +/-11MHz 2) at fc +/-20MHz 3) at fc > +/-30MHz 3 Constellation Error(EVM)@ target power 1) 6Mbps 2) 9Mbps 3) 12Mbps 4) 18Mbps 5) 24Mbps 6) 36Mbps 7) 48Mbps 8) 54Mbps 4 Frequency Error
-20
-28
-40
-5
-8
-10
-13
-16
-19
-22
-25 20 dBr dBr dBr dB dB dB dB dB dB dB dB ppm
-20 7 RX Characteristics Min. Typ. Max. 5 Minimum Input Level Sensitivity 1) 6Mbps (PER 10%) 2) 9Mbps (PER 10%) 3) 12Mbps (PER 10%) 4) 18Mbps (PER 10%) 5) 24Mbps (PER 10%) 6) 36Mbps (PER 10%) 7) 48Mbps (PER 10%) 8) 54Mbps (PER 10%)
-85
-84
-82
-80
-77
-73
-69
-65 Unit dBm dBm dBm dBm dBm dBm dBm dBm 9.3 IEEE 802.11n HT20/40 Section(2.4GHz) Items Contents Specification Mode Channel Data rate (MCS index) IEEE802.11n HT20/[email protected] OFDM HT20:CH1 to CH13 HT40:CH3 to CH11 MCS0/1/2/3/4/5/6/7 TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) For antenna portMCS7 2. Spectrum Mask @target power 1) fc +/-22MHz 2) fc +/-40MHz 3) fc > +/-60MHz 3. Constellation Error(EVM)@ target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 4. Frequency Error RX Characteristics 5. Minimum Input Level Sensitivity 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%)
-20
-28
-45
-5
-10
-13
-16
-19
-22
-25
-28 20 Max. HT20 HT40
-82
-79
-77
-74
-79
-76
-74
-71 dBr dBr dBr dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm
Typ.
-20 Min.
8 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%) 6. Maximum Input Level (PER 10%)
-20
-67
-63
-62
-61
-70
-66
-65
-64
Bm dBm dBm dBm dBm 9.4 IEEE 802.11ax HE20/40 Section (2.4GHz) Items Contents Specification Mode Channel Data rate (MCS index) IEEE802.11ax HE20/[email protected] OFDMA HE20:CH1 to CH13 HE40:CH3 to CH11 MCS0/1/2/3/4/5/6/7/8/9 TX Characteristics Min. Typ. Max. Unit 1. Power Levels (Calibrated) 1) For antenna portMCS11 2. Spectrum Mask @VHT20/VHT40 target power 1) fc +/- 11MHz/21MHz/41MHz 2) fc +/-20MHz/40MHz 3) fc +/-30MHz/60MHz 3. Constellation Error(EVM)@ target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 9) MCS8 10) MCS9 11) MCS10 12) MCS11 4. Frequency Error RX Characteristics 5.Minimum Input Level Sensitivity 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%)
-20
-28
-40
-5
-10
-13
-16
-19
-22
-25
-27
-30
-32
-34
-35 20 Max. HE20 HE40
-82
-79
-77
-74
-79
-76
-74
-71 dBr dBr dBr dB dB dB dB dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm
Typ.
-20 Min.
9 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%) 9) MCS8(PER 10%) 10) MCS9(PER 10%) 11) MCS10(PER 10%) 12) MCS11(PER 10%) 6. Maximum Input Level (PER 10%)
-30
-67
-63
-62
-61
-56
-54
-51
-49
-70
-66
-65
-64
-59
-57
-54
-51
dBm dBm dBm dBm dBm dBm dBm dBm dBm 10 10. Reference Design 10.1 DC Electrical Characteristics Symbol Description conditions Min. Typ. Max. Unit VDD33 VDDIO IVDD33 IVDDIO VIH VIL VOH VOL RPU RPD Power supplies I/O input power supplies Power supply current I/O supply current High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Internal pull-up resistor Internal pull-down resistor
3.0 3.0 1.7
VDDIO=3.3V
VDDIO*0.625 VDDIO=1.8V VDDIO*0.65 VDDIO=3.3V VDDIO=1.8V
-0.3 VDDIO=3.3V VDDIO-0.4 VDDIO=1.8V VDDIO-0.2 VDDIO=3.3V VDDIO=1.8V VDDIO=3.3V VDDIO=1.8V VDDIO=3.3V VDDIO=1.8V
-0.3 40 10 40 10 3.3 3.3 1.8
75 50 75 50 3.6 3.6 1.9 800 50 VDDIO+0.3 VDDIO*0.25 VDDIO*0.35 VDDIO+0.3 0.4 0.2 190 100 190 100 V V mA mA V V V V k k 15 11. Mechanical,Environmental and Reliability Tests Test Items Test Conditions Qty Criteria Condition 11-1 Drop test The packed samples within 100Kg can be tested Drop height:
Face Side: 800/600/450mm Edge line: 600/450/350mm Drop time: 1 each Face and edge. X-Y-Z direction, first Frequency changing from 10Hz to 30Hz to 10Hz,amplitude 0.75mm, Vibration 5 times vibrations, then 11-2 test 11-3 Impact test frequency Changing from 30Hz to 55 Hz to 30 Hz, amplitude 0.15mm, 5 time vibration. Impact acceleration:
50m/sec2;
Impact duration: 16ms Impact times: 1000. Soldering 11-4 ability test Soldering temperature:
2355 Soldering duration:
20.5S Humidity Leave samples in 403, 11-5 test 93% RH @ 96 hours After drop test, the outer box and inner box will not been broken by appearance visual inspection. 1xBox 3 3 3 3 After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification. After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification. 1 . After soldering, the soldered area must be covered by a smooth bright solder layer, some deficiencies such as a small amount of the pinhole, not wetting are allowed, but the deficiencies can not be in the same place 2 . At least 90% of soldered area shall be covered continuously by the soldering material. Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error functional parameter shall be satisfied with the test specification. 17 11-6 High Thermostat cabinet temperature:
temperature load life test 555 After test, leave samples in standard 60 condition for 1 hour and test, Power, EVM and Frequency error shall be satisfied Applied voltage:
with the test specification. 110% rated voltage Working duration: 200 hour (Supply Voltage Cycle 23h power on, 1h power off) High 11-7 temperature load test Low temperature storage 11-8 Temperature: 555 Samples work for 16 hours Leave the samples in
-253@24 hours After test, the Appearance, Power, EVM and Frequency error shall be Satisfied with the test specification. 3 Leave samples in standard test condition for 2 hours then test, the Appearance, 3 Power, EVM and Frequency error shall be satisfied with the test specification. test Low 11-9 temperature load test 11-10 Temperature circle test ContinuousTP 11-11 test Leave samples in -
153@ 2 hours, samples function shall be normal, the let samples work for 1 hour One cycle duration
-103@3H 403 @3H Total cycle: 10x Twice cycle duration
-103@4H
+603@4H,
+25@2H@2H Discharge voltage:
1kV C: 150pF 11-12 ESD Discharge resistance 330 Positive10 times 1 time for each second After test, leave the samples in standard condition and tested the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification. After test, leave the samples in standard condition and tested Power EVM and Frequency error shall be qualified and all the characters shall be satisfied with the test specification. During test, There will not been appeared signal disconnection or interruption between DUT and AP. The products can recoverable smoothly after ESD test. 3 3 3 3 18 12. Package () 1 19 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursua nt to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful inte rference in a residential installation. This equipment generates uses and can radiate radio frequency energy a nd, if not installed and used in accordance with the instructions, may cause harmful interference to radio com munications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turn ing the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receivingantenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help important announcement Important Note:
Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/Canada. This device is intended only for OEM integrators under the following conditions:
1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2. The transmitter module may not be co-located with any other transmitter or antenna, 3. For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. (if modular only test Channel 1-11) As long as the three conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Important Note:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following"
Contains FCC ID: 2BL2Z20800D8-04"
Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01r01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. 2.4 Limited module procedures Not applicable 2.5 Trace antenna designs Not applicable 2.6 RF exposure considerations This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. 2.7 Antennas This radio transmitter to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. has been approved by Federal Communications Commission FCC ID: 2BL2Z20800D8-04 Antenna No. Model No. of antenna:
Type of antenna:
Gain of the antenna
(Max.) Frequency range:
2.4G Wi-Fi
FPC Antenna 1.82 2400-2500MHz 2.8 Label and compliance information The final end product must be labeled in a visible area with the following" Contains FCC ID: 2BL2Z20800D8-04". 2.9 Information on test modes and additional testing requirements Host manufacturer is strongly recommended to confirm compliance with FCC requirements for the transmitter when the module is installed in the host. 2.10 Additional testing, Part 15 Subpart B disclaimer Host manufacturer is responsible for compliance of the host system with module installed with all other applicable requirements for the system such as Part 15 B. 2.11 Note EMI Considerations Host manufacture is recommended to use D04 Module Integration Guide recommending as "best practice" RF design engineering testing and evaluation in case non-linear interactions generate additional non-compliant limits due to module placement to host components or properties. 2.12 How to make changes This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. According to the KDB 996369 D02 Q&A Q12, that a host manufacture only needs to do an evaluation (i.e., no C2PC required when no emission exceeds the limit of any individual device (including unintentional radiators) as a composite. The host manufacturer must fix any failure.