2.4GHz 3216 Chip Antenna: 3216F245M02 3216 Chip antenn a For Bluetooth / WLAN Applicationsd P/N:
RANT3216F245M02 Dimension (mm) 3.23 0.20 1.66 0.20 1.23 0.20 L W T
: 13530576606 RAIN International Technology Co., Ltd. 502, No.2 Makan South Road, Xili Town, Nanshan District,ShenzhenGuangdong, China TEL: 13530576606 1 10 2.4GHz 3216 Chip Antenna: 3216F245M02 Part Number Information RANT 3216 A B F C 245 M E D 02 F Product Series Dimension L x W Material A B C D Working Frequency E F Feeding mode Antenna type Antenna 3.2X1.6mm (+-0.2mm) High K material 2.4 ~ 2.5GHz Monopole & Single Feeding Type=02 1. Electrical Specification Part Number Central Frequency Bandwidth Return Loss Peak Gain Impedance Operating Temperature Maximum Power Specification RANT3216F245M02 2450 100 (Min.)
-6.5 (Max) 3 50
-40+85 4 MHz MHz dB dBi Ohm W sec. Resistance to Soldering Heats 10 ( @ 260) Polarization Azimuth Beamwidth Termination Linear Omni-directional Cu / Sn (Leadless) RAIN International Technology Co., Ltd.
: 13530576606 TEL: 13530576606 Remark : Bandwidth & Peak Gain was measured under evaluation board of next page 2 10 2.4GHz 3216 Chip Antenna: 3216F245M02 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit RAIN International Technology Co., Ltd.
: 13530576606 TEL: 13530576606 3 10 2.4GHz 3216 Chip Antenna: 3216F245M02 Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint
(Unit : mm) RAIN International Technology Co., Ltd.
: 13530576606 TEL: 13530576606 4 10 2.4GHz 3216 Chip Antenna: 3216F245M02 3. Measurement Results Return Loss RAIN International Technology Co., Ltd.
: 13530576606 TEL: 13530576606 5 10 2.4GHz 3216 Chip Antenna: 3216F245M02 Radiation Pattern Y X Z Efficiency 2400MHz 55.21 %
2450MHz 66.45 %
2500MHz 57.53 %
RAIN International Technology Co., Ltd.
: 13530576606 TEL: 13530576606 6 10 2.4GHz 3216 Chip Antenna: 3216F245M02 4.Reliability and Test Condictions REQUIREMENTS ITEM 1. Wetting shall exceed 90% coverage Solderability 2. No visible mechanical damage TEMP () 230 150 41 sec. 60sec Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within 6%
TEMP () 260 150 100.5 sec. 60sec 1. No visible mechanical damage 1. No visible mechanical damage Component Adhesion
(Push test) Component Adhesion
(Pull test) TEST CONDITION Pre-heating temperature:150/60sec. Solder temperature:2305 Duration:41sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Pre-heating temperature:150/60sec. Solder temperature:2605 Duration:100.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin The device should be reflow soldered(2305 for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. RAIN International Technology Co., Ltd.
: 13530576606 TEL: 13530576606 7 10 2.4GHz 3216 Chip Antenna: 3216F245M02 1. No visible mechanical damage Thermal shock 2. Central Freq. change :within 6%
Phase 1 2 3 4 Temperature() Time(min)
+855 Room Temperature 303 Within 3sec
-402 Room Temperature 303 Within 3sec Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. Humidity 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. 5.Soldering and Mounting
+85=>303min
-40=>303min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature: 855 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature:-405 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature: 402 Humidity: 90% to 95% RH Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Reflow Soldering PRE-HEATING SOLDERING 10s max. NATURAL COOLING 250~260 230 180 150
) C
E R U T A R E P M E T 60~120 s 30~60s Iron Soldering PRE-HEATING SOLDERING within 3s NATURAL COOLING 350 300 150
) C
E R U T A R E P M E T TIME(sec.) TIME(sec.) Over 60s Gradual cooling Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent
: 13530576606 process control limitations. In the event that a soldering iron must be RAIN International Technology Co., Ltd. employed the following precautions are recommended. TEL: 13530576606 8 10 2.4GHz 3216 Chip Antenna: 3216F245M02 Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 280 tip temperature (max) 1.0mm tip diameter (max) Limit soldering time to 3 sec. 6.Packaging Information Tape Specification:
1.80 1.59 3.51 RAIN International Technology Co., Ltd. Reel Specification: (7, 180 mm)
: 13530576606 TEL: 13530576606 9 10 2.4GHz 3216 Chip Antenna: 3216F245M02 Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.00.5 602 13.50.5 1782 3000 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes:
1. Temperature and humidity conditions: -10~ 40 and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. RAIN International Technology Co., Ltd.
: 13530576606 TEL: 13530576606 10 10