Hi-12FL Specifications V1.0 Hi-12FL Specifications Version V1.0 Copyright 2021 Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 1 of 18 Disclaimer and copyright notice Hi-12FL Specifications V1.0 The information in this article, including the URL address for reference, is subject to change without prior notice. The documentation is provided "as is" without any warranty, including any warranties of merchantability, fitness for a particular purpose, or non-infringement, and any warranties mentioned in the proposal, specification or sample. This document is not responsible for any infringement of any patent rights arising out of the use of the information in this document. No license, express or implied, by estoppel or otherwise, is hereby granted. The test data obtained in this paper are all obtained by Ai-Thinker laboratory , and the actual results may be slightly different. The Wi-Fi alliance membership mark is owned by the WiFi alliance. All trade mark names, trademarks and registered trademarks mentioned herein are the property of their respective owners and are hereby declared. The final interpretation right is owned by Shenzhen Ai-Thinker Technology Co., Ltd. Note The contents of this manual may be changed due to the version upgrade of the product or other reasons. Shenzhen Ai-Thinker Technology Co., Ltd. reserves the right to modify the contents of this manual without any notice. This manual is only used as a guide, and Shenzhen Ai-Thinker Technology Co., Ltd. makes every effort to provide accurate information in this manual, but Shenzhen Ai-Thinker Technology Co., Ltd. does not ensure that the contents of the manual are completely true,, All statements and information in this manual. and the recommendations do not constitute for any warranty, express or implied. Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 2 of 18 Hi-12FL Specifications V1.0 Document development/revision/revocation resume Vision Data Revised content Edition Approve V1.0 2021.08.30 First Edition Peihong Su Ning Guan Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 3 of 18 Hi-12FL Specifications V1.0 Contents 1. Product Overview ..................................................................................................................... 5 1.1. Features .......................................................................................................................... 6 2.Main parameters ........................................................................................................................ 7 2.1. Electrical parameters ...................................................................................................... 7 2.2. Electrical characteristics ................................................................................................. 8 2.3. WIFI Electrical characteristics ....................................................................................... 9 2.4. Power consumption ........................................................................................................ 9 3.Appearance dimensions........................................................................................................... 11 4.Pin definition ........................................................................................................................... 12 5. Schematic diagrams................................................................................................................ 14 5.1. 5.1. Schematic diagrams of module ............................................................................. 14 5.2. 5.2. Application circuit diagram ................................................................................... 15 6.Design guidance ...................................................................................................................... 15 6.1. Antenna layout requirements ........................................................................................ 15 6.2. Power Supply ............................................................................................................... 16 7.Reflow soldering ..................................................................................................................... 17 8.Packaging information ............................................................................................................ 18 9.Product related model.............................................................................................................. 18 10.Contact us .............................................................................................................................. 18 Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 4 of 18 1. Product Overview Hi-12FL Specifications V1.0 Hi-12FL is a Wi-Fi module developed by Ai-Thinker. It can be widely used in intelligent terminal products related to the IoT, such as smart homes, smart security, and smart cities. Hi-12FL is equipped with Hi3861LV100 core processor chip. The chip is a highly integrated 2.4GHz low-power SoC WiFi chip that integrates IEEE 802.11b/g/n baseband and RF circuits. The RF circuit includes power amplifier PA, low noise amplifier LNA, RF balun, antenna switch and power supply Management and other modules. It supports 20MHz standard bandwidth and 5MHz/10MHz narrow bandwidth, and provides a maximum physical layer rate of 72.2Mbit/s. The WiFi baseband of the chip supports Orthogonal Frequency Division Multiplexing (OFDM) technology, and is backward compatible with Direct Sequence Spread Spectrum (DSSS) and Complementary Code Keying (CCK) technology, and supports various data in IEEE 802.11 b/g/n protocols rate. The Hi3861LV100 chip of the Hi-12FL module also integrates a high-performance 32-bit microprocessor,a hardware security engine, and a wealth of peripheral interfaces. The peripheral interfaces include SPIUARTI2CPWMGPIO and multiple ADC, It also supports high-speed SDIO2.0 SlaveSlave interface, the highest clock can reach 50MHz; The chip has built-in SRAM and Flash, which can run independently, and supports running programs on The Hi-12FL module supports Huawei LiteOS and third-party components, and provides an open and easy-to-use development and debugging environment. Flash. Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 5 of 18 Hi-12FL Specifications V1.0 Figure 1 Main chip architecture diagram 1.1. Features 11 2.4GHz Frequency bandch1ch11 Support all data rates of IEEE802.11b/g/n single antenna Support maximum rate72.2Mbps@HT20 MCS7 Support STBC Support Short-GI Support STA and AP formas an AP, it supports up to 6 STAs to access. Support WFA WPA/WPA2 personal, WPS2.0 High-performance 32bit microprocessor, with a maximum operating frequency of 160MHz. Integrated EFUSE internally, supports secure storage, secure boot, and hardware ID Embedded SRAM 352KB, ROM 288KB, embedded 2MB Flash Support 256 node Mesh networking Support AT command, can get started quickly Huawei LiteOS, an open operating system, provides an open, efficient and safe system development and operating environment Adopts SMD-22 package Support UART/SPI/I2C/GPIO/ADC/PWM/I2S/SDIO interface Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 6 of 18 Hi-12FL Specifications V1.0 Table 1 main parameter descriptions 2.Main parameters Model Name Hi-12FL Package SMD-22 Size 24.0*16.0*3.2(0.2)mm Antenna On-Board PCB 2400 ~ 2483.5MHz
-40 ~ 85
-40 ~ 125 , < 90%RH Frequency Range Operating Temperature Store Temperature Power supply range Support Interface Voltage 3.0V ~ 3.6VElectrical current >500mA UART/SPI/I2C/GPIO/ADC/PWM /I2S/SDIO UART Rate Default 115200 WiFi 802.11b/g/n Security WFA WPA/WPA2 personalWPS2.0 2.1. Electrical parameters Hi-12FL module is electrostatic sensitive devices and special precautions need to be taken when handling Figure 2 ESD anti-static diagram Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 7 of 18 2.2. Electrical characteristics Hi-12FL Specifications V1.0 Table 2 Main parameter description Parameters Conditions Min Max Unit Supply voltage VCC Interface voltage VDDIO1/
VDDIO2 VIH VIL VOH VOL I/O
3.0 3.125 2.4
-0.3 2.4
Typical values 3.3 3.3
3.6 3.6 3.63 0.8
0.4 V V V V V V Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 8 of 18 2.3. WIFI Electrical characteristics Hi-12FL Specifications V1.0 Table 3 Description of main parameters Description Operating frequency Typical values 2412 - 2462 Output power 11n mode HT20PA output power 11g modePA output power 11b modePA output power 11b, 1 Mbps 11b, 11 Mbps 6 Mbps (1/2 BPSK) 54 Mbps (3/4 64-QAM) HT20 (MCS7) 2.4. Power consumption Receiving sensitivity 12.52 122 112
-96
-89
-92
-74
-72 Unit MHz dBm dBm dBm dBm dBm dBm dBm dBm The following power consumption data is measured based on a 3.3V power supply and an ambient temperature of 25C. All measurements were completed at the antenna interface without SAW filters All emission data are based on 50% duty cycle, measured in continuous emission mode. Table 4 Description of main parameters Mode Tx 802.11b, CCK 11Mbps, POUT=+17dBm Tx 802.11g, OFDM 54Mbps, POUT
=+15dBm Mix
Typical values TBD TBD Max
Unit mA mA Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 9 of 18 Tx 802.11n, MCS7, POUT =+14dBm Hi-12FL Specifications V1.0
TBD TBD TBD TBD TBD TBD TBD TBD
mA mA mA mA A A A A Rx 802.11b,1024 bit Rx 802.11g,1024 bit Rx 802.11n,1024 bit Ultra Deep Sleep DTIM1 DTIM3 DTIM10 Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 10 of 18 Hi-12FL Specifications V1.0 3.Appearance dimensions Figure 3 The appearance of the module(For reference only Figure 4 Module size diagram Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 11 of 18 Hi-12FL Specifications V1.0 4.Pin definition Figure 5 Schematic diagram of the pin Hi-12FL series modules have 22 interfaces. As shown in the pin diagram, the pin function definition table is the interface definition. able 5 Hi-07FL Pin function definition No. Name Function IO08 IO11 GPIO_08,UART1_RTS,SPI0_TXD,PWM1_OUT,I2S0_WS,WL AN_ACTIVE,JTAG_ENABLE GPIO_11UART2_TXDSPI0_RXDSDIO_CMDADC5 PWM2_OUTI2S0_RXHW_ID6 PWRON IO14 IO13 IO12 IO09 Chip PMU power-on enable pin, pulled up inside the module 0: Power off 1: Power on GPIO_14UART0_LOG_RXDUART2_CTSSDIO_D1 PWM5_OUTI2C0_SCLHW_ID2 GPIO_13UART0_LOG_TXDUART2_RTSSDIO_D0 ADC6PWM4_OUTI2S0_WSI2C0_SDA GPIO_12UART2_RXDSPI0_CS1SDIO_CLKADC0 PWM3_OUTI2S0_CLKHW_ID7 GPIO_09UART2_RTSSPI0_TXDSDIO_D2ADC4 PWM0_OUTI2S0_MCKI2C0_SCL VCC Power supply, recommended 3.3V, > 500mA NC NC NC NC NC NC IO00 Internally connected with 32K crystal IO01 Internally connected with 32K crystal NC GND Grounded IO05 GPIO_05UART1_RXDSPI0_CS1ADC2PWM2_OUT Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 12 of 18 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Hi-12FL Specifications V1.0 I2S0_MCKBT_STATUSHW_ID4 GPIO_06UART1_TXDSPI0_CLKPWM3_OUTI2S0_TX COEX_SWITCHJTAG_MODE GPIO_07UART1_CTSSPI0_RXDADC3PWM0_OUT I2S0_CLKBT_ACTIVEHW_ID5 GPIO_10UART2_CTSSPI0_CLKSDIO_D3PWM1_OUT I2S0_TXI2C0_SDA GPIO_02 UART1_RTS SPI1_TXD PWM2_OUT JTAG_TRSTNREFCLK_FREQ_STATUS GPIO_04 UART0_LOG_RXD ADC1 PWM1_OUT I2C1_SCLJTAG_TMSHW_ID3 GPIO_03UART0_LOG_TXDUART1_CTSSPI1_CS1 PWM5_OUTI2C1_SDAJTAG_TDI IO06 IO07 IO10 IO02 IO04 IO03 Note: IO00 and IO01 are internally connected to 32K crystals and cannot be used, please leave them open. Table 6 Module start mode description System start up mode Pin Default state Low level High level IO2/REFCLK_FREQ_STA TUS Pull down 40MHzDefault 24MHz IO6/JTAG_MODE Pull down IO8/JTAG_ENABLE Pull down Normal function mode Default Ordinary IODefault DFT Test mode JTAG enable Note: IO2/IO6/IO8 are hardware configuration words, which cannot be in high level state when power on, otherwise the module cannot enter normal working state Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 13 of 18 Hi-12FL Specifications V1.0 5. Schematic diagrams 5.1. 5.1. Schematic diagrams of module Figure 6 Module schematic diagram Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 14 of 18 5.2. 5.2. Application circuit diagram Hi-12FL Specifications V1.0 Figure 7 Application circuit diagram Note: IO2/IO6/IO8 are hardware configuration words and cannot be in a high level state after power-on, otherwise the module cannot enter normal working state. 6.Design guidance 6.1. Antenna layout requirements 1The installation position on the motherboard, the following two ways are recommended Solution 1: Put the module on the edge of the main board, and the antenna area extends out of the edge of the main board. Solution 2: Put the module on the edge of the motherboard, and hollow out an area at the antenna position on the edge of the motherboard 2In order to meet the performance of the on-board antenna, it is forbidden to place metal Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 15 of 18 Hi-12FL Specifications V1.0 Figure 8 Schematic diagram of antenna layout 6.2. Power Supply 1Recommended 3.3V voltage, peak current above 500mA 2It is recommended to use LDO power supply; if using DC-DC, it is recommended that the ripple be controlled within 30mV. 3It is recommended to reserve the position of the dynamic response capacitor for the DC-DC power supply circuit, which can optimize the output ripple when the load changes greatly. 43.3V power interface recommends adding ESD devices Figure 9 DC-DC step-down circuit diagram 6.3. GPIO
(1)There are some GPIO ports on the periphery of the module. If you need to use it, it is recommended to connect a 10-100 ohm resistor in series with the IO port. This can suppress overshoot and make the levels on both sides more stable. Helps both EMI and ESD
(2)For the pull-up and pull-down of special IO ports, please refer to the instructions in the specification. This will affect the startup configuration of the module. Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 16 of 18 Hi-12FL Specifications V1.0
(3)The IO port of the module is 3.3V. If the main control and the IO level of the module do not match, a level conversion circuit needs to be added.
(4)If the IO port is directly connected to a peripheral interface, or a terminal such as a header, it is recommended to reserve an ESD device near the terminal of the IO trace Figure 10 Level conversion circuit 7.Reflow soldering Figure 11 Reflow soldering Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 17 of 18 Hi-12FL Specifications V1.0 8.Packaging information As shown in the figure below, Hi-12FL is packed with tape Figure 12 Schematic diagram of packaging 9.Product related model Table 7 Table of related models Model Chip Package Size Antenna Hi-12F Hi3861V100 SMD-22 24.0*16.0*3.2(0.2)mm On-board Hi-12FL Hi3861LV100 SMD-22 24.0*16.0*3.2(0.2)mm On-board Hi-07S Hi3861V100 SMD-22 17.0*16.0*3.2(0.2)mm Hi-07SL Hi3861LV100 SMD-22 17.0*16.0*3.2(0.2)mm IPEX IPEX Product related informationhttps://docs.ai-thinker.com 10.Contact us Official websitehttps://www.ai-thinker.com Development DOCS https://docs.ai-thinker.com Official Forumhttp://bbs.ai-thinker.com Sample purchasehttps://ai-thinker.en.alibaba.com/
Business cooperationoverseas@aithinker.com Technical supportsupport@aithinker.com Baoan District, Shenzhen. Tel 0755-29162996 Company AddressRoom 403,408-410, Block C, Huafeng Smart Innovation Port, Gushu 2nd Road, Xixiang, Copyright 2021 Shenzhen Ai-Thinker Technology Co., Ltd All Rights Reserved Page 18 of 18 FCC WARNING FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncon-
trolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following:
Contains Transmitter Module 2ATPO-HI12FL Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C (15.247).it Specifically identified AC Power Line Conducted Emission, Radiated Spurious emissions, Band edge and RF Conducted Spurious Emissions, Conducted Peak Output Power, Bandwidth, Power Spectral Density, Antenna Requirement. Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-
point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The product antenna uses an irreplaceable antenna with a gain of 1dBi Limited module procedures If a modular transmitter is approved as a limited module, then the module manufacturer isresponsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as:
shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a single module. 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information:
(1) to the host product manufacturer, to define the application conditions
(mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-
product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: The module complies with FCC radiofrequency radiation exposure limits for uncontrolled environments. The device is installed and operated with a distance of more than 20 cm between the radiator and your body." This module follows FCC statement design, FCC ID :2ATPO-HI12FL Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The product antenna uses an irreplaceable antenna with a gain of 1dBi 2.7 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: "Contains FCC ID: 2ATPO-HI12FL. 2.8 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. Explanation: Shenzhen Ai-Thinker Technology Co., Ltd. can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. 2.9 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.