Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com Version: 1 Issued Date: 2022/10/24 Datasheet
(Product): BT 5.1 module
(Model No.): Holyiot-22029-nrf52833 1 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 1. Description ............................................................................................................................................................................. 3 Hardware : ......................................................................................................................................................................... 3 Features : ........................................................................................................................................................................... 3 Application: ........................................................................................................................................................................ 5 2. Introduction ............................................................................................................................................................................ 5 2.1 Programmer ................................................................................................................................................................ 6 2.2 Software development Tool ...................................................................................................................................... 6 2.3 Protocols ..................................................................................................................................................................... 6 Software Development Kit ...................................................................................................................................... 6 2.4 SoftDevices ................................................................................................................................................................. 7 3. Product Descriptions ............................................................................................................................................................ 7 3.1 Mechanical drawings ................................................................................................................................................. 8 3.2 Pin assignments ......................................................................................................................................................... 8 4. Mounting our board on the host PCBA ............................................................................................................................ 11 5. Miscellaneous ...................................................................................................................................................................... 11 6. Absolute maximum ratings ................................................................................................................................................ 12 7. FCC WARNING........................................................................................................................................................................ 13 2 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 1. Description HOLYIOT-22029 BLE 5.1 module is based on Nordic nRF52833 SoC, the nRF52833 SoC is a powerful, highly flexible ultra-low power multi-protocol SoC ideally suited for Bluetooth low energy (previously called Bluetooth Smart), ANT and 2.4GHz ultra low-power wireless applications. The nRF52833 SoC is built around a 32-bit ARM Cortex-M4F CPU with FPU.Flash512kB + 128kB RAM. Angle-of-arrival (AoA) and angle-of-departure (AoD), 128-bit AES/ECB/CCM/AAR co-processor . It offers a wealth of peripherals that include NFC, USB and multiple interface options The embedded 2.4GHz transceiver supports Bluetooth low energy, ANT and proprietary 2.4 GHz protocol stack. It is on air compatible with the nRF51 Series, nRF24L and nRF24AP Series products from Nordic Semiconductor. Multiprotocol radio (bluetooth low energy, ANT, 2.4G proprietary) Bluetooth 5.1 long range Processing power and flash flexibility Multiprotocol radio Hardware :
SWD programmer (SWDIO,SWCLK,VDD,GND) nRF52833 aQFN73 package, 7 x 7 mm Size : 19mm*13.5mm BLE stack & RF 2.4Ghz Features :
Bluetooth 5.1, IEEE 802.15.4-2006, 2.4 GHz transceiver
-96 dBm sensitivity in 1 Mbps Bluetooth low energy mode
-103 dBm sensitivity in 125 kbps Bluetooth low energy mode (long range)
-20 to +8 dBm TX power, configurable in 4 dB steps On-air compatible with nRF52, nRF51, nRF24L, and nRF24AP Series Supported data rates:
Bluetooth 3 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 5.1 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps IEEE 802.15.4-2006 250 kbps Proprietary 2.4 GHz 2 Mbps, 1 Mbps Angle-of-arrival (AoA) and angle-of-
departure (AoD) direction finding using Bluetooth Single-ended antenna output (on-chip balun) 128-bit AES/ECB/CCM/AAR co-processor (on-the-fly packet encryption) 4.9 mA peak current in TX (0 dBm) 4.6 mA peak current in RX RSSI (1 dB resolution) ARM Cortex
-M4 32-bit processor with FPU, 64 MHz 217 EEMBC CoreMark score running from flash memory 52 A/MHz running CoreMark from flash memory 38 A/MHz running CoreMark from RAM Watchpoint and trace debug modules (DWT, ETM, and ITM) Serial wire debug (SWD) Rich set of security features Secure boot ready Flash access control list (ACL) Debug control and configuration Access port protection (CTRL-AP) Secure erase Flexible power management 1.7 V to 5.5 V supply voltage range On-chip DC/DC and LDO regulators with automated low current modes Automated peripheral power management Fast wake-up using 64 MHz internal oscillator 0.6 A at 3 V in System OFF mode, no RAM retention 1.5 A at 3 V in System ON mode, no RAM retention, wake on RTC 512 kB flash and 128 kB RAM Advanced on-chip interfaces USB 2.0 full speed (12 Mbps) controller High-speed 32 MHz SPI Type 2 near field communication (NFC-A) tag with wake-on field Touch-to-pair support Programmable peripheral interconnect (PPI) 42 general purpose I/O pins EasyDMA automated data transfer between memory and peripherals Nordic SoftDevice ready with support for concurrent multiprotocol 12-bit, 200 ksps ADC 8 configurable channels with programmable gain 4 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 64 level comparator 15 level low-power comparator with wake-up from System OFF mode Temperature sensor 4x four channel pulse width modulator (PWM) unit with EasyDMA Audio peripherals I2S, digital microphone interface (PDM) 5x 32-bit timer with counter mode Up to 4x SPI master/3x SPI slave with EasyDMA Up to 2x I2C compatible two-wire master/slave 2x UART (CTS/RTS) with EasyDMA Quadrature decoder (QDEC) 3x real-time counter (RTC) Single crystal operation Application:
Advanced computer peripherals and I/O devices Mouse Keyboard Multi-touch trackpad Advanced wearables Health/fitness sensor and monitor devices Wireless payment enabled devices Internet of things (IoT) Smart home sensors and controllers Industrial IoT sensors and controllers Interactive entertainment devices Remote controls Gaming controllers 2. Introduction 2.1 Programmer HOLYIOT-22029 module use the Serial Wire Debug(SWD port ), the module which layout the SWDIO, SWCLK, VDD, GND for debug and flash your own firmware, more info about the SWD, please visit https://www.silabs.com/community/mcu/32-
bit/knowledge-base.entry.html/2014/10/21/serial_wire_debugs-qKCT You can using the Jlink or Jtag for programmer. 5 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 2.2 Software development Tool It supports the standard Nordic Software Development Tool-chain using Segger Embedded Studio, Keil, IAR and GCC. More info please visit https://www.nordicsemi.com/Software-and-Tools/Development-Tools 2.3 Protocols This module support Bluetooth5.1, IEEE 802.15.4-2006, 2.4 GHz transceiver, 2.4GHz proprietary. So we can use different protocols for different situations. Software Development Kit Nordic Semiconductor's Software Development Kits (SDK) are your starting point for software development on the nRF51 and nRF52 Series. It contains source code libraries and example applications covering wireless functions, libraries for all peripherals, bootloaders, wired and OTA FW upgrades, RTOS examples, serialization libraries. More info please visit https://www.nordicsemi.com/Software-and-
Tools/Software/nRF5-SDK You can also download the SDK for coding development . 2.4 SoftDevices Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled, pre-linked binary files. SoftDevices can be programmed in nRF5 series devices, and are freely downloadable from the Nordic website. Please download that here: https://www.nordicsemi.com/Software-and-
Tools/Software/S132 Over-The-Air DFU The SoC is supported by an Over-The-Air Device Firmware Upgrade (OTA DFU) feature. This allows for in the field updates of application software and SoftDevice. 3. Product Descriptions 6 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 3.1 Mechanical drawings 3.2 Pin assignments 7 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com PIN No. PIN define 1 2 3 4 5 6 7 8 9 10 11 12 GND P0.25 P0.24 P0.23 P1.07 P1.06 P1.05 P1.04 P1.03 P1.02 P1.01 VDD 8 Functions Ground Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Power 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com GND P0.02
(AIN0) P0.03
(AIN1) Ground Digital I/O(general purpose I/O2) Analog input Digital I/O(general purpose I/O2 ) Analog input P0.04 Digital I/O(general purpose I/O2 )
(AIN2) Analog input P0.05 Digital I/O(general purpose I/O2 )
(AIN3) P0.06 P0.07 Analog input Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) TRACECLK Trace clock P0.08 VDD VDDH VBUS D-
D+
P0.16 P0.17 P0.18 Digital I/O(general purpose I/O) Power Power High voltage power supply Power 5 V input for USB 3.3 V regulator USB D-
USB D+
Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) nRESET Configurable as pin RESET P0.20 P0.21 P0.22 P1.00 Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) TRACEDATA0 Trace buffer TRACEDATA[0]
SWDIO SWDCLK P0.09 NFC1 P0.10 9 Debug Serial wire debug I/O for debug and programming Debug Serial wire debug clock input for debug and programming Digital I/O(general purpose I/O1 NFC1 input(antenna connection) Digital I/O(general purpose I/O1 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com NFC2 P0.31
(AIN7) P0.30
(AIN6) P0.29
(AIN5) P0.28
(AIN4) P0.27 P0.26 P0.19 P1.09 NFC2 input(antenna connection) Digital I/O(general purpose I/O2 ) Analog input Digital I/O(general purpose I/O2 ) Analog input Digital I/O(general purpose I/O2 ) Analog input Digital I/O(general purpose I/O2 ) Analog input Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) TRACEDATA3 Trace buffer TRACEDATA[3]
P1.08 P0.11 Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) TRACEDATA2 Trace buffer TRACEDATA[2]
P0.12 Digital I/O(general purpose I/O) TRACEDATA1 Trace buffer TRACEDATA[1]
P0.13 P0.14 P0.15 Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) Digital I/O(general purpose I/O) 37 38 39 40 41 42 43 44 45 46 47 48 49 50 4. Mounting our board on the host PCBA We suggest that you mount our RF board(HOLYIOT-22029 -nRF52833) on the board like that:
1. For the best Bluetooth performance, the antenna of the area need to extend about several mm without ground under the antenna of the edge of the host PCB. 2. The second choice is that place our board at the corner of host PCB, the antenna of board need to extend several mm outside of the Ground plane of the host PCB. 10 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 5. Miscellaneous Soldering Temperature-Time Profile for Re-Flow Soldering. Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight. 11 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 6. Absolute maximum ratings Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device. Absolute maximum ratings:
12 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com 7.FCC WARNING FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful 13 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncon-
trolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other 14 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following:
Contains Transmitter Module 2ALGY-22029 15 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See alsoSection 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C (15.247).it Specifically identified AC Power Line Conducted Emission, Radiated Spurious emissions, Band edge and RF Conducted Spurious Emissions, Conducted Peak Output Power, Bandwidth, Power Spectral Density, Antenna Requirement. 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-
point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The product antenna uses an irreplaceable antenna with a gain of 1dBi 2.4 Single Modular If a modular transmitter is approved as a Single Modular , then the module manufacturer isresponsible for approving the host environment that the Single Modular is used with. The manufacturer of a Single Modular must describe, both in the filing and in the installation instructions, the alternative means that the Single Modular manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A Single Modular manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as:
shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited 16 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This Single Modular procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a single module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list
(BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) 17 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com Production test procedures for ensuring compliance The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID
(new application) procedure followed by a Class II permissive change application 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions
(mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). 18 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com Explanation: The module complies with FCC radiofrequency radiation exposure limits for uncontrolled environments. The device is installed and operated with a distance of more than 20 cm between the radiator and your body." This module follows FCC statement design, FCC ID :2ALGY-22029 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. 19 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The product antenna uses an irreplaceable antenna with a gain of
-1.45dBi 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: "Contains FCC ID: 2ALGY-22029 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. Explanation: Ningde lingyang Electronic Technology Co., Ltd. can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the 20 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com modular transmitter grant of certification. If the grantee markets their product 21 Shenzhen Holyiot Technology Co.,Ltd www.holyiot.com info@holyiot.com as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B. 22