FCC ID: 2ABN2-BM4044B2 Bluetooth Module

RF-BM-4044B2 Bluetooth Low Energy Module Version 1.1 Shenzhen RF-star Technology Co., Ltd. Aug. 02, 2018 www.szrfstar.com Ver1.1 - Aug., 2018 RF-BM-4044B2 1 Device Overview 1.1 Description RF-BM-4044B2 module is designed based on CC2640R2FRSM Bluetooth Smart BT 5.0 System-on-Chip, fully supports the single mode Bluetooth Low Energy operation. The module contains a 32-bit ARM CortexTM-M3 processor, with the working frequency at 48.0 MHz which is the same as the main processor. The module has rich peripherals function libraries, and a unique ultra-low power sensor controller, which is fit for connecting the external sensors in the sleep mode and/or acquiring analog and digital data independently. 1.2 Key Features RF

- 2.4 GHz RF transceiver compatible with Analog

- MUX Bluetooth low energy 4.2 and specification

- Continuous Time Comparator

- Excellent receiver sensitivity (-97 dBm for

- Ultra-Low-Power Analog Comparator BLE)

- Programmable Current Source

- Programmable output power up to +2 dBm

- UART

- Signal-ended or differential RF interface

- 2 SSI (SPI, MICROWIRE, TI) Microcontroller

- Powerful ARM Cortex-M3

- EEMBC CoreMark Score: 142

- Up to 48-MHz Clock Speed

- I2C

- I2S

- Real-Time Clock (RTC)

- AES-128 Security Module

- 275 KB of Nonvolatile Memory Including 128

- True Random Number Generator (TRNG) KB of In-System Programmable Flash Low Power

- Up to 28 KB of System SRAM, of Which 20

- Wide Supply Voltage Range: 1.8 V to 3.8 V KB is Ultra-Low Leakage SRAM

- Active-Mode RX: 5.9 mA

- 8 KB of SRAM for Cache or System RAM Use

- Active-Mode TX at 0 dBm: 6.1 mA

- 2-Pin cJTAG and JTAG Debugging

- Active-Mode MCU: 61 A/MHz

- Supports Over-The-Air Upgrade (OTA)

- Active-Mode MCU: 48.5 CoreMark/mA Ultra-Low Power Sensor Controller

- Active-Mode Sensor Controller: 0.4 mA + 8.2

- 16-Bit Architecture A/MHz

- 2 KB of Ultra-Low Leakage SRAM for Code

- Standby: 1.1 A

(RTC Running and and Data Peripherals RAM/CPU Retention)

- Shutdown: 100 nA (Wake Up on External

- 12 Bit ADC, 200 ksamples/s, 8 Channel Events) 1.3 Applications Smart toys Fitness equipment Environmental sensor nodes Passive key-less entry (PKE) Shenzhen RF-star Technology Co., Ltd. Page 1 of 13 www.szrfstar.com Smart door locks Phone accessories Health-care equipment Smart lighting Energy harvesting Thermometer Human input devices Sports equipment RF-BM-4044B2 Ver1.1 - Aug., 2018 Shenzhen RF-star Technology Co., Ltd. Page 2 of 13 www.szrfstar.com Table of Contents RF-BM-4044B2 Ver1.1 - Aug., 2018 1 Device Overview ............................................................................................................................................................ 1 1.1 Description .......................................................................................................................................................... 1 1.2 Key Features .................................................................................................................................................. 1 1.3 Applications ........................................................................................................................................................ 1 1.4 Functional Block Diagram .................................................................................................................................. 2 Table of Contents .............................................................................................................................................................. 3 Table of Figures ................................................................................................................................................................. 4 Table of Tables .................................................................................................................................................................. 4 2 Module Configuration and Functions ............................................................................................................................. 5 2.1 Module Parameters ............................................................................................................................................ 5 2.2 Module Pin Diagram ........................................................................................................................................... 6 3.3 Pin Functions ...................................................................................................................................................... 6 3 Specifications ................................................................................................................................................................. 7 3.1 Recommended Operating Conditions ................................................................................................................ 7 3.2 Power Consumption ........................................................................................................................................... 7 3.2 RF Test ............................................................................................................................................................... 7 4 Application, Implementation, and Layout ....................................................................................................................... 8 4.1 Module Photos .................................................................................................................................................... 8 4.2 Recommended PCB Footprint ........................................................................................................................... 9 4.3 Typical Application Circuit ................................................................................................................................. 10 4.4 Basic Operation of Hardware Design ............................................................................................................... 10 4.5 Trouble Shooting ............................................................................................................................................... 11 4.5.1 Unsatisfactory Transmission Distance ................................................................................................... 11 4.5.2 Vulnerable Module ................................................................................................................................. 11 4.5.3 High Bit Error Rate ................................................................................................................................ 12 4.6 Electrostatics Discharge Warnings ................................................................................................................... 12 4.7 Soldering and Reflow Condition ....................................................................................................................... 12 5 Certification .................................................................................................................................................................. 13 5.1 FCC warnings ................................................................................................................................................... 13 6 Revision History ........................................................................................................................................................... 13 Shenzhen RF-star Technology Co., Ltd. Page 3 of 13 www.szrfstar.com RF-BM-4044B2 Ver1.1 - Aug., 2018 Table of Figures Figure 1. Functional Block Diagram of RF-BM-4044B2 ........................................................................................... 2 Figure 2. The Pin Diagram of RF-BM-4044B2 ......................................................................................................... 6 Figure 3. The Photos of RF-BM-4044B2 .................................................................................................................. 8 Figure 4. The Top View of RF-BM-4044B2 (mm) ..................................................................................................... 9 Figure 5. Typical Application Circuit ....................................................................................................................... 10 Figure 6. Recommended Reflow for Lead Free Solder .......................................................................................... 12 Table of Tables Table 1. The Parameters of RF-BM-4044B2 ............................................................................................................ 5 Table 2. The Pin Diagram of RF-BM-4044B2 ........................................................................................................... 6 Table 3. Recommended Operating Conditions of RF-BM-4044B2 .......................................................................... 7 Table 4. The Table of Power Consumption ............................................................................................................... 7 Table 5. The Table of Power Consumption ............................................................................................................... 7 Shenzhen RF-star Technology Co., Ltd. Page 4 of 13 www.szrfstar.com RF-BM-4044B2 Ver1.1 - Aug., 2018 2 Module Configuration and Functions 2.1 Module Parameters Table 1. The Parameters of RF-BM-4044B2 Chipset CC2640R2FRSM Supply Power Voltage 1.8 V ~ 3.8 V, recommended to 3.3 V Frequency Maximum Transmit Power Receiving Sensitivity GPIO Crystal RAM Flash Package Frequency Error Dimension Type of Antenna Operating Temperature Storage Temperature 2402 MHz ~ 2480 MHz

-21.0 dBm ~ +2.5 dBm

-97 dBm 10 24 MHz 20 KB 128 KB SMT Packaging 20 kHz 16.6 mm x 11.2 mm x 1.7 mm PCB Antenna

-40 +85

-40 +125 Shenzhen RF-star Technology Co., Ltd. Page 5 of 13 www.szrfstar.com 2.2 Module Pin Diagram Figure 2. The Pin Diagram of RF-BM-4044B2 RF-BM-4044B2 Ver1.1 - Aug., 2018 3.3 Pin Functions Pin Name Chip Pin Pin Type Description Table 2. The Pin Diagram of RF-BM-4044B2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 GND VDDZ GND VCC Power GND Power Power supply 1.8 V ~ 3.8 V, Recommend 3.3 V TMSC TMSC JTAG JTAG: TMSC TCKC TCKC JTAG JTAG: TCKC RES_N REST REST Reset after power on. No need for external RC circuit. Programmable I/O GND GND P06 P09 GND GND P08 P07 P05 P04 P03/BRTS P02/BCTS P01/TX P06 P09 GND GND P0.8 P0.7 P0.5 P0.4 P0.3 P0.2 P0.1 I/O I/O GND GND I/O I/O I/O I/O I/O I/O I/O Shenzhen RF-star Technology Co., Ltd. Page 6 of 13 RF-BM-4044B2 Ver1.1 - Aug., 2018 www.szrfstar.com 17 18 P00/RX P0.0 NC

-

I/O

-

3 Specifications 3.1 Recommended Operating Conditions Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table below. Long-term work beyond this limit will affect the reliability of the module more or less. Table 3. Recommended Operating Conditions of RF-BM-4044B2 Items Condition Min. Typ. Max. Unit Operating Supply Voltage Battery Mode Operating Temperature Environmental Hot Pendulum

/

/

Notes 1.8

-25

-20 3.3 25 3.8 75

+20 V

/min

(1) The operating temperature is limited to the change of crystals frequency;

(2) To ensure the RF performance, the ripple wave on the source must be less than 200 mV. 3.2 Power Consumption When measured on the RF-BM-4044B2 reference design with T A = 25 , V BAT = 3.3 V with DC/DC enabled unless Table 4. The Table of Power Consumption otherwise noted. Test Item Average Current Test Condition Power consumption on sleep 0.1 A EN is in high level. Broadcast Connection 60 A Broadcast interval: 200 ms. 70 A Connection interval: 100 ms Module receives UART data and transmits to APP Module receives APP data and transmits to MCU 3.2 RF Test 180 A

(20 bytes, 10 time/s) Connection interval: 100 ms 160 A

(20 bytes, 10 time/s) Connection interval: 100 ms When measured on the RF-BM-4044B2 reference design with T A = 25 , V BAT = 3.3 V with DC/DC, channel of 39th

(2442 MHz) enabled unless otherwise noted. Table 5. The Table of Power Consumption Shenzhen RF-star Technology Co., Ltd. Page 7 of 13 RF-BM-4044B2 Ver1.1 - Aug., 2018 Test Value 5 (Max.) 20

-36

-30

-93 Unit dBm KHz dBm dBm dBm www.szrfstar.com Test Item Parameter Transmitter Power Frequency Error Radiation (30 m ~ 1 G) Radiation (1 G ~ 12.75 G) Receiver Sensitivity (8% PER) 4 Application, Implementation, and Layout 4.1 Module Photos Figure 3. The Photos of RF-BM-4044B2 Shenzhen RF-star Technology Co., Ltd. Page 8 of 13 www.szrfstar.com 4.2 Recommended PCB Footprint RF-BM-4044B2 Ver1.1 - Aug., 2018 Figure 4. The Top View of RF-BM-4044B2 (mm) Shenzhen RF-star Technology Co., Ltd. Page 9 of 13 www.szrfstar.com RF-BM-4044B2 Ver1.1 - Aug., 2018 4.4 Basic Operation of Hardware Design 1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power supply. Otherwise, the reverse connection may cause permanent damage to the module;

2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated voltage. 3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin, which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference. 4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing. If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top Shenzhen RF-star Technology Co., Ltd. Page 10 of 13 www.szrfstar.com RF-BM-4044B2 Ver1.1 - Aug., 2018 Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital part of module and routed in the Bottom Layer (all copper is well grounded). 5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;

6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for example: USB 3.0;

9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality antenna extension wire can be used to extend the antenna to the outside of the case. 10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened. 4.5 Trouble Shooting 4.5.1 Unsatisfactory Transmission Distance 1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened. Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to the ground. 2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor. 3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the metal shell. 4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The higher the data rate, the closer the distance. 5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower the voltage, the smaller the power is. 6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance. 4.5.2 Vulnerable Module 1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated Shenzhen RF-star Technology Co., Ltd. Page 11 of 13 www.szrfstar.com voltage. RF-BM-4044B2 Ver1.1 - Aug., 2018 2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices. 3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application. If there is no special demand, it is not recommended to use at too high or too low temperature. 4.5.3 High Bit Error Rate 1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or modify the frequency and channel to avoid interferences. 2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability. 3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high. 4.6 Electrostatics Discharge Warnings The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions below:

1. According to the anti-static measures, bare hands are not allowed to touch modules. 2. Modules must be placed in anti- static areas. 3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design. Static may result in the degradation in performance of module, even causing the failure. 4.7 Soldering and Reflow Condition 1. Heating method: Conventional Convection or IR/convection. 2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent methods. 3. Solder paste composition: Sn/3.0 Ag/0.5 Cu 4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile. 5. Temperature profile: Reflow soldering shall be done according to the following temperature profile. 6. Peak temperature: 245 . Figure 6. Recommended Reflow for Lead Free Solder Shenzhen RF-star Technology Co., Ltd. Page 12 of 13 www.szrfstar.com 5 Certification 5.1 FCC warnings RF-BM-4044B2 Ver1.1 - Aug., 2018 FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Integral PCB antenna with antenna gain 0dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. We will retain control over the final installation of the modular such that compliance of the end product is assured. In such cases, an operating condition on the limit modular approval for the module must be only approved for use when installed in devices produced by a specific manufacturer. If any hardware modify or RF control software modify will be made by host manufacturer,C2PC or new certificate should be apply to get approval,if those change and modification made by host manufacturer not expressly approved by the party responsible for compliance ,then it is illegal. FCC Radiation Exposure Statement The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: 2ABN2-BM4044B2 Or Contains FCC ID: 2ABN2-BM4044B2 When the module is installed inside another device, the user manual of the host must contain below warning statements;

1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference.

(2) This device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install this modular with limit modular approval should perform the test of radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209 &

15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirementthen the host can be sold legally. Shenzhen RF-star Technology Co., Ltd. Page 13 of 13

YES Yes YES N/A Refer to instruction Integral PCB antenna with antenna gain 0dBi Comment Refer to instruction FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Compliance list INTEGRATION INSTRUCTIONS for 996369 D03 OEM the and 996369 D03 OEM by Sections 2.2 through 2.10. Requirement 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules

(Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. 2.4 Limited module procedures If a modular transmitter is approved as a limited module, then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial Refer to instruction We will retain control over the final installation of the modular such that compliance of the end product is assured. In such cases, an operating condition on the limit modular approval for the module must be only approved for use when installed in devices produced by a specific manufacturer. If any hardware modify or RF control software modify will be made by host manufacturer,C2PC or new certificate should be apply to get approval,if those change and modification made by host manufacturer not expressly approved by the party responsible for compliance ,then it is illegal. YES approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.4 variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);

different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);

a manner permitting host manufacturers to design the printed circuit (PC) board layout;

d) Appropriate parts by manufacturer c) The parameters shall be provided in a) Information that includes permitted b) Each design shall be considered a N/A Not applicable e) Test procedures for design f) Production test procedures for and specifications;

verification; and ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered YES Refer to instruction This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-

located or operating in conjunction with any other antenna or transmitter. YES Refer to instruction Integral PCB antenna with antenna gain 0dBi to be a specific antenna type)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. 2.10 Additional testing, Part 15 Subpart B disclaimer YES YES Refer to instruction If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: 2ABN2-BM4044B2 Or Contains FCC ID: 2ABN2-BM4044B2 Refer to instruction Any company of the host device which install this modular with limit modular approval should perform the test of radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209

&15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 &15.207 ,15B Class B requirementthen the host can be sold legally. YES Refer to instruction The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.6 Any company of the host device which install this modular with limit modular approval should perform the test of radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209

&15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 &15.207 ,15B Class B requirementthen the host can be sold legally. When the module is installed inside another device, the user manual of the host must contain below warning statements;

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

DATE2019-Sep-06 Equipment Autorisation Division Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 FCC ID: 2ABN2-BM4044B2 Product Name: Bluetooth Module Request for Confidentiality Pursuant to Sections 0.457 and 0.459 of the commissions rules, we hereby request that the following documents be held confidential:

(List here the documents for which you are seeking confidentiality for example ) Schematics Block diagram Operation description These materials contain trade secrets and proprietary information and are not customarily released to the public. The public disclosure of this information might be harmful to the company and provide unjustified benefits to our competitors.

<Signature>

NameAroo woo TitleManager Applicant CompanyShenZhen RF-STAR Technology CO.,LTD

Limit Modular approval Declaration letter We ShenZhen RF-STAR Technology CO.,LTD apply Limit modular approval for Product Name: Bluetooth Module Model: RF-BM-4044B2 FCC ID: 2ABN2-BM4044B2 According to 996369 D01 Module Equip Auth Guide v01r04 and 15.212 requirement:

1) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must beon the module assembly;

Answer No not shielded 2)The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal;

Answer Yes All inputs to the modules are buffered through logic or microprocessor inputs. 3)The modular transmitter must have its own power supply regulation. Answer Yes A low drop out regulator is used for modular power supply regulation. 4)The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b);

Answer Yes Device is equipped with PCB antenna.

(5)The module must demonstrate compliance in a stand-alone configuration;

Answer Yesdistance between modular and all AEs are longer than 10cm refer to setup photo.

(6) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements);

Answer Yes The modular has a permanent fixed label, and below statement was listed in the User Manual ;The host device must be labeled to display the FCC ID of the module Contains FCC ID: 2ABN2-BM4044B2

(7)The module must comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee;

Answer Yes The module comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee, Refer to test report and user manual .

(8)The module must comply with RF exposure requirements Answer Yes Transmitter meets MPE calculation of 47 CFR 1.1307 . Refer to MPE Reports and Refer to modular installation manual.

<Signature>

NameAroo Woo TitleManager Applicant CompanyShenZhen RF-STAR Technology CO.,LTD