FCC ID: 2ABN2-BG22B1 BT module

RF-BM-BG22B1 EFR32BG22 Bluetooth 5.2 Low Energy Module Version 1.0 Shenzhen RF-star Technology Co., Ltd. www.szrfstar.com 1 Device Overview RF-BM-BG22B1 1.1 Module Series with each other as well. There are three modules of RF-BM-BG22Bx series. All of them are based on Silicon Labs EFR32BG22 series. Because the EFR32BG22 chips are compatible in package, pins and peripherals, those three modules are pin-to-pin compatible Model Chip Model FLASH RAM Protocol Table 1. Module Specification of RF-BM-BG22Bx Max. CPU TX Speed Power BG22B1 EFR32BG22C112F352GM32-C 38.4 MHz 0 dBm 352 kB 32 kB BG22B2 EFR32BG22C222F352GM32-C 76.8 MHz

+6 dBm 352 kB 32 kB BG22B3 EFR32BG22C224F512GM32-C 76.8 MHz

+6 dBm 512 kB 32 kB Note: RF-BM-BG22B1 and RF-BM-BG22B2 do not support AoA/AoD and LE Long Range (125 kbps and 500 kbps) BT5.2 BT5.2 Proprietary BT5.2 Direction finding Proprietary PHYs. 1.2 Description RF-BM-BG22B1 is an RF module based on EFR32BG22C112F352GM32-C, one of Gecko family of SoCs from Silicon Labs, with a 32-bit ARM Cortex-M33 core with 38.4 MHz maximum operating frequency. It integrates a 38.4 MHz crystal, a matching, an antenna matching, a low-pass filter and antenna options of a meander line inverted-F PCB antenna and a half-hole interface. It supports Bluetooth 5.2 low energy and can be preprogrammed with a serial interface communication protocol for simple programming. It also has a range of analog and digital interfaces such as PRS, ADC, UART, SPI, I2C, PWM, ISO 7816, IrDA, I2S, EUART and PDM. It features low power consumption, compact size, robust connection distance, and rigid reliability. The module reaches up to 0 dBm TX power. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB design. RF-BM-BG22B1 is pin-to-pin compatible with BG22B2 and BG22B3. 1.3 Key Features Protocol

- Bluetooth 5.2 low energy

- Flash: 352 kB

- RAM: 32 kB Supported Modulation Format TX power: -28 dBm ~ 0 dBm

- 2 (G)FSK with fully configurable shaping Wide Peripherals High-Performance 32-bit 38.4 MHz ARM Cortex-

- 12-bit 1 Mbps SAR Analog to Digital Converter M33 with DSP instruction and floating-point unit for

(ADC) efficient signal processing

- Up to 18 GPIOs with output state retention and Memory asynchronous interrupts Shenzhen RF-star Technology Co., Ltd. Page 1 of 15 www.szrfstar.com RF-BM-BG22B1

- 8 Channel DMA Controller single-crystal operation

- 12 Channel Peripheral Reflex System (PRS)

- RFSENSE with selective OOK mode

- 416-bit Timer / Counter with 3 Compare / Capture

- Die temperature sensor with +/-2 degree C

/ PWM channels accuracy across temperature range

- 132-bit Timer / Counter with 3 Compare / Capture Wide Operation Range

/ PWM channels

- 32-bit Real Time Counter

- 2.2 V to 3.8 V single power supply

- Operating temperature: -40 C to +85 C

- 24-bit Low Energy Timer for waveform generation Security Features

- 1Watchdog Timer

- Secure Boot with Root of Trust and Secure Loader

- 2Universal Synchronous / Asynchronous Receiver

(RTSL)

/ Transmitter (UART / SPI / SmartCard (ISO 7816) /

- Hardware Cryptographic Acceleration for IrDA / I2S) AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC

- 1 Enhanced Universal Asynchronous Receiver /

(up to 256-bit), ECDSA, and ECDH Transmitter (EUART)

- True Random Number Generator (TRNG) compliant

- 2I2C interface with SMBus support with NIST SP800-90 and AIS-31

- Digital microphone interface (PDM)

- ARM TrustZone

- Precision Low-Frequency RC Oscillator enabling

- Secure Debug with lock / unlock 1.4 Applications Asset tags and beacons Sports, fitness and wellness devices Consumer electronics remote controls Connected home Portable medical Building automation and security Shenzhen RF-star Technology Co., Ltd. Page 2 of 15 www.szrfstar.com RF-BM-BG22B1 1.5 Functional Block Diagram Figure 1. Functional Block Diagram of RF-BM-BG22B1 1.6 Part Number Conventions The part numbers are of the form of RF-BM-BG22B1 where the fields are defined as follows:

RF BM BG22 B1

Figure 2. Part Number Conventions of RF-BM-BG22B1 Company Name RF-star Wireless Type Bluetooth Module Module Version The first version Chipset Silicon Labs EFR32BG22 Series Shenzhen RF-star Technology Co., Ltd. Page 3 of 15 www.szrfstar.com RF-BM-BG22B1 Table of Contents 1 Device Overview ............................................................................................................................................................. 1 1.1 Module Series ..................................................................................................................................................... 1 1.2 Description............................................................................................................................................................ 1 1.3 Key Features ....................................................................................................................................................... 1 1.4 Applications .......................................................................................................................................................... 2 1.5 Functional Block Diagram .............................................................................................................................. 3 1.6 Part Number Conventions .............................................................................................................................. 3 Table of Contents ................................................................................................................................................................ 4 2 Module Configuration and Functions ...................................................................................................................... 5 2.1 Module Parameters ........................................................................................................................................... 5 2.2 Module Pin Diagram ......................................................................................................................................... 6 2.3 Pin Functions ....................................................................................................................................................... 6 3 Specifications ................................................................................................................................................................... 7 3.1 Recommended Operating Conditions ....................................................................................................... 7 3.2 Handling Ratings ................................................................................................................................................ 7 4 Application, Implementation, and Layout............................................................................................................... 8 4.1 Module Photos .................................................................................................................................................... 8 4.2 Recommended PCB Footprint ...................................................................................................................... 8 4.3 Antenna .................................................................................................................................................................. 9 4.3.1 Antenna Design Recommendation ................................................................................................ 9 4.4 Basic Operation of Hardware Design ........................................................................................................ 9 4.5 Trouble Shooting .............................................................................................................................................. 10 4.5.1 Unsatisfactory Transmission Distance ........................................................................................ 10 4.5.2 Vulnerable Module .............................................................................................................................. 11 4.5.3 High Bit Error Rate ............................................................................................................................. 11 4.6 Electrostatics Discharge Warnings ........................................................................................................... 11 4.7 Soldering and Reflow Condition ................................................................................................................. 11 4.8 Optional Packaging ......................................................................................................................................... 13 6 Revision History ............................................................................................................................................................ 14 7 Contact Us ....................................................................................................................................................................... 15 Shenzhen RF-star Technology Co., Ltd. Page 4 of 15 www.szrfstar.com RF-BM-BG22B1 2 Module Configuration and Functions 2.1 Module Parameters Table 2. Parameters of RF-BM-BG22B1 Chipset EFR32BG22C112F352GM32-C Supply Power Voltage 2.2 V ~ 3.8 V, recommended to 3.3 V Frequency 2402 MHz ~ 2480 MHz Transmit Power

-28.0 dBm ~ 0 dBm (typical: 0 dBm) Receiving Sensitivity Power Consumption

-98.9 dBm sensitivity @ 1 Mbit/s GFSK

-96.2 dBm sensitivity @ 2 Mbit/s GFSK 3.6 mA RX current (1 Mbps GFSK) 4.1 mA TX current @ 0 dBm output power GPIO Crystal RAM Flash Package 18 38.4 MHz 32 kB 352 kB SMT Packaging Frequency Error 24 kHz Dimension 16.6 * 11.2 * 2.10 mm Type of Antenna PCB antenna, half-hole antenna interface Operating Temperature

-40 +85 Storage Temperature

-40 +125 Shenzhen RF-star Technology Co., Ltd. Page 5 of 15 www.szrfstar.com RF-BM-BG22B1 2.2 Module Pin Diagram Figure 3. Pin Diagram of RF-BM-BG22B1 2.3 Pin Functions Table 3. Pin Functions of RF-BM-BG22B1 Pin Name Pin Type Description Pin1 GND Pin2 VCC Ground 2.2 V ~ 3.8 V, recommended to 3.3 V Pin3 PA01/SWCLK I/O GPIO/SWCLK(connect jlink) Pin4 PA02/SWDIO I/O GPIO/SWDIO(connect jlink) Pin5 RESET Reset, active low, internal pull-up. I I/O I/O I/O I/O I/O Pin6 PA03 Pin7 PA04 Pin8 GND Pin9 GND Pin10 PC02 Pin11 PC03 Pin12 PC04 GPIO GPIO Ground Ground GPIO GPIO GPIO Shenzhen RF-star Technology Co., Ltd. Page 6 of 15 www.szrfstar.com RF-BM-BG22B1 Pin13 PC05 Pin14 PA05 Pin15 PA06 Pin16 PC00 Pin17 PC01 Pin18 NC I/O I/O I/O I/O I/O GPIO GPIO GPIO GPIO GPIO 3 Specifications 3.1 Recommended Operating Conditions The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table below. Long-term work beyond this limit will affect the reliability of the module more or less. Table 4. Recommended Operating Conditions of RF-BM-BG22B1 Items Condition Typ. Max. Unit Operating Supply Voltage Battery Mode 3.3 3.8 V Frequency Range Operating Temperature Environmental Hot Pendulum 3.2 Handling Ratings Storage Temperature Human Body Model Moisture Sensitivity Level Charged Device Model

Tstg HBM Min. 2.2 2402

-40

-20 Min.

-40 2480 MHz

+25

+85

+20

/min

+25

+125 2000 2 500 V V Table 5. Handling Ratings of RF-BM-BG22B1 Items Condition Typ. Max. Unit Shenzhen RF-star Technology Co., Ltd. Page 7 of 15 www.szrfstar.com RF-BM-BG22B1 4 Application, Implementation, and Layout 4.1 Module Photos Figure 4. Photos of RF-BM-BG22B1 4.2 Recommended PCB Footprint Figure 5. Recommended PCB Footprint of RF-BM-BG22B1 (mm) Shenzhen RF-star Technology Co., Ltd. Page 8 of 15 www.szrfstar.com RF-BM-BG22B1 4.3 Antenna 4.3.1 Antenna Design Recommendation 1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality antenna extension wire can be used to extend the antenna to the outside of the case. 2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened. 3. The recommendation of antenna layout. The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the antenna is a key factor to increase the data rate and transmission range. Therefore, the layout of the module antenna location and routing is recommended as follows:

1 Place the antenna on the edge (corner) of the PCB. 2 Make sure that there is no signal line or copper foil in each layer below the antenna. 3 It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is minimally affected. Note: The hollow-out position is based on the antenna used. Figure 6. Recommendation of Antenna Layout 4.4 Basic Operation of Hardware Design 1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power supply. Otherwise, the reverse connection may cause permanent damage to the module;

2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage. 3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin, Shenzhen RF-star Technology Co., Ltd. Page 9 of 15 www.szrfstar.com RF-BM-BG22B1 which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference. 4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded). 5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;

6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate 8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for isolation and shielding can be done. example, USB 3.0. 4.5 Trouble Shooting 4.5.1 Unsatisfactory Transmission Distance 1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened. Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The performances of ground absorption and reflection of radio waves will be poor when the module is tested close to the 2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor. 3. The signal attenuation will be very obvious if there is a metal near the antenna or the module is placed inside the ground. metal shell. 4. The incorrect power register set or the high data rate in an open-air may shorten the communication distance. The 5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower higher the data rate, the closer the distance. the voltage, the smaller the power is. 6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance. Shenzhen RF-star Technology Co., Ltd. Page 10 of 15 www.szrfstar.com RF-BM-BG22B1 4.5.2 Vulnerable Module 1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage. 2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices. 3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If there is no special demand, it is not recommended to use at too high or too low temperature. 4.5.3 High Bit Error Rate 1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or modify the frequency and channel to avoid interferences. 2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability. 3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high. 4.6 Electrostatics Discharge Warnings The module will be damaged for the discharge of static. RF-star suggests that all modules should follow the 3 precautions below:

1. According to the anti-static measures, bare hands are not allowed to touch modules. 2. Modules must be placed in anti-static areas. 3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design. Static may result in the degradation in performance of the module, even causing the failure. 4.7 Soldering and Reflow Condition 1. Heating method: Conventional Convection or IR/convection. 2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5 3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile. 4. Temperature profile: Reflow soldering shall be done according to the following temperature profile. 5. Peak temperature: 245 . Table 6. Temperature Table of Soldering and Reflow Profile Feature Sn-Pb Assembly Pb-Free Assembly Solder Paste Sn63 / Pb37 Sn96.5 / Ag3.0 / Cu0.5 Min. Preheating Temperature (Tmin) Max. Preheating Temperature (Tmax) Preheating Time (Tmin to Tmax) (t1) Average Ascend Rate (Tmax to Tp) 100 150 60 s ~ 120 s Max. 3 /s 150 200 60 s ~ 120 s Max. 3 /s Shenzhen RF-star Technology Co., Ltd. Page 11 of 15 www.szrfstar.com RF-BM-BG22B1 Liquid Temperature (TL) Time above Liquidus (tL) Peak Temperature (Tp) 183 217 60 s ~ 90 s 30 s ~ 90 s 220 ~ 235 230 ~ 250 Average Descend Rate (Tp to Tmax) Max. 6 /s Max. 6 /s Time from 25 to Peak Temperature (t2) Max. 6 minutes Max. 8 minutes Time of Soldering Zone (tP) 2010 s 2010 s Figure 7. Recommended Reflow for Lead-Free Solder Shenzhen RF-star Technology Co., Ltd. Page 12 of 15 www.szrfstar.com RF-BM-BG22B1 4.8 Optional Packaging Note: Default tray packaging. Figure 8. Optional Packaging Mode 5 FCC Warning two conditions:

undesiredoperation. This device complies with Part 15 of the FCC Rules. Operation is subject to the following

(1) This device may not cause harmful interference.

(2) This device must accept any interference received, including interference that may cause Shenzhen RF-star Technology Co., Ltd. Page 13 of 15 www.szrfstar.com RF-BM-BG22B1 6 Revision History Date Version No. Description 2022.06.10 V1.0 The initial version is released. Note:

the latest version. 1. The document will be optimized and updated from time to time. Before using this document, please make sure it is 2. To obtain the latest document, please download it from the official website: www.szrfstar.com. Shenzhen RF-star Technology Co., Ltd. Page 14 of 15 www.szrfstar.com RF-BM-BG22B1 7 Contact Us SHENZHEN RF-STAR TECHNOLOGY CO., LTD. Shenzhen HQ:

Tel.: 86-755-3695 3756 Chengdu Branch:

Tel.: 86-28-6577 5970 Email: sunny@szrfstar.com, sales@szrfstar.com Web.: www.szrfstar.com Add.: C601, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China, 518057 Add.: N2-1604, Global Center, North No. 1700, Tianfu Avenue, Hi-Tech District, Chengdu, Sichuan, China, 610095 Shenzhen RF-star Technology Co., Ltd. Page 15 of 15 FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 PCB antenna , Antenna gain 0dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

2ABN2-BG22B1 Or Contains FCC ID: 2ABN2-BG22B1 When the module is installed inside another device, the user manual of the host must contain below warning statements;

1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference;

(2) This device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install modular with limit modular approval should perform the test of radiated & conducted emission and spurious emission, etc. according to FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirementthen the host can be sold legally.

DATE: |2022/7/19 Federal Communications Commission arleern & Evaluation Division 7345 Oakland Mills Road Columbia, Maryland 21046 Authority to Act as Agent On our behalf, | appoint BlueAsia_of Technical Services(Shenzhen)_Co., Ltd. AN DBuildingC,No.107,ShihuanRoad,ShiyanStreet,BaoanDistrict,Shenzhen___ (Name of Agent company name and address) to act as our agent in the preparation of this application for ra le certification. | certify that submitted documents properly describe the device or system for which equipment certification is sought. | also certify that each unit manufactured, imported or marketed, as defined in the Federal Communications Commissions regulations will have affixed to it a label identical to that submitted for approval with this application. For instances where our authorized agent signs the application for certification on our behalf, | acknowledge that all responsibility for complying with the terms and conditions for certification, still resides with ShenZhen RF-STAR Technology CO.,LTD_ and2F,BLDG.8,Zone A,BaoAn Internet Industry Base,BaoYuan Road,XiXiang, BaoAn DIST |ShenzhenChina (Applicant Name and address)

<Signature>

Name: Aroo woo

YES Yes YES N/A Comment Refer to instruction FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Refer to instruction PCB antenna , Antenna gain 0dBi Compliance list INTEGRATION INSTRUCTIONS for 996369 D03 OEM the and 996369 D03 OEM by Sections 2.2 through 2.10. Requirement 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules

(Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. 2.4 Limited module procedures If a modular transmitter is approved as a limited module, then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum N/A Not applicable N/A Not applicable signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.4 a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);

b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape

(traces in phase) can affect antenna gain and must be considered);

c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;

d) Appropriate parts by manufacturer and specifications;

e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that YES Refer to instruction This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. YES Refer to instruction PCB antenna , Antenna gain 0dBi unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible YES YES Refer to instruction If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:

Contains Transmitter Module FCC ID: :

2ABN2-BG22B1 Or Contains FCC ID: :

2ABN2-BG22B1 Refer to instruction Any company of the host device which install modular with limit modular approval should perform the test of radiated &

conducted emission and spurious emission,etc. according to FCC part 15C :

15.247 and 15.209 &15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209

&15.207 ,15B Class B requirementthen the host can be sold legally. YES Refer to instruction Any company of the host device which install modular with limit modular approval should perform the test of radiated

& conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209

&15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209

&15.207 ,15B Class B requirementthen the host can be sold legally. for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.6 When the module is installed inside another device, the user manual of the host must contain below warning statements;

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

DATE2022/7/19 Equipment Autorisation Division Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 FCC ID: _2ABN2-BG22B1__ Product Name: _BT module___ Request for Confidentiali Pursuant to Sections 0.457 and 0.459 of the commissions rules, we hereby request that the following documents be held confidential:

(List here the documents for which you are seeking confidentiality for example ...)

| Schematics e Block diagram e Operation description These materials contain trade secrets and proprietary information and are not customarily released to the public. The public disclosure of this information might be harmful to the company and provide unjustified benefits to our competitors.

<Signature>

Name: Aroo woo Pees:

Title: Project Manager Lv fon Company: ShenZhen RF-STAR Technology. G

Modular approval Declaration letter We ShenZhen RF-STAR Technology CO.,LTD apply Single modular approval for Product Name: BT module Model: RF-BM-BG22B1 FCC ID: 2ABN2-BG22B1 According to 996369 D01 Module Equip Auth Guide v01r04 and 15.212 requirement:

1) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly;

Answer Yes, shielding for both side . 2) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal;

Answer Yes All inputs to the modules are buffered through logic or microprocessor inputs. 3)The modular transmitter must have its own power supply regulation. Answer Yes A low drop out regulator is used for modular power supply regulation. 4) The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b);

Answer Yes Device is equipped with PCB antenna.

(5) The module must demonstrate compliance in a stand-alone configuration;

Answer Yes distance between modular and all AEs are bigger than 10cm refer to setup photo.

(6) The module must be labeled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements);

Answer Yes The modular has a permanent fixed label, and below statement was listed in the User Manual;The host device must be labeled to display the FCC ID of the module Contains FCC ID: 2ABN2-BG22B1

(7) The module must comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee;

Answer Yes The module comply with all specific rules applicable to the transmitter the grantee, Refer to test report and user manual . including all the conditions provided in the integration instructions by

(8) The module must comply with RF exposure requirements Answer Yes Transmitter meets MPE calculation of 47 CFR 1.1307 . Refer to MPE Reports and Refer to modular installation manual Please contact me if you have any further questions. Thanks for your attention. Best Regards, Signature:

Aroo Woo Project Manager ShenZhen RF-STAR Technology CO.,LTD July 27, 2022