ShenzhenRF-starTechnologyCo.,Ltd. IS-ZB-001 HardwareSpeci fication ShenzhenRF-starTechnologyCo.,Ltd 1 ShenzhenRF-starTechnologyCo.,Ltd. Index Index................................................................................................................................................................................2 ModuleParameters......................................................................................................................................................... 3 PinDefinition..................................................................................................................................................................4 PCBPackageSize...........................................................................................................................................................6 SchematicDiagram.........................................................................................................................................................7 LayoutProposals.............................................................................................................................................................8 RecommendedOperatingConditions.............................................................................................................................9 ReflowConditions........................................................................................................................................................10 ElectrostaticDischargeWarnings.................................................................................................................................11 ContactUs.....................................................................................................................................................................12 2 ShenzhenRF-starTechnologyCo.,Ltd. l ModuleP arameters MCU SupplyVoltage Frequency Sensitivity Frequency Error FLASH RAM OperatingTempera ture Range Storage Temperature Range Module Size RXCurre nt RXCurrent TX Current Deep SleepMode SiliconLa bs:EFR32MG1B232F256GM32-C0 2.3V ~ 3.6V3. 3V willbe recommended 2405 MHz 2480MHz
-98 dBm 20 kHz 256KB 32KB
-40 +85
-40 +125 20.4*14.8*1.7mm 8.7mA (1Mbps GFSK) 9.8mA (250kbps 0-QPSK DSSS) 8.2mA (at 0dBm) 5.5uA 3 ShenzhenRF-starTechnologyCo.,Ltd. l PinDefinition PinNo. PinName Function Remarks Figure 1PinDefinition Pin1 Pin2 Pin3 Pin4 Pin5 Pin6 Pin7 Pin8 Pin9 Pin10 Pin11 Pin12 Pin13 PD13 PD14 PD15 PB13 PB12 PB11 PB14 PB15 PA0 PA1 VCC PF2 GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCC I/O Groud Powersupply (2.3Vto3.6V)3.3Vwillberecommended Grounding 4 ShenzhenRF-starTechnologyCo.,Ltd. Pin14 Pin15 Pin16 Pin17 Pin18 Pin19 PC11 SWCLK VCC SWDIO GND RES I/O SWCLK VCC SWDIO Groud RESET ConnecttheJ-LinksimulatorSWCLK Powersupply (2.3Vto3.6V)3.3Vwillberecommended ConnecttheJ-LinksimulaorSWDIO Grounding Activewhensetlowlevel 5 ShenzhenRF-starTechnologyCo.,Ltd. l PCBPackageSize Thicknessofthemoduleis1.9 0.2mm Figure 2ModuleSize 6 ShenzhenRF-starTechnologyCo.,Ltd. l SchematicDiagram Figure 3SchematicDiagram 7 ShenzhenRF-starTechnologyCo.,Ltd. l LayoutProposals TheserpentineantennaonPCBisfreespaceelectromagneticradiation.Theplaceandlayout rangearekeystoenhancethedatarateandtransmitrange. ThusBelowarethelayoutproposalsforantennaandroute:
1,Placetheantennaontheedge(corner)ofthePCBbackplane. 2,Makesurethereisnosignalorcopperfoilineachlayer. 3,Hollowingouttheyellowpanepart(figure4)tomakelessS11interference. Figure 4 8 ShenzhenRF-starTechnologyCo.,Ltd. l RecommendedOperatingConditions Notes
(1)Theoperatingtemperatureislimitedtothechangeofcrystal
(2)ToensuretheRFperformance,theripplewaveonthesourcemustbelessthan sfrequency;
Identification TestCondition Batterymode
/
Source&IO Operating Temperature Environmental HotPendulum Min 2.3
-40
-20 Typ 3.3 25 Max 3.6 85 20 300mV Unit V
/Min 9 ShenzhenRF-starTechnologyCo.,Ltd. l ReflowConditions 1.Heatingmode conventionalconvectionorIRconvection 2.Timesallowedtoreflow:2times,forthebelowreflow(conditions) 3.Temperaturecurve:thereflowshouldbeinaccordancewiththetemperaturecurveshownbelow
(figure5) 4.Highest 245C figure 5 Figure5Parts heat-resistancetemperaturecurveforwelding(weldingpoint 10 ShenzhenRF-starTechnologyCo.,Ltd. l ElectrostaticDischargeWarnings Modulewillbedamagedforthedischargeofstatic,RFstarsuggestthatallmodulesshould followthe3precautionsbelow.:
1,Accordingtotheanti-staticmeasures,barehandsarenotallowedtotouchmodules. 2,Modulesmustbeplacedinanti-staticareas. 3,Taketheanti-staticcircuitry(wheninputtingHVorVHF)intoconsiderationinproduct design. Staticmayresultinthedegradationinperformanceofmodule,evencausingthefailure. 11 ShenzhenRF-starTechnologyCo.,Ltd. l ContactUs SHENZHENRFSTARTECHNOLOGYCO.,L TD. Tel07558632 9829 Web: www.szrfstar.com Fax07558632 9413 Add2F,Block8,Dist.A,InternetI ndustry Base,Baoyuan Road ,Baoan Dist,Shenzhen E-mailsales@szrfstar.com 12 1 IS-ZB-001(ZIGBEE) Module This module is shenzhen letter chi da technology co., LTD., based on the Silabs EFR32MG1B232 chip design of Wireless Gecko series system level module (SoC), based on the 32-bit energy-saving ARM architecture (M4 nuclear, 40 MHZ operating frequency, integrated with 2.4 GHz balanced/unbalanced converter, 2.4 GHz send power of up to 19.5 dBm power amplifier (PA) of the radio transceiver.Able to support wireless communication protocols such as Thread and ZigBee.It is mainly used for home connection, lighting, health and medical care, measurement and home and building automationandsafety. FCC Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. If the FCC identification number is not visible when the module is installed inside the host, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Contains Transmitter Module Contains FCC ID: 2ABN2-RSZB001 or Contains FCC ID: 2ABN2-RSZB001 Any similar wording that expresses the same meaning may be used. The host, which the modular was installed in, should provide the shielding for the transmitter.