TB1206 Product specification Revision note Date 2018-12-18 Version V1.0 Description The first version ShenzhenTopbandCo.,Ltd. CONTENT CONTENT 1. OVERVIEW ........................................................................................................................ 1 1.1 Product features .................................................................................................................... 1 1.2 Application field ................................................................................................................... 2 2. ELECTRICAL PARAMETERS .......................................................................................... 2 2.1 working conditions ............................................................................................................... 2 2.2 Power consumption parameters ........................................................................................... 3 3. RADIO FREQUENCY CHARACTERISTICS .................................................................. 4 3.1 Radio frequency (rf) basic characteristics ............................................................................ 4 3.2 Output power ........................................................................................................................ 4 3.3 The adjacent channel inhibition ........................................................................................... 4 3.4 Receiving sensitivity ............................................................................................................ 5 4. MODULE INTERFACE ...................................................................................................... 5 4.1 Size package ......................................................................................................................... 5 4.2 Pin definition ........................................................................................................................ 6 5. ANTENNA INFORMATION .............................................................................................. 7 5.1 Type of antenna .................................................................................................................... 7 5.2 Reduce the antenna interference .......................................................................................... 7 5.3 An external antenna connector ............................................................................................. 8 6. ENCAPSULATES INFORMATION AND PRODUCTION GUIDANCE ........................ 8 6.1 Mechanical dimensions ........................................................................................................ 8 6.2 Production guide .................................................................................................................. 9 6.3 Reflow soldering temperature curve .................................................................................. 10 6.4 Peripheral wiring advice ..................................................................................................... 11 APPENDIX - DESIGN INFORMATION ................................................................................ 11 FCC COMPLIANCE ............................................................................................................... 12 I TB1206 Product specification 1.Overview TB1206 is a low power consumption embedded Wi-Fi module ,developed by the Shenzhen Topband Co., ltd. It consists of a high level of integration of wireless RF chip ESP8266 and small amounts of peripheral componentsWith built-in wi-fi network protocol stack and rich library functions.TB1206 is embedded ultra-low power consumption of the 32-bit RISC processorWith 16 bits simple model CPU clock speeds up to 160 MHZsupports real-time operating system RTOSCan use up to 80%
of the capacity for application programming and development TB1206 integrates all wi-fi MAC and complete TCP/IP protocol function library The user can use the module for networking function added to existing equipment Also can build an independent network controller and develop Wi-Fi product embedded to satisfy his needs 1.1 Product features SOC features Built-in ultra-low power consumption 32-bit MCU The main frequency supports 80 MHZ and 160 MHZsupports RTOS Built-in TCP/IP protocol stack Built-in 1 road 10 bits high precision ADC Rich peripheral interfaces 2 X UART 1 X ADC 1 X En 1 X Wake up the pin 1 X HSPI 1 X I2C 1 X I2S Most 11 X GPIOs Wi-Fi connectivity 1 TB1206 Product specification Supports 802.11 b/g/n. Supports the STA/AP/STA + AP mode Supports WPA/WPA2 security mechanism. Supports WEP/TKIP/AES encryption type. Supports the AT remote upgrade and the clouds OTA upgrade. Supports SmartConfig and AP two types of Matching network (Including Android and iOS devices). 1.2 Application field Intelligent building Smart home Intelligent security Industrial wireless control The baby monitor Wise medical Wise energy 2.Electrical parameters 2.1 working conditions Parameter Working voltage Working temperature Working humidity Storage temperature Electrostatic Table 2-1 normal working conditions Minimum value 3.0 Typical value 3.3 Maximum value 3.6
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85 90 85 2 2 Unit Remark V
%RH KV TAMB=25 TB1206 Product specification
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0.5 KV TAMB=25 discharge voltage ( Human body model) Electrostatic discharge voltage
( Machine model) 2.2 Power consumption parameters Table2-2 power consumption parameters Mode Minimum value Tx802.11bCCK 11MbpsPOUT=+17dBm Tx802.11g OFDM 54 MbpsPOUT =+15dBm Tx802.11nMCS7POUT =+13dBm Rx 802.11b length of the packet 1024 byte
-80dBm Rx 802.11g length of the packet 1024 byte
-70dBm Rx 802.11n length of the packet 1024 byte
-65dBm Modem-sleep Light-sleep Deep-sleep Power outages
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Typical values 170 140 120 50 56 56 15 0.9 20 0.5 Maximum values Unit
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mA mA mA mA mA mA mA mA A A Note : Modem-Sleep mode is used for scenes where the CPU needs to work all the time, such as applied in PWM or I2S and so on. When Wi-Fi keeps connective, and if there is no data transmission, shut down the circuit of Wi-Fi Modem to save power according to 802.11 standard ( e.g U-APSD ). For example, while it with DTIM3, maintain sleep for 300ms, and receive Beacon package from AP in the awake interval time for 3ms, the current consumption would be 15mA. Note : Light-Sleep mode is used for applications where the CPU is intended to be paused, 3 TB1206 Product specification like switch of Wi-Fi. When Wi-Fi keeps connective, and if there is no data transmission, turn off the circuit of Wi-Fi Modem and pause CPU to save power according to 802.11 standard
( e.g U-APSD ). For example, while it with DTIM3, maintain sleep for 300ms, and receive Beacon package from AP in the awake interval time for 3ms, the current consumption would be 0.9mA. Note : Deep-Sleep mode is used for scenes where Wi-Fi needs no to be maintained connective. It takes a long time to send data package once. For example, the sensor that measures temperature at a time per 100 second, whose whole average current consumption would be much less than 1mA when it needs 0.3s-1s to connect AP after awakening per 300 second. 3.Radio frequency characteristics 3.1 Radio frequency (rf) basic characteristics Parameter Working frequency Wi-Fi standard Data transfer rate Table 3-1 rf basic features Instructions 2.412~2.462GHz IEEE 802.11b/g/n (Channel 1-11) 802.11b 802.11g 802.11n 125.511Mbps 69121824364854Mbps HT20MCS0~7 3.2 Output power Max power<20dBm Parameter Table 3-2 output power Typical values minimum value Maximum values Under 72.2 Mbps Output power of the PA Under 11b mode Output power of the PA 15.5 17.5 3.3 The adjacent channel inhibition 16.5 18.5 17.5 19.5 Unit dBm dBm Table 3-3 adjacent channel inhibition parameter minimum Typical Maximum Unit 4 TB1206 Product specification OFDM6Mbps OFDM54Mbps HT20MCS0 HT20 MCS7 3.4 Receiving sensitivity Parameter DSSS1Mbps CCK11Mbps 6Mbps1/2 BPSK 54Mbps3/4 64-QAM value values values
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37 21 37 20
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able 3-4 receiving sensitivity Minimum value Typical values Maximum values
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dB dB dB dB Unit dBm dBm dBm dBm dBm HT20MCS765 Mbps72.2 Mbps 4.Module interface 4.1 Size package TB1206 is divided into TB1206-E and TB1206 - P two types depending on the different types of antenna TB1206 - E size of the appearance is 18 mm (W) x 14.3 mm (L) x 3.5 mm (H) Its appearance dimensions is as shown in figure 4-1 TB1206
-p appearance size is 18 mm (W) x 21 mm (L) x 3.5 mm (H) Its appearance dimensions is as shown in figure 4-2 5 TB1206 Product specification Figure 4-1 TB1206 - E appearance size figure Figure 4-2 TB1206 -p appearance size figure 4.2 Pin definition TB1206 pin map is as shown in figure 4-3Pin function description table is as shown in table 4-1 Figure 4-3 module pin map Table 4-1 module pin function specification table Name VCC EN IO14 IO12 type P I I/O I/O Functional specifications 3.3 V power supply (VDD) enabled pin of outside of Chip needs to be pulled high for normal work GPIO14HSPI_CLK GPIO12HSPI_MISO Pin 1 2 3 4 6 TB1206 Product specification IO13 IO15 IO2 IO0 GND IO4 RXD TXD GND IO5 RST ADC IO16 GND I/O I/O I/O I/O P I/O I/O I/O P I/O I I I/O P GPIO13HSPI_MOSIUART0_CTS GPIO15 MTDOHSPICSUART0_RTS GPIO2UART1_TXD GPIO0SPI_CS2 GND GPIO4 GPIO3 Can be used as UART Rx when copying Flash content GPIO1 Can be used as UART Tx when copying Flash content GND GPIO5 An external reset signal (effective low level) Reset module A/D conversion pin Deep sleep wake up GND 5 6 7 8 9 10 11 12 13 14 15 16 17 18 TB1206 supports UART Downloading mode and Flash Booting modein different work modePin is defined as shown in table 4-2 Table 4-2 pin mode GPIO15 Model UART Downloading mode Flash Boot mode Low Low 5.Antenna information 5.1 Type of antenna GPIO0 Low High GPIO2 High High TB1206 -E is for the IPX antenna specifications TB1206 - P is for a PCB antenna specifications 5.2 Reduce the antenna interference When using PCB antenna on Wi-Fi moduleIn order to ensure the optimization of 7 TB1206 Product specification Wi-Fi performanceSuggested that the module antenna part and other metal components at least above 16 mm distance User PCB don't route or has no copper in antenna areaSo as not to affect the antenna performance 5.3 An external antenna connector External antenna connector size is as shown in figure 5-1. Figure 5-1 external antenna connector size chart 6.Encapsulates information and production guidance 6.1 Mechanical dimensions Figure 6-1 TB1206 - E mechanical size chart 8 TB1206 Product specification Figure 6-2 TB1206 -p mechanical size chart Figure 6-3 TB1206 - E side view Figure 6-4 TB1206 - P side view 6.2 Production guide Factory module storage conditions is as followmust be SMT by SMT machine And must finish SMT in 24 hours of open the packaging and copying firmware Otherwise, it needs to be vacuum-packed againbaking module Before SMT SMT need instruments 9 TB1206 Product specification Reflow soldering SMT machine AOI monitor 6-8 mm diameter suction nozzle Baking need equipment Cabinet baking box Antistatic, high temperature resistant tray Antistatic high temperature resistant gloves Factory module storage conditions is as follow Moisture bag must be stored in temperature < 30 Environment humidity <
85% RH Dry packaging productsThe shelf life should be 6 months from the date of packing seal In the whole process of production Operators must wear electrostatic ring for each station When operating, prevent module from touching water or dirt 6.3 Reflow soldering temperature curve Recommend the use of lead-free soldering Reflow soldering less than 2 times. Reflow soldering temperature curve are shown in figure 6-5 below. 10 TB1206 Product specification Ramp to Reflow-temperature:25150C time6090s temperature riseing ramp rate:13C/s. Preheat temperature zone- temperature:150200C time60-120s. Reflow soldering area-temperature: greater than217C time60-90s; Peak temperature235250C time 3070s. cooling zone- temperature: Peak temperature180C, temperature Cooling down ramp rate:-1-5 C/s. solder-tin silver copper alloy Lead-free solder (SAC305) Figure 6-5 reflow soldering temperature curve 6.4 Peripheral wiring advice The TB1206 integrates high-speed GPIO and peripheral interfacesThis can cause severe switching noiseIf some applications require higher power consumption and EMI characteristicsIt is recommended to connect resistance of 10~100 ohms in series on digital I/O lineThis prevents too much impact when switching the power supplyand make the signal smoothIt also prevents the release of static electricity
(ESD) to a certain extent. Appendix - design information Espressif ESP8266 resources ESP8266 quick start guide. ESP8266 SDK start guide. ESP8266 SDK. ESP8266 download tool. 11 TB1206 Product specification ESP8266 official BBS. ESP8266 resources collection. FCC Compliance This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful in a residential installation.This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur ina particular installation.If this equipment does cause harmful interference to radio or television reception,which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
interference Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
"This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body." This module is designed to comply with the FCC statement, FCC ID is: 2ADDWTB1206. The host system using this module, should have label in a visible area indicated the following texts: "Contains FCC ID: 2ADDWTB1206". The host will Satisfy Class I or Class permissive change based this module FCC ID 12 TB1206 Product specification Manufacture: Shenzhen Topband Co., Ltd. Manufacture address: Topband Industrial Park, Liyuan Industrial Zone, Shiyan Town, BaoAn District, Shenzhen, Guangdong, China, 518108 Importer: XXXXXX Importer address: XXXXXXXX 13