Uascent Technology Co., Ltd UAW6158B Wi-Fi and Bluetooth Combo SoC Module Datasheet Office: 7th Floor,Building A2,Chuangzhi Yuncheng,Liuxian Avenue,Xili Community, Nanshan District, Shenzhen, China TEL: +86-755-8257-1152 E-MAIL: marketing@uascent-iot.com Website: www.uascent-iot.com Customer Approval :
Company Title Signature Date Uascent Uascent Technology Co., Ltd 1 www.uascent-iot.com Revision History. Version Date Revision Content 1.0 2021/07/12 New version Draft Nick Approved Jeremywu UAW6158B Uascent Technology Co., Ltd 2 www.uascent-iot.com UAW6158B CONTENTS 1 Overview. ................................................................................................................................ 4 1.1 Introduction. ............................................................................................................................4 1.2 Features. .................................................................................................................................4 1.3 Model General Specification. ................................................................................................. 5 1.4 Recommended Operating Rating. ......................................................................................... 5 1.5 Reference power consumption for conventional continuous operation. ............................... 5 1.6 System Power Consumption. .................................................................................................6 1.7 ESD Specifications ..................................................................................................................7 2 WiFi Specification. ...................................................................................................................7 4 Pin Descriptions. ......................................................................................................................8 4.2 Pin Definition. ......................................................................................................................... 9 4.3 Power-ON Sequence. .......................................................................................................... 10 Reset Timing Parameters ..........................................................................................................11 4.4 Reset control. ....................................................................................................................... 12 4 Host Interface Timing Diagram. .............................................................................................12 4.1 SDIO Pin Description. .......................................................................................................... 12 4.2 SDIO Characteristics. ...........................................................................................................12 4.3 SDIO version 2.0 Timing Specifications. ............................................................................. 13 5 Dimensions. ...........................................................................................................................13 5.1 Module Picture. .....................................................................................................................13 5.2 Marking Description. .............................................................................................................14 5.3 Module Physical Dimensions. .............................................................................................. 15 5.4 PCB Layout Reference. ....................................................................................................... 15 6 Reference Design. .................................................................................................................16 7 Environmental Requirements. ............................................................................................... 16 7.1 Recommended Reflow Profile. .............................................................................................16 7.2 Patch Wi-Fi modules installed before the notice. .................................................................17 7.3 Humidity sensitive control. ....................................................................................................18 8 Package style. ....................................................................................................................... 19 8.1 Reel. ..................................................................................................................................... 19 8.1.1 Packaging Detail. .............................................................................................................. 19 8.2 Antistatic tray. ....................................................................................................................... 20 8.2.1 Packaging Detail. .............................................................................................................. 21 9 Purchase Packaging Information. ......................................................................................... 22 10 Disclaimer and copyright notice. ......................................................................................... 23 Uascent Technology Co., Ltd 3 www.uascent-iot.com UAW6158B 1 Overview. 1.1 Introduction. UAW6158B is a wireless SDIO 1T1R 11b/g/n Wi-Fi and Bluetooth Low Energy 5.0 module designed with the latest low-power simple-chip, which adopts advanced design technology to achieve Low Power consumption and high throughput Up to 150Mpbs, and communicates with peripherals through the SDIO interface. The module works in the 2.4GHz band and supports 802.11b /g/n wireless standard. The UAW6158B series supports BLE Master, Slave, Advertiser, Scanner roles. It supports standard HCI in BLE side. The module adopts 3.3V single power supply and SMT installation mode, which can be flexibly applied to all kinds of consumer products to meet customer needs to the greatest extent. The UAW6158B integrated the Balun, T/R switch, LNA, PA with advanced architecture enhancement to achieve great receive sensitivity for noisy home scenarios. This compact module is a total solution for Wi-Fi technology. The module is specifically developed for Smart phones and Portable devices. 1.2 Features. IEEE 802.11 b/g/n compliant. Bluetooth Low Energy version 5.0. Internal co-existence scheme between Wi-Fi and Bluetooth. Concurrent slave/advertiser/scanner operations supported. Support 20/40MHz up to MCS7 150Mbps. Andes D10F 32-bit RISC core which runs at up to 320MHz. 128KB ROM and up to 384KB SRAM for Instruction and data SRAM in total. STA, SoftAP and Sniffer modes supported. Concurrent AP + STA supported. Ad-hoc, peer-to-peer and Wi-Fi Direct modes supported. Low power Tx/Rx for short range scenario. Low power beacon listen mode. Low power dormant mode. Low power Shut-Down mode. Suspend/Wake-up manger controller. Security and encryption. AES/SHA/ECC hardware acceleration. Master mode supported. SIG Mesh v1.01 supported. Device Provision Protocol (DPP) with BLE 5.0 Extended Advertising supported. Uascent Technology Co., Ltd 4 www.uascent-iot.com UAW6158B Block Diagram:
SDIO 1.3 Model General Specification. Model Name UAW6158B Product Description Support Wi-Fi + Bluetooth Dimension Wi-Fi Interface L x W x T: 12 x 12 x 1.8 (typical) mm Support SDIO Operating temperature
-10C to 70C Storage temperature
-40C to +125C 1.4 Recommended Operating Rating. Description Min. Typ. Ambient Temperature (TA) VBAT VDDIO
(VIL)
(VIH)
(VT+)
(VT-) Input Low voltage when VDDIO=3.3V Input High voltage when VDDIO=3.3V Schmitt trigger low to high threshold voltage when VDDIO=3.3V Schmitt trigger high to low threshol voltage when VDDIO=3.3V
(VOL) Output low voltage when VDDIO=3.3V
-10 3.13 1.75
-0.3 2 1.6 1.27 25 3.3 1.8 or 3.3 1.74 1.4
(VOH) Output high voltage when VDDIO=3.3V 2.4 Max. 70 3.46 3.46 0.8 3.6 1.89 1.56 0.4 Unit deg.C V V V V V V V V 1.5 Reference power consumption for conventional continuous Uascent Technology Co., Ltd 5 www.uascent-iot.com operation. UAW6158B Parameter Condition / Notes Typ. Unit IRF IRF IRF IRF IRF IRF IRF IRF TX model RX model 11b 11M 11g 54M 11n HT20 MCS7 11n HT40 MCS7 11b 11M 11g 54M 11n HT20 MCS7 11n HT40 MCS7 212 161 163 163 33 33 33 33 mA mA mA mA mA mA mA mA 1.6 System Power Consumption. Note: All results are measured at the condition that VIO and VBAT are 3.3V. Peak operating reference power consumption. Power Consumption at DCDC mode (DCDC buck convertor is enable) WLAN Operational Modes OFFa Rx, CCK, 1 Mbps Rx, OFDM, 54 Mbps Rx, HT20, MCS7 Rx, HT40, MCS7 Tx, CCK, 1 Mbps Tx, OFDM, 54 Mbps@15dBm Tx, HT20, MCS7@15dBm Tx, HT40, MCS7@15dBm Power-saving(MCU_off)b , DTIM1 Power-saving(MCU_off)b , DTIM3 Typ.
<1 33 33 33 33 212 161 163 163 0.43 0.21 Power Consumption at LDO mode (DCDC buck convertor is disable) WLAN Operational Modes OFFa Rx, CCK, 1 Mbps Rx, OFDM, 54 Mbps Rx, HT20, MCS7 Rx, HT40, MCS7 Tx, CCK, 1 Mbps@19dBm Typ.
<1 80 80 80 80 243 Unit uA mA mA mA mA mA mA mA mA mA mA Unit uA mA mA mA mA mA Uascent Technology Co., Ltd 6 www.uascent-iot.com Tx, OFDM, 54 Mbps@15dBm Tx, HT20, MCS7@15dBm Tx, HT40, MCS7@15dBm Power-saving(MCU_off)b , DTIM1 Power-saving(MCU_off)b , DTIM3 214 215 215 1.20 0.45 UAW6158B mA mA mA mA mA Intra-beacon Sleep when MCU is turn off. a. OFF mode test condition: VBAT=GND, RVDD33=GND, VDD=3.3V, LDO_EN=0V. b. c. Conditions: VBAT=GND, RVDD33=GND, VDD=3.3V. d. When the CPU CLK is 160MHz, the Tx current increases 10mA, when the CPU CLK is 320MHz, the Tx current increases 20mA. e. When the CPU CLK is 160MHz, the Rx current increases 6mA, when the CPU CLK is 320MHz, the Rx current increases 12mA. 1.7 ESD Specifications Pin Type Human Body Mode (HBM) CDM Test Conditio refers to MIL-STD- 883G Method 3015.7
-20 ESD Rating Pass 3 Pass 500 Unit KV V 2 WiFi Specification. Features Main Chipset Operating Frequency Operating Voltage Host Interface WIFI Standard Descriptions iComm SV6158M 2.4122.484GHz, 1T1R compliant 3.3Vdc 10% supply voltage SDIO Wi-Fi:
Modulation Wi-Fi:
PHY Data rates Wi-Fi:
Transmit Output Power Wi-Fi:
IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, 802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps), 802.11 g/n: OFDM 802.11b: 11, 5.5, 2, 1 Mbps 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps 802.11n: up to 150Mbps HT20 MCS0-MCS7HT40 MCS0-MCS7 802.11b@11Mbps 172dBm 802.11g@54Mbps 142dBm 802.11n@65Mbps 132dBm Other rate power control by power by rate. Uascent Technology Co., Ltd 7 www.uascent-iot.com UAW6158B EVM Receiver Sensitivity
(HT20) Receiver Sensitivity
(HT40) Operating Channel 802.11b /11Mbps: EVM-18dB 802.11g /54Mbps: EVM-28dB 802.11n /65Mbps: EVM-30dB 802.11b@8% PER11Mbps< -88dBm 802.11g@10% PER 54Mbps< -74dBm 802.11n@10% PER MCS 7 <-72dBm 802.11n@10% PER MCS 7 <-69dBm Wi-Fi 2.4GHz:
11: (Ch. 1-11) United States(North America) 13: (Ch. 1-13) Europe 14: (Ch. 1-14) Japan Network Architecture Wi-Fi: Ad-hoc, peer-to-peer and Wi-Fi Direct modes supported WFA features Wi-Fi: WEP,WPA, WPA2,WPA3 WMM Antenna Needs to be added antenna 2.1 Bluetooth Specifications. Features Main Chipset Operating Frequency Operating Voltage Host Interface Bluetooth Standard Transmit Output Power Receiver Sensitivity Antenna Descriptions iComm SV6158M 2.4022.480GHz 3.3Vdc 10% supply voltage SDIO IEEE 802.11 d/e/i/k/r/w supported Typ. 6dBm Max. 10dBm Typ. -91dBm Max. -94dBm Needs to be added antenna 3 Pin Descriptions. 3.1 Pin Outline. Uascent Technology Co., Ltd 8 www.uascent-iot.com UAW6158B 3.2 Pin Definition.
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Name GND ANT GND NC Type P RF P Description Ground connections Antenna connections Ground connections Voltage Pin No. 1 2 3 4 5 9 10~11 12 13 14 15 16 17 18 19 20 21 22 GPIO12 I/O 6~8 NC VDD33 NC LDO_EN WAKE_UP_HOSH SDIO_D2 SD_D3 SD_CMD SD_CLK SD_D0 SD_D1 GND NC VDDIO NC P I O I/O I/O I/O I I/O I/O P P 23~30 Uascent Technology Co., Ltd Floating (Dont connected to ground) GPIO, Strap Floating (Dont connected to ground) Supply 3.3V Floating (Dont connected to ground) Wi-Fi reset pin, default pull high WLAN to wake-up HOST SDIO Data line 2 SDIO Data line 3 SDIO Command Input SDIO Clock Input SDIO Data line 0 SDIO Data line 1 Ground connections Floating (Dont connected to ground) I/O Voltage supply input 1.8V to 3.3V Floating (Dont connected to 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 1.8V ~ 3.3V 9 www.uascent-iot.com UAW6158B 31 32 33 34~35 36 37 38 40~44 GND NC GND NC GND GPIO1 GPIO0 NC P P P I/O I/O ground) Ground connections Floating (Dont connected to ground) Ground connections Floating (Dont connected to ground) Ground connections GPIO,UART_LOG_TX GPIO,UART_LOG_RX Floating (Dont connected to ground) P:POWER I:INPUT O:OUTPUT 3.3 Power-ON Sequence. the UAW6158B from power-up to Shows the VDD33=3.3V power-on sequence of firmware download, including the initial device power-on reset evoked by LDO_EN signal. The LDO_EN input level must be kept above the threshold voltage. After initial power-on, the LDO_EN signal can be held low to turn off the SV6158 or pulsed low to induce a subsequent reset. After LDO_EN is asserted, the host starts the power-on sequence of the UAW6158B. From that point, the typical UAW6158B power-on sequence is shown below:
1. Within T1+2.5ms, the internal power-on reset (POR) will be done. And host could download firmware code of DPLL setting if the crystal is not default setting, 26MHz. The internal running clock is crystal frequency. 2. After 100us of DPLL settling time, host could set internal clock to full speed and finish all the downloading of firmware code. Uascent Technology Co., Ltd 10 www.uascent-iot.com UAW6158B Power-on sequence with typical power Reset Timing Parameters Parameters Description Min. Unit Uascent Technology Co., Ltd 11 www.uascent-iot.com T1 Duration of LDO_EN signal level <
VIL_nRST(refer to its value in Table 9:
Recommended Operating Conditions and DC Characteristics) to reset the chip UAW6158B 500 us 3.4 Reset control. The UAW6158B LDO_EN pin can be used to completely reset the entire chip. After this signal has been de-asserted, the UAW6158B is in off mode waiting for host communication. Until then, the MAC, Baseband modem, and MCU subsystem blocks are powered off and all modules are held in reset. Once the host has initiated communication, the UAW6158B turns on its crystal and later on DPLL. After all clocks are stable and running, the resets to all blocks are automatically de-asserted. 4 Host Interface Timing Diagram. 4.1 SDIO Pin Description. The module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps), and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This out-of-band interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK CMD Clock Command Line 4.2 SDIO Characteristics. SDIO is compliant to SDIO specification version 2.0, supporting 1-bit and 4-bit data transfer mode, and compliant to high speed SD Bus Uascent Technology Co., Ltd 12 www.uascent-iot.com UAW6158B 4.3 SDIO version 2.0 Timing Specifications. Symbol Parameter Min. Typ. Max Unit Clock CLK (All values are referred to min(VIH) and max (VIL). fpp tTLH tTHL tISU tIH tODLY tOH Clock frequency Data Transfer Mode Clock rise time Clock fall time 0 7 7 Inputs CMD, DAT (reference to CLK) 6 2 Outputs CMD, DAT (reference to CLK)
Input set-up time Input hold time Output Delay time during Data Transfer Mode Output Hold time 2.5 50
14 14 MHz ns ns ns ns ns ns
5 Dimensions. 5.1 Module Picture. Uascent Technology Co., Ltd 13 www.uascent-iot.com L x W : 12 x 12 (+0.3/-0.1) mm UAW6158B TOP BOTTOM H: 1.8 (0.2) mm Chip PCB Weight 0.35g 5.2 Marking Description. MAC: A840XXXXXXXX Uascent Technology Co., Ltd 14 www.uascent-iot.com 5.3 Module Physical Dimensions. UAW6158B 5.4 PCB Layout Reference. Uascent Technology Co., Ltd 15 www.uascent-iot.com 6 Reference Design. UAW6158B Note:
1. VDDIO can connect 3.3V when GPIO level is 3.3V. 2. The design of the antenna should be far away from the metal parts, and the antenna connecting wire should choose the braided mesh shielding copper wire with low loss. 3. RF line as short as possible, and need to do 50 ohm impedance. 4. Please use curved or straight lines for RF layout. 5. The -type network is reserved between the RF port of the module and the antenna, and of the -type network is close to the antenna. 6. SDIO PCB Layout needs the same length, and then the ground wire is used to wrap it. 7. If PCB board antenna is used, no other metal is allowed within 8mm around the antenna, nor can copper beryllium be laid. 7 Environmental Requirements. 7.1 Recommended Reflow Profile. Referred to IPC/JEDEC standard. Peak Temperature : <250C Number of Times : 2 times Uascent Technology Co., Ltd 16 www.uascent-iot.com UAW6158B 7.2 Patch Wi-Fi modules installed before the notice. Module installed note:
1. Take and use the module, please insure the electrostatic protective measures. 2. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows:
3. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 , relative humidity: < 90% r.h. 4. The module vacuum packing once opened, time limit of the assembly:
Card:1) check the humidity display value should be less than 30% (in blue), such as:
30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption. 2.) factory environmental temperature humidity control: -30 , 60% r.h.. 3). Once opened, the workshop the preservation of life for 168 hours. 5. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 , 8 hours. 3). After baking, put the right amount of desiccant to seal packages. Uascent Technology Co., Ltd 17 www.uascent-iot.com 7.3 Humidity sensitive control. UAW6158B Uascent Technology Co., Ltd 18 www.uascent-iot.com UAW6158B 8 Package style. 8.1 Reel. A roll of 2000pcs. 8.1.1 Packaging Detail. Reel Size: 330mm*28mm Reel Anti-static plastic bag Vacuum parcel Uascent Technology Co., Ltd 19 www.uascent-iot.com Moisture proofing bead A roll of 2000pcs. UAW6158B Vacuum parcel effect diagram. Size 395mm X 370mm X 50mm A box of 10000pcs Note:
There is a "triangular arrow" on the humidity indicator card indicating at 30%RH (as shown in the picture below). If the chemical changes to pink in the circle it points to, the element is damp and needs baking. Outer box size:410mm X 395mm X 280mm 8.2 Antistatic tray. The modules are placed on an anti-static tray, and each tray is equipped with 100PCS of modules with real air anti-static packaging, moisture-proof beads and humidity labels inside the packaging. 20 anti-static trays are placed in each small carton and 5 small cartons are placed in each large carton. Uascent Technology Co., Ltd 20 www.uascent-iot.com 8.2.1 Packaging Detail. UAW6158B SIZE: L290mm X W200mm X H9.5mm Uascent Technology Co., Ltd 21 www.uascent-iot.com SIZE: 13.6mm X 13.6mm X 6mm A box of 2000pcs. UAW6158B Vacuum parcel effect diagram. Size 325mm X 230mm X 80mm A box of 10000pcs. Note:
There is a "triangular arrow" on the humidity indicator card indicating at 30%RH (as shown in the picture below). If the chemical changes to pink in the circle it points to, the element is damp and needs baking. Outer box size:430mm X 340mm X 250mm 9 Purchase Packaging Information. Part No. Description Small package UAW6158B Reel style Antistatic tray style 2000PCS 2000PCS Big box 10000PCS 10000PCS Uascent Technology Co., Ltd 22 www.uascent-iot.com Note: Please confirm the packaging style with our sales staff before purchasing this product. If no packing style is specified before purchase, we will ship the goods by our own choice of packing method. UAW6158B 10 Disclaimer and copyright notice. All information in this document is provided according to the product status quo and subject to change without notice. The contents of this document disclaim any warranties, including any warranties of fitness for sale, fitness for a particular purpose or non-infringement, and any warranties mentioned elsewhere in any proposal, specification or sample. This document is not liable for any infringement of patent rights arising from the use of the information contained in this document. This document does not grant any license, express or implied, to use any intellectual property rights, estoppel or otherwise. All trademarks mentioned herein are the property of their respective owners. 11 Attention. Due to product version upgrade or other reasons, the content of this manual may be changed. Shenzhen Uascent Technology Co., Ltd. reserves the right to modify the content of this manual without any notice or prompt. If users need to obtain the latest product information, please apply for the final document with our company.This manual is only used as a guide. Shenzhen Uascent Technology Co., Ltd. tries its best to provide the latest information in this manual, but does not guarantee that the content of the manual is completely accurate. None of the statements, information and recommendations contained in this manual constitute any warranty, express or implied. FCC statements:
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the users authority to operate the equipment.The device has been evaluated to meet general RF exposure requirement, The device can be used in portable exposure condition without restriction. Federal Communication Commission
(FCC) Radiation Exposure Statement Power is so low that no RF exposure calculation is needed. This device is intended only for OEM integrators under the following conditions: 1.The antenna Uascent Technology Co., Ltd 23 www.uascent-iot.com UAW6158B must be installed such that 20 cm is maintained between the antenna and users. 2. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, additional transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required for the installed module. Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Federal Communications Commission of the U.S. Government (FCC) and the Canadian Government authorizations are no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator shall be responsible for re-evaluating the end-product
(including the transmitter) and obtaining a separate FCC authorization in the U.S. and candada. OEM Integrators End Product Labeling Considerations: This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: " Contains, FCC ID: 2A68EJX-UAW6158B0". The grantees FCC ID can be used only when all FCC compliance requirements are met.OEM Integrators End Product Manual Provided to the End User: The OEM integrator shall not provide information to the end user regarding how to install or remove this RF module in end product user manual. The end user manual must include all required regulatory information and warnings as outlined in this document. Uascent Technology Co., Ltd 24 www.uascent-iot.com