LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module AI-LINK Features Reserving System IEEE Std. 802.11b IEEE Std. 802.11g IEEE Std. 802.11n Chip Solution WIFI Qualcomm QCA4010 Size 30.0mm*16.0mm*3.0mm Model Overview Install Module Name Standard Data Rate Band Antenna Interface LTM3210 SMT IEEE 802.11b/g/n 135Mbps 2.4 GHz Stamp Hole Note 3.3V power supply Sichuan AI-Link Technology Co.,Ltd Add: Anzhou,Industrial park,Mianyang,Sichuan Tel 13881190925 Web: http://www.changhong.com LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Feedback of customers Confirmation We accept the specification after Confirmed Customer name Customer signature Confirmation Date Please feed back this paper and first paper after your signature by the address,thanks!
ADD Anzhou,Industrial park,Mianyang,Sichuan Factory Sichuan AI-Link Technology Co.,Ltd. Approved Checked Designed Product WiFi Module Model Date LTM3210 2018-07-03 Sichuan AI-Link Technology Co., Ltd. page 2 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Record of Modification No V1.0 Date of modification 20180703 Main content of modification Initial release Reason of modification Serial number of modification Confirm Fengjie Sichuan AI-Link Technology Co., Ltd. page 3 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 1. Brief description:
IOT MODULE LTM3210 is based on Qualcomm QCA4010 complied with IEEE 802.11b/g/n standard in 2.4GHz ISM band.Supported for 135Mbps high speed wireless network connection. LTM3210 module includes the following components:
QCA4010 chip An integrated Balun to save cost and size, minimize tuning and tolerance A printed antenna 2MB SPI Flash memory and etc 2. Module Interface LTM3210 manufacturing interface LTM3210 host interfaces USB 2.0 interface with integrated controller and PHY for manufacturing test and configuration. UART host interface to a remote microcontroller with an AT style command set. 3. Package outline and Mounting:
Figure 3.1 LTM3210 module dimensions Sichuan AI-Link Technology Co., Ltd. page 4 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Table 3.1 LTM3210 module dimensions NOTE: General tolerance 0.2mm unless otherwise stated 4. Pin Definition:
Figure 4.1 top view Sichuan AI-Link Technology Co., Ltd. page 5 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Table 4.1 LTM3210 pin assignment Sichuan AI-Link Technology Co., Ltd. page 6 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 5.Bootstrap Signals Table 5.1 Bootstrap Signals 6.Timing specifications 6.1 SPI master interface timing Figure 6.1 SPI master timing Table 6.1 SPI master timing Sichuan AI-Link Technology Co., Ltd. page 7 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 6.2 SPI slave interface timing Figure 6.2 SPI slave timing 7.Product Pictures Table 6.1 SPI slave timing TOP VIEW BOTTOM VIEW Sichuan AI-Link Technology Co., Ltd. page 8 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 8.Key Materials Items Category MPN Description MFR Notes 1 2 3 IC PCB QCA4010 LTM3210 116 QFN FR-4,2LAY Crystal E3SB40E000900E 40M Qualcomm Sunlord IQPCB JWT Hosonic 9.General Requirements:
No. 7-1 7-2 7-3 7-4 7-5 7-6 Feature Operation Voltage Current Consumption Operation Temperature Antenna Type SDIO Storage Temperature Description 3.3V+/-0.3 Total3.3V@Max 410mA BW 40 MHZ@14dbm 0C to +70C Integral PCB antenna SDIO slave Interface
-45C to +135C Sichuan AI-Link Technology Co., Ltd. page 9 of 17 10.Electrical Characteristics:
10-1 IEEE 802.11b Section:
Items Specification Mode Channel Data rate TX Characteristics 1. Power Levels(Calibrated) 1) for each data rate 2. Spectrum Mask @ target power 1) fc +/-11MHz to +/-22MHz 2) fc > +/-22MHz 3 Constellation Error(EVM)@ target power 1) 1Mbps 2) 2Mbps 3) 5.5Mbps 4) 11Mbps 4. Frequency Error RX Characteristics 5 Minimum Input Level Sensitivity(each chain) 1) 1Mbps (FER 8%) 2) 2Mbps (FER 8%) 3) 5.5Mbps (FER 8%) 4) 11Mbps (FER 8%) 6 Maximum Input Level (FER 8%) LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Contents IEEE802.11b DSSS CH1 to CH11 1, 2, 5.5, 11Mbps Min. Typ. Max. Unit Remark 18.5
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-5 Typ.
-
dBm dBr dBr dB dB dB dB ppm Unit dBm dBm dBm dBm dBm
-30
-50
-10
-10
-10
-10 10 Max.
-83
-80
-79
-76
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-10 Min.
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-10 Sichuan AI-Link Technology Co., Ltd. page 10 of 17 10-2 IEEE 802.11g Section:
Items Specification Mode Channel Data rate TX Characteristics 1. Power Levels 1) for each data rate 2. Spectrum Mask @ target power 1) at fc +/-11MHz 2) at fc +/-20MHz 3) at fc > +/-30MHz 3 Constellation Error(EVM)@ target power 1) 6Mbps 2) 9Mbps 3) 12Mbps 4) 18Mbps 5) 24Mbps 6) 36Mbps 7) 48Mbps 8) 54Mbps 4 Frequency Error RX Characteristics 5 Minimum Input Level Sensitivity(each chain) 1) 6Mbps (PER 10%) 2) 9Mbps (PER 10%) 3) 12Mbps (PER 10%) 4) 18Mbps (PER 10%) 5) 24Mbps (PER 10%) 6) 36Mbps (PER 10%) 7) 48Mbps (PER 10%) 8) 54Mbps (PER 10%) 6 Maximum Input Level (PER 10%) LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Contents IEEE802.11g OFDM CH1 to CH11 6, 9, 12, 18, 24, 36, 48, 54Mbps Min. Typ. Max. Unit Remark
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-
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-10 Min.
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-20 21.5
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-5 Typ.
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-20
-28
-40
-5
-8
-10
-13
-16
-19
-22
-25 10 Max.
-85
-84
-82
-80
-77
-73
-69
-65
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dBm dBr dBr dBr dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm Sichuan AI-Link Technology Co., Ltd. page 11 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 10-3 IEEE 802.11n HT20 Section:
Items Specification Mode Channel Data rate (MCS index) TX Characteristics 2. Power Levels 1) for each data rate 3. Spectrum Mask @target power 1) at fc +/-11MHz 2) at fc +/-20MHz 3) at fc > +/-30MHz 4. Constellation Error(EVM)@ target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 5. Frequency Error RX Characteristics 6. Minimum Input Level Sensitivity(each chain) 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%) 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%) 7. Maximum Input Level (PER 10%) Remark Contents IEEE802.11n HT20 @ 2.4GHz ISM OFDM CH1 to CH11 MCS0/1/2/3/4/5/6/7 Typ. Typ. 19.5
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Typ.
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Max. Max.
-
-20
-28
-45
-5
-10
-13
-16
-19
-22
-25
-28 10 Max.
-82
-79
-77
-74
-70
-66
-65
-64
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Unit Unit dBm dBr dBr dBr dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm Min. Min.
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-10 Min.
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-20 Sichuan AI-Link Technology Co., Ltd. page 12 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module Remark 10-4 IEEE 802.11n HT40 Section:
Items Specification Mode Channel Data rate (MCS index) TX Characteristics 1. Power Levels (Calibrated) 1) for each data rate 2. Spectrum Mask @target power 1) at fc +/-22MHz 2) at fc +/-40MHz 3) at fc > +/-60MHz 3. Constellation Error(EVM)@target power 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 4. Frequency Error RX Characteristics 5. Minimum Input Level Sensitivity(each chain) 1) MCS0 (PER 10%) 2) MCS1 (PER 10%) 3) MCS2 (PER 10%) 4) MCS3 (PER 10%) 5) MCS4 (PER 10%) 6) MCS5 (PER 10%) 7) MCS6 (PER 10%) 8) MCS7 (PER 10%) 6. Maximum Input Level(PER 10%) Contents IEEE802.11n HT40 @ 2.4GHz ISM OFDM CH3 to CH9 MCS0/1/2/3/4/5/6/7 Min. Min.
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-10 Min. Typ. Typ. 19.2
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-5 Typ.
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-20
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Max. Max.
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-20
-28
-45
-5
-10
-13
-16
-19
-22
-25
-28 10 Max.
-79
-76
-74
-71
-67
-63
-62
-61
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Unit Unit dBm dBr dBr dBr dB dB dB dB dB dB dB dB ppm Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm Sichuan AI-Link Technology Co., Ltd. page 13 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 11.Mechanical, Environmental and Reliability Tests Test Items 4-1 Drop test 4-2 Vibration test 4-3 Impact test Test Conditions The packed samples within 100Kg can be tested Drop height:
Face Side: 800/600/450mm Edge line: 600/450/350mm Drop time: 1 each Face and edge. X-Y-Z direction, first Frequency changing from 10Hz to 30Hz to 10Hz
,amplitude 0.75mm, 5 times vibrations, then frequency Changing from 30Hz to 55 Hz to 30 Hz, amplitude 0.15mm, 5 time vibration. Impact acceleration:
50m/sec2;
Impact duration: 16ms Impact times: 1000. 4-4 4-5 Soldering ability test Soldering temperature:
2355 Soldering duration:
20.5S Humidity test Leave samples in 403, 93% RH @ 96 hours 4-6 High temperature load life test Thermostat cabinet temperature: 555 Applied voltage:
110% rated voltage Working duration: 200 hour
(Supply Voltage Cycle 23h power on, 1h power off) Qty 1xBox 3 3 3 3 Criteria Condition After drop test, the outer box and inner box will not visual been inspection. appearance broken by test, After the Appearance, Power EVM and Frequency error shall be satisfied with the specification. test, After the Appearance, Power EVM and Frequency error shall be satisfied with the specification. the soldered area must be 1. After soldering, covered by a smooth bright solder layer, some deficiencies such as a small amount of the pinhole, not wetting are allowed, but the deficiencies can not be in the same place 2. At least 90% of soldered area shall be covered continuously by the soldering material. Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error functional parameter shall be satisfied with the test specification. 60 After test, leave samples in standard condition for 1 hour and test, Power, EVM and Frequency error shall be satisfied with the test specification. 4-7 4-8 High temperature load test Temperature: 555 Samples work for 16 hours Low temperature storage test Leave the samples in
-253@24 hours 3 3 After test, the Appearance, Power, EVM and Frequency error shall be Satisfied with the test specification. Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification. Sichuan AI-Link Technology Co., Ltd. page 14 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 4-9 Low temperature load test 4-10 Temperature circle test 4-11 Continuous TP test 4-12 ESD Leave samples in
-153@ 2 hours, samples function shall be normal, the let samples work for 1 hour One cycle duration
-103 @3H 403 @3H Total cycle: 10x Twice cycle duration
-103@4H
+603@4H,
+25@2H@2H Discharge voltage: 2kV C: 150pF Discharge resistance330 Positive10 times 1 time for each second 3 3 3 3 test, leave the samples in standard After condition and tested the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification. test, leave the samples in standard After condition and tested Power EVM and Frequency error shall be qualified and all the characters shall be satisfied with the test specification. During test, There will not been appeared signal disconnection or interruption between DUT and AP. The products can recoverable smoothly after ESD test. Sichuan AI-Link Technology Co., Ltd. page 15 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 12.Package 1put the products into the trays 2tie up the trays 3put the trays into the box 4fill the interspace with cystosepiment 5paste the sticker on the box Sichuan AI-Link Technology Co., Ltd. page 16 of 17 LTM3210 IEEE 802.11b/g/n 1T1R SDIO IOT Module 13.FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Labeling Instruction for End User Device Integrator Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC ID: XXXXXX any similar wording that expresses the same meaning may be used. 15.19 Labelling requirements shall be complied on end user device. Labelling rules for special device, please refer to 2.925, 15.19 (a)(5) and relevant KDB publications. For E-label, please refer to 2.935. Installation Notice The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application, a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. FCC Part 15B Compliance Requirements for End User Device The OEM integrator is responsible for ensuring that the host product which is installed and operating with the module is in compliant with Part 15B requirements. Please note that For a Class B digital device or peripheral, the instructions furnished the user manual of the end-user product shall include statement set out in 15.105 Information to the user or such similar statement and place it in a prominent location in the text of the manual. Sichuan AI-Link Technology Co., Ltd. page 17 of 17