FCC ID: N7NHL7748 HL7748 module

AirPrime HL77xx Product Technical Specification 41110555 1.0 September 21, 2017 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note:

Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operators control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided as is. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. 41110555 Rev 1.0 September 21, 2017 2 Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright 2017 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless, AirPrime, AirLink, AirVantage, WISMO, ALEOS and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher is a registered trademark of NETGEAR, Inc., used under license. Windows and Windows Vista are registered trademarks of Microsoft Corporation. Macintosh and Mac OS X are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com 41110555 Rev 1.0 September 21, 2017 3 Product Technical Specification Document History Version Date Updates 1.0 September 21, 2017 Creation 41110555 Rev 1.0 September 21, 2017 4 Contents 1. INTRODUCTION ................................................................................................ 10 Common Flexible Form Factor (CF3) ................................................................................ 10 1.1. 1.2. 1.3. 1.4. 1.5. 1.6. 1.7. 1.8. Physical Dimensions ......................................................................................................... 11 General Features ............................................................................................................... 11 Architecture........................................................................................................................ 13 Interfaces ........................................................................................................................... 13 Connection Interface ......................................................................................................... 14 ESD ................................................................................................................................... 15 Environmental and Certifications ....................................................................................... 15 Environmental Specifications ................................................................................... 15 Regulatory ................................................................................................................ 16 RoHS Directive Compliant ....................................................................................... 16 Disposing of the Product .......................................................................................... 16 1.8.1. 1.8.2. 1.8.3. 1.8.4. 1.9. References ........................................................................................................................ 16 2. PAD DEFINITION ............................................................................................... 17 Pad Types .......................................................................................................................... 21 2.1. 2.2. Pad Configuration (Top View, Through Module) ............................................................... 22 3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23 Power Supply..................................................................................................................... 23 3.1. 3.2. 3.3. 3.4. Current Consumption ........................................................................................................ 24 VGPIO ............................................................................................................................... 25 USIM Interface ................................................................................................................... 25 UIM1_DET ............................................................................................................... 26 3.4.1. 3.5. 3.6. 3.7. 3.8. 3.9. USB Interface .................................................................................................................... 26 Electrical Information for Digital I/O ................................................................................... 27 General Purpose Input/Output (GPIO) .............................................................................. 28 Main Serial Link (UART1) .................................................................................................. 28 Power On Signal (PWR_ON_N) ........................................................................................ 29 3.10. Reset Signal (RESET_IN_N) ............................................................................................. 30 3.11. Analog to Digital Converter (ADC)..................................................................................... 31 3.12. Clock Interface ................................................................................................................... 32 3.13. Debug Interface ................................................................................................................. 32 3.14. JTAG Interface................................................................................................................... 32 3.15. Wake Up Signal (WAKE-UP) ............................................................................................. 33 3.16. Fast Shutdown Signal (FAST_SHUTDOWN) .................................................................... 34 3.17. PWM .................................................................................................................................. 34 41110555 Rev 1.0 September 21, 2017 5 Product Technical Specification 3.18. RF Interface ....................................................................................................................... 35 3.18.1. RF Connection ......................................................................................................... 35 3.18.2. RF Performances ..................................................................................................... 35 4. MECHANICAL DRAWINGS ............................................................................... 37 5. DESIGN GUIDELINES ....................................................................................... 39 Power-Up Sequence ......................................................................................................... 39 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. 5.8. 5.9. Module Switch-Off ............................................................................................................. 39 Sleep Mode Management ................................................................................................. 39 Power Supply Design ........................................................................................................ 40 Power On Connection Examples....................................................................................... 40 USIM1 Application ............................................................................................................. 41 EMC and ESD Guidelines for USIM1 Card ....................................................................... 41 ESD Guidelines for USB .................................................................................................... 42 PWM .................................................................................................................................. 42 6. RELIABILITY SPECIFICATION (TBC) .............................................................. 44 Reliability Compliance ....................................................................................................... 44 6.1. 6.2. Reliability Prediction Model ............................................................................................... 44 Life Stress Test ........................................................................................................ 44 Environmental Resistance Stress Tests .................................................................. 45 Corrosive Resistance Stress Tests ......................................................................... 45 Thermal Resistance Cycle Stress Tests .................................................................. 46 Mechanical Resistance Stress Tests ....................................................................... 47 Handling Resistance Stress Tests ........................................................................... 48 6.2.1. 6.2.2. 6.2.3. 6.2.4. 6.2.5. 6.2.6. 7. FCC LEGAL INFORMATION ............................................................................. 49 8. ORDERING INFORMATION .............................................................................. 51 9. TERMS AND ABBREVIATIONS ........................................................................ 52 41110555 Rev 1.0 September 21, 2017 6 List of Figures Figure 1. Architecture Overview ..................................................................................................... 13 Figure 2. Mechanical Overview (Top View and Bottom View) ....................................................... 14 Figure 3. Actual Module (Top View) ............................................................................................... 14 Figure 4. Actual Module (Bottom View) .......................................................................................... 14 Figure 5. Pad Configuration ............................................................................................................ 22 Figure 6. PWR_ON_N and PWR_OFF Sequence ......................................................................... 30 Figure 7. JTAG Timing Waveform .................................................................................................. 33 Figure 8. Relative Timing for the PWM Output ............................................................................... 34 Figure 9. Mechanical Drawing ........................................................................................................ 37 Figure 10. Dimensions and Footprint Drawing ................................................................................. 38 Figure 11. Voltage Limiter Example ................................................................................................. 40 Figure 12. PWR_ON_N Connection Example with Switch ............................................................... 40 Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor ........................... 40 Figure 14. Design Application with USIM1 Slot ................................................................................ 41 Figure 15. EMC and ESD Components Close to the USIM1. ......................................................... 41 Figure 16. ESD Protection for USB .................................................................................................. 42 Figure 17. Example of an LED Driven by the PWM0 Output ........................................................... 42 Figure 18. Example of a BUZZER Driven by the PWM0 Output ...................................................... 43 41110555 Rev 1.0 September 21, 2017 7 List of Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Supported Bands/Connectivity ........................................................................................ 10 General Features ............................................................................................................ 11 ESD Specifications .......................................................................................................... 15 Environmental Specifications .......................................................................................... 15 Pin Definition ................................................................................................................... 17 Pad Type Codes .............................................................................................................. 21 Power Supply Pad Description ........................................................................................ 23 Power Supply Electrical Characteristics .......................................................................... 23 Low Current Consumption Mode ..................................................................................... 24 Table 10. Current Consumption (Nominal Voltage at 3.7V; Ambient Temperature at +25C) ....... 24 Table 11. VGPIO Pad Description ................................................................................................... 25 Table 12. VGPIO Electrical Characteristics ..................................................................................... 25 Table 13. USIM1 Pad Description ................................................................................................... 26 Table 14. USIM1 Electrical Characteristics ..................................................................................... 26 Table 15. USB Pad Description ....................................................................................................... 26 Table 16. USB Electrical Characteristics ......................................................................................... 27 Table 17. Digital I/O Electrical Characteristics ................................................................................ 27 Table 18. GPIO Pad Description ..................................................................................................... 28 Table 19. UART1 Pad Description .................................................................................................. 28 Table 20. PWR_ON_N Pad Description .......................................................................................... 29 Table 21. PWR_ON_N Electrical Characteristics ........................................................................... 29 Table 22. RESET_IN_N Pad Description ........................................................................................ 30 Table 23. RESET_IN_N Electrical Characteristics .......................................................................... 31 Table 24. ADC Pad Description ...................................................................................................... 31 Table 25. ADC Electrical Characteristics ........................................................................................ 31 Table 26. Clock Interface Pad Description ...................................................................................... 32 Table 27. Software Trace Pad Description...................................................................................... 32 Table 28. JTAG Pad Description ..................................................................................................... 32 Table 29. JTAG Electrical Characteristics ....................................................................................... 33 Table 30. WAKE-UP Pad Description ............................................................................................. 33 Table 31. WAKE-UP Electrical Characteristics ............................................................................... 34 Table 32. FAST_SHUTDOWN Pad Description ............................................................................. 34 Table 33. FAST_SHUTDOWN Electrical Characteristics ............................................................... 34 Table 34. PWM Pad Description ..................................................................................................... 35 Table 35. PWM Electrical Characteristics (TBC)............................................................................. 35 Table 36. RF Pad Connection ......................................................................................................... 35 Table 37. Typical RX Sensitivity ...................................................................................................... 36 41110555 Rev 1.0 September 21, 2017 8 Product Technical Specification Table 38. Standards Conformity ...................................................................................................... 44 Table 39. Life Stress Test................................................................................................................ 44 Table 40. Environmental Resistance Stress Tests ......................................................................... 45 Table 41. Corrosive Resistance Stress Tests ................................................................................. 45 Table 42. Thermal Resistance Cycle Stress Tests ......................................................................... 46 Table 43. Mechanical Resistance Stress Tests .............................................................................. 47 Table 44. Handling Resistance Stress Tests .................................................................................. 48 Table 45. Ordering Information ....................................................................................................... 51 41110555 Rev 1.0 September 21, 2017 9 1. Introduction This document is the Product Technical Specification for the AirPrime HL77xx series of embedded modules. It defines the high-level product features and illustrates the interfaces for these features; and is intended to cover the hardware aspects of the product, including electrical and mechanical. Variants covered in this document are:

HL7718 HL7748 HL7749 The AirPrime HL77xx modules belong to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides data connectivity on LTE networks (as listed in Table 1 Supported Bands/Connectivity). The AirPrime HL77xx modules support a large variety of interfaces such as USB 2.0, UART, ADC, USIM interface, PWM and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions. Table 1. Supported Bands/Connectivity RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power 8 1 7 7 L H 8 4 7 7 L H 9 4 7 7 L H LTE B2 LTE B3 LTE B4 LTE B12 LTE B13 LTE B28 1850 to 1910 MHz 1710 to 1785 MHz 1710 to 1755 MHz 699 to 716 MHz 777 to 787 MHz 703 to 748 MHz 1930 to 1990 MHz 1805 to 1880 MHz 2110 to 2155 MHz 729 to 746 MHz 746 to 756 MHz 758 to 803 MHz 23dBm 2dBm 23dBm 2dBm 23dBm 2dBm 23dBm 2dBm 23dBm 2dBm 23dBm 2dBm

1.1. Common Flexible Form Factor (CF3) The AirPrime HL77xx modules belong to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique solution to a series of problems faced commonly in the WWAN module space as it:

Accommodates multiple radio technologies (LTE advanced) and band groupings. Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions. Offers electrical and functional compatibility. Provides Direct Mount as well as Socketability depending on customer needs. 41110555 Rev 1.0 September 21, 2017 10 Product Technical Specification 1.2. Physical Dimensions Introduction AirPrime HL77xx modules are compact, robust, fully shielded modules with the following dimensions:

Length: 23 mm Width: 22 mm Thickness: 2.5 mm Weight: 2.6 g Note:

Dimensions specified above are typical values. 1.3. General Features The table below summarizes the AirPrime HL77xx modules features. Table 2. General Features Feature Description Physical Electrical RF SIM interface Application interface Small form factor (146-pad solderable LGA pad) 23mm x 22mm x 2.5mm

(nominal) Metal shield can. RF connection pads (RF main interface) Baseband signals connection Single or double supply voltage (VBATT and VBATT_PA) 3.2V 4.5V HL7718 (Mono-band LTE):

HL7748 (Tri-band LTE):

LTE B13 LTE B2 LTE B4 LTE B12 HL7749 (Dual-band LTE):

LTE B3 LTE B28 Only 1.8V support for USIM1 SIM extraction / hot plug detection SIM/USIM support Conforms with ETSI UICC Specifications. Supports SIM application tool kit with proactive SIM commands NDIS NIC interface support (Windows 7, Windows 8, Linux) MBIM support Multiple non-multiplexed USB channel support Dial-up networking USB selective suspend to maximize power savings CMUX multiplexing over UART AT command interface 3GPP 27.007 standard, plus proprietary extended AT commands 41110555 Rev 1.0 September 21, 2017 11 Product Technical Specification Feature Description Introduction Protocol stack SMS Connectivity Environmental Single mode LTE operation:

LTE FDD, bandwidth 1.4-20 MHz Intra-frequency and inter-frequency mobility System Release: 3GPP Rel. 13 Category M1 (up to 375 kbit/s in uplink, 300 kbit/s in downlink) Max modulation 16 QAM UL/DL SMS over SGs SMS MO and MT SMS saving to SIM card or ME storage SMS reading from SIM card or ME storage SMS sorting SMS concatenation SMS Status Report SMS replacement support SMS storing rules (support of AT+CNMI, AT+CNMA) Multiple cellular packet data profiles Sleep mode for minimum idle power draw Mobile-originated PDP context activation / deactivation Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol). PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context RFC1144 TCP/IP header compression Operating temperature ranges (industrial grade):

Class A: -30C to +70C Class B: -40C to +85C RTC Real Time Clock (RTC) 41110555 Rev 1.0 September 21, 2017 12 Product Technical Specification 1.4. Architecture Introduction The figure below presents an overview of the AirPrime HL77xx modules internal architecture and external interfaces. Note:

Dotted parts are optional depending on variant. AirPrime HL7718, HL7748 and HL7749 26MHz Transceiver Baseband MCU DSP PMU Analog Baseband Peripherals RAM Memory 32.768KHz RX SAW Filters VBATT_PA Front-End Module

(SAW/PA/

Switch) Flash Memory LGA-

146 VGPIO LGA-

146 RESET_IN_N PWR_ON USB SIM Switch Embedded SIM Figure 1. Architecture Overview 1.5. Interfaces The AirPrime HL77xx modules provide the following interfaces and peripheral connectivity:

1x - VGPIO (1.8V) 1x - 1.8V USIM 1x - eUICC/USIM (optional embedded SIM) 1x - USB 2.0 10x - GPIOs (1 of which has a multiplex) 1x - 8-wire UART 1x - Active Low POWER ON 1x - Active Low RESET 2x - ADC 2x - System Clock Out (32,768KHz and 26MHz) 1x Debug Interface 41110555 Rev 1.0 September 21, 2017 13 Product Technical Specification 1x - JTAG Interface 1x - Wake up signal 1x - Fast shutdown signal 1x - PWM 1x - Main RF Antenna Introduction 1.6. Connection Interface The AirPrime HL77xx modules are an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB. Figure 2. Mechanical Overview (Top View and Bottom View) The 146 pads have the following distribution:

66 inner signal pads, 1x0.5mm, pitch 0.8mm 1 reserved test point (do not connect), 1.0mm diameter 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm 4 inner corner ground pads, 1x1mm 4 outer corner ground pads, 1x0.9mm Figure 3. Actual Module (Top View) Figure 4. Actual Module (Bottom View) 41110555 Rev 1.0 September 21, 2017 14 Product Technical Specification 1.7. ESD Refer to the following table for ESD Specifications. Table 3. ESD Specifications Category Connection Specification Introduction Operational RF ports Non-operational Host connector interface IEC-61000-4-2 Level (Electrostatic Discharge Immunity Test) Unless otherwise specified:

JESD22-A114 1kV Human Body Model (TBC) JESD22-A115 200V Machine Model (TBC) JESD22-C101C 250V Charged Device Model (TBC) Signals SIM connector Other host signals Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user. 1.8. Environmental and Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below. Table 4. Environmental Specifications Conditions Operating Class A Operating Class B Storage Range

-30C to +70C

-40C to +85C

-40C to +85C Class A is defined as the operating temperature ranges that the device:

Shall exhibit normal function during and after environmental exposure. Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device:

Shall remain fully functional during and after environmental exposure Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance. Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed. 41110555 Rev 1.0 September 21, 2017 15 Product Technical Specification 1.8.2. Regulatory Introduction The AirPrime HL7718 and HL7748 modules will be compliant with FCC regulations, while the AirPrime HL7749 module will be compliant with RCM regulations. 1.8.3. RoHS Directive Compliant The AirPrime HL77xx modules are compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). 1.8.4. Disposing of the Product This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner. 1.9. References

[1] AirPrime HL Series Customer Process Guidelines Reference Number: 4114330

[2] AirPrime HL77xx AT Commands Interface Guide Reference Number: 41110842

[3] AirPrime HL Series Development Kit User Guide Reference Number: 4114877 41110555 Rev 1.0 September 21, 2017 16 2. Pad Definition AirPrime HL77xx pads are divided into 2 functional categories. Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads are guaranteed to be forward and/or backward compatible with the next generation of CF3 modules. Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pad location. Other pads marked as not connected or reserved should not be used. Table 5. Pin Definition Pad #

Signal Name Function 1 2 3 4 5 6 7 8 9 10 11 GPIO1 UART1_RI UART1_RTS UART1_CTS UART1_TX UART1_RX UART1_DTR UART1_DCD UART1_DSR GPIO2 RESET_IN_N General purpose input/output UART1 Ring indicator UART1 Request to send UART1 Clear to send UART1 Transmit data UART1 Receive data UART1 Data terminal ready UART1 Data carrier detect UART1 Data set ready General purpose input/output Input reset signal I/O I/O O I O I O I O O I/O I Active Low/High Power Supply Domain Recommendation for Unused Pads Type

-

-

L L

-

-

L L L

-

L 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Left Open Connect to test point Connect to test point Connect to test point Connect to test point Connect to test point Connect to test point Connect to test point Connect to test point Connect to test point Left Open Extension Core Core Core Core Core Core Core Core Core Core 41110555 Rev 1.0 September 21, 2017 17 Product Technical Specification Pad #

Signal Name Function I/O Active Low/High Power Supply Domain Recommendation for Unused Pads Type Pad Definition 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 USB_D-

USB_D+

USB Data Negative (Low / Full Speed) USB Data Negative (High Speed) USB Data Positive (Low / Full Speed) USB Data Positive (High Speed) Not Connected Not Connected Not Connected Not Connected (Reserved for future use) Not Connected (Reserved for future use) Wake Up Not Connected (Reserved for future use) Not Connected NC NC NC NC NC WAKE-UP NC NC GNSS_FREQ_OUT 26MHz System Clock Output 32K_CLKOUT ADC1 ADC0 UIM1_VCC UIM1_CLK UIM1_DATA UIM1_RESET GND NC GND PCM_OUT*

PCM_IN*

PCM_SYNC*

32.768kHz System Clock Output Analog to digital converter Analog to digital converter 1.8V USIM1 Power supply 1.8V USIM1 Clock 1.8V USIM1 Data 1.8V USIM1 Reset Ground Not Connected Ground PCM data out PCM data in PCM sync out I/O I/O I O O I I O O I/O O 0V 0V O I I/O

-

-

H

-

-

-

-

-

-

-

L

-

-

-

3.3V 0.38V 3.3V 0.38V 1.8V 1.8V 1.8V 1.2V 1.2V 1.8V 1.8V 1.8V 1.8V 0V 0V 1.8V 1.8V 1.8V Connect to test point Extension Connect to test point Extension Left Open Left Open Left Open Left Open Left Open Mandatory connection Mandatory connection Mandatory connection Mandatory connection Mandatory connection Mandatory connection Left Open Left Open Left Open Not connected Not connected Not connected Not connected Not connected Extension Not connected Not connected Extension Extension Extension Extension Core Core Core Core Extension Not connected Extension Extension Extension Extension 41110555 Rev 1.0 September 21, 2017 18 Product Technical Specification Pad #

Signal Name Function I/O Active Low/High Power Supply Domain Recommendation for Unused Pads Type Pad Definition 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 PCM_CLK*

GND NC GND GPIO7 GPIO8 NC NC DEBUG_TX VGPIO GPIO6 NC GND RF_MAIN GND DEBUG_RX GPIO10 GPIO11 GPIO15 NC NC NC PWM0 PWR_ON_N NC PCM clock Ground Not Connected (Reserved for future use) Ground General purpose input/output General purpose input/output Not Connected (Reserved for future use) Not Connected (Reserved for future use) Debug Transmit data GPIO voltage output General purpose input/output Not Connected (Reserved for future use) Ground RF Input/output Ground Debug Receive data General purpose input/output General purpose input/output General purpose input/output Not Connected Not Connected Not Connected Pulse Width Modulation Active Low Power On control signal Not Connected I/O 0V 0V I/O I/O O O I/O 0V 0V I I/O I/O I/O O I

-

-

-

-

-

-

-

-

-

L 1.8V 0V 0V 1.8V 1.8V 1.8V 1.8V 1.8V 0V 0V 1.8V 1.8V 1.8V 1.8V 1.8V/3V 1.8V Left Open Mandatory connection Mandatory connection Left Open Connect to test point Left Open Left Open Left Open Left Open Mandatory connection Mandatory connection Mandatory connection Left Open Left Open Left Open Left Open Left Open Mandatory connection Extension Core Not connected Core Core Core Not connected Not connected Extension Core Core Not connected Core Core Core Extension Extension Extension Extension Not connected Not connected Not connected Extension Core Not connected 41110555 Rev 1.0 September 21, 2017 19 Product Technical Specification Pad #

Signal Name Function I/O Active Low/High 61 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) 62 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) 63 VBATT Power supply I I I 64 65 66 67-70 71 -

166 167 -

234 236 237 238 239 240 241 242 UIM1_DET / GPIO3 USIM1 Detection / General purpose input/output FAST_SHUTDOWN Fast Shutdown GPIO5 GND General purpose input/output Ground I/O I I/O GND Note:

These pads are not available on the AirPrime HL77xx modules. GND Ground JTAG_RESET JTAG_TCK JTAG_TDO JTAG_TMS JTAG_TRST JTAG_TDI NC JTAG RESET JTAG Test Clock JTAG Test Data Output JTAG Test Mode Select JTAG Test Reset JTAG Test Data Input Not Connected GND I I O I I I

*

This pad is not supported on the AirPrime HL77xx.

-

-

-

H L

-

L

-

-

-

L

-

Pad Definition Recommendation for Unused Pads Type Mandatory connection Core Mandatory connection Core Mandatory connection Core Left Open Left Open Left Open Left Open Left Open Left Open Left Open Left Open Left Open Core Extension Extension Core Core Extension Extension Extension Extension Extension Extension Not connected Power Supply Domain 3.2V (min) 3.7V (typ) 4.5V (max) 3.2V (min) 3.7V (typ) 4.5V (max) 3.2V (min) 3.7V (typ) 4.5V (max) 1.8V 1.8V 1.8V 0V 0V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 41110555 Rev 1.0 September 21, 2017 20 Pad Definition Product Technical Specification 2.1. Pad Types Table 6. Pad Type Codes Type I O I/O L H T T/PU T/PD PU PD N/A Definition Digital Input Digital Output Digital Input / Output Active High Active Low Tristate Tristate with pull-up enabled Tristate with pull-down enabled Pull-up enabled Pull-down enabled Not Applicable 41110555 Rev 1.0 September 21, 2017 21 Product Technical Specification 2.2. Pad Configuration (Top View, Through Module) Pad Definition I D T _ G A T J T S R T _ G A T J S M T _ G A T J O D T _ G A T J K C T _ G A T J C N T E S E R _ G A T J 242 241 240 239 238 237 236 Core pin Extension pin N _ N I _ T E S E R R S D _ 1 T R A U D C D _ 1 T R A U R T D _ 1 T R A U X R _ 1 T R A U X T _ 1 T R A U S T C _ 1 T R A U S T R _ 1 T R A U I R _ 1 T R A U 2 O I P G 1 O I P G

+

D _ B S U

-

D _ B S U C N C N C N C N C N 168 242 241 240 239 238 237 236 167 GND WAKE-UP NC NC GNSS_FREQ_OUT 32K_CLKOUT ADC1 ADC0 UIM1_VCC UIM1_CLK UIM1_DATA UIM1_RESET GND NC GND PCM_OUT GND 68 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 9 8 7 6 1 5 4 3 2 1 192 193 194 195 196 197 198 171 191 214 215 216 217 218 199 172 190 213 228 229 230 219 200 173 189 212 227 234 231 220 201 174 188 211 226 233 232 221 202 175 187 210 225 224 223 222 203 176 186 209 208 207 206 205 204 177 185 184 183 182 181 180 179 178 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 69 4 3 5 3 6 3 7 3 8 3 9 3 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8 4 9 4 0 5 1 5 70 GND GPIO5 FAST_SHUTDOWN UIM1_DET / GPIO3 VBATT VBATT_PA VBATT_PA NC PWR_ON_N PWM0 NC NC NC GPIO15 GPIO11 GPIO10 GND 169 170 N I _ M C P K L C _ M C P C N Y S _ M C P D N G C N D N G 7 O I P G 8 O I P G C N C N O I P G V 6 O I P G C N D N G X T _ G U B E D D N G I N A M _ F R X R _ G U B E D Figure 5. Pad Configuration 41110555 Rev 1.0 September 21, 2017 22 3. Detailed Interface Specifications Note:

If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL77xx modules support separate VBATT and VBATT_PA connections if requirements below are fulfilled. 3.1. Power Supply The AirPrime HL77xx modules are supplied through the VBATT and VBATT_PA signals. Refer to the following table for the pad description of the Power Supply interface. Table 7. Power Supply Pad Description Pad Number Signal Name I/O Description 63 61, 62 37, 39, 48, 67-70, 167-234 VBATT VBATT_PA GND I I Power supply (base band) Power supply (radio frequency) Ground Refer to the following table for the electrical characteristics of the Power Supple interface. Table 8. Power Supply Electrical Characteristics Supply Minimum Typical Maximum VBATT voltage (V) VBATT_PA voltage (V) Full Specification VBATT_PA voltage (V) Extended Range 3.21 3.21 2.82 (TBC) 3.7 3.7 3.7 4.5 4.5 4.5 1 2 Note:

This value must be guaranteed during the burst No guarantee of 3GPP performances over extended range Load capacitance for VBATT is around 37F 20% (TBC) embedded inside the module. Load capacitance for VBATT_PA is around 11F 20% (TBC) embedded inside the module. 41110555 Rev 1.0 September 21, 2017 23 Product Technical Specification 3.2. 3.2. Current Consumption Detailed Interface Specifications The following table lists the current consumption of the AirPrime HL77xx modules at different conditions. Note:

Typical values are defined for VBATT/VBATT_PA at 3.7V and 25C, for 50 impedance at all RF ports with VSWR1:1 and CMW500. Maximum values are defined with worst conditions among supported ranges of voltages and temperature (50, VSWR1:1 and CMW500). Table 9. Low Current Consumption Mode Parameter Typical Maximum Unit Off mode Sleep mode (deregistered from the network) PSM mode 15 1.3 100 (TBC) TBD TBD TBD A mA A Table 10. Current Consumption (Nominal Voltage at 3.7V; Ambient Temperature at +25C) Parameter Band Frequency Typical Unit LTE in communication mode (TX Max) B3 Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL LTE in communication mode (TX Max) B28 Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL LTE in communication mode (TX Max) B12 Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL LTE in communication mode (TX Max) B2 Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL LTE in communication mode (TX Max) B4 Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL LTE in communication mode (TX Max) B13 Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL 1810 MHz 1843 MHz 1875 MHz 763 MHz 781 MHz 798 MHz 734 MHz 738 MHz 741 MHz 1935 MHz 1960 MHz 1985 MHz 2115 MHz 2133 MHz 2150 MHz 751 MHz 290 285 285 275 268 260 265 260 260 290 292 303 280 284 280 250 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 41110555 Rev 1.0 September 21, 2017 24 Detailed Interface Specifications Product Technical Specification 3.3. VGPIO The VGPIO output can be used to:

Pull-up signals such as I/Os Supply the digital transistors driving LEDs The VGPIO output is available when the AirPrime HL77xx module is switched ON. Refer to the following table for the pad description of the VGPIO interface. Table 11. VGPIO Pad Description Pad Number Signal Name 45 VGPIO I/O O Description GPIO voltage output Refer to the following table for the electrical characteristics of the VGPIO interface. Table 12. VGPIO Electrical Characteristics Parameter Minimum Typical Maximum Remarks Voltage level (V) Current capability Active Mode (mA) Current capability Sleep Mode (mA) Rise Time (ms) 1.7 1.8

-

-

-

-

-

-

1.9 TBD TBD TBD Both active mode and sleep mode Power management support up to

(TBD) mA output in Active mode Power management support up to

(TBD) mA output in Sleep mode Start-Up time from 0V 3.4. USIM Interface The AirPrime HL77xx modules have one physical USIM interface, USIM1, and an optional internal USIM or eUICC. The USIM1 interface allows control of a 1.8V USIM and is fully compliant with GSM 11.11 recommendations concerning USIM functions. The five signals used by the UIM1 are as follows:

UIM1_VCC: Power supply UIM1_CLK: Clock UIM1_DATA: I/O port UIM1_RESET: Reset UIM1_DET/GPIO3: Hardware SIM detection Refer to the following table for the pad description of the USIM1 interface. 41110555 Rev 1.0 September 21, 2017 25 Product Technical Specification Table 13. USIM1 Pad Description Detailed Interface Specifications Pad Number Signal Name Description Multiplex 26 27 28 29 64 UIM1_VCC UIM1_CLK UIM1_DATA UIM1_RESET UIM1_DET / GPIO3 1.8V USIM1 Power supply 1.8V USIM1 Clock 1.8V USIM1 Data 1.8V USIM1 Reset 1.8V USIM1 Detection GPIO3 Refer to the following table for the electrical characteristics of the USIM1 interface. Table 14. USIM1 Electrical Characteristics Parameter Minimum Typical Maximum Remarks UIM1 Interface Voltage (V)

(VCC, CLK, IO, RESET) UIM1 Detect UIM1_VCC Current (mA)

-

-

-

1.80 1.80

-

-

-

10 (TBC) The appropriate output voltage is auto detected and selected by software. High active Refer to section 5.6 USIM1 Application for a USIM application example. 3.4.1. UIM1_DET UIM1_DET is used to detect and notify the application about the insertion and removal of a USIM device in the USIM socket connected to the main USIM interface (UIM1). When a USIM is inserted, the state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a USIM is removed, the state of UIM1_DET transitions from logic 1 to logic 0. Enabling or disabling this USIM detect feature can be done using an AT command. Refer to document

[2] AirPrime HL77xx AT Commands Interface Guide for more information. 3.5. USB Interface The AirPrime HL77xx modules have one Universal Serial Bus interface compliant with USB Rev 2.0

(self-powered). Refer to the following table for the pad description of the USB interface. Table 15. USB Pad Description Pad Number Signal Name 12 13 USB_D-

USB_D+

I/O I/O I/O Function USB Data Negative USB Data Positive 41110555 Rev 1.0 September 21, 2017 26 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the USB interface. Table 16. USB Electrical Characteristics Parameter Minimum Typical Maximum Units Input voltage at pins USB_D+ / USB_D-

3.15 3.3 3.45 V 3.6. Electrical Information for Digital I/O The table below enumerates the electrical characteristics of the following digital interfaces:

UART PCM JTAG GPIOs RESET PWM WAKE_UP Table 17. Digital I/O Electrical Characteristics Parameter Description Minimum Typical Maximum Units VIH VIL IIH / IIL VOH VOL IOH / IOL RPU RPD Logic High Input Voltage 0.85 x VDDIO*

Logic Low Input Voltage

-0.3 Input Leakage Current (either Low or High, and No Pull enabled) Logic High Output Voltage VDDIO* 0.45 Logic Low Output Voltage Output Leakage Current

(either Low or High) assume no external load Internal Pull Down Resistor Internal Pull Up Resistor 0 53 54 VDDIO* + 0.3 0.25 x VDDIO*

0.03 VDDIO*

0.8 0.03 89 96 164 189 7 V V A V V A K K pF Input Capacitance Input Pin Capacitance

*

VDDIO = VGPIO = 1.8V. 41110555 Rev 1.0 September 21, 2017 27 Product Technical Specification Detailed Interface Specifications 3.7. General Purpose Input/Output (GPIO) The AirPrime HL77xx modules provide 10 GPIOs, 1 of which has a multiplex. The following table describes the pin description of the GPIO interface. Table 18. GPIO Pad Description Pad Number Signal Name Multiplex I/O Power Supply Domain 1 10 40 41 46 52 53 54 64 66 GPIO1 GPIO2 GPIO7 GPIO8 GPIO6 GPIO10 GPIO11 GPIO15 GPIO3 GPIO5 UIM1_DET I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 3.8. Main Serial Link (UART1) The main serial link (UART1) is used for communication between the AirPrime HL77xx modules and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface. The main serial link (UART1) is an asynchronous serial interface. The signals used by UART1 are as follows:

TX data (UART1_TX) RX data (UART1_RX) Request To Send (UART1_RTS) Clear To Send (UART1_CTS) Data Terminal Ready (UART1_DTR) Data Set Ready (UART1_DSR) Data Carrier Detect (UART1_DCD) Ring Indicator (UART1_RI) Note:

Signal names are according to PC view. Refer to the following table for the pad description of the main serial link (UART1) interface. Table 19. UART1 Pad Description Pad Number Signal Name*

I/O*

Description 2 3 UART1_RI UART1_RTS O I Signal incoming calls (data only), SMS, etc. Request to send 41110555 Rev 1.0 September 21, 2017 28 Product Technical Specification Detailed Interface Specifications Pad Number Signal Name*

I/O*

Description 4 5 6 7 8 9 UART1_CTS UART1_TX UART1_RX O I O UART1_DTR I (active low) UART1_DCD UART1_DSR O O The AirPrime HL77xx is ready to receive AT commands Transmit data Receive data Prevents the AirPrime HL77xx from entering sleep mode, switches between data mode and command mode, and wakes the module up. Signal data connection in progress Signal UART interface is ON

*

According to PC view. Note:

UART1_CTS must be left floating or set to level 0 before starting the HL77xx module. 3.9. Power On Signal (PWR_ON_N) The PWR_ON_N signal is internally connected to the permanent 1.8V supply regulator inside the AirPrime HL77xx module via a pull-up resistor. Once VBATT is supplied to the module, this 1.8V supply regulator will be enabled and so the PWR_ON_N signal is by default at high level. A low-level signal on PWR_ON_N must be provided to switch the AirPrime HL77xx module ON, and the signal must be kept at low level to keep the module ON. Refer to the following table for the pad description of the PWR_ON_N interface. Table 20. PWR_ON_N Pad Description Pad Number Signal Name 59 PWR_ON_N I/O I Description Power the AirPrime HL77xx On Refer to the following table for the electrical characteristics of the PWR_ON_N interface. Table 21. PWR_ON_N Electrical Characteristics Parameter Minimum Typical Maximum Input Voltage-Low (V) Input Voltage-High (V) Power-up period (ms) from PWR_ON_N falling edge Always set to GND PWR_ON_N assertion time (ms) 1.33 (TBC) 25 (TBC)

-

-

-

0.51 (TBC) 2.2 (TBC)

-

41110555 Rev 1.0 September 21, 2017 29 Product Technical Specification Detailed Interface Specifications Power OFF Power ON Power OFF VBATT RESET PWR_ON_N VGPIO ( pin 45 ) Base Band PMU supply Module is OFF Module is ON Module is OFF Figure 6. PWR_ON_N and PWR_OFF Sequence As PWR_ON_N is internally pulled up with 1M, an open collector or open drain transistor must be used for ignition. Note:

VGPIO is an output from the module that can be used to check if the module is active. When VGPIO = 0V, the module is OFF When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode) Note:

To power the module off, use AT command AT+CPOF or AT+CPWROFF. 3.10. Reset Signal (RESET_IN_N) To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms (TBC). This action will immediately restart the AirPrime HL77xx module with the PWR_ON_N signal at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally pulled up, an open collector or open drain transistor should be used to control this signal. Note:

As RESET_IN_N is referenced to the VGPIO signal (1k pull-up resistor to VGPIO 1.8V) an open collector or open drain transistor should be used to control this signal. Refer to the following table for the pad description of the RESET_IN_N interface. Table 22. RESET_IN_N Pad Description Pad Number Signal Name 12 RESET_IN_N I/O I Description Hardware reset the module 41110555 Rev 1.0 September 21, 2017 30 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the RESET_IN_N interface. Table 23. RESET_IN_N Electrical Characteristics Parameter Minimum Typical Maximum Input Voltage-Low (V) Input Voltage-High (V) Reset assertion time (ms) Power-up period (ms) from RESET_IN_N falling edge*

1.33 (TBC) 20 (TBC) 2000 (TBC)

-

-

-

-

0.51 (TBC) 2.2 (TBC)

-

-

*

With the PWR_ON_N signal at low level. 3.11. Analog to Digital Converter (ADC) Two Analog to Digital Converter inputs, ADC0 and ADC1, are provided by AirPrime HL77xx modules. These converters are 8-bits resolution ADCs ranging from 0 to 1.8V. Typical ADC use is for monitoring external voltage, wherein an application is used to safely power OFF an external supply in case of overvoltage. Refer to the following table for the pad description of the ADC interface. Table 24. ADC Pad Description Pad Number Signal Name I/O Description 24 25 ADC1 ADC0 I I Analog to digital converter Analog to digital converter Refer to the following table for the electrical characteristics of the ADC interface. Table 25. ADC Electrical Characteristics Parameter Minimum Typical Maximum Unit Remarks ADCx Resolution Conversion Rate Input Voltage Range Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error Input Resistance Input Capacitance during sampling phase

-

-

0

-

-

-

-

43

-

8

-

-

1 0.5 1 1 52 3

-

2 1.8 2 1 2 2 61 bits MHz V LSB LSB LSB LSB k pF General purpose input

%FS

%FS 41110555 Rev 1.0 September 21, 2017 31 Product Technical Specification 3.12. Clock Interface Detailed Interface Specifications The AirPrime HL77xx modules support two digital clock interfaces. Enabling or disabling the clock out feature can be done using AT commands. For more information about AT commands, refer to document [2] AirPrime HL77xx AT Commands Interface Guide. Refer to the following table for the pad description of the clock out interfaces. Table 26. Clock Interface Pad Description Pad Number Signal Name I/O I/O Type Description 22 23 GNSS_FREQ_OUT 32K_CLKOUT O O 1.8V 1.8V 26MHz Digital Clock output 32.768kHz Digital Clock output 3.13. Debug Interface The AirPrime HL77xx modules provide a 2-wire debug port interface. Table 27. Software Trace Pad Description Pad Number Signal Name*

I/O*

I/O Type Description 44 51 DEBUG_TX DEBUG_RX O I 1.8V 1.8V Debug Transmit Data Debug Receive Data

*

According to module view. Note:

It is strongly recommended to provide access through Test Points to this interface. 3.14. JTAG Interface The JTAG interface provides debug access to the core of the AirPrime HL77xx modules. These JTAG signals are accessible through solder-able test points. Refer to the following table for the pad description of the JTAG interface. Table 28. JTAG Pad Description Pad Number 236 237 238 239 240 241 Note:

Signal Name JTAG_RESET JTAG_TCK JTAG_TDO JTAG_TMS JTAG_TRST JTAG_TDI Function JTAG RESET JTAG Test Clock JTAG Test Data Output JTAG Test Mode Select JTAG Test Reset JTAG Test Data Input It is recommended to provide access through Test Points to this interface the JTAG pads (for Failure Analysis debugging). All signals listed in the table above should be outputs on the customer board to allow JTAG debugging. 41110555 Rev 1.0 September 21, 2017 32 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the JTAG interface. Table 29. JTAG Electrical Characteristics Symbol Parameter Minimum Typical Maximum Unit JTAG_TCK clock period JTAG_TCK clock period high JTAG_TCK clock period low JTAG_TDI setup time to JTAG_TCK JTAG_TDI hold time from JTAG_TCK JTAG_TDO valid before JTAG_TCK low-end JTAG_TDO valid after JTAG_TCK high begin 0.038 (TBC) 26 (TBC) 12 (TBC) 12 (TBC) 12 (TBC) 10 (TBC)

-

-

-

-

78 (TBC)

-

-

-

-

-

-

0 (TBC) 20 (TBC)

-

-

MHz ns ns ns ns s ns Ftck tc2 tc3 tc4 tc5 tc6 tc7 Figure 7. JTAG Timing Waveform 3.15. Wake Up Signal (WAKE-UP) The AirPrime HL77xx modules provide one WAKE-UP signal. The WAKE-UP signal is used to wake the system up from ultra-low power modes (from OFF or Sleep modes, FAST_SHUTDOWN, or after a software power off). This signal should be set to high level

(external 1.8V) for at least (TBD) ms until the system is active to wake the module up from these modes. The system will not be allowed to go into ultra-low or off mode for as long as this signal is kept high. By default, the software waits for a high state to wake-up. Note:

The module has an embedded pull-down on this signal. After a power off mode, the only way to restart the module is to perform a hardware power off then power on if this signal is not used. Refer to the following table for the pad description of the WAKE-UP interface. Table 30. WAKE-UP Pad Description Pad Number Signal Name I/O I/O Type Description 19 WAKE-UP I 1.8V WAKE-UP 41110555 Rev 1.0 September 21, 2017 33 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the WAKE-UP interface. Table 31. WAKE-UP Electrical Characteristics I/O Type Parameter Minimum Typical Maximum Unit Digital VIL VIH 0.7 x VDDIO*

0.3 V V

*

VDDIO = VGPIO = 1.8 V. 3.16. Fast Shutdown Signal (FAST_SHUTDOWN) The AirPrime HL77xx modules provide one FAST_SHUTDOWN signal. Refer to the following table for the pad description of the FAST_SHUTDOWN interface. Table 32. FAST_SHUTDOWN Pad Description Pad Number Signal Name I/O I/O Type Description FAST_SHUTDOWN I 1.8V Shuts down the module without deregistration from the network 65 Refer to the following table for the electrical characteristics of the FAST_SHUTDOWN interface. Table 33. FAST_SHUTDOWN Electrical Characteristics I/O Type Parameter Minimum Typical Maximum Unit Digital VIL VIH 0.7 x VDDIO 0.3xVDDIO V V

*

VDDIO = VGPIO = 1.8 V. 3.17. PWM The AirPrime HL77xx modules provide one PWM signal that can be used in conjunction with an external transistor for driving a vibrator, or a backlight LED. The PWM uses two 7-bit unsigned binary numbers one for the output period and one for the pulse width or the duty cycle. The relative timing for the PWM output is shown in the figure below. Figure 8. Relative Timing for the PWM Output 41110555 Rev 1.0 September 21, 2017 34 Product Technical Specification Detailed Interface Specifications Refer to the following table for the pad description of the PWM interface. Table 34. PWM Pad Description Pad Number Signal Name 58 PWM0 I/O O I/O Type Description 1.8V PWM output Refer to the following table for the electrical characteristics of the PWM interface. Table 35. PWM Electrical Characteristics (TBC) Parameter Conditions Minimum Typical Maximum Unit VOH VOL IPEAK Frequency Duty cycle High impedance load

-

-

-

-

--

-

-

25.6 1 1.8

-

-

-

-

-

0.2 8 1625 99 V V mA kHz

%

3.18. RF Interface The RF interface of the AirPrime HL77xx modules allow the transmission of RF signals. This interface has a 50 nominal impedance. 3.18.1. RF Connection A 50 (with maximum VSWR 1.1:1, and 0.5dB loss) RF track is recommended to be connected to standard RF connectors such as SMA, UFL, etc. for antenna connection. Refer to the following table for the pad description of the RF interface. Table 36. RF Pad Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 49 RF_MAIN 50 1.5:1 1.5:1 3.18.2. RF Performances RF performances are compliant with 3GPP recommendation TS 36.101. The following table shows typical RX sensitivity with the reference sensitivity level at 95% of the maximum throughput, using the following 3GPP test conditions:

3GPP Pattern QPSK modulation 4RB_DL, 6RB_UL 23dBm UL power 41110555 Rev 1.0 September 21, 2017 35 Product Technical Specification Table 37. Typical RX Sensitivity Detailed Interface Specifications LTE Band dBm/15kHz dBm/1.4MHz 3GPP Limit (dBm) 2 3 4 12 13 28

-126

-126

-125.5

-125.5

-126.5

-126.5

-107, 4

-107, 4

-106, 9

-106, 9

-107, 9

-107, 9

-100.3

-99.3

-102.3

-99.3

-99.3

-100.7 41110555 Rev 1.0 September 21, 2017 36 4. Mechanical Drawings Figure 9. Mechanical Drawing 41110555 Rev 1.0 September 21, 2017 37 Product Technical Specification Mechanical Drawings Figure 10. Dimensions and Footprint Drawing 41110555 Rev 1.0 September 21, 2017 38 5. Design Guidelines 5.1. Power-Up Sequence Apply voltage to the VBATT pin for at least 10 ms (TBC) prior to applying a low-level logic to the PWR_ON_N pin. Apply a low-level logic to the PWR_ON_N pin (pin 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 25 seconds (TBC) after PWR_ON_N for either UART or USB. When using UART, the AT command interface is available after the transition of UART1_CTS from high to low level. When using a USB connection, the AirPrime HL77xx module will start communicating with the host after USB enumeration. The time when AT commands can be sent will depend on the initialization time on the USB host. Note:

As PWR_ON_N is internally pulled up with 1M, an open collector or open drain transistor must be used for ignition. 5.2. Module Switch-Off AT commands AT+CPOF and AT+CPWROFF enables the user to properly switch the AirPrime HL77xx module off. 5.3. Sleep Mode Management AT command AT+KSLEEP enables sleep mode configuration; this command can only be used with serial link UART1. AT+KSLEEP=0:

The module is active when the DTR signal is active (low electrical level). When DTR is deactivated (high electrical level), the module enters sleep mode after a while. On DTR activation (low electrical level), the module wakes up. AT+KSLEEP=1:

The module determines when it enters sleep mode (when no more tasks are running). Any character on the serial link wakes the module up. The first character is lost. AT+KSLEEP=2: The module never enters sleep mode. Note:

The DTR signal must only be set to low-level 0 to wake up from Sleep mode. This pin must be set to high-level 1 (1.8V) or left floating (internal pull-up) for all other modes. 41110555 Rev 1.0 September 21, 2017 39 Product Technical Specification 5.4. Power Supply Design Design Guidelines The AirPrime HL77xx module should not be supplied with voltage over 4.5V even temporarily or however briefly. If the systems main board power supply unit is unstable or if the systems main board is supplied over 4.5V, even in the case of transient voltage presence on the circuit, the modules power amplifier may be severely damaged. To avoid such issues, add a voltage limiter to the modules power supply lines so that VBATT and VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as simple as a Zener diode with decoupling capacitors as shown in the diagram below. Power Supply VBATT/VBATT _PA

+

+

4 0 4 D F p 5

. 0 5 0 4 D 4 0 4 C F m 5

. 1 5 0 4 C F 0 5 1 7 0 4 C F n 0 0 1 Figure 11. Voltage Limiter Example 5.5. Power On Connection Examples Refer to the following figures for PWR_ON_N connection examples using a switch and an open collector transistor. X GND Figure 12. Switch 1 3 2 PWR_ON PWR_ON_N Connection Example with Switch From application MCU GPIO control PWR_ON T1 Rohm DTC144EE GND Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor 41110555 Rev 1.0 September 21, 2017 40 Product Technical Specification 5.6. USIM1 Application The AirPrime HL77xx modules support one USIM1 slot. Design Guidelines Figure 14. Design Application with USIM1 Slot 5.7. EMC and ESD Guidelines for USIM1 Card Decoupling capacitors must be added according to the drawing below, as close as possible to the UIM1 card connectors on UIM1_CLK, UIM1_RESET, UIM1_VCC, UIM1_DATA and UIM1_DET signals to avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the USIM1 electrical interface. A typical schematic including USIM1 detection is provided below. Figure 15. EMC and ESD Components Close to the USIM1. Sierra Wireless recommends using a ESDALC6V1-5P6 ESD diode for D100. 41110555 Rev 1.0 September 21, 2017 41 Product Technical Specification 5.8. ESD Guidelines for USB Design Guidelines When the USB interface is externally accessible, it is required to have ESD protection on the USB_D+

and USB_D- signals. Figure 16. ESD Protection for USB Sierra Wireless recommends using the following components:

FIL400: 90 DLP0NSN900HL2L EMC filter D400: RCLAMP0503N or ESD5V3U2U-03LRH ESD diode 5.9. PWM Refer to the following figures for examples of using the PWM0 signal for driving an LED or a BUZZER. Figure 17. Example of an LED Driven by the PWM0 Output The value of R607 can be harmonized depending on LED (D605) characteristics. The recommended digital transistor to use for T601 is the DTC144EE from ROHM. 41110555 Rev 1.0 September 21, 2017 42 Product Technical Specification Design Guidelines Figure 18. Example of a BUZZER Driven by the PWM0 Output The recommended MOS transistor to use for T1 is the RUM003N02 from ROHM, and the recommended diode to use for D1 is the BAS16W from NXP. 41110555 Rev 1.0 September 21, 2017 43 6. Reliability Specification (TBC) AirPrime HL77xx modules will be tested against the Sierra Wireless Industrial Reliability Specification defined below. 6.1. Reliability Compliance AirPrime HL77xx modules connected on a development kit board application are targeted to be compliant with the following requirements. Table 38. Standards Conformity Abbreviation Definition IEC ISO International Electro technical Commission International Organization for Standardization 6.2. Reliability Prediction Model 6.2.1. Life Stress Test The following tests the AirPrime HL77xx modules product performance. Table 39. Life Stress Test Designation Condition Performance Test PT3T & PTRT Standard: N/A Special conditions:

Temperature:

Class A: -30C to +70C

Class B: -40C to +85C

Rate of temperature change: 3C/min Recovery time: 3 hours Operating conditions: Powered Duration: 14 days 41110555 Rev 1.0 September 21, 2017 44 Product Technical Specification Reliability Specification (TBC) 6.2.2. Environmental Resistance Stress Tests The following tests the AirPrime HL77xx modules resistance to extreme temperature. Table 40. Environmental Resistance Stress Tests Designation Condition Cold Test Active COTA Resistance to Heat Test RH Standard: IEC 680068-2-1, Test Ad Special conditions:

Temperature: -40C Temperature variation: 1C/min Operating conditions: Powered ON with a power cycle of 1 minute ON and 2 minutes OFF Duration: 3 days Standard: IEC 680068-2-2, Test Bb Special conditions:

Temperature: +85C Temperature variation: 1C/min Operating conditions: Powered ON with a power cycle of 15 minutes ON and 15 minutes OFF Duration: 50 days 6.2.3. Corrosive Resistance Stress Tests The following tests the AirPrime HL77xx modules resistance to corrosive atmosphere. Table 41. Corrosive Resistance Stress Tests Designation Humidity Test HUT Condition Standard: IEC 60068-2-3, Test Ca Special conditions:

Temperature: +65C RH: 95%

Temperature variation: 3 +/- 0.6C/min Operating conditions: Powered on, DUT is powered up for 15 minutes and OFF for 15 minutes Duration: 10 days 41110555 Rev 1.0 September 21, 2017 45 Product Technical Specification Designation Condition Reliability Specification (TBC) Component Solder Wettability CSW Standard: JESD22 B102, Method 1/Condition C, Solderability Test Method Special conditions:

Test method: Dip and Look Test with Steam preconditioning 8 h+/-15min. dip for 5 +0/-0.5 seconds Moist Heat Cyclic Test MHCT Operating conditions: Un-powered Duration: 1 day Standard: IEC 60068-2-30, Test Db Special conditions:

Upper temperature: +40 2C Lower temperature: +25 5C RH:

Upper temperature: 93%

Lower temperature: 95%

Number of cycles: 21 (1 cycle/24 hours) Temperature Variation: 3 +/- 0.6C/min Operating conditions: Powered ON for 15 minutes during each 3 hours ramp up and 3 hours ramp down (in middle) for every cycle Duration: 21 days 6.2.4. Thermal Resistance Cycle Stress Tests The following tests the AirPrime HL77xx modules resistance to extreme temperature cycling. Table 42. Thermal Resistance Cycle Stress Tests Designation Condition Thermal Shock Test TSKT Temperature Change TCH Standard: IEC 60068-2-14, Test Na Special conditions:

Temperature: -30C to +80C Temperature Variation: less than 30s Number of cycles: 600 Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 9 days Standard: IEC 60068-2-14, Test Nb Special conditions:

Temperature: -40C to +90C Temperature Variation: 3 +/- 0.6C/min Number of cycles: 400 Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 29 days 41110555 Rev 1.0 September 21, 2017 46 Product Technical Specification Reliability Specification (TBC) 6.2.5. Mechanical Resistance Stress Tests The following tests the AirPrime HL77xx modules resistance to vibrations and mechanical shocks. Table 43. Mechanical Resistance Stress Tests Designation Condition Sinusoidal Vibration Test SVT Random Vibration Test RVT Mechanical Shock Test MST Standard: IEC 60068-2-6, Test Fc Special conditions:

Frequency range: 16 Hz to 1000 Hz Displacement: 0.35mm (peak-peak) Acceleration:

5G from 16 to 62 Hz 3G from 62 to 200 Hz 1G from 200 to 1000 Hz Sweep rate: 1 octave / cycle Number of Sweep: 20 sweeps/axis Sweep direction: X, Y, Z Operating conditions: Un-powered Duration: 2 days Standard: IEC 60068-2-64, Test Fh Special conditions:

Frequency range: 10 Hz 2000 Hz Power Spectral Density in [(m/s)/Hz]

g2/Hz at 10Hz g2/Hz at 250Hz 0.005 g2/Hz at 1000Hz 0.005 g2/Hz at 2000Hz Peak factor: 3 Duration per Axis: 1 hr / axis Operating conditions: Un-powered Duration: 1 day Standard: IEC 60068-2-27, Test Ea Special conditions:

Shock Test 1:

Wave form: Half sine

Peak acceleration: 30g

Duration: 11ms

Number of shocks: 8

Direction: X, Y, Z Shock Test 2:

Wave form: Half sine

Peak acceleration: 100g

Duration: 6ms

Number of shocks: 3

Direction: X, Y, Z Operating conditions: Un-powered Duration: 72 hours 41110555 Rev 1.0 September 21, 2017 47 Product Technical Specification 6.2.6. Handling Resistance Stress Tests Reliability Specification (TBC) The following tests the AirPrime HL77xx modules resistance to handling malfunctions and damage. Table 44. Handling Resistance Stress Tests Designation Condition ESDC Test ESD Test Free Fall Test FFT 1 Standard: JESD22-A114, JESD22-A115, JESD22-C101 Special conditions:

HBM (Human Body Model): 1KV (Class 1C) MM (Machine Model): 200V CDM (Charged Device Model): 250V (Class II) Operating conditions: Powered Duration: 3 days Standard: IEC 61000-4-2 Special conditions:

Contact Voltage: 2kV, 4kV, 6kV Air Voltage: 2kV, 4kV, 8kV Operating conditions: Powered Duration: 3 days Standard: IEC 60068-2-32, Test Ed Special conditions:

Number of drops: 2 drops per unit Height: 1m Operating conditions: Un-powered Duration: 6 hours 41110555 Rev 1.0 September 21, 2017 48 7. FCC Legal Information The HL7718 and HL7748 modules have been granted modular approval for mobile applications. Integrators may use the HL7718 or HL7748 modules in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the users body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed:

For HL7718: TBD dBi in Band 13 For HL7748:

9.0 dBi in Band 2

6.0 dBi in Bands 4 and 12 3. The HL7718 and HL7748 modules must not transmit simultaneously with other collocated radio transmitters within a host device. 4. The RF signal must be routed on the application board using tracks with a 50 characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the figure below and that is available free of charge at http://www.agilent.com). 41110555 Rev 1.0 September 21, 2017 49 Product Technical Specification FCC Legal Information If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro-

controllers, etc.) may degrade the reception performances. The GSM/GPRS connector is intended to be directly connected to a 50 antenna and no matching is needed. 5. A label must be affixed to the outside of the end product into which the HL7718 or HL7748 module is incorporated, with a statement similar to the following:

This device contains FCC ID: <FCC ID as listed in the table below>

Embedded Module HL7718 HL7748 FCC ID TBD N7NHL7748 6. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded HL7718 or HL7748 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note:

If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093. 41110555 Rev 1.0 September 21, 2017 50 8. Ordering Information Table 45. Ordering Information Model Name Description Part Number HL7718 HL7748 HL7749 DEV-KIT HL7718 embedded module HL7748 embedded module HL7749 embedded module HL Series Development Kit Contact Sierra Wireless for the latest SKU Contact Sierra Wireless for the latest SKU Contact Sierra Wireless for the latest SKU 6000620 41110555 Rev 1.0 September 21, 2017 51 9. Terms and Abbreviations Abbreviation Definition ADC AGC AT CDMA CF3 CLK CODEC CPU DAC DTR EGNOS EMC EMI EN ESD ETSI FDMA GAGAN GLONASS GND GNSS GPIO GPRS GSM Hi Z IC IMEI I/O LED LNA MAX MIN MSAS N/A PA PC PCB PCL PLL PWM QZSS Analog to Digital Converter Automatic Gain Control Attention (prefix for modem commands) Code Division Multiple Access Common Flexible Form Factor Clock Coder Decoder Central Processing Unit Digital to Analog Converter Data Terminal Ready European Geostationary Navigation Overlay Service Electro-Magnetic Compatibility Electro-Magnetic Interference Enable Electro-Static Discharges European Telecommunications Standards Institute Frequency-division multiple access GPS aided geo augmented navigation Global Navigation Satellite System Ground Global Navigation Satellite System General Purpose Input Output General Packet Radio Service Global System for Mobile communications High impedance (Z) Integrated Circuit International Mobile Equipment Identification Input / Output Light Emitting Diode Low Noise Amplifier Maximum Minimum Multi-functional Satellite Augmentation System Not Applicable Power Amplifier Personal Computer Printed Circuit Board Power Control Level Phase Lock Loop Pulse Width Modulation Quasi-Zenith Satellite System 41110555 Rev 1.0 September 21, 2017 52 Product Technical Specification Terms and Abbreviations Abbreviation Definition RF RFI RMS RST RTC RX SCL SDA SIM SMD SPI SW PSRAM TBC TBD TP TX TYP UART UICC USB UIM VBATT VSWR WAAS Radio Frequency Radio Frequency Interference Root Mean Square Reset Real Time Clock Receive Serial Clock Serial Data Subscriber Identification Module Surface Mounted Device/Design Serial Peripheral Interface Software Pseudo Static RAM To Be Confirmed To Be Defined Test Point Transmit Typical Universal Asynchronous Receiver-Transmitter Universal Integrated Circuit Card Universal Serial Bus User Identity Module Main Supply Voltage from Battery or DC adapter Voltage Standing Wave Ratio Wide Area Augmentation System 41110555 Rev 1.0 September 21, 2017 53