FCC ID: N7NMC7475 Radio Module

 

AirPrime MC7475 Product Technical Specification 41110251 Rev 3 Proprietary and Confidential Contents subject to change Product Technical Specification Important Notice Safety and Hazards Limitation of Liability Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Do not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator's control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Rev 3 Sep.17 2 41110251 Copyright Trademarks Contact Information Preface 2017 Sierra Wireless. All rights reserved. Sierra Wireless, AirPrime, AirLink, AirVantage and the Sierra Wireless logo are registered trademarks of Sierra Wireless, Inc. Windows and Windows Vista are registered trademarks of Microsoft Corporation. Other trademarks are the property of their respective owners. Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com Revision History Revision number Release date Changes 1 2 3 June 2017 June 2017 September 2017 Initial release Updated Miscellaneous DC Power Consumption table:

Updated notes, corrected module number typo Updated Regulatory section (antenna gain, EIRP limit, FCC ID, FCC Part 27 notice) Updated GPS SpecificationsAcquisition times Updated module dimensions Updated dimensioned view figure Updated sample label Updated Copper Pad Location figure Rev 3 Sep.17 3 41110251 Contents Introduction . 9 Supported RF Bands . 9 Physical Features. 9 Application Interface Features . 9 Modem Features . 10 LTE Features . 10 Position Location (GPS) . 10 Supporting Documents. 10 Required Connectors . 11 Ordering Information. 11 Integration Requirements . 11 Standards Compliance . 12 Electrical Specifications . 13 Host Interface Pin Assignments . 14 Power Supply . 18 USB Interface . 18 USB Throughput Performance . 18 SIM Interface . 19 SIM Implementation . 21 Control Interface (Signals) . 22 WAKE_N Wake Host . 22 WAN_LED_NLED Output . 22 SYSTEM_RESET_NReset Input . 23 Antenna Control . 23 RF Specifications . 24 RF Connections . 24 Shielding . 24 Antenna and Cabling . 25 Ground Connection . 25 Rev 3 Sep.17 4 41110251 Contents Interference and Sensitivity . 26 Interference From Other Wireless Devices . 26 Host-generated RF Interference . 26 Device-generated RF Interference . 26 Methods to Mitigate Decreased Rx Performance . 27 Radiated Spurious Emissions (RSE) . 27 Radiated Sensitivity Measurement . 27 Sierra Wireless Sensitivity Testing and Desensitization Investigation . 27 Sensitivity vs. Frequency . 28 Supported Frequencies . 28 Conducted Rx Sensitivity / Tx Power. 28 GPS Specifications . 29 Power . 30 Power Consumption. 30 Power Interface . 31 Power Ramp-up . 31 Power-On/Off Timing . 31 Power Supply Noise . 33 Mechanical and Environmental Specifications . 34 Device Views . 35 Labeling . 36 Electrostatic Discharge (ESD) . 36 Thermal Considerations. 37 Regulatory Compliance and Industry Certifications . 40 Important Notice. 40 Safety and Hazards . 40 Important Compliance Information for the United States of America. 41 Antenna Specification . 43 Recommended Main/Rx Diversity Antenna Specifications . 43 Rev 3 Sep.17 5 41110251 Product Technical Specification Recommended GPS Antenna Specifications . 45 Antenna Tests . 45 Design Checklist . 47 Packaging . 49 References . 51 Sierra Wireless Documents . 51 Command Documents . 51 Industry/Other Documents . 51 Acronyms . 52 Index. 57 Rev 3 Sep.17 6 41110251 List of Tables Table 1-1: Supported RF Bands . 9 Table 1-2: Required Host-Module Connectors . 11 Table 2-1: Standards Compliance . 12 Table 3-1: Connector Pin Assignments . 14 Table 3-2: Power and Ground Specifications . 18 Table 3-3: USB Interfaces . 18 Table 3-4: SIM Interface Signals . 19 Table 3-5: Module Control Signals. 22 Table 3-6: Antenna Control Signals. 23 Table 4-1: LTE Frequency Bands . 28 Table 4-2: Conducted Rx (Receive) SensitivityLTE Bands . 28 Table 4-3: Conducted Tx (Transmit) Power Tolerances . 28 Table 4-4: GPS Specifications. 29 Table 5-1: Averaged Standby DC Power Consumption. 30 Table 5-2: Averaged Call Mode DC Power Consumption . 31 Table 5-3: Miscellaneous DC Power Consumption . 31 Table 5-4: USB 2.0 Power-On/Off Timing Parameters (Double Enumeration) . 32 Table 5-5: USB 2.0 Power-On/Off Timing Parameters (Single Enumeration) . 32 Table 6-1: Mechanical and Environmental Specifications . 34 Table 7-1: Antenna Gain Specifications. 41 Table 7-2: Collocated Radio Transmitter Specifications . 42 Table 8-1: Antenna Requirements . 43 Table 8-2: GPS Antenna Requirements . 45 Table 9-1: Hardware Integration Design Considerations. 47 Table A-1: Acronyms and Definitions. 52 Rev 3 Sep.17 7 41110251 List of Figures Figure 3-1: System Block Diagram . 13 Figure 3-2: SIM Application Interface (applies to both SIM interfaces) . 20 Figure 3-3: SIM Card Contacts (Contact View) . 20 Figure 3-4: Recommended WAKE_N Connection. 22 Figure 3-5: Example LED. 23 Figure 4-1: Module Connectors . 24 Figure 5-1: Signal Timing (USB Enumeration). 32 Figure 6-1: Top View . 35 Figure 6-2: Dimensioned View. 35 Figure 6-3: Sample Unit Label . 36 Figure 6-4: Shield locations (Top view) . 37 Figure 6-5: Copper Pad Location on Bottom Side of Module . 38 Figure 10-1: Device Placement in Module Tray. 49 Figure 10-2: Shipping Package . 50 Figure 10-3: Outer (shipping) Box . 50 Rev 3 Sep.17 8 41110251 1: Introduction 1 The Sierra Wireless MC7475 PCI Express Mini Card is a compact, lightweight, wireless modem that provides LTE and GPS connectivity for M2M applications, notebook, ultrabook and tablet computers over several radio frequency bands. Supported RF Bands The modem, based on the Altair FourGee6300 baseband processor, supports data operation on LTE networks over the bands described in Table 1-1. Table 1-1: Supported RF Bands Technology Bands Notes Data rates:

Downlink (Cat 4):

FDD: 150 Mbps Uplink (Cat 4):

FDD: 50 Mbps LTE 2, 4, 12, 125

GPS 1575.42 MHz Physical Features

Small form factorconforms to type F2 as specified in PCI Express Mini Card Electromechanical Specification Revision 1.2. Ambient operating temperature range:

Class A (3GPP compliant): -20C to +70C Class B (operational, non-3GPP compliant): -30C to +85C (reduced operating parameters required) Important: The internal module temperature must be kept below 90C. For best perfor-

mance, the internal module temperature should be kept below 80C. Proper mounting, heat sinks, and active cooling may be required, depending on the integrated application. Application Interface Features

USB interface AT command interface Support for active antenna control via dedicated antenna control signals

(ANT_CTRL0:3) Dynamic power reduction support via software and dedicated signal (DPR) Rev 3 Sep.17 9 41110251 Product Technical Specification Modem Features Traditional modem COM port support for AT commands USB suspend / resume Sleep mode for minimum idle power draw Enhanced Operator Name String (EONS)

Mobile-originated PDP context activation / deactivation

Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol). PAP and CHAP support PDP context type (IPv4, IPv6, or IPv4v6). IP Packet Data Protocol context supports dual IPv4v6.

LTE Features

CQI/RI/PMI reporting Paging procedures Paging in Idle and Connected mode Dedicated bearer Network-initiated dedicated bearer UE-initiated dedicated bearer

Multiple PDN connections (IPv4 and IPv6 combinations), subject to operating

system support. Connected mode intra-LTE mobility Idle mode intra-LTE mobility Detach procedure Network-initiated detach with reattach required Network-initiated detach followed by connection release Position Location (GPS)

Customizable tracking session Automatic tracking session on startup Supporting Documents Several additional documents describe Mini Card design, usage, integration, and other features. See References on page 51. Rev 3 Sep.17 10 41110251 Introduction Required Connectors Table 1-2 describes the connectors used to integrate AirPrime MC-series modules into your host device. Table 1-2: Required Host-Module Connectorsa Connector type RF cables EDGE (52-pin) SIM

Description

Mate with Hirose U.FL connectors

(model U.FL #CL331-0471-0-10) Three connector jacks Industry-standard mating connector Some manufacturers include Tyco, Foxconn, Molex Example: UDK board uses Molex 67910-0001 Industry-standard connector. Type depends on how host device exposes the SIM socket Example: UDK board uses ITT CCM03-3518 a. Manufacturers/part numbers are for reference only and are subject to change. Choose connectors that are appropriate for your own design. Ordering Information To order, contact the Sierra Wireless Sales Desk at +1 (604) 232-1488 between 8 AM and 5 PM Pacific Time. Integration Requirements Sierra Wireless provides, in the document suite, guidelines for successful Mini Card integration and offers integration support services as necessary. When integrating the MC7475 PCI-Express Mini Card, the following items need to be addressed:

MountingEffect on temperature, shock, and vibration performance

Power supplyImpact on battery drain and possible RF interference

Antenna location and typeImpact on RF performance

Regulatory approvalsAs discussed in Regulatory Compliance and Industry Certifications on page 40. Service provisioningManufacturing process Host InterfaceCompliance with interface voltage levels

Rev 3 Sep.17 11 41110251 2: Standards Compliance 2 The MC7475 Mini Card complies with the mandatory requirements described in the following standards. The exact set of requirements supported is network operator-

dependent. Table 2-1: Standards Compliance Technology Standards LTE

3GPP Release 11 Rev 3 Sep.17 12 41110251 3: Electrical Specifications 3 The system block diagram in Figure 3-1 on page 13 represents the MC7475 module integrated into a host system. The module includes the following interfaces to the host:

WAKE_N Signal used to wake the host when specific events occur.

WAN_LED_NActive-low LED drive signal provides an indication of RADIO ON PowerSupplied to the module by the host. state, either WAN or GPS. SYSTEM_RESET_NActive-low reset input. AntennaThree U.FL RF connectors (main (Rx/Tx), GPS, and auxiliary (Rx diversity). For details, see RF Specifications on page 24. Antenna controlThree signals that can be used to control external antenna switches. Dual SIMSupported through the interface connector. The SIM cavities /

connectors must be placed on the host device for this feature. USBUSB 2.0 interface to the host for data, control, and status information.

The MC7475 has two main interface areasthe host I/O connector and the RF ports. Details of these interfaces are described in the sections that follow. Figure 3-1: System Block Diagram Rev 3 Sep.17 13 41110251 Product Technical Specification Host Interface Pin Assignments The MC7475 host I/O connector provides pins for power, serial communications, and control. Pin assignments are listed in Table 3-1. Refer to the following tables for pin details based on interface types:

Table 3-2, Power and Ground Specifications, on page 18 Table 3-3, USB Interfaces, on page 18 Table 3-4, SIM Interface Signals, on page 19 Table 3-5, Module Control Signals, on page 22 Note: On any given interface (USB, SIM, etc.), leave unused inputs and outputs as no-

connects. Note: The host should not drive any signals to the module until the power-on sequence is complete. Table 3-1: Connector Pin Assignmentsa Pin Signal name 1 2 3 4 5 WAKE_N VCC ANT_CTRL0 /

GPIO1 GND ANT_CTRL1 /

GPIO2 Active state Low Power High Low Power High Low Pin typeb Description Directionc OC Wake host Output V

-

V

-

Power supply Input

(ANT_CTRL0) Customer-

defined external switch control for multiple antennas

(GPIO1) General purpose I/O Ground

(ANT_CTRL1) Customer-

defined external switch control for multiple antennas

(GPIO2) General purpose I/O Output Output Input High Input Low Output High Output Low Input Output Output Input High Input Low Output High Output Low 6 NC

-

No connect

-

-

Voltage levels (V) Min Typ Max

-

3.135 1.35 0 1.53

-0.30 1.35 0.00

-

1.35 0 1.53

-0.30 1.35 0.00

-

-

3.30 1.80

-

1.80 1.80 0 1.80

-

1.80 1.80

-

0.10 3.60 1.90 0.8 2.10 0.45 1.90 0.8

-

1.90 0.8 2.10 0.45 1.90 0.8

-

Rev 3 Sep.17 14 41110251 Table 3-1: Connector Pin Assignmentsa (Continued) Electrical Specifications Pin Signal name Pin typeb 7 8 9 USIM2_RST USIM_PWR GND 10 USIM_DATA 11 12 VREF_1.8Vd USIM_CLK 13 USIM2_PWR 14 USIM_RST 15 16 17 GND NC USIM2_CLK 18 GND

-

-

V

-

-

-

-

-

V

-

-

V Description Directionc SIM 2 Reset Output Active state Low High Voltage levels (V) Min Typ Max 0 2.55 (3V SIM) 1.35 (1.8V SIM)

-

-

0.45 3.10 (3V SIM) 1.90 (1.8V SIM) SIM VCC supply Output Power 2.90 (3V SIM) 1.75 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.10 (3V SIM) 1.85 (1.8V SIM) Ground SIM IO pin Input Input Output Power Low High Low High

-

-0.30 (3V SIM)

-0.30 (1.8V SIM) 0

-

-

0.60 (3V SIM) 0.35 (1.8V SIM) 2.10 (3V SIM) 1.17 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.30 (3V SIM) 2.10 (1.8V SIM) 0

-

0.40 2.55 (3V SIM) 1.35 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.10 (3V SIM) 1.90 (1.8V SIM) 1.8V reference voltage output Output Power 1.75 SIM Clock Output Low High 0 1.80

-

1.85 0.45 2.55 (3V SIM) 1.35 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.10 (3V SIM) 1.90 (1.8V SIM) SIM 2 VCC supply Output Power 2.90 (3V SIM) 1.75 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.10 (3V SIM) 1.85 (1.8V SIM) SIM Reset Output Low High 0

-

0.45 2.55 (3V SIM) 1.35 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.10 (3V SIM) 1.90 (1.8V SIM) Ground Input Power No connect

-

SIM 2 Clock Output

-

Low High

-

-

0 0

-

-

-

-

0.45 2.55 (3V SIM) 1.35 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.10 (3V SIM) 1.90 (1.8V SIM) Ground Input Power

-

0

-

Rev 3 Sep.17 15 41110251 Product Technical Specification Table 3-1: Connector Pin Assignmentsa (Continued) Pin Signal name Pin typeb Description Directionc Active state 19 USIM2_DATA

-

SIM 2 IO pin Input Output NC GND

-

V SYSTEM_RESET_Ne OC No connect

-

Ground Reset Input Input Voltage levels (V) Min Typ Max

-0.30 (3V SIM)

-0.30 (1.8V SIM)

-

0.60 (3V SIM) 0.35 (1.8V SIM) 2.10 (3V SIM) 1.17 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.30 (3V SIM) 2.10 (1.8V SIM) 0

-

0.40 2.55 (3V SIM) 1.35 (1.8V SIM) 3.00 (3V SIM) 1.80 (1.8V SIM) 3.10 (3V SIM) 1.90 (1.8V SIM)

-

-

-0.30

-

0

-

Low High Low High

-

Power Low Power supply Input Power 3.135 3.30 Ground Ground Input Input No connect

-

Power Power

-

Ground Input Power Reserved Host must not repurpose this pin. Reserved Host must not repurpose this pin. Ground Ground USB data negative Ground USB data positive Input Input Power Power Input/Output Differential Input Power Input/Output Differential

-

-

-

-

-

-

-

-

-

0 0

-

0 0 0

-

0

-

-

-

0.63 3.60

-

-

-

-

-

-

-

-

-

20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 Reserved VCC Reserved GND GND NC GND NC Reserved NC Reserved GND GND USB_D-

GND USB_D+

VCC GND VCC V V V

-

V V V

-

V

-

V V V Power supply Ground Power supply Input Input Input Power Power Power 3.135

-

3.135 3.30 0 3.30 3.60

-

3.60 Rev 3 Sep.17 16 41110251 Table 3-1: Connector Pin Assignmentsa (Continued) Active state Low Power High Low Pin Signal name Pin typeb Description Directionc 42 43 44 WAN_LED_N OC LED Driver GND ANT_CTRL2 /

GPIO3 V

-

Ground

(ANT_CTRL2) Customer-

defined external switch control for multiple antennas

(GPIO3) General purpose I/O Output Input Output Output Input High Input Low Output High Output Low 45 NC 46 ANT_CTRL3/

GPIO4

-

47 NC 48 49 50 51 NC NC GND NC 52 VCC

-

V V Reserved Host must not repurpose this pin.

(ANT_CTRL3) Customer-

defined external switch Input High Input Low Input High Input Low Output High Output Low

(GPIO4) General purpose I/O Reserved Host must not repurpose this pin. No connect

-

-

Reserved Host must not repurpose this pin. Ground Input Power Reserved Host must not repurpose this pin. Electrical Specifications Voltage levels (V) Min Typ Max 0

-

1.35 0 1.53

-0.30 1.35 0.00 1.35 0 1.53

-0.30 1.35 0.00

-

-

-

0 1.80

-

1.80 1.80 1.80

-

1.80 1.80

-

0 0.15f

-

1.90 0.8 2.10 0.45 1.90 0.8 1.90 0.8 2.10 0.45 1.90 0.8

-

-

Power supply Input Power 3.135 3.30 3.60 a. The host should leave all NC (no connect) pins unconnected. b. AAnalog; IInput; NPNo pull; ODigital output; OCOpen Collector; PUDigital input (internal pull up); PDDigital output

(internal pull down); VPower or ground c. Signal directions are from modules point of view (e.g. Output from module to host, Input to module from host.) d. To avoid adverse effects on module operation, do not draw more than 10 mA current on pin 11. Rev 3 Sep.17 17 41110251 Product Technical Specification e. The module must not be plugged into a port that supports PCI Expressthe pin is used by a PCIE signal, which can cause the module to be in reset state or occasionally reset. f. Max voltage level when current < 100 mA. Power Supply The host provides power to the MC7475 through multiple power and ground pins as summarized in Table 3-2. The host must provide safe and continuous power at all times; the module does not have an independent power supply, or protection circuits to guard against electrical issues. Table 3-2: Power and Ground Specifications Name Pins Specification Min Typ Max Units VCC 2, 24, 39, 41, 52 Voltage range See Table 3-1 on page 14. Ripple voltage GND 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50

-

USB Interface

-

-

-

0 100

-

mVpp V Important: Host support for USB 2.0 signals is required. The device supports a USB 2.0 interface for communication between the host and module. The interface complies with the [7] Universal Serial Bus Specification, Rev 2.0, and the host device must be designed to the same standards (subject to details shown in Table 3-3 below). (Note: When designing the host device, careful PCB layout practices must be followed.) Table 3-3: USB Interfaces Name Pin Description USB 2.0 USB_D-

USB_D+

36 38 USB data negative USB data positive USB Throughput Performance This device has been designed to achieve optimal performance and maximum throughput using USB high-speed mode (USB 2.0). Although the device may operate with a high speed host, throughput performance will be on an as is Rev 3 Sep.17 18 41110251 Electrical Specifications basis and needs to be characterized by the OEM. Note that throughput will be reduced and may vary significantly based on packet size, host interface, and firmware revision. SIM Interface Note: Host support for SIM interface signals is required. The module supports up to two SIMs (Subscriber Identity Module) (1.8 V or 3 V). Each SIM holds information for a unique account, allowing users to optimize their use of each account on multiple devices. The SIM pins (Table 3-4) provide the connections necessary to interface to SIM sockets located on the host device as shown in Figure 3-2 on page 20. Voltage levels over this interface comply with 3GPP standards. The types of SIM connectors used depends on how the host device exposes the SIM sockets. Table 3-4: SIM Interface Signals SIM Primary Name Pin Description USIM_PWR USIM_DATA USIM_CLK USIM_RST USIM_GND Secondary USIM2_PWR USIM2_DATA USIM2_CLK USIM2_RST USIM2_GND 8 10 12 14 13 19 17 7 SIM voltage Data I/O Serial clock Reset Ground SIM voltage Data I/O Serial clock Reset SIM indication SIM contact numbera 1 7 3 2 5 2 3 7 1

-

Notes Power supply for SIM Bi-directional SIM data line Serial clock for SIM data Active low SIM reset Ground reference USIM_GND is common to module ground Power supply for SIM 2 Bi-directional SIM 2 data line Serial clock for SIM 2 data Active low SIM 2 reset Ground reference USIM2_GND is common to module ground a. See Figure 3-3 on page 20 for SIM card contacts. Rev 3 Sep.17 19 41110251 Product Technical Specification 4.7uF X5R typ 0.1uF Located near SIM socket

(C1)

(C3)

(C7)

(C2)

(C5)

(Optional. Locate near the SIM socket) 15 k - 30 k USIM_PWR NOTE: UIM signals refer to both USIM1 and USIM2.

(Optional. Locate near the SIM socket) 47 pF, 51 USIM_CLK USIM_DATA USIM_RST USIM_GND AirPrime embedded module SIM card connector ESD protection Located near SIM socket. NOTE: Carefully consider if ESD protection is required it may increase signal rise time and lead to certification failure Figure 3-2: SIM Application Interface (applies to both SIM interfaces) Contact View (notched corner at top left) RFU I/O VPP GND C8 C7 C6 C5 C4 C3 C2 C1 RFU CLK RST VCC Figure 3-3: SIM Card Contacts (Contact View) Rev 3 Sep.17 20 41110251 Note: For interface design requirements, refer to ETSI TS 102 230 V5.5.0, section 5.2. Electrical Specifications SIM Implementation When designing the remote SIM interface, you must make sure that SIM signal integrity is not compromised. Some design recommendations include:

Total impedance of the VCC and GND connections to the SIM, measured at the module connector, should be less than 1 to minimize voltage drop

(includes any trace impedance and lumped element componentsinductors, filters, etc.). Position the SIM connector 10 cm from the module. If a longer distance is required because of the host device design, use a shielded wire assembly connect one end as close as possible to the SIM connector and the other end as close as possible to the module connector. The shielded assembly may help shield the SIM interface from system noise. Avoid routing the clock and data lines for each SIM (USIM_CLK/

USIM_DATA, USIM2_CLK/USIM2_DATA) in parallel over distances 2 cmcross-coupling of a clock and data line pair can cause failures. 3GPP has stringent requirements for I/O rise time (<1 s), signal level limits, and noise immunityconsider this carefully when developing your PCB layout. Keep signal rise time <1 skeep SIM signals as short as possible, and keep very low capacitance traces on the data and clock signals

(USIM_CLK, USIM_DATA, USIM2_CLK, USIM2_DATA). High capacitance increases signal rise time, potentially causing your device to fail certification tests. Add external pull-up resistors (15 k30 k), if required, between the data and power lines for each SIM (USIM_DATA/USIM_PWR, USIM2_DATA/

USIM2_PWR) to optimize the signal rise time. VCC line should be decoupled close to the SIM socket. SIM is specified to run up to 5 MHz (SIM clock rate). Take note of this speed in the placement and routing of the SIM signals and connectors. You must decide whether additional ESD protection is required for your product, as it is dependent on the application, mechanical enclosure, and SIM connector design. The SIM pins will require additional ESD protection if they are exposed to high ESD levels (i.e. can be touched by a user). Putting optional decoupling capacitors on the SIM power lines (USIM_PWR, USIM2_PWR) near the SIM sockets is recommendedthe longer the trace length (impedance) from the socket to the module, the greater the capaci-

tance requirement to meet compliance tests. Putting an optional series capacitor and resistor termination (to ground) on the clock lines (USIM_CLK, USIM2_CLK) at the SIM sockets to reduce EMI and increase signal integrity is recommended if the trace length between the SIM socket and module is long47 pF and 50 resistor are recommended. Test your first prototype host hardware with a Comprion IT3 SIM test device at a suitable testing facility.

Rev 3 Sep.17 21 41110251 Product Technical Specification Control Interface (Signals) The MC7475 provides signals for:

Waking the host when specific events occur

LED driver output These signals are summarized in Table 3-5 and paragraphs that follow. Table 3-5: Module Control Signals Name WAKE_N WAN_LED_N Pin Description 1 42 Wake host LED driver a. OCOpen Collector; PUDigital pin Input, internal pull up WAKE_N Wake Host Typea OC OC Note: Host support for WAKE_N is optional. The module uses WAKE_N to wake the host when specific events occur. The host must provide a 5 k100 k pullup resistor that considers total line capacitance (including parasitic capacitance) such that when WAKE_N is deasserted, the line will rise to 3.3 V (Host power rail) in < 100 ns. See Figure 3-4 on page 22 for a recommended implementation. VCC 5k-100k WAKE_N Host 1 R Q 3 2 Control MiniCard Figure 3-4: Recommended WAKE_N Connection WAN_LED_NLED Output Note: Host support for WAN_LED_N is optional. The module drives the LED output according to [6] PCI Express Mini Card Electromechanical Specification Revision 2.1. Note: The LED configuration is customizable. Contact your Sierra Wireless account repre-

sentative for details. Rev 3 Sep.17 22 41110251 Electrical Specifications VCC Current limiting Resistor LED WAN_LED_N MiniCard MIO Figure 3-5: Example LED SYSTEM_RESET_NReset Input Note: Host support for SYSTEM_RESET_N is optional. SYSTEM_RESET_N has an internal 1.8 V internal pull up that requires an open collector input from the host. Set this signal to active low to reset the device. Note that the minimum pulse width is 2 s. Note: The module must not be plugged into a port that supports PCI Express SYSTEM_RESET_N is carried on a pin that is used for a PCIE signal, which can cause the module to be in reset state or occasionally reset. Antenna Control Note: Host support for antenna control signals is optional. The MC7475 Mini Card provides three output signals (listed in Table 3-6) that may be used for host designs that incorporate tunable antennas. Table 3-6: Antenna Control Signals Name Description Pin Customer-defined external switch control for tunable antennas ANT_CTRL0 ANT_CTRL1 ANT_CTRL2 ANT_CTRL3 3 5 44 46 Rev 3 Sep.17 23 41110251 4: RF Specifications 4 The MC7475 includes three RF connectors for use with host-supplied antennas:

Main RF connectorTx/Rx path

GPS RF connectorDedicated GPS

Auxiliary RF connectorRx diversity The module does not have integrated antennas. Main RF connector GPS RF connector Auxiliary (Rx diversity) RF connector I/O connector Figure 4-1: Module Connectors RF Connections When attaching antennas to the module:

Use Hirose U.FL connectors (3 mm x 3 mm, low profile; model U.FL #CL331-0471-0-10) to attach antennas to connection points on the module, as shown in Figure 4-1 on page 24. Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01)) to prevent damage to the module or coaxial cable assembly.

Match coaxial connections between the module and the antenna to 50 .

Minimize RF cable losses to the antenna; the recommended maximum cable

loss for antenna cabling is 0.5 dB. To ensure best thermal performance, mounting holes must be used to attach

(ground) the device to the main PCB ground or a metal chassis. Note: If the antenna connection is shorted or open, the modem will not sustain permanent damage. Shielding The module is fully shielded to protect against EMI and the shield must not be removed. Rev 3 Sep.17 24 41110251 RF Specifications Antenna and Cabling When selecting the antenna and cable, it is critical to RF performance to optimize antenna gain and cable loss. Note: For detailed electrical performance criteria, see Appendix 8: Antenna Specification on page 43. Choosing the Correct Antenna and Cabling When matching antennas and cabling:

The antenna (and associated circuitry) should have a nominal impedance of 50 with a recommended return loss of better than 10 dB across each frequency band of operation. The system gain value affects both radiated power and regulatory (FCC) test results. Designing Custom Antennas Consider the following points when designing custom antennas:

A skilled RF engineer should do the development to ensure that the RF performance is maintained. If both CDMA and UMTS modules will be installed in the same platform, you may want to develop separate antennas for maximum performance. Determining the Antennas Location When deciding where to put the antennas:

Antenna location may affect RF performance. Although the module is shielded to prevent interference in most applications, the placement of the antenna is still very importantif the host device is insufficiently shielded, high levels of broadband noise or spurious interference can degrade the modules performance. Connecting cables between the module and the antenna must have 50 impedance. If the impedance of the module is mismatched, RF performance is reduced significantly. Antenna cables should be routed, if possible, away from noise sources

(switching power supplies, LCD assemblies, etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna. See Interference From Other Wireless Devices on page 26.

Ground Connection When connecting the module to system ground:

Prevent noise leakage by establishing a very good ground connection to the module through the host connector. Connect to system ground using the two mounting holes at the top of the module (shown in Figure 4-1 on page 24).

Minimize ground noise leakage into the RF. Depending on the host board design, noise could potentially be coupled to Rev 3 Sep.17 25 41110251 Product Technical Specification the module from the host board. This is mainly an issue for host designs that have signals traveling along the length of the module, or circuitry operating at both ends of the module interconnects. Interference and Sensitivity Several interference sources can affect the modules RF performance

(RF desense). Common sources include power supply noise and device-

generated RF. RF desense can be addressed through a combination of mitigation techniques

(Methods to Mitigate Decreased Rx Performance on page 27) and radiated sensitivity measurement (Radiated Sensitivity Measurement on page 27). Interference From Other Wireless Devices Wireless devices operating inside the host device can cause interference that affects the module. To determine the most suitable locations for antennas on your host device, evaluate each wireless devices radio system, considering the following:

Any harmonics, sub-harmonics, or cross-products of signals generated by wireless devices that fall in the modules Rx range may cause spurious response, resulting in decreased Rx performance. The Tx power and corresponding broadband noise of other wireless devices may overload or increase the noise floor of the modules receiver, resulting in Rx desense.

The severity of this interference depends on the closeness of the other antennas to the modules antenna. To determine suitable locations for each wireless devices antenna, thoroughly evaluate your host devices design. Host-generated RF Interference All electronic computing devices generate RF interference that can negatively affect the receive sensitivity of the module. Display panel and display drivers Switching-mode power supplies Proximity of host electronics to the antenna in wireless devices can contribute to decreased Rx performance. Components that are most likely to cause this include:

Microprocessor and memory

Device-generated RF Interference The module can cause interference with other devices. Wireless devices such as AirPrime embedded modules transmit in bursts (pulse transients) for set durations

(RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise. Rev 3 Sep.17 26 41110251 RF Specifications

Methods to Mitigate Decreased Rx Performance It is important to investigate sources of localized interference early in the design cycle. To reduce the effect of device-generated RF on Rx performance:

Put the antenna as far as possible from sources of interference. The drawback is that the module may be less convenient to use. Shield the host device. The module itself is well shielded to avoid external interference. However, the antenna cannot be shielded for obvious reasons. In most instances, it is necessary to employ shielding on the components of the host device (such as the main processor and parallel bus) that have the highest RF emissions. Filter out unwanted high-order harmonic energy by using discrete filtering on low frequency lines. Form shielding layers around high-speed clock traces by using multi-layer PCBs. Route antenna cables away from noise sources.

Radiated Spurious Emissions (RSE) When designing an antenna for use with AirPrime embedded modules, the host device with an AirPrime embedded module must satisfy any applicable standards/local regulatory bodies for radiated spurious emission (RSE) for receive-only mode and for transmit mode (transmitter is operating). Note that antenna impedance affects radiated emissions, which must be compared against the conducted 50-ohm emissions baseline. (AirPrime embedded modules meet the 50-ohm conducted emissions requirement.) Radiated Sensitivity Measurement A wireless host device contains many noise sources that contribute to a reduction in Rx performance. To determine the extent of any receiver performance desensitization due to self-

generated noise in the host device, over-the-air (OTA) or radiated testing is required. This testing can be performed by Sierra Wireless or you can use your own OTA test chamber for in-house testing. Sierra Wireless Sensitivity Testing and Desensitization Investigation Although AirPrime embedded modules are designed to meet network operator requirements for receiver performance, they are still susceptible to various performance inhibitors. As part of the Engineering Services package, Sierra Wireless offers modem OTA sensitivity testing and desensitization (desense) investigation. For more information, contact your account manager or the Sales Desk (see Contact Information on page 3). Rev 3 Sep.17 27 41110251 Product Technical Specification Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and TRP (Total Radiated Power) according to CTIA's published test procedure. Sensitivity vs. Frequency For LTE bands, sensitivity is defined as the RF level at which throughput is 95% of maximum. Supported Frequencies The MC7475 supports:

Multiple-band LTESee Table 4-1 on page 28 (supported bands)

GPS Table 4-1: LTE Frequency Bands Frequency (Tx) Band Band 2 Band 4 Band 12 Band 125 18501910 MHz 17101755 699716 MHz 23152318 MHz Frequency (Rx) 19301990 MHz 21102155 MHz 729746 MHz 23472350 MHz Conducted Rx Sensitivity / Tx Power Table 4-2: Conducted Rx (Receive) Sensitivity LTE Bands LTE bands LTE Band 2 LTE Band 4 LTE Band 12 LTE Band 125 Bandwidth

(MHz) Conducted Rx sensitivity (dBm) 5 5 5 3

-100.6

-102.8

-103.2

-102.6 Table 4-3: Conducted Tx (Transmit) Power Tolerances Conducted transmit power Notes Parameter LTE LTE Band 2,4,12 LTE Band 125

+23 dBm 1 dB

+13 dBm 1 dB QPSK full RB Rev 3 Sep.17 28 41110251 RF Specifications GPS Specifications Note: For detailed electrical performance criteria, see Recommended GPS Antenna Specifications on page 45. Table 4-4: GPS Specifications Parameter/feature Description Satellite channels Maximum 12 channels, simultaneous tracking Protocols NMEA 0183 V3.0 Acquisition time Hot start: 5 s Cold start: 37 s Note: Measured with signal strength = -135 dBm. Sensitivity Trackinga: -160 dBm Acquisition (Standalone)b: -145 dBm Operational limits Altitude <6000 m or velocity <100 m/s

(Either limit may be exceeded, but not both.) a. Tracking sensitivity is the lowest GPS signal level for which the device can still detect an in-view satellite 50% of the time when in sequential tracking mode. b. Acquisition sensitivity is the lowest GPS signal level for which the device can still detect an in-view satellite 50% of the time. Rev 3 Sep.17 29 41110251 5 5: Power Power Consumption Power consumption measurements in the tables below are for the MC7475 Mini Card module connected to the host PC via USB. The module does not have its own power source and depends on the host device for power. For a description of input voltage requirements, see Power Supply on page 18. Table 5-1: Averaged Standby DC Power Consumption Current Signal Description Bandsa Typ Maxb Unit VCC Standby current consumption (Sleep mode deactivatedc) LTE Band 2 13.5 21 Band 4 Band 12 Band 125 13.5 13 13 22 22 21 a. For supported bands, see Table 4-1, LTE Frequency Bands, on page 28. b. Measured at nominal 3.3 V voltage. c. Assumes USB bus is fully suspended during measurements mA mA mA mA Notes /

configuration DRX cycle = 8 (2.56 s) Rev 3 Sep.17 30 41110251 Power Table 5-2: Averaged Call Mode DC Power Consumption Description Tx power Band LTE 23 dBm B2/B4 B12 B125 Peak current

(averaged over 100 s) a. Measured at 25C/nominal 3.3 V voltage Currenta Typ Unit Notes 900 828 647 1012 mA mA mA mA 100/50 Mbps, 20 MHz BW 60/25 Mbps, 10 MHz BW 7.2/12.6 Mbps, 3 MHz BW All LTE bands Table 5-3: Miscellaneous DC Power Consumption Signal Description VCC Maximum current Current / Voltage Min Typ Max Unit Notes / configuration 1.5 100 A mA

Across all bands, all temperature ranges 3.3 V supply See GPS RF connector in Figure 4-1 on page 24 GNSS active antenna specifications:

DC voltage range: 3.03.25 V Within specified DC voltage range, MC7475 will drive current up to 100 mA

(depending on antenna load). Specifications valid over operating input DC voltage (VCC) and temperature range. GPS Signal connector Active bias on GPS port 3.00 3.15 3.25 V Power Interface Power Ramp-up On initial power up, inrush current depends on the power supply rise timeturn on time >100 s is required for < 3A inrush current. The supply voltage must remain within specified tolerances while this is occurring. Power-On/Off Timing Figure 5-1 describes the timing sequence for powering the module on and off. Note: The host should not drive any signals to the module until the power-on sequence is complete. Rev 3 Sep.17 31 41110251 Product Technical Specification DEVICE STATE Disconnected Off Power-on Sequence Active Power-off Sequence Off Disconnected VCC High Low USB_D+

(Double enumeration) High Low USB_D+

(Single enumeration) High Low t_USB_suspend t_USB_active t_pwr_off_seq t_pwr_on_seq t_pwr_on_seq Figure 5-1: Signal Timing (USB Enumeration) t_pwr_off_seq Table 5-4: USB 2.0 Power-On / Off Timing Parameters (Double Enumeration) Parameter Maximum (s) Typical (s) t_pwr_on_seq t_USB_active t_USB_suspend t_pwr_off_seq TBD TBD TBD TBD TBD TBD TBD TBD Table 5-5: USB 2.0 Power-On/Off Timing Parameters (Single Enumeration) Parameter Maximum (s) Typical (s) t_pwr_on_seq t_pwr_off_seq TBD TBD TBD TBD USB Enumeration The unit supports single and double USB enumeration with the host:

Single enumeration:

Enumeration starts within maximum t_pwr_on_seq seconds of power-on. Double enumerationAs shown in Figure 5-1 on page 32:

First enumeration starts within t_pwr_on_seq seconds of power-on (while

USB_D+ is high) Second enumeration starts after t_USB_suspend (when USB_D+ goes high again) Rev 3 Sep.17 32 41110251 Power Power Supply Noise Noise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 100 mVp-p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity. Additional decoupling capacitors can be added to the main VCC line to filter noise into the device. Rev 3 Sep.17 33 41110251 6 6: Mechanical and Environmental Speci-

fications The MC7475 module complies with the mechanical and environmental specifications in Table 6-1. Final product conformance to these specifications depends on the OEM device implementation. Table 6-1: Mechanical and Environmental Specifications Ambient temperature Mode Operational Class A Operational Class B Details

-20C to +70C 3GPP compliant

-30C to +85C non-3GPP compliant (reduced operating parameters required) Non-operational

-40C to +85C, 96 hours

(from MIL-STD 202 Method 108) Relative humidity Non-operational 85C, 85% relative humidity for 48 hours

(non-condensing) Vibration Shock Drop Non-operational Random vibration, 10 to 2000 Hz, 0.1 g2/Hz to 0.0005 g2/

Hz, in each of three mutually perpendicular axes. Test duration of 60 minutes for each axis, for a total test time of three hours. Non-operational Half sine shock, 11 ms, 30 g, 8x each axis. Half sine shock, 6 ms, 100 g, 3x each axis. Non-operational 1 m on concrete on each of six faces, two times (module only). Thermal considerations See Thermal Considerations on page 37. Form factor Dimensions PCI-Express Mini Card shielded with metal and metalized fabric (F2 specification) Length:

Width:

Thickness:

Weight:

50.8 mm 29.85 mm 2.75 mm (max) 8.7 g Rev 3 Sep.17 34 41110251 Mechanical and Environmental Specifications Device Views Figure 6-1: Top View 2.60.1 29.850.15 24.20.1 5 1

. 0 8

. 0 5 1

. 0 5 0

. 8 4 8.250.1 10.1 1.6 +0.15

-0.05 4.880.25 14.50.25 19.290.25 3.850.1 1.650.1 40.05 1

. 0 4 5.60.05 13.60.05 PIN #51 PIN #1 1.50.1 TOP SIDE Figure 6-2: Dimensioned View X A M 1

. 0 5 2

. 0 P Y T 1

. 0 5 5

. 2 2.6 +0.15

-0.10 0.60.05 TYP 0.80.03 pitch TYP

(Note: All dimensions shown in mm.) Rev 3 Sep.17 35 41110251 Product Technical Specification Labeling MC7430 IMEI # 352678011234569 FPPDDDYNNNNHH |||||||||||||||||||||||||||||||||||

BB FCC ID: N7Nxxxxxx PRODUCT OF CHINA Figure 6-3: Sample Unit Label Note: The displayed label is an example only. The production label will vary by SKU. Sierra Wireless logo and product name IMEI number in Code-128 barcode format SKU number (when required) Factory Serial Number (FSN) in alphanumeric format The MC7475 label is non-removable and contains:

Manufacturing date code (incorporated into FSN)

Licensed vendor logo Applicable certification marks/details (e.g. FCC ID, etc. Example shows FCC ID.) Note: The MC7475 supports OEM partner-specific label requirements. Electrostatic Discharge (ESD) The OEM is responsible for ensuring that the Mini Card host interface pins are not exposed to ESD during handling or normal operation. (See Table 6-1 on page 34 for specifications.) ESD protection is highly recommended for the SIM connector at the point where the contacts are exposed, and for any other signals from the host interface that would be subjected to ESD by the user of the product. (The device includes ESD protection on the antenna.) Rev 3 Sep.17 36 41110251 Mechanical and Environmental Specifications Thermal Considerations Embedded modules can generate significant amounts of heat that must be dissipated in the host device for safety and performance reasons. RF Baseband Figure 6-4: Shield locations (Top view) The amount of thermal dissipation required depends on:

Supply voltageMaximum power dissipation for the module can be up to 3.5 W at voltage supply limits. UsageTypical power dissipation values depend on the location within the host product, throughput, amount of data transferred, etc.

Specific areas requiring heat dissipation are shown in Figure 6-4:

RFBottom face of module near RF connectors. Likely to be the hottest area. BasebandBottom face of module, below the baseband area.

To enhance heat dissipation:

It is recommended to add a heat sink that mounts the module to the main PCB or metal chassis (a thermal compound or pads must be used between the module and the heat sink). Rev 3 Sep.17 37 41110251 Product Technical Specification Copper Pad 2

. 0 5

. 9 2 Figure 6-5: Copper Pad Location on Bottom Side of Module

Maximize airflow over/around the module.

Module mounting holes must be used to attach (ground) the device to the Locate the module away from other hot components. main PCB ground or a metal chassis. You may also need active cooling to pull heat away from the module.

Note: Adequate dissipation of heat is necessary to ensure that the module functions properly. Module Integration Testing When testing your integration design:

Test to your worst case operating environment conditions (temperature and voltage) Test using worst case operation (transmitter on 100% duty cycle, maximum power)

Monitor temperature on the underside of the module. Attach thermocouples to the areas indicated in Figure 6-4 on page 37 (Baseband, RF). Note: Make sure that your system design provides sufficient cooling for the module proper mounting, heat sinks, and active cooling may be required, depending on the integrated application. The internal module temperature must be kept to <90C when integrated to prevent damage to the modules components. For best performance, keep the internal module temperature below 80C. Rev 3 Sep.17 38 41110251 Mechanical and Environmental Specifications

(For acceptance, certification, quality, and production (including RF) test suggestions, see Testing on page 15.) Rev 3 Sep.17 39 41110251 7: Regulatory Compliance and Industry Certifications 7 This module is designed to meet, and upon commercial release, will meet the requirements of the following regulatory bodies and regulations, where applicable:

Federal Communications Commission (FCC) of the United States Upon commercial release, the following industry certifications will have been obtained, where applicable:

PTCRB Additional certifications and details on specific country approvals may be obtained upon customer requestcontact your Sierra Wireless account representative for details. Additional testing and certification may be required for the end product with an embedded MC7475 module and are the responsibility of the OEM. Sierra Wireless offers professional services-based assistance to OEMs with the testing and certification process, if required. Important Notice Because of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless module are used in a normal manner with a well-

constructed network, the Sierra Wireless module should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless and its affiliates accept no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless module, or for failure of the Sierra Wireless module to transmit or receive such data. Safety and Hazards Do not operate your MC7475 module:

Where explosive atmospheres may be present including refuelling points, fuel In areas where blasting is in progress

depots, and chemical plants Near medical equipment, life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the MC7475 module MUST BE POWERED OFF. Otherwise, the MC7475 module can transmit signals that could interfere with this equipment. In an aircraft, the MC7475 module MUST BE POWERED OFF. Otherwise, the MC7475 module can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular Rev 3 Sep.17 40 41110251 Regulatory Compliance and Industry Certifications network. Use of a cellular phone in an aircraft is illegal in some jurisdictions. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both. Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC7475 module may be used normally at this time. Important Compliance Information for the United States of America Note: Details are preliminary and subject to change. The MC7475 module, upon commercial release, will have been granted modular approval for mobile and fixed applications. Integrators may use the MC7475 module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the users body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the limits stipulated in Table 7-1 on page 41. Table 7-1: Antenna Gain Specifications Device Technology Band MC7475 Mini Card LTE 2 4 12 125 Frequency

(MHz) 18501910 17101755 699716 23152318 Maximum antenna gain

(dBi) 6 6 6 10 Important: Mobile carriers often have limits on total radiated power (TRP), which requires an efficient antenna. The end product with an embedded module must output sufficient power to meet the TRP requirement but not too much to exceed FCC EIRP limit. If you need assistance in meeting this requirement, please contact Sierra Wireless. 3. The MC7475 module may transmit simultaneously with other collocated radio transmitters within a host device, provided the following conditions are met:

Each collocated radio transmitter has been certified by FCC for mobile application. At least 20 cm separation distance between the antennas of the collocated transmitters and the users body must be maintained at all times. Rev 3 Sep.17 41 41110251 Product Technical Specification The output power and antenna gain in a collocated configuration must not exceed the limits and configurations stipulated in Table 7-2. Table 7-2: Collocated Radio Transmitter Specifications Device Technology Frequency

(MHz) EIRP Limit

(dBm) Collocated transmittersa WLAN WiMAX BT 24002500 51505850 23002400 25002700 33003800 24002500 23 23 25 25 25 15 a. Valid collocated transmitter combinations: WLAN+BT; WiMAX+BT.

(WLAN+WiMAX+BT is not permitted.) 4. A label must be affixed to the outside of the end product into which the MC7475 module is incorporated, with a statement similar to the following:

This device contains FCC ID: N7NMC7475. 5. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded MC7475 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093. Note: Per FCC Part 27, mobile and portable stations containing MC7475 modules are not permitted to transmit using LTE B125 (23152318 MHz). Rev 3 Sep.17 42 41110251 8: Antenna Specification 8 This appendix describes recommended electrical performance criteria for main path, Rx diversity path, and GPS antennas used with AirPrime embedded modules. The performance specifications described in this section are valid while antennas are mounted in the host device with antenna feed cables routed in their final application configuration. Note: Antennas should be designed before the industrial design is finished to make sure that the best antennas can be developed. Recommended Main/Rx Diversity Antenna Specifications Table 8-1: Antenna Requirements a Requirements Comments Parameter Antenna system Operating bands Antenna 1 Operating bands Antenna 2 External multi-band antenna system with Rx diversity (Ant1/

Ant2)b 669746 MHz 17101990 MHz 21102155 MHz 23152350 MHz 729746 MHz 19301990 MHz 21102155 MHz 23472350 MHz VSWR of Ant1 and Ant2

< 2:1 (recommended)

< 3:1 (worst case) On all bands including band edges Rev 3 Sep.17 43 41110251 Product Technical Specification Table 8-1: Antenna Requirements (Continued)a Requirements Parameter Total radiated efficiency of Ant1 and Ant2

> 50% on all bands Radiation patterns of Ant1 and Ant2 Envelope correlation coefficient between Ant1 and Ant2 Mean Effective Gain of Ant1 and Ant2 (MEG1, MEG2) Ant1 and Ant2 Mean Effective Gain Imbalance I MEG1 / MEG2 I Maximum antenna gain Nominally Omni-directional radiation pattern in azimuth plane.

< 0.4 on low Rx bands (up to 1500 MHz)

< 0.2 on high Rx bands (over 1500 MHz)

-3 dBi

< 6 dB for Rx diversity operation Must not exceed antenna gains due to RF exposure and ERP/

EIRP limits, as listed in the modules FCC grant. Isolation between Ant1 and Ant2 (S21)

> 10 dB Power handling

> 2 W RF power on low bands

> 1 W on high bands

Comments

Measured at the RF connector.

Includes mismatch losses, losses in the matching circuit, and antenna losses, excluding cable loss. Sierra Wireless recommends using antenna efficiency as the primary parameter for evaluating the antenna system. Peak gain is not a good indication of antenna performance when integrated with a host device (the antenna does not provide omni-directional gain patterns). Peak gain can be affected by antenna size, location, design type, etc.the antenna gain patterns remain fixed unless one or more of these parameters change. See Important Compliance Information for the United States of America on page 41.

If antennas can be moved, test all positions for both antennas.

Make sure all other wireless devices

(Bluetooth or WLAN antennas, etc.) are turned OFF to avoid interference.

Measure power endurance over 4 hours

(estimated talk time) using a 2 W CW signalset the CW test signal frequency to the middle of the PCS Tx band

(1880 MHz for PCS). Visually inspect device to ensure there is no damage to the antenna structure and matching components. VSWR/TIS/TRP measurements taken before and after this test must show similar results. Rev 3 Sep.17 44 41110251 Antenna Specification a. These worst-case VSWR figures for the transmitter bands may not guarantee RSE levels to be within regulatory limits. The device alone meets all regulatory emissions limits when tested into a cabled (conducted) 50 ohm system. With antenna designs with up to 2.5:1 VSWR or worse, the radiated emissions could exceed limits. The antenna system may need to be tuned in order to meet the RSE limits as the complex match between the module and antenna can cause unwanted levels of emissions. Tuning may include antenna pattern changes, phase/delay adjustment, passive component matching. Examples of the application test limits would be included in FCC Part 22, Part 24 and Part 27, test case 4.2.2 for WCDMA

(ETSI EN 301 908-1), where applicable. b. Ant1Primary, Ant2Secondary (Rx Diversity) Recommended GPS Antenna Specifications Table 8-2: GPS Antenna Requirements Parameter Frequency range Field of view (FOV) Polarization

(average Gv/Gh) Free space average gain

(Gv+Gh) over FOV Gain Requirements Comments 1575.42 MHz 2 MHz minimum

Omni-directional in azimuth

-45 to +90 in elevation

> 0 dB

> -6 dBi (preferably > -3 dBi) Vertical linear polarization is sufficient. Gv and Gh are measured and averaged over -45 to

+90 in elevation, and 180 in azimuth.

Maximum gain and uniform coverage in the high elevation angle and zenith. Gain in azimuth plane is not desired.

Average 3D gain Isolation between GPS and Ant1 Typical VSWR Polarization

> -5 dBi

> 10 dB in all uplink bands

< 2.5:1 Any other than LHCP (left-hand circular polarized) is acceptable. Antenna Tests The following guidelines apply to the requirements described in Table 8-1 on page 43 and Table 8-2 on page 45:

Perform electrical measurements at room temperature (+20C to +26C) unless otherwise specified For main and Rx diversity path antennas, make sure the antennas (including contact device, coaxial cable, connectors, and matching circuit with no more than six components, if required) have nominal impedances of 50 across supported frequency bands.

Rev 3 Sep.17 45 41110251 Product Technical Specification

All tests (except isolation/correlation coefficient)Test the main or Rx diversity antenna with the other antenna terminated. Any metallic part of the antenna system that is exposed to the outside environment needs to meet the electrostatic discharge tests per IEC61000-4-

2 (conducted discharge +8kV). The functional requirements of the antenna system are tested and verified while the embedded modules antenna is integrated in the host device. Note: Additional testing, including active performance tests, mechanical, and accelerated life tests can be discussed with Sierra Wireless engineering services. Contact your Sierra Wireless representative for assistance. Rev 3 Sep.17 46 41110251 9 9: Design Checklist This chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on. Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration. Table 9-1: Hardware Integration Design Considerations Suggestion Section where discussed Component placement Protect the SIM socket so the SIM cannot be removed while the host is powered up. SIM Implementation on page 21 If an ESD suppressor is not used, allow space on the SIM connector for series resistors in layout. (Up to 100 may be used depending on ESD testing requirements). SIM Implementation on page 21 Minimize RF cable losses as these affect performance values listed in product specification documents. Antennas RF Connections on page 24 Match the module/antenna coax connections to 50 mismatched antenna impedance and cable loss negatively affect RF performance. RF Connections on page 24 If installing CDMA and UMTS modules in the same device, consider using separate antennas for maximum performance. Power Antenna and Cabling on page 25 Make sure the power supply can handle the maximum current specified for the module type. Power Consumption on page 30 Limit the total impedance of VCC and GND connections to the SIM at the connector to less than 1 (including any trace impedance and lumped element componentsinductors, filters, etc.). All other lines must have a trace impedance less than 2 . SIM Implementation on page 21 Decouple the VCC line close to the SIM socket. The longer the trace length (impedance) from socket to module, the greater the capacitance requirement to meet compliance tests. PCB signal routing USB 2.0Route these signals over 90 differential lines on the PCB. EMI / ESD Investigate sources of localized interference early in the design cycle. SIM Implementation on page 21 Methods to Mitigate Decreased Rx Performance on page 27 Provide ESD protection for the SIM connector at the exposed contact point (in particular, the CLK, VCC, IO, and RESET lines). SIM Implementation on page 21 Rev 3 Sep.17 47 41110251 Product Technical Specification Table 9-1: Hardware Integration Design Considerations (Continued) Suggestion Section where discussed Keep very low capacitance traces on the USIM_DATA and USIM_CLK signals. SIM Implementation on page 21 To minimize noise leakage, establish a very good ground connection between the module and host. Ground Connection on page 25 Route cables away from noise sources (for example, power supplies, LCD assemblies, etc.). Methods to Mitigate Decreased Rx Performance on page 27 Shield high RF-emitting components of the host device (for example, main processor, parallel bus, etc.). Methods to Mitigate Decreased Rx Performance on page 27 Use discrete filtering on low frequency lines to filter out unwanted high-

order harmonic energy. Methods to Mitigate Decreased Rx Performance on page 27 Use multi-layer PCBs to form shielding layers around high-speed clock traces. Thermal Methods to Mitigate Decreased Rx Performance on page 27 Test to worst case operating conditionstemperature, voltage, and operation mode (transmitter on 100% duty cycle, maximum power). Thermal Considerations on page 37 Use appropriate techniques to reduce module temperatures (for example, airflow, heat sinks, heat-relief tape, module placement, etc.). Host / Modem communication Make sure the host USB driver supports remote wakeup, resume, and suspend operations, and serial port emulation. When no valid data is being sent, do not send SOF tokens from the host

(causes unnecessary power consumption). Thermal Considerations on page 37 Rev 3 Sep.17 48 41110251 10: Packaging 10 Sierra Wireless AirPrime Mini Cards are packaged in sealed manufacturing boxes, each containing a single tray with a capacity of 100 modules (Figure 10-1 and Figure 10-2). Groups of three manufacturing boxes are then inserted into an outer box for shipping (Figure 10-3). In the standard packaging:

1. Mini Cards are inserted, system connector first, into the base portion (T1) of a two-part tray. all facing the same direction. This allows the top edge of each Mini Card to contact the top of the triangular features in the tray cover (T2) (see Detail A). 2. The tray base and tray cover snap together at four connection points. Triangular recesses hold top edges of Mini Cards T2 System connector Tray connection points Detail A See Detail A T1 Figure 10-1: Device Placement in Module Tray 3. The tray cover (T2) is secured to the tray base (T1) with ESD-safe tape (EP1) at four locations. 4. The tray is placed in a manufacturing box (T2 at the top), sealed with a security tape (P1), and a manufacturing label (L3) is placed on the bottom-right corner, above the security tape. If required for the SKU, an additional label (L4) can be placed beside L3. Rev 3 Sep.17 49 41110251 Product Technical Specification T2 EP1 T1 P1 L4 B1 L3 B1 Figure 10-2: Shipping Package 5. Three manufacturing boxes are placed in an outer shipping box (B2). If fewer than three manufacturing boxes are being shipped, empty boxes are added to the outer box The outer box is sealed with security tape (P1) and a label (L5) is placed on the box. 6. B1 P1 B2 B2 L5 Figure 10-3: Outer (shipping) Box Rev 3 Sep.17 50 41110251 11: References 11 This guide deals specifically with hardware integration issues that are unique to AirPrime embedded modules. Sierra Wireless Documents For additional documents describing embedded module design, usage, and integration issues, contact your Sierra Wireless account representative. Command Documents

[1] AT Command Set for User Equipment (UE) (Release 6) (3GPP TS 27.007) Industry/Other Documents The following non-Sierra Wireless references are not included in your documentation package:

[2] FCC Regulations - Part 15 - Radio Frequency Devices

[3] IEC-61000-4-2 level 3

[4] IEC-61000-4-2 level (Electrostatic Discharge Immunity Test)

[5] Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module (Doc# 3GPP TS 11.10-4)

[6] PCI Express Mini Card Electromechanical Specification Revision 2.1

[7] Universal Serial Bus Specification, Rev 2.0

[8] JESD22-A114-B

[9] JESD22-C101 Rev 3 Sep.17 51 41110251 A: Acronyms A 3rd Generation Partnership Project Octagonal Phase Shift Keying Automatic Gain Control Table A-1: Acronyms and Definitions Acronym or term Definition 3GPP 8PSK AGC API BER BLER bluetooth CQI COM CS CSG CW dB Continuous waveform Communication port Block Error Rate Circuit-switched Closed Subscriber Group Channel Quality Indication Application Programming Interface Bit Error RateA measure of receive sensitivity Wireless protocol for data exchange over short distances Decibel = 10 x log10 (P1/P2) P1 is calculated power; P2 is reference power Decibel = 20 x log10 (V1/V2) V1 is calculated voltage, V2 is reference voltage dBm DC-HSPA+

DCS A logarithmic (base 10) measure of relative power (dB for decibels); relative to milliwatts (m). A dBm value will be 30 units (1000 times) larger (less negative) than a dBW value, because of the difference in scale (milliwatts vs. watts). Dual Carrier HSPA+

Digital Cellular System A cellular communication infrastructure that uses the 1.8 GHz radio spectrum. DL DRX DSM DUT eICIC EIRP EMC EMI Downlink (network to mobile) Discontinuous Reception Distributed Shared Memory Device Under Test Enhanced Inter-Cell Interference Coordination Effective (or Equivalent) Isotropic Radiated Power Electromagnetic Compatibility Electromagnetic Interference Rev 3 Sep.17 52 41110251 Table A-1: Acronyms and Definitions (Continued) Acronyms Acronym or term Definition ERP ESD FCC Effective Radiated Power Electrostatic Discharge Federal Communications Commission The U.S. federal agency that is responsible for interstate and foreign communications. The FCC regulates commercial and private radio spectrum management, sets rates for communications services, determines standards for equipment, and controls broadcast licensing. Consult www.fcc.gov. FDD FDMA feICIC FER firmware FOTA FOV FSN GMSK GPS Host HSDPA HSPA+

HSUPA Hz IF IMEI IMS inrush current inter-RAT IOT Frequency Division Duplexing Frequency Division Multiple Access Further Enhanced Inter-Cell Interference Coordination Frame Error RateA measure of receive sensitivity. Software stored in ROM or EEPROM; essential programs that remain even when the system is turned off. Firmware is easier to change than hardware but more permanent than software stored on disk. Firmware Over The AirTechnology used to download firmware upgrades directly from the service provider, over the air. Field Of View Factory Serial NumberA unique serial number assigned to the mini card during manufacturing. Gaussian Minimum Shift Keying modulation Global Positioning System An American system that uses a series of 24 satellites in middle circular orbit to provide navigational data. The device into which an embedded module is integrated High Speed Downlink Packet Access Enhanced HSPA, as defined in 3GPP Release 7 and beyond High Speed Uplink Packet Access Hertz = 1 cycle/second Intermediate Frequency International Mobile Equipment Identity IP Multimedia SubsystemArchitectural framework for delivering IP multimedia services. Peak current drawn when a device is connected or powered on Radio Access Technology Interoperability Testing Rev 3 Sep.17 53 41110251 Product Technical Specification Table A-1: Acronyms and Definitions (Continued) Acronym or term Definition IS Interim Standard. After receiving industry consensus, the TIA forwards the standard to ANSI for approval. ISIM LED LHCP LNA LPM LPT LTE MCS MHz NAS / AS NC NIC NLIC NMEA OEM OFDMA OMA DM OTA PA packet PCB PCC PCS PDN PMI IMS Subscriber Identity Module (Also referred to as a SIM card) Light Emitting Diode. A semiconductor diode that emits visible or infrared light. Left-Hand Circular Polarized Low Noise Amplifier Low Power Mode Line Print Terminal Long Term Evolutiona high-performance air interface for cellular mobile communication systems. Modulation and Coding Scheme Megahertz = 10e6 Hz Network Access Server No Connect Network Interface Card Non-Linear Interference Cancellation National Marine Electronics Association Original Equipment Manufacturera company that manufactures a product and sells it to a reseller. Orthogonal Frequency Division Multiple Access Open Mobile Alliance Device ManagementA device management protocol. Over the air (or radiated through the antenna) Power Amplifier A short, fixed-length block of data, including a header, that is transmitted as a unit in a communications network. Printed Circuit Board Primary Component Carrier Personal Communication System A cellular communication infrastructure that uses the 1.9 GHz radio spectrum. Packet Data Network Pre-coding Matrix Index Rev 3 Sep.17 54 41110251 Table A-1: Acronyms and Definitions (Continued) Acronyms Acronym or term Definition PSS PST PTCRB QAM Primary synchronisation signal Product Support Tools PCS Type Certification Review Board Quadrature Amplitude Modulation. This form of modulation uses amplitude, frequency, and phase to transfer data on the carrier wave. QOS QPSK RAT RF RI roaming Quality of Service Quadrature Phase-Shift Keying Radio Access Technology Radio Frequency Ring Indicator A cellular subscriber is in an area where service is obtained from a cellular service provider that is not the subscribers provider. Radiated Spurious Emissions Secondary Component Carrier Received Signal Strength Indication RSE RSSI SCC SDK SED Sensitivity Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed Measure of lowest power signal that the receiver can measure. Software Development Kit Smart Error Detection BER/BLER/SNR value at the receiver output. SIB SIM SIMO SISO SKU S/N SNR SOF System Information Block Subscriber Identity Module. Also referred to as USIM or UICC. Single Input Multiple Outputsmart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side. This improves performance and security. Single Input Single Outputantenna technology that uses a single antenna at both the transmitter side and the receiver side. Stock Keeping Unitidentifies an inventory item: a unique code, consisting of numbers or letters and numbers, assigned to a product by a retailer for purposes of identification and inventory control. Signal-to-noise (ratio) Signal-to-Noise Ratio Start of FrameA USB function. Rev 3 Sep.17 55 41110251 Product Technical Specification Table A-1: Acronyms and Definitions (Continued) Acronym or term Definition SSS SUPL TDD TIA/EIA Secondary synchronisation signal. Secure User Plane Location Time Division Duplexing Telecommunications Industry Association / Electronics Industry Association. A standards setting trade organization, whose members provide communications and information technology products, systems, distribution services and professional services in the United States and around the world. Consult www.tiaonline.org. TIS TRP UDK UE UICC UL UMTS USB USIM VCC VSWR WAN WLAN ZIF ZUC Total Isotropic Sensitivity Total Radiated Power Universal Development Kit (for PCI Express Mini Cards) User Equipment Universal Integrated Circuit Card (Also referred to as a SIM card.) Uplink (mobile to network) Universal Mobile Telecommunications System Universal Serial Bus Universal Subscriber Identity Module (UMTS) Supply voltage Voltage Standing Wave Ratio Wide Area Network Wireless Local Area Network Zero Intermediate Frequency ZUC stream cypher Rev 3 Sep.17 56 41110251 Index Numerics 3D gain, average gain 3D average (GNSS), 45 3GPP compliance LTE, 12 A acronyms and definitions, 52 56 antenna connection considerations, 24 connectors, 13 custom, design, 25 GNSS, specifications, recommended, 45 limit, matching coaxial connections, 24 location, considerations, 25 matching, considerations, 25 maximum cable loss, 24 routing, 25 specification, 43 46 specifications, recommended, 43 testing, 45 antennas design checklist, 47 application interface features, 9 approvals, regulatory and industry, 40 averaged call mode DC power consumption, 31 averaged standby DC power consumption, 30 B bands supported, RF summary, 9 LTE, 28 bearers, dedicated, 10 block diagram system, 13 bottom view, 35 C cable loss antenna, maximum, 24 capacitors with SIM, 21 with XIM_DATA / XIM_CLK, 21 checklist, design, 47 communications, host to modem design checklist, 48 conducted Tx power tolerances, 28 connection grounding, 25 connectors, 24 connectors, required host-module, 11 control interface, 22 CQI, 10 D DC power consumption averaged call mode, 31 averaged standby, 30 desense. See RF design checklist antennas, 47 component placement, 47 EMI/ESD, 47 host/modem communications, 48 power, 47 thermal, 48 USB3, 47 detach procedure, 10 digital interface, 23 dimensioned view, 35 dimensions, 34, 35 diversity connector, location, 24 drop specifications, 34 E EDGE connector, required, 11 electrical specifications, 13 electrostatic discharge. See ESD envelope correlation coefficient, 44 environmental specifications, 34 36 ESD design checklist, 47 protection requirements, 36 F field of view, 45 filtering, RF desense, 27 form factor, 34 FOV, 45 free space average gain, 45 frequencies supported, 28 frequency band support LTE, 28 Rev 3 Sep.17 57 41110251 Product Technical Specification G gain GNSS, 45 maximum, 41, 44 mean effective, 44 mean effective imbalance, 44 GNSS antenna specifications, recommended, 45 connector location, 24 features supported, 10 GPS specifications, 29 ground specifications, 18 grounding connection considerations, 25 H host interface pin assignments, 14 humidity specifications, 34 I I/O connector location, 24 I/O rise time requirements, 21 impedance moduleantenna, 25 SIM, 21 industry approvals, 40 integration requirements, 11 interface control interface, 22 digital interface, 23 feature summary, 9 host, pin assignments, 14 SIM, 19 USB, 18 interference device generated, 26 host-generated, 26 power supply noise, 33 wireless devices, 26 intra-LTE mobility, 10 isolation, 44, 45 L labeling, 36 LED example, 23 LED output, 13, 22 LTE 3GPP compliance, 12 features, 10 frequency band support, 28 M mean effective gain, 44 Rev 3 Sep.17 mean effective gain imbalance, 44 mechanical specifications, 34 36 N noise leakage, minimizing, 25 RF interference, power supply, 33 O OEM labeling, 36 ordering information, 11 P packaging, 49 paging procedures, 10 PCB multi-layer, shielding for RF desense, 27 PDN connections, multiple, 10 pin assignments, host interface, 14 PMI, 10 polarization, 45 position location, 10 power design checklist, 47 handling, 44 power-up timing, 31 ramp-up timing, 31 supply, RF interference, 33 supply, ripple limit, 33 power consumption, DC averaged call mode, 31 averaged standby, 30 power specifications, 18 power tolerances, conducted Tx, 28 R radiated efficiency, total, 44 radiated sensitivity measurement, 27 radiated spurious emissions, 27 radiation patterns, 44 references, 51 regulatory approvals, 40 regulatory information, 40 42 FCC, 41 limitation of liability, 40 safety and hazards, 40 reset device, 23 resistors, external pull-up, 21 58 41110251 Index T temperature specifications, 34 temperature, module. See thermal thermal considerations, 37 38 design checklist, 48 dissipation, factors affecting, 37 dissipation, suggestions, 37 internal temperature, maximum, 38 testing, module, 38 timing power ramp-up, 31 power-up, 31 top view, 35 tracking session automatic, 10 standalone, 10 Tx power tolerances, conducted, 28 U USB high / full speed throughput performance, 18 interface, 18 USB3 design checklist, 47 V vibration specifications, 34 VSWR, 43, 45 W WAKE_N, 13, 22 WLAN_LED_N, 22 RF antenna cable loss, maximum, 24 antenna connection, considerations, 24 connectors, required, 11 desense device-generated, 26 harmonic energy, filtering, 27 mitigation suggestions, 27 shielding suggestions, 27 interference other devices, 26 power supply, 33 wireless devices, 26 RF bands supported summary, 9 LTE, 28 RF connector location, 24 RF specifications, 24??

RI, 10 RSE, 27 Rx sensitivity conducted, 28 S sales ordering, 11 sensitivity conducted, RF parameter, 28 defined, 28 radiated measurement, overview, 27 testing, overview, 27 shielding module, compliance, 24 reducing RF desense, 27 shock specifications, 34 signals, 22 SYSTEM_RESET_N, 23 WAKE_N, 22 WLAN_LED_N, 22 SIM capacitor recommendations, 21 card contacts, 20 clock rate, 21 connector, required, 11 electrical specifications, 21 impedance, connectors, 21 interface, 19 interface diagram, 20 operation, 21 specifications electrical, 13 environmental specifications, 34 36 GPS, 29 mechanical, 34 36 RF, 24??

standby DC power consumption, averaged, 30 system block diagram, 13 SYSTEM_RESET_N, 23 Rev 3 Sep.17 59 41110251