FCC ID: N7NHL7688 Wireless module

Product Technical Specification AirPrime HL7688 4119272 2.0 August 16, 2016 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note:

Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operators control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided as is. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. 4119272 Rev 2.0 August 16, 2016 2 Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright 2016 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless, AirPrime, AirLink, AirVantage, WISMO, ALEOS and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher is a registered trademark of NETGEAR, Inc., used under license. Windows and Windows Vista are registered trademarks of Microsoft Corporation. Macintosh and Mac OS X are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795 6:00 am to 6:00 pm PST Corporate and product information Web: sierrawireless.com 4119272 Rev 2.0 August 16, 2016 3 Product Technical Specification Document History Version Date May 23, 2016 May 26, 2016 May 30, 2016 1.0 1.1 1.2 2.0 Updates Creation Updated:

Table 2 General Features 1.8.2 Regulatory 3.16.2 RF Performances Updated:

Figure 2 Mechanical Overview 4 Mechanical Drawings August 16, 2016 Updated section 7 FCC Regulations 4119272 Rev 2.0 August 16, 2016 4 Contents 2.1. 1.9. 1.8.1. 1.8.2. 1.8.3. 1.8.4. 1.1. 1.2. 1.3. 1.4. 1.5. 1.6. 1.7. 1.8. 1. INTRODUCTION .................................................................................................. 10 Common Flexible Form Factor (CF3) ............................................................................. 10 Physical Dimensions ..................................................................................................... 10 General Features .......................................................................................................... 11 Architecture ................................................................................................................... 13 Interfaces ...................................................................................................................... 14 Connection Interface ..................................................................................................... 14 ESD .............................................................................................................................. 15 Environmental and Certifications ................................................................................... 15 Environmental Specifications ................................................................................. 15 Regulatory ............................................................................................................. 16 RoHS Directive Compliant ..................................................................................... 16 Disposing of the Product ........................................................................................ 16 References .................................................................................................................... 16 2. PAD DEFINITION ................................................................................................. 17 Pad Configuration (Top View, Through Module) ........................................................... 22 3. DETAILED INTERFACE SPECIFICATIONS ....................................................... 23 Power Supply ................................................................................................................ 23 Current Consumption .................................................................................................... 23 VGPIO ........................................................................................................................... 24 BAT_RTC ...................................................................................................................... 25 SIM Interface ................................................................................................................. 25 UIM1_DET ............................................................................................................. 26 USB .............................................................................................................................. 26 Electrical Information for Digital I/O ............................................................................... 26 General Purpose Input/Output (GPIO) .......................................................................... 27 Main Serial Link (UART1) .............................................................................................. 28 POWER-ON Signal (PWR_ON_N) ................................................................................ 28 Reset Signal (RESET_IN_N) ........................................................................................ 29 Analog to Digital Converter (ADC1) ............................................................................... 30 Clock Interface .............................................................................................................. 30 PCM .............................................................................................................................. 31 Debug Interfaces ........................................................................................................... 32 3.15.1. Trace Debug .......................................................................................................... 32 3.15.2. JTAG ...................................................................................................................... 33 RF Interface .................................................................................................................. 33 3.16.1. RF Connection ....................................................................................................... 33 3.6. 3.7. 3.8. 3.9. 3.10. 3.11. 3.12. 3.13. 3.14. 3.15. 3.1. 3.2. 3.3. 3.4. 3.5. 3.5.1. 3.16. 4119272 Rev 2.0 August 16, 2016 5 Product Technical Specification 5.4.1. 5.4.2. 5.5. 5.6. 5.7. 5.1. 5.2. 5.3. 5.4. 3.16.2. RF Performances ................................................................................................... 34 3.16.3. TX_ON Indicator (TX_ON) ..................................................................................... 34 4. MECHANICAL DRAWINGS ................................................................................. 36 5. DESIGN GUIDELINES ......................................................................................... 39 Power-Up Sequence ..................................................................................................... 39 Module Switch-Off ......................................................................................................... 40 Emergency Power OFF ................................................................................................. 40 Sleep Mode Management ............................................................................................. 40 Using UART1 ......................................................................................................... 40 Using USB ............................................................................................................. 41 Power Supply Design .................................................................................................... 41 ESD Guidelines for SIM Card ........................................................................................ 41 ESD Guidelines for USB ............................................................................................... 42 6. RELIABILITY SPECIFICATION ........................................................................... 43 Reliability Compliance ................................................................................................... 43 Reliability Prediction Model ........................................................................................... 43 6.2.1. Life Stress Test ...................................................................................................... 43 6.2.2. Environmental Resistance Stress Tests ................................................................. 44 6.2.3. Corrosive Resistance Stress Tests ........................................................................ 44 6.2.4. Thermal Resistance Cycle Stress Tests ................................................................. 45 6.2.5. Mechanical Resistance Stress Tests ..................................................................... 47 6.2.6. Handling Resistance Stress Tests ......................................................................... 48 7. FCC REGULATIONS ........................................................................................... 50 8. ORDERING INFORMATION ................................................................................ 52 9. TERMS AND ABBREVIATIONS .......................................................................... 53 6.1. 6.2. 4119272 Rev 2.0 August 16, 2016 6 List of Figures Architecture Overview ................................................................................................... 13 Figure 1. Mechanical Overview .................................................................................................... 14 Figure 2. Pad Configuration ......................................................................................................... 22 Figure 3. PCM Timing Waveform ................................................................................................. 32 Figure 4. TX_ON State During Transmission ............................................................................... 35 Figure 5. Mechanical Drawing ...................................................................................................... 36 Figure 6. Dimensions Drawing ..................................................................................................... 37 Figure 7. Footprint ........................................................................................................................ 38 Figure 8. Figure 9. PWR_ON_N Sequence with VGPIO Information .......................................................... 39 Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO ........................................................... 40 Figure 11. Voltage Limiter Example ............................................................................................... 41 Figure 12. EMC and ESD Components Close to the SIM .............................................................. 42 Figure 13. ESD Protection for USB ................................................................................................ 42 4119272 Rev 2.0 August 16, 2016 7 List of Tables Supported Bands/Connectivity ...................................................................................... 10 Table 1. General Features .......................................................................................................... 11 Table 2. ESD Specifications ........................................................................................................ 15 Table 3. Environmental Specifications ........................................................................................ 15 Table 4. Regulation Compliance ................................................................................................. 16 Table 5. Pad Definition ................................................................................................................ 17 Table 6. Power Supply ................................................................................................................ 23 Table 7. Current Consumption .................................................................................................... 23 Table 8. Current Consumption per Power Supply ....................................................................... 24 Table 9. VGPIO Electrical Characteristics ................................................................................... 24 Table 10. BAT_RTC Electrical Characteristics .............................................................................. 25 Table 11. UIM1 Pad Description ................................................................................................... 25 Table 12. Electrical Characteristics of UIM1.................................................................................. 26 Table 13. USB Pad Description .................................................................................................... 26 Table 14. Table 15. Digital I/O Electrical Characteristics .............................................................................. 27 Table 16. GPIO Pad Description ................................................................................................... 27 Table 17. UART1 Pad Description ................................................................................................ 28 PWR_ON_N Electrical Characteristics .......................................................................... 29 Table 18. RESET_IN_N Electrical Characteristics ........................................................................ 29 Table 19. Table 20. ADC Interface Pad Description ..................................................................................... 30 ADC Electrical Characteristics ...................................................................................... 30 Table 21. Clock Interface Pad Description .................................................................................... 30 Table 22. Table 23. PCM Interface Pad Description ..................................................................................... 31 PCM Electrical Characteristics ...................................................................................... 31 Table 24. Trace Debug Pad Description ....................................................................................... 32 Table 25. Table 26. JTAG Pad Description ................................................................................................... 33 RF Main Connection ..................................................................................................... 33 Table 27. RF Diversity Connection ............................................................................................... 33 Table 28. Table 29. Conducted RX Sensitivity UMTS Bands ..................................................................... 34 Conducted RX Sensitivity LTE Bands ........................................................................ 34 Table 30. TX_ON Indicator Pad Description ................................................................................. 34 Table 31. Table 32. TX_ON Characteristics ................................................................................................. 34 Standards Conformity ................................................................................................... 43 Table 33. Life Stress Test ............................................................................................................. 43 Table 34. Table 35. Environmental Resistance Stress Tests ........................................................................ 44 Corrosive Resistance Stress Tests ............................................................................... 44 Table 36. Table 37. Thermal Resistance Cycle Stress Tests ........................................................................ 45 4119272 Rev 2.0 August 16, 2016 8 Product Technical Specification Table 38. Mechanical Resistance Stress Tests ............................................................................. 47 Table 39. Handling Resistance Stress Tests ................................................................................ 48 Table 40. Ordering Information ..................................................................................................... 52 4119272 Rev 2.0 August 16, 2016 9 1. Introduction This document is the Product Technical Specification for the AirPrime HL7688 Embedded Module. It defines the high level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. The AirPrime HL7688 belongs to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless networks (as listed in Table 1 Supported Bands/Connectivity). The HL7688 supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions. Table 1. Supported Bands/Connectivity RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power LTE B2 LTE B4 LTE B5 LTE B17 UMTS B2 UMTS B5 1850 to 1910 MHz 1710 to 1755 MHz 824 to 849 MHz 704 to 716 MHz 1850 to 1910 MHz 824 to 849 MHz 1930 to 1990 MHz 2110 to 2155 MHz 869 to 894 MHz 734 to 746 MHz 1930 to 1990 MHz 869 to 894 MHz 23 dBm (+/- 2dBm) Class 3bis 23 dBm (+/- 2dBm) Class 3bis 23 dBm (+/- 2dBm) Class 3bis 23 dBm (+/- 2dBm) Class 3bis 23 dBm (+/- 2dBm) Class 3bis 23 dBm (+/- 2dBm) Class 3bis 1.1. Common Flexible Form Factor (CF3) The AirPrime HL7688 belongs to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique solution to a series of problems faced commonly in the WWAN module space as it:

Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions Offers electrical and functional compatibility Provides Direct Mount as well as Socketability depending on customer needs 1.2. Physical Dimensions AirPrime HL7688 modules are compact, robust, fully shielded modules with the following dimensions:

Length: 23 mm Width: 22 mm Thickness: 2.5 mm Weight: 3.5 g Note:

Dimensions specified above are typical values. 4119272 Rev 2.0 August 16, 2016 10 Product Technical Specification 1.3. General Features The table below summarizes the AirPrime HL7688 features. Table 2. General Features Feature Description Introduction Small form factor (146-pad solderable LGA pad) 23mm x 22mm x 2.5mm (nominal) Physical Complete body shielding RF connection pads (RF main interface) Baseband signals connection Electrical Single or double supply voltage (VBATT and VBATT_PA) 3.2V 4.5V RF SIM interface Application interface Quad-band LTE:

LTE B2: 1900 PCS LTE B4: 1700 AWS LTE B5: 850 CLR LTE B17: 700 Dual-band UMTS:

UMTS B2: 1900 PCS UMTS B5: 850 CLR 1.8V/3V support Dual SIM Single Standby (DSSS) SIM extraction / hot plug detection SIM/USIM support Conforms with ETSI UICC Specifications Supports SIM application tool kit with proactive SIM commands NDIS NIC interface support (Windows XP, Windows 7, Windows 8, Windows CE, Linux) Multiple non-multiplexed USB channel support Dial-up networking USB selective suspend to maximize power savings CMUX multiplexing over UART*

AT command interface 3GPP 27.007 standard, plus proprietary extended AT commands 4119272 Rev 2.0 August 16, 2016 11 Product Technical Specification Feature Description Single mode LTE operation:

Introduction LTE FDD, bandwidth 1.4-20 MHz System Release: 3GPP Rel. 9 Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink) Rx Diversity Max modulation 64 QAM DL, 16 QAM UL SMS over SGs and IMS SON ANR Public Warning System PWS Intra-frequency and inter-frequency mobility Protocol Stack SMS HSDPA (High Speed Downlink Packet Access) Evolved High Speed Downlink Packet Access (HSDPA+) Compliant with 3GPP Release 9 Up to Category 24 (DC, 42.2Mbps) Continuous Packet Connectivity (CPC) Enhance fractional DPCH IPv6 support HSUPA (High Speed Uplink Packet Access) Compliant with 3GPP Release 9 Category 7 (11.5Mbps) Robust Header Compression (RoHC) RXDIV Performance Enhancements Type 3i (HSDPA) HSPA Enhancements MAC-ehs Rel. 7 HSDPA Enhanced CELL_FACH/PCH states HSUPA Enhanced CELL_FACH states (eFACH) Rel 8 MAC-i/is Rel.8 Serving cell change enhancements Rel. 8 SMS over SGs and IMS SMS MO and MT SMS saving to SIM card or ME storage SMS reading from SIM card or ME storage SMS sorting SMS concatenation SMS Status Report SMS replacement support SMS storing rules (support of AT+CNMI, AT+CNMA) 4119272 Rev 2.0 August 16, 2016 12 Product Technical Specification Feature Description Introduction Connectivity Multiple (up to 20) cellular packet data profiles Sleep mode for minimum idle power draw Mobile-originated PDP context activation / deactivation Support QoS profile Release 97 Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput Release 99 QoS negotiation Background, Interactive, and Streaming Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol). Supports PAP and CHAP authentication protocols PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context RFC1144 TCP/IP header compression Environmental Operating temperature ranges (industrial grade):

Class A: -30C to +70C Class B: -40C to +85C RTC Real Time Clock (RTC) with calendar 1.4. Architecture The figure below presents an overview of the AirPrime HL7688s internal architecture and external interfaces. Memory

(Flash + RAM) Baseband MCU DSP PMU RF Analog Baseband AirPrime HL7688 RX_LTE Dulpexer RF Antenna Switch RF Main TX_LTE PA LGA-

146 Peripherals RX_LTE SAW Filters RF Antenna Switch RF DIV VBATT GND VGPIO BAT_RTC GPIO x 12 UART x 1 LGA-

146 Trace Debug (5 pins) JTAG 26M_CLKOUT 32K_CLKOUT SIM1 RESET_IN PWR_ON USB ADC x 1 PCM TX_ON Figure 1. Architecture Overview 26MHz 32.768KHz 4119272 Rev 2.0 August 16, 2016 13 Product Technical Specification 1.5. The AirPrime HL7688 module provides the following interfaces and peripheral connectivity:

Interfaces Introduction 1x 8-wire UART 1x Active Low RESET 1x USB 2.0 1x Backup Battery Interface 2x System Clock Out 1x Active Low POWER-ON 1x 1.8V/3V SIM 1x JTAG Interface 12x GPIOs (2 of which have multiplexes) 1x Main Antenna 1x RX Diversity Antenna 1x VGPIO 1x TX_ON 1x ADC 1x PCM 1x Debug Interface 1.6. Connection Interface The AirPrime HL7688 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB. Figure 2. Mechanical Overview The 146 pads have the following distribution:

66 inner signal pads, 1x0.5mm, pitch 0.8mm 1 reserved test point (do not connect), 1.0mm diameter 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm 4 inner corner ground pads, 1x1mm 4 outer corner ground pads, 1x0.9mm 4119272 Rev 2.0 August 16, 2016 14 Product Technical Specification 1.7. ESD Refer to the following table for ESD Specifications. Introduction Note:

Information specified in the following table is preliminary and subject to change. Table 3. ESD Specifications Category Connection Specification Operational RF ports Non-operational Host connector interface IEC-61000-4-2 Level (Electrostatic Discharge Immunity Test) Unless otherwise specified:

JESD22-A114 +/- 1kV Human Body Model JESD22-A115 +/- 200V Machine Model JESD22-C101C +/- 250V Charged Device Model Signals SIM connector Other host signals Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user. 1.8. Environmental and Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below. Table 4. Environmental Specifications Conditions Operating Class A Operating Class B Storage Range

-30C to +70C

-40C to +85C

-40C to +85C Class A is defined as the operating temperature ranges that the device:

Shall exhibit normal function during and after environmental exposure. Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device:

Shall remain fully functional during and after environmental exposure Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance. Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed. 4119272 Rev 2.0 August 16, 2016 15 Product Technical Specification Introduction 1.8.2. Regulatory The AirPrime HL7688 is compliant with FCC regulations. FCC compliance will be reflected on the AirPrime HL7688 label. Table 5. Regulation Compliance Document Current Version Description GCF-CC NAPRD.03 FCC Part 22, 24, 27 v3.56.1 or later V5.22 or later NA GCF Conformance Certification Criteria North American Program Reference Document Federal Communications Commission 1.8.3. RoHS Directive Compliant The AirPrime HL7688 module is compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). 1.8.4. Disposing of the Product This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner. 1.9. References

[1] AirPrime HL Series Customer Process Guidelines Reference Number: 4114330

[2] AirPrime HL7688 AT Commands Interface Guide Reference Number: TBD 4119272 Rev 2.0 August 16, 2016 16 2. Pad Definition AirPrime HL7688 pads are divided into 3 functional categories. Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules. Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pad location. Custom functions and associated pads are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os. Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on other CF3 modules. Other pads marked as not connected or reserved should not be used. Table 6. Pad Definition Pad #

Signal Name Function 1 2 3 4 5 6 7 8 GPIO1 UART1_RI /

TRACE_DATA3 UART1_RTS UART1_CTS UART1_TX UART1_RX UART1_DTR UART1_DCD /

TRACE_DATA1 General purpose input/output UART1 Ring indicator / Trace data 3 UART1 Request to send UART1 Clear to send UART1 Transmit data UART1 Receive data UART1 Data terminal ready UART1 Data carrier detect / Trace data 1 I/O I/O O I O I O I O Active Low / High Power Supply Domain Recommendation for Unused Pads Type L L L L 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Left Open Extension Connect to test point Core / Custom Connect to test point Core Connect to test point Core Connect to test point Core Connect to test point Core Connect to test point Core Connect to test point Core / Custom 4119272 Rev 2.0 August 16, 2016 17 Product Technical Specification Pad Definition Pad #

Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 UART1_DSR /

TRACE_DATA0 GPIO2 / TRACE_DATA2 General purpose input/output / Trace data 2 RESET_IN_N UART1 Data set ready / Trace data 0 USB_D-

USB_D+

NC NC USB_VBUS NC NC NC NC BAT_RTC 26M_CLKOUT 32K_CLKOUT ADC1 NC UIM1_VCC UIM1_CLK Input reset signal USB Data Negative (Low / Full Speed) USB Data Negative (High Speed) USB Data Positive (Low / Full Speed) USB Data Positive (High Speed) Not Connected (Reserved for future use) Not Connected (Reserved for future use) USB VBUS Not Connected (Reserved for future use) Not Connected (Reserved for future use) Not Connected (Reserved for future use) Not Connected (Reserved for future use) Power supply for RTC backup 26MHz System Clock Output 32.768kHz System Clock Output Analog to digital converter Not Connected (Reserved for future use) 1.8V/3V SIM1 Power supply 1.8V/3V SIM1 Clock UIM1_DATA 1.8V/3V SIM1 Data O I/O I I/O I/O I I/O O O I O O I/O L L 1.8V 1.8V 1.8V 3.3V 0.38V 3.3V 0.38V 5V 1.8V 1.8V 1.8V 1.2V 1.8V/3V 1.8V/3V 1.8V/3V Connect to test point Core / Custom Connect to test point Core / Custom Left Open Core Connect to test point Extension Connect to test point Extension Not connected Not connected Left Open Left Open Connect to test point Extension Left Open Left Open Left Open Left Open Left Open Left Open Left Open Left Open Left Open Mandatory connection Mandatory connection Mandatory connection Not connected Not connected Not connected Not connected Extension Extension Extension Extension Not connected Core Core Core 4119272 Rev 2.0 August 16, 2016 18 Product Technical Specification Pad Definition Pad #

Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 UIM1_RESET 1.8V/3V SIM1 Reset GND RF_DIV GND PCM_OUT PCM_IN PCM_SYNC PCM_CLK GND NC GND Ground RF Input - Diversity Ground PCM data out PCM data in PCM sync out PCM clock Ground Not Connected (Reserved for future use) Ground GPIO7 GPIO8 / TRACE_CLK NC NC GPIO13 VGPIO GPIO6 NC General purpose input/output General purpose input/output / Trace clock Not Connected (Reserved for future use) Not Connected (Reserved for future use) General purpose input/output GPIO voltage output General purpose input/output Not Connected (Reserved for future use) GND Ground O 0V 0V O I I/O I/O 0V 0V I/O I/O O O I/O 0V L 1.8V/3V 0V 0V 1.8V 1.8V 1.8V 1.8V 0V 0V 1.8V 1.8V 1.8V 1.8V 1.8V 0V Core Extension Extension Extension Extension Extension Extension Extension Mandatory connection Mandatory connection Mandatory connection Mandatory connection Left Open Left Open Left Open Left Open Mandatory connection Left Open Mandatory connection Left Open Connect to test point Core/Custom Not connected Left Open Left Open Not connected Extension Left Open Core Left Open Left Open Core Left Open Not connected Mandatory connection Not connected Core Core Core Core 4119272 Rev 2.0 August 16, 2016 19 Product Technical Specification Pad #

Signal Name Function 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67-70 RF_MAIN RF Input/output GND GPIO14 GPIO10 GPIO11 GPIO15 NC NC NC NC PWR_ON TX_ON VBATT_PA VBATT_PA VBATT UIM1_DET GPIO4 GPIO5 GND Ground General purpose input/output General purpose input/output General purpose input/output General purpose input/output Not Connected (Reserved for future use) Not Connected (Reserved for future use) Not Connected (Reserved for future use) Not Connected (Reserved for future use) Active Low Power On control signal TX indicator Power supply (refer to section 3.1 Power Supply for more information) Power supply (refer to section 3.1 Power Supply for more information) Power supply UIM1 Detection General purpose input/output General purpose input/output Ground Pad Definition Active Low / High Power Supply Domain Recommendation for Unused Pads Type L H H 0V 1.8V 1.8V 1.8V 1.8V 1.8V 2.3V 3.2V (min) 3.7V (typ) 4.5V (max) 3.2V (min) 3.7V (typ) 4.5V (max) 3.2V (min) 3.7V (typ) 4.5V (max) 1.8V 1.8V 1.8V 0V Mandatory connection Mandatory connection Left Open Left Open Left Open Left Open Left Open Left Open Left Open Left Open Mandatory connection Left Open Mandatory connection Mandatory connection Mandatory connection Left Open Left Open Left Open Core Core Extension Extension Extension Extension Not connected Not connected Not connected Not connected Core Extension Core Core Core Core Extension Extension Core I/O 0V I I/O I/O I/O I O I I I I/O I/O I/O GND 4119272 Rev 2.0 August 16, 2016 20 Product Technical Specification Pad Definition Pad #

Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 71 - 166 Note:

These pads are not available on the AirPrime HL7688 module. 167 - 234 GND 236 237 238 239 240 241 242 JTAG_RESET JTAG_TCK JTAG_TDO JTAG_TMS JTAG_TRST JTAG_TDI JTAG_RTCK Ground JTAG RESET JTAG Test Clock JTAG Test Data Output JTAG Test Mode Select JTAG Test Reset JTAG Test Data Input JTAG Returned Test Clock GND I I O I I I O L L 0V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Left Open Left Open Left Open Left Open Left Open Left Open Left Open Core Extension Extension Extension Extension Extension Extension Extension 4119272 Rev 2.0 August 16, 2016 21 Product Technical Specification 2.1. Pad Configuration (Top View, Through Module) Pad Definition Figure 3. Pad Configuration 4119272 Rev 2.0 August 16, 2016 22 3. Detailed Interface Specifications Note:

If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7688 modules support separate VBATT and VBATT_PA connection if requirements below are fulfilled. 3.1. Power Supply The AirPrime HL7688 modules is supplied through the VBATT signal with the following characteristics. Table 7. Power Supply Supply Minimum Typical Maximum VBATT voltage (V) VBATT_PA voltage (V) Full Specification VBATT_PA voltage (V) Extended Range 3.2*

3.2*

2.8 3.7 3.7 3.7 4.5 4.5 4.5

*

This value has to be guaranteed during the burst. Note:

Load capacitance for VBATT is around 32F 20% embedded inside the module. Load capacitance for VBATT_PA is around 10F 20% embedded inside the module. 3.2. Current Consumption The following table lists the current consumption of the AirPrime HL7688 at different conditions. Note:

The following data is with USB disconnected to achieve the lowest current consumption. An additional 0.6mA will be consumed if USB is connected. Typical values are defined for VBATT/VBATT_PA at 3.7V and 25C, for 50 impedance at all RF ports. Maximum values are provided for VSWR3:1 with worst conditions among supported ranges of voltages and temperature. Table 8. Current Consumption Parameter Off mode Sleep mode LTE DRX = 1.28s USB = disconnected Band 2 Band 4 Band 5 Band 17 Minimum Typical Maximum Unit 95 1.2 1.2 1.2 1.2 110 1.4 1.4 1.4 1.4 202 6.2 6.2 6.2 6.2 A mA mA mA mA 4119272 Rev 2.0 August 16, 2016 23 Product Technical Specification Detailed Interface Specifications Parameter Minimum Typical Maximum Unit LTE in communication mode

(TX Max) UMTS (TX Max) Band 2 Band 4 Band 5 Band 17 Band 2 Band 5 630 510 440 540 570 400 650 610 520 560 660 460 895 945 745 780 770 500 mA mA mA mA mA mA Table 9. Current Consumption per Power Supply Parameter (at nominal voltage, 3.7 V) Typical Unit Band 2 Band 4 Band 5 Band 17 Band 2 Band 5 Band 2 Band 4 Band 5 Band 17 Band 2 Band 5 214 207 211 218 124 118 436 403 309 342 536 342 mA mA mA mA mA mA mA mA mA mA mA mA LTE in communication mode (TX Max) USB = disconnected VBATT_BB UMTS (TX Max) USB = disconnected LTE in communication mode (TX Max) USB = disconnected VBATT_PA UMTS (TX Max) USB = disconnected 3.3. VGPIO The VGPIO output can be used to:

Pull-up signals such as I/Os Supply the digital transistors driving LEDs The VGPIO output is available when the AirPrime HL7688 module is switched ON. Table 10. VGPIO Electrical Characteristics Parameter Minimum Typical Maximum Remarks Voltage level (V) Current capability Active Mode (mA) Current capability Sleep Mode (mA) Rise Time(ms) 1.7 1.8

-

-

-

-

-

-

1.9 50 3 1.5 Both active mode and sleep mode Power management support up to 50mA output in Active mode Power management support up to 3mA output in Sleep mode Start-Up time from 0V 4119272 Rev 2.0 August 16, 2016 24 Detailed Interface Specifications Product Technical Specification 3.4. BAT_RTC The AirPrime HL7688 module provides an input/output to connect a Real Time Clock power supply. This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported when VBATT is available but a back-up power supply is needed to save date and hour when VBATT is switched off. If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator. Table 11. BAT_RTC Electrical Characteristics Parameter Minimum Typical Maximum Unit Input voltage Input current consumption Output voltage Max charging current (@VBATT=3.7V)

-

-

-5%

-

1.8 2.5 (TBC) 1.8 25

-

-

+5%

-

V A V mA Note:

When used with the HL Series snap-in socket, or when compatibility with HL6528x is needed, Sierra Wireless recommends adding a 10F capacitor to the BAT_RTC pad. 3.5. SIM Interface The AirPrime HL7688 has one physical SIM interface, UIM1, which has optional support for dual SIM application with an external SIM switch. The UIM1 interface allows control of a 1.8V/3V SIM and is fully compliant with GSM 11.11 recommendations concerning SIM functions. The five signals used by this interface are as follows:

UIM1_VCC: power supply UIM1_CLK: clock UIM1_DATA: I/O port UIM1_RESET: reset UIM1_DET: SIM detection Table 12. UIM1 Pad Description Pad #

Signal Name Description 26 27 28 29 64 UIM1_VCC UIM1_CLK UIM1_DATA UIM1_RESET UIM1_DET 1.8V/3V SIM1 Power supply 1.8V/3V SIM1 Clock 1.8V/3V SIM1 Data 1.8V/3V SIM1 Reset UIM1 Detection 4119272 Rev 2.0 August 16, 2016 25 Product Technical Specification Table 13. Electrical Characteristics of UIM1 Detailed Interface Specifications Parameter Minimum Typical Maximum Remarks UIM1 Interface Voltage (V)

(VCC,CLK,IO,RST) UIM1 Detect UIM1_VCC Current (mA) UIM1_VCC Line Regulation

(mV/V) UIM1_VCC Power-up Setting Time (s) from power down

-

-

-

-

-

-

2.9 1.80 1.80

-

-

10

-

-

-

10 50

-

The appropriate output voltage is auto detected and selected by software. High active Max output current in sleep mode = 3 mA At Iout_Max 3.5.1. UIM1_DET UIM1_DET is used to detect and notify the application about the insertion and removal of a SIM device in the SIM socket connected to the SIM interface. When a SIM is inserted, the state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a SIM is removed, the state of UIM1_DET transitions from logic 1 to logic 0. 3.6. USB The AirPrime HL7688 has one USB interface. Table 14. USB Pad Description Pad Number Signal Name 12 13 16 USB_D-

USB_D+

USB_VBUS I/O I/O I/O I Function USB Data Negative USB Data Positive USB VBUS Note:

When the 5V USB supply is not available, connect USB_VBUS to VBATT to supply the USB interface. 3.7. Electrical Information for Digital I/O The AirPrime HL7688 supports two groups of digital interfaces with varying current drain limits. The following list enumerates these interface groupings and the following table enumerates the electrical characteristics of each digital interface. Group 1 (6mA current drain limit) GPIO2, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15 Group 2 (1mA current drain limit) GPIO1, GPIO5, GPIO7 UART1 JTAG PCM 4119272 Rev 2.0 August 16, 2016 26 Product Technical Specification Table 15. Digital I/O Electrical Characteristics Detailed Interface Specifications Parameter Input Current-High(A) Input Current-Low(A) Group 1 Group 2 DC Output Current-High (mA) DC Output Current-Low (mA) DC Output Current-High (mA) DC Output Current-Low (mA) Input Voltage-High(V) Input Voltage-Low(V) Output Voltage-High(V) Output Voltage-Low(V) Symbol Minimum Typical Maximum Remarks IIH IIL IOH IOL IOH IOL VIH VIL VOH VOH VOL VOL

-

-

-

-6

-

-1 1.19

-0.20 1.35 1.50

-

-

-

-

-

-

-

-

-

-

-

-

-

-

240 240 6

-

1

-

2.10 0.38

-

-

0.35 0.2 IOH = -6mA IOH = -0.1mA IOH = 6mA IOH = 0.1mA 3.8. General Purpose Input/Output (GPIO) The AirPrime HL7688 module provides 12 GPIOs, 2 of which have multiplexes. Table 16. GPIO Pad Description Pad Number Signal Name Multiplex I/O Power Supply Domain 1 10 40 41 44 46 51 52 53 54 65 66 GPIO1 GPIO2 GPIO7 GPIO8 GPIO13 GPIO6 GPIO14 GPIO10 GPIO11 GPIO15 GPIO4 GPIO5 TRACE_DATA2 TRACE_CLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 4119272 Rev 2.0 August 16, 2016 27 Detailed Interface Specifications Product Technical Specification 3.9. Main Serial Link (UART1) The main serial link (UART1) is used for communication between the AirPrime HL7688 module and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface. The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s. The signals used by UART1 are as follows:

TX data (UART1_TX) RX data (UART1_RX) Request To Send (UART1_RTS) Clear To Send (UART1_CTS) Data Terminal Ready (UART1_DTR) Data Set Ready (UART1_DSR) Data Carrier Detect (UART1_DCD) Ring Indicator (UART1_RI) Signal names are according to PC view. Note:

UART1 pad description is summarized in the table below. Table 17. UART1 Pad Description Pad #

Signal Name*

I/O*

Description 2 3 4 5 6 7 8 9 UART1_RI UART1_RTS UART1_CTS UART1_TX UART1_RX O I O I O UART1_DTR I (active low) UART1_DCD UART1_DSR O O

*

According to PC view. Signal incoming calls (data only), SMS, etc. Request to send AirPrime HL7688 is ready to receive AT commands Transmit data Receive data Prevents the AirPrime HL7688 from entering sleep mode, switches between data mode and command mode, and wakes the module up. Signal data connection in progress Signal UART interface is ON 3.10. POWER-ON Signal (PWR_ON_N) A low level signal has to be provided to switch the AirPrime HL7688 module ON. It is internally connected to the permanent 1.8V supply regulator inside the HL7688 via a pull-up resistor. Once VBAT is supplied to the HL7688 module, this 1.8V supply regulator will be enabled and so the PWR_ON_N signal is by default at high level. The PWR_ON_N signals characteristics are listed in the table below. 4119272 Rev 2.0 August 16, 2016 28 Product Technical Specification Table 18. PWR_ON_N Electrical Characteristics Detailed Interface Specifications Parameter Minimum Typical Maximum Input Voltage-Low (V) Input Voltage-High (V) Power-up period (ms) from PWR_ON_N falling edge PWR_ON_N assertion time (ms) 1.33 2000 25

-

-

-

0.51 2.2

-

Note:

As PWR_ON_N is internally pulled up with 47k, an open collector or open drain transistor must be used for ignition. VGPIO is an output from the module that can be used to check if the module is active. When VGPIO = 0V, the module is OFF When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode) Note:

PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT command AT+CPWROFF. 3.11. Reset Signal (RESET_IN_N) To reset the module, a low level pulse must be sent on the RESET_IN_N pad for 20ms. This action will immediately restart the AirPrime HL7688 module with the PWR_ON_N signal at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally pulled up, an open collector or open drain transistor has to be used to control this signal. The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for the next power on. Note:

As RESET_IN_N is referenced to the VRTC (200k pull-up resistor to VRTC 1.8V) an open collector or open drain transistor has to be used to control this signal. Table 19. RESET_IN_N Electrical Characteristics Parameter Minimum Typical Maximum Input Voltage-Low (V) Input Voltage-High (V) Reset assertion time (ms) Power-up period (ms) from RESET_IN_N falling edge*

1.33 20 2000

-

-

-

-

0.51 2.2

-

-

*

With the PWR_ON_N Signal at low level 4119272 Rev 2.0 August 16, 2016 29 Product Technical Specification 3.12. Analog to Digital Converter (ADC1) One Analog to Digital Converter input, ADC1, is provided by the AirPrime HL7688 module. This converter is a 10-bit resolution ADC ranging from 0 to 1.2V. The following table describes the pad description of the ADC interface. Detailed Interface Specifications Table 20. ADC Interface Pad Description Pad Number Signal Name 24 ADC1 I/O I Description Analog to digital converter Typical ADC1 use is for monitoring external voltage; wherein an application is used to safely power OFF an external supply in case of overvoltage. Table 21. ADC Electrical Characteristics Parameter Minimum Typical Maximum Remarks ADC1 Resolution (bits) Input Voltage Range (V) Update rate per channel (kHz) Integral Nonlinearity (bits) Offset Error (bits) Gain Input Resistance (M) Input Capacitance (pF)

-

0

-

-

-

849 1

-

10

-

-

-

-

853

-

1

-

1.2 125 2 1 858

-

-

General purpose input LSB LSB 3.13. Clock Interface The AirPrime HL7688 module supports two digital clock interfaces. The following table describes the pad description of the clock out interfaces. Table 22. Clock Interface Pad Description Pad Number Signal Name I/O I/O Type Description 22 23 26M_CLKOUT 32K_CLKOUT O O 1.8V 1.8V 26MHz Digital Clock output 32.768kHz Digital Clock output Enabling or disabling the clock out feature can be done using AT commands. For more information about AT commands, refer to document [2] AirPrime HL7688 AT Commands Interface Guide. 4119272 Rev 2.0 August 16, 2016 30 Product Technical Specification 3.14. PCM The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used, for example, to connect an external audio codec. The programmability of this interface allows addressing a large range of audio peripherals. The signals used by the Digital Audio Interface are as follows:

Detailed Interface Specifications PCM_SYNC: The frame synchronization signal delivers an 8 kHz frequency pulse that synchronizes the frame data in and the frame data out. PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral. PCM_OUT: The frame data out relies on the selected configuration mode. PCM_IN: The frame data in relies on the selected configuration mode. The PCM interface is a high speed full duplex interface that can be used to send and receive digital audio data to external audio ICs. The Digital Audio Interface also features the following:

PCM master or slave 16 bits data word length, linear mode MSB first Configurable PCM bit clock rate on 256kHz, 384kHz or 512kHz Long frame sync The following table describes the pad description of the PCM interface. Table 23. PCM Interface Pad Description Pad Number Signal Name 33 34 35 36 PCM_OUT PCM_IN PCM_SYNC PCM_CLK I/O O I I/O I/O Description PCM data out PCM data in PCM sync out PCM clock Refer to the following table for the electrical characteristics of the digital audio interface. Table 24. PCM Electrical Characteristics Signal Description Minimum Typical Maximum Unit Tsync_low +

Tsync_high Tsync_low Tsync_high TCLK-cycle TIN-setup TIN-hold TOUT-delay PCM-SYNC period PCM-SYNC low time PCM-SYNC high time PCM-CLK period (T) PCM-IN setup time PCM-IN hold time PCM-OUT delay time 1.95 59.6 12 125 62.5 62.5 2.6 3.9 21.6 s s s s ns ns ns 4119272 Rev 2.0 August 16, 2016 31 Product Technical Specification Detailed Interface Specifications Signal Description Minimum Typical Maximum Unit TSYNC-delay PCM-SYNC output delay

-24 31.2 ns The following figure shows the PCM timing waveform. Figure 4. PCM Timing Waveform 3.15. Debug Interfaces The AirPrime HL7688 module provides 2 interfaces for a powerful debug system. 3.15.1. Trace Debug The AirPrime HL7688 module provides a Trace Debug interface, providing real-time instruction and data trace of the modem core. Table 25. Trace Debug Pad Description Pad Number Signal Name Function Multiplex 2 8 9 10 41 TRACE_DATA3 TRACE_DATA1 TRACE_DATA0 TRACE_DATA2 TRACE_CLK Trace data 3 Trace data 1 Trace data 0 Trace data 2 Trace clock GPIO2 GPIO8 Note:

It is strongly recommended to provide access to this interface through Test Points. 4119272 Rev 2.0 August 16, 2016 32 Product Technical Specification Detailed Interface Specifications 3.15.2. JTAG The JTAG interface provides debug access to the core of the AirPrime HL7688. These JTAG signals are accessible through solder-able test points. Table 26. JTAG Pad Description Pad Number Signal Name Function 236 237 238 239 240 241 242 Note:

JTAG_RESET JTAG_TCK JTAG_TDO JTAG_TMS JTAG_TRST JTAG_TDI JTAG_RTCK JTAG RESET JTAG Test Clock JTAG Test Data Output JTAG Test Mode Select JTAG Test Reset JTAG Test Data Input JTAG Returned Test Clock It is recommended to provide access through Test Points to this interface the JTAG pads (for Failure Analysis debugging). All signals listed in table above shall be outputs on the customer board to allow JTAG debugging. 3.16. RF Interface The RF interface of the HL7688 module allows the transmission of RF signals. This interface has a 50 nominal impedance. 3.16.1. RF Connection A 50 stripline can be used to connect to standard RF connectors such as SMA, UFL, etc. for antenna connection. Table 27. RF Main Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 49 RF_MAIN 50 1.5:1 1.5:1 Table 28. RF Diversity Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 31 RF_DIV 50 1.5:1

---

4119272 Rev 2.0 August 16, 2016 33 Product Technical Specification 3.16.2. RF Performances Detailed Interface Specifications Note:

Values in the tables below are preliminary and subject to change. Table 29. Conducted RX Sensitivity UMTS Bands Frequency Band Conducted Rx Sensitivity (dBm) Primary (Typical) Secondary (Typical) Band 2 Band 5 0.1% BER 12.2 kbps

-109.5

-110.0

-110.0

-110.5 4G RF performances are compliant with 3GPP recommendation TS 36.101. Table 30. Conducted RX Sensitivity LTE Bands Frequency Band Conducted Rx Sensitivity (dBm) Primary (Typical) Secondary (Typical) SIMO (Typical) LTE B2 LTE B4 LTE B5 LTE B17 Full RB; BW: 20 MHz*

Full RB; BW: 20 MHz*

Full RB; BW: 10 MHz*

Full RB; BW: 10 MHz*

-93

-95

-98

-98

-94

-95

-99

-99

-97

-98

-101

-101

*

Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity 10*log (10 MHz/x_MHz) 3.16.3. TX_ON Indicator (TX_ON) The AirPrime HL7688 module provides a signal, TX_ON, for TX indication. The TX_ON is a 2.3V signal and its status signal depends on the module transmitter state. Refer to the following table for the status of the TX_ON signal depending on the embedded modules state. Table 31. TX_ON Indicator Pad Description Pad Number Signal Name Function I/O Type Power Supply Domain 60 TX_ON TX indicator O 2.3V Table 32. TX_ON Characteristics Parameter Minimum Tadvance Tdelay 30s Typical 10s Maximum 4119272 Rev 2.0 August 16, 2016 34 Product Technical Specification Detailed Interface Specifications Figure 5. TX_ON State During Transmission 4119272 Rev 2.0 August 16, 2016 35 4. Mechanical Drawings Figure 6. Mechanical Drawing 4119272 Rev 2.0 August 16, 2016 36 Product Technical Specification Mechanical Drawings Figure 7. Dimensions Drawing 4119272 Rev 2.0 August 16, 2016 37 Product Technical Specification Mechanical Drawings Figure 8. Footprint 4119272 Rev 2.0 August 16, 2016 38 5. Design Guidelines 5.1. Power-Up Sequence Apply a LOW level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB. When using UART1, the AT command interface is available after the transition of UART1_CTS from high to low level. When using a USB connection, the HL7688 will start communicating with the host after USB enumeration. The time when AT commands can be sent will depend on the initialization time on the USB host. Figure 9. PWR_ON_N Sequence with VGPIO Information Note:

As PWR_ON_N is internally pulled up with 47k, an open collector or open drain transistor must be used for ignition. The PWR_ON_N pad has the minimum assertion time requirement of 25ms, with LOW active. Once the valid power on trigger is detected, the PWR_ON_N pad status can be left open. The maximum inrush current is 1.3 A and lasts less than 1.5 ms. 4119272 Rev 2.0 August 16, 2016 39 Product Technical Specification 5.2. Module Switch-Off AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7688 module off. Design Guidelines Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO Note:

PWR_ON_N is internally pulled up by 47k to 1.8V. 5.3. Emergency Power OFF If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must only be used in emergency situations if the system freezes (not responding to AT commands). To perform an emergency power off, a low level pulse must be sent on the RESET_IN_N pad for 20ms while the PWR_ON_N signal is inactive (high level). This action will immediately shut the HL7688 module down and the registers of the CPU and RAM memory will be reset for the next power on. 5.4. Sleep Mode Management 5.4.1. Using UART1 AT command AT+KSLEEP enables sleep mode configuration. AT+KSLEEP=0:

The module is active when DTR signal is active (low electrical level). When DTR is deactivated (high electrical level), the module enters sleep mode after a while. On DTR activation (low electrical level), the module wakes up. AT+KSLEEP=1:

The module determines when it enters sleep mode (when no more tasks are running). 0x00 character on the serial link wakes the module up. AT+KSLEEP=2:

4119272 Rev 2.0 August 16, 2016 40 Product Technical Specification The module never enters sleep mode. Design Guidelines 5.4.2. Using USB Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is in use. 5.5. Power Supply Design The AirPrime HL7688 module should not be supplied with voltage over 4.5V even temporarily or however briefly. If the systems main board power supply unit is unstable or if the systems main board is supplied with over 4.5V, even in the case of transient voltage presence on the circuit, the modules power amplifier may be severely damaged. To avoid such issues, add a voltage limiter to the modules power supply lines so that VBATT and VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as simple as a Zener diode with decoupling capacitors as shown in the diagram below. Figure 11. Voltage Limiter Example 5.6. ESD Guidelines for SIM Card Decoupling capacitors must be added according to the drawings below as close as possible to the SIM card connectors on UIM1_CLK, UIM1_RST, UIM1_VCC, UIM1_DATA and UIM1_DET signals to avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the SIM electrical interface. A typical schematic including SIM detection is provided below. 4119272 Rev 2.0 August 16, 2016 41 Product Technical Specification Design Guidelines Figure 12. EMC and ESD Components Close to the SIM 5.7. ESD Guidelines for USB When the USB interface is externally accessible, it is required to have ESD protection on the USB_VBUS, USB_D+ and USB_D- signals. Figure 13. ESD Protection for USB Note:

It is not recommended to have an ESD diode with feedback path from USB_VBUS to either USB_D+ or USB_D-. Sierra Wireless recommends using a 90 DLP0NSN900HL2L EMC filter and an RCLAMP0503N or ESD5V3U2U-03LRH ESD diode. 4119272 Rev 2.0 August 16, 2016 42 6. Reliability Specification AirPrime HL7688 modules are tested against the Sierra Wireless Industrial Reliability Specification defined below. 6.1. Reliability Compliance The AirPrime HL7688 module connected on a development kit board application is compliant with the following requirements. Table 33. Standards Conformity Abbreviation Definition IEC ISO International Electro technical Commission International Organization for Standardization 6.2. Reliability Prediction Model 6.2.1. Life Stress Test The following tests the AirPrime HL7688 modules product performance. Table 34. Life Stress Test Designation Condition Performance Test PT3T & PTRT Standard: N/A Special conditions:

Temperature:

Class A: -30C to +70C Class B: -40C to +85C Rate of temperature change: 3C/min Recovery time: 3 hours Operating conditions: Powered Duration: 14 days 4119272 Rev 2.0 August 16, 2016 43 Product Technical Specification Reliability Specification 6.2.2. Environmental Resistance Stress Tests The following tests the AirPrime HL7688 modules resistance to extreme temperature. Table 35. Environmental Resistance Stress Tests Designation Condition Cold Test Active COTA Standard: IEC 680068-2-1, Test Ad Special conditions:

Temperature: -40C Temperature variation: 1C/min Resistance to Heat Test RH Operating conditions: Powered ON with a power cycle of 1 minute ON and 2 minutes OFF Duration: 3 days Standard: IEC 680068-2-2, Test Bb Special conditions:

Temperature: +85C Temperature variation: 1C/min Operating conditions: Powered ON with a power cycle of 15 minutes ON and 15 minutes OFF Duration: 50 days 6.2.3. Corrosive Resistance Stress Tests The following tests the AirPrime HL7688 modules resistance to corrosive atmosphere. Table 36. Corrosive Resistance Stress Tests Designation Humidity Test HUT Condition Standard: IEC 60068-2-3, Test Ca Special conditions:

Temperature: +65C RH: 95%

Temperature variation: 3 +/- 0.6C/min Operating conditions: Powered on, DUT is powered up for 15 minutes and OFF for 15 minutes Duration: 10 days 4119272 Rev 2.0 August 16, 2016 44 Product Technical Specification Reliability Specification Designation Condition Component Solder Wettability CSW Standard: JESD22 B102, Method 1/Condition C, Solderability Test Method Special conditions:

Test method: Dip and Look Test with Steam preconditioning 8 h+/-15min. dip for 5 +0/-0.5 seconds Moist Heat Cyclic Test MHCT Operating conditions: Un-powered Duration: 1 day Standard: IEC 60068-2-30, Test Db Special conditions:

Upper temperature: +40 2C Lower temperature: +25 5C RH:

Upper temperature: 93%

Lower temperature: 95%

Number of cycles: 21 (1 cycle/24 hours) Temperature Variation: 3 +/- 0.6C/min Operating conditions: Powered ON for 15 minutes during each 3 hours ramp up and 3 hours ramp down (in middle) for every cycle Duration: 21 days 6.2.4. Thermal Resistance Cycle Stress Tests The following tests the AirPrime HL7688 modules resistance to extreme temperature cycling. Table 37. Thermal Resistance Cycle Stress Tests Designation Condition Thermal Shock Test TSKT Standard: IEC 60068-2-14, Test Na Special conditions:

Temperature: -30C to +80C Temperature Variation: less than 30s Number of cycles: 600 Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 9 days 4119272 Rev 2.0 August 16, 2016 45 Product Technical Specification Reliability Specification Designation Condition Temperature Change TCH Standard: IEC 60068-2-14, Test Nb Special conditions:

Temperature: -40C to +90C Temperature Variation: 3 +/- 0.6C/min Number of cycles: 400 Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 29 days 4119272 Rev 2.0 August 16, 2016 46 Product Technical Specification Reliability Specification 6.2.5. Mechanical Resistance Stress Tests The following tests the AirPrime HL7688 modules resistance to vibrations and mechanical shocks. Table 38. Mechanical Resistance Stress Tests Designation Condition Standard: IEC 60068-2-6, Test Fc Special conditions:

Frequency range: 16 Hz to 1000 Hz Displacement: 0.35mm (peak-peak) Acceleration:

5G from 16 to 62 Hz 3G from 62 to 200 Hz 1G from 200 to 1000 Hz Sweep rate: 1 octave / cycle Number of Sweep: 20 sweeps/axis Sweep direction: +/- X,+/- Y, +/- Z Operating conditions: Un-powered Duration: 2 days Standard: IEC 60068-2-64, Test Fh Special conditions:

Frequency range: 10 Hz 2000 Hz Power Spectral Density in [(m/s)/Hz]

0.1 g2/Hz at 10Hz 0.01 g2/Hz at 250Hz 0.005 g2/Hz at 1000Hz 0.005 g2/Hz at 2000Hz Peak factor: 3 Duration per Axis: 1 hr / axis Operating conditions: Un-powered Duration: 1 day Standard: IEC 60068-2-27, Test Ea Sinusoidal Vibration Test SVT Random Vibration Test RVT Mechanical Shock Test 4119272 Rev 2.0 August 16, 2016 47 Product Technical Specification Reliability Specification Designation MST Condition Special conditions:

Shock Test 1:

Wave form: Half sine Peak acceleration: 30g Duration: 11ms Number of shocks: 8 Direction: X, Y, Z Shock Test 2:

Wave form: Half sine Peak acceleration: 100g Duration: 6ms Number of shocks: 3 Direction: X, Y, Z Operating conditions: Un-powered Duration: 72 hours 6.2.6. Handling Resistance Stress Tests The following tests the AirPrime HL7688 modules resistance to handling malfunctions and damage. Table 39. Handling Resistance Stress Tests Designation Condition ESDC Test ESD Test Free Fall Test FFT 1 Standard: JESD22-A114, JESD22-A115, JESD22-C101 Special conditions:

HBM (Human Body Model): 1KV (Class 1C) MM (Machine Model): 200V CDM (Charged Device Model): 250V (Class II) Operating conditions: Powered Duration: 3 days Standard: IEC 61000-4-2 Special conditions:

Contact Voltage: 2kV, 4kV, 6kV Air Voltage: 2kV, 4kV, 8kV Operating conditions: Powered Duration: 3 days Standard : IEC 60068-2-32, Test Ed Special conditions:

Number of drops: 2 drops per unit Height: 1m 4119272 Rev 2.0 August 16, 2016 48 Product Technical Specification Reliability Specification Designation Condition Operating conditions: Un-powered Duration: 6 hours 4119272 Rev 2.0 August 16, 2016 49 7. FCC Regulations The AirPrime HL7688 module has been granted modular approval for mobile applications. Integrators may use the HL7688 module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the users body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed:

9.01 dBi in Band 2 6.00 dBi in Band 4 10.41 dBi in Band 5 9.74 dBi in Band 17 3. The HL7688 module must not transmit simultaneously with other collocated radio transmitters within a host device. 4. The RF signal must be routed on the application board using tracks with a 50 characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the figure below and that is available free of charge at http://www.agilent.com). 4119272 Rev 2.0 August 16, 2016 50 Product Technical Specification FCC Regulations If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro-

controllers, etc.) may degrade the reception performances. The antenna connector is intended to be directly connected to a 50 antenna and no matching is needed. 5. A label must be affixed to the outside of the end product into which the HL7688 module is incorporated, with a statement similar to the following:

This device contains FCC ID: N7NHL7688 6. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded HL7688 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note:

If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093. 4119272 Rev 2.0 August 16, 2016 51 8. Ordering Information Table 40. Ordering Information Model Name Description Part Number HL7688 DEV-KIT HL7688 embedded module HL Series Development Kit Contact Sierra Wireless for the latest SKU 6000620 4119272 Rev 2.0 August 16, 2016 52 9. Terms and Abbreviations Abbreviation Definition ADC AGC AT CDMA CF3 CLK CODEC CPU DAC DTR EGNOS EMC EMI EN ESD ETSI FDMA GAGAN GLONASS GND GNSS GPIO GPRS GSM Hi Z IC IMEI I/O LED LNA MAX MIN MSAS N/A PA PC PCB PCL PLL PWM QZSS Analog to Digital Converter Automatic Gain Control Attention (prefix for modem commands) Code Division Multiple Access Common Flexible Form Factor Clock Coder Decoder Central Processing Unit Digital to Analog Converter Data Terminal Ready European Geostationary Navigation Overlay Service Electromagnetic Compatibility Electromagnetic Interference Enable Electrostatic Discharges European Telecommunications Standards Institute Frequency-division multiple access GPS aided geo augmented navigation Global Navigation Satellite System Ground Global Navigation Satellite System General Purpose Input Output General Packet Radio Service Global System for Mobile communications High impedance (Z) Integrated Circuit International Mobile Equipment Identification Input / Output Light Emitting Diode Low Noise Amplifier Maximum Minimum Multi-functional Satellite Augmentation System Not Applicable Power Amplifier Personal Computer Printed Circuit Board Power Control Level Phase Lock Loop Pulse Width Modulation Quasi-Zenith Satellite System 4119272 Rev 2.0 August 16, 2016 53 Product Technical Specification Abbreviation Definition Terms and Abbreviations RF RFI RMS RST RTC RX SCL SDA SIM SMD SPI SW PSRAM TBC TBD TP TX TYP UART UICC USB UIM VBATT VSWR WAAS Radio Frequency Radio Frequency Interference Root Mean Square Reset Real Time Clock Receive Serial Clock Serial Data Subscriber Identification Module Surface Mounted Device/Design Serial Peripheral Interface Software Pseudo Static RAM To Be Confirmed To Be Defined Test Point Transmit Typical Universal Asynchronous Receiver-Transmitter Universal Integrated Circuit Card Universal Serial Bus User Identity Module Main Supply Voltage from Battery or DC adapter Voltage Standing Wave Ratio Wide Area Augmentation System 4119272 Rev 2.0 August 16, 2016 54