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WT41u DATA SHEET Friday, 03 February 2017 Version 1.0 Comment First version Table reformatting, value updates etc Replaced Bluecore4 with chipset, added ordering codes Rest of table reformatting, added antenna & connector dimension drawings Added current consumption, RF characteristics Added certification texts Added current consumption results, edit TX power variation over VDD range. Slight edits to specifications OPN descriptions updated Full production VERSION HISTORY Version 0.8 0.8.1 0.8.2 0.8.3 0.8.4 0.8.5 0.8.6 0.8.7 0.8.8 1.0 Silicon Labs 3.3.1 3.3.2 TABLE OF CONTENTS 1 Ordering Information......................................................................................................................................6 2 Pinout and Terminal Description ...................................................................................................................7 3 Electrical Characteristics ............................................................................................................................ 11 Absolute Maximum Ratings ................................................................................................................ 11 3.1 3.2 Recommended Operating Conditions ................................................................................................. 11 Input / Output Terminal Characteristics .............................................................................................. 12 3.3 Input/Output Terminal Characteristics (Digital) ............................................................................ 12 Input/Output Terminal Characteristics (USB) .............................................................................. 13 3.4 PIO Current Sink and Source Capability ............................................................................................. 13 3.5 Transmitter Performance For BDR ..................................................................................................... 14 3.6 Receiver Performance ........................................................................................................................ 15 3.7 Current Consumption .......................................................................................................................... 15 4 Physical Dimensions .................................................................................................................................. 16 5 Soldering Recommendations ..................................................................................................................... 19 6 Layout Guidelines ....................................................................................................................................... 20 7 UART Interface ........................................................................................................................................... 21 7.1 UART Bypass ...................................................................................................................................... 23 7.2 UART Configuration While Reset is Active ......................................................................................... 23 7.3 UART Bypass Mode ............................................................................................................................ 23 8 USB Interface ............................................................................................................................................. 24 8.1 USB Data Connections ....................................................................................................................... 24 8.2 USB Pull-Up resistor ........................................................................................................................... 24 8.3 USB Power Supply .............................................................................................................................. 24 8.4 Self-Powered Mode ............................................................................................................................. 24 8.5 Bus-Powered Mode ............................................................................................................................. 25 8.6 USB Suspend Current ......................................................................................................................... 26 8.7 USB Detach and Wake-Up Signaling.................................................................................................. 26 8.8 USB Driver .......................................................................................................................................... 27 8.9 USB v2.0 Compliance and Compatibility ............................................................................................ 27 9 Serial Peripheral Interface (SPI) ................................................................................................................. 28 PCM Codec Interface ............................................................................................................................. 29 10 PCM Interface Master/Slave ........................................................................................................ 29 Long Frame Sync ......................................................................................................................... 30 Short Frame Sync ........................................................................................................................ 30 Multi-slot Operation ...................................................................................................................... 31 GCI Interface ................................................................................................................................ 31 Slots and Sample Formats ........................................................................................................... 32 10.1 10.2 10.3 10.4 10.5 10.6 Silicon Labs 11 12 13 10.7 10.8 10.9 11.1 12.1 13.1 13.2 13.3 13.4 13.5 13.6 13.7 Additional Features ...................................................................................................................... 33 PCM_CLK and PCM_SYNC Generation ..................................................................................... 33 PCM Configuration ....................................................................................................................... 34 I/O Parallel Ports ..................................................................................................................................... 37 PIO Defaults ................................................................................................................................. 37 Reset ....................................................................................................................................................... 38 Pin States on Reset ..................................................................................................................... 39 Certifications ........................................................................................................................................... 40 Bluetooth ...................................................................................................................................... 40 FCC .............................................................................................................................................. 40 ISEDC .......................................................................................................................................... 41 ISEDC (Franais) ......................................................................................................................... 41 CE ................................................................................................................................................ 42 MIC Japan .................................................................................................................................... 43 Qualified Antenna Types for WT41u-E and WT41u-N ................................................................ 44 Moisture Sensitivity Level (MSL).................................................................................................. 44 13.3.1 Silicon Labs WT41u Bluetooth Module DESCRIPTION WT41u is a long range class 1, Bluetooth 2.1 +
EDR module. WT41u is a highly integrated and sophisticated Bluetooth module, containing all the necessary elements from Bluetooth radio and a fully implemented protocol stack. Therefore, WT41u provides an ideal solution for developers who want to integrate Bluetooth wireless technology into their design with limited knowledge of Bluetooth and RF technologies. WT41u is optimized for long range applications is available with an integrated chip antenna, an RF pin for a custom on-board antenna or a U.FL connector for an external 2dBi dipole antenna. By default, WT41u module is equipped with powerful and easy-to-use iWRAP firmware. iWRAP enables users to access Bluetooth functionality with simple ASCII commands delivered to the module over serial interface - it's just like a Bluetooth modem. APPLICATIONS:
Hand held terminals Industrial devices Point-of-Sale systems PCs Personal Digital Assistants (PDAs) Computer Accessories Access Points Automotive Diagnostics Units FEATURES:
Fully Qualified Bluetooth v2.1 + EDR end product CE qualified MIC Japan compatibility fully tested with ARIB Full modular certification for FCC and IC STD-T66 TX power: 17 dBm RX sensitivity: -94 dBm Integrated chip antenna, RF pin or U.FL antenna connector Class 1, range up to 650 meters with chip antenna or up to 1km with an external dipole Industrial temperature range from -40oC to
+85oC RoHS Compliant USB interface (USB 2.0 compatible) UART with bypass mode 6 x GPIO 1 x 8-bit AIO Integrated iWRAPTM Bluetooth stack or HCI firmware Silicon Labs 1 Ordering Information Firmware iWRAP 5.6 firmware iWRAP 5.5 firmware iWRAP 5.0.2 firmware U.FL Connector WT41u-E-AI56 WT41u-E-AI55 WT41u-E-AI5 HCI firmware, BT2.1 + EDR WT41u-E-HCI21 Internal chip antenna WT41u-A-AI56 WT41u-A-AI55 WT41u-A-AI5 WT41u-A-HCI21 Table 1: Ordering information Silicon Labs Page 6 of 44 2 Pinout and Terminal Description 9 5 8 5 7 5 6 5 5 5 4 5 3 5 D N G D N G D N G D N G D N G D N G D N G 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 GND GND GND GND GND GND GND GND GND VDD_PA PIO2 PIO3 UART_RTS UART_RX GND USB+
USB-
UART_CTS PCM_IN PCM_CLK PCM_SYNC GND Pins 1 and 52 (GND) are not connected and have been removed 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 RF RFGND GND GND GND GND GND GND AIO UART_TX PIO5 SPI_MOSI SPI_MISO SPI_CLK SPI_CSB GND PIO7 PIO6 RESET VDD GND T U O _ M C P D N G D N G D N G D N G 4 O P I D N G 4 2 5 2 6 2 7 2 8 2 9 2 0 3 Figure 1: WT41u pin out Silicon Labs Page 7 of 44 Pad name NC RESET GND RF RFGND VDD_PA VDD Pad number 1, 52 33 2-10, 16, 23, 24, 26-28, 30, 31, 36, 44-49, 53-
59 51 50 11 32 Pad type Description Not connected Pins 1 and 52 are not present on the footprint Digital input Ground Active low reset with weak internal pull-up. Keep low for >5ms to reset module Ground pads should all be connected to a ground plane with minimum trace length, especially on the antenna end of the module Not connected No internal connection Ground Connect to ground plane Supply voltage Supply voltage for the RF power amplifier and low noise amplifier Supply voltage Supply voltage for the Bluetooth chipset Table 2: Supply and RF Terminal Descriptions PIO signal Pad number Description PIO[2]
PIO[3]
PIO[4]
PIO[5]
PIO[6]
PIO[7]
AIO[1]
12 13 29 41 34 35 43 Bi-directional digital in/out with programmable strength and pull-up/pull-
down Bi-directional digital in/out with programmable strength and pull-up/pull-
down Bi-directional digital in/out with programmable strength and pull-up/pull-
down Bi-directional digital in/out with programmable strength and pull-up/pull-
down Bi-directional digital in/out with programmable strength and pull-up/pull-
down Bi-directional digital in/out with programmable strength and pull-up/pull-
down Bi-directional analog in/out Table 3: GPIO Terminal Descriptions Silicon Labs Page 8 of 44 PCM signal Pad number Pad type Description PCM_OUT PCM_IN PCM_SYNC PCM_CLK 25 20 22 21 Output, weak internal pull-down Synchronous data output Input, weak internal pull-down Synchronous data input Bi-directional, weak internal pull-down Synchronous data sync Bi-directional, weak internal pull-down Synchronous data clock Table 4: PCM Terminal Descriptions UART signal Pad number Pad type Description UART_TX UART_RTS#
UART_RX UART_CTS#
42 14 15 19 Output, weak pull-up internal UART data output, active high Output, weak pull-up internal UART request to send, active low Input, weak internal pull-
down UART data input, active high Input, weak internal pull-
down UART clear active low to send, Table 5: UART Terminal Descriptions USB signal Pad number Pad type Description USB+
USB-
17 18 Bidirectional USB data line with internal 1.5kohm pull-up Bidirectional USB data line Table 6: USB Terminal Descriptions Silicon Labs Page 9 of 44 SPI signal SPI_MOSI SPI_CS#
SPI_CLK SPI_MISO Pad number 40 37 38 39 Pad type Description Input, weak internal pull-down SPI data input Input, weak internal pull-up Chip select, active low Input, weak internal pull-down SPI clock Output, weak internal pull-down SPI data output Table 7: Terminal Descriptions Silicon Labs Page 10 of 44 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Specification Storage temperature VDD_PA, VDD Other terminal voltages 3.2 Recommended Operating Conditions Table 8: Absolute Maximum Ratings Specification Operating temperature VDD_PA, VDD Min
-40
-0.4 Max 85 3.7 VSS-0.4 VDD+0.4 Min
-40 3.0 Max 85 3.6 Unit C V V Unit C V Table 9: Recommended Operating Conditions Silicon Labs Page 11 of 44 3.3 Input / Output Terminal Characteristics 3.3.1 Input/Output Terminal Characteristics (Digital) Digital Terminals Input Voltage Levels VIL input logic level low 2.7 V VDD 3.0 V 1.7 V VDD 1.9 V VIH input logic level high Output Voltage Levels VOL output logic level low
(IO = 4.0 mA) 2.7V VDD 3.0 V VOL output logic level low
(IO = 4.0 mA) 1.7V VDD 1.9 VOL output logic level high
(IO = 4.0 mA) 2.7V VDD 3.0 VOL output logic level high
(IO = 4.0 mA) 1.7V VDD 1.9 Input and Tristate Current with Strong pull-up Strong pull-down Weak pull-up Weak pull-down I/O pad leakage current CI input capacitance Min
-0.4
-0.4 0.7 VDD
-
-
VDD - 0.2 VDD - 0.4
-100 10
-5.0 0.2
-1 1.0 Typ Max Unit
-
-
-
-
-
-
-
-40 40
-1.0 1.0 0
-
0.8 0.4 VDD + 0.4 0.2 0.4
-10 100
-0.2 5.0 1 5.0 V V V V V V V A A A A A pF Silicon Labs Page 12 of 44 3.3.2 Input/Output Terminal Characteristics (USB) USB Terminals VDD_USB for correct USB operation Input Threshold VIL input logic level log VIH input logic level high Min 3.1
-
0.7VDD_USB Typ
-
-
Max 3.6 0.3VDD_USB
-
Unit V V V 3.4 PIO Current Sink and Source Capability Figure 2: WT41u PIO Current Drive Capability Silicon Labs Page 13 of 44 3.5 Transmitter Performance For BDR RF characteristic Max transmit power Transmit power variation over temperature range Transmit power variation over supply voltage range Transmit power variation over frequency range Transmit power control range 20dB bandwidth for modulated carrier Avg drift F1avg Min Typ Max Bluetooth specification Unit 16
-2
-0.5
-0.5
-13
-11 17 998 165 18 2 0.5 0.5 17 6
<20 dBm
<1000 40 140 to 175 dB dB dB dBm kHz kHz kHz Silicon Labs Page 14 of 44 3.6 Receiver Performance Antenna gain not taken into account Characteristic, VDD=3.3V, room temperature Packet type Typ Bluetooth specification Sensitivity for 0.1% BER Sensitivity variation over temperature range DH1 DH5 2-DH1 2-DH5 3-DH1 3-DH5
-94.1
-90.5
-96.5
-94.5
-89.5
-86
+/-2
-70 3.7 Current Consumption Table 10: Receiver sensitivity Unit dBm dBm dBm dBm dBm dBm dB Operating mode Stand-by, page mode 0 2000 1 TX 3-DH5 TX 2-DH5 TX DH5 RX Deep sleep, page mode 0 2000 1 Inquiry Peak Average Unit 108 108 184 50 113 2 85 85 136 44 0.36 58 mA mA mA mA mA mA mA Table 11: Current consumption Silicon Labs Page 15 of 44 4 Physical Dimensions Figure 3: Physical dimensions (top view) Figure 4: Dimensions for the RF pin used as antenna connection on WT41u-N (top view) Silicon Labs Page 16 of 44 Figure 5: Dimensions of WT41u-E Figure 6: Dimensions of WT41u-A Silicon Labs Page 17 of 44 Figure 7: Recommended land pattern Silicon Labs Page 18 of 44 5 Soldering Recommendations This section describes the soldering recommendations regarding WT41u Module. WT41u is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used. Refer to technical documentations of particular solder paste for profile configurations. Avoid using more than two reflow cycles. Aperture size of the stencil should be 1:1 with the pad size. A no-clean, type-3 solder paste is recommended. For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines. Silicon Labs Page 19 of 44 6 Layout Guidelines Use good layout practices to avoid excessive noise coupling to supply voltage traces or sensitive analog signal traces, such as analog audio signals. If using overlapping ground planes use stitching vias separated by max 3 mm to avoid emission from the edges of the PCB. Connect all the GND pins directly to a solid GND plane and make sure that there is a low impedance path for the return current following the signal and supply traces all the way from start to the end. A good practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This arrangement will make sure that any return current follows the forward current as close as possible and any loops are minimized. Figure 8: Typical 4-layer PCB construction Signals GND Power Signals Overlapping GND layers without GND stitching vias Overlapping GND layers with GND stitching vias shielding the RF energy Figure 9: Use of stitching vias to avoid emissions from the edges of the PCB Silicon Labs Page 20 of 44 7 UART Interface This is a standard UART interface for communicating with other serial devices.WT41u UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. Four signals are used to implement the UART function. When WT41u is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. All UART connections are implemented using CMOS technology and have signalling levels of 0V and VDD. UART configuration parameters, such as data rate and packet format, are set using WT41u software. Note:
In order to communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port adapter card is required for the PC. Parameter Data rate Flow control Parity Number of stop bits Bits per channel Possible values Minimum Maximum RTS/CTS or None None, Odd or Even 1 or 2 8 1200bps (2% error) 9600bps (1% error) 3Mbps (1% error) Table 12: Possible UART Settings The UART interface is capable of resetting WT41u upon reception of a break signal. A break is identified by a continuous logic low (0V) on the UART_RX terminal, as shown in Figure 10. If tBRK is longer than the value, defined by PSKEY_HOST_IO_UART_RESET_TIMEOUT, (0x1a4), a reset will occur. This feature allows a host to initialise the system to a known state. Also, WT41u can emit a break character that may be used to wake the host. Figure 10: Break Signal Table 17 shows a for PSKEY_UART_BAUD_RATE (0x204). There is no requirement to use these standard values. Any data rate within the supported range can be set in the PS Key according to the formula in Equation 1. list of commonly used data their associated values rates and Silicon Labs Page 21 of 44 Equation 1: Data Rate Data rate [bits/s]
Persistent store value
(Hex) 1200 2400 4800 9600 19200 38400 57600 76800 115200 230400 460800 921600 1382400 1843200 2764800 0x0005 0x000A 0x0014 0x0027 0x004F 0x009D 0x00EC 0x013B 0x01D8 0x03B0 0x075F 0x0EBF 0x161E 0x1D7E 0x2C3D Error [bits/s]
Error [%]
5 10 20 39 79 157 236 315 472 944 1887 3775 5662 7550 11325 1.73 1.73 1.73
-0.82 0.45
-0.18 0.03 0.14 0.03 0.03
-0.02 0
-0.01 0 0 Table 13: Standard Data Rates Silicon Labs Page 22 of 44 7.1 UART Bypass Figure 11: UART Bypass Architecture 7.2 UART Configuration While Reset is Active The UART interface for WT41u while the chip is being held in reset is tristate. This will allow the user to daisy chain devices onto the physical UART bus. The constraint on this method is that any devices connected to this bus must tristate when WT41u reset is de-asserted and the firmware begins to run. 7.3 UART Bypass Mode Alternatively, for devices that do not tristate the UART bus, the UART bypass mode on the chipset can be used. The default state of the chipset after reset is de-asserted; this is for the host UART bus to be connected to the chipset UART, thereby allowing communication to the chipset via the UART. All UART bypass mode connections are implemented using CMOS technology and have signalling levels of 0V and VDD. In order to apply the UART bypass mode, a BCCMD command will be issued to the chipset. Upon this issue, it will switch the bypass to PIO[7:4] as Figure 11 indicates. Once the bypass mode has been invoked, WT41u will enter the Deep Sleep state indefinitely. In order to re-establish communication with WT41u, the chip must be reset so that the default configuration takes effect. It is important for the host to ensure a clean Bluetooth disconnection of any active links before the bypass mode is invoked. Therefore, it is not possible to have active Bluetooth links while operating the bypass mode. The current consumption for a device in UART bypass mode is equal to the values quoted for a device in standby mode. Silicon Labs Page 23 of 44 8 USB Interface This is a full speed (12Mbits/s) USB interface for communicating with other compatible digital devices. WT41u acts as a USB peripheral, responding to requests from a master host controller such as a PC. The USB interface is capable of driving a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented can behave as specified in the USB section of the Bluetooth v2.1 + EDR specification or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. As USB is a master/slave oriented system (in common with other USB peripherals), WT41u only supports USB Slave operation. 8.1 USB Data Connections The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to the internal USB I/O buffers of the the chipset, therefore, have a low output impedance. To match the connection to the characteristic impedance of the USB cable, resistors must be placed in series with USB_DP/USB_DN and the cable. 8.2 USB Pull-Up resistor WT41u features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when WT41u is ready to enumerate. It signals to the PC that it is a full speed (12Mbits/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with section 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15k 5% pull-
down resistor (in the hub/host) when VDD_PADS = 3.1V. This presents a Thevenin resistance to the host of at least 900. Alternatively, an external 1.5k pull-up resistor can be placed between a PIO line and D+ on the USB cable. The firmware must be alerted to which mode is used by setting PSKEY_USB_PIO_PULLUP appropriately. The default setting uses the internal pull-up resistor. 8.3 USB Power Supply The USB specification dictates that the minimum output high voltage for USB data lines is 2.8V. To safely meet the USB specification, the voltage on the VDD supply terminal must be an absolute minimum of 3.1V. Silicon Labs recommends 3.3V for optimal USB signal quality. 8.4 Self-Powered Mode In self-powered mode, the circuit is powered from its own power supply and not from the VBUS (5V) line of the USB cable. It draws only a small leakage current (below 0.5mA) from VBUS on the USB cable. This is the easier mode for which to design, as the design is not limited by the power that can be drawn from the USB hub or root port. However, it requires that VBUS be connected to WT41u via a resistor network (Rvb1 and Rvb2), so WT41u can detect when VBUS is powered up. The chipset will not pull USB_DP high when VBUS is off. Self-powered USB designs (powered from a battery or PSU) must ensure that a PIO line is allocated for USB pullup purposes. A 1.5k 5% pull-up resistor between USB_DP and the selected PIO line should be fitted to the design. Failure to fit this resistor may result in the design failing to be USB compliant in self-powered mode. The internal pull-up in the chipset is only suitable for bus-powered USB devices, e.g., dongles. Silicon Labs Page 24 of 44 Figure 12: USB Connections for Self-Powered Mode The terminal marked USB_ON can be any free PIO pin. The PIO pin selected must be registered by setting PSKEY_USB_PIO_VBUS to the corresponding pin number. Identifier Rs Rvb1 Rvb2 Value Function 27 nominal Impedance matching to USB cable 22k 5%
47k 5%
VBUS ON sense divider VBUS ON sense divider Figure 13: USB Interface Component Values 8.5 Bus-Powered Mode In bus-powered mode, the application circuit draws its current from the 5V VBUS supply on the USB cable. WT41u negotiates with the PC during the USB enumeration stage about how much current it is allowed to consume. On power-up the device must not draw more than 100 mA but after being configured it can draw up to 500 mA. For WT41u, the USB power descriptor should be altered to reflect the amount of power required. This is accomplished by setting PSKEY_USB_MAX_POWER (0x2c6). This is higher than for a Class 2 application due to the extra current drawn by the Transmit RF PA. By default for WT41u the setting is 300 mA. When selecting a regulator, be aware that VBUS may go as low as 4.4V. The inrush current (when charging reservoir and supply decoupling capacitors) is limited by the USB specification. See the USB Specification. Some applications may require soft start circuitry to limit inrush current if more than 10uF is present between VBUS and GND. The 5V VBUS line emerging from a PC is often electrically noisy. As well as regulation down to 3.3V and 1.8V, applications should include careful filtering of the 5V line to attenuate noise that is above the voltage regulator bandwidth. Excessive noise on WT41u supply pins will result in reduced receiver sensitivity and a distorted RF transmit signal. Silicon Labs Page 25 of 44 Figure 14: USB Connections for Bus-Powered Mode 8.6 USB Suspend Current All USB devices must permit the USB controller to place them in a USB suspend mode. While in USB Suspend, bus-powered devices must not draw more than 2.5mA from USB VBUS (self-powered devices may draw more than 2.5mA from their own supply). This current draw requirement prevents operation of the radio by bus-powered devices during USB Suspend. When computing suspend current, the current from VBUS through the bus pull-up and pull-down resistors must be included. The pull-up resistor at the device is 1.5 k. (nominal). The pull-down resistor at the hub is 14.25k. to 24.80k. The pull-up voltage is nominally 3.3V, which means that holding one of the signal lines high takes approximately 200uA, leaving only 2.3mA available from a 2.5mA budget. Ensure that external LEDs and/or amplifiers can be turned off by the chipset. The entire circuit must be able to enter the suspend mode. 8.7 USB Detach and Wake-Up Signaling lines are shared with PIO pins and can be assigned WT41u can provide out-of-band signaling to a host controller by using the control lines called USB_DETACH and USB_WAKE_UP. These are outside the USB specification (no wires exist for them inside the USB cable), but can be useful when embedding WT41u into a circuit where no external USB is visible to the user. Both control to any PIO pin by setting PSKEY_USB_PIO_DETACH and PSKEY_USB_PIO_WAKEUP to the selected PIO number. USB_DETACH is an input which, when asserted high, causes WT41u to put USB_DN and USB_DP in high impedance state and turns off the pull-up resistor on DP. This detaches the device from the bus and is logically equivalent to unplugging the device. When USB_DETACH is taken low, WT41u will connect back to USB and await enumeration by the USB host. USB_WAKE_UP is an active high output (used only when USB_DETACH is active) to wake up the host and allow USB communication to recommence. It replaces the function of the software USB WAKE_UP message
(which runs over the USB cable) and cannot be sent while the chipset is effectively disconnected from the bus. Silicon Labs Page 26 of 44 Figure 15: USB_Detach and USB_Wake_Up Signals 8.8 USB Driver A USB Bluetooth device driver is required to provide a software interface between the chipset and Bluetooth software running on the host computer. Please, contact Silicon Labs support at http://www.silabs.com for suitable drivers. 8.9 USB v2.0 Compliance and Compatibility Although WT41u meets the USB specification, Silicon Labs cannot guarantee that an application circuit designed around the module is USB compliant. The choice of application circuit, component choice and PCB layout all affect USB signal quality and electrical characteristics. The information in this document is intended as a guide and should be read in association with the USB specification, with particular attention being given to Chapter 7. Independent USB qualification must be sought before an application is deemed USB compliant and can bear the USB logo. Such qualification can be obtained from a USB plugfest or from an independent USB test house. Terminals USB_DP and USB_DN adhere to the USB Specification v2.0 (Chapter 7) electrical requirements. The chipset is compatible with USB v2.0 host controllers; under these circumstances the two ends agree the mutually acceptable rate of 12Mbits/s according to the USB v2.0 specification. Silicon Labs Page 27 of 44 9 Serial Peripheral Interface (SPI) The SPI port can be used for system debugging. It can also be used for programming the Flash memory and setting the PSKEY configurations. WT41u uses 16-bit data and 16-bit address serial peripheral interface, where transactions may occur when the internal processor is running or is stopped. SPI interface is connected using the MOSI, MISO, CSB and CLK pins. Please, contact the Silicon Labs support at http://www.silabs.com for detailed information about the instruction cycle. Silicon Labs Page 28 of 44 10 PCM Codec Interface PCM is a standard method used to digitize audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, WT41u has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. WT41u offers a bidirectional digital audio interface that routes directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on WT41u allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any one time. WT41u can operate as the PCM interface master generating an output clock of 128, 256 or 512kHz. When configured as PCM interface slave, it can operate with an input clock up to 2048kHz. WT41u is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. It supports 13-bit or 16-bit linear, 8-bit -law or A-law companded sample formats at 8ksamples/s and can receive and transmit on any selection of three of the first four slots following PCM_SYNC. The PCM configuration options are enabled by setting PSKEY_PCM_CONFIG32. WT41u interfaces directly to PCM audio devices. NOTE: Analog audio lines are very sensitive to RF disturbance. Use good layout practices to ensure noise less audio. Make sure that the return path for the audio signals follows the forward current all the way as close as possible and use fully differential signals when possible. Do not compromise audio routing. 10.1 PCM Interface Master/Slave When configured as the master of the PCM interface, WT41u generates PCM_CLK and PCM_SYNC. When configured as the Slave of the PCM interface, WT41u accepts PCM_CLK rates up to 2048kHz. Figure 16: PCM Interface Master Silicon Labs Page 29 of 44 Figure 17: PCM Interface Slave 10.2 Long Frame Sync Long Frame Sync is the name given to a clocking format that controls the transfer of PCM data words or samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When WT41u is configured as PCM master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is 8-bits long. When WT41u is configured as PCM Slave, PCM_SYNC may be from two consecutive falling edges of PCM_CLK to half the PCM_SYNC rate, i.e., 62.5s long. Figure 18: Long Frame Sync (Shown with 8-bit Companded Sample) WT41u samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge. 10.3 Short Frame Sync In Short Frame Sync, the falling edge of PCM_SYNC indicates the start of the PCM word. PCM_SYNC is always one clock cycle long. Silicon Labs Page 30 of 44 Figure 19: Short Frame Sync (Shown with 16-bit Sample) As with Long Frame Sync, WT41u samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge. 10.4 Multi-slot Operation More than one SCO connection over the PCM interface is supported using multiple slots. Up to three SCO connections can be carried over any of the first four slots. Figure 20: Multi-slot Operation with Two Slots and 8-bit Companded Samples 10.5 GCI Interface WT41u is compatible with the GCI, a standard synchronous 2B+D ISDN timing interface. The two 64kbits/s B channels can be accessed when this mode is configured. Silicon Labs Page 31 of 44 Figure 21: GCI Interface The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8kHz. With WT41u in Slave mode, the frequency of PCM_CLK can be up to 4.096MHz. 10.6 Slots and Sample Formats WT41u can receive and transmit on any selection of the first four slots following each sync pulse. Slot durations can be either 8 or 16 clock cycles. Durations of 8 clock cycles may only be used with 8-bit sample formats. Durations of 16 clocks may be used with 8-bit, 13-bit or 16-bit sample formats. WT41u supports 13-bit linear, 16-bit linear and 8-bit -law or A-law sample formats. The sample rate is 8ksamples/s. The bit order may be little or big endian. When 16-bit slots are used, the 3 or 8 unused bits in each slot may be filled with sign extension, padded with zeros or a programmable 3-bit audio attenuation compatible with some Motorola codecs. Silicon Labs Page 32 of 44 Figure 22: 16-bit Slot Length and Sample Formats 10.7 Additional Features WT41u has a mute facility that forces PCM_OUT to be 0. In master mode, PCM_SYNC may also be forced to 0 while keeping PCM_CLK running which some codecs use to control power down. 10.8 PCM_CLK and PCM_SYNC Generation WT41u has two methods of generating PCM_CLK and PCM_SYNC in master mode. The first is generating these signals by DDS from the chipset internal 4MHz clock. Using this mode limits PCM_CLK to 128, 256 or 512kHz and PCM_SYNC to 8kHz. The second is generating PCM_CLK and PCM_SYNC by DDS from an internal 48MHz clock (which allows a greater range of frequencies to be generated with low jitter but consumes more power). This second method is selected by setting bit 48M_PCM_CLK_GEN_EN in PSKEY_PCM_CONFIG32. When in this mode and with long frame sync, the length of PCM_SYNC can be either 8 or 16 cycles of PCM_CLK, determined by LONG_LENGTH_SYNC_EN in PSKEY_PCM_CONFIG32. The Equation 2 describes PCM_CLK frequency when being generated using the internal 48MHz clock:
Silicon Labs Page 33 of 44 Equation 2: PCM_CLK Frequency When Being Generated Using the Internal 48MHz Clock The frequency of PCM_SYNC relative to PCM_CLK can be set using Equation 3:
Equation 3: PCM_SYNC Frequency Relative to PCM_CLK CNT_RATE, CNT_LIMIT and SYNC_LIMIT are set using PSKEY_PCM_LOW_JITTER_CONFIG. As an example, set PSKEY_PCM_LOW_JITTER_CONFIG to 0x08080177. PCM_SYNC PCM_CLK generate 512kHz 8kHz, with at to at 10.9 PCM Configuration The PCM configuration is set using two PS Keys, PSKEY_PCM_CONFIG32 detailed in Table 18 and PSKEY_PCM_LOW_JITTER_CONFIG in Table 19. The default for PSKEY_PCM_CONFIG32 is 0x00800000, i.e., first slot following sync is active, 13-bit linear voice format, long frame sync and interface master generating 256kHz PCM_CLK from 4MHz internal clock with no tri-state of PCM_OUT. Silicon Labs Page 34 of 44 Description Set to 0 0 selects Master mode with internal generation of PCM_CLK and PCM_SYNC. 1 selects Slave mode requiring externally generated PCM_CLK and PCM_SYNC. This should be set to 1 if 48M_PCM_CLK_GEN_EN (bit 11) is set. 0 selects long frame sync (rising edge indicates start of frame), Set to 0 0 selects long frame sync (rising edge indicates start of frame), 1 selects short frame sync (falling edge indicates start of frame). 0 transmits and receives voice samples MSB first, 1 uses LSB 0 transmits and receives voice samples MSB first, 1 uses LSB 0 tristates PCM_OUT immediately after the falling edge of PCM_CLK in the last bit of an active slot, assuming the next slot is also not active. 1 tristates PCM_OUT after the rising edge of PCM_CLK. 0 enables PCM_SYNC output when master, 1 suppresses PCM_SYNC whilst keeping PCM_CLK running. Some CODECS utilize this to enter a low power state 1 enables GCI mode. 1 forces PCM_OUT to 0. 0 sets PCM_CLK and PCM_SYNC generation via DDS from internal 4 MHz clock. 1 sets PCM_CLK and PCM_SYNC generation via DDS from internal 48 MHz clock. 0 sets PCM_SYNC length to 8 PCM_CLK cycles and 1 sets length to 16 PCM_CLK cycles. Only applies for long frame sync and with 48M_PCM_CLK_GEN_EN set to 1. Name
-
SLAVE MODE EN SHORT SYNC EN
-
SIGN EXTENDED EN LSB FIRST EN TX TRISTATE EN TX TRISTATE RISING EDGE EN SYNC SUPPRESS EN GCI MODE EN MUTE EN 48M PCM CLK GEN EN LONG LENGTH SYNC EN Bit position 0 1 2 3 4 5 6 7 8 9 10 11 12
-
[20:16]
Set to 0b00000. MASTER CLK RATE
[22:21]
Selects 128 (0b01), 256 (0b00), 512 (0b10) kHz PCM_CLK frequency when master and 48M_PCM_CLK_GEN_EN (bit 11) is low. ACTIVE SLOT
[26:23]
Default is 0001. Ignored by firmaware SAMPLE FORMAT
[28:27]
Selects between 13 (0b00), 16 (0b01), 8 (0b10) bit sample with 16 cycle slot duration 8 (0b11) bit sample 8 cycle slot duration. Table 14: PSKEY_PCM_CONFIG32 description Silicon Labs Page 35 of 44 Description Sets PCM_CLK counter limit Sets PCM_CLK count rate Sets PCM_SYNC division relative to PCM_CLK Name CNT LIMIT CNT RATE SYNC LIMIT Bit position
[12:0]
[23:16]
[31:24]
Table 15: PSKEY_PCM_LOW_JITTER_CONFIG Description Silicon Labs Page 36 of 44 11 I/O Parallel Ports Six lines of programmable bidirectional input/outputs (I/O) are provided. All the PIO lines are power from VDD. PIO lines can be configured through software to have either weak or strong pull-ups or pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. WT41u has a general purpose analogue interface pin AIO[1]. This is used to access internal circuitry and control signals. It may be configured to provide additional functionality. Auxiliary functions available via AIO[1] include an 8-bit ADC and an 8-bit DAC. Typically the ADC is used for battery voltage measurement. Signals selectable at this pin include the band gap reference voltage and a variety of clock signals: 48, 24, 16, 8MHz and the XTAL clock frequency. When used with analogue signals, the voltage range is constrained by the analogue supply voltage internally to the module (1.8V). When configured to drive out digital level signals (e.g., clocks), the output voltage level is determined by VDD. 11.1 PIO Defaults Silicon Labs cannot guarantee that these terminal functions remain the same. Refer to the software release note for the implementation of these PIO lines, as they are firmware build-specific. Silicon Labs Page 37 of 44 12 Reset WT41u may be reset from several sources: RESET pin, power on reset, a UART break character or via software configured watchdog timer. The RESET pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESET be applied for a period greater than 5ms. The power on reset occurs when the VDD_CORE supply internally to the module falls below typically 1.5V and is released when VDD_CORE rises above typically 1.6V. At reset the digital I/O pins are set to inputs for bidirectional pins and outputs are tri-state. The reset should be held active at power up until all the supply voltages have stabilized to ensure correct operation of the internal flash memory. Following figure shows an example of a simple power up reset circuit. Time constant of the RC circuitry is set so that the supply voltage is safely stabilized before the reset deactivates. Figure 23: Example of a simple power on reset circuit. Silicon Labs Page 38 of 44 12.1 Pin States on Reset Pad name PIO[7:2]
PCM_OUT PCM_IN PCM_SYNC PCM_CLK UART_TX UART_RX UART_RTS UART_CTS USB+
USB-
SPI_CSB SPI_CLK SPI_MOSI SPI_MISO AIO[1]
State Input, weak pull-down 3-state, weak pull-down Input, weak pull-down Input, weak pull-down Input, weak pull-down 3-state, weak pull-up Input, weak pull-down 3-state, weak pull-up Input, weak pull-down Input, weak pull-down Input, weak pull-down Input, weak pull-down Input, weak pull-down Input, weak pull-down 3-state, weak pull-down Output, driving low Table 16: Pin States on Reset Silicon Labs Page 39 of 44 13 Certifications 13.1 Bluetooth The WT41u is Bluetooth qualified and the declaration ID is B015141 (QDID 22298) 13.2 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the users authority to operate the equipment. FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). OEM Responsibilities to comply with FCC Regulations The WT41u Module has been certified for integration into products only by OEM integrators under the following condition:
The antenna(s) must be installed such that a minimum separation distance of 42 mm is maintained between the radiator (antenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note: In the event that this condition cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The WT41u Module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module FCC ID: QOQWT41u"
or
"Contains FCC ID: QOQWT41u"
Silicon Labs Page 40 of 44 The OEM integrator must not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 13.3 ISEDC This radio transmitter (IC: 5123A-WT41U) has been approved by Industry Canada to operate with the embedded chip antenna. Other antenna types are strictly prohibited for use with this device. This device complies with Industry Canadas license-exempt RSS standards. Operation is subject to the following two conditions:
1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. WT41u meets the given requirements when the minimum separation distance to human body 40 mm. RF exposure or SAR evaluation is not required when the separation distance is 40 mm or more. If the separation distance is less than 40 mm the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The WT41u Module has been certified for integration into products only by OEM integrators under the following conditions:
The antenna(s) must be installed such that a minimum separation distance of 40 mm is maintained between the radiator (antenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate IC authorization. End Product Labeling The WT41u module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module IC: 5123A-WT41u"
or
"Contains IC: 5123A-WT41u"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 13.3.1 ISEDC (Franais) Cet metteur radio (IC : 5123A-WT41u) a reu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorpore. Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil. Silicon Labs Page 41 of 44 Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes:
1. Lappareil ne doit pas produire de brouillage; et 2. Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible de provoquer un fonctionnement non dsir de lappareil. Dclaration relative l'exposition aux radiofrquences (RF) Les limites applicables lexemption de lvaluation courante du DAS sont nonces dans le CNR 102, 5e dition. Le module Bluetooth WT41u rpond aux exigences donnes quand la distance de sparation minimum par rapport au corps humain est de 40 mm. L'valuation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de sparation est de 40 mm ou plus. Si la distance de sparation est infrieure 40 mm, il incombe l'intgrateur FEO d'valuer le DAS. Responsabilits du FEO ayant trait la conformit avec les rglements IC Le Module Bluetooth WT41u a t certifi pour une intgration dans des produits uniquement par les intgrateurs FEO dans les conditions suivantes:
La ou les antennes doivent tre installes de telle faon qu'une distance de sparation minimum de 40 mm soit maintenue entre le radiateur (antenne) et toute personne tout moment. Le module metteur ne doit pas tre install au mme endroit ou fonctionner conjointement avec toute autre antenne ou metteur. Ds lors que les deux conditions ci-dessus sont respectes, aucun test supplmentaire de lmetteur nest obligatoire. Cependant, il incombe toujours l'intgrateur FEO de tester la conformit de son produit final vis-
-vis de toute exigence supplmentaire requise avec ce module install (par exemple, missions de dispositifs numriques, exigences relatives aux matriels priphriques PC, etc). Note: S'il s'avre que ces conditions ne peuvent tre respectes (pour certaines configurations ou la colocation avec un autre metteur), alors l'autorisation IC n'est plus considre comme valide et l'identifiant IC ne peut plus tre employ sur le produit final. Dans ces circonstances, l'intgrateur FEO aura la responsabilit de rvaluer le produit final (y compris l'metteur) et d'obtenir une autorisation IC distincte. tiquetage du produit final L'tiquette du Module WT41u porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est install l'intrieur d'un autre appareil, alors l'extrieur de l'appareil dans lequel le module est install doit aussi porter une tiquette faisant rfrence au module qu'il contient. Dans ce cas, une tiquette comportant les informations suivantes doit tre appose sur une partie visible du produit final.
"Contient le module metteur IC: 5123A-WT41U"
ou
"Contient IC : 5123A-WT41U"
L'intgrateur FEO doit tre conscient de ne pas fournir d'informations l'utilisateur final permettant d'installer ou de retirer ce module RF ou de changer les paramtres lis aux RF dans le mode d'emploi du produit final. 13.4 CE The Declaration of Compliance and the test documentation can be consulted in www.silabs.com. Please note that every application using the WT41-A or WT41-N will need to perform the radio EMC tests on the end product according to EN 301 489-17. RF exposure requirements must be verified in an end product assembly. Test documentation and software for the EN 300 328 radiated spurious emissions testing can be requested from the Silicon Labs support. Silicon Labs Page 42 of 44 13.5 MIC Japan The WT41u module in certified for Japan. Certification number: 209-J00231 Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Translation: This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law. Silicon Labs Page 43 of 44 13.6 Qualified Antenna Types for WT41u-E and WT41u-N This device has been designed to operate with a standard 2.14 dBi dipole antenna. Any antenna of a different type or with a gain higher than 2.14 dBi is strictly prohibited for use with this device. Using an antenna of a different type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. The required antenna impedance is 50 . Antenna type Dipole Maximum gain 2.14 dBi Table 17: Qualified Antenna Types for WT41u-E/N To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (EIRP) is not more than that permitted for successful communication. Any standard 2.14 dBi dipole antenna can be used without an additional application to FCC. 13.7 Moisture Sensitivity Level (MSL) Moisture sensitivity level (MSL) of this product is 3. For the handling instructions please refer to JEDEC J-
STD-020 and JEDEC J-STD-033. If baking is required, devices may be baked for 12 hours at 125C +/-5C for high temperature device containers. Silicon Labs Page 44 of 44 Simplicity Studio One-click access to MCU and wireless tools, documentation, software, source code libraries &
more. Available for Windows, Mac and Linux!
IoT Portfolio www.silabs.com/IoT SW/HW www.silabs.com/simplicity Quality www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Trademark Information Silicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, Clockbuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA http://www.silabs.com
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