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User manual | Users Manual | 2.82 MiB | July 12 2023 | |||
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Internal Photos | Internal Photos | 1.25 MiB | July 07 2023 | |||
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External Photos | External Photos | 718.43 KiB | July 12 2023 | |||
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ID Label and Location | ID Label/Location Info | 53.63 KiB | July 12 2023 | |||
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Label and Location | ID Label/Location Info | 31.43 KiB | July 07 2023 | |||
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Attestation Statement | Attestation Statements | 294.33 KiB | July 12 2023 | |||
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Cover Letter | Cover Letter(s) | 104.56 KiB | July 12 2023 | |||
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FCC Request for Confidentiality | Cover Letter(s) | 203.75 KiB | July 12 2023 | |||
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Module Declaration | Cover Letter(s) | 113.39 KiB | July 12 2023 | |||
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Operational Description | Operational Description | 2.62 MiB | November 29 2022 / November 30 2022 | |||
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RF Exposure Report | RF Exposure Info | 303.70 KiB | July 12 2023 | |||
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Test Report | Test Report | 502.38 KiB | July 12 2023 | |||
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Test Set Up Photos | Test Setup Photos | 1.27 MiB | July 12 2023 | |||
1 2 3 4 5 | Frequency Block Diagram | Block Diagram | July 07 2023 | confidential | ||||
1 2 3 4 5 | Schematics | Schematics | July 07 2023 | confidential | ||||
1 2 3 4 5 | Tune Up Procedure | Parts List/Tune Up Info | July 07 2023 | confidential | ||||
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FCC Modular Approval Letter | Cover Letter(s) | 70.55 KiB | November 29 2022 / November 30 2022 | |||
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ANT Interface Statement | Cover Letter(s) | 109.99 KiB | August 10 2022 | |||
1 2 3 4 5 | BOM | Parts List/Tune Up Info | August 10 2022 | confidential | ||||
1 2 3 4 5 | Block Diagram | Block Diagram | August 10 2022 | confidential | ||||
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FCC Agent Authorization | Cover Letter(s) | 83.75 KiB | August 10 2022 | |||
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FCC Long Term Confidentiality Letter | Cover Letter(s) | 94.02 KiB | August 10 2022 | |||
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MPE Report | RF Exposure Info | 390.15 KiB | August 10 2022 | |||
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Modular Approval Letter | Cover Letter(s) | 188.69 KiB | August 10 2022 | |||
1 2 3 4 5 | PCB 1 | Parts List/Tune Up Info | August 10 2022 | confidential | ||||
1 2 3 4 5 | PCB 2 | Parts List/Tune Up Info | August 10 2022 | confidential | ||||
1 2 3 4 5 | PCB Layout | Parts List/Tune Up Info | August 10 2022 | confidential | ||||
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Test Report 4 | Test Report | 4.70 MiB | August 10 2022 | |||
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Test Report 5 | Test Report | 4.79 MiB | August 10 2022 | |||
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Test Report 6 | Test Report | 692.37 KiB | August 10 2022 | |||
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Test Report WCDMA | Test Report | 1.97 MiB | August 10 2022 |
1 2 3 4 5 | User manual | Users Manual | 2.82 MiB | July 12 2023 |
SIM7912&SIM7906 Hardware Design LTE Module SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: 86-21-31575100 support@simcom.com www.simcom.com SIM7912&SIM7906 Hardware Design V1.02 Document Title:
Version:
Date:
Status:
GENERAL NOTES SIM7912&SIM7906 Hardware Design V1.03 2022-03-07 Released SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMERS POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMERS SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE. COPYRIGHT THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT, ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY TECHNICAL INFORMATION INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE AT ANY TIME. SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: +86 21 31575100 Email: simcom@simcom.com For more information, please visit:
https://www.simcom.com/download/list-863-en.html For technical support, or to report documentation errors, please visit:
https://www.simcom.com/ask/ or email to: support@simcom.com Copyright 2021 SIMCom Wireless Solutions Limited All Rights Reserved. www.simcom.com 2 / 85 SIM7912&SIM7906 Hardware Design V1.02 Version History Date Version Description of change 2021-07-30 V1.00 Initial release 2021-10-28 V1.01 Update SIM7906 module data Update the Power on and Reset data Update the current consumption data Update the ESD data Update the 209 pin definition 2021-12-06 V1.02 Update comment in PCIe 2022-03-07 V1.03 Exchanged LTE band B29&B30 to B28&B40 for SIM7912A&SIM7906A. 2023-05-07 V1.04 For SIM7912A adds LTE B48 For SIM7906A adds LTE B48 Author Hongjun Tu Meng Zhang Wenke Gan Meng Zhang Wenke Gan Meng Zhang Wenke Gan Wenke Gan www.simcom.com 3 / 85 SIM7912&SIM7906 Hardware Design V1.02 Contents 1 Introduction .......................................................................................................................................... 10 1.1 Product Outline .................................................................................................................................. 10 1.2 Hardware Block Diagram .................................................................................................................. 12 1.3 Feature Overview .............................................................................................................................. 12 2 Package Information ........................................................................................................................... 15 2.1 Pin Assignment Overview ................................................................................................................. 15 2.2 Pin Description .................................................................................................................................. 16 2.3 Mechanical Dimensions .................................................................................................................... 25 3 Interface Application ........................................................................................................................... 26 3.1 Power Supply .................................................................................................................................... 26 3.1.1 Power Supply Design Guide ....................................................................................................... 26 3.1.2 Recommended Power Supply Circuit ......................................................................................... 28 3.1.3 Voltage Monitor ........................................................................................................................... 29 3.2 Power On and Off Module ................................................................................................................. 29 3.2.1 Power On .................................................................................................................................... 29 3.2.2 Power Off .................................................................................................................................... 31 3.3 Reset Function .................................................................................................................................. 32 3.4 Output Power Management .............................................................................................................. 33 3.5 USB Interface .................................................................................................................................... 33 3.6 PCIe Interface.................................................................................................................................... 36 3.7 SDIO Interface ................................................................................................................................... 38 3.8 SIM Interface ..................................................................................................................................... 40 3.9 PCM and I2S Interface ...................................................................................................................... 42 I2S Timing ................................................................................................................................... 43 I2S Reference Circuit .................................................................................................................. 44 3.10 I2C Interface ................................................................................................................................... 45 3.11 UART Interface ............................................................................................................................... 46 3.12 SPI Interface ................................................................................................................................... 48 3.13 ADC Interface ................................................................................................................................. 48 3.14 GPIOs Interface .............................................................................................................................. 49 3.15 Network Status Indication ............................................................................................................... 49 3.16 Status Indication ............................................................................................................................. 50 3.17 Flight Mode Control ........................................................................................................................ 51 3.18 USB_BOOT Interface ..................................................................................................................... 52 3.19 Antenna Tuner Control Interface* .................................................................................................. 52 3.9.1 3.9.2 4 Antenna Interfaces .............................................................................................................................. 54 4.1 Antenna Definitions ........................................................................................................................... 54 4.1.1 3G/4G Operating Frequency....................................................................................................... 54 4.1.2 GNSS Frequency ........................................................................................................................ 57 4.2 Antenna Installation ........................................................................................................................... 57 www.simcom.com 4 / 85 SIM7912&SIM7906 Hardware Design V1.02 4.2.1 PCB Layout Guidelines ............................................................................................................... 57 4.2.2 Antenna Tuner ............................................................................................................................. 57 4.2.3 Antenna Requirements ............................................................................................................... 60 5 Electrical Specifications ..................................................................................................................... 62 5.1 Absolute Maximum Ratings .............................................................................................................. 62 5.2 Operating Conditions ......................................................................................................................... 62 5.3 Operating Mode ................................................................................................................................. 63 5.3.1 Operating Mode Definition .......................................................................................................... 63 5.3.2 Sleep Mode ................................................................................................................................. 64 5.3.3 Minimum Functionality Mode and Flight Mode ........................................................................... 65 5.4 Current Consumption ........................................................................................................................ 65 5.5 RF Output Power ............................................................................................................................... 67 5.6 Conducted Receive Sensitivity .......................................................................................................... 68 5.7 Thermal Design ................................................................................................................................. 68 5.8 ESD ................................................................................................................................................... 68 6 Manufacturing ...................................................................................................................................... 70 6.1 Top and Bottom View of SIM7912 ..................................................................................................... 70 6.2 Label Description Information ........................................................................................................... 70 6.3 Recommended PCB Footprint .......................................................................................................... 72 6.4 Recommended SMT Stencil .............................................................................................................. 73 6.5 Recommended SMT Reflow Profile .................................................................................................. 74 6.6 Moisture Sensitivity Level (MSL) ....................................................................................................... 75 6.7 Baking Requirements ........................................................................................................................ 75 7 8 Packaging ............................................................................................................................................. 76 Appendix ............................................................................................................................................... 79 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface ................................................. 79 8.2 Related Documents ........................................................................................................................... 81 8.3 Terms and Abbreviations ................................................................................................................... 83 8.4 Safety Caution ................................................................................................................................... 85 www.simcom.com 5 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table Index Table 1: SIM7912 frequency bands ......................................................................................................... 10 Table 2: SIM7906 frequency bands ......................................................................................................... 11 Table 3: Key features ............................................................................................................................... 12 Table 4: IO parameters definition ............................................................................................................ 16 Table 5: DC parameters definition ........................................................................................................... 16 Table 6: Pin description ........................................................................................................................... 17 Table 7: VBAT pins electronic characteristics ......................................................................................... 26 Table 8: Recommended TVS1 list ........................................................................................................... 27 Table 9: Definition of PWRKEY pin ......................................................................................................... 29 Table 10: Power on timing and electronic characteristic ......................................................................... 30 Table 11: Power off timing and electronic characteristic ......................................................................... 31 Table 12: Definition of RESET_N pin ...................................................................................................... 32 Table 13: RESET electronic characteristics ............................................................................................ 33 Table 14: Output power management summary ..................................................................................... 33 Table 15: Definition of USB interface....................................................................................................... 34 Table 16: Definition of PCIe interface ...................................................................................................... 36 Table 17: Definition of SDIO interface ..................................................................................................... 38 Table 18: Definition of SIM interface........................................................................................................ 40 Table 19: SIM electronic characteristics in 1.8V mode (SIM_PWR=1.8V) ............................................. 40 Table 20: SIM electronic characteristics 3.0V mode (SIM_PWR=3.0V) ................................................. 41 Table 21: Recommended TVS and SIM socket list ................................................................................. 42 Table 22: The PCM interface is multiplexing with I2S interface .............................................................. 42 Table 23: PCM / I2S format ..................................................................................................................... 43 Table 24: I2S timing parameters .............................................................................................................. 44 Table 25: Definition of I2C interface ........................................................................................................ 45 Table 26: Definition of UART interface .................................................................................................... 46 Table 27: Definition of SPI interface ........................................................................................................ 48 Table 28: Definition of ADC interface ...................................................................................................... 48 Table 29: GPIO list ................................................................................................................................... 49 Table 30: Definition of network indication pins ........................................................................................ 49 Table 31: NET_STATUS pin status.......................................................................................................... 50 Table 32: Definition of W_DISABLE pin .................................................................................................. 51 Table 33: W_DISABLE pin status ............................................................................................................ 52 Table 34: Pin Definition of USB_BOOT Interface .................................................................................... 52 Table 35: PIN Definition of RFFE Interface for Antenna Tuner Control .................................................. 53 Table 36: Antenna port definitions ........................................................................................................... 54 Table 37: SIM7912 operating frequencies ............................................................................................... 54 Table 38: SIM7906 operating frequencies ............................................................................................... 55 Table 39: GNSS frequency ...................................................................................................................... 57 Table 40: 3G/4G/GNSS antennas ........................................................................................................... 60 Table 41: GNSS antenna (for dedicated GNSS antenna only)*.............................................................. 60 Table 42: Absolute maximum ratings ...................................................................................................... 62 www.simcom.com 6 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 43: VBAT recommended operating ratings .................................................................................... 62 Table 44: 1.8V digital I/O characteristics ................................................................................................. 63 Table 45: Operating temperature ............................................................................................................. 63 Table 46: Operating mode definition ....................................................................................................... 63 Table 47: Current consumption on VBAT pins (VBAT=3.8V) .................................................................. 65 Table 48: Conducted output power.......................................................................................................... 67 Table 49: The ESD performance measurement table (temperature: 25, humidity: 45%) ................... 68 Table 50: Label description of module information .................................................................................. 71 Table 51: MSL ratings summary .............................................................................................................. 75 Table 52: Baking requirements ................................................................................................................ 75 Table 53: Tray size ................................................................................................................................... 77 Table 54: Small carton size ..................................................................................................................... 77 Table 55: Big carton size ......................................................................................................................... 78 Table 56: Coding schemes and maximum net data rates over air interface ........................................... 79 Table 57: Related documents .................................................................................................................. 81 Table 58: Terms and abbreviations .......................................................................................................... 83 Table 59: Safety caution .......................................................................................................................... 85 www.simcom.com 7 / 85 SIM7912&SIM7906 Hardware Design V1.02 Figure Index Figure 1: SIM7912&SIM7906 module block diagram ............................................................................. 12 Figure 2: Pin assignment ......................................................................................................................... 15 Figure 3: Dimensions of SIM7912&SIM7906 (unit: mm) ........................................................................ 25 Figure 4: Power Supply Limits during Burst Transmission...................................................................... 26 Figure 5: Power supply reference circuit ................................................................................................. 27 Figure 6: Linear regulator reference circuit ............................................................................................. 28 Figure 7: Switching mode power supply reference circuit ...................................................................... 28 Figure 8: Power on the module use button ............................................................................................. 29 Figure 9: Power on the module use GPIO drive ..................................................................................... 29 Figure 10: Power on sequence ............................................................................................................... 30 Figure 11: Power off sequence ................................................................................................................ 31 Figure 12: Reset the module use GPIO drive ......................................................................................... 32 Figure 13: Reset the module use button ................................................................................................. 32 Figure 14: The reset timing sequence of the module .............................................................................. 33 Figure 15: Reference Circuit of USB Application .................................................................................... 35 Figure 16: PCIe interface reference circuit (RC Mode) ........................................................................... 37 Figure 17: PCIe interface reference circuit (EP) ..................................................................................... 38 Figure 18: SD card reference circuit........................................................................................................ 39 Figure 19: SIM interface reference circuit ............................................................................................... 41 Figure 20: I2S timing ............................................................................................................................... 44 Figure 21: Audio codec reference circuit ................................................................................................. 44 Figure 22: I2C reference circuit ............................................................................................................... 45 Figure 23: UART level conversion circuit ................................................................................................ 47 Figure 24: UART TX level conversion circuit ........................................................................................... 47 Figure 25: UART RX level conversion circuit .......................................................................................... 47 Figure 26: SPI reference circuit ............................................................................................................... 48 Figure 27: Network Indicator reference circuit ........................................................................................ 50 Figure 28: Reference Circuits of STATUS ............................................................................................... 51 Figure 29: W_DISABLE# pin reference circuit ........................................................................................ 51 Figure 30: Reference Circuit of USB_BOOT........................................................................................... 52 Figure 31: Aperture tuner reference block diagram ................................................................................ 58 Figure 32: Impedance tuner reference block diagram ............................................................................ 58 Figure 33: Hybrid tuner reference block diagram .................................................................................... 59 Figure 34: M.2 package Tuner mipi interface .......................................................................................... 59 Figure 35: LGA package Tuner mipi interface ......................................................................................... 60 Figure 36: Top and bottom view of Module ............................................................................................. 70 Figure 37: Label description of module ................................................................................................... 70 Figure 38: Recommended PCB footprint ................................................................................................ 72 Figure 39: Recommended SMT stencil ................................................................................................... 73 Figure 40: Recommended SMT reflow profile ......................................................................................... 74 Figure 41: Packaging process ................................................................................................................. 76 Figure 42: Module tray drawing ............................................................................................................... 76 www.simcom.com 8 / 85 Figure 43: Small carton drawing .............................................................................................................. 77 Figure 44: Big carton drawing ................................................................................................................. 77 SIM7912&SIM7906 Hardware Design V1.02 www.simcom.com 9 / 85 SIM7912&SIM7906 Hardware Design V1.02 1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and test results of the SIM7912 and SIM7906 module. With the help of this document customers can quickly understand SIM7912 and SIM7906 module. Associated with other software application notes and user guides, customers can use module to easily design and develop application products. 1.1 Product Outline Aimed at the global market, SIM7912 is the LTE Cat 12 module and SIM7906 is the LTE Cat 6, which are supports wireless communication modes of LTE-TDD/LTE-FDD/HSPA+. SIM7912 supports DL 3CA or 2CA and SIM7906 supports DL 2CA only. The supported radio frequency bands are described in the Table 1: SIM7912 frequency bands. Table 1: SIM7912 frequency bands Network Type SIM7912A SIM7912E B2/B4/B5/B7/B12/B13/B14/B17/B25/B 26/B66/B71 B1/B3/B5/B7/B8/B20/B28/B32 LTE-FDD
(with Rx-diversity) LTE-TDD
(with Rx-diversity) B41/B48 B2+B4+B5/B13/B71;B2+B5+B66;B2+
B13+B66;B2+B7+B12/B66;B4+B7+B1 2;B2+B2+B5/B12/B13/B66;B5+B5+B2
/B66;B7+B7+B2/B4/B5;B66+B66+B2/
B5/B13/B66;B41+B41+B25/B26/B41;
DL 3CA CA DL 2CA B12+B12/B25/B46*/B66;B13+B46*/B4 8*/B66;B14+B66;B19+B42*;B25+B25/
B26/B41/B46*;B26+B41/B46*;B28+B4 0/B41/46*;B2+B2/B4/B5/B7/B12/B13/
B28/B46*/B48*/B66/B71;B40+B40 B41+B41/B5/B7/B12/B13/B28/B46*/
B71;B5+B5/B7/B12/B25/B4 B34/B38/B39/B40/B41/B43*/B46 */
B48*
B1+B3+B3/B5/B7/B8/B20/B28/B38/B4 1;B1+B40+B40;B1+B41+B41;B1+B7+
B20;B3+B3+B7/B20/B28;B3+B7+B7/B 8/B20/B28;B3+B40+B40;
B3+B41+B41;B7+B7+B20/B28;B40+B 40+B40;B41+B41+B41 B1+B1/B3/B5/B7/B8/B20/B28*/B38*/B 40*/B41*
B3+B3/B5/B7/B8/B20/B28/B38*/B40*/
B41*
B7+B5/B7/B8*/B20/B28;B20+B32/B38
/B40;
B38+B38;B40+B40;B41+B41;B48+B4 8*;
www.simcom.com 10 / 85 SIM7912&SIM7906 Hardware Design V1.02 0/B41B/46*/B48*/B66;B66+B66/B71;B 7+B7/B12/B28/B46*;
B2/B4/B5 B1/B3/B5/B8 GPS/Galileo/GLONASS/BeiDou GPS/Galileo/GLONASS/BeiDou WCDMA GNSS Table 2: SIM7906 frequency bands Network Type SIM7906A SIM7906E LTE-FDD
(with Rx-diversity) LTE-TDD
(with Rx-diversity) CA DL 2CA WCDMA GNSS NOTE B2/B4/B5/B7/B12/B13/B14/B17/B25/B 26/B28/B66/B71 B1/B3/B5/B7/B8/B20/B28/B32 B40/B41/B43*/B46*/B48 B34/B38/B39/B40/B41/B43*/B46
*/B48 B12+B12/B25/B46*/B66;B13+B46*/B4 8*/B66;B14+B66;B19;B25+B25/B26/
B41/B46*;B26+B41/B46*;B28+B4 0/
B41/46*;B2+B2/B4/B5/B7/B12/B13/
B28/B46*/B48*/B66/B71;B40+B4 0 B41+B41/B4+B4/B5/B7/B12/B13/B28/
B46*/B71;B5+B5/B7/B12/B25/B4 0/
B41B/46*/B48*/B66;B66+B66/B71;B 7
+B7/B12/B28/B46*;
B1+B1/B3/B5/B7/B8/B20/B28*/B38*/B 40*/B41*
B3+B3/B5/B7/B8/B20/B28/B38*/B40*/
B41*
B7+B5/B7/B8*/B20/B28;B20+B32/B38
/B40;
B38+B38;B40+B40;B41+B41;B48+B4 8*;
B2/B4/B5 B1/B3/B5/B8 GPS/Galileo/GLONASS/BeiDou GPS/Galileo/GLONASS/BeiDou 1. GNSS function is optional. 2.
* function is optional. With a physical dimension of 39.5mm * 37.0mm * 2.8mm, module can meet almost all requirements for M2M applications. SIM7912 and SIM7906 are an SMD type module and can be embedded in applications through its 300 LGA pins With the 300 LGA pins, module owns rich interfaces, includes USB2.0/USB3.0, PCIe, SDIO (SD Card), SIM card, digital audio (I2S or PCM), ADCs, I2C, UART, GPIOs, five antennas for 3G/4G and GNSS. www.simcom.com 11 / 85 SIM7912&SIM7906 Hardware Design V1.02 1.2 Hardware Block Diagram The block diagram of SIM7912&SIM7906 is shown in the following figure. Figure 1: SIM7912&SIM7906 module block diagram 1.3 Feature Overview Table 3: Key features Feature Implementation Power supply Transmit power LTE Features VBAT:3.3V4.3V Typical: 3.8V Class 3 (23dBm2dB) for LTE-TDD bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (24dBm+1/-3dB) for WCDMA bands Support FDD/TDD LTE Category 12 with CA and MIMO Support uplink QPSK and 16-QAM and **64-QAM modulation www.simcom.com 12 / 85 ANT MAINMemory SupportEBI1Internal memoryEBI2Internal functionsResource and pwr mgtSecurity and QFP ROMGP clock and PDM outsJTAGModes, resets, configClock generationGPIOsProcessorsCortex-A7Hexagon DSP:ModemAudioRPM cortex-M3Air interfacesWCDMA processingLTE processingGSM processingQualcomm LocationSuite; Gen 9V1 Chipset and RFFE I/FsSerial interfacesQlink digital interfaceConnectivityPCEe UART PCM(audio*2)SPII2S I2C UIM1/UIM2(dual-V) USB2.0/USB3.0 Secure digital 3.0(dual-V) BasebandPMICInput pwr mgtOut pwr mgtUser I/FsGeneral housekeepingIC-level I/FsMEMORYNAND+LPDDR2TransceiverSDR modem subsystem (SDR MSS)RF transmitters for dual UL(Tx0/Tx1)RF receivers with carrier aggregation supportGNSSMODULEANT DIVANT MIMO1ANT MIMO2ANT GNSSRESET_NPWRKEYBT_ENWLAN_PWR_ENSIM1 CardSIM2 CardUSB2.0/USB3.0I2CSD CardUARTPCMRFFE_CLK/DATAUSB_BOOTPCIeGPIOsSD_VDDVDD_RFVDD_EXTVDD_P2VBAT_BBVBAT_RFADC(*2)WLAN_SLP_CLKI2S_MCLKTx/RxBolcksPRxDRxMIMOTxQLINKControlControl38.4MXO SIM7912&SIM7906 Hardware Design V1.02 Support downlink QPSK, 16-QAM and 64-QAM and **256-QAM modulation Support 1.4MHz to 60MHz (3CA) RF bandwidth Support 44 MIMO in DL direction FDD: Max 600Mbps (DL)/150Mbps (UL) TDD: Max 430Mbps (DL)/90Mbps (UL) Main antenna interface (ANT_MAIN) Rx-diversity antenna interface (ANT_DIV) MIMO antenna interfaces (ANT_MIMO1, ANT_MIMO2) GNSS antenna interface (ANT_GNSS) Two pins (NET_MODE and NET_STATUS) to indicate network connectivity status GNSS engine: GPS/GLONASS/BeiDou/Galileo Protocol: NMEA Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default Support identity card: 1.8V/ 3.0V Include SIM1 and SIM2 interfaces Support Dual SIM single standby Comply with PCI Express Specification Revision 2.1 and support Antenna Network Indication GNSS Features SMS SIM interface PCIe interface 5Gbps per lane UART interface I2C interface PCM interface SDIO interface USB interface Firmware upgrade Physical characteristics www.simcom.com Used for data transmission Support up to three UART Data rate up to 4 Mbps Support I2C Data rate up to 400 Kbps Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Support 4bit SD card or 4bit eMMC, meet SDIO3.0 specification 1.8V or 3.0V dual-voltage operation for SD card Data rate up to 200Mbps Comply with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0 Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentence output, and voice over USB*
Support USB serial drivers for: Windows 7/8/8.1/10; Linux 2.6/3.x/4.1~4.15;
Android 4.x/5.x/6.x/7.x/8.x/9.x Firmware upgrade over USB2.0 interface Size: 39.5mm*37mm*2.8mm Weight: Almost 8.38 g 13 / 85 SIM7912&SIM7906 Hardware Design V1.02 Normal operation temperature: -30C to +75C Extended operation temperature: -40C to +85C Storage temperature: -40C to +90C All hardware components are fully compliant with EU RoHS directive Temperature range RoHS NOTE 1. * means under development. 2** means SIM7912 supportedSIM7906 unsupported. www.simcom.com 14 / 85 SIM7912&SIM7906 Hardware Design V1.02 2 Package Information 2.1 Pin Assignment Overview The following figure shows the pin assignment of SIM7912&SIM7906. Figure 2: Pin assignment www.simcom.com 15 / 85 1RESET_N3BT_EN5WLAN_PWR_EN7RESERVED9RESERVED11RESERVED13GND15RESERVED17GND19RESERVED21RESERVED23RESERVED25SIM1_DET27SIM1_CLK29SIM1_DATA31GND33USB_ DM35GND37USB_ SS_TX_M39GND41USB_ SS_RX_M42I2C_SDA44GND46SD_VDD48SD_DATA350SD_DATA152SD_DET54GND56CTS62DTR58RXD60TXD64GND66PCM_IN72RESERVED68PCM_OUT70GND74SIM2_VDD80SIM2_CLK76GND78SIM2_DET82GND86VBAT_RF84GND88VBAT_RF43I2C_SCL45GND47SD_DATA249SD_DATA051SD_CMD53SD_CLK55GND61RI57RTS59DCD63GND65PCM_SYNC71RFFE_CLK67PCM_CLK69GND73RFFE_DATA79SIM2_RST75GND77SIM2_DATA81GND85VBAT_RF83GND87VBAT_RF2PWRKEY4RESERVED6RESERVED8RESERVED10GND12RESERVED14RESERVED16GND18RESERVED20RESERVED22RESERVED24GND26SIM1_VDD28SIM1_RST30GND32USB_ VBUS34USB_ DP36USB_ ID38USB_ SS_TX_P40USB_ SS_RX_P177GND178GND179PCIE_REFCLK_P180PCIE_REFCLK_M181GND182PCIE_ TX_M183PCIE_ TX_P184GND185PCIE_ RX_M186PCIE_ RX_P187GND188PCIE_ CLK_ REQ_N189PCIE_ RST_N190PCIE_WAKE_N191GND192RESERVED193RESERVED194RESERVED195RESERVED129GND127ANT_DIV125GND123GND121GND119ANT_ GNSS117GND115GND113ANT_ MIMO2111GND109GND107ANT_ MAIN105GND103GND101ANT_ MIMO199GND97GND95RESERVED93GND91RESERVED89GND128GND126GND124GND122GND120GND118GND116GND114GND112GND110GND108GND106GND104GND102GND100GND98GND96GND94GND92GND90GND214GND213RESERVED212RESERVED211RESERVED210RESERVED209WLAN_PA_EN208GND207GND206GND205GND204GND203GND202GND201RESERVED200RESERVED199RESERVED198RESERVED197RESERVED196GND176RESERVED174GND172GPIO_5170NET_STATUS168VDD_EXT166BT_RTS164BT_CTS162VDD_RF156VBAT_BB160WAKE_ON_ WIRELESS158GND154GND152I2S_MCLK146COEX_UART_RX150WAKEUP_IN148GND144SLEEP_IND138GPIO_1142GND140USB_BOOT136DBG_RXD132GND134RESERVED130GND173ADC0171STATUS169WLAN_SLP_CLK167GND165BT_RXD163BT_TXD161GPIO_4155VBAT_BB159GPIO_3157GND153GND151W_DISABLE#145COEX_UART_EN149WLAN_EN147NET_MODE143OTG_PWR_EN137DBG_TXD141GND139GPIO_2135VDD_P2133GND175ADC1131GND215GND216GND217GND218GND219GND220GND221GND222GND223GND224GND233GND242GND251GND260GND269GND278GND287GND225GND226GND227GND228GND229GND230GND231GND232GND234GND235GND236GND237GND238GND239GND240GND241GND243GND244GND245GND246GND247GND248GND249GND250GND252GND253GND254GND255GND256GND257GND258GND259GND261GND262GND263GND264GND265GND266GND267GND268GND270GND271GND272GND273GND274GND275GND276GND277GND279GND280GND281GND282GND283GND284GND285GND286GND288GND289GND290GND291GND292GND293GND294GND295GNDSIM7912&SIM7906POWER PinsGND PinsGPIOs and Other PinsRESERVED PinsUART PinsPCIe PinsUSB PinsSIM PinsSDIO PinsPCM PinsI2C Pins299GND298GND297GND 296 GND300GNDANT Pins SIM7912&SIM7906 Hardware Design V1.02 NOTE 1. Keep all RESERVED pins and unused pins unconnected. 2. GND pins 215~299 should be connected to ground in the design. 2.2 Pin Description Table 4: IO parameters definition Pin type Description PI PO AI AIO DIO DI DO PU PD OD Power Input Power Output Analog Input Analog Input /Output Bidirectional Digital Input /Output Digital Input Digital Output Pull Up Pull Down Open Drain Table 5: DC parameters definition Voltage domain Parameter VDD_P2=1.8V Min Typ Max P2 VOH VOL VIH VIL VDD_P2=3.0V VOH VOL VIH VIL VDD_P3=1.8V High level output 1.4V Low level output High level input Low level input 0V 1.3V 0.3V High level output 2.15V Low level output High level input Low level input 0V 1.8V 0.3V P3 VOH VOL High level output 1.35V Low level output 0V
0.45V 2V 0.58V
0.35V 3.15V 0.7V 1.8V 0.45V www.simcom.com 16 / 85 SIM7912&SIM7906 Hardware Design V1.02 VIH VIL High level input Low level input 1.3V 0.3V VDD_P4/P5=1.8V VOH VOL VIH VIL High level output 1.45V Low level output 0V High level input 1.26V Low level input 0V VDD_P4/P5=3.0V VOH VOL VIH VIL High level output 2.4V Low level output High level input Low level input 0V 2.1V 0V
P4/P5 2.1V 0.5V 1.8V 0.4V 2.1V 0.36V 3V 0.4V 3.05V 0.57V Table 6: Pin description Power supply Pin name VBAT_BB VBAT_RF Pin No. 155, 156 85,8 6, 87, 88 PI PI VDD_P2 135 PI Electrical description Description Comment VMAX=4.3V VTYP =3.8V VMIN=3.3V VMAX=4.3V VTYP =3.8V VMIN=3.3V VDD_P2
=SD_VDD or VDD_P2
=VDD_EXT Input power supply for modules BB part Input power supply for modules RF part SD card power supply in a It must be provided with sufficient current up to 1.0A. It must be provided with sufficient current up to transmitting 1.5A burst. If an SD card is used, to connect VDD_P2 SD_VDD. If an eMMC* is used or SDIO interface is unused, connect VDD_P2 to VDD_EXT. VDD_EXT 168 PO VTYP =1.8V VDD_RF 162 PO VTYP =2.85V Provide 1.8V for external circuit. Provide 2.85V for external RF circuit. Iomax=50mA Iomax=120mA 10, 13, 16, 17, 24, 30, 31, 35, 39, 44, 45, 54, 55, 63, 64, 69, 70, 75, 76, 81, 82, 83, 84, 89, 90, 92, 93, 94, 96, 97, 98, 99, 100, 102, 103, 104, 105, 106, 108, 109, 110, 111, 112, 114, 115, 116, 117, 118, 120, 121, 122, 123, 124, 125, 126, 128, 129, 130, 131, 132, 133, 141, 142, 148, 153, 154, 157, 158, 167, 174, 177, 178, 181, 184, 187, 191, 196, 202~208, 214~299 Ground GND Turn on/off www.simcom.com 17 / 85 SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin No. Electrical description Description Comment RESIN_N 1 DI,PU P3 PWRKEY 2 DI,PU P3 Reset the module, active low Power on/off the module, active low 1.8V power domain. Pulled up internally. Active low. 1.8V power domain. Pulled up internally. Active low. Status indication Pin name Pin No. Electrical description Description Comment NET_MODE 147 DO NET_STATUS 170 DO STATUS 171 DO P3 P3 P3 Indicate the modules network registration mode Indicate the modules network activity status Indicate the modules operation status 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. USB interface Pin name Pin No. Electrical description Description Comment USB_VBUS 32 PI VMAX=5.25V VMIN=3.3V USB VBUS detection Not support charge USB_ DP 34 AIO USB_ DM 33 AIO USB_SS_TX_P 38 AO USB_SS_TX_M 37 AO USB_SS_RX_P 40 AI USB_SS_RX_M 41 AI Differential USB bi-directional data plus Differential USB bi-directional data minus USB3.0 super-speed transmit data plus USB3.0 super-speed transmit data minus USB3.0 super-speed receive data plus USB3.0 super-speed receive data minus USB_ID 36 DI P3 OTG identification OTG_PWR_EN 143 DO,PD P3 USB OTG power supply DC-DC enable signal Required 90 differential impedance Compliant with USB 2.0 standard specifications Required 90 differential Impedance Compliant with USB 3.0 standard specifications 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. SIM interface Pin name Pin No. Electrical description Description Comment SIM1_VDD 26 PO 1.8V For SIM:
Power supply for SIM1 card Either 1.8V or 3.0V is supported by the module www.simcom.com 18 / 85 SIM7912&SIM7906 Hardware Design V1.02 automatically. If unused, please keep open VMAX=1.9V VMIN=1.7V For SIM:
3.0V VMAX=3.05V VMIN=2.75V SIM1_DATA 29 DIO P4 SIM1_CLK SIM1_RST 27 28 DO DO SIM1_DET 25 DI P4 P4 P3 SIM2_VDD 74 PO 1.8V For SIM:
VMAX=1.9V VMIN=1.7V For SIM:
3.0V VMAX=3.05V VMIN=2.75V SIM2_DATA 77 DIO P4 SIM2_CLK SIM2_RST 80 79 DO DO SIM2_DET 78 DI P4 P4 P3 SIM1 card data signal, which has been pulled up to SIM1_VDD by a 20K resistor internally SIM1 clock signal SIM1 reset signal SIM1 card detect signal, which need pulled up to VDD_EXT by a 470K resistor externally Power supply for SIM2 card SIM2 card data, which has been pulled up to SIM2_VDD by a 20K resistor internally SIM2 clock signal SIM2 reset signal SIM2 card detect, which need pulled up to VDD_EXT by a 470KR resistor externally Pin No. SPI interface Pin name SPI_CS_N SPI_CLK SPI_MOSI SPI_MISO Main UART interface www.simcom.com Electrical description Description Comment DO DO DO DI P3 P3 P3 P3 SPI chip select SPI clock Master output slaver input Master output slaver input 19 / 85 SIM7912&SIM7906 Hardware Design V1.02 Electrical description Description Comment Pin name CTS RTS RXD DCD TXD RI Pin No. 56 57 58 59 60 61 DO DI DI DO DO DO P3 P3 P3 P3 P3 P3 Clear to send Request to send Receive data Data Carrier detect Transmit data Ring indicator DTR 62 DI P3 ready, terminal Data sleep mode control:
Pulled up by default. Pulling down to low level will wake up the module. 1.8V power domain. If unused, keep it open. Default use command for AT BT interface*
Pin name Pin No. Electrical description Description Comment BT_EN 3 DO P3 function BT control enable BT _TXD 163 DO P3 Transmit data BT _CTS 164 DO P3 Clear to send BT_RXD 165 DI P3 Receive data BT _RTS 166 DI P3 Request to send Debug UART interface 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_MOSI. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_CLK. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_MISO. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_CS. Pin name Pin No. www.simcom.com Electrical description Description Comment 20 / 85 DBG_ RXD 136 DI DBG_ TXD PCM & I2C interface 137 DO SIM7912&SIM7906 Hardware Design V1.02 P3 P3 Receive data Transmit data 1.8V power domain. If unused, keep it open. Pin name Pin No. Electrical description Description Comment I2C_SCL 43 OD I2C clock signal I2C_SDA 42 OD I2C data signal PCM_SYNC 65 DIO P3 PCM synchronous signal PCM_IN 66 DI P3 PCM data input PCM_CLK 67 DO P3 PCM clock output PCM_OUT 68 DO P3 PCM data output I2S_MCLK 152 DO P3 I2S master clock output 1.8V power domain. An external pull-up resistor is required. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. If unused, keep it open. Provide a digital clock output for an external audio codec. If unused, keep it open. ADC interface Pin name Pin No. Electrical description Description Comment ADC0 173 AI 1.875V ADC1 175 AI 1.875V Analog to digital converter input0 Analog to digital converter input1 If unused, keep it open. If unused, keep it open. Pin No. Electrical description Description Comment PCIe reference clock plus PCIe reference clock minus PCIe transmit minus Required 90 differential impedance PCIe interface Pin name PCIe_REF CLK_P PCIe_REF CLK_M 179 AIO 180 AIO PCIe_TX_M 182 AO www.simcom.com 21 / 85 SIM7912&SIM7906 Hardware Design V1.02 PCIe_TX_P 183 AO PCIe_RX_M PCIe_RX_P 185 186 AI AI PCIe transmit plus PCIe receive minus PCIe receive plus PCIe_CLK_ REQ_N 188 DI P3 PCIe clock request PCIe_WAKE 190 DI P3 PCIe wake-up PCIe_RST 189 DO P3 PCIe reset WLAN Control interface*
In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. Pin No. Electrical description Description Comment Pin name WLAN_PWR_ EN COEX_UART_T X COEX_UART_R X 5 DO 145 DO 146 DI WLAN_EN 149 DO WAKE_ON_ WIRELESS 160 DI 169 DO WLAN_SLP_ CLK SDIO interface Pin name P3 P3 P3 P3 P3 P3 WLAN power supply enable control LTE/WLAN coexistence signal LTE/WLAN coexistence signal WLAN function enable control Wake up module by an external Wi-Fi module 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Active high. If unused, keep it open. 1.8V power domain. Active low. If unused, keep it open. WLAN sleep clock If unused, keep it open. Pin No. Electrical description Description Comment SD_VDD 46 PO 1.8/3.0V SD card application:
SDIO pull up power source. Connected it to VDD_P2. eMMC application:
Keep it open when used for eMMC www.simcom.com 22 / 85 SD_DATA0 49 DIO SD_DATA1 50 DIO SD_DATA2 47 DIO SD_DATA3 48 DIO SD_CMD SD_CLK SD_DET 51 53 52 DIO DO DI,PU P2 P2 P2 P2 P2 P2 P3 SIM7912&SIM7906 Hardware Design V1.02 SDC data bit 0 or eMMC* data bit 0 SDC data bit 1 or eMMC data bit 1 SDC data bit 2 or eMMC data bit 2 SDC data bit 3 or eMMC data bit 3 SDC command output SDC clock output SD card insertion detection Required 50 impedance If unused, keep it open. 1.8V power domain, If unused, keep it open. Other interface Pin name Pin No. Electrical description Description Comment GPIO_1 GPIO_2 GPIO_3 GPIO_4 GPIO_5 138 IO,PD 139 IO,PU 159 IO,PD 161 IO,PD 172 IO,PD USB_BOOT 140 DI SLEEP_IND 144 DO P3 P3 P3 P3 P3 P3 P3 General purpose input/output ports 1.8V power domain, If unused, keep it open. Force the module into emergency download mode Sleep indication 1.8V power domain. Active high. If unused, keep it open. 1.8V power domain, If unused, keep it open. 1.8V power domain. Pulled up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pulled up by default. In low voltage level, the module will enter airplane mode. If unused, keep it open. Default in LTE mode, Pull-down to the GND. Can switch to WLAN mode. WAKEUP_IN 150 DI,PU P3 Sleep mode control W_DISABLE#
151 DI,PU P3 Airplane mode control WLAN_PA_EN 209 DI,PD P3 WLAN PA Enable Antenna Tuner control interface Pin name Pin No. Electrical description Description Comment RFFE_CLK 71 DO P3 RFFE serial interface for 1.8V power domain, www.simcom.com 23 / 85 RFFE_DATA 73 Antenna interface Pin name Pin No. SIM7912&SIM7906 Hardware Design V1.02 DIO P3 external tuner control If unused, keep it open. Electrical description Description Comment ANT_MAIN 107 AIO ANT_DIV 127 AI ANT_ MIMO1 101 AI ANT_MIMO2 113 AI Main antenna interface supporting all bands RXD antenna interface supporting all bands 44 MIMO antenna interface supporting all bands 44 MIMO antenna interface supporting all bands ANT_GNSS 119 AI GNSS antenna interface RESERVED interface 50 impedance 50 impedance If unused, keep open. 50 impedance If unused, keep open. 50 impedance If unused, keep open. 50 impedance If unused, keep open. them them them them 4, 6~9, 11, 12, 14, 15, 18, 19, 20, 21, 22, 23, 72, 91, 95, 134, 176, 192, 193, 194, 195, 197, 198, 199, 200, 201, 210, 211, 212, 213, 300 Reserved for future use Keep unconnected. these pins RESERVED NOTE 1. * means under development. 2. The I2C signals need pull up to VDD_EXT by 2.2K resistors out of the module. 3. If not use SDIO function, the VDD_P2 pin should connect to VDD_EXT pin out of the module. 4. Do not pull up USB_BOOT during normal power up. 5. Unused and RESERVED pins should keep open. 6. Recommend ESD protect components out of the module for used interfaces. 7. All GND pins should be connected to the customers main PCB. 8. GPIO2 will become low level when the module starts up. 9. Pin 209 in V1.01 module is reserved. www.simcom.com 24 / 85 SIM7912&SIM7906 Hardware Design V1.02 2.3 Mechanical Dimensions The following figure shows the mechanical dimensions of SIM7912&SIM7906. Figure 3: Dimensions of SIM7912&SIM7906 (unit: mm) www.simcom.com 25 / 85 SIM7912&SIM7906 Hardware Design V1.02 3 Interface Application 3.1 Power Supply Module provides six VBAT pins dedicated to connection with an external power supply. There are two separate voltage domains for VBAT. Four VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part The following table shows details of VBAT pins and ground pins. Table 7: VBAT pins electronic characteristics Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 85, 86, 87, 88 VBAT_BB 155, 156 Power supply for the modules RF part Power supply for the modules baseband part 3.3 3.8 4.3 3.3 3.8 4.3 V V 3.1.1 Power Supply Design Guide The power supply range of the module is from 3.3V to 4.3V. Please make sure the input voltage will never drop below 3.3V. The following figure shows the voltage drop during Tx power in 3G and 4G networks. Figure 4: Power Supply Limits during Burst Transmission www.simcom.com 26 / 85 Min.VBATVoltage DropBurst TransmissionIpeakBurst TransmissionBurst Transmission SIM7912&SIM7906 Hardware Design V1.02 To decrease the voltage dropping, make sure that the capacitors of VBAT net must not less than 640uF. The following figure shows the reference circuit of power supply for the VBAT. Figure 5: Power supply reference circuit In this reference circuit, some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMI suppression. NOTE 1. Both C1 and C5 are 220 F tantalum capacitor (ESR=0.7). 2. C3, C4, C7 and C8 are multi-layer ceramic chip (MLCC) capacitors from 0.1uF to 1uF with low ESR in high frequency band, which can be used for EMC performance. 3. TVS1 is used for surge protection. Table 8: Recommended TVS1 list No. 1 Manufacturer Part Number ESDBW5V0A1 Js-ele Power dissipation Package 5V DFN1006-2L 2 3 4 5 6 Prisem Way-on Will semi Will semi Way-on PESDHC2FD4V5BH 4.5V WS05DPF-B ESD5611N ESD56151W05 WS4.5DPV 5V 5V 5V 4.5V DFN1006-2L DFN1006-2L DFN1006-2L SOD-323 DFN1610-2L Power supply layout guidelines:
Both VBAT and return path should be as short and wide as possible to minimize the voltage drop. The width of VBAT_BB trace should be no less than 1.5mm, and the width of VBAT_RF trace should be no less than 2mm. These capacitors should be placed as closely as possible to the VBAT_BB and VBAT_RF pins. The VBAT trace should pass through TVS and capacitors, and then pass through the VBAT pins. The small value capacitors should be placed close to the VBAT pins. www.simcom.com 27 / 85 C7100uFC6100nFC833pFC433pFVBAT_BBVBAT_RFTVS1VBATC1220uF5VC3100nFC2C5220uF100uFModuleFB101 The customers PCB design must have a solid ground plane throughout the board as the primary reference plane for most signals. SIM7912&SIM7906 Hardware Design V1.02 3.1.2 Recommended Power Supply Circuit It is recommended to use a switching mode power supply or a linear regulator power supply. Make sure it can provide the current up to 3A at least. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output. Figure 6: Linear regulator reference circuit NOTE An extra minimum load of R3 is required, to ensure it work properly under light load in sleep mode and power off mode. For the details about minimum load, please refer to specification of MIC29502WU. The following figure shows the switching mode power supply reference circuit with 5~12V input and 3.8V output. Figure 7: Switching mode power supply reference circuit NOTE 1. In order to avoid damaging the module, please do not switch off the power supply when module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. www.simcom.com 28 / 85 VinVoutGNDADJ3+PWR_CTRLR2R1VBAT100K(1%)47K(1%)+U1MIC29502WU5412C1C2100uF1uFDC INPUTR3470RENFUSEC3330uFC4100nF10uFENINLXBSGNDFBVBATDC INPUTPWR_CTRL10uF10uF100nFL101VLS5045EX-3R3N3.3UH160K 1%100nF100pF22uF10uF30K 1%C1C2C3C4C5R3R4C6C8C9U1SY8105IADCFuseFB1UPZ1608E300-5R0TF30ohm@100MHz165423 2. It is suggested that customer's design should have the ability to switch off the power supply for module in abnormal state, and then switch on the power to restart the module. 3. The PWR_CTRL signal recommend connect to the host and can be controlled. SIM7912&SIM7906 Hardware Design V1.02 3.1.3 Voltage Monitor To monitor the VBAT voltage, the AT command AT+CBC can be used. NOTE For more details about voltage monitor commands, please refer to Document [1] in the appendix. 3.2 Power On and Off Module 3.2.1 Power On Drive the PWRKEY pin to a low level and hold it for 1 seconds, then release, the module will be powered on. This pin is already pulled up internally. The electrical characteristics are listed in Table 10, and the following figure shows the power on circuit. Figure 8: Power on the module use button Figure 9: Power on the module use GPIO drive Table 9: Definition of PWRKEY pin www.simcom.com 29 / 85 PWRKEY1KModulePMU 1sPWRKEY1KModulePMUPWRKEY1sGPIOMCU SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin no. I/O Functional description PWRKEY 2 DI Power on/off the module, active low Comment 1.8V power domain. Pulled-up internally. Active low The power on sequence is shown in the following figure. Figure 10: Power on sequence Table 10: Power on timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit Twait Ton The waiting time from power supply available to power-on action The time of holding on PWRKEY pin to a low level Ton(VDD_EXT) The time from power-on action to VDD_EXT ready Ton(usb) Ton(uart) The time from power-on action to USB port ready The time from power-on issue to UART port ready Ton(STATUS) The time from power-on action to STATUS ready 30 1000 100 11 15
12
25
ms ms ms s s s NOTE After enter force download mode, the PWRKEY pin need to release and dont pull low always. If not, the module will restart and then cause the download fail. www.simcom.com 30 / 85 PWRKEYRESET_NVBATTonTwaitVDD_EXTT1USB PortUndefinedActiveTon(usb)STATUSTon(STATUS)UARTUndefinedActiveTon(uart) SIM7912&SIM7906 Hardware Design V1.02 3.2.2 Power Off The following methods can be used to power off the module. Method 1: Power off the module by holding the PWRKEY to a low level 2 second then release. Method 2: Power off the module by AT command AT+CPOF. For details about AT+CPOF, please refer to Document [1] in the appendix. NOTE If the temperature is outside the range of -30~+70, some warning will be reported via AT port. If the temperature is outside the range of -40~+85, module will be powered off automatically. For details about AT+CPOF, please refer to Document [1] in the appendix. Normal power off action will make the module disconnect from the network, allow the software enter a safe state, and save key data before the module is powered off completely. The power off sequence is shown in the following figure. Figure 11: Power off sequence Table 11: Power off timing and electronic characteristic Symbol Parameter Time value Min. Typ. Max. The time of holding on PWRKEY pin to a low level 2.5 The time from power-off issue to USB port off The time from power-off issue to STATUS off 27 25
28 26 5
Toff Toff(usb) Toff(status) NOTE Unit s s s www.simcom.com 31 / 85
(Input)USB PortInactiveActivePWRKEYActiveSTATUSToff(STATUS)VDD_EXTToff(VDD_EXT)Toff(USB)Toff SIM7912&SIM7906 Hardware Design V1.02 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise, the module will be turned on again after successful turn-off. 3.3 Reset Function Module can be reset by driving the RESET_N pin down to a low level for 500ms at least and then releasing it. The RESET_N signal has been internally pulled up to 1.8V, so there is no need to pull it up externally. Please refer to the following figure for the recommended reference circuit. Figure 12: Reset the module use GPIO drive Figure 13: Reset the module use button Table 12: Definition of RESET_N pin www.simcom.com 32 / 85 Reset ImpulseRESET_NResetLogicR1.8VModule1K200~600msGPIOMCUResetLogicR1.8VModule1KTreset200~600msRESET_N SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin no. I/O Functional description Comment RESET_N 1 DI Reset the module active low Table 13: RESET electronic characteristics Symbol Description Min. Typ. Max. Unit Treset The time of holding on RESET_N pin to a low level 250 500
ms The reset timing sequence of the module is shown in the following figure. Figure 14: The reset timing sequence of the module NOTE Please ensure that there is no capacitance on RESET_N pin. 3.4 Output Power Management Table 14: Output power management summary Pin name Pin no Typical voltage (V) Rated current (mA) Sleep state Comment VDD_EXT 168 1.8 50 Always on VDD_RF 162 2.8 SD_VDD 46 1.8/3 150 150 Always on Always on Output power supply for external IO pull up circuits Provide 2.85V for external RF circuit. SDIO pull up power source 3.5 USB Interface www.simcom.com 33 / 85 Module stateRestarResetingVBATRunningRESET_N500ms0VVIL0.4V1.2VVIH1.9V SIM7912&SIM7906 Hardware Design V1.02 Module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0 and 2.0 specifications. This USB interface supports super speed (5Gbps) on USB 3.0 and high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. The following table shows the pin definition of USB interface. Table 15: Definition of USB interface Pin name Pin no. I/O Functional description Comment USB_VBUS 32 PI USB VBUS detection AIO AIO AO AO Differential USB bi-directional data plus Differential USB bi-directional data minus USB3.0 super-speed transmit data plus USB3.0 super-speed transmit data minus AI USB3.0 super-speed receive data plus AI USB3.0 super-speed receive data minus DI OTG identification Typical 5.0V Not support for charging Required 90 differential impedance Compliant with USB 2.0 standard specifications Required 90 differential Impedance Compliant with USB 3.0 standard specifications 1.8V power domain. If unused, keep it open 1.8V power domain. If unused, keep it open 143 DO OTG power control USB_ DP 34 USB_ DM 33 38 37 40 41 36 USB_SS_TX _P USB_SS_TX _M USB_SS_ RX_P USB_SS_RX _M USB_ID OTG_PWR_ EN The following figure is the USB reference circuit. www.simcom.com 34 / 85 SIM7912&SIM7906 Hardware Design V1.02 Figure 15: Reference Circuit of USB Application NOTE 1. USB_VBUS is used for USB insertion detection. Its voltage input range is 3.6V~5.25V. 2. For sleep mode, if the Host does not support USB suspend mode, the input of USB_VBUS needs to be controlled by host. Choosing Q1 for placement. 3. For sleep mode, if the host supports USB suspend mode, USB_VBUS can be directly connected to VDD. Choosing R1 for placement. 4. The capacitors C1/C2 need to be placed close to the Host side. 5. Recommended add a 1 resistor in series and parallel varistor in USB3.0 for ESD protection. HS USB DP/DM layout guidelines:
Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 1mm. Gap from other signals keeps 3xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, audio, and 38.4M XO). Maximum PCB trace length cannot exceed 100mm outside of module, the shorter trace and more better. SS USB TX/RX layout guidelines:
Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 500um. www.simcom.com 35 / 85 Close to Host100nFC1USB_DPUSB_DM100nFUSB_SS_TX_PUSB_SS_TX_MUSB_SS_RX_PUSB_SS_RX_MBasebandModuleUSB_VBUSHostUSB_SS_TX_PUSB_SS_TX_MUSB_SS_RX_PUSB_SS_RX_MUSB_DPUSB_DMVDDUSB_IDGPIOGNDGND100nF100nF3.6V~5.25VC2GPIOQ1R1Choose one of R1 and Q1GSD0 SIM7912&SIM7906 Hardware Design V1.02 Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, especially 2.4 GHz). Route differential pairs in the inner layers with a solid GND reference to have good impedance control and to minimize discontinuities. Keep isolation between the Tx pair, Rx pair, and DP/DM to avoid crosstalk. If core vias are used, use no more than two core vias per signal line to limit stubs. 3.6 PCIe Interface Module provides one integrated PCIe (Peripheral Component Interconnect Express) interface which complies with the PCI Express Specification, Revision 2.1 and supports 5Gbps per lane. The PCIe interface of module is only used for data transmission PCI Express Specification Revision 2.1 compliance Data rate at 5Gbps per lane Can be used to connect to an external Ethernet IC (MAC and PHY) or WLAN IC Table 16: Definition of PCIe interface Pin name Pin no. I/O Functional description Comment PCIE_REFCL K_P PCIE_REFCL K_M PCIE_TX_M PCIE_TX_P PCIE_RX_M PCIE_RX_P PCIE_CLK_R EQ_N 179 AIO PCIe reference clock plus 180 182 183 185 186 AIO PCIe reference clock minus AO AO AI AI PCIe transmit0 minus PCIe transmit0 plus PCIe receive0 minus PCIe receive0 plus 188 IO PCIe clock request PCIE_WAKE _N 190 IO PCIe wake-up PCIE_RST_N 189 IO PCIe reset Required 90 differential impedance If unused, keep it open. In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an output signal. In slave mode, it is an www.simcom.com 36 / 85 SIM7912&SIM7906 Hardware Design V1.02 input signal. If unused, keep it open PCIe interface layout guidelines:
All other sensitive/high-speed signals and circuits must be protected from PCIe corruption. PCIe signals must be protected from noisy signals (clocks, SMPS). Each trace needs to be adjacent to a ground plane. Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. Maximum PCB trace length cannot exceed 150mm outside of module, the shorter trace and more better. In Root Complex Mode, the module is configured to act as a PCIe RC device. The following figure shows a reference circuit of PCIe RC mode. Figure 16: PCIe interface reference circuit (RC Mode) In Endpoint Mode, the module is configured to act as a PCIe EP device. The following figure shows a reference circuit of PCIe EP mode www.simcom.com 37 / 85 ModuleWLAN device100nFPCIe_REFCLK_MPCIe_REFCLK_PPCIe_RXMPCIe_RXPPCIe_CLKMPCIe_CLKPPCIe_WAKEPCIe_RSTPCIe_CLKREQPCIe_TX_MPCIe_TX_PPCIe_RX_MPCIe_RX_PPCIe_TXMPCIe_TXP100nF100nF100nFPCIe_RSTPCIe_WAKEPCIe_CLKREQVDD_EXT100K100K100KClose to Wlan SIM7912&SIM7906 Hardware Design V1.02 Figure 17: PCIe interface reference circuit (EP) NOTE 1. USB is required because PCIe does not support features such as firmware upgrade, GNSS NMEA output and software debugging. Firmware upgrade must be over USB 2.0, while GNSS NMEA output and software debugging can be over USB 2.0/3.0 (USB 2.0 is recommended) 2. All the PCIe level of module is 1.8V. If it communicates with the 3.3V serial port level, a level conversion chip needs to be added in the middle. 3. The Endpoint mode of PCIe is under the development. 3.7 SDIO Interface Module provides one SDIO interface which supports SD 3.0 protocol and eMMC*. The following table shows the pin definition. Table 17: Definition of SDIO interface Pin name Pin no. I/O Functional description Comment www.simcom.com 38 / 85 ModuleHOST100nFPCIe_REFCLK_MPCIe_REFCLK_PPCIe_RXMPCIe_RXPPCIe_CLKMPCIe_CLKPPCIe_WAKEPCIe_RSTPCIe_CLKREQPCIe_TX_MPCIe_TX_PPCIe_RX_MPCIe_RX_PPCIe_TXMPCIe_TXP100nF100nF100nFPCIe_RSTPCIe_WAKEPCIe_CLKREQVDD_EXT100K100K100KClose to APUSB_DPUSB_DMUSB_DPUSB_DM0R0R SD_VDD 46 PO SIM7912&SIM7906 Hardware Design V1.02 SD card application: SDIO pull up power source. eMMC application: Keep it open when used for eMMC. 1.8V/3.0V configurable output. Cannot be used for SD card power supply. SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 SD_CMD SD_CLK SD_DET 49 50 47 48 51 53 52 DIO SDIO data signal (bit 0) DIO SDIO data signal (bit 1) DIO SDIO data signal (bit 2) DIO SDIO data signal (bit 3) DIO SDIO command signal DO SDIO clock signal DI SD card insertion detection The following figure shows the SD card reference circuit. Required 50 impedance If unused, keep it open. 1.8V power domain. If unused, keep it open. Figure 18: SD card reference circuit NOTE 1. The voltage range of SD power supply is 2.7V~3.6V and a sufficient current up to 0.8A should be provided. As the maximum output current of SD_VDD is 50mA which can only be used for SDIO pull-up resistors, an external power supply is needed for SD card. 2. The load capacitance of SDIO bus needs to be less than 5pF. 3. If eMMC function is required, SD_DET need to be pull-down to GND. SDIO interface layout guidelines:
www.simcom.com 39 / 85 SD_VDDSD_DATA3SD_DATA2SD_DATA1SD_DATA0SD_CLKSD_CMDSD_DETVDDSD_DATA3SD_DATA2SD_DATA1SD_DATA0SD_CLKSD_CMDSD_DETModuleSD Card33RClose to module100k100k100k100k100k470kVDD_EXT100nF100uF33pFVDD_2.85V<5pF SIM7912&SIM7906 Hardware Design V1.02 Require trace impedance is 36 to 50. CLK to DATA/CMD length mismatch is less than 0.5mm. 3035 termination resistance on clock net and placed close to the module. Gap from other signals keeps 1.5xline width. Gap lane-to-lane 1.5xline width. Bus capacitance load is less than 5pF. Trace routes away from other sensitive signals. Maximum PCB trace length cannot exceed 30mm out of the module for 104Mbps data rate, the shorter trace and more better. Maximum PCB trace length cannot exceed 100mm out of the module for 50Mbps data rate, the shorter trace and more better. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 100mm. The total trace length inside the module is 25mm, so the exterior total trace length should be less than 75mm. 3.8 SIM Interface Module supports two SIM cards but single standby. SIM1 and SIM2 are dual-voltage 1.8 V or 3.0 V interfaces. Table 18: Definition of SIM interface Pin name Pin no. I/O Functional description Comment SIM1_VDD 26 PO Power supply for SIM1 card SIM1_DATA 29 DIO SIM1 card data signal, which has been pulled up to SIM1_VDD by a 20K resistor internally SIM1_CLK SIM1_RST 27 28 DO DO SIM1 clock signal SIM1 reset signal SIM1_DET 25 DI SIM1 card detect signal, which need pulled up to VDD_EXT by a 470K resistor externally 1.8/3.0V voltage domain, SIM interface should be protected against ESD. SIM2_VDD 74 PO Power supply for SIM2 card SIM2_DATA 77 DIO SIM2 card data, which has been pulled up to SIM2_VDD by a 20K resistor internally If unused, please keep open SIM2_CLK SIM2_RST 80 79 DO DO SIM2 clock signal SIM2 reset signal SIM2_DET 78 DI SIM2 card detect, which need pulled up to VDD_EXT by a 470KR resistor externally Table 19: SIM electronic characteristics in 1.8V mode (SIM_PWR=1.8V) www.simcom.com 40 / 85 Symbol Parameter SIM_VDD Power supply for SIM card VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage 1.44 Low-level output voltage 0 Min. 1.65 1.26 0 SIM7912&SIM7906 Hardware Design V1.02 Typ. Max. Unit 1.8
1.95 1.95 0.36 1.8 0.4 V V V V V Table 20: SIM electronic characteristics 3.0V mode (SIM_PWR=3.0V) Symbol Parameter Min. Typ. Max. Unit SIM_VDD Power supply for SIM card VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage 2.7 2.1 0 2.4 0 3.0
3.05 3.05 0.6 3.0 0.4 V V V V V The module supports SIM card hot-swap function through the SIM_DET pin, which is a level trigger pin. The SIM_DET pin requires pull up externally. The following figure shows SIM card reference circuit. Figure 19: SIM interface reference circuit After inserting SIM card, the SIM_DET pin will change from low to high level. The rising edge will indicate that the SIM card has been inserted. After removing the SIM card, the SIM_DET pin will change from high to low level. This falling edge will indicate the removal of the SIM card. Using AT+UIMHOTSWAPON=0 or 1 and AT+UIMHOTSWAPLEVEL=0 or 1AT command to set module SIM card hot swap function enable and SIM card detection level, for more details, please refer to SIM7912&SIM7906 Series AT Command Manual document. www.simcom.com 41 / 85 TVS(U)SIM_VDD(U)SIM_CLK(U)SIM_DATA(U)SIM_RST0220nF(U)SIM SocketMUP-C792-300(NC)100(U)SIM_DET33pFGND1GND1CD1CD1Module(NC)(NC)(NC)VCCRSTCLKGNDVPPI/OVDD_EXT470K Using AT+SMSIMCFG=1,1 and AT+SMSIMCFG=1,2 AT command to switch SIM1 and SIM2 function, for more details, please refer to Document [1] in the appendix. SIM7912&SIM7906 Hardware Design V1.02 The following table shows recommended TVS of ESD protect and SIM socket. Table 21: Recommended TVS and SIM socket list Name TVS SIM socket Manufacturer ST MUP Model ESDA6V1-5W6 MUP-C792-3 If the SIM card hot-swap function is not used, customers should keep the SIM_DET pin open. NOTE 1. The recommended SIM socket is normal close, which makes SIM_DET is active high. If the active low of SIM_DET is required, SIM socket should be normal open. 2. AT command AT+UIMHOTSWAPLEVEL could change the SIM_DET detection level and the default value is 1, which is active high, for more details, please refer to Document [1] in the appendix. The SIM card layout guidelines:
Make sure that the SIM card socket should be far away from the antennas. SIM traces should be away from RF, VBAT and high-speed signals. The traces should be as short as possible. Keep SIM sockets GND pins directly connect to the main ground. Shielding the SIM card signals by ground. Recommended to place a 33pF1uF capacitor on SIM_VDD net and place close to the holder. The rise/fall time of SIM_CLK should not exceed 40ns. The parasitic capacitance of TVS should not exceed 60pF, and the TVS should be placed close to the SIM socket. 3.9 PCM and I2S Interface Module supports one I2S/PCM interface for external codec, which meets the requirements in the Phillips I2S bus specification. The PCM interface is multiplexing with I2S interface. The default audio interface of the module is I2S. Table 22: The PCM interface is multiplexing with I2S interface www.simcom.com 42 / 85 Pin name Pin no. I/O Functional description Comment SIM7912&SIM7906 Hardware Design V1.02 1.8V power domain. If unused, please keep open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. Provide a digital clock output for an external audio codec. If unused, keep it open. PCM_OUT 68 DO PCM_IN 66 DI PCM data output. It can also be multiplexed as I2S_D1. PCM data input. It can also be multiplexed as I2S_D0. PCM_CLK 67 DO PCM data clock. It can also be multiplexed as I2S_CLK. PCM_SYNC 65 DIO PCM data frame synchronization signal. It can also be multiplexed as I2S_WS. I2S_MCLK 152 DO Clock output Table 23: PCM / I2S format Characteristics Specification Line interface format Data length Linear(fixed) 16bits(fixed) I2S flock/sync source Master mode(fixed) I2S clock rate I2S MCLK rate Data ordering NOTE 1.536 MHz (default) 12.288MHz (default) MSB For more details about PCM/I2S AT commands, please refer to Document [1] in the appendix. 3.9.1 I2S Timing The module supports I2S sampling rate of 48 KHz and 32bit coding signal (16bit length), the timing sequence is shown in the following figure. www.simcom.com 43 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 24: I2S timing parameters Figure 20: I2S timing Signal Parameter Description Min. Typ. Max. Unit Frequency Frequency 12.288 12.288 MHz I2S_MCLK I2S_CLK I2S_WS T t(HC) t(LC) t(sr) t(hr) t(dtr) t(htr) T t(HC) t(LC) Clock period Clock high Clock low Frequency Frequency 81.380 81.380 0.45T 0.45T 0.55T 0.55T
0.45T 0.45T 16.276 Clock period Clock high Clock low DIN/DOUT and WS input setup time DIN/DOUT and WS input hold time 0 DIN/DOUT and WS output delay DIN/DOUT and WS output hold time 0 1.536 651.04
0.55T 0.55T 65.10 ns ns ns MHz ns ns ns ns ns ns ns 3.9.2 I2S Reference Circuit The following figure shows the external codec reference design. Figure 21: Audio codec reference circuit www.simcom.com 44 / 85 I2S_MCLK22pF(NC)ADCDAT1LRCK1BCLK1DACDAT1MCLKSCLSDAIN 1PMICBIAS1LOUTR/NMICNAU88102.2K2.2uFI2C1_SCLI2C1_SDAI2S_RXI2S_TXI2S_WAI2S_CLKMoudle22pF(NC)22pF(NC)22pF(NC)22pF(NC)LOUTL/P0R0R33pFSpeaker33pFLESD8LH5.0CT5GLESD8LH5.0CT5G1uF1uF1.8V1.8V3.3V1.8VAVDDCPVDDDBVDDMICVDDDCVDD1.2VDACREF1.8VVDD_EXT2.2K2.2K SIM7912&SIM7906 Hardware Design V1.02 Audio layout guidelines Analog input:
0.2mm trace widths; 0.2mm spacing between traces. Pseudo differential route for MIC. Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high-speed signals. Analog output:
Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other digital signals with fast transients. Speaker output signal route as differential pair with 0.5mm trace widths. 3.10 I2C Interface Module supports one I2C interfaces, meet I2C specification version 5.0, and data rate up to 400 Kbps. The following figure shows the I2C bus reference circuit. Figure 22: I2C reference circuit Table 25: Definition of I2C interface Pin name Pin no. I/O Functional description Comment I2C_SCL I2C_SDA 43 42 OD I2C serial clock OD I2C serial data I2C default use for codec Pull up to VDD_EXT externally If unused, keep it open. www.simcom.com 45 / 85 ModuleI2C_SDAI2C deviceSDAGNDGNDI2C_SCLSCLVDD_EXT2.2K2.2K SIM7912&SIM7906 Hardware Design V1.02 NOTE 1. SDA and SCL need to pull up to VDD_EXT by a 2.2K resistor externally. 2. For more details about AT commands please refer to Document [1] in the appendix. 3.11 UART Interface The module provides three UART interfaces: main UART interface, debug UART interface, and BT UART interface. Features of these interfaces are shown as below:
Main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps
(default), 230400bps, 460800bps, 921600bps and up to 4M bps baud rates. This interface is used for data transmission and AT command communication. Debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. BT UART interface supports 115200bps baud rate. It is used for BT communication and can be multiplexed into SPI interface*. Table 26: Definition of UART interface Pin name Pin no. I/O Functional description Comment CTS RTS TXD RXD DCD RI DTR DBG _TXD DBG _RXD BT_CTS BT_ RTS BT_ TXD BT_ RXD BT_EN 56 57 60 58 59 61 62 137 136 164 166 163 165 3 DO Clear to send DI Request to send DO Transmit data DI Receive data DO Carrier detect DO Ring indicator DI Data terminal ready sleep mode control DO Transmit data DI Receive data DO Clear to send DI Request to send DO Transmit data DI Receive data DO BT function enable control 1.8V power domain Default use for AT command. 1.8V power domain. Used for debug only. Default use for BT 1.8V power domain If unused, keep it open. All the UART level of module is 1.8V. If it communicates with the 3.3V serial port level, a level conversion www.simcom.com 46 / 85 chip needs to be added in the middle. It is recommended to use TIs TXS0104EPWR level shift, the reference circuit is as follows. SIM7912&SIM7906 Hardware Design V1.02 Figure 23: UART level conversion circuit The following level shifting circuits can also be used:
Figure 24: UART TX level conversion circuit Figure 25: UART RX level conversion circuit www.simcom.com 47 / 85 VCCATXS0104EPWR100pFOEA1A2A3A4VCCBGNDB1B2B3B4VDD_1V8UART_CTSUART_RTSUART_TXDUART_RXD100pFVDD_3V3UART_CTS_3V3UART_RTS_3V3UART_TXD_3V3UART_RXD_3.3VVDD_1V84.7K47KTXD4.7KModuleVDD_EXTRXDVDDDTEVDD_1V84.7K47K4.7KDTERXDModuleVDD_1V8TXDVDD 3.12 SPI Interface SIM7912&SIM7906 Hardware Design V1.02 Module provides one SPI interface multiplexed from BT UART interface. The interface only supports master mode with a maximum clock frequency up to 50MHz. The following table shows the pin definition of SPI interface. Table 27: Definition of SPI interface Pin name Pin no. I/O Functional description Comment BT_CTS BT_ RTS BT_ TXD BT_ RXD 164 166 163 165 DO Can be multiplexed into SPI_CLK. DI Can be multiplexed into SPI_CS. DO Can be multiplexed into SPI_MOSI. DI Can be multiplexed into SPI_MISO. 1.8V power domain The following figure shows the reference circuit of SPI interface. Figure 26: SPI reference circuit 3.13 ADC Interface Module supports two 15bits ADC interfaces. Its performance parameters are shown as follow:
Table 28: Definition of ADC interface Pin name Pin no. I/O Functional description Comment ADC0 173 AI Input Voltage Range:
0~1.875V General purpose analog to digital converter interface. www.simcom.com 48 / 85 ModuleSPI_MOSISPI deviceDICLKSPI_CLKSPI_MISOCSVDD_EXT10KSPI_CS_NDO ADC1 175 AI Input Voltage Range:
0~1.875V SIM7912&SIM7906 Hardware Design V1.02 If unused, keep it open. General purpose analog to digital converter interface If unused, keep it open. NOTE 1. The input voltage of ADC should not exceed 1.875V 2. It is prohibited to supply any voltage to ADC pins when VBAT is removed. 3. It is recommended to use resistor divider circuit for ADC application. 3.14 GPIOs Interface The follow pins of module can be used as GPIO function, if the customer does not use the default functions. In addition, these pins support alternate function by software configure according to the customers requirements. Table 29: GPIO list Pin name Pin no. I/O Functional description Comment GPIO_1 GPIO_2 GPIO_3 GPIO_4 GPIO_5 138 139 159 161 172 IO IO IO IO IO General purpose input/output ports. These four GPIOs can also be multiplexed into a group of PCM or I2S for BT. General purpose input/output ports. This GPIO can also be multiplexed into 1PPS for GNSS. 1.8V power domain. If unused, keep it open. 3.15 Network Status Indication The network indication pins can be used to drive network status indication LEDs. The following tables describe pin definition and logic level changes in different network status. Table 30: Definition of network indication pins www.simcom.com 49 / 85 SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin no. I/O Functional description Comment NET_STATU S 170 NET_MODE 147 DO DO Indicate the modules network activity status. Indicate the modules network registration mode. 1.8V power domain. If unused, keep it open 1.8V power domain. If unused, keep it open The timing parameters are shown in the following table. Table 31: NET_STATUS pin status Pin Name Status NET_MODE Always High Always Low Description Registered on network Others NET_STATUS Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 27: Network Indicator reference circuit 3.16 Status Indication The STATUS pin is set as the module status indicator. It outputs high level voltage when the module is turned on. www.simcom.com 50 / 85 Module1KVBATNetworkIndicator4.7K The following table describes pin definition of STATUS. SIM7912&SIM7906 Hardware Design V1.02 Figure 28: Reference Circuits of STATUS 3.17 Flight Mode Control The W_DISABLE pin can be used to control module to enter or exit the flight mode. In flight mode, the RF circuit is closed to prevent interference with other equipments and minimize current consumption. Its reference circuit is shown in the following figure. Figure 29: W_DISABLE# pin reference circuit Table 32: Definition of W_DISABLE pin Pin name Pin no. I/O Functional description Comment W_DISABLE
151 DI Flight mode control input active low www.simcom.com 51 / 85 Module1KVBATSTATUS4.7KModuleVDD_EXT10KHOSTW_DISABLE SIM7912&SIM7906 Hardware Design V1.02 Table 33: W_DISABLE pin status W_DISABLE pin status Module operation Input low level Flight mode: RF is disabled Input high level AT+CFUN=4: Flight mode AT+CFUN=1: RF is enabled (Default) 3.18 USB_BOOT Interface Module provides a USB_BOOT pin. Pulling up USB_BOOT to VDD_EXT before power-on will make the module enter emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 34: Pin Definition of USB_BOOT Interface Pin name Pin no. I/O Functional description Comment USB_BOOT 140 DI Force the module into emergency download mode 1.8V power domain. Active high. If unused, keep it open. The following figure shows a reference circuit of USB_BOOT. Figure 30: Reference Circuit of USB_BOOT 3.19 Antenna Tuner Control Interface*
The module supports external antenna tuner control through either RFFE interface or dedicated GPIO interfaces. Customers can choose either one according to their tuner design. The following are the pin definitions of the RFFE and dedicated GPIO interfaces. www.simcom.com 52 / 85 ModuleVDD_EXTUSB_BOOT10K Close to module Test points SIM7912&SIM7906 Hardware Design V1.02 Table 35: PIN Definition of RFFE Interface for Antenna Tuner Control Pin name Pin no. I/O Functional description Comment RFFE_CLK 71 DO RFFE_DATA 73 DIO RFFE serial interface for external tuner control. 1.8V voltage domain. If unused, please keep open VDD_RF 162 PO Provide 2.85V for external RF circuit. NOTE 1. * means under development, for details please contact SIMCom support teams. www.simcom.com 53 / 85 SIM7912&SIM7906 Hardware Design V1.02 4 Antenna Interfaces Module provides five antennas for 3G/4G and GNSS. The antenna ports have an RF impedance of 50. 4.1 Antenna Definitions For detailed designs about antenna, please refer to the antenna design guide Document [14]
SIM7912&SIM7906_LGA Antenna Port Mapping and Design Guide in the appendix. Table 36: Antenna port definitions FUNCTIONS 3G/4G LB/MHB TRX 3G/4G LB/MHB DIV DL-MIMO1
(B1/B3/B7/B38/B41/43/48/46 for SIM7912E)
(B2/B4/B25/B66/B7/B41/43/4 8/46 For SIM7912A) DL-MIMO2
(B1/B3/B7/B38/B41/43/48/46 for SIM7912E)
(B2/B4/B25/B66/B7/B41/43/4 8/46 For SIM7912A) GNSS NOTE ANT_MAI N ANT_DI V ANT_MIM O1 ANT_MIM O2 ANT_GNS S
1. ANT_MIMO1 and ANT_MIMO2 are optional for SIM7906E and SIM7906A. 4.1.1 3G/4G Operating Frequency Table 37: SIM7912 operating frequencies Frequency Uplink (UL) Downlink (DL) Duplex www.simcom.com 54 / 85 band WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B32 LTE B34 LTE B38 LTE B39 LTE B40 LTE B41 LTE B43 LTE B48 LTE B66 LTE B71 SIM7912&SIM7906 Hardware Design V1.02 mode 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz 1850 MHz ~1910 MHz 1930 MHz ~ 1990 MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755 MHz 2110 MHz ~ 2155 MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz 1850 MHz ~ 1910MHz 1930 MHz ~ 1990MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755MHz 2110 MHz ~ 2155MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 2500 MHz ~ 2570MHz 2620 MHz ~ 2690MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 698 MHz ~ 716MHz 728 MHz ~ 746MHz 777 MHz ~787MHz 746 MHz ~ 756MHz 788 MHz ~ 798MHz 758 MHz ~ 768MHz 704 MHz ~ 716MHz 734 MHz ~ 746MHz 815 MHz ~ 830MHz 860 MHz ~ 875MHz 830 MHz ~ 845MHz 875 MHz ~ 890MHz 832 MHz ~ 862MHz 791 MHz ~ 821MHz 1850 MHz ~ 1915MHz 1930 MHz ~ 1995MHz 814 MHz ~849MHz 859 MHz ~ 894MHz 703 MHz ~ 748MHz 758 MHz ~ 803MHz
1452 MHz ~ 1496MHz 2010 MHz ~ 2025MHz 2010 MHz ~ 2025MHz 2570 MHz ~ 2620 MHz 2570 MHz ~ 2620 MHz 1880 MHz ~ 1920MHz 1880 MHz ~ 1920MHz 2300 MHz ~ 2400 MHz 2300 MHz ~ 2400 MHz 2496 MHz ~ 2690 MHz 2496 MHz ~ 2690 MHz 3600MHz ~ 3800MHz 3600 MHz ~ 3800MHz 3550 MHz ~ 3700MHz 3550 MHz ~ 3700MHz 1710 MHz ~ 1780MHz 2110 MHz ~ 2180MHz 663 MHz ~ 698MHz 617MHz ~ 652MHz FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD TDD TDD FDD FDD Table 38: SIM7906 operating frequencies Frequency band WCDMA B1 Uplink (UL) Downlink (DL) 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz Duplex mode FDD www.simcom.com 55 / 85 SIM7912&SIM7906 Hardware Design V1.02 1850 MHz ~1910 MHz 1930 MHz ~ 1990 MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755 MHz 2110 MHz ~ 2155 MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz 1850 MHz ~ 1910MHz 1930 MHz ~ 1990MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755MHz 2110 MHz ~ 2155MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 2500 MHz ~ 2570MHz 2620 MHz ~ 2690MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 698 MHz ~ 716MHz 728 MHz ~ 746MHz 777 MHz ~787MHz 746 MHz ~ 756MHz 788 MHz ~ 798MHz 758 MHz ~ 768MHz 704 MHz ~ 716MHz 734 MHz ~ 746MHz 815 MHz ~ 830MHz 860 MHz ~ 875MHz 830 MHz ~ 845MHz 875 MHz ~ 890MHz 832 MHz ~ 862MHz 791 MHz ~ 821MHz 1850 MHz ~ 1915MHz 1930 MHz ~ 1995MHz 814 MHz ~849MHz 859 MHz ~ 894MHz 703 MHz ~ 748MHz 758 MHz ~ 803MHz
1452 MHz ~ 1496MHz 2010 MHz ~ 2025MHz 2010 MHz ~ 2025MHz 2570 MHz ~ 2620 MHz 2570 MHz ~ 2620 MHz 1880 MHz ~ 1920MHz 1880 MHz ~ 1920MHz 2300 MHz ~ 2400 MHz 2300 MHz ~ 2400 MHz 2496 MHz ~ 2690 MHz 2496 MHz ~ 2690 MHz 3600MHz ~ 3800MHz 3600 MHz ~ 3800MHz 3550 MHz ~ 3700MHz 3550 MHz ~ 3700MHz 1710 MHz ~ 1780MHz 2110 MHz ~ 2180MHz 663 MHz ~ 698MHz 617MHz ~ 652MHz FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD TDD TDD FDD FDD WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B32 LTE B34 LTE B38 LTE B39 LTE B40 LTE B41 LTE B43 LTE B48 LTE B66 LTE B71 NOTE 2. LTE-FDD B32 support Rx only and are only for secondary component carrier. www.simcom.com 56 / 85 4.1.2 GNSS Frequency The following table shows frequency specification of GNSS antenna interface. SIM7912&SIM7906 Hardware Design V1.02 Table 39: GNSS frequency Type GPS L1/Galileo/QZSS GPS L5 GLONASS BeiDou/Compass 4.2 Antenna Installation 4.2.1 PCB Layout Guidelines Frequecy 1575.421.023MHz 1176.4510.23MHz 1597.5~1605.8MHz 1561.0982.046MHz To avoid interference, minimalize the insertion loss of the RF trace, the PCB should follow below rules:
(1) The coaxial cable PCB pads, RF antenna connector and other connectors which used to test contact performance of module should place as close as to the module antenna pads.
(2) The antenna matching network should place to antenna feed port.
(3) The RF trace should be as short and straight as possible, and do not routing as perpendicular line, we recommend do it as 45 corner trace.
(4) And the RF trace ground should be complete;
(5) RF device should place ground to the nearest ground plane;
(6) Between RF trace and below should avoid other signal trace or parallel trace to the RF signal.
(7) Recommend to more ground vias near the RF traces. 4.2.2 Antenna Tuner When end device needs to support 700MHz low frequency(B12\B13\B28), it is recommended to add anten na tuner to improve RF performance. Antenna tuner contains antenna aperture tuner, antenna impedance tuner and hybrid tuner of the two. Aperture tuner optimizes the total antenna efficiency from the free space of the antenna terminal, and can optimize antenna efficiency across multiple frequency bands. Impedance tuner adjusts the mismatch between the RF front end and the antenna to achieve maximum transmission power. Hybrid tuner combines the advantages of both to maximize antenna RF performance. Customers c an choose according to specific needs, according to the recommendations from the antenna vendor. www.simcom.com 57 / 85 SIM7912&SIM7906 Hardware Design V1.02 Figure 31: Aperture tuner reference block diagram Figure 32: Impedance tuner reference block diagram www.simcom.com 58 / 85 tuner3G/4G MODULERFFE MIPIANT CONTRLORFEEDANTtuner3G/4G MODULERFFE MIPIANT CONTRLORFEEDANT SIM7912&SIM7906 Hardware Design V1.02 Figure 33: Hybrid tuner reference block diagram The antenna control Tuner mipi interface of different package modules is as follows. Figure 34: M.2 package Tuner mipi interface www.simcom.com 59 / 85 tuner3G/4G MODULERFFE MIPIANT CONTRLORFEEDANTtuner SIM7912&SIM7906 Hardware Design V1.02 Figure 35: LGA package Tuner mipi interface NOTE 1. When multiple Tuners are needed, pay attention to the distinction of the same device USID under the same group of mipi;
2. For details please refer to the Antenna Tuner Reference Design document and contact SIMCom support teams. 4.2.3 Antenna Requirements The following table shows the requirements on 3G/4G antennas and GNSS antenna. Table 40: 3G/4G/GNSS antennas Parameter Requirement Operating Frequency Direction Gain Impedance Efficiency Max. Input Power VSWR Isolation See Table 37: SIM7912 operating frequencies for each antenna Omni Directional
> -3dBi (Avg) 50
> 50 %
50W
< 2 20dB is preferred Cable Insertion Loss <1GHz Cable Insertion Loss 1GHz~2.2GHz Cable Insertion Loss 2.3GHz~2.7GHz Cable Insertion Loss 3.3GHz~6GHz
<1dB
<1.5dB
<2dB
<2.5dB www.simcom.com 60 / 85 Table 41: GNSS antenna (for dedicated GNSS antenna only)*
SIM7912&SIM7906 Hardware Design V1.02 Parameter Operating Frequency Direction Antenna Gain Impedance Efficiency Max. Input Power VSWR Polarization Noise Figure for Active Antenna Total Gain for Active Antenna Cable Insertion Loss NOTE Requirement L1: 1559~1609MHZ L5: 1166~1187MHz Hemisphere, face to sky
> 2 dBic 50
> 50 %
50W
< 2 RHCP or Linear
< 1.5
< 17 dB
<1.5dB
*: These recommendations are for dedicated GNSS antenna which the application need best of class GNSS tracking performance. www.simcom.com 61 / 85 SIM7912&SIM7906 Hardware Design V1.02 5 Electrical Specifications 5.1 Absolute Maximum Ratings Absolute maximum rating for digital and analog pins of module are listed in the following table:
Table 42: Absolute maximum ratings Parameter Voltage at VBAT1 pins Voltage at USB_VBUS Voltage at PWRKEY Voltage at RESIN_N Voltage at digital pins (GPIO, I2C, UART, I2S) Voltage at digital pins SIM Min. Typ. Max. Unit
4.7 5.5 2.1 1.9 2.1 3.05 V V V V V V NOTE 1. The VBAT include VBAT_BB and VBAT_RF pins. 5.2 Operating Conditions Table 43: VBAT recommended operating ratings Parameter Voltage at VBAT1 pins USB_VBUS NOTE Min. 3.3 3.3 Typ. 3.8 5.0 Max. Unit 4.3 5.25 V V 1. The VBAT include VBAT_BB and VBAT_RF pins. www.simcom.com 62 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 44: 1.8V digital I/O characteristics Parameter Description Min. Typ. Max. Unit High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage VIH VIL VOH VOL NOTE 1.17 0 1.35 0
2.1 0.63 1.8 0.45 V V V V These parameters are for digital interface pins, such as UART, I2C, I2S, SPI, and GPIOs (SIM_DET, SD_DET). Table 45: Operating temperature Parameter Normal operation temperature (3GPP compliant) Extended operation temperature Storage temperature Min.
-30
-40
-40 Typ.
+25
Max. Unit
+75
+85
+90 5.3 Operating Mode 5.3.1 Operating Mode Definition The table below summarizes the various operating modes of module. Table 46: Operating mode definition Mode Function Normal operation Sleep AT command AT+CSCLK=1 can be used to set the module to a sleep mode. In this case, the current consumption of module will be reduced to a very low level and the module can still receive paging message and SMS. Idle Software is active. Module is registered to the network and ready to www.simcom.com 63 / 85 SIM7912&SIM7906 Hardware Design V1.02 communicate. Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences and antenna. Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level);
uplink/downlink data rates, etc. AT command AT+CFUN=0 can be used to set the Module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the Module will not work and the SIM card will not be accessible, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. AT command AT+CFUN=4 or pulling down the W_disable1# pin can be used to set the Module to flight mode without removing the power supply. In this mode, the RF part of the Module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. Normally module will go into power off mode by sending the AT command AT+CPOF or pull down the FUL_CARD_POWER_OFF#
pin. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible. Talk Standby Data transmission Minimum functionality mode Flight mode Power off 5.3.2 Sleep Mode In sleep mode, the current consumption of module will be reduced to a very low level. Several hardware and software conditions must be satisfied in order to let module enter into sleep mode:
UART condition USB condition Software condition NOTE Before designing, pay attention to how to realize sleeping/waking function. www.simcom.com 64 / 85 SIM7912&SIM7906 Hardware Design V1.02 5.3.3 Minimum Functionality Mode and Flight Mode Minimum functionality mode ceases a majority function of Module, in order to minimizing the power consumption. This mode is set by the AT command which provides a choice of 3 different functionality levels. AT+CFUN=0: Minimum functionality AT+CFUN=1: Full functionality (Default) AT+CFUN=4: Flight mode If module has been set to minimum functionality mode, the RF SIM card function will be closed while the serial port and USB are still available. If module has been set to flight mode, the RF function will be closed, while the SIM card, the serial port and USB are still available. When module is in minimum functionality or flight mode, it can return to full functionality by the AT command AT+CFUN=1. 5.4 Current Consumption The current consumptions are listed in the follows table. Table 47: Current consumption on VBAT pins (VBAT=3.8V) Description Power off mode GNSS mode Sleep mode
(GNSS off, without connection USB) Condition. Power off DPO WCDMA(AT+CFUN=0) WCDMA DRX=1.28s WCDMA DRX=2.56s LTE-FDD(AT+CFUN=0) LTE-FDD DRX=0.32s LTE-FDD DRX=0.64s LTE-FDD DRX=1.28s LTE-FDD DRX=2.56s LTE-TDD(AT+CFUN=0) LTE-TDD DRX=0.32s LTE-TDD DRX=0.64s LTE-TDD DRX=1.28s LTE-TDD DRX=2.56s Typical Unit 20 15 0.818 1.472 1.025 0.698 3.243 2.106 1.617 1.041 0.702 3.421 2.225 1.425 1.212 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle mode WCDMA 12.504 mA www.simcom.com 65 / 85
(GNSS off, without connection USB) LTE FDD LTE TDD 15.465 mA 9.25 mA SIM7912&SIM7906 Hardware Design V1.02 HSDPA data WCDMA B2 WCDMA B4 WCDMA B5 LTE data LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B25 LTE-FDD B26 LTE-TDD B41 LTE-FDD B48 LTE-FDD B66 LTE-TDD B71
@Power 22.30dBm Typical: 536 mA
@Power 22.28dBm Typical: 586 mA
@Power 23.05dBm Typical: 553 mA
@5MHz 21.31dBm Typical : 528 mA Typical : 547 mA
@10MHz 21.25dBm Typical : 546 mA
@20MHz 21.32dBm
@5MHz 23.12dBm Typical : 608 mA
@10MHz 23.19dBm Typical : 632 mA
@20MHz 22.81dBm Typical : 609 mA
@5MHz 22.81dBm Typical : 541 mA
@10MHz 22.98dBm Typical : 548 mA
@5MHz 22.38dBm Typical : 696 mA
@10MHz 22.95dBm Typical : 720 mA Typical : 785 mA
@20MHz 22.92dBm
@5MHz 22.07dBm Typical : 542 mA
@10MHz 22.09dBm Typical : 552 mA
@5MHz 22.70dBm Typical : 538 mA Typical : 522 mA
@10MHz 22.60dBm
@5MHz 22.89dBm Typical : 528 mA
@10MHz 23.05dBm Typical : 536 mA
@5MHz 22.54dBm Typical : 526 mA Typical : 531 mA
@10MHz 22.50dBm
@5MHz 23.89dBm Typical : 602 mA Typical : 645 mA
@10MHz 23.76dBm
@20MHz 23.78dBm Typical : 744 mA
@5MHz 22.96dBm Typical : 607 mA Typical : 598 mA
@10MHz 22.83dBm Typical : 711 mA
@5MHz 22.63dBm Typical : 720 mA
@10MHz 22.59dBm Typical : 714 mA
@20MHz 22.49dBm Typical : 683 mA
@5MHz 22.77dBm Typical : 688 mA
@10MHz 22.23dBm Typical : 676 mA
@20MHz 20.86dBm
@5MHz 22.43dBm Typical : 737 mA
@10MHz 22.39dBm Typical : 762 mA
@20MHz 22.23dBm Typical: 780 mA Typical : 524 mA
@5MHz 22.18dBm Typical : 520 mA
@10MHz 22.10dBm Typical : 517 mA
@20MHz 22.25dBm www.simcom.com 66 / 85 SIM7912&SIM7906 Hardware Design V1.02 NOTE 1. The VBAT include VBAT_BB and VBAT_RF pins. 2. The current consumption of Table 47: Current consumption on VBAT pins (VBAT=3.8V) based on SIM7912E and it is only for reference, please refer to actual current consumption. 5.5 RF Output Power The RF output power is shown in the following table. Table 48: Conducted output power Frequency WCDMA Bands LTE-FDD Bands LTE-TDD Bands Max 24dBm + 1/-3dB 23dBm + 2/-2dB 23dBm + 2/-2dB Min
< -50dBm
< -40dBm
< -40dBm www.simcom.com 67 / 85 SIM7912&SIM7906 Hardware Design V1.02 5.6 Conducted Receive Sensitivity Module conducted RF receiving sensitivity is fully meet 3GPP specification. Customers can get more details by check 3GPP official website http://www.3gpp.org/. 5.7 Thermal Design Make sure that the module can reach maximum work performance under extended temperature or extreme conditions for a long time, thermal dissipation design is very important. There are some design rules to enhance thermal dissipation performance:
Keep the module away from other heat sources such as battery, power, AP, etc. All the GND pins of the module should be connected. Add enough through GND via on the main PCB. Via material is very important solid copper and stacked via is better. Make sure maximize airflow around the module. Recommend use heat dissipation material connect to the customers device on the top side of the module to enhance the heat dissipation. Large heat dissipation area is better. Chose a high effective heat dissipation material is better such as heat pipe, graphite sheets. 5.8 ESD Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the customers main board, the ESD components should be placed closed to the connectors which human body may touch, such as SIM card socket, SD card socket, audio jacks, switches, USB interface, etc. The following table shows the module ESD measurement performance. Table 49: The ESD performance measurement table (temperature: 25, humidity: 45%) Part VBAT, GND Antenna Interfaces Other PADs NOTE Contact discharge(kV) Air discharge(kV) 4 4 2 8 8 4 Test conditions:
1. The external of the module has surge protection diodes and ESD protection diodes. www.simcom.com 68 / 85 2. The data in Table 49: The ESD performance measurement table (temperature: 25, humidity: 45%) were tested using SIMCom EVB. SIM7912&SIM7906 Hardware Design V1.02 www.simcom.com 69 / 85 SIM7912&SIM7906 Hardware Design V1.02 6 Manufacturing 6.1 Top and Bottom View of Module Figure 36: Top and bottom view of Module 6.2 Label Description Information T 2 D A A A B C E A F A Figure 37: Label description of module www.simcom.com 70 / 85 Table 50: Label description of module information SIM7912&SIM7906 Hardware Design V1.02 No. A B C D E F NOTE Description LOGO Project name Product code QR code Serial number International mobile equipment identity Figure 36: Top and bottom view of and Figure 37: Label description of module are the effect diagrams of the module, for reference only. Please refer to the actual product for appearance. www.simcom.com 71 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.3 Recommended PCB Footprint The following figure shows the PCB footprint of SIM7912&SIM7906. Figure 38: Recommended PCB footprint www.simcom.com 72 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.4 Recommended SMT Stencil The following figure shows the SMT stencil of SIM7912&SIM7906. Figure 39: Recommended SMT stencil www.simcom.com 73 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.5 Recommended SMT Reflow Profile The following figure shows the SMT reflow profile of SIM7912&SIM7906. Figure 40: Recommended SMT reflow profile NOTE Refer to Module secondary-SMT-UGD for more information about the module shipping and manufacturing. www.simcom.com 74 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.6 Moisture Sensitivity Level (MSL) Module is susceptible to damage induced by absorbed moisture and high temperature. A packages moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent MSL ratings are summarized in Table 51. Table 51: MSL ratings summary MSL Out-of-bag floor life 1 2 2a 3 4 5 5a 6 Unlimited 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. Comments
+30/85% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH The device samples are currently classified as MSL3 at 255 (+5, -0)C, following the latest IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature (255C) should not be confused with the peak temperature within the recommended solder reflow profile. 6.7 Baking Requirements It is necessary to bake modules if the prescribed time limit has been exceeded. The baking conditions are specified in Table 52. Note that if baking is required, the devices must be transferred into trays that can be baked to at least 125C. Table 52: Baking requirements Baking conditions options 40C5C, <5% RH 120C5C, <5% RH Duration 192 hours 4 hours www.simcom.com 75 / 85 SIM7912&SIM7906 Hardware Design V1.02 7 Packaging Module supports tray packaging. The packaging process is shown in the following figures. Figure 41: Packaging process Module tray drawing www.simcom.com 76 / 85 Figure 42: Module tray drawing SIM7912&SIM7906 Hardware Design V1.02 Table 53: Tray size Length3mm Width3mm 242.0 161.0 Number 8 Figure 43: Small carton drawing Table 54: Small carton size Length10mm Width10mm Height10mm Number 270 180 120 8*19-2=150 Big carton drawing Figure 44: Big carton drawing www.simcom.com 77 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 55: Big carton size Length10mm Width10mm Height10mm Number 380 280 280 150*4=600 www.simcom.com 78 / 85 SIM7912&SIM7906 Hardware Design V1.02 8 Appendix 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface Table 56: Coding schemes and maximum net data rates over air interface HSDPA device category Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 7 Category 8 Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19 Category 20 Category 21 Category 22 Category 23 1.2Mbps 1.2Mbps 1.8Mbps 1.8Mbps 3.6Mbps 3.6Mbps 7.2Mbps 7.2Mbps 10.2Mbps 14.4Mbps 0.9Mbps 1.8Mbps 17.6Mbps 21.1Mbps 23.4Mbps 28Mbps 23.4Mbps 28Mbps 35.5Mbps 42Mbps 23.4Mbps 28Mbps 35.5Mbps 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK QPSK QPSK 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 16QAM 64QAM Category 24 HSUPA device category 42.2Mbps Max data ratepeak 64QAM Modulation type Category 1 Category 2 Category 3 0.96Mbps 1.92Mbps 1.92Mbps QPSK QPSK QPSK www.simcom.com 79 / 85 SIM7912&SIM7906 Hardware Design V1.02 Category 4 Category 5 Category 6 LTE-FDD device category
(Downlink) 3.84Mbps 3.84Mbps 5.76Mbps QPSK QPSK QPSK Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 12 10Mbps 50Mbps 100Mbps 150Mbps 300Mbps 300Mbps 600Mbps QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM/25 6QAM LTE-FDD device category
(Uplink) Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 12 5Mbps 25Mbps 50Mbps 50Mbps 75Mbps 50Mbps 100 Mbps QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM/64QAM QPSK/16QAM QPSK/16QAM/64QAM www.simcom.com 80 / 85 SIM7912&SIM7906 Hardware Design V1.02 8.2 Related Documents Table 57: Related documents NO. Title Description
[1]
[2]
SIM7912&SIM7906 Series AT Command Manual ITU-T Draft new ecommendation.25ter
[3]
3GPP TS 51.010-1
[4]
3GPP TS 34.124
[5]
3GPP TS 34.121
[6]
3GPP TS 34.123-1
[7]
3GPP TS 34.123-3
[8]
EN 301 908-02 V2.2.1
[9]
EN 301 489-24 V1.2.1 AT Command Manual Serial asynchronous automatic dialing and control Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network;
Terminal conformance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3:
Abstract Test Suites. Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment
[10]
IEC/EN60950-1(2001) Safety of information technology equipment (2000)
[11]
3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification
[12] GCF-CC V3.23.1 Global Certification Forum Certification Criteria
[13]
2002/95/EC
[14]
SIM7912&SIM7906_LGA Antenna Port Mapping and Deign Guide Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(RoHS) Antenna design guidelines for diversity receiver system www.simcom.com 81 / 85 SIM7912&SIM7906 Hardware Design V1.02
[15]
SIM7912&SIM7906_CA COMBO list CA list for SIM7912 and SIM7906
[16] Antenna Tuner reference design Antenna tuning method and antenna tuning reference design example www.simcom.com 82 / 85 SIM7912&SIM7906 Hardware Design V1.02 8.3 Terms and Abbreviations Table 58: Terms and abbreviations Abbreviation Description ADC CS CTS DRX DTR DTX EFR EMC ESD FDD FR GNSS GPS HR I2C I2S IMEI LTE MDIO MMD MO MSB PCB PCIe RF RGMII SDIO SIM SMS SPI TDD TX UART VSWR SM Analog-to-Digital Converter Coding Scheme Clear to Send Discontinuous Reception Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electromagnetic Compatibility Electrostatic Discharge Frequency Division Dual Full Rate Global Navigation Satellite System Global Positioning System Half Rate Inter-Integrated Circuit Inter-IC Sound International Mobile Equipment Identity Long Term Evolution Management Data Input/Output MDIO manageable device Mobile Originated Most Significant Bit Printed Circuit Board Peripheral Component Interface Express Radio Frequency Reduced Gigabit Media Independent Interface Secure Digital Input and Output Subscriber Identification Module Short Message Service serial peripheral interface Time Division Dual Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio SIM phonebook www.simcom.com 83 / 85 SIM7912&SIM7906 Hardware Design V1.02 HSDPA HSUPA WCDMA SIM UMTS UART LB MHB UHB LAA TRX High Speed Downlink Packet Access High Speed Uplink Packet Access Wideband Code Division Multiple Access Universal subscriber identity module Universal mobile telecommunications system Universal asynchronous receiver transmitter Low Frequency Band Middle and High Frequency Band Ultra High Frequency Band Limited Access Authorization Transmit and Receive signal UL-MIMO DL-MIMO Uplink- Multiple Input Multiple Output Downlink- Multiple Input Multiple Output www.simcom.com 84 / 85 SIM7912&SIM7906 Hardware Design V1.02 8.4 Safety Caution Table 59: Safety caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. www.simcom.com 85 / 85 FCC Caution. 15.19 Labelling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the condition that this device does not cause harmful interference. 15.21 Information to user. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. Body-worn Operation This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withmini mum distance 20cm between the radiator & your body This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this Modular, including any applicable source-based time averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID:
2AJYU-8XM0001 or Contains FCC ID: 2AJYU-8XM0001 must be used.
1 2 3 4 5 | Attestation Statement | Attestation Statements | 294.33 KiB | July 12 2023 |
SIMCom Wireless Solutions Limited CERTIFICATIONS CONCERNING COVERED EQUIPMENT Date:2023-07-06 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID:2AJYU-8XM0001 To Whom It May Concern:
As required by section 2.911(d)(5)(i), [SIMCom Wireless Solutions Limited] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. As required by section 2.911(d)(5)(ii), [SIMCom Wireless Solutiarts Limited] (the applicant) certifies that, as of the date of the filing of the application, the applicant [is not]
identified on the Covered List as an entity producing covered equipment. Thank you for your attention to this matter. Sincerely yours, Signature wget Printed Name:Yongsheng Li Company:SIMCom Wireless Solutions Limited Job Title: manager Email:Yongsheng Li@simcom.com Telephone: +86 21 3252 3134
1 2 3 4 5 | Cover Letter | Cover Letter(s) | 104.56 KiB | July 12 2023 |
SIMCom Wireless Solutions Limited Date: 2023-7-10 To: Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Subject: Class II Permissive Change for FCC ID: 2AJYU-8XM0001, Grant date:
07/07/2023 (Model: SIM7912A) To whom it may concern This is to request a Class II permissive change to our product (Model: SIM7906A) The model SIM7912A had added the LTE Band 48. (FCC ID: 2AJYU-8XM0001, Grant date:
07/07/2023). The difference between SIM7912A and SIM7906A is that the category of SIM7912A is CAT12, with 3CA and 2CA, but the category of SIM7906A is CAT6, only 2CA. Their difference is achieved through software (NV setting). There is no hardware change in the product itself. So, the previous C2PC application report (For SIM7906A, FCC ID: 2AJYU-8XM0001, Grant date:
11/30/2022) still applies to the current C2PC. The report number is I22W00071-WCDMA+LTE-RF-
Rev1. Please contact me if you have any questions or need future information regarding this application. Regards, Signature Printed Name: Yongsheng Li Company: SIMCom Wireless Solutions Limited Job Title: manager Email: yongsheng.li@simcom.com Telephone: +86 2131575137
1 2 3 4 5 | FCC Request for Confidentiality | Cover Letter(s) | 203.75 KiB | July 12 2023 |
SIMCom Wireless Solutions Limited Request for Confidentiality Letter-FCC Date2023-06-29 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Re: Request for confidentiality FCC ID:2AJYU-8XM0001 To whom it may concern, We hereby respectfully request that under the provision of 47 CFR 0.459 and 0.457(d) the documents listed below and attached with this application for certification be provided with confidential status. Operational Description.pdf Any exhibit / information for which we have requested confidentiality, but which may not be accorded such treatment by the FCC, should be returned to us. The documents listed above contain trade secrets that are treated as confidential by us. Substantial competitive harm to us could result should they be made available to the public. Sincerely, Printed Name:Yongsheng Li Company:SIMCom Wireless Solutions Limited Job Title:manager Email:Yongsheng Li@simcom.com Telephone: +86 21 3252 3134
1 2 3 4 5 | Module Declaration | Cover Letter(s) | 113.39 KiB | July 12 2023 |
SIMCom Wireless Solutions Limited
[2023-07-06]
Dear Application Examiner:
[SIMCom Wireless Solutions Limited, SIM7906A, 2AJYU-8XM0001] is seeking modular approval. The radio meets the requirements for modular approval as detailed in FCC 15.212. Compliance to each of the requirements is described below:
1. 2. 3. 4. 5. 6. 7. 8. The modular transmitter must have its own RF shielding. The radio portion of the module is contained in its own RF shielding. The shielding is installed at the factory. Please see the Internal Photos exhibit. The modular transmitter must have buffered modulation/data inputs. The EUT has buffered data inputs to insure compliance with Part 15 requirements under conditions of excessive data rates or over-modulation. Please see the Schematics exhibit. The modular transmitter must have its own power supply regulation. The EUT has its own power supply regulation to insure compliance with Part 15 requirements regardless of the quality or level of external DC supplying the module from the host unit. Please see Schematics exhibit. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(c). Licensed products are not applicable. The modular transmitter must be tested in a stand-alone configuration. The EUT was tested in a stand-alone configuration. The module was greater than 10 cm from the host device. Please see test setup photos exhibit and technical report exhibit. The modular transmitter must be labeled with its own FCC ID number. The EUT is labeled with its own FCC ID number. Please see FCC ID label & location exhibit. If the FCC ID number will not be visible when the module is installed inside a host device, another label with the FCC ID will be applied to the exterior of the host device. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. The EUT is compliant with all applicable FCC rules. Detail instructions for maintaining compliance are given in the User Manual. The modular transmitter must comply with any applicable RF exposure requirements. The EUT is compliant with all applicable RF exposure requirements. Please see RF Exposure Exhibit. Please contact me if you have additional questions. Your attention to this matter is greatly appreciated. Best regards,
, Yongsheng Li and manage]
1 2 3 4 5 | Operational Description | Operational Description | 2.62 MiB | November 29 2022 / November 30 2022 |
SIM7912&SIM7906 Hardware Design LTE Module SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: 86-21-31575100 support@simcom.com www.simcom.com SIM7912&SIM7906 Hardware Design V1.02 Document Title:
Version:
Date:
Status:
GENERAL NOTES SIM7912&SIM7906 Hardware Design V1.03 2022-03-07 Released SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMERS POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMERS SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE. COPYRIGHT THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT, ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY TECHNICAL INFORMATION INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE AT ANY TIME. SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: +86 21 31575100 Email: simcom@simcom.com For more information, please visit:
https://www.simcom.com/download/list-863-en.html For technical support, or to report documentation errors, please visit:
https://www.simcom.com/ask/ or email to: support@simcom.com Copyright 2021 SIMCom Wireless Solutions Limited All Rights Reserved. www.simcom.com 2 / 85 SIM7912&SIM7906 Hardware Design V1.02 Version History Date Version Description of change 2021-07-30 V1.00 Initial release 2021-10-28 V1.01 Update SIM7906 module data Update the Power on and Reset data Update the current consumption data Update the ESD data Update the 209 pin definition 2021-12-06 V1.02 Update comment in PCIe 2022-03-07 V1.03 Exchanged LTE band B29&B30 to B28&B40 for SIM7912A&SIM7906A. Author Hongjun Tu Meng Zhang Wenke Gan Meng Zhang Wenke Gan Meng Zhang Wenke Gan www.simcom.com 3 / 85 SIM7912&SIM7906 Hardware Design V1.02 Contents 1 Introduction .......................................................................................................................................... 10 1.1 Product Outline .................................................................................................................................. 10 1.2 Hardware Block Diagram .................................................................................................................. 12 1.3 Feature Overview .............................................................................................................................. 12 2 Package Information ........................................................................................................................... 15 2.1 Pin Assignment Overview ................................................................................................................. 15 2.2 Pin Description .................................................................................................................................. 16 2.3 Mechanical Dimensions .................................................................................................................... 25 3 Interface Application ........................................................................................................................... 26 3.1 Power Supply .................................................................................................................................... 26 3.1.1 Power Supply Design Guide ....................................................................................................... 26 3.1.2 Recommended Power Supply Circuit ......................................................................................... 28 3.1.3 Voltage Monitor ........................................................................................................................... 29 3.2 Power On and Off Module ................................................................................................................. 29 3.2.1 Power On .................................................................................................................................... 29 3.2.2 Power Off .................................................................................................................................... 31 3.3 Reset Function .................................................................................................................................. 32 3.4 Output Power Management .............................................................................................................. 33 3.5 USB Interface .................................................................................................................................... 33 3.6 PCIe Interface.................................................................................................................................... 36 3.7 SDIO Interface ................................................................................................................................... 38 3.8 SIM Interface ..................................................................................................................................... 40 3.9 PCM and I2S Interface ...................................................................................................................... 42 I2S Timing ................................................................................................................................... 43 I2S Reference Circuit .................................................................................................................. 44 3.10 I2C Interface ................................................................................................................................... 45 3.11 UART Interface ............................................................................................................................... 46 3.12 SPI Interface ................................................................................................................................... 48 3.13 ADC Interface ................................................................................................................................. 48 3.14 GPIOs Interface .............................................................................................................................. 49 3.15 Network Status Indication ............................................................................................................... 49 3.16 Status Indication ............................................................................................................................. 50 3.17 Flight Mode Control ........................................................................................................................ 51 3.18 USB_BOOT Interface ..................................................................................................................... 52 3.19 Antenna Tuner Control Interface* .................................................................................................. 52 3.9.1 3.9.2 4 Antenna Interfaces .............................................................................................................................. 54 4.1 Antenna Definitions ........................................................................................................................... 54 4.1.1 3G/4G Operating Frequency....................................................................................................... 54 4.1.2 GNSS Frequency ........................................................................................................................ 57 4.2 Antenna Installation ........................................................................................................................... 57 www.simcom.com 4 / 85 SIM7912&SIM7906 Hardware Design V1.02 4.2.1 PCB Layout Guidelines ............................................................................................................... 57 4.2.2 Antenna Tuner ............................................................................................................................. 57 4.2.3 Antenna Requirements ............................................................................................................... 60 5 Electrical Specifications ..................................................................................................................... 62 5.1 Absolute Maximum Ratings .............................................................................................................. 62 5.2 Operating Conditions ......................................................................................................................... 62 5.3 Operating Mode ................................................................................................................................. 63 5.3.1 Operating Mode Definition .......................................................................................................... 63 5.3.2 Sleep Mode ................................................................................................................................. 64 5.3.3 Minimum Functionality Mode and Flight Mode ........................................................................... 65 5.4 Current Consumption ........................................................................................................................ 65 5.5 RF Output Power ............................................................................................................................... 67 5.6 Conducted Receive Sensitivity .......................................................................................................... 68 5.7 Thermal Design ................................................................................................................................. 68 5.8 ESD ................................................................................................................................................... 68 6 Manufacturing ...................................................................................................................................... 70 6.1 Top and Bottom View of SIM7912 ..................................................................................................... 70 6.2 Label Description Information ........................................................................................................... 70 6.3 Recommended PCB Footprint .......................................................................................................... 72 6.4 Recommended SMT Stencil .............................................................................................................. 73 6.5 Recommended SMT Reflow Profile .................................................................................................. 74 6.6 Moisture Sensitivity Level (MSL) ....................................................................................................... 75 6.7 Baking Requirements ........................................................................................................................ 75 7 8 Packaging ............................................................................................................................................. 76 Appendix ............................................................................................................................................... 79 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface ................................................. 79 8.2 Related Documents ........................................................................................................................... 81 8.3 Terms and Abbreviations ................................................................................................................... 83 8.4 Safety Caution ................................................................................................................................... 85 www.simcom.com 5 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table Index Table 1: SIM7912 frequency bands ......................................................................................................... 10 Table 2: SIM7906 frequency bands ......................................................................................................... 11 Table 3: Key features ............................................................................................................................... 12 Table 4: IO parameters definition ............................................................................................................ 16 Table 5: DC parameters definition ........................................................................................................... 16 Table 6: Pin description ........................................................................................................................... 17 Table 7: VBAT pins electronic characteristics ......................................................................................... 26 Table 8: Recommended TVS1 list ........................................................................................................... 27 Table 9: Definition of PWRKEY pin ......................................................................................................... 29 Table 10: Power on timing and electronic characteristic ......................................................................... 30 Table 11: Power off timing and electronic characteristic ......................................................................... 31 Table 12: Definition of RESET_N pin ...................................................................................................... 32 Table 13: RESET electronic characteristics ............................................................................................ 33 Table 14: Output power management summary ..................................................................................... 33 Table 15: Definition of USB interface....................................................................................................... 34 Table 16: Definition of PCIe interface ...................................................................................................... 36 Table 17: Definition of SDIO interface ..................................................................................................... 38 Table 18: Definition of SIM interface........................................................................................................ 40 Table 19: SIM electronic characteristics in 1.8V mode (SIM_PWR=1.8V) ............................................. 40 Table 20: SIM electronic characteristics 3.0V mode (SIM_PWR=3.0V) ................................................. 41 Table 21: Recommended TVS and SIM socket list ................................................................................. 42 Table 22: The PCM interface is multiplexing with I2S interface .............................................................. 42 Table 23: PCM / I2S format ..................................................................................................................... 43 Table 24: I2S timing parameters .............................................................................................................. 44 Table 25: Definition of I2C interface ........................................................................................................ 45 Table 26: Definition of UART interface .................................................................................................... 46 Table 27: Definition of SPI interface ........................................................................................................ 48 Table 28: Definition of ADC interface ...................................................................................................... 48 Table 29: GPIO list ................................................................................................................................... 49 Table 30: Definition of network indication pins ........................................................................................ 49 Table 31: NET_STATUS pin status.......................................................................................................... 50 Table 32: Definition of W_DISABLE pin .................................................................................................. 51 Table 33: W_DISABLE pin status ............................................................................................................ 52 Table 34: Pin Definition of USB_BOOT Interface .................................................................................... 52 Table 35: PIN Definition of RFFE Interface for Antenna Tuner Control .................................................. 53 Table 36: Antenna port definitions ........................................................................................................... 54 Table 37: SIM7912 operating frequencies ............................................................................................... 54 Table 38: SIM7906 operating frequencies ............................................................................................... 55 Table 39: GNSS frequency ...................................................................................................................... 57 Table 40: 3G/4G/GNSS antennas ........................................................................................................... 60 Table 41: GNSS antenna (for dedicated GNSS antenna only)*.............................................................. 60 Table 42: Absolute maximum ratings ...................................................................................................... 62 www.simcom.com 6 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 43: VBAT recommended operating ratings .................................................................................... 62 Table 44: 1.8V digital I/O characteristics ................................................................................................. 63 Table 45: Operating temperature ............................................................................................................. 63 Table 46: Operating mode definition ....................................................................................................... 63 Table 47: Current consumption on VBAT pins (VBAT=3.8V) .................................................................. 65 Table 48: Conducted output power.......................................................................................................... 67 Table 49: The ESD performance measurement table (temperature: 25, humidity: 45%) ................... 68 Table 50: Label description of module information .................................................................................. 71 Table 51: MSL ratings summary .............................................................................................................. 75 Table 52: Baking requirements ................................................................................................................ 75 Table 53: Tray size ................................................................................................................................... 77 Table 54: Small carton size ..................................................................................................................... 77 Table 55: Big carton size ......................................................................................................................... 78 Table 56: Coding schemes and maximum net data rates over air interface ........................................... 79 Table 57: Related documents .................................................................................................................. 81 Table 58: Terms and abbreviations .......................................................................................................... 83 Table 59: Safety caution .......................................................................................................................... 85 www.simcom.com 7 / 85 SIM7912&SIM7906 Hardware Design V1.02 Figure Index Figure 1: SIM7912&SIM7906 module block diagram ............................................................................. 12 Figure 2: Pin assignment ......................................................................................................................... 15 Figure 3: Dimensions of SIM7912&SIM7906 (unit: mm) ........................................................................ 25 Figure 4: Power Supply Limits during Burst Transmission...................................................................... 26 Figure 5: Power supply reference circuit ................................................................................................. 27 Figure 6: Linear regulator reference circuit ............................................................................................. 28 Figure 7: Switching mode power supply reference circuit ...................................................................... 28 Figure 8: Power on the module use button ............................................................................................. 29 Figure 9: Power on the module use GPIO drive ..................................................................................... 29 Figure 10: Power on sequence ............................................................................................................... 30 Figure 11: Power off sequence ................................................................................................................ 31 Figure 12: Reset the module use GPIO drive ......................................................................................... 32 Figure 13: Reset the module use button ................................................................................................. 32 Figure 14: The reset timing sequence of the module .............................................................................. 33 Figure 15: Reference Circuit of USB Application .................................................................................... 35 Figure 16: PCIe interface reference circuit (RC Mode) ........................................................................... 37 Figure 17: PCIe interface reference circuit (EP) ..................................................................................... 38 Figure 18: SD card reference circuit........................................................................................................ 39 Figure 19: SIM interface reference circuit ............................................................................................... 41 Figure 20: I2S timing ............................................................................................................................... 44 Figure 21: Audio codec reference circuit ................................................................................................. 44 Figure 22: I2C reference circuit ............................................................................................................... 45 Figure 23: UART level conversion circuit ................................................................................................ 47 Figure 24: UART TX level conversion circuit ........................................................................................... 47 Figure 25: UART RX level conversion circuit .......................................................................................... 47 Figure 26: SPI reference circuit ............................................................................................................... 48 Figure 27: Network Indicator reference circuit ........................................................................................ 50 Figure 28: Reference Circuits of STATUS ............................................................................................... 51 Figure 29: W_DISABLE# pin reference circuit ........................................................................................ 51 Figure 30: Reference Circuit of USB_BOOT........................................................................................... 52 Figure 31: Aperture tuner reference block diagram ................................................................................ 58 Figure 32: Impedance tuner reference block diagram ............................................................................ 58 Figure 33: Hybrid tuner reference block diagram .................................................................................... 59 Figure 34: M.2 package Tuner mipi interface .......................................................................................... 59 Figure 35: LGA package Tuner mipi interface ......................................................................................... 60 Figure 36: Top and bottom view of Module ............................................................................................. 70 Figure 37: Label description of module ................................................................................................... 70 Figure 38: Recommended PCB footprint ................................................................................................ 72 Figure 39: Recommended SMT stencil ................................................................................................... 73 Figure 40: Recommended SMT reflow profile ......................................................................................... 74 Figure 41: Packaging process ................................................................................................................. 76 Figure 42: Module tray drawing ............................................................................................................... 76 www.simcom.com 8 / 85 Figure 43: Small carton drawing .............................................................................................................. 77 Figure 44: Big carton drawing ................................................................................................................. 77 SIM7912&SIM7906 Hardware Design V1.02 www.simcom.com 9 / 85 SIM7912&SIM7906 Hardware Design V1.02 1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and test results of the SIM7912 and SIM7906 module. With the help of this document customers can quickly understand SIM7912 and SIM7906 module. Associated with other software application notes and user guides, customers can use module to easily design and develop application products. 1.1 Product Outline Aimed at the global market, SIM7912 is the LTE Cat 12 module and SIM7906 is the LTE Cat 6, which are supports wireless communication modes of LTE-TDD/LTE-FDD/HSPA+. SIM7912 supports DL 3CA or 2CA and SIM7906 supports DL 2CA only. The supported radio frequency bands are described in the Table 1: SIM7912 frequency bands. Table 1: SIM7912 frequency bands Network Type SIM7912A SIM7912E B2/B4/B5/B7/B12/B13/B14/B17/B25/B 26/B66/B71 B1/B3/B5/B7/B8/B20/B28/B32 LTE-FDD
(with Rx-diversity) LTE-TDD
(with Rx-diversity) B41 B2+B4+B5/B13/B71;B2+B5+B66;B2+
B13+B66;B2+B7+B12/B66;B4+B7+B1 2;B2+B2+B5/B12/B13/B66;B5+B5+B2
/B66;B7+B7+B2/B4/B5;B66+B66+B2/
B5/B13/B66;B41+B41+B25/B26/B41;
DL 3CA CA DL 2CA B12+B12/B25/B46*/B66;B13+B46*/B4 8*/B66;B14+B66;B19+B42*;B25+B25/
B26/B41/B46*;B26+B41/B46*;B28+B4 0/B41/46*;B2+B2/B4/B5/B7/B12/B13/
B28/B46*/B48*/B66/B71;B40+B40 B41+B41/B5/B7/B12/B13/B28/B46*/
B71;B5+B5/B7/B12/B25/B4 B34/B38/B39/B40/B41/B43*/B46 */
B48*
B1+B3+B3/B5/B7/B8/B20/B28/B38/B4 1;B1+B40+B40;B1+B41+B41;B1+B7+
B20;B3+B3+B7/B20/B28;B3+B7+B7/B 8/B20/B28;B3+B40+B40;
B3+B41+B41;B7+B7+B20/B28;B40+B 40+B40;B41+B41+B41 B1+B1/B3/B5/B7/B8/B20/B28*/B38*/B 40*/B41*
B3+B3/B5/B7/B8/B20/B28/B38*/B40*/
B41*
B7+B5/B7/B8*/B20/B28;B20+B32/B38
/B40;
B38+B38;B40+B40;B41+B41;B48+B4 8*;
www.simcom.com 10 / 85 SIM7912&SIM7906 Hardware Design V1.02 0/B41B/46*/B48*/B66;B66+B66/B71;B 7+B7/B12/B28/B46*;
B2/B4/B5 B1/B3/B5/B8 GPS/Galileo/GLONASS/BeiDou GPS/Galileo/GLONASS/BeiDou WCDMA GNSS Table 2: SIM7906 frequency bands Network Type SIM7906A SIM7906E LTE-FDD
(with Rx-diversity) LTE-TDD
(with Rx-diversity) CA DL 2CA WCDMA GNSS NOTE B2/B4/B5/B7/B12/B13/B14/B17/B25/B 26/B28/B66/B71 B1/B3/B5/B7/B8/B20/B28/B32 B40/B41/B43*/B46*/B48*
B34/B38/B39/B40/B41/B43*/B46 */
B48*
B12+B12/B25/B46*/B66;B13+B46*/B4 8*/B66;B14+B66;B19;B25+B25/B26/
B41/B46*;B26+B41/B46*;B28+B4 0/
B41/46*;B2+B2/B4/B5/B7/B12/B13/
B28/B46*/B48*/B66/B71;B40+B4 0 B41+B41/B4+B4/B5/B7/B12/B13/B28/
B46*/B71;B5+B5/B7/B12/B25/B4 0/
B41B/46*/B48*/B66;B66+B66/B71;B 7
+B7/B12/B28/B46*;
B1+B1/B3/B5/B7/B8/B20/B28*/B38*/B 40*/B41*
B3+B3/B5/B7/B8/B20/B28/B38*/B40*/
B41*
B7+B5/B7/B8*/B20/B28;B20+B32/B38
/B40;
B38+B38;B40+B40;B41+B41;B48+B4 8*;
B2/B4/B5 B1/B3/B5/B8 GPS/Galileo/GLONASS/BeiDou GPS/Galileo/GLONASS/BeiDou 1. GNSS function is optional. 2.
* function is optional. With a physical dimension of 39.5mm * 37.0mm * 2.8mm, module can meet almost all requirements for M2M applications. SIM7912 and SIM7906 are an SMD type module and can be embedded in applications through its 300 LGA pins With the 300 LGA pins, module owns rich interfaces, includes USB2.0/USB3.0, PCIe, SDIO (SD Card), SIM card, digital audio (I2S or PCM), ADCs, I2C, UART, GPIOs, five antennas for 3G/4G and GNSS. www.simcom.com 11 / 85 SIM7912&SIM7906 Hardware Design V1.02 1.2 Hardware Block Diagram The block diagram of SIM7912&SIM7906 is shown in the following figure. Figure 1: SIM7912&SIM7906 module block diagram 1.3 Feature Overview Table 3: Key features Feature Implementation Power supply Transmit power LTE Features VBAT:3.3V4.3V Typical: 3.8V Class 3 (23dBm2dB) for LTE-TDD bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (24dBm+1/-3dB) for WCDMA bands Support FDD/TDD LTE Category 12 with CA and MIMO Support uplink QPSK and 16-QAM and **64-QAM modulation www.simcom.com 12 / 85 ANT MAINMemory SupportEBI1Internal memoryEBI2Internal functionsResource and pwr mgtSecurity and QFP ROMGP clock and PDM outsJTAGModes, resets, configClock generationGPIOsProcessorsCortex-A7Hexagon DSP:ModemAudioRPM cortex-M3Air interfacesWCDMA processingLTE processingGSM processingQualcomm LocationSuite; Gen 9V1 Chipset and RFFE I/FsSerial interfacesQlink digital interfaceConnectivityPCEe UART PCM(audio*2)SPII2S I2C UIM1/UIM2(dual-V) USB2.0/USB3.0 Secure digital 3.0(dual-V) BasebandPMICInput pwr mgtOut pwr mgtUser I/FsGeneral housekeepingIC-level I/FsMEMORYNAND+LPDDR2TransceiverSDR modem subsystem (SDR MSS)RF transmitters for dual UL(Tx0/Tx1)RF receivers with carrier aggregation supportGNSSMODULEANT DIVANT MIMO1ANT MIMO2ANT GNSSRESET_NPWRKEYBT_ENWLAN_PWR_ENSIM1 CardSIM2 CardUSB2.0/USB3.0I2CSD CardUARTPCMRFFE_CLK/DATAUSB_BOOTPCIeGPIOsSD_VDDVDD_RFVDD_EXTVDD_P2VBAT_BBVBAT_RFADC(*2)WLAN_SLP_CLKI2S_MCLKTx/RxBolcksPRxDRxMIMOTxQLINKControlControl38.4MXO SIM7912&SIM7906 Hardware Design V1.02 Support downlink QPSK, 16-QAM and 64-QAM and **256-QAM modulation Support 1.4MHz to 60MHz (3CA) RF bandwidth Support 44 MIMO in DL direction FDD: Max 600Mbps (DL)/150Mbps (UL) TDD: Max 430Mbps (DL)/90Mbps (UL) Main antenna interface (ANT_MAIN) Rx-diversity antenna interface (ANT_DIV) MIMO antenna interfaces (ANT_MIMO1, ANT_MIMO2) GNSS antenna interface (ANT_GNSS) Two pins (NET_MODE and NET_STATUS) to indicate network connectivity status GNSS engine: GPS/GLONASS/BeiDou/Galileo Protocol: NMEA Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default Support identity card: 1.8V/ 3.0V Include SIM1 and SIM2 interfaces Support Dual SIM single standby Comply with PCI Express Specification Revision 2.1 and support Antenna Network Indication GNSS Features SMS SIM interface PCIe interface 5Gbps per lane UART interface I2C interface PCM interface SDIO interface USB interface Firmware upgrade Physical characteristics www.simcom.com Used for data transmission Support up to three UART Data rate up to 4 Mbps Support I2C Data rate up to 400 Kbps Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Support 4bit SD card or 4bit eMMC, meet SDIO3.0 specification 1.8V or 3.0V dual-voltage operation for SD card Data rate up to 200Mbps Comply with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0 Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentence output, and voice over USB*
Support USB serial drivers for: Windows 7/8/8.1/10; Linux 2.6/3.x/4.1~4.15;
Android 4.x/5.x/6.x/7.x/8.x/9.x Firmware upgrade over USB2.0 interface Size: 39.5mm*37mm*2.8mm Weight: Almost 8.38 g 13 / 85 SIM7912&SIM7906 Hardware Design V1.02 Normal operation temperature: -30C to +75C Extended operation temperature: -40C to +85C Storage temperature: -40C to +90C All hardware components are fully compliant with EU RoHS directive Temperature range RoHS NOTE 1. * means under development. 2** means SIM7912 supportedSIM7906 unsupported. www.simcom.com 14 / 85 SIM7912&SIM7906 Hardware Design V1.02 2 Package Information 2.1 Pin Assignment Overview The following figure shows the pin assignment of SIM7912&SIM7906. Figure 2: Pin assignment www.simcom.com 15 / 85 1RESET_N3BT_EN5WLAN_PWR_EN7RESERVED9RESERVED11RESERVED13GND15RESERVED17GND19RESERVED21RESERVED23RESERVED25SIM1_DET27SIM1_CLK29SIM1_DATA31GND33USB_ DM35GND37USB_ SS_TX_M39GND41USB_ SS_RX_M42I2C_SDA44GND46SD_VDD48SD_DATA350SD_DATA152SD_DET54GND56CTS62DTR58RXD60TXD64GND66PCM_IN72RESERVED68PCM_OUT70GND74SIM2_VDD80SIM2_CLK76GND78SIM2_DET82GND86VBAT_RF84GND88VBAT_RF43I2C_SCL45GND47SD_DATA249SD_DATA051SD_CMD53SD_CLK55GND61RI57RTS59DCD63GND65PCM_SYNC71RFFE_CLK67PCM_CLK69GND73RFFE_DATA79SIM2_RST75GND77SIM2_DATA81GND85VBAT_RF83GND87VBAT_RF2PWRKEY4RESERVED6RESERVED8RESERVED10GND12RESERVED14RESERVED16GND18RESERVED20RESERVED22RESERVED24GND26SIM1_VDD28SIM1_RST30GND32USB_ VBUS34USB_ DP36USB_ ID38USB_ SS_TX_P40USB_ SS_RX_P177GND178GND179PCIE_REFCLK_P180PCIE_REFCLK_M181GND182PCIE_ TX_M183PCIE_ TX_P184GND185PCIE_ RX_M186PCIE_ RX_P187GND188PCIE_ CLK_ REQ_N189PCIE_ RST_N190PCIE_WAKE_N191GND192RESERVED193RESERVED194RESERVED195RESERVED129GND127ANT_DIV125GND123GND121GND119ANT_ GNSS117GND115GND113ANT_ MIMO2111GND109GND107ANT_ MAIN105GND103GND101ANT_ MIMO199GND97GND95RESERVED93GND91RESERVED89GND128GND126GND124GND122GND120GND118GND116GND114GND112GND110GND108GND106GND104GND102GND100GND98GND96GND94GND92GND90GND214GND213RESERVED212RESERVED211RESERVED210RESERVED209WLAN_PA_EN208GND207GND206GND205GND204GND203GND202GND201RESERVED200RESERVED199RESERVED198RESERVED197RESERVED196GND176RESERVED174GND172GPIO_5170NET_STATUS168VDD_EXT166BT_RTS164BT_CTS162VDD_RF156VBAT_BB160WAKE_ON_ WIRELESS158GND154GND152I2S_MCLK146COEX_UART_RX150WAKEUP_IN148GND144SLEEP_IND138GPIO_1142GND140USB_BOOT136DBG_RXD132GND134RESERVED130GND173ADC0171STATUS169WLAN_SLP_CLK167GND165BT_RXD163BT_TXD161GPIO_4155VBAT_BB159GPIO_3157GND153GND151W_DISABLE#145COEX_UART_EN149WLAN_EN147NET_MODE143OTG_PWR_EN137DBG_TXD141GND139GPIO_2135VDD_P2133GND175ADC1131GND215GND216GND217GND218GND219GND220GND221GND222GND223GND224GND233GND242GND251GND260GND269GND278GND287GND225GND226GND227GND228GND229GND230GND231GND232GND234GND235GND236GND237GND238GND239GND240GND241GND243GND244GND245GND246GND247GND248GND249GND250GND252GND253GND254GND255GND256GND257GND258GND259GND261GND262GND263GND264GND265GND266GND267GND268GND270GND271GND272GND273GND274GND275GND276GND277GND279GND280GND281GND282GND283GND284GND285GND286GND288GND289GND290GND291GND292GND293GND294GND295GNDSIM7912&SIM7906POWER PinsGND PinsGPIOs and Other PinsRESERVED PinsUART PinsPCIe PinsUSB PinsSIM PinsSDIO PinsPCM PinsI2C Pins299GND298GND297GND 296 GND300GNDANT Pins SIM7912&SIM7906 Hardware Design V1.02 NOTE 1. Keep all RESERVED pins and unused pins unconnected. 2. GND pins 215~299 should be connected to ground in the design. 2.2 Pin Description Table 4: IO parameters definition Pin type Description PI PO AI AIO DIO DI DO PU PD OD Power Input Power Output Analog Input Analog Input /Output Bidirectional Digital Input /Output Digital Input Digital Output Pull Up Pull Down Open Drain Table 5: DC parameters definition Voltage domain Parameter VDD_P2=1.8V Min Typ Max P2 VOH VOL VIH VIL VDD_P2=3.0V VOH VOL VIH VIL VDD_P3=1.8V High level output 1.4V Low level output High level input Low level input 0V 1.3V 0.3V High level output 2.15V Low level output High level input Low level input 0V 1.8V 0.3V P3 VOH VOL High level output 1.35V Low level output 0V
0.45V 2V 0.58V
0.35V 3.15V 0.7V 1.8V 0.45V www.simcom.com 16 / 85 SIM7912&SIM7906 Hardware Design V1.02 VIH VIL High level input Low level input 1.3V 0.3V VDD_P4/P5=1.8V VOH VOL VIH VIL High level output 1.45V Low level output 0V High level input 1.26V Low level input 0V VDD_P4/P5=3.0V VOH VOL VIH VIL High level output 2.4V Low level output High level input Low level input 0V 2.1V 0V
P4/P5 2.1V 0.5V 1.8V 0.4V 2.1V 0.36V 3V 0.4V 3.05V 0.57V Table 6: Pin description Power supply Pin name VBAT_BB VBAT_RF Pin No. 155, 156 85,8 6, 87, 88 PI PI VDD_P2 135 PI Electrical description Description Comment VMAX=4.3V VTYP =3.8V VMIN=3.3V VMAX=4.3V VTYP =3.8V VMIN=3.3V VDD_P2
=SD_VDD or VDD_P2
=VDD_EXT Input power supply for modules BB part Input power supply for modules RF part SD card power supply in a It must be provided with sufficient current up to 1.0A. It must be provided with sufficient current up to transmitting 1.5A burst. If an SD card is used, to connect VDD_P2 SD_VDD. If an eMMC* is used or SDIO interface is unused, connect VDD_P2 to VDD_EXT. VDD_EXT 168 PO VTYP =1.8V VDD_RF 162 PO VTYP =2.85V Provide 1.8V for external circuit. Provide 2.85V for external RF circuit. Iomax=50mA Iomax=120mA 10, 13, 16, 17, 24, 30, 31, 35, 39, 44, 45, 54, 55, 63, 64, 69, 70, 75, 76, 81, 82, 83, 84, 89, 90, 92, 93, 94, 96, 97, 98, 99, 100, 102, 103, 104, 105, 106, 108, 109, 110, 111, 112, 114, 115, 116, 117, 118, 120, 121, 122, 123, 124, 125, 126, 128, 129, 130, 131, 132, 133, 141, 142, 148, 153, 154, 157, 158, 167, 174, 177, 178, 181, 184, 187, 191, 196, 202~208, 214~299 Ground GND Turn on/off www.simcom.com 17 / 85 SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin No. Electrical description Description Comment RESIN_N 1 DI,PU P3 PWRKEY 2 DI,PU P3 Reset the module, active low Power on/off the module, active low 1.8V power domain. Pulled up internally. Active low. 1.8V power domain. Pulled up internally. Active low. Status indication Pin name Pin No. Electrical description Description Comment NET_MODE 147 DO NET_STATUS 170 DO STATUS 171 DO P3 P3 P3 Indicate the modules network registration mode Indicate the modules network activity status Indicate the modules operation status 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. USB interface Pin name Pin No. Electrical description Description Comment USB_VBUS 32 PI VMAX=5.25V VMIN=3.3V USB VBUS detection Not support charge USB_ DP 34 AIO USB_ DM 33 AIO USB_SS_TX_P 38 AO USB_SS_TX_M 37 AO USB_SS_RX_P 40 AI USB_SS_RX_M 41 AI Differential USB bi-directional data plus Differential USB bi-directional data minus USB3.0 super-speed transmit data plus USB3.0 super-speed transmit data minus USB3.0 super-speed receive data plus USB3.0 super-speed receive data minus USB_ID 36 DI P3 OTG identification OTG_PWR_EN 143 DO,PD P3 USB OTG power supply DC-DC enable signal Required 90 differential impedance Compliant with USB 2.0 standard specifications Required 90 differential Impedance Compliant with USB 3.0 standard specifications 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. SIM interface Pin name Pin No. Electrical description Description Comment SIM1_VDD 26 PO 1.8V For SIM:
Power supply for SIM1 card Either 1.8V or 3.0V is supported by the module www.simcom.com 18 / 85 SIM7912&SIM7906 Hardware Design V1.02 automatically. If unused, please keep open VMAX=1.9V VMIN=1.7V For SIM:
3.0V VMAX=3.05V VMIN=2.75V SIM1_DATA 29 DIO P4 SIM1_CLK SIM1_RST 27 28 DO DO SIM1_DET 25 DI P4 P4 P3 SIM2_VDD 74 PO 1.8V For SIM:
VMAX=1.9V VMIN=1.7V For SIM:
3.0V VMAX=3.05V VMIN=2.75V SIM2_DATA 77 DIO P4 SIM2_CLK SIM2_RST 80 79 DO DO SIM2_DET 78 DI P4 P4 P3 SIM1 card data signal, which has been pulled up to SIM1_VDD by a 20K resistor internally SIM1 clock signal SIM1 reset signal SIM1 card detect signal, which need pulled up to VDD_EXT by a 470K resistor externally Power supply for SIM2 card SIM2 card data, which has been pulled up to SIM2_VDD by a 20K resistor internally SIM2 clock signal SIM2 reset signal SIM2 card detect, which need pulled up to VDD_EXT by a 470KR resistor externally Pin No. SPI interface Pin name SPI_CS_N SPI_CLK SPI_MOSI SPI_MISO Main UART interface www.simcom.com Electrical description Description Comment DO DO DO DI P3 P3 P3 P3 SPI chip select SPI clock Master output slaver input Master output slaver input 19 / 85 SIM7912&SIM7906 Hardware Design V1.02 Electrical description Description Comment Pin name CTS RTS RXD DCD TXD RI Pin No. 56 57 58 59 60 61 DO DI DI DO DO DO P3 P3 P3 P3 P3 P3 Clear to send Request to send Receive data Data Carrier detect Transmit data Ring indicator DTR 62 DI P3 ready, terminal Data sleep mode control:
Pulled up by default. Pulling down to low level will wake up the module. 1.8V power domain. If unused, keep it open. Default use command for AT BT interface*
Pin name Pin No. Electrical description Description Comment BT_EN 3 DO P3 function BT control enable BT _TXD 163 DO P3 Transmit data BT _CTS 164 DO P3 Clear to send BT_RXD 165 DI P3 Receive data BT _RTS 166 DI P3 Request to send Debug UART interface 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_MOSI. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_CLK. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_MISO. 1.8V power domain. If unused, keep it open. BT UART interface pin by default. Can be multiplexed into SPI_CS. Pin name Pin No. www.simcom.com Electrical description Description Comment 20 / 85 DBG_ RXD 136 DI DBG_ TXD PCM & I2C interface 137 DO SIM7912&SIM7906 Hardware Design V1.02 P3 P3 Receive data Transmit data 1.8V power domain. If unused, keep it open. Pin name Pin No. Electrical description Description Comment I2C_SCL 43 OD I2C clock signal I2C_SDA 42 OD I2C data signal PCM_SYNC 65 DIO P3 PCM synchronous signal PCM_IN 66 DI P3 PCM data input PCM_CLK 67 DO P3 PCM clock output PCM_OUT 68 DO P3 PCM data output I2S_MCLK 152 DO P3 I2S master clock output 1.8V power domain. An external pull-up resistor is required. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. If unused, keep it open. Provide a digital clock output for an external audio codec. If unused, keep it open. ADC interface Pin name Pin No. Electrical description Description Comment ADC0 173 AI 1.875V ADC1 175 AI 1.875V Analog to digital converter input0 Analog to digital converter input1 If unused, keep it open. If unused, keep it open. Pin No. Electrical description Description Comment PCIe reference clock plus PCIe reference clock minus PCIe transmit minus Required 90 differential impedance PCIe interface Pin name PCIe_REF CLK_P PCIe_REF CLK_M 179 AIO 180 AIO PCIe_TX_M 182 AO www.simcom.com 21 / 85 SIM7912&SIM7906 Hardware Design V1.02 PCIe_TX_P 183 AO PCIe_RX_M PCIe_RX_P 185 186 AI AI PCIe transmit plus PCIe receive minus PCIe receive plus PCIe_CLK_ REQ_N 188 DI P3 PCIe clock request PCIe_WAKE 190 DI P3 PCIe wake-up PCIe_RST 189 DO P3 PCIe reset WLAN Control interface*
In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. Pin No. Electrical description Description Comment Pin name WLAN_PWR_ EN COEX_UART_T X COEX_UART_R X 5 DO 145 DO 146 DI WLAN_EN 149 DO WAKE_ON_ WIRELESS 160 DI 169 DO WLAN_SLP_ CLK SDIO interface Pin name P3 P3 P3 P3 P3 P3 WLAN power supply enable control LTE/WLAN coexistence signal LTE/WLAN coexistence signal WLAN function enable control Wake up module by an external Wi-Fi module 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Active high. If unused, keep it open. 1.8V power domain. Active low. If unused, keep it open. WLAN sleep clock If unused, keep it open. Pin No. Electrical description Description Comment SD_VDD 46 PO 1.8/3.0V SD card application:
SDIO pull up power source. Connected it to VDD_P2. eMMC application:
Keep it open when used for eMMC www.simcom.com 22 / 85 SD_DATA0 49 DIO SD_DATA1 50 DIO SD_DATA2 47 DIO SD_DATA3 48 DIO SD_CMD SD_CLK SD_DET 51 53 52 DIO DO DI,PU P2 P2 P2 P2 P2 P2 P3 SIM7912&SIM7906 Hardware Design V1.02 SDC data bit 0 or eMMC* data bit 0 SDC data bit 1 or eMMC data bit 1 SDC data bit 2 or eMMC data bit 2 SDC data bit 3 or eMMC data bit 3 SDC command output SDC clock output SD card insertion detection Required 50 impedance If unused, keep it open. 1.8V power domain, If unused, keep it open. Other interface Pin name Pin No. Electrical description Description Comment GPIO_1 GPIO_2 GPIO_3 GPIO_4 GPIO_5 138 IO,PD 139 IO,PU 159 IO,PD 161 IO,PD 172 IO,PD USB_BOOT 140 DI SLEEP_IND 144 DO P3 P3 P3 P3 P3 P3 P3 General purpose input/output ports 1.8V power domain, If unused, keep it open. Force the module into emergency download mode Sleep indication 1.8V power domain. Active high. If unused, keep it open. 1.8V power domain, If unused, keep it open. 1.8V power domain. Pulled up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pulled up by default. In low voltage level, the module will enter airplane mode. If unused, keep it open. Default in LTE mode, Pull-down to the GND. Can switch to WLAN mode. WAKEUP_IN 150 DI,PU P3 Sleep mode control W_DISABLE#
151 DI,PU P3 Airplane mode control WLAN_PA_EN 209 DI,PD P3 WLAN PA Enable Antenna Tuner control interface Pin name Pin No. Electrical description Description Comment RFFE_CLK 71 DO P3 RFFE serial interface for 1.8V power domain, www.simcom.com 23 / 85 RFFE_DATA 73 Antenna interface Pin name Pin No. SIM7912&SIM7906 Hardware Design V1.02 DIO P3 external tuner control If unused, keep it open. Electrical description Description Comment ANT_MAIN 107 AIO ANT_DIV 127 AI ANT_ MIMO1 101 AI ANT_MIMO2 113 AI Main antenna interface supporting all bands RXD antenna interface supporting all bands 44 MIMO antenna interface supporting all bands 44 MIMO antenna interface supporting all bands ANT_GNSS 119 AI GNSS antenna interface RESERVED interface 50 impedance 50 impedance If unused, keep open. 50 impedance If unused, keep open. 50 impedance If unused, keep open. 50 impedance If unused, keep open. them them them them 4, 6~9, 11, 12, 14, 15, 18, 19, 20, 21, 22, 23, 72, 91, 95, 134, 176, 192, 193, 194, 195, 197, 198, 199, 200, 201, 210, 211, 212, 213, 300 Reserved for future use Keep unconnected. these pins RESERVED NOTE 1. * means under development. 2. The I2C signals need pull up to VDD_EXT by 2.2K resistors out of the module. 3. If not use SDIO function, the VDD_P2 pin should connect to VDD_EXT pin out of the module. 4. Do not pull up USB_BOOT during normal power up. 5. Unused and RESERVED pins should keep open. 6. Recommend ESD protect components out of the module for used interfaces. 7. All GND pins should be connected to the customers main PCB. 8. GPIO2 will become low level when the module starts up. 9. Pin 209 in V1.01 module is reserved. www.simcom.com 24 / 85 SIM7912&SIM7906 Hardware Design V1.02 2.3 Mechanical Dimensions The following figure shows the mechanical dimensions of SIM7912&SIM7906. Figure 3: Dimensions of SIM7912&SIM7906 (unit: mm) www.simcom.com 25 / 85 SIM7912&SIM7906 Hardware Design V1.02 3 Interface Application 3.1 Power Supply Module provides six VBAT pins dedicated to connection with an external power supply. There are two separate voltage domains for VBAT. Four VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part The following table shows details of VBAT pins and ground pins. Table 7: VBAT pins electronic characteristics Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 85, 86, 87, 88 VBAT_BB 155, 156 Power supply for the modules RF part Power supply for the modules baseband part 3.3 3.8 4.3 3.3 3.8 4.3 V V 3.1.1 Power Supply Design Guide The power supply range of the module is from 3.3V to 4.3V. Please make sure the input voltage will never drop below 3.3V. The following figure shows the voltage drop during Tx power in 3G and 4G networks. Figure 4: Power Supply Limits during Burst Transmission www.simcom.com 26 / 85 Min.VBATVoltage DropBurst TransmissionIpeakBurst TransmissionBurst Transmission SIM7912&SIM7906 Hardware Design V1.02 To decrease the voltage dropping, make sure that the capacitors of VBAT net must not less than 640uF. The following figure shows the reference circuit of power supply for the VBAT. Figure 5: Power supply reference circuit In this reference circuit, some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMI suppression. NOTE 1. Both C1 and C5 are 220 F tantalum capacitor (ESR=0.7). 2. C3, C4, C7 and C8 are multi-layer ceramic chip (MLCC) capacitors from 0.1uF to 1uF with low ESR in high frequency band, which can be used for EMC performance. 3. TVS1 is used for surge protection. Table 8: Recommended TVS1 list No. 1 Manufacturer Part Number ESDBW5V0A1 Js-ele Power dissipation Package 5V DFN1006-2L 2 3 4 5 6 Prisem Way-on Will semi Will semi Way-on PESDHC2FD4V5BH 4.5V WS05DPF-B ESD5611N ESD56151W05 WS4.5DPV 5V 5V 5V 4.5V DFN1006-2L DFN1006-2L DFN1006-2L SOD-323 DFN1610-2L Power supply layout guidelines:
Both VBAT and return path should be as short and wide as possible to minimize the voltage drop. The width of VBAT_BB trace should be no less than 1.5mm, and the width of VBAT_RF trace should be no less than 2mm. These capacitors should be placed as closely as possible to the VBAT_BB and VBAT_RF pins. The VBAT trace should pass through TVS and capacitors, and then pass through the VBAT pins. The small value capacitors should be placed close to the VBAT pins. www.simcom.com 27 / 85 C7100uFC6100nFC833pFC433pFVBAT_BBVBAT_RFTVS1VBATC1220uF5VC3100nFC2C5220uF100uFModuleFB101 The customers PCB design must have a solid ground plane throughout the board as the primary reference plane for most signals. SIM7912&SIM7906 Hardware Design V1.02 3.1.2 Recommended Power Supply Circuit It is recommended to use a switching mode power supply or a linear regulator power supply. Make sure it can provide the current up to 3A at least. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output. Figure 6: Linear regulator reference circuit NOTE An extra minimum load of R3 is required, to ensure it work properly under light load in sleep mode and power off mode. For the details about minimum load, please refer to specification of MIC29502WU. The following figure shows the switching mode power supply reference circuit with 5~12V input and 3.8V output. Figure 7: Switching mode power supply reference circuit NOTE 1. In order to avoid damaging the module, please do not switch off the power supply when module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. www.simcom.com 28 / 85 VinVoutGNDADJ3+PWR_CTRLR2R1VBAT100K(1%)47K(1%)+U1MIC29502WU5412C1C2100uF1uFDC INPUTR3470RENFUSEC3330uFC4100nF10uFENINLXBSGNDFBVBATDC INPUTPWR_CTRL10uF10uF100nFL101VLS5045EX-3R3N3.3UH160K 1%100nF100pF22uF10uF30K 1%C1C2C3C4C5R3R4C6C8C9U1SY8105IADCFuseFB1UPZ1608E300-5R0TF30ohm@100MHz165423 2. It is suggested that customer's design should have the ability to switch off the power supply for module in abnormal state, and then switch on the power to restart the module. 3. The PWR_CTRL signal recommend connect to the host and can be controlled. SIM7912&SIM7906 Hardware Design V1.02 3.1.3 Voltage Monitor To monitor the VBAT voltage, the AT command AT+CBC can be used. NOTE For more details about voltage monitor commands, please refer to Document [1] in the appendix. 3.2 Power On and Off Module 3.2.1 Power On Drive the PWRKEY pin to a low level and hold it for 1 seconds, then release, the module will be powered on. This pin is already pulled up internally. The electrical characteristics are listed in Table 10, and the following figure shows the power on circuit. Figure 8: Power on the module use button Figure 9: Power on the module use GPIO drive Table 9: Definition of PWRKEY pin www.simcom.com 29 / 85 PWRKEY1KModulePMU 1sPWRKEY1KModulePMUPWRKEY1sGPIOMCU SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin no. I/O Functional description PWRKEY 2 DI Power on/off the module, active low Comment 1.8V power domain. Pulled-up internally. Active low The power on sequence is shown in the following figure. Figure 10: Power on sequence Table 10: Power on timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit Twait Ton The waiting time from power supply available to power-on action The time of holding on PWRKEY pin to a low level Ton(VDD_EXT) The time from power-on action to VDD_EXT ready Ton(usb) Ton(uart) The time from power-on action to USB port ready The time from power-on issue to UART port ready Ton(STATUS) The time from power-on action to STATUS ready 30 1000 100 11 15
12
25
ms ms ms s s s NOTE After enter force download mode, the PWRKEY pin need to release and dont pull low always. If not, the module will restart and then cause the download fail. www.simcom.com 30 / 85 PWRKEYRESET_NVBATTonTwaitVDD_EXTT1USB PortUndefinedActiveTon(usb)STATUSTon(STATUS)UARTUndefinedActiveTon(uart) SIM7912&SIM7906 Hardware Design V1.02 3.2.2 Power Off The following methods can be used to power off the module. Method 1: Power off the module by holding the PWRKEY to a low level 2 second then release. Method 2: Power off the module by AT command AT+CPOF. For details about AT+CPOF, please refer to Document [1] in the appendix. NOTE If the temperature is outside the range of -30~+70, some warning will be reported via AT port. If the temperature is outside the range of -40~+85, module will be powered off automatically. For details about AT+CPOF, please refer to Document [1] in the appendix. Normal power off action will make the module disconnect from the network, allow the software enter a safe state, and save key data before the module is powered off completely. The power off sequence is shown in the following figure. Figure 11: Power off sequence Table 11: Power off timing and electronic characteristic Symbol Parameter Time value Min. Typ. Max. The time of holding on PWRKEY pin to a low level 2.5 The time from power-off issue to USB port off The time from power-off issue to STATUS off 27 25
28 26 5
Toff Toff(usb) Toff(status) NOTE Unit s s s www.simcom.com 31 / 85
(Input)USB PortInactiveActivePWRKEYActiveSTATUSToff(STATUS)VDD_EXTToff(VDD_EXT)Toff(USB)Toff SIM7912&SIM7906 Hardware Design V1.02 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise, the module will be turned on again after successful turn-off. 3.3 Reset Function Module can be reset by driving the RESET_N pin down to a low level for 500ms at least and then releasing it. The RESET_N signal has been internally pulled up to 1.8V, so there is no need to pull it up externally. Please refer to the following figure for the recommended reference circuit. Figure 12: Reset the module use GPIO drive Figure 13: Reset the module use button Table 12: Definition of RESET_N pin www.simcom.com 32 / 85 Reset ImpulseRESET_NResetLogicR1.8VModule1K200~600msGPIOMCUResetLogicR1.8VModule1KTreset200~600msRESET_N SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin no. I/O Functional description Comment RESET_N 1 DI Reset the module active low Table 13: RESET electronic characteristics Symbol Description Min. Typ. Max. Unit Treset The time of holding on RESET_N pin to a low level 250 500
ms The reset timing sequence of the module is shown in the following figure. Figure 14: The reset timing sequence of the module NOTE Please ensure that there is no capacitance on RESET_N pin. 3.4 Output Power Management Table 14: Output power management summary Pin name Pin no Typical voltage (V) Rated current (mA) Sleep state Comment VDD_EXT 168 1.8 50 Always on VDD_RF 162 2.8 SD_VDD 46 1.8/3 150 150 Always on Always on Output power supply for external IO pull up circuits Provide 2.85V for external RF circuit. SDIO pull up power source 3.5 USB Interface www.simcom.com 33 / 85 Module stateRestarResetingVBATRunningRESET_N500ms0VVIL0.4V1.2VVIH1.9V SIM7912&SIM7906 Hardware Design V1.02 Module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0 and 2.0 specifications. This USB interface supports super speed (5Gbps) on USB 3.0 and high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. The following table shows the pin definition of USB interface. Table 15: Definition of USB interface Pin name Pin no. I/O Functional description Comment USB_VBUS 32 PI USB VBUS detection AIO AIO AO AO Differential USB bi-directional data plus Differential USB bi-directional data minus USB3.0 super-speed transmit data plus USB3.0 super-speed transmit data minus AI USB3.0 super-speed receive data plus AI USB3.0 super-speed receive data minus DI OTG identification Typical 5.0V Not support for charging Required 90 differential impedance Compliant with USB 2.0 standard specifications Required 90 differential Impedance Compliant with USB 3.0 standard specifications 1.8V power domain. If unused, keep it open 1.8V power domain. If unused, keep it open 143 DO OTG power control USB_ DP 34 USB_ DM 33 38 37 40 41 36 USB_SS_TX _P USB_SS_TX _M USB_SS_ RX_P USB_SS_RX _M USB_ID OTG_PWR_ EN The following figure is the USB reference circuit. www.simcom.com 34 / 85 SIM7912&SIM7906 Hardware Design V1.02 Figure 15: Reference Circuit of USB Application NOTE 1. USB_VBUS is used for USB insertion detection. Its voltage input range is 3.6V~5.25V. 2. For sleep mode, if the Host does not support USB suspend mode, the input of USB_VBUS needs to be controlled by host. Choosing Q1 for placement. 3. For sleep mode, if the host supports USB suspend mode, USB_VBUS can be directly connected to VDD. Choosing R1 for placement. 4. The capacitors C1/C2 need to be placed close to the Host side. 5. Recommended add a 1 resistor in series and parallel varistor in USB3.0 for ESD protection. HS USB DP/DM layout guidelines:
Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 1mm. Gap from other signals keeps 3xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, audio, and 38.4M XO). Maximum PCB trace length cannot exceed 100mm outside of module, the shorter trace and more better. SS USB TX/RX layout guidelines:
Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 500um. www.simcom.com 35 / 85 Close to Host100nFC1USB_DPUSB_DM100nFUSB_SS_TX_PUSB_SS_TX_MUSB_SS_RX_PUSB_SS_RX_MBasebandModuleUSB_VBUSHostUSB_SS_TX_PUSB_SS_TX_MUSB_SS_RX_PUSB_SS_RX_MUSB_DPUSB_DMVDDUSB_IDGPIOGNDGND100nF100nF3.6V~5.25VC2GPIOQ1R1Choose one of R1 and Q1GSD0 SIM7912&SIM7906 Hardware Design V1.02 Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, especially 2.4 GHz). Route differential pairs in the inner layers with a solid GND reference to have good impedance control and to minimize discontinuities. Keep isolation between the Tx pair, Rx pair, and DP/DM to avoid crosstalk. If core vias are used, use no more than two core vias per signal line to limit stubs. 3.6 PCIe Interface Module provides one integrated PCIe (Peripheral Component Interconnect Express) interface which complies with the PCI Express Specification, Revision 2.1 and supports 5Gbps per lane. The PCIe interface of module is only used for data transmission PCI Express Specification Revision 2.1 compliance Data rate at 5Gbps per lane Can be used to connect to an external Ethernet IC (MAC and PHY) or WLAN IC Table 16: Definition of PCIe interface Pin name Pin no. I/O Functional description Comment PCIE_REFCL K_P PCIE_REFCL K_M PCIE_TX_M PCIE_TX_P PCIE_RX_M PCIE_RX_P PCIE_CLK_R EQ_N 179 AIO PCIe reference clock plus 180 182 183 185 186 AIO PCIe reference clock minus AO AO AI AI PCIe transmit0 minus PCIe transmit0 plus PCIe receive0 minus PCIe receive0 plus 188 IO PCIe clock request PCIE_WAKE _N 190 IO PCIe wake-up PCIE_RST_N 189 IO PCIe reset Required 90 differential impedance If unused, keep it open. In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an input signal. In slave mode, it is an output signal. If unused, keep it open. In master mode, it is an output signal. In slave mode, it is an www.simcom.com 36 / 85 SIM7912&SIM7906 Hardware Design V1.02 input signal. If unused, keep it open PCIe interface layout guidelines:
All other sensitive/high-speed signals and circuits must be protected from PCIe corruption. PCIe signals must be protected from noisy signals (clocks, SMPS). Each trace needs to be adjacent to a ground plane. Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. Maximum PCB trace length cannot exceed 150mm outside of module, the shorter trace and more better. In Root Complex Mode, the module is configured to act as a PCIe RC device. The following figure shows a reference circuit of PCIe RC mode. Figure 16: PCIe interface reference circuit (RC Mode) In Endpoint Mode, the module is configured to act as a PCIe EP device. The following figure shows a reference circuit of PCIe EP mode www.simcom.com 37 / 85 ModuleWLAN device100nFPCIe_REFCLK_MPCIe_REFCLK_PPCIe_RXMPCIe_RXPPCIe_CLKMPCIe_CLKPPCIe_WAKEPCIe_RSTPCIe_CLKREQPCIe_TX_MPCIe_TX_PPCIe_RX_MPCIe_RX_PPCIe_TXMPCIe_TXP100nF100nF100nFPCIe_RSTPCIe_WAKEPCIe_CLKREQVDD_EXT100K100K100KClose to Wlan SIM7912&SIM7906 Hardware Design V1.02 Figure 17: PCIe interface reference circuit (EP) NOTE 1. USB is required because PCIe does not support features such as firmware upgrade, GNSS NMEA output and software debugging. Firmware upgrade must be over USB 2.0, while GNSS NMEA output and software debugging can be over USB 2.0/3.0 (USB 2.0 is recommended) 2. All the PCIe level of module is 1.8V. If it communicates with the 3.3V serial port level, a level conversion chip needs to be added in the middle. 3. The Endpoint mode of PCIe is under the development. 3.7 SDIO Interface Module provides one SDIO interface which supports SD 3.0 protocol and eMMC*. The following table shows the pin definition. Table 17: Definition of SDIO interface Pin name Pin no. I/O Functional description Comment www.simcom.com 38 / 85 ModuleHOST100nFPCIe_REFCLK_MPCIe_REFCLK_PPCIe_RXMPCIe_RXPPCIe_CLKMPCIe_CLKPPCIe_WAKEPCIe_RSTPCIe_CLKREQPCIe_TX_MPCIe_TX_PPCIe_RX_MPCIe_RX_PPCIe_TXMPCIe_TXP100nF100nF100nFPCIe_RSTPCIe_WAKEPCIe_CLKREQVDD_EXT100K100K100KClose to APUSB_DPUSB_DMUSB_DPUSB_DM0R0R SD_VDD 46 PO SIM7912&SIM7906 Hardware Design V1.02 SD card application: SDIO pull up power source. eMMC application: Keep it open when used for eMMC. 1.8V/3.0V configurable output. Cannot be used for SD card power supply. SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 SD_CMD SD_CLK SD_DET 49 50 47 48 51 53 52 DIO SDIO data signal (bit 0) DIO SDIO data signal (bit 1) DIO SDIO data signal (bit 2) DIO SDIO data signal (bit 3) DIO SDIO command signal DO SDIO clock signal DI SD card insertion detection The following figure shows the SD card reference circuit. Required 50 impedance If unused, keep it open. 1.8V power domain. If unused, keep it open. Figure 18: SD card reference circuit NOTE 1. The voltage range of SD power supply is 2.7V~3.6V and a sufficient current up to 0.8A should be provided. As the maximum output current of SD_VDD is 50mA which can only be used for SDIO pull-up resistors, an external power supply is needed for SD card. 2. The load capacitance of SDIO bus needs to be less than 5pF. 3. If eMMC function is required, SD_DET need to be pull-down to GND. SDIO interface layout guidelines:
www.simcom.com 39 / 85 SD_VDDSD_DATA3SD_DATA2SD_DATA1SD_DATA0SD_CLKSD_CMDSD_DETVDDSD_DATA3SD_DATA2SD_DATA1SD_DATA0SD_CLKSD_CMDSD_DETModuleSD Card33RClose to module100k100k100k100k100k470kVDD_EXT100nF100uF33pFVDD_2.85V<5pF SIM7912&SIM7906 Hardware Design V1.02 Require trace impedance is 36 to 50. CLK to DATA/CMD length mismatch is less than 0.5mm. 3035 termination resistance on clock net and placed close to the module. Gap from other signals keeps 1.5xline width. Gap lane-to-lane 1.5xline width. Bus capacitance load is less than 5pF. Trace routes away from other sensitive signals. Maximum PCB trace length cannot exceed 30mm out of the module for 104Mbps data rate, the shorter trace and more better. Maximum PCB trace length cannot exceed 100mm out of the module for 50Mbps data rate, the shorter trace and more better. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 100mm. The total trace length inside the module is 25mm, so the exterior total trace length should be less than 75mm. 3.8 SIM Interface Module supports two SIM cards but single standby. SIM1 and SIM2 are dual-voltage 1.8 V or 3.0 V interfaces. Table 18: Definition of SIM interface Pin name Pin no. I/O Functional description Comment SIM1_VDD 26 PO Power supply for SIM1 card SIM1_DATA 29 DIO SIM1 card data signal, which has been pulled up to SIM1_VDD by a 20K resistor internally SIM1_CLK SIM1_RST 27 28 DO DO SIM1 clock signal SIM1 reset signal SIM1_DET 25 DI SIM1 card detect signal, which need pulled up to VDD_EXT by a 470K resistor externally 1.8/3.0V voltage domain, SIM interface should be protected against ESD. SIM2_VDD 74 PO Power supply for SIM2 card SIM2_DATA 77 DIO SIM2 card data, which has been pulled up to SIM2_VDD by a 20K resistor internally If unused, please keep open SIM2_CLK SIM2_RST 80 79 DO DO SIM2 clock signal SIM2 reset signal SIM2_DET 78 DI SIM2 card detect, which need pulled up to VDD_EXT by a 470KR resistor externally Table 19: SIM electronic characteristics in 1.8V mode (SIM_PWR=1.8V) www.simcom.com 40 / 85 Symbol Parameter SIM_VDD Power supply for SIM card VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage 1.44 Low-level output voltage 0 Min. 1.65 1.26 0 SIM7912&SIM7906 Hardware Design V1.02 Typ. Max. Unit 1.8
1.95 1.95 0.36 1.8 0.4 V V V V V Table 20: SIM electronic characteristics 3.0V mode (SIM_PWR=3.0V) Symbol Parameter Min. Typ. Max. Unit SIM_VDD Power supply for SIM card VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage 2.7 2.1 0 2.4 0 3.0
3.05 3.05 0.6 3.0 0.4 V V V V V The module supports SIM card hot-swap function through the SIM_DET pin, which is a level trigger pin. The SIM_DET pin requires pull up externally. The following figure shows SIM card reference circuit. Figure 19: SIM interface reference circuit After inserting SIM card, the SIM_DET pin will change from low to high level. The rising edge will indicate that the SIM card has been inserted. After removing the SIM card, the SIM_DET pin will change from high to low level. This falling edge will indicate the removal of the SIM card. Using AT+UIMHOTSWAPON=0 or 1 and AT+UIMHOTSWAPLEVEL=0 or 1AT command to set module SIM card hot swap function enable and SIM card detection level, for more details, please refer to SIM7912&SIM7906 Series AT Command Manual document. www.simcom.com 41 / 85 TVS(U)SIM_VDD(U)SIM_CLK(U)SIM_DATA(U)SIM_RST0220nF(U)SIM SocketMUP-C792-300(NC)100(U)SIM_DET33pFGND1GND1CD1CD1Module(NC)(NC)(NC)VCCRSTCLKGNDVPPI/OVDD_EXT470K Using AT+SMSIMCFG=1,1 and AT+SMSIMCFG=1,2 AT command to switch SIM1 and SIM2 function, for more details, please refer to Document [1] in the appendix. SIM7912&SIM7906 Hardware Design V1.02 The following table shows recommended TVS of ESD protect and SIM socket. Table 21: Recommended TVS and SIM socket list Name TVS SIM socket Manufacturer ST MUP Model ESDA6V1-5W6 MUP-C792-3 If the SIM card hot-swap function is not used, customers should keep the SIM_DET pin open. NOTE 1. The recommended SIM socket is normal close, which makes SIM_DET is active high. If the active low of SIM_DET is required, SIM socket should be normal open. 2. AT command AT+UIMHOTSWAPLEVEL could change the SIM_DET detection level and the default value is 1, which is active high, for more details, please refer to Document [1] in the appendix. The SIM card layout guidelines:
Make sure that the SIM card socket should be far away from the antennas. SIM traces should be away from RF, VBAT and high-speed signals. The traces should be as short as possible. Keep SIM sockets GND pins directly connect to the main ground. Shielding the SIM card signals by ground. Recommended to place a 33pF1uF capacitor on SIM_VDD net and place close to the holder. The rise/fall time of SIM_CLK should not exceed 40ns. The parasitic capacitance of TVS should not exceed 60pF, and the TVS should be placed close to the SIM socket. 3.9 PCM and I2S Interface Module supports one I2S/PCM interface for external codec, which meets the requirements in the Phillips I2S bus specification. The PCM interface is multiplexing with I2S interface. The default audio interface of the module is I2S. Table 22: The PCM interface is multiplexing with I2S interface www.simcom.com 42 / 85 Pin name Pin no. I/O Functional description Comment SIM7912&SIM7906 Hardware Design V1.02 1.8V power domain. If unused, please keep open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. Provide a digital clock output for an external audio codec. If unused, keep it open. PCM_OUT 68 DO PCM_IN 66 DI PCM data output. It can also be multiplexed as I2S_D1. PCM data input. It can also be multiplexed as I2S_D0. PCM_CLK 67 DO PCM data clock. It can also be multiplexed as I2S_CLK. PCM_SYNC 65 DIO PCM data frame synchronization signal. It can also be multiplexed as I2S_WS. I2S_MCLK 152 DO Clock output Table 23: PCM / I2S format Characteristics Specification Line interface format Data length Linear(fixed) 16bits(fixed) I2S flock/sync source Master mode(fixed) I2S clock rate I2S MCLK rate Data ordering NOTE 1.536 MHz (default) 12.288MHz (default) MSB For more details about PCM/I2S AT commands, please refer to Document [1] in the appendix. 3.9.1 I2S Timing The module supports I2S sampling rate of 48 KHz and 32bit coding signal (16bit length), the timing sequence is shown in the following figure. www.simcom.com 43 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 24: I2S timing parameters Figure 20: I2S timing Signal Parameter Description Min. Typ. Max. Unit Frequency Frequency 12.288 12.288 MHz I2S_MCLK I2S_CLK I2S_WS T t(HC) t(LC) t(sr) t(hr) t(dtr) t(htr) T t(HC) t(LC) Clock period Clock high Clock low Frequency Frequency 81.380 81.380 0.45T 0.45T 0.55T 0.55T
0.45T 0.45T 16.276 Clock period Clock high Clock low DIN/DOUT and WS input setup time DIN/DOUT and WS input hold time 0 DIN/DOUT and WS output delay DIN/DOUT and WS output hold time 0 1.536 651.04
0.55T 0.55T 65.10 ns ns ns MHz ns ns ns ns ns ns ns 3.9.2 I2S Reference Circuit The following figure shows the external codec reference design. Figure 21: Audio codec reference circuit www.simcom.com 44 / 85 I2S_MCLK22pF(NC)ADCDAT1LRCK1BCLK1DACDAT1MCLKSCLSDAIN 1PMICBIAS1LOUTR/NMICNAU88102.2K2.2uFI2C1_SCLI2C1_SDAI2S_RXI2S_TXI2S_WAI2S_CLKMoudle22pF(NC)22pF(NC)22pF(NC)22pF(NC)LOUTL/P0R0R33pFSpeaker33pFLESD8LH5.0CT5GLESD8LH5.0CT5G1uF1uF1.8V1.8V3.3V1.8VAVDDCPVDDDBVDDMICVDDDCVDD1.2VDACREF1.8VVDD_EXT2.2K2.2K SIM7912&SIM7906 Hardware Design V1.02 Audio layout guidelines Analog input:
0.2mm trace widths; 0.2mm spacing between traces. Pseudo differential route for MIC. Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high-speed signals. Analog output:
Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other digital signals with fast transients. Speaker output signal route as differential pair with 0.5mm trace widths. 3.10 I2C Interface Module supports one I2C interfaces, meet I2C specification version 5.0, and data rate up to 400 Kbps. The following figure shows the I2C bus reference circuit. Figure 22: I2C reference circuit Table 25: Definition of I2C interface Pin name Pin no. I/O Functional description Comment I2C_SCL I2C_SDA 43 42 OD I2C serial clock OD I2C serial data I2C default use for codec Pull up to VDD_EXT externally If unused, keep it open. www.simcom.com 45 / 85 ModuleI2C_SDAI2C deviceSDAGNDGNDI2C_SCLSCLVDD_EXT2.2K2.2K SIM7912&SIM7906 Hardware Design V1.02 NOTE 1. SDA and SCL need to pull up to VDD_EXT by a 2.2K resistor externally. 2. For more details about AT commands please refer to Document [1] in the appendix. 3.11 UART Interface The module provides three UART interfaces: main UART interface, debug UART interface, and BT UART interface. Features of these interfaces are shown as below:
Main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps
(default), 230400bps, 460800bps, 921600bps and up to 4M bps baud rates. This interface is used for data transmission and AT command communication. Debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. BT UART interface supports 115200bps baud rate. It is used for BT communication and can be multiplexed into SPI interface*. Table 26: Definition of UART interface Pin name Pin no. I/O Functional description Comment CTS RTS TXD RXD DCD RI DTR DBG _TXD DBG _RXD BT_CTS BT_ RTS BT_ TXD BT_ RXD BT_EN 56 57 60 58 59 61 62 137 136 164 166 163 165 3 DO Clear to send DI Request to send DO Transmit data DI Receive data DO Carrier detect DO Ring indicator DI Data terminal ready sleep mode control DO Transmit data DI Receive data DO Clear to send DI Request to send DO Transmit data DI Receive data DO BT function enable control 1.8V power domain Default use for AT command. 1.8V power domain. Used for debug only. Default use for BT 1.8V power domain If unused, keep it open. All the UART level of module is 1.8V. If it communicates with the 3.3V serial port level, a level conversion www.simcom.com 46 / 85 chip needs to be added in the middle. It is recommended to use TIs TXS0104EPWR level shift, the reference circuit is as follows. SIM7912&SIM7906 Hardware Design V1.02 Figure 23: UART level conversion circuit The following level shifting circuits can also be used:
Figure 24: UART TX level conversion circuit Figure 25: UART RX level conversion circuit www.simcom.com 47 / 85 VCCATXS0104EPWR100pFOEA1A2A3A4VCCBGNDB1B2B3B4VDD_1V8UART_CTSUART_RTSUART_TXDUART_RXD100pFVDD_3V3UART_CTS_3V3UART_RTS_3V3UART_TXD_3V3UART_RXD_3.3VVDD_1V84.7K47KTXD4.7KModuleVDD_EXTRXDVDDDTEVDD_1V84.7K47K4.7KDTERXDModuleVDD_1V8TXDVDD 3.12 SPI Interface SIM7912&SIM7906 Hardware Design V1.02 Module provides one SPI interface multiplexed from BT UART interface. The interface only supports master mode with a maximum clock frequency up to 50MHz. The following table shows the pin definition of SPI interface. Table 27: Definition of SPI interface Pin name Pin no. I/O Functional description Comment BT_CTS BT_ RTS BT_ TXD BT_ RXD 164 166 163 165 DO Can be multiplexed into SPI_CLK. DI Can be multiplexed into SPI_CS. DO Can be multiplexed into SPI_MOSI. DI Can be multiplexed into SPI_MISO. 1.8V power domain The following figure shows the reference circuit of SPI interface. Figure 26: SPI reference circuit 3.13 ADC Interface Module supports two 15bits ADC interfaces. Its performance parameters are shown as follow:
Table 28: Definition of ADC interface Pin name Pin no. I/O Functional description Comment ADC0 173 AI Input Voltage Range:
0~1.875V General purpose analog to digital converter interface. www.simcom.com 48 / 85 ModuleSPI_MOSISPI deviceDICLKSPI_CLKSPI_MISOCSVDD_EXT10KSPI_CS_NDO ADC1 175 AI Input Voltage Range:
0~1.875V SIM7912&SIM7906 Hardware Design V1.02 If unused, keep it open. General purpose analog to digital converter interface If unused, keep it open. NOTE 1. The input voltage of ADC should not exceed 1.875V 2. It is prohibited to supply any voltage to ADC pins when VBAT is removed. 3. It is recommended to use resistor divider circuit for ADC application. 3.14 GPIOs Interface The follow pins of module can be used as GPIO function, if the customer does not use the default functions. In addition, these pins support alternate function by software configure according to the customers requirements. Table 29: GPIO list Pin name Pin no. I/O Functional description Comment GPIO_1 GPIO_2 GPIO_3 GPIO_4 GPIO_5 138 139 159 161 172 IO IO IO IO IO General purpose input/output ports. These four GPIOs can also be multiplexed into a group of PCM or I2S for BT. General purpose input/output ports. This GPIO can also be multiplexed into 1PPS for GNSS. 1.8V power domain. If unused, keep it open. 3.15 Network Status Indication The network indication pins can be used to drive network status indication LEDs. The following tables describe pin definition and logic level changes in different network status. Table 30: Definition of network indication pins www.simcom.com 49 / 85 SIM7912&SIM7906 Hardware Design V1.02 Pin name Pin no. I/O Functional description Comment NET_STATU S 170 NET_MODE 147 DO DO Indicate the modules network activity status. Indicate the modules network registration mode. 1.8V power domain. If unused, keep it open 1.8V power domain. If unused, keep it open The timing parameters are shown in the following table. Table 31: NET_STATUS pin status Pin Name Status NET_MODE Always High Always Low Description Registered on network Others NET_STATUS Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 27: Network Indicator reference circuit 3.16 Status Indication The STATUS pin is set as the module status indicator. It outputs high level voltage when the module is turned on. www.simcom.com 50 / 85 Module1KVBATNetworkIndicator4.7K The following table describes pin definition of STATUS. SIM7912&SIM7906 Hardware Design V1.02 Figure 28: Reference Circuits of STATUS 3.17 Flight Mode Control The W_DISABLE pin can be used to control module to enter or exit the flight mode. In flight mode, the RF circuit is closed to prevent interference with other equipments and minimize current consumption. Its reference circuit is shown in the following figure. Figure 29: W_DISABLE# pin reference circuit Table 32: Definition of W_DISABLE pin Pin name Pin no. I/O Functional description Comment W_DISABLE
151 DI Flight mode control input active low www.simcom.com 51 / 85 Module1KVBATSTATUS4.7KModuleVDD_EXT10KHOSTW_DISABLE SIM7912&SIM7906 Hardware Design V1.02 Table 33: W_DISABLE pin status W_DISABLE pin status Module operation Input low level Flight mode: RF is disabled Input high level AT+CFUN=4: Flight mode AT+CFUN=1: RF is enabled (Default) 3.18 USB_BOOT Interface Module provides a USB_BOOT pin. Pulling up USB_BOOT to VDD_EXT before power-on will make the module enter emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 34: Pin Definition of USB_BOOT Interface Pin name Pin no. I/O Functional description Comment USB_BOOT 140 DI Force the module into emergency download mode 1.8V power domain. Active high. If unused, keep it open. The following figure shows a reference circuit of USB_BOOT. Figure 30: Reference Circuit of USB_BOOT 3.19 Antenna Tuner Control Interface*
The module supports external antenna tuner control through either RFFE interface or dedicated GPIO interfaces. Customers can choose either one according to their tuner design. The following are the pin definitions of the RFFE and dedicated GPIO interfaces. www.simcom.com 52 / 85 ModuleVDD_EXTUSB_BOOT10K Close to module Test points SIM7912&SIM7906 Hardware Design V1.02 Table 35: PIN Definition of RFFE Interface for Antenna Tuner Control Pin name Pin no. I/O Functional description Comment RFFE_CLK 71 DO RFFE_DATA 73 DIO RFFE serial interface for external tuner control. 1.8V voltage domain. If unused, please keep open VDD_RF 162 PO Provide 2.85V for external RF circuit. NOTE 1. * means under development, for details please contact SIMCom support teams. www.simcom.com 53 / 85 SIM7912&SIM7906 Hardware Design V1.02 4 Antenna Interfaces Module provides five antennas for 3G/4G and GNSS. The antenna ports have an RF impedance of 50. 4.1 Antenna Definitions For detailed designs about antenna, please refer to the antenna design guide Document [14]
SIM7912&SIM7906_LGA Antenna Port Mapping and Design Guide in the appendix. Table 36: Antenna port definitions FUNCTIONS 3G/4G LB/MHB TRX 3G/4G LB/MHB DIV DL-MIMO1
(B1/B3/B7/B38/B41/43/48/46 for SIM7912E)
(B2/B4/B25/B66/B7/B41/43/4 8/46 F or SIM7912A) DL-MIMO2
(B1/B3/B7/B38/B41/43/48/46 for SIM7912E)
(B2/B4/B25/B66/B7/B41/43/4 8/46 F or SIM7912A) GNSS NOTE ANT_MAI N ANT_DI V ANT_MIM O1 ANT_MIM O2 ANT_GNS S
1. ANT_MIMO1 and ANT_MIMO2 are optional for SIM7906E and SIM7906A. 4.1.1 3G/4G Operating Frequency Table 37: SIM7912 operating frequencies Frequency Uplink (UL) Downlink (DL) Duplex www.simcom.com 54 / 85 band WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B32 LTE B34 LTE B38 LTE B39 LTE B40 LTE B41 LTE B43 LTE B48 LTE B66 LTE B71 SIM7912&SIM7906 Hardware Design V1.02 mode 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz 1850 MHz ~1910 MHz 1930 MHz ~ 1990 MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755 MHz 2110 MHz ~ 2155 MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz 1850 MHz ~ 1910MHz 1930 MHz ~ 1990MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755MHz 2110 MHz ~ 2155MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 2500 MHz ~ 2570MHz 2620 MHz ~ 2690MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 698 MHz ~ 716MHz 728 MHz ~ 746MHz 777 MHz ~787MHz 746 MHz ~ 756MHz 788 MHz ~ 798MHz 758 MHz ~ 768MHz 704 MHz ~ 716MHz 734 MHz ~ 746MHz 815 MHz ~ 830MHz 860 MHz ~ 875MHz 830 MHz ~ 845MHz 875 MHz ~ 890MHz 832 MHz ~ 862MHz 791 MHz ~ 821MHz 1850 MHz ~ 1915MHz 1930 MHz ~ 1995MHz 814 MHz ~849MHz 859 MHz ~ 894MHz 703 MHz ~ 748MHz 758 MHz ~ 803MHz
1452 MHz ~ 1496MHz 2010 MHz ~ 2025MHz 2010 MHz ~ 2025MHz 2570 MHz ~ 2620 MHz 2570 MHz ~ 2620 MHz 1880 MHz ~ 1920MHz 1880 MHz ~ 1920MHz 2300 MHz ~ 2400 MHz 2300 MHz ~ 2400 MHz 2496 MHz ~ 2690 MHz 2496 MHz ~ 2690 MHz 3600MHz ~ 3800MHz 3600 MHz ~ 3800MHz 3550 MHz ~ 3700MHz 3550 MHz ~ 3700MHz 1710 MHz ~ 1780MHz 2110 MHz ~ 2180MHz 663 MHz ~ 698MHz 617MHz ~ 652MHz FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD TDD TDD FDD FDD Table 38: SIM7906 operating frequencies Frequency band WCDMA B1 Uplink (UL) Downlink (DL) 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz Duplex mode FDD www.simcom.com 55 / 85 SIM7912&SIM7906 Hardware Design V1.02 1850 MHz ~1910 MHz 1930 MHz ~ 1990 MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755 MHz 2110 MHz ~ 2155 MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 1920 MHz ~ 1980 MHz 2110 MHz ~ 2170 MHz 1850 MHz ~ 1910MHz 1930 MHz ~ 1990MHz 1710 MHz ~ 1785 MHz 1805 MHz ~ 1880 MHz 1710 MHz ~ 1755MHz 2110 MHz ~ 2155MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 2500 MHz ~ 2570MHz 2620 MHz ~ 2690MHz 880 MHz ~ 915 MHz 925 MHz ~ 960 MHz 698 MHz ~ 716MHz 728 MHz ~ 746MHz 777 MHz ~787MHz 746 MHz ~ 756MHz 788 MHz ~ 798MHz 758 MHz ~ 768MHz 704 MHz ~ 716MHz 734 MHz ~ 746MHz 815 MHz ~ 830MHz 860 MHz ~ 875MHz 830 MHz ~ 845MHz 875 MHz ~ 890MHz 832 MHz ~ 862MHz 791 MHz ~ 821MHz 1850 MHz ~ 1915MHz 1930 MHz ~ 1995MHz 814 MHz ~849MHz 859 MHz ~ 894MHz 703 MHz ~ 748MHz 758 MHz ~ 803MHz
1452 MHz ~ 1496MHz 2010 MHz ~ 2025MHz 2010 MHz ~ 2025MHz 2570 MHz ~ 2620 MHz 2570 MHz ~ 2620 MHz 1880 MHz ~ 1920MHz 1880 MHz ~ 1920MHz 2300 MHz ~ 2400 MHz 2300 MHz ~ 2400 MHz 2496 MHz ~ 2690 MHz 2496 MHz ~ 2690 MHz 3600MHz ~ 3800MHz 3600 MHz ~ 3800MHz 3550 MHz ~ 3700MHz 3550 MHz ~ 3700MHz 1710 MHz ~ 1780MHz 2110 MHz ~ 2180MHz 663 MHz ~ 698MHz 617MHz ~ 652MHz FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD TDD TDD FDD FDD WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B32 LTE B34 LTE B38 LTE B39 LTE B40 LTE B41 LTE B43 LTE B48 LTE B66 LTE B71 NOTE 2. LTE-FDD B32 support Rx only and are only for secondary component carrier. www.simcom.com 56 / 85 4.1.2 GNSS Frequency The following table shows frequency specification of GNSS antenna interface. SIM7912&SIM7906 Hardware Design V1.02 Table 39: GNSS frequency Type GPS L1/Galileo/QZSS GPS L5 GLONASS BeiDou/Compass 4.2 Antenna Installation 4.2.1 PCB Layout Guidelines Frequecy 1575.421.023MHz 1176.4510.23MHz 1597.5~1605.8MHz 1561.0982.046MHz To avoid interference, minimalize the insertion loss of the RF trace, the PCB should follow below rules:
(1) The coaxial cable PCB pads, RF antenna connector and other connectors which used to test contact performance of module should place as close as to the module antenna pads.
(2) The antenna matching network should place to antenna feed port.
(3) The RF trace should be as short and straight as possible, and do not routing as perpendicular line, we recommend do it as 45 corner trace.
(4) And the RF trace ground should be complete;
(5) RF device should place ground to the nearest ground plane;
(6) Between RF trace and below should avoid other signal trace or parallel trace to the RF signal.
(7) Recommend to more ground vias near the RF traces. 4.2.2 Antenna Tuner When end device needs to support 700MHz low frequency(B12\B13\B28), it is recommended to add anten na tuner to improve RF performance. Antenna tuner contains antenna aperture tuner, antenna impedance tuner and hybrid tuner of the two. Aperture tuner optimizes the total antenna efficiency from the free space of the antenna terminal, and can optimize antenna efficiency across multiple frequency bands. Impedance tuner adjusts the mismatch between the RF front end and the antenna to achieve maximum transmission power. Hybrid tuner combines the advantages of both to maximize antenna RF performance. Customers c an choose according to specific needs, according to the recommendations from the antenna vendor. www.simcom.com 57 / 85 SIM7912&SIM7906 Hardware Design V1.02 Figure 31: Aperture tuner reference block diagram Figure 32: Impedance tuner reference block diagram www.simcom.com 58 / 85 tuner3G/4G MODULERFFE MIPIANT CONTRLORFEEDANTtuner3G/4G MODULERFFE MIPIANT CONTRLORFEEDANT SIM7912&SIM7906 Hardware Design V1.02 Figure 33: Hybrid tuner reference block diagram The antenna control Tuner mipi interface of different package modules is as follows. Figure 34: M.2 package Tuner mipi interface www.simcom.com 59 / 85 tuner3G/4G MODULERFFE MIPIANT CONTRLORFEEDANTtuner SIM7912&SIM7906 Hardware Design V1.02 Figure 35: LGA package Tuner mipi interface NOTE 1. When multiple Tuners are needed, pay attention to the distinction of the same device USID under the same group of mipi;
2. For details please refer to the Antenna Tuner Reference Design document and contact SIMCom support teams. 4.2.3 Antenna Requirements The following table shows the requirements on 3G/4G antennas and GNSS antenna. Table 40: 3G/4G/GNSS antennas Parameter Requirement Operating Frequency Direction Gain Impedance Efficiency Max. Input Power VSWR Isolation See Table 37: SIM7912 operating frequencies for each antenna Omni Directional
> -3dBi (Avg) 50
> 50 %
50W
< 2 20dB is preferred Cable Insertion Loss <1GHz Cable Insertion Loss 1GHz~2.2GHz Cable Insertion Loss 2.3GHz~2.7GHz Cable Insertion Loss 3.3GHz~6GHz
<1dB
<1.5dB
<2dB
<2.5dB www.simcom.com 60 / 85 Table 41: GNSS antenna (for dedicated GNSS antenna only)*
SIM7912&SIM7906 Hardware Design V1.02 Parameter Operating Frequency Direction Antenna Gain Impedance Efficiency Max. Input Power VSWR Polarization Noise Figure for Active Antenna Total Gain for Active Antenna Cable Insertion Loss NOTE Requirement L1: 1559~1609MHZ L5: 1166~1187MHz Hemisphere, face to sky
> 2 dBic 50
> 50 %
50W
< 2 RHCP or Linear
< 1.5
< 17 dB
<1.5dB
*: These recommendations are for dedicated GNSS antenna which the application need best of class GNSS tracking performance. www.simcom.com 61 / 85 SIM7912&SIM7906 Hardware Design V1.02 5 Electrical Specifications 5.1 Absolute Maximum Ratings Absolute maximum rating for digital and analog pins of module are listed in the following table:
Table 42: Absolute maximum ratings Parameter Voltage at VBAT1 pins Voltage at USB_VBUS Voltage at PWRKEY Voltage at RESIN_N Voltage at digital pins (GPIO, I2C, UART, I2S) Voltage at digital pins SIM Min. Typ. Max. Unit
4.7 5.5 2.1 1.9 2.1 3.05 V V V V V V NOTE 1. The VBAT include VBAT_BB and VBAT_RF pins. 5.2 Operating Conditions Table 43: VBAT recommended operating ratings Parameter Voltage at VBAT1 pins USB_VBUS NOTE Min. 3.3 3.3 Typ. 3.8 5.0 Max. Unit 4.3 5.25 V V 1. The VBAT include VBAT_BB and VBAT_RF pins. www.simcom.com 62 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 44: 1.8V digital I/O characteristics Parameter Description Min. Typ. Max. Unit High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage VIH VIL VOH VOL NOTE 1.17 0 1.35 0
2.1 0.63 1.8 0.45 V V V V These parameters are for digital interface pins, such as UART, I2C, I2S, SPI, and GPIOs (SIM_DET, SD_DET). Table 45: Operating temperature Parameter Normal operation temperature (3GPP compliant) Extended operation temperature Storage temperature Min.
-30
-40
-40 Typ.
+25
Max. Unit
+75
+85
+90 5.3 Operating Mode 5.3.1 Operating Mode Definition The table below summarizes the various operating modes of module. Table 46: Operating mode definition Mode Function Normal operation Sleep AT command AT+CSCLK=1 can be used to set the module to a sleep mode. In this case, the current consumption of module will be reduced to a very low level and the module can still receive paging message and SMS. Idle Software is active. Module is registered to the network and ready to www.simcom.com 63 / 85 SIM7912&SIM7906 Hardware Design V1.02 communicate. Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences and antenna. Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level);
uplink/downlink data rates, etc. AT command AT+CFUN=0 can be used to set the Module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the Module will not work and the SIM card will not be accessible, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. AT command AT+CFUN=4 or pulling down the W_disable1# pin can be used to set the Module to flight mode without removing the power supply. In this mode, the RF part of the Module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. Normally module will go into power off mode by sending the AT command AT+CPOF or pull down the FUL_CARD_POWER_OFF#
pin. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible. Talk Standby Data transmission Minimum functionality mode Flight mode Power off 5.3.2 Sleep Mode In sleep mode, the current consumption of module will be reduced to a very low level. Several hardware and software conditions must be satisfied in order to let module enter into sleep mode:
UART condition USB condition Software condition NOTE Before designing, pay attention to how to realize sleeping/waking function. www.simcom.com 64 / 85 SIM7912&SIM7906 Hardware Design V1.02 5.3.3 Minimum Functionality Mode and Flight Mode Minimum functionality mode ceases a majority function of Module, in order to minimizing the power consumption. This mode is set by the AT command which provides a choice of 3 different functionality levels. AT+CFUN=0: Minimum functionality AT+CFUN=1: Full functionality (Default) AT+CFUN=4: Flight mode If module has been set to minimum functionality mode, the RF SIM card function will be closed while the serial port and USB are still available. If module has been set to flight mode, the RF function will be closed, while the SIM card, the serial port and USB are still available. When module is in minimum functionality or flight mode, it can return to full functionality by the AT command AT+CFUN=1. 5.4 Current Consumption The current consumptions are listed in the follows table. Table 47: Current consumption on VBAT pins (VBAT=3.8V) Description Power off mode GNSS mode Sleep mode
(GNSS off, without connection USB) Condition. Power off DPO WCDMA(AT+CFUN=0) WCDMA DRX=1.28s WCDMA DRX=2.56s LTE-FDD(AT+CFUN=0) LTE-FDD DRX=0.32s LTE-FDD DRX=0.64s LTE-FDD DRX=1.28s LTE-FDD DRX=2.56s LTE-TDD(AT+CFUN=0) LTE-TDD DRX=0.32s LTE-TDD DRX=0.64s LTE-TDD DRX=1.28s LTE-TDD DRX=2.56s Typical Unit 20 15 0.818 1.472 1.025 0.698 3.243 2.106 1.617 1.041 0.702 3.421 2.225 1.425 1.212 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle mode WCDMA 12.504 mA www.simcom.com 65 / 85
(GNSS off, without connection USB) LTE FDD LTE TDD 15.465 mA 9.25 mA SIM7912&SIM7906 Hardware Design V1.02 HSDPA data WCDMA B2 WCDMA B4 WCDMA B5 LTE data LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B25 LTE-FDD B26 LTE-TDD B41 LTE-FDD B66 LTE-TDD B71
@Power 22.30dBm Typical: 536 mA
@Power 22.28dBm Typical: 586 mA
@Power 23.05dBm Typical: 553 mA
@5MHz 21.31dBm Typical : 528 mA Typical : 547 mA
@10MHz 21.25dBm Typical : 546 mA
@20MHz 21.32dBm
@5MHz 23.12dBm Typical : 608 mA
@10MHz 23.19dBm Typical : 632 mA
@20MHz 22.81dBm Typical : 609 mA
@5MHz 22.81dBm Typical : 541 mA
@10MHz 22.98dBm Typical : 548 mA
@5MHz 22.38dBm Typical : 696 mA
@10MHz 22.95dBm Typical : 720 mA Typical : 785 mA
@20MHz 22.92dBm
@5MHz 22.07dBm Typical : 542 mA
@10MHz 22.09dBm Typical : 552 mA
@5MHz 22.70dBm Typical : 538 mA Typical : 522 mA
@10MHz 22.60dBm
@5MHz 22.89dBm Typical : 528 mA
@10MHz 23.05dBm Typical : 536 mA
@5MHz 22.54dBm Typical : 526 mA Typical : 531 mA
@10MHz 22.50dBm
@5MHz 23.89dBm Typical : 602 mA Typical : 645 mA
@10MHz 23.76dBm
@20MHz 23.78dBm Typical : 744 mA
@5MHz 22.96dBm Typical : 607 mA Typical : 598 mA
@10MHz 22.83dBm Typical : 711 mA
@5MHz 22.63dBm Typical : 720 mA
@10MHz 22.59dBm Typical : 714 mA
@20MHz 22.49dBm Typical : 737 mA
@5MHz 22.43dBm Typical : 762 mA
@10MHz 22.39dBm Typical : 780 mA
@20MHz 22.23dBm Typical : 524 mA
@5MHz 22.18dBm Typical : 520 mA
@10MHz 22.10dBm Typical : 517 mA
@20MHz 22.25dBm www.simcom.com 66 / 85 SIM7912&SIM7906 Hardware Design V1.02 NOTE 1. The VBAT include VBAT_BB and VBAT_RF pins. 2. The current consumption of Table 47: Current consumption on VBAT pins (VBAT=3.8V) based on SIM7912E and it is only for reference, please refer to actual current consumption. 5.5 RF Output Power The RF output power is shown in the following table. Table 48: Conducted output power Frequency WCDMA Bands LTE-FDD Bands LTE-TDD Bands Max 24dBm + 1/-3dB 23dBm + 2/-2dB 23dBm + 2/-2dB Min
< -50dBm
< -40dBm
< -40dBm www.simcom.com 67 / 85 SIM7912&SIM7906 Hardware Design V1.02 5.6 Conducted Receive Sensitivity Module conducted RF receiving sensitivity is fully meet 3GPP specification. Customers can get more details by check 3GPP official website http://www.3gpp.org/. 5.7 Thermal Design Make sure that the module can reach maximum work performance under extended temperature or extreme conditions for a long time, thermal dissipation design is very important. There are some design rules to enhance thermal dissipation performance:
Keep the module away from other heat sources such as battery, power, AP, etc. All the GND pins of the module should be connected. Add enough through GND via on the main PCB. Via material is very important solid copper and stacked via is better. Make sure maximize airflow around the module. Recommend use heat dissipation material connect to the customers device on the top side of the module to enhance the heat dissipation. Large heat dissipation area is better. Chose a high effective heat dissipation material is better such as heat pipe, graphite sheets. 5.8 ESD Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the customers main board, the ESD components should be placed closed to the connectors which human body may touch, such as SIM card socket, SD card socket, audio jacks, switches, USB interface, etc. The following table shows the module ESD measurement performance. Table 49: The ESD performance measurement table (temperature: 25, humidity: 45%) Part VBAT, GND Antenna Interfaces Other PADs NOTE Contact discharge(kV) Air discharge(kV) 4 4 2 8 8 4 Test conditions:
1. The external of the module has surge protection diodes and ESD protection diodes. www.simcom.com 68 / 85 2. The data in Table 49: The ESD performance measurement table (temperature: 25, humidity: 45%) were tested using SIMCom EVB. SIM7912&SIM7906 Hardware Design V1.02 www.simcom.com 69 / 85 SIM7912&SIM7906 Hardware Design V1.02 6 Manufacturing 6.1 Top and Bottom View of Module Figure 36: Top and bottom view of Module 6.2 Label Description Information T 2 D A A A B C E A F A Figure 37: Label description of module www.simcom.com 70 / 85 Table 50: Label description of module information SIM7912&SIM7906 Hardware Design V1.02 No. A B C D E F NOTE Description LOGO Project name Product code QR code Serial number International mobile equipment identity Figure 36: Top and bottom view of and Figure 37: Label description of module are the effect diagrams of the module, for reference only. Please refer to the actual product for appearance. www.simcom.com 71 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.3 Recommended PCB Footprint The following figure shows the PCB footprint of SIM7912&SIM7906. Figure 38: Recommended PCB footprint www.simcom.com 72 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.4 Recommended SMT Stencil The following figure shows the SMT stencil of SIM7912&SIM7906. Figure 39: Recommended SMT stencil www.simcom.com 73 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.5 Recommended SMT Reflow Profile The following figure shows the SMT reflow profile of SIM7912&SIM7906. Figure 40: Recommended SMT reflow profile NOTE Refer to Module secondary-SMT-UGD for more information about the module shipping and manufacturing. www.simcom.com 74 / 85 SIM7912&SIM7906 Hardware Design V1.02 6.6 Moisture Sensitivity Level (MSL) Module is susceptible to damage induced by absorbed moisture and high temperature. A packages moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent MSL ratings are summarized in Table 51. Table 51: MSL ratings summary MSL Out-of-bag floor life 1 2 2a 3 4 5 5a 6 Unlimited 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. Comments
+30/85% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH
+30/60% RH The device samples are currently classified as MSL3 at 255 (+5, -0)C, following the latest IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature (255C) should not be confused with the peak temperature within the recommended solder reflow profile. 6.7 Baking Requirements It is necessary to bake modules if the prescribed time limit has been exceeded. The baking conditions are specified in Table 52. Note that if baking is required, the devices must be transferred into trays that can be baked to at least 125C. Table 52: Baking requirements Baking conditions options 40C5C, <5% RH 120C5C, <5% RH Duration 192 hours 4 hours www.simcom.com 75 / 85 SIM7912&SIM7906 Hardware Design V1.02 7 Packaging Module supports tray packaging. The packaging process is shown in the following figures. Figure 41: Packaging process Module tray drawing www.simcom.com 76 / 85 Figure 42: Module tray drawing SIM7912&SIM7906 Hardware Design V1.02 Table 53: Tray size Length3mm Width3mm 242.0 161.0 Number 8 Figure 43: Small carton drawing Table 54: Small carton size Length10mm Width10mm Height10mm Number 270 180 120 8*19-2=150 Big carton drawing Figure 44: Big carton drawing www.simcom.com 77 / 85 SIM7912&SIM7906 Hardware Design V1.02 Table 55: Big carton size Length10mm Width10mm Height10mm Number 380 280 280 150*4=600 www.simcom.com 78 / 85 SIM7912&SIM7906 Hardware Design V1.02 8 Appendix 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface Table 56: Coding schemes and maximum net data rates over air interface HSDPA device category Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 7 Category 8 Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19 Category 20 Category 21 Category 22 Category 23 1.2Mbps 1.2Mbps 1.8Mbps 1.8Mbps 3.6Mbps 3.6Mbps 7.2Mbps 7.2Mbps 10.2Mbps 14.4Mbps 0.9Mbps 1.8Mbps 17.6Mbps 21.1Mbps 23.4Mbps 28Mbps 23.4Mbps 28Mbps 35.5Mbps 42Mbps 23.4Mbps 28Mbps 35.5Mbps 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK QPSK QPSK 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 16QAM 64QAM Category 24 HSUPA device category 42.2Mbps Max data ratepeak 64QAM Modulation type Category 1 Category 2 Category 3 0.96Mbps 1.92Mbps 1.92Mbps QPSK QPSK QPSK www.simcom.com 79 / 85 SIM7912&SIM7906 Hardware Design V1.02 Category 4 Category 5 Category 6 LTE-FDD device category
(Downlink) 3.84Mbps 3.84Mbps 5.76Mbps QPSK QPSK QPSK Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 12 10Mbps 50Mbps 100Mbps 150Mbps 300Mbps 300Mbps 600Mbps QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM/25 6QAM LTE-FDD device category
(Uplink) Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 12 5Mbps 25Mbps 50Mbps 50Mbps 75Mbps 50Mbps 100 Mbps QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM/64QAM QPSK/16QAM QPSK/16QAM/64QAM www.simcom.com 80 / 85 SIM7912&SIM7906 Hardware Design V1.02 8.2 Related Documents Table 57: Related documents NO. Title Description
[1]
[2]
SIM7912&SIM7906 Series AT Command Manual ITU-T Draft new ecommendation.25ter
[3]
3GPP TS 51.010-1
[4]
3GPP TS 34.124
[5]
3GPP TS 34.121
[6]
3GPP TS 34.123-1
[7]
3GPP TS 34.123-3
[8]
EN 301 908-02 V2.2.1
[9]
EN 301 489-24 V1.2.1 AT Command Manual Serial asynchronous automatic dialing and control Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network;
Terminal conformance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3:
Abstract Test Suites. Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment
[10]
IEC/EN60950-1(2001) Safety of information technology equipment (2000)
[11]
3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification
[12] GCF-CC V3.23.1 Global Certification Forum Certification Criteria
[13]
2002/95/EC
[14]
SIM7912&SIM7906_LGA Antenna Port Mapping and Deign Guide Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(RoHS) Antenna design guidelines for diversity receiver system www.simcom.com 81 / 85 SIM7912&SIM7906 Hardware Design V1.02
[15]
SIM7912&SIM7906_CA COMBO list CA list for SIM7912 and SIM7906
[16] Antenna Tuner reference design Antenna tuning method and antenna tuning reference design example www.simcom.com 82 / 85 SIM7912&SIM7906 Hardware Design V1.02 8.3 Terms and Abbreviations Table 58: Terms and abbreviations Abbreviation Description ADC CS CTS DRX DTR DTX EFR EMC ESD FDD FR GNSS GPS HR I2C I2S IMEI LTE MDIO MMD MO MSB PCB PCIe RF RGMII SDIO SIM SMS SPI TDD TX UART VSWR SM Analog-to-Digital Converter Coding Scheme Clear to Send Discontinuous Reception Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electromagnetic Compatibility Electrostatic Discharge Frequency Division Dual Full Rate Global Navigation Satellite System Global Positioning System Half Rate Inter-Integrated Circuit Inter-IC Sound International Mobile Equipment Identity Long Term Evolution Management Data Input/Output MDIO manageable device Mobile Originated Most Significant Bit Printed Circuit Board Peripheral Component Interface Express Radio Frequency Reduced Gigabit Media Independent Interface Secure Digital Input and Output Subscriber Identification Module Short Message Service serial peripheral interface Time Division Dual Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio SIM phonebook www.simcom.com 83 / 85 SIM7912&SIM7906 Hardware Design V1.02 HSDPA HSUPA WCDMA SIM UMTS UART LB MHB UHB LAA TRX High Speed Downlink Packet Access High Speed Uplink Packet Access Wideband Code Division Multiple Access Universal subscriber identity module Universal mobile telecommunications system Universal asynchronous receiver transmitter Low Frequency Band Middle and High Frequency Band Ultra High Frequency Band Limited Access Authorization Transmit and Receive signal UL-MIMO DL-MIMO Uplink- Multiple Input Multiple Output Downlink- Multiple Input Multiple Output www.simcom.com 84 / 85 SIM7912&SIM7906 Hardware Design V1.02 8.4 Safety Caution Table 59: Safety caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. www.simcom.com 85 / 85 FCC Caution. 15.19 Labelling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the condition that this device does not cause harmful interference. 15.21 Information to user. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. Body-worn Operation This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withmini mum distance 20cm between the radiator & your body This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this Modular, including any applicable source-based time averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID:
2AJYU-8XM0001 or Contains FCC ID: 2AJYU-8XM0001 must be used.
1 2 3 4 5 | FCC Modular Approval Letter | Cover Letter(s) | 70.55 KiB | November 29 2022 / November 30 2022 |
SIMCom Wireless Solutions Limited
[2022-11-25]
Dear Application Examiner:
[SIMCom Wireless Solutions Limited, SIM7906A, 2AJYU-8XM0001] is seeking modular approval. The radio meets the requirements for modular approval as detailed in FCC 15.212. Compliance to each of the requirements is described below:
1. 2. 3. 4. 5. 6. 7. 8. The modular transmitter must have its own RF shielding. The radio portion of the module is contained in its own RF shielding. The shielding is installed at the factory. Please see the Internal Photos exhibit. The modular transmitter must have buffered modulation/data inputs. The EUT has buffered data inputs to insure compliance with Part 15 requirements under conditions of excessive data rates or over-modulation. Please see the Schematics exhibit. The modular transmitter must have its own power supply regulation. The EUT has its own power supply regulation to insure compliance with Part 15 requirements regardless of the quality or level of external DC supplying the module from the host unit. Please see Schematics exhibit. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(c). Licensed products are not applicable. The modular transmitter must be tested in a stand-alone configuration. The EUT was tested in a stand-alone configuration. The module was greater than 10 cm from the host device. Please see test setup photos exhibit and technical report exhibit. The modular transmitter must be labeled with its own FCC ID number. The EUT is labeled with its own FCC ID number. Please see FCC ID label & location exhibit. If the FCC ID number will not be visible when the module is installed inside a host device, another label with the FCC ID will be applied to the exterior of the host device. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. The EUT is compliant with all applicable FCC rules. Detail instructions for maintaining compliance are given in the User Manual. The modular transmitter must comply with any applicable RF exposure requirements. The EUT is compliant with all applicable RF exposure requirements. Please see RF Exposure Exhibit. Please contact me if you have additional questions. Your attention to this matter is greatly appreciated. Best regards,
, Yongsheng Li and manage]
1 2 3 4 5 | ANT Interface Statement | Cover Letter(s) | 109.99 KiB | August 10 2022 |
The Statement of ANT interface Date: 2022-07-28 We Shanghai P.R.China 200335 Declare that:
Company Name: SIMCom Wireless Solutions Limited Address: 8F, Building 3, No.289 LinHong Road, Changning District, ANT LISTANT MAIN,ANT DIV,ANT MIMO1 ANT MIMO2,ANT GNSS In this SIM7912A FCC certification, the three antenna ports of ANT MIMO1, MIMO2, and ANT In this GNSS are not used. These three antenna ports are reserved for subsequent 5G. certification, these three ports are only antenna ports, and there is no actual antenna. So in this certification, ANT MIMO1, MIMO2 and ANT GNSS did not play any role. Yongshengli SIMCom Wireless Solutions Limited
1 2 3 4 5 | FCC Agent Authorization | Cover Letter(s) | 83.75 KiB | August 10 2022 |
SIMCom Wireless Solutions Limited
(05/24/2022) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: LETTER OF AGENT AUTHORIZATION To Whom It May Concern:
We, the undersigned, hereby authorize (Chongqing Academy of Information and Communications Technology) to act on our behalf in all matters relating to application for equipment authorization, including the signing of all documents relating to these matters. We also hereby certify that no party to the application authorized hereunder is subject to the denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C.853(a). This agreement expires one year from the current date. Sincerely,
1 2 3 4 5 | FCC Long Term Confidentiality Letter | Cover Letter(s) | 94.02 KiB | August 10 2022 |
<SIMCom Wireless Solutions Limited>
FCC Long term Confidentiality Letter
(05/24/2022) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: SIMCom Wireless Solutions Limited (4G MODULE /SIM7912A 2AJYU-
8XM0001) To Whom It May Concern:
This letter serves as an official request for confidentiality under sections 0.457 and 0.459 of CFR 47. We have requested that the (Block Diagram/Schematics/Parts List / Tune Up Procedure/Operational Description) required to be submitted with this application be permanently withheld from public review. SPECIFY REASON FOR REQUEST (i.e. the above documents are company proprietary information that could never get into the possession of your competition). Please contact me if there is any information you may need. Sincerely,
1 2 3 4 5 | Modular Approval Letter | Cover Letter(s) | 188.69 KiB | August 10 2022 |
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Request for Modular/Limited Modular Approval Date: 5.24.2022 Subject: Manufacturers Declaration for Modular Approval
- Limited Modular Approval
- Split Modular Approval
- - Limited Split Modular Approval Confidentiality Request for:
2AJYU-8XM0001 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)
- YES - NO(*) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>
2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)
- YES - NO(*) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>
3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)
- YES - NO(*) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>
4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)
- YES - NO(*) Details: <example The module connects to its antenna using an UFL connector which is considered a non-standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>
5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)
- YES - NO(*) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Modular Approval Requirement 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see Requirement Met KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:
XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)
- YES - NO(*) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>
7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)
- YES - NO(*) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>
8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties toensure compliance. 15.212(a)(1)(viii) YES - NO(*) Details: <example The module meets Portable exclusion levels as shown in the RF exposure information filed with this application.>
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Limited Module Description When Applicable
* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA;
the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>
Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met
- Provided in Separate Cover Letter
- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >
2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.
- Provided in Separate Cover Letter
- N/A Details: <example N/A>
Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained.
- Provided in Separate Cover Letter
- N/A Details: <example N/A >
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?
- YES
- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets thenecessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types
(monopole, PIFA, dipole, etc note that omni-directional is not considered atype) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. Provide information on how to configure test modes for evaluation b. a. 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 Sincerely, By:
manager Liyongsheng
- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.
- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead.
(Signature/Title1)
(Print name)
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2023-07-12 | 3560 ~ 3690 | CBE - Citizens Band End User Devices | Class II Permissive Change |
2 | 2023-07-07 | 3560 ~ 3690 | CBE - Citizens Band End User Devices | Original Equipment |
3 | 2022-11-30 | 2500 ~ 2570 | PCB - PCS Licensed Transmitter | Class II permissive change or modification of presently authorized equipment |
4 | 2022-08-10 | JAV - Other Non-Digital SDoC Devices | Original Equipment | |
5 | 2500 ~ 2570 | PCB - PCS Licensed Transmitter |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 3 4 5 | Effective |
2023-07-12
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1 2 3 4 5 |
2023-07-07
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|||||
1 2 3 4 5 |
2022-11-30
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1 2 3 4 5 |
2022-08-10
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1 2 3 4 5 | Applicant's complete, legal business name |
SIMCom Wireless Solutions Limited
|
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1 2 3 4 5 | FCC Registration Number (FRN) |
0025948449
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1 2 3 4 5 |
0031089808
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1 2 3 4 5 | Physical Address |
Building 3, No.289 Linhong Road
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1 2 3 4 5 |
Shanghai, N/A
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1 2 3 4 5 |
Shanghai, N/A 200335
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1 2 3 4 5 |
China
|
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app s | TCB Information | |||||
1 2 3 4 5 | TCB Application Email Address |
p******@element.com
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1 2 3 4 5 |
t******@metlabs.com
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1 2 3 4 5 | TCB Scope |
B2: General Mobile Radio And Broadcast Services equipment in the following 47 CFR Parts 22 (non-cellular) 73, 74, 90, 95, 97, & 101 (all below 3 GHz)
|
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1 2 3 4 5 |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
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1 2 3 4 5 |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
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app s | FCC ID | |||||
1 2 3 4 5 | Grantee Code |
2AJYU
|
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1 2 3 4 5 | Equipment Product Code |
8XM0001
|
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app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 3 4 5 | Name |
Y******** L******
|
||||
1 2 3 4 5 | Title |
Manage
|
||||
1 2 3 4 5 | Telephone Number |
+86 2********
|
||||
1 2 3 4 5 | Fax Number |
+86 2********
|
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1 2 3 4 5 |
y******@simcom.com
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app s | Technical Contact | |||||
1 2 3 4 5 | Firm Name |
SIMCom Wireless Solutions Limited
|
||||
1 2 3 4 5 | Name |
y**** L******
|
||||
1 2 3 4 5 | Physical Address |
SIMCom Headquarters Building, Building 3
|
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1 2 3 4 5 |
Shanghai
|
|||||
1 2 3 4 5 |
China
|
|||||
1 2 3 4 5 | Telephone Number |
86 21********
|
||||
1 2 3 4 5 |
Y******@simcom.com
|
|||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 3 4 5 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 4 5 | No | |||||
1 2 3 4 5 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 3 4 5 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 3 4 5 | Equipment Class | CBE - Citizens Band End User Devices | ||||
1 2 3 4 5 | PCB - PCS Licensed Transmitter | |||||
1 2 3 4 5 | JAV - Other Non-Digital SDoC Devices | |||||
1 2 3 4 5 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | 4G Module | ||||
1 2 3 4 5 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 3 4 5 | Modular Equipment Type | Does not apply | ||||
1 2 3 4 5 | Single Modular Approval | |||||
1 2 3 4 5 | Limited Single Modular Approval | |||||
1 2 3 4 5 | Purpose / Application is for | Class II Permissive Change | ||||
1 2 3 4 5 | Original Equipment | |||||
1 2 3 4 5 | Class II permissive change or modification of presently authorized equipment | |||||
1 2 3 4 5 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 3 4 5 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 3 4 5 | Grant Comments | This device supports LTE bandwidths of 5, 10, 15, 20 MHz for TDD LTE Band 48. Single Modular Approval. Output power is total conducted per BW at the antenna terminal. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi- transmitter product procedures. OEM integrators and end-Users must be provided with transmitter operating conditions for satisfying RF exposure compliance. The antenna gain, including cable loss, must not exceed 1 dBi for satisfying RF exposure compliance, as defined in 2.1091. | ||||
1 2 3 4 5 | This filing is to add LTE Band 48. This device supports LTE bandwidths of 5, 10, 15, 20 MHz for TDD LTE Band 48. Single Modular Approval. Output power is total conducted per BW at the antenna terminal. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi- transmitter product procedures. OEM integrators and end-Users must be provided with transmitter operating conditions for satisfying RF exposure compliance. The antenna gain, including cable loss, must not exceed 1 dBi for satisfying RF exposure compliance, as defined in 2.1091. | |||||
1 2 3 4 5 | Single Modular Approval. Power listed is conducted. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi- transmitter product procedures. OEM integrators and end-Users must be provided with transmitter operating conditions for satisfying RF exposure compliance. This device contains functions that are not operational in U.S. Territories. This filing is only applicable for U.S. operations. The maximum antenna gain allowed is 1.5dBi. | |||||
1 2 3 4 5 | Limited Modular Approval. Power listed is conducted. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi- transmitter product procedures. OEM integrators and end-Users must be provided with transmitter operating conditions for satisfying RF exposure compliance. This device contains functions that are not operational in U.S. Territories. This filing is only applicable for U.S. operations. The maximum antenna gain allowed is 1.5dBi. | |||||
1 2 3 4 5 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 3 4 5 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 3 4 5 | Firm Name |
Chongqing Academy of Information and Communcations
|
||||
1 2 3 4 5 | Name |
L****** Q******
|
||||
1 2 3 4 5 | Telephone Number |
023-8********
|
||||
1 2 3 4 5 |
l******@caict.ac.cn
|
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
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Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 96 | 3552.5 | 3697.5 | 0.0986 | 2.5 ppm | 4M52G7D | ||||||||||||||||||||||||||||||||||
1 | 2 | 96 | 3560 | 3690 | 0.0979 | 2.5 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 3 | 96 | 3560 | 3690 | 0.0807 | 2.5 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 96 | 3552.5 | 3697.5 | 0.0986 | 2.5 ppm | 4M52G7D | ||||||||||||||||||||||||||||||||||
2 | 2 | 96 | 3560 | 3690 | 0.0979 | 2.5 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
2 | 3 | 96 | 3560 | 3690 | 0.0807 | 2.5 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
3 | 1 | 24E | 1852.4 | 1907.6 | 0.17 | 0.013 ppm | 4M13G7D | ||||||||||||||||||||||||||||||||||
3 | 2 | 24E | 1852.4 | 1907.6 | 0.14 | 0.013 ppm | 4M15W7D | ||||||||||||||||||||||||||||||||||
3 | 3 | 27 | 1710 | 1755 | 0.18 | 0.007 ppm | 4M15G7D | ||||||||||||||||||||||||||||||||||
3 | 4 | 27 | 1710 | 1755 | 0.11 | 0.007 ppm | 4M13W7D | ||||||||||||||||||||||||||||||||||
3 | 5 | 22H | 826.4 | 846.6 | 0.17 | 0.0022 ppm | 4M13G7D | ||||||||||||||||||||||||||||||||||
3 | 6 | 22H | 826.4 | 846.6 | 0.13 | 0.0022 ppm | 4M13G7D | ||||||||||||||||||||||||||||||||||
3 | 7 | 24E | 1850 | 1910 | 0.46 | 0.0054 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
3 | 8 | 24E | 1850 | 1910 | 0.43 | 0.0054 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 9 | 24E | 1850 | 1910 | 0.44 | 0.0054 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 1 | 27 | 1710 | 1755 | 0.47 | 0.0047 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
3 | 11 | 27 | 1710 | 1755 | 0.44 | 0.0047 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 12 | 27 | 1710 | 1755 | 0.43 | 0.0047 ppm | 1M09W7D | ||||||||||||||||||||||||||||||||||
3 | 13 | 27 | 1710 | 1755 | 0.41 | 0.0047 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 14 | 22H | 824 | 849 | 0.51 | 0.007 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 15 | 22H | 824 | 849 | 0.47 | 0.007 ppm | 4M47W7D | ||||||||||||||||||||||||||||||||||
3 | 16 | 22H | 824 | 849 | 0.47 | 0.007 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 17 | 27 | 2500 | 2570 | 0.55 | 0.0027 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
3 | 18 | 27 | 2500 | 2570 | 0.54 | 0.0027 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
3 | 19 | 27 | 2500 | 2570 | 0.54 | 0.0027 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
3 | 2 | 27 | 699 | 716 | 0.62 | 0.0095 ppm | 4M49G7D | ||||||||||||||||||||||||||||||||||
3 | 21 | 27 | 699 | 716 | 0.61 | 0.0095 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 22 | 27 | 699 | 716 | 0.6 | 0.0095 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
3 | 23 | 27 | 699 | 716 | 0.58 | 0.0095 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 24 | 27 | 777 | 787 | 0.53 | 0.0044 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 25 | 27 | 777 | 787 | 0.52 | 0.0044 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 26 | 9 | 788 | 798 | 0.76 | 0.0039 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 27 | 9 | 788 | 798 | 0.67 | 0.0039 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 28 | 27 | 704 | 716 | 0.61 | 0.0063 ppm | 4M49G7D | ||||||||||||||||||||||||||||||||||
3 | 29 | 27 | 704 | 716 | 0.58 | 0.0063 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 3 | 27 | 704 | 716 | 0.57 | 0.0063 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 31 | 24E | 1850 | 1915 | 0.75 | 0.0058 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
3 | 32 | 24E | 1850 | 1915 | 0.7 | 0.0058 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 33 | 24E | 1850 | 1915 | 0.74 | 0.0058 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 34 | 24E | 1850 | 1915 | 0.7 | 0.0058 ppm | 17M8W7D | ||||||||||||||||||||||||||||||||||
3 | 35 | 22H | 824 | 849 | 0.86 | 0.0066 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 36 | 22H | 824 | 849 | 0.77 | 0.0066 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
3 | 37 | 22H | 824 | 849 | 0.75 | 0.0066 ppm | 13M4W7D | ||||||||||||||||||||||||||||||||||
3 | 38 | 9 | 814 | 824 | 0.72 | 0.0066 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
3 | 39 | 9 | 814 | 824 | 0.69 | 0.0066 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 4 | 9 | 814 | 824 | 0.71 | 0.0089 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
3 | 41 | 9 | 814 | 824 | 0.68 | 0.0089 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 42 | 27 | 1710 | 1780 | 1.14 | 0.0042 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
3 | 43 | 27 | 1710 | 1780 | 1.03 | 0.0042 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 44 | 27 | 1710 | 1780 | 1.03 | 0.0042 ppm | 1M09W7D | ||||||||||||||||||||||||||||||||||
3 | 45 | 27 | 663 | 698 | 0.96 | 0.0018 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 46 | 27 | 663 | 698 | 0.9 | 0.0018 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 47 | 27 | 663 | 698 | 0.92 | 0.0018 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 48 | 27 | 2496 | 2690 | 1.14 | 0.0027 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
3 | 49 | 27 | 2496 | 2690 | 0.64 | 0.0027 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
3 | 5 | 27 | 2496 | 2690 | 1.03 | 0.0027 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
3 | 51 | 27 | 2496 | 2690 | 0.61 | 0.0027 ppm | 17M8W7D | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
4 | 1 | 15B | |||||||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
5 | 1 | 24E | 1852.4 | 1907.6 | 0.17 | 0.013 ppm | 4M13G7D | ||||||||||||||||||||||||||||||||||
5 | 2 | 24E | 1852.4 | 1907.6 | 0.14 | 0.013 ppm | 4M15W7D | ||||||||||||||||||||||||||||||||||
5 | 3 | 27 | 1710 | 1755 | 0.18 | 0.007 ppm | 4M15G7D | ||||||||||||||||||||||||||||||||||
5 | 4 | 27 | 1710 | 1755 | 0.11 | 0.007 ppm | 4M13W7D | ||||||||||||||||||||||||||||||||||
5 | 5 | 22H | 826.4 | 846.6 | 0.17 | 0.0022 ppm | 4M13G7D | ||||||||||||||||||||||||||||||||||
5 | 6 | 22H | 826.4 | 846.6 | 0.13 | 0.0022 ppm | 4M13W7D | ||||||||||||||||||||||||||||||||||
5 | 7 | 24E | 1850 | 1910 | 0.46 | 0.0054 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
5 | 8 | 24E | 1850 | 1910 | 0.43 | 0.0054 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
5 | 9 | 24E | 1850 | 1910 | 0.44 | 0.0054 ppm | 17M8W7D | ||||||||||||||||||||||||||||||||||
5 | 1 | 27 | 1710 | 1755 | 0.47 | 0.0047 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
5 | 11 | 27 | 1710 | 1755 | 0.44 | 0.0047 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
5 | 12 | 27 | 1710 | 1755 | 0.43 | 0.0047 ppm | 1M09W7D | ||||||||||||||||||||||||||||||||||
5 | 13 | 27 | 1710 | 1755 | 0.41 | 0.0047 ppm | 17M8W7D | ||||||||||||||||||||||||||||||||||
5 | 14 | 22H | 824 | 849 | 0.51 | 0.007 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 15 | 22H | 824 | 849 | 0.47 | 0.007 ppm | 4M47W7D | ||||||||||||||||||||||||||||||||||
5 | 16 | 22H | 824 | 849 | 0.47 | 0.007 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 17 | 27 | 2500 | 2570 | 0.55 | 0.0027 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
5 | 18 | 27 | 2500 | 2570 | 0.54 | 0.0027 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
5 | 19 | 27 | 2500 | 2570 | 0.54 | 0.0027 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
5 | 2 | 27 | 699 | 716 | 0.62 | 0.0095 ppm | 4M49G7D | ||||||||||||||||||||||||||||||||||
5 | 21 | 27 | 699 | 716 | 0.61 | 0.0095 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 22 | 27 | 699 | 716 | 0.6 | 0.0095 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
5 | 23 | 27 | 699 | 716 | 0.58 | 0.0095 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 24 | 27 | 777 | 787 | 0.53 | 0.0044 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 25 | 27 | 777 | 787 | 0.52 | 0.0044 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 26 | 27 | 788 | 798 | 0.76 | 0.0039 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 27 | 27 | 788 | 798 | 0.67 | 0.0039 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 28 | 27 | 704 | 716 | 0.61 | 0.0063 ppm | 4M49G7D | ||||||||||||||||||||||||||||||||||
5 | 29 | 27 | 704 | 716 | 0.58 | 0.0063 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 3 | 27 | 704 | 716 | 0.57 | 0.0063 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 31 | 24E | 1850 | 1915 | 0.75 | 0.0058 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
5 | 32 | 24E | 1850 | 1915 | 0.7 | 0.0058 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
5 | 33 | 24E | 1850 | 1915 | 0.74 | 0.0058 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 34 | 24E | 1850 | 1915 | 0.7 | 0.0058 ppm | 17M8W7D | ||||||||||||||||||||||||||||||||||
5 | 35 | 22H | 824 | 849 | 0.86 | 0.0066 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 36 | 22H | 824 | 849 | 0.77 | 0.0066 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
5 | 37 | 22H | 824 | 849 | 0.75 | 0.0066 ppm | 13M4W7D | ||||||||||||||||||||||||||||||||||
5 | 38 | 9 | 814 | 824 | 0.72 | 0.0066 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
5 | 39 | 9 | 814 | 824 | 0.69 | 0.0066 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 4 | 9 | 814 | 824 | 0.71 | 0.0089 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
5 | 41 | 9 | 814 | 824 | 0.68 | 0.0089 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 42 | 27 | 1710 | 1780 | 1.14 | 0.0042 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
5 | 43 | 27 | 1710 | 1780 | 1.03 | 0.0042 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
5 | 44 | 27 | 1710 | 1780 | 1.03 | 0.0042 ppm | 1M09W7D | ||||||||||||||||||||||||||||||||||
5 | 45 | 27 | 663 | 698 | 0.96 | 0.0018 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
5 | 46 | 27 | 663 | 698 | 0.9 | 0.0018 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
5 | 47 | 27 | 663 | 698 | 0.92 | 0.0018 ppm | 17M8W7D | ||||||||||||||||||||||||||||||||||
5 | 48 | 27 | 2496 | 2690 | 1.14 | 0.0027 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
5 | 49 | 27 | 2496 | 2690 | 0.64 | 0.0027 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
5 | 5 | 27 | 2496 | 2690 | 1.03 | 0.0027 ppm | 8M94W7D | ||||||||||||||||||||||||||||||||||
5 | 51 | 27 | 2496 | 2690 | 0.61 | 0.0027 ppm | 17M8W7D |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC