FCC ID: 2AJYU-8PYA003 LTE /HSPA/GSM/GNSS MODULE

SIM7600G/G-H_Hardware Design_V1.01 Smart Machine Smart Decision Document Title SIM7600G/SIM7600G-H_Hardware Design Version Date Status 1.01 2019-10-21 Released Document Control ID SIM7600G_SIM7600G-H_Hardware Design _V1.01 General Notes SIMCom offers this information as a service to its users to support the application and engineering efforts that use the products designed by SIMCom. The information provided is based on the requirements specifically from the users. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the users possession. Furthermore, the system validation of the product designed by SIMCom within a larger electronic system remains the responsibility of the user or the users system integrator. All specifications supplied herein are subject to change without notice. Copyright This document contains the proprietary technical information which is the property of SIMCom Limited, copying of this document, giving it to others, the using or communication of the contents thereof are forbidden without the official authority by SIMCom. Offenders are liable to the payment of the damages. All rights are reserved in the event of grant of a patent or the registration of a utility model or design. All specifications supplied herein are subject to change without notice Copyright SIMCom Wireless Solutions Co., Ltd. 2019 SIM7600G_SIM7600G-H_Hardware Design _V1.01 2 2019-10-21 Smart Machine Smart Decision FCC Caution:

(1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

(2) Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment.

(3) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

(4) Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user authority to operate the equipment.

(6) Labelling requirements:This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation.

(6) if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID:

2AJYU-8PYA003 or Contains FCC ID: 2AJYU-8PYA003 must be used. This product is suitable for collocation internal and external antenna.Gain the scope of the reference is as follows:

Smart Machine Smart Decision Contents Contents .............................................................................................................................................3 Revision History ................................................................................................................................5 1 Introduction ................................................................................................................................6 1.1 Product Outline .....................................................................................................................6 1.2 Hardware Interface Overview ...............................................................................................7 1.3 Hardware Block Diagram......................................................................................................8 1.4 Functional Overview .............................................................................................................9 2 Package Information................................................................................................................ 11 2.1 Pin Assignment Overview ................................................................................................... 11 2.2 Pin Description ....................................................................................................................14 2.3 Mechanical Information ......................................................................................................19 2.4 Footprint Recommendation .................................................................................................20 3 Interface Application ...............................................................................................................21 3.1 Power Supply ......................................................................................................................21 3.1.1 Power Supply Design Guide ........................................................................................22 3.1.2 Recommended Power Supply Circuit ..........................................................................23 3.1.3 Voltage Monitor ............................................................................................................23 3.2 Power on/Power off/Reset Function ....................................................................................24 Power on .......................................................................................................................24 3.2.1 3.2.2 Power off ......................................................................................................................25 3.2.3 Reset Function ..............................................................................................................26 3.3 UART Interface ...................................................................................................................27 3.3.1 UART Design Guide ....................................................................................................27 3.3.2 RI and DTR Behavior ...................................................................................................29 3.4 USB Interface ......................................................................................................................30 3.5 HSIC interface .....................................................................................................................31 3.7 SGMII Interface ..................................................................................................................31 3.7.1 Reference schematic with AR8033 ..............................................................................32 3.7.2 Reference schematic with BCM89820 .........................................................................33 3.8 USIM Interface....................................................................................................................34 3.8.1 USIM Application Guide ..............................................................................................34 3.9 PCM Interface .....................................................................................................................38 PCM timing ..................................................................................................................38 PCM Application Guide ...............................................................................................39 SD Interface .....................................................................................................................40 I2C Interface ....................................................................................................................42 SDIO Interface .................................................................................................................42 SPI Interface ....................................................................................................................42 Network status .................................................................................................................43 Flight Mode Control ........................................................................................................43 Other interface .................................................................................................................44 3.10 3.11 3.12 3.13 3.14 3.15 3.16 SIM7600G_SIM7600G-H_Hardware Design _V1.01 3 2019-10-21 3.9.1 3.9.2 3.16.1 3.16.2 3.16.3 Sink Current Source ..................................................................................................44 ADC ..........................................................................................................................45 LDO ..........................................................................................................................45 Smart Machine Smart Decision 4 RF Specifications ......................................................................................................................47 4.7 GSM/UMTS/LTE RF Specifications ..................................................................................47 4.8 GSM /UMTS/LTE Antenna Design Guide ..........................................................................50 4.9 GNSS ..................................................................................................................................51 4.9.1 GNSS Technical specification ......................................................................................52 4.9.2 GNSS Application Guide .............................................................................................52 5 Electrical Specifications ...........................................................................................................54 5.7 Absolute maximum ratings .................................................................................................54 5.8 Operating conditions ...........................................................................................................54 5.9 Operating Mode ..................................................................................................................55 5.9.1 Operating Mode Definition ..........................................................................................55 5.9.2 Sleep mode ...................................................................................................................56 5.9.3 Minimum functionality mode and Flight mode ............................................................56 Current Consumption .......................................................................................................57 ESD Notes .......................................................................................................................59 5.10 5.11 6 SMT Production Guide ...........................................................................................................60 6.7 Top and Bottom View of MODULE ...................................................................................60 6.8 Label Information ................................................................................................................61 6.9 Typical SMT Reflow Profile ...............................................................................................62 6.10 Moisture Sensitivity Level (MSL) ...................................................................................62 6.11 Stencil Foil Design Recommendation..............................................................................63 7 Packaging ..................................................................................................................................64 Appendix ..........................................................................................................................................66

. Coding Schemes and Maximum Net Data Rates over Air Interface .......................................66

. Related Documents ..................................................................................................................68

. Terms and Abbreviations ........................................................................................................70

. Safety Caution .........................................................................................................................72 SIM7600G_SIM7600G-H_Hardware Design _V1.01 4 2019-10-21 Smart Machine Smart Decision 1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom MODULE. With the help of this document and other software application notes/user guides, users can understand and use MODULE to design and develop applications quickly. 1.1 Product Outline Aimed at the global market, the MODULE support GSM, WCDMA, LTE-TDD and LTE-FDD. Users can choose the MODULE according to the wireless network configuration. The supported radio frequency bands are described in the following table. Table 1: Module frequency bands Standard Frequency SIM7600G SIM7600G-H GSM WCDMA 850MHz 900MHz 1800M Hz 1900M Hz B1 B2 B4 B5 B6 B8 B19 FDD B1 FDD B2 FDD B3 FDD B4 FDD B5 FDD B7 LTE FDD B8 FDD B12 FDD B13 FDD B18 FDD B19 FDD B20 FDD B25 SIM7600G_SIM7600G-H_Hardware Design _V1.01 6 2019-10-21 Smart Machine Smart Decision FDD B26 FDD B28 FDD B66 TDD B34 TDD B38 TDD B39 TDD B40 TDD B41 Category CAT1 CAT4 With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the MODULE can meet almost any space requirement in users applications, such as smart phone, PDA, industrial handheld, machine-to-machine and vehicle application, etc. 1.2 Hardware Interface Overview The interfaces are described in detail in the next chapters include:

Power Supply USB2.0 Interface UART Interface MMC/SD Interface SDIO Interface USIM Interface SPI Interface GPIO ADC LDO Power Output Current Sink Source PCM Interface SPI Interface I2C Interface HSIC Interface SGMII Interface SIM7600G_SIM7600G-H_Hardware Design _V1.01 7 2019-10-21 Smart Machine Smart Decision 1.3 Hardware Block Diagram The block diagram of the MODULE is shown in the figure below. Figure 1: MODULE block diagram SIM7600G_SIM7600G-H_Hardware Design _V1.01 8 2019-10-21 Smart Machine Smart Decision 1.4 Functional Overview Table 2: General features Feature Power supply Power saving Radio frequency bands Implementation Single supply voltage 3.44.2V, Recommend supply voltage 3.8V Current in sleep mode : <5mA Please refer to the table 1 GSM/GPRS power class:

--GSM850: 4 (2W)

--EGSM900: 4 (2W)

--DCS1800: 1 (1W)

--PCS1900: 1 (1W) EDGE power class:

--GSM850: E2 (0.5W)

--EGSM900: E2 (0.5W)

--DCS1800: E1 (0.4W)

--PCS1900: E1 (0.4W) UMTS power class:

--WCDMA :3 (0.25W) LTE power class: 3 (0.25W) GPRS multi-slot class 12 EDGE multi-slot class 12 UMTS R99 speed: 384 kbps DL/UL HSPA+: 5.76 Mbps(UL), 42 Mbps(DL) HSDPA/HSUPA: 2.2 Mbps(UL), 2.8 Mbps(DL) LTE CAT 1: 10 Mbps(DL) 5 Mbps(UL) LTE CAT 4 :150 Mbps (DL) 50 Mbps (UL) GSM/UMTS/LTE main antenna. UMTS/LTE auxiliary antenna GNSS antenna GNSS engine (GPS,GLONASS and BD) Protocol: NMEA 0183 MT, MO, CB, Text and PDU mode SMS storage: USIM card or ME(default) Transmission of SMS alternatively over CS or PS. Transmitting power Data Transmission Throughput Antenna GNSS SMS USIM interface Support identity card: 1.8V/ 3V USIM application toolkit Phonebook management Support SAT class 3, GSM 11.14 Release 98 Support USAT Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN SIM7600G_SIM7600G-H_Hardware Design _V1.01 9 2019-10-21 Audio feature UART interface MMC/SD SDIO USB Smart Machine Smart Decision Support PCM interface Only support PCM master mode and short frame sync, 16-bit linear data formats A full modem serial port by default Baud rate: 300bps to 4Mbps(default:115200bps) Autobauding baud rate: 9600,19200,38400,57600,115200bps Can be used as the AT commands or data stream channel Support RTS/CTS hardware handshake Multiplex ability according to GSM 07.10 Multiplexer Protocol Support MMC and SD cards with 2.85 V on SD port Support SDIO with 1.8 V only on SDIO port USB 2.0 high speed interface, Can used be send AT command, Software update, GNSS NMEA,USB voice function etc. Firmware upgrade Firmware upgrade over USB interface or FOTA Physical characteristics Size:30*30*2.9m Weight:5.7 g Temperature range Normal operation temperature: -30C to +80C Extended operation temperature: -40C to +85C*

Storage temperature -45C to +90C

*Note: Module is able to make and receive voice calls, data calls, SMS and make GPRS/UMTS/HSPA+/LTE traffic in -40 ~ +85. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range. SIM7600G_SIM7600G-H_Hardware Design _V1.01 10 2019-10-21 Smart Machine Smart Decision 2 Package Information 2.1 Pin Assignment Overview All functions of the MODULE will be provided through 135 pads that will be connected to the users platform. The following Figure is a high-level view of the pin assignment of the MODULE. GND GND PWRKEY RESET GND

*SPI_CLK

*SPI_MISO

*SPI_MOSI

*SPI_CS GND USB_VBUS USB_DN USB_DP GND VDD_1V8 USB_ID USIM_DATA USIM_RST USIM_CLK USIM_VDD GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 81 85 USB_BOOT*

60 GND AUX_ANT 88 89 90 91 92 93 94 95 RESERVED RESERVED RESERVED RESERVED RESERVED GND GPIO4 GPIO2 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 RESERVED 111 GND 110 SGMII_INT_N 109 SGMII_RST_N 108 RESERVED 107 DBG_RXD RESERVED 106 105 RESERVED 104 120-135 GND 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 82 GND GND SDA SCL FLIGHTMODE*

USIM_DET*

GPIO41*

NETLIGHT GPIO43*

STATUS SD_DET ADC1 ADC2 ISINK VDD_AUX GND DBG_TXD GND MAIN_ANT GND UART USB SDC VBAT USIM SDIO SGMII PCM I2C SPI RESERVED Figure 2: Pin assignment overview SIM7600G_SIM7600G-H_Hardware Design _V1.01 11 2019-10-21 Table 3: Pin definition Smart Machine Smart Decision Pin No. Pin name Pin No. Pin name 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 GND PWRKEY GND SPI_MISO*

SPI_CS*

USB_VBUS USB_DP VDD_1V8 USIM_DATA USIM_CLK SD_CMD SD_DATA1 SD_DATA3 SDIO_DATA1 SDIO_CMD SDIO_DATA3 GPIO3*

HSIC_STROBE GND VBAT GND GND ISINK ADC1 STATUS NETLIGHT USIM_DET*

SCL GND AUX_ANT GND VBAT GND CTS 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 GND RESET SPI_CLK*

SPI_MOSI*

GND USB_DN GND USB_ID USIM_RST USIM_VDD SD_DATA0 SD_DATA2 SD_CLK SDIO_DATA2 SDIO_DATA0 SDIO_CLK GPIO6*

HSIC_DATA VBAT GND DBG_TXD VDD_AUX ADC2 SD_DET GPIO43*

GPIO41*

FLIGHTMODE*

SDA GND GND VBAT GND RTS RXD SIM7600G_SIM7600G-H_Hardware Design _V1.01 12 2019-10-21 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 121 123 125 127 129 131 133 135 RI TXD PCM_OUT PCM_SYNC GND GNSS_ANT GND COEX1*

BOOT_CFG0*

GPIO77 RESERVED RESERVED GND GPIO2 GPIO_54 RESERVED RESERVED RESERVED RESERVED RESERVED SGMII_INT_N RESERVED SGMII_RX_M SGMII_TX_P SGMII_MDC GPIO_19 GND GND GND GND GND GND GND GND Smart Machine Smart Decision 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 122 124 126 128 130 132 134 DCD DTR PCM_IN PCM_CLK GND GND MAIN_ANT COEX2*

COEX3*

RESERVED RESERVED RESERVED GPIO4 GPIO1 GND RESERVED RESERVED RESERVED DBG_ RXD SGMII_RST_N GND SGMII_RX_P SGMII_TX_M SGMII_MDIO GND GND GND GND GND GND GND GND GND NOTE: Means Before the normal power up, COEX1, COEX3 or BOOT_CFG0 cannot be pulled up, otherwise module will not be powered up normally.

* Means that pins has MUX function. SIM7600G_SIM7600G-H_Hardware Design _V1.01 13 2019-10-21 Smart Machine Smart Decision 2.2 Pin Description Table 4: IO parameters definition Pin type Description PI PO AI AIO I/O DI DO DOH DOL PU PD Power input Power output Analog input Analog input/output Bidirectional input /output Digital input Digital output Digital output with high level Digital output with low level Pull up Pull down Table 5: Pin description Pin name Pin No. Default status Description Comment Power supply VBAT 38,39, 62,63 PI VDD_AUX 44 PO VDD_1V8 15 PO Power supply, voltage range:

3.44.2V. LDO power output for other external circuits with Max 150mA current output. Its output voltage is 2.85V by default.The voltage can be configured from 1.7V to 3.05V by AT command. 1.8 output with Max 50mA current output for external circuit, such as level shift circuit. If used SGMII function ,this pin used for SGMII function. If unused, keep it open. If unused, keep it open. GND 1,2,5, 10,14,37

,40,41,4 3,57,58, 60,61,64

,65,77,7 8,80,81, 93,96,11 0,118,12 0,121,12 2,123,12 4,125,12 6,127,12 8,129,13 Ground SIM7600G_SIM7600G-H_Hardware Design _V1.01 14 2019-10-21 0,131,13 2,133,13 4135 System Control PWRKEY RESET SD interface SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 SD_CLK SD_DET USIM interface 3 4 21 22 23 24 25 26 48 Smart Machine Smart Decision DI,PU System power on/off control input, active low. DI, PU System reset control input, active low. The high voltage is 0.8V;

RESET has been pulled up to 1.8V via 40Kohm resistor internally. I/O,PD SDIO command I/O,PD I/O,PD I/O,PD I/O,PD DO DI,PU SDIO data SDIO clock SD card insertion detect H: SD card is removed L: SD card is inserted If unused, keep them open. USIM_DATA 17 I/O,PU USIM Card data I/O, which has been pulled up via a 10KR resistor to USIM_VDD internally. Do not pull it up or down externally. USIM_RST USIM_CLK 18 19 DO,PD USIM Reset DO,PD USIM clock USIM_VDD 20 PO,PD Power output for USIM card, its output Voltage depends on USIM card type automatically. Its output current is up to 50mA. All lines of USIM interface should be protected against ESD. SPI interface SPI_CLK*

SPI_MISO*

SPI_MOSI*

SPI_CS*

USB USB_VBUS USB_DN 6 7 8 9 11 12 DO DI DO DO AI SPI clock output SPI master in/slave out data SPI master out/slave in data SPI chip-select output Default SPI Optional: BT uart function Valid USB detection input with 3.0~5.25V detection voltage AI, AO Negative line of the differential, bi-directional USB signal. SIM7600G_SIM7600G-H_Hardware Design _V1.01 15 2019-10-21 Smart Machine Smart Decision AI, AO Positive line of the differential, bi-directional USB signal. AI High-speed USB ID input Keep it open. USB_DP USB_ID SGMII interface SGMII_RX_P SGMII_RX_M SGMII_TX_M SGMII_TX_P 13 16 112 113 114 115 SGMII_RST_N 108 AI AI AO AO DO SGMII receive positive SGMII receive - negative SGMII transmit - negative SGMII transmit positive Ethernet PHY reset SGMII_INT_N 109 DI,PU Ethernet PHY interrupt SGMII_MDIO 116 DIO Management data input/output-data SGMII_MDC 117 DO Management data input/output-clock UART interface RTS CTS RXD RI DCD TXD DTR DBG_UART 66 67 68 69 70 71 72 DOH DI DI DOH DOH DOH DI,PU Request to send Clear to Send Receive Data Ring Indicator Carrier detects Transmit Data DTE get ready DBG_TXD 42 DO Log output DBG_RXD 106 DI Log input I2C interface SCL SDA 55 56 OD I2C clock output OD I2C data input/output SDIO interface SDIO_DATA1 SDIO_DATA2 SDIO_CMD SIM7600G_SIM7600G-H_Hardware Design _V1.01 I/O I/O I/O 27 28 29 SDIO data1 SDIO data2 SDIO command If unused, keep them open. External 1.5K pull-up resistor from 3.3V/2.5V to MDIO_DATA and 10K pull-up resistor from VDD_1V8 to ETH_INT_N are needed when the Ethernet PHY is connected. If unused, please keep them open. If unused, keep them open. If unused, keep them open. If unused, keep open, or else pull them up via 2.2K resistors to 1.8V. It can be used for WLAN function. If unused, please 16 2019-10-21 Smart Machine Smart Decision keep them open. SDIO data0 SDIO data3 SDIO clock If use, please refer to document [27]

Otherwise keep them open. please If unused, please keep them open. unused, If them open. keep HSIC strobe wakeup HSIC data DO,PD DI,PD I/O,PD I/O,PU PCM data output. PCM data input. PCM data frame sync signal. PCM data bit clock. LED control output as network status indication. Operating status output. High level: Power on and firmware ready Low level: Power off Default: GPIO Default: GPIO Default: GPIO Default: GPIO Default: GPIO DO,PU IO,PD IO,PD IO,PD IO,PD IO,PD AIO MAIN antenna soldering pad AI AI PI AI AI GNSS antenna soldering pad Auxiliary antenna soldering pad Ground-referenced current sink. Analog-digital converter input 1 Analog-digital converter input 2 If unused, please keep them open. Reserved for future use Please keep open. them I/O I/O DO I/O I/O SDIO_DATA0 SDIO_DATA3 SDIO_CLK HSIC interface HSIC_STROBE HSIC_DATA PCM interface PCM_OUT PCM_IN PCM_SYNC PCM_CLK GPIO 30 31 32 35 36 73 74 75 76 NETLIGHT 51 DO,PU STATUS GPIO4 GPIO2 GPIO1 GPIO_54 GPIO_19 RF interface MAIN _ANT GNSS_ANT AUX_ANT Other interface ISINK ADC1 ADC2 RESERVED 49 94 95 96 97 119 82 79 59 45 47 46 88,89,90

,91,92,9 9,100,10 1,102,10 3,104,10 5,107,11 1 Mux function interface COEX1*

83 I/O RF synchronizing between Wi-Fi and LTE. Default:COEX1*

Option:WLAN_EN SIM7600G_SIM7600G-H_Hardware Design _V1.01 17 2019-10-21 Smart Machine Smart Decision COEX2*

COEX3*

84 86 I/O I/O RFsynchronizing between Wi-Fi and LTE. RF synchronizing between Wi-Fi and LTE. BOOT_CFG0* 85 DI,PD FLIGHTMODE*

54 DI,PU Boot configuration input. Module will be forced into USB download mode by connect 85 pin to VDD_1V8 during power up. level(or open): Normal Flight Mode control input. High Mode Low level: Flight Mode GPIO3*

GPIO6*

33 34 IO IO GPIO GPIO USIM_DET*

53 IO Default: GPIO Optional: USIM card detecting input. H: USIM is removed L: USIM is inserted GPIO77*

GPIO43*

GPIO41*

87 50 52 IO GPIO I/O,PD GPIO I/O,PD GPIO Default:COEX2*

Option: WoWWAN Default:COEX3*

Option:BT_PCM_C LK Default:

BOOT_CFG0*

Option:COEX_RX D Do place 2 test points for debug. DO NOT PULL UP BOOT_CFG0 DURING NORMAL POWER UP!

Default:

FLIGHTMODE*

Option:BT_PCM_I N Default:GPIO3*

Option:WL_PWR_ EN Default:GPIO6*

Option:WL_SLP_C LK Default:USIM_DE T*

Option:BT_EN Default:GPIO77*

Option:BT_PCM_O UT Default:GPIO43*

Option:COEX_TX D Default:GPIO41*

Option:BT_PCM_S YNC SIM7600G_SIM7600G-H_Hardware Design _V1.01 18 2019-10-21 Smart Machine Smart Decision 2.3 Mechanical Information The following figure shows the package outline drawing of MODULE. Figure 3: Dimensions (Unit: mm) SIM7600G_SIM7600G-H_Hardware Design _V1.01 19 2019-10-21 Smart Machine Smart Decision 2.4 Footprint Recommendation Figure 4: Footprint recommendation (Unit: mm) SIM7600G_SIM7600G-H_Hardware Design _V1.01 20 2019-10-21 Smart Machine Smart Decision 3 Interface Application 3.1 Power Supply The power supply pins of MODULE include 4 pins (pin 62&63, pin 38&39) named VBAT. The 4 VBAT pads supply the power to RF and baseband circuits directly. On VBAT pads, the ripple current up to 2A typically, due to GSM/GPRS emission burst (every 4.615ms), may cause voltage drop. So the power supply for these pads must be able to provide sufficient current up to more than 2A in order to avoid the voltage drop is more than 300mV. The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase. Figure 5: VBAT voltage drop during burst emission (GSM/GPRS) Note: The test condition: The voltage of power supply for VBAT is 3.8V, Cd=100 F tantalum capacitor (ESR=0.7) and Cf=100nF (Please refer to Figure 6Application circuit). Table 6: VBAT pins electronic characteristic Symbol VBAT Description Module power voltage Module power peak current in normal mode. IVBAT(peak) IVBAT(average) IVBAT(sleep) IVBAT(power-off) Module power current in power off mode. Power supply current in sleep mode Module power average current in normal mode Min. Typ. Max. Unit 3.4 3.8

2 4.2

V A Please refer to the table 34

20 uA SIM7600G_SIM7600G-H_Hardware Design _V1.01 21 2019-10-21 3.1.1 Power Supply Design Guide Smart Machine Smart Decision Make sure that the voltage on the VBAT pins will never drop below 3.4V, even during a transmit burst, when current consumption may rise up to 2A. If the voltage drops below 3.4V, the RF performance may be affected. Note: If the power supply for VBAT pins can support up to 2A, more than 300uF capacitors are recommended .Otherwise users must use a total of 1000uF capacitors typically, in order to avoid of the voltage drop more than 300mV. Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMC. These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the recommended circuit. Recommend Bead for vbat filter are BLM21PG300SN1D and MPZ2012S221A Figure 6: Power supply application circuit In addition, in order to guard for over voltage protection, it is suggested to use TVS. Note: user could only power pin 62, 63 or only power pin 38, 39, for these pins are connected inside the MODULE. Table 7: Recommended TVS list No. Manufacturer Part Number Power dissipation Package 1 2 3 4 5*

6*

JCET WAYON WILLSEMI WILLSEMI PRISEMI WAYON ESDBW5V0A1 WS05DPF-B ESD5611N ESD56151W05 PESDHC2FD4V5BH WS4.5DPV 5V 5V 5V 5V 4.5V 4.5V DFN1006-2L DFN1006-2L DFN1006-2L SOD-323 DFN1006-2L DFN1610-2L Note: If user chooses TVS, please pay attention to Clamping Voltage in your datasheet . For example when the surge input is 100V,the Clamping Voltage is less than 10V.

*If vbat is higher than 3.8V, do not choose 5 and 6. SIM7600G_SIM7600G-H_Hardware Design _V1.01 22 2019-10-21 3.1.2 Recommended Power Supply Circuit Smart Machine Smart Decision It is recommended that a switching mode power supply or a linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist a peak current up to 2A. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output. Figure 7: Linear regulator reference circuit If there is a big voltage difference between input and output for VBAT power supply, or the efficiency is extremely important, then a switching mode power supply will be preferable. The following figure shows the switching mode power supply reference circuit. Figure 8: Switching mode power supply reference circuit Note: The Switching Mode power supply solution for VBAT must be chosen carefully against Electro Magnetic Interference and ripple current from depraving RF performance. 3.1.3 Voltage Monitor To monitor the VBAT voltage, the AT command AT+CBC can be used. For monitoring the VBAT voltage outside or within a special range, the AT command AT+CVALARM can be used to enable the under-voltage warning function. If users need to power off MODULE, when the VBAT voltage is out of a range, the AT command AT+CPMVT can be used to enable under-voltage power-off function. Note: Under-voltage warning function and under-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1]. SIM7600G_SIM7600G-H_Hardware Design _V1.01 23 2019-10-21 Smart Machine Smart Decision 3.2 Power on/Power off/Reset Function 3.2.1 Power on MODULE can be powered on by pulling the PWRKEY pin down to ground. The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode, close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the following figure for the recommended reference circuit. Figure 9: Reference power on/off circuit Note: Module could be automatically power on by connecting PWRKEY pin to ground via 0R resistor directly. The power-on scenarios are illustrated in the following figure. Ton VBAT PWRKEY

(Input) STATUS

(Output) UART Port Undefined Ton(status

) Ton(uart

) Ton(usb) USB Port Undefined VDD_AUX Ton(vdd_aux) Active Active Figure 10: Power on timing sequence SIM7600G_SIM7600G-H_Hardware Design _V1.01 24 2019-10-21 Smart Machine Smart Decision Table 8: Power on timing and electronic characteristic Symbol Parameter Min. Ty p. 100 500 15 16 The time of active low level impulse of PWRKEY pin to power on MODULE The time from power-on issue to STATUS pin output high level(indicating power up ready ) The time from power-on issue to UART port ready 13 The time from power-on issue to VDD_AUX ready The time from power-on issue to USB port ready Input high level voltage on PWRKEY pin Input low level voltage on PWRKEY pin 11 0.6

-0.3 14 2.5 12 0.8 0 Max. Unit

1.8 0.5 ms s s s s V V Ton Ton(status) Ton(uart) Ton(vdd_aux) Ton(usb) VIH VIL 3.2.2 Power off The following methods can be used to power off MODULE. Method 1: Power off MODULE by pulling the PWRKEY pin down to ground. Method 2: Power off MODULE by AT command AT+CPOF. Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by AT command AT+CPMVT. Method 4: over-temperature or under-temperature automatic power off. Note: If the temperature is outside the range of -30~+80, some warning will be reported via AT port. If the temperature is outside the range of -40~+85, MODULE will be powered off automatically. For details about AT+CPOF and AT+CPMVT, please refer to Document [1]. These procedures will make MODULE disconnect from the network and allow the software to enter a safe state, and save data before MODULE be powered off completely. The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure. SIM7600G_SIM7600G-H_Hardware Design _V1.01 25 2019-10-21 Smart Machine Smart Decision Figure 11: Power off timing sequence Table 9: Power off timing and electronic characteristic Symbol Parameter Time value Min. Typ. Max. Unit Toff Toff(status) The active low level time pulse on PWRKEY pin to power off MODULE

2.5

The time from power-off issue to STATUS pin output low level(indicating power off )*

25 26

The time from power-off issue to USB port off The time from power-off issue to UART port off Toff(uart) Toff(usb) Toff-on

*Note: The STATUS pin can be used to detect whether MODULE is powered on or not. When MODULE has been powered on and firmware goes ready, STATUS will be high level, or else STATUS will still low level. The buffer time from power-off issue to power-on issue 14 15 27 28 0

s s s s s 3.2.3 Reset Function MODULE can be reset by pulling the RESET pin down to ground. Note: This function is only used as an emergency reset, when AT command AT+CPOF and the PWRKEY pin all have lost efficacy. The RESET pin has been pulled up with a 40K resistor to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the RESET pin. Please refer to the following figure for the recommended reference circuit. SIM7600G_SIM7600G-H_Hardware Design _V1.01 26 2019-10-21 Smart Machine Smart Decision Figure 12: Reference reset circuit Table 10: RESET pin electronic characteristic Symbol Description Min. Typ. Max. Unit The active low level time impulse on RESET pin to reset MODULE Input high level voltage Input low level voltage 100 200 500 ms 1.17

-0.3 1.8 0 2.1 0.8 V V Treset VIH VIL 3.3 UART Interface MODULE provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE

(Data Communication Equipment). AT commands and data transmission can be performed through UART interface. 3.3.1 UART Design Guide The following figures show the reference design. SIM7600G_SIM7600G-H_Hardware Design _V1.01 27 2019-10-21 Smart Machine Smart Decision Figure 13: UART full modem Figure 14: UART null modem The MODULE UART is 1.8V voltage interface. If users UART application circuit is 3.3V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas Instruments is recommended. The following figure shows the voltage matching reference design. VDD_1V8 or External 1V8 MODULE 100nF TXD RXD RTS CTS DTR DCD RI UART port 47K TXB0108RGYR VCCA OE A1 A2 A3 A4 A5 A6 A7 A8 VCCB GND B1 B2 B3 B4 B5 B6 B7 B8 3.3V 100nF 47K TXD_3.3V RXD_3.3V RTS_3.3V CTS_3.3V DTR_3.3V DCD_3.3V RI_3.3V Figure 15: Reference circuit of level shift User can use another level shifter circuits as follow SIM7600G_SIM7600G-H_Hardware Design _V1.01 28 2019-10-21 Smart Machine Smart Decision Figure 16: level matching circuit To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect MODULE to the RS-232-C interface, for example SP3238ECA, etc. Note1: User needs to use high speed transistors such as MMBT3904. Note2: MODULE supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate is 115200bps. 3.3.2 RI and DTR Behavior The RI pin can be used to interrupt output signal to inform the host controller such as application CPU. Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming, and then it will change to low level. SIM7600G_SIM7600G-H_Hardware Design _V1.01 29 2019-10-21 Smart Machine Smart Decision Figure 177: RI behaviourSMS and URC report Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is answered or hung up. Figure 188 : RI behaviourvoice call Note: For more details of AT commands about UART, please refer to document [1] and [22]. DTR pin can be used to wake MODULE from sleep. When MODULE enters sleep mode, pulling down DTR can wake MODULE. 3.4 USB Interface The MODULE contains a USB interface compliant with the USB2.0 specification as a peripheral, but the USB charging function is not supported. MODULE can be used as a USB device. MODULE supports the USB suspend and resume mechanism which can reduce power consumption. If there is no data transmission on the USB bus, MODULE will enter suspend mode automatically, and will be resumed by some events such as voice call, receiving SMS, etc. SIM7600G_SIM7600G-H_Hardware Design _V1.01 30 2019-10-21 Smart Machine Smart Decision Figure19: USB reference circuit Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction capacitance of the ESD component on USB data lines. Typically, the capacitance should be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G provided by On Semiconductor (www.onsemi.com ). D3 is suggested to select the diode with anti-ESD and voltage surge function, or user could add a TVS for surge clamping. The recommend TVS please refer to table 7. NoteThe USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance. 3.5 HSIC interface HSIC is a 2-signal source synchronous serial interface which uses 240MHz DDR signaling to provide High-Speed 480Mbps USB transfers which are 100% host driver compatible with traditional USB cable-connected topologies. Full-Speed (FS) and Low-Speed (LS) USB transfers are not directly supported by the HSIC interface (a HSIC enabled hub can provide FS and LS support, as well as IC_USB support) The differences between HSIC and USB2.0 are listed below:

Table 11: Key differences between HSIC and HS-USB HSIC Signal-ended signaling at 1.2 V Two signals STROBE, DATA Double data rate signaling HS-USB 480 Mbps only Maximum trace length of 10 cm No HS chirp protocol Lower power consumption (digital) No concept of disconnect USB2.0 Differential signaling Four wires Ground, D+, D-, VBUS Data inferred from differential signaling HS/FS/LS support Maximum cable length of 5 m HS chirp protocol Higher power consumption (analog) Hot plug/play support module implements a HSIC interface compliant with the HSIC1.0 specification which can be used to connect to the external IC. Note: The module HSIC default work as HSIC to LAN function, if user have any other questions , please contact simcom for more details. 3.6 SGMII Interface MODULE provides a SGMII interface with an Ethernet MAC embedded, users could add a PHY to connect to the Ethernet, and the PHY device could be controlled by the MDIO interface and other dedicated signals. Two Ethernet PHY are supported: AR8031/AR8033 (Qualcomm) and BCM89820 (Broadcom). The AR8031/AR8033 is used for the industrial field and the BCM89820 is dedicated for the automotive field. SIM7600G_SIM7600G-H_Hardware Design _V1.01 31 2019-10-21 Smart Machine Smart Decision IEEE 802.3 Ethernet 10/100/1000Mbps, SGMII IF Main features of SGMII:

Ethernet Mac integrated in the module Supports IEEE 1588, Precision Time Protocol (PTP) Full duplex rated to 1 Gbps Half/full duplex for 10/100 Mbps Can be external Ethernet PHY 10/100/1000Mbps), BCM89820(automotive 10/100Mbps) connected to like AR8031/AR8033(industrial Uses 8B10B encoding of data with effective baud data rate of 1 Gbps, data rate is always 1.25 Gbps (or DDR clock is always at 625 MHz) Main features of MDIO:

Host mode only Dual voltage: 1.8 V or 2.85 V operation Default signal frequency: 6.25MHz MDIO_DATA is OD-gate, and requires an external 1.5 k pull-up resistor to VMDIO. For the AR8031/AR8033, User should provide 3.3V to power the external Ethernet PHY system and the current should be more than 200mA. 3.6.1 Reference schematic with AR8033 Figure20: Reference SGMII circuit with AR8033 For the BCM89820, Users should provide 3.3V and 1.2V to power the external Ethernet PHY system and the data interface of PHY. The current of 3.3V and 1.2V should be more than 100mA and 150mA. SIM7600G_SIM7600G-H_Hardware Design _V1.01 32 2019-10-21 Smart Machine Smart Decision 3.6.2 Reference schematic with BCM89820 Figure21: Reference SGMII circuit with BCM89820 Note: The module SGMII function default closed. If user need, please contact SIMCom for more details or refer to document [28]

SIM7600G_SIM7600G-H_Hardware Design _V1.01 33 2019-10-21 Unit V Unit V USIM_ VDD VIH VIL VOH VOL USIM_ VDD VIH VIL VOH VOL Smart Machine Smart Decision 3.7 USIM Interface MODULE supports both 1.8V and 3.0V USIM Cards. Table 12: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V) Symbol Parameter Min. Typ. Max. LDO power output voltage 1.75 1.8 1.95 High-level input voltage 0.65*USIM_VDD Low-level input voltage

-0.3 High-level output voltage USIM_VDD -0.45 Low-level output voltage 0

0

0 USIM_VDD +0.3 V 0.35*USIM_VDD V USIM_VDD 0.45 V V Table 123: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V) Symbol Parameter Min. Typ. Max. LDO power output voltage 2.75 2.95 3.05 High-level input voltage 0.65*USIM_VDD Low-level input voltage

-0.3 High-level output voltage USIM_VDD -0.45 Low-level output voltage 0

0

0 USIM_VDD +0.3 V 0.25*USIM_VDD V USIM_VDD 0.45 V V 3.7.1 USIM Application Guide It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder reference circuit. SIM7600G_SIM7600G-H_Hardware Design _V1.01 34 2019-10-21 Smart Machine Smart Decision Figure 192: USIM interface reference circuit Note: USIM_DATA has been pulled up with a 10K resistor to USIM_VDD in MODULE. A 100nF capacitor on USIM_VDD is used to reduce interference. For more details of AT commands about USIM, please refer to document [1].USIM_CLK is very important signal, the rise time and fall time of USIM_CLK should be less than 40ns, otherwise the USIM card might not be initialized correctly. The USIM_DET pin is used for detection of the USIM card hot plug in. User can select the 8-pin USIM card holder to implement USIM card detection function. The following figure shows the 8-pin SIM card holder reference circuit. Figure 203: USIM interface reference circuit with USIM_DET If the USIM card detection function is not used, user can keep the USIM_DET pin open. SIM7600G_SIM7600G-H_Hardware Design _V1.01 35 2019-10-21 Smart Machine Smart Decision SIM card circuit is susceptible, the interference may cause the SIM card failures or some other situations, so it is strongly recommended to follow these guidelines while designing:

Make sure that the SIM card holder should be far away from the antenna while in PCB layout. SIM traces should keep away from RF lines, VBAT and high-speed signal lines. The traces should be as short as possible. Keep SIM holders GND connect to main ground directly. Recommended to place a 0.11uF capacitor on USIM_VDD line and keep close to the Shielding the SIM card signal by ground. holder. The rise/fall time of USIM_CLK should not be more than 40ns. Add some TVS and the parasitic capacitance should not exceed 60pF. SIM7600G_SIM7600G-H_Hardware Design _V1.01 36 2019-10-21 Smart Machine Smart Decision Recommended USIM Card Holder It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User can visit http://www.amphenol.com for more information about the holder. Figure 214: Amphenol SIM card socket Table 134: Amphenol USIM socket pin description Signal USIM_VDD USIM_RST USIM_CLK GND VPP USIM_DATA Description USIM Card Power supply. USIM Card Reset. USIM Card Clock. Connect to GND. NC USIM Card data I/O. Pin C1 C2 C3 C5 C6 C7 SIM7600G_SIM7600G-H_Hardware Design _V1.01 37 2019-10-21 Smart Machine Smart Decision 3.8 PCM Interface MODULE provides a PCM interface for external codec, which can be used in master mode with short sync and 16 bits linear format. Table 145: PCM format Characteristics Line Interface Format Data length Specification Linear(Fixed) 16bits(Fixed) PCM Clock/Sync Source Master Mode(Fixed) PCM Clock Rate PCM Sync Format Data Ordering 2048 KHz (Fixed) Short sync(Fixed) MSB Note: For more details about PCM AT commands, please refer to document [1]. 3.8.1 PCM timing MODULE supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec. Figure 225: PCM_SYNC timing Figure 236: EXT codec to MODULE timing SIM7600G_SIM7600G-H_Hardware Design _V1.01 38 2019-10-21 Smart Machine Smart Decision Figure 247: Module to EXT codec timing Table 16: PCM timing parameters Parameter Description Min. Typ. Max. Unit T(sync) PCM_SYNC cycle time T(synch) PCM_SYNC high level time T(syncl) PCM_SYNC low level time T(clk) T(clkh) T(clkl) T(susync) PCM_CLK cycle time PCM_CLK high level time PCM_CLK low level time PCM_SYNC setup time high before falling edge of PCM_CLK T(hsync) PCM_SYNC hold time after falling edge of PCM_CLK T(sudin) PCM_IN setup time before falling edge of PCM_CLK T(hdin) PCM_IN hold time after falling edge of PCM_CLK T(pdout) Delay from PCM_CLK rising to PCM_OUT valid T(zdout) Delay from PCM_CLK falling to PCM_OUT HIGH-Z 60 10 125 488 124.5 488 244 244 244 244 160 60

s ns s ns ns ns ns ns ns ns ns ns 3.8.2 PCM Application Guide The following figure shows the external codec reference design. SIM7600G_SIM7600G-H_Hardware Design _V1.01 39 2019-10-21 Smart Machine Smart Decision Figure 258: Audio codec reference circuit 3.9 SD Interface MODULE provides a 4-bit SD/MMC/eMMC interface with clock rate up to 200 MHz. When connected to a SD or MMC card, the voltage of SD interface is 1.8/2.85V, which is compatible with Secure Digital Physical Layer Specification version 3.0 and SDIO Card Specification version 3.0.It supports up to 128GB SD cards. When connected to a eMMC card, the interface voltage will be a single 1.8V, which is compatible with eMMC Specification, version 4.5. It supports up to 128GB eMMC cards. Table 17: SD/MMC electronic characteristic as 2.85V (SD_DATA0-3SD_CLK and SD_CMD) Symbol Parameter Min. Typ. Max. Unit VIH VIL VOH VOL High-level input voltage 0.65*2.85 Low-level input voltage

-0.3

0 2.85+0.3 0.25*2.85 High-level output voltage 0.75*2.85 2.85 2.85 Low-level output voltage 0 0 0.15*2.85 V V V V Table 158: SD/MMC/eMMC electronic characteristic as 1.8V (SD_DATA0-3SD_CLK and SD_CMD) Symbol Parameter Min. Typ. Max. Unit VIH VIL VOH VOL High-level input voltage 0.7*1.8 Low-level input voltage

-0.3 High-level output voltage 1.8-0.4 Low-level output voltage 0

0 1.8 0 1.8+0.2 0.3*1.8 1.8 0.45 V V V V Users should provide 2.85V to power SD card system and the current should more than 350mA, which is showed below as VCC_SD. ESD/EMI components should be arranged beside SD card socket. Refer to the following application circuit. SIM7600G_SIM7600G-H_Hardware Design _V1.01 40 2019-10-21 Smart Machine Smart Decision Figure29: SD reference circuit Users should provide 2.85V to power eMMC card system and 1.8V to power the SDIO_DATA/CMD/CLK signals. The source of 2.85V should be able to provide more than 500mA* which showed below as VCC_eMMC, as the source of 1.8V should be able to provide more than 300mA* which showed below as VCCQ_1V8. ESD/EMI components should be arranged close to the eMMC card. Refer to the following application circuit. VCC_eMMC Module VCCQ_1V8 VCCQ_1V8 SD_CMD RESOUT_N SD_CLK SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 eMMC VCC VCC VCC VCC VCCQ VCCQ VCCQ VCCQ VDDIM CMD RST CLK D0 D1 D2 D3 D4 D5 D6 D7 DS Figure 30: eMMC reference circuit

*NOTE: For the current of VCC_eMMC and VCCQ_1V8, users should better refer to the related datasheet of eMMC which is used. The listed current of 500mA and 300mA are just for your reference. SIM7600G_SIM7600G-H_Hardware Design _V1.01 41 2019-10-21 Smart Machine Smart Decision SD/MMC/eMMC card layout guide lines:

Protect SD card signals from noisy signals (clocks, SMPS, etc.). Up to 200 MHz clock rate, 50 nominal, 10% trace impedance CLK to DATA/CMD length matching < 1 mm Total routing length < 50 mm Spacing to all other signals = 2x line width Bus capacitance < 10 pF 3.10 I2C Interface MODULE provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400 kbps. Its operation voltage is 1.8V. The following figure shows the I2C bus reference design. Figure31: I2C reference circuit NoteSDA and SCL do not have pull-up resistors in MODULE. So, 2 external pull up resistors are needed in application circuit. AT+CRIIC and AT+CWIIC AT commands could be used to read/write register values of the I2C peripheral devices. For more details about AT commands please refer to document [1]. 3.11 SDIO Interface MODULE provides a 4 bit 1.8V SDIO interface for WLAN solution with W58 module. The SDIO interface can be used for WLAN solution. Note: Special software version for CAT4 MODULEs supports this function. 3.12 SPI Interface SIM7600G provides a SPI interface as a master only. It provides a duplex, synchronous, serial SIM7600G_SIM7600G-H_Hardware Design _V1.01 42 2019-10-21 Smart Machine Smart Decision communication link with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 50 MHz NoteFor more details of the AT commands about the SPI, please refer to document [1]. 3.13 Network status The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following figure. Figure32: NETLIGHT reference circuit Note: The value of the resistor named R depends on the LED characteristic. Table 19: NETLIGHT pin status NETLIGHT pin status Module status Always On Searching Network; Call Connect(include VOLTE,SRLTE) 200ms ON, 200ms OFF Data Transmit; 4G registered;

800ms ON, 800ms OFF 2G/3G registered network OFF Power off ;Sleep Note: NETLIGHT output low level as OFF, and high level as ON. 3.14 Flight Mode Control The FLIGHTMODE pin can be used to control MODULE to enter or exit the Flight mode. In Flight mode, the RF circuit is closed to prevent interference with other equipments and minimize SIM7600G_SIM7600G-H_Hardware Design _V1.01 43 2019-10-21 Smart Machine Smart Decision current consumption. Bidirectional ESD protection component FLIGHTMODE pin, its reference circuit is shown in the following figure. is suggested to add on Figure 33: Flight mode switch reference circuit Table 20: FLIGHTMODE pin status FLIGHTMODE pin status Input Low Level Input High Level Module operation Flight Mode: RF is closed AT+CFUN=0: RF is closed AT+CFUN=1:RF is working 3.15 Other interface 3.15.1 Sink Current Source The ISINK pin is VBAT tolerant and intended to drive some passive devices, such as LCD backlight and white LED, etc. Its output current can be up to 40mA and be set by the AT command AT+ CLEDITST. Table 21: Sink current electronic characteristic Symbol VISINK IISINK Description Voltage tolerant Current tolerant Min. 0.5 0 Typ.

Max. VBAT 40 Unit V mA ISINK is a ground-referenced current sink. The following figure shows its reference circuit. SIM7600G_SIM7600G-H_Hardware Design _V1.01 44 2019-10-21 Smart Machine Smart Decision Figure34: ISINK reference circuit Note: The sinking current can be adjusted to meet the design requirement through the AT command AT+ CLEDITST =<0>, <value>.The value ranges from 0 to 8, on behalf of the current from 0mA to 40mA by 5mA step. 3.15.2 ADC MODULE has 2 dedicated ADC pins named ADC1 and ADC2.They are available for digitizing analog signals such as battery voltage and so on. These electronic specifications are shown in the following table. Table 22: ADC1 and ADC2 electronic characteristics Characteristics Resolution Conversion time Input Range Input serial resistance Min. 0.1 1 Typ. 15 442 Max. 1.7 Unit Bits ms V M Note: AT+CADC and AT+CADC2 can be used to read the voltage of the ADC1 and ADC2 pins, for more details, please refer to document [1]. 3.15.3 LDO MODULE has a LDO power output, named VDD_AUX. its output voltage is 2.85V by default, Users can switch the LDO on or off by the AT command AT+CVAUXS and configure its output voltage by the AT command AT+CVAUXV. SIM7600G_SIM7600G-H_Hardware Design _V1.01 45 2019-10-21 Smart Machine Smart Decision Table 23: Electronic characteristic Min. Description Output voltage Symbol VVDD_AUX IO NoteFor more details of AT commands about VDD_AUX, please refer to document [1]. Output current Max. Typ. 2.85 3.05 150 1.7 V

mA Unit SIM7600G_SIM7600G-H_Hardware Design _V1.01 46 2019-10-21 Smart Machine Smart Decision 4 RF Specifications 4.1 GSM/UMTS/LTE RF Specifications Table 16: Conducted transmission power Table 17: Operating frequencies Frequency GSM850 EGSM900 Receiving 869894MHz 925960MHz Transmission 824849 MHz 880915 MHz SIM7600G_SIM7600G-H_Hardware Design _V1.01 47 2019-10-21 Smart Machine Smart Decision 18051880 MHz 1930~1990 MHz 21102170 MHz 1930~1990 MHz 2110~2155MHz 869894 MHz 877~882MHz 925960 MHz 875~890MHz DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 The LTE Operating frequencies are shown in the following table 24. Note: Operating frequencies of LTE TDD B41 for the MODULE is 100MHz BW, 25552655 MHz GPS GLONASS BD 17101785 MHz 1850~1910 MHz 19201980 MHz 1850~1910 MHz 1710~1755MHz 824849 MHz 832~837MHz 880915 MHz 835~845MHz 1574.4 1576.44 MHz 1598 1606 MHz 1559 1563 MHz

Table 2418: E-UTRA operating bands E-UTRA Operating Band Uplink (UL) operating band Downlink (DL) operating band Duplex Mode 1 2 3 4 5 7 8 12 13 18 19 20 25 26 28 66 34 38 39 40 41 1920 ~1980 MHz 1850~1910 MHz 1710 ~1785 MHz 1710~1755MHz 824849 MHz 2500~2570MHz 880 ~915 MHz 699~716MHz 777~787MHz 815~830MHz 830~845MHz 832~862MHz 1850~1915MHz 814~849MHz 703~748MHz 1710~1780MHz 2010~2025MHz 2570 ~2620 MHz 1880~1920MHz 2300 ~2400 MHz 2496~2696 MHz 2110 ~2170 MHz 1930~1990 MHz 1805 ~1880 MHz 2110~2155MHz 869894MHz 2620~2690MHz 925 ~960 MHz 728~746MHz 746~757MHz 860~875MHz 875~890MHz 791~ 821MHz 1930~1995MHz 859~894MHz 758~803MHz 2110~2200MHz 2010~2025MHz 2570 ~2620 MHz 1880~1920MHz 2300 ~2400 MHz 2496~2696 MHz FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD SIM7600G_SIM7600G-H_Hardware Design _V1.01 48 2019-10-21 Smart Machine Smart Decision Table 19: Conducted receive sensitivity Receive sensitivity(Typical)

< -109dBm Receive sensitivity(MAX) 3GPP Frequency GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8

< -109dBm

< -109dBm

< -109dBm

< -110dBm

< -110dBm

< -110dBm

< -110dBm

< -110dBm

< -110dBm WCDMA B19 LTE FDD/TDD

< -110dBm See table 26. Table 2620: Reference sensitivity (QPSK) 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP E-UTR 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz Duplex A band Standard Standard Standard Standard Standard Standard Mode 1 2 3 4 5 7 8 12 13 18 19 20 25 26 28 66 34 38 39 40 41

-102.7

-101.7

-104.7

-103.2

-102.2

-101.7

-99.7

-98.7

-101.7

-100.2

-99.2

-98.7

-101.2

-102.7

-104.7

-98.2

-99.7

-100.2

-101.7

-100

-98

-97

-100

-98

-98

-97

-97

-97

-100

-100

-97

-96.5

-97.5

-98.5

-100

-100

-100

-100

-100

-99

-97

-95

-94

-97

-95

-95

-94

-94

-94

-97

-97

-94

-93.5

-94.5

-95.5

-97

-97

-97

-97

-97

-96

-95.2

-93.2

-92.2

-95.2

-93.2

-95.2

-95.2

-91.2

-91.7

-92.7

-93.7

-95.2

-95.2

-95.2

-95.2

-95.2

-94.2

-94

-92

-91

-94

-92

-90

-90.5

-91

-94

-94

-94

-93 FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD SIM7600G_SIM7600G-H_Hardware Design _V1.01 49 2019-10-21 Smart Machine Smart Decision 4.2 GSM /UMTS/LTE Antenna Design Guide Users should connect antennas to MODULEs antenna pads through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50. SIMCom recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements:

Table 21: Trace loss Frequency 700MHz-960MHz 1710MHz-2170MHz 2300MHz-2650MHz Loss

<0.5dB

<0.9dB

<1.2dB To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit. Figure35: Antenna matching circuit (MAIN_ANT) In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of components can only be achieved after the antenna tuning and usually provided by antenna vendor. By default, the R1, R2 are 0 resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS for ESD protection, and it is optional for users according to application environment. The RF test connector is used for the conducted RF performance test, and should be placed as close as to the MODULEs MAIN_ANT pin. The traces impedance between MODULE and antenna must be controlled in 50. SIM7600G_SIM7600G-H_Hardware Design _V1.01 50 2019-10-21

Smart Machine Smart Decision Figure 266: Antenna matching circuit (AUX_ANT) In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4 are 0resistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is optional for users according to application environment. Two TVS are recommended in the table below. Table 22: Recommended TVS Package 0201 0402 Part Number LXES03AAA1-154 LXES15AAA1-153 Vender Murata Murata NoteSIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high bands in the designing of LTE-TDD, such as band38, band40 and band41. Because of the high insert loss of the RF cable and layout lines, the receiver sensitivity of these bands above will have risk to meet the authentication without the diversity antenna. For more details about auxiliary antenna design notice, please refer to document [25]. 4.3 GNSS MODULE merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a high-availability solution that offers industry-leading accuracy and performance. This solution performs well, even in very challenging environmental conditions where conventional GNSS receivers fail, and provides a platform to enable wireless operators to address both location-based services and emergency mandates. SIM7600G_SIM7600G-H_Hardware Design _V1.01 51 2019-10-21 Smart Machine Smart Decision 4.3.1 GNSS Technical specification Tracking sensitivity: -159 dBmGPS/-158 dBmGLONASS/-159 dBmBD Cold-start sensitivity: -148 dBm Accuracy (Open Sky): 2.5m (CEP50) TTFF (Open Sky) : Hot start <1s, Cold start<35s Receiver Type: 16-channel, C/A Code GPS L1 Frequency: 1575.421.023MHz GLONASS: 1597.5~1605.8 MHz BD: 1559.05~1563.14 MHz Update rate: Default 1 Hz GNSS data format: NMEA-0183 GNSS Current consumption : 100mA (GSM/UMTS/LTE Sleep ,in total on VBAT pins) GNSS antenna: Passive/Active antenna Note: If the antenna is active type, the power should be given by main board because there is no power supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external LNA should be used. 4.3.2 GNSS Application Guide Users can adopt an active antenna or a passive antenna to MODULE. If using a passive antenna, an external LNA is a must to get better performance. The following figures are the reference circuits. Figure 277: Active antenna circuit SIM7600G_SIM7600G-H_Hardware Design _V1.01 52 2019-10-21 Smart Machine Smart Decision Figure 288: Passive antenna circuit (Default) In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values of the components can only be achieved after antenna tuning and usually provided by antenna vendor. C2 is used for DC blocking. L3 is the matching component of the external LNA, and the value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active antenna and V_LNA need external power supplies which should be considered according to active antenna and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by shutting down active antennas and LNA when GNSS is not working. GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB automatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS, user should configure MODULE in proper operating mode by AT command. Please refer to related documents for details. MODULE can also get position location information through AT directly. Note: GNSS is closed by default and can be started by AT+CGPS. The AT command has two parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode. AGPS mode needs more support from the mobile telecommunication network. Please refer to document [24] for more details. SIM7600G_SIM7600G-H_Hardware Design _V1.01 53 2019-10-21 Smart Machine Smart Decision 5 Electrical Specifications 5.1 Absolute maximum ratings Absolute maximum rating for digital and analog pins of MODULE are listed in the following table:

Table 23: Absolute maximum ratings Parameter Voltage at VBAT Voltage at USB_VBUS Voltage at digital pins

(RESET,SPI,Keypad,GPIO,I2C,UART,PCM) Voltage at digital pins (SD,USIM) Voltage at PWRKEY 5.2 Operating conditions Table 24: Recommended operating ratings Min.

-0.5

-0.5

-0.3

-0.3

-0.3 Typ.

Max. 6.0 5.85 2.1 3.05 1.8 Unit V V V V Parameter Voltage at VBAT Voltage at USB_VBUS Min. 3.4 3.0 Typ. 3.8 5.0 Max. 4.2 5.25 Unit V V Table 25: 1.8V Digital I/O characteristics*

Parameter Description VIH VIL VOH VOL IOH IOL IIH IIL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage High-level output current(no pull down resistor) Low-level output current(no pull up resistor) Input high leakage current (no pull down resistor) Min. 1.17

-0.3 1.35 0

Input low leakage current(no pull up resistor)

-1 Typ. 1.8 0

2

-2

Max. Unit 2.1 0.63 1.8 0.45

1

V V V V mA mA uA uA SIM7600G_SIM7600G-H_Hardware Design _V1.01 54 2019-10-21 Smart Machine Smart Decision

*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT, FLIGHTMODE, STATUS, USIM_DET, SD_DET), SDIO, I2C, UART, PCM, COEXn, and BOOT_CFG0. The operating temperature of MODULE is listed in the following table. Table 26: Operating temperature Parameter Normal operation temperature Extended operation temperature*

Storage temperature

*Note: Module is able to make and receive voice calls, data calls, SMS and make GSM/

UMTX/LTE traffic in -40 ~ +85. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range. Max. 80 85

+90 Min.

-30

-40

-45 Typ. 25 25 25 Unit 5.3 Operating Mode 5.3.1 Operating Mode Definition The table below summarizes the various operating modes of MODULE product. Table 27: Operating mode Definition Mode Function n o i t a r e p o l a m r o N GSM /UMTS/LTE Sleep In this case, the current consumption of MODULE will be reduced to the minimal level and the MODULE can still receive paging message and SMS. GSM/UMTS/LTE Idle Software is active. Module is registered to the network, and the MODULE is ready to communicate. GSM/UMTS/LTE Talk GPRS/EDGE/

UMTS/LTE Standby Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antenna. Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. GPRS/EDGE/

UMTS/LTE Data transmission There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level);

uplink/downlink data rates, etc. Minimum functionality mode AT command AT+CFUN=0 AT+CSCLK=1 can be used to set the MODULE to a minimum functionality mode without removing the power supply. In this mode, the RF part of the MODULE will not work and the USIM card will not be accessible, but the serial port and SIM7600G_SIM7600G-H_Hardware Design _V1.01 55 2019-10-21 Smart Machine Smart Decision USB port are still accessible. The power consumption in this mode is lower than normal mode. AT command AT+CFUN=4 or pulling down the FLIGHTMODE pin can be used to set the MODULE to flight mode without removing the power supply. In this mode, the RF part of the MODULE will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. Module will go into power off mode by sending the AT command AT+CPOF or pull down the PWRKEY pin, normally. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible. Flight mode Power off 5.3.2 Sleep mode In sleep mode, the current consumption of MODULE will be reduced to the minimal level, and MODULE can still receive paging message and SMS. Several hardware and software conditions must be satisfied together in order to let MODULE enter into sleep mode:

1. UART condition 2. USB condition 3. Software condition Note: Before designing, pay attention to how to realize sleeping/waking function and refer to Document [26] for more details. 5.3.3 Minimum functionality mode and Flight mode Minimum functionality mode ceases a majority function of MODULE, thus minimizing the power consumption. This mode is set by the AT command which provides a choice of the functionality levels. AT+CFUN=0: Minimum functionality AT+CFUN=1: Full functionality (Default) AT+CFUN=4: Flight mode If MODULE has been set to minimum functionality mode, the RF function and USIM card function will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be unavailable. If MODULE has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable. When MODULE is in minimum functionality or flight mode, it can return to full functionality by the AT command AT+CFUN=1. SIM7600G_SIM7600G-H_Hardware Design _V1.01 56 2019-10-21 Smart Machine Smart Decision 5.4 Current Consumption The current consumption is listed in the table below. Table 28: Current consumption on VBAT Pins (VBAT=3.8V) Sleep mode@ BS_PA_MFRMS=2 Typical: 2.307ma Idle mode@ BS_PA_MFRMS=2 Typical: 17ma

@ -140dBmTracking Typical:38ma Sleep mode Typical: 2.04ma Idle mode Typical: 17.3ma Sleep mode @DRX=1.28S Typical: 1.819ma Idle mode @DRX=1.28S Typical: 16.845ma

@power level #5 Typical: 307ma

@ power level #5 Typical: 295ma

@power level #5 Typical: 200 ma

@power level #5 Typical: 227 ma GNSS GNSS supply current

(AT+CFUN=0,with USB connection) GSM sleep/idle mode GSM/GPRS supply current

(GNSS offwithout USB connection) UMTS sleep/idle mode WCDMA supply current

(GNSS offwithout USB connection) LTE sleep/idle mode LTE supply current

(GNSS offwithout USB connection) GSM Talk GSM850 EGSM900 DCS1800 PCS1900 UMTS Talk WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 GPRS GSM850( 1 Rx,4 Tx ) EGSM900( 1 Rx,4 Tx ) DCS1800( 1 Rx,4 Tx ) PCS1900( 1 Rx,4 Tx ) GSM850( 3Rx, 2 Tx ) EGSM900( 3Rx, 2 Tx ) DCS1800( 3Rx, 2 Tx ) PCS1900( 3Rx, 2 Tx ) EDGE GSM850( 1 Rx,4 Tx ) EGSM900( 1 Rx,4 Tx ) DCS1800( 1 Rx,4 Tx ) PCS1900( 1 Rx,4 Tx ) GSM850( 3Rx, 2 Tx ) EGSM900( 3Rx, 2 Tx ) SIM7600G_SIM7600G-H_Hardware Design _V1.01 57 2019-10-21

@Power 24dBm Typical: 661ma

@Power 24dBm Typical: 668 ma

@Power 24dBm Typical: 599 ma

@Power 24dBm Typical: 558 ma

@Power 24dBm Typical: 554 ma

@Power 24dBm Typical: 634ma

@Power 24dBm Typical: 561 ma

@power level #5 Typical: 586 ma

@power level #5 Typical: 540 ma

@power level #0 Typical: 382 ma

@power level #0 Typical: 416 ma

@power level #5 Typical: 438 ma

@power level #5 Typical: 419 ma

@power level #0 Typical: 291 ma

@power level #0 Typical: 328 ma

@power level #8 Typical: 523ma

@power level #8 Typical: 477ma

@power level # 2 Typical: 380ma

@power level #2 Typical: 414ma

@power level #8 Typical: 298ma

@power level #8 Typical: 273ma Smart Machine Smart Decision DCS1800( 3Rx, 2 Tx ) PCS1900( 3Rx, 2 Tx ) LTE data LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B66 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39

@power level #2 Typical: 246ma

@power level #2 Typical: 268ma

@5MHz 22.3dBm Typical: 711 ma

@10MHz 22.4dBm Typical: 718 ma

@20MHz 22.4dBm Typical: 756 ma

@5MHz 22.1dBm Typical: 676 ma

@10MHz 22.4dBm Typical: 723 ma

@20MHz 22.3dBm Typical: 759 ma

@5MHz 22.2dBm Typical: 666 ma

@10MHz 22.1dBm Typical: 662 ma

@20MHz 22.1dBm Typical: 682 ma

@5MHz 22.0dBm Typical: 709 ma

@10MHz 22.1dBm Typical:769 ma

@20MHz 22.6dBm Typical: 896 ma

@5MHz 22.2dBm Typical: 619 ma

@10MHz 22.1dBm Typical: 628 ma

@5MHz 22.2dBm Typical: 599 ma

@10MHz 22.1dBm Typical: 611 ma

@20MHz 22.1dBm Typical: 680ma

@5MHz 22.8dBm Typical: 699 ma

@10MHz 22.8dBm Typical: 751 ma

@5MHz 22.7dBm Typical: 600 ma

@10MHz 22.7dBm Typical: 607 ma

@5MHz 21.9dBm Typical: 685 ma

@10MHz 22.0dBm Typical: 653 ma

@5MHz 21.3dBm Typical: 702 ma

@10MHz 22.5dBm Typical: 711 ma

@15MHz 22.6dBm Typical: 747 ma

@5MHz 22.4dBm Typical: 616 ma

@10MHz 22.3dBm Typical: 622 ma

@15MHz 22.5dBm Typical: 679 ma

@5MHz 21.8dBm Typical: 658 ma

@10MHz 21.8dBm Typical: 668 ma

@20MHz 21.8dBm Typical: 767 ma

@5MHz 22dBm Typical: 634 ma

@10MHz 22dBm Typical: 702 ma

@20MHz 22dBm Typical: 781 ma

@5MHz 22.4dBm Typical: 615 ma

@10MHz 22.7dBm Typical:664 ma

@15MHz 22.3dBm Typical:713 ma

@5MHz 22.4dBm Typical: 811ma

@10MHz 22.5dBm Typical: 879 ma

@20MHz 22.4dBm Typical: 773 ma

@5MHz 22dBm Typical: 707ma

@10MHz 22dBm Typical: 728ma

@20MHz 22dBm Typical: 795 ma

@5MHz 22dBm Typical: 555 ma

@10MHz 22dBm Typical: 546 ma

@5MHz 21.8dBm Typical: 799ma

@10MHz 21.8dBm Typical: 759ma

@20MHz 21.8dBm Typical: 779ma

@5MHz 22dBm Typical:575 ma SIM7600G_SIM7600G-H_Hardware Design _V1.01 58 2019-10-21 Smart Machine Smart Decision

@10MHz 22dBm Typical: 627 ma

@20MHz 22dBm Typical: 681 ma

@5MHz 21.5dBm Typical: 727 ma

@10MHz 21.7dBm Typical: 715 ma

@20MHz 21.7dBm Typical: 703 ma

@5MHz 21.6dBm Typical:803 ma

@10MHz 21.7dBm Typical: 771 ma

@20MHz 21.7dBm Typical: 793 ma LTE-TDD B40 LTE-TDD B41 5.5 ESD Notes MODULE is sensitive to ESD in the process of storage, transporting, and assembling. When MODULE is mounted on the users mother board, the ESD components should be placed beside the connectors which human body may touch, such as USIM card holder, audio jacks, switches, keys, etc. The following table shows the MODULE ESD measurement performance without any external ESD component. Table 29: The ESD performance measurement table (Temperature: 25, Humidity: 45%) Part VBAT,GND Antenna port Other PADs Contact discharge

+/-5K Air discharge

+/-10K

+/-4K

+/-0.5K

+/-8K

+/-1K SIM7600G_SIM7600G-H_Hardware Design _V1.01 59 2019-10-21 Smart Machine Smart Decision 6 SMT Production Guide 6.1 Top and Bottom View of MODULE Figure 299: Top and bottom view of MODULE SIM7600G_SIM7600G-H_Hardware Design _V1.01 60 2019-10-21 Smart Machine Smart Decision 6.2 Label Information Figure 40: Label information Table 30: The description of label information No. A B C D E Description LOGO Module part number Project name Serial number International mobile equipment identity SIM7600G_SIM7600G-H_Hardware Design _V1.01 61 2019-10-21 Smart Machine Smart Decision 6.3 Typical SMT Reflow Profile SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints. Figure41: The ramp-soak-spike reflow profile of MODULE Note: For more details about secondary SMT, please refer to the document [21]. 6.4 Moisture Sensitivity Level (MSL) MODULE is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the prescribed time limit is exceeded, users should bake MODULE for 192 hours in drying equipment (<5% RH) at 40+5/-0C, or 72 hours at 85+5/-5C. Note that plastic tray is not heat-resistant, and only can be baked at 45 C. Table 31: Moisture Sensitivity Level and Floor Life Moisture Sensitivity Level

(MSL) Floor Life (out of bag) at factory ambient30C/60% RH or as stated 1 2 2a 3 4 5 5a 6 Unlimited at 30/85% RH 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. SIM7600G_SIM7600G-H_Hardware Design _V1.01 62 2019-10-21 Smart Machine Smart Decision NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage. 6.5 Stencil Foil Design Recommendation The recommended thickness of stencil foil is more than 0.15mm. Figure 42 : Stencil Foil SIM7600G_SIM7600G-H_Hardware Design _V1.01 63 2019-10-21 Smart Machine Smart Decision 7 Packaging MODULE support tray packaging. Figure43: packaging diagram Module tray drawing Figure 304: Tray drawing SIM7600G_SIM7600G-H_Hardware Design _V1.01 64 2019-10-21 Smart Machine Smart Decision Table 32: Tray size Length3mm Width3mm 242.0 161.0 Number 15 Small carton drawing Figure 315: Small carton drawing Table 33: Small Carton size Length10mm Width10mm Height10mm 270 180 120 Big carton drawing Number 15*20=300 Figure 46: Big carton drawing Table 34: Big Carton size Length10mm Width10mm Height10mm Number SIM7600G_SIM7600G-H_Hardware Design _V1.01 65 2019-10-21 Smart Machine Smart Decision 380 280 280 300*4=1200 Appendix

. Coding Schemes and Maximum Net Data Rates over Air Interface Table 35: Coding Schemes and Maximum Net Data Rates over Air Interface Multislot definition(GPRS/EDGE) Slot class 1 2 3 4 5 6 7 8 9 10 11 12 GPRS coding scheme DL slot number 1 2 2 3 2 3 3 4 3 4 4 4 Max data rata4 slots UL slot number 1 1 2 1 2 2 3 1 2 2 3 4 Active slot number 2 3 3 4 4 4 4 5 5 5 5 5 Modulation type CS 1 = 9.05 kb/s / time slot CS 2 = 13.4 kb/s / time slot CS 3 = 15.6 kb/s / time slot CS 4 = 21.4 kb/s / time slot 36.2 kb/s 53.6 kb/s 62.4 kb/s 85.6 kb/s GMSK GMSK GMSK GMSK EDGE coding scheme Max data rata4 slots Modulation type MCS 1 = 8.8 kb/s/ time slot MCS 2 = 11.2 kb/s/ time slot MCS 3 = 14.8 kb/s/ time slot MCS 4 = 17.6 kb/s/ time slot MCS 5 = 22.4 kb/s/ time slot MCS 6 = 29.6 kb/s/ time slot MCS 7 = 44.8 kb/s/ time slot MCS 8 = 54.4 kb/s/ time slot MCS 9 = 59.2 kb/s/ time slot 35.2 kb/s 44.8 kb/s 59.2 kb/s 70.4 kb/s 89.6 kb/s 118.4 kb/s 179.2 kb/s 217.6 kb/s 236.8 kb/s GMSK GMSK GMSK GMSK 8PSK 8PSK 8PSK 8PSK 8PSK HSDPA device category Max data ratepeak Modulation type Category 1 Category 2 Category 3 1.2Mbps 1.2Mbps 1.8Mbps 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK SIM7600G_SIM7600G-H_Hardware Design _V1.01 66 2019-10-21 Smart Machine Smart Decision Category 4 Category 5 Category 6 Category 7 Category 8 Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19 Category 20 Category 21 Category 22 Category 23 Category 24 1.8Mbps 3.6Mbps 3.6Mbps 7.2Mbps 7.2Mbps 10.2Mbps 14.4Mbps 0.9Mbps 1.8Mbps 17.6Mbps 21.1Mbps 23.4Mbps 28Mbps 23.4Mbps 28Mbps 35.5Mbps 42Mbps 23.4Mbps 28Mbps 35.5Mbps 42.2Mbps 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK QPSK QPSK 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM HSUPA device category Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 LTE-FDD device category

(Downlink) Category 1 Category 2 Category 3 Category 4 LTE-FDD device category

(Uplink) Category 1 Category 2 Category 3 0.96Mbps 1.92Mbps 1.92Mbps 3.84Mbps 3.84Mbps 5.76Mbps QPSK QPSK QPSK QPSK QPSK QPSK Max data ratepeak Modulation type 10Mbps 50Mbps 100Mbps 150Mbps QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM Max data ratepeak Modulation type 5Mbps 25Mbps 50Mbps QPSK/16QAM QPSK/16QAM QPSK/16QAM SIM7600G_SIM7600G-H_Hardware Design _V1.01 67 2019-10-21 Smart Machine Smart Decision Category 4 50Mbps QPSK/16QAM

. Related Documents Table 36: Related Documents NO. Title

[1]

[2]

[3]

[4]

SIM7500_SIM7600 Series_AT Command Manual_V1.xx ITU-T Draft new recommendationV.25ter GSM 07.07 GSM 07.10

[5]

GSM 07.05

[6]

GSM 11.14

[7]

GSM 11.11

[8]

GSM 03.38

[9]

GSM 11.10

[10]

3GPP TS 51.010-1

[11]

3GPP TS 34.124

[12]

3GPP TS 34.121

[13]

3GPP TS 34.123-1

[14]

3GPP TS 34.123-3

[15] EN 301 908-02 V2.2.1

[16] EN 301 489-24 V1.2.1 Description AT Command Manual Serial asynchronous automatic dialing and control Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment Data Circuit terminating Equipment

(DTE DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital cellular telecommunications system (Phase 2+);

Specification of the SIM Application Toolkit for the Subscriber Identity Module Mobile Equipment (SIM ME) interface Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module Mobile Equipment (SIM ME) interface Digital cellular telecommunications system (Phase 2+);

Alphabets and language-specific information Digital cellular telecommunications system (Phase 2) Mobile Station (MS) conformance specification Part 1:

Conformance specification Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network;

Terminal conformance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3:

Abstract Test Suites. Electromagnetic compatibility and Radio spectrum Matters

(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread

(UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters SIM7600G_SIM7600G-H_Hardware Design _V1.01 68 2019-10-21 Smart Machine Smart Decision

(ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment Safety of information technology equipment (2000) Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification Global Certification Forum - Certification Criteria Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment

(RoHS) Module secondary SMT Guidelines This document describes how to use UART interface of SIMCom modules. USB AUDIO Application Note GPS Application Note

[17]

IEC/EN60950-1(2001)

[18]

3GPP TS 51.010-1

[19] GCF-CC V3.23.1

[20]

2002/95/EC

[21] Module

[22]

[23]

[24]

secondary-SMT-UGD-V1.xx SIM7X00 Series_UART_Application Note_V1.xx SIM7100_SIM7500_SIM7600 Series_USB AUDIO_Application Note_V1.xx SIM7X00 Series_GPS_Application Note_V1.xx

[25] Antenna design guidelines for Antenna design guidelines for diversity receiver system diversity receiver system SIM7100_SIM7500_SIM7600 _Sleep Mode_Application Note_V1.xx 7600CE-LAN-Reference Design V1.0 SIM7600_Series_SGMII-Refe rence_Design_V1.00 Sleep Mode Application Note HSIC Application Note SGMII Reference Design

[26]

[27]

[28]

SIM7600G_SIM7600G-H_Hardware Design _V1.01 69 2019-10-21 Smart Machine Smart Decision

. Terms and Abbreviations Table 37: Terms and Abbreviations Abbreviation ADC ARP BER BTS CS CSD CTS DAC DRX DSP DTE DTR DTX EFR EGSM EMC ESD ETS EVDO FCC FD FDMA FR GMSK GNSS GPRS GPS GSM HR HSPA I2C IMEI LTE MO MS MT NMEA PAP PBCCH PCB PCS Description Analog-to-Digital Converter Antenna Reference Point Bit Error Rate Base Transceiver Station Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Discontinuous Reception Digital Signal Processor Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Evolution Data Only Federal Communications Commission (U.S.) SIM fix dialing phonebook Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System General Packet Radio Service Global Positioning System Global Standard for Mobile Communications Half Rate High Speed Packet Access Inter-Integrated Circuit International Mobile Equipment Identity Long Term Evolution Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated National Marine Electronics Association Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Personal Communication System, also referred to as GSM 1900 SIM7600G_SIM7600G-H_Hardware Design _V1.01 70 2019-10-21 Smart Machine Smart Decision RF RMS RTC SIM SMS SPI SMPS TDMA TE TX UART VSWR SM NC EDGE HSDPA HSUPA ZIF WCDMA VCTCXO USIM UMTS UART Radio Frequency Root Mean Square (value) Real Time Clock Subscriber Identification Module Short Message Service serial peripheral interface Switched-mode power supply Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio SIM phonebook Not connect Enhanced data rates for GSM evolution High Speed Downlink Packet Access High Speed Uplink Packet Access Zero intermediate frequency Wideband Code Division Multiple Access Voltage control temperature-compensated crystal oscillator Universal subscriber identity module Universal mobile telecommunications system Universal asynchronous receiver transmitter SIM7600G_SIM7600G-H_Hardware Design _V1.01 71 2019-10-21 Smart Machine Smart Decision

. Safety Caution Table 38: Safety Caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. SIM7600G_SIM7600G-H_Hardware Design _V1.01 72 2019-10-21

Tel: 408-526-1188 Fax: 408-526-1088 Email: sales.eaw@us.bureauveritas.com 775 Montague Expressway Milpitas, CA 95035 Project and Product Certification Representative Authorization Letter Reason for Amendment (current / obsolete) Initial Release (obsolete) Revised wording (obsolete) Updated company template (obsolete) Updated letter information (obsolete) Added FCC ID field (obsolete) Updated company name & logo (current) Revision History From 1.0 1.0 2.0 3.0 4.0 5.0 To 1.0 2.0 3.0 4.0 5.0 6.0 Approved Date Nov-14-2006 Sept25-2007 Jan-31-2012 May-23-2014 Sep-16-2014 Jun-27-2018 SCS-F18: Project and Product Certification Representative Authorization Letter Page 1 of 3 Rev 6.0

(Client's Company Letterhead / Logo) SIMCom Wireless Solutions Limited Logo:SIMCOM

(1.15. 2020) To: BVCPS, INC. 775 Montague Expressway, Milpitas, CA 95035 USA Dear Sir/Madam, Re: Product Certification Representative Authorization Letter We, SIMCom Wireless Solutions Limited hereby authorize Bureau Veritas Consumer Product Services, Inc. to act as a Certification Body for certifying for the following project(s):

FCC ID: 2AJYU-8PYA003 Product Description: LTE /HSPA/GSM/GNSS MODULE Model: SIM7600G-H/SIM7600G-HminiPCIE Sincerely, Clients signature Clients name / title Li yongsheng/Project manager Contact information / address: No.633 Jinzhong Road,Shanghai SCS-F18: Project and Product Certification Representative Authorization Letter Page 2 of 3 Rev 6.0

(Client's Company Letterhead / Logo) Shanghai Simcom Wireless Solutions Limited Logo:SIMCOM

(12.22. 2019) To: BVCPS, INC. 775 Montague Expressway, Milpitas, CA 95035 USA Dear Sir/Madam, Re: Project and Product Certification Representative Authorization Letter We, _____ Shanghai Simcom Wireless Solutions Limited_____ hereby authorize Bureau Veritas Consumer Product Services, Inc. to act as a Certification Body for certifying for the following project(s):

FCC ID: 2AJYU--8PYA003 Product Description: LTE /HSPA/GSM/GNSS MODULE Model: SIM7600G-H/SIM7600G-HminiPCIE We affirm that between Bureau Veritas Consumer Product Services, Inc. and ____ Shanghai Simcom Wireless Solutions Limited ___, any difference in understanding, including test plan, measurement methods, applicable standards and relevant procedures and processes have been resolved prior to commencement of testing activities. Sincerely, Clients signature Clients name / title Li weixing/Project manager Contact information / address SIM Technology Building.,No.633, JinzhongRd,Changning District, Shanghai, P.R.China SCS-F18: Project and Product Certification Representative Authorization Letter Page 3 of 3 Rev 6.0

SIMCom Wireless Solutions Limited Declaration Letter SIM7600G-H and SIM7600G-H miniPCIE are both LTE /HSPA/GSM/GNSS MODULE. They have the same software version and hardware design, including chipset, circuits, PCB and components. SIM7600G-H miniPCIE is combined with a SIM7600G-H module and a miniPCIE adapter board. The adapter board switches SIM7600G-H module to follow PCI Express Mini Card 1.2 standard connector protocol. No any other internal changes in SIM7600G-H module. Following details are the difference between two modules. Module SIM7600G-H Frequency bands GSMGSM850/PCS1900 WCDMAB2/4/5 LTEB2/4/5/7/12/13/25/26/41/66 Interface external photo Only Module, LCC package SIM7600G-H miniPCIE GSMGSM850/PCS1900 WCDMAB2/4/5 LTEB2/4/5/7/12/13/25/26/41/66 PCI Express Mini Card 1.2 standard connector Signature:

Printedname/title:

Address:Bldg. B, SIM Technology Bldg.,No.633, Jinzhong Rd, Changning Dist., Shanghai, P.R.China

775 Montague Expressway Milpitas, CA 95035 Tel: 408-526-1188 Fax: 408-526-1088Email:

sales.eaw@us.bureauveritas.com Confidentiality Request Letter Reason for Amendment (current / obsolete) Initial Release (obsolete) Adding CFR 2.459 (obsolete) Updated company template& Added text box

(obsolete) Added IC confidentiality letter form (obsolete) Corrections to STC form. Added reference to KDB

(obsolete) Updated company logo (current) Revision History From 1.0 1.0 2.0 3.0 4.0 5.0 To 1.0 2.0 3.0 4.0 5.0 6.0 Approved Date Nov-14-2006 August 11 - 2008 Jan-31-2012 March-26-2015 Nov-19-2015 Jun-26-2019 SCS-F19: Confidentiality Request Letter Page 1 of 2 Rev 6.0

(Client's Company Letterhead / Logo) SIMCom Wireless Solutions Limited Logo:SIMCOM

(1.13. 2020) To:

Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD Subject: Permanent Confidentiality Request for FCC ID: 2AJYU-8PYA003 Pursuant to sections 0.457 and 0.459 of CFR 47, we respectfully request permanent confidential treatment of the following Exhibits accompanying this application as:

- Block Diagram

- Schematics

- Operational Description

- Tune up Procedure

- Part List The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, Clients signature:

Clients name & title: Li yongsheng/Project manager Contact information / address: No.633 Jinzhong Road,Shanghai SCS-F19: Confidentiality Request Letter Page 2 of 2 Rev 6.0

775 Montague Expressway Milpitas, CA 95035 Tel: 408-526-1188 Fax: 408-526-1088 Email: sales.eaw@us.bureauveritas.com Modular Approval Declaration Letter Reason for Amendment (current / obsolete) Initial Release (Obsolete) Added IC Modular Letter (Obsolete) Add LMA and MA option (Obsolete) Revised per RSS Gen issue 3.0 (Obsolete) Removed Foot(2) (obsolete) Adding New note per KDB996369 D01 V01R03

(obsolete) Updated company template & Added text box (obsolete) Updated modular requirement (obsolete) Updated template to meet RSP 100 issue 10 (obsolete) Updated template to meet RSP 100 issue 11 (obsolete)) Revised the Modular Requirement statements

(obsolete) Updated template with BV logo (current) Revision History To From 1.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 Approved Date Dec-04-2006 Feb 16 2009 April 14 2010 Jan 12 2011 July 19 2011 August 29 2011 Jan-31-2012 Sept 05 2014 Nov 20 2014 March 19 2015 July 28, 2016 June 26, 2019 SCS-F26 Modular Approval Letter Page 1 of 2 Rev 12.0 SIMCom Wireless Solutions Limited

(Date) 1/13/2020

(LTE /HSPA/GSM/GNSS MODULE) FCC ID: 2AJYU-8PYA003 , is seeking FCC Authorization as a The EUT meets the requirements for as detailed in KDB 996369. Compliance to each of the requirements is described below:

Item Single Modular Transmitter /

Single Modular Approval /

Modular requirement Yes No Single Limited Modular Transmitter (Please check one) Single Limited Modular Approval (Please check one) Please provide a detailed explanation if the answer is No. 1 2 3 4 5 6 7 8 Note:

(1) Have its own RF shielding Have buffered modulation/data inputs (if such inputs are provided) The modular transmitter must have its own power supply regulation. Meet the antenna requirements of section 15.203 Be tested in a stand-alone configuration, i.e., the antenna, AC or DC power and data input/output lines must be connected to the module but, the module must not be inside another case during testing. Be labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. The modular transmitter is manufactured so that the user can not influence the operation of the transmitter that will operate outside of the scope of the regulations. Address compliance with the Commission`s RF exposure limits in Sections 1.1310 and 2.1093. Yes Yes Yes Yes Yes Yes Yes Yes LMA may be granted when one or more of the requirements in the table above cannot be demonstrated. LMA will also be issued in those instances where applicants can demonstrate that they will retain control over the final installation of the device, such that compliance of the end product is assured. In such cases, an operating condition on the LMA for the module must state that the module is only approved for use when installed in devices produced by a specific manufacturer. When LMA is sought, the application for equipment certification must specifically state how control of the end product into which the module will be installed, and will be maintained, such that full compliance of the end product is always ensured.

(2) Please provide Clear and specific instructions describing the conditions, limitations and procedures for third-parties to use and/or integrate the module into a host device.

(3) For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description of how such control is implemented to ensure prevention of third party modification must be provided (see KDB 594280). Note 1: Compliance of a module in its final configuration is the responsibility of the applicant. A host device will not be considered certified if the instructions regarding antenna configuration provided in the original description, of one or more separately certified modules it contains, were not followed. Example: A separately certified low-power transceiver module using Bluetooth technology which is housed in a desktop computer, laptop or peripheral does not require the overall system to be recertified, if the desktop computer, laptop or peripheral, as a stand-alone unit, complies with all applicable technical standards. Clients signature Clients name / title Li yongsheng/Project manager Contact information / address : No.633 Jinzhong Road,Shanghai SCS-F26 Modular Approval Letter Page 2 of 2 Rev 12.0