FCC ID: 2AJYU-8XM0002 MODULE with WCDMA and LTE

 

SIM7906G-M2_R2 Hardware Design (2x2MIMO) LTE Module SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Changning District, Shanghai P.R.China Tel: 86-21-31575100 support@simcom.com www.simcom.com SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Document Title:

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GENERAL NOTES SIM7906G-M2_R2 Hardware Design (2x2MIMO) V1.02 2022-07-25 Released SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMERS POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMERS SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE. COPYRIGHT THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT, ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY TECHNICAL INFORMATION INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE AT ANY TIME. SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R.China Tel: +86 21 31575100 Email: simcom@simcom.com For more information, please visit:

https://www.simcom.com/download/list-863-en.html For technical support, or to report documentation errors, please visit:

https://www.simcom.com/ask/ or email to: support@simcom.com Copyright 2021 SIMCom Wireless Solutions Limited All Rights Reserved. www.simcom.com 2 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Version History Date 2021-11-12 V1.01 2022-07-25 V1.02 Version Description of change Original version 1. Add eSIM description. 2. Add PIN22 and PIN28 description. 3. Description the hardware not support audio by default. 4. Add Table1 SIM7906A/E/G-M2 frequency bands. 5. Modified supply power VBAT:3.1354.4V,Typ:3.3V. Author Dong LiuMeng Hu Dong LiuYi Zheng www.simcom.com 3 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Contents 1 Introduction .................................................................................................................................. 9 1.1 Product Outline ................................................................................................................................... 9 1.2 Hardware Block Diagram ................................................................................................................. 10 1.3 Functional Overview ......................................................................................................................... 11 2 Package Information ..................................................................................................................13 2.1 Top and Bottom View of Module ....................................................................................................... 13 2.2 Pin Assignment Overview ................................................................................................................. 14 2.2.1 WLAN ZIF Connector ............................................................................................................. 14 2.3 Pin Description ................................................................................................................................. 15 2.4 Package Dimensions ........................................................................................................................ 20 2.5 Label information .............................................................................................................................. 21 3 Interface Application ..................................................................................................................22 3.1 Power Supply ................................................................................................................................... 22 3.1.1 Power Supply Design Guide .................................................................................................. 22 3.1.2 Recommended Power Supply Circuit .................................................................................... 24 3.1.3 Voltage Monitor ...................................................................................................................... 25 3.2 Full_Card_Power_Off# ..................................................................................................................... 25 3.2.1 Power on ................................................................................................................................ 26 3.2.2 Power off ................................................................................................................................ 27 3.3 Reset Function ................................................................................................................................. 28 3.4 UART interface ................................................................................................................................. 29 3.5 I2C Interface ..................................................................................................................................... 31 3.6 WoWWAN# ....................................................................................................................................... 32 3.7 USB Interface ................................................................................................................................... 33 3.8 PCIe Interface ................................................................................................................................... 36 3.9 USIM Interface .................................................................................................................................. 38 3.9.1 USIM Application Guide ......................................................................................................... 38 3.9.2 USIM layout guide .................................................................................................................. 40 3.10 I2S Interface * ................................................................................................................................. 40 3.11 DPR ................................................................................................................................................ 42 3.12 CONFIG Pins .................................................................................................................................. 44 3.13 LED1# ............................................................................................................................................. 44 3.14 W_DISABLE1# ............................................................................................................................... 45 3.15 ANTCTRL interface ........................................................................................................................ 46 3.16 W_DISABLE2# ............................................................................................................................... 46 3.17 FORCE DOWNLOAD & GET DEBUG LOG .................................................................................. 47 3.17.1 Forcing USB Boot ................................................................................................................ 48 3.17.2 Get UART log ....................................................................................................................... 49 www.simcom.com 4 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 4 Antenna Interfaces .....................................................................................................................50 4.1 Antenna Definitions........................................................................................................................... 50 4.1.1 WCDMA/LTE Operating Frequency ...................................................................................... 50 4.1.2 GNSS Frequency ................................................................................................................... 51 4.2 Antenna Installation .......................................................................................................................... 52 4.2.1 Antenna Requirements........................................................................................................... 52 4.2.2 Recommended RF Connector for Antenna Installation ......................................................... 52 5 Electrical Specifications .............................................................................................................54 5.1 Absolute maximum ratings ............................................................................................................... 54 5.2 Operating conditions ........................................................................................................................ 54 5.3 Operating Mode ................................................................................................................................ 56 5.3.1 Operating Mode Definition............................................................................................................. 56 5.3.2 Sleep mode ................................................................................................................................... 57 5.3.3 Minimum functionality mode and Flight mode ............................................................................... 57 5.4 RF Output Power/Current Consumption .......................................................................................... 58 5.5 Conducted Receive Sensitivity ......................................................................................................... 60 5.6 ESD .................................................................................................................................................. 62 6 Connect SIM7906G-M2 to board ................................................................................................63 7 Thermal Design ...........................................................................................................................64 8 Packaging....................................................................................................................................65 9 Appendix .....................................................................................................................................68 9.1 Coding Schemes and Maximum Net Data Rates over Air Interface ................................................ 68 9.2 Related Documents .......................................................................................................................... 69 9.3 Terms and Abbreviations .................................................................................................................. 71 9.4 Safety Caution .................................................................................................................................. 73 www.simcom.com 5 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table Index Table 1 : SIM7906A/E/G-M2 frequency bands .............................................................................................................................. 9 Table 2 : SIM7906G-M2 General features .................................................................................................................................... 11 Table 3 : IO parameters definition .................................................................................................................................................. 15 Table 4 : IO parameters definition .................................................................................................................................................. 16 Table 5 : Pin description .................................................................................................................................................................. 16 Table 6 : Pin description of WLAN ZIF connector interface ....................................................................................................... 19 Table 7 : The description of label information............................................................................................................................... 21 Table 8 : VBAT pins electronic characteristic ............................................................................................................................... 22 Table 9 : Recommended TVS diode list ........................................................................................................................................ 23 Table 10 : Power on timing and electronic characteristic ............................................................................................................ 27 Table 11 : Power off timing and electronic characteristic ............................................................................................................ 28 Table 12 : RESET pin electronic characteristic ............................................................................................................................ 29 Table 13 : Definition of USB interface ............................................................................................................................................ 34 Table 14 : USB interface TVS diode list ........................................................................................................................................ 34 Table 15 : Definition of PCIe interface ........................................................................................................................................... 36 Table 16 : PCIe interface recommended TVS diode list ............................................................................................................. 37 Table 17 : USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V) ........................................................................... 38 Table 18 : USIM electronic characteristic 3.0V mode (USIM_VDD=2.85V) ............................................................................. 38 Table 19 : Definition of I2S interface .............................................................................................................................................. 41 Table 20 : The PCM interface is multiplexing with I2S interface ................................................................................................ 41 Table 21 : DPR interface ................................................................................................................................................................. 42 Table 22 : CONFIG Pins .................................................................................................................................................................. 44 Table 23 : CONFIG interface definition ......................................................................................................................................... 44 Table 24 : LED1# pin status ............................................................................................................................................................ 45 Table 25 : W_DISABLE1# pin status ............................................................................................................................................. 45 Table 26 : Definition of antenna control interface......................................................................................................................... 46 Table 27 : Definition of W_DISABLE2# pin ................................................................................................................................... 47 Table 28 : W_DISABLE2# pin status ............................................................................................................................................. 47 Table 29 : Test point status ............................................................................................................................................................. 48 Table 30 : Antenna port definitions ................................................................................................................................................. 50 Table 31 : SIM7906G-M2 WCDMA/LTE Operating frequencies ................................................................................................ 50 Table 32 : GNSS frequency ............................................................................................................................................................ 51 Table 33 : WCDMA/LTE antenna ................................................................................................................................................... 52 Table 34 : the major specifications of the RF connector ............................................................................................................. 53 Table 35 : Absolute maximum ratings ............................................................................................................................................ 54 Table 36 : Recommended operating ratings ................................................................................................................................. 54 Table 37 : 1.8V Digital I/O characteristics* ................................................................................................................................... 54 Table 38 : Operating temperature .................................................................................................................................................. 55 Table 39 : Operating mode Definition ............................................................................................................................................ 56 Table 40 : SIM7906G-M2 Current consumption on VBAT Pins (VBAT=3.3V) ......................................................................... 58 Table 41 : Conducted Output Power ............................................................................................................................................ 59 Table 42 : SIM7906G-M2 Conducted RF Receiving Sensitivity ................................................................................................ 60 www.simcom.com 6 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 43 : The ESD performance measurement table (Temperature: 25, Humidity: 45%) ................................................ 62 Table 44 : The silica gel selection guide........................................................................................................................................ 64 Table 45 : Tray size .......................................................................................................................................................................... 66 Table 46 : Small Carton size ........................................................................................................................................................... 66 Table 47 : Big Carton size ............................................................................................................................................................... 67 Table 48 : Coding Schemes and Maximum Net Data Rates over Air Interface ....................................................................... 68 Table 49 : Related Documents ....................................................................................................................................................... 69 Table 50 : Terms and Abbreviations ............................................................................................................................................... 71 Table 51 : Safety Caution ................................................................................................................................................................ 73 www.simcom.com 7 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure Index Figure 1 : SIM7906G-M2 .............................................................................................................................................................. 11 Figure 2 : Top and bottom view of module (bottom side reserved ground plane for thermal) ............................................... 13 Figure 3 : Pin assignment ............................................................................................................................................................... 14 Figure 4 : Pin map of WLAN ZIF connector interface ................................................................................................................. 15 Figure 5 : Dimensions of SIM7906G-M2 (Unit: mm) ................................................................................................................... 20 Figure 6 : Label information ............................................................................................................................................................ 21 Figure 7 : Power supply application circuit ................................................................................................................................... 23 Figure 8 : Linear regulator reference circuit ................................................................................................................................. 24 Figure 9 : Switching mode power supply reference circuit ......................................................................................................... 24 Figure 10 : Reference power on/off circuit .................................................................................................................................... 26 Figure 11 : Power on timing sequence .......................................................................................................................................... 26 Figure 12 : Power off timing sequence .......................................................................................................................................... 28 Figure 13 : Reference reset circuit ................................................................................................................................................. 29 Figure 14 : UART modem ............................................................................................................................................................... 30 Figure 15 : Reference circuit of level shift ..................................................................................................................................... 30 Figure 16 : Level matching circuit with triode ............................................................................................................................... 31 Figure 17 : I2C reference circuit ..................................................................................................................................................... 32 Figure 18 : WoWWAN# behaviorSMS and URC report etc. ............................................................................................. 32 Figure 19 : WoWWAN# reference circuit ...................................................................................................................................... 33 Figure 20 : USB reference circuit ................................................................................................................................................... 34 Figure 21 : PCIe interface reference circuit (EP Mode) .............................................................................................................. 36 Figure 22 : USIM interface reference circuit ................................................................................................................................. 39 Figure 23 : USIM interface reference circuit with USIM_DET .................................................................................................... 39 Figure 24 : Audio codec diagram circuit ...................................................................................................................................... 40 Figure 25 : Connection of DPR pin ................................................................................................................................................ 42 Figure 26 : LED1# reference circuit ............................................................................................................................................... 44 Figure 27 : Flight mode switch reference circuit .......................................................................................................................... 45 Figure 28 : W_DISABLE2#pin reference circuit ........................................................................................................................... 47 Figure 29 : Test point location ......................................................................................................................................................... 48 Figure 30 : Forcing USB Boot ......................................................................................................................................................... 48 Figure 31 : UART LOG .................................................................................................................................................................... 49 Figure 32 : RF connector ................................................................................................................................................................ 53 Figure 33 : Equipment diagram ...................................................................................................................................................... 63 Figure 34 : Thermal design diagram .............................................................................................................................................. 64 Figure 35 : packaging diagram ....................................................................................................................................................... 65 Figure 36 : Tray drawing .................................................................................................................................................................. 65 Figure 37 : Small carton drawing ................................................................................................................................................... 66 Figure 38 : Big carton drawing ....................................................................................................................................................... 66 www.simcom.com 8 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom M.2 card. With the help of this document and other software application notes/user guides, users can understand and use SIM7906G-M2 to design and develop mobile and laptop applications quickly. 1.1 Product Outline Aimed at the global market, SIM7906G-M2 supports WCDMA, LTE-TDD and LTE-FDDDL 2CA. The supported radio frequency bands are described in the table1. Table 1: SIM7906A/E/G-M2 frequency bands Standard Frequency A:1NN0 A:1NN0 A:1NN0 E:1NN0 E:1NN0 E:1NN0 G:1NN0 G:1NN0 G:1NN0 1NN1G8 G0AA G0AB G0AC G0AA G0AB G0AC G0AA G0AB G0AC AB WCDMA B1 B2 B3 B4 B5 B6 B8 B9 B19 FDD B1 FDD B2 FDD B3 FDD B4 FDD B5 LTE FDD B7 FDD B8 FDD B12 FDD B13 FDD B14 FDD B17 www.simcom.com 9 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 FDD B18 FDD B19 FDD B20 FDD B25 FDD B26 FDD B28 FDD B29 FDD B30 FDD B32 FDD B66 TDD B38 TDD B40 TDD B41 TDD B42 TDD B43 TDD B46 TDD B48 CAT6 CAT6 CAT6 CAT6 CAT6 CAT6 CAT6 CAT6 CAT6 CAT6 GNSS Category NOTE 1. B29 & B32 & B46are only for secondary component carrier 2. GNSS function is optional. With a physical dimension of 30.0*42.0*2.3 mm, SIM7906G-M2 can meet PCI Express M.2 Specification, and can meet almost any space requirement in users applications. With M.2 Type 3042-S3-B, SIM7906G-M2 has almost all common interface integrated, such as USB2.0, PCIe, USIM card, UART, I2C, DRP, LED#, MAIN_ANT and AUX_ANT etc. With all the interfaces, SIM7906G-M2 can also be utilized in the industrial handheld, machine-to-machine laptop application and especially the router. 1.2 Hardware Block Diagram The block diagram of SIM7906G-M2 is shown as below:

www.simcom.com 10 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 1: SIM7906G-M2 1.3 Functional Overview Table 2: SIM7906G-M2 General features Feature Power supply Power consumption Implementation VBAT:3.1354.4V Typical supply voltage: 3.3V Power off current: <100uA www.simcom.com 11 / 79 High SpeedInterfaceSDX12UIM InterfaceLow SpeedPeripherals(All can be Configured asGPIOs)GPIOsAudio DSPSystemRAM+ROMPower System&Clock SystemQlink digitalinterfacsSDR660SDR modemsubsystemRF transmittersFor dual ULRF receiversWith carrierGNSSRFFEMainDuplexerSwitchSAWDRXDuplexerSwitchSAWMMPASAWeMCPNANDLPDDR2PMD9655USB2.0USB3.0PCIeUIM Card withDET(3V/1.8V)2Wire UART+I2COr 4Wire BT_UARTANTCTL0~2WIFI ControlPCIe ControlDPRCOEXWAKE_ON_WWAN(Open Collentor)LED(Open Collentor)GNSS_EN&WAKEUPINPOWER32KHzSPMIBB_CLKPWR_ON(Open Collentor)RESETNMIPI_RFFEWLAN SLP CLKPCM&BT_PCMMIPI_RFFEWLAN_EN&BT_EN8-bitNANDLPDDR2QLinkGPIOsMIPI_RFFEGRFCsGRFCsGRFCsMIPI_RFFE38.4MHzANT_MAINANT_DRXSIM7906G_M2DR_SYNCCONFIG0CONFIG1CONFIG2CONFIG3UIM22.6*2.4mm SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Radio frequency bands Please refer to the table 1 Current in sleep mode : TBD (USB suspend) Class 3 (23dBm2dB) for LTE-TDD bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (24dBm+1/-3dB) for WCDMA bands Support FDD/TDD LTE Category 12 with CA and MIMO Support uplink QPSK and 16-QAM and 64-QAM modulation Support downlink QPSK, 16-QAM and 64-QAM and 256-QAM modulation Support 22 MIMO in DL direction FDD: Max 300Mbps (DL), 50Mbps (UL) TDD: Max 226Mbps (DL), 28Mbps (UL) Main antenna (MAIN) Rx-diversity antenna & GNSS(AUX & GNSS) MT, MO, CB, Text and PDU mode SMS storage: USIM card or ME(default) Transmission of SMS alternatively over CS or PS. Daul SIM(one build-in eSIM 2.6*2.4mm),Support identity card: 1.8V/ 3V Support SAT class 3, GSM 11.14 Release 98 Support USAT Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN Compliant with the PCI Express Base 2.0 Specification, Revision 1.0. Dual mode PCIe controller, working as Root Complex or Endpoint Support PCI Express Gen1 2.5Gb/s raw bandwidth Support link width x1 Embedded DMA engine with up to 250MB/s throughout AXI Master/Slave interface for inbound/outbound data transfer Baud rate: 300bps to 921600bps(default:115200bps) Can be used as the AT commands or data stream channel Multiplex ability according to GSM 07.10 Multiplexer Protocol Apply to the I2C Specification, version 3.0 Clock up to 400Kbps One USB 3.0 SuperSpeed and high-speed (for backward compatibility) Firmware upgrade over USB interface Size:30*42*2.3mm Weight: 5.8g Normal operation temperature: -30C to +70C 3GPP compliant Non operation temperature: -40C to +85C*

Storage temperature -40C to +90C 72 hours Transmitting power LTE Features Antenna SMS application USIM interface USIM toolkit Phonebook management PCIe interface UART interface I2C interface USB Firmware upgrade Physical characteristics Temperature range NOTE Module is able to make and receive voice calls, data calls, SMS and make GPRS/UMTS/HSPA+/LTE traffic in -40 ~ +85. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extended operating temperature range. www.simcom.com 12 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 2 Package Information 2.1 Top and Bottom View of Module Figure 2: Top and bottom view of module (bottom side reserved ground plane for thermal) NOTE The above is the design effect drawing of the module for reference, and the actual appearance shall prevail in kind. www.simcom.com 13 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 2.2 Pin Assignment Overview All functions of the M.2 card will be provided through 75 (including 8 notch pins) pads that will be connected to the customers platform. The following table is the high-level view of the pin assignment of the card. Figure 3: Pin assignment 2.2.1 WLAN ZIF Connector SIM7906G-M2 provide a WLAN ZIF connector for WIFI function, the connector is position bottom side of the module and it no assembly on the module by default, about this connector and WIFI function more details, please contact SIMCom support teams, the following figure is pin map of the WLAN ZIF connector. www.simcom.com 14 / 79 VBATVBATVBATCONFIG_2=GNDGNDGNDCONFIG_1=GNDRESET#(I)(1.8V)ANTCTL0(O)(1.8V)GNDREFCLKPREFCLKNGNDPERp0PERn0GNDSDX_UIM2_PRESENTUIM1-PWRPETp0PETn0GNDUIM1-DATAUIM1-CLKUIM1-RESETDPR(2)/I2S_WS (1.8/3.3V)GNDGNSS_EN#(3.3/1.8V)TUNER_VDD/PCM_DOUT(1.8V)ANT_TUNNER_CFG/PCM_DIN(1.8V)PCM_CLK (1.8V)GNDDPR(1)(1.8/3.3V)WoWWAN#(OD)(1.8/3.3V)CONFIG_0=GNDNotchNotchNotchNotchNotchNotchNotchNotchLED#(OD)(3.3V)FUL_CARD_POWER_OFF#(3.3/1.8V)VBATVBATGNDUSB_D-USB_D+GNDGNDCONFIG_3=NC74727068666462605856545250484644424038363432302826242220108642757371676965636157595553514749454341373935333129252723211195713SDX_RFFE0_DATASDX_RFFE0_CLKPEWAKE#(3.3V)CLKREQ# (3.3V)SDX_UIM1_PRESENTI2C_SDAI2S_MCLKCOEX_TX(1.8V)COEX_RX(1.8V)PERST#(3.3V)VREG_L13E_UIM2_1P8SDX_UIM2_RESET_NSDX_UIM2_CLKSDX_UIM2_DATAI2C_SCLWAKE_UP_IN#(3.3/1.8V)USB3.0-Rx+USB3.0-Rx USB3.0-Tx+USB3.0-Tx ANTCTL1(O)(1.8V)ANTCTL2(O)(1.8V)ANTCTL3(O)/DR_SYNC(1.8V)PIN74PIN10PIN2PIN11PIN1PIN20PIN21PIN75BOTTOP SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 4: Pin map of WLAN ZIF connector interface 2.3 Pin Description Table 3: IO parameters definition Pin type Description PI PO AI AIO DIO DI DO DOH DOL PU PD OD OC Power input Power output Analog input Analog input/output Bidirectional digital input /output Digital input Digital output Digital output with high level Digital output with low level Pull up Pull down Open Drain Open collector www.simcom.com 15 / 79 PIN 1 PIN 30 PIN NumberPIN Name302928272625242322212019181716151413121110987654321GNDVREG_S4M_1P904GNDGNDGNDGNDWIFI_PWR_EN_GPIO_50GNDLAA_AS_EN_GPIO_23WL_XFEM_CTRL_PA_MUT_GPIO_21WL_XFEM_CTRL_LAA_RX_GPIO_43WL_GPIO_GPIO_22WLAN_EN_GPIO_95COEX_UART_RXGNDSLEEP_CLKGNDVREG_S4M_1P904VREG_S4M_1P904VREG_S3M_0P824VREG_S3M_0P824VREG_S3M_0P824VREG_S3M_0P824VREG_S3M_0P824VREG_S3M_0P824VREG_S2M_1P224VREG_S2M_1P224VREG_S2M_1P224VREG_L6M_1P8COEX_UART_TX SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 4: IO parameters definition Voltage domain Parameter VDD_P3=1.8V Min Typ Max P3 P4 P5 VOH VOL VIH VIL Rp VDD_P4=1.8V VOH VOL VIH VIL Rp VDD_P4=2.85V VOH VOL VIH VIL Rp VDD_P5=2.85V VOH VOL VIH VIL Rp High level output Low level output High level input Low level input 1.35V 0V 1.2V

-0.3V Pull up/down resistor 20K ohm High level output Low level output High level input Low level input 1.44V 0V 1.26V

-0.3V Pull up/down resistor 10K ohm High level output Low level output High level input Low level input 2.28V 0V 2.0V

-0.3V Pull up/down resistor 10K ohm High level output Low level output High level input Low level input 2.28V 0V 2.0V

-0.3V

1.8V

1.8V

1.8V 0.45V 2.1V 0.6V 60K ohm 1.8V 0.4V 2.1V 0.36V 100K ohm 2.85V 0.4V 3.15V 0.57V 100K ohm 2.85V 0.4V 3.15V 0.57V Pull up/down resistor 10K ohm 100K ohm Table 5: Pin description Pin name Power supply Pin no. Electrical description Description Comment VBAT GND 2,4,70, 72,74 3,5,11, 27,33, 39,45, 51,57, PI Power supply Range3.1354.4V Typical3.3V These pins should be connected together to withstand sufficent current Ground www.simcom.com 16 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 71,73 System control FULL_CARD_PO WER_OFF#

6 DI,PD RESET#

67 P3 DI,PU High level: the module power on Low level: the module power off System reset control input Active low Its 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO RESET# has been pulled up to 1.8V internally 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO The module is configured as the WWAN USB3.0 interface type Main communication interface USB3.0 data rate up to 10Gbps USB2.0 data rate up to 480Mbps Support One port; PCIe Gen 2 (PCIe Gen 1 compatible) If unused, please keep open WWAN RF disable Active low W_DISABLE2# GNSS disable Active low Wake on the host Active low Connected to ground internally Connected to ground internally Connected to ground internally Not connected Differential USB bi-directional data positive Differential USB bi-directional data negative USB3.0 transmit data negative USB3.0 transmit data positive USB3.0 receive data negative USB3.0 receive data positive PCIe transmit data negative PCIe transmit data positive PCIe receive data negative PCIe receive data positive PCIe reference clock negative PCIe reference clock positive PCIe reset signal Active low PCIe reference clock request signal Active low PCIe wake up control Active low VBAT~3.3V voltage domain, CLKREQ# and PEWAKE# required pull up external, Default as EP mode, If unused, please keep W_DISABLE1#

8 W_DISABLE2#

WoWWAN#

26 23 Configuration pins CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 USB2.0/USB3.0 USB_D+

USB_D-

USB3.0_Tx-

USB3.0_Tx+

USB3.0_Rx-

USB3.0_Rx+

PCIe interface PETn0 PETp0 PERn0 PERp0 REFCLKN REFCLKP 21 69 75 1 7 9 29 31 35 37 41 43 47 49 53 55 PCIe assistant interface PERST#

CLKREQ#

PEWAKE#

50 52 54 DI DI OD GND GND GND NC AIO AIO AO AO AI AI AO AO AI AI AIO AIO DI DIO DIO www.simcom.com 17 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02

(U)SIM interface

(U)SIM1_PWR 36 PO

(U)SIM1_DATA 34 P4 DIO

(U)SIM1_CLK 32

(U)SIM1_RESET 30 P4 P4 DO DO

(U)SIM1_DET 66 P3 DI

(U)SIM2_PWR 48 PO

(U)SIM2_DATA 42 P5 DIO

(U)SIM2_CLK 44

(U)SIM2_RESET 46 P5 P5 DO DO

(U)SIM2_DET 40 P3 DI Antenna control interface2 Power supply for (U)SIM1 card

(U)SIM1 card data, which has been pulled up to

(U)SIM1_VDD via a 20KR resistor internally

(U)SIM1 clock signal

(U)SIM1 reset control

(U)SIM1 card detect, which has been pulled up to VDD_P3 via a 470KR resistor internally Power supply for (U)SIM2 card

(U)SIM2 card data, which has been pulled up to

(U)SIM2_VDD via a 20KR resistor internally

(U)SIM2 clock signal

(U)SIM2 reset control

(U)SIM2 card detect, which has been pulled up to VDD_P3 via a 470KR resistor internally ANTCTL0 ANTCTL1 ANTCTL 2 ANTCTL3 2

(DR_SYNC) RFFE_SDATA RFFE_SCLK I2S interface I2S_CLK ANT_TUNNER_ CFG

(I2S_RX) 3 TUNER_VDD

(I2S_TX) 3 I2S_WA 3 DPR2 3 *

59 61 63 65 58 56 20 22 P3 P3 P3 DO DO DO Antenna tuner control0 Antenna tuner control1 Antenna tuner control2 P3 DO Antenna tuner control3

(Dead reckoning synchronization signal) P3 P3 DIO DO Antenna tuner MIPI DATA Antenna tuner MIPI CLK P3 DO I2S clock output P3 DI ANT_TUNNER_CFG_1.8V

(I2S data input) 24 P3 DO Tuner_VDD_1.8V

(I2S data output) 28 P3 DO DI I2S word alignment select

(L/R) DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) sensor interrupt input I2S master clock I2S_MCLK 60 P3 DO I2C interface open 1.8/3.0V voltage domain,

(U)SIM interfaces should be protected against ESD If unused, please keep open. The eSIM has been reserved internal. 1.8/3.0V voltage domain,

(U)SIM interfaces should be protected against ESD If unused, please keep open 1.8V voltage domain. If unused, please keep open 1.8V voltage domain, also can be used as PCM interface, If need audio function, please contact SIMCom support teams. If unused, please keep open. www.simcom.com 18 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 P3 DIO I2C data signal P3 DO I2C clock signal P3 DO P3 DI SIM7906G-M2 hardware configures as coexistence signal function by default 1.8V voltage domain, Internal pulled up to 1.8V. If unused, please keep open If need normal communication UART(AT command), please contact SIMCom support teams I2C_SDA I2C_SCL Coex interface4 COEX1*

(UART_TX*) COEX2*

(UART_RX*) Other pins LED1#

68 38 64 62 10 DPR1*

25 P3 DI OD The module status indicator via LED devices Active low DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) sensor interrupt input Notch Notch NOTE 12, 13, 14, 15, 16, 17, 18, 19 Notch 1. * means under development. 2. The RFFE signals are multiplexed with ANTCTL3 and DR_SYNC. 3. SIM7906G-M2 hardware configures as DPR2Tuner_VDD_1.8V and ANT_TUNNER_CFG output function by default.If need I2S data, please contact SIMCom support teams. 4. SIM7906G-M2 interface the pin of 62 and 64 hardware support COEX_UART function by default. Table 6: Pin description of WLAN ZIF connector interface Pin name SLEEP_CLK COEX_UART_TX COEX_UART_RX WL_EN_GPIO_52 WL_GPIO_GPIO_94 WL_XFEM_CTRL_LAA_RX_GPIO_26 WL_XFEM_CTRL_PA_MUT_GPIO_41 LAA_AS_EN_GPIO_40 WL_SW_CTRL PIN no. 2 Electrical description P3 DO 4 5 6 7 8 9 10 12 P3 DO P3 DI P3 P3 P3 P3 P3 P3 DO DO DO DO DO DO Discribtion Sleep clock output for W80 only LTE&WLAN coexistence data transmit LTE&WLAN coexistence data receive W80 RF coexistence signals www.simcom.com 19 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 14 16,17, 18 20,21, 22,23, 24,25 27,28, 29 1,3,11, 13,15, 19,26, 30 PO PO Output power supply for W80 only Output power supply for W80 only PO Output power supply for W80 only PO Output power supply for W80 only Ground VREG_L6E_1P8 VREG_S2E_1P224 VREG_S3E_0P824 VREG_S4E_1P904 GNG 2.4 Package Dimensions Figure 5: Dimensions of SIM7906G-M2 (Unit: mm) www.simcom.com 20 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 2.5 Label information Figure 6: Label information Table 7: The description of label information No. A B C D E F Description SIMCom logo Project name QR code Module part number Serial number International mobile equipment identity www.simcom.com 21 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3 Interface Application 3.1 Power Supply The recommended power supply of SIM7906G-M2 is 3.3V and the voltage ranges from 3.135 V to 4.4 V. The SIM7906G-M2 has 5 power pins and 11 ground pins, to ensure the SIM7906G-M2 card works normally, all the pins must be connected. The connector pin is defined to support 500mA current per pin continuously. Table 8: VBAT pins electronic characteristic Symbol Description VBAT Module power voltage. IVBAT(peak) Module power peak current in normal mode. IVBAT(power-off) Module power current in power off mode. Min. Typ. Max. Unit 3.135

50 3.3 1.0 80 4.4 2.0 100 V A uA 3.1.1 Power Supply Design Guide Make sure that the voltage on the VBAT pins will never drop below 3.135V, even during a transmit event, when current consumption may rise up to 1.0A. If the voltage drops below 3.135V, the module might be powered off automatically. NOTE Be sure the power supply for VBAT pins can support more than1.0A, using a total of more than 330uF capacitors is recommended, in order to avoid the voltage dropping to lower than 3.135V. Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMC. These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 1.0 mm to minimize PCB trace impedance. The following figure shows the recommended circuit. www.simcom.com 22 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 If the VBAT generated by a switch mode power supply, it is suggested to add a bead to suppress the Interference. Recommend part of FB101 is BLM21PG300SN1D or MPZ2012S221A. Figure 7: Power supply application circuit NOTE The test condition: The voltage of power supply for VBAT is 3.3V, Ca is a 100 F tantalum capacitor

(ESR=0.7). PIN3,5,71,73 are the main return current path of module, these pins should be coppered by a ground plane to main ground. All other GND pins also need connect to ground. In addition, in order to guard for over voltage protection, it is suggested to use a TVS diode to protect the M.2 card. TVS diode should be placed near VBAT pins. Table 9: Recommended TVS diode list No. Manufacturer Part Number VRWM Package 1 2 3 4 JCET WAYON WILL WILL ESDBW5V0A1 WS05DPF-B ESD5611N ESD56151W05 5V 5V 5V 5V DFN1006-2L DFN1006-2L DFN1006-2L SOD-323 www.simcom.com 23 / 79 2GNDGNDModuleCcFB101TVS10uFVBATCa100uFVBAT4707274Cb100nFCc33pFVBATVBATVBATVBAT3,571,73Width more than 2mmMake a copper to main ground SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.1.2 Recommended Power Supply Circuit It is recommended that a switching mode power supply or a linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist the current which could be more than 1A. The following figure shows the linear regulator reference circuit with 5V input and 3.3V output. Figure 8: Linear regulator reference circuit If there is a high dropout between input and VBAT, or the efficiency is extremely important, then a switching mode power supply will be preferable. The following figure shows the switching mode power supply reference circuit with 12V input and 3.3V output. Figure 9: Switching mode power supply reference circuit NOTE The Switching Mode power supply solution for VBAT must be chosen carefully against Electro Magnetic Interference and ripple current from depraving RF performance. PWR_CTRL must connect to host in case that the module system crash. www.simcom.com 24 / 79 VinVoutGNDFB3+PWR_CTRLR102R101VBAT20K(1%)10K(1%)+U101MIC293025412C101C102100uF1uFDC INPUTR103470ROn/OffFUSEC103330uFC104100nFFUSEVinVoutFBU10112345LM2596-ADJ+100uHMBR360L101C101+C102D102C103R102R101FB101330uFVBAT20K(1%)10K(1%)100uF1uFC104100nF270 ohm@100Mhz DC INPUTPWR_CTRLGNDOn/Off SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.1.3 Voltage Monitor To monitor the VBAT voltage, the AT command AT+CBC can be used. For monitoring the VBAT voltage outside or within a special range, the AT command AT+CVALARM can be used to enable the Over-voltage warning function. If users need to power off module when the VBAT voltage is out of a range, the AT command AT+CPMVT can be used to enable over-voltage power-off function. NOTE Over-voltage warning function and over-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1]. The module will power on automatically after the under-voltage power off procedure if the Full_Card_Power_Off# signal keeps at high level. 3.2 Full_Card_Power_Off#

Module can be powered on by pulling the Full_Card_Power_Off# pin up to high level through GPIO, which is 3.3V tolerant. Full_Card_Power_Off# signal is an active low input signal and will turn the module on when asserted high

(1.7 V) and will force the module to shut down when asserted low (0.2 V). This pin is 3.3V tolerant and can be driven by either 1.8V or 3.3V GPIO and has been pulled down internal. www.simcom.com 25 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 10: Reference power on/off circuit NOTE Module could be automatically power on by connecting Full_Card_Power_Off# pin to VBAT via 0R resistor directly. 3.2.1 Power on The power-on scenarios are illustrated in the following figure. Figure 11: Power on timing sequence www.simcom.com 26 / 79 Power On ModuleFULL_CARD_POWER_OFF#MCUGPIO(1.8V/3.3V)Q1Power on Logic20KR1NCPower off RESET#(Input)TwaitVBATFull_Card_Power_Off#(Input)USB PortUndefinedActiveTon(usb)Power off SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 10: Power on timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit Twait The time which is used to wait the VBAT to be stable. 100

Ton(usb) The time from power-on issue to USB port ready

VIH VIL Input high level voltage on Full_Card_Power_Off# pin 1.0 Input low level voltage on Full_Card_Power_Off# pin

-0.3 0 TBD 1.8

50 4.4 0.2 ms s V V 3.2.2 Power off The following conditions could make the module power off. Condition 1: Power off module by holding the Full_Card_Power_Off# pin to a low level. Condition 2: Power off module by removing the VBAT. Condition 3: Power off module by AT command AT+CPOF. Condition 4: Over-voltage or under-voltage automatic power off. Condition 5: Over-temperature or under-temperature automatic power off. NOTE The over-temperature and over-voltage function is disabled by default. If the temperature is outside the range of -30~+70, some warnings will be reported via AT port. If the temperature is outside the range of -40~+85, module will be powered off automatically. (if the function is enabled) The module will power on automatically after the condition 3 ~ 4 power off procedure if the Full_Card_Power_Off# signal keeps at high level. These procedures under condition 1~3 will make the M.2 card disconnect from the network and allow the software to enter a safe state, and save data before the card be powered off completely. The power off scenario by pulling down the Full_Card_Power_Off# pin is illustrated in the following figure. www.simcom.com 27 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 12: Power off timing sequence Table 11: Power off timing and electronic characteristic Symbol Parameter Time value Min. Typ. Max. Unit Toff(usb) The time from power-off issue to USB port off

TBD 20 s 3.3 Reset Function Module can be reset by pulling the RESET# pin down to ground. NOTE This function is only used as an emergency reset, when both AT command AT+CPOF and the Full_Card_Power_Off# pin have lost efficacy. The RESET# need a pull up with a resistor to 1.8V or 3.3V, it is strongly recommended to put a100pF capacitor and an ESD protection diode close to the RESET# pin. Please refer to the following figure for the recommended reference circuit. www.simcom.com 28 / 79 Toff(USB)(Input)USB PortPower offActiveFull_Card_Power_Off#Active SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 13: Reference reset circuit Table 12: RESET pin electronic characteristic Symbol Description Min. Typ. Max. Unit Treset VIH VIL The active low level impulse time on RESET_N pin to reset module Input high level voltage Input low level voltage 250 1.2 0

600 ms 1.9 0.4 V V 3.4 UART interface Module provides a 2-wire UART (universal asynchronous serial transmission) interface as DCE (Data Communication Equipment). AT commands and data transmission can be performed through UART interface. The following figures show the reference design. www.simcom.com 29 / 79 4.7K47KReset ImpulseRESET#Reset LogicNA1.8VModule100pFTreset10K1.8V SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 14: UART modem The module UART is 1.8V voltage interface. If users UART application circuit is 3.3V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0102RGYR provided by Texas Instruments is recommended. The following figure shows the voltage matching reference design. Figure 15: Reference circuit of level shift Customers can use another level shifter circuits as follow. www.simcom.com 30 / 79 TXDRXDModule(DCE)Host(DTE)UARTUARTTXDRXDTXDRXDA1A2ModuleTXB0102RGYRUART portB1B2VCCAOE1.8V100nF3.3V100nFVCCBGNDTXD_3.3VRXD_3.3V SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 16: Level matching circuit with triode NOTE User need to use high speed transistors such as MMBT3904, or use NMOS such as 2SK3541T2L. Module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600. The default band rate is 115200bps. Dotted line signal should refer to the TXD and RXD circuit. HOST_WK_MODULE function please refer chapter 3.17. 3.5 I2C Interface Module provides an I2C interface compatible with I2C specification, version 3.0, with clock rate up to 400 kbps. Its operation voltage is 1.8V. The following figure shows the I2C bus reference design. www.simcom.com 31 / 79 1.8V4.7K1K~4.7KMCU_RXDVIO_MCUTXDModuleHost4.7K1K~4.7KRXD1.8VMCU_TXDHOST_WK_MODULEGNDGPIOGND1nF1nF470pF_NMGPIOGPIO SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 17: I2C reference circuit NOTE I2C_SDA and I2C_SCL have no pull-up resistors in module. So, 2 external pull up resistors are necessary in application circuit. For more details about AT commands please refer to document [1]. 3.6 WoWWAN#

The WoWWAN# pin is an open drain signal which can be used as an interrupt signal to the host. Normally it will keep high logic level until certain conditions such as receiving SMS, voice call (CSD, video) or URC reporting, then WoWWAN# will change to low logic level to inform the host (client PC), the pulse time is 1 second. Figure 18: WoWWAN# behaviorSMS and URC report etc. WoWWAN# Reference circuit is recommended in the following figure. www.simcom.com 32 / 79 ModuleI2C_SDASDAGNDGNDI2C_SCLSCL1.8V2.2K2.2KDeviceHIGHLOW1sWoWWAN#

SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 19: WoWWAN# reference circuit 3.7 USB Interface SIM7906G-M2 supports one USB interface which complies with the USB3.0 and 2.0 specifications. Customers can choose USB3.0 or USB2.0 for their needs. USB 3.0 data rate up to 10Gbps. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. The module supports USB suspend and resume mechanism which can save power consumption. If there is no data transmission on the USB bus, the module will enter suspend mode automatically. The following figure is the USB reference circuit. www.simcom.com 33 / 79 ModuleVCC From Host10 ~100KHostInterrupt inputBB ChipWoWWAN#

SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 13: Definition of USB interface Figure 20: USB reference circuit Pin name Pin no. Electrical description Description Comment USB_D+

USB_D-

7 9 USB3.0_Tx-

29 USB3.0_Tx+

31 USB3.0_Rx-

35 USB3.0_Rx+

37 AIO AIO AO AO AI AI Differential USB bi-directional data positive Differential USB bi-directional data negative USB3.0 transmit data negative USB3.0 transmit data positive USB3.0 receive data negative USB3.0 receive data positive USB3.0 data rate up to 10Gbps USB2.0 data rate up to 480Mbps Table 14: USB interface TVS diode list No. Manufacturer Part number Package 1 WILL ESD5302N-3/TR DFN1006-3L www.simcom.com 34 / 79 USB_SS_RX_PUSB_SS_RX_MUSB_SS_TX_PUSB_SS_TX_MModuleApplication ProcessorUSB3.1_Tx+USB3.1_Tx-100nF100nFPIN31PIN29USB3.1_Rx+USB3.1_Rx-100nFPIN37PIN35100nFTVS/0.5pFTVS/0.5pFUSB_HS_PUSB_HS_MUSB_D+USB_D-PIN7PIN9TVS/0.5pF SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 USB HS D+/D- layout guidelines:

Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 1mm. Gap from other signals keeps 3xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, audio, and 38.4M XO). The TVS diode should be placed close to the USB pins of M.2 connector. Maximum PCB trace length cannot exceed 100mm outside of module, the shorter trace and more better. USB SS TX/RX layout guidelines:

Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, especially 2.4 GHz). The TVS diode should be placed close to the USB pins of M.2 connector. Route differential pairs in the inner layers with a solid GND reference to have good impedance control and to minimize discontinuities. Keep isolation between the Tx pair, Rx pair, and DP/DM to avoid crosstalk. If core vias are used, use no more than two core vias per signal line to limit stubs. www.simcom.com 35 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.8 PCIe Interface SIM7906G-M2 supports PCIe Gen 2 (PCIe Gen 1 compatible) , and can be used as Root Complex or Endpoint mode. CLKREQ# and PEWAKE# needs pull up to 3.3V by 100K resesitor in customers design. The following figure is the PCIe reference circuit. Figure 21: PCIe interface reference circuit (EP Mode) NOTE 1. * means under development. 2. The AC capacitors of AP_PETn0 and AP_PETp0 should be closed to AP. 3. The voltage domain of PCIe assistant signals is VBAT~3.3V. Table 15: Definition of PCIe interface Pin Name Pin No. Electrical Description Functional Description Comment PETn0 41 AIO PETp0 43 AIO PCI Express Lane 0, Transmit Pair, Negative Signal 2.5GHz serial interface PCI Express Lane 0, Transmit Pair, Positive Signal 2.5GHz serial interface www.simcom.com 36 / 79 AP_PERn0AP_PERp0AP_PETn0AP_PETp0ModuleApplication ProcessorPETn0PETp0100nF100nFPIN41PIN43PERn0PERp0100nFPIN47PIN49100nF100K100KREFCLKNREFCLKPPERSTR#PEWAKE#CLKREQ#PIN53PIN55AP_REFCLKNAP_REFCLKPAP_PERSTR#AP_PEWAKE#AP_CLKREQ#PIN52PIN50PIN54+3.3VTVS/0.5pFTVS/0.5pFTVS/0.5pFUSB_HS_DPUSB_HS_DMUSB_HS_DPUSB_HS_DM SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 PCI Express Lane 0, Receive Pair, Negative Signal 2.5GHz Serial interface PCI Express Lane 0, Receive Pair, Positive Signal 2.5GHz Serial interface 100MHz PCI Express platform reference Clock Negative signal of differential pair 100MHz PCI Express platform Reference Clock. Positive signal of differential pair PERSTR# is a functional reset to the Add-In module active low PCIe reference clock request signal active low PCIe wake up signal active low VBAT~3.3V voltage domain, CLKREQ# and PEWAKE#

required pull up external, Default as EP mode. If unused, please keep open PERn0 47 AIO PERp0 49 AIO REFCLKN 53 AIO REFCLKP 55 AIO PERST#

50 DI CLKREQ#

52 DIO PEWAKE#

54 DIO NOTE 1.SIM7906G-M2 interface the pin of PCIe endpoint(EP) mode by default. Support root complex(RC) mode of the module , for more details, please contact SIMCom support teams. Table 16: PCIe interface recommended TVS diode list No. Manufacturer Part Number Package 1 WILL ESD5302N-3/TR DFN1006-3L PCIe interface layout guidelines:

Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 700um (5ps). Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. Should be routed away from sensitive signals. The TVS diode should be placed close to the PCIe pins of M.2 connector. www.simcom.com 37 / 79 1 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.9 USIM Interface Module supports both 1.8V and 3.0V USIM Cards.The eSIM has been reserved internal , which is compatible with USIM2 signal,and it no assembly on the module by default. Table 17: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V) Symbol Parameter Min. USIM_VDD LDO power output voltage 1.75 Typ. Max. 1.8 1.95 VIH VIL VOH VOL High-level input voltage 0.65*USIM_VDD Low-level input voltage

-0.3 High-level output voltage USIM_VDD -0.45 Low-level output voltage 0

0

0 USIM_VDD +0.3 0.35*USIM_VDD USIM_VDD 0.45 Table 18: USIM electronic characteristic 3.0V mode (USIM_VDD=2.85V) Symbol Parameter Min. USIM_VDD LDO power output voltage 2.75 Typ. Max. 2.85 3.05 VIH VIL VOH VOL High-level input voltage 0.65*USIM_VDD Low-level input voltage

-0.3 High-level output voltage USIM_VDD -0.45 Low-level output voltage 0

0

0 USIM_VDD +0.3 0.25*USIM_VDD USIM_VDD 0.45 Unit V V V V V Unit V V V V V 3.9.1 USIM Application Guide It is recommended to use an ESD protection component such as ESDA6V1-5W6 produced by ST

(www.st.com ) or SMF12C produced by ON SEMI (www.onsemi.com ). Note that the USIM peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder reference circuit. www.simcom.com 38 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 22: USIM interface reference circuit The SIM Detect pin is used for detection of the USIM card hot plug in. User can select the 8-pin USIM card holder to implement USIM card detection function. The following figure shows the 8-pin SIM card holder reference circuit. Figure 23: USIM interface reference circuit with USIM_DET If the USIM card detection function is not used, user can keep the SIM Detect pin open. NOTE The eSIM has been reserved internal , which is compatible with USIM2 signal,and it no assembly on the module by default. This function is under development,about eSIM for details please contact SIMCom support teams. www.simcom.com 39 / 79 ModuleTVSUSIM_VDDUSIM_CLKUSIM_DATAUSIM_RSTVCC GNDRST VPPCLK I/O22100nFC707 10M006 512USIM Socket222222pF_NM22pF_NM22pF_NMModuleUSIM_VDDUSIM_CLKUSIM_DATAUSIM_RSTUSIM_DETPRESENCE100nFMOLEX-91228USIM CardVCCGNDRSTVPPCLKI/O22pF(NC)TVS1Deserved22R0R22R22R22pF(NC)22pF(NC) SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.9.2 USIM layout guide SIM card circuit is susceptible, the interference may cause the SIM card failures or some other situations, so it is strongly recommended to follow these guidelines while designing:

The traces should be as short as possible. Make sure that the SIM card holder should be far away from the antenna while in PCB layout. SIM traces should keep away from RF lines, VBAT and high-speed signal lines. Keep SIM holders GND connect to main ground directly. Shielding the SIM card signal by ground. Recommended to place a 0.11uF capacitor on USIM_VDD line and keep close to the holder. Add some TVS and the parasitic capacitance should not exceed 60pF. The rise/fall time of USIM_CLK should not be more than 40ns. 3.10 I2S Interface *

The SDX device supports two (primary and secondary) bidirectional multiple inter-IC sound (MI2S) interfaces and two (primary and secondary) PCM interfaces to support I2S/PCM devices. The following figure is the external codec reference design circuit. NOTE Figure 24: Audio codec diagram circuit 1*The module configures as DPR2Tuner_VDD_1.8V and ANT_TUNNER_CFG output function on the same interfaces with PCM interfaces by default,If need PCM audio function, please contact SIMCom support teams. www.simcom.com 40 / 79 I2S_MCLK22pF(NC)ADCDAT1LRCK1BCLK1DACDAT1MCLKSCLSDAIN1PMICBIAS1LOUTR/NMICALC56162.2K2.2uFI2C_SCLI2C_SDAI2S_RXI2S_TXI2S_WAI2S_CLKModule22pF(NC)22pF(NC)22pF(NC)22pF(NC)LOUTL/P0R0R33pFSpeaker33pFLESD8LH5.0CT5GLESD8LH5.0CT5G1uF1uF1.8V1.8V3.3V1.8VAVDDCPVDDDBVDDMICVDDDCVDDDACREF1.8V2.2uF SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 19: Definition of I2S interface Pin name Pin no. I2S_CLK I2S_RX I2S_TX I2S_WA I2S_MCLK 20 22 24 28 60 Electrical description DO DI DO DO DO Description I2S clock output I2S data input I2S data output I2S word alignment select (L/R) I2S master clock Comment 1.8V voltage domain, also can be used as PCM interface, If unused, please keep open The PCM interface is multiplexing with I2S interface. The default audio interface of the module is I2S. Table 20: The PCM interface is multiplexing with I2S interface Pin name I2S_RX I2S_TX I2S_WA I2S_CLK I2S_MCLK Audio layout guidelines:

PCM interface PCM_DIN PCM_OUT PCM_SYNC PCM_CLK

Analog input 0.2mm trace widths; 0.2mm spacing between other signals trace. Pseudo differential route for MIC. Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high speed signals. Analog output Speaker output signal route as differential pair with 0.5mm trace widths. Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other high speed signals. Audio power and GND Recommend add magnetic bead on AVDD net reserved for debug. VDD cannot directly use VBAT as the power supply. AGND need add GND via to the main GND plane directly. www.simcom.com 41 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.11 DPR DPR (Dynamic Power Reduction) signal is used by SIM7906G-M2 to assist in meeting regulatory SAR

(Specific Absorption Rate) requirements for RF exposure. The signal is provided by a host system proximity sensor to module to provide an input trigger causing a reduction in the radio transmit output power. User can use AT command to active this function, if do not need this function, this pin can be keep floating. Table 21: DPR interface Pin no Pin Name Pin status Function 25 DPR1 Low High Max transmitting power will be reduced by set through AT command Max transmitting power will not be reduced (default) 28 DPR2 DI SAR solution: In case of HW only solution. Floating Max transmitting power will not be reduced The proximity sensor should be controlled by host, following figure shows the connection relationship between module and sensor. Figure 25: Connection of DPR pin NOTE The DRP function is under developing. www.simcom.com 42 / 79 ModuleVCC From Host10KProximitySensorInterrupt outputDPRHostUSB2.0Active lowBB Chip SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 www.simcom.com 43 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.12 CONFIG Pins These signals provide the means to indicate the specific configuration of the module. SIM7906G-M2 is configured as WWAN-USB3.0 . Table 22: CONFIG Pins Pin no Pin Name Description 21 69 75 1 CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 Connected to GND internally. Connected to GND internally. Connected to GND internally. No Connect internally. In the M.2 specification, the 4 pins are defined as below:

Table 23: CONFIG interface definition CONFIG_0

(Pin 21) GND CONFIG _1

(Pin 69) GND CONFIG _2

(Pin 75) GND CONFIG _3

(Pin 1) NC Module type and main host interface WWAN USB 3.0 Comments Vender defined 3.13 LED1#

LED1# is open drain output and is used to allow SIM7906G-M2 to provide network status via LED which will be provided by the host. Figure 26: LED1# reference circuit www.simcom.com 44 / 79 RVCCLED1#ModuleBB Chip SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 NOTE The value of the resistor named R depends on the LED characteristic. The timing sequence is as followed:

Table 24: LED1# pin status LED1# pin status Module status Always On Searching Network; Call Connect (include VOLTE, SRLTE) 200ms ON, 200ms OFF Data Transmit; 4G registered;

800ms ON, 800ms OFF 3G registered network OFF Power off; Sleep 3.14 W_DISABLE1#

The W_DISABLE1# pin controls SIM7906G-M2 to enter or exit the flight mode, when the W_DISABLE1#

signal is asserted to low level, all RF functions would be disabled. When the W_DISABLE1# signal is not asserted, the RF function will be active if it was not disabled by other means such as software. Its reference circuit is shown in the following figure. Figure 27: Flight mode switch reference circuit W_DISABLE1# pin status as below:

Table 25: W_DISABLE1# pin status www.simcom.com 45 / 79 ModuleVCC From Host10KHOSTBB ChipW_DISABLE1#VIO_1V8100KW_DISABLE1#

SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 W_DISABLE1# pin status Module operation Input Low Level Input High Level Flight Mode: RF is closed AT+CFUN=4: RF is closed AT+CFUN=1: RF is working (default) 3.15 ANTCTRL interface ANTCTL[0:3] are used for tunable antenna control and should be routed to anappropriate antenna control circuitry. The following table are the definitions for antenn control interfaces. Table 26: Definition of antenna control interface Pin Name Pin No. Electrical Description Description Comments 59 61 58 56 DO DO DO DO Antenna tuner control0 Antenna tuner control1 Antenna tuner control2 Antenna tuner control3 1.8V voltage domain. If unused, please keep open ANTCTL0 ANTCTL1 ANTCTL 2 ANTCTL3

(DR_SYNC) NOTE This function is under development, for details please contact SIMCom support teams. 3.16 W_DISABLE2#

The W_DISABLE2# pin controls SIM7906G-M2 to disable the GNSS function. When the W_DISABLE2#

signal is pulled to low level, the GNSS function would be disabled. The following figure shows the reference circuit of W_DISABLE2#. www.simcom.com 46 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Figure 28: W_DISABLE2#pin reference circuit Table 27: Definition of W_DISABLE2# pin Pin name Pin no. Electrical description Description Comments W_DISABLE2# 26 DI GNSS disable Active low 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO Table 28: W_DISABLE2# pin status W_DISABLE2# pin status Input Low Level Input High Level Module operation GNSS function is disabled AT+CGPS=0: GNSS function is disabled AT+CGPS=1: GNSS function is enabled(default) 3.17 FORCE DOWNLOAD & GET DEBUG LOG SIM7906G-M2 reserve test points to facilitate customers to use the forced download function. At the same time, we can also read the debugging log. www.simcom.com 47 / 79 ModuleVCC From Host10KHOSTBB ChipW_DISABLE2#VIO_1V8100KPIN26 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 29: Test point status Figure 29: Test point location Test point Pin name Electrical description Description Comments A B C D E F G RESET#

DI,PU VOUT1.8V DO,PU FORCE_USB_BOOT DI DEBUG_TX DEBUG_RX USB_D-

USB_D+

DO DI DIO DIO 3.17.1 Forcing USB Boot RESET# has been pulled up to 1.8V internally 1.8V voltage domain 1.8V voltage domain System reset control input Active low pulled up to 1.8V internally Connect to VOUT1.8V enter to force download function Debug UART TX Debug UART RX Differential USB bi-directional data negative Differential USB bi-directional data positive During development or factory production, a boot from the USB 2.0 port can be forced by using test point of FORCED_USB_BOOT. FORCED_USB_BOOT always takes precedence, regardless of the state of the BOOT_CONFIG GPIOs or FAST_BOOT_SEL fuses. We can short circuit test points B and C of the module forces the SDX device to boot from the USB_HS port. Figure 30: Forcing USB Boot www.simcom.com 48 / 79 ModuleTP_BTP_CS1 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 3.17.2 Get UART log During development we need get UART LOG to analyze problems. We can obtain log on PC through serial port tool.The default band rate is 115200bps. Figure 31: UART LOG www.simcom.com 49 / 79 ModuleTP_DTP_ETXRXserial port toolPCGNDGNDUSB SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 4 Antenna Interfaces SIM7906G-M2 provides two antennas for 3G/4G and GNSS. The antenna ports have an RF impedance of 50. 4.1 Antenna Definitions For detailed designs about antenna, please refer to the antenna design guide Document [14]

SIM7906G-M2 Antenna Port Mapping and Design Guide in the appendix. Table 30: Antenna port definitions FUNCTIONS MAIN AUX GNSS 3G/4G LB/MHB TRX 3G/4G LB/MHB DIV GNSS 4.1.1 WCDMA/LTE Operating Frequency The following table shows WCDMA/LTE Operating frequencies Table 31: SIM7906G-M2 WCDMA/LTE Operating frequencies Band Uplink (UL) Downlink (DL) WCDMA B1 1920 ~1980 MHz WCDMA B2 1850 ~1910 MHz WCDMA B3 1710 ~1785 MHz WCDMA B4 1710 ~1755 MHz 824849 MHz 2110 ~2170 MHz 1930 ~1990 MHz 1805 ~1880 MHz 2110 ~2155 MHz 869894MHz WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B9 832.4837.6 MHz 877.4882.6MHz 880 ~915 MHz 925 ~960 MHz 1749.9 ~1784.9 MHz 1844.9 ~1879.9 MHz WCDMA B19 830 ~845 MHz LTE B1 LTE B2 1920 ~1980 MHz 1850 ~1910 MHz 875 ~890 MHz 2110 ~2170 MHz 1930 ~1990 MHz Duplex Mode FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD www.simcom.com 50 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 1710 ~1785 MHz 1710 ~1755 MHz 824849 MHz 2500~2570MHz 880 ~915 MHz 699 ~716 MHz 777 ~787 MHz 788 ~798 MHz 704 ~716 MHz 815 ~830 MHz 830 ~845 MHz 832~862MHz 1805 ~1880 MHz 2110 ~2155 MHz 869894MHz 2620~2690MHz 925 ~960 MHz 729 ~746 MHz 746 ~756 MHz 758 ~768 MHz 734 ~746 MHz 860 ~875 MHz 875 ~890 MHz 791~ 821MHz 1850 ~1915 MHz 1930 ~1995 MHz 814 ~849 MHz 703~748 MHz N/A 2305 ~2315 MHz N/A 2570 ~2620 MHz 2300 ~2400 MHz 2555 ~2655 MHz 859 ~894 MHz 758~803 MHz 717 ~728 MHz 2350 ~2360 MHz 1452~1492MHz 2570 ~2620 MHz 2300 ~2400 MHz 2555 ~2655 MHz 3400 ~3599.9 MHz 3400 ~3599.9 MHz 3600 ~3799.9 MHz 3600 ~3799.9 MHz 5150 ~5925 MHz 5150 ~5925 MHz 3550 ~3700 MHz 1710 ~1780 MHz 3550 ~3700 MHz 2110 ~2200 MHz FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD LAA TDD FDD LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B29 LTE B30 LTE B32 LTE B38 LTE B40 LTE B41 LTE B42 LTE B43 LTE B46 LTE B48 LTE B66 NOTE LTE-FDD B29 & B32 & B46 supports Rx only and are only for secondary component carrier. 4.1.2 GNSS Frequency The following table shows frequency specification of GNSS antenna interface. Table 32: GNSS frequency www.simcom.com 51 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Type GPS L1/Galileo/QZSS GPS L5 GLONASS BeiDou/Compass Frequecy 1575.421.023MHz 1176.4510.23MHz 1597.5~1605.8MHz 1561.0982.046MHz 4.2 Antenna Installation 4.2.1 Antenna Requirements The following table shows the requirements on 3G/4G and GNSS antennas. Recommended Antenna Characteristics Table 33: WCDMA/LTE antenna Item Direction Gain Impedance Efficiency VSWR Requirements Omni directional

> -3dBi (Avg) 50

> 50 %

< 2 Cable insertion Loss <1GHz

<1dB Cable insertion Loss 1GHz~2.2GHz Cable insertion Loss 2.3GHz~2.7GHz

<1.5dB

<2dB NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 4.2.2 Recommended RF Connector for Antenna Installation www.simcom.com 52 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 When choosing antennas, user should pay attentions to the connector on antenna which should match with the connector on the module. The standard 2x2 mm size RF receptacle connectors have been used on SIM7906G-M2. The dimension of the connector on SIM7906G-M2 is 2.0*2.0*0.6mm, which is from I-PEX, and the Part Number is 20449-001E-03. Shows the RF connector dimension in the following figure:

Figure 32: RF connector The major specifications of the RF connector as below:

Table 34: the major specifications of the RF connector Item Nominal Frequency Range Nominal Impedance Temperature Rating Initial Contact Resistance

(without conductor resistance) Voltage Standing Wave Ratio (V.S.W.R.) Specification DC to 6 GHz 50

-40 to + 85 Center contact 20.0mmax. Outer contact 20.0mmax. Meet the requirements of 1.3max.(DC3GHz) 1.45max.(3GHz6GHz) There are two kinds of coaxial cables mating the RF connector in the SIM7906G-M2, SIMCom recommend use Murata and SUZHOU KELI, and the Part Number is MXFR32HP1000 of the Murata and KLC-2058 of the KELI. www.simcom.com 53 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 5 Electrical Specifications 5.1 Absolute maximum ratings Absolute maximum rating for digital and analog pins of module are listed in the following table:

Table 35: Absolute maximum ratings Parameter Voltage at VBAT pins Voltage at digital pins (GPIO,I2C,UART, I2S) Voltage at digital pins (USIM) Voltage at FULCARD_POWER_OFF#

Voltage at RESET#

Min. Typ. Max. Unit

-0.3

-0.3

-0.3

-0.3

-0.3

4.7 2.1 3.05 4.7 VBAT V V V V V 5.2 Operating conditions Table 36: Recommended operating ratings Parameter Voltage at VBAT Min. 3.135 Typ. 3.3 Max. 4.4 Unit V Table 37: 1.8V Digital I/O characteristics*

Parameter Description VIH VIL VOH VOL IOH IOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage High-level output current(no pull down resistor) Low-level output current(no pull up resistor) Min. 1.17

-0.3 1.35 0

Typ. 1.8 0

2

-2 Max. Unit 2.1 0.63 1.8 0.45

V V V V mA mA www.simcom.com 54 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Input high leakage current (no pull down resistor)

Input low leakage current(no pull up resistor)

-1

1

uA uA IIH IIL NOTE These parameters are for digital interface pins, such as UART, I2C, ANTCTL and GPIOs (DPR, SIM DETECT). The operating temperature of module is listed in the following table. Table 38: Operating temperature Parameter Normal operation temperature(3GPP compliant) Extended operation temperature*

Storage temperature NOTE Min. Typ. Max. Unit

-30

-40

-40 25 25 25 70 85 90 Module is able to make and receive voice calls, data calls, SMS and make UMTX/LTE traffic in -40 ~

+85. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range. www.simcom.com 55 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 5.3 Operating Mode 5.3.1 Operating Mode Definition The table below summarizes the various operating modes of module product. Table 39: Operating mode Definition Mode Function n o i t a r e p o l a m r o N UMTS/LTE Sleep UMTS/LTE Idle UMTS/LTE Talk UMTS/LTE Standby UMTS/LTE Data transmission Minimum functionality mode Flight mode Power off AT command AT+CSCLK=1 can be used to set the module to a sleep mode. In this case, the current consumption of module will be reduced to a very low level and the module can still receive paging message and SMS. Software is active. Module is registered to the network, and the module is ready to communicate. Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antenna. Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level);

uplink/downlink data rates, etc. AT command AT+CFUN=0 can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work and the USIM card will not be accessible, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. AT command AT+CFUN=4 or pulling down the W_disable1# pin can be used to set the module to flight mode without removing the power supply. In this mode, the RF part of the module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. Module will go into power off mode by pull down the Full_Card_Power_Off# pin, normally. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible. www.simcom.com 56 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 5.3.2 Sleep mode In sleep mode, the current consumption of module will be reduced to a very low level, and module can still receive paging message and SMS. Several hardware and software conditions must be satisfied in order to let module enter into sleep mode:

1. UART condition 2. USB condition 3. Software condition NOTE Before designing, pay attention to how to realize sleeping/waking function. 5.3.3 Minimum functionality mode and Flight mode Minimum functionality mode ceases a majority function of module, thus minimizing the power consumption. This mode is set by the AT command which provides a choice of the functionality levels. AT+CFUN=0: Minimum functionality AT+CFUN=1: Full functionality (Default) AT+CFUN=4: Flight mode If module has been set to minimum functionality mode, the RF function and USIM card function will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be unavailable. If module has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable. When module is in minimum functionality or flight mode, it can return to full functionality by the AT command AT+CFUN=1. www.simcom.com 57 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 5.4 RF Output Power/Current Consumption The current consumption is listed in the table below. Table 40: SIM7906G-M2 Current consumption on VBAT Pins (VBAT=3.3V) UMTS sleep/idle mode WCDMA supply current

(GNSS offwithout USB connection) Sleep mode @DRX=9 Typical:TBD mA Idle mode @DRX=9 Typical: TBD mA LTE sleep/idle mode LTE FDD supply current

(GNSS offwithout USB connection) LTE TDD supply current

(GNSS offwithout USB connection) Sleep mode Typical:TBD mA Idle mode Typical: TBD mA Sleep mode Typical: TBD mA Idle mode Typical: TBD mA HSDPA data WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B9 WCDMA B19 LTE data LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7

@Power 23.54 dBm Typical: 683 mA

@Power 23.49dBm Typical: 616 mA

@Power 23.25 dBm Typical: 693 mA

@Power 24.2 dBm Typical: 595 mA

@Power 23.45 dBm Typical: 637 mA

@Power 23.48 dBm Typical: 642 mA

@Power 23.86 dBm Typical: 659 mA

@Power 23.37 dBm Typical: 733 mA

@Power 23.53 dBm Typical: 636 mA

@5MHz 22.87 dBm Typical: 700 mA

@10MHz 22.85 dBm Typical: 715 mA

@20MHz 22.96 dBm Typical: 729 mA

@1.4MHz 23.04 dBm Typical: 635 mA

@5MHz 23.07 dBm Typical: 627 mA

@10MHz 23.03 dBm Typical:643 mA

@20MHz 23.06 dBm Typical: 685 mA

@1.4MHz 22.98 dBm Typical: 691 mA

@5MHz 23.04 dBm Typical: 710 mA

@10MHz 23.03 dBm Typical: 723 mA

@20MHz 23.06 dBm Typical: 754 mA

@1.4MHz 22.97 dBm Typical: 658 mA

@5MHz 23.18 dBm Typical: 662 mA

@10MHz 23.03 dBm Typical: 665 mA

@20MHz 23.09dBm Typical: 676 mA

@1.4MHz 23.84 dBm Typical: 703 mA

@5MHz 23.88 dBm Typical: 720 mA

@10MHz 23.87 dBm Typical: 752 mA

@5MHz 22.43 dBm Typical: 642 mA

@10MHz 22.59 dBm Typical: 662 mA www.simcom.com 58 / 79 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B30 LTE-FDD B66 LTE-TDD B38 LTE-TDD B40 LTE-TDD B41 LTE-TDD B42 LTE-TDD B43 LTE-TDD B48 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02

@20MHz 22.67 dBm Typical: 731 mA

@1.4MHz 24.04 dBm Typical: 715 mA

@5MHz 24.07 dBm Typical: 761 mA

@10MHz 24.16 dBm Typical: 808 mA

@1.4MHz 23.89 dBm Typical: 746 mA

@5MHz 24.03 dBm Typical: 701 mA

@10MHz 23.97 dBm Typical: 655 mA

@5MHz 24.09 dBm Typical: 827 mA

@10MHz 24.06 dBm Typical: 772 mA

@5MHz 24.01 dBm Typical: 795 mA

@10MHz 23.97 dBm Typical: 803 mA

@5MHz 23.99 dBm Typical: 766 mA

@10MHz 24.02 dBm Typical: 730 mA

@5MHz 24.07 dBm Typical: 729 mA

@10MHz 24.03 dBm Typical: 740 mA

@15MHz 24.06 dBm Typical: 777 mA

@5MHz 24.13 dBm Typical: 706 mA

@10MHz 24.06 dBm Typical: 736 mA

@15MHz 24.01 dBm Typical: 793 mA

@5MHz 23.98 dBm Typical: 730 mA

@10MHz 23.98 dBm Typical: 688 mA

@20MHz 23.97 dBm Typical: 671 mA

@1.4MHz 23.01 dBm Typical: 637 mA

@5MHz 22.91 dBm Typical: 632 mA

@10MHz 23.03 dBm Typical: 636 mA

@20MHz 22.93dBm Typical: 684 mA

@1.4MHz 24.15 dBm Typical: 762 mA

@5MHz 24.18 dBm Typical:787 mA

@10MHz 24.10 dBm Typical: 794 mA

@15MHz 24.07 dBm Typical: 790 mA

@3MHz 24.05 dBm Typical: 756 mA

@5MHz 23.98 dBm Typical: 752 mA

@10MHz 24.01 dBm Typical: 790 mA

@20MHz 23.92 dBm Typical: 886 mA

@5MHz 22.56 dBm Typical: 778 mA

@10MHz 22.45 dBm Typical: 810 mA

@1.4MHz 22.96 dBm Typical: 585 mA

@5MHz 22.98 dBm Typical: 586 mA

@10MHz 23.03 dBm Typical: 608 mA

@20MHz 23.1 dBm Typical: 647 mA

@5MHz 23.16 dBm Typical :355 mA

@10MHz 23.11 dBm Typical :362 mA

@20MHz 23.14 dBm Typical :387 mA

@5MHz 23.09 dBm Typical : 300 mA

@10MHz 23.14 dBm Typical : 312 mA

@20MHz 23.10 dBm Typical : 344 mA

@5MHz 22.97 dBm Typical : 383 mA

@10MHz 23.02 dBm Typical : 414 mA

@20MHz 23.08 dBm Typical : 416 mA

@5MHz 22.49 dBm Typical : 363 mA

@10MHz 22.41 dBm Typical : 365 mA

@20MHz 22.37 dBm Typical : 382 mA

@5MHz 21.85 dBm Typical :392 mA

@10MHz 21.81 dBm Typical : 395 mA

@20MHz 21.92 dBm Typical : 413 mA

@5MHz 23.23 dBm Typical : 395 mA

@10MHz 23.26 dBm Typical : 398 mA

@20MHz 23.13 dBm Typical : 410 mA www.simcom.com 59 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 5.5 Conducted Receive Sensitivity The following tables show conducted RF receiving sensitivity of SIM7906G-M2 module. Table 41: SIM7906G-M2 Conducted RF Receiving Sensitivity Frequency WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B9 WCDMA B19 LTE-FDD B1(10M) LTE-FDD B2(10M) LTE-FDD B3(10M) LTE-FDD B4(10M) LTE-FDD B5(10M) LTE-FDD B7(10M) LTE-FDD B8(10M) LTE-FDD B12(10M) LTE-FDD B13(10M) LTE-FDD B14(10M) LTE-FDD B17(10M) LTE-FDD B18(10M) LTE-FDD B19(10M) LTE-FDD B20(10M) LTE-FDD B25(10M) LTE-FDD B26(10M) LTE-FDD B28(10M) LTE-FDD B30(10M) LTE-FDD B66(10M) SIM7906G-M2 3GPP Requirement

(dBm) Rx Sensitivity Typical(dBm)

-106.7

-104.7

-103.7

-106.7

-104.7

-106.7

-103.7

-105.7

-106.7

-96.3

-94.3

-93.3

-96.3

-94.3

-94.3

-93.3

-93.3

-93.3

-93.3

-93.3

-96.3

-96.3

-93.3

-92.8

-93.8

-94.8

-93.3

-95.8

-112.1

-113.5

-112.5

-111.7

-113.5

-113.5

-113.6

-113

-113.5

-99.2

-100.5

-100.3

-99.3

-101.2

-100.6

-100.8

-100.7

-100.3

-96.5

-100.6

-101.2

-101.1

-100.8

-100.3

-101.3

-100.7

-99.8

-99.8 www.simcom.com 60 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 LTE-TDD B38(10M) LTE-TDD B40(10M) LTE-TDD B41(10M) LTE-TDD B42(10M) LTE-TDD B43(10M) LTE-TDD B48(10M)

-96.3

-96.3

-94.3

-95

-95

-95

-101.5

-101.3

-101.1

-101.8

-101.4

-101.5 NOTE The data in above table are gotten at static condition. SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple (two for SIM7906G-M2) antennas at the receiver side, which can improve Rx performance. Per 3GPP specification. www.simcom.com 61 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 5.6 ESD Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the users mother board, the ESD components should be placed beside the connectors which human body may touch, such as USIM card holder, SD card holder, audio jacks, switches, USB interface, etc. The following table shows the module ESD measurement performance without any external ESD component. Table 42: The ESD performance measurement table (Temperature: 25, Humidity: 45%) Part VBAT,GND Antenna port Full_Card_Power_Off#

USB RESET_N USIM Card Other PADs Contact discharge Air discharge

+/-5K

+/-5K

+/-2K

+/-1K

+/-1K

+/-1K

+/-1K

+/-10K

+/-10K

+/-4K

+/-2K

+/-2K

+/-2K

+/-2K www.simcom.com 62 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 6 Connect SIM7906G-M2 to board The module should be equipped well by the connector and screw as the following figure illustration. The module Stand-off and mounting screw also serve as part of the module Electrical Ground path. The Stand-off should be connected directly to the ground plane on the platform. So that when the module is mounted and the mounting screw is screwed on to hold the module in place, this will make the electrical ground connection from the module to the platform ground plane. Figure 33: Equipment diagram www.simcom.com 63 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 7 Thermal Design Customer should pay attentions to the thermal design of SIM7906G-M2, for the mass data application scenario, the module would work in max power status and last long time, the temperature of module would increase quickly, especially in high temperature environment. Module reserved a ground plane on the bottom side for the heat dissipating, customer could conduct the heat to the large board by the silica gel, and the surface area on large board should be more than 460 mm2. For better thermal performance, customer could use a heat sink device to conduct the heat to the air. Figure 34: Thermal design diagram Table 43: The silica gel selection guide Item Specific Gravity Test method ASTMD792 Recommend value Unit g/cc 3.20.1 Continuous use Temp EN344 Volume Resistivity Voltage Endurance Flame Rating Conductivity ASTMD257 ASTMD149 UL-94 ASTMD5470

-40~+220 1.0*1011 4 V-0 8

-CM KV/mm w/m-k www.simcom.com 64 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 8 Packaging Module support tray packaging. Figure 35: packaging diagram Module tray drawing Figure 36: Tray drawing www.simcom.com 65 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 44: Tray size Length3mm 245.0 Small carton drawing Width3mm 165.0 Number 10 Table 45: Small Carton size Figure 37: Small carton drawing Length10mm Width10mm Height10mm 270 180 120 Number 10*20=200 Big carton drawing Figure 38: Big carton drawing www.simcom.com 66 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Table 46: Big Carton size Length10mm Width10mm Height10mm Number 380 280 280 200*4=800 www.simcom.com 67 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 9 Appendix 9.1 Coding Schemes and Maximum Net Data Rates over Air Interface Table 47: Coding Schemes and Maximum Net Data Rates over Air Interface HSDPA device category Max data ratepeak Modulation type Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 7 Category 8 Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19 Category 20 Category 21 Category 22 Category 23 Category 24 1.2Mbps 1.2Mbps 1.8Mbps 1.8Mbps 3.6Mbps 3.6Mbps 7.2Mbps 7.2Mbps 10.2Mbps 14.4Mbps 0.9Mbps 1.8Mbps 17.6Mbps 21.1Mbps 23.4Mbps 28Mbps 23.4Mbps 28Mbps 35.5Mbps 42Mbps 23.4Mbps 28Mbps 35.5Mbps 42.2Mbps 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK QPSK QPSK 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM HSUPA device category Max data ratepeak Modulation type Category 1 Category 2 0.96Mbps 1.92Mbps QPSK QPSK www.simcom.com 68 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Category 3 Category 4 Category 5 Category 6 LTE-FDD device category

(Downlink) Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 12 LTE-FDD device category

(Uplink) Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 12 1.92Mbps 3.84Mbps 3.84Mbps 5.76Mbps QPSK QPSK QPSK QPSK Max data ratepeak Modulation type 10Mbps 50Mbps 100Mbps 150Mbps 300Mbps 300Mbps 600Mbps QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM/256QAM Max data ratepeak Modulation type 5Mbps 25Mbps 50Mbps 50Mbps 75Mbps 50Mbps 100 Mbps QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM/64QAM QPSK/16QAM QPSK/16QAM/64QAM 9.2 Related Documents Table 48: Related Documents NO. Title Description SIM7906G/SIM7912G-M2 Series_AT Command Manual_V1.xx ITU-T recommendationV.25ter Draft new GSM 07.07 GSM 07.10

[1]

[2]

[3]

[4]

[5]

GSM 07.05

[6]

GSM 11.14 AT Command Manual Serial asynchronous automatic dialing and control Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment Data Circuit terminating Equipment

(DTE DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital cellular telecommunications system (Phase 2+);

Specification of the SIM Application Toolkit for the Subscriber www.simcom.com 69 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Identity Module Mobile Equipment (SIM ME) interface telecommunications system (Phase 2+);

Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module Mobile Equipment (SIM ME) interface Digital cellular Alphabets and language-specific information Digital cellular telecommunications system (Phase 2) Mobile Station (MS) conformance specification Part 1:

Conformance specification Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network;

Terminal conformance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3:

Abstract Test Suites. Electromagnetic compatibility and Radio spectrum Matters

(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread

(UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters

(ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment Safety of information technology equipment (2000) Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification Global Certification Forum - Certification Criteria Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment

(RoHS) This document describes how to use UART interface of SIMCom modules.

[7]

GSM 11.11

[8]

GSM 03.38

[9]

GSM 11.10

[10]

3GPP TS 51.010-1

[11]

3GPP TS 34.124

[12]

3GPP TS 34.121

[13]

3GPP TS 34.123-1

[14]

3GPP TS 34.123-3

[15] EN 301 908-02 V2.2.1

[16] EN 301 489-24 V1.2.1

[17]

IEC/EN60950-1(2001)

[18]

3GPP TS 51.010-1

[19] GCF-CC V3.23.1

[20]

2002/95/EC

[21] SIM7X00 Series_UART_Application Note_V1.xx

[22] SIM7X00 GPS Application Note Series_GPS_Application Note_V1.xx

[23] Antenna design guidelines Antenna design guidelines for diversity receiver system for diversity receiver system www.simcom.com 70 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 9.3 Terms and Abbreviations Table 49: Terms and Abbreviations Abbreviation Description ADC ARP BER BTS CS CSD CTS DAC DRX DSP DTE DTR DTX EFR EGSM EMC ESD ETS EVDO FCC FD FDMA FR GMSK GNSS GPRS GPS GSM HR HSPA HSIC I2C IMEI LTE MDIO MMD Analog-to-Digital Converter Antenna Reference Point Bit Error Rate Base Transceiver Station Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Discontinuous Reception Digital Signal Processor Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Evolution Data Only Federal Communications Commission (U.S.) SIM fix dialing phonebook Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System General Packet Radio Service Global Positioning System Global Standard for Mobile Communications Half Rate High Speed Packet Access High-speed Inter-chip Inter-Integrated Circuit International Mobile Equipment Identity Long Term Evolution Management Data Input/Output MDIO manageable device www.simcom.com 71 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 MO MS MT NMEA PAP PBCCH PCB PCS RF RMS RTC SIM SMS SPI SMPS TDMA TE TX UART VSWR SM SGMII NC EDGE HSDPA HSUPA ZIF WCDMA VCTCXO USIM UMTS UART Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated National Marine Electronics Association Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Personal Communication System, also referred to as GSM 1900 Radio Frequency Root Mean Square (value) Real Time Clock Subscriber Identification Module Short Message Service serial peripheral interface Switched-mode power supply Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio SIM phonebook Serial gigabit media independent interface Not connect Enhanced data rates for GSM evolution High Speed Downlink Packet Access High Speed Uplink Packet Access Zero intermediate frequency Wideband Code Division Multiple Access Voltage control temperature-compensated crystal oscillator Universal subscriber identity module Universal mobile telecommunications system Universal asynchronous receiver transmitter www.simcom.com 72 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 9.4 Safety Caution Table 50: Safety Caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. Declaration of conformity Herby, SIMCom Wireless Solutions Limited declares that this MODULE,SIM7906G-M2 is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. www.simcom.com 73 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Use the MODULE in the environment with the temperature between -30 and 70. The device complies with RF specifications when the device used at 5mm from your body. Herby, SIMCom Wireless Solutions Limited declares that this MODULE,SIM7906G-M2 is in compliance with the essential requirements and other relevant provisions of UK Radio Equipment Regulations (SI 2017/1206).In accordance with Article 102 and Article 10(10),this product allowed to be used in all GB. FCC MODULAR APPROVAL INFORMATION EXAMPLES for Manual This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference.

(2) This device must accept any interference received, including interference that may cause undesired operation. CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. www.simcom.com 74 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 OEM INTEGRATION INSTRUCTIONS:

This device is intended only for OEM integrators under the following conditions:

The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal on-board antenna that has been originally tested and certified with this module. External antennas are not supported. As long as these 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). The end-product may need Verification testing, Declaration of Conformity testing, a Permissive Class II Change or new Certification. Please involve a FCC certification specialist in order to determine what will be exactly applicable for the end-product. Validity of using the module certification:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. In such cases, please involve a FCC certification specialist in order to determine if a Permissive Class II Change or new Certification is required. Upgrade Firmware:

The software provided for firmware upgrade will not be capable to affect any RF parameters as certified for the FCC for this module, in order to prevent compliance issues. End product labeling:

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: 2AJYU-8XM0002. Information that must be placed in the end user manual:

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. CAUTION: Exposure to Radio Frequency Radiation. Antenna shall be mounted in such a manner to minimize the potential for human contact during normal operation. The antenna should not be contacted during operation to avoid the possibility of exceeding the FCC radio frequency exposure limit. www.simcom.com 75 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 IC Information This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'opration est soumise aux deux conditions suivantes:

(1) cet appareil ne peut causer d'interfrences, et

(2) cet appareil doit accepter toute interfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement de l'appareil. The end product must be labeled to display the Industry Canada certification number of the module. Contains transmitter module IC: 23761-8XM0001 Le dispositif d'accueil doivent tre tiquets pour afficher le numro de certification d'Industrie Canada du module. Contient module metteur IC: 649E-WCA735M Information for OEM Integrator This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. End product labelling The label for end product must include Contains IC: 23761-8XM0001. CAUTION: Exposure to Radio Frequency Radiation. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20cm between the radiator and your body. This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The Host Marketing Name (HMN) must be indicated at any location on the exterior of the host product or product packaging or product literature, which shall be available with the host product or online. This radio transmitter [ lC: 23761-8XM0001] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. www.simcom.com 76 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 22, part 24, part 27, part90. 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The EUT has a Rubber Duck Antenna, and the antenna use a permanently attached antenna which is not replaceable. 2.4 Limited module procedures If a modular transmitter is approved as a limited module, then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is not a limited module. www.simcom.com 77 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects:

layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);

b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);

c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit

(PC) board layout;

d) Appropriate parts by manufacturer and specifications;

e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Explanation: Yes, The module with trace antenna designs, and This manual has been shown the layout of trace design, antenna, connectors, and isolation requirements. 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body." This module is designed to comply with the FCC statement, FCC ID is:

2AJYU-8XM0002. www.simcom.com 78 / 79 SIM7906G-M2_R2_Hardware Design(2x2MIMO)_V1.02 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The EUT has a Rubber Duck Antenna, and the antenna use a permanently attached antenna which is not replaceable. 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: Contains FCC ID: 2AJYU-8XM0002, Contains IC: 23761-8XM0001 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. Explanation: Top band can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant

(when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B. www.simcom.com 79 / 79

 

 

 

 

 

 

 

 

 

 

SIM7906G-M2_V1.0_220725 SIM7906G-M2 P/N:S2-XXXXX SN:XXXXXXXXXXXXXXX IMEI:XXXXXXXXXXXXXXX FCC ID:2AJYU-8XM0002 IC :23761-8XM0001 5mm 1.5mm 5.4 mm 1mm 1mm 1mm 1mm 1mm SIM7906G-M2 P/N:S2-XXXXX SN:XXXXXXXXXXXXXXX IMEI:XXXXXXXXXXXXXXX FCC ID:2AJYU-8XM0002 IC :23761-8XM0001 2mm 5mm 8mm 2mm 34.46 mm 29.26 mm 8mm 2mm SIM7906X-M2 P/N:S2-XXXXX SN:XXXXXXXXXXXXXXX IMEI:XXXXXXXXXXXXXXX FCC ID:2AJYU-8XM0002 IC :23761-8XM0001 Arial 6pt Arial 4pt Regular PN SN IMEI Lable Location

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SIMCom Wireless Solutions Limited Date: 15 Sep, 2022 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 RE: SIMCom Wireless Solutions Limited FCC ID: 2AJYU-8XM0002 FCC Certification Confidentiality Request Gentlemen:

This letter is to comply with 47 CFR 0.457 and 0.459 pertaining to confidentiality material. CommuniTake Technologies Ltd. requests that the following documents regarding this submission for FCC ID : 2AJYU-8XM0002 be kept Long-Term confidential:

Exhibit Type Block Diagram Operational Description Operational Description.pdf Tune-Up-Procedure Part List BOM.pdf File Name Block Diagram.pdf Tune up procedure.pdf And below exhibit kept short-term confidential (180 days):

Exhibit Type External Photos Internal Photos Test Setup Photos Users Manuals File Name External Photo.pdf Internal Photo.pdf Test Setup Photos.pdf Users Manual.pdf Those documents contain detailed system and equipment description and related information about the product which CommuniTake Technologies Ltd. considers to be confidential proprietary, a custom design and, otherwise, not releasable to the general public. Since this design is a basis form which future technological products will evolve, CommuniTake Technologies Ltd. considers this information would be of benefit to its competitors, and that the disclosure of the information in these documents would give competitors an unfair advantage in the market. Thank you for your attention to this matter. Yours Sincerely,

(signature) Print name: Yongsheng Li Title: GM SIMCom Wireless Solutions Limited

 

 

Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: ___2AJYU-8XM0002____ Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. 3. The modular transmitter must have its own power supply regulation. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Answer from applicant YES, please check the exhibition photo. YES, the modular has buffer modulation/data inputs. MCP name: NM1482KSLAXCL-3B from NANYA YES, it has power supply regulation. PMU name: PMD-

9655-0-116WLNSP-HR-01-0-

01 from QUALCOMM YES, the requirements of antenna connector and spurious emission have been fulfilled. YES, please refer to the setup photo. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). YES, the module will be label with its own FCC ID. 7. edThe modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. YES, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. YES, the RF exposure requirements has been fulfilled. Please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single or split modular transmitters that comply partially with the requirements above. Name and surname of applicant (or authorized representative): Yongsheng Li Date: _______2022/10/9________ Signature: ___________________

 

 

SIMCom Wireless Solutions Limited Date: 15 Sep, 2022 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 To Whom It May Concern:

The SIMCom Wireless Solutions Limited, the undersigned, hereby authorizes Mr. Wu Xuewen from Shenzhen BALUN Technology Co., Ltd., to act on the behalf of the SIMCom Wireless Solutions Limited solely in matters relating to the application for an FCC equipment authorization for FCC ID: 2AJYU-8XM0002 including the signing of documents in connection with this Application. Necessary acts carried out by Shenzhen BALUN Technology Co., Ltd. in connection with the Application shall have the same effect as acts of the SIMCom Wireless Solutions Limited. The SIMCom Wireless Solutions Limited also hereby certify that no party to this application is subject to a denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. Section 862. Yours Sincerely,

(signature) Print name: Yongsheng Li Title: GM SIMCom Wireless Solutions Limited