FCC ID: 2AJYU-8FCA101 NB-IoT Wireless Module

SIM7020G_User Manual_V1.00 Smart Machine Smart Decision Document Title SIM7020G_User Manual Version Date Status 1.00 2019-01-15 Release Document Control ID SIM7020G_User Manual_V1.00 General Notes SIMCom offers this information as a service to its customers to support the application and engineering efforts that use the products designed by SIMCom. The information provided is based on the requirements specifically from the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customers possession. Furthermore, the system validation of the product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customers system integrator. All specifications supplied herein are subject to change without notice. Copyright This document contains the proprietary technical information which is the property of SIMCom Limited, copying of this document, giving it to others, the using or communication of the contents thereof are forbidden without the official authority by SIMCom. Offenders are liable to the payment of the damages. All rights are reserved in the event of grant of a patent or the registration of a utility model or design. All specifications supplied herein are subject to change without notice Copyright SIMCom Wireless Solutions Co., Ltd. 2019 Compliance Information FCC Compliance Statement: This device complies the FCC Rules . Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. This device must accept any interference received, including interference that may cause undesired operation. Product that is a radio transmitter is labeled with FCC ID2AJYU-8FCA101 FCC Caution:

(1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

(2) Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment.

(3) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

(4) Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user authority to operate the equipment.

(5) the modules FCC ID is not visible when installed in the host, or

(6) if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: 2AJYU-8FCA101 SIM7020G_User Manual_V1.00 1 2019-01-15 Smart Machine Smart Decision Contents Contents .............................................................................................................................................2 Table Index ........................................................................................................................................4 Figure Index ......................................................................................................................................6 1 Introduction ................................................................................................................................8 1.1 Product Outline .....................................................................................................................8 1.2 Hardware Interface Overview ...............................................................................................9 1.3 Hardware Block Diagram......................................................................................................9 1.4 Functional Overview ...........................................................................................................10 2 Package Information................................................................................................................ 11 2.1 Pin Assignment Overview ................................................................................................... 11 2.2 Pin Description ....................................................................................................................13 2.3 Mechanical Information ......................................................................................................16 2.4 Footprint Recommendation .................................................................................................17 2.5 Paste mask Recommendation ..............................................................................................18 3 Interface Application ...............................................................................................................19 3.1 Power Supply ......................................................................................................................19 3.2 Power Supply Design Guide ...............................................................................................19 3.3 Voltage Monitor...................................................................................................................22 3.4 Power on/Power off/Reset Function ....................................................................................22 Power on .......................................................................................................................22 3.4.1 3.4.2 Power off ......................................................................................................................24 3.4.3 Reset Function ..............................................................................................................25 3.5 UART Interface ...................................................................................................................26 3.5.1 UART Design Guide ....................................................................................................26 3.5.2 RI and DTR Behavior...................................................................................................28 3.6 USB Interface ......................................................................................................................28 3.7 SIM Interface ......................................................................................................................29 SIM Application Guide ................................................................................................30 3.8 Network status .....................................................................................................................31 3.9 ADC ....................................................................................................................................32 Power Supply Output .......................................................................................................32 3.10 3.11 I2C Interface ....................................................................................................................33 SPI Interface ....................................................................................................................34 3.12 3.7.1 4 RF Specifications ......................................................................................................................35 4.1 LTE RF Specifications ........................................................................................................35 4.2 LTE Antenna Design Guide ................................................................................................36 4.3 RF traces note ......................................................................................................................37 4.3.1 RF traces layout ............................................................................................................37 4.3.2 LTE ANT and other system ANT decoupling...............................................................39 5 Electrical Specifications ...........................................................................................................40 SIM7020G_User Manual_V1.00 2 2019-01-15 Smart Machine Smart Decision 6 Electrical Specifications ...........................................................................................................40 6.1 Absolute maximum ratings .................................................................................................40 6.2 Operating conditions ...........................................................................................................40 6.3 Operating Mode ..................................................................................................................41 6.3.1 Operating Mode Definition ..........................................................................................41 6.3.2 Sleep mode ...................................................................................................................42 6.3.3 Minimum functionality mode and Flight mode ............................................................42 6.3.4 Power Saving Mode (PSM) ..........................................................................................43 6.3.5 Extended Mode DRX (e-DRX) ....................................................................................43 6.4 Current Consumption ..........................................................................................................43 6.5 ESD Notes ...........................................................................................................................44 7 SMT Production Guide ............................................................................................................46 7.1 Top and Bottom View of SIM7020G ..................................................................................46 7.2 Typical SMT Reflow Profile ...............................................................................................46 7.3 Moisture Sensitivity Level (MSL) ......................................................................................47 7.4 Baking Requirements ..........................................................................................................47 8 Packaging ..................................................................................................................................48 9 Appendix ...................................................................................................................................51 9.1 Related Documents .............................................................................................................51 9.2 Terms and Abbreviations .....................................................................................................53 9.3 Safety Caution .....................................................................................................................55 SIM7020G_User Manual_V1.00 3 2019-01-15 Smart Machine Smart Decision Table Index Table 1: SIM7020G frequency bands and air interface...............................................................8 Table 2: General features ..........................................................................................................10 Table 3: Pin definition ...............................................................................................................12 Table 4: IO parameters definition .............................................................................................13 Table 5: Pin description ............................................................................................................13 Table 6: VBAT pins electronic characteristic ............................................................................19 Table 7: The path of the power supply ......................................................................................20 Table 8VDET+PMOS&LDO & diode ..............................................................................21 Table 9: Recommended TVS diode list ....................................................................................22 Table 10: Power on timing and electronic characteristic ..........................................................24 Table 11: Power off timing and electronic characteristic ..........................................................25 Table 12: RESET pin electronic characteristic .........................................................................26 Table 13: Recommended TVS list ............................................................................................29 Table 14: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V) ..............................29 Table 15: SIM electronic characteristic 3.0V mode (SIM_VDD=3V)......................................29 Table 17: NETLIGHT pin status ...............................................................................................31 Table 16: ADC electronic characteristics ..................................................................................32 Table 19: Electronic characteristic ............................................................................................33 Table 20: Pin definition of the I2C............................................................................................33 Table 21: I2C multiplexing function .........................................................................................33 Table 22: Pin definition of the SPI ............................................................................................34 Table 23: Conducted transmission power .................................................................................35 Table24: Maximum Power Reduction (MPR) for UE category NB2 Power Class 3 ...............35 Table 25: E-UTRA operating bands ..........................................................................................36 Table 26: CAT-NB2 Reference sensitivity (QPSK) ..................................................................36 Table 27: Trace loss ..................................................................................................................36 Table 28: Recommended TVS ..................................................................................................37 Table 29: Absolute maximum ratings .......................................................................................40 Table 30: Recommended operating ratings ...............................................................................40 Table 31: 1.8V Digital I/O characteristics* ...............................................................................40 Table 32: Operating temperature...............................................................................................41 Table 33: Operating mode Definition .......................................................................................41 Table 34: RTC_GPIO0/RTC_EINT characteristics ..................................................................43 Table 35: Current consumption on VBAT Pins (VBAT=3.3V).................................................43 Table 36: The ESD performance measurement table ................................................................44 Table 37: Moisture Sensitivity Level and Floor Life ................................................................47 Table 38: Baking requirements .................................................................................................47 Table 39: Tray size ....................................................................................................................49 Table 40: Small Carton size ......................................................................................................49 Table 41: Big Carton size ..........................................................................................................50 Table 42: Related Documents ...................................................................................................51 Table 43: Terms and Abbreviations...........................................................................................53 Table 39: Safety Caution ...........................................................................................................55 SIM7020G_User Manual_V1.00 4 2019-01-15 Smart Machine Smart Decision SIM7020G_User Manual_V1.00 5 2019-01-15 Smart Machine Smart Decision Figure Index Figure 1: SIM7020G block diagram ...........................................................................................9 Figure 2: Pin assignment overview ........................................................................................... 11 Figure 3: Dimensions (Unit: mm) .............................................................................................16 Figure 4: Footprint recommendation (Unit: mm) .....................................................................17 Figure 5: Paste mask SMT stencil footprint outline (Unit: mm)...............................................18 Figure 6: Recommended power supply reference design circuit ..............................................20 Figure 7: Power supply application circuit ...............................................................................22 Figure 8: Reference power on/off circuit ..................................................................................23 Figure 9: Power on timing sequence .........................................................................................23 Figure 10: Power off timing sequence ......................................................................................24 Figure 11: Reference reset circuit .............................................................................................25 Figure 12: UART full modem ...................................................................................................26 Figure 13: UART null modem ..................................................................................................26 Figure 14: Reference circuit of level shift ................................................................................27 Figure 15: TX level matching circuit ........................................................................................27 Figure 16: RX level matching circuit ........................................................................................28 Figure 17: RI behaviour SMS and URC report .................................................................28 Figure 18: USB reference circuit ..............................................................................................29 Figure 19: SIM interface reference circuit ................................................................................30 Figure 21: NETLIGHT reference circuit ..................................................................................31 Figure 22Power on sequence of the VDD_EXT ...................................................................32 Figure 23Power on sequence of the VDD_3V3 ....................................................................32 Figure 24: SPI interface level conversion reference circuit ......................................................34 Figure 25: Antenna matching circuit (MAIN_ANT) ................................................................37 Figure 26: RF trace should be far away from other high speed signal lines .............................38 Figure 27: The distance between GND to the inner conductor of SMA ...................................38 Figure 28: Top and bottom view of SIM7020G ........................................................................46 Figure 29: The ramp-soak-spike reflow profile of SIM7020G .................................................46 Figure 30: packaging diagram ..................................................................................................48 Figure 32: Tray drawing............................................................................................................49 Figure 32: Small carton drawing...............................................................................................49 Figure 33: Big carton drawing ..................................................................................................50 SIM7020G_User Manual_V1.00 6 2019-01-15 Smart Machine Smart Decision Revision History Data Version Description of change 2019-01-15 1.00 Original Author olivier.Wu lijuan.yin SIM7020G_User Manual_V1.00 7 2019-01-15 1 Introduction This document describes SIM7020G hardware interface in great detail. The document can help customer to quickly understand SIM7020G interface specifications, electrical and mechanical details. With the help of this document and other SIM7020G application notes, customer guide, customers can use SIM7020G to design various applications quickly. 1.1 Product Outline The SIM7020G series modules support LTE CAT-NB1 and LTE CAT-NB2. With a tiny configuration of 17.6*15.7*2.3mm, SIM7020G can meet almost all the space requirements in customers applications, such as smart phone, PDA and other mobile devices. And the physical dimension is compatible with the packaging of SIM868. Table 1: SIM7020G frequency bands and air interface Standard Frequency HD-FDD B1 B2 B3 B4 B5 B8 B12 B13 B17 B18 B19 B20 B25 B26 B28 B66 B70 B71 Variants SIM7020G Smart Machine Smart Decision 1.2 Hardware Interface Overview The interfaces are described in detail in the next chapters include:

Power Supply USB Interface UART Interface SPI Interface I2C Interface SIM Interface ADCs Power Output GPIOs Antenna Interface 1.3 Hardware Block Diagram The block diagram of the SIM7020G module is shown in the figure below. SIM7020G_User Manual_V1.00 9 2019-01-15 Figure 1: SIM7020G block diagram USBSIM CardBase Band Power Management UnitRFTransceiverBoostFEMANTPWRKEYNRESETVDD_EXTUSB_VBUSVBAT(Supply)SIM_VDDUARTGPIO(s)ADCDebugVDD_3V3ENRTC_GPIO/EINTeSIM(NC)I2CSPI Smart Machine Smart Decision 1.4 Functional Overview Table 2: General features Feature Power supply Power saving Implementation Power supply voltage 2.13.6V,Typ=3.3V Current in sleep mode: 236uA (at+cfun=0) Current in PSM mode: 3.4uA Radio frequency bands Transmitting power Please refer to the table 1 LTE 23dBm Data Transmission Throughput LTE CAT NB2: 126Kbps (DL) LTE CAT NB2: 150Kbps (UL) Antenna LTE antenna. SMS MT, MO, Text and PDU mode SIM interface Support identity card: 1.8V/ 3V UART1 interface A full modem serial port by default Baud rate: default: 0bps (auto baud rate) Can be used as the AT commands or data stream channel Support RTS/CTS hardware handshake UART2 interface Can be used for debugging and upgrading firmware Baud rate: It is 921600bps when used download mode. USB USB 1.1 interface for debugging (Log port can be selected by AT command.) Firmware upgrade Firmware upgrade over UART2 interface Physical characteristics Size: 17.6*15.7*2.3mm Weight: 1.3g0.2g Temperature range Extended operation temperature: -40C to + 85C*

Normal operation temperature: -30C to + 80C Storage temperature -45C to + 90C

*Note: The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range. SIM7020G_User Manual_V1.00 10 2019-01-15 Smart Machine Smart Decision 2 Package Information 2.1 Pin Assignment Overview Figure 2: Pin assignment overview

*Note:

SIM7020G add PIN 43 - 73 in the inner ring, PIN in the outer ring is completely consistent with that in SIM7020. SIM7020G_User Manual_V1.00 11 2019-01-15 234567891011121UART1_TXDUART1_RXDUART1_RTSUART1_CTSUART1_DCDUART1_DTRUART1_RIGNDVDD_3V3GPIO0RTC_GPIO0RTC_EINT141516171819202113GNDSIM_DETSIM_DATASIM_CLKSIM_RSTSIM_VDDGNDNCGND353637383940414234VBATSTATUSNETLIGHTVDD_EXTPWRKEYADCGNDGNDVBAT333231302928272625242322GNDANTGNDGNDGPIO1RESETGNDUSB_DMUSB_DPUSB_VBUSUART2_RXDUART2_TXD4644504947484565645452535556636259605861684357666751697576747773727170NCNCNCNCNCNCNCNCNCNCNCNCGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDSDASCL GPIO4GPIO3 ADC2GPIO2SPI_SSSPI_MOSISPI_CLKSPI_MISO Smart Machine Smart Decision Table 3: Pin definition Pin No. Pin Name Pin No. Pin Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 UART1_TXD UART1_RXD UART1_RTS UART1_CTS UART1_DCD UART1_DTR UART1_RI GND VDD_3V3 GPIO0 RTC_GPIO0 RTC_EINT GND SIM_DET SIM_DATA SIM_CLK SIM_RST SIM_VDD GND NC GND UART2_TXD UART2_RXD USB_VBUS USB_DP USB_DM GND RESET GPIO1 GND GND ANT GND VBAT VBAT 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 ADC PWRKEY VDD_EXT NETLIGHT STATUS NC NC GND NC NC SPI_SS SPI_MOSI SPI_CLK SPI_MISO NC NC NC NC ADC2 GPIO2 GPIO3 GPIO4 NC NC NC GND SDA SCL GND GND NC GND GND GND GND SIM7020G_User Manual_V1.00 12 2019-01-15 Smart Machine Smart Decision 73 GND 36 37 GND GND 2.2 Pin Description Table 4: IO parameters definition Pin type Description Power input Power output Analog input Analog input/output Bidirectional input /output Digital input Digital output Digital output with high level Digital output with low level Pull up Pull down PI PO AI AIO I/O DI DO DOH DOL PU PD Table 5: Pin description Pin name Pin No. Default status Power supply VBAT 3435 PI VDD_EXT 40 PO VDD_3V3 9 PO Description Comment Power supply, voltage range:

2.1-3.6V. Power output 1.8V for other external circuits with Max 50mA current output, such as level shift circuit. Not present in PSM mode. If unused, keep it floating. Power output 3.3V for other external circuits with Max 50mA current output. Not present in PSM mode. Voltage range 3.3V-3.5V( depend on VBAT). If unused, keep it floating. GND 813 1921 2730 3133 3637 4563 Ground SIM7020G_User Manual_V1.00 13 2019-01-15 Smart Machine Smart Decision 6667 69-73 System Control PWRKEY 39 DIPU System power on/off control input, active low. The efficient input level must be below 0.5V. RESET 28 DIPU System reset control input, active low. SIM interface SIM_DATA SIM_RST SIM_CLK 15 17 16 I/OPU SIM Card data I/O DO DO SIM Reset SIM clock SIM_VDD 18 PO Power output for SIM card, its output Voltage depends on SIM card type automatically. PWRKEY has been pulled up to VBAT via 40Kohm resistor internally. RESET has been pulled up to VBAT via 40Kohm resistor internally. All lines of SIM interface should be protected against ESD. SIM_DET 14 DI SIM card detecting input. (This function do not support yet in standard software.) If used, keep a 100k resistor pulling up to the VDD_EXT USB USB_VBUS 24 DI,PD Valid USB detection input with 2.5~5.25V detection voltage USB_DP USB_DM UART interface UART1_TXD UART1_RXD UART1_RTS UART1_CTS UART1_DCD UART1_DTR UART1_RI 25 26 1 2 3 4 5 6 7 UART2_TXD UART2_RXD 22 23 I/O I/O Positive line of the differential, bi-directional USB signal. USB interface for debugging Negative line of the differential, bi-directional USB signal. DOH Transmit Data DIPU Receive Data DIPU Request to send DOH Clear to Send If unused, keep them DOH Data carrier detect floating. DIPU Transmit Data DOH Ring Indicator DOH Transmit Data DIPU Receive Data Voltage Domain: 1.8V Indicate and Control in PSM Mode SIM7020G_User Manual_V1.00 14 2019-01-15 Smart Machine Smart Decision RTC_GPIO0 11 DO RTC_EINT 12 DIPU GPIO NETLIGHT 41 DO STATUS 42 DO 10 29 57 58 59 64 65 51 49 50 48 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 I2C interface SDA SCL SPI interface SPI_MISO SPI_MOSI SPI_CLK SPI_SS RF interface IO IO IO IO IO I/O I/O DI DO DO DO In PSM mode, RTC_GPIO0 will change state from low to high when RTC_EINT receive an interrupt event to exit PSM. Enter PSM(RTC_GPIO0 is low) Exit PSM (RTC_GPIO0 is high) Voltage Domain:

VBAT RTC_EINT can be used to wake up SIM7020G from PSM mode, which is pull up to VBAT, active is low. LED control output as network status indication. Operating status output. High level: Power on and firmware ready Low level: Power off Do not pull down before power on If unused, keep them floating. Voltage Domain: 1.8V Open drain output Open drain output If these pins are unused, keep floating. Host input and slave output signals Host outputs slave input signals Clock signal generated by the main device Slave enable signal controlled by master device these SPI MASTER If unused, keep floating. Voltage Domain: 1.8V pins are ANT 32 AI antenna Other interface ADC ADC2 NC 38 56 20 AI AI Analog-digital converter input. Voltage range: 0.1-1.4V. If unused, keep them floating. No connection. Keep it floating SIM7020G_User Manual_V1.00 15 2019-01-15 2.3 Mechanical Information The following figure shows the package outline drawing of SIM7020G. Figure 3: Dimensions (Unit: mm) Smart Machine Smart Decision 2.4 Footprint Recommendation Figure 4: Footprint recommendation (Unit: mm) SIM7020G_User Manual_V1.00 17 2019-01-15 Smart Machine Smart Decision 2.5 Paste mask Recommendation The recommended thickness of stencil foil is 0.15mm. Figure 5: Paste mask SMT stencil footprint outline (Unit: mm) SIM7020G_User Manual_V1.00 18 2019-01-15 Smart Machine Smart Decision 3 Interface Application 3.1 Power Supply The power supply for SIM7020G must be able to provide sufficient instantaneous current up to more than 760mA@2.1V in order to satisfy the power supply current for maximum consumption. Table 6: VBAT pins electronic characteristic Symbol VBAT Description Module power voltage IVBAT(peak)@3.3V Module power peak current in NB emission IVBAT(average) Module power average current in normal mode IVBAT(sleep) IVBAT(PSM) Power supply current in sleep mode Power supply current in PSM mode IVBAT(power-off) Module power current in power off mode. Min. Typ. Max. Unit 2.1 500 3.3 3.6 V

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mA Please refer to the table 32

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3.4

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12 uA uA 3.2 Power Supply Design Guide In the design of the user, special attention must be paid to the design of the power supply to ensure the stable operation of the module.SIM7020G can support the use of Li-MnO2 battery, DC (LDO/ DC-DC), Li-SOCl2 battery and other external power supply, such as its reference design. Note: If the power supply for VBAT pins can support up to500mA@3.3V, using a total of more than 100uF capacitors is recommended, or else users must using a total of 300uF capacitors typically, in order to avoid the voltage drop. The module power peak current depends on the total capacitance. Using a total of 1000uF capacitors in the test that will reduce the peak current to 320mA. SIM7020G_User Manual_V1.00 19 2019-01-15 Smart Machine Smart Decision Figure 6: Recommended power supply reference design circuit Table 7: The path of the power supply VBAT power supply Li-MnO2 DC (LDO/DC-DC) Li-SOCl2 Li-SOCl2 The path of the power 1 2 3 4 Note: Using Li-SOCl2 battery, the open circuit voltage is about 3.8v, larger than the VBAT maximum 3.6v.It is necessary to add the schottky diode ( column 3 of table 7) or voltage limiting circuit (column 4 of table 7) between the battery and the module, and lithium battery or DC can directly supply power (column 1/2 of table 7). 1schottky diodeOn-SEMI , MBR2H200SF 2voltage limiting circuit: VDET+PMOSFETVDET IC Seiko S-1000C33-I4T1U PMOSFET:On-SEMI ,MCH3374-TL-E (Pb-Free), MCH3374-TL-W (Pb-Free/Halogen Free) 3LDO DC TI TPS7A92 If the use of power adapter output 5V power supply or lithium ion battery: RT5707WSC 4VDET+PMOS&LDO & diode SIM7020G_User Manual_V1.00 20 2019-01-15 BOOSTsystem currentSIM7020GmodulePABasebandRFPMUPA currentbaseband currentVDET@3.3VVBATLi-SOCl2Li-MnO2DC(LDO/DC-DC)++CaCbCcCdCe0402040204020RVBATSurge TVSMBR2H200SFOUTMCH3374GNDVDDNC S-1000C334321 Smart Machine Smart Decision Table 8VDET+PMOS&LDO & diode VDET+PMOS 2A LDO DC TPS7A92 Cost Mediate (Good) high Solution Size 6.45mm2 6.25mm2 (only TPS7A92) Vmin: 2.1V VBAT operating range Vmax: 3.8V (Good) Vmin: 2.36V(=2.1V+Vdo) Vmax: 3.8V Efficiency @Vin > 3.3V Ploss = 0.75V(Vf@1A) * 1A = 0.75W Ploss = (3.8V-3.3V) * 1A = 0.5W 2A Diode MBR2H200SF less (BEST) 4.455mm2 Vmin: 3.0V(2.1V+0.9V@1A) Vmax: 3.8V (Bad) Ploss = 0.9V(Vf@1A) * 1A =

0.9W Efficiency @Vin < 3.3V Ploss = Ron(<0.125ohm) * 1.652(A) < 0.34W(Good) Ploss = 0.26V * 1.65A = 0.429W Ploss = 0.9V * 1.65A = 1.485W Current consumption MAX < 0.9Ua 2.8mA=> 2.1mA(ground current)+0.7mA(VFB leakage) No extra current consumption impact

(Good)

(Bad)

(BEST) Comprehensive evaluation: VDET+PMOS is recommended. LDO solution: LDO current capacity and low Iq are a compromise, and it is not competitive in performance and cost. Schottky diode solution: price should be at an advantage but minimum input voltage should be at 3V at VBAT. The power supply range of SIM7020G is from 2.1V to 3.6V.Recommended voltage is 3.3V. The transmitting burst will cause voltage drop and the power supply must be able to provide sufficient current up to 760mA@2.1VMake sure that the voltage on the VBAT pins will never drop below 2.1V, or module will work abnormally. Note: SYSTEM CURRENT EVALUAATE:

system current= PA current +baseband current=760mA Max.PA input current=400mA Max.baseband current=20mA(Without other device on system) If boost converter efficiency 85%;calculate boost input current=(400mA*3.3V)/0.85/2.1V=740mA; *Boost output=3.3V/battery min.=2.1V. Note: Battery pulse current capability should be confirmed with battery vender. SELECT BATTERY CURRENT CAPABILITY >760mA Based on the recommendations, the following combination is placed near the VBAT capacitance, near the module VBAT input, suggested to parallel a low ESR (ESR) = 0.7 100 uF Ca and Cb tantalum capacitor, and Cc 100 nF, Cd 100 pF(0402 size) and Ce22pF (0402 size) filtering capacitance, To improve RF performance and system stability .These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 1 mm to minimize PCB trace impedance. SIM7020G_User Manual_V1.00 21 2019-01-15 Smart Machine Smart Decision Figure 7: Power supply application circuit In addition, for ESD protection, it is suggested to add a TVS diode near the VBAT PINs. Table 9: Recommended TVS diode list No. Manufacturer Part Number Package 1 2 3 Prisemi Prisemi PESDHC2FD4V5B DFN1006 PESDHC3D3V3U SOD323 DFN1006 WILLsemi ESD5651N-2/TR 3.3 Voltage Monitor To monitor the VBAT voltage, the AT command AT+CBC can be used. When the VBAT voltage is out of the range, the module will be power off when the overvoltage power-off function is enabled. The AT command AT+CBATCHK=1 can be used to enable the overvoltage power-off function and the under-voltage power-off function. Note: Under-voltage warning function and under-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1]. 3.4 Power on/Power off/Reset Function 3.4.1 Power on SIM7020G can be powered on by pulling the PWRKEY pin to ground. The PWRKEY pin has been pulled up with a resistance to VBAT internally, so it does not need to be pulled up externally. It is strongly recommended to put a 100nF capacitor and an ESD protection diode close to the PWRKEY pin, as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the following figure for the recommended reference circuit. SIM7020G_User Manual_V1.00 22 2019-01-15 VBATVBATGNDModule5.1V500mWVBATCb100uF100pFCeCc100uFCaCd100nF22pFGND Smart Machine Smart Decision Figure 8: Reference power on/off circuit Note: Do not directly ground the PWRKEY pin, and do not lower GPIO0 before starting the machine. The power-on scenarios are illustrated in the following figure. Figure 9: Power on timing sequence SIM7020G_User Manual_V1.00 23 2019-01-15 4.7K47KTurn on/off impulsePWRKEYPower on/off logicVBATModule1K100nFHL40KSTATUS(Output)TonVBATPWRKEY(Input)Ton(status)UART PortUndifinedActiveTon(uart)UndifinedActiveUSB PortTon(usb) Smart Machine Smart Decision Table 10: Power on timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit 215 800

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ms Ton The time of active low level impulse of PWRKEY pin to power on module The time from power-on issue to Ton(status) STATUS pin output high level(indicating power up ready ) The time from power-on issue to UART port ready The time from power-on issue to USB port ready 2 Input high level voltage on PWRKEY pin 0.7*VBAT Input low level voltage on PWRKEY pin Ton(uart) Ton(usb) VIH VIL ms s s V 0.3*VBAT V 440 4 3.4.2 Power off The following methods can be used to power off SIM7020G. Method 1: Power off SIM7020G by pulling the PWRKEY pin to ground. Method 2: Power off SIM7020G by AT command AT+CPOWD=1. Method 3: over-voltage or under-voltage automatic power off. The function can be enabled by AT command AT+CBATCHK=1. Default is disabled. Note: For details about AT+CPOWD and AT+CBATCHK, please refer to Document [1]. These procedures will make modules disconnect from the network and allow the software to enter a safe state, and save data before module be powered off completely. The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure. SIM7020G_User Manual_V1.00 24 2019-01-15 Figure 10: Power off timing sequence

(Output)Toff(Input)Toff(status)UART PortUndefinedActiveToff(uart)TonToff-onUSB PortUndefinedActiveToff(usb)PWRKEYSTATUS Smart Machine Smart Decision Table 11: Power off timing and electronic characteristic Symbol Parameter Time value Min. Typ. Max. Unit Toff Toff(status) The active low level time pulse on PWRKEY pin to power off module The time from power-off issue to STATUS pin output low level(indicating power off )*

Toff(uart) The time from power-off issue to UART port off Toff(usb) The time from power-off issue to USB port off Toff-on The buffer time from power-off issue to power-on issue 0.8 1

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5

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0.55 1 1

-

s s s s s

*Note: The STATUS pin can be used to detect whether module is powered on or not. When module has been powered on and firmware goes ready, STATUS will be high level, or else STATUS will still low level. 3.4.3 Reset Function SIM7020G can be reset by pulling the RESET pin to ground. Note: This function is only used as an emergency reset. The RESET pin will be ineffectiveness in the power off mode. The RESET pin has been pulled up to VBAT with a 40K resistor internally. So it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the RESET pin. Please refer to the following figure for the recommended reference circuit. Figure 11: Reference reset circuit SIM7020G_User Manual_V1.00 25 2019-01-15 4.7K47KRESETReset Logic40KVBATModule1K100nFTreset Smart Machine Smart Decision Table 12: RESET pin electronic characteristic Symbol Description Min. Typ. Max. Unit Treset VIH VIL The active low level time impulse on RESET pin to reset module 40 Input high level voltage 0.7*VBAT Input low level voltage

-

-

ms V 0.3*VBAT V 3.5 UART Interface SIM7020G provides a 7-wire UART1 (universal asynchronous serial transmission) interface as DCE (Data Communication Equipment). AT commands and data transmission can be performed through UART1 interface.UART2 can be used for debugging and download software. 3.5.1 UART Design Guide The following figures show the reference design. Figure 12: UART full modem SIM7020G_User Manual_V1.00 26 2019-01-15 Figure 13: UART null modem TXDRXDRTSCTSUART_DTRUART_DCDUART1_RITXDRXDRTSCTSDTRDCDRINGMODULE (DCE)CUSTOMER (DTE)Serial portSerial portMODULE (DCE)HOST(DTE)UARTUARTTXDRXDRTSCTSDTRDCDRITXDRXDRTSCTSDTRDCDRINGInterruptWake up host Smart Machine Smart Decision The SIM7020G UART is 1.8V voltage interface. If users UART application circuit is 3.3V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas Instruments is recommended. The following figure shows the voltage matching reference design. Figure 14: Reference circuit of level shift Note: When it uses the level shifter IC, the pull up resistance on TXD_3.3V, RTS_3.3V, DCD_3.3V should not be less than 47K. Also the following reference circuit is recommended:

Figure 15: TX level matching circuit SIM7020G_User Manual_V1.00 27 2019-01-15 TXDRXDRTSCTSDTRDCDRIA7A1A2A3A4A5A6MODULEDCETXB0108RGYRUART A8B7B1B2B3B4B5B6B8VCCAOEVDD_EXTVCCB47K47KTXD_3.3VDTE3.3V100nF100nFRXD_3.3VRTS_3.3VCTS_3.3VDTR_3.3VDCD_3.3VRI_3.3VVDD_EXT4.7K47KUART1_TXD4.7KMODULEDCEVDD_EXTRXDVDDDTE Smart Machine Smart Decision Figure 16: RX level matching circuit Note: The default band rate is 0bps (auto baud rate). The triode conversion circuit is not suitable for high band rate more than 460800. When using UART2 for downloading software, the band rate is 921600bps, please pay attention to the devices speed support. 3.5.2 RI and DTR Behavior The RI pin description:

The RI pin can be used to interrupt output signal to inform the host controller such as application CPU. Before that, users must use AT command AT+CFGRI=1 to enable this function. Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming, then it will output a low level pulse 120ms, in the end, it will become high level. Figure 17: RI behaviour SMS and URC report Note: For more details of AT commands about UART, please refer to document [1]. The DTR pin description:

After setting the AT command AT+CSCLK=1, SIM7020G will enter sleep mode by pulling up the DTR pin when module is in idle mode. In sleep mode, the UART is unavailable. When SIM7020G enters sleep mode, pulling down DTR can wake up module. After setting the AT command AT+CSCLK=0, SIM7020G will do nothing when the DTR pin is pulling up. 3.6 USB Interface The SIM7020G contains a USB interface compliant with the USB1.1 specification as a peripheral, SIM7020G_User Manual_V1.00 28 2019-01-15 VDD_EXT4.7K47K4.7KDTEUART1_RXDMODULEDCEVDD_EXTTXDVDDIdleHIGHLOW Receiving SMS reports coming RI120ms Smart Machine Smart Decision but the USB charging function is not supported. Figure 18: USB reference circuit Because of the high speed on USB bus, more attention should be paid to the influence of the junction capacitance of the ESD component on USB data lines. Table 13: Recommended TVS list No. Manufacturer Part Number Description Package ON Semi ESD9L5.0ST5G TVS 5V 0.5PF 150mW RO SOD-923 TOSHIBA DF2S6.8UFS TVS 5V 2PF 150mW RO SOD-923 ON Semi ESD9L5.0ST5G TVS 5V 0.5PF 150mW RO SOD-923 TOSHIBA DF2S6.8UFS TVS 5V 2PF 150mW RO SOD-923 1 2 3 4 3.7 SIM Interface SIM7020G supports both 1.8V and 3.0V SIM Cards. Table 14: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V) Symbol Parameter Min. Typ. Max. SIM_VDD LDO power output voltage 1.75 1.8 1.95 Unit V VIH VIL VOH VOL High-level input voltage 0.65*SIM_VDD Low-level input voltage

-0.3

-

0 SIM_VDD +0.3 V 0.25*SIM_VDD V High-level output voltage SIM_VDD -0.45

-

SIM_VDD Low-level output voltage 0 0 0.45 V V Table 15: SIM electronic characteristic 3.0V mode (SIM_VDD=3V) SIM7020G_User Manual_V1.00 29 2019-01-15 USB_VBUSUSB_DMUSB_DPGNDUSB USBVBUSD-D+GNDD2D10USB_IDD3MODULEHOST Smart Machine Smart Decision Symbol Parameter Min. Typ. Max. SIM_VDD LDO power output voltage 2.75 3.05 Unit V VIH VIL VOH VOL High-level input voltage 0.65*SIM_VDD Low-level input voltage

-0.3 SIM_VDD +0.3 V 0.25*SIM_VDD V High-level output voltage SIM_VDD -0.45

-

SIM_VDD Low-level output voltage 0 0 0.45 V V 3

-

0 3.7.1 SIM Application Guide It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the SIM peripheral circuit should be close to the SIM card socket. The following figure shows the 6-pin SIM card holder reference circuit. Figure 19: SIM interface reference circuit Note: A 100nF capacitor on SIM_VDD is used to reduce interference. For more details of AT commands about SIM, please refer to document [1].SIM_CLK is very important signal, the rise time and fall time of SIM_CLK should be less than 40ns, otherwise the SIM card might not be initialized correctly. If SIM_DET is used, a 10K resistor is necessary to pulling up to the power VDD_EXT. SIM card circuit is susceptible to interference, causing the SIM card failures or some other situations, SIM7020G_User Manual_V1.00 30 2019-01-15 MODULETVSSIM_VDDSIM_CLKSIM_DATASIM_RSTVCC GNDRST VPPCLK I/O22100nFC707 10M006 512SIM Socket222222pF22pF22pFSIM_DET Smart Machine Smart Decision it is strongly recommended to follow these guidelines while designing:

Make sure that SIM card holder should far away from NB_IOT antenna while in PCB layout. SIM traces should keep away from RF lines, VBAT and high-speed signal lines. The traces should be as short as possible. Keep SIM holders GND connect to main ground directly. Shielding the SIM card signal by ground well. Recommended to place a 100nF capacitor on SIM_VDD line and keep close to the holder. Add some TVS and the parasitic capacitance should not exceed 50pF, and 22 resistor in serials the SIM signal could enhance ESD protection. 3.8 Network status The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following figure. Figure 20: NETLIGHT reference circuit Note: The value of the resistor named R depends on the LED characteristic. Table 16: NETLIGHT pin status NETLIGHT pin status 64ms ON, 800ms OFF Module status No registered network 64ms ON, 3000ms OFF Registered network 64ms ON, 300ms OFF Data transmit OFF Power off or PSM mode Note: NETLIGHT output low level as OFF, and high level as ON. SIM7020G_User Manual_V1.00 31 2019-01-15 ModuleNETLIGHT VBAT4.7K47KR Smart Machine Smart Decision 3.9 ADC SIM7020G has a dedicated ADC pin. It is available for digitizing analog signals such as battery voltage and so on. The electronic specifications are shown in the following table. Table 17: ADC electronic characteristics Characteristics Resolution Input Range Min. Typ. Max. 0.1 10 1.4 Unit Bits V Note: AT+CADC can be used to read the voltage of the ADC pin, for more details, please refer to document [1]. 3.10 Power Supply Output SIM7020G has a LDO power output named VDD_EXT. The output voltage is 1.8V. Meanwhile it has a DCDC power output named VDD_3V3, which voltage range is 3.3V-3.5V (depend on VBAT). Both of them are not present in PSM mode. Figure 21Power on sequence of the VDD_EXT Figure 22Power on sequence of the VDD_3V3 SIM7020G_User Manual_V1.00 32 2019-01-15 VDD_EXT(Output)64msVBATPWRKEY(Input)VDD_3V3(Output)70msVBATPWRKEY(Input) Smart Machine Smart Decision Table 18: Electronic characteristic Pin name Description Min. Typ. Max. Unit 1.7

-

3.2

-

1.8

-

3.3

-

1.9 50 V mA VBAT-0.1 V 50 mA VDD_EXT VVDD_EXT Output voltage IO Output current VDD_3V3 VVDD_3V3 Output voltage IO Output current 3.11 I2C Interface The SIM7020G provides an I2C interface which is only used in the embedded AT application. Table 19: Pin definition of the I2C Pin name Pin Description Comment number 65 64 I2C serial bus clock I2C serial bus data Voltage Domain: 1.8V SCL SDA Notes:

1. This function is not supported in the standard firmware. If customer wants this function, the firmware must be customized. Please contact SIMCom for more details. 2. If customer design I2C please pull up to VDD_EXT. 3. I2C is master mode 400kbps,up to 3.4Mbp,supporting7-bit/10-bit addressing. Table 20: I2C multiplexing function Pin name Pin number Mode 0(default) SCL SDA 74 75 SCL SDA Mode 1 GPIO6 GPIO7 Note: Multiplexing function need different software supply. SIM7020G_User Manual_V1.00 33 2019-01-15 Smart Machine Smart Decision 3.12 SPI Interface The SIM7020G provides an SPI interface(master mode), It could be used as SPI interface in the embedded AT application.. Table 21: Pin definition of the SPI Pin name Pin Description Comment number SPI_MISO SPI_MOSI SPI_CLK SPI_SS 51 49 50 48 Host input and slave output signals Host outputs slave input signals Clock signal generated by the main device Slave enable signal controlled by master device SPI MASTER Voltage Domain:

1.8V SPI interface voltage domain is 1.8v.If the voltage domain of the slave device system is 3.3v, a level switch shall be added between the module and the slave device Converter; It is recommended to use a level converter that supports SPI data rate. The reference circuit is shown below:

Figure 23: SPI interface level conversion reference circuit Notes:

1. This function is not supported in the standard firmware. If customer wants this function, the firmware must be customized. Please contact SIMCom for more details. SIM7020G_User Manual_V1.00 34 2019-01-15 Module(DCE)TranslatorGNDGNDVCCASPI_SSSPI_CLKSPI_MOSISPI_MISOVDD_EXTA1A2A3A4DTEGNDVDDSPI_SSSPI_CLKSPI_MOSISPI_MISOB1B2B3B4VCCBGND0.1uF0.1uF0E Smart Machine Smart Decision 4 RF Specifications 4.1 LTE RF Specifications Table 22: Conducted transmission power Frequency LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B66 Power 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB Min.

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm LTE-FDD B70 LTE-FDD B71

*NoteThe max power is tested result single-tone in CAT-NB2. Multi-tone test results please 23dBm +/-2.7dB 23dBm +/-2.7dB

<-40dBm

<-40dBm refer to part 6.2.3F.3 for CAT-NB2. Table23: Maximum Power Reduction (MPR) for UE category NB2 Power Class 3 Modulation Tone positions for 3 Tones allocation QPSK 0-2 3-5 and 6-8 9-11 MPR 0.5 dB 0 dB 0.5 dB Tone positions for 6 Tones allocation 0-5 and 6-11 MPR 1 dB 1 dB Tone positions for 12 Tones allocation MPR 0-11 2 dB SIM7020G_User Manual_V1.00 35 2019-01-15 Smart Machine Smart Decision Table 24: E-UTRA operating bands E-UTRA UL Freq. DL Freq. Duplex Mode 1 2 3 4 5 8 12 13 17 18 19 20 25 26 28 66 70 71 1920~1980 MHz 1850~1910MHz 1710~1785 MHz 1710~1755MHz 824~849 MHz 880~915 MHz 699~716 MHz 777~787 MHz 704~716MHz 815~830 MHz 830~845 MHz 832~862 MHz 2110~2170 MHz 1930~1990MHz 1805~1880 MHz 2110~2155MHz 869~894 MHz 925~960 MHz 729~746 MHz 746~756 MHz 734~746MHz 860~875 MHz 875~890 MHz 791~821 MHz 1850~1915MHz 1930~1995MHz 814~849 MHz 703~748 MHz 1710~1780MHz 1695~1710MHz 663~698MHz 859~894 MHz 758~803 MHz 2110~2200MHz 1995~2020MHz 617~652MHz HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD HD-FDD Table 25: CAT-NB2 Reference sensitivity (QPSK) Sensitivity dBm Sensitivity dBm Sensitivity dBm Operating band

(95% throughput

(95% throughput

(95% throughput 3GPP required ) without repetitions ) with repetitions ) 1,2,3,4,5,8,12,13,17,18,19, 20,25,26,28,66,70,71

-108.2

-114

-131 4.2 LTE Antenna Design Guide Users should connect antennas to SIM7020Gs antenna pads through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50.SIMCom recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements:

Table 26: Trace loss Frequency 700MHz-960MHz 1710MHz-2170MHz Loss

<0.5dB

<0.9dB SIM7020G_User Manual_V1.00 36 2019-01-15 Smart Machine Smart Decision 2300MHz-2650MHz

<1.2dB To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit. Figure 24: Antenna matching circuit (MAIN_ANT) In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of components can only be achieved after the antenna tuning and usually provided by antenna vendor. By default, the R1, R2 are 0 resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS for ESD protection, and it is optional for users according to application environment. The RF test connector is used for the conducted RF performance test, and should be placed as close as to the modules MAIN_ANT pin. The traces impedance between SIM7020G and antenna must be controlled in 50. Two TVS are recommended in the table below. Table 27: Recommended TVS Package Part Number 0201 0402 LXES03AAA1-154 LXES15AAA1-153 4.3 RF traces note 4.3.1 RF traces layout Vender Murata Murata Keep the RF trace from module ant pin to antenna as short as possible RF trace should be 50 either on the top layer or in the inner layer RF trace should be avoided right angle and sharp angle. Put enough GND vias around RF traces. RF trace should be far away from other high speed signal lines. SIM7020G_User Manual_V1.00 37 2019-01-15 Smart Machine Smart Decision Figure 25: RF trace should be far away from other high speed signal lines Avoiding the paroling rout of other system antennas nearly. There should be some distance from The GND to the inner conductor of the SMA connector. It is better to keep out all the layers from inner to the outer conductor. Figure 26: The distance between GND to the inner conductor of SMA

*Note1:Keep distance from GND to SMA connector throughout all PCB layers;

SIM7020G_User Manual_V1.00 38 2019-01-15 Smart Machine Smart Decision

*Note2:GND pads around the ANT pad should not be hot pad;

GND pads around the ANT pad should not be hot pad to keep the GND complete,as shown in fig.27 Note2. 4.3.2 LTE ANT and other system ANT decoupling Make sure the efficiency of LTE main ANT more than 40%

Keep the decoupling of LTE main ANT to WLAN ANT more than 15dB Keep the decoupling of LTE main ANT to GNSS ANT more than 30dB Note: The decoupling value can be provided by ANT adventure. More details can refer to the document[25]. SIM7020G_User Manual_V1.00 39 2019-01-15 Smart Machine Smart Decision 5 Electrical Specifications 6 Electrical Specifications 6.1 Absolute maximum ratings Absolute maximum rating for digital and analog pins of SIM7020G are listed in the following table:

Table 28: Absolute maximum ratings Parameter Voltage at VBAT Voltage at USB_VBUS Voltage at digital pins (GPIO, UART etc) Voltage at digital pins (SIM) Voltage at PWRKEY/RESET/RTC_EINT/RTC_GPIO0

-0.3 6.2 Operating conditions Table 29: Recommended operating ratings Min. Typ. Max. Unit

-0.3

-0.3

-0.3

-0.3

-

-

-

-

-

3.6 5.5 3.6 3.6 3.6 V V V V Parameter Voltage at VBAT Voltage at USB_VBUS Min. 2.1 3.6 Typ. Max. Unit 3.3 5.0 3.6 5.25 V V Table 30: 1.8V Digital I/O characteristics*

Parameter Description VIH VIL VOH VOL IOH IOL IIH Min. 1.17

-0.3 1.35 High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage 0 High-level output current(no pull down resistor) Low-level output current(no pull up resistor) Input high leakage current (no Typ. Max. Unit 1.8 2.1 0

-

-

0.63 1.8 0.45 4 4 5 V V V V mA mA uA SIM7020G_User Manual_V1.00 40 2019-01-15 Smart Machine Smart Decision pull down resistor) IIL Input low leakage current(no pull up resistor) 5 uA

*Note: These parameters are for digital interface pins, such as GPIOs (including NETLIGHT, STATUS, SIM_DET), UART. The operating temperature of SIM7020G is listed in the following table. Table 31: Operating temperature Parameter Min. Typ. Max. Normal operation temperature Extended operation temperature*

Storage temperature

-30

-40

-45 25 25 25 80 85 90 Unit

*Note: The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range. 6.3 Operating Mode 6.3.1 Operating Mode Definition The table below summarizes the various operating modes of SIM7020G product. Table 32: Operating mode Definition Mode Function Sleep mode the minimal level and the module can still receive paging In this case, the current consumption of module will be reduced to n o i t a r e p o l a m r o N Idle mode message and SMS. Software is active. Module is registered to the network, and the module is ready to communicate. Module is ready for data transmission, but no data is currently Standby mode sent or received. In this case, power consumption depends on network settings. Data transmission mode consumption is related to network settings (e.g. power control There is data transmission in progress. In this case, power Minimum functionality mode level); uplink/downlink data rates, etc. AT command AT+CFUN=0 AT+CSCLK=1 can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work and the SIM card will not be accessible, but the serial port SIM7020G_User Manual_V1.00 41 2019-01-15 Smart Machine Smart Decision and USB port are still accessible. The power consumption in this mode is lower than normal mode. AT command AT+CFUN=4 can be used to set the module to flight mode without removing the power supply. In this mode, the Flight mode RF part of the module will not work, but the serial port and USB PSM mode port are still accessible. The power consumption in this mode is lower than normal mode. In this mode, the module will be the least current consumption. Meanwhile, all the output of the LDO and DCDC in the module will be closed except the RTC power. And also all of the functions will be unavailable except the RTC function. In PSM, RTC_GPIO0 will change state from high to low. RTC_EINT or PWRKEY can wake up the module. Module will go into power off mode by sending the AT command AT+CPOWD=1 or pull down the PWRKEY pin, normally. In Power off mode this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible. 6.3.2 Sleep mode In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still receive paging message and SMS. Several hardware and software conditions must be satisfied together in order to let SIM7020G enter sleep mode:

1. UART condition 2. USB condition 3. Software condition 6.3.3 Minimum functionality mode and Flight mode Minimum functionality mode ceases a majority function of the module, thus minimizing the power consumption. This mode is set by the AT command which provides a choice of the functionality levels. AT+CFUN=0: Minimum functionality AT+CFUN=1: Full functionality (Default) AT+CFUN=4: Flight mode If SIM7020G has been set to minimum functionality mode, the RF function and SIM card function will be closed. In this case, the serial port and USB are still accessible, but RF function and SIM card will be unavailable. If SIM7020G has been set to flight mode, the RF function will be closed. In this case, the serial port SIM7020G_User Manual_V1.00 42 2019-01-15 Smart Machine Smart Decision and USB are still accessible, but RF function will be unavailable. When SIM7020G is in minimum functionality or flight mode, it can return to full functionality by the AT command AT+CFUN=1. 6.3.4 Power Saving Mode (PSM) SIM7020G module can enter into PSM for reducing its power consumption. The mode is similar to power-off, but the module remains registered on the network and there is no need to re-attach or re-establish the network connections. So in PSM all the functions will be unavailable except the RTC function, module cannot immediately respond users requests. In PSM, RTC_GPIO0 will change state from low to high if RTC_EINT receive interrupt event. Either of the following methods will wake up the module from PSM:

Pulling PWRKEY or RTC_EINT to low level will wake up the module. When T3412 timer expires, the module will be automatically woken up. Power domain of RTC_GPIO0 and RTC_EINT is VBAT, please consider the electrical characteristics when connecting to external IO (suggest to use trigger as low-active). Table 33: RTC_GPIO0/RTC_EINT characteristics IO RTC_EINT RTC_EINT IO RTC_GPIO0 RTC_GPIO0 Vih(min). 1.575 2.725 Vih(max). Vil(min). Vil(max). VBAT 2.1 3.6 0 0 0.525 0.905 2.1(min) 3.6(max) Voh(min). Voh(max). Vol(min). Vol(max). VBAT 1.785 3.085

-

-

-

-

0.315 0.545 2.1(min) 3.6(max) 6.3.5 Extended Mode DRX (e-DRX) In idle or sleep mode, module and the network may negotiate over non-access stratum signaling the use of extended mode DRX for reducing power consumption. 6.4 Current Consumption The current consumption is listed in the table below. Table 34: Current consumption on VBAT Pins (VBAT=3.3V) Sleep/Idle Mode LTE supply current

(without USB connection) Sleep mode Typical: 236uA (at+cfun=0) Idle mode Typical: 5.6mA SIM7020G_User Manual_V1.00 43 2019-01-15 Smart Machine Smart Decision Power Saving Mode PSM supply current eDRX eDRX mode supply current Tested in sleep mode LTE data LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 6.5 ESD Notes PSM mode Typical: 3.4uA

@PTW=10.24s, Typical230uA

@PTW=10.24s, Typical130uA

@PTW=20.48s, Typical95uA

@PTW=20.48s, Typical77.5uA

@PTW=40.96s, Typical69uA eDRX=20.48s, DRX=1.28s eDRX=20.48s, DRX=2.56s eDRX=81.92s, DRX=2.56s eDRX=162.84s, DRX=2.56s eDRX=655.36s, DRX=2.56s

@23dbm Typical: 134mA

@10dbm Typical: 42mA

@0dbm Typical: 32mA

@23dbm Typical: 116mA

@10dbm Typical: 44mA

@0dbm Typical: 31 mA

@23dbm Typical: 116mA

@10dbm Typical: 35mA

@0dbm Typical: 25mA

@23dbm Typical: 128mA

@10dbm Typical: 35mA

@0dbm Typical: 25mA

@23dbm Typical: 113mA

@10dbm Typical: 34mA

@0dbm Typical: 26mA

@23dbm Typical: 126mA

@10dbm Typical: 38mA

@0dbm Typical: 27mA SIM7020G is sensitive to ESD in the process of storage, transporting, and assembling. When SIM7020G is mounted on the users mother board, the ESD components should be placed beside the connectors which human body may touch, such as SIM card holder, audio jacks, switches, keys, etc. The following table shows the SIM7020G ESD measurement performance without any external ESD component. Table 35: The ESD performance measurement table Part GNDShield GND RF VBAT Contact discharge(kV) Air discharge(kV)

+/-6

+/-6

+/-5

+/-12

+/-12

+/-10 SIM7020G_User Manual_V1.00 44 2019-01-15 Smart Machine Smart Decision Antenna port

+/-5 Other PADs Note: Temperature: 25, Humidity: 45%, tested on SIMCOM-EVB.

+/-3

+/-10

+/-6 SIM7020G_User Manual_V1.00 45 2019-01-15 Smart Machine Smart Decision 7 SMT Production Guide 7.1 Top and Bottom View of SIM7020G Figure 27: Top and bottom view of SIM7020G 7.2 Typical SMT Reflow Profile SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints. Figure 28: The ramp-soak-spike reflow profile of SIM7020G SIM7020G_User Manual_V1.00 46 2019-01-15 Smart Machine Smart Decision Note: For more details about secondary SMT, please refer to the document [21]. 7.3 Moisture Sensitivity Level (MSL) SIM7020G is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying equipment (<5% RH) at 40+5/-0C, or 72 hours at 85+5/-5C. Note that plastic tray is not heat-resistant, and only can be baked at 45 C. Table 36: Moisture Sensitivity Level and Floor Life Moisture Sensitivity Level Floor Life (out of bag) at factory ambient30C/60% RH or as

(MSL) stated 1 2 2a 3 4 5 5a 6 Unlimited at 30/85% RH 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage. 7.4 Baking Requirements SIM7020G modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under the following conditions: the environment temperature is lower than 40, and the air humidity is less than 90%. If the condition meets one of the following ones shown below, the modules should be baked sufficiently before re-flow soldering, and the baking condition is shown in table below; otherwise the module will be at the risk of permanent damage during re-flow soldering. If the vacuum package is broken or leakage;

If the vacuum package is opened after 6 months since its been packed;

If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient30/60%RH or as stated. Table 37: Baking requirements SIM7020G_User Manual_V1.00 47 2019-01-15 Smart Machine Smart Decision Baking temperature Moisture 405 1205

<5%

<5%

Time 192 hours 4 hours Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for preheating, and otherwise the tray may be damaged by high-temperature heating. 8 Packaging SIM7020G module support tray packaging (default packaging). Figure 29: packaging diagram Module tray drawing SIM7020G_User Manual_V1.00 48 2019-01-15 Smart Machine Smart Decision Figure 30: Tray drawing Table 38: Tray size Length3mm Width3mm Module number 242.0 161.0 50 Small carton drawing Figure 31: Small carton drawing Table 39: Small Carton size Length10mm Width10mm Height10mm Module number 270 180 120 50*20=1000 Big carton drawing SIM7020G_User Manual_V1.00 49 2019-01-15 Smart Machine Smart Decision Figure 32: Big carton drawing Table 40: Big Carton size Length10mm Width10mm Height10mm Module number 380 280 280 1000*4=4000 SIM7020G_User Manual_V1.00 50 2019-01-15 Smart Machine Smart Decision 9 Appendix 9.1 Related Documents Table 41: Related Documents NO. Title Description

[1]

[2]

[3]

[4]

SIM70X0 Series_AT Command Manual_V1.xx ITU-T Draft new recommendationV.25ter GSM 07.07 GSM 07.10

[5]

GSM 07.05

[6]

GSM 11.14

[7]

GSM 11.11

[8]

GSM 03.38

[9]

GSM 11.10

[10]

3GPP TS 51.010-1

[11]

3GPP TS 34.124

[12]

3GPP TS 34.121

[13]

3GPP TS 34.123-1

[14]

3GPP TS 34.123-3

[15] EN 301 908-02 V2.2.1 AT Command Manual Serial asynchronous automatic dialing and control Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment Data Circuit terminating Equipment

(DTE DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module Mobile Equipment (SIM ME) interface the SIM Application Toolkit for Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module Mobile Equipment (SIM ME) interface Digital cellular telecommunications system (Phase 2+);

Alphabets and language-specific information Digital cellular telecommunications system (Phase 2) Mobile Station (MS) conformance specification Part 1:

Conformance specification Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network;

Terminal conformance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3:

Abstract Test Suites. Electromagnetic compatibility and Radio spectrum Matters

(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread

(UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive SIM7020G_User Manual_V1.00 51 2019-01-15 Smart Machine Smart Decision

[16] EN 301 489-24 V1.2.1 Electromagnetic compatibility and Radio Spectrum Matters

(ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment

[17]

IEC/EN60950-1(2001) Safety of information technology equipment (2000)

[18]

3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification

[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria

[20]

2002/95/EC Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

[21] Module Module secondary SMT Guidelines

[22]

secondary-SMT-UGD-V1.xx SIM7X00 Series_UART_Application Note_V1.xx SIM7X00 Series_USB This document describes how to use UART interface of SIMCom modules.

[23]

AUDIO_Application USB AUDIO Application Note Note_V1.xx

[24]

ETSI EN 301 908-13

(ETSI TS 136521-1 R13.4.0) IMT cellular networks; Harmonized EN covering the essential requirements of article 3.2 of the R&TTE Directive;

Part 13

[25] Antenna design guidelines for Antenna design guidelines for diversity receiver system diversity receiver system

[26]

SIM7X00 Series_Sleep Mode_ Application Note_V1.xx Sleep Mode Application Note SIM7020G_User Manual_V1.00 52 2019-01-15 Smart Machine Smart Decision 9.2 Terms and Abbreviations Table 42: Terms and Abbreviations Abbreviation ADC Description Analog-to-Digital Converter ARP BER BD BTS CS CSD CTS DAC DRX DSP DTE DTR DTX EFR EGSM EMC ESD ETS EVDO FCC FD FDMA FR GMSK GNSS GPRS GPS GSM HR HSPA I2C IMEI LTE MO MS MT NMEA PAP PBCCH PCB Antenna Reference Point Bit Error Rate BeiDou Base Transceiver Station Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Discontinuous Reception Digital Signal Processor Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Evolution Data Only Federal Communications Commission (U.S.) SIM fix dialing phonebook Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System General Packet Radio Service Global Positioning System Global Standard for Mobile Communications Half Rate High Speed Packet Access Inter-Integrated Circuit International Mobile Equipment Identity Long Term Evolution Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated National Marine Electronics Association Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board SIM7020G_User Manual_V1.00 53 2019-01-15 PCS RF RMS RTC SIM SMS SMPS TDMA TE TX UART VSWR SM NC EDGE HSDPA HSUPA ZIF WCDMA VCTCXO SIM UMTS UART PSM Personal Communication System, also referred to as GSM 1900 Smart Machine Smart Decision Radio Frequency Root Mean Square (value) Real Time Clock Subscriber Identification Module Short Message Service Switched-mode power supply Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio SIM phonebook Not connect Enhanced data rates for GSM evolution High Speed Downlink Packet Access High Speed Uplink Packet Access Zero intermediate frequency Wideband Code Division Multiple Access Voltage control temperature-compensated crystal oscillator Universal subscriber identity module Universal mobile telecommunications system Universal asynchronous receiver transmitter Power save mode SIM7020G_User Manual_V1.00 54 2019-01-15 Smart Machine Smart Decision 9.3 Safety Caution Table 43: Safety Caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. SIM7020G_User Manual_V1.00 55 2019-01-15 Smart Machine Smart Decision E. INTEGRATION INSTRUCTIONS 1.1 List of applicable FCC rules FCC Rule Part 22HFCC Rule Part 24EFCC Rule Part 27 and FCC Rule Part 90 1.2 Summarize the specific operational use conditions 1.2 Summarize the specific operational use conditions None. None. 1.3 Limited module procedures None. 1.4 Trace antenna designs Refer to sections 4.2 and 4.3. 1.5 RF exposure considerations For the product,under normal use condition is at least 20cm away from the body of the user,the uer must keeping at least 20cm distance to the product. 1.6 Antennas GSM/UMTS/LTE main antenna,UMTS/LTE auxiliary antenna and GNSS antenna. Antennas typemonopole 1.7 Label and compliance information If the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:

Contains Transmitter Module FCC ID: 2AJYU-8FCA101 1.8 Information on test modes and additional testing requirements Refer to sections 5.3. 1.9 Additional testing, Part 15 Subpart B disclaimer The module only complies with the FCC Rule Part 22HFCC Rule Part 24E FCC Rule Part 27and FCC Rule Part 90.If the module is installed in the host device, the host manufacturer is responsible for the compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. For example, if the host manufacturer markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the host manufacturer shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Smart Machine Smart Decision Contact us:

Shanghai SIMCom Wireless Solutions Limited. Address: Building B, No.633 Jinzhong Road, Changning District, Shanghai P.R.China 200335 Tel: +86 21 3157 5100\3157 5200 Email: simcom@simcom.com Website: www.simcom.com Technical Support EMEA West Europe APAC ASEAN America North America we-support@simcom.com asean-support@simcom.com us-support@simcom.com East Europe Australia and New Zealand Central and South America ee-support@simcom.com anz-support@simcom.com la-support@simcom.com Middle East Big China me-support@simcom.com China-support@simcom.com Africa af-support@simcom.com SIM7020G_User Manual_V1.00 56 2019-01-15

SIM7020G EUT Front EUT Back EUT in mainboard Front EUT in mainboard Back

Authority to Act as Agent Date: 2019/06/25 American Certification Body, Inc. 6731 Whittier Avenue Suite C110 McLean, VA 22101 To Whom It May Concern:

Chongqing Academy of Information and Communication Technology/Zeng Yiqi is authorized to act on our behalf, until otherwise notified, for applications to American Certification Body, Inc.

(ACB). We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002 (b), to the application is subject to denial of federal benefits, that includes FCC benefits. Thank you, Agency Agreement Expiration Date: 12 months By:

Title:

(Signature1)

(Print name) project manager On behalf of: Shanghai SIMCom Wireless Solutions Limited 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead.

Request for Modular/Limited Modular Approval Date: June 27, 2019 Subject: Manufacturers Declaration for - Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: ______2AJYU-8FCA101___ __ For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 8 Basic Requirements FCC Part 15.212(a)(1) 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)

- YES - NO(*) Details: < The modular transmitter must have its own shielding. Please refer to B19W50128-BM816 -Internal Photos. >

2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)

- YES - NO(*) Details: < The modular transmitter has buffered modulation/data inputs to ensure that the module will comply with part 15 requirements with any type of input signal.>

3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)

- YES - NO(*) Details: < The modular transmitter has its own power supply regulation.Please refer to BM816_Block Diagram .>

4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

- YES - NO(*) Details: < The requirements of antenna connector and spurious emissions have been fulfilled.Please refer to B19W50128-MPE ;

B19W50128-EMC;

B19W50128-WWAN ;

Test reports. >

5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)

- YES - NO(*) Details: < The modular transmitter is tested in a stand-alone configuration. Please refer to B19W50128-EMC Test Setup Photos and B19W50128-RF Test Setup Photos .>

053019-02a 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see Modular Approval Requirement Requirement Met KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:

XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)

- YES - NO(*) Details: < The modular transmitter is labelled with its own FCC ID. Labelling instructions for host devices are stated in the user manual under chapter Compliance with FCC and IC Rules and Regulations.>

7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)

- YES - NO(*) Details: < The modular transmitter complies with any specific rules or operating requirements. Instructions are provided in the user manual..>

8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii)

- YES - NO(*) Details: < The modular transmitter complies with RF exposure requirements. Please refer to MPE calculation for the exposure information.

(B19W50128-MPE).>

053019-02a Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA;

the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement Requirement Met 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280.

- Provided in Separate Cover Letter

- N/A Details: < N/A. >

2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained.

- Provided in Separate Cover Letter

- N/A Details: <example N/A >

053019-02a OEM Integration Manual Guidance KDB 996369 D01 V02 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration Items required to be in the manual See KDB 996369 D01 V02, Section 2 instructions are internal confidential documents. As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can 1. List of applicable FCC rules. KDB 996369 D01 V02, Section 2.2 be placed in the operational description, but this should include a cover letter as cited above. a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D01 V02, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point 3. Limited Module Procedures. KDB 996369 D01 V02, Section 2.4 systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such 4. Trace antenna designs. KDB 996369 D01 V02, Section 2.5 that compliance is ensured, such as Class II for new hosts, etc. a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D01 V02, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D01 V02, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types

(monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D01 V02, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product Information on test modes and additional testing requirements. KDB 996369 D01 V02, Section 2.9 8. a. b. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D01 V02, Section 2.10

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. Sincerely, By:

___________

(Signature/Title1) _______________ _____ ________

(Print name) 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 053019-02a

SIMCom Wireless Solutions Ltd. Declaration Letter of the bands MF25D Antenna supports Date: 2019.8.8 To Whom It May Concern:

Hereby, Name of Manufacturer: SIMCom Wireless Solutions Ltd. Address:

Building B,SIM Technology Building, No.633 Jinzhong Road, Changning District, Shanghai P.R.China declares that this antenna:

external antenna MF25D for SIM7020G module test As listed in the provided antenna specification, the frequency range of antenna MF25D covers the NB-IoT bands 1/2/3/4/5/8/12/13/17/18/19/20/25/26/28/66/70/71, which means the antenna supports all the bands supported by SIM7020G module. Sincerely, Signature:

Contact Person: Li Yongsheng E-mail: Yongsheng.li@simcom.com

Request for Confidentiality Date:

2019/6/25 Subject: Confidentiality Request for: =

2AJYU-8FCA101 Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 9.4, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Permanent Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual Permanent*2 Permanent Permanent Permanent Permanent Permanent*3 SIMCom Wireless Solutions Limited of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. has spent substantial effort in developing this product and it is one of the first Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of (specifynumberofdaysnottoexceed180)3 Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify ACB in the event information regarding the product or the product is made available to the public. ACB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. days from the date of the Grant of Equipment NOTE for Industry Canada Applications:

IC currently only distinguishes Permanent Confidentiality exhibits as shown above. Short Term confidentiality is not considered applicable to IC applications. Sincerely, By:

(Signature/Title4)

(Print name) 2 - The asterisked items (*) require further information to be provided to ACB before permanent confidentiality will be extended to these exhibits. Please refer to FCC KDB 726920 and the specific Document link for D01 found at:

https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=41731 and review section II, 3) regarding specific information that must accompany these requests. 3 - Please refer to http://acbcert.com/documents/misc-docs/Memo-Short-Term-Vs-Standard-Confidentiality.pdf for complete details. 4 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate