FCC ID: 2AJYU-8XN0001 NR/LTE /WCDMA MODULE

SIM8260A Hardware Design 5G Module 5G Module SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: 86-21-31575100 support@simcom.com www.simcom.com SIM8260A_Hardware Design_V1.05 Document Title:

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GENERAL NOTES SIM8260A_Hardware_Design 1.05 2022-09-05 Release SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMERS POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMERS SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE. COPYRIGHT THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT, ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY TECHNICAL INFORMATION INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE AT ANY TIME. SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: +86 21 31575100 Email: simcom@simcom.com For more information, please visit:

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Contact Us (simcom.com)or email to: support@simcom.com Copyright 2021 SIMCom Wireless Solutions Limited All Rights Reserved. www.simcom.com 2 / 122 SIM8260A_Hardware Design_V1.05 Version History Date Version Description of change 2021-9-27 1.00 Release 2021-11-26 1.01 2021-12-29 1.02 2022-03-02 1.03 1.Correct the PIN H39 to AH39 in table 5 2.Change some information about the baud rate frequency band supported by the serial port in the NOTE of 3.11 UART Interface. 3.Delete the PIN BA29 of the GND column in Table 5. 4.Add the power consumption current 120uA of the Power off mode in Table 62. 5. Change PIN W1 to RFU and PIN AM7 to GPIO, correct the information about ant interface in table 5 6.Add information about the conditions for the software with chip PM7250B to start up at 3.3V in the note of 3.1 Power Supply. 7.Correct some information about Frequency bands of SIM8260E and SIM8260A in the table, and data transmission throughput of 5G NR in table2. 8.Add the GPIO88 PIN in the GPIO row of Table 5, and add the EBIN2 interface in Table 5. 9.Delete the used RFU PIN, and modify the Pin assignment of Figure 2 accordingly. 1. Change table 61 GPIO66 not support INT 2. Module pin AH3 change PIN name to RFU, table5, table42 delete this PIN description and change figure2 of the pin assignment of the module. 3.table 5 add notice for EBI2 interface 4.Exchang table5, table49 SIM8260C module ANT1 and ANT2 ant description 1. Change Figure 2 pin BA25 TO ANT1, BA33 to ANT2 2. Change table 44 3G net night to 200ms ON/OFF 3. Chane Table 62 power consumption current 135uA of the Power off mode and RF max power 4. Change the definition of GNSS antenna in table5/49/50 5. Updated Figure 46 and 47 6. Updated Figure 50 7. Change PIN AH3 GPIO90 for EBI2_CS Author Yaling Wang Yi Zheng Chen Cheng Tao yu Yi Zheng Chen Cheng Yaling Wang Yi Zheng Yaling Wang 2022-05-07 1.04 1.Change the document name to SIM82X0X and Yaling Wang www.simcom.com 3 / 122 2022-09-05 1.05 SIM8260A_Hardware Design_V1.05 Shaoxu Hou SIM83X0X_Series_Hardware Design 2.Add SIM8360A, SIM8380A and SIM8280A information 3.change table 6: about ANT Pin Frequency Range 4.change Table 13 Power on timing and electronic characteristic and add note 5.change chapter 3.8 about (u)SIM socket model 6.add chapter 3.21 about mmW interface 7.add chapter 6.7 about baking conditions Shaoxu Hou Zhongxi Xiang Increase the minimum output current capability 1. Changed Table about mmW recommended connector type 2. Modify Table, add SIM8380E module information 3. Modify Table, modify the main frequency of the application processor, and add the module weight information 4. Add lines of Ipeak (QTM) related information to the content of Table 5. requirement of external DCDC for mmW modules 6. Add module VDD_EXT peripheral reference circuit 7. Changed the content of the PCIe switch chapter, and changed the corresponding recommended material table 8. Add PCIe interface for IPQxxxx related content 9. Change the Codec ALC5616 special attention content 10. Supplement table content of W_DISABLE pin description 11. Change module Figure 12. Increase the content that PCIe_RST needs to be pulled up 13. The ID resistance of reference circuit is changed from 100K to 200K 14. Modify the description of pin AF3(SLEEP_OUT) 15. The data transfer throughput of different modules is changed to a table representation 16. Add the antenna port definition table of SIM8380E 17. Modify the Ipeak,Ton (STATUS)value 18. Change the description of module pin D9 19. Added chip junction temperature table in thermal design chapter the PM7250B interface www.simcom.com 4 / 122 SIM8260A_Hardware Design_V1.05 Contents Version History .................................................................................................................................................. 3 Contents ............................................................................................................................................................ 5 Table Index ........................................................................................................................................................ 7 Figure Index .......................................................................................................................................................9 1 Introduction ................................................................................................................................................ 11 1.1 Product Outline ................................................................................................................................... 11 1.2 Hardware Block Diagram ....................................................................................................................13 1.3 Feature Overview ............................................................................................................................... 14 2 Package Information ................................................................................................................................. 16 2.1 Pin Assignment Overview ...................................................................................................................16 2.2 Pin Description ....................................................................................................................................18 2.3 Mechanical Dimensions ......................................................................................................................27 3 Interface Application .................................................................................................................................. 29 3.1 Power Supply ......................................................................................................................................29 3.1.1 Power Supply Design Guide ..................................................................................................... 29 3.1.2 Recommended Power Supply Circuit ....................................................................................... 32 3.1.3 Voltage Monitor ..........................................................................................................................34 3.2 Power On and Off Module .................................................................................................................. 35 3.2.1 Power On ...................................................................................................................................35 3.2.2 Power Off ...................................................................................................................................36 3.3 Reset Function ....................................................................................................................................38 3.4 Output Power Management ............................................................................................................... 39 3.4.1 VDD_EXT Reference Circuit .....................................................................................................40 3.5 USB Interface ......................................................................................................................................40 3.6 PCIe Interface ..................................................................................................................................... 44 3.6.1 PCIe for W82 ............................................................................................................................. 45 3.6.2 PCIe for RTL8125B ................................................................................................................... 46 3.6.3 PCIe Switch ............................................................................................................................... 47 3.6.4 PCIe interface for Qualcomm IPQxxxx ..................................................................................... 49 3.7 SDIO Interface .................................................................................................................................... 49 3.8 (U)SIM Interface ..................................................................................................................................52 3.9 I2S Interface ........................................................................................................................................54 3.9.1 I2S Timing ..................................................................................................................................54 3.9.2 I2S Reference Circuit ................................................................................................................ 55 3.10 I2C Interface ..................................................................................................................................... 57 3.11 UART Interface ..................................................................................................................................58 3.12 SPI Interface ..................................................................................................................................... 60 3.13 ADC Interface ....................................................................................................................................61 3.14 WLAN/BT Interface ...........................................................................................................................62 www.simcom.com 5 / 122 SIM8260A_Hardware Design_V1.05 3.15 PM7250B Interface ........................................................................................................................... 64 3.16 GPIOs Interface ................................................................................................................................ 66 3.17 Network Status ..................................................................................................................................67 3.18 Flight Mode Control .......................................................................................................................... 68 3.19 TDD_SYNC_PPS ............................................................................................................................. 69 3.20 Antenna Control Interface* ............................................................................................................... 70 4 Antenna Interfaces .....................................................................................................................................71 4.1 Antenna Definitions .............................................................................................................................71 4.1.1 3G/4G/5G Operating Frequency ...............................................................................................72 4.1.2 GNSS Frequency ...................................................................................................................... 73 4.2 Antenna Installation ............................................................................................................................ 74 4.2.1 PCB Layout Guidelines ............................................................................................................. 74 4.2.2 Antenna Tuner ........................................................................................................................... 74 4.2.3 Antenna Requirements ..............................................................................................................76 4.2.4 RF Plug Recommendation ........................................................................................................ 77 5 Electrical Specifications .............................................................................................................................79 5.1 Absolute Maximum Ratings ................................................................................................................79 5.2 Operating Conditions .......................................................................................................................... 80 5.3 Operating Mode .................................................................................................................................. 81 5.3.1 Operating Mode Definition ........................................................................................................ 81 5.3.2 Sleep Mode ............................................................................................................................... 82 5.3.3 Minimum Functionality Mode and Flight Mode .........................................................................82 5.4 Current Consumption ..........................................................................................................................83 5.5 RF Output Power ................................................................................................................................ 84 5.6 Conducted Receive Sensitivity .........................................................................................................102 5.7 Thermal Design .................................................................................................................................103 5.8 ESD ................................................................................................................................................... 104 6 Manufacturing .......................................................................................................................................... 105 6.1 Top and Bottom View of SIM8XX0X .................................................................................................105 6.2 Label Description Information ...........................................................................................................105 6.3 Recommended PCB Footprint ......................................................................................................... 106 6.4 Recommended SMT Stencil .............................................................................................................107 6.5 Recommended SMT Reflow Profile ................................................................................................. 108 6.6 Moisture Sensitivity Level (MSL) ...................................................................................................... 109 6.7 Baking Requirements ........................................................................................................................110 7 Packaging .................................................................................................................................................111 8 Appendix .................................................................................................................................................. 113 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface ............................................... 113 8.2 Related Documents .......................................................................................................................... 115 8.3 Terms and Abbreviations .................................................................................................................. 117 8.4 Safety Caution ...................................................................................................................................119 www.simcom.com 6 / 122 SIM8260A_Hardware Design_V1.05 Table Index Table 1 : SIM8260A frequency bands .......................................................................................................11 Table 2 : SIM8260Adata transfer throughput ...........................................................................................11 Table 3 : Key features ............................................................................................................................... 14 Table 4 : Pin differences of SIM8260A ..................................................................................................... 17 Table 5 : IO parameters definition ............................................................................................................ 18 Table 6 : DC parameters definition ........................................................................................................... 18 Table 7 : Pin description ............................................................................................................................19 Table 8 : VBAT pins electronic characteristics ......................................................................................... 29 Table 9 : Definition of VBAT and GND pins ..............................................................................................31 Table 10 : Recommended D1 list ............................................................................................................. 32 Table 11 : Recommended power chip list .................................................................................................33 Table 12 : Recommended chip list ........................................................................................................... 34 Table 13 : Definition of PWRKEY pin ....................................................................................................... 35 Table 14 : Power on timing and electronic characteristic .........................................................................36 Table 15 : Power off timing and electronic characteristic .........................................................................37 Table 16 : Definition of RESIN_N pin ....................................................................................................... 38 Table 17 : RESET electronic characteristics ............................................................................................ 39 Table 18 : Output power management summary .....................................................................................39 Table 19 : Module VDD_EXT pin protection tube TVS recommended materials ....................................40 Table 20 : Definition of USB interface ...................................................................................................... 42 Table 21 : Recommended CC detector list .............................................................................................. 43 Table 22 : Recommended SS USB switch list ......................................................................................... 43 Table 23 : Recommended OTG 5V DC-DC and USB interface TVS list .................................................43 Table 24 : Definition of PCIe interface ......................................................................................................45 Table 25 : Recommended W82 list ...........................................................................................................46 Table 26 : Recommended RTL8125B and RJ45 list ................................................................................47 Table 27 : Recommended PCIe SWITCH list .......................................................................................... 48 Table 28 : Definition of SDIO interface ..................................................................................................... 50 Table 29 : Recommended TVS and SD card socket list ..........................................................................51 Table 30 : (U)SIM electronic characteristics in 1.8V mode ((U)SIM_PWR=1.8V) .................................. 52 Table 31 : (U)SIM electronic characteristics 3.0V mode ((U)SIM_PWR=3.0V) ...................................... 52 Table 32 : Definition of (U)SIM interface .................................................................................................. 53 Table 33 : Recommended TVS and (U)SIM socket list ............................................................................53 Table 34 : I2S format .................................................................................................................................54 Table 35 : I2S timing parameters ..............................................................................................................55 Table 36 : The PCM interface is multiplexing with I2S interface ..............................................................56 Table 37 : Recommended audio list ......................................................................................................... 56 Table 38 : Definition of I2C interface ........................................................................................................ 57 Table 39 : Definition of UART interface .................................................................................................... 59 Table 40 : Definition of SPI interface ........................................................................................................ 60 www.simcom.com 7 / 122 SIM8260A_Hardware Design_V1.05 Table 41 : Definition of ADC interface ...................................................................................................... 61 Table 42 : ADC performance parameters .................................................................................................61 Table 43 : Definition of WLAN/BT interface ..............................................................................................62 Table 44 : Definition of PM7250B interface ..............................................................................................64 Table 45 : GPIO list ................................................................................................................................... 66 Table 46 : Definition of NET_STATUS pin ................................................................................................67 Table 47 : NET_STATUS pin status ......................................................................................................... 68 Table 48 : Definition of W_DISABLE pin .................................................................................................. 68 Table 49 : W_DISABLE pin status ............................................................................................................68 Table 50 : Definition of TDD_SYNC_PPS pin .......................................................................................... 69 Table 51 : Definition of antenna control interface through GPIOs ........................................................... 70 Table 56 : The Antenna port definitions of A SIM8260A .......................................................................... 71 Table 57 : 3G/4G band frequency ............................................................................................................ 72 Table 58 : NR band frequency .................................................................................................................. 72 Table 59 : GNSS frequency ...................................................................................................................... 73 Table 60 : 3G/4G/5G/GNSS antennas ..................................................................................................... 76 Table 61 : GNSS antenna (for dedicated GNSS antenna only)* ............................................................. 76 Table 62 : Electrical Specifications of 20449-001E-03 ............................................................................ 77 Table 63 : Absolute maximum ratings ...................................................................................................... 79 Table 64 : VBAT recommended operating ratings ................................................................................... 80 Table 65 : 1.8V digital I/O characteristics ................................................................................................. 80 Table 66 : Operating temperature .............................................................................................................80 Table 67 : Operating mode definition ....................................................................................................... 81 Table 68 : Current consumption on VBAT pins (VBAT=3.8V) ..................................................................83 Table 69 : Conducted output power ........................................................................................................84 Table 71 : Chip junction temperature table ............................................................................................ 103 Table 72 : The ESD performance measurement table (temperature: 25C, humidity: 45%) ................104 Table 73 : Label description of module information ............................................................................... 106 Table 74 : MSL ratings summary ............................................................................................................ 109 Table 75 : Baking requirements .............................................................................................................. 110 Table 76 : Tray size ................................................................................................................................. 111 Table 77 : Small carton size ....................................................................................................................112 Table 78 : Big carton size ........................................................................................................................112 Table 79 : Coding schemes and maximum net data rates over air interface ........................................ 113 Table 80 : Related documents ................................................................................................................ 115 Table 81 : Terms and abbreviations ........................................................................................................117 Table 82 : Safety caution .........................................................................................................................119 www.simcom.com 8 / 122 SIM8260A_Hardware Design_V1.05 Figure Index Figure 1 : Module block diagram .............................................................................................................. 13 Figure 2 : Pin assignment(Top View) ........................................................................................................16 Figure 3 : Dimensions of SIM8260A (unit: mm) ....................................................................................... 28 Figure 4 : Power consumption at ENDC combination of B2 (20MHz) and N79 (100MHz) .................... 30 Figure 5 : Power consumption of entire systeam .....................................................................................30 Figure 6 : Power supply reference circuit .................................................................................................31 Figure 7 : Linear regulator reference circuit ............................................................................................. 33 Figure 8 : Switching mode power supply reference circuit ...................................................................... 33 Figure 9 : Switching mode power supply reference circuit for mmW ...................................................... 34 Figure 10 : Power on the module use button ........................................................................................... 35 Figure 11 : Power on the module use GPIO drive ................................................................................... 35 Figure 12 : Power on sequence ............................................................................................................... 36 Figure 13 : Power off sequence ................................................................................................................37 Figure 14 : Reset the module use GPIO drive ......................................................................................... 38 Figure 15 : Reset the module use button ................................................................................................. 38 Figure 16 : The reset timing sequence of the module ............................................................................. 39 Figure 17 : Module VDD_EXT peripheral reference circuit ..................................................................... 40 Figure 18 : Type-C USB reference circuit with PM7250B ........................................................................41 Figure 19 : Type-C USB reference circuit with CC detector .................................................................... 42

...................................................................................................... 42 Figure 20 : USB3.1 reference circuit Figure 21 : PCIe interface reference circuit (RC) .....................................................................................44 Figure 22 : PCIe interface reference circuit (EP) ..................................................................................... 44 Figure 23 : PCIe interface reference circuit (RC) for W82 .......................................................................46 Figure 24 : PCIe interface reference circuit (RC) for RTL8125B .............................................................47 Figure 25 : PCIe switch reference circuit ................................................................................................. 48 Figure 26 : Schematic diagram of module connected to IPQxxxx .........................................................49 Figure 27 : SD card reference circuit ........................................................................................................50 Figure 28 : eMMC reference circuit .......................................................................................................... 50 Figure 29 : (U)SIM interface reference circuit .......................................................................................... 52 Figure 30 : I2S timing ................................................................................................................................55 Figure 31 : Audio codec reference circuit .................................................................................................56 Figure 32 : I2C reference circuit ............................................................................................................... 57

.............................................................................................. 58 Figure 33 : UART level conversion circuit

.........................................................................................58 Figure 34 : UART TX level conversion circuit Figure 35 : UART RX level conversion circuit

........................................................................................ 59

............................................................................................................. 60 Figure 36 : SPI reference circuit Figure 37 : SIM8260A and W82 connect circuit .......................................................................................62 Figure 38 : PM7250B interface diagram circuit ........................................................................................64 Figure 39 : NET_STATUS reference circuit ............................................................................................. 67 Figure 40 : W_DISABLE pin reference circuit ..........................................................................................68 www.simcom.com 9 / 122 SIM8260A_Hardware Design_V1.05 Figure 41 : TDD_SYNC_PPS pin reference circuit ..................................................................................69 Figure 43 : Aperture tuner reference block diagram ................................................................................ 74 Figure 44 : Impedance tuner reference block diagram ............................................................................75 Figure 45 : Hybrid tuner reference block diagram ................................................................................... 75 Figure 46 : LGA package Tuner mipi interface .........................................................................................75 Figure 47 : 3D view of 20449-001E-03 .................................................................................................... 77 Figure 48 : 3D view of 20449-001E-0 ...................................................................................................... 78 Figure 49 : 3D drawing of LGA thermal dissipation design ..................................................................103 Figure 50 : Top and bottom view of SIMXX0X ....................................................................................... 105 Figure 51 : Label description of module ................................................................................................. 106 Figure 52 : Recommended PCB footprint .............................................................................................. 107 Figure 53 : Recommended SMT stencil .................................................................................................108 Figure 54 : Recommended SMT reflow profile ...................................................................................... 108 Figure 55 : Packaging process ............................................................................................................... 111 Figure 56 : Module tray drawing ............................................................................................................. 111 Figure 57 : Small carton drawing ............................................................................................................112 Figure 58 : Big carton drawing ................................................................................................................112 www.simcom.com 10 / 122 SIM8260A_Hardware Design_V1.05 1 Introduction interfaces, mechanical This document describes the electronic specifications, RF specifications, characteristics, and test results of the SIM8260A module. With the help of this documentcustomers can quickly understand SIM8260A module. Associated with other software application notes and user guides, customers can use SIM8260A to design and develop mobile and laptop applications easily. 1.1 Product Outline SIM8260A is a wireless communication module focusing on 5G market; it supports multi-air access technology including 5G NR (NSA/SA), LTE-FDD, LTE-TDD, and WCDMA, can meet the 3GPP R16 NR specification, and integrates GNSS1 system including dual bands GPS, GLONASS, Beidou, Galileo and QZSS. The modules supported radio frequency bands are shown in the following table. Table 1: SIM8260A frequency bands Standard Frequency bands SIM8260A Module n2/n5/n7/n12/n14/n25/n26/n41/n48/n66/n71/n77/n78 B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 B41 B2/B4/B5 GPS L1+L5 dual bands/GLONASS/BeiDou/Galileo/QZSS 5G NR LTE-FDD LTE-TDD WCDMA GNSS1 NOTE 1. GNSS function is optional. Standard modules do not support L5 by default. The data transfer throughput of the module is shown in the table below. Table 2: SIM8260Adata transfer throughput Standard Data transfer SIM8260A Module Sub-6G SA 2.4Gbps(DL)/1Gbps(UL) Sub-6G NSA 3.4Gbps(DL)/600Mbps(UL) LTE HSPA+

1.6Gbps(DL)/200Mbps(UL) 42Mbps(DL)/5.76Mbps(UL) www.simcom.com 11 / 122 SIM8260A_Hardware Design_V1.05 With a physical dimension of 41.0mm*43.6mm*2.8mm, SIM8260A can meet almost all requirements of customers applications. With the 369 LGA pins, SIM8260A owns rich interfaces, includes USB3.1, PCIe3.0/4.0, SDIO3.0, (U)SIM card, digital audio (I2S or PCM), SPI, I2C, UART, GPIOs, four antennas for 3G/4G/5G and GNSS. For more details about the antenna pins, please refer to the pin definition. With all these interfaces, SIM8260A Series can also be utilized in the handheld terminal, laptop application and especially the 5G CPE. www.simcom.com 12 / 122 SIM8260A_Hardware Design_V1.05 1.2 Hardware Block Diagram The block diagram of SIM8260A is shown in the following figure. Figure 1: Module block diagram www.simcom.com 13 / 122 SIM8260A_Hardware Design_V1.05 1.3 Feature Overview Table 3: Key features Feature Implementation Application processor Arm Cortex-A7 up to 1.8 GHz Memory RAM Memory ROM Power supply 4Gb 16-bit LPDDR4X at 2.13 GHz, 8Gb optional*

4Gb 8-bit NAND, 8Gb optional*

VBAT:3.3V4.4V Typical: 3.8V Power consumption Typical: 2.6 mA @sleep mode (GNSS off, VBAT=3.8V) Transmit power Power Class 3 for WCDMA/LTE/5G NR Power Class 2 for 5G NR(n41/n77/n78/n79) Antenna Five antennas for 3G/4G/5G/GNSS GNSS (optional) SMS

(U)SIM interface

(U)SIM application toolkit GNSS engine: GPS L1+L5/GLONASS/BeiDou/Galileo/QZSS Protocol: NMEA MT, MO, CB, Text and PDU mode SMS storage: (U)SIM card or ME (default) Transmission of SMS alternatively over CS or PS. Support identity card: 1.8V/ 3.0V Include (U)SIM1 and (U)SIM2 interfaces Support Dual SIM single standby Support SAT class 3 Support USAT Phonebook management Support phonebook types: DC, MC, RC, SM, ME, FD, ON, LD, EN Digital audio interface PCIe interface WLAN/BT interface PMI interface3 UART interface I2C interface www.simcom.com One I2S interface with dedicated main clock for primary digital audio, the I2S also can be configured as PCM MCLK frequency: 12.288MHz (default) WCDMA AMR-NB VoLTE AMR-WB Echo cancellation Noise suppression Two lane PCIe interfaces, support PCIe Gen 3 (Gen 1/2 compatible), which up to 8Gbps per lane. One lane PCIe interfaces, support PCIe Gen 4, which up to 16Gbps per lane. Support W822 interface, which support 802.11ax with 3.6Gbps, support BT5.2 Support PM7250B interface, which support USB Type-C, QC4.0* and USB-PD3.0*

Default Support up to three UART Data rate up to 4 Mbps Default Support up to two I2C, meet I2C specification, version 5.0 Data rate up to 400 Kbps 14 / 122 SPI interface SDIO interface USB interface SIM8260A_Hardware Design_V1.05 Only support master mode Data rate up to 50Mbps Support 4bit SD card or 8bit eMMC, meet SDIO3.0 specification 1.8V or 3.0V dual-voltage operation for SD card Clock output up to 200 MHz for SD card; up to 100 MHz for eMMC Support one USB controller, USB3.1 Gen2 or USB2.0 USB3.1: super speed, with data rate which up to 10Gbps USB2.0: high speed interface, support USB operations at low-speed and full-speed, which refer to USB1.0 and USB1.1 Firmware upgrade Firmware upgrade over USB interface Physical characteristics Temperature range Size: 41x43.6x2.8mm SIM8260A weight11.45g (typical) Normal operation temperature: -30C to +70C (3GPP compliant) Extended operation temperature: -40C to +85C3 Storage temperature: -40C to +90C NOTE 1. * means under development,for more information, please connect the SIMCom FAE teams. 2. W82 is SIMCom WiFi-6 module. 3. When Module is within the extended operation temperature range, Module is able to establish and maintain voice, data transmission, SMS and emergency call, etc. The performance may deviate slightly from the 3GPP specifications and will meet 3GPP specifications again when the temperature returns to normal operating temperature levels. It is strongly recommended that customers take heat dissipation measures to ensure that the junction temperature of the chip cant be exceeded (for example, the temperature of the CPU cannot exceed 105C). www.simcom.com 15 / 122 SIM8260A_Hardware Design_V1.05 2 Package Information 2.1 Pin Assignment Overview All functions of the SIM8260A will be provided through 369 LGA pins. The following figure is the pin assignment of the module. Figure 2: Pin assignment(Top View) www.simcom.com 16 / 122 SIM8260A_Hardware Design_V1.05 Table 4: Pin differences of SIM8260A SIM8260A module name M.2 pin number AR51 AG51 AL51 AC51 AM45 AT45 AK45 AP45 AT79 AH49 AF49 AP49 AW19 BA37 BA29 AY14 AY1 RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU QTM_THERM RFU N79_TO_WL_TXEN WL_TX_EN GNSS ANT www.simcom.com 17 / 122 SIM8260A_Hardware Design_V1.05 2.2 Pin Description Table 5: IO parameters definition Pin type Description PI PO AI AIO DIO DI DO PU PD Power Input Power Output Analog Input Analog Input /Output Bidirectional Digital Input /Output Digital Input Digital Output Pull Up Pull Down Table 6: DC parameters definition Voltage domain Parameter VDD_P2=1.8V Min Typ Max VOH VOL VIH VIL Rp P2 VDD_P2=3.0V VOH VOL VIH VIL Rp VDD_P3=1.8V VOH VOL VIH VIL Rp P3 High level output Low level output High level input Low level input Pull up/down resistor 1.4V 0V 1.27V 0V 10K ohm High level output 2.25V Low level output 0V High level input 1.84V Low level input 0V Pull up/down resistor 10K ohm High level output 1.35V Low level output 0V High level input 1.26V Low level input 0V Pull up/down resistor 20K ohm P4/P5 VDD_P4/P5=1.8V

0.45V 2V 0.58V 100K ohm 3.0V 0.375V 3.25V 0.75V 100K ohm 1.8V 0.45V 2.1V 0.6V 60K ohm www.simcom.com 18 / 122 SIM8260A_Hardware Design_V1.05 VOH VOL VIH VIL Rp High level output 1.44V Low level output 0V High level input 1.26V Low level input 0V Pull up/down resistor 10K ohm VDD_P4/P5=3.0V VOH VOL VIH VIL Rp High level output Low level output High level input Low level input Pull up/down resistor 2.4V 0V 2.1V 0V 10K ohm

1.8V 0.4V 2.1V 0.36V 100K ohm 3.0V 0.4V 3.05V 0.6V 100K ohm Table 7: Pin description Pin no. Electrical description Description Comment Pin name Power supply VBAT_BB VBAT_RF PI PI V45, V49, U47 Y49, AC47, AA47, W47, AD45, AB45, Y45 VDD_EXT AL5 PO VREG_1P3 M45 PO VREG_0P9 P49 PO VREG_1P9 N47 PO L10E_3P1 C41 PO VMAX=

4.4V VTYP

=3.8V VMIN=3

.3V VMAX=

4.4V VTYP

=3.8V VMIN=3

.3V VTYP

=1.8V VTYP

=1.28 V VTYP

=0.88 V VTYP=

1.88V VTYP=

3.08V Input power supply for modules BB part Input power supply for modules RF part Output power supply for external IO pull up circuits Output power supply for W82 only Output power supply for W82 only Output power supply for W82 and QTM Output power supply for PM7250B USB PD-PHY and USB switch www.simcom.com 19 / 122 VIO_OUT D42 PO VTYP=

1.8V Output power PM7250B IO only supply for SIM8260A_Hardware Design_V1.05 GND A7, B8, A11, B12, C15, A15, B16, C17, C19, D22, D24, D26, C27, A27, B28, D28, C31, C33, C35, C37, D40, A41, B42, J5, AD7, AJ1, AK3, AM3, AN1, AN5, AP3, AR1, AR5, AT3, AT7, AU1, AU5, AV3, AW1, R47, T49, U51, W51, AA51, AB49, AD49, AE47, AF45, AH45, AG47, AJ47, AL47, AN47, AR47, AU47, AV49, AW51, AV10, AV12, AV14, AV16, AV18, AV20, AV22, AV24, AV26, AV28, AV30, AV32, AV34, AV36, AV38,A V40, AV42, AW9, AW11, AW13, AW15, AW23, AW25, AW27, AW29, AW31, AW33,AW35, AW37, AW39, AW41, AW43, AY6, AY8, AY12, AY18, AY20, AY22, AY24,AY26, AY28, AY30, AY32, AY34, AY36, AY38, AY40, AY42, AY44, AY46, BA5, BA17, BA21, BA23, BA27, BA31, BA35, BA39, BA43, BA45, AM13, AM17, AM21, AM24, AM27, AM31, AM35, AM39, AH13, AH17, AH21, AH24, AH27, AH31, AH35, AH39, AE13, AE17, AE21, AE24, AE27, AE31, AE35, AE39, AA13, AA17, AA21, AA24, AA27, AA31, AA35, AA39, U13, U17, U21, U24, U27, U31, U35, U39, P13, P17, P21, P24, P27, P31, P35, P39, K13, K17, K21, K24, K27, K31, K35, K39, A1, B4, C7, A51, B48, C45, BA1, AY4, AW7, BA51, AY48, AW45, AM49, AK49, AE51, AJ51, AN51, AU51 DI DI 1.1V Power on/off the module, active low P3 Reset the module, active low Pull up to 1.2V internally without PM7250B Pull up to 1.8V inside the module System control PWRKEY RESIN_N Status indicator STATUS NET_STATUS A45 A43 AJ5 AE1 DO DO P3 P3 TDD_SYNC_PPS AW21 DO P3 USB_BOOT D12 DI P3 W_DISABLE AG1 DI P3 SLEEP_OUT AF3 DO P3 USB interface USB_VBUS USB_HS_DP USB_HS_DM C9 B6 A5 AI AIO AIO Indicate Module is on PMU_GPIO_13 activity network Indicate status of the module 1.It can generate pulse use for indication NSA and SA sub6 the beginning frame flag of DL-UL 2.TDD_SYNC_PPS Can be Configuration to GPS_1PPS Module will be forced into USB boot mode by connect to VDD_EXT externally Flight mode control active low Module in Sleep mode output signal to external AP active high input PMU_GPIO_14 1.8V voltage domain. The TDD_SYNC_PPS and GPS_1PPS function cant be used at the same time. GPIO_32 GPIO_42, this pin cant be before power on pulled up GPIO_86 GPIO_97 USB VBUS detection Not support charge Differential USB bi-directional data plus Differential USB bi-directional data minus Required 85 differential impedance Compliant with USB 2.0 standard specifications www.simcom.com 20 / 122 SIM8260A_Hardware Design_V1.05 USB_SS_TX_P A13 AO USB_SS_TX_M B14 AO USB_SS_ RX_P B10 USB_SS_RX_M A9 USB_ID*

C11 AI AI DI USB3.1 super-speed transmit data plus USB3.1 super-speed transmit data minus USB3.1 super-speed receive data plus USB3.1 super-speed receive data minus Required 85 differential Impedance Compliant with USB 3.1 standard specifications P3 USB ID If unused, please keep open OTG_EN*

D10 DO P3 USB_SS_SW C13 DO P3 PM7250B interface2 CHG_SYS_OK C43 DI FAULT_N B44 DIO SPMI_CLK A47 DO SPMI_DATA B46 DIO

(U)SIM interface

(U)SIM1_VDD B51 PO P4

(U)SIM1_DATA E51 DIO P4 USB OTG power supply DC-DC enable signal USB Type-C switch control signal, Used without PM7250B When charger input is inserted, PM7250B output signal to Module. When the charging chip is not used, this pin can be connected to GND to realize the power-on function Used to send/receive the fault condition across all PMICs in the chipset SPMI communication bus clock signal SPMI communication bus data signal Power supply for (U)SIM1 card

(U)SIM1 card data signal, which has been pulled up to

(U)SIM1_VDD by a 20K resistor in Module

(U)SIM1_CLK

(U)SIM1_RST D49 C51 DO DO P4 P4

(U)SIM1 clock signal

(U)SIM1 reset signal

(U)SIM1_DET E47 DI P3

(U)SIM2_VDD F49 PO

(U)SIM1 card detect signal, which need pulled up to VDD_EXT by a 470K resistor externally Power supply for (U)SIM2 card Required 50 impedance 1.8/3.0V voltage domain,

(U)SIM interface should be protected against ESD. If unused, please keep open www.simcom.com 21 / 122 SIM8260A_Hardware Design_V1.05

(U)SIM2_DATA G47 DIO P5

(U)SIM2card data, which has been pulled up to

(U)SIM2_VDD by a 20K resistor in Module

(U)SIM2_CLK

(U)SIM2_RST H49 G51 DO DO P5 P5

(U)SIM2 clock signal

(U)SIM2 reset signal

(U)SIM2_DET F45 DI P3 SPI interface SPI_CS_N SPI_CLK SPI_MOSI SPI_MISO UART1 interface UART1_CTS UART1_RTS UART1_TXD UART1_RXD UART1_DCD UART1_RI UART1_DTR D18 D20 D14 D16 AA1 AC1 AB3 AD3 W5 AA5 AC5 BT UART interface BT_UART_CTS BT_UART_RTS BT_UART_TXD BT_UART_RXD R5 U5 T7 V7 Debug UART interface DBG_UART_RXD L5 DBG_UART_TXD I2C interface1 I2C1_SCL I2C1_SDA N5 M7 P7 I2C2_SCL AB7 DO DO DO DI DI DO DO DI DO DO DI DI DO DO DI DI DO OD OD OD P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3

(U)SIM2 card detect, which need pulled up to VDD_EXT by a 470K resistor externally SPI chips select SPI clock Master output slaver input Master input slaver output Clear to send Request to send Transmit data Receive data Carrier detect Ring indicator Data terminal ready Clear to send Request to send Transmit data Receive data Receive data Transmit data I2C1 clock signal I2C1 data signal I2C2 clock signal I2C2_SDA Y7 OD P3 I2C2 data signal Default use for AT command If not need 7-wire UART, these signals can be used as GPIO Default use for BT Used for debug only I2C1 default use for codec Pull up to VDD_EXT externally I2C2 default use for sensor Pull up to VDD_EXT Externally FOR EBI LCD PIN AB7 GPIO84 for EBI LCD_TE PIN Y7 GPIO85 for EBI LCD_RESET www.simcom.com 22 / 122 SIM8260A_Hardware Design_V1.05 BT I2S interface BT_ I2S_DOUT BT_ I2S_DIN BT_I2S_CLK BT_ I2S_WS K3 M3 J1 G1 DO DI DO DO P3 P3 P3 P3 I2S data output I2S data input I2S bit clock I2S word select I2S Audio Codec interface I2S_DOUT/

PCM_DOUT I2S_DIN/

PCM_DIN I2S_CLK/

PCM_CLK I2S_WS/

PCM_SYNC I2S_MCLK N1 R1 P3 T3 L1 CDC_RST_N AK7 ADC interface DO P3 I2S/PCM data output DI P3 I2S/PCM data input DO P3 I2S/PCM clock output I2S word select/

PCM synchronous signal I2S master clock output DIO DO DO P3 P3 P3 Default use for W82 Default is I2S interface, can be configured as PCM interface by software. If unused, please keep open ADC0 ADC1 AH7 AF7 AI AI PCIe interface PCIe_REFCLK_P B22 PCIe_REFCLK_M A21 PCIe_TX0_M PCIe_TX0_P PCIe_TX1_M PCIe_TX1_P PCIe_RX0_M PCIe_RX0_P PCIe_RX1_M PCIe_RX1_P PCIe_CLKREQ PCIe_WAKE B18 A17 B20 A19 A25 B26 A23 B24 C21 C25 AIO AIO AO AO AO AO AI AI AI AI DIO DI P3 P3 Module reset the external codec active low Soft Default not supported For EBI LCD_backlight_contrl Required 85 differential impedance Analog to digital converter input0 Analog to digital converter input1 PCIe reference clock plus PCIe reference clock minus PCIe transmit0 minus PCIe transmit0 plus PCIe transmit1 minus PCIe transmit1 plus PCIe receive0 minus PCIe receive0 plus PCIe receive1 minus PCIe receive1 plus PCIe clock request input low CLKREQ and WAKE PCIe wake-up input low need pull up to VDD_EXT externally;

When there is an external level conversion chip, CLKREQ,WAKE, RST all need to be pulled up Default as RC mode PCIe_RST C23 DO P3 PCIe reset output low www.simcom.com 23 / 122 W82 control interface2 WL_SW_CTRL K49 SDX_TO_WL_CTI M49 WL_TO_SDX_CTI L47 WL_PA_MUTING H45 SLEEP_CLK BT_EN WL_EN WL_LAA_RX J51 N51 K45 J47 WL_LAA_AS_EN L51 DI DO DI DO DO DO DO DO DO DO P3 P3 P3 P3 P3 P3 P3 P3 P3 SIM8260A_Hardware Design_V1.05 W82 switch control W82 GPIO W82 GPIO WLAN XFEM control for PA mute Sleep clock output for W82 only W82 BT enable WLAN enable If unused, please keep open If unused, please PD 10k WLAN XFEM control for LAA receiver WLAN LAA AS enable SIM8260C not support LAA, unused please PD 10k to GND COEX_UART_TX D COEX_UART_RX D WL_TXEN_TO_N 79 N79_TO_WL_TXE N BA7 BA9 DI P3 BA37 DI P3 BA29 DO P3 LTE&WLAN data transmit LTE&WLAN data receive coexistence coexistence From Module N79 to the W82 From the W82 to Module N79 From Module to the W82 WL_LAA_TX_EN R51 DO P3 WL_TX_EN AY14 DI P3 From the W82 to Module LTE coexistence signals N79 and WIFI coexistence signals SIM8260E/A unused, please keep open SIM8260C/E/A unused, please keep open SIM8260C unused, please keep open SDIO interface SDIO_VDD3 SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3 SDIO_CMD SDIO_CLK SDIO_VDD_EN F7 B1 C1 D3 F3 G5 E5 H7 PI 1.8/3. 0V DIO P2 Power input for internal SDIO circuit SDC data bit 0 or eMMC data bit 0 DIO P2 DIO P2 DIO P2 DIO DO DO P2 P2 P3 SDC data bit 1 or eMMC data bit 1 SDC data bit 2 or eMMC data bit 2 SDC data bit 3 or eMMC data bit 3 SDC command output SDC clock output Enable the SD card power or eMMC data bit 4 SD card insertion detect or eMMC data bit 5 Required 45 impedance and length match<1mm Layout bus length

<15mm(208MHZ)

<100mm(50MHZ) SD card can support 1.8V/3.3V, but eMMC only support 1.8V SDIO_DET E1 DI P3 www.simcom.com 24 / 122 GPIO100 GPIO101 H3 K7 DIO DIO RESOUT_N AW17 DO EBI2 interface EBI2_AD_0 EBI2_AD_1 EBI2_AD_2 EBI2_AD_3 EBI2_AD_4 EBI2_AD_5 EBI2_AD_6 EBI2_AD_7 EBI2_WE_N EBI2_ CLE EBI2_RE_N EBI2 _CS mmW interface A33 A39 B34 B38 C39 B36 B40 A37 A35 A31 B32 AH3 DO DO DO DO DO DO DO DO DO DO DI DI IFH1 AR51 AIO P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 IFH2 AG51 AIO IFH3 AL51 AIO IFH4 AC51 AIO IFV1 AM45 AIO SIM8260A_Hardware Design_V1.05 Required 50 impedance, Standard software not supported EBI2 interface The EBI2 interface and the internal NAND of the module share the interface, there can be no pull-up or pull-down externally, and the external length is preferably less than 100mm If unused, please keep open eMMC data bit 6 eMMC data bit 7 eMMC RST_N EBI2 data0 EBI2 data1 EBI2 data2 EBI2 data3 EBI2 data4 EBI2 data5 EBI2 data6 EBI2 data7 EBI2_WE_N EBI2_ CLE EBI2_RE_N EBI2_LCD_CS Horizontal polarization IF output signal and control signal for mmW RFIC device 1 Horizontal polarization IF output signal and control signal for mmW RFIC device 2 Horizontal polarization IF output signal and control signal for mmW RFIC device 3 Horizontal polarization IF output signal and control signal for mmW RFIC device 4 Vertical polarization IF output signal and local oscillator (LO) signal for mmW RFIC device 1 Vertical polarization IF output signal and local oscillator (LO) signal for mmW RFIC device 2 AT45 AIO IFV2 IFV3 AK45 AIO Vertical polarization IF output www.simcom.com 25 / 122 SIM8260A_Hardware Design_V1.05 IFV4 AP45 AIO QTM0_PON AT49 DO P3 QTM1_PON AH49 DO P3 QTM2_PON AF49 DO P3 QTM3_PON AP49 DO P3 signal and local oscillator (LO) signal for mmW RFIC device 3 Vertical polarization IF output signal and local oscillator (LO) signal for mmW RFIC device 4 Power on/reset 0 for QTM module Power on/reset 1 for QTM module Power on/reset 2 for QTM module Power on/reset 3 for QTM module QTM_THERM AW19 AI QTM thermal detect GPIO interface GPIO106 GPIO47 GPIO105 GPIO31 GPIO102 GPIO107 GPIO82 GPIO83 GPIO88 GPIO96 AY10 AE5 D38 C29 D36 U1 V3 Y3 AG5 AM7 DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Only QTM547 support thermal detect If unused, please keep open PMU_GPIO6 Antenna control interface4 AP7 DIO RFFE0_CLK BA11 DO RFFE0_DATA BA13 DIO ANT_CTRL0 ANT_CTRL1 ANT interface BA15 AY16 DO DO GNSS ANT AY1 AI SIM8260A Module ANT0 AL1 AIO 1.8V Used for GPIO P3 P3 P3 P3 Antenna tuner MIPI CLK Antenna tuner MIPI DATA Antenna tuner control0 Antenna tuner control1 Required 50 impedance Receiving GNSS signals 1166MHz~1229MHz 1565MHz~1610MHz 4G/5G LB/MHB TX0/DRX, 5G N41/77/78/79 617MHz~894MHz 1710MHz~2690MHz www.simcom.com 26 / 122 SIM8260A_Hardware Design_V1.05 TX0/DRX_MIMO 4G/5G MHB DRX_MIMO, 5G N77/78/79 DRX 4G LAA DRX 4G/5G MHB PRX_MIMO, 5G N77/78/79 PRX_MIMO, 4G LAA PRX 4G/5G LB TX1/PRX, 5G MHB TX1/DRX, 5G N41/77/78/79 TX1/PRX 3300MHz~5000MHz 1930MHz~2690MHz 3300MHz~5925MHz 1930MHz~2690MHz 3300MHz~5925MHz 617MHz~894MHz 1710MHz~2690MHz 3300MHz~5000MHz BA25 AI BA33 AI BA47 AIO BA41, AY51, BA19, B30, A29, D32, D30, D34, T45, P45, W1 Reserved for future use ANT1 ANT2 ANT3 RFU PIN RFU MARK D9 NOTE PIN used module, keep it externally inside the floating 1. The I2C signals need pull up to VDD_EXT by 2.2K resistors out of the module. 2. Only used to W82 and PM7250B pins dont use as other circuits. 3. If not use SDIO function, the SDIO_VDD pin should connect to VDD_EXT out of the module. 4. Please confirm with SIMCom for the detail design about Antenna control interface. 5. * means under development, for more information, please connect the SIMCom FAE support team. RFU pins should keep open. Recommend add ESD protect components to the interface that is touched by human hands. (e. g. SIM/SD/USB/BUTTOM/ANT) The GPIO MAX voltage is 2.1V, if exceeded, may cause permanent damage to the module. All GND pins should be connected to the customers main PCB. For SIM8260A module BA37 RFU. 2.3 Mechanical Dimensions The following figure shows the mechanical dimensions of SIM8260A. www.simcom.com 27 / 122 SIM8260A_Hardware Design_V1.05 Figure 3: Dimensions of SIM8260A (unit: mm) www.simcom.com 28 / 122 SIM8260A_Hardware Design_V1.05 3 Interface Application 3.1 Power Supply The recommended power supply for SIM8260A is 3.8V and the voltage range from 3.3V to 4.4V. It is necessary to ensure that the voltage of VABT cannot be lower than 3.3V after the maximum voltage drop. the module will be powered off automatically. The max voltage is not higher than 4.4V, otherwise the module may be permanently damaged. The module has 3 BB power pins, 7 RF power pins and 10 power ground pins, to ensure the module works normally, all power and ground pins should be connected. Table 8: VBAT pins electronic characteristics Symbol Description Min. Typ. Max. Unit Module power supply voltage 3.3 3.8 Peak current Peak current at maximum power Peak current at maximum power Current in sleep mode Current in power off mode

4.5 135 4.4 1.8 1.0 TBD

V A A A mA uA VBAT1 Ipeak Ipeak (QTM545) Ipeak (QTM547) Isleep Ileakage NOTE 1. The VBAT include VBAT_BB and VBAT_RF pins in this document. 2.If the customer uses the charging chip PM7250B and the software with charging function, when the power supply voltage is lower than 3.3V, the module will not be powered on. If the customer wants o power on the module, the charger must be plugged in. 3.1.1 Power Supply Design Guide When B2(20MHz) and N79(100MHz) ENDC combination are connected under the instrument, the peak current can reach to 1.8A at 3.8V power supply. In order to ensure that the VBAT voltage is no less than required 3.3V when the module at maximum power radio transmission, and considering the voltage drop and conversion efficiency, it is strongly recommended that the DC-DC or LDO output capacity should not be less than 3A. www.simcom.com 29 / 122 This chapter is under development. The indicated peak power consumption data is an estimated value, not the final measured data. The data will be supplemented by subsequent versions. SIM8260A_Hardware Design_V1.05 Figure 4: Power consumption at ENDC combination of B2 (20MHz) and N79 (100MHz) NOTE Test conditions The total capacitors of VBAT net are not less than 640uF. The peak current is only the current consumption of the module, dont include the current consumption of other devices outside the module. The Ipeak and voltage drop data in Table and Figure above were tested using SIMCom EVB and connecting instrument at 3.8V power supply, the ENDC combination is B2 (20MHz) and N79

(100MHz), subcarrier spacing is 30KHz. The B2 (20MHz) and N79 (100MHz) ENDC combination is the max power consumption of the module. When WLAN and Ethernet functions are added according to SIMCOM's reference design, the peak current of the entire system can reach 2.6A. For ensure the normal operation of the module and peripherals, it is strongly recommended that the DC-DC or LDO output capacity is not less than 3A. Figure 5: Power consumption of entire systeam NOTE www.simcom.com 30 / 122 Test conditions The above current consumption data is measured using SIMCOM EVB. The test current consumption data includes SIM8260A module, SIMCom WLAN module W82 and Ethernet PHY RTL8125B, to be added in subsequent versions. SIM8260A_Hardware Design_V1.05 To decrease the voltage dropping, make sure that the capacitors of VBAT net must not less than 640uF. The following figure shows the reference circuit of power supply for the VBAT. Figure 6: Power supply reference circuit Table 9: Definition of VBAT and GND pins Pin name Pin no. Electrical description Description Comment VBAT_BB VBAT_RF GND PI PI VMAX=4.4V VTYP =3.8V VMIN=3.3V VMAX=4.4V VTYP =3.8V VMIN=3.3V Input power supply for modules BB part V45, V49, U47 Y49, AC47, AA47, W47, AD45, AB45, Y45 A7,B8,A11,B12,C15,A15,B16,C17,C19,D22,D24,D26,C27,A27,B28,D28,C31,C33, C35,C37,D40,A41,B42,J5,AD7,AJ1,AK3,AM3,AN1,AN5,AP3,AR1,AR5,AT3,AT7,A U1,AU5,AV3,AW1,R47,T49,U51,W51,AA51,AB49,AD49,AE47,AF45,AH45,AG47,A J47,AL47,AN47,AR47,AU47,AV49,AW51,AV10,AV12,AV14,AV16,AV18,AV20,AV2 2,AV24,AV26,AV28,AV30,AV32,AV34,AV36,AV38,AV40,AV42,AW9,AW11,AW13, AW15,AW23,AW25,AW27,AW29,AW31,AW33,AW35,AW37,AW39,AW41,AW43,A Y6,AY8,AY12,AY18,AY20,AY22,AY24,AY26,AY28,AY30,AY32,AY34,AY36,AY38,A Y40,AY42,AY44,AY46,BA5,BA17,BA21,BA23,BA27,BA31,BA35,BA39,BA43,BA45, Input power supply for modules RF part www.simcom.com 31 / 122 SIM8260A_Hardware Design_V1.05 AM13,AM17,AM21,AM24,AM27,AM31,AM35,AM39,AH13,AH17,AH21,AH24,AH27, AH31,AH35,AH39,AE13,AE17,AE21,AE24,AE27,AE31,AE35,AE39,AA13,AA17,AA 21,AA24,AA27,AA31,AA35,AA39,U13,U17,U21,U24,U27,U31,U35,U39,P13,P17,P 21,P24,P27,P31,P35,P39,K13,K17,K21,K24,K27,K31,K35,K39,A1,B4,C7,A51,B48, C45,BA1,AY4,AW7,BA51,AY48,AW45,AM49,AK49,AE51,AJ51,AN51,AU51 NOTE Both C1 and C5 are 220 F tantalum capacitor (ESR=0.7). C3, C4, C7 and C8 are multi-layer ceramic chip (MLCC) capacitors from 33pF to 1uF with low ESR in high frequency band, which can be used for EMC performance. D1 is used for surge protection. Pins AF45, AE47, AD49, AB49, AA51, AD49, W51, U51, T49 and R47 of GND are the main ground for power return. Table 10: Recommended D1 list Name D1 Manufacturer LRC Prisemi Part number LEDZ5.1BT1G PZ5D4V2H Power supply layout guidelines:

Both VBAT and return path should be as short and wide as possible to minimize the voltage drop. The width of VBAT_BB trace should be no less than 1.5mm, and the width of VBAT_RF trace should be no less than 2mm. ESR<20m These capacitors should be placed as closely as possible to the VBAT_BB and VBAT_RF pins. The VBAT trace should pass through Zener diode and capacitors, and then pass through the VBAT pins. The small value capacitors should be placed close to the VBAT pins. The customers PCB design must have a solid ground plane throughout the board as the primary reference plane for most signals. 3.1.2 Recommended Power Supply Circuit It is recommended to use a switching mode power supply or a linear regulator power supply. Make sure it can provide the current up to 3A at least. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output. www.simcom.com 32 / 122 SIM8260A_Hardware Design_V1.05 Figure 7: Linear regulator reference circuit NOTE An extra minimum load of R3 is required, to ensure it work properly under light load in sleep mode and power off mode. For the details about minimum load, please refer to specification of MIC29502WU. Table 11: Recommended power chip list Name U1 Manufacturer MICREL Model MIC29502WU The following figure shows the switching mode power supply reference circuit with 5~12V input and 3.8V output. Figure 8: Switching mode power supply reference circuit The following figure shows the switching mode power supply reference circuit with 8.8~16V input and 3.8V output. www.simcom.com 33 / 122 SIM8260A_Hardware Design_V1.05 Figure 9: Switching mode power supply reference circuit for mmW NOTE In order to avoid damaging the module, please do not switch off the power supply when module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. It is suggested that customer's design should have the ability to switch off the power supply for module in abnormal state, and then switch on the power to restart the module. The PWR_CTRL signal recommend connect to the host and can be controlled. Table 12: Recommended chip list Name Ferrite bead Manufacturer Sunlord Power inductor Coilcraft 3.1.3 Voltage Monitor Model UPZ1608E300-5R0TF XAL1010-451ME To monitor the VBAT voltage, the AT command AT+CBC can be used. NOTE For more details about voltage monitor commands, please refer to Document [1] in the appendix. www.simcom.com 34 / 122 SIM8260A_Hardware Design_V1.05 3.2 Power On and Off Module 3.2.1 Power On Drive the PWRKEY pin to a low level and hold it for 2 seconds, then release, the module will be powered on. This pin is already pulled up internally. The power on timing and electrical characteristics are listed in the following table, and the following figure shows the power on circuit. Figure 10: Power on the module use button Figure 11: Power on the module use GPIO drive Table 13: Definition of PWRKEY pin Pin name Pin no. Electrical description PWRKEY A45 DI Description Comment Power on/off the module, active low www.simcom.com 35 / 122 The power on sequence is shown in the following figure. SIM8260A_Hardware Design_V1.05 Figure 12: Power on sequence Table 14: Power on timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit Twait Ton T1 The waiting time from power supply available to power-on action The time of holding on PWRKEY pin to a low level The time from power-on action to VDD_EXT ready Ton(usb) The time from power-on action to USB port ready Ton (STATUS) The time from power-on action to STATUS ready VIH VIL Input high level voltage on PWRKEY pin Input low level voltage on PWRKEY pin 100 2

1.1 0

11.45 12 20 55

2.1 0.3 ms s ms s s V V NOTE After enter force download mode, the PWRKEY pin need to release and dont pull low always. If not, the module will restart and then cause the download fail. The timing of Ton(usb) and Ton (STATUS) is related to the module software. The time here is based on the standard version test and is for reference only. 3.2.2 Power Off The following methods can be used to power off the module. Method 1: Power off the module by holding the PWRKEY to a low level two second then release. Method 2: Power off the module by AT command AT+CPOF. www.simcom.com 36 / 122 SIM8260A_Hardware Design_V1.05 NOTE If the temperature is outside the range of -30~+70C, some warning will be reported via AT port. If the temperature is outside the range of -40~+85C, module will be powered off automatically. For details about AT+CPOF, please refer to Document [1] in the appendix. Normal power off action will make the module disconnect from the network, allow the software entered a safe state, and save key data before the module is powered off completely. The power off sequence is shown in the following figure. Figure 13: Power off sequence Table 15: Power off timing and electronic characteristic Parameter Description The time of holding on PWRKEY pin to a low level The time from power-off issue to USB port off The time from power-off issue to STATUS off Toff Toff(usb) Toff(status) NOTE Time value Min. Typ. Max. 2

3.5 2.1

Unit s s s After pressing the PWRKEY button, you must wait for 12S to disconnect the power supply or press the PWRKEY again to turn on the module, otherwise it may damage the module or fail to turn on module. The timing of Toff(usb)and Toff(status) is related to the module software. The time here is based on the standard version test and is for reference only. www.simcom.com 37 / 122 SIM8260A_Hardware Design_V1.05 3.3 Reset Function Module can be reset by driving the RESIN_N pin down to a low level. The RESIN_N signal has been internally pulled up to 1.8V, so there is no need to pull it up externally. Please refer to the following figure for the recommended reference circuit. Figure 14: Reset the module use GPIO drive Figure 15: Reset the module use button Table 16: Definition of RESIN_N pin Pin name Pin no. Electrical description Description Comment RESIN_N A43 DI P3 Reset the module, active low The reset timing sequence of the module is shown in the following figure. www.simcom.com 38 / 122 SIM8260A_Hardware Design_V1.05 VBAT RESIN_N Module state T reset 600ms 300ms 0V VIL 0.4V 1.2V VIH 1.9V Running Reseting Restar Figure 16: The reset timing sequence of the module Table 17: RESET electronic characteristics Symbol Description The time of holding on RESIN_N pin to a low level Input high level voltage Input low level voltage Treset VIH VIL NOTE Please ensure that there is no capacitance on RESIN_N pin. Min. Typ. Max. Unit 300 1.2 0

600 1.9 0.4 ms V V 3.4 Output Power Management Table 18: Output power management summary Pin name Pin no Typical voltage (V) Rated current (mA) Sleep state Comment VDD_EXT AL5 1.8 VREG_1P3 M45 1.28 VREG_0P9 P49 0.88 VREG_1P9 N47 1.88 L10E_3P1 C41 3.08 VIO_OUT D42 1.8 50 500 1500 500 30 0.2 LPM retention off retention off on Output power supply for external IO pull up circuits Output power supply for W82 only Output power supply for W82 only Output power supply for W82 only Output power supply for PM7250B USB PD-PHY and USB switch Output power supply for PM7250B IO circuit only www.simcom.com 39 / 122 SIM8260A_Hardware Design_V1.05 3.4.1 VDD_EXT Reference Circuit The following figure is the reference circuit diagram of the VDD_EXT pin periphery of the module. Figure 17: Module VDD_EXT peripheral reference circuit NOTE It is recommended to place a TVS protection tube near the VDD_EXT pin of the module to protect the module pins. The recommended TVS models are shown in the following table. It is recommended to connect a 2.2R resistor in series with the VDD_EXT pin close to the module for ESD protection. Table 19: Module VDD_EXT pin protection tube TVS recommended materials package NO. Manufacturer Model Operating Voltage 3.3V ESD9L5.0ST5G RC0402JR072R2L

SOD-923 0402 Name D1 R1 1 2 ON YAGEO 3.5 USB Interface SIM8260A has one USB controllerwhich complies with USB3.1 and USB2.0 specifications. The high-speed PHY and super-speed PHY share the same USB 3.1 Gen2 controller, customers can choose USB3.1 or USB2.0 for their needs. USB3.1 Gen2 data rate is up to 10Gbps. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. SIM8260A supports USB suspend and resume mechanism, which can save power consumption. If there is no data transmission on the USB bus, module will enter suspend mode automatically. The following figure is the USB reference circuit. www.simcom.com 40 / 122 SIM8260A_Hardware Design_V1.05 Figure 18: Type-C USB reference circuit with PM7250B www.simcom.com 41 / 122 Figure 19: Type-C USB reference circuit with CC detector SIM8260A_Hardware Design_V1.05 Figure 20: USB3.1 reference circuit Table 20: Definition of USB interface Pin characteristics Functional description Comment Pin name USB_VBUS USB_HS_DP Pin no. C9 B6 AI AIO USB_HS_DM A5 AIO USB_SS_TX_P A13 AO USB_SS_TX_M B14 AO USB_SS_ RX_P B10 USB_SS_RX_M A9 USB_ID C11 AI AI DI OTG_EN D10 DO P3 P3 USB VBUS detection Not support charge Differential USB bi-directional data plus Differential USB bi-directional data minus USB3.1 super-speed transmit data plus USB3.1 super-speed transmit data minus USB3.1 super-speed receive data plus USB3.1 super-speed receive data minus USB ID USB OTG power supply DC-DC enable signal Required 85 differential impedance Compliant with USB 2.0 standard specifications Required 85 differential Impedance Compliant with USB 3.1 standard specifications Standard software not supported www.simcom.com 42 / 122 SIM8260A_Hardware Design_V1.05 USB_SS_SW C13 DO P3 USB Type-C switch control signal Table 21: Recommended CC detector list Name CC Detector Manufacturer PERICOM Model PI5USB30216D Table 22: Recommended SS USB switch list Name USB Switch Manufacturer PERICOM Model PI3DBS12212A Table 23: Recommended OTG 5V DC-DC and USB interface TVS list Name OTG TVS Manufacturer AWINIC WILL Model AW3605DNR ESD5302N-3/TR Please refer to the reference design for the design circuit diagram of OTG. HS USB DP/DM layout guidelines:

Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than 1mm. Gap from other signals keeps 3xline width. External TVS or EMI components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, audio, and XO). Maximum PCB trace length cannot exceed 100mm outside of module, the shorter trace and better. SS USB TX/RX layout guidelines:

Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than 500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. External TVS or EMI components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, especially 2.4 GHz). Route differential pairs in the inner layers with a solid GND reference to have good impedance control and to minimize discontinuities. Keep isolation between the Tx pair, Rx pair, and DP/DM to avoid crosstalk. If core vias are used, use no more than two core vias per signal line to limit stubs. www.simcom.com 43 / 122 SIM8260A_Hardware Design_V1.05 3.6 PCIe Interface SIM8260A support PCIe Gen3 2-lane or PCIe Gen4 1-lane interfaces, which can be used as EP or RC mode. PCIe3 data rate up to 8Gbps per lane, PCIe4 data rate up to 16Gbps per lane. The following figure is the PCIe reference circuit. Figure 21: PCIe interface reference circuit (RC) Figure 22: PCIe interface reference circuit (EP) NOTE www.simcom.com 44 / 122 SIM8260A_Hardware Design_V1.05 The 220nF AC capacitors should be placed near the PCIe_TX Table 24: Definition of PCIe interface Pin name Pin no. Pin characteristics PCIe_REFCLK_P B22 AIO PCIe_REFCLK_M A21 AIO PCIe_TX0_M PCIe_TX0_P PCIe_TX1_M PCIe_TX1_P PCIe_RX0_M PCIe_RX0_P PCIe_RX1_M PCIe_RX1_P PCIe_CLKREQ PCIe_WAKE B18 A17 B20 A19 A25 B26 A23 B24 C21 C25 AO AO AO AO AI AI AI AI DI DI P3 P3 Functional description PCIe reference clock plus PCIe reference clock minus PCIe transmit0 minus PCIe transmit0 plus PCIe transmit1 minus PCIe transmit1 plus PCIe receive0 minus PCIe receive0 plus PCIe receive1 minus PCIe receive1 plus PCIe clock request PCIe wake-up PCIe_RST C23 DO P3 PCIe reset Comment Required 85 differential impedance PCIe_CLKREQ and PCIe_WAKE need pull up to VDD_EXT externally, Default as RC mode PCIe interface layout guidelines:

All other sensitive/high-speed signals must be far away PCIe signals. PCIe signals must be protected be far away noisy signals (clocks, SMPS). Each trace needs to be adjacent to a ground plane. Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. Maximum PCB trace length cannot exceed 150mm outside of module, the shorter trace and better. 3.6.1 PCIe for W82 PCIe Gen3 lane0 can be connected to W82 as WLAN data interface, SIM8260As module serves as RC and W82 module serves as EP. PCIe_CLKREQ and PCIe_WAKE already be pulled up to 1.8V in W82. The details design please refer to the reference circuit document. The following figure is the PCIe www.simcom.com 45 / 122 reference circuit. SIM8260A_Hardware Design_V1.05 Figure 23: PCIe interface reference circuit (RC) for W82 NOTE The PCIe control signal voltage domain of the module and W82 are 1.8V. For more details about W82, please refer to Document [20] in the appendix. Table 25: Recommended W82 list Name W82 Manufacturer SIMCOM Model S2-10ADA 3.6.2 PCIe for RTL8125B PCIe Gen3 lane0 can be connected to RTL8125B-TE as Ethernet data interface. SIM8260A module serves as RC and RTL8125B-TE serves as EP. Need to pull up PCIe_CLKREQ, PCIe_WAKE, PCIe_RST from module to 3.3V. The details design please refer to the reference circuit document. The following figure is the PCIe reference circuit. www.simcom.com 46 / 122 SIM8260A_Hardware Design_V1.05 Figure 24: PCIe interface reference circuit (RC) for RTL8125B NOTE The 220nF AC capacitors should be placed near the PCIe_TX The PCIe control signal voltage domain of the module is 1.8V, through the level shifter, the RTL8125B is 3.3V. For more details about RTL8125B, please refer to Document [17] in the appendix. Table 26: Recommended RTL8125B and RJ45 list Name RTL8125B RJ45 Manufacturer REALTEK ZhengGu Model RTL8125B-CG RJ45-114B4DZ-G020 3.6.3 PCIe Switch When PCIe switch is added, the module can use W82 and others such as AQR113* at the same time. The details design please refer to the QPS615 reference circuit document. The following figure is the PCIe reference circuit. www.simcom.com 47 / 122 SIM8260A_Hardware Design_V1.05 Figure 25: PCIe switch reference circuit NOTE The 220nF AC capacitors should be placed near the PCIe_TX

* means under development. Table 27: Recommended PCIe SWITCH list Name PCIe Switch Manufacturer Qualcomm PCIE clock buffer Diodes W82 module SIMCom Model QPS615 PI6CBF18501ZLAIEX-13R S2-10ADA www.simcom.com 48 / 122 AQR113 QEP8121 RTL8211 MARVELL Qualcomm REALTEK SIM8260A_Hardware Design_V1.05 AQR113C-B0-C QEP-8121-1-56MQFN-**-02-0 RTL8211F-CG 3.6.4 PCIe interface for Qualcomm IPQxxxx PCIe connected to qualcomm IPQxxxx is designed to be used as CPE application, the module does EP and the qualcomm IPQxxxx does RC. Since the PCIe_WAKE, PCIe_RST, and PCIe_CLKREQ control signals of IPQxxxx are in the voltage domain of 1.8V, on the module side, CLKREQ# and PEWAKE# need to be pulled up to 1.8V externally through 100KR. The following figure is a schematic diagram of the module connected to IPQxxxx. Figure 26: Schematic diagram of module connected to IPQxxxx 3.7 SDIO Interface SIM8260A provide 8-bit SDIO interface, which meets the SDIO3.0 specifications and supports SDIO host mode. The clock output up to 200MHz for SD card, and up to 100MHz for eMMC. Support 4-bit dual-voltage 1.8V or 3.0V SD card or 8-bit 1.8V eMMC. The SD card and the eMMC reference circuits are shown below. www.simcom.com 49 / 122

SIM8260A Hardware Design 5G Module 5G Module SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: 86-21-31575100 support@simcom.com www.simcom.com SIM8260A_Hardware Design_V1.05 Document Title:

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GENERAL NOTES SIM8260A_Hardware_Design 1.05 2022-09-05 Release SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMERS POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMERS SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE. COPYRIGHT THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT, ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY TECHNICAL INFORMATION INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE AT ANY TIME. SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: +86 21 31575100 Email: simcom@simcom.com For more information, please visit:

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Contact Us (simcom.com)or email to: support@simcom.com Copyright 2021 SIMCom Wireless Solutions Limited All Rights Reserved. www.simcom.com 2 / 122 SIM8260A_Hardware Design_V1.05 Version History Date Version Description of change 2021-9-27 1.00 Release 2021-11-26 1.01 2021-12-29 1.02 2022-03-02 1.03 1.Correct the PIN H39 to AH39 in table 5 2.Change some information about the baud rate frequency band supported by the serial port in the NOTE of 3.11 UART Interface. 3.Delete the PIN BA29 of the GND column in Table 5. 4.Add the power consumption current 120uA of the Power off mode in Table 62. 5. Change PIN W1 to RFU and PIN AM7 to GPIO, correct the information about ant interface in table 5 6.Add information about the conditions for the software with chip PM7250B to start up at 3.3V in the note of 3.1 Power Supply. 7.Correct some information about Frequency bands of SIM8260E and SIM8260A in the table, and data transmission throughput of 5G NR in table2. 8.Add the GPIO88 PIN in the GPIO row of Table 5, and add the EBIN2 interface in Table 5. 9.Delete the used RFU PIN, and modify the Pin assignment of Figure 2 accordingly. 1. Change table 61 GPIO66 not support INT 2. Module pin AH3 change PIN name to RFU, table5, table42 delete this PIN description and change figure2 of the pin assignment of the module. 3.table 5 add notice for EBI2 interface 4.Exchang table5, table49 SIM8260C module ANT1 and ANT2 ant description 1. Change Figure 2 pin BA25 TO ANT1, BA33 to ANT2 2. Change table 44 3G net night to 200ms ON/OFF 3. Chane Table 62 power consumption current 135uA of the Power off mode and RF max power 4. Change the definition of GNSS antenna in table5/49/50 5. Updated Figure 46 and 47 6. Updated Figure 50 7. Change PIN AH3 GPIO90 for EBI2_CS Author Yaling Wang Yi Zheng Chen Cheng Tao yu Yi Zheng Chen Cheng Yaling Wang Yi Zheng Yaling Wang 2022-05-07 1.04 1.Change the document name to SIM82X0X and Yaling Wang www.simcom.com 3 / 122 2022-09-05 1.05 SIM8260A_Hardware Design_V1.05 Shaoxu Hou SIM83X0X_Series_Hardware Design 2.Add SIM8360A, SIM8380A and SIM8280A information 3.change table 6: about ANT Pin Frequency Range 4.change Table 13 Power on timing and electronic characteristic and add note 5.change chapter 3.8 about (u)SIM socket model 6.add chapter 3.21 about mmW interface 7.add chapter 6.7 about baking conditions Shaoxu Hou Zhongxi Xiang Increase the minimum output current capability 1. Changed Table about mmW recommended connector type 2. Modify Table, add SIM8380E module information 3. Modify Table, modify the main frequency of the application processor, and add the module weight information 4. Add lines of Ipeak (QTM) related information to the content of Table 5. requirement of external DCDC for mmW modules 6. Add module VDD_EXT peripheral reference circuit 7. Changed the content of the PCIe switch chapter, and changed the corresponding recommended material table 8. Add PCIe interface for IPQxxxx related content 9. Change the Codec ALC5616 special attention content 10. Supplement table content of W_DISABLE pin description 11. Change module Figure 12. Increase the content that PCIe_RST needs to be pulled up 13. The ID resistance of reference circuit is changed from 100K to 200K 14. Modify the description of pin AF3(SLEEP_OUT) 15. The data transfer throughput of different modules is changed to a table representation 16. Add the antenna port definition table of SIM8380E 17. Modify the Ipeak,Ton (STATUS)value 18. Change the description of module pin D9 19. Added chip junction temperature table in thermal design chapter the PM7250B interface www.simcom.com 4 / 122 SIM8260A_Hardware Design_V1.05 Contents Version History .................................................................................................................................................. 3 Contents ............................................................................................................................................................ 5 Table Index ........................................................................................................................................................ 7 Figure Index .......................................................................................................................................................9 1 Introduction ................................................................................................................................................ 11 1.1 Product Outline ................................................................................................................................... 11 1.2 Hardware Block Diagram ....................................................................................................................13 1.3 Feature Overview ............................................................................................................................... 14 2 Package Information ................................................................................................................................. 16 2.1 Pin Assignment Overview ...................................................................................................................16 2.2 Pin Description ....................................................................................................................................18 2.3 Mechanical Dimensions ......................................................................................................................27 3 Interface Application .................................................................................................................................. 29 3.1 Power Supply ......................................................................................................................................29 3.1.1 Power Supply Design Guide ..................................................................................................... 29 3.1.2 Recommended Power Supply Circuit ....................................................................................... 32 3.1.3 Voltage Monitor ..........................................................................................................................34 3.2 Power On and Off Module .................................................................................................................. 35 3.2.1 Power On ...................................................................................................................................35 3.2.2 Power Off ...................................................................................................................................36 3.3 Reset Function ....................................................................................................................................38 3.4 Output Power Management ............................................................................................................... 39 3.4.1 VDD_EXT Reference Circuit .....................................................................................................40 3.5 USB Interface ......................................................................................................................................40 3.6 PCIe Interface ..................................................................................................................................... 44 3.6.1 PCIe for W82 ............................................................................................................................. 45 3.6.2 PCIe for RTL8125B ................................................................................................................... 46 3.6.3 PCIe Switch ............................................................................................................................... 47 3.6.4 PCIe interface for Qualcomm IPQxxxx ..................................................................................... 49 3.7 SDIO Interface .................................................................................................................................... 49 3.8 (U)SIM Interface ..................................................................................................................................52 3.9 I2S Interface ........................................................................................................................................54 3.9.1 I2S Timing ..................................................................................................................................54 3.9.2 I2S Reference Circuit ................................................................................................................ 55 3.10 I2C Interface ..................................................................................................................................... 57 3.11 UART Interface ..................................................................................................................................58 3.12 SPI Interface ..................................................................................................................................... 60 3.13 ADC Interface ....................................................................................................................................61 3.14 WLAN/BT Interface ...........................................................................................................................62 www.simcom.com 5 / 122 SIM8260A_Hardware Design_V1.05 3.15 PM7250B Interface ........................................................................................................................... 64 3.16 GPIOs Interface ................................................................................................................................ 66 3.17 Network Status ..................................................................................................................................67 3.18 Flight Mode Control .......................................................................................................................... 68 3.19 TDD_SYNC_PPS ............................................................................................................................. 69 3.20 Antenna Control Interface* ............................................................................................................... 70 4 Antenna Interfaces .....................................................................................................................................71 4.1 Antenna Definitions .............................................................................................................................71 4.1.1 3G/4G/5G Operating Frequency ...............................................................................................72 4.1.2 GNSS Frequency ...................................................................................................................... 73 4.2 Antenna Installation ............................................................................................................................ 74 4.2.1 PCB Layout Guidelines ............................................................................................................. 74 4.2.2 Antenna Tuner ........................................................................................................................... 74 4.2.3 Antenna Requirements ..............................................................................................................76 4.2.4 RF Plug Recommendation ........................................................................................................ 77 5 Electrical Specifications .............................................................................................................................79 5.1 Absolute Maximum Ratings ................................................................................................................79 5.2 Operating Conditions .......................................................................................................................... 80 5.3 Operating Mode .................................................................................................................................. 81 5.3.1 Operating Mode Definition ........................................................................................................ 81 5.3.2 Sleep Mode ............................................................................................................................... 82 5.3.3 Minimum Functionality Mode and Flight Mode .........................................................................82 5.4 Current Consumption ..........................................................................................................................83 5.5 RF Output Power ................................................................................................................................ 84 5.6 Conducted Receive Sensitivity .........................................................................................................102 5.7 Thermal Design .................................................................................................................................103 5.8 ESD ................................................................................................................................................... 104 6 Manufacturing .......................................................................................................................................... 105 6.1 Top and Bottom View of SIM8XX0X .................................................................................................105 6.2 Label Description Information ...........................................................................................................105 6.3 Recommended PCB Footprint ......................................................................................................... 106 6.4 Recommended SMT Stencil .............................................................................................................107 6.5 Recommended SMT Reflow Profile ................................................................................................. 108 6.6 Moisture Sensitivity Level (MSL) ...................................................................................................... 109 6.7 Baking Requirements ........................................................................................................................110 7 Packaging .................................................................................................................................................111 8 Appendix .................................................................................................................................................. 113 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface ............................................... 113 8.2 Related Documents .......................................................................................................................... 115 8.3 Terms and Abbreviations .................................................................................................................. 117 8.4 Safety Caution ...................................................................................................................................119 www.simcom.com 6 / 122 SIM8260A_Hardware Design_V1.05 Table Index Table 1 : SIM8260A frequency bands .......................................................................................................11 Table 2 : SIM8260Adata transfer throughput ...........................................................................................11 Table 3 : Key features ............................................................................................................................... 14 Table 4 : Pin differences of SIM8260A ..................................................................................................... 17 Table 5 : IO parameters definition ............................................................................................................ 18 Table 6 : DC parameters definition ........................................................................................................... 18 Table 7 : Pin description ............................................................................................................................19 Table 8 : VBAT pins electronic characteristics ......................................................................................... 29 Table 9 : Definition of VBAT and GND pins ..............................................................................................31 Table 10 : Recommended D1 list ............................................................................................................. 32 Table 11 : Recommended power chip list .................................................................................................33 Table 12 : Recommended chip list ........................................................................................................... 34 Table 13 : Definition of PWRKEY pin ....................................................................................................... 35 Table 14 : Power on timing and electronic characteristic .........................................................................36 Table 15 : Power off timing and electronic characteristic .........................................................................37 Table 16 : Definition of RESIN_N pin ....................................................................................................... 38 Table 17 : RESET electronic characteristics ............................................................................................ 39 Table 18 : Output power management summary .....................................................................................39 Table 19 : Module VDD_EXT pin protection tube TVS recommended materials ....................................40 Table 20 : Definition of USB interface ...................................................................................................... 42 Table 21 : Recommended CC detector list .............................................................................................. 43 Table 22 : Recommended SS USB switch list ......................................................................................... 43 Table 23 : Recommended OTG 5V DC-DC and USB interface TVS list .................................................43 Table 24 : Definition of PCIe interface ......................................................................................................45 Table 25 : Recommended W82 list ...........................................................................................................46 Table 26 : Recommended RTL8125B and RJ45 list ................................................................................47 Table 27 : Recommended PCIe SWITCH list .......................................................................................... 48 Table 28 : Definition of SDIO interface ..................................................................................................... 50 Table 29 : Recommended TVS and SD card socket list ..........................................................................51 Table 30 : (U)SIM electronic characteristics in 1.8V mode ((U)SIM_PWR=1.8V) .................................. 52 Table 31 : (U)SIM electronic characteristics 3.0V mode ((U)SIM_PWR=3.0V) ...................................... 52 Table 32 : Definition of (U)SIM interface .................................................................................................. 53 Table 33 : Recommended TVS and (U)SIM socket list ............................................................................53 Table 34 : I2S format .................................................................................................................................54 Table 35 : I2S timing parameters ..............................................................................................................55 Table 36 : The PCM interface is multiplexing with I2S interface ..............................................................56 Table 37 : Recommended audio list ......................................................................................................... 56 Table 38 : Definition of I2C interface ........................................................................................................ 57 Table 39 : Definition of UART interface .................................................................................................... 59 Table 40 : Definition of SPI interface ........................................................................................................ 60 www.simcom.com 7 / 122 SIM8260A_Hardware Design_V1.05 Table 41 : Definition of ADC interface ...................................................................................................... 61 Table 42 : ADC performance parameters .................................................................................................61 Table 43 : Definition of WLAN/BT interface ..............................................................................................62 Table 44 : Definition of PM7250B interface ..............................................................................................64 Table 45 : GPIO list ................................................................................................................................... 66 Table 46 : Definition of NET_STATUS pin ................................................................................................67 Table 47 : NET_STATUS pin status ......................................................................................................... 68 Table 48 : Definition of W_DISABLE pin .................................................................................................. 68 Table 49 : W_DISABLE pin status ............................................................................................................68 Table 50 : Definition of TDD_SYNC_PPS pin .......................................................................................... 69 Table 51 : Definition of antenna control interface through GPIOs ........................................................... 70 Table 56 : The Antenna port definitions of A SIM8260A .......................................................................... 71 Table 57 : 3G/4G band frequency ............................................................................................................ 72 Table 58 : NR band frequency .................................................................................................................. 72 Table 59 : GNSS frequency ...................................................................................................................... 73 Table 60 : 3G/4G/5G/GNSS antennas ..................................................................................................... 76 Table 61 : GNSS antenna (for dedicated GNSS antenna only)* ............................................................. 76 Table 62 : Electrical Specifications of 20449-001E-03 ............................................................................ 77 Table 63 : Absolute maximum ratings ...................................................................................................... 79 Table 64 : VBAT recommended operating ratings ................................................................................... 80 Table 65 : 1.8V digital I/O characteristics ................................................................................................. 80 Table 66 : Operating temperature .............................................................................................................80 Table 67 : Operating mode definition ....................................................................................................... 81 Table 68 : Current consumption on VBAT pins (VBAT=3.8V) ..................................................................83 Table 69 : Conducted output power ........................................................................................................84 Table 71 : Chip junction temperature table ............................................................................................ 103 Table 72 : The ESD performance measurement table (temperature: 25C, humidity: 45%) ................104 Table 73 : Label description of module information ............................................................................... 106 Table 74 : MSL ratings summary ............................................................................................................ 109 Table 75 : Baking requirements .............................................................................................................. 110 Table 76 : Tray size ................................................................................................................................. 111 Table 77 : Small carton size ....................................................................................................................112 Table 78 : Big carton size ........................................................................................................................112 Table 79 : Coding schemes and maximum net data rates over air interface ........................................ 113 Table 80 : Related documents ................................................................................................................ 115 Table 81 : Terms and abbreviations ........................................................................................................117 Table 82 : Safety caution .........................................................................................................................119 www.simcom.com 8 / 122 SIM8260A_Hardware Design_V1.05 Figure Index Figure 1 : Module block diagram .............................................................................................................. 13 Figure 2 : Pin assignment(Top View) ........................................................................................................16 Figure 3 : Dimensions of SIM8260A (unit: mm) ....................................................................................... 28 Figure 4 : Power consumption at ENDC combination of B2 (20MHz) and N79 (100MHz) .................... 30 Figure 5 : Power consumption of entire systeam .....................................................................................30 Figure 6 : Power supply reference circuit .................................................................................................31 Figure 7 : Linear regulator reference circuit ............................................................................................. 33 Figure 8 : Switching mode power supply reference circuit ...................................................................... 33 Figure 9 : Switching mode power supply reference circuit for mmW ...................................................... 34 Figure 10 : Power on the module use button ........................................................................................... 35 Figure 11 : Power on the module use GPIO drive ................................................................................... 35 Figure 12 : Power on sequence ............................................................................................................... 36 Figure 13 : Power off sequence ................................................................................................................37 Figure 14 : Reset the module use GPIO drive ......................................................................................... 38 Figure 15 : Reset the module use button ................................................................................................. 38 Figure 16 : The reset timing sequence of the module ............................................................................. 39 Figure 17 : Module VDD_EXT peripheral reference circuit ..................................................................... 40 Figure 18 : Type-C USB reference circuit with PM7250B ........................................................................41 Figure 19 : Type-C USB reference circuit with CC detector .................................................................... 42

...................................................................................................... 42 Figure 20 : USB3.1 reference circuit Figure 21 : PCIe interface reference circuit (RC) .....................................................................................44 Figure 22 : PCIe interface reference circuit (EP) ..................................................................................... 44 Figure 23 : PCIe interface reference circuit (RC) for W82 .......................................................................46 Figure 24 : PCIe interface reference circuit (RC) for RTL8125B .............................................................47 Figure 25 : PCIe switch reference circuit ................................................................................................. 48 Figure 26 : Schematic diagram of module connected to IPQxxxx .........................................................49 Figure 27 : SD card reference circuit ........................................................................................................50 Figure 28 : eMMC reference circuit .......................................................................................................... 50 Figure 29 : (U)SIM interface reference circuit .......................................................................................... 52 Figure 30 : I2S timing ................................................................................................................................55 Figure 31 : Audio codec reference circuit .................................................................................................56 Figure 32 : I2C reference circuit ............................................................................................................... 57

.............................................................................................. 58 Figure 33 : UART level conversion circuit

.........................................................................................58 Figure 34 : UART TX level conversion circuit Figure 35 : UART RX level conversion circuit

........................................................................................ 59

............................................................................................................. 60 Figure 36 : SPI reference circuit Figure 37 : SIM8260A and W82 connect circuit .......................................................................................62 Figure 38 : PM7250B interface diagram circuit ........................................................................................64 Figure 39 : NET_STATUS reference circuit ............................................................................................. 67 Figure 40 : W_DISABLE pin reference circuit ..........................................................................................68 www.simcom.com 9 / 122 SIM8260A_Hardware Design_V1.05 Figure 41 : TDD_SYNC_PPS pin reference circuit ..................................................................................69 Figure 43 : Aperture tuner reference block diagram ................................................................................ 74 Figure 44 : Impedance tuner reference block diagram ............................................................................75 Figure 45 : Hybrid tuner reference block diagram ................................................................................... 75 Figure 46 : LGA package Tuner mipi interface .........................................................................................75 Figure 47 : 3D view of 20449-001E-03 .................................................................................................... 77 Figure 48 : 3D view of 20449-001E-0 ...................................................................................................... 78 Figure 49 : 3D drawing of LGA thermal dissipation design ..................................................................103 Figure 50 : Top and bottom view of SIMXX0X ....................................................................................... 105 Figure 51 : Label description of module ................................................................................................. 106 Figure 52 : Recommended PCB footprint .............................................................................................. 107 Figure 53 : Recommended SMT stencil .................................................................................................108 Figure 54 : Recommended SMT reflow profile ...................................................................................... 108 Figure 55 : Packaging process ............................................................................................................... 111 Figure 56 : Module tray drawing ............................................................................................................. 111 Figure 57 : Small carton drawing ............................................................................................................112 Figure 58 : Big carton drawing ................................................................................................................112 www.simcom.com 10 / 122 SIM8260A_Hardware Design_V1.05 1 Introduction interfaces, mechanical This document describes the electronic specifications, RF specifications, characteristics, and test results of the SIM8260A module. With the help of this documentcustomers can quickly understand SIM8260A module. Associated with other software application notes and user guides, customers can use SIM8260A to design and develop mobile and laptop applications easily. 1.1 Product Outline SIM8260A is a wireless communication module focusing on 5G market; it supports multi-air access technology including 5G NR (NSA/SA), LTE-FDD, LTE-TDD, and WCDMA, can meet the 3GPP R16 NR specification, and integrates GNSS1 system including dual bands GPS, GLONASS, Beidou, Galileo and QZSS. The modules supported radio frequency bands are shown in the following table. Table 1: SIM8260A frequency bands Standard Frequency bands SIM8260A Module n2/n5/n7/n12/n14/n25/n26/n41/n48/n66/n71/n77/n78 B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B48/B66/B71 B41 B2/B4/B5 GPS L1+L5 dual bands/GLONASS/BeiDou/Galileo/QZSS 5G NR LTE-FDD LTE-TDD WCDMA GNSS1 NOTE 1. GNSS function is optional. Standard modules do not support L5 by default. The data transfer throughput of the module is shown in the table below. Table 2: SIM8260Adata transfer throughput Standard Data transfer SIM8260A Module Sub-6G SA 2.4Gbps(DL)/1Gbps(UL) Sub-6G NSA 3.4Gbps(DL)/600Mbps(UL) LTE HSPA+

1.6Gbps(DL)/200Mbps(UL) 42Mbps(DL)/5.76Mbps(UL) www.simcom.com 11 / 122 SIM8260A_Hardware Design_V1.05 With a physical dimension of 41.0mm*43.6mm*2.8mm, SIM8260A can meet almost all requirements of customers applications. With the 369 LGA pins, SIM8260A owns rich interfaces, includes USB3.1, PCIe3.0/4.0, SDIO3.0, (U)SIM card, digital audio (I2S or PCM), SPI, I2C, UART, GPIOs, four antennas for 3G/4G/5G and GNSS. For more details about the antenna pins, please refer to the pin definition. With all these interfaces, SIM8260A Series can also be utilized in the handheld terminal, laptop application and especially the 5G CPE. www.simcom.com 12 / 122 SIM8260A_Hardware Design_V1.05 1.2 Hardware Block Diagram The block diagram of SIM8260A is shown in the following figure. Figure 1: Module block diagram www.simcom.com 13 / 122 SIM8260A_Hardware Design_V1.05 1.3 Feature Overview Table 3: Key features Feature Implementation Application processor Arm Cortex-A7 up to 1.8 GHz Memory RAM Memory ROM Power supply 4Gb 16-bit LPDDR4X at 2.13 GHz, 8Gb optional*

4Gb 8-bit NAND, 8Gb optional*

VBAT:3.3V4.4V Typical: 3.8V Power consumption Typical: 2.6 mA @sleep mode (GNSS off, VBAT=3.8V) Transmit power Power Class 3 for WCDMA/LTE/5G NR Power Class 2 for 5G NR(n41/n77/n78/n79) Antenna Five antennas for 3G/4G/5G/GNSS GNSS (optional) SMS

(U)SIM interface

(U)SIM application toolkit GNSS engine: GPS L1+L5/GLONASS/BeiDou/Galileo/QZSS Protocol: NMEA MT, MO, CB, Text and PDU mode SMS storage: (U)SIM card or ME (default) Transmission of SMS alternatively over CS or PS. Support identity card: 1.8V/ 3.0V Include (U)SIM1 and (U)SIM2 interfaces Support Dual SIM single standby Support SAT class 3 Support USAT Phonebook management Support phonebook types: DC, MC, RC, SM, ME, FD, ON, LD, EN Digital audio interface PCIe interface WLAN/BT interface PMI interface3 UART interface I2C interface www.simcom.com One I2S interface with dedicated main clock for primary digital audio, the I2S also can be configured as PCM MCLK frequency: 12.288MHz (default) WCDMA AMR-NB VoLTE AMR-WB Echo cancellation Noise suppression Two lane PCIe interfaces, support PCIe Gen 3 (Gen 1/2 compatible), which up to 8Gbps per lane. One lane PCIe interfaces, support PCIe Gen 4, which up to 16Gbps per lane. Support W822 interface, which support 802.11ax with 3.6Gbps, support BT5.2 Support PM7250B interface, which support USB Type-C, QC4.0* and USB-PD3.0*

Default Support up to three UART Data rate up to 4 Mbps Default Support up to two I2C, meet I2C specification, version 5.0 Data rate up to 400 Kbps 14 / 122 SPI interface SDIO interface USB interface SIM8260A_Hardware Design_V1.05 Only support master mode Data rate up to 50Mbps Support 4bit SD card or 8bit eMMC, meet SDIO3.0 specification 1.8V or 3.0V dual-voltage operation for SD card Clock output up to 200 MHz for SD card; up to 100 MHz for eMMC Support one USB controller, USB3.1 Gen2 or USB2.0 USB3.1: super speed, with data rate which up to 10Gbps USB2.0: high speed interface, support USB operations at low-speed and full-speed, which refer to USB1.0 and USB1.1 Firmware upgrade Firmware upgrade over USB interface Physical characteristics Temperature range Size: 41x43.6x2.8mm SIM8260A weight11.45g (typical) Normal operation temperature: -30C to +70C (3GPP compliant) Extended operation temperature: -40C to +85C3 Storage temperature: -40C to +90C NOTE 1. * means under development,for more information, please connect the SIMCom FAE teams. 2. W82 is SIMCom WiFi-6 module. 3. When Module is within the extended operation temperature range, Module is able to establish and maintain voice, data transmission, SMS and emergency call, etc. The performance may deviate slightly from the 3GPP specifications and will meet 3GPP specifications again when the temperature returns to normal operating temperature levels. It is strongly recommended that customers take heat dissipation measures to ensure that the junction temperature of the chip cant be exceeded (for example, the temperature of the CPU cannot exceed 105C). www.simcom.com 15 / 122 SIM8260A_Hardware Design_V1.05 2 Package Information 2.1 Pin Assignment Overview All functions of the SIM8260A will be provided through 369 LGA pins. The following figure is the pin assignment of the module. Figure 2: Pin assignment(Top View) www.simcom.com 16 / 122 SIM8260A_Hardware Design_V1.05 Table 4: Pin differences of SIM8260A SIM8260A module name M.2 pin number AR51 AG51 AL51 AC51 AM45 AT45 AK45 AP45 AT79 AH49 AF49 AP49 AW19 BA37 BA29 AY14 AY1 RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU QTM_THERM RFU N79_TO_WL_TXEN WL_TX_EN GNSS ANT www.simcom.com 17 / 122 SIM8260A_Hardware Design_V1.05 2.2 Pin Description Table 5: IO parameters definition Pin type Description PI PO AI AIO DIO DI DO PU PD Power Input Power Output Analog Input Analog Input /Output Bidirectional Digital Input /Output Digital Input Digital Output Pull Up Pull Down Table 6: DC parameters definition Voltage domain Parameter VDD_P2=1.8V Min Typ Max VOH VOL VIH VIL Rp P2 VDD_P2=3.0V VOH VOL VIH VIL Rp VDD_P3=1.8V VOH VOL VIH VIL Rp P3 High level output Low level output High level input Low level input Pull up/down resistor 1.4V 0V 1.27V 0V 10K ohm High level output 2.25V Low level output 0V High level input 1.84V Low level input 0V Pull up/down resistor 10K ohm High level output 1.35V Low level output 0V High level input 1.26V Low level input 0V Pull up/down resistor 20K ohm P4/P5 VDD_P4/P5=1.8V

0.45V 2V 0.58V 100K ohm 3.0V 0.375V 3.25V 0.75V 100K ohm 1.8V 0.45V 2.1V 0.6V 60K ohm www.simcom.com 18 / 122 SIM8260A_Hardware Design_V1.05 VOH VOL VIH VIL Rp High level output 1.44V Low level output 0V High level input 1.26V Low level input 0V Pull up/down resistor 10K ohm VDD_P4/P5=3.0V VOH VOL VIH VIL Rp High level output Low level output High level input Low level input Pull up/down resistor 2.4V 0V 2.1V 0V 10K ohm

1.8V 0.4V 2.1V 0.36V 100K ohm 3.0V 0.4V 3.05V 0.6V 100K ohm Table 7: Pin description Pin no. Electrical description Description Comment Pin name Power supply VBAT_BB VBAT_RF PI PI V45, V49, U47 Y49, AC47, AA47, W47, AD45, AB45, Y45 VDD_EXT AL5 PO VREG_1P3 M45 PO VREG_0P9 P49 PO VREG_1P9 N47 PO L10E_3P1 C41 PO VMAX=

4.4V VTYP

=3.8V VMIN=3

.3V VMAX=

4.4V VTYP

=3.8V VMIN=3

.3V VTYP

=1.8V VTYP

=1.28 V VTYP

=0.88 V VTYP=

1.88V VTYP=

3.08V Input power supply for modules BB part Input power supply for modules RF part Output power supply for external IO pull up circuits Output power supply for W82 only Output power supply for W82 only Output power supply for W82 and QTM Output power supply for PM7250B USB PD-PHY and USB switch www.simcom.com 19 / 122 VIO_OUT D42 PO VTYP=

1.8V Output power PM7250B IO only supply for SIM8260A_Hardware Design_V1.05 GND A7, B8, A11, B12, C15, A15, B16, C17, C19, D22, D24, D26, C27, A27, B28, D28, C31, C33, C35, C37, D40, A41, B42, J5, AD7, AJ1, AK3, AM3, AN1, AN5, AP3, AR1, AR5, AT3, AT7, AU1, AU5, AV3, AW1, R47, T49, U51, W51, AA51, AB49, AD49, AE47, AF45, AH45, AG47, AJ47, AL47, AN47, AR47, AU47, AV49, AW51, AV10, AV12, AV14, AV16, AV18, AV20, AV22, AV24, AV26, AV28, AV30, AV32, AV34, AV36, AV38,A V40, AV42, AW9, AW11, AW13, AW15, AW23, AW25, AW27, AW29, AW31, AW33,AW35, AW37, AW39, AW41, AW43, AY6, AY8, AY12, AY18, AY20, AY22, AY24,AY26, AY28, AY30, AY32, AY34, AY36, AY38, AY40, AY42, AY44, AY46, BA5, BA17, BA21, BA23, BA27, BA31, BA35, BA39, BA43, BA45, AM13, AM17, AM21, AM24, AM27, AM31, AM35, AM39, AH13, AH17, AH21, AH24, AH27, AH31, AH35, AH39, AE13, AE17, AE21, AE24, AE27, AE31, AE35, AE39, AA13, AA17, AA21, AA24, AA27, AA31, AA35, AA39, U13, U17, U21, U24, U27, U31, U35, U39, P13, P17, P21, P24, P27, P31, P35, P39, K13, K17, K21, K24, K27, K31, K35, K39, A1, B4, C7, A51, B48, C45, BA1, AY4, AW7, BA51, AY48, AW45, AM49, AK49, AE51, AJ51, AN51, AU51 DI DI 1.1V Power on/off the module, active low P3 Reset the module, active low Pull up to 1.2V internally without PM7250B Pull up to 1.8V inside the module System control PWRKEY RESIN_N Status indicator STATUS NET_STATUS A45 A43 AJ5 AE1 DO DO P3 P3 TDD_SYNC_PPS AW21 DO P3 USB_BOOT D12 DI P3 W_DISABLE AG1 DI P3 SLEEP_OUT AF3 DO P3 USB interface USB_VBUS USB_HS_DP USB_HS_DM C9 B6 A5 AI AIO AIO Indicate Module is on PMU_GPIO_13 activity network Indicate status of the module 1.It can generate pulse use for indication NSA and SA sub6 the beginning frame flag of DL-UL 2.TDD_SYNC_PPS Can be Configuration to GPS_1PPS Module will be forced into USB boot mode by connect to VDD_EXT externally Flight mode control active low Module in Sleep mode output signal to external AP active high input PMU_GPIO_14 1.8V voltage domain. The TDD_SYNC_PPS and GPS_1PPS function cant be used at the same time. GPIO_32 GPIO_42, this pin cant be before power on pulled up GPIO_86 GPIO_97 USB VBUS detection Not support charge Differential USB bi-directional data plus Differential USB bi-directional data minus Required 85 differential impedance Compliant with USB 2.0 standard specifications www.simcom.com 20 / 122 SIM8260A_Hardware Design_V1.05 USB_SS_TX_P A13 AO USB_SS_TX_M B14 AO USB_SS_ RX_P B10 USB_SS_RX_M A9 USB_ID*

C11 AI AI DI USB3.1 super-speed transmit data plus USB3.1 super-speed transmit data minus USB3.1 super-speed receive data plus USB3.1 super-speed receive data minus Required 85 differential Impedance Compliant with USB 3.1 standard specifications P3 USB ID If unused, please keep open OTG_EN*

D10 DO P3 USB_SS_SW C13 DO P3 PM7250B interface2 CHG_SYS_OK C43 DI FAULT_N B44 DIO SPMI_CLK A47 DO SPMI_DATA B46 DIO

(U)SIM interface

(U)SIM1_VDD B51 PO P4

(U)SIM1_DATA E51 DIO P4 USB OTG power supply DC-DC enable signal USB Type-C switch control signal, Used without PM7250B When charger input is inserted, PM7250B output signal to Module. When the charging chip is not used, this pin can be connected to GND to realize the power-on function Used to send/receive the fault condition across all PMICs in the chipset SPMI communication bus clock signal SPMI communication bus data signal Power supply for (U)SIM1 card

(U)SIM1 card data signal, which has been pulled up to

(U)SIM1_VDD by a 20K resistor in Module

(U)SIM1_CLK

(U)SIM1_RST D49 C51 DO DO P4 P4

(U)SIM1 clock signal

(U)SIM1 reset signal

(U)SIM1_DET E47 DI P3

(U)SIM2_VDD F49 PO

(U)SIM1 card detect signal, which need pulled up to VDD_EXT by a 470K resistor externally Power supply for (U)SIM2 card Required 50 impedance 1.8/3.0V voltage domain,

(U)SIM interface should be protected against ESD. If unused, please keep open www.simcom.com 21 / 122 SIM8260A_Hardware Design_V1.05

(U)SIM2_DATA G47 DIO P5

(U)SIM2card data, which has been pulled up to

(U)SIM2_VDD by a 20K resistor in Module

(U)SIM2_CLK

(U)SIM2_RST H49 G51 DO DO P5 P5

(U)SIM2 clock signal

(U)SIM2 reset signal

(U)SIM2_DET F45 DI P3 SPI interface SPI_CS_N SPI_CLK SPI_MOSI SPI_MISO UART1 interface UART1_CTS UART1_RTS UART1_TXD UART1_RXD UART1_DCD UART1_RI UART1_DTR D18 D20 D14 D16 AA1 AC1 AB3 AD3 W5 AA5 AC5 BT UART interface BT_UART_CTS BT_UART_RTS BT_UART_TXD BT_UART_RXD R5 U5 T7 V7 Debug UART interface DBG_UART_RXD L5 DBG_UART_TXD I2C interface1 I2C1_SCL I2C1_SDA N5 M7 P7 I2C2_SCL AB7 DO DO DO DI DI DO DO DI DO DO DI DI DO DO DI DI DO OD OD OD P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3

(U)SIM2 card detect, which need pulled up to VDD_EXT by a 470K resistor externally SPI chips select SPI clock Master output slaver input Master input slaver output Clear to send Request to send Transmit data Receive data Carrier detect Ring indicator Data terminal ready Clear to send Request to send Transmit data Receive data Receive data Transmit data I2C1 clock signal I2C1 data signal I2C2 clock signal I2C2_SDA Y7 OD P3 I2C2 data signal Default use for AT command If not need 7-wire UART, these signals can be used as GPIO Default use for BT Used for debug only I2C1 default use for codec Pull up to VDD_EXT externally I2C2 default use for sensor Pull up to VDD_EXT Externally FOR EBI LCD PIN AB7 GPIO84 for EBI LCD_TE PIN Y7 GPIO85 for EBI LCD_RESET www.simcom.com 22 / 122 SIM8260A_Hardware Design_V1.05 BT I2S interface BT_ I2S_DOUT BT_ I2S_DIN BT_I2S_CLK BT_ I2S_WS K3 M3 J1 G1 DO DI DO DO P3 P3 P3 P3 I2S data output I2S data input I2S bit clock I2S word select I2S Audio Codec interface I2S_DOUT/

PCM_DOUT I2S_DIN/

PCM_DIN I2S_CLK/

PCM_CLK I2S_WS/

PCM_SYNC I2S_MCLK N1 R1 P3 T3 L1 CDC_RST_N AK7 ADC interface DO P3 I2S/PCM data output DI P3 I2S/PCM data input DO P3 I2S/PCM clock output I2S word select/

PCM synchronous signal I2S master clock output DIO DO DO P3 P3 P3 Default use for W82 Default is I2S interface, can be configured as PCM interface by software. If unused, please keep open ADC0 ADC1 AH7 AF7 AI AI PCIe interface PCIe_REFCLK_P B22 PCIe_REFCLK_M A21 PCIe_TX0_M PCIe_TX0_P PCIe_TX1_M PCIe_TX1_P PCIe_RX0_M PCIe_RX0_P PCIe_RX1_M PCIe_RX1_P PCIe_CLKREQ PCIe_WAKE B18 A17 B20 A19 A25 B26 A23 B24 C21 C25 AIO AIO AO AO AO AO AI AI AI AI DIO DI P3 P3 Module reset the external codec active low Soft Default not supported For EBI LCD_backlight_contrl Required 85 differential impedance Analog to digital converter input0 Analog to digital converter input1 PCIe reference clock plus PCIe reference clock minus PCIe transmit0 minus PCIe transmit0 plus PCIe transmit1 minus PCIe transmit1 plus PCIe receive0 minus PCIe receive0 plus PCIe receive1 minus PCIe receive1 plus PCIe clock request input low CLKREQ and WAKE PCIe wake-up input low need pull up to VDD_EXT externally;

When there is an external level conversion chip, CLKREQ,WAKE, RST all need to be pulled up Default as RC mode PCIe_RST C23 DO P3 PCIe reset output low www.simcom.com 23 / 122 W82 control interface2 WL_SW_CTRL K49 SDX_TO_WL_CTI M49 WL_TO_SDX_CTI L47 WL_PA_MUTING H45 SLEEP_CLK BT_EN WL_EN WL_LAA_RX J51 N51 K45 J47 WL_LAA_AS_EN L51 DI DO DI DO DO DO DO DO DO DO P3 P3 P3 P3 P3 P3 P3 P3 P3 SIM8260A_Hardware Design_V1.05 W82 switch control W82 GPIO W82 GPIO WLAN XFEM control for PA mute Sleep clock output for W82 only W82 BT enable WLAN enable If unused, please keep open If unused, please PD 10k WLAN XFEM control for LAA receiver WLAN LAA AS enable SIM8260C not support LAA, unused please PD 10k to GND COEX_UART_TX D COEX_UART_RX D WL_TXEN_TO_N 79 N79_TO_WL_TXE N BA7 BA9 DI P3 BA37 DI P3 BA29 DO P3 LTE&WLAN data transmit LTE&WLAN data receive coexistence coexistence From Module N79 to the W82 From the W82 to Module N79 From Module to the W82 WL_LAA_TX_EN R51 DO P3 WL_TX_EN AY14 DI P3 From the W82 to Module LTE coexistence signals N79 and WIFI coexistence signals SIM8260E/A unused, please keep open SIM8260C/E/A unused, please keep open SIM8260C unused, please keep open SDIO interface SDIO_VDD3 SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3 SDIO_CMD SDIO_CLK SDIO_VDD_EN F7 B1 C1 D3 F3 G5 E5 H7 PI 1.8/3. 0V DIO P2 Power input for internal SDIO circuit SDC data bit 0 or eMMC data bit 0 DIO P2 DIO P2 DIO P2 DIO DO DO P2 P2 P3 SDC data bit 1 or eMMC data bit 1 SDC data bit 2 or eMMC data bit 2 SDC data bit 3 or eMMC data bit 3 SDC command output SDC clock output Enable the SD card power or eMMC data bit 4 SD card insertion detect or eMMC data bit 5 Required 45 impedance and length match<1mm Layout bus length

<15mm(208MHZ)

<100mm(50MHZ) SD card can support 1.8V/3.3V, but eMMC only support 1.8V SDIO_DET E1 DI P3 www.simcom.com 24 / 122 GPIO100 GPIO101 H3 K7 DIO DIO RESOUT_N AW17 DO EBI2 interface EBI2_AD_0 EBI2_AD_1 EBI2_AD_2 EBI2_AD_3 EBI2_AD_4 EBI2_AD_5 EBI2_AD_6 EBI2_AD_7 EBI2_WE_N EBI2_ CLE EBI2_RE_N EBI2 _CS mmW interface A33 A39 B34 B38 C39 B36 B40 A37 A35 A31 B32 AH3 DO DO DO DO DO DO DO DO DO DO DI DI IFH1 AR51 AIO P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 IFH2 AG51 AIO IFH3 AL51 AIO IFH4 AC51 AIO IFV1 AM45 AIO SIM8260A_Hardware Design_V1.05 Required 50 impedance, Standard software not supported EBI2 interface The EBI2 interface and the internal NAND of the module share the interface, there can be no pull-up or pull-down externally, and the external length is preferably less than 100mm If unused, please keep open eMMC data bit 6 eMMC data bit 7 eMMC RST_N EBI2 data0 EBI2 data1 EBI2 data2 EBI2 data3 EBI2 data4 EBI2 data5 EBI2 data6 EBI2 data7 EBI2_WE_N EBI2_ CLE EBI2_RE_N EBI2_LCD_CS Horizontal polarization IF output signal and control signal for mmW RFIC device 1 Horizontal polarization IF output signal and control signal for mmW RFIC device 2 Horizontal polarization IF output signal and control signal for mmW RFIC device 3 Horizontal polarization IF output signal and control signal for mmW RFIC device 4 Vertical polarization IF output signal and local oscillator (LO) signal for mmW RFIC device 1 Vertical polarization IF output signal and local oscillator (LO) signal for mmW RFIC device 2 AT45 AIO IFV2 IFV3 AK45 AIO Vertical polarization IF output www.simcom.com 25 / 122 SIM8260A_Hardware Design_V1.05 IFV4 AP45 AIO QTM0_PON AT49 DO P3 QTM1_PON AH49 DO P3 QTM2_PON AF49 DO P3 QTM3_PON AP49 DO P3 signal and local oscillator (LO) signal for mmW RFIC device 3 Vertical polarization IF output signal and local oscillator (LO) signal for mmW RFIC device 4 Power on/reset 0 for QTM module Power on/reset 1 for QTM module Power on/reset 2 for QTM module Power on/reset 3 for QTM module QTM_THERM AW19 AI QTM thermal detect GPIO interface GPIO106 GPIO47 GPIO105 GPIO31 GPIO102 GPIO107 GPIO82 GPIO83 GPIO88 GPIO96 AY10 AE5 D38 C29 D36 U1 V3 Y3 AG5 AM7 DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Used for GPIO Only QTM547 support thermal detect If unused, please keep open PMU_GPIO6 Antenna control interface4 AP7 DIO RFFE0_CLK BA11 DO RFFE0_DATA BA13 DIO ANT_CTRL0 ANT_CTRL1 ANT interface BA15 AY16 DO DO GNSS ANT AY1 AI SIM8260A Module ANT0 AL1 AIO 1.8V Used for GPIO P3 P3 P3 P3 Antenna tuner MIPI CLK Antenna tuner MIPI DATA Antenna tuner control0 Antenna tuner control1 Required 50 impedance Receiving GNSS signals 1166MHz~1229MHz 1565MHz~1610MHz 4G/5G LB/MHB TX0/DRX, 5G N41/77/78/79 617MHz~894MHz 1710MHz~2690MHz www.simcom.com 26 / 122 SIM8260A_Hardware Design_V1.05 TX0/DRX_MIMO 4G/5G MHB DRX_MIMO, 5G N77/78/79 DRX 4G LAA DRX 4G/5G MHB PRX_MIMO, 5G N77/78/79 PRX_MIMO, 4G LAA PRX 4G/5G LB TX1/PRX, 5G MHB TX1/DRX, 5G N41/77/78/79 TX1/PRX 3300MHz~5000MHz 1930MHz~2690MHz 3300MHz~5925MHz 1930MHz~2690MHz 3300MHz~5925MHz 617MHz~894MHz 1710MHz~2690MHz 3300MHz~5000MHz BA25 AI BA33 AI BA47 AIO BA41, AY51, BA19, B30, A29, D32, D30, D34, T45, P45, W1 Reserved for future use ANT1 ANT2 ANT3 RFU PIN RFU MARK D9 NOTE PIN used module, keep it externally inside the floating 1. The I2C signals need pull up to VDD_EXT by 2.2K resistors out of the module. 2. Only used to W82 and PM7250B pins dont use as other circuits. 3. If not use SDIO function, the SDIO_VDD pin should connect to VDD_EXT out of the module. 4. Please confirm with SIMCom for the detail design about Antenna control interface. 5. * means under development, for more information, please connect the SIMCom FAE support team. RFU pins should keep open. Recommend add ESD protect components to the interface that is touched by human hands. (e. g. SIM/SD/USB/BUTTOM/ANT) The GPIO MAX voltage is 2.1V, if exceeded, may cause permanent damage to the module. All GND pins should be connected to the customers main PCB. For SIM8260A module BA37 RFU. 2.3 Mechanical Dimensions The following figure shows the mechanical dimensions of SIM8260A. www.simcom.com 27 / 122 SIM8260A_Hardware Design_V1.05 Figure 3: Dimensions of SIM8260A (unit: mm) www.simcom.com 28 / 122 SIM8260A_Hardware Design_V1.05 3 Interface Application 3.1 Power Supply The recommended power supply for SIM8260A is 3.8V and the voltage range from 3.3V to 4.4V. It is necessary to ensure that the voltage of VABT cannot be lower than 3.3V after the maximum voltage drop. the module will be powered off automatically. The max voltage is not higher than 4.4V, otherwise the module may be permanently damaged. The module has 3 BB power pins, 7 RF power pins and 10 power ground pins, to ensure the module works normally, all power and ground pins should be connected. Table 8: VBAT pins electronic characteristics Symbol Description Min. Typ. Max. Unit Module power supply voltage 3.3 3.8 Peak current Peak current at maximum power Peak current at maximum power Current in sleep mode Current in power off mode

4.5 135 4.4 1.8 1.0 TBD

V A A A mA uA VBAT1 Ipeak Ipeak (QTM545) Ipeak (QTM547) Isleep Ileakage NOTE 1. The VBAT include VBAT_BB and VBAT_RF pins in this document. 2.If the customer uses the charging chip PM7250B and the software with charging function, when the power supply voltage is lower than 3.3V, the module will not be powered on. If the customer wants o power on the module, the charger must be plugged in. 3.1.1 Power Supply Design Guide When B2(20MHz) and N79(100MHz) ENDC combination are connected under the instrument, the peak current can reach to 1.8A at 3.8V power supply. In order to ensure that the VBAT voltage is no less than required 3.3V when the module at maximum power radio transmission, and considering the voltage drop and conversion efficiency, it is strongly recommended that the DC-DC or LDO output capacity should not be less than 3A. www.simcom.com 29 / 122 This chapter is under development. The indicated peak power consumption data is an estimated value, not the final measured data. The data will be supplemented by subsequent versions. SIM8260A_Hardware Design_V1.05 Figure 4: Power consumption at ENDC combination of B2 (20MHz) and N79 (100MHz) NOTE Test conditions The total capacitors of VBAT net are not less than 640uF. The peak current is only the current consumption of the module, dont include the current consumption of other devices outside the module. The Ipeak and voltage drop data in Table and Figure above were tested using SIMCom EVB and connecting instrument at 3.8V power supply, the ENDC combination is B2 (20MHz) and N79

(100MHz), subcarrier spacing is 30KHz. The B2 (20MHz) and N79 (100MHz) ENDC combination is the max power consumption of the module. When WLAN and Ethernet functions are added according to SIMCOM's reference design, the peak current of the entire system can reach 2.6A. For ensure the normal operation of the module and peripherals, it is strongly recommended that the DC-DC or LDO output capacity is not less than 3A. Figure 5: Power consumption of entire systeam NOTE www.simcom.com 30 / 122 Test conditions The above current consumption data is measured using SIMCOM EVB. The test current consumption data includes SIM8260A module, SIMCom WLAN module W82 and Ethernet PHY RTL8125B, to be added in subsequent versions. SIM8260A_Hardware Design_V1.05 To decrease the voltage dropping, make sure that the capacitors of VBAT net must not less than 640uF. The following figure shows the reference circuit of power supply for the VBAT. Figure 6: Power supply reference circuit Table 9: Definition of VBAT and GND pins Pin name Pin no. Electrical description Description Comment VBAT_BB VBAT_RF GND PI PI VMAX=4.4V VTYP =3.8V VMIN=3.3V VMAX=4.4V VTYP =3.8V VMIN=3.3V Input power supply for modules BB part V45, V49, U47 Y49, AC47, AA47, W47, AD45, AB45, Y45 A7,B8,A11,B12,C15,A15,B16,C17,C19,D22,D24,D26,C27,A27,B28,D28,C31,C33, C35,C37,D40,A41,B42,J5,AD7,AJ1,AK3,AM3,AN1,AN5,AP3,AR1,AR5,AT3,AT7,A U1,AU5,AV3,AW1,R47,T49,U51,W51,AA51,AB49,AD49,AE47,AF45,AH45,AG47,A J47,AL47,AN47,AR47,AU47,AV49,AW51,AV10,AV12,AV14,AV16,AV18,AV20,AV2 2,AV24,AV26,AV28,AV30,AV32,AV34,AV36,AV38,AV40,AV42,AW9,AW11,AW13, AW15,AW23,AW25,AW27,AW29,AW31,AW33,AW35,AW37,AW39,AW41,AW43,A Y6,AY8,AY12,AY18,AY20,AY22,AY24,AY26,AY28,AY30,AY32,AY34,AY36,AY38,A Y40,AY42,AY44,AY46,BA5,BA17,BA21,BA23,BA27,BA31,BA35,BA39,BA43,BA45, Input power supply for modules RF part www.simcom.com 31 / 122 SIM8260A_Hardware Design_V1.05 AM13,AM17,AM21,AM24,AM27,AM31,AM35,AM39,AH13,AH17,AH21,AH24,AH27, AH31,AH35,AH39,AE13,AE17,AE21,AE24,AE27,AE31,AE35,AE39,AA13,AA17,AA 21,AA24,AA27,AA31,AA35,AA39,U13,U17,U21,U24,U27,U31,U35,U39,P13,P17,P 21,P24,P27,P31,P35,P39,K13,K17,K21,K24,K27,K31,K35,K39,A1,B4,C7,A51,B48, C45,BA1,AY4,AW7,BA51,AY48,AW45,AM49,AK49,AE51,AJ51,AN51,AU51 NOTE Both C1 and C5 are 220 F tantalum capacitor (ESR=0.7). C3, C4, C7 and C8 are multi-layer ceramic chip (MLCC) capacitors from 33pF to 1uF with low ESR in high frequency band, which can be used for EMC performance. D1 is used for surge protection. Pins AF45, AE47, AD49, AB49, AA51, AD49, W51, U51, T49 and R47 of GND are the main ground for power return. Table 10: Recommended D1 list Name D1 Manufacturer LRC Prisemi Part number LEDZ5.1BT1G PZ5D4V2H Power supply layout guidelines:

Both VBAT and return path should be as short and wide as possible to minimize the voltage drop. The width of VBAT_BB trace should be no less than 1.5mm, and the width of VBAT_RF trace should be no less than 2mm. ESR<20m These capacitors should be placed as closely as possible to the VBAT_BB and VBAT_RF pins. The VBAT trace should pass through Zener diode and capacitors, and then pass through the VBAT pins. The small value capacitors should be placed close to the VBAT pins. The customers PCB design must have a solid ground plane throughout the board as the primary reference plane for most signals. 3.1.2 Recommended Power Supply Circuit It is recommended to use a switching mode power supply or a linear regulator power supply. Make sure it can provide the current up to 3A at least. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output. www.simcom.com 32 / 122 SIM8260A_Hardware Design_V1.05 Figure 7: Linear regulator reference circuit NOTE An extra minimum load of R3 is required, to ensure it work properly under light load in sleep mode and power off mode. For the details about minimum load, please refer to specification of MIC29502WU. Table 11: Recommended power chip list Name U1 Manufacturer MICREL Model MIC29502WU The following figure shows the switching mode power supply reference circuit with 5~12V input and 3.8V output. Figure 8: Switching mode power supply reference circuit The following figure shows the switching mode power supply reference circuit with 8.8~16V input and 3.8V output. www.simcom.com 33 / 122 SIM8260A_Hardware Design_V1.05 Figure 9: Switching mode power supply reference circuit for mmW NOTE In order to avoid damaging the module, please do not switch off the power supply when module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. It is suggested that customer's design should have the ability to switch off the power supply for module in abnormal state, and then switch on the power to restart the module. The PWR_CTRL signal recommend connect to the host and can be controlled. Table 12: Recommended chip list Name Ferrite bead Manufacturer Sunlord Power inductor Coilcraft 3.1.3 Voltage Monitor Model UPZ1608E300-5R0TF XAL1010-451ME To monitor the VBAT voltage, the AT command AT+CBC can be used. NOTE For more details about voltage monitor commands, please refer to Document [1] in the appendix. www.simcom.com 34 / 122 SIM8260A_Hardware Design_V1.05 3.2 Power On and Off Module 3.2.1 Power On Drive the PWRKEY pin to a low level and hold it for 2 seconds, then release, the module will be powered on. This pin is already pulled up internally. The power on timing and electrical characteristics are listed in the following table, and the following figure shows the power on circuit. Figure 10: Power on the module use button Figure 11: Power on the module use GPIO drive Table 13: Definition of PWRKEY pin Pin name Pin no. Electrical description PWRKEY A45 DI Description Comment Power on/off the module, active low www.simcom.com 35 / 122 The power on sequence is shown in the following figure. SIM8260A_Hardware Design_V1.05 Figure 12: Power on sequence Table 14: Power on timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit Twait Ton T1 The waiting time from power supply available to power-on action The time of holding on PWRKEY pin to a low level The time from power-on action to VDD_EXT ready Ton(usb) The time from power-on action to USB port ready Ton (STATUS) The time from power-on action to STATUS ready VIH VIL Input high level voltage on PWRKEY pin Input low level voltage on PWRKEY pin 100 2

1.1 0

11.45 12 20 55

2.1 0.3 ms s ms s s V V NOTE After enter force download mode, the PWRKEY pin need to release and dont pull low always. If not, the module will restart and then cause the download fail. The timing of Ton(usb) and Ton (STATUS) is related to the module software. The time here is based on the standard version test and is for reference only. 3.2.2 Power Off The following methods can be used to power off the module. Method 1: Power off the module by holding the PWRKEY to a low level two second then release. Method 2: Power off the module by AT command AT+CPOF. www.simcom.com 36 / 122 SIM8260A_Hardware Design_V1.05 NOTE If the temperature is outside the range of -30~+70C, some warning will be reported via AT port. If the temperature is outside the range of -40~+85C, module will be powered off automatically. For details about AT+CPOF, please refer to Document [1] in the appendix. Normal power off action will make the module disconnect from the network, allow the software entered a safe state, and save key data before the module is powered off completely. The power off sequence is shown in the following figure. Figure 13: Power off sequence Table 15: Power off timing and electronic characteristic Parameter Description The time of holding on PWRKEY pin to a low level The time from power-off issue to USB port off The time from power-off issue to STATUS off Toff Toff(usb) Toff(status) NOTE Time value Min. Typ. Max. 2

3.5 2.1

Unit s s s After pressing the PWRKEY button, you must wait for 12S to disconnect the power supply or press the PWRKEY again to turn on the module, otherwise it may damage the module or fail to turn on module. The timing of Toff(usb)and Toff(status) is related to the module software. The time here is based on the standard version test and is for reference only. www.simcom.com 37 / 122 SIM8260A_Hardware Design_V1.05 3.3 Reset Function Module can be reset by driving the RESIN_N pin down to a low level. The RESIN_N signal has been internally pulled up to 1.8V, so there is no need to pull it up externally. Please refer to the following figure for the recommended reference circuit. Figure 14: Reset the module use GPIO drive Figure 15: Reset the module use button Table 16: Definition of RESIN_N pin Pin name Pin no. Electrical description Description Comment RESIN_N A43 DI P3 Reset the module, active low The reset timing sequence of the module is shown in the following figure. www.simcom.com 38 / 122 SIM8260A_Hardware Design_V1.05 VBAT RESIN_N Module state T reset 600ms 300ms 0V VIL 0.4V 1.2V VIH 1.9V Running Reseting Restar Figure 16: The reset timing sequence of the module Table 17: RESET electronic characteristics Symbol Description The time of holding on RESIN_N pin to a low level Input high level voltage Input low level voltage Treset VIH VIL NOTE Please ensure that there is no capacitance on RESIN_N pin. Min. Typ. Max. Unit 300 1.2 0

600 1.9 0.4 ms V V 3.4 Output Power Management Table 18: Output power management summary Pin name Pin no Typical voltage (V) Rated current (mA) Sleep state Comment VDD_EXT AL5 1.8 VREG_1P3 M45 1.28 VREG_0P9 P49 0.88 VREG_1P9 N47 1.88 L10E_3P1 C41 3.08 VIO_OUT D42 1.8 50 500 1500 500 30 0.2 LPM retention off retention off on Output power supply for external IO pull up circuits Output power supply for W82 only Output power supply for W82 only Output power supply for W82 only Output power supply for PM7250B USB PD-PHY and USB switch Output power supply for PM7250B IO circuit only www.simcom.com 39 / 122 SIM8260A_Hardware Design_V1.05 3.4.1 VDD_EXT Reference Circuit The following figure is the reference circuit diagram of the VDD_EXT pin periphery of the module. Figure 17: Module VDD_EXT peripheral reference circuit NOTE It is recommended to place a TVS protection tube near the VDD_EXT pin of the module to protect the module pins. The recommended TVS models are shown in the following table. It is recommended to connect a 2.2R resistor in series with the VDD_EXT pin close to the module for ESD protection. Table 19: Module VDD_EXT pin protection tube TVS recommended materials package NO. Manufacturer Model Operating Voltage 3.3V ESD9L5.0ST5G RC0402JR072R2L

SOD-923 0402 Name D1 R1 1 2 ON YAGEO 3.5 USB Interface SIM8260A has one USB controllerwhich complies with USB3.1 and USB2.0 specifications. The high-speed PHY and super-speed PHY share the same USB 3.1 Gen2 controller, customers can choose USB3.1 or USB2.0 for their needs. USB3.1 Gen2 data rate is up to 10Gbps. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. SIM8260A supports USB suspend and resume mechanism, which can save power consumption. If there is no data transmission on the USB bus, module will enter suspend mode automatically. The following figure is the USB reference circuit. www.simcom.com 40 / 122 SIM8260A_Hardware Design_V1.05 Figure 18: Type-C USB reference circuit with PM7250B www.simcom.com 41 / 122 Figure 19: Type-C USB reference circuit with CC detector SIM8260A_Hardware Design_V1.05 Figure 20: USB3.1 reference circuit Table 20: Definition of USB interface Pin characteristics Functional description Comment Pin name USB_VBUS USB_HS_DP Pin no. C9 B6 AI AIO USB_HS_DM A5 AIO USB_SS_TX_P A13 AO USB_SS_TX_M B14 AO USB_SS_ RX_P B10 USB_SS_RX_M A9 USB_ID C11 AI AI DI OTG_EN D10 DO P3 P3 USB VBUS detection Not support charge Differential USB bi-directional data plus Differential USB bi-directional data minus USB3.1 super-speed transmit data plus USB3.1 super-speed transmit data minus USB3.1 super-speed receive data plus USB3.1 super-speed receive data minus USB ID USB OTG power supply DC-DC enable signal Required 85 differential impedance Compliant with USB 2.0 standard specifications Required 85 differential Impedance Compliant with USB 3.1 standard specifications Standard software not supported www.simcom.com 42 / 122 SIM8260A_Hardware Design_V1.05 USB_SS_SW C13 DO P3 USB Type-C switch control signal Table 21: Recommended CC detector list Name CC Detector Manufacturer PERICOM Model PI5USB30216D Table 22: Recommended SS USB switch list Name USB Switch Manufacturer PERICOM Model PI3DBS12212A Table 23: Recommended OTG 5V DC-DC and USB interface TVS list Name OTG TVS Manufacturer AWINIC WILL Model AW3605DNR ESD5302N-3/TR Please refer to the reference design for the design circuit diagram of OTG. HS USB DP/DM layout guidelines:

Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than 1mm. Gap from other signals keeps 3xline width. External TVS or EMI components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, audio, and XO). Maximum PCB trace length cannot exceed 100mm outside of module, the shorter trace and better. SS USB TX/RX layout guidelines:

Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than 500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. External TVS or EMI components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, especially 2.4 GHz). Route differential pairs in the inner layers with a solid GND reference to have good impedance control and to minimize discontinuities. Keep isolation between the Tx pair, Rx pair, and DP/DM to avoid crosstalk. If core vias are used, use no more than two core vias per signal line to limit stubs. www.simcom.com 43 / 122 SIM8260A_Hardware Design_V1.05 3.6 PCIe Interface SIM8260A support PCIe Gen3 2-lane or PCIe Gen4 1-lane interfaces, which can be used as EP or RC mode. PCIe3 data rate up to 8Gbps per lane, PCIe4 data rate up to 16Gbps per lane. The following figure is the PCIe reference circuit. Figure 21: PCIe interface reference circuit (RC) Figure 22: PCIe interface reference circuit (EP) NOTE www.simcom.com 44 / 122 SIM8260A_Hardware Design_V1.05 The 220nF AC capacitors should be placed near the PCIe_TX Table 24: Definition of PCIe interface Pin name Pin no. Pin characteristics PCIe_REFCLK_P B22 AIO PCIe_REFCLK_M A21 AIO PCIe_TX0_M PCIe_TX0_P PCIe_TX1_M PCIe_TX1_P PCIe_RX0_M PCIe_RX0_P PCIe_RX1_M PCIe_RX1_P PCIe_CLKREQ PCIe_WAKE B18 A17 B20 A19 A25 B26 A23 B24 C21 C25 AO AO AO AO AI AI AI AI DI DI P3 P3 Functional description PCIe reference clock plus PCIe reference clock minus PCIe transmit0 minus PCIe transmit0 plus PCIe transmit1 minus PCIe transmit1 plus PCIe receive0 minus PCIe receive0 plus PCIe receive1 minus PCIe receive1 plus PCIe clock request PCIe wake-up PCIe_RST C23 DO P3 PCIe reset Comment Required 85 differential impedance PCIe_CLKREQ and PCIe_WAKE need pull up to VDD_EXT externally, Default as RC mode PCIe interface layout guidelines:

All other sensitive/high-speed signals must be far away PCIe signals. PCIe signals must be protected be far away noisy signals (clocks, SMPS). Each trace needs to be adjacent to a ground plane. Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. Maximum PCB trace length cannot exceed 150mm outside of module, the shorter trace and better. 3.6.1 PCIe for W82 PCIe Gen3 lane0 can be connected to W82 as WLAN data interface, SIM8260As module serves as RC and W82 module serves as EP. PCIe_CLKREQ and PCIe_WAKE already be pulled up to 1.8V in W82. The details design please refer to the reference circuit document. The following figure is the PCIe www.simcom.com 45 / 122 reference circuit. SIM8260A_Hardware Design_V1.05 Figure 23: PCIe interface reference circuit (RC) for W82 NOTE The PCIe control signal voltage domain of the module and W82 are 1.8V. For more details about W82, please refer to Document [20] in the appendix. Table 25: Recommended W82 list Name W82 Manufacturer SIMCOM Model S2-10ADA 3.6.2 PCIe for RTL8125B PCIe Gen3 lane0 can be connected to RTL8125B-TE as Ethernet data interface. SIM8260A module serves as RC and RTL8125B-TE serves as EP. Need to pull up PCIe_CLKREQ, PCIe_WAKE, PCIe_RST from module to 3.3V. The details design please refer to the reference circuit document. The following figure is the PCIe reference circuit. www.simcom.com 46 / 122 SIM8260A_Hardware Design_V1.05 Figure 24: PCIe interface reference circuit (RC) for RTL8125B NOTE The 220nF AC capacitors should be placed near the PCIe_TX The PCIe control signal voltage domain of the module is 1.8V, through the level shifter, the RTL8125B is 3.3V. For more details about RTL8125B, please refer to Document [17] in the appendix. Table 26: Recommended RTL8125B and RJ45 list Name RTL8125B RJ45 Manufacturer REALTEK ZhengGu Model RTL8125B-CG RJ45-114B4DZ-G020 3.6.3 PCIe Switch When PCIe switch is added, the module can use W82 and others such as AQR113* at the same time. The details design please refer to the QPS615 reference circuit document. The following figure is the PCIe reference circuit. www.simcom.com 47 / 122 SIM8260A_Hardware Design_V1.05 Figure 25: PCIe switch reference circuit NOTE The 220nF AC capacitors should be placed near the PCIe_TX

* means under development. Table 27: Recommended PCIe SWITCH list Name PCIe Switch Manufacturer Qualcomm PCIE clock buffer Diodes W82 module SIMCom Model QPS615 PI6CBF18501ZLAIEX-13R S2-10ADA www.simcom.com 48 / 122 AQR113 QEP8121 RTL8211 MARVELL Qualcomm REALTEK SIM8260A_Hardware Design_V1.05 AQR113C-B0-C QEP-8121-1-56MQFN-**-02-0 RTL8211F-CG 3.6.4 PCIe interface for Qualcomm IPQxxxx PCIe connected to qualcomm IPQxxxx is designed to be used as CPE application, the module does EP and the qualcomm IPQxxxx does RC. Since the PCIe_WAKE, PCIe_RST, and PCIe_CLKREQ control signals of IPQxxxx are in the voltage domain of 1.8V, on the module side, CLKREQ# and PEWAKE# need to be pulled up to 1.8V externally through 100KR. The following figure is a schematic diagram of the module connected to IPQxxxx. Figure 26: Schematic diagram of module connected to IPQxxxx 3.7 SDIO Interface SIM8260A provide 8-bit SDIO interface, which meets the SDIO3.0 specifications and supports SDIO host mode. The clock output up to 200MHz for SD card, and up to 100MHz for eMMC. Support 4-bit dual-voltage 1.8V or 3.0V SD card or 8-bit 1.8V eMMC. The SD card and the eMMC reference circuits are shown below. www.simcom.com 49 / 122

SIM8260A_Hardware Design_V1.05 Figure 27: SD card reference circuit Figure 28: eMMC reference circuit Table 28: Definition of SDIO interface Pin name SDIO_VDD1 Pin no. F7 Pin characteristics PI 1.8/3.0V SDIO_DATA0 B1 DIO P2 www.simcom.com Functional description Comment Power input for internal SDIO circuit SDC data bit 0 or eMMC data bit 0 Required 45 impedance 50 / 122 SIM8260A_Hardware Design_V1.05 SDC data bit 1 or eMMC data bit 1 SDC data bit 2 or eMMC data bit 2 SDC data bit 3 or eMMC data bit 3 SDC command output SDC clock output Enable the SD card power or eMMC data bit 4 SD card insertion detect or eMMC data bit 5 eMMC data bit 6 eMMC data bit 7 eMMC RST_N If used as eMMC data signals, required 45 impedance SDIO_DATA1 C1 DIO P2 SDIO_DATA2 D3 DIO P2 SDIO_DATA3 F3 DIO P2 SDIO_CMD SDIO_CLK SD_VDD_EN SDIO_DET GPIO100 GPIO101 G5 E5 H7 E1 H3 K7 DIO P2 DO DO P2 P3 DI P3 DIO P3 DIO P3 RESOUT_N AW17 DO P3 NOTE If not use SDIO interface, the SD_VDD pin should connect to VDD_EXT out of the module. Table 29: Recommended TVS and SD card socket list Name TVS Manufacturer ON SD card socket ALPS eMMC SanDisk Model ESD9L5.0ST5G SCHA4B0400 SDINBDG4_8G SDIO interface layout guidelines:

Require trace impedance is 45. CLK to DATA/CMD length mismatch is less than 0.5mm. 33 termination resistance on clock be placed in module. Gap from other signals keeps 1.5xline width. Gap lane-to-lane 1.5xline width. Bus capacitance load is less than 5pF. Trace routes away from other sensitive signals. Maximum PCB trace length cannot exceed 30mm out of the module for 104Mbps data rate, the shorter trace and better. Maximum PCB trace length cannot exceed 100mm out of the module for 50Mbps data rate, the shorter trace and better. www.simcom.com 51 / 122 SIM8260A_Hardware Design_V1.05 3.8 (U)SIM Interface SIM8260A supports two (U)SIM cards but single standby. (U)SIM1 and (U)SIM2 are dual-voltage 1.8 V or 3.0 V interfaces. Table 30: (U)SIM electronic characteristics in 1.8V mode ((U)SIM_PWR=1.8V) Symbol Parameter Min.

(U)SIM_VDD Power supply for (U)SIM card 1.65 VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage 1.26 0 1.44 0 Typ. 1.8

Max. 1.95 1.95 0.36 1.8 0.4 Unit V V V V V Table 31: (U)SIM electronic characteristics 3.0V mode ((U)SIM_PWR=3.0V) Symbol Parameter Min. Typ. Max. Unit

(U)SIM_VDD Power supply for (U)SIM card 2.7 3.0 VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage 2.1 0 2.4 0

3.05 3.05 0.6 3.0 0.4 V V V V V The module supports (U)SIM card hot-swap function through the (U)SIM_DET pin, which is a level trigger pin and needs to be pulled up externally. The USIM_DET pin requires pull up externally. The following figure shows (U)SIM card reference circuit. Figure 29: (U)SIM interface reference circuit www.simcom.com 52 / 122 SIM8260A_Hardware Design_V1.05 After inserting (U)SIM card, the (U)SIM_DET pin will change from low to high level. The rising edge will indicate that the (U)SIM card has been inserted. After removing the (U)SIM card, the (U)SIM_DET pin will change from high to low level. This falling edge will indicate the removal of the (U)SIM card. Using AT+UIMHOTSWAPON=0 or 1 and AT+UIMHOTSWAPLEVEL=0 or 1AT command to set module SIM card hot swap function enable and SIM card detection level, for more details, please refer to SIM8200 Series_AT Command Manual document. Using AT+SMSIMCFG=1,1 and AT+SMSIMCFG=1,2 AT command to switch (U)SIM1 and (U)SIM2 function, for more details, please refer to SIM8200 Series_AT Command Manual document. Table 32: Definition of (U)SIM interface Pin name

(U)SIM1_VDD Pin no. B51 Pin characteristics PO P4

(U)SIM1_DATA E51 DIO P4

(U)SIM1_CLK

(U)SIM1_RST D49 C51 DO DO

(U)SIM1_DET E47 DI

(U)SIM2_VDD F49 PO

(U)SIM2_DATA G47 DIO

(U)SIM2_CLK

(U)SIM2_RST H49 G51 DO DO

(U)SIM2_DET F45 DI P4 P4 P3 P5 P5 P5 P5 P3 Functional description Comment Power supply for (U)SIM1 card

(U)SIM1 card data signal, which has been pulled up to

(U)SIM1_VDD by a 20K resistor internally

(U)SIM1 clock signal

(U)SIM1 reset signal

(U)SIM1 card detect signal, which need pulled up to VDD_EXT by a 470K resistor externally Power supply for (U)SIM2 card

(U)SIM2 card data, which has been pulled up to (U)SIM2_VDD by a 20K resistor internally

(U)SIM2 clock signal

(U)SIM2 reset signal

(U)SIM2 card detect, which need pulled up to VDD_EXT by a 470KR resistor externally 1.8/3.0V voltage domain, (U)SIM interface should be protected against ESD. If unused, please keep open The following table shows recommended TVS of ESD protect and (U)SIM socket. Table 33: Recommended TVS and (U)SIM socket list Name TVS Manufacturer ST

(U)SIM socket Suntech Model ESDA6V1-5W6 5039600696 www.simcom.com 53 / 122 SIM8260A_Hardware Design_V1.05 If the (U)SIM card hot-swap function is not used, customers should keep the (U)SIM_DET pin open. The (U)SIM card layout guidelines:

Make sure that the (U)SIM card socket should be far away from the antennas.

(U)SIM traces should be away from RF, VBAT and high-speed signals. The traces should be as short as possible. Keep (U)SIM sockets GND pin directly connect to the main ground. Shielding the (U)SIM card signals by ground. Recommended to place a 33pF1uF capacitor on (U)SIM_VDD net and place close to the holder. The rise/fall time of (U)SIM_CLK should not exceed 40ns. The parasitic capacitance of TVS should not exceed 60pF, and the TVS should be placed close to the (U)SIM socket. 3.9 I2S Interface SIM8260A supports one I2S/PCM interface for external codec, which meets the requirements in the Phillips I2S bus specification. Table 34: I2S format Characteristics Specification Line interface format Data length Linear(fixed) 16bits(fixed) I2S flock/sync source Master mode(fixed) 1.536 MHz (default) 12.288MHz (default) MSB I2S clock sate I2S MCLK rate Data ordering NOTE For more details about I2S AT commands, please refer to document [1] in the appendix. 3.9.1 I2S Timing The module supports I2S sampling rate of 48 KHz and 32bit coding signal (16bit length), the timing sequence is shown in the following figure. www.simcom.com 54 / 122 SIM8260A_Hardware Design_V1.05 Figure 30: I2S timing Table 35: I2S timing parameters Signal Parameter Description I2S_MCLK I2S_CLK I2S_WS Frequency Frequency T t(HC) t(LC) Clock period Clock high Clock low Frequency Frequency T t(HC) t(LC) t(sr) t(hr) t(dtr) t(htr) Clock period Clock high Clock low DIN/DOUT and WS input setup time DIN/DOUT and WS input hold time DIN/DOUT and WS output delay DIN/DOUT and WS output hold time I2S Reference Circuit 3.9.2 The following figure shows the external codec reference design. Min. Typ. Max. Unit 12.288 12.288 MHz 81.380 81.380 0.45T 0.45T 8 20.83 0.45T 0.45T 16.276 0 0 48 20.83 0.55T 0.55T 48 125 0.55T 0.55T 65.10 ns ns ns KHz us ns ns ns ns ns ns www.simcom.com 55 / 122 Figure 31: Audio codec reference circuit SIM8260A_Hardware Design_V1.05 The PCM interface is multiplexing with I2S interface. The default audio interface of the module is I2S. Table 36: The PCM interface is multiplexing with I2S interface Pin name Pin no. Electrical description Description Comment N1 R1 P3 T3 L1 DO P3 I2S/PCM data output DI P3 I2S/PCM data input DO P3 I2S/PCM clock output DIO DO P3 P3 I2S word selection/

PCM synchronization signal I2S master clock output Default is I2S interface, can be configured as PCM interface by software, If unused, please keep open I2S_DOUT/

PCM_DOUT I2S_DIN/

PCM_DIN I2S_CLK/

PCM_CLK I2S_WS/

PCM_SYNC I2S_MCLK NOTE For more details about audio function, please refer to Document [19] in the appendix. Codec ALC5616 supports 5-wire I2S by default. Software can configure the internal registers of ACL5616 to configure 4-wire I2S (without I2S_MCLK signal) or 5-wire I2S (with I2S_MCLK signal) interface. Table 37: Recommended audio list Name ALC5616 Manufacturer REALTEK Model ALC5616-CGT Audio layout guidelines Analog input 0.2mm trace widths; 0.2mm spacing between traces. Pseudo differential route for MIC. Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high speeding signals. Analog output Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other digital signals with fast transients. Speaker output signal route as differential pair with 0.5mm trace widths. www.simcom.com 56 / 122 SIM8260A_Hardware Design_V1.05 3.10 I2C Interface SIM8260A default support two I2C interfaces, meet I2C specification version 5.0, and data rate up to 400 Kbps. The following figure shows the I2C bus reference circuit. Figure 32: I2C reference circuit Table 38: Definition of I2C interface Pin name Pin no. I2C1_SCL I2C1_SDA I2C2_SCL I2C2_SDA M7 P7 AB7 Y7 Electrical description OD OD OD OD description Comment P3 P3 P3 P3 I2C1 default use for codec Pull up to VDD_EXT externally I2C2 default use for sensor Pull up to VDD_EXT externally NOTE NOTE SDA and SCL need to pull up to VDD_EXT by a 2.2K resistor externally. For more details about AT commands please refer to document [1] in the appendix. www.simcom.com 57 / 122 SIM8260A_Hardware Design_V1.05 3.11 UART Interface SIM8260A default supports 3 UART ports for communication, which data rate up to 4Mbps. All the UART level of SIM8260A is 1.8V. If it communicates with the 3.3V serial port level, a level conversion chip needs to be added in the middle. It is recommended to use TXS0104EPWR level shift of TI, the reference circuit is as follows. Figure 33: UART level conversion circuit The following level shifting circuits can also be used:

Figure 34: UART TX level conversion circuit www.simcom.com 58 / 122 SIM8260A_Hardware Design_V1.05 Figure 35: UART RX level conversion circuit Table 39: Definition of UART interface Pin no. AA1 AC1 AB3 AD3 W5 AA5 AC5 R5 U5 T7 V7 L5 N5 Pin name UART1_CTS UART1_RTS UART1_TXD UART1_RXD UART1_DCD UART1_RI UART1_DTR BT_UART_CTS BT_UART_RTS BT_UART_TXD BT_UART_RXD DBG_UART_RXD DBG_UART_TXD NOTE Electrical description description Comment DI DO DO DI DO DO DI DI DO DO DI DI DO P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 P3 Clear to send Request to send Transmit data Receive data Carrier detect Ring indicator Data terminal ready Clear to send Request to send Transmit data Receive data Receive data Transmit data Default use for AT command Default use for BT Used for debug only The 4-wire UART interface support flow control function. The baud rate frequency band supported by the serial port: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600,115200,203400,460800,921600. The UART rate is as high as 4MHZ. When the baud rate is greater than 460bps, is not recommended to use a transistor for level conversion. it The UART rate is as high as 4MHZ. When the baud rate is greater than 460Kbps, it is not recommended to use a transistor for level conversion. UART1 is used as AT command and DTR detection by default, it is not recommended to be used for other functions www.simcom.com 59 / 122 SIM8260A_Hardware Design_V1.05 3.12 SPI Interface SIM8260A SPI interface only supports master mode, data rate up to 50MHz. Usually, SPI interface is used to connect ROM or LCD and other devices. The SPI reference circuit is shown as follows:

Figure 36: SPI reference circuit Table 40: Definition of SPI interface Pin name Pin no. SPI_CS_N SPI_CLK SPI_MOSI SPI_MISO D18 D20 D14 D16 Electrical description DO DO DO DI description SPI chip select SPI clock Master output slaver input Master input slaver output Comment www.simcom.com 60 / 122 SIM8260A_Hardware Design_V1.05 3.13 ADC Interface SIM8260A supports two 16bits ADC interfaces. Its performance parameters are shown as follows:

Table 41: Definition of ADC interface Pin name Pin no. Electrical description description Comment ADC0 ADC1 AH7 AF7 AI AI Table 42: ADC performance parameters Analog to digital converter input0 Analog to digital converter input1 Parameter Comments Min Input voltage range Programmable Resolution Analog input bandwidth Sample rate Accuracy 0

Typ

16 500 4.8 20 Max 1.875

Unit V bits KHz MHz mV www.simcom.com 61 / 122 SIM8260A_Hardware Design_V1.05 3.14 WLAN/BT Interface SIM8260A supports W82 interface including PCIe, UART, GPIOs, and customers can connect to the W82 WLAN/BT module through this interface. The reference circuit is as follows:

Figure 37: SIM8260A and W82 connect circuit Table 43: Definition of WLAN/BT interface Pin name WL_SW_CTRL SDX_TO_WL_CTI Pin no. K49 M49 Electrical description DO DO description Comment W82 switch control W82 GPIO If unused, please keep open www.simcom.com 62 / 122 SIM8260A_Hardware Design_V1.05 WL_TO_SDX_CTI L47 DI W82 GPIO WL_PA_MUTING H45 DO SLEEP_CLK BT_EN WL_EN J51 N51 K45 DO DO DO WL_LAA_RX J47 DI WLAN XFEM control for PA mute Sleep clock output for W82 only W82 BT enable WLAN enable WLAN XFEM control for LAA receiver WL_LAA_AS_EN L51 DO WLAN LAA AS enable COEX_UART_TXD BA7 DO COEX_UART_RXD BA9 DI WL_TXEN_TO_N79 BA37 DI N79_TO_WL_TXEN BA29 DO LTE&WLAN coexistence data transmit LTE&WLAN coexistence data receive From Module N79 to the W82 From the W82 to Module N79 WL_LAA_TX_EN R51 DO From Module to the W82 WL_TX_EN AY14 DI From the W82 to Module If unused, please PD 10k SIM8260C not support LAA, unused please PD 10k LTE coexistence signals SIM8260E/A unused, please keep open SIM8260C/E/A not supported, unused please keep open SIM8260C not supported. NOTE For more details about WIFI function, please refer to Document [20] in the appendix. BT is under development. W82 performance as follows, details please refer to the W82 hardware design. Compliant with IEEE 802.11a/b/g/n/ac/ax. Supports 2x2 Multi-User Multiple-Input Multiple-Output (MU-MIMO.) Tri band 2.4G/5G/6G chains. 20/40 MHz channel bandwidth for 2.4 GHz and 20/40/80/160 MHz channel bandwidth for 5 GHz and 6 GHz Dynamic Frequency Selection (DFS, radar detection). Offloading traffic for minimal host utilization at 11ac/ax speeds. Low power PCIe interface. Support BT 5.2 www.simcom.com 63 / 122 SIM8260A_Hardware Design_V1.05 3.15 PM7250B Interface SIM8260A supports PM7250B interface, customers can use PM7250B to manage the charge of the module. The reference circuits as follows:

Figure 38: PM7250B interface diagram circuit Table 44: Definition of PM7250B interface Pin name Pin no. Pin characteristics Functional description Comment USB_VBUS C9 AI USB VBUS detection Not support charge CHG_SYS_OK C43 DI FAULT_N B44 DIO SPMI_CLK A47 DO When charger input is inserted PM7250B output signal to PMU. When the charging chip is not used, this pin can be connected to GND to realize the power-on function Used to send/receive the fault condition across all PMICs in the chipset SPMI communication bus clock signal SPMI_DATA B46 DIO SPMI communication bus data signal L10E_3P1 C41 PO Output power supply for PM7250B USB PD-PHY and USB switch VIO_OUT D42 PO Output power for PM7250B IO circuit Required 50 impedance www.simcom.com 64 / 122 SIM8260A_Hardware Design_V1.05 PM7250B performance as follows: please refer to SIM8260A reference design for details Supports USB Type-C specification Rev. 3.1 and USB power delivery specification Rev. 3.0. Supports Qualcomm Quick Charge 2.0, Quick Charge 3.0, and Quick Charge 4.0* technology. NOTE

*means Indicates to be updated. For more details about charge function, please refer to Document [17] in the appendix. SPMI interface layout guidelines:

Require single-ended trace impedance is 50 10%. CLK to DATA length mismatch is less than 0.5mm. Bus capacitance load is less than 10PF. Gap to other signals keeps 3xline width. Gap clock-to-data keeps 2xline width. Trace routes away from sensitive signals. Maximum PCB trace length cant exceed 50mm out of the moduleThe shorter trace and better. www.simcom.com 65 / 122 SIM8260A_Hardware Design_V1.05 3.16 GPIOs Interface The follow pins of SIM8260A can be used as GPIO function, If the customer does not want to use the GPIO default configuration, they can choose the Alternate option in the table below, but they need to contact our company for confirmation. Table 45: GPIO list PIN Name I2S_WS I2S_DIN I2S_DOUT I2S_CLK BT_I2S_WS BT_I2S_DIN BT_I2S_DOUT BT_I2S_CLK UART1_TXD UART1_RXD UART1_CTS UART1_RTS BT_UART_TXD BT_UART_RXD BT_UART_CTS BT_UART_RTS SPI_MOSI SPI_MISO SPI_CS_N SPI_CLK GPIO107 GPIO82 GPIO83 GPIO31 PIN No. T3 R1 N1 P3 G1 M3 K3 J1 AB3 AD3 AA1 AC1 T7 V7 R5 U5 D14 D16 D18 D20 U1 V3 Y3 GPIO GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO48 GPIO49 GPIO80 GPIO81 GPIO63 GPIO64 GPIO65 GPIO66 GPIO4 GPIO5 GPIO6 GPIO7 GPIO107 GPIO82 GPIO83 C29 GPIO31 TDD_SYNC_PPS AW21 GPIO47 W_DISABLE GPIO88 AE5 AG1 AG5 GPIO32 GPIO47 GPIO86 GPIO88 Default function I2S_WS I2S_DIN I2S_DOUT I2S_SCK Alternate function 1 PCM_SYNC PCM_DIN PCM_DOUT PCM_CLK Alternate function 2 inter rupt BT_I2S_WS BT_I2S_DIN SPI_MOSI UART_TX SPI_MISO UART_RX BT_I2S_DOUT SPI_CS_N UART_CTS BT_I2S_SCK SPI_CLK UART_RTS UART1_TX UART1_RX UART1_CTS UART1_RTS BT_UART_TX BT_UART_RX BT_UART_CTS BT_UART_RTS I2C_SDA I2C_SCL SPI_MOSI SPI_MISO UART_TX UART_RX UART_CTS UART_RTS I2C_SDA I2C_SCL I2C_SDA SPI_CS_N I2C_SCL SPI_CLK SPI_MOSI SPI_MISO SPI_CS SPI_CLK GPIO107 GPIO82 GPIO83 GPIO31 TDD_SYNC_PP S ETH_1_INTN_W OL W_DISABLE ETH_0_INTN_W OL www.simcom.com 66 / 122 SIM8260A_Hardware Design_V1.05 AK7 AM7 AF3 D36 D38 GPIO92 GPIO96 GPIO97 GPIO102 GPIO105 AY10 GPIO106 GPIO92 GPIO96 SLEEP_OUT GPIO102 GPIO105 GPIO106 AP7 AJ5 AE1 PMU_GPIO6 PMU_GPIO6 PMU_GPIO13 STATUS PMU_GPIO14 NET_STATUS GPIO92 GPIO96 SLEEP_OUT GPIO102 GPIO105 GPIO106 PMU_GPIO6 STATUS NET_STATUS NOTE means the GPIO support interrupt function. GPIO default state is B-PD, GPIO66 cannot be pulled up externally. UART1 is used as AT command by default, it is not recommended to be used for other functions 3.17 Network Status The NET_STATUS pin is used to control network status LED, its reference circuit is shown in the following figure. Figure 39: NET_STATUS reference circuit Table 46: Definition of NET_STATUS pin Pin Name Pin No. Electrical Description NET_STATUS AE1 DO P3 Description Comments Indicate network activity status of the module www.simcom.com 67 / 122 SIM8260A_Hardware Design_V1.05 NOTE The value of the resistor R1 depends on the LED characteristics. The timing parameters are shown in the following table. Table 47: NET_STATUS pin status NET_STATUS pin status Always On Module status Searching network; call connection (including 5G, VOLTE) 100ms ON, 100ms OFF 5G Data transmitting; 5G registered on network 200ms ON, 200ms OFF 3G/4G Data transmitting; 4G registered on network 800ms ON, 800ms OFF 3G registered on network OFF Power off; in sleep mode 3.18 Flight Mode Control The W_DISABLE pin can be used to control SIM8260A to enter or exit the flight mode. In flight mode, the RF circuit is closed to prevent interference with other equipments and minimize current consumption. Its reference circuit is shown in the following figure. Figure 40: W_DISABLE pin reference circuit Table 48: Definition of W_DISABLE pin Pin Name Pin No. Electrical Description W_DISABLE AG1 DI P3 Description Comments Flight mode control input active low Table 49: W_DISABLE pin status www.simcom.com 68 / 122 SIM8260A_Hardware Design_V1.05 W_DISABLE pin status Input low level Module operation Flight mode: RF is disabled Input high level AT+CFUN=0: Minimal functional mode (SIM card function is off) AT+CFUN=4: Flight mode (SIM card function is on) AT+CFUN=1: RF is enabled (Default) Both W_DISABLE and AT commands can change the working mode of the module, but W_DISABLE has a higher priority. When W_DISABLE is low, it is forced to enter flight mode. When W_DISABLE is high, it can enter different working modes by sending AT commands. 3.19 TDD_SYNC_PPS SIM8260A support TDD_SYNC_PPS signal, it can generate pulse use for indication NSA and SA sub6 the beginning frame flag of DL-UL, the pin level is 1.8V, customers can direct connect this pin to TDD synchronous input circuit. Recommended reference circuit is shown in the following figure. Figure 41: TDD_SYNC_PPS pin reference circuit Table 50: Definition of TDD_SYNC_PPS pin Pin name Pin no. Electrical description Description Comments TDD_SYNC_PPS AW21 DO NOTE It can generate pulse 1. use for indication NSA and SA sub6 the beginning frame flag of DL-UL 2. The TDD_SYNC_PPS pin also can be configured GPS_1PPS signal output by software 1.8V voltage domain. The TDD_SYNC_PPS and GPS_1PPS function cant be used at the same time. The TDD_SYNC_PPS pin also can be configured GPS_1PPS signal output by software, the www.simcom.com 69 / 122 TDD_SYNC_PPS and GPS_1PPS function cant be used at the same time. SIM8260A_Hardware Design_V1.05 The following is TDD_SYNC_PPS signal design guidelines This signal trace should be treated as a data transmission line, required impedance is 50 . This signal trace should as short as possible and cannot exceed 40mm out of the module. This signal trace should far away from RF, power and high-speed signals. This signal trace should be protected completely by GND. The rising slew rate is no poor than 3ns, falling slew rate is no poor than 5ns, even with default lowest drive strength (2mA) being selected. 3.20 Antenna Control Interface*

ANT_CTL [0:1] and RFFE0 signals are used for tunable antenna control and should be routed to an appropriate antenna control circuitry. The following table are the definitions for antenna control interfaces. Table 51: Definition of antenna control interface through GPIOs Pin Name Pin No. Electrical Description Description Comments RFFE0_CLK BA11 DO Antenna tuner MIPI CLK RFFE0_DATA BA13 DIO Antenna tuner MIPI DATA ANT_CTRL0 BA15 ANT_CTRL1 AY16 DO DO Antenna tuner control0 Antenna tuner control1 1.8V voltage domain. If unused, please keep open NOTE

* means under development, for details please contact SIMCom support teams. The RFFE0 signals are multiplexed with ANTCTL2 and ANTCTL3. www.simcom.com 70 / 122 SIM8260A_Hardware Design_V1.05 4 Antenna Interfaces SIM8260A provides four antennas for 3G/4G/5G and GNSS. The antenna ports have an RF impedance of 50. 4.1 Antenna Definitions For detailed designs about antenna and if there is a requirement for minimum antennas, please refer to the antenna design guide SIM8200 Series_LGA Antenna Port Mapping and Design Guide. Table 56: The Antenna port definitions of A SIM8260A Frequency band 3G/4G/5G 3G/4G/5G 5G LB MHB n41/n77/n78/n79 Antenna ANT0 ANT1 ANT2 ANT3 GNSS TX0/DRX TX0/PRX TX0/DRX_MIMO 3G/4G/5G 5G 4G 3G/4G/5G 5G 4G GNSS 3G/4G/5G 3G/4G/5G 5G GNSS MHB n77/n78/n79 LAA MHB n77/n78/n79 LAA L1 DRX_MIMO DRX DRX PRX_MIMO PRX_MIMO PRX LB MHB n41/n77/n78/n79 TX1/PRX TX1/DRX TX1/PRX L1 L5*

NOTE 4G LB only support 2*2 DL-MIMO, the detailed information reference document [14].

* means not supported by default. www.simcom.com 71 / 122 SIM8260A_Hardware Design_V1.05 4.1.1 3G/4G/5G Operating Frequency Table 57: 3G/4G band frequency Frequency band WCDMA B2 WCDMA B4 WCDMA B5 LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 LTE B14 LTE B17 LTE B25 LTE B26 LTE B66 LTE B71 LTE B41 Uplink (UL) Downlink (DL) 1850 MHz ~ 1910 MHz 1930 MHz ~ 1990 MHz 1710 MHz ~ 1755 MHz 2110 MHz ~ 2155 MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 1850 MHz ~ 1910 MHz 1930 MHz ~ 1990 MHz 1710 MHz ~ 1755 MHz 2110 MHz ~ 2155 MHz 824 MHz ~ 849 MHz 869 MHz ~ 894MHz 2500 MHz ~ 2570MHz 2620 MHz ~ 2690MHz 698 MHz ~ 716 MHz 728MHz ~ 746 MHz 777 MHz ~ 787 MHz 746 MHz ~ 756 MHz 788 MHz ~ 798 MHz 758 MHz ~ 768 MHz 704 MHz ~ 716 MHz 734 MHz ~746 MHz 1850 MHz ~ 1915MHz 1930 MHz ~ 1995MHz 814 MHz ~ 849 MHz 859 MHz ~ 894 MHz 1710 MHz ~ 1780 MHz 2110 MHz ~ 2220 MHz 663 MHz ~ 698 MHz 617 MHz ~ 652 MHz 2496 MHz ~ 2690 MHz 2496 MHz ~ 2690 MHz Table 58: NR band frequency Frequency band NR n2 NR n5 NR n7 NR n12 NR n14 NR n25 NR n26 NR n41 NR n48 NR n66 NR n71 NR n77 NR n78 Uplink (UL) Downlink (DL) 1850MHz ~ 1910MHz 1930MHz ~ 1990MHz 824MHz ~ 849MHz 869MHz ~ 894MHz 2500MHz ~ 2570MHz 2620MHz ~ 2690MHz 698MHz ~ 716MHz 788MHz ~ 798MHz 728MHz ~ 746MHz 758MHz ~ 768MHz 1850MHz ~ 1915MHz 1930MHz ~ 1995MHz 814MHz ~ 849MHz 859MHz ~ 894MHz 2496MHz ~ 2690MHz 2496MHz ~ 2690MHz 3550MHz ~ 3700MHz 3550MHz ~ 3700MHz 1710MHz ~ 1780MHz 2110MHz ~ 2220MHz 663 MHz ~ 698 MHz 617 MHz ~ 652 MHz 3300MHz ~ 4200MHz 3300MHz ~ 4200MHz 3300MHz ~ 3800MHz 3300MHz ~ 3800MHz Duplex mode WCDMA WCDMA WCDMA FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD Duplex mode FDD FDD FDD FDD FDD FDD FDD TDD TDD FDD FDD TDD TDD www.simcom.com 72 / 122 4.1.2 GNSS Frequency The following table shows frequency specification of GNSS antenna interface. SIM8260A_Hardware Design_V1.05 Table 59: GNSS frequency Type GPS L1/Galileo/QZSS GPS L5 GLONASS BeiDou/Compass Frequency 1575.421.023MHz 1176.4510.23MHz 1597.5~1605.8MHz 1561.0982.046MHz www.simcom.com 73 / 122 SIM8260A_Hardware Design_V1.05 4.2 Antenna Installation 4.2.1 PCB Layout Guidelines To avoid interference, minimalize the insertion loss of the RF trace, the PCB should follow below rules:

The coaxial cable PCB pads, RF antenna connector and other connectors which used to test contact performance of module should place as close as to the module antenna pads. The antenna matching network should place to antenna feed port. The RF trace should be as short and straight as possible, and do not routing as perpendicular line, we recommend do it as 45 corner trace. The RF traces should be grounded. RF device should place grounding wire on the nearest grounding surface. Between RF trace and below should avoid other signal trace or parallel trace to the RF signal. Recommend to more ground vias near the RF traces. 4.2.2 Antenna Tuner When the device supports 700MHz low frequency(B12\B13\B28), it is recommended to add antenna tuner to improve RF performance. Antenna tuner contains antenna aperture tuner, antenna impedance tuner an d hybrid tuner of the two. Aperture tuning optimizes the total antenna efficiency from the free space of the antenna terminal, and can optimize antenna efficiency across multiple frequency bands. Impedance tuner adjusts the mismatch between the RF front end and the antenna to achieve maximum transmission power. Hybrid tuner combines the advantages of the two to maximize antenna RF performance. Customers can choose according to specific needs, according to the recommendations from the antenna vendor. Figure 43: Aperture tuner reference block diagram www.simcom.com 74 / 122 SIM8260A_Hardware Design_V1.05 Figure 44: Impedance tuner reference block diagram Figure 45: Hybrid tuner reference block diagram The antenna control Tuner mipi interface of different package modules are as follows. Figure 46: LGA package Tuner mipi interface www.simcom.com 75 / 122 SIM8260A_Hardware Design_V1.05 NOTE When multiple Tuners are needed, pay attention to the distinction of the same device USID under the same group of mipi. For details, please refer to the Antenna Tuner Reference Design document and contact SIMCom support teams. 4.2.3 Antenna Requirements The following table shows the requirements on 3G/4G/5G antennas and GNSS antenna. Table 60: 3G/4G/5G/GNSS antennas Parameter Operating Frequency Direction Gain Impedance Efficiency Max. Input Power VSWR Isolation Requirement See Table 7 for each antenna Omni Directional

> -3dBi (Avg) 50

> 50 %

50W

< 2 20dB is preferred Cable Insertion Loss <1GHz Cable Insertion Loss 1GHz~2.2GHz Cable Insertion Loss 2.3GHz~2.7GHz Cable Insertion Loss 3.3GHz~6GHz

<1dB

<1.5dB

<2dB

<2.5dB Table 61: GNSS antenna (for dedicated GNSS antenna only)*

Parameter Operating Frequency Direction Antenna Gain Impedance Efficiency Max. Input Power VSWR Polarization Requirement L1: 1559~1609MHZ L5: 1166~1187MHz Hemisphere, face to sky

> 2 dBic 50

> 50 %

50W

< 2 RHCP or Linear Noise Figure for Active Antenna

< 1.5 www.simcom.com 76 / 122 SIM8260A_Hardware Design_V1.05 Total Gain for Active Antenna Cable Insertion Loss

< 17 dB

<1.5dB NOTE

*: These recommendations are for dedicated GNSS antenna which the application need best of class GNSS tracking performance. 4.2.4 RF Plug Recommendation SIM8260A is mounted with I-PEXs receptacle RF connectors 20449-001E-03, which size is 2.0mm*2.0mm*0.6mm. The connector dimensions are shown as below. Figure 47: 3D view of 20449-001E-03 The following table shows the RF connectors electrical specifications. Table 62: Electrical Specifications of 20449-001E-03 Item Voltage Rating Nominal Frequency Range Nominal Impedance Temperature Rating Insulation Resistance Withstanding Voltage www.simcom.com Specification 60V r.m.s. maximum DC to 6GHz 50

-40C to +90C 500 M minimum No evidence of breakdown 77 / 122 Initial Contact Resistance

(Without conductor resistance) Center contact 20.0mmax. Outer contact 20.0mmax. SIM8260A_Hardware Design_V1.05 Voltage Standing Wave Ratio (V.S.W.R.) Meet the requirements of 1.3 max. (DC 1.45 max. (3GHz 3GHz) 6GHz) To get best RF performance, the RF plug connector should be designed to match the receptacle 20449-001E-03, and the parts come from I-PEX is the recommended. The following is the mechanical information of the I-PEXs RF coaxial cable GLJ-RH120-1901 for reference, for further technical support, the customer could visit the I-PEXs website or contact the local sales team. Figure 48: 3D view of 20449-001E-0 www.simcom.com 78 / 122 SIM8260A_Hardware Design_V1.05 5 Electrical Specifications 5.1 Absolute Maximum Ratings Absolute maximum rating for digital and analog pins of module are listed in the following table:

Table 63: Absolute maximum ratings Parameter Voltage at VBAT1 pins Voltage at USB_VBUS Voltage at PWRKEY Voltage at RESIN_N Voltage at digital pins (GPIO, I2C, UART, I2S) Voltage at digital pins (U)SIM Min. Typ. Max. Unit

4.8 6 2.1 1.9 2.1 3.05 V V V V V V NOTE 1.The VBAT include VBAT_BB and VBAT_RF pins. www.simcom.com 79 / 122 SIM8260A_Hardware Design_V1.05 5.2 Operating Conditions Table 64: VBAT recommended operating ratings Parameter Voltage at VBAT1 pins Min. 3.3 Typ. 3.8 Max. 4.4 Unit V NOTE 1. The VBAT include VBAT_BB and VBAT_RF pins. Table 65: 1.8V digital I/O characteristics Parameter Description Min. Typ. Max. Unit High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage High-level, tri-state leakage current

(No pull-down resistor) Low-level, tri-state leakage current

(No pull up resistor) Input high leakage current (No pull-down resistor) Input low leakage current (no pull up resistor) 1.17 0 1.35 0

-1

-1

2.1 0.63 1.8 0.45 1

1

V V V V uA uA uA uA VIH VIL VOH VOL IOZH IOZL IIH IIL NOTE These parameters are for digital interface pins, such as UART, I2C, I2S, SPI, and GPIOs

(SIM_DET, SD_DET). Table 66: Operating temperature Parameter Normal operation temperature (3GPP compliant) Extended operation temperature Storage temperature www.simcom.com Min.

-30

-40

-40 Typ. Max. Unit

70 85 90 C C C 80 / 122 SIM8260A_Hardware Design_V1.05 5.3 Operating Mode 5.3.1 Operating Mode Definition The table below summarizes the various operating modes of module. Table 67: Operating mode definition Mode UMTS/LTE/5G Sleep Function AT command AT+CSCLK=1 can be used to set the module to a sleep mode. In this case, the current consumption of module will be reduced to a very low level and the module can still receive paging message and SMS. UMTS/LTE/5G Idle Software is active. Module is registered to the network and ready to communicate. Normal operation UMTS/LTE/5G Talk Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences and antenna. UMTS/LTE/5G Standby Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. UMTS/LTE/5G Data transmission There is data transmission in progress. In this case, power consumption is related to network settings (e. g. power control level);

uplink/downlink data rates, etc. Minimum functionality mode Flight mode Power off AT command AT+CFUN=0 can be used to set the Module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the Module will not work and the (U)SIM card will not be accessible, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. AT command AT+CFUN=4 or pulling down the W_disable1# pin can be used to set the Module to flight mode without removing the power supply. In this mode, the RF part of the Module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. Normally module will go into power off mode by sending the AT command AT+CPOF or pull down the FUL_CARD_POWER_OFF#

pin. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are not accessible. www.simcom.com 81 / 122 SIM8260A_Hardware Design_V1.05 5.3.2 Sleep Mode In sleep mode, the current consumption of module will be reduced to a very low level. Several hardware and software conditions must be satisfied in order to let module enter sleep mode:

1. UART condition 2. USB condition 3. Software condition NOTE Before designing, pay attention to how to realize sleeping/waking function. 5.3.3 Minimum Functionality Mode and Flight Mode Minimum functionality mode ceases a majority function of Module, in order to minimizing the power consumption. This mode is set by the AT command which provides a choice of 3 different functionality levels. AT+CFUN=0: Minimum functionality AT+CFUN=1: Full functionality (Default) AT+CFUN=4: Flight mode If module has been set to minimum functionality mode, the RF (U)SIM card function will be closed while the serial port and USB are still available. If module has been set to flight mode, the RF function will be closed, while the (U)SIM card, the serial port and USB are still available. When module is in minimum functionality or flight mode, it can return to full functionality by the AT command AT+CFUN=1. www.simcom.com 82 / 122 SIM8260A_Hardware Design_V1.05 Typical Unit 135*

TBD 2.6 4.5 3.5 2.6 10.5 6.5 4.5 4 2.6 10.5 6.5 4.5 4 2.6 10.5 6.5 4.5 4 28 28 28 28 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 5.4 Current Consumption The current consumptions are listed in the follows table. Table 68: Current consumption on VBAT pins (VBAT=3.8V) Description Power off mode GNSS mode Condition. Power off

(AT+CFUN=0, connection USB) WCDMA(AT+CFUN=0) WCDMA DRX=1.28s WCDMA DRX=2.56s LTE-FDD(AT+CFUN=0) LTE-FDD DRX=0.32s LTE-FDD DRX=0.64s LTE-FDD DRX=1.28s LTE-FDD DRX=2.56s LTE-TDD(AT+CFUN=0) LTE-TDD DRX=0.32s LTE-TDD DRX=0.64s LTE-TDD DRX=1.28s LTE-TDD DRX=2.56s NR* (AT+CFUN=0) NR DRX=0.32s NR DRX=0.64s NR DRX=1.28s NR DRX=2.56s WCDMA LTE FDD LTE TDD 5G SA Max 865mA Max 865mA Max 865mA Max 895mA Max 895mA Max 765mA Max 945mA Sleep mode

(GNSS off, without connection USB) Idle mode

(GNSS off, without connection USB) HSDPA data*

WCDMA B2 WCDMA B4 WCDMA B5 LTE data LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 www.simcom.com 83 / 122 SIM8260A_Hardware Design_V1.05 Max 765mA Max 765mA Max 765mA Max 765mA Max 895mA Max 765mA Max 895mA Max 765mA Max 955mA Max 960mA Max 765mA Max 985mA Max 765mA Max 765mA Max 960mA Max 765mA Max 1400mA Max 800mA Max 960mA Max 765mA Max 1000mA Max 1000mA LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B25 LTE-FDD B26 LTE-FDD B66 LTE-FDD B71 LTE-TDD B41 5G NR data 5G n2 5G n5 5G n7 5G n12 5G n14 5G n25 5G n26 5G n41 5G n48 5G n66 5G n71 5G n77 5G n78 NOTE The VBAT include VBAT_BB and VBAT_RF pins. The current consumption of the above table only for reference, please refer to actual current consumption. Use BAND N78 for 5G NR current test RF current consumption data is based on maximum power 220.5dBm test for PC3 and 26 1dBm test for PC2 5.5 RF Output Power The RF output power is shown in the following table. Table 69: Conducted output power www.simcom.com 84 / 122 SIM8260A_Hardware Design_V1.05 B2 WCDMA B4 B5 B2 B4 B5 B7 B12 B13 B14 B17 B25 B26(Part2 2 B26(Part9 0 B41 B66 B71 LTE RMC QPSK HSDPA QPSK HSUPASubtest1 QPSK/16QAM HSUPASubtest2 QPSK/16QAM HSUPASubtest3 QPSK/16QAM QPSK/16QAM HSUPASubtest4 HSUPASubtest51852.4/1907.6 QPSK/16QAM QPSK/16QAM HSUPASubtest51880 QPSK RMC QPSK HSDPA QPSK/16QAM HSUPA QPSK RMC QPSK HSDPA QPSK/16QAM HSUPASubtest1/2 QPSK/16QAM HSUPASubtest3 23.11 22.11 201 211 17.21 22.51 171 21.91 23.21 22.51 22.51 24.31 23.51 221 191 HSUPASubtest4 QPSK/16QAM 23.51 HSUPASubtest5 1.4/3/5/10/15/20MHz 1.4/3/5/10/15/20MHz 1.4/3MHz 5/10MHz 5/10/15/20MHz 1.4/3/5/10MHz 5/10MHz 5/10MHz 5/10MHz 1.4/3/5/10/15/20MHz QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM 181 27.41 27.81 28.31 28.41 26.71 27.91 28.31 281 281 27.51 1.4/3/5/10MHz QPSK/16QAM 281 1.4/3/5/10MHz QPSK/16QAM 26.51 5/10/15/20MHz 5/10/15/20MHz 1.4/3/5/10/15/20MHz 1.4/3/5/10/15/20MHz 5/10/15/20MHz 5MHz 10/15MHz(L/M) 10/15MHz(H) 20MHz QPSK 16QAM QPSK 16QAM QPSK 16QAM 16QAM 16QAM 16QAM 24.21 23.31 24.21 23.31 261 26.21 26.11 25.21 25.21 www.simcom.com 85 / 122 5+20/10+5/10+20/15+20/15+15/

15+20/20+5/20+10/20+15/20+20 MHz 5+20/10+5/10+20/15+20/15+15/

15+20/20+5/20+10/20+15/20+20 MHz 5+20/10+5/10+20/15+20/15+15/

15+20/20+5/20+10/20+15/20+20 MHz 5+20/10+5/10+20/15+20/15+15M Hz 15+20/20+5/20+10/20+15/20+20 MHz(Size1) 15+20/20+5/20+10/20+15/20+20 MHz 1.4/3/5/10/15/20MHz PCC 1.4/3/5/10/15/20MHz PCC 1.4/3/5/10/15/20MHz PCC 1.4/3/5/10/15/20MHz PCC 1.4/3/5/10/15/20MHz SCC 1.4/3/5/10/15/21MHz SCC 1.4/3/5/10/15/22MHz SCC 1.4/3/5/10/15/23MHz SCC 5/10/15/20MHz PCC 5/10/15/20MHz PCC 5/10/15/20MHz PCC 5/10/15/20MHz PCC 5/10/15/20MHz SCC 5/10/15/20MHz SCC 5/10/15/20MHz SCC 5/10/15/20MHz SCC 1.4/3/5/10/15/20MHz PCC 1.4/3/5/10/15/20MHz PCC 1.4/3/5/10/15/20MHz PCC 1.4/3/5/10/15/20MHz PCC 5/10/15/20MHz SCC 5/10/15/20MHz SCC 5/10/15/20MHz SCC 5/10/15/20MHz SCC 3/5/15/10MHz PCC 3/5/15/10MHz PCC 3/5/15/10MHz PCC 3/5/15/10MHz PCC 1.4/3/5/10/15/20MHz SCC CA_41C CA_2A-4A CA_2A-12A CA_2A-66A CA_12A-66 A SIM8260A_Hardware Design_V1.05 16QAM 24.31 64QAM 23.41 256QAM 20.31 QPSK QPSK QPSK QPSK Q16 Q64 Q256 QPSK Q16 Q64 Q256 QPSK Q16 Q64 Q256 QPSK Q16 Q64 Q256 QPSK Q16 Q64 Q256 QPSK Q16 Q64 Q256 QPSK Q16 Q64 Q256 QPSK 24.81 25.31 23.51 21.51 21.61 21.61 18.81 21.21 21.21 21.31 18.41 20.61 20.61 20.31 17.61 21.71 21.81 21.41 18.51 20.31 20.41 20.41 17.51 19.91 19.81 20.01 17.11 21.71 21.81 21.31 18.41 20.81 www.simcom.com 86 / 122 SIM8260A_Hardware Design_V1.05 1.4/3/5/10/15/21MHz SCC 1.4/3/5/10/15/22MHz SCC 1.4/3/5/10/15/23MHz SCC 1852.5 1860 1900 1880 1907.5 1855 1905 1902.5 1857.5 1852.5 1855 1857.5 Outer_Full 1857.5 1860 1880 1902.5 Outer_Full 1902.5 1905 1907.5 Inner_Full Outer_Full CP Outer_Full DFT Edge_1RB_Left CP Edge_1RB_Left DFT Edge_1RB_Right CP Edge_1RB_Right DFT Inner_Full Outer_Full Edge_1RB_Left Edge_1RB_Right Inner_Full Outer_Full Edge_1RB_Left CP Edge_1RB_Left DFT Q16 Q64 Q256 QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 256QAM pi/2 BPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 20.71 20.41 17.41 22.61 22.711 22.451 22.561 22.21 22.591 22.291 22.421 22.71 22.41 22.61 21.61 22.71 22.631 21.61 21.61 22.61 22.41 221 21.61 21.31 22.91 23.31 21.31 23.41 21.41 23.41 21.21 23.31 21.81 21.821 22.51 22.21 23.41 22.351 20.71 21.91 n2,DC_7A_ n2A 5G B66-n5,DC _7A_n5A,D C_66A_n5A

,DC_7A-66 A-66A_n5A www.simcom.com 87 / 122 SIM8260A_Hardware Design_V1.05 Edge_1RB_Right CP Edge_1RB_Right DFT Inner_Full Outer_Full Edge_1RB_Left Edge_1RB_Right inter_Full CP inter_Full DFT (2510MHz inter_Full DFT Outer_Full CP Outer_Full DFT Edge_1RB_Left CP Edge_1RB_Left DFT Edge_1RB_Left DFT 2510M Edge_1RB_Right CP Edge_1RB_Right DFT Inner_Full Outer_Full CP Outer_Full DFT Edge_1RB_Left CP Edge_1RB_Left DFT Edge_1RB_Right CP Edge_1RB_Right DFT n7,DC_2A_ n7A,DC_5A _n7A,DC_6 6A_n7A,DC _5A-7A_n7 A,DC_66A-

66A_n7A,D C_7C-66A-

66A_n5A 64QAM 64QAM 256QAM 256QAM 256QAM 256QAM pi/2 BPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 20.71 21.71 21.821 21.91 21.71 21.31 23.31 23.01 20.91 23.31 21.41 23.41 21.51 21.01 23.51 21.61 23.31 23.51 21.51 22.41 21.51 22.51 21.61 22.51 22.01 256QAM 22.01 Inner_Full 2510M pi/2 BPSK 20.91 Inner_Full pi/2 BPSK 23.41 Outer_Full 2510M pi/2 BPSK 20.91 Outer_Full Edge_1RB_Left Edge_1RB_Right pi/2 BPSK pi/2 BPSK 23.41 21.51 pi/2 BPSK 21.51 n12 CP DFT CP DFT CP DFT QPSK QPSK 16QAM 16QAM 64QAM 64QAM 21.41 22.01 20.91 22.01 19.41 20.51 www.simcom.com 88 / 122 SIM8260A_Hardware Design_V1.05 CP Outer_Full DFT 707.5M Outer_Full DFT Inner_Full DFT Edge_1RB_Left DFT 707.5M Edge_1RB_Left DFT Edge_1RB_RightDFT CP DFT CP DFT n14 Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP DFT CP DFT CP DFT CP B66-n25,D C_66A_n25 A,DC_7C_n 5A,DC_66A

-66A_n5A, DC_2A-66A _n25A, DFT Outer_Full CP 1882.5MHz Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP n26PART22 DFT DFT CP n26 part90 CP DFT 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM pi/2 BPSK QPSK QPSK 16QAM 16QAM 64QAM 256QAM pi/2 BPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 64QAM 64QAM 256QAM 256QAM 256QAM QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 64QAM 256QAM pi/2 BPSK QPSK QPSK 19.51 20.51 18.31 20.51 18.11 20.11 22.01 21.51 22.41 23.01 21.91 22.81 21.41 21.41 22.91 22.01 22.31 21.41 21.41 23.31 23.031 22.01 22.71 21.71 20.91 20.91 19.51 22.31 20.81 21.01 20.81 23.01 22.71 21.81 21.41 21.41 22.81 22.31 22.91 www.simcom.com 89 / 122 SIM8260A_Hardware Design_V1.05 Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP Outer_Full CP Inner_Full CP Edge_1RB_Left CP Edge_1RB_Right CP Outer_Full DFT Inner_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT Outer_Full CP Inner_Full CP Edge_1RB_Left CP Edge_1RB_Right CP Outer_Full DFT Inner_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT CP DFT Outer_Full CP Inner_Full CP n41,DC_2A _n41A,DC_ 66A_n41A, DC_2A-2A_ n41A,DC_2 A-66A_n41 A,DC_2C-6 6A_n41A,D C_2A-2A-6 6A_n41A 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 256QAM pi/2 BPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 64QAM 256QAM 256QAM Edge_1RB_Left CP 2506.02MHz 256QAM Edge_1RB_Left CP Edge_1RB_Right CP Outer_Full DFT Inner_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT Outer_Full DFT Inner_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM pi/2 BPSK pi/2 BPSK pi/2 BPSK pi/2 BPSK 21.91 20.91 20.91 20.91 22.81 21.31 21.41 22.81 23.71 25.21 23.31 23.41 25.71 25.51 23.31 23.51 23.71 24.81 23.31 23.51 24.61 25.71 23.31 23.51 23.31 24.21 23.11 23.31 19.51 23.01 23.11 25.21 24.31 23.01 23.11 25.51 25.71 23.31 23.41 www.simcom.com 90 / 122 SIM8260A_Hardware Design_V1.05 n41-MIMO Inner_Full Outer_Full Edge_1RB_Left Edge_1RB_Right Inner_Full Outer_Full Edge_1RB_Left Edge_1RB_Right n66,DC_2A _n66A,DC_ 5A_n66A,D C_7A_n66A

,DC_12A_n 66A,DC_7C _n66A,DC_ 2A-12A_n6 6A,DC_5A-

7A_n66A,D C_5A-66A_ n66A,DC_1 2A-66A_n6 6A,DC_7A-

66A_n66A, DC_5A-7A-

66A_n66A, DC_5A-7C_ n66A,DC_5 A-7C-66A_ n66A Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP 1767.5MHz Edge_1RB_Right CP Inner_Full DFT Outer_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT 1767.5MHz Edge_1RB_Right DFT Inner_Full CP 1722.5MHz Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP Inner_Full DFT Outer_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP Edge_1RB_Right CP 1767.5MHz Inner_Full DFT Outer_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 64QAM 256QAM QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 256QAM 256QAM 256QAM 256QAM 25.31 23.91 23.31 23.41 24.91 23.91 23.31 23.51 23.51 23.51 22.21 20.71 20.61 21.71 20.51 22.71 22.71 22.51 23.61 22.51 20.01 21.61 20.71 20.31 21.31 22.71 21.71 21.61 22.51 20.21 20.21 19.81 19.81 20.91 21.21 21.11 20.91 21.861 20.21 20.21 19.91 20.91 www.simcom.com 91 / 122 SIM8260A_Hardware Design_V1.05 Inner_Full DFT Outer_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT Inner_Full DFT Outer_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT 1767.5MHz Edge_1RB_Right DFT Inner_Full CP Outer_Full CP Edge_1RB_Left CP Edge_1RB_Right CP DFT CP DFT 256QAM 256QAM 256QAM 256QAM pi/2 BPSK pi/2 BPSK pi/2 BPSK pi/2 BPSK pi/2 BPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 64QAM 256QAM 21.21 21.21 20.61 21.61 22.61 22.61 22.41 23.51 22.41 22.91 21.41 21.41 21.31 23.51 22.51 23.51 21.91 21.91 pi/2 BPSK 23.41 Inner_Full CP Inner_Full CP 70M Outer_Full CP Outer_Full CP 10/15/70M Edge_1RB_Left CP Edge_1RB_Right CP 10/70M Edge_1RB_Right CP Inner_Full DFT Outer_Full DFT Outer_Full DFT 10/15/70M QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 24.771 20.81 24.41 22.01 21.931 20.81 23.11 25.41 25.41 23.91 n71,DC_2A _n71A,DC_ 66A_n71A, DC_66C_n7 1A,DC_2C_ n71A,DC_2 A-66A_n71 A,DC_2A-2 A_n71A,DC _2A-71A_n 71A,DC_66 A-71A_n71 A,DC_66A-

66A_n71A, DC_2C-66A _n71A,DC_ 2A-66C_n7 1A,DC_2A-

2A-66A_n7 1A,DC_2A-

66A-66A_n 71A,DC_2A

-66A-71A_ n71A n77L www.simcom.com 92 / 122 SIM8260A_Hardware Design_V1.05 Edge_1RB_Left DFT QPSK Edge_1RB_Left DFT 10/15/70M QPSK Edge_1RB_Right DFT Edge_1RB_Right DFT 10/15/70M Inner_Full CP Inner_Full CP 10/15/70M Outer_Full CP Outer_Full CP 10/15/70M Edge_1RB_Left DFT Edge_1RB_Left DFT 10/15/70M Edge_1RB_Right DFT QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM Edge_1RB_Right DFT 10/15/70M 16QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM pi/2 BPSK Inner_Full CP Inner_Full CP 10/15/70M Outer_Full CP Outer_Full CP 10/15/70M Edge_1RB_Left DFT Edge_1RB_Left DFT 10/15/70M Edge_1RB_Right DFT Edge_1RB_Right DFT 10/15/70M Inner_Full CP Inner_Full CP 10/15/70M Outer_Full CP Outer_Full CP 10/15/70M Edge_1RB_Left CP Edge_1RB_Left CP 10/15/70M Edge_1RB_Right CP Edge_1RB_Right CP 10/15/70M Inner_Full DFT Inner_Full DFT 10/15/70M Outer_Full DFT Outer_Full DFT 10/15/70M Edge_1RB_Left DFT Edge_1RB_Left DFT 10/15/70M Edge_1RB_Right DFT Edge_1RB_Right DFT 10/15/70M Inner_Full/Outer_Full DFT Inner_Full DFT

/Outer_Full10/15/70M Edge_1RB_Left

/Edge_1RB_Right DFT 23.01 21.31 23.11 21.41 24.41 22.91 23.41 22.01 21.41 22.91 23.21 22.11 23.81 22.41 23.91 22.41 23.01 21.51 23.11 21.61 22.91 21.51 22.91 21.61 22.61 21.11 22.81 21.71 23.91 22.41 23.91 22.41 22.61 21.21 22.81 21.21 25.41 pi/2 BPSK 23.81 pi/2 BPSK 23.01 www.simcom.com 93 / 122 n77H Edge_1RB_Left/Edge_1RB_Right DFT 10/15/70M Inner_Full CP 10/15MHz Inner_Full CP 70MHz Inner_Full CP 20/30/40/50/60/80/90/100MHz Outer_Full CP 10/15MHz Outer_Full CP 70MHz Outer_Full CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Left CP 10/15MHz Edge_1RB_Left CP 70MHz Edge_1RB_Left CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Right CP 10/15MHz Edge_1RB_Right CP 70MHz Edge_1RB_Right CP 20/30/40/50/60/80/90/100MHz Inner_Full DFT 10/15MHz Inner_Full DFT 70MHz Inner_Full DFT 20/30/40/50/60/80/90/100MHz Outer_Full DFT 10/15MHz Outer_Full DFT 70MHz Outer_Full DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15MHz Edge_1RB_Left DFT 70MHz Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15MHz Edge_1RB_Right DFT 70MHz Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Inner_Full CP 10/15/70MHz Inner_Full CP 20/30/40/50/60/80/90/100MHz Outer_Full CP 10/15MHz Outer_Full CP 70MHz Outer_Full CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Left CP 10/15MHz Edge_1RB_Left CP 70MHz SIM8260A_Hardware Design_V1.05 pi/2 BPSK 21.31 QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 24.31 21.911 25.11 21.91 19.71 23.61 22.251 21.51 21.21 21.51 20.01 23.31 23.91 22.91 25.61 23.01 22.71 25.61 21.21 21.61 23.31 21.51 20.91 23.21 22.941 24.61 22.01 19.61 23.71 21.61 21.21 www.simcom.com 94 / 122 SIM8260A_Hardware Design_V1.05 Edge_1RB_Left CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Right CP 10/15MHz Edge_1RB_Right CP 70MHz Edge_1RB_Right CP 20/30/40/50/60/80/90/100MHz Inner_Full DFT 10/15MHz Inner_Full DFT 70MHz Inner_Full DFT 20/30/40/50/60/80/90/100MHz Outer_Full DFT 10/15MHz Outer_Full DFT 70MHz Outer_Full DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15MHz Edge_1RB_Left DFT 70MHz Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15MHz Edge_1RB_Right DFT 70MHz Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Inner_Full CP 10/15MHz Inner_Full CP 70MHz Inner_Full CP 20/30/40/50/60/80/90/100MHz Outer_Full CP 10/15MHz Outer_Full CP 70MHz Outer_Full CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Left CP 10/15MHz Edge_1RB_Left CP 70MHz Edge_1RB_Left CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Right CP 10/15MHz Edge_1RB_Right CP 70MHz Edge_1RB_Right CP 20/30/40/50/60/80/90/100MHz Inner_Full DFT 10/15MHz Inner_Full DFT 70MHz Inner_Full DFT 20/30/40/50/60/80/90/100MHz Outer_Full DFT 10/15MHz Outer_Full DFT 70MHz 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 23.31 21.51 21.01 23.31 23.91 22.31 25.61 23.01 21.21 25.71 21.61 21.31 23.21 21.41 20.91 23.31 21.41 19.31 23.11 21.51 19.31 23.11 21.31 21.01 23.11 21.21 20.81 23.11 22.41 20.81 24.11 22.41 21.01 www.simcom.com 95 / 122 SIM8260A_Hardware Design_V1.05 Outer_Full DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15MHz Edge_1RB_Left DFT 70MHz Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15MHz Edge_1RB_Right DFT 70MHz Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Inner_Full CP 10/15MHz Inner_Full CP 70MHz Inner_Full CP 20/30/40/50/60/80/90/100MHz Outer_Full CP 10/15MHz Outer_Full CP 70MHz Outer_Full CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Left CP 10/15MHz Edge_1RB_Left CP 70MHz Edge_1RB_Left CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Right CP 10/15MHz Edge_1RB_Right CP 70MHz Edge_1RB_Right CP 20/30/40/50/60/80/90/100MHz Inner_Full DFT 10/15MHz Inner_Full DFT 70MHz Inner_Full DFT 20/30/40/50/60/80/90/100MHz Outer_Full DFT 10/15MHz Outer_Full DFT 70MHz Outer_Full DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15MHz Edge_1RB_Left DFT 70MHz Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15MHz Edge_1RB_Right DFT 70MHz Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Inner_Full/Outer_Full DFT 10/15MHz 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 24.21 21.51 21.21 23.21 21.41 20.71 23.31 21.51 19.51 23.21 21.51 19.21 23.11 20.91 21.21 22.91 21.11 20.61 23.01 22.41 20.81 24.21 22.61 20.91 24.21 21.21 20.91 22.91 21.11 20.31 23.01 pi/2 BPSK 23.01 www.simcom.com 96 / 122 SIM8260A_Hardware Design_V1.05 Edge_1RB_Right/Edge_1RB_Left DFT 10/15MHz Inner_Full/Outer_Full DFT 70MHz Edge_1RB_Right/Edge_1RB_Left DFT 70MHz DFT 20/30/40/50/60/80/90/100MHz Inner_Full CP 10/15/20/30/40/50/60/80/90/1 00MHz Inner_Full CP 70MHz Outer_Full CP Edge_1RB_Left

/Edge_1RB_Right DFT Inner_Full/Outer_Full DFT Edge_1RB_Left

/Edge_1RB_Right DFT Inner_Full CP Outer_Full CP Edge_1RB_Left

/Edge_1RB_Right CP Inner_Full DFT Outer_Full DFT Edge_1RB_Left

/Edge_1RB_Right DFT CP DFT 10/15/70MHz DFT 20/30/40/50/60/80/90/100MHz CP Inner_Full DFT Outer_Full DFT Edge_1RB_Left DFT Edge_1RB_Right DFT Inner_Full/Outer_Full DFT Edge_1RB_Left

/Edge_1RB_Right DFT Inner_Full CP Outer_Full CP 10/15/70MHz Outer_Full CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Left CP Edge_1RB_Right CP pi/2 BPSK 21.51 pi/2 BPSK 23.11 pi/2 BPSK 21.21 pi/2 BPSK 25.81 QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 64QAM 64QAM 256QAM 256QAM 256QAM 256QAM 256QAM pi/2 BPSK 24.31 22.11 22.81 22.51 24.91 22.71 23.91 22.81 22.61 24.91 24.01 22.71 22.41 23.021 23.41 22.41 23.31 23.31 22.01 22.21 25.01 pi/2 BPSK 22.51 QPSK QPSK QPSK QPSK QPSK 24.81 21.91 23.31 22.61 22.781 n78L,DC_2 A_n78A,DC _7A_n78A, DC_2A-7A_ n78A, n78H www.simcom.com 97 / 122 QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM QPSK QPSK Inner_Full DFT Outer_Full DFT 70MHz Outer_Full DFT 10/15/20/30/40/50/60/80/90/1 00MHz Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15/70MHz QPSK Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15/70MHz Inner_Full CP 70MHz Inner_Full CP 10/15/20/30/40/50/60/80/90/1 00MHz Outer_Full CP 70MHz Outer_Full CP 10/15/20/30/40/50/60/80/90/1 00MHz Edge_1RB_Left CP Edge_1RB_Right CP Inner_Full DFT 20/30/40/50/60/80/90/100MHz Inner_Full DFT 10/15/70MHz Outer_Full DFT 20/30/40/50/60/80/90/100MHz Outer_Full DFT 10/15/70MHz Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15/70MHz 16QAM Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15/70MHz CP 10/15/70MHz CP 20/30/40/50/60/80/90/100MHz Inner_Full DFT 20/30/40/50/60/80/90/100MHz Inner_Full DFT 10/15/70MHz Outer_Full DFT 20/30/40/50/60/80/90/100MHz Outer_Full DFT 10/15/70MHz 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 64QAM 64QAM 16QAM SIM8260A_Hardware Design_V1.05 25.41 24.91 25.41 22.91 22.21 22.81 22.41 24.31 22.21 20.71 23.211 22.61 22.811 25.41 25.11 24.41 23.01 22.91 22.21 22.91 22.51 22.11 23.11 23.51 23.41 23.91 23.91 www.simcom.com 98 / 122 SIM8260A_Hardware Design_V1.05 64QAM 64QAM 64QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM 256QAM Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15/70MHz 64QAM Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15/70MHz Inner_Full CP 10/15/70MHz Inner_Full CP 20/30/40/50/60/80/90/100MHz Outer_Full CP 10/15/70MHz Outer_Full CP 20/30/40/50/60/80/90/100MHz Edge_1RB_Left CP Edge_1RB_Left CP 60MHz 3750 Edge_1RB_Right CP Edge_1RB_Right CP 60MHz 3750 Inner_Full DFT 10/15/70MHz Inner_Full DFT 20/30/40/50/60/80/90/100MHz Outer_Full DFT 10/15MHz Outer_Full DFT 70MHz Outer_Full DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15/70MHz 256QAM Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15MHz Edge_1RB_Right DFT 20/30/40/50/60/70/80/90/100M Hz Inner_Full DFT Outer_Full DFT 10/15/70MHz Outer_Full DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Left DFT 10/15/70MHz pi/2 BPSK Edge_1RB_Left DFT 20/30/40/50/60/80/90/100MHz Edge_1RB_Right DFT 10/15/70MHz Edge_1RB_Right DFT 20/30/40/50/60/80/90/100MHz Inner_Full pi/2 BPSK pi/2 BPSK 256QAM 256QAM pi/2 BPSK pi/2 BPSK pi/2 BPSK pi/2 BPSK 256QAM 256QAM 256QAM 256QAM QPSK 23.91 22.91 23.91 22.91 21.51 23.11 21.51 23.11 22.781 19.01 23.01 22.01 24.01 23.71 21.41 23.31 23.81 21.81 22.61 21.21 22.61 25.51 24.91 25.41 22.21 22.91 22.41 22.91 25.01 n77L-MIMO www.simcom.com 99 / 122 SIM8260A_Hardware Design_V1.05 Outer_Full/Edge_1RB_Left/Edg e_1RB_Right Inner_Full Outer_Full/Edge_1RB_Left/Edg e_1RB_Right 10/15/20/30/40/50/60/70/80/9 0MHz 100MHz Inner_Full 10/15/70MHz Inner_Full 20/30/40/50/6080/90/100MHz Outer_Full 10/15/70MHz Outer_Full 20/30/40/50/6080/90/100MHz Edge_1RB_Left 10/15/70MHz Edge_1RB_Left 20/30/40/50/6080/90/100MHz Edge_1RB_Right 10/15/70MHz Edge_1RB_Right 20/30/40/50/6080/90/100MHz Inner_Full 10/15/70MHz Inner_Full 20/30/40/50/6080/90/100MHz Outer_Full 10/15/70MHz Outer_Full 20/30/40/50/6080/90/100MHz Edge_1RB_Left 10/15/70MHz Edge_1RB_Left 20/30/40/50/6080/90/100MHz Edge_1RB_Right 10/15/70MHz Edge_1RB_Right 20/30/40/50/6080/90/100MHz Inner_Full 10/15/70MHz Inner_Full 20/30/40/50/6080/90/100MHz Outer_Full 10/15/70MHz Outer_Full 20/30/40/50/6080/90/100MHz Edge_1RB_Left 10/15/70MHz Edge_1RB_Left 20/30/40/50/6080/90/100MHz Edge_1RB_Right 10/15/70MHz QPSK 16QAM 16QAM 64QAM 256QAM 256QAM QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 64QAM 23.61 24.61 23.61 23.21 23.11 22.71 23.91 25.31 22.41 23.81 22.01 23.41 21.91 23.31 23.41 24.81 22.51 23.81 21.91 23.41 21.91 23.31 22.01 23.31 22.01 23.21 21.91 23.51 21.91 www.simcom.com 100 / 122 SIM8260A_Hardware Design_V1.05 Edge_1RB_Right 20/30/40/50/6080/90/100MHz 10/15/70MHz 20/30/40/50/6080/90/100MH Inner_Full Outer_Full/Edge_1RB_Left/Edg e_1RB_Right 10/15/70MHz 20/30/40/50/6080/90/100MHz n78H-MIMO Inner_Full Outer_Full/Edge_1RB_Left/Edg e_1RB_Right Inner_Full Outer_Full/Edge_1RB_Left/Edg e_1RB_Right 64QAM 256QAM 256QAM QPSK QPSK 16QAM 16QAM 64QAM 256QAM QPSK QPSK 16QAM 16QAM 64QAM 256QAM 23.31 21.01 23.31 24.91 23.41 23.71 24.41 23.01 23.01 25.01 23.51 24.41 23.51 23.01 23.01 www.simcom.com 101 / 122 SIM8260A_Hardware Design_V1.05 5.6 Conducted Receive Sensitivity SIM8260A conducted RF receiving sensitivity is fully meet 3GPP specification. Customers can get more details by check 3GPP official website http://www.3gpp.org. www.simcom.com 102 / 122 SIM8260A_Hardware Design_V1.05 5.7 Thermal Design Make sure that the SIM8260A can reach maximum work performance under extended temperature or extreme conditions for a long time, thermal dissipation design is very important. The thermal dissipation design of LGA is described in Figure as follows:

Figure 49: 3D drawing of LGA thermal dissipation design There are some design rules to enhance thermal dissipation performance:

Keep the module away from other heat sources such as battery, power, AP, etc. All the GND pins of the module should be connected. Add enough through GND via on the main PCB. Via material is very important solid copper and stacked via is better. Make sure maximize airflow around the module. Recommend use heat dissipation material connect to the customers device on the top side of the module to enhance the heat dissipation. Large heat dissipation area is better. Chose a high effective heat dissipation material is better such as heat pipe, graphite sheets. Table 71: Chip junction temperature table Chip model NM4484NSPAXAE-3F PMK65 PMX65 SDX65/SDX62 QET7100 www.simcom.com Junction temperature 85 125 125 105 115 103 / 122 SIM8260A_Hardware Design_V1.05 QPM6679 QPM6375 QPM6621 S55643-11 SDR735 SMR546 QTM545 QTM547 5.8 ESD 85 85 85 85 105 105 85 105 Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the customers main board, the ESD components should be placed closed to the connectors which human body may touch, such as (U)SIM card socket, SD card socket, audio jacks, switches, USB interface, etc. The following table shows the module ESD measurement performance. Table 72: The ESD performance measurement table (temperature: 25C, humidity: 45%) Contact discharge Air discharge 5kV 5 kV 4 kV 4 kV 3 kV 3 kV 3 kV 10 kV 10 kV 8 kV 8 kV 6 kV 6 kV 6 kV Part VBAT, GND Antenna PWRKEY USB RESET_N

(U)SIM Other PADs NOTE Test conditions:

The external of the module has surge protection diodes and ESD protection diodes. The data in table above were tested using SIMCom EVB. www.simcom.com 104 / 122 SIM8260A_Hardware Design_V1.05 6 Manufacturing 6.1 Top and Bottom View of SIM8XX0X Figure 50: Top and bottom view of SIMXX0X 6.2 Label Description Information A C G D F B E www.simcom.com 105 / 122 T Figure 51: Label description of module Table 73: Label description of module information SIM8260A_Hardware Design_V1.05 No. A B C D E F G NOTE Description LOGO Project name Product code Serial number QR code International mobile equipment identity Product Details Serial Number The Figure above are the effect diagrams of the module, for reference only. Please refer to the actual product for appearance. SIM8XX0X is Project name, Include these product names SIM8380A, SIM8280A, SIM8260C, SIM8260E, SIM8260A. For more detailed product differences, please consult the SIMCom FAE teams. 6.3 Recommended PCB Footprint The following figure shows the PCB footprint of SIM8260A. www.simcom.com 106 / 122 SIM8260A_Hardware Design_V1.05 Figure 52: Recommended PCB footprint NOTE Keep out Area is used for internal testing of the module; customers do not need to leave pads. See module recommended package for details 6.4 Recommended SMT Stencil The following figure shows the SMT stencil of SIM8260A. www.simcom.com 107 / 122 SIM8260A_Hardware Design_V1.05 Figure 53: Recommended SMT stencil 6.5 Recommended SMT Reflow Profile The following figure shows the SMT reflow profile of SIM8260A. Figure 54: Recommended SMT reflow profile www.simcom.com 108 / 122 SIM8260A_Hardware Design_V1.05 NOTE Refer to Module secondary-SMT-UGD for more information about the module shipping and manufacturing. 6.6 Moisture Sensitivity Level (MSL) SIM8260A is susceptible to damage induced by absorbed moisture and high temperature. A packages moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent MSL ratings are summarized as follows. Table 74: MSL ratings summary MSL Out-of-bag floor life 1 2 2a 3 4 5 5a 6 Unlimited 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. Comments

+30C /85% RH

+30C /60% RH

+30C /60% RH

+30C /60% RH

+30C /60% RH

+30C /60% RH

+30C /60% RH

+30C /60% RH The SIM8260A device samples are currently classified as MSL3 at 255 (+5, -0) C, following the latest IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature

(255C) should not be confused with the peak temperature within the recommended solder reflow profile. www.simcom.com 109 / 122 SIM8260A_Hardware Design_V1.05 6.7 Baking Requirements It is necessary to bake modules if the prescribed time limit has been exceeded. The baking conditions are specified in Table 71. Note that if baking is required, the devices must be transferred into trays that can be baked to at least 125C. The module is vacuum-packed and has a shelf life of 6 months when the temperature is less than 40 degrees and the relative humidity is less than 90%. If any of the following three conditions are met, the module should be thoroughly baked before reflow welding, as shown in Table 71. Otherwise, the module may be permanently damaged during reflow welding. Vacuum packing damaged or air leakage. When vacuum packing is opened in good condition, the storage time is more than 6 months (from the date of packing). When the vacuum packaging is intact, the storage time of the vacuum packaging is not more than 6 months (calculated from the date of packaging), but the storage time of the vacuum packaging is more than 168 hours in the workshop with temperature <30C and relative humidity <60%. Table 75: Baking requirements Baking conditions options 40C5C, <5% RH 120C5C, <5% RH Duration 192 hours 8 hours Note Original pallet is not applicable NOTE NOTE The tray is not resistant to high temperature. If the customer's baking temperature is 120C, the module should be taken out of the tray for baking, otherwise the tray may be damaged by high temperature www.simcom.com 110 / 122 SIM8260A_Hardware Design_V1.05 7 Packaging SIM8260A module supports tray packaging. The packaging process is shown in the following figures. Figure 55: Packaging process Module tray drawing Figure 56: Module tray drawing Table 76: Tray size www.simcom.com 111 / 122 Length3mm 242.0 Width3mm 161.0 Number 8 SIM8260A_Hardware Design_V1.05 Table 77: Small carton size Figure 57: Small carton drawing Length10mm Width10mm Height10mm Number 270 8*19-2=150 120 180 Big carton drawing Figure 58: Big carton drawing Table 78: Big carton size Length10mm Width10mm Height10mm Number 150*4=600 380 280 280 www.simcom.com 112 / 122 SIM8260A_Hardware Design_V1.05 8 Appendix 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface Table 79: Coding schemes and maximum net data rates over air interface HSDPA device category Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 7 Category 8 Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19 Category 20 Category 21 Category 22 Category 23 Category 24 HSUPA device category Category 1 Category 2 Category 3 Category 4 Max data ratepeak 1.2Mbps 1.2Mbps 1.8Mbps 1.8Mbps 3.6Mbps 3.6Mbps 7.2Mbps 7.2Mbps 10.2Mbps 14.4Mbps 0.9Mbps 1.8Mbps 17.6Mbps 21.1Mbps 23.4Mbps 28Mbps 23.4Mbps 28Mbps 35.5Mbps 42Mbps 23.4Mbps 28Mbps 35.5Mbps 42.2Mbps Max data ratepeak 0.96Mbps 1.92Mbps 1.92Mbps 3.84Mbps Modulation type 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK QPSK QPSK 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM Modulation type QPSK QPSK QPSK QPSK www.simcom.com 113 / 122 Category 5 Category 6 LTE-FDD device category

(Downlink) Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 LTE-FDD device category

(Uplink) Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 SIM8260A_Hardware Design_V1.05 3.84Mbps 5.76Mbps QPSK QPSK Max data ratepeak Modulation type 10Mbps 50Mbps 100Mbps 150Mbps 300Mbps 300Mbps QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM Max data ratepeak Modulation type 5Mbps 25Mbps 50Mbps 50Mbps 75Mbps 50Mbps QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM/64QAM QPSK/16QAM www.simcom.com 114 / 122 SIM8260A_Hardware Design_V1.05 8.2 Related Documents Table 80: Related documents NO. Title Description

[1]

[2]

[3]

[4]

[5]

[6]

SIM8200 Series_AT Command Manual 3GPP TS 51.010-1 3GPP TS 34.124 3GPP TS 34.121 3GPP TS 34.123-1 3GPP TS 34.123-3

[7]

EN 301 908-02 V2.2.1

[8]

EN 301 489-24 V1.2.1

[9]

[10]

[11]

IEC/EN60950-1(2001) 3GPP TS 51.010-1 GCF-CC V3.23.1

[12]

2002/95/EC SIM8260A_LGA Antenna Port Mapping and Deign Guide NSA_ENDC_For_8260 SIM8260AEA&SIM8260A_CA COMBO list Antenna Tuner reference design

[13]

[14]

[15]

[16]

[17]

AT Command Manual Digital cellular telecommunications system

(Release 5); Mobile Station (MS) conformance specification Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network; Terminal conformance specification;

Radio transmission and reception (FDD) User Equipment (UE) conformance specification;

Part 3: Abstract Test Suites. Electromagnetic compatibility and Radio spectrum Matters

(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread

(UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24:

Specific conditions for IMT-2000 CDMA Direct Spread

(UTRA) for Mobile and portable (UE) radio and ancillary equipment Safety of information technology equipment (2000) Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification Global Certification Forum Certification Criteria Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Antenna design guidelines ENDC list for SIM8260A EA &CA list for SIM8260A Antenna tuning method and antenna tuning reference design example SIM8200 Series Ethernet RTL8125_HDK Documents about RTL8125B www.simcom.com 115 / 122 SIM8260A_Hardware Design_V1.05

[18]

[19]

[20]

SIM8X60X Series PM7250B_HDK Documents about charge SIM8200 Series CODEC ALC5616_HDK Documents about audio SIM8260A WIFI-6 W82_HDK Documents about W82

[21]

SIM8260 Series_KDL SIM8260 Series LGA module reference design

[22]

SIM82X0X and SIM83X0X LGA Series_OPEN_GPIOs List Documents about GPIO configuration

[23]

SIMCOM_Module_Thermal_Design_Guide Documents about thermal design

[24]

SIM8260 Series QPS615_HDK Documents about QPS615

[25]

SIM8260 Series QEP8121_HDK Documents about QEP8121

[26]

SIM8260 Series RTL8367_HDK Documents about RTL8367 www.simcom.com 116 / 122 SIM8260A_Hardware Design_V1.05 8.3 Terms and Abbreviations Table 81: Terms and abbreviations Abbreviation Description ADC CS CTS DRX DTR DTX EFR EMC ESD FDD FR GNSS GPS HR I2C I2S IMEI LTE MDIO MMD MO MSB PCB PCIe RF RGMII SDIO SIM SMS SPI TDD TX UART VSWR Analog-to-Digital Converter Coding Scheme Clear to Send Discontinuous Reception Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electromagnetic Compatibility Electrostatic Discharge Frequency Division Dual Full Rate Global Navigation Satellite System Global Positioning System Half Rate Inter-Integrated Circuit Inter-IC Sound International Mobile Equipment Identity Long Term Evolution Management Data Input/Output MDIO manageable device Mobile Originated Most Significant Bit Printed Circuit Board Peripheral Component Interface Express Radio Frequency Reduced Gigabit Media Independent Interface Secure Digital Input and Output Subscriber Identification Module Short Message Service serial peripheral interface Time Division Dual Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio www.simcom.com 117 / 122 SIM8260A_Hardware Design_V1.05 SM HSDPA HSUPA WCDMA

(U)SIM UMTS UART LB MHB UHB LAA TRX SIM phonebook High Speed Downlink Packet Access High Speed Uplink Packet Access Wideband Code Division Multiple Access Universal subscriber identity module Universal mobile telecommunications system Universal asynchronous receiver transmitter Low Frequency Band Middle and High Frequency Band Ultra-High Frequency Band Limited Access Authorization Transmit and Receive signal UL-MIMO DL-MIMO Uplink- Multiple Input Multiple Output Downlink- Multiple Input Multiple Output www.simcom.com 118 / 122 SIM8260A_Hardware Design_V1.05 8.4 Safety Caution Table 82: Safety caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent these interference with communication systems. Forgetting to think much of instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if is used close to TV sets, radios, computers or other electric equipment. it Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid

(U)SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e. g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid (U)SIM card be properly inserted in the cellular terminal or mobile. www.simcom.com 119 / 122 SIM8260A_Hardware Design_V1.05 FCC Caution. 15.19 Labelling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the condition that this device doesnotcauseharmfulinterference. 15.21 Information to user. AnyChangesormodificationsnotexpresslyapprovedbythepartyresponsibleforcompliancecouldv oid theuser'sauthoritytooperatetheequipment. 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can bedetermined byturning the equipment off and on,the user is encouraged to try to correctthe interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help. Body-worn Operation This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withmini mum distance 20cm between the radiator &

your body C.Appendix A A1.Requirement of FCC KDB 996369 D03 for module certification:

1.1List of applicable FCC rules:

ThemodulecomplieswithFCCPart22,24,27,90,96 1.2Summarizethespecificoperationaluseconditions 1.3Limited module procedures:

www.simcom.com 120 / 122 SIM8260A_Hardware Design_V1.05 The module does not have a standard antenna, which belong to Limited module Standard requires:

Clear and specific instructions describing the conditions, limitations and procedures for thirdparties to use and/or integrate the module into a host device (see Comprehensive integration instructions below). Resolve: Supply example as follows:

Installation Notes:

1) SIM8260A Module Power supply range is DC 3.3V~4.2V, when you use SIM8260A Module design product, the power supply cannot exceed this range. 2) Whenconnec tSIM8260A Moduletothehostdevice,thehostdevicemustbepoweroff. 3) Make sure the module pins correctly installed. 4) Makesurethatthemoduledoesnotallowuserstoreplaceordemolition. 5)Alltypesofantennas thatcanbeusedwithatransmitterExternal antennawithmaximum gainnot Exceeding2.86dBi. 1.4Trace antenna designs: Not applicable. 1.5RFexposureconsiderations:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. 1.6Antennas:

The module does not have a standard antenna. 1.7Label and compliance information This device complieswith part 15 oftheFCCRules.Operation issubject to the condition that this devicedoesnotcauseharmfulinterference.AnyChangesormodificationsnotexpresslyapprovedb y the party responsible for compliance could void the user's authority to operate the equipment. Note:This equipmenthas been tested and found tocomplywith the limitsfor aClassBdigital device, pursuantto part 15 oftheFCCRules.These limits are designed to provide reasonable protection againstharmfulinterferenceinaresidentialinstallation.Thisequipmentgeneratesusesandcanradi ate radio frequency energy and, if notinstalled and used in accordancewith the instructions,may cause harmfulinterferencetoradiocommunications.However,thereisnoguarantee thatinterferencewill not occurin a particularinstallation.Ifthis equipment does cause harmful interference to radio or television reception,which can be determined by turning the equipment off and on, the useris encouraged to try to correct the interference by one ormore ofthe followingmeasures:

-Reorientorrelocate the receivingantenna.

-Increase the separationbetweenthe equipment andreceiver.

-Connect the equipment into an outlet on a circuit differentfrom that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help. Body-wornOperation www.simcom.com 121 / 122 SIM8260A_Hardware Design_V1.05 This equipment complieswithFCCradiation exposure limitssetforth for an uncontrolled environment.This equipmentshould be installed and operatedwithminimumdistance 20cmbetween the radiator&your bodyThe host productLabelingRequirements:

NOTICE:The host productmustmake sure that FCClabeling requirements are met.Thisincludes clearlyvisible exteriorlabelontheoutsideofthe finalproduct housingthatdisplaysthe contents shown in below:

Contains FCC ID:2AJYU-8XN0001 1.8Informationontestmodes andadditionaltestingrequirements:

When setting up the configuration, ifthe pairing and call box optionsfortesting do not work, the tester needsto coordinatewith themodulemanufacturerto accessthe testmode software. 1.9Additional testing, Part 15 Subpart B disclaimer:

Themodulartransmitteris onlyFCCauthorized forthe specific rule parts(FCCPart 22,24,27,90,96)list on the grant, and that the host product manufacturer isresponsible for compliance to any other FCC rulesthat apply to the host not covered by themodulartransmitter grant of certification. 1.10Informationontestmodes andadditionaltestingrequirements:

When testing, testers need to referto the user manual, and the sample powersupply needsto use a special adapte rpower supply. Contact us:

Shanghai SIMCom Wireless Solutions Ltd. Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China 200335 Tel+86 21 3235 3300 Fax+86 21 3235 3020 URLwww.simcomm2m.com www.simcom.com 122 / 122

2mm 5mm 1mm 1mm 1mm 1mm 2mm 22.8mm SIM8260A m m 6 1

. 0 4 10mm 2mm P/N:S2-XXXXX XXXXXXXX SN:XXXXXXXXXXXXXXX IMEI:XXXXXXXXXXXXXXX FCC ID:2AJYU-8XN0001 2mm 2mm 42.76mm SIM8260A P/N:S2-XXXXX XXXXXXXX SN:XXXXXXXXXXXXXXX IMEI:XXXXXXXXXXXXXXX FCC ID:2AJYU-8XN0001 SIM8260A P/N:S2-XXXXX XXXXXXXX SN:XXXXXXXXXXXXXXX IMEI:XXXXXXXXXXXXXXX FCC ID:2AJYU-8XN0001

SIMCom Wireless Solutions Limited Authority to Act as Agent Date: April 4, 2023 American Certification Body, Inc. 313 Park Avenue Suite 300 Falls Church, VA 22046 To Whom It May Concern:

______(Chongqing Academy of Information and Communications Technology)______ is authorized to act on our behalf, until otherwise notified, for applications to American Certification Body, Inc.

(ACB). We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002 (b), to the application is subject to denial of federal benefits, that includes FCC benefits. We also declare that the information provided to the FCC is true and correct to the best of our knowledge (47 CFR 2.911(d)) and we have been informed of the grantee responsibilities (47 CFR 2.909) with regard to certified equipment. Thank you, Agency Agreement Expiration Date: _____(2023/4/1-2024/4/1)_____ By:

(Signature1) ____Yongsheng Li___

(Print name) Title:

_____manager_____________________ On behalf of: __ SIMCom Wireless Solutions Limited____

(Company Name) Telephone:

___86 21 3157 5100______ 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 050222-17

THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Request for Confidentiality Date: April 4, 2023 Subject: Confidentiality Request for: ______(2AJYU-8XN0001)______ Pursuant to FCC 47 CFR 0.457(d) and 0.459 and/or IC RSP-100, Section 12.4, the applicant requests that a part of the subject application(s) be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Exhibit Permanent Block Diagrams

--------------------------- External Photos Permanent *1 Internal Photos Permanent Operation Description/Theory of Operation Permanent Parts List & Placement/BOM Permanent Tune-Up Procedure Permanent Schematics

--------------------------- Test Setup Photos Permanent *1 Users Manual ______(SIMCom Wireless Solutions Limited)______ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality for FCC Applications:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of __ (specify number of days not to exceed 180)2___ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify ACB in the event information regarding the product or the product is made available to the public before the requested period has expired. ACB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. Short Term Confidentiality for Industry Canada Applications:

Starting May 2022, ISED will recognize short term confidentiality on certain exhibits until the intended date of marketing. The applicant requests the exhibits selected above as short term confidential be withheld from public view until:

(specify ISED expiration date / date of marketing) . Sincerely, By:

_____ __ manager____ ___Yongsheng Li_______ 1 - The asterisked items (*) require further information to be provided to ACB before permanent confidentiality will be extended to these exhibits. Please refer to FCC KDB 726920 and the specific Document link for D01 found at:

https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=41731 and review section II, 3) regarding specific information that must accompany these requests. 2 - Please refer to https://acbcert.com/documents/misc-docs/Memo-Short-Term-Vs-Standard-Confidentiality.pdf for complete details. 050222-17 THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD

(Signature/Title3)

(Print name) 3 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 050222-17

SIMCom Wireless Solutions Limited Certification Application Attestation Statements Date: April 4, 2023 American Certification Body, Inc. 313 Park Avenue Suite 300 Falls Church, VA 22046 To Whom It May Concern:

Statement for 47 CFR section 2.911(d)(5)(i) ______(SIMCom Wireless Solutions Limited)______ certifies that as of the date of the application the equipment for which authorization is sought is not covered equipment1 prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. If the equipment for which the applicant seeks authorization is produced by any of the entities identified on the current Covered List, including affiliates or subsidiaries of the named companies, the applicant must include an explanation on why the equipment is not covered equipment. Additional Explanation: <N/A>

Statement for 47 CFR section 2.911(d)(5)(ii) ______(SIMCom Wireless Solutions Limited)______ (the applicant) certifies that, as of the date of the filing of this application, the applicant - is / - is not identified on the Covered List as an entity producing covered equipment. Thank you, By:

(Signature2) ____Yongsheng Li____

(Print name) Title:

_____manager________ Company:

__SIMCom Wireless Solutions Limited__ Telephone:

__86 21 3157 5100_ 1 - The Commissions Covered List is published by the Public Safety and Homeland Security Bureau and posted on the Commissions website. This Covered List, which is periodically updated, identifies particular equipment, produced by particular entities, that constitutes covered equipment. https://www.fcc.gov/supplychain/coveredlist . 2 - Letters must be placed on appropriate letterhead. 022423-17 rev 6

THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Request for Modular/Limited Modular Approval Date: March 20, 2023 Subject: Manufacturers Declaration for - Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: ______2AJYU-8XN0001______ 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)

- YES - NO(*) Details: The module has shield which covers all RF components and circuitry. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)

- YES - NO(*) Details: The modular transmitter must have buffered modulation/data inputs. 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)

- YES - NO(*) Details: The module contains its own power supply regulation. 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

- YES - NO(*) Details: The modular transmitter must comply with the antenna and transmission system requirements 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: The module was tested stand-alone as shown in test setup photographs filed with this application.

- YES - NO(*) 070920-02b THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Modular Approval Requirement 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see Requirement Met KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:

XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Details: There is a label on the module as shown in the labeling exhibit filed with this application.

7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)

- YES - NO(*)

- YES - NO(*) Details: The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: The module meets RF exposure requirements.

- YES - NO(*) 070920-02b THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA;

the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: N/A Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met

- Provided in Separate Cover Letter

- N/A Details: The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. 2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: N/A Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained.

- Provided in Separate Cover Letter

- N/A Details: N/A 070920-02b THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types

(monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. a. 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 b. Sincerely, By: ___ ___________GM__________ ___Yongsheng Li_________________

(Signature/Title1)

(Print name) 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 070920-02b

SIMCom Wireless Solutions Limited Date: 2023-03-01 Federal Communications Commission TO:

Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Subject: Class II Permissive Change for FCC ID: 2AJYU-8XN0001, Grant date:

08/10/2022 To whom it may concern, This is to request a Class II permissive change to our product (FCC ID: 2AJYU-

8XN0001), We declare that compared with the Parent (model: SIM8260A which not support B48 and n48, FCC ID: 2AJYU-8XN0001), the Variant (model: SIM8260A which support B48 and n48 The LTE BAND48 and NR n48 frequency bands were opened by refreshing the software, and no other changes were made. Please contact me if you have any questions or need future information regarding this application. Regards, Signature Printed Name:

Yongsheng Li Company:

SIMCom Wireless Solutions Limited Job Title:

GM Email:

yongsheng.li@simcom.com Telephone:

+86 2131575137

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6515892.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Attestation Statements

(03/27/2023) TO: Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046, USA RE: Attestation Statements Part 2.911(d)(7) request for (2AJYU-8XN0001)

(SIMCom Wireless Solutions Limited ), the undersigned, hereby authorize (Lucky Cowboy Global Services, LLC) to act as our designated U.S. agent for service of process,

(SIMCom Wireless Solutions Limited) accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment.

(Lucky Cowboy Global Services, LLC) accepts the responsibility to act as designated U.S. agent for service of process. Applicant Information Company Name:SIMCom Wireless Solutions Limited Contact Name:Yongsheng Li Address:Building 3, No.289 Linhong Road, Shanghai, China Telephone No:+86 21 3252 3134 Email:Yongsheng Li@simcom.com Signature

[Yong sheng Li]

U.S. Agent Information:

Company Name:Lucky Cowboy Global Services, LLC Address:2213 S. Braeswood Blvd. #12E Houston, TX 77030 USA FRN:0033510934 Contact Name:Louie Liu Telephone No:+1 (713) 992-3369 Email:info@luckycowboyglobalservices.com Signature

[Louie Liu]

THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Request for Modular/Limited Modular Approval Date: October 25, 2022 Subject: Manufacturers Declaration for - Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: ______2AJYU-8XN0001______ 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)

- YES - NO(*) Details: The module has shield which covers all RF components and circuitry. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)

- YES - NO(*) Details: The modular transmitter must have buffered modulation/data inputs. 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)

- YES - NO(*) Details: The module contains its own power supply regulation. 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

- YES - NO(*) Details: The modular transmitter must comply with the antenna and transmission system requirements 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: The module was tested stand-alone as shown in test setup photographs filed with this application.

- YES - NO(*) 070920-02b THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Modular Approval Requirement 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see Requirement Met KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:

XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Details: There is a label on the module as shown in the labeling exhibit filed with this application.

7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)

- YES - NO(*)

- YES - NO(*) Details: The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: The module meets RF exposure requirements.

- YES - NO(*) 070920-02b THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA;

the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: N/A Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met

- Provided in Separate Cover Letter

- N/A Details: The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. 2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: N/A Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained.

- Provided in Separate Cover Letter

- N/A Details: N/A 070920-02b THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types

(monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. a. 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 b. Sincerely, By: ___ ___________GM__________ ___Yongsheng Li_________________

(Signature/Title1)

(Print name) 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 070920-02b

THIS MUST BE SIGNED BY THE APPLICANT AND SHOULD BE PLACED ON APPLICANTS LETTERHEAD ONLY IF AGENT IS SUBMITTING APPLICATION Authority to Act as Agent Date: ____9/30/2022___ American Certification Body, Inc. 6731 Whittier Avenue Suite C110 McLean, VA 22101 To Whom It May Concern:

______China Telecommunication Technology Labs._____ is authorized to act on our behalf, until otherwise notified, for applications to American Certification Body, Inc. (ACB). We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002 (b), to the application is subject to denial of federal benefits, that includes FCC benefits. Thank you, Agency Agreement Expiration Date: ___9/30/2022 By:

_______ ___________ __Yongshengli______________________

(Signature1)

(Print name) Title:

________manager__________________ On behalf of: _______ SIMCom Wireless Solutions Limited___________________

(Company Name) Telephone:

_________021-32523423 _________________ 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 022311 6 THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Request for Confidentiality Date: ____9/30/2022____ Subject: Confidentiality Request for: SIM8260A Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*2 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ SIMCom Wireless Solutions Limited has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify ACB in the event information regarding the product or the product is made available to the public. ACB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title3) ______Yongshengli______

(Print name) 2 - The asterisked items (*) require further justification before permanent confidentiality will be allowed. These also currently require review by the FCC under their Permit-But-Ask policy before the grant is issued and can delay completion of an application. Further justification should be added to the note above. One such example for a potted device would be: The EUT is FULLY potted using a non-removable epoxy based material. Removal of potting material causes irreparable damage to internal circuitry. See photographs exhibits that outline the device before and after potting. 3 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. 022311 6