FCC ID: 2AJYU-8XN0003 The SIM826A-M2 is the Multi-Band 5G NR/LTE-FDD/LTE- TDD/HSPA+ module which supports R16 5G NSA/SA

 

SIM8262A-M2 Series Hardware Design 5G Module SIMCom Wireless Solutions Limited. SIMCom Headquarters Building, Building 3, No. 289 Linhong Changning District, Shanghai P.R.China Tel: 86-21-31575100 support@SIMcom.com www.SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Document title:

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SIM826XX_SIM8X80-M2 Series Hardware Design V1.07 2023-05-31 Release GENERAL NOTES SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS TO SUPPORT THE APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED ON THE REQUIREMENTS SPECIFICALLY FROM THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMERS POSSESSION. FURTHERMORE, THE SYSTEM VALIDATION OF THE PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMERS SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE. COPYRIGHT THIS DOCUMENT CONTAINS THE PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY OF SIMCOM LIMITED, COPYING OF THIS DOCUMENT, GIVING IT TO OTHERS, THE USING OR COMMUNICATION OF THE CONTENTS THEREOF ARE FORBIDDEN WITHOUT THE OFFICIAL AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF THE DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF GRANT OF A PATENT OR THE REGISTRATION OF A UTILITY MODEL OR DESIGN. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE. SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: +86 21 31575100 Email: SIMcom@SIMcom.com For more information, please visit:

https://www.SIMcom.com/download/list-863-en.html For technical support, or to report documentation errors, please visit:

https://www.SIMcom.com/ask/ or email to: support@SIMcom.com Copyright 2022 SIMCom Wireless Solutions Limited All Rights Reserved. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Author shaoxu hou Yaling.wa ng Shaoxu hou Xueting wang Wentao tan Xin zhang Yaling wang Shaoxu houXin zhang Yao chen Version History Date 2022-04-

15 2022-05-

30 Versio n 1.00 1.01 2022-06-

23 1.02 2022-08-

19 1.03 www.(U)SIMcom.com Description of change Initial Release Change Table42, about the definition and Change the note of Table 44 Change Table 45, about the the 3 Change Table 1 and Table 59, about the WCDMA andLTE-TDD frequency bands of SIM8262A-M2 and currentconsumption 4 Change Table 46, Table 47, about recommended mmWmodule connector and the antenna port definitions of mmW 5 Change Figure31, about the connection diagram ofmodule and mmW module 8 change the frequency range of table 47, SIM8260C-M2\SIM8262A-M2 and SIM8262E-

M2 9 change table 49, B30\B32\B46 module operatingfrequency 6 Change Figure 1,2,3 and Table 3, about Hardware block diagram, M2 interface pin assignment, WLAN ZIFconnector and Pin differences 7 Change Table2, add information about CPU, RAM andROM 8 Change Table7, about the definition and description ofpin 22,24,28,59,61,63 and 65 9 Change Table9, about the definition and description ofpin 65 10 description ofantenna control interface 11 12 definition ofQTM_THERM_DET 13 14 LED1# pin10.Change Table1,2,3,7,47,48 ,59,61and Figure32,36,37add the information of SIM8260G-

M2 1. Change Table8, about the Peak current. 2. Change the Table 1, Table 49, 59, delete informationabout B75 / B76 frequency, increase about n75 / n76 / n257 / n258 / n260 / n261 spectrum information 13.Modify the antenna definition of SIM8380G-M2 as shown in Figure 1 1. Modify Table 2 to increase the data transmissionthroughput About SIM8260C-M2/SIM8280G-M2/SIM8380G-M2 data 2. Modify Table 2 and add the UL MIMO informationabout SIM8280G-M2/SIM8380G-M2 in MIMO 3. Modify Table 59 and add the flow consumptioninformation of SIM8262E/A-M2 module 4. Modify Table 60, add frequency band information, andmark PC2/PC3 5. Modify Table 61, about the Conducted RF receivingsensitivity 6. Add PCIe interface use for W82, RTL8125B Add Table47, about the note of mmW Change Table36, about the description of andIPQxxxx application content chapter SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 2022-09-

23 1.04 2022-10-

20 1.05 2022-11-

22 1.06 2023-05-

31 1.07 Yi zheng Hao ma Yao chen Yi zheng Yao chen Yao chenYi zheng Yao chen 5 Modify Table 62,SIM8260G/SIM8280G/SIM8380G-

M2rf power consumption data update 6 Modify Table 64, SIM8260G/SIM8280G/SIM8380G-

M2sensitivity data update 7 Add table65 1.Add table2,table45 2. RF modify 3. Modify part of error description 4. Add figure1 5. Update table69, figure34 4 Note the signal of PIN65 VIO_1V8 add the filtercapacitor total capacity value cant more than 1uF 5 In chapter 5.8 illustrate the post of screws and screwsused to fix the M2 module should have good electrical conductivity 6 Update PIN38 name in figure27 7 Modify logic low level description in table42 8 Delete the module internal pull up resister in figure34 9 In chapter 5.7 add thermal dissipation expose copperarea size of bottom of module 10 Update 5G ULMIMO support band in table38.Update Antenna port definitions 1. Update Isleep description in table10. in table52 2. Add test point of module chapter 2.1.3. 3. Add RF cable operation chapter 4.2.3. 4. Update table65, modify description and table format. 5. Delete all about SIM8280G-M2 information. 6. Update PIN60 description in table4, updateW_DISABLE1# description in table9. 7. Add table6. 8. Add mmW547 connect diagram in figure37. 9. Update MCP is JSFCCA5QHAFGA-405A in table68. 10. Modify (U)SIM chapter content. 11. Add VDD_IO power on sequence in figure14. 12. Update TVDD_IO power on sequence in table16. 13. Modify part of description errors. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Contents Contents..................................................................................................................................................................................... 5 Table Index.................................................................................................................................................................................7 Figure Index...............................................................................................................................................................................9 1. Introduction.........................................................................................................................................................................10 Product Outline..................................................................................................................................................................... 11 Hardware Block Diagram.................................................................................................................................................... 12 Feature Overview................................................................................................................................................................. 12 2. Package Information.........................................................................................................................................................14 Pin Assignment Overview................................................................................................................................................... 14 M2 interface pin assignment................................................................................................................................... 14 WLAN ZIF Connector............................................................................................................................................... 16 Test Point of Module.................................................................................................................................................17 Pin Description......................................................................................................................................................................19 Mechanical Dimensions...................................................................................................................................................... 25 3. Interface Application........................................................................................................................................................ 26 Power Supply........................................................................................................................................................................ 26 Power Supply Design Guide...................................................................................................................................26 Recommended Power Supply Circuit....................................................................................................................28 Voltage Monitor......................................................................................................................................................... 31 Power On and Off Module.................................................................................................................................................. 32 Power On....................................................................................................................................................................32 Power Off....................................................................................................................................................................33 Reset Function......................................................................................................................................................................35 I2C Interface..........................................................................................................................................................................37 WoWWAN#*..........................................................................................................................................................................38 USB Interface........................................................................................................................................................................38 PCIe Interface....................................................................................................................................................................... 41 USB and PCIe Modes*............................................................................................................................................ 42 PCIe for W82............................................................................................................................................................. 44 PCIe for RTL8125B-TE............................................................................................................................................45 PCIe for Qualcomm IPQxxxx*................................................................................................................................ 46

(U)SIM Interface................................................................................................................................................................... 47 Always Close (U)SIM Card Design........................................................................................................................ 48 Always Open (U)SIM Card Design........................................................................................................................ 48 Without CD PIN (U)SIM Card Design....................................................................................................................48 I2S Interface.......................................................................................................................................................................... 50 I2S Timing.................................................................................................................................................................. 50 I2S Reference Circuit............................................................................................................................................... 51 3.10 DPR*.....................................................................................................................................................................................52 3.11 CONFIG Pins...................................................................................................................................................................... 53 3.12 LED1#.................................................................................................................................................................................. 54 W_DISABLE1#................................................................................................................................................................... 55 TDD_SYNC_PPS*............................................................................................................................................................. 57 W_DISABLE2#*...................................................................................................................................................... 58 Antenna Control Interface*............................................................................................................................................... 60 UART Interface................................................................................................................................................................... 62 GPIOs Interface..................................................................................................................................................................63 mmW Interface................................................................................................................................................................... 64 4. Antenna Interfaces............................................................................................................................................................ 66 Antenna Definitions.............................................................................................................................................................. 66 3G/4G/5G/mmW Operating Frequency................................................................................................................ 68 GNSS Frequency...................................................................................................................................................... 70 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 4.2 Antenna Installation..............................................................................................................................................................71 Antenna Requirements.............................................................................................................................................71 RF Plug Recommendation...................................................................................................................................... 71 RF Cable Assembly Operation............................................................................................................................... 73 5. Electrical Specifications..................................................................................................................................................75 Absolute Maximum Ratings................................................................................................................................................ 75 Operating Conditions........................................................................................................................................................... 76 Operating Mode.................................................................................................................................................................... 77 Operating Mode Definition.......................................................................................................................................77 Sleep Mode................................................................................................................................................................ 77 Minimum Functionality Mode and Flight Mode.................................................................................................... 78 Current Consumption...........................................................................................................................................................79 RF Output Power..................................................................................................................................................................85 Conducted Receive Sensitivity.......................................................................................................................................... 86 Thermal Design.....................................................................................................................................................................91 ESD.........................................................................................................................................................................................92 6. Appearance......................................................................................................................................................................... 93 Top and Bottom View of Module........................................................................................................................................93 Label Description Information............................................................................................................................................ 94 7. Packaging............................................................................................................................................................................ 95 8. Appendix..............................................................................................................................................................................96 Coding Schemes and Maximum Net Data Rates over Air Interface........................................................................... 96 Related Documents..............................................................................................................................................................98 Terms and Abbreviations.................................................................................................................................................... 98 Safety Caution.................................................................................................................................................................... 100 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Table Index Table 1 : Module frequency bands............................................................................................................................................................................ 11 Table 2 : Data transmission throughput....................................................................................................................................................................11 Table 3 : Key features................................................................................................................................................................................................. 12 Table 4 : Pin differences of SIM826XX-M2 and SIM8X80-M2..............................................................................................................................14 Table 5 : Recommended WLAN ZIF connector list................................................................................................................................................ 17 Table 6 : Test point of module description............................................................................................................................................................... 18 Table 7 : IO parameters definition............................................................................................................................................................................. 19 Table 8 : DC parameters definition........................................................................................................................................................................... 19 Table 9 : Pin description............................................................................................................................................................................................. 19 Table 10 : VBAT pins electrical characteristics....................................................................................................................................................... 26 Table 11 : Definition of VBAT and GND pins........................................................................................................................................................... 27 Table 12 : Recommended D1 list.............................................................................................................................................................................. 27 Table 13 : PIN65 of the module recommend TVS list............................................................................................................................................ 28 Table 14 : Recommended FB1 and L1 list...............................................................................................................................................................30 Table 15 : Definition of FULL_CARD_POWER_OFF# pin....................................................................................................................................32 Table 16 : Power on timing and electrical characteristics......................................................................................................................................32 Table 17 : Power off timing and electrical characteristics......................................................................................................................................34 Table 18 : Recommended Q1 list.............................................................................................................................................................................. 35 Table 19 : Definition of RESET# pin......................................................................................................................................................................... 35 Table 20 : RESET# pin electrical characteristics.................................................................................................................................................... 36 Table 21 : Definition of I2C interface.........................................................................................................................................................................37 Table 22 : Definition of WoWWAN# pin....................................................................................................................................................................38 Table 23 : Definition of USB interface.......................................................................................................................................................................39 Table 24 : USB interface recommended CC detector, USB3.1 type-C switch and TVS diode list..................................................................39 Table 25 : Definition of PCIe interface...................................................................................................................................................................... 41 Table 26 : PCIe interface recommended TVS diode list........................................................................................................................................41 Table 27 : Recommended shift level list...................................................................................................................................................................44 Table 28 : Recommended RTL8125B IC list........................................................................................................................................................... 45 Table 29 : (U)SIM electrical characteristics in 1.8V mode ((U)SIM_PWR=1.8V).............................................................................................. 47 Table 30 : (U)SIM electrical characteristics in 3.0V mode ((U)SIM_PWR=3.0V).............................................................................................. 47 Table 31 : Definition of (U)SIM interface.................................................................................................................................................................. 47 Table 32 : Recommended TVS and always close (U)SIM socket list..................................................................................................................47 Table 33 : I2S format...................................................................................................................................................................................................50 Table 34 : I2S timing parameters.............................................................................................................................................................................. 50 Table 35 : Definition of I2S interface.........................................................................................................................................................................51 Table 36 : The PCM interface is multiplexing with I2S interface.......................................................................................................................... 51 Table 37 : Definition of DPR# pin.............................................................................................................................................................................. 52 Table 38 : CONFIG pins state of the module.......................................................................................................................................................... 53 Table 39 : CONFIG interface definition.................................................................................................................................................................... 53 Table 40 : Definition of LED1# pin.............................................................................................................................................................................54 Table 41 : LED1# pin status....................................................................................................................................................................................... 55 Table 42 : Definition of W_DISABLE1# pin..............................................................................................................................................................55 Table 43 : W_DISABLE1# pin status........................................................................................................................................................................55 Table 44 : Definition of TDD_SYNC_PPS pin......................................................................................................................................................... 57 Table 45 : Definition of W_DISABLE2# pin..............................................................................................................................................................58 Table 46 : Recommended D1 list.............................................................................................................................................................................. 58 Table 47 : W_DISABLE2#* pin status...................................................................................................................................................................... 58 Table 48 : Definition of antenna control interface through GPIOs........................................................................................................................60 Table 49 : Definition of UART interface.................................................................................................................................................................... 62 Table 50 : GPIO list..................................................................................................................................................................................................... 63 Table 51 : mmW Interface.......................................................................................................................................................................................... 64 Table 52 : Recommended mmW module connector list........................................................................................................................................ 64 Table 53 : Antenna port definitions............................................................................................................................................................................66 Table 54 : Frequency band and antenna ports mapping....................................................................................................................................... 67 Table 55 : Module operating frequency.................................................................................................................................................................... 68 Table 56 : GNSS frequency....................................................................................................................................................................................... 70 Table 57 : 3G/4G/5G/GNSS antennas..................................................................................................................................................................... 71 Table 58 : GNSS antenna (for dedicated GNSS antenna only) *.........................................................................................................................71 Table 59 : Electrical Specifications of 20449-001E-03.......................................................................................................................................... 72 Table 60 : Absolute maximum ratings.......................................................................................................................................................................75 Table 61 : VBAT recommended operating ratings..................................................................................................................................................76 Table 62 : 1.8V Digital I/O characteristics................................................................................................................................................................ 76 Table 63 : Operating temperature............................................................................................................................................................................. 76 Table 64 : Operating mode definition........................................................................................................................................................................77 Table 65 : Module Current consumption on VBAT pins (VBAT=3.8V).................................................................................................................79 Table 66 : Conducted output power..........................................................................................................................................................................85 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Table 67 : Conducted RF receiving sensitivity........................................................................................................................................................86 Table 68 : Chip junction temperature table..............................................................................................................................................................91 Table 69 : The ESD performance measurement table (Temperature: 25, Humidity: 45%).........................................................................92 Table 70 : Label description of the module information.........................................................................................................................................94 Table 71 : Tray size.....................................................................................................................................................................................................95 Table 72 : Small carton size.......................................................................................................................................................................................95 Table 73 : Big carton size...........................................................................................................................................................................................95 Table 74 : Coding schemes and maximum net data rates over air interface.....................................................................................................96 Table 75 : Related documents...................................................................................................................................................................................98 Table 76 : Terms and abbreviations......................................................................................................................................................................... 98 Table 77 : Safety caution......................................................................................................................................................................................... 100 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Figure Index Figure 1 : SIMCom 5G module model illustrate......................................................................................................................................................10 Figure 2 : Block diagram.............................................................................................................................................................................................12 Figure 3 : Pin assignment...........................................................................................................................................................................................14 Figure 4 : Pin map of WLAN ZIF connector interface............................................................................................................................................ 16 Figure 5 : Test point of SIM826XX/SIM8X80-M2 series module.......................................................................................................................... 17 Figure 6 : Dimensions of the module (unit: mm).....................................................................................................................................................25 Figure 7 : Maximum current consumption of the module...................................................................................................................................... 26 Figure 8 : Power supply reference circuit................................................................................................................................................................ 27 Figure 9 : Power supply reference circuit................................................................................................................................................................ 28 Figure 10 : Linear regulator reference circuit.......................................................................................................................................................... 29 Figure 11 : Switching mode power supply reference circuit..................................................................................................................................29 Figure 12 : Switching mode power supply reference circuit for mmW module (SIM8380G-M2).................................................................... 30 Figure 13 : Reference power on/off circuit...............................................................................................................................................................32 Figure 14 : Power on sequence................................................................................................................................................................................ 32 Figure 15 : Power off sequence................................................................................................................................................................................ 34 Figure 16 : Reference reset circuit............................................................................................................................................................................35 Figure 17 : The reset timing sequence of the module........................................................................................................................................... 36 Figure 18 : I2C reference circuit................................................................................................................................................................................37 Figure 19 : WoWWAN# signal level at SMS and URC report...............................................................................................................................38 Figure 20 : WoWWAN# reference circuit................................................................................................................................................................. 38 Figure 21 : USB reference circuit.............................................................................................................................................................................. 39 Figure 22 : Type-C USB reference circuit with CC detector................................................................................................................................. 39 Figure 23 : PCIe interface reference circuit (EP Mode).........................................................................................................................................41 Figure 24 : PCIe power-on sequence requirements of M.2 specification........................................................................................................... 42 Figure 25 : PCIe power-on sequence requirements of module............................................................................................................................42 Figure 26 : The module connect W82 reference circuit (PCIe assistant signal is 3.3V version).....................................................................44 Figure 27 : The module connect RTL8125B-TE reference circuit (3.3V PCIe assistant signal version)....................................................... 45 Figure 28 : The module connect IPQxxxx reference circuit (1.8V PCIe assistant signal version).................................................................. 46 Figure29 : Always close (U)SIM card reference circuit.......................................................................................................................................... 48 Figure30 : Always open (U)SIM card reference circuit.......................................................................................................................................... 48 Figure31 : Without CD pin (U)SIM card reference circuit......................................................................................................................................49 Figure 32 : I2S timing.................................................................................................................................................................................................. 50 Figure 33 : Audio codec diagram circuit................................................................................................................................................................... 51 Figure 34 : LED1# reference circuit.......................................................................................................................................................................... 54 Figure 35 : W_DISABLE1# pin reference circuit.....................................................................................................................................................55 Figure 36 : TDD_SYNC_PPS pin reference circuit................................................................................................................................................ 57 Figure 37 : W_DISABLE2# pin reference circuit.....................................................................................................................................................58 Figure 38 : UART level conversion circuit................................................................................................................................................................62 Figure 39 : The connection diagram of module and mmW module.....................................................................................................................64 Figure 40 : Antenna interfaces of Modules.............................................................................................................................................................. 66 Figure 41 : 3D view of 20449-001E-03.................................................................................................................................................................... 72 Figure 42 : 3D view of MXHJD3HJ1000.................................................................................................................................................................. 72 Figure 43 : RF cable correct pull and push operation............................................................................................................................................ 73 Figure 44 : RF cable error pull and push operation................................................................................................................................................73 Figure 45 : Use RF cable tool correct pull and push operation............................................................................................................................ 74 Figure 46 : Use RF cable tool error pull and push operation................................................................................................................................ 74 Figure 47 : Thermal design diagram.........................................................................................................................................................................91 Figure 48 : Top and bottom view of the module......................................................................................................................................................93 Figure 49 : Label description of the module............................................................................................................................................................ 94 Figure 50 : Packaging procedures............................................................................................................................................................................ 95 Figure 51 : Tray view of the module..........................................................................................................................................................................95 Figure 52 : Small carton view.................................................................................................................................................................................... 95 Figure 53 : Big carton view.........................................................................................................................................................................................95 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 1. Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and test results of the SIM826XX/SIM8X80-M2 module. With the help of this documentcustomers can quickly understand SIM826XX/SIM8X80-M2 Series module. Associated with other software application notes and user guides, customers can use SIM826XX/SIM8X80-M2 Series to design and develop mobile and laptop applications easily. Figure 1: SIMCom 5G module model illustrate www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Product Outline SIM826XX/SIM8X80-M2 Series is a wireless communication module focusing on 5G market, it supports multi-air access technology including 5G NR (NSA/SA), LTE-FDD, LTE-TDD, and WCDMA, can meet the 3GPP R16 NR specification, and data rate which up to 4Gps (DL). GNSS system is optional, and it includes dual bands GLONASS/Bei Dou/Galileo/QZSS. Only SIM8380G-M2 support mmW. The modules supported radio frequency bands are shown in the following table. Table 1: Module frequency bands SIM8262A-M2 5G NR LTE-FDD LTE-TDD WCDMA GNSS1 n1/n2/n5/n7/n8/n12/n13/n14/n18/n20/n25/n26/n30/n38/n41/n48/n66/n71/n77/n78/n7 9 B1/B2/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B29/B30/B66/B71 B38/B41/B42/B43/B46/B48 B1/ B2/B4/B5/B8 L1+L52 The physical dimension of SIM8260C/SIM8260G/SIM8380G-M2 is 30.0mm*52.0mm*2.3mm and SIM8262E/A-M2 is 30.0mm*42.0mm*2.3mm, which all can meet PCI Express M.2 specifications, and can meet almost all space requirements in customers applications. The module owns rich interfaces, includes USB3.1, PCIe3.0, (U)SIM card, digital audio 3(I2S or PCM), I2C, GPIOs, four antennas for 3G/4G/5G and GNSS. SIM8380-M2 has 4 dedicated antennas for mmW. With all the interfaces, module can also be utilized in the handheld terminal, machine-to-machine laptop application and especially the notebook. NOTE 3 GNSS system is optional. 4 L5 is not support by default, if customers need to support L5, hardware needs to be customized, for more detail, please contact SIMCom support teams. 5 SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. Table 2: Data transmission throughput Module SIM8262A-M2 Data transmission throughput NSA: 3.0Gbps (DL)/660Mbps (UL) SA: 2.4Gbps(DL)/900Mbps(UL) LTE: 1Gbps (DL)/150Mbps (UL) HSPA+: 42Mbps (DL)/5.76Mbps (UL) www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Hardware Block Diagram The block diagram of module is shown in the following figure. Figure 2: Block diagram NOTE 1.SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. 2.?

eans the DPR2 function can use module support interrupt GPIO configuration. Feature Overview Table 3: Key features Feature Application processor Implementation Arm Cortex-A7 up to 1.8 GHz Memory RAM Memory ROM Power supply1 Minimum power consumption mode Transmit power Modulation system MIMO 4Gb 16-bit LPDDR4X at 2.13 GHz 4Gb 8-bit NAND VBAT: 3.1354.4V Typical: 3.8V Typical: 5.3mA (VBAT=3.8V, AT+CFUN=0 & AT+CSCLK=1 & USB no connect) Power Class 3 for WCDMA/LTE/5G NRPower Class 2 for n41/n77/n78/n79 NR: DL 256QAM, UL 256QAM LTE: DL 256QAM, UL 256QAM WCDMA: 16QAM 64QAM QPSKmmW: 64QAM DL / UL DL 4*4MIMO (LB only support 2*2) UL 2*2MIMO (only support n41) : SIM8262E/A-M2 UL 2*2MIMO (only support n38/n41/n48/n77/n78/n79) :

SIM8260G/SIM8380G-M2 Antenna Four antennas for 3G/4G/5G and GNSS GNSS (optional) GNSS engine: GPS /GLONASS/Bei Dou/Galileo/QZSSProtocol: NMEA SMS

(U)SIM interface www.(U)SIMcom.com MT, MO, CB, Text and PDU mode SMS storage: (U)SIM card or ME (default) Transmission of SMS alternatively over CS or PS Support (U)SIM card:1.8V/3.0V Include (U)SIM1 and (U)SIM2 interfacesSupport dual (U)SIM single standby3

(U)SIM application toolkit Support SAT class 3Support USAT SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com Phonebook management Support phonebook types: DC, MC, RC, SM, ME, FD, ON, LD, EN SIM8262A-M2 Series Hardware Design V1.07 Digital audio interface PCIe interface I2C interface USB UART interface Firmware upgrade Physical characteristics One I2S interface with dedicated main-clock for primary digital audio, theI2S also can be configured as PCM4 3 MCLK frequency: 12.288MHz (default) 4 WCDMA AMR-NB 5 6 7 VoLTE AMR-WB Echo Cancellation Noise Suppression 1. One lane PCIe interface, support Gen 3.0 (Gen 1/2 compatible) 2. High communication data rate which up to 16Gbps 1. Meet I2C specification, version 3.0 2. Data rate up to 400Kbps Support USB 3.1 Gen2 or USB 2.0 USB3.1: super speed, with data rate which up to 10Gbps USB2.0: high speed interface, support USB operations at low-speed andfull-speed, which refer to USB1.0 and USB1.1 Module hardware configurescommand) by default communicati on norm al UA RT a s

A T Firmware upgrade over USB interface SIM8260C-M2, SIM8260G-M2, SIM8380G-M2 Size:30mm*52mm*2.3mm SIM8262E/A-M2 Size:

30mm*42mm*2.3mmSIM8260C-M2 Weight: 9.34g (typical) SIM8262E-M2 Weight: 7.00g (typical) SIM8262A-M2 Weight: 6.85g (typical) SIM8260G-M2 Weight: 8.37g (typical) SIM8380G-M2 Weight: 8.60g (typical) Temperature range Normal operation temperature: -30C to +70C (3GPP compliant) Extended operation temperature: -40C to +85C2 Storage temperature: -40C to +90C NOTE 1. The recommended operating voltage of the module is 3.8V. If the voltage is lower than 3.135V, the RF performance will not meet the 3GPP specifications. 2. When Module is within the extended operation temperature range, Module is able to establish and maintain voice, data transmission, SMS and emergency call, etc. The performance may deviate slightly from the 3GPP specifications and will meet 3GPP specifications again when the temperature returns to normal operating temperature levels. It is strongly recommended that customers take heat dissipation measures to ensure that the normal operating temperature of the module cant be exceeded, refer to thermal design section for details. 3. SIM8260G and SIM8380G-M2 module reserve eSIM inside, M2 interface without (U)SIM2 interface. 4. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 2. Package Information Pin Assignment Overview M2 interface pin assignment M2 interface has 75 pins, including 8 notch pins. Customer design should match pins functions. The following figure is the pin assignment of the module. NOTE: ALL of modules are not support hot swap; hot swap may cause permanent damage to the modules. Figure 3: Pin assignment The pin differences of SIM826XX-M2 and SIM8X80-M2 module below. Table 4: Pin differences of SIM826XX-M2 and SIM8X80-M2 module SIM8262 A-name M2 M.2 pin number 48 46 44 42 40 28 24 22 59

(U)SIM2_PW R

(U)SIM2_RE S ET

(U)SIM2_CL K

(U)SIM2_DA T A

(U)SIM2_DE T I2S_WA I2S_TX I2S_RX ANTCTL0 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 60 61 63 I2S_MCLK ANTCTL1 LAA/N79_TX _ www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 EN RESET#

I2C_SDA I2C_SCL 67 68 38 NOTE 1. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. 2. About mmW function, SIM8380G-M2 only supports two group of QTMs signal; use QTM0_PON and QTM3_PON by default. 3. When the module work N79 or LAA band, PIN63 of SIM8262E-M2, SIM8260C-M2 and PIN59 of SIM8260G-M2, SIM8380G-M2 is output signal, from 5G modules output to WIFI module, the goal is turning off WIFI module RF reception to protect WIFI module. 4. When the WIFI module is working, PIN63 of the SIM8262A-M2 is input signal, from WIFI module output to 5G modules, the goal is turning off 5G module RF LAA LNA to protect 5G module. 5. PIN60 of SIM8260G-M2 (IPQxxxx version) as to module LAA band DL receive protects control. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 WLAN ZIF Connector SIM826XX/SIM8X80-M2 Series provide a WLAN ZIF connector for WIFI function, the connector is located bottom side of the module and it no assembly on the module by default. About this connector and WIFI function more details, please contact SIMCom support teams, the following figure is pin map of the WLAN ZIF connector. Figure 4: Pin map of WLAN ZIF connector interface NOTE 1. Connector is no assembly on the module by default. 2. The module not supports the function of WIFI by default. 3. The WALN ZIF connector of SIM826XX_SIM8X80 M2 series module default WIFI module model is W82, other WIFI module models is not supported. If customers need other modules support, please contact the SIMCom support team. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Table 5: Recommended WLAN ZIF connector list Name Manufacturer Part number Position number Connector ACES ELECTONICS 51614-03001-002

Test Point of Module The following figure shows test point of SIM826XX/SIM8X80-M2 series module. Figure 5: Test point of SIM826XX/SIM8X80-M2 series module www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Table 6: Test point of module description Test Point PICE_INI_BYPASS Description For the windows version module, before powering on module short PCIE_INI_BYPASS and 1.8V, and then power on module, used to bypass PCIe initial in BIOS stage. 1.8V Module internal power VDD_EXT output. FORCE_USB_BOOT DBUG_TX DBUG_RX USB_HS_DM USB_HS_DP Short FORCE_USB_BOOT and 1.8V before powering on module,and then power on module, used to enter to force download mode. If the windows version modules need to enter force download mode,need to short PCIE_INI_BYPASS, FORCE_USB_BOOT and 1.8V at the same time, and then power on module, used to enter to forcedownload mode. Debug UART TX Debug UART RX USB2.0 DM USB2.0 DP FULL_CARD_POWER_OFF

VBAT Power on signal of module Power supply of module GND GND www.(U)SIMcom.com Pin Description Table 7: IO parameters definition Pin type Description PI Power Input PO AI AIO DIO DI DO DOH DOL PU PD OD OC Power Output Analog Input Analog Input/Output Digital Input /Output Digital Input Digital Output Digital Output with High level Digital Output with Low level Pull Up Pull Down Open Drain Open Collector Table 8: DC parameters definition Voltage domain Parameter VDD_P3=1.8V SIM8262A-M2 Series Hardware Design V1.07 Min Type Max Table 9: Pin description P3 P4/P5 VOH VOL VIH VIL Rp VOH VOL VIH VIL Rp High level output 1.35V Low level output 0V High level input Low level input Pull up/down resistor 1.26V 0V 20K ohm VDD_P4/P5=1.8V High level output 1.44V Low level output 0V High level input Low level input Pull up/down resistor 1.26V 0V 10K ohm 2.4V 0V 2.1V 0V VDD_P4/P5=3.0V VOH VOL VIH VIL Rp Pin name www.(U)SIMcom.com P i n n o

. High level output Low level output High level input Low level input Pull up/down Electrical descripti on

1.8V

1.8V 0.45V 2.1V 0.54V 60K ohm 1.8V 0.4V 1.95V 0.36V 100K ohm 3.0V 0.4V 3.05V 0.6V 10K ohm 100K ohm Description Comment SIM8262A-M2 Series Hardware Design V1.07 connected together to withstand sufficent current If need to use VIO_1V8, need to string 2.2R resister outside the module , and at the same time add TVS protect diode Its 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO SIM8260C--M2 RESET# pin needs to be pulled up to 1.8V by adding 100KR externally 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO The hardware of module support TDD_SYNC_PPS function by default Need pulled up to 1.8V by adding 100KR externally The module is configured as the WWAN USB3.1 interface type Main communication interface USB3.1 data rate up to 10Gbps USB2.0 data rate up to 480Mbps 72,74 Range3.1354.4V Typical3.8V VIO_1V8 65 PO 1.8V output voltage GND System control 3,5,11,27, 33,39,45,51,5 7,71,73 Ground FULL_CARD_POW ER_OFF#

6 DI, PD High level: the module power on Low level: the module power off RESET#

67 P3 DI System reset control input Active low Flight mode Active low Pulse output indication NSA and SA sub6 for the beginning frame flag of DL-UL GNSS disable control Active low Wake on the host interrupt output signal Active low Connected to ground internally Connected to ground internally Connected to ground internally Not connected Differential USB bi-directional data positive Differential USB bi-directional data negative USB3.1 transmit data negative USB3.1 transmit data positive USB3.1 receive data negative USB3.1 receive data positive W_DISABLE1#

8 TDD_SYNC_PPS 26 P3 W_DISABLE2#1 WoWWAN#

Configuration pins CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 USB2.0/USB3.1 USB_HS_DP USB_HS_DM USB_SS_TX_M USB_SS_TX_P USB_SS_RX_M USB_SS_RX_P PCIe interface PETn0 PETp0 23 21 69 75 1 7 9 29 31 35 37 41 43 www.(U)SIMcom.com DI DO DI OD GND GND GND NC AIO AIO AO AO AI AI AO AO PCIe transmit data negative PCIe transmit data positive Support PCIe Gen 3.0, data rate up to 8Gbps one lane. SIM8262A-M2 Series Hardware Design V1.07 PERn0 PERp0 REFCLKN REFCLKP 47 49 53 55 PCIe assistant interface7 50 PERST#

CLKREQ#

PEWAKE#

(U)SIM interface2 52 54 AI AI AIO AIO DIO DIO DIO

(U)SIM1_PWR 36 P4 PO

(U)SIM1_DATA 34 P4 DIO

(U)SIM1_CLK

(U)SIM1_RESET 32 30 P4 P4 DO DO

(U)SIM1_DET 66 P3 DI

(U)SIM2_PWR VDD_1V9

(U)SIM2_CLK QTM3_PON

(U)SIM2_RESET QTM2_PON

(U)SIM2_DATA QTM1_PON 48 44 46 42 P5 P5 P3 P5 P3 P5 P3 Antenna control interface3 PO DO DO DO DO mmW which up to DO mmW ANTCTL0 59 P3 DO www.(U)SIMcom.com PCIe receive data negative PCIe receive data positive PCIe reference clock negati ve positive PCIe reference clock PCIe reset signal Active low PCIe reference clockrequest signal Active low PCIe wake up controlActive low Power supply for

(U)SIM1card

(U)SIM1 card data, whichhas been pulled up to SIM1_PWR via a 20KR resistor internally

(U)SIM1 clock signal

(U)SIM1 reset control

(U)SIM1 card detect, whichhas been pulled up to VDD_P3 via a 100KR resistor internally Power supply for

(U)SIM2card Power supply for mmWQTM VDD

(U)SIM2 clock signal Power on/reset 3 for mmWQTM module

(U)SIM2 reset control Power on/reset 2 for QTM module

(U)SIM2 card data, DIO has been pulled

(U)SIM2_PWR via a 20KR resistor internally Power on/reset 1 for VDD_P3 via a 100KR QTM module

(U)SIM2 card detect, which QTM module resistor internally Antenna tuner control0 If unused, please keep open 3.3V voltage domain, CLKREQ# and PEWAKE# required pullup external, If unused, please keep open 1.8/3.0V voltage domain,

(U)SIM interfaces should be protected against ESD If unused, please keep open SIM8260C/SIM8262E/

S IM8262A-M2 support

(U)SIM2 SIM8260G-M2 and SIM8380G -M2 not support (U)SIM2 interface, but the reserved eSIM card is to connected

(U)SIM2 inside of support mmW the module Only SIM8380G-M2 1.8V voltage domain. If unused, please keep open SIM8260C-M2, SIM8262E-M2 and SIM8262A-M2 are be defined as ANTCTL0 SIM8262A-M2 Series Hardware Design V1.07 63 59 DO LAA/N79_TX_EN*

P3 DO 63 DI Active high Coexistence signals of n79 and WIFI signal. When the output power of N79 is too high, output high level to WIFI module to turn off the WIFI 5G LNA. Active high Coexistence signals of n79 and WIFI signal. When the output power of N79 is too high, output high level to WIFI module to turn off the WIFI 5G LNA. Active high Coexistence signals of LAA and WIFI signal. When WIFI 5G is output power too high, output high level to 5G module to turn off 5G modules LAA LNA. ANTCTL1 P3 DO Antenna tuner control1 61 QTM_THERM_DET ANTCTL2

(RFFE_SDATA)3 ANTCTL 3

(RFFE_SCLK)3 I2S interface4 AI DO

(DIO) mmW QTM module thermal detect Antenna tuner control2

(Antenna tuner MIPI DATA)3 58 P3 56 P3 DO Antenna tuner control3

(Antenna tuner MIPI CLK)3 I2S_CLK 20 P3 DO I2S clock output I2S_RX DI I2S data input 22 P3 ANTCTL4 DO Antenna tuner control4 I2S_TX VIO_1V8 I2S_WA www.(U)SIMcom.com 24 P3 28 P3 DO I2S data output PO DO power for tuner I2S word alignment select 1.8V voltage domain. If unused, please keep open SIM8260G-M2 and SIM8380G-M2 are be defined as ANTCTL0 SIM8260G-M2 and SIM8380G-M2 are defined as output signal and use for protect WIFI module. SIM8260C-M2 SIM8262E-M2 are defined as output signal and use for protect WIFI module. SIM8262A-M2 are be defined as input signal and use for protect 5G module. 1.8V voltage domain. If unused, please keep open Only SIM8380G-M2 is defined as QTM_THERM_DET 1.8V voltage domain. If unused, please keep open 1.8V voltage domain. If unused, please keep open 1.8V voltage domain, also can be used as PCM interface. If unused, please keep open 1.8V voltage domain, also can be used as PCM interface. If unused, please keep open Only SIM8262E-M2 is defined as ANTCTL4, not support interrupt 1.8V voltage domain, also can be used as PCM interface. If unused, please keep open Only SIM8262E-M2 is defined as VIO_1V8 1.8V voltage domain, SIM8262A-M2 Series Hardware Design V1.07 DPR2 DI

(L/R) DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) sensor interrupt input I2S_MCLK6 DO I2S master clock 60 P3 WL_TX_EN6 DI Coexist WIFI to control LAA/N79 also can be used as PCM interface. If unused, please keep open Only SIM8262E-M2 is defined as DPR2 1.8V voltage domain, also can be used as PCM interface. If unused, please keep open The function of I2S_MCLK is default 1.8V voltage domain, If unused, please keep open SIM8380G-M2 hardware support I2S_MCLK by default The function of I2S_MCLK and WL_TX_EN are not support at the same time Only SIM8380G-M2 support hardware configure WL_TX_EN function V voltage domain, If unused, please keep open I2C interface5 I2C_SDA I2C_SCL COEX interface UART_TX COEX_TX*

UART_RX COEX_RX*

Other pins LED1#

P3 P3 P3 P3 68 38 64 62 10 DIO DO I2C data signal I2C clock signal DO DI OD Module hardware configures as normal communication UART (AT command) by default If need coexistence signal function, please contact SIMCom support teams The module status indicator via LED devices Active low DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) sensor interrupt input DPR*

25 P3 DI Notch Notch 12, 13, 14, 15, 16, 17, 18, 19 Notch WLAN ZIF connector interface*

WL_SLEEP_CLK COEX_UART_TX Z2 Z4 P3 P3 COEX_UART_RX Z5 P3 www.(U)SIMcom.com D O D O D WLAN Sleep clock 32.768K output LTE&WLAN coexistence data transmit LTE&WLAN coexistence data receive SIM8262A-M2 Series Hardware Design V1.07 WL_EN_GPIO WL_GPIO WL_LAA_RX Z6 Z7 Z8 P3 P3 P3 DO DI(O

) DO WL_PA_MUT Z9 P3 DO LAA_AS_EN Z10 P3 DO WL_SW_CTRL Z12 P3 DI Enable the WLAN Active high Reserved GPIO for WLAN WLAN XFEM control forLAA receiver Module high band LTE andWLAN 2.4g PA control signal, pull up to turn off 2.4g chain 1 PA Allow LAA to control WLAN FEM during WLAN in sleepmode WLAN module in active and sleep mode, externalpower switch Supply 1.35V to WLAN control module WL_VDD_VM WL_VDD_VL Z16, Z17, Z18 PO Z20, Z21, Z22, Z23, Z24, Z25 PO Supply 0.95V to WLAN module WL_VDD_VH Z27, Z28, Z29 PO GND Z1, Z3, Z11, Z13, Z15, Z19, Z26, Z30 Power supply 1.95V to WLAN module These three voltages are typical values, and the voltage varies slightly with the working status of wifi NOTE

* means under development. 1. W_DISABLE2# can be set through the AT command by software, hardware function not support by default, if customer need to hardware support, hardware need to be customized. 2. SIM8260G-M2 and SIM8380G-M2 module reserve eSIM inside, without (U)SIM2 interface. 3. The RFFE signals are multiplexed with ANTCTL2 and ANTCTL3. 4. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. 5. Only SIM8260C-M2 module I2C need pulled-up to 1.8V by 2.2KR resistor externally, other modules I2C internal be pulled-up to 1.8V by 2.2K resistor already. 6. About pin60 of the module, only SIM8380G-M2 support hardware configure WL_TX_EN function, by default, SIM8380G-M2 hardware support if need to WL_TX_EN function, SIM8380G-M2 need to special custom version, and only supporting 4 lines I2S interface (no I2S_MCLK signal), and if need to use I2S digital audio interface, the codec can only use ALC5616. 7. SIM8262E-M2/SIM8262A-M2/SIM8260G-M2* module PCIe assistant signal has 1.8V and 3.3V two versions, for more details, please contact the SIMCom support team. 8. For more details, please contact the SIMCom support team. I2S_MCLK function, www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 2.3 Mechanical Dimensions The following figure shows the mechanical dimensions of SIM8262E/A-M2. Figure 6: Dimensions of the module (unit: mm) NOTE 1. Make sure that the module can reach maximum work performance under extended temperature or extreme conditions for a long time, thermal dissipation design is very important. On customer main PCB, the size of exposed copper thermal dissipation area and exposed copper thermal dissipation area of module should be consistent. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3. Interface Application Power Supply The recommended power supply of module is 3.8V and the voltage ranges from 3.135 V to 4.4V. Please make sure that the input voltage will never drop below 3.135V, otherwise the module will be powered off automatically. The module has 5 power pins and 11 ground pins. To ensure the module works properly, all pins should be connected. Table 10: VBAT pins electrical characteristics Symbol Description VBAT Ipeak_sub6 Ipeak_sub6+mm W Im in Ileakage Module power supply voltage Peak current Peak current Current in minimum power consumption mode

(VBAT=3.8V, AT+CFUN=0 & AT+CSCLK=1 &

USB no connect) Current in power off mode Min. 3.135

Typ

. 3.8

5.3 Max. 4.4 1.8 3

Un it V A A mA 128 150 uA Power Supply Design Guide For SIM826XX-M2 and SIM8260G-M2, when using 3.8V power supply, the max peak current can reach to 1.8A under the maximum transmit power of the module. Ensure that the VBAT voltage drop to minimum voltage is no less than 3.135V when the module at maximum power radio transmission, and considering the voltage drop and conversion efficiency, it is strongly recommended that the DC-DC or LDO output capacity should not be less than 3A. Figure 7: Maximum current consumption of the module NOTE 1. The total capacitors of VBAT net are not less than 420uF. 2. When the voltage drop on VBAT reaches its maximum value, please ensure VABT voltage drop to minimum voltage is not less than 3.135V. 3. Only SIM8380G-M2 support mmW. www.(U)SIMcom.com To decrease the voltage dropping, be closely to VBAT pin add compensation capacitors capacity value no less than SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com 420uF. The following figure shows the reference circuit of power supply for the VBAT. SIM8262A-M2 Series Hardware Design V1.07 Figure 8: Power supply reference circuit In this reference circuit, some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMI suppression. These capacitors should be put as close as possible to VBAT pins. Also, users should keep VBAT trace on circuit board wider than 3.0mm to reduce the PCB trace impedance. Table 11: Definition of VBAT and GND pins Pin name Pin no. Electrical description description Comment VABT 2,4,70,72, 74 VIO_1V8 65 PI PO 3,5,11,27, 33,39,45,5 1

,57,71,73 GND NOTE These pins should be connected together to withstand sufficent current Power supply Range3.135 4.4V Typical3.8V 1.8V output voltage Ground 1. C5 is 220 F tantalum capacitor, ESR=0.7. 2. C1 and C2 are multi-layer ceramic chip (MLCC) capacitors from 33pF to 1uF with low ESR in high frequency band, which can Improves EMC performance. 3. D1 is used for ESD protection. Table 12: Recommended D1 list No. Manufacturer Part number VRWM Package Ref. Designator 1 2 WILL CYGWAYON ESD56201D0 4 WS4.5DPV 4.85V DFN1610-2L D1 4.7V DFN1610-2L www.(U)SIMcom.com Power supply layout guidelines:

Both VBAT and return trace should be as short and wide as possible to minimize the voltage drop. SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com These capacitors should be placed as closely as possible with VBAT pins. The VBAT trace should pass through TVS diode and capacitors, and then VBAT pins. The capacitor of the small The width of VBAT trace cannot be less than 3.0mm. value should be placed close to VBAT pins. The PCB design must have a solid ground plane as the primary reference plane for most signals. SIM8262A-M2 Series Hardware Design V1.07 The following figure is reference circuit of the modules PIN65. Figure 9: Power supply reference circuit NOTE 1. Recommend placing a TVS at the PIN65 pin of the module for ESD protection, recommend TVS diode as show in follows table. 2. Recommend strings a 2.2R resister at the PIN65 pin of the module for ESD protection. 3. The signal of PIN65 VIO_1V8 add the filter capacitor total capacity value cant more than 1uF. Table 13: PIN65 of the module recommend TVS list No. Manufacturer Part number VRWM Package Ref. Designator 1 2 WAYON YAGEO WE2.5DF-B 2.5V DFN1006-2L RC0402JR072R2 L

0402 D1 R1 Recommended Power Supply Circuit For SIM826XX-M2 and SIM8260G-M2, it is recommended to use a switching mode power supply or a linear regulator www.(U)SIMcom.com power supply. Make sure it can provide the current up to 3A at least. SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com Figure10 shows the linear regulator reference circuit with 5V input and 3.8V output. Figure11 shows the switching mode power supply reference circuit with 5~12V input and 3.8V output. For SIM8380G-M2, it is recommended to use a switching mode power supply, make sure it can provide the current up to 16A at least. Figure12 shows the switching mode power supply reference circuit with 8.8~16V input and 3.8V output. SIM8262A-M2 Series Hardware Design V1.07 Figure 10: Linear regulator reference circuit NOTE 1. An extra minimum load of R3 is required, to ensure it work properly under light load in sleep mode and power off mode. For the details about minimum load, please refer to specification of MIC29502WU. Figure 11: Switching mode power supply reference circuit www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Figure 12: Switching mode power supply reference circuit for mmW module (SIM8380G-M2) Table 14: Recommended FB1 and L1 list Name Manufacturer Part number Position number Ferrite bead Sunlord UPZ1608E300-5R0TF Power inductor Coilcraft XAL1010-451ME FB1 L1 NOTE 1. In order to avoid damaging the module, please do not switch off the power supply when module works normally. Only after the module is shut down by FULL_CARD_POWER_OFF# or AT command, and wait for 12s at least, then the power supply can be cut off. 2. When the module in abnormal state, make sure design should have the ability to switch off the power supply and then switch on the power to restart the module. The PWR_CTRL signal recommend connect to the host and the power of module can be controlled. 3. Only SIM8380G-M2 support mmW. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Voltage Monitor To monitor the VBAT voltage, the AT command AT+CBC can be used. NOTE 1. For the details about voltage monitor commands, please refer to SIM826X-M2 Series_AT Command Manual in the appendix. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Power On and Off Module Driving the FULL_CARD_POWER_OFF# pin to a high level, module will be powered on. It can be driven by either 1.8V or 3.3V GPIO. The following figure shows the power on/off circuit. Figure 13: Reference power on/off circuit Table 15: Definition of FULL_CARD_POWER_OFF# pin Pin name Pin no. Electrical description description Comment 6 DI, PD FULL_CARD _ POWER_OF F#

Power On High level: the modulepowers on Low level: the modulepowers off Its 3.3V tolerant butcan be driven by either 1.8V or 3.3V GPIO The power on sequence is shown in the following figure. Figure 14: Power on sequence Table 16: Power on timing and electrical characteristics Symbol Parameter Twait The waiting time from power supply available to power-

onaction Min. Typ. Max. Unit 100

ms www.(U)SIMcom.com Ton(usb) The time from power-on action to USB port ready

13

s SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com TVDD_IO The time from power-on action to internal VDD_IO normal output Input high level voltage on FULL_CARD_POWER_OFF#pin Input low level voltage on FULL_CARD_POWER_OFF#

pin VIH VIL NOTE SIM8262A-M2 Series Hardware Design V1.07

0 11. 5 1.8

12 4.5 0.2 ms V V 1. After the module is shut down, please wait at least 12 seconds before turning off the power, and then power on the module. 2. The test of Twait is based on SIMcom development board test. 3. Before power on module, the pin of module cannot have voltage infuse, otherwise lead to module RF boot error. Power Off The following methods can be used to power off the module. 3 Method 1: Power off the module by holding the FULL_CARD_POWER_OFF# pin to low level. 4 Method 2: Power off module by AT command AT+CPOF. NOTE 1. For the details about AT+CPOF, please refer to SIM826X-M2 Series_AT Command Manual in the appendix. 2. When the module is powered off by AT command, if the power supply and FULL_CARD_POWER _OFF# are not shut down, the module will automatically power on again. Above normal power-off action will make the module disconnect from the network, allow the software to enter a safe state, and save key data before the module is powered off completely. The power off sequence is shown in the following figure. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Figure 15: Power off sequence Table 17: Power off timing and electrical characteristics Symbol Parameter TVIO_1V8_off TO ff(USB) The time from power off action to VIO_1V8 completelypower down The time from power off action to USB port off Time value Ty p. Max

. Uni t 3 2

s s Mi n.

NOTE 1 After the module is shut down, please wait at least 12 seconds before turning off the power, and then power on the module. 2 The test of TVIO_1V8_off is based on SIMcom development board test. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Reset Function Module can be reset by driving the RESET# pin down to a low level. The RESET# signal has been internally pulled up to 1.8V, so it does not need pull up externally. Please refer to the following figure for the recommended reference circuit. Figure 16: Reference reset circuit Table 18: Recommended Q1 list Name N-Channel MOSFET WILLSEMI Manufacturer Part number WNM2046-3/TR Position number Q1 NOTE 1. * means if the RESET# pin want to be used, the RESET# pin of SIM8260C-M2 need be pulled up to 1.8V by 100KR resister externally. Table 19: Definition of RESET# pin Pin name Pin no. Electrical description description Comment RESET#

67 DI System reset control inputActive low www.(U)SIMcom.com SIM8260C-M2 RESET# pin needsto be pulled up to 1.8V by adding The reset timing sequence of the module is shown in the following figure. SIM8262A-M2 Series Hardware Design V1.07 100KR externally Figure 17: The reset timing sequence of the module Table 20: RESET# pin electrical characteristics Symbol Treset Description Low level hold time on RESET# pin Input high level voltage Input low level voltage VIH VIL NOTE 1. Please ensure that there is no capacitance on RESET# pin. Min. 280 1.2 0 Typ. Max. Unit 600 ms

1.9 0.4 V V www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 I2C Interface Module supports an I2C interface meet I2C specification version 3.0, with data rate up to 400kbps. The following figure shows the I2C interface reference circuit. Figure 18: I2C reference circuit Table 21: Definition of I2C interface Pin name Pin no. I2C_SDA I2C_SCL 68 38 Electrical description DIO DO Description Comment I2C data signal I2C clock signal NOTE 1.* means only SIM8260C-M2 I2C need pull up to 1.8V by 2.2KR resistor externally. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 WoWWAN#*

The WoWWAN# pin is a system wake-on signal which can be used as an interrupt signal for the host. Normally it keeps high level. And it will change to low level when certain conditions occur, such as receiving SMS, voice call (CSD, video) or URC reporting, the low-level pulse time is 1 second. Figure 19: WoWWAN# signal level at SMS and URC report WoWWAN# recommended reference circuit is shown in the following figure. Figure 20: WoWWAN# reference circuit Table 22: Definition of WoWWAN# pin Pin name Pin no. Electrical description WoWWAN#

23 OD Description Wake on the hostActive low Comment NOTE 1.* means under developmentfor more details, please contact the SIMCom support team. USB Interface Module supports one USB interface which complies with the USB3.1 and 2.0 specifications. Customers can choose USB3.1 or USB2.0 for their needs. USB 3.1 data rate up to 10Gbps. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 The module supports USB suspend and resume mechanism which can save power consumption. If there is no data transmission on the USB bus, the module will enter suspend mode automatically. The following figure is the USB reference circuit. Figure 21: USB reference circuit The following figure is the type-C USB reference circuit with CC detector. Figure 22: Type-C USB reference circuit with CC detector NOTE 1.If use PCIe interface already, PEWAKE#, CLKREQ#, PERST# signal of the module cannot use for GPIO control, but can use other unused GPIO ports configuration. 2. Only SIM8260C-M2s I2C need pull up to 1.8V by 2.2KR resistor externally. Table 23: Definition of USB interface Pin name Pin no. Electrical description Description Comment USB_HS_DP USB_HS_DM USB_SS_TX_M USB_SS_TX_P USB_SS_RX_M USB_SS_RX_P PEWAKE#*

CLKREQ#*

PERST#*

NOTE 7 9 29 31 35 37 54 52 50 AIO AIO AO AO AI AI DI DI DO Differential USB bi-

directionaldata positive Differential USB bi-

directionaldata negative USB3.1 transmit data negative USB3.1 transmit data positive USB3.1 receive data negative USB3.1 receive datapositive For CC detector function For indicating change in I2Cregisters interrupt signal. USB3.1 type-C switch controlsignal USB3.1 data rateup to 10Gbps USB2.0 data rateup to 480Mbps Need external pullup to 3.3V by 100KR resistor 1.* means PEWAKE#, CLKREQ#, PERST# be used for PCIe control signal by default if need configure type-c USB interface, and unused PCIe interface of module, recommend these three signal used for GPIO function. Table 24: USB interface recommended CC detector, USB3.1 type-C switch and TVS diode list No. Manufacturer Part number Package www.(U)SIMcom.com 1 WILL ESD5302N-3/TR DFN1006-3L SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 2 3 PERICOM PERICOM PI5USB30216D PI3DBS12212A QFN12 QFN3X3 USB HS DP/DM layout guidelines:

Maximum PCB trace length cannot exceed 100mm outside of module, the shorter the better. Require differential trace impedance is 9010% . The intra-lane length mismatch of the differential signal lanes is less than 1mm. Gap from other signals keeps 3xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, audio, and XO). The TVS diode should be placed close to the USB pins of M.2 connector. USB SS TX/RX layout guidelines:

Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than 500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. External components should be placed near the USB connector. Trace routes away from other sensitive signals (RF, especially 2.4 GHz). The TVS diode should be placed close to the USB pins of M.2 connector. Route differential pairs in the inner layers with a solid GND reference to have good impedance control and to minimize discontinuities. Keep isolation between the Tx pair, Rx pair, and DP/DM to avoid crosstalk. If core vias are used, use no more than two core vias per signal line to limit stubs. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 PCIe Interface Module supports PCIe Gen3 one lane interfaces, which data rate up to 8Gbps, and can be used as EP or RC mode. CLKREQ# and PEWAKE# needs pull up to 3.3V by 10K resesitor in customers design. The following figure is the PCIe reference circuit. Figure 23: PCIe interface reference circuit (EP Mode) NOTE 1. * means under development. 2. The AC capacitors of AP_PETn0 and AP_PETp0 should be closed to AP. 3. SIM8262E-M2/SIM8262A-M2/SIM8260G-M2* module PCIe assistant signal has 1.8V and 3.3V two versions, for more details, please contact the SIMCom support team. 4. If the module uses PCIe interface and USB interface in EP mode at the same time, the module low power mode current than only use PICe interface in EP mode higher. 5. If match with QPS615, please refer SIM8260G-M2 & QPS615 & W82 & RTL8211F & QEP8121 &

RTL8221B Connect Pin Mapping(xxxxxx) document. Table 25: Definition of PCIe interface Pin name Pin no. PETn0 PETp0 PERn0 PERp0 REFCLKN REFCLKP PERST#

CLKREQ#

PEWAKE#

41 43 47 49 53 55 50 52 54 Electrical descriptio Functional description n AO PCIe transmit data negative Comment AO AI AI AIO AIO DI DIO DIO PCIe transmit data positive PCIe receive data negative PCIe receive data positive PCIe reference clocknegative PCIe reference clock positive PERST# is a functional resetto the Add-In module active low PCIe reference clock requestsignal active low PCIe wake up signalactive low 3.3V voltage domain, CLKREQ#

and PEWAKE#

required pull up external, Default as EP mode.If unused, please keep open Table 26: PCIe interface recommended TVS diode list No. Manufacturer Part number Package www.(U)SIMcom.com 1 WILL ESD5302N-3/TR DFN1006-3L SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com PCIe timing SIM8262A-M2 Series Hardware Design V1.07 Figure 24: PCIe power-on sequence requirements of M.2 specification Figure 25: PCIe power-on sequence requirements of module PCIe interface layout guidelines:

Maximum PCB trace length cannot exceed 150mm outside of module, the shorter trace the better. Require differential trace impedance is 8510% . The intra-lane length mismatch of the differential signal lanes is less than 500um. Gap from other signals keeps 4xline width. Gap between Rx-to-Tx keeps 4xline width. Should be routed away from sensitive signals. The TVS diode should be placed close to the PCIe pins of M.2 connector. All other sensitive/high-speed signals and circuits must be protected from PCIe corruption. PCIe signals must be protected from noisy signals (clocks, SMPS). Each trace needs to be adjacent to a ground plane. USB and PCIe Modes*

Module supports communication both USB and PCIe interfaces, the followings describe USB mode, USB-AT-based PCIe mode, eFuse-based PCIe mode. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 USB mode Supports USB3.1 (backward compatible USB2.0) interface feature Supports MBIM/QMI/AT Communication can be switched to PCIe mode by AT command USB interface is default communication interface between SIM826XX/SIM8X80-M2 module and a host. If need to use PCIe interface for the communication between a host, an AT command under USB mode can be used. For more details about the AT command, please refer to SIM826X-M2 Series_AT Command Manual. It is suggested that USB 2.0 interface be reserved for firmware upgrade. USB-AT-based PCIe mode Supports MBIM/QMI/AT Communication can be switched back to USB mode by AT command When SIM826XX/SIM8X80-M2 module works at the USB-AT-based (switched from USB mode by AT command) PCIe mode, it supports MBIM/QMI/AT, and can be switched back to USB mode by AT command. But the firmware upgrade via PCIe interface is supported, so USB 2.0 interface must be reserved for the firmware upgrade. eFuse-based PCIe mode*

Supports MBIM/QMI/AT Supports Non-X86 systems and X86(Windows and Linux) system (supports BIOS PCIe early initial) SIM826XX/SIM8X80-M2 can also be reprogrammed to PCIe mode based on eFuse. If the communication is switched to PCIe mode by burnt eFuse, the communication cannot be switched back to USB mode. If the host does not support firmware upgrade through PCIe, then SIM826XX/SIM8X80-M2 USB2.0 interface (Pin 7 and Pin 9 of SIM826XX/SIM8X80-M2 M2 interface) and two test points (VIO_1V8 and FORCE_USB_BOOT) must be used for the firmware upgrade. For more details, please contact SIMCom support teams. NOTE 2 * means under development, for more detail, please contact SIMCom support teams. 3 FORCE_USB_BOOT for system firmware upgrade. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 PCIe for W82 PCIe can connect to W82 as WLAN data interface, WLAN ZIF connector for W82 power supply and assistance control, the module as RC and W82 as EP. CLKREQ#, PEWAKE# and PERST# signals need to connect 3.3V to 1.8V shift level between the module and W82, the following figure is the PCIe reference circuit, the details design please refer to the reference circuit document. Figure 26: The module connect W82 reference circuit (PCIe assistant signal is 3.3V version) Table 27: Recommended shift level list No. 1 Manufacturer TI Part number TXS0104EYZT Package GXU/ZXU(BGA) NOTE 1. SIM8262E-M2 and SIM8262A-M2 has 1.8V and 3.3V PCIe assistant signal hardware versions, for 3.3V PCIe assistant hardware version, on the module side, the PEWAKE# and CLKREQ# signals need to be pulled up to 3.3V by 10K resister, for 1.8V PCIe assistant hardware version, on the module side, the PEWAKE# and CLKREQ# signals need to be pulled up to 1.8V by 10K resister. 2. In W82 module, the PEWAKE# and CLKREQ# signals internal pull up to 1.8V already, if module is 3.3V PCIe assistant control signal version, between module and W82 need add 3.3V to 1.8V level shifter. 3. About WLAN ZIF connector pin description of the module, please refers to chapter2.1.2. 4. SIM8262E-M2/SIM8262A-M2/SIM8260G-M2* has 1.8V and 3.3V PCIe assistant signal hardware versions, Please pay attention to whether the levels match when use PCIe interface. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 PCIe for RTL8125B-TE PCIe can connect to RTL8125B-TE as Ethernet data interface, the module as RC and RTL8125B-TE as EP. CLKREQ# and PEWAKE# needs pull up to 3.3V by 10K resistor in customers design, the details design please refers to the reference circuit document. Figure 27: The module connect RTL8125B-TE reference circuit (3.3V PCIe assistant signal version) Table 28: Recommended RTL8125B IC list No. 1 Manufacturer REALTEK Part number RTL8125B-CG Package 6mm*6mm*1mm NOTE The AC capacitors of PCIe_TXM and PCIe_TXP should be placed near the RTL8125B. RTL8125Bs PCIe_WAKE, PCIe_RST, PCIe and CLKREQ signal voltage domain is 3.3Vif module is 1.8V PCIe assistant control signal version, between module and RTL8125B need add 1.8V to 3.3V level shifter, on level shifter 1.8V side, PCIe_WAKE PCIe_RST PCIe_CLKREQ need to pull up to 1.8V, on level shifter 3.3V side, PCIe_WAKEPCIe_RSTPCIe_CLKREQ need to pull up to 3.3V. SIM8262E-M2 and SIM8262A-M2 has 1.8V and 3.3V PCIe assistant signal hardware versions, Please pay attention to whether the levels match when use PCIe interface. For more details, please contact SIMCom support teams. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.7.5 PCIe for Qualcomm IPQxxxx*

PCIe can connect to qualcomm IPQxxxx as CPE application, the module as EP and qualcomm IPQxxxx as RC. Due to IPQxxxxs PCIe_WAKE, PCIe_RST and PCIe_CLKREQ signal voltage domain is 1.8V, So, CLKREQ# and PEWAKE# needs pull up to 1.8V by 10K resistor in customers design, the following figure is the module connect to IPQxxxx connection diagram. Figure 28: The module connect IPQxxxx reference circuit (1.8V PCIe assistant signal version) NOTE Qualcomm IPQxxxxs PCIe_WAKE, PCIe_RST and PCIe_CLKREQ signal voltage domain is 1.8V if module is 3.3V PCIe assistant control signal version, between module and IPQxxxx need add 3.3V to 1.8V level shifter, on level shifter 1.8V side, PCIe_WAKEPCIe_RSTPCIe_CLKREQ need to pull up to 1.8V, on level shifter 3.3V side, PCIe_WAKEPCIe_RSTPCIe_CLKREQ need to pull up to 3.3V. SIM8262E-M2 and SIM8262A-M2 has 1.8V and 3.3V PCIe assistant signal hardware versions, Please pay attention to whether the levels match when use PCIe interface.

* means the modules hardware and software not support this function by default, if need module coordinate IPQxxxx use, please contact SIMCom support teams. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.8 (U)SIM Interface Module supports two (U)SIM cards but single standby. Both (U)SIM1 and (U)SIM2 are dual-voltage 1.8V or 3.0V. Table 29: (U)SIM electrical characteristics in 1.8V mode ((U)SIM_PWR=1.8V) Symbol Parameter Min.

(U)SIM_PW R Power supply for (U)SIM card 1.65 VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage 1.26 0 1.44 0 Typ. 1.8

Table 30: (U)SIM electrical characteristics in 3.0V mode ((U)SIM_PWR=3.0V) Symbol Parameter

(U)SIM_PW R Power supply for (U)SIM card VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Min. 2.7 2.1 0 2.4 0 Table 31: Definition of (U)SIM interface Typ. 3.0

0

0 Max. 1.95 1.95 0.36 1.8 0.4 Max. 3.05 3.05 0.6 3.0 0.4 Unit V V V V V Unit V V V V V Pin name Pin no.

(U)SIM1_PWR

(U)SIM1_DATA

(U)SIM1_CLK

(U)SIM1_RESET

(U)SIM1_DET

(U)SIM2_PWR

(U)SIM2_CLK

(U)SIM2_RESET

(U)SIM2_DATA 36 34 32 30 66 48 44 46 42 Electrical description PO P4 P4 P4 P4 P3 P5 P5 P5 P5 DIO DO DO DI PO DO DO DIO

(U)SIM2_DET 40 P3 DI www.(U)SIMcom.com Description Comment Power supply for (U)SIM1 card

(U)SIM1 card data, which has been pulled up to SIM1_PWR via a 20KR resistor internally

(U)SIM1 clock signal

(U)SIM1 reset control

(U)SIM1 card detect, which has been pulled up to VDD_P3 via a 100KR resistor internally Power supply for (U)SIM2 card

(U)SIM2 clock signal

(U)SIM2 reset control

(U)SIM2 card data, which has been pulled up to SIM2_PWR via a 20KR resistor internally

(U)SIM2 card detect, which has been pulled up to P3 via a 1.8/3.0V voltage domain,

(U)SIM interfaces should be protectedagainst ESD If unused, pleasekeep open SIM8260C/SIM8 262E/SIM8262A

-M2 support (U)SIM2 SIM8260G-M2 andSIM8380G-

M2 not support (U)SIM2 interface, but the reserved eSIM SIM8262A-M2 Series Hardware Design V1.07 100KR resistor internally cardis connected to

(U)SIM2 inside ofthe module The following table shows recommended TVS of ESD protect and (U)SIM socket. Table 32: Recommended TVS and always close (U)SIM socket list www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Name TVS Manufacturer ST

(U)SIM socket MOLEX Part number ESDA6V1-5W6 5039600696 If the (U)SIM card hot-swap function is not used, customers can keep the (U)SIM_DET pin open.

(U)SIM traces should keep away from RF lines, VBAT and high-speed signal lines. The traces should be as short as possible. Keep (U)SIM holders GND connect to main ground directly. Shielding the (U)SIM card signal by ground. The (U)SIM card layout guidelines:

Make sure that the (U)SIM card holder should be far away from the antenna while in PCB layout. Recommended to place a 33pF1uF capacitor on (U)SIM_PWR line and keep close to the holder. The rise/fall time of (U)SIM_CLK should not be more than 40ns. The (U)SIM_CLK trace needs to be adjacent to a ground plane three-dimensional. The parasitic capacitance of TVS should not exceed 30pF and the TVS should be placed close to the (U)SIM socket. NOTE Always Close (U)SIM Card Design Always close (U)SIM card reference circuit as shown in the following figure. Figure29: Always close (U)SIM card reference circuit When no (U)SIM card insertCD pin connect with GND(U)SIM_DET is low level;

When (U)SIM card insertCD pin disconnect with GND(U)SIM_DET is high level. Always Open (U)SIM Card Design Always open (U)SIM card reference circuit as shown in the following figure. Figure30: Always open (U)SIM card reference circuit When no (U)SIM card insertCD pin disconnect with GND(U)SIM_DET is high level;

When (U)SIM card insertCD pin dconnect with GND(U)SIM_DET is low level. NOTE 1. The modules (U)SIM1_DET and (U)SIM2_DET pins have been internally pulled up VDD_P3 already by 100KR resister. 3.8.3 Without CD PIN (U)SIM Card Design www.(U)SIMcom.com If neednt (U)SIM hot swap function, please keep (U)SIM_DET pin disconnect, without CD pin (U)SIM card reference circuit as shown in the following figure. SIM8262A-M2 Series Hardware Design V1.07 Figure31: Without CD pin (U)SIM card reference circuit www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 I2S Interface Module supports one I2S interface for external codec, which follows the requirements in the Phillips I2S bus specification. Table 33: I2S format Characteristics Line interface format Data length Specification Linear (Fixed) 16bits (Fixed) I2S clock/sync source I2S clock frequency Master mode (Fixed) 1.536MHz (Default) I2S MCLK frequency 12.288MHz (Default) Data ordering MSB NOTE 1. For the details about I2S AT commands, please refer to SIM826X-M2 Series_AT Command Manualin the appendix. I2S Timing The module supports I2S sampling rate of 48 KHz and 32-bit coding signal (16-bit length), the timing sequence is shown in the following figure. Figure 32: I2S timing Table 34: I2S timing parameters Signal Parameter Frequency Description Working Frequency I2S_MCL K T t(HC) t(LC) www.(U)SIMcom.com Clock period Clock high Clock low Min. 81.380 0.45T 0.45T Typ. Max. Unit 12.28 MHz 8 81.38 0 12.28 8 0.55T ns ns 0.55T ns I2S_CLK Frequency Working Frequency 1.536 MHz SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com T t(HC) t(LC) Frequency t(sr) t(hr) t(dtr) t(htr) Clock period Clock high Clock low Working Frequency DIN/DOUT and WA input setuptime DIN/DOUT and WA input holdtime DIN/DOUT and WA outputdelay DIN/DOUT and WA output holdtime I2S_WA design circuit. SIM8262A-M2 Series Hardware Design V1.07 0.45T 0.45T 16.276 0 0 651 48 0.55T 0.55T 65.10 ns ns ns KHz ns ns ns ns I2S Reference Circuit The following figure is the external codec reference Figure 33: Audio codec diagram circuit Table 35: Definition of I2S interface Electrical description DO DI DO DO DO Description Comment I2S clock output I2S data input I2S data output I2S word alignment select (L/R) I2S master clock 1.8V voltage domain, also can be used as PCM interface, if unused, please keep open Pin name Pin no. 20 22 24 28 60 I2S_CLK I2S_RX I2S_TX I2S_WA I2S_MCLK NOTE 1 If use ALC5616 audio codec, the software can configuration ALC5616 internal registers, and can configuration 4 lines I2S (no I2S_MCLK signal) interface or 5 lines I2S (embrace I2S_MCLK signal) interface. 2 If use NAU8810 audio codec, the software only configure 5 lines I2S (embrace I2S_MCLK signal) interface. The PCM interface is multiplexing with I2S interface. The default audio interface of the module is I2S. Table 36: The PCM interface is multiplexing with I2S interface Pin name I2S_RX I2S_TX I2S_WA I2S_CLK I2S_MCLK Audio layout guidelines:

Analog input www.(U)SIMcom.com PCM interface PCM_DIN PCM_OUT PCM_SYNC PCM_CLK

0.2mm trace widths; 0.2mm spacing between other signals trace. SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Pseudo differential route for MIC. Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high-speed signals. Analog output Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other high-speed signals. Speaker output signal route as differential pair with 0.5mm trace widths. Audio power and GND Recommend add magnetic bead on AVDD net reserved for debug. VDD cannot directly use VBAT as the power supply. AGND need add GND via to the main GND plane directly. NOTE 1. Only SIM8260C-M2 need to add a 2.2KR resistor to 1.8V externally, other modules I2C have 2.2K pull-up inside. DPR*

DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) requirements. The RF output power would reduce if this signal is triggered by sensor under some certain conditions, such as SAR sensor triggered, defined by customers. User can activate this function with AT command. Table 37: Definition of DPR# pin Pin no. Pin name Pin status 25 DPR Low High Function Max transmitting power will be reduced by set through ATcommand Max transmitting power will not be reduced (default) Floating Max transmitting power will not be reduced NOTE 1. * means under development, for details please contact SIMCom support teams. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 CONFIG Pins These signals are provided to indicate its specific configuration that is WWAN-USB3.1 of SIM826XX/SIM8X80-M2. Table 38: CONFIG pins state of the module Pin no. Pin name 21 CONFIG_0 69 75 1 CONFIG_1 CONFIG_2 CONFIG_3 Description Connected to ground internally Connected to ground internally Connected to ground internally Not connected In the M.2 specifications, the CONFIG pins are defined as below. Table 39: CONFIG interface definition CONFIG_0 CONFIG _1 CONFIG _2 CONFIG _3

(Pin 69) Module type and

(Pin 75)

(Pin 1)

(Pin 21) Comments main host interface1 GND GND NC WWAN USB 3.1 Vender defined GND NOTE 1. The USB3.1 and PCIe interface can be supported at the same time of SIM826XX_SIM8X80 M2 series module. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 LED1#

LED1# is open drain output and is used to allow module to provide network status via LED which will be provided by the host. Figure 34: LED1# reference circuit Table 40: Definition of LED1# pin Pin name Pin no. Electrical description LED1#

10 OD Description Comments The module status indicatorvia LED devices Active low NOTE 1. The value of the resistor R1 depends on the LED characteristics. The recommend value of R1 is 2KR. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 The timing parameters are shown in the following table. Table 41: LED1# pin status LED1# pin status Always On Module status Searching network; call connection (including 5G, VOLTE) 100ms ON, 100ms OFF 5G Data transmits; 5G registered network 200ms ON, 200ms OFF 3G/4G Data transmits; 4G registered network 800ms ON, 800ms OFF OFF 3G registered network Power off: Sleep mode W_DISABLE1#

The W_DISABLE1# pin controls module to enter the flight mode. When the W_DISABLE1# signal is pulled to low level, RF function would be disabled. Otherwise, the RF function would be active. Recommended reference circuit is shown in the following figure. Figure 35: W_DISABLE1# pin reference circuit Table 42: Definition of W_DISABLE1# pin Pin name Pin no. Electrical description Description Comments W_DISABLE1

8 DI Flight mode 3.3V tolerant but can be driven by either 1.8V or 3.3VGPIO NOTE 1. The W_DISABLE1# signal is pulled up to 1.8V by software configure in the module. Table 43: W_DISABLE1# pin status W_DISABLE1# pin status Module operation www.(U)SIMcom.com Input low level Input high level Flight mode: RF is disabled (SIM card function turn on) AT+CFUN=4: Flight mode(SIM card function turn on)AT+CFUN=1: RF is enabled (default) AT+CFUN=0: Minimum power mode(SIM card function turn off) SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.14 TDD_SYNC_PPS*

In SIM826XX/SIM8X80-M2 design, TDD_SYNC_PPS and W_DISABLE2# function coexists in PIN26 of module. Hardware support TDD_SYNC_PPS function by default. When PIN26 configure as TDD_SYNC_PPS function, it can generate pulse use for indication NSA and SA sub6 the beginning frame flag of DL-UL, the pin level is 1.8V. Recommended reference circuit is shown in the following figure. Figure 36: TDD_SYNC_PPS pin reference circuit Table 44: Definition of TDD_SYNC_PPS pin Pin name Pin no. Electrical description TDD_SYNC_PP S 26 DO Description Comments It can generate pulse use for indication NSA and SA sub6 TDD the beginning frame flag of DL-UL 1.8V voltage domain NOTE 1. * means under development. 2. The TDD_SYNC_PPS pin also can be configured GPS_1PPS signal output by software, theTDD_SYNC_PPS and GPS_1PPS function cant be used at the same time. 3. About TDD_SYNC_PPS and GPS_1PPS function more detail, please contact SIMCom The following is TDD_SYNC_PPS signal design guidelines This signal trace should be treated as a data transmission line, required impedance is 50 . This signal trace should as short as possible and cannot exceed 40mm out of the module. This signal trace should far away from RF, power and high-speed signals. This signal trace should be protected completely by GND. The rising slew rate is no poor than 3ns, falling slew rate is no poor than 5ns, even with default lowest drive strength

(2mA) being selected. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.14.1 W_DISABLE2#*

The W_DISABLE2# pin controls module to disable the GNSS function. When the W_DISABLE2# signal is pulled to low level, the GNSS function would be disabled. Recommended reference circuit is shown in the following figure. Figure 37: W_DISABLE2# pin reference circuit Table 45: Definition of W_DISABLE2# pin Pin name Pin no. Electrical description W_DISABLE2

26 DI NOTE Description Comments GNSS disable Active low can be driven by either 1.8V or 3.3V GPIO 4 The W_DISABLE2# signal is pulled up to 1.8V by software configure in the module. 5 If HOST side control GPIO is 1.8V voltage domain, not need to add D1, If HOST side control GPIO is 3.3V voltage domain, must need to add D1. Table 46: Recommended D1 list No. Manufacturer Part number Forward current Package Ref. Designator 1 2 LRC WILL LDSR01S30ST5 G WSB5557Z 2A 2A DFN0603 D1 DFN0603 Table 47: W_DISABLE2#* pin status W_DISABLE2# pin status Input Low Level Module operation GNSS function is disabled www.(U)SIMcom.com Input High Level AT+CGPS=0: GNSS function is disabled AT+CGPS=1: GNSS function is enabled(default) SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 NOTE 3 * means under development, for details please contact SIMCom support teams. 4 The W_DISABLE2# function can be set by software AT command, if need this function, please contact SIMCom support team. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.7 Antenna Control Interface*

ANTCTL[0:4] and RFFE signals are used for tunable antenna control and should be routed to an appropriate antenna control circuitry. The following table is the definitions for antenna control interfaces Table 48: Definition of antenna control interface through GPIOs Pin name Pin no. Electrical description Description Comments ANTCTL0 59 63 DO Antenna tuner control0 59 DO LAA/N79_TX_E N*

ANTCTL1 ANTCTL2

(RFFE_SDAT A) 63 61 58 www.(U)SIMcom.com DO DI DO DO

(DI O) Active high Coexistence signals of n79and WIFI signal. When the output power of N79 is too high, output highlevel to WIFI module to turn off the WIFI 5G LNA. Active high Coexistence signals of n79and WIFI signal. When the output power of N79 is too high, output highlevel to WIFI module to turn off the WIFI 5G LNA. Active high Coexistence signals of LAAand WIFI signal. When WIFI 5G is output power too high, output high level to 5G module to turn off5G modules LAA LNA. Antenna tuner control1 Antenna tuner control2

(Antenna tuner MIPI DATA) 1.8V voltage domain. If unused,please keep open SIM8260C-M2, SIM8262E-M2 andSIM8262A-

M2 are be defined as ANTCTL0 SIM8260G-M2 andSIM8380G-

M2 are be defined as ANTCTL0 SIM8260G-M2 andSIM8380G-

M2 are defined as outputsignal and use for protect WIFI module. SIM8260C-M2 SIM8262E-

M2 are defined as outputsignal and use for protect WIFI module. SIM8262A-M2 are be defined as inputsignal and use for protect 5G module. 1.8V voltage domain. If unused,please keep open 1.8V voltage domain. If unused,please keep open SIM8262A-M2 Series Hardware Design V1.07 ANTCTL3

(RFFE_SCL K) 56 DO Antenna tuner control3

(Antenna tuner MIPI CLK) ANTCTL4 22 DO Antenna tuner control4 1.8V voltage domain. If unused,please keep open 1.8V voltage domain. If unused, please keep open Only SIM8262E-M2 is defined as ant tunner control4 not support interrupt www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 NOTE 1. * means under development, for details please contact SIMCom support teams. 2. The RFFE signals are multiplexed with ANTCTL2 and ANTCTL3. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.8 UART Interface Module hardware configure as normal communication UART (AT command) by default. If need coexistence signal function, please contact SIMCom support teams. Table 49: Definition of UART interface Pin name Pin no. Electrical description Description 64 62 DO DI Module hardware configures as normal communication UART

(AT command) by default UART_ TX COEX1

UART_ RX COEX2

Comments If need coexistence signalfunction, please contact SIMCom support teams The UART level of module is 1.8V, if need communication with 3.3V serial port levelit recommends to use level shift IC. The following figure shows the reference design circuit of level shift. Figure 38: UART level conversion circuit NOTE 1. If need coexistence signal function, please contact SIMCom support teams. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.9 GPIOs Interface There pins can be configured as GPIO function of module in following table, and it configuration by software configure according to the customers requirements. Table 50: GPIO list Module UART_TX UART_RX I2S_WA1 I2S_RX I2S_TX I2S_CLK DPR I2C_SDA I2C_SCL TDD_SYNC_PPS*

I2S_MCLK NOTE Pin no. 64 Interrupt function Y Pull (default options) B-PD: nppukp 62 28 22 24 20 25 68 38 26 60 Y Y Y Y Y Y Y Y Y N B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp

* means under development, about TDD_SYNC_PPS function more detail, please contact SIMCom support teams. 1. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interface, in not support digital audio version, definition of PIN28 & PIN24

& PIN22 as follows:

PIN28 define as DPR2. PIN24 define as VIO_1P8. PIN22 define as ANTCTL4, not support interrupt. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3.10 mmW Interface Only SIM8380G-M2 supports mmW, and its PIN definition is designed on the following pins of the M2 interface. Table 51: mmW Interface Pin name Pin no. QTM_THERM_DET VDD_1V9 QTM3_PON QTM2_PON QTM1_PON QTM0_PON 61 48 44 46 42 40 Electrical description AI PO DO DO DO DO Description mmW QTM module thermal detect Power supply for mmW QTM VDD Power on/reset 3 for mmW QTM module Power on/reset 2 for mmW QTM module Power on/reset 1 for mmW QTM module Power on/reset 0 for mmW QTM module SIM8380G-M2 support mmW modules are QTM545 and QTM547. Recommended reference circuit is shown in the following figure. Figure 39: The connection diagram of module and mmW module NOTE 1. The PIN61 of SIM8380G-M2 define for QTM_THERM_DET. 2. Only QTM547 support QTM_THERM_DET. 3. QTM545 embrace IF intermediate frequency signal, FPC material requirement is high, for more details, please refer SIM83X0 Series_mmWave_QTM545_QTM547_Antenna_Module_Application_Notes_V1.xx document. Table 52: Recommended mmW module connector list Name Manufacturer Part number Position number Connector Panasonic Connector Panasonic Connector Connector IPEX IPEX QTM design guidelines AXG3B0612DJ 1 AXG4B0612DJ 1 20981-001E-02 Connector on customer PCB board Connector on QTM545 module IF ANT RF Connector on PCB board 20980-001R-13 IF ANT RF connectors on the coaxial cable Logic design A 100PF capacitor needs to be added to the VDD_1P9 power supply of each QTM545 module A 22PF and 4.7UF capacitor needs to be added to the VDD_1P9 power supply of each QTM547 module 100PF capacitor needs to be added to the VCC_QTM power supply of each QTM545 module 100PF and 10UF capacitor needs to be added to the VCC_QTM power supply of each QTM5457module If the QTM_PON signal is not used, add a 100 resistor to GND Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high speeding signals. IF cable isolation recommendation to avoid LTE de-sense in co-existence mode. www.(U)SIMcom.com 0.5 GHz 1.7 GHz: 70 dB SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 1.7 GHz 3.0 GHz: 60 dB 3.0 GHz 6.0 GHz: 65 dB 6.0 GHz 10 GHz: 65 dB 10.0 GHz 15 GHz: 55 dB Layout design VCC_QTM Maximum allowed DC resistance <=90 (m) VDD_1P9 Maximum allowed DC resistance <=150 (m) www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 4. Antenna Interfaces SIM8260C-M2 provides five antenna interfaces, SIM8262E/A-M2, SIM8260G-M2 provide four antenna interfaces, and all of them should be 50 impedance controlled for RF signal. SIM8380G-M2 has four antenna interfaces and four dedicated antennas for mmW. Antenna Definitions Antenna interfaces are shown in the following figure. Figure 40: Antenna interfaces of Modules Table 53: Antenna port definitions ANT item SIM8262A-M2 ANT function ANT0 ANT1 ANT2 3G/4G/5G LMHB TRX 4G UHB DL-MIMO1 5G n41 UL-MIMO2 5G n38/n41 DL-MIMO2 5G n48/n77/n78/79 DL-MIMO1 3G/4G/5G MHB DL-

MIMO1 4G UHB DL-MIMO2 5G n38/n41 DIV 5G n48/n77/n78/n79 DL-MIMO2 3G/4G/5G MHB TX1/DL-

MIMO24G UHB TRX 4G B42/B43/B48 TRX 5G n38/n41 TRX 5G n48/n77/n78/n79 TRX www.(U)SIMcom.com Frequency range Functional description 617MHz~960MHz 1710MHz~2690MHz 3300MHz~5000Mhz 3G/4G/5G signal transmit andreceive 1930MHz~2690MHz 3300MHz~5000MHz 3G/4G/5G signal receive 1710MHz~2690MHz 3300MHz~5000MHz 3G/4G/5G signal transmit andreceive ANT3 3G/4G/5G LB TX1/DIV 3G/4G/5G MHB DIV 4G UHB DIV 5G n38/n41 DL-MIMO1 663MHz~960MHz 1930MHz~2690MHz 3300MHz~5000Mhz 3G/4G/5G/GNSS signal transmitand receive SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 5G n48/n77/n78/n79 DIV GNSS1 L1+L5 2 NOTE 1.About mmW, the function of QTM547 is being developed, for more detail, please contact SIMCom Table 54: Frequency band and antenna ports mapping BANDS FUNCTIO NS SIM8262A-M2 3G/4G/5 G 4G 5G 5G 5G LAA 3G/4G/5 G 4G 5G 5G 3G/4G/5 G 4G 5G 5G 3G/4G/5 G 4G 5G 5G LAA GNSS1 LMHB UHB n41 n38/n41 n48/n77/n78/n7 9 B46 MHB UHB n38/n41 n48/n77/n78/n7 9 MHB UHB n38/n41 n48/n77/n78/n7 9 LMHB UHB n38/n41 n48/n77/n78/n7 9 B46 L1+L52 ANTENNA S AN T0 AN T1 ANT2 ANT3 3 GNSS TRX DIV UL-MIMO2 DL-MIMO2 DIV PRX DL-MIMO1 DL-MIMO1 DIV DL-MIMO1 TX1/DL-

MIMO2 TRX TRX TRX DIV DL-MIMO1 DIV DL-MIMO1 DIV www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 NOTE 1. GNSS system is optional. 2. L5 is not support by default, if customer needs to support L5, hardware needs to be customized. For more detail, please contact SIMCom support teams. 3. Only SIM8260C-M2 GNSS support separate antenna, please contact the SIMCom support team for more details. 4. * means SIM8260G-M2 and SIM8380G-M2 are under development, only SIM8380G-M2 support mmW. For more detail, please contact SIMCom support teams. 5. DIV means diversity reception, DL_MIMO1 means PRX_MIMO, DL_MIMO2 means DRX_MIMO. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 3G/4G/5G/mmW Operating Frequency Table 55: Module operating frequency Frequency bands WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1 LTE B2 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B29 LTE B30 LTE B38 LTE B41 LTE B42 LTE B43 LTE B46 LTE B48 LTE B66 LTE B71 5G n1 5G n2 5G n5 5G n7 5G n8 5G n12 Uplink (UL) Downlink (DL) 1920 ~1980MHz 1850 ~1910MHz 1710~1755 MHz 824849MHz 880 ~915MHz 1920 ~1980MHz 1850 ~1910MHz 1710~1755 MHz 824849 MHz 2500~2570MHz 880 ~915MHz 698 ~716MHz 777 ~787MHz 788 ~798MHz 704 ~716MHz 815 ~830MHz 830 ~845MHz 832~862MHz 1850~1915MHz 814 ~849MHz 717~728MHz 2305~2315MHz 2570 ~2620MHz 2496 ~2690MHz 3400 ~3600MHz 3600 ~3800MHz 5150~5925MHz 3550~3700MHz 1710~1780MHz 663 ~698MHz 1920 ~1980MHz 1850 ~1910MHz 824849 MHz 2500~2570MHz 880 ~915MHz 699 ~716MHz 2110 ~2170MHz 1930 ~1990MHz 2110~2155MHz 869894MHz 925 ~960MHz 2110 ~2170MHz 1930 ~1990MHz 2110~2155MHz 869894MHz 2620~2690MHz 925 ~960MHz 728 ~746MHz 746 ~756MHz 758 ~768MHz 734 ~746MHz 860 ~875MHz 875 ~890MHz 791~ 821MHz 1930~1995MHz 859 ~894MHz 717~728MHz 2350~2360MHz 2570 ~2620MHz 2496 ~2690MHz 3400 ~3600MHz 3600 ~3800MHz 5150~5925MHz 3550~3700MHz 2110~2180MHz 617 ~652MHz 2110 ~2170MHz 1930 ~1990MHz 869894MHz 2620~2690MHz 925 ~960MHz 729 ~746MHz www.(U)SIMcom.com Duplex Mode FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD TDD FDD FDD FDD FDD FDD FDD FDD FDD SIM8262A-M2 Series Hardware Design V1.07 5G n13 5G n14 5G n18 5G n20 5G n25 5G n26 5G n30 5G n38 5G n41 5G n48 5G n66 5G n71 5G n77 5G n78 5G n79 GPS GLONASS Beidou Galileo 746 ~756MHz 758 ~768MHz 815 ~830MHz 832~862MHz 1850 ~1915MHz 814 ~849MHz 2305 ~2315 MHz 2570 ~2620MHz 2496~2690MHz 3550 ~3700MHz 1710~1780MHz 663 ~698 MHz 3300~4200MHz 3300~3800MHz 4400~5000MHz 1574.4 1576.44 MHz 1598~1606MHz 1559~1563MHz 1559~1610MHz 777 ~787MHz 788 ~798MHz 860 ~875MHz 791~ 821MHz 1930 ~1995MHz 859 ~894MHz 2350 ~2360 MHz 2570 ~2620MHz 2496~2690MHz 3550 ~3700MHz 2110~2180MHz 617 ~652 MHz 3300~4200MHz 3300~3800MHz 4400~5000MHz FDD FDD FDD FDD FDD FDD FDD TDD TDD FDD TDD FDD TDD TDD TDD www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 GNSS Frequency The following table shows frequency specifications of GNSS antenna interface. Table 56: GNSS frequency Type GPS L1/Galileo/QZSS GPS L5 GLONASS Frequency 1575.421.023MHz 1176.4510.23MHz 1597.5~1605.8MHz BeiDou/Compass 1561.0982.046MHz www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Antenna Installation Antenna Requirements The following table shows the requirements on 3G/4G/5G antennas and GNSS antenna. Table 57: 3G/4G/5G/GNSS antennas Parameter Operating Frequency Requirement See Table 53, 54 for each antenna Direction Gain Impedance Efficiency Max. Input Power VSWR Isolation Omni Directional

> -3dBi (Avg) 50

> 50 %

50W

< 2 20dB is preferred Cable Insertion Loss <1GHz Cable Insertion Loss 1GHz~2.2GHz Cable Insertion Loss 2.3GHz~2.7GHz Cable Insertion Loss 3.3GHz~6GHz

<1dB

<1.5dB

<2dB

<2.5dB Table 58: GNSS antenna (for dedicated GNSS antenna only) *

Parameter Operating Frequency Direction Antenna Gain Impedance Efficiency Max. Input Power VSWR Polarization Noise Figure for Active Antenna Total Gain for Active Antenna Cable Insertion Loss Requirement L1: 1559~1609MHZ L5: 1166~1187MHz Hemisphere, face to sky

> 2 dBic 50

> 50 %

50W

< 2 RHCP or Linear

< 1.5

< 17 dB

<1.5dB NOTE 1. * means these recommendations are for dedicated GNSS antenna which the application need best of class GNSS tracking performance. RF Plug Recommendation www.(U)SIMcom.com SIM826XX/SIM8X80-M2 is mounted with I-PEXs receptacle RF connectors 20449-001E-03, which size is 2.0mm*2.0mm*0.6mm. The connector dimensions are shown as below. SIM8262A-M2 Series Hardware Design V1.07 Figure 41: 3D view of 20449-001E-03 The following table shows the RF connectors electrical specifications. Table 59: Electrical Specifications of 20449-001E-03 Item Voltage Rating Nominal Frequency Range Nominal Impedance Temperature Rating Insulation Resistance Withstanding Voltage Initial Contact Resistance

(Without conductor resistance) Voltage Standing Wave Ratio (V.S.W.R.) Specification 60V r.m.s. maximum DC to 6GHz 50

-40C to +90C 500 M minimum No evidence of breakdown Center contact 20.0mmax.Outer contact 20.0mmax. Meet the requirements 3GHz) of1.3max. (DC 1.45max.(3GHz 6GHz) To get best RF performance, the RF plug connector should be designed to match the receptacle 20449-001E-03, and the parts come from I-PEX is the recommended. The following is the mechanical information of the Murata's RF coaxial cable MXHJD3HJ1000 for reference. For further technical support, the customer could visit the Muratas websitewww.murata.comor contact the local sales team. Figure 42: 3D view of MXHJD3HJ1000 www.(U)SIMcom.com 4.2.3 RF Cable Assembly Operation RF cables correct pull and push operation as shown in the following figure. SIM8262A-M2 Series Hardware Design V1.07 RF cables error pull and push operation as shown in the following figure. Figure 43: RF cable correct pull and push operation Figure 44: RF cable error pull and push operation www.(U)SIMcom.com Use RF cable tool correct pull and push operation as shown in the following figure, for more details, please visit https://www.i-pex.com. SIM8262A-M2 Series Hardware Design V1.07 Figure 45: Use RF cable tool correct pull and push operation Use RF cable tool correct pull and push operation as shown in the following figure, for more details, please visit https://www.i-pex.com. Figure 46: Use RF cable tool error pull and push operation www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 5. Electrical Specifications Absolute Maximum Ratings Absolute maximum rating for digital and analog pins of module are listed in the following table. Table 60: Absolute maximum ratings Parameter Voltage at VBAT pins Min.

Typ.

Voltage at digital pins (GPIO, I2C, UART, I2S) Voltage at digital pins ((U)SIM) Voltage at FULL_CARD_POWER_OFF#

Voltage at RESET#

Max. 4.8 2.1 3.05 4.5 1.9 Unit V V V V V www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Operating Conditions Table 61: VBAT recommended operating ratings Parameter Voltage at VBAT Min. 3.135 Typ. 3.8 Max. 4.4 Unit V Table 62: 1.8V Digital I/O characteristics Parameter Description VIH VIL VOH VOL IOZH IOZL IIH IIL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage High-level, tri-state leakage current (No pull-down resistor) Low-level, tri-state leakagecurrent (No pull-

up resistor) Input high leakage current(No pull-down resistor) Input low leakage current(No pull-up resistor) Min. 1.17 0 1.35 0

-1

-1 Typ. Max. Unit

2.1 0.63 1.8 0.45 1

1

V V V V uA uA uA uA Table 63: Operating temperature Parameter Normal operation temperature (3GPP compliant) Extended operation temperature*

Storage temperature Min.

-30

-40

-40 Typ.

Max. 70 85 90 Unit NOTE 1.*means the module is able to establish and maintain voice, data transmission, SMS and emergency call, etc. The performance may deviate slightly from the 3GPP specifications and will meet 3GPP specifications again when the temperature returns to normal operating temperature levels. the module works at an environment higher than 70 , thermal dissipation measure must be taken, and ensure that the temperature of the module CPU is not higher than 100 . If www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Operating Mode Operating Mode Definition The table below summarizes the various operating modes of SIM826XX/SIM8X80-M2. Table 64: Operating mode definition Mode Function Normal operati on UMTS/LTE/5G Sleep UMTS/LTE/5G Idle UMTS/LTE/5G Talk UMTS/LTE/5G Standby UMTS/LTE/5G Data transmission Minimum functionality mode Flight mode Minimum power consumptionmode Power off AT command AT+CSCLK=1 can be used to set the module to a sleepmode. In this case, the current consumption of module will be reducedto a very low level and the module can still receive paging message and SMS Software is active. Module is registered to the network, and ready tocommunicate Connection between two subscribers is in progress. In this case, thepower consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antennas Module is ready for data transmission, but no data is currently sent orreceived. In this case, power consumption depends on network settings. There is data transmission in progress. In this case, power consumption is related to network settings (e.g., power control level);

uplink/downlink data rates, etc. AT command AT+CFUN=0 can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work and the (U)SIM card will not be accessible, but USB port are still accessible. The power consumption in this mode is lower than normal mode AT command AT+CFUN=4 or pulling down the W_DISABLE1# pin can be used to set the module to flight mode without removing the power supply. In this case, the RF part of the module will not work, the serial port and USB are still available. The power but consumption is lower than normal mode In AT+CFUN=0 condition, send AT+CSCLK=1, the module enter minimum power consumption mode. Normally module will go into power off mode by sending the AT command AT+CPOF or pull down the FULL_CARD_POWER_OFF#pin. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are notavailable Sleep Mode In sleep mode, the current consumption of the module will be reduced to a very low level. Several hardware and software conditions must be satisfied in order to let module enter into sleep mode:

14. UART condition www.(U)SIMcom.com 15. USB condition 16. Software condition SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 NOTE 1. Before designing, pay attention to how to realize sleeping/waking function. Minimum Functionality Mode and Flight Mode Minimum functionality mode ceases a majority of functions of the module, in order to minimize the power consumption. This mode is set by the AT command which provides a choice of 3 different functionality levels. 5 AT+CFUN=0: Minimum functionality 6 AT+CFUN=1: Full functionality (Default) 7 AT+CFUN=4: Flight mode If module has been set to minimum functionality mode, the RF (U)SIM card functions will be closed while USB are still available. If module has been set to flight mode, the RF function will be closed while the (U)SIM card, the serial port and USB are still available. When module is in minimum functionality or flight mode, it can return to full functionality by the AT command AT+CFUN=1. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Current Consumption The current consumptions are listed in the table below. Table 65: Module Current consumption on VBAT pins (VBAT=3.8V) Description Power off mode GNSS mode

(AT+CSCLK=1 & AT+CFUN=0 &

Without USB connection) Minimum power consumptionmode

(GNSS off & AT+CSCLK = 1

Without USB connection) Condition Power off Typical 128uA Max 150 uA AT+CGPS=1(DPO mode) 22 mA 25 mA AT+CFUN=0 3.6mA 5.3 mA WCDMA DRX=1.28s WCDMA DRX=2.56s LTE-FDD DRX=0.32s LTE-FDD DRX=0.64s LTE-FDD DRX=1.28s LTE-FDD DRX=2.56s LTE-TDD DRX=0.32s LTE-TDD DRX=0.64s LTE-TDD DRX=1.28s LTE-TDD DRX=2.56s 5G-N78 DRX=0.64s 5G-N78 DRX=1.28s WCDMA LTE FDD LTE TDD 5G NR SA WCDMA LTE FDD LTE TDD 5G NR SA Sleep mode

(GNSS off & AT+CSCLK = 1

Without USB connection) Idle mode

(GNSS off & connection USB) Idle mode

(GNSS off & Without connectionUSB) 4.7mA 4.6mA 7.1mA 5.5mA 4.7mA 4.2mA 7.1mA 5.6mA 4.6mA 4.3mA 7mA 5.5mA 44.62 mA 45.22 mA 45.29 mA 46.07 mA 5.1mA 5.7mA 5.7mA 8mA 6.5 mA 6 mA 12.2 mA 8.5 mA 6.7 mA 6.1 mA 12.2 mA 8.5 mA 6.4 mA 6.1 mA 13.5 mA 9 mA 50 mA 50 mA 50 mA 50 mA 28 mA 28 mA 28 mA 28 mA SIM8262A-M2 RF Current consumption HSDPA data WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE data

@Power 24.08dBm Typical: 837mA

@Power 23.93dBm Typical: 861mA

@Power 23.98dBm Typical: 811mA

@Power 23.78dBm Typical: 809mA

@Power 24.08dBm Typical: 808mA LTE-FDD B1 www.(U)SIMcom.com

@5MHz 21.3dBm Typical : 812mA SIM8262A-M2 Series Hardware Design V1.07

@10M Hz

@20M Hz

@5MHz

@10M Hz

@20M Hz

@5MHz

@10M Hz

@20M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@20M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@20M Hz 21dBm Typical : 908mA 21dBm Typical : 914mA 23.1dB m 23.2dB m 23.1dB m 23.3dB m 23.2dB m 23.1dB m 22.2dB m 22.1dB m 22dBm 22dBm Typical : 838mA Typical : 854mA Typical : 857mA Typical : 809mA Typical : 808mA Typical : 825mA Typical : 458mA Typical : 459mA Typical : 958mA Typical : 967mA 21.8dBm Typical : 946mA 21.6dB m 21.6dBm 21.9dB m 21.8dBm 22.4dB m 22.3dBm 22.2dB m 22.2dBm Typical : 502mA Typical : 490mA Typical : 502mA Typical : 452mA Typical : 585mA Typical : 590mA Typical : 503mA Typical : 448mA 22dBm 21.8dBm Typical : 458mA Typical : 398mA 22.2dB m 22.2dBm 22.2dB m 22dBm 21.8dB m 21.9dBm Typical : 474mA Typical : 489mA Typical : 427mA Typical : 425mA Typical : 491mA Typical : 483mA 22.1dBm Typical : 466mA LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07

@5MHz

@10M Hz

@20M Hz

@5MHz

@10M Hz

@15M Hz

@5MHz

@10M Hz

@5MHz

@10M Hz

@20M Hz

@5MHz

@10M Hz

@20M Hz

@5MHz

@10M Hz

@15M Hz

@5MHz

@10M Hz 23.1dB m 23.2dBm Typical : 867mA Typical : 856mA 23.1dBm Typical : 853mA 22.1dB m 22.1dBm Typical : 419mA Typical : 458mA 21.9dBm Typical : 451mA 22.2dB m 22.2dBm 23.3dB m 23.3dBm Typical : 729mA Typical : 730mA Typical : 855mA Typical : 858mA 23.2dBm Typical : 842mA 22.3dB m 22.1dBm Typical : 1025mA Typical : 914mA 23dBm Typical : 1001mA 22.1dB m 22.1dBm Typical : 419mA Typical : 458mA 21.9dBm Typical : 451mA 23.2dB m 23.1dBm Typical : 1932mA Typical : 1945mA LTE-FDD B25 LTE-FDD B26 LTE-FDD B30 LTE-TDD B38 LTE-TDD B41 LTE-TDD B42 LTE-TDD B43 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 LTE-TDD B46 LTE-TDD B48 LTE-FDD B66 LTE-FDD B71 5G NR data 5G n1 5G n2 5G n5 5G n7 5G n8 5G n12 5G n13 5G n14 5G n18 5G n20 5G n25 5G n26 5G n30 www.(U)SIMcom.com

@20MHz 22.8dBm Typical : 1936mA

@5MHz

@10MHz

@20MHz

@5MHz

@10MHz

@20MHz

@5MHz

@10MHz

@20MHz

@5MHz

@10MHz

@20MHz 23.8dBm Typical : 673mA 23.8dBm Typical : 683mA 23.8dBm Typical : 649mA 23.7dBm Typical : 1186mA 23.8dBm Typical : 1157mA 23.6dBm Typical : 1211mA 21.8dBm Typical : 854mA 21.6dBm Typical : 861mA 21.5dBm Typical : 864mA 21.9dBm Typical : 543mA 21.9dBm Typical : 590mA 21.8dBm Typical : 527mA 21.2dBm Typical: 753mA

@5MHz

@20MHz 21.5dBm Typical :770mA

@40MHz 21.3dBm Typical :825mA 21.5dBm Typical: 866mA

@5MHz

@15MHz 22.0dBm Typical: 856mA

@20MHz 21.8dBm Typical: 868mA 22.0dBm Typical :3861mA

@5MHz

@10MHz 22.3dBm Typical :394mA

@20MHz 22.4dBm Typical :404mA

@5MHz 21.8dBm Typical :689mA

@10MHz 21.5dBm Typical :690mA

@20MHz 21.6dBm Typical :704mA

@5MHz 21.5dBm Typical :502mA

@10MHz 21.8dBm Typical :504mA

@20MHz 21.6dBm Typical :515mA

@5MHz 21.2dBm Typical: 501mA

@15MHz 21.5dBm Typical: 532mA

@5MHz 21.3dBm Typical: 445mA

@10MHz 21.6dBm Typical: 479mA

@5MHz 21.5dBm Typical: 447mA

@10MHz 21.3dBm Typical: 456mA

@5MHz 22.0dBm Typical :420mA

@10MHz 21.8dBm Typical :431mA

@20MHz 21.9dBm Typical :443mA

@5MHz 22.2dBm Typical :406mA

@10MHz 22.1dBm Typical :412mA

@20MHz 22.3dBm Typical :421mA

@5MHz 22.2dBm Typical :698mA

@10MHz 22.1dBm Typical :703mA

@20MHz 22.3dBm Typical :712mA

@5MHz 21.8dBm Typical :466mA

@10MHz 21.7dBm Typical :476mA

@20MHz 21.6dBm Typical :477mA

@5MHz 21.9dBm Typical :625mA

@10MHz 21.5dBm Typical :636mA SIM8262A-M2 Series Hardware Design V1.07 5G n41 5G n48 5G n66 5G n71 5G n77 5G n78 5G n79 22.7dBm Typical :916mA 22.0dBm Typical :613mA 25.1dBm Typical :1345mA

@10MHz

@20MHz 22.1dBm Typical :634mA

@40MHz 22.2dBm Typical :645mA

@20MHz

@60MHz 25.5dBm Typical :1401mA

@100MHz 25.2dBm Typical :1491mA

@10MHz

@20MHz 22.5dBm Typical :921mA

@40MHz 22.8dBm Typical :933mA

@5MHz 22.5dBm Typical :805mA

@20MHz 22.5dBm Typical :820mA

@40MHz 22.4dBm Typical :876mA

@5MHz 21.8dBm Typical :512mA

@10MHz 21.7dBm Typical :533mA

@20MHz 21.6dBm Typical :521mA

@10MHz

@50MHz 25.3dBm Typical :1324mA

@100MHz 25.7dBm Typical :1365mA

@10MHz 25.2dBm Typical :1322mA

@50MHz 25.5dBm Typical :1376mA

@100MHz 25.1dBm Typical :1387mA 25.5dBm Typical :1345mA SIM8260G /SIM8380G-M2 RF Current consumption HSDPA data WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 WCDMA B19 LTE data LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 www.(U)SIMcom.com

@Power 23.1dBm Typical: 870mA

@Power 23.2dBm Typical: 900mA

@Power 23.1dBm Typical: 905mA

@Power 24.1dBm Typical: 580mA

@Power 24.2dBm Typical: 615mA

@Power 24.2dBm Typical: 575mA

: 890mA

: 900mA

@5MHz 23.2dBm Typical

@10MHz 23.1dBm Typical

@20MHz 22.9dBm Typical : 1020mA

@5MHz 23.1dBm Typical

@10MHz 23.2dBm Typical

@20MHz 23.1dBm Typical : 920mA

: 930mA

: 910mA

: 930mA

: 860mA

@5MHz 23.1dBm Typical

@10MHz 23.1dBm Typical

@20MHz 23.1dBm Typical : 900mA

@5MHz

@10MHz 940mA@20MHz 23.1dBm Typical : 930mA 23.1dBm Typical :

22.9dBm

@5MHz 540mA@10MHz Typical : 950mA 22.9dBm Typical :

22.9dBm

@5MHz 935mA@10MHz Typical : 535mA 23.2dBm Typical :

23.2dBm

@20MHz Typical : 880mA 22.9dBm Typical : 830mA LTE-FDD B8

@5MHz 590mA@10MHz 23.0dBm Typical :

23.1dBm Typical : 550mA SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B30 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 www.(U)SIMcom.com

@5MHz

@10MH z

@5MHz

@10MH z

@5MHz

@10MH z

@5MHz

@10MH z

@5MHz

@10MH z

@5MHz

@10MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@5MHz

@10MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@5MHz Typical : 525mA Typical : 940mA Typical : 450mA Typical : 460mA Typical : 510mA Typical : 540mA Typical : 460mA Typical : 510mA Typical : 930mA Typical : 465mA Typical : 505mA Typical : 455mA Typical : 500mA Typical : 450mA Typical : 540mA 23.0dBm Typical : 460mA Typical : 465mA 23.2dB m 23.0dB m 23.1dB m 23.1dB m 23.2dB m 23.1dB m 23.2dB m 22.9dB m 23.0dB m 23.2dB m 23.0dB m 23.1dB m 23.1dB m 22.8dB m 23.2dB m 23.3dB m 23.1dB m 23.0dB m 23.1dB m 23.3dB m 23.3dB m 23.0dB m 23.1dB m 23.2dB m 23.0dB m 23.1dB m 23.0dB m 23.0dB m 22.9dB m 23.1dB m 23.2dB m 23.0dB m 23.2dB m Typical : 525mA Typical : 530mA Typical : 540mA Typical : 550mA Typical : 750mA Typical : 380mA Typical : 385mA Typical : 470mA Typical : 380mA Typical : 915mA Typical : 750mA Typical : 390mA Typical : 390mA Typical : 540mA Typical : 390mA Typical : 390mA Typical : 390mA SIM8262A-M2 Series Hardware Design V1.07

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@5MHz

@10MH z

@20MH z

@Powe r

@Powe r

@Powe r

@Powe r 23.2dB m 23.1dB m 23.2dB m 23.2dB m 23.1dB m 23.2dB m 23.2dB m 23.0dB m 23.6dB m 23.6dB m 23.4dB m 23.4dB m 23.4dB m 23.2dB m 23.1dB m 23.2dB m 23.1dB m 23.0dB m 23.1dB m 23.0dB m 23.4dB m 22.6dB m 22.7dB m 23.2dB m Typical : 480mA Typical : 480mA Typical : 480mA Typical : 480mA Typical : 480mA Typical : 330mA Typical : 325mA Typical : 330mA Typical : 320mA Typical : 320mA Typical : 320mA Typical : 540mA Typical : 550mA Typical : 542mA Typical : 950mA Typical : 970mA Typical : 980mA Typical : 588mA Typical : 565mA Typical : 530mA Typical: 1300mA Typical: 1265mA Typical: 1262mA Typical: 586mA LTE-TDD B40 LTE-TDD B41 LTE-TDD B42 LTE-TDD B43 LTE-TDD B48 LTE-FDD B66 LTE-FDD B71 5G NR data 5G n1 5G n2 5G n3 5G n5 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07

@Power 23.1dBm Typical: 980mA

@Power 23.2dBm Typical: 625mA

@Power 22.7dBm Typical: 545mA

@Power 22.5dBm Typical: 485mA

@Power 23.0dBm Typical: 470mA

@Power 23.0dBm Typical: 530mA

@Power

@Power 22.9dBm Typical: 590mA 23.4dBm Typical: 1265mA

@Power 23.0dBm Typical: 560mA

@Power 22.9dBm Typical: 630mA

@Power 23.6dBm Typical: 940mA

@Power 23.4dBm Typical: 430mA

@Power

@Power 23.2dBm Typical: 455mA 26.7dBm Typical: 1400mA

@Power 23.6dBm Typical: 630mA

@Power 23.2dBm Typical: 1155mA

@Power 23.1dBm Typical: 570mA

@Power 26.1dBm Typical: 850mA

@Power 26.1dBm Typical: 850mA

@Power 25.8dBm Typical: 850mA

@Power 31dBm Typical: 1248mA

@Power 30dBm Typical: 1164mA

@Power 30dBm Typical: 1070mA

@Power 32dBm Typical: 1070mA 5G n7 5G n8 5G n12 5G n13 5G n14 5G n18 5G n20 5G n25 5G n26 5G n28 5G n30 5G n38 5G n40 5G n41 5G n48 5G n66 5G n71 5G n77 5G n78 5G n79 5G n257 5G n258 5G n260 5G n261 NOTE 1.Only SIM8380G-M2 support mmWfor more detail, please contact SIMCom support teams. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 RF Output Power The RF output power is shown in the following table. Table 66: Conducted output power Bands WCDMA Bands Max 23dBm + 1/-3dB LTE-FDD Bands 23dBm + 2/-2dB LTE-TDD Bands 23dBm + 2/-2dB 23dBm + 2/-2dB Min

< -50dBm

< -40dBm

< -40dBm

< -40dBm 26dBm + 2/-2dB

< -40dBm TBD TBD 5G Sub-6 Bands(PC3) 5G Sub-6 Bands

(n41 n77 n78 n79PC2) mmW Bands www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Conducted Receive Sensitivity The conducted RF receiving sensitivity is shown in the following table. Table 67: Conducted RF receiving sensitivity SIM8260C-M2 receiving sensitivity Primary (Typ.)

-115.5dbm Primary + DIV(Typ.) TBD 4MIMO(Typ.)

Frequency WCDMA B1 WCDMA B5 WCDMA B8 LTE B1(10M) LTE B3(10M) LTE B5(10M) LTE B7(10M) LTE B8(10M) LTE B20(10M) LTE B28(10M) LTE B34(10M) LTE B38(10M) LTE B39(10M) LTE B40(10M) LTE B41(10M) 5G n1(15M) 5G n3(15M) 5G n28(15M)

-116.5dbm

-116dbm

-96.5dbm

-97.5dbm

-100dbm

-99dbm

-99dbm

-99dbm

-100.5dbm

-98dbm

-98.5dbm

-99.5dbm

-97.5dbm

-98dbm

-95dbm

-97dbm

-97dbm 5G n41(100M)

-87 dbm 5G n78(100M) 5G n79(100M)

-87.5dbm

-87.5dbm SIM8262E-M2 receiving sensitivity TBD TBD

-100dbm

-101dbm

-103dbm

-100dbm

-103dbm

-102dbm

-103dbm

-101.5dbm

-101dbm

-102dbm

-101dbm

-100dbm

-97.5dbm

-99.5dbm

-98.5dbm

-89.9dbm

-91.3dbm

-91.3dbm

-103dbm

-104dbm

-103dbm

-103dbm

-103dbm

-102dbm

-102dbm

-92dbm

-92.5dbm

-93dbm Frequency WCDMA B1 WCDMA B5 WCDMA B8 LTE B1(10M) LTE B3(10M) LTE B5(10M) LTE B7(10M) LTE B8(10M) LTE B18(10M) LTE B19(10M) www.(U)SIMcom.com Primary (Typ.) TBD Primary + DIV(Typ.)

-111dbm 4MIMO(Typ.)

TBD TBD

-96.5dbm

-97.5dbm

-100dbm

-99dbm

-99dbm

-100dbm

-100dbm

-114dbm

-113dbm

-100dbm

-101dbm

-103dbm

-100dbm

-103dbm

-103dbm

-103dbm

-103dbm

-104dbm

-103dbm

SIM8262A-M2 Series Hardware Design V1.07 LTE B20(10M) LTE B26(10M) LTE B28(10M) LTE B38(10M) LTE B39(10M) LTE B40(10M) LTE B41(10M) LTE B42(10M) LTE B43(10M) LTE B48(10M) LTE B66(10M) 5G n1(15M) 5G n3(15M) 5G n5(15M) 5G n7(15M) 5G n8(15M) 5G n20(15M) 5G n26(15M) 5G n28(15M) 5G n38(15M) 5G n40(80M)

-99dbm

-100dbm

-100.5dbm

-98.5dbm

-99.5dbm

-97.5dbm

-98dbm

-99dbm

-99.5dbm

-98.9dbm

-97dbm

-95dbm

-97dbm

-94.3dbm

-94.5dbm

-96.3dbm

-95.3dbm

-93.3dbm

-97dbm

-97dbm

-89.3 dbm 5G n41(100M)

-87 dbm 5G n48(40M) 5G n66(20M) 5G n77(100M) 5G n78(100M) 5G n79(100M)

-90.7 dbm

-94.5 dbm

-87.5dbm

-87.5dbm

-87.5dbm SIM8262A-M2 receiving sensitivity WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1(10M) LTE B2(10M) LTE B4(10M) LTE B5(10M) LTE B7(10M) LTE B8(10M) LTE B12(10M) LTE B13(10M) LTE B14(10M) TBD TBD TBD TBD TBD

-96.5dbm

-97.5dbm

-97dbm

-100dbm

-99dbm

-99dbm

-99dbm

-98.5dbm

-98.5dbm www.(U)SIMcom.com

-102dbm

-103dbm

-103dbm

-101dbm

-102dbm

-101dbm

-100dbm

-102dbm

-103dbm

-102dbm

-100dbm

-97.5dbm

-99.5dbm

-97.2dbm

-97.6dbm

-99.3dbm

-99.5dbm

-95.3dbm

-98.5dbm

-98.5dbm

-91.4 dbm

-89.9dbm

-92.9dbm

-96.7 dbm

-91.3dbm

-91.3dbm

-91.3dbm

-111dbm

-113dbm

-113dbm

-114dbm

-113dbm

-100dbm

-101dbm

-101dbm

-103dbm

-100dbm

-103dbm

-103.5dbm

-103dbm

-103dbm

-103dbm

-103dbm

-104dbm

-104.5dbm

-104.2dbm

-102.6dbm

-102dbm

-102dbm

-99.8dbm

-92.9 dbm

-92dbm

-94.6 dbm

-98.4 dbm

-92.5dbm

-92.5dbm

-93dbm

-103dbm

-103.5dbm

-103dbm

-103dbm

SIM8262A-M2 Series Hardware Design V1.07 LTE B17(10M) LTE B18(10M) LTE B19(10M) LTE B20(10M) LTE B25(10M) LTE B26(10M) LTE B29 LTE B30(10M) LTE B38(10M) LTE B39(10M) LTE B41(10M) LTE B42(10M) LTE B43(10M) LTE B46 LTE B48(10M) LTE B66(10M) LTE B71(10M) 5G n1(15M) 5G n2(10M) 5G n5(15M) 5G n7(15M) 5G n8(15M) 5G n12(15M) 5G n13(10M) 5G n14(10M) 5G n18(15M) 5G n20(15M) 5G n25(15M) 5G n26(15M) 5G n30(10M) 5G n38(20M) 5G n41(100M) 5G n48(40M) 5G n66(20M) 5G n71(15M) 5G n77(100M) 5G n78(100M) 5G n79(100M)

-100.5dbm

-100dbm

-100.5dbm

-100dbm

-98dbm

-100dbm TBD

-98dbm

-97.5dbm

-98dbm

-98dbm

-99dbm

-99.5dbm TBD

-99dbm

-97dbm

-97.5dbm

-95dbm

-96.7dbm

-94.3dbm

-94.5dbm

-96.3dbm

-95.1dbm

-97.8dbm

-96.3dbm

-96.4dbm

-95.3dbm

-95.0dbm

-93.3dbm

-95.2dbm

-95.3dbm

-87 dbm

-93.7dbm

-92.9dbm

-94.5dbm

-87.5dbm

-87.5dbm

-87.5dbm

-104dbm

-103.5dbm

-103.5dbm

-104dbm

-101dbm

-103dbm TBD

-100.5dbm

-99dbm

-99dbm

-99.5dbm

-101.5dbm

-102dbm TBD

-101.5dbm

-99dbm

-100dbm

-97.5dbm

-98.8dbm

-97.2dbm

-97.6dbm

-99.3dbm

-97.3dbm

-99.8dbm

-98.6dbm

-98.4dbm

-99.5dbm

-97.1dbm

-95.3dbm

-97.2dbm

-97.8dbm

-89.9dbm

-95.9dbm

-95.5dbm

-96.9dbm

-91.3dbm

-91.3dbm

-91.3dbm SIM8260G-M2 /SIM8380G-M2 receiving sensitivity WCDMA B1 WCDMA B2 WCDMA B4

-111dbm

-111dbm

-111dbm www.(U)SIMcom.com

-113.5dbm

-113.5dbm

-113dbm

-103dbm

-102.5dbm

-102dbm

-103.5dbm

-103.5dbm TBD

-103.5dbm

-102dbm

-102.5dbm

-102dbm

-101dbm

-99.8dbm

-99.7dbm

-99.6dbm

-92dbm

-98.7dbm

-97.8dbm

-92.5dbm

-92.5dbm

-93dbm

SIM8262A-M2 Series Hardware Design V1.07 WCDMA B5 WCDMA B8 WCDMA B19 LTE B1(10M) LTE B2(10M) LTE B3(10M) LTE B4(10M)

-112dbm

-111dbm

-111dbm

-98.9dbm

-99.3dbm

-98.6dbm

-99.4dbm LTE B5(10M)

-100.2dbm LTE B7(10M) LTE B8(10M) LTE B12(10M) LTE B13(10M) LTE B14(10M) LTE B17(10M) LTE B18(10M) LTE B19(10M) LTE B20(10M)

-98.8dbm

-99.6dbm

-100dbm

-100.4dbm

-100.2dbm

-100dbm

-99.7dbm

-100.1dbm

-100.2dbm LTE B25(10M)

-99.1dbm LTE B26(10M)

-99.96dbm LTE B28(10M) LTE B30(10M) LTE B34(10M) LTE B38(10M) LTE B39(10M)

-99.6dbm

-96.4dbm

-99.7dbm

-97.9dbm

-99.7dbm LTE B40(10M)

-99dbm LTE B41(10M) LTE B42(10M) LTE B43(10M) LTE B48(10M) LTE B66(10M)

-97.9dbm

-99.7dbm

-99.7dbm

-99.6dbm

-99.3dbm LTE B71(10M)

-100.1dbm 5G n1(10M) 5G n2(10M) 5G n3(10M) 5G n5(10M) 5G n7(10M) 5G n8(10M) 5G n12(10M) 5G n13(10M) 5G n14(10M) 5G n18(10M) 5G n20(10M) 5G n25(10M)

-98.8dbm

-98.1dbm

-98.6dbm

-100.5dbm

-98.5dbm

-99.5dbm

-100.5dbm

-99dbm

-97.8dbm

-100.2dbm

-100dbm

-98.9dbm www.(U)SIMcom.com

-114.5dbm

-114.5dbm

-113.5dbm

-100.8dbm

-101dbm

-100dbm

-101dbm

-102.5dbm

-101.5dbm

-101.4dbm

-103dbm

-103dbm

-103dbm

-103dbm

-103dbm

-103.4dbm

-103.6dbm

-101dbm

-103.3dbm

-103.3dbm

-100dbm

-101.7dbm

-101.3dbm

-101.2dbm

-101.4dbm

-103.6dbm

-102.1dbm

-102.2dbm

-102.4dbm

-101.8dbm

-103.5dbm

-101.6dbm

-101.7dbm

-101.1dbm

-103dbm

-101.1dbm

-102.9dbm

-102.8dbm

-102.5dbm

-102.5dbm

-103dbm

-103.2dbm

-101.3dbm

-104.8dbm

-105.3dbm

-104.3dbm

-105.1dbm

-104.5dbm

-104.9dbm

-104.1dbm

-104.4dbm

-105.4dbm

-104.2dbm

-104.8dbm

-105.3dbm

-105.2dbm

-105.3dbm

-104.8dbm

-104.8dbm

-105.1dbm

-104.6dbm

-104.5dbm

-104.9dbm SIM8262A-M2 Series Hardware Design V1.07 5G n26(10M) 5G n28(10M) 5G n30(10M) 5G n38(10M) 5G n40(10M) 5G n48(10M) 5G n66(10M) 5G n71(10M)

-99.5dbm

-99.6dbm

-95dbm

-97.6dbm

-98.1dbm

-99.6dbm

-98.3dbm

-100.5dbm 5G n41(100M)

-87dbm 5G n77(100M) 5G n78(100M) 5G n79(100M) mmW n257 mmW n258 mmW n260 mmW n261

-89.1dbm

-89.6dbm

-89.1dbm TBD TBD TBD TBD

-103.2dbm

-103.3dbm

-99.6dbm

-101.5dbm

-101.8dbm

-101.7dbm

-101.8dbm

-103.1dbm

-90.8dbm

-91.5dbm

-91.6dbm

-91.4dbm TBD TBD TBD TBD

-104.5dbm

-105.2dbm

-104.9dbm

-106.1dbm

-105.1dbm

-92.8dbm

-93.2dbm

-93.4dbm

-93.3dbm TBD TBD TBD TBD www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 5.7 Thermal Design Make sure that the module can reach maximum work performance under extended temperature or extreme conditions for a long time, thermal dissipation design is very important. Module reserved a ground plane on the bottom side for the heat dissipating, customer could conduct the heat to the large board by the silica gel, for better thermal performance, customer could use a heat sink device to conduct the heat to the air. Figure 47: Thermal design diagram Keep the module away from other heat sources such as battery, power, AP, etc. There are some design rules to enhance thermal dissipation performance:

Make sure that the module mounting holes connect to the main PCB ground fully. Make sure maximize airflow around the module. Add enough through via on the main PCB. Via material is very important solid copper and stacked via is better. Recommend use heat dissipation material connect to the customers devices on the top side of the module to enhance the heat dissipation. Large thermal dissipation area is better. Chose a high effective heat dissipation material thermal conductivity is 8w/m-k. is better such as heat pipe, graphite sheets. The recommend NOTE 1. On customer main PCB, the size of exposed copper thermal dissipation area and exposed copper thermal dissipation area of module should be consistent, for more details, please refer to chapter2.3. Table 68: Chip junction temperature table Chip model JSFCCA5QHAFGA-405A PMK65 PMX65 SDX65/SDX62 QET7100 QPM6679 QPM6375 QPM6621 S55643-11 SDR735 SMR546 QTM545 QTM547 www.(U)SIMcom.com Junction temperature 85 125 125 105 115 85 85 85 85 105 105 85 105 SIM8262A-M2 Series Hardware Design V1.07 5.8 ESD Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the customers main board, the ESD components should be placed closed to the connectors which human body may touch, such as (U)SIM card holder, audio jacks, switches, USB interface, etc. The following table shows the module ESD test performance. In main PCB board, the post of screws and screws used to fix the M2 module should have good electrical conductivity and facilitate ESD release to better protect the module. Table 69: The ESD performance measurement table (Temperature: 25, Humidity: 45%) Part VBAT, GND Antenna FULL_CARD_POWER_OFF#

USB RESET#

(U)SIM Other PAD NOTE Contact discharge Air discharge

+/- 4KV

+/- 8KV

+/- 4KV

+/- 3KV

+/- 3KV

+/- 2KV

+/- 2KV

+/- 2KV

+/- 8KV

+/- 6KV

+/- 6KV

+/- 5KV

+/- 5KV

+/- 5KV Test conditions:

11. 12. The external of the module has surge protection diodes and ESD protection diodes. The data in the table above was tested using SIMCom EVB. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Appearance Top and Bottom View of Module SIM8262A-M2 Figure 48: Top and bottom view of the module www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Label Description Information Table 70: Label description of the module information Figure 49: Label description of the module No. A B C D E F G NOTE Description LOGO Project name Product code QR code Serial number International mobile equipment identity Product deputy code(from left to right):

The firstplatform information of module The secondRF PA information of moduleThe thirdMCP information of module The fourthMCP storage size of module The fifthGPSL1,GPSL5,WIFI,B46 function information of moduleThe sixthwindows PCIe, ESIM function information of module SeventhmmW function information of module The eighthreserve 1. Above label description of the module only for reference. Please refer to the actual product for appearance. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Packaging Module supports tray packaging. The packaging procedures are shown in the following figure. Figure 50: Packaging procedures Table 71: Tray size Length?mm 242

.0 Figure 51: Tray view of the module Width?mm 161

.0 Numb er 1 0 Figure 52: Small carton view Table 72: Small carton size Length?0mm Width?0mm Height?0mm 2 7 0 1 8 0 1 2 0 Numb er 10*20=2 00 Figure 53: Big carton view Table 73: Big carton size Length?0mm Width?0mm Height?0mm 3 8 0 2 8 0 2 8 0 Numb er 200*4=8 00 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Appendix Coding Schemes and Maximum Net Data Rates over Air Interface Table 74: Coding schemes and maximum net data rates over air interface HSDPA device category Category 1 Max data ratepeak Modulation type 1.2Mbps 16QAM, QPSK Category 2 Category 3 Category 4 Category 5 Category 6 Category 7 Category 8 Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19 Category 20 Category 21 Category 22 Category 23 Category 24 HSUPA device category Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 LTE-FDD device category type(Downlink) Category 1 www.(U)SIMcom.com 1.2Mbps 1.8Mbps 1.8Mbps 3.6Mbps 3.6Mbps 7.2Mbps 7.2Mbps 10.2Mbps 14.4Mbps 0.9Mbps 1.8Mbps 17.6Mbps 21.1Mbps 23.4Mbps 28Mbps 23.4Mbps 28Mbps 35.5Mbps 42Mbps 23.4Mbps 28Mbps 35.5Mbps 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK 16QAM, QPSK QPSK QPSK 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 16QAM 64QAM 42.2Mbps Max data ratepeak Modulation type 0.96Mbps 64QAM QPSK 1.92Mbps 1.92Mbps 3.84Mbps 3.84Mbps 5.76Mbps QPSK QPSK QPSK QPSK QPSK Max data ratepeak Modulation 10Mbps QPSK/16QAM/64QAM SIM8262A-M2 Series Hardware Design V1.07 Category 4 Category 6 Category 12 Category 16 LTE-FDD device category type(Uplink) Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 13 150Mbps 300Mbps 600Mbps 1000Mbps QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM/256QAM QPSK/16QAM/64QAM/256QAM Max data ratepeak Modulation 5Mbps 25Mbps 50Mbps 50Mbps 75Mbps 50Mbps 150Mbps QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM/64QAM QPSK/16QAM QPSK/16QAM/64QAM www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Description AT Command Manual Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification NG-RAN; Architecture description Electromagnetic Compatibility (EMC) for mobile terminals andancillary equipment. Electromagnetic Compatibility (EMC) for mobile terminals andancillary equipment. Technical Specification Group Radio Access Network;Terminal conformance specification;

Third Generation cellular Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3:

Abstract Test Suites. Electromagnetic compatibility and Radio spectrum Matters(ERM); Base Stations (BS) and User Equipment

(UE) for IMT-2000. networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread

(UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters

(ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment Safety of information technology equipment (2000) Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification Global Certification Forum - Certification Criteria Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous electronic equipment

(RoHS) NR substances electrical technical and in transmissio n an d receptio n radi o specificati on Antenna design guidelines SIM8260G-M2 & QPS615 & W82 & RTL8211F &

QEP8121 & RTL8221B connect pin mapping. Related Documents Table 75: Related documents No.

[1]

[2]

[3]

[4]

[5]

[6]

Title SIM826X-M2 Series_ATCommand Manual 3GPP TS 51.010-1 3GPP TS 38.401 3GPP TS 34.124 3GPP TS 34.121 3GPP TS 34.123-1

[7]

3GPP TS 34.123-3

[8]

EN 301 908-02 V2.2.1

[9]

EN 301 489-24 V1.2.1

[10]

[11]

[12]

IEC/EN60950-1(2001) 3GPP TS 51.010-1 GCF-CC V3.23.1

[13]

2002/95/EC

[14]

[15]

[16]

3GPP TS 38.101 SIM826X_M2_Antenna PortMapping and Design Guide SIM8260G-M2 & QPS615 &

W82 & RTL8211F &

QEP8121

& RTL8221B Connect PinMapping(xxxxxx) www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Terms and Abbreviations Table 76: Terms and abbreviations www.(U)SIMcom.com Abbreviation ADC Description Analog-To-Digital Converter SIM8262A-M2 Series Hardware Design V1.07 ARP BER BTS CS CSD CTS DAC DRX DSP DTE DTR DTX DPR DIV EFR EMC ESD ETS EVDO FCC FD FDD FDMA FR GMSK GNSS GPS HR HSPA HSIC I2C I2S IMEI LTE LB LAA LNA MO MSB MHB MT Antenna Reference Point Bit Error Rate Base Transceiver Station Coding Scheme Circuit Switched Data Clear To Send Digital-To-Analog Converter Discontinuous Reception Digital Signal Processor Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Dynamic Power Reduction The Diversity Receive signal Enhanced Full Rate Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Evolution Data Only Federal Communications Commission (U.S.)

(U)SIM fix dialing phonebook Frequency Division Dual Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Half Rate High Speed Packet Access High-Speed Inter-Chip Inter-Integrated Circuit Inter-IC Sound International Mobile Equipment Identity Long Term Evolution Low Frequency Band Limited Access Authorization Low-noise Amplifier Mobile Originated Most Significant Bit Middle And High Frequency Band Mobile Terminated www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 MIMO NMEA PAP PBCCH PCB PCIe RF RMS RTC SIM SMS SPI SMPS TDD TDMA TE TX TRX VSWR SM SGMII NC HSDPA HSUPA ZIF WCDMA VCTCXO

(U)SIM UHB UMTS UART mmW Multiple Input Multiple Output National Marine Electronics Association Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Peripheral Component Interface Express Radio Frequency Root Mean Square (value) Real Time Clock Subscriber Identification Module Short Message Service Serial Peripheral Interface Switched-Mode Power Supply Time Division Dual Time Division Multiple Access Terminal Equipment (also referred to as DTE) Transmit Direction The Diversity Receive signal Voltage Standing Wave Ratio

(U)SIM Phonebook Serial Gigabit Media Independent Interface Not connect High Speed Downlink Packet Access High Speed Uplink Packet Access Zero Intermediate Frequency Wideband Code Division Multiple Access Voltage Control Temperature-Compensated Crystal Oscillator Universal Subscriber Identity Module Ultra-High Frequency Band Universal Mobile Telecommunications System Universal Asynchronous Receiver Transmitter millimeter Wave Safety Caution Table 77: Safety caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid

(U)SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g., lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid (U)SIM card be properly inserted in the cellular terminal or mobile. is used close to TV sets, it Declaration of conformity Herby, SIMCom Wireless Solutions Limited declares that this MODULE,SIM8262A-M2 is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. Use the MODULE in the environment with the temperature between -30 and 70. The device complies with RF specifications when the device used at 5mm from your body. FCC MODULAR APPROVAL INFORMATION EXAMPLES for Manual This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

This device may not cause harmful interference. This device must accept any interference received, including interference that may cause undesiredoperation. www.(U)SIMcom.com SIM8262A-M2 Series Hardware Design V1.07 CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. connected. Connect the equipment into an outlet on a circuit different from that to which the receiver is Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. OEM INTEGRATION INSTRUCTIONS:

This device is intended only for OEM integrators under the following conditions:

The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal on-board antenna that has been originally tested and certified with this module. External antennas are not supported. As long as these 3 conditions above are met, further transmitter test will not berequired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). The end-product may need Verification testing, Declaration of Conformity testing, a Permissive Class II Change or new Certification. Please involve a FCC certification specialist in order to determine what will be exactly applicable for the end-product. Validity of using the module certification:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product(including the transmitter) and obtaining a separate FCC authorization. In such cases, please involve a FCC certification specialist in order to determine if a Permissive Class II Change or new Certification is required. www.(U)SIMcom.com The software provided for firmware upgrade will not be capable to affect any RF parameters as certified forthe FCC for this module, in order to prevent compliance issues. SIM8262A-M2 Series Hardware Design V1.07 End product labeling:

This transmitter module is authorized only for use in device where the antenna may be installed such that20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: 2AJYU-8XN0003. Information that must be placed in the end user manual:

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. CAUTION: Exposure to Radio Frequency Radiation. Antenna shall be mounted in such a manner to minimize the potential for human contact during normal operation. The antenna should not be contacted during operation to avoid the possibility of exceeding theFCC radio frequency exposure limit. Requirement per KDB996369 D03 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of amodule grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need tonotify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 22, part 24, part 27, part90,part96. Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits onantennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The EUT has a Rubber Duck Antenna, and the antenna use a permanently attached antenna which is not replaceable.The manufacturer does not specify this antenna, but it is recommended to use it. www.(U)SIMcom.com SIM826AG-M2 Series Hardware Design V1.06 Limited module procedures If a modular transmitter is approved as a limited module, then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the productinto which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is not a limited module. RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information:

(1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-

product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body." This module is designed to comply with the FCC statement, FCC IDis:

2AJYU-8XN0003. Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects:

layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. 1 Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width,shape(s), www.simcom.com dielectric constant, and impedance as applicable for each type of antenna);

SIM826AG-M2 Series Hardware Design V1.06 2 Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);

3 The parameters shall be provided in a manner permitting host manufacturers to design the printedcircuit (PC) board layout;

4 Appropriate parts by manufacturer and specifications;

5 Test procedures for design verification; and 6 Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Explanation: No, the module does not include trace antenna design. Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must beincluded as part of the information to the host product manufacturer. The antenna list shall also identify theantenna types

(monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type)). www.simcom.com SIM826AG-M2 Series Hardware Design V1.06 For situations where the host product manufacturer is responsible for an external connector, for examplewith an RF pin and antenna trace design, the integration instructions shall inform the installer that uniqueantenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The EUT has a Rubber Duck Antenna, and the antenna use a permanently attached antennawhich is not replaceable. Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCCID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB www.simcom.com SIM826XX_SIM8X80-M2 Series Hardware Design V1.07 Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: Contains FCC ID: 2AJYU-8XN0003 Information on test modes and additional testing requirements Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. Explanation: This module is tested in a standalone mobile RF exposure condition and anyco-located or simultaneous transmission with other transmitter(s) or portable use willrequire a separate class ll permissive change re-evaluation or new certification. Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specificrule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not www.simcom.com SIM826XX_SIM8X80-M2 Series Hardware Design V1.07 require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC SubpartB. www.simcom.com